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US2918439A - Resins from bis(2,3-epoxy-cyclopentyl) ether - Google Patents

Resins from bis(2,3-epoxy-cyclopentyl) ether Download PDF

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US2918439A
US2918439A US629473A US62947356A US2918439A US 2918439 A US2918439 A US 2918439A US 629473 A US629473 A US 629473A US 62947356 A US62947356 A US 62947356A US 2918439 A US2918439 A US 2918439A
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bis
ether
epoxycyclopentyl
composition
resins
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US629473A
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Phillips Benjamin
Paul S Starcher
Jr Charles W Mcgary
Jr Charles T Patrick
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Union Carbide Corp
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Union Carbide Corp
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Priority to BE563326D priority patent/BE563326A/xx
Priority to US629476A priority patent/US2921925A/en
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Priority to US629473A priority patent/US2918439A/en
Priority to GB39334/57A priority patent/GB839906A/en
Priority to FR1209899D priority patent/FR1209899A/en
Priority to DE1420796A priority patent/DE1420796C3/en
Priority to DEU5000A priority patent/DE1233607B/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Definitions

  • resins are suitable for a variety of applications, for example, Wherein strength and load carrying capabilities at elevated temperatures, in addition to hardness and toughness, are required.
  • Our solid resins can also be made with high degrees of hardness and are particularly valuable as durable, wear-resistant and scratch-resistant materials. They can be made as transparent solids, colored solids, and as solids which are capable of being machined and polished.
  • Anion exchange properties are other characteristics of resins which can be made by our invention. Insolubility in most organic solvents is another property that is characteristic of the resins of our invention.
  • the resin was infusible.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Polyesters Or Polycarbonates (AREA)

Description

2,918,439 a RES INS FROM BIS(2,3-EPOXY-CYCLOPENTYL) ETHER Benjamin Phillips and Paul S. Starcher, Charleston, and Charles W. McGary, Jr., and Charles T. Patrick, Jr.,
South Charleston, W. Va., assignors to Union Carbide Corporation, a corporation of New York No Drawing. Application December 20, 1956 Serial No. 629,473
26 Claims. (Cl. 260-2) This invention relates to curable compositions and resinous compositions made therefrom. More particularly, this invention is directed to amine-epoxide compositions which are useful in the synthetic resins art for adhesives, protective coatings, castings, laminates, films and the like, and to processes for their preparation.
Our resinous compositions can be obtained as hard, tough, solid resins, semi-solid resins and viscous, liquid resins from mixtures containing bis(2,3-epoxycyclopentyl) ether and polyfunctional amines. Our solid resins can be made as infusible materials with high heat distortion values and capable of supporting loads of up to 264 pounds per square inch at temperatures as high as 180 C. to 200 C., and above. Resins having high room temperature flexural strengths, of over 22,000 pounds per square inch, and high room temperature compressive strengths, of the order of 46,200 pounds per square inch and higher, can be made in accordance with our invention. flexural strengths at elevated temperatures, forexample, over 11,000 pounds per square inch at 150 C. and over 9,000 pounds per square inch at 175 C. These resins are suitable for a variety of applications, for example, Wherein strength and load carrying capabilities at elevated temperatures, in addition to hardness and toughness, are required. Our solid resins can also be made with high degrees of hardness and are particularly valuable as durable, wear-resistant and scratch-resistant materials. They can be made as transparent solids, colored solids, and as solids which are capable of being machined and polished. Anion exchange properties are other characteristics of resins which can be made by our invention. Insolubility in most organic solvents is another property that is characteristic of the resins of our invention.
Our semi-solid and viscous liquid resins can be made so as to contain reactive epoxy groups or reactive amino hydrogens. Semi-solid or viscous liquid resins containing reactive epoxy groups are obtainable having plasticizing and stabilizing properties for chlorine containing polymers, e.g., polyvinyl chloride and chlorinated rubbers. These epoxy-containing resins also are reactive with active hydrogen compounds, such as, polyhydric alcohols and polyfunctional amines, with active hydroxyl compounds, e.g., polycarboxylic acids, or with polycarboxylic acid anhydrides. These resins are useful, for example, in coating formulations and are advantageous in that tack-free films can be formed and cured rapidly by heating. Amino hydrogen containing resins of our invention are non-volatile and are free of objectionable odors. They are capable of reacting with epoxides and polyepoxides in forming valubale resins.
The curable compositions of this invention can be prepared by mixing bis(2,3-epoxycyclopentyl) ether and a polyfunctional amine in liquid form at roomtempera Moreover, such resins have high 2,918,439 Patented Dec. 22, 1959 ture or higher temperatures. By the term polyfunctional amine, as used herein, is meantan amine having at least two active amino hydrogen atoms which can be on the same nitrogen or on different nitrogen atoms. Bis(2,3-epoxycyclopentyl) ether can be maintained as a liquid at room temperatures without the use of solvents or diluents. There is little, or no necessity for heating to high temperatures or for the use of solvents or reac tive diluents in order to obtain a homogeneous mixtureof the amine and diepoxide, although such measures canbe employed, if desired. These mixtures, can be kept for long periods, up to a week and longer, at roomtemperatures with substantially no increase in viscosity,
.thus making such mixtures particularly suited for appli-- cations wherein a long pot-life is desired.
Our resinous compositions can be prepared from these curable compositions by the application of heat. The curing can be carried out by maintaining the curable compositions attemperatures from 30 C. to 250 C. Temperatures higher than 250 C. can be used although some discoloration which may not be desired may be brought about in the resinous compositions thus'formed. The time for elfecting the complete cure can be made to vary from a few minutes to several hours depending upon the selection of curing temperature. A high curing temperature will provide a resinous composition in less time than a low curing temperature. It is preferred, however, to heat the composition at a temperature within the range from 50C. to 150C. to first partially cure the composition. A temperature from C. to 200 C. then can be used to complete the cure. temperatures within the above-specified range of 30 C. to 250 C. can be employed if desired to eifect the complete cure.
While not wishing to be held to any particular theory or mechanics of reaction, itis believed that in curing one epoxy group of a bis(2,3-epoxycyclopentyl) ether molecule reacts, with a maximum of one amino hydro gen of a polyfunctional amine molecule with the formation of a hydroxyl group attached to the ether molecule and a carbon to nitrogen to. carbon linkage connecting the ether and amine molecules. Thus, a. polyfunctional amine having'more than 2 amino hydrogens to the molecule would cross-link through carbon to nitrogen to carbon linkages, as is believed to occur. Also, according to our observations a degree of etherification occurs from intermolecular reactions of two or more epoxy such relative proportions, for example, as'provide from about 0.3 to 4 amino hydrogens of amine foreach epoxy group of the ether. Solid resins that are particularly valuable from the standpoint of their outstanding properties of hardness, toughness, infusibility, high heat distortion values and insolubility in most'organic solvents can be produced in accordance with our teachings. Illustra T tively, such particularly valuable resins can be produced by curing mixtures of polyfunctional amines and bis- However, any one or combination of two or more.
( 2 ,3 ep oxycyc1open tyl) ether ,in relative proportions providing from 0.4 to 2 amino hydrogens of the amine for each epoxy group of the ether. Anion exchange resins can be produced from mixtures of polyfunctional amines and bis(2,3-epoxycyclopentyl) ether in relative proportions 'providing, for example, from about 1 to 3 amino hydrogens of the amine for each epoxy group of the ether.
Our solid resins are useful in producing a large variety of molded or cast articles of manufacture. Thus, our curable compositions can be cast or molded in many different sizes and shapes to form such articles as buttons, combs, brush handles, childrens toys, structural parts'for instrument and radio cabinets and the like. By partially curing solid resin producing compositions to form a gel a heat hardenable composition can be obtained. This'heat hardenable composition then can be granulated or reduced to powderform and used as a moldingor casting composition, with, or without the addition of other ingredients. Fillers, e.g., talc, wood flour, alpha cellulose and the like, and pigments, e.g., titanium dioxide, antimony oxide, zinc oxide, carbon black and the like may be incorporated with our compositions to produce colored opaque objects.
Those of our solid resins which have high heatdistortion values are useful in industrial applications wherein load carrying capabilities at high temperatures in addition to hardness and toughness is required. Such applications include hot fluid carrying conduits, high temperature electrical insulation, e.g., in high-speed aircraft and guided missiles, tools, dies and molds used at high tem eratures, and various laminates, molded articles, adhesives an surface coatings which are subject to high temperature uses.
Cur solid resins are also useful as coatings and the like for providing durable surfaces to objects. Of particular note in this regard is the fluid nature of our curable compositions making them particularly Well suited for easy application to surfaces by such conventional methods as brushing spraying, spreading and the like. This application can be performed without a solvent although one may be emploved if desired. Pigments may also be added to provide coloration to the coating or the com osition mav be applied without a pigment to give a coatin of natural color or trans arency.
A further use of these compositions is in the field of adhesives. These compositions, when cured, adhere tenaciously to many types of materials, e.g., wood, cloth, metal; glass, paper and the like. In this respect they are particularly useful in manufacturing laminates of the above materials.
Anion exchange resins also can be made according to our teachings herein. Solid resins having anion exchange properties can be produced from mixtures of polyfunctional amines and bis(2,3 epoxycvclopentyl) ether. Anoutstanding feature of this use is that our compositions can be'easily cast or molded into any shape to fit specific anion-exchange applications.
Liquid resins containing reactive groups can be made from our curable compositions. Illustratively. such liquid resins can be made by curing mixtures of polyfunctional amines and bis(2,3-epoxvcyclopentyl) ether in such relative amounts as to provide, for example, less than about .3 or more than about 4 arninofhydrogens of amine for each epoxy group of ether. More particularly, liquid resins containing reactive epoxy groups can'be made by curinga composition containing, for example, less than .3 amino hydrogens for each epoxy group. Such epoxy group-containing liquid resins find particularly valuable uses in coating formulations wherein additional polyfunctional 'amine' hardeneror other active hydrogenc'om pound, e.g., polyhydricphenols, polyhydric alcohols, or
, application as tack-free films and can be cured rapidly by'heating. Other uses for our epoxy group-containing liquid resins are as plasticizers because of their lowvolatility and as stabilizers for chlorine containing polymers. Polyvinyl chloride, polyvinylidene chloride and chlorinated rubbers have been found to discolor and deteriorate upon exposure to strong sunlight or the ravages of nature for prolonged periods. It has been discovered that our epoxy containing compositions tend to discourage such discoloration and deterioration. Again more particularly, liquid resins containing reactive amino hydrogens can be produced by curing our amine-epoxide mixtures which contain, for example, more than 4 amino hydrogens for each epoxy group. Liquid resins containing reactive amino hydrogens have the particular properties of being of nonvolatile nature and free from objectionable odors. They can be used in applications where an active hydrogen compound is needed, for ex ample, in hardening "polymerizable epoxide compositions such as the reaction products of polyhydric phenols and epichlorhydrin.
Our resinous compositions can be regarded as mixtures of polymeric molecules characterized by the presence therein of interconnected units comprising polyvalent' polyfunctional amine residues and tetravalent dicyclopentyl ether groups having hydrocarbon cyclopentanerings joined in pairs through carbon to oxygen to carbon linkages. Each of the rings have one valence onthe 2-- position carbon atom and one valence on the 3-positioncarbon atom, one valence of a given cyclopentane ring i being attached to an amino nitrogen atom of one of said polyvalent polyfunctional amine residues, a carbon. to nitrogen to carbon linkage thereby interconnecting the polyvalent polyfunctional amine residues and the tetra-- valent dicyclopentyl other group, and not more than one other valence of a given cyclopentane ring being attached to a hydroxyl group. By the term, polyvalent polyfunctional amine residue, as used herein, is meant a polyvalent group which can be regarded as the residue of a polyfunctional amine molecule which is lacking at least two amino hydrogensj By the terms 2-position carbon I is that carbon atom forming one end of the carbon to active hydroxyl compound, e'.g., polycarboxylic acids, or
oxygen to carbon linkage joining two of said rings into a tetravalent dicyclopentyl ether group as shownm the following graphic'formula:
The polymeric molecules of our resinous compositions are closs-linked, linear or cyclic in nature and can be terminated by o'neor more monovalent organic groups or,
in the case of cyclic moleoules. need not be terminated. As terminal groups. for our polymeric-molecules, monovalent groups from the class of 2, 3 epoxycyclopentyloxy- I Z-hydroxycyclopentyl group, 2,3-epoxycyclopentyloxy 3 valent polyfunctional amine residues,v as used herein, is
meant monovalent groups which can be regarded as the residue ofa polyfunctional amine molecule which is lack ing one amino hydrogenm Bis( 2, 3-epoxycyclopentyl) ether is a'liquid diepoxy dicyclic aliphatic etherv having aviscos'ity of about 28 centipoises at 2 7? .The preparation of this diepoxide' involves what can be termed epoxidation, or the controlled oxidation of the double bonds of bis(2-cyclopentenyl) other which, isself, can be made from cyclopentadiene by the successive steps of hydrochlorination and alkaline hydrolysis. More specifically, bis (2-cyclope ntenyl) ether can be prepared from the reaction of cyclopentadiene with hydrogen chloride in a suitable solvent, e.g., benzene, or without a solvent, for a period of about one hour at a low temperature, such as 0 C. to 15 .C., thereby forming 1-chl0ro2-cyclopentene. Subsequently, l-chloro-Z- cyclopentene can be subjected to alkaline hydrolysis with an aqueous solution of sodium carbonate or sodium hydroxide at a temperature of the order of 40 C. to 60 C. to, form bis'(2-cyclopentenyl) ether. A substantially pure bis(2-cyclopentenyl) ether then can be obtained by any suitable separation procedure, for example, fractional distillation.
Suitable epoxidizing agents for the epoxidation reaction include peracetic acid and acetaldehyde monoperacetate. The epoxidation reaction can be advantageously carried out by charging bis(2-cyclopentenyl) ether to a reaction vessel and then gradually adding the epoxidizing agent. In order to provide ease of handling and to avoid the for mation of highly concentrated or crystalline peracetic acid with its attendant explosion hazard, the epoxidizing agent preferably is employed as a solution in a suitable solvent, asfor example, acetone, chloroform, methylethyl ketone, ethyl acetate, butyl acetate, and the like. The reaction can be carried out at a temperature within the range of about 25 C. to 150 0, although lower and higher temperatures may be used. However, longer reac' tion times are needed at the lower temperatures to produce high yields. At the higher temperatures, side reactions form undesirable materials which can be removed, however, by suitable purification procedures, such as, fractional distillation. The reaction is continued until an analysis for epoxidizing agent indicates that an amount at least sufiicient to epoxidize all the double bonds of the bis(2-cyclopentenyl) ether has been consumed. In this connection it is desirable to employ an excess over the theoretical amount of peracetic acid to assure complete epoxidation. Upon discontinuance of the reaction, byproducts, solvent and unreacted material are removed by any convenient procedure, such as, by adding a potboiler, e.g., ethylbenzene, and stripping low-boiling materials. A liquid material, identified as bis(2,3-epoxycyclopentyl) ether, is obtained. This product partially solidifies on standing at room temperature for 1 to 3 days which indicates the possible formation of a solid position isomer. This semi-solid bis(2,3-epoxycyclopentyl) other can be liquefied by melting at a temperature of 30 C. to 35 C. and will remain a liquid for a period of several days at room temperature.
Polyfunctional amines are typified by the aliphatic primary amines, such as, ethylamine, isopropylamine, nbutylarnine, isobutylamine, 2-ethylhexylamine, monoethanolamine, monoisopropanolamine, beta alanine, amides, e.g., formamide, acetamide, propionamide, nbutyroamide, stearamides, hexahydrobenzamide, and the like; aromatic primary amines, such as, aniline, paramethylbenzylamine, and the like; heterocyclic primary amines, such as, N-(aminoethyl) morpholine, N-(aminopropyl) morpholine, and the like, the aliphatic polyamines, such as, ethylenediamine, propylenediamines, butylenediamines, pentylenediamines, hexylenediamines, octylenediamines, nonylenediarnines, decylenediamines, dimethylurea, 1,3-diamino-2-propanol, 3,3-iminobispro pylamine, guanidine and the like; aromatic polyamines, such as meta-, ortho-, and para-phenylenediamines, 1,4- naphthalenediamine, 1,4-anthradiamine, 3,3'-biphenyldiamine, 3,4-biphenyldiamine, 3,4-toluenediamine, meta xylylenediamine, alpha, alpha-bi-paratoluidine, para, para-methylenedianiline, 1methoxy-6-methylmeta-phenylenediamine, para, para'-sulfonyldiamine and the like; and heterocyclic polyamines, such as piperazine, 2,5.di-
methylpiperazine, melamine, 2,4-diamine-5-(aminomethyl) pyrimidine, 2,4,6-triaminopyrimidine, 3,9-bis(aminoethyl) spirobi-metadioxane, the polyalkylene polyamines, in particular, the polyethylene polyamines and polypropylene polyamines, such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine, and the like.
Other polyfunctional amines include the low molecular weight polyamides Which are condensation products of polycarboxylic acids, in particular, hydrocarbon dicarboxylic acids, with polyamines, particularly, diamines, such as those monomeric diamines previously listed. Typical polyamides can be prepared in accordance with known condensation procedures from adipic acid and hexamethylenediamine, dilinoleic acid and ethylenediamine, terephthalic acid and diethylenetriamine and the like.
Still other illustrations of polyfunctional amines are the addition products of polyamines, in particular diamines, and triamines, and low molecular weight epoxides containing oxirane oxygen linked to vicinal carbon atoms, such as, ethylene oxide, propylene oxide, butadiene dioxide, diglycidyl ether, epoxidized soybean oil, epoxidized safilower oil, and the like, and polyglycidyl polyethers, such as those prepared from polyhydric phenols and epichlorhydrin. Particularly useful polyfunctional amines are the monoand poly-hydroxyalkyl polyalkylene polyamines which can be prepared by the addition reaction of polyalkylene polyamines, preferably, ethylenediamine, propylenediamine, diethylenetriamine, dipropylenetriamine or triethylenetetramine and the like, with ethylene oxide or propylene oxide. This reaction can be conducted under pressure at temperatures of 50 C. or 55 C. to boiling in the absence of solvents or in the presence of water or an alcohol. However, the reaction is more advantageously carried out at temperatures below 40 C. and preferably below 35 C. without pressure. The amines so produced include N-hydroxyethylethylenediamine, N,N-bis(hydroxyethyl)ethylenediamine, N-bis- (hydroxyethyl) diethylenetriamine, N,N-bis (hydroxyethyl) diethylenetriamine, N,N" bis(hydroxyethyl)diethylenetriamine, N-hydroxypropyldiethylenetriamine, N,N- bis (hydroxypropyl) diethylenetriamine, N,N" bis(hydroxypropyl)diethylenetriamine, N-hydroxyethylpropylenediamine, N-hydroxypropyl-propylenediamine, N hydroxyethyldipropylenetriamine, N,N-bis(hydroxyethyl)dipropylenetriamine, N,N bis(hydroxyetl'1yl)dipropylenetriamine, tris(hydroxyethyl)triethylenetetramine and the like. Other polyfunctional amines can be prepared with known procedures by the addition reaction of polyglycidyl polyethers of dihydric phenols and polyamines, in particular, polyalkylene polyamines. Of particular importance in forming these epoxide polyamine adducts are the diglycidyl diethers of dihydric phenols, such as for example, the homologues of dihydroxydiphenylmethanes singularly or mixed and the di'hydroxydiphenyldimethylmethanes singularly or mixed. Mixtures of diglycidyl diethers of dihydric phenols can be prepared by reacting epichlorhydrin with a dihydric phenol using a molar excess of epichlorhydrin over the theoretical molar requirement. Substantially pure cuts of the diglycidyl diethers then can be obtained by fractional distillation under reduced pressure, for example. lllustratively, the polyfunctional amine, i.e., the epoxidepolyamine adduct, itself can be prepared by mixingthe diglycidyl polyether of a dihydric phenol with a polyalkylene diamine such as diethylenetriamine, dipropylenetriamine, and the like, bringing to an elevated temperature, for example, up to about 200 C. and maintaining at such an elevated temperature for a period of from 4 to 5 hours. Alternatively, as an illustration, polyfunctional amines can be prepared by adding a diglycidyl diether of a dihydric phenol to a polyalkylene polyamine over a period of time around three to four hours, while maintaining the reac tion mixture at an elevated temperature, for example, up to about 200 C. -and subsequently adding a dihydric phenol.
Additional polyfunctional amines include the low molecular weight addition products of a polyamine, preferably a polyalkylene polyamine such as those listed above, and a vinyl group-containing compound. ,Typical vinyl group-containing compounds are ethylene, propylene, l-butene, isobutene, acrolein, vinyl chloride, vinyl acetate, acrylonitrile, styrene and the like. These-polyfunctional amines can be prepared in accordance with known procedures by reacting a polyamine and a vinyl group-containing compound in various proportions at a temperature in the range from 20 C. to 100 C. and removingunreacted materials and-low boiling materials by vacuum distillation.
.Other polyfunctionalamines having atotal of at least two active-amino hydrogen atoms to the molecule can be advantageously employed in the epoxide; compositions of this invention. For example, such polyfunctional amines as mixtures of para,para'-methylenedianiline and meta-phenylenedianiline, or other mixtures of two or more polyfunctional amines, can be used. Particularly valuable compositions made in accordance with this invention are obtainable from bis 2,3-epoxycyclopentyl) ether and such polyfunctional amines as described above which have melting points or melting point ranges below about 150 C.
The following illustrative examples are presented. Wherever appearing in these examples, heat distortion values were obtained at 264 pounds per square inch of stress in accordance with ASTM test method D-648-45T. Barcol hardness values presented in the examples were determined through the use of a Barcol Impressor GYZJ 934-1 at a temperature of 25 C. unlessotherwise indicated. Izod impact values as presented in the examples were obtained in accordance with ASTM test method, D-256-47T at a temperature of 25 C. unless otherwise indicated. vRockwell hardness values, flexural strengths, compressive strengths, tensile strengths and compressive yields given in the examples were all determined in accordance with ASTM test procedures at a temperature of about 25 C. unless otherwise indicated.
EXAMPLE 1 -A mixture of 0.29 gram of 1,6-hexanediamine and 0.92 gram of bis(2,3-epoxycyclopentyl) ether was prepared and calculated as containing one amino hydrogen atom for each epoxy group. The mixture was maintained at 120 C. and after 67 minutes formed a gel. The gel was heated to 160 C. for 3 hours and converted into a transparent, amber resin having a Barcol hardness of 35. This resin was infusible.
EXAMPLE 2 A mixture was prepared from 0.43 gram of 1,6-hexanediamine and 0.92 gram of bis(2,3-epoxycyclopentyl) ether. The proportions of 1,6-hexanediamine and bis(2,3- epoxycyclopentyl) ether were calculated as containing 1.5 amino hydrogen atoms for each epoxy group. The mixture was placed in a mold and heated at a temperature of 120 C. for about 18 minutes during which time a gel formed. The gel was heated for 3 hours at a temperature of about 160 C. A transparent resin having a Barcol hardness of 30 was formed. This resin was infusible.
EXAMPLE 3 A mixture was prepared from 0.27 gram of para-phenylenediamine and 092 gram of bis(2,3-epoxycyclopentyl) ether and placed in a mold for curing. This mixture contained proportions of para-phenylenediamine and bis(2,3:epoxycyclopentyl) ether which were calculated as containing 1 amino hydrogen atom for each epoxy group. The mixture was heated at a temperature s of about 120 C. and a gel formed within 27 minutes of heating at this temperature. The gel was heated for three hours at a temperature of about 160 C. and by the end of this time had converted to a resin having a Barcol'hardne'ss of 48. This resin was infusible.
' EXAMPLE 4 A mixture of 6 moles of epichlorhydrin and 1 mole of 4,4-dihydroxydiphenyldimethylmethane was heated in the presence of a small quantity of water. Sodium hydroxide (2.04 moles) was added in installments and heat was discontinued as the temperature reached about 80 C. and cooling was started to maintain the temperature below 100 C. After the exotherm had subsided and all the sodium hydroxide had been added, excess epichlorhydrin and the water were removed by vacuum distillation. The residue was cooled after the addition of 50 ml. of benzene and the salt was removed, by filtration. After removingthe benzene by vacuum distillation, the resulting polyglycidyl polyether had an aver} age molecular weight of 380 and an epoxide equivalent, i.e., grams of polyether per epoxy group, of 190 as calculated by a standard epoxy analysis using pyridine hydrochloride reagent.
EXAMPLE 5 The polyglycidyl polyether such as that obtained in Example 4, and diethylenetriamine were mixed. in the proportions of 1.0 mole of polyether and 6.0 moles of triamine. The reaction mixture then was heated to a temperature of 100 C. and then was maintained at that temperature for a period of 2 hours. After this period, two moles of excess diethylenetriamine were removed by vacuum distillation maintaining the kettle at 100 C. At the end of this operation 795 grams of a liquid residue representing an epoxide-polyamine adduct having a viscosity of 9000 centipoises was obtained. This epoxidepolyamine adduct analyzed as containing 52 percent by Weight of reacted diethylenetriamine by determination of amino groups utilizing a perchloric acid titration to methyl violet endpoint in glacial acetic acid.
EXAMPLE 6 A mixture of 35 percent by weight of the epoxidepolyamine adduct as prepared in Example 5 and 65percent by weight of bis(2,3-epoxycyclophenyl) ether was prepared. The ratio of active amino hydrogen atoms per epoxy group in this mixture was calculated as about 0.94. This mixture was brought to and maintained at the following temperatures; first, a temperature of about 50 C. for 4 hours, then, a temperature of 75 C. for 2 more hours and, finally, a temperature'of about C. for an additional 1.5 hours. During this time a gel was formed. This gel was thenheated successively at C. for 2 hours and at 160 C. for- 2 hours. After this heat treatment a resin was obtained and was found to have a Barcol hardness of 44 and a heat distortion point of 159 C. at 26.4 pounds per square inch. This resin was infusible.
EXAMPLES 7 THROUGH 19 Thirteen mixtures, each containing bis(2,3 -epoxycyclopentyl) ether and diethylenetriamine in the respective amounts ingrams shown in columns I and II of Table I were prepared. The ratio of the number of active amino hydrogen atoms per epoxy group of each mixture are correspondingly listed in column III of Table I. Each mixture was maintained at a temperature of C. for the periods of time listed in column IV of Table I and then at a temperature of 160 C1for from 4 to 6 hours. After maintaining the mixtures of Examples 10 through 17 at a temperature of about 120 C. for the time specified in column IV, gels formed in each case. After maintaining the mixtures of Examples 7, 8 and 9 at 120 C. for, respectively, 8, 2 and 2.25
T able I I II III IV V Grams of Ratio of Cure Example Bis (2,3- Grams of Active Amino Tune in Barcol Number eporycylo- Dietlxylene- Hydrogen Hours at Hardness pentyl triarnine Atoms Per 120 C.
Ether Epoxy Group The resins of Examples 7, 16 and 17 were softer but infusible.
EXAMPLES 20 THROUGH 33 Fourteen mixtures were prepared as follows. Bis (2,3- epoxycyclopentyl) ether and p,p-methylenedianiline were mixed in various proportions as listed in Table II. The mixture thus obtained contained ratios of active amino hydrogen atoms per epoxy group as correspondingly listed in Table II below.
Table II Ratio of Bis (2,3-epoxyp,p-Methylene- Active Amino Example Number cyclopentyl) dianiline Hydrogen Ether (Grams) (Grams) Atoms Per Epoxy Group O. 91 0. 099 0. 2 0. 91 0. 148 0. 3 0. 91 0. 198 0. 4 27. 6 7. 4 O. 49 25. 8 9. 2 0. G 24. 2 10. 8 0. 82 22. 8 12. 2 0. 98 18. 0 12. 0 1. 22 16. 5 13. 5 1. 50 0. 91 H 0. 99 2. 0 0. 91- 1. 24 2. 5 0. 91 1. 48 3. 0 0. 91 1. 73 3. 5 0. 91 1. 97 4. 0
The mixtures thus obtained were warmed until homogeneous melts were formed. The melts of Examples 20, 21, 22 and 29 through 33 were maintained at a temperature of about 120 C. for 29.5 hours. Each melt of Examples 23 through 28 was formed into a casting by maintaining at a temperature of about 80 C. for 25 to 50 hours and then at a temperature of 160 C. for an additional 6 hours. Transparent, solid resins having the properties correspondingly listed in Table III below were obtained from the melts of Examples 21 through 33 whereas a viscous. liquid resin was formed from the melt of Example20. The resins of Examples 22 through 29 were tough and infusible in addition to the below listed properties. Determinations of heat distortion and Izod impact values at about 25 C. were not made for Examples through 22 and Examples 29 through 33.
. Table III Bareol Heat Dis- Izod Impact Example Number Hardness tortion (foot-pounds/ C.) inch of notch) Mixtures of bis(2,3-epoxycyclopentyl) ether and amines such as those described in the preceding examples have been kept for periods of one week and longer at room temperatures (about 25 C.) without any appreciable increase in viscosity.
EXAMPLE 34 A mixture of 1.82 grams of bis(2,3-epoxycyclopentyl) ether and 0.93 gram of aniline was prepared. This mixture contained proportions of aniline and diepoxide providing one active amino hydrogen atom per epoxy group. The mixture was brought to C. and maintained at this temperature for about 26 hours. After this time, the temperature of the mixture was raised to C. and held for 6 additional hours. There was'obtained a transparent, dark brown resin.
EXAMPLE 35 A mixture of 1.82 grams of bis(2,3-epoxycyclopentyl) ether and 1.29 grams of Z-ethylhexylamine was prepared. This mixture contained proportions of amine and diepoxide providing one active amino hydrogen atom per epoxy group. The mixture was cured for 26 hours at a temperature of 120 C. and then for 6 hours at 160 C. There was obtained a transparent, dark brown resin.
EXAMPLE 36 obtained:
Heat distortion C 179 Rockwell hardness M-120 Flexural strengths:
Room temperature (about 25 C.) p.s.i 22,900
150 C p.s.i 11,400 C. p.s.i 9,100 Compressive strength p.s.i 46,200 Compressive yield p.s.i 28,100 Tensile strength -p.s.i 8,500
The resin was infusible.
EXAMPLE 37 A homogeneous mixture of 0.91 gram of bis(2,3- epoxycyclopentyl) ether and 0.34 gram ofmeta-xylylene diarnine was prepared at room temperature. The mixture contained proportions of amine and diepoxide providing one active amino hydrogen atom per epoxy group. The temperature of the mixture was raised to about 120 C. and held there for about 6 hours during the first 30 minutes of which time a gel was formed. The temperature of the gel then was raised to about 160 C. and held there for about 6 hours. A tough resin having a Barcol hardness of 46 was thus obtained. The resin was infusible.
EXAMPLE 38 A mixture was prepared from 0.91 gram of bis(2,3- epoxycyclopentyl) ether and 1.82 grams of a polyamide known as Versamid 115, which is a commercially available polyamide having an amine number of 220 which represents the number of milligrams of KOH equivalent to 1 gram of polyamide and a viscosity of 625 poises at 40 C. The amounts of bis(2,3-epoxycyclopentyl) ether and polyamide contained by this mixture were such as to provide 0.715 active amino hydrogen atom per epoxy group. The mixture was brought to a temperature of 120 C. and maintained there until a gel formed, requiring about minutes. The gel was maintained at 120 C. for an additional 2 hours and 15 minutes and then was brought to and held at a temperature of 160 C. for 6 hours. An amber, tough, flexible resin was thus obtained.
Our curable compositions can also contain other polyfunctional compounds which are reactive with epoxy groups. For example, polyols or compounds containing more than one aliphatic or phenolic hydroxyl group can be added to our curable compositions and valuable resins can be formed therefrom. Other polyfunctional compounds which can be added are polycarboxylic anhydrides. Also other polyepoxides can be added to our curable compositions which then can be cured to provide useful resins.
What is claimed is:
1. A composition which is curable to a solid resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and a polyfunctional amine in proportions containing from 0.3 to 4.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
2. A composition which is curable to a solid resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and 1,6-hexanediamine in proportions containing from 0.3 to 4.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
3. A composition which is curable to a hard, tough resin, said composition comprising bis(2,3-epoxycyc1opentyl) ether and 1,6-hexanediamine in proportions containing from 0.4 to 2.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
4. A composition which is curable to a solid resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and phenylenediamine in proportions containing from 0.3 to 4.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
- 5. A composition which is curable to a hard, tough resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and phenylenediamine in proportions containing from 0.4 to 2.0 amino hydrogen atoms of the amhine for each epoxy group of bis(2,3-epoxycyclopentyl) et er.
6. A composition which is curable to a solid resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and diethylenetriamine in proportions containing from 0.3 to 4.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
7. A composition which is curable to a hard, tough resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and diethylenetriarnine in proportions containing from 0.4 to 2.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
8. A composition which is curable to a solid resin, said. composition comprising bis(2,3-epoxycyclopentyl) ether and p,p'-methylenedianiline in proportions containing from 0.3 to 4.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
9. A composition which is curable to a hard, tough resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and p,p-methylenedianiline in proportions containing from 0.4 to 2.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
10. A composition which is curable to a solid resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and meta-xylylenedfamine in proportions containining from 0.3 to 4.0 amino hydrogen atoms of theamine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
11. A composition which is curable to a hard; tough resin, said composition comprising bis(2,3-epoxycyclo pentyl) ether and meta-xylylenediamine in proportions containing from 0.4 to 2.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl), ether.
12. A composition which is curable to a solid'resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and 2-ethylhexylamine in proportions containing from 0.3 to 4.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether. I
13. A composition which is curable to a hard, tough resin, said composition comprising bis(2,3-epoxycyclopentyl) ether and 2-ethy1hexylamine in proportions containing from 0.4 to 2.0 amino hydrogen atoms of the amine for each epoxy group of bis(2,3-epoxycyclopentyl) ether.
14. The resin obtained by heating the composition of claim 1.
15. The resin obtained by heating the composition of claim 2.
16. The resin obtained by heating the composition of claim 3.
17. The resin obtained by heating the composition of claim 4.
18. The resin obtained by heating the composition of claim 5.
19. The resin obtained by heating the composition of claim 6.
20. The resin obtained by heating the composition of claim 7.
21. The resin obtained by heating the composition of claim 8.
22. The resin obtained by heating the composition of claim 9.
23. The resin obtained by heating the composition brclaim 10.
24. The resin obtained by heating the composition of claim 11.
25. The resin obtained by heating the composition of claim 12.
26. The resin obtained by heating the composition of claim 13.
References Cited in the file of this patent UNITED STATES PATENTS

Claims (1)

1. A COMPOSITION WHICH IS CURABLE TO A SOLID RESIN, SAID COMPOSITION COMPRISING BIS(2,3-EPOXYCYCLOPENTYL) ETHER AND A POLYFUNCTIONAL AMINE IN PROPORTIONS CONTAINING FORM 0.3 TO 490 AMINO HYDROGEN ATOMS OF THE AMINE FOR EACH EPOXY GROUP OF BIS(2,3-EPOXYCYCLOPENTYL) ETHER.
US629473A 1956-12-20 1956-12-20 Resins from bis(2,3-epoxy-cyclopentyl) ether Expired - Lifetime US2918439A (en)

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US629473A US2918439A (en) 1956-12-20 1956-12-20 Resins from bis(2,3-epoxy-cyclopentyl) ether
US629476A US2921925A (en) 1956-12-20 1956-12-20 Polyepoxide compositions
GB39334/57A GB839906A (en) 1956-12-20 1957-12-18 Reaction products of bis (2:3-epoxycyclopentyl) ether with a polyfunctional amine compound
FR1209899D FR1209899A (en) 1956-12-20 1957-12-19 Preparation of 2,3-epoxycyclopentyl double oxide ether resins
DE1420796A DE1420796C3 (en) 1956-12-20 1957-12-20 Process for the production of epoxy polyadducts
DEU5000A DE1233607B (en) 1956-12-20 1957-12-20 Process for the production of molded parts, coatings and bonds

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3026294A (en) * 1959-09-30 1962-03-20 Du Pont Process for curing chlorosulfonated polyethylene elastomers
US3264248A (en) * 1959-12-03 1966-08-02 Gen Electric Encapsulating compositions containing an epoxy resin, metaxylylene diamine, and tris-beta chlorethyl phosphate, and encapsulated modules
US3314896A (en) * 1961-12-29 1967-04-18 Union Carbide Corp Cyclic epoxides and compositions containing same
US4816533A (en) * 1982-08-12 1989-03-28 Canadian Patents And Development Ltd. Epoxy fortifiers based on aromatic amines

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2739161A (en) * 1954-12-16 1956-03-20 Velsicol Chemical Corp Bis-epoxycyclopentanyl ether

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT171730B (en) * 1949-08-12 1952-06-25 Ciba Geigy Process for the production of elastic plastics
US2609357A (en) * 1950-11-13 1952-09-02 Rohm & Haas Preparation of thermoset resins
BE523503A (en) * 1952-11-03
BE547845A (en) * 1955-05-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2739161A (en) * 1954-12-16 1956-03-20 Velsicol Chemical Corp Bis-epoxycyclopentanyl ether

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3026294A (en) * 1959-09-30 1962-03-20 Du Pont Process for curing chlorosulfonated polyethylene elastomers
US3264248A (en) * 1959-12-03 1966-08-02 Gen Electric Encapsulating compositions containing an epoxy resin, metaxylylene diamine, and tris-beta chlorethyl phosphate, and encapsulated modules
US3314896A (en) * 1961-12-29 1967-04-18 Union Carbide Corp Cyclic epoxides and compositions containing same
US4816533A (en) * 1982-08-12 1989-03-28 Canadian Patents And Development Ltd. Epoxy fortifiers based on aromatic amines

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NL223382A (en)
GB839906A (en) 1960-06-29
DE1420796A1 (en) 1969-01-16
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BE563326A (en)
DE1420796B2 (en) 1973-04-26
FR1209899A (en) 1960-03-04

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