US3056733A - Process for electrolytic deposition of gold-copper-cadmium alloys - Google Patents
Process for electrolytic deposition of gold-copper-cadmium alloys Download PDFInfo
- Publication number
- US3056733A US3056733A US106182A US10618261A US3056733A US 3056733 A US3056733 A US 3056733A US 106182 A US106182 A US 106182A US 10618261 A US10618261 A US 10618261A US 3056733 A US3056733 A US 3056733A
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- United States
- Prior art keywords
- gold
- cyanide
- copper
- cadmium
- per liter
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Definitions
- the present invention relates to an improved process for the electrodeposit of bright coatings of gold-coppercadmium alloys.
- periodically reversed direct current to improve the smoothness and lustre of electrolytic deposits, such as, for example, of gold
- electrolytic deposits such as, for example, of gold
- the use of periodically reversed current, as is known in other electrolytic baths, in the galvanic deposition of gold alloys does not in itself provide advantages.
- aqueous baths are employed at a pH of 9-11 and contain 1 to 3 g. per liter of gold as potassium gold cyanide 5 to g., preferably 8 to 13 g., per liter of copper as potassium copper cyanide or sodium copper cyanide 0.1 to 0.8 g. per liter of cadmium as potassium cadmium cyanide or sodium cadmium cyanide, and 3 to 8 g. per liter of free cyanide calculated as potassium cyanide.
- the duration of the cathodic phase is 4 to seconds and the duration of the anodic phase 0.5 to 2 seconds and the current density during the cathodic phase is 0.5 to 1.5 a./dm. and the current density during the anodic phase is 0.75 to 3.75 a./dm. preferably 1.0 to 3.0 a./dm.
- the gold-copper-cadium alloys thus electrolytically deposited from cyanidic baths have such lustre that further polishing is unnecessary.
- the quality of the deposit is not improved over that obtained when operating without reversal of current but in most instances is of lower lustre.
- Example 1 An aqueous bath containing 2.2 g. per liter of gold as potassium gold cyanide, 12 g. per liter of copper as potassium copper cyanide, 0.5 g. per liter of cadmium as potassium cadmium cyanide and 7 g. per liter of free potassium cyanide was electrolysed with periodic reversal of current supplied to the electrodes. During the period of cathodic connection of the electrodes to the material to be gold plated, the current density was 1.5
- Example 2 An aqueous bath containing 1 g. per liter of gold as potassium gold cyanide, 8 g. per liter of copper as potassium copper cyanide, 0.15 g. per liter of cadmium as potassium cadmium cyanide and 3.5 g. per liter of free potassium cyanide was electrolysed with periodic reversal of current supplied to the electrodes. During the period of cathodic connection of the electrodes to the material to be gold plated, the current density was 0.6 a./dm. whereas during the period of the anodic connection the current density was 1.0 a./dm.. The duration of the cathodic connections was 4 seconds each, whereas the duration of the anodic connections was 0.8 second each. The procedure was continued until a gold alloy plate 20;]. thick had been attained.
- the gold alloys deposited according to the invention have the following properties: They are highly lustrous and require no further polishing. They are of high gold content and therefore resistant against tarnish. They are hard and resistant to abrasion. They also are of good colortone.
- composition is 10 20% Cu, 10 20% Cd and the remainder gold, preferably, 12 13% Cu, 12 13% Cd and the remainder gold.
- the ratio of the current density during the cathodic phase to the current density during the anodic phase is less than 1:15, preferably 1:2.
- each cathodic phase being 4 to 20 seconds and the duration of each anodic phase being 0.5 to 2 seconds and maintaining a current density of 0.5 to 1.5 a./dm. during the cathodic phase and a current density of 0.75 to 3.75 a./dm. during the anodic phase, whereby the ratio of cathodic to anodic current density is less than 1:1.5.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Description
United States Patent 1 3,056,733 PROQESS FOR ELECTROLYTIC DEPOSITION 0F GOLD-COPPER-CADMIUM ALLOYS Gerhard Heilmann, Pforzheim, Germany, assignor to Deutsche Goldund Silber-Scheideanstalt vormals Roessler, Frankfurt am Main, Germany No Drawing. Filed Apr. 23, 1961, Ser. No. 106,182
Claims. (Cl. 204-44) The present invention relates to an improved process for the electrodeposit of bright coatings of gold-coppercadmium alloys.
In the electrolytic deposition of gold alloys baths are chiefly used which contain the gold and the alloying metals, such as silver, copper, cadmium, nickle and the like, in the form of cyanidic complex salts. Thicker deposits from such baths usually turn out to be more or less dull and lustreless. With suited bath composition and suited current density it is possible under favorable circumstances to produce more or less lustrous deposits but even in this case it is usually necessary to subject the coating deposited to a subsequent mechanical polishing in order to provide the lustre required, for example, in the jewelry and watch industry.
The use of periodically reversed direct current to improve the smoothness and lustre of electrolytic deposits, such as, for example, of gold, is generally known. However, the use of periodically reversed current, as is known in other electrolytic baths, in the galvanic deposition of gold alloys does not in itself provide advantages.
According to the invention it was unexpectedly found that, even when employing an anodic current density higher than the cathodic current density, highly lustrous gold-copper-cadium alloys can only be deposited provided certain bath compositions are maintained and in addition that a particular time sequence of anodic and cathodic connection is maintained. In the process according to the invention aqueous baths are employed at a pH of 9-11 and contain 1 to 3 g. per liter of gold as potassium gold cyanide 5 to g., preferably 8 to 13 g., per liter of copper as potassium copper cyanide or sodium copper cyanide 0.1 to 0.8 g. per liter of cadmium as potassium cadmium cyanide or sodium cadmium cyanide, and 3 to 8 g. per liter of free cyanide calculated as potassium cyanide.
Furthermore, the duration of the cathodic phase is 4 to seconds and the duration of the anodic phase 0.5 to 2 seconds and the current density during the cathodic phase is 0.5 to 1.5 a./dm. and the current density during the anodic phase is 0.75 to 3.75 a./dm. preferably 1.0 to 3.0 a./dm. The gold-copper-cadium alloys thus electrolytically deposited from cyanidic baths have such lustre that further polishing is unnecessary. On the other hand, when the gold alloy is deposited using current reversal techniques but operating outside of the limits indicated, the quality of the deposit is not improved over that obtained when operating without reversal of current but in most instances is of lower lustre.
The following examples will serve to illustrate the process according to the invention:
Example 1 An aqueous bath containing 2.2 g. per liter of gold as potassium gold cyanide, 12 g. per liter of copper as potassium copper cyanide, 0.5 g. per liter of cadmium as potassium cadmium cyanide and 7 g. per liter of free potassium cyanide was electrolysed with periodic reversal of current supplied to the electrodes. During the period of cathodic connection of the electrodes to the material to be gold plated, the current density was 1.5
a./dm. whereas during the period of the anodic connection the current density was 3.2 a./dm. The dura tion of the cathodic connections was 7.5 seconds each,
whereas the duration of the anodic connections was 1.2
3,056,733 Patented Oct. 2, 1962 seconds each. The procedure was continued until a gold alloy plate 20 thick had been attained.
Example 2 An aqueous bath containing 1 g. per liter of gold as potassium gold cyanide, 8 g. per liter of copper as potassium copper cyanide, 0.15 g. per liter of cadmium as potassium cadmium cyanide and 3.5 g. per liter of free potassium cyanide was electrolysed with periodic reversal of current supplied to the electrodes. During the period of cathodic connection of the electrodes to the material to be gold plated, the current density was 0.6 a./dm. whereas during the period of the anodic connection the current density was 1.0 a./dm.. The duration of the cathodic connections was 4 seconds each, whereas the duration of the anodic connections was 0.8 second each. The procedure was continued until a gold alloy plate 20;]. thick had been attained.
The gold alloys deposited according to the invention have the following properties: They are highly lustrous and require no further polishing. They are of high gold content and therefore resistant against tarnish. They are hard and resistant to abrasion. They also are of good colortone.
Their composition is 10 20% Cu, 10 20% Cd and the remainder gold, preferably, 12 13% Cu, 12 13% Cd and the remainder gold.
The high current densities employed produce a high plating speed so that the process is very economical.
The ratio of the current density during the cathodic phase to the current density during the anodic phase is less than 1:15, preferably 1:2.
I claim:
1. In a process for the electrolytic deposit of gold-cop per-cadmium alloys from aqueous alkaline cyanide baths using periodically reversed direct current, the steps which comprise electrolytically depositing a gold-copper-cadmium alloy from an aqueous cyanide bath maintained at a pH of 9 11 and containing 1 to 3 g. per liter of gold as potassium gold cyanide, 5 15 g. per liter of copper as an alkali metal copper cyanide selected from the group consisting of potassiumand sodium copper cyanides, 0.1 to 0.8 g. per liter of cadmium as an alkali metal cadmiurn cyanide selected from the group consisting of potassiumand sodium cadmium cyanides and 3 to 8 g. per liter of free cyanide calculated as potassium cyanide, the duration of each cathodic phase being 4 to 20 seconds and the duration of each anodic phase being 0.5 to 2 seconds and maintaining a current density of 0.5 to 1.5 a./dm. during the cathodic phase and a current density of 0.75 to 3.75 a./dm. during the anodic phase, whereby the ratio of cathodic to anodic current density is less than 1:1.5.
2. The process of claim 1 in which the current density employed during the anodic phase is 1.0 to 3.0 a./dm.
3. The process of claim 1 in which the bath contains 8 to 13 g. per liter of copper as alkali metal copper cyanide.
4. The process of claim 1 in which the gold alloy deposited is of the following composition 10 20% Cu, 10 20% Cd and the remainder Au.
5. The process of claim 1 in which the gold alloy deposited is of the following composition 12 13% Cu, 12 13% Cd and the remainder Au.
References Cited in the file of this patent UNITED STATES PATENTS 2,141,157 Peterson Dec. 20, 1938 2,451,341 Iernstedt Oct. 12, 1948 2,724,687 Spreter et a1 Nov. 22, 1955 FOREIGN PATENTS 1,032,636 Germany June 19, 1958
Claims (1)
1. IN A PROCESS FOR THE ELEECTROLYTIC DEPOSIT OF GOLD-COPPER-CADMIUM ALLOYS FROM AQUEOUS ALKALINE CYANIDE BATHS USING PERIODICALLY REVERSED DIRECT CURRENT, THE STEPS WHICH COMPRISE ELECTROLYTICALLY DEPOSITING A GOLD-COPPER-CADMIUM ALLOY FROM AN AQUEOUS CYANIDE BATH MAINTAINED AT A PH OF 9 - 11 AND CONTAINING 1 TO 3 G. PER LITER OF GOLD AS POTASSIUM GOLD CYANIDE, 5-15 G. PER LITER OF COPPER AS AN ALKALI METAL COPPER CYANIDE SELECTED FROM THE GROUP CONSISTING OF POTASSIUM- AND SODIUM COPPER CYANIDES, 0.1 TO 0.8 G. PER LITER OF CADMIUM AS AN ALKALI METAL CADMIUM CYANIDE SELECTED FROM THE GROUP CONSISTING OF POTASSIUM- AND SODIUM CADMIUM CYANIDES AND 3 TO 8 G. PER LITER OF FREE CYANIDE CALCULATED AS POTASSIUM CYANIDE, THE DURATION OF EACH CATHODIC PHASE BEING 4 TO 20 SECONDS AND THE DURATION OF EACH ANODIC PHASE BEING 0.5 TO 2 SECONDS AND MAINTAINING A CURRENT DENSITY OF 0.5 TO 2 A./DM.2 DURING THE CATHODIC PHASE AND A CURRENT DENSITY OF 0.75 TO 3.75 A./DM.2 DURING THE ANODIC PHASE, WHEREBY THE RATIO OF CATHODIC TO ANODIC CURRENT DENSITY IS LESS THAN 1:1.5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US106182A US3056733A (en) | 1960-04-23 | 1961-04-28 | Process for electrolytic deposition of gold-copper-cadmium alloys |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DED0033180 | 1960-04-23 | ||
US106182A US3056733A (en) | 1960-04-23 | 1961-04-28 | Process for electrolytic deposition of gold-copper-cadmium alloys |
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US106182A Expired - Lifetime US3056733A (en) | 1960-04-23 | 1961-04-28 | Process for electrolytic deposition of gold-copper-cadmium alloys |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4179344A (en) * | 1973-07-02 | 1979-12-18 | Lea-Ronal, Inc. | Gold alloy plating compositions and method |
US4486275A (en) * | 1983-02-07 | 1984-12-04 | Heinz Emmenegger | Solution for electroplating a gold-copper-cadmium alloy |
US4547436A (en) * | 1982-11-19 | 1985-10-15 | E. I. Du Pont De Nemours And Company | Conductive element metallized with a thick film gold composition |
WO2001038609A1 (en) * | 1999-11-29 | 2001-05-31 | Enthone-Omi Inc. | METHOD OF PRODUCING AuCuGa ALLOY COATING USING ELECTROLYSIS, AND ALLOYS PRODUCED BY SUCH A METHOD |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2141157A (en) * | 1938-08-23 | 1938-12-20 | Metals & Controls Corp | Alloy |
US2451341A (en) * | 1945-08-10 | 1948-10-12 | Westinghouse Electric Corp | Electroplating |
US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
DE1032636B (en) * | 1956-09-08 | 1958-06-19 | Degussa | Supplementary solution to reduce the increase in alkalinity in cyanidic baths for the galvanic deposition of gold alloys |
-
1961
- 1961-04-28 US US106182A patent/US3056733A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2141157A (en) * | 1938-08-23 | 1938-12-20 | Metals & Controls Corp | Alloy |
US2451341A (en) * | 1945-08-10 | 1948-10-12 | Westinghouse Electric Corp | Electroplating |
US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
DE1032636B (en) * | 1956-09-08 | 1958-06-19 | Degussa | Supplementary solution to reduce the increase in alkalinity in cyanidic baths for the galvanic deposition of gold alloys |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4179344A (en) * | 1973-07-02 | 1979-12-18 | Lea-Ronal, Inc. | Gold alloy plating compositions and method |
US4547436A (en) * | 1982-11-19 | 1985-10-15 | E. I. Du Pont De Nemours And Company | Conductive element metallized with a thick film gold composition |
US4486275A (en) * | 1983-02-07 | 1984-12-04 | Heinz Emmenegger | Solution for electroplating a gold-copper-cadmium alloy |
WO2001038609A1 (en) * | 1999-11-29 | 2001-05-31 | Enthone-Omi Inc. | METHOD OF PRODUCING AuCuGa ALLOY COATING USING ELECTROLYSIS, AND ALLOYS PRODUCED BY SUCH A METHOD |
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