US3856694A - Process for stripping nickel from articles and composition utilized therein - Google Patents
Process for stripping nickel from articles and composition utilized therein Download PDFInfo
- Publication number
- US3856694A US3856694A US00370889A US37088973A US3856694A US 3856694 A US3856694 A US 3856694A US 00370889 A US00370889 A US 00370889A US 37088973 A US37088973 A US 37088973A US 3856694 A US3856694 A US 3856694A
- Authority
- US
- United States
- Prior art keywords
- chloride
- tellurium
- ions
- stripping
- selenium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
Definitions
- the instant invention is particularly directed to a novel composition for removing nickel and generally similar unwanted deposits from plating racks and like articles and to a process for utilizing said composition.
- the formulation conceived by applicant comprising about 4.5 to 14.5 moles/liter of 4 .Z Be r1 it r i g a gi d a chloride ion in the an idu nt of 0.0] to 0.5 moles/liter, a copper ion in the amount of about 0.01 to 0.l moles/- liter, and a source of tellurium or selenium ions in the amount of approximately 0.005 to 0.2 moles/liter.
- the molar ratio of tellurium or selenium ions to chloride ions is in the general range of about one to three.
- the stripping solution employed in the practice of this invention may be prepared by either one of two procedures. First, there can be initially formed a sodium or potassium salt of tellurium dioxide (tellurous acid anhydride) or selenium dioxide (selenous acid anhydride) by mixing approximately l5 grams of Te 0 or Se 0 with about 10 to 12 ml. of NaOH or KOH, diluting the solution obtained to about 150 ml., and thereafter filtering out the precipitate. A preferred concentration for the hydroxide used is about 50%. The sodium or potassium tellurite or selenite obtained is then combined with measured quantities of nitric acid, cupric sulfate and sodium chloride to provide the novel stripping solution of this invention.
- a second procedure for formulating the stripping solution is to directly admix predetermined amounts of Te 0 or 5e0 HNO CuSO, 5H O, and NaCl.
- This procedure T is somewhat less expensive than going through the first approach, however, at times it may be found that combining the TeO or SeO directly with HNO produces a somewhat violent reaction.
- the first mentioned procedure is accordingly preferred at the present time.
- EXAMPLE I A solution was made up of 500 mil. HNO 5.7 g. Cu- SO .5H O, 3.3 g. NaCl and 3.0 g. FeCl which were diluted to l liter. A stainless steel part having a nickel deposit thereon of about 1 mil in thickness was immersed therein. and it took about 87 seconds before the deposit was removed.
- EXAMPLE II There was formulated a solution containing 500 ml. HNO 5.7 g. CuSO .5H O, 3.3 g. NaCl, 2.0 g. ofa commercially available strip aid (composition unknown), and this mixture diluted to 1 liter. It took about 141 seconds to remove a 1 mil thick nickel deposit from a stainless steel part.
- EXAMPLE III A solution was made up of 500 ml. HNO 5.7 g. Cu- SO .5H O, 3.3 g. NaCl and 1.5 g. Na TeO which were diluted to 1 liter. It only took 38 seconds to strip a l mil nickel deposit from a stainless steel part.
- Example III The procedure of Example III was again followed, except that 1.5 g. NaF was used in place of the Na TeO A nickel deposit of the same thickness took l 10 sec onds to be removed from a stainless steel part.
- EXAMPLE VI There was formulated a stripping solution containing 500 ml. HNO 5.7 g. CuSO .5H O, 3.3 g. NaCl, 1 g. KBrO and 0.3 g. KIO which was diluted to l liter. A l mil nickel deposit was removed from a stainless steel part in seconds.
- EXAMPLE Vll A solution was made up of 500 ml. HNO 5.7 g Cu- SO .5H O, 3.3 g. NaCl and 1 ml. bromine, the mixture being diluted to 1 liter. A 1 mil nickel deposit was stripped from a stainless steel part in 94 seconds.
- EXAMPLE Vlll There was formulated a stripping solution containing 500 ml. HNO 5.7 g. CuSO .5H O, 3.3 g. NaCl. and ml. Na TeO solution prepared as earlier described, and this mixture was diluted to 1 liter. A nickel deposit of a thickness of 1 mil was stripped in only 58 seconds.
- EXAMPLE lX A solution was prepared as in Example Vlll, but the amount of NaJeO solution was increased to ml. A deposit of the same thickness was removed in only 33 seconds.
- EXAMPLE X There was formulated a stripping solution containing 2 g/l TeO 600 g/l HNO 5.7 g/l CuSO .5H O and 3.3 g/l NaCl. An unwanted nickel deposit one mil thick was stripped from a stainless steel part in 27 seconds. which is about 30% faster than commerically available strippers.
- potassium hydroxide can readily be substituted for sodium hydroxide; potassium, manganese or cupric chloride can be used in place of sodium chloride; and cupric nitrate or chloride are substituents for cupric sulfate. Further, if desired. a portion of the nitric acid may be replaced by an equivalent (i.e., acid equivalent) amount of sulfurric acid, thereby satisfying the hydrogen ion requirement by a less expensive acid.
- a composition for stripping accumulated nickel deposits from plating apparatus and the like which comprises nitric acid and sources of chloride, copper and tellurium or selenium ions, said chloride ion being present in concentrations of about 0.01 to 0.5 M and said tellurium or selenium ions being present in small but effective amounts sufficient to accelerate the stripping rate without noticeable deleterious effects upon the plating apparatus.
- composition as defined in claim 1 in which the tellurium or selenium ions are present in concentrations of about 0.005 to 0.2 M.
- composition as defined in claim 1 in which the copper ion is present in concentrations of about 0.0l to 0.5 M.
- composition as defined in claim I in which the nitric acid is approximately 42 Be. and is present in an amount of about 4.5 to 14.5 M.
- An aqueous solution for stripping accumulated nickel deposits from plating apparatus which contains therein about 2 to l0 grams per liter of tellurium or selenium dioxide, 600 to 850 grams per liter of nitric acid, 2 to 20 grams per liter of copper sulfate, and 3.5 to 35.5 grams per liter of a source of chloride ions.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Chemically Coating (AREA)
Abstract
The present invention is directed to the chemical removal of adherent nickel deposits on plating racks and the like employing a composition which contains therein nitric acid and sources of chloride, copper and tellurium or selenium ions and to a process for stripping such unwanted deposits from electroplating apparatus without noticeable damage to the base metal and at speeds not normally obtainable with prior art compositions and methods.
Description
United States Patent 1191 1111 3,856,694 Becking Dec. 24, 1974 PROCESS FOR STRIPPING NICKEL FROM 3,365,461 H1968 Saubestre et a]. 134/3 R ICL AND O I O UTILIZED 3,399,143 8/I968 Slominski l34/4l Foelsch 3,709,824 l/l973 Oda etal. [34/41 [75] Inventor: Donald H. Becking, Birmingham, 3,717,520 2/l973 Brindisi v. 156/18 Mich. [73] Assignee: Oxy Metal Finishing Corporation, gzz g sgl g ggg Lovermg warren Mlch' Attorney, Agent, or Firm-B. F. Claeboe [22] Filed: June 18, 1973 [21] App]. No.: 370,889 ABSTRACT The present invention is directed to the chemical re- [52] US Cl 252/101 134/3 134/41 moval of adherent nickel deposits on plating racks and 3 252/79 2 5 the like employing a composition which contains [51] 1111. c1 c23 1/04, 623 l/O8 therein Pi i i9 and Sources of M Copper and 58 Field of Search 252/792, 101, 142; 134/3, L2HEB%2FT"1PH13QE and a Process f P- 134/41; 156/18 pmg suc unwanted deposits from electroplating apparatus without noticeable damage to the base metal and [56] References Cited at) :nodt 111112121233 obtainable w1th pnor art com- UNITED STATES PATENTS p 3,197,341 7/1965 Wallace 134 3 3 Clam, N0 Drawings PROCESS FOR STRIPPING NICKEL FROM ARTICLES AND COMPOSITION UTILIZED TI-IEREIN BACKGROUND OF THE INVENTION It is known in the art to which this invention pertains that nickel and related metallic coatings on the contact tips of the plating racks of electroplating apparatus can be remove by either mechanical means or chemical techniques. In the mechnical approach it has been conventional to use a hammer or like too] means to shatter the unwanted nickel deposit on the contact tips, and while this treatment is generally effective, it suffers from the disadvantages of being time-consuming and may ultimately result in damage to the metal base. Then too, some plating racks contain several hundred individual tips, so that mechanical removal of the unwanted coatings thereon leads to substantial labor costs.
Chemical methods for dissolution of the nickel deposits on stainless steel racks have generally employed nitr c acTl, and MEETS approach represents an improvement over the hammer method, the use of nitric acid by itself is tedious since nickel is only slowly attacked by this acid. It has accordingly been customary to add a catalyst such as a chloride ion, but this substance in the presence of strong nitric acid forms nitrosyl chloride which is a gas at temperatures above about- 5.5C., and accordingly. its benefit to the stripping solution is soon lost by volatilization. The addition of other ions to the solution has also been proposed, as the i g da t e ion disclosed in Pat. No. 3,399,143; however, following these teachings does not obviate the objection of relatively slow stripping speeds, and may under particular conditions cause damage to the stainless steel contact tips.
SUMMARY OF THE INVENTION The instant invention is particularly directed to a novel composition for removing nickel and generally similar unwanted deposits from plating racks and like articles and to a process for utilizing said composition. the formulation conceived by applicant comprising about 4.5 to 14.5 moles/liter of 4 .Z Be r1 it r i g a gi d a chloride ion in the an idu nt of 0.0] to 0.5 moles/liter, a copper ion in the amount of about 0.01 to 0.l moles/- liter, and a source of tellurium or selenium ions in the amount of approximately 0.005 to 0.2 moles/liter. Preferably, the molar ratio of tellurium or selenium ions to chloride ions is in the general range of about one to three.
While applicant does not wish to be bound by a particular theory. it would appear from work performed to date that tellurium or selenium when admixed with the other constituents of the solution herein disclosed in the general molar ratios above set forth possesses filmforming capabilities. This is perceptible to the naked eye when an examination is made of a stainless steel substrate, and is the apparent reason why there is no noticeable attack upon the surface being stripped and also why unwanted nigkel deposits can be removed at si kjepr xim lebi lfaste nthan emmefiie l available plating solutions.
DESCRIPTION OF THE PREFERRED EMBODIMENT The stripping solution employed in the practice of this invention may be prepared by either one of two procedures. First, there can be initially formed a sodium or potassium salt of tellurium dioxide (tellurous acid anhydride) or selenium dioxide (selenous acid anhydride) by mixing approximately l5 grams of Te 0 or Se 0 with about 10 to 12 ml. of NaOH or KOH, diluting the solution obtained to about 150 ml., and thereafter filtering out the precipitate. A preferred concentration for the hydroxide used is about 50%. The sodium or potassium tellurite or selenite obtained is then combined with measured quantities of nitric acid, cupric sulfate and sodium chloride to provide the novel stripping solution of this invention.
A second procedure for formulating the stripping solution is to directly admix predetermined amounts of Te 0 or 5e0 HNO CuSO, 5H O, and NaCl. This procedure Ts somewhat less expensive than going through the first approach, however, at times it may be found that combining the TeO or SeO directly with HNO produces a somewhat violent reaction. The first mentioned procedure is accordingly preferred at the present time.
The invention will now be more fully described with reference to the following examples, which were run at a solution temperature of approximately 40C.
EXAMPLE I A solution was made up of 500 mil. HNO 5.7 g. Cu- SO .5H O, 3.3 g. NaCl and 3.0 g. FeCl which were diluted to l liter. A stainless steel part having a nickel deposit thereon of about 1 mil in thickness was immersed therein. and it took about 87 seconds before the deposit was removed.
EXAMPLE II There was formulated a solution containing 500 ml. HNO 5.7 g. CuSO .5H O, 3.3 g. NaCl, 2.0 g. ofa commercially available strip aid (composition unknown), and this mixture diluted to 1 liter. It took about 141 seconds to remove a 1 mil thick nickel deposit from a stainless steel part.
EXAMPLE III A solution was made up of 500 ml. HNO 5.7 g. Cu- SO .5H O, 3.3 g. NaCl and 1.5 g. Na TeO which were diluted to 1 liter. It only took 38 seconds to strip a l mil nickel deposit from a stainless steel part.
EXAMPLE IV The procedure of Example III was followed except that Na SeO was substituted for the Na TeO The same thickness deposit was removed in 35 seconds.
' EXAMPLE V The procedure of Example III was again followed, except that 1.5 g. NaF was used in place of the Na TeO A nickel deposit of the same thickness took l 10 sec onds to be removed from a stainless steel part.
EXAMPLE VI There was formulated a stripping solution containing 500 ml. HNO 5.7 g. CuSO .5H O, 3.3 g. NaCl, 1 g. KBrO and 0.3 g. KIO which was diluted to l liter. A l mil nickel deposit was removed from a stainless steel part in seconds.
EXAMPLE Vll A solution was made up of 500 ml. HNO 5.7 g Cu- SO .5H O, 3.3 g. NaCl and 1 ml. bromine, the mixture being diluted to 1 liter. A 1 mil nickel deposit was stripped from a stainless steel part in 94 seconds.
EXAMPLE Vlll There was formulated a stripping solution containing 500 ml. HNO 5.7 g. CuSO .5H O, 3.3 g. NaCl. and ml. Na TeO solution prepared as earlier described, and this mixture was diluted to 1 liter. A nickel deposit of a thickness of 1 mil was stripped in only 58 seconds.
EXAMPLE lX A solution was prepared as in Example Vlll, but the amount of NaJeO solution was increased to ml. A deposit of the same thickness was removed in only 33 seconds.
EXAMPLE X There was formulated a stripping solution containing 2 g/l TeO 600 g/l HNO 5.7 g/l CuSO .5H O and 3.3 g/l NaCl. An unwanted nickel deposit one mil thick was stripped from a stainless steel part in 27 seconds. which is about 30% faster than commerically available strippers.
In the exemplary formulations set forth above, potassium hydroxide can readily be substituted for sodium hydroxide; potassium, manganese or cupric chloride can be used in place of sodium chloride; and cupric nitrate or chloride are substituents for cupric sulfate. Further, if desired. a portion of the nitric acid may be replaced by an equivalent (i.e., acid equivalent) amount of sulfurric acid, thereby satisfying the hydrogen ion requirement by a less expensive acid.
Various modifications in the compositions of this invention have been pointed out herein. and these and other changes can of course be effected without departing from the spirit of the invention of the scope of the subjoined claims.
I claim:
1. A composition for stripping accumulated nickel deposits from plating apparatus and the like, which comprises nitric acid and sources of chloride, copper and tellurium or selenium ions, said chloride ion being present in concentrations of about 0.01 to 0.5 M and said tellurium or selenium ions being present in small but effective amounts sufficient to accelerate the stripping rate without noticeable deleterious effects upon the plating apparatus.
2. A composition as defined in claim 1, in which the tellurium or selenium ions are present in concentrations of about 0.005 to 0.2 M.
3. A composition as defined in claim 1, in which the copper ion is present in concentrations of about 0.0l to 0.5 M.
4. A composition as defined in claim I, in which the nitric acid is approximately 42 Be. and is present in an amount of about 4.5 to 14.5 M.
5. An aqueous solution for stripping accumulated nickel deposits from plating apparatus, which contains therein about 2 to l0 grams per liter of tellurium or selenium dioxide, 600 to 850 grams per liter of nitric acid, 2 to 20 grams per liter of copper sulfate, and 3.5 to 35.5 grams per liter of a source of chloride ions.
6. An aqueous solution as defined in claim 1, in which the source of chloride ions is selected from the group consisting of sodium chloride, potassium chloride, manganese chloride and cupric chloride.
7. In a method of stripping nickel deposits from articles by immersing them in a concentrated nitric acid solution containing a chloride catalyst. the improvement which comprises adding to said solution a small but effective amount of a selenite or tellurite compound capable of providing selenium or tellurium ions in the solution.
8. A stripping method as defined in claim 7, in which the selenium or tellurium ions are present in concentrations of about 0.005 to 0.2 M.
Claims (8)
1. A COMPOSITION FOR STRIPPING ACCUMULATED NICKEL DEPOSITS FROM PLATING APPARATUS AND THE LIKE, WHICH COMPRISES NITRIC ACID AND SOURCES OF CHLORIDE, COPPER AND TELLURIUM OR SELENIUM IONS, SAID CHLORIDE ON BEING PRESENT IN CONCENTRATIONS OF ABOUT 0.01 TO 0.5 M AND SAID TELLURIUM OR SELENIUM IONS BEING PRESENT IN SMALL BUT EFFECTIVE AMOUNTS SUFFICIENT TO ACCELERATE THE STRIPPING RATE WITHOUT NOTICEABLE DELETERIOUS EFFECTS UPON THE PLATING APPARATUS.
2. A composition as defined in claim 1, in which the tellurium or selenium ions are present in concentrations of about 0.005 to 0.2 M.
3. A composition as defined in claim 1, in which the copper ion is present in concentrations of about 0.01 to 0.5 M.
4. A composition as defined in claim 1, in which the nitric acid is approximately 42 Be. and is present in an amount of about 4.5 to 14.5 M.
5. AN AQUEOUS SOLUTION FOR STRIPPING ACCUMULATED NICKEL DEPOSITS FROM PLATING APPARATUS, WHICH CONTAINS THEREIN ABOUT 2 TO 10 GRAMS PER LITER OF TELLURIUM OR SELENIUM DIOXIDE, 600 TO 850 GRAMS PER LITER OF NITRIC ACID, 2 TO 20 GRAMS PER LITER OF COPPER SULFATE, AND 3.5 TO 35.5 GRAMS PER LITER OF A SOURCE OF CHLORIDE IONS.
6. An aqueous solution as defined in claim 1, in which the source of chloride ions is selected from the group consisting of sodium chloride, potassium chloride, manganese chloride and cupric chloride.
7. IB A METHOD OF STRIPPING NICKEL DEPOSITS FROM ARTICLES BY IMMERSING THEM IN A CONCENTRATED NITRIC ACID SOLUTION CONTAINING A CHLORIDE CATALYST, THE IMPROVEMENT WHICH COMPRISES ADDING TO SAID SOLUTION A SMALL BUT EFFECTIVE AMOUNT OF A SELENITE OR TELLURITE COMPOUND CAPABLE OF PROVIDING SELENIUM OR TELLURIUM IONS IN THE SOLUTION.
8. A stripping method as defined in claim 7, in which the selenium or tellurium ions are present in concentrations of about 0.005 to 0.2 M.
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES427394A ES427394A1 (en) | 1973-06-18 | 1973-06-18 | Process for stripping nickel from articles and composition utilized therein |
| US00370889A US3856694A (en) | 1973-06-18 | 1973-06-18 | Process for stripping nickel from articles and composition utilized therein |
| ZA00743138A ZA743138B (en) | 1973-06-18 | 1974-05-16 | Process for stripping nickel from articles and compositions utilized therein |
| AU69051/74A AU485233B2 (en) | 1973-06-18 | 1974-05-16 | Process for stripping nickel from articles and composition utilized therein |
| CA201,047A CA1040987A (en) | 1973-06-18 | 1974-05-28 | Process for stripping nickel from articles and composition utilized therein |
| NL7407382A NL7407382A (en) | 1973-06-18 | 1974-05-31 | |
| DE2428380A DE2428380C3 (en) | 1973-06-18 | 1974-06-12 | Aqueous solution for removing nickel deposits |
| IT51539/74A IT1013479B (en) | 1973-06-18 | 1974-06-14 | COMPOSITION AND METHOD FOR REMOVING NICKEL DEPOSITS FROM OBJECTS |
| JP6864374A JPS5647263B2 (en) | 1973-06-18 | 1974-06-15 | |
| GB2674074A GB1475327A (en) | 1973-06-18 | 1974-06-17 | Process and composition for stripping metal deposits from substrates |
| BR4948/74A BR7404948D0 (en) | 1973-06-18 | 1974-06-17 | COMPOSITION FOR REMOVAL OF ACCUMULATED NICKEL DEPOSITS IN A COATING AND SIMILAR EQUIPMENT AND IMPROVEMENT IN A PROCESS FOR REMOVAL OF ITEM NICKEL DEPOSITS |
| FR7421109A FR2233418A1 (en) | 1973-06-18 | 1974-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00370889A US3856694A (en) | 1973-06-18 | 1973-06-18 | Process for stripping nickel from articles and composition utilized therein |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3856694A true US3856694A (en) | 1974-12-24 |
Family
ID=23461605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00370889A Expired - Lifetime US3856694A (en) | 1973-06-18 | 1973-06-18 | Process for stripping nickel from articles and composition utilized therein |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US3856694A (en) |
| JP (1) | JPS5647263B2 (en) |
| BR (1) | BR7404948D0 (en) |
| CA (1) | CA1040987A (en) |
| DE (1) | DE2428380C3 (en) |
| ES (1) | ES427394A1 (en) |
| FR (1) | FR2233418A1 (en) |
| GB (1) | GB1475327A (en) |
| IT (1) | IT1013479B (en) |
| NL (1) | NL7407382A (en) |
| ZA (1) | ZA743138B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4025358A (en) * | 1974-10-11 | 1977-05-24 | Audi Nsu Auto Union Aktiengesellschaft | Process for currentless separation of a nickel layer from objects of light metal |
| US4042451A (en) * | 1975-08-05 | 1977-08-16 | M&T Chemicals Inc. | Selected stripping of nickel-iron alloys from ferrous substrates |
| US4244833A (en) * | 1979-11-15 | 1981-01-13 | Oxy Metal Industries Corporation | Composition and process for chemically stripping metallic deposits |
| US4274908A (en) * | 1978-08-15 | 1981-06-23 | United Technologies Corporation | Cyanide free solution and process for removing gold-nickel braze |
| US4339282A (en) * | 1981-06-03 | 1982-07-13 | United Technologies Corporation | Method and composition for removing aluminide coatings from nickel superalloys |
| US4554049A (en) * | 1984-06-07 | 1985-11-19 | Enthone, Incorporated | Selective nickel stripping compositions and method of stripping |
| US4608091A (en) * | 1982-01-11 | 1986-08-26 | Enthone, Incorporated | Peroxide selective stripping compositions and method |
| US4746369A (en) * | 1982-01-11 | 1988-05-24 | Enthone, Incorporated | Peroxide selective stripping compositions and method |
| US6642199B2 (en) | 2001-04-19 | 2003-11-04 | Hubbard-Hall, Inc. | Composition for stripping nickel from substrates and process |
| WO2014134708A1 (en) * | 2013-03-05 | 2014-09-12 | Sherritt International Corporation | Method of recovering nickel or cobalt while mitigating corrosion |
| US11460778B2 (en) * | 2018-04-12 | 2022-10-04 | Versum Materials Us, Llc | Photoresist stripper |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4353780A (en) * | 1980-10-01 | 1982-10-12 | United Technologies Corporation | Chemical milling of high tungsten content superalloys |
| DK395481A (en) * | 1980-10-01 | 1982-04-02 | United Technologies Corp | METHOD AND METHOD FOR PROCESSING SUBSTANCES OF A NICKEL-ALUMINUM ALLOY |
| CA1209886A (en) * | 1982-01-11 | 1986-08-19 | Thomas W. Bleeks | Peroxide selective stripping compositions and method |
| CH674851A5 (en) * | 1987-12-01 | 1990-07-31 | Bbc Brown Boveri & Cie | |
| DE69314070T2 (en) * | 1992-03-04 | 1998-02-26 | Macdermid Inc | Process for removing tin or tin-lead alloys from copper surfaces |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3197341A (en) * | 1961-06-19 | 1965-07-27 | Rohr Corp | Method and composition for descaling stainless steels and related alloys |
| US3365401A (en) * | 1967-03-14 | 1968-01-23 | Enthone | Immersion type nickel stripper |
| US3399143A (en) * | 1967-08-02 | 1968-08-27 | Macdermid Inc | Method of stripping nickel from articles and the composition used therein |
| US3553016A (en) * | 1967-06-02 | 1971-01-05 | Lithcote Corp | Method and composition for treating stainless steel |
| US3709824A (en) * | 1971-01-07 | 1973-01-09 | Nippon Soda Co | Method and composition for chemical polishing of stainless steel surfaces |
| US3717520A (en) * | 1971-02-09 | 1973-02-20 | Enthone | Composition and method for selectively stripping nickel and/or copper |
-
1973
- 1973-06-18 ES ES427394A patent/ES427394A1/en not_active Expired
- 1973-06-18 US US00370889A patent/US3856694A/en not_active Expired - Lifetime
-
1974
- 1974-05-16 ZA ZA00743138A patent/ZA743138B/en unknown
- 1974-05-28 CA CA201,047A patent/CA1040987A/en not_active Expired
- 1974-05-31 NL NL7407382A patent/NL7407382A/xx not_active Application Discontinuation
- 1974-06-12 DE DE2428380A patent/DE2428380C3/en not_active Expired
- 1974-06-14 IT IT51539/74A patent/IT1013479B/en active
- 1974-06-15 JP JP6864374A patent/JPS5647263B2/ja not_active Expired
- 1974-06-17 BR BR4948/74A patent/BR7404948D0/en unknown
- 1974-06-17 GB GB2674074A patent/GB1475327A/en not_active Expired
- 1974-06-18 FR FR7421109A patent/FR2233418A1/fr not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3197341A (en) * | 1961-06-19 | 1965-07-27 | Rohr Corp | Method and composition for descaling stainless steels and related alloys |
| US3365401A (en) * | 1967-03-14 | 1968-01-23 | Enthone | Immersion type nickel stripper |
| US3553016A (en) * | 1967-06-02 | 1971-01-05 | Lithcote Corp | Method and composition for treating stainless steel |
| US3399143A (en) * | 1967-08-02 | 1968-08-27 | Macdermid Inc | Method of stripping nickel from articles and the composition used therein |
| US3709824A (en) * | 1971-01-07 | 1973-01-09 | Nippon Soda Co | Method and composition for chemical polishing of stainless steel surfaces |
| US3717520A (en) * | 1971-02-09 | 1973-02-20 | Enthone | Composition and method for selectively stripping nickel and/or copper |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4025358A (en) * | 1974-10-11 | 1977-05-24 | Audi Nsu Auto Union Aktiengesellschaft | Process for currentless separation of a nickel layer from objects of light metal |
| US4042451A (en) * | 1975-08-05 | 1977-08-16 | M&T Chemicals Inc. | Selected stripping of nickel-iron alloys from ferrous substrates |
| US4274908A (en) * | 1978-08-15 | 1981-06-23 | United Technologies Corporation | Cyanide free solution and process for removing gold-nickel braze |
| US4244833A (en) * | 1979-11-15 | 1981-01-13 | Oxy Metal Industries Corporation | Composition and process for chemically stripping metallic deposits |
| US4339282A (en) * | 1981-06-03 | 1982-07-13 | United Technologies Corporation | Method and composition for removing aluminide coatings from nickel superalloys |
| US4608091A (en) * | 1982-01-11 | 1986-08-26 | Enthone, Incorporated | Peroxide selective stripping compositions and method |
| US4746369A (en) * | 1982-01-11 | 1988-05-24 | Enthone, Incorporated | Peroxide selective stripping compositions and method |
| US4554049A (en) * | 1984-06-07 | 1985-11-19 | Enthone, Incorporated | Selective nickel stripping compositions and method of stripping |
| US6642199B2 (en) | 2001-04-19 | 2003-11-04 | Hubbard-Hall, Inc. | Composition for stripping nickel from substrates and process |
| WO2014134708A1 (en) * | 2013-03-05 | 2014-09-12 | Sherritt International Corporation | Method of recovering nickel or cobalt while mitigating corrosion |
| US11460778B2 (en) * | 2018-04-12 | 2022-10-04 | Versum Materials Us, Llc | Photoresist stripper |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2428380C3 (en) | 1979-06-07 |
| AU6905174A (en) | 1975-11-20 |
| JPS5036321A (en) | 1975-04-05 |
| GB1475327A (en) | 1977-06-01 |
| NL7407382A (en) | 1974-12-20 |
| JPS5647263B2 (en) | 1981-11-09 |
| BR7404948D0 (en) | 1975-01-07 |
| FR2233418A1 (en) | 1975-01-10 |
| DE2428380A1 (en) | 1975-01-09 |
| CA1040987A (en) | 1978-10-24 |
| ES427394A1 (en) | 1977-02-01 |
| ZA743138B (en) | 1975-06-25 |
| IT1013479B (en) | 1977-03-30 |
| DE2428380B2 (en) | 1978-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3856694A (en) | Process for stripping nickel from articles and composition utilized therein | |
| US4051057A (en) | Solutions for cleaning surfaces of copper and its alloys | |
| US2937940A (en) | Selective stripping of electroplated metals | |
| US3367874A (en) | Process and composition for acid dissolution of metals | |
| US3242090A (en) | Compositions for and methods of removing gold deposits by chemical action | |
| US3163524A (en) | Selective stripping of electroplated metals | |
| US2891871A (en) | Tin immersion plating composition and process for using the same | |
| USRE30714E (en) | Removal of copper containing incrustations from ferrous surfaces | |
| US4352690A (en) | Acid gold bath for the electroless deposition of gold | |
| US4371397A (en) | Chemical copper-plating bath | |
| US4042451A (en) | Selected stripping of nickel-iron alloys from ferrous substrates | |
| US3717520A (en) | Composition and method for selectively stripping nickel and/or copper | |
| CA1211691A (en) | Thallium-containing composition for stripping palladium | |
| US3365401A (en) | Immersion type nickel stripper | |
| US3583867A (en) | Compositions for and method of dissolving nickel | |
| US3399143A (en) | Method of stripping nickel from articles and the composition used therein | |
| US2295545A (en) | Treatment of metal | |
| US3235392A (en) | Electroless deposition of palladium | |
| US2581490A (en) | Electrolytic process of stripping metallic coatings from a ferrous metal base | |
| US4539044A (en) | Electroless copper plating | |
| CA1236252A (en) | Compositions and processes for coating ferrous surfaces with copper | |
| US2692187A (en) | Method of pickling and pickling compositions | |
| US3671332A (en) | Metal treating process | |
| Rogers et al. | Effect of germanium on the transformation of white to gray tin, at comparatively low temperature | |
| EP0398202A1 (en) | Composition and process for zinc phosphating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
| AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
| AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
| AS | Assignment |
Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
|
| AS | Assignment |
Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |