US20150048355A1 - Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device - Google Patents
Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device Download PDFInfo
- Publication number
- US20150048355A1 US20150048355A1 US14/527,167 US201414527167A US2015048355A1 US 20150048355 A1 US20150048355 A1 US 20150048355A1 US 201414527167 A US201414527167 A US 201414527167A US 2015048355 A1 US2015048355 A1 US 2015048355A1
- Authority
- US
- United States
- Prior art keywords
- electrode
- organic
- layer
- upper electrode
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005401 electroluminescence Methods 0.000 title claims abstract description 120
- 238000004519 manufacturing process Methods 0.000 title description 7
- 239000010410 layer Substances 0.000 claims abstract description 235
- 239000012044 organic layer Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims description 61
- 239000002184 metal Substances 0.000 claims description 61
- 239000011575 calcium Substances 0.000 claims description 36
- 229910045601 alloy Inorganic materials 0.000 claims description 35
- 239000000956 alloy Substances 0.000 claims description 35
- 229910019015 Mg-Ag Inorganic materials 0.000 claims description 31
- 239000011241 protective layer Substances 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 25
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 21
- 229910052791 calcium Inorganic materials 0.000 claims description 21
- 239000011777 magnesium Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 229910052783 alkali metal Inorganic materials 0.000 claims description 13
- 150000001340 alkali metals Chemical class 0.000 claims description 13
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052749 magnesium Inorganic materials 0.000 claims description 10
- 229910052738 indium Inorganic materials 0.000 claims description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052747 lanthanoid Inorganic materials 0.000 claims description 8
- 150000002602 lanthanoids Chemical class 0.000 claims description 8
- 239000011734 sodium Substances 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 229910001148 Al-Li alloy Inorganic materials 0.000 claims description 5
- 239000011135 tin Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 81
- 239000000463 material Substances 0.000 description 42
- 238000002347 injection Methods 0.000 description 38
- 239000007924 injection Substances 0.000 description 38
- 239000000758 substrate Substances 0.000 description 38
- 230000003247 decreasing effect Effects 0.000 description 35
- 230000000052 comparative effect Effects 0.000 description 25
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 18
- 230000000694 effects Effects 0.000 description 17
- 238000007789 sealing Methods 0.000 description 16
- 230000007547 defect Effects 0.000 description 15
- 230000007850 degeneration Effects 0.000 description 12
- 230000000717 retained effect Effects 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 11
- 238000001228 spectrum Methods 0.000 description 11
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 10
- 230000002349 favourable effect Effects 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 8
- 230000005525 hole transport Effects 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 230000010363 phase shift Effects 0.000 description 7
- 229910000861 Mg alloy Inorganic materials 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 6
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- DMEVMYSQZPJFOK-UHFFFAOYSA-N 3,4,5,6,9,10-hexazatetracyclo[12.4.0.02,7.08,13]octadeca-1(18),2(7),3,5,8(13),9,11,14,16-nonaene Chemical group N1=NN=C2C3=CC=CC=C3C3=CC=NN=C3C2=N1 DMEVMYSQZPJFOK-UHFFFAOYSA-N 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000003449 preventive effect Effects 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000000391 spectroscopic ellipsometry Methods 0.000 description 3
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000882 Ca alloy Inorganic materials 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- VBVAVBCYMYWNOU-UHFFFAOYSA-N coumarin 6 Chemical compound C1=CC=C2SC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 VBVAVBCYMYWNOU-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 2
- 238000013041 optical simulation Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- -1 8-quinolinol aluminum Chemical compound 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 229910000583 Nd alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000001769 aryl amino group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- WNDSQRGJJHSKCQ-UHFFFAOYSA-N naphthalene-1,5-dicarbonitrile Chemical compound C1=CC=C2C(C#N)=CC=CC2=C1C#N WNDSQRGJJHSKCQ-UHFFFAOYSA-N 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/876—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
-
- H01L51/5234—
-
- H01L27/3244—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/18—Carrier blocking layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80524—Transparent cathodes, e.g. comprising thin metal layers
-
- H01L2251/558—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Definitions
- the present disclosure relates to an organic electroluminescence (EL) device suitable for a device including a resonator structure and a display unit including the same.
- EL organic electroluminescence
- the organic EL device in which electroluminescence of an organic material is used has been already applied to an organic EL display unit as a light emitting device capable of realizing high luminance light emission by low voltage direct current drive.
- the organic EL device has, for example, a structure in which a lower electrode, an organic layer including a light emitting layer, and an upper electrode are sequentially layered over a substrate. Light generated in the light emitting layer is extracted from one of the lower electrode side and the upper electrode side or both sides.
- the upper electrode is made of, for example, a transparent conductive film.
- a metal oxide conductive material such as an oxide of indium and tin (ITO) and an oxide of indium and zinc (IZO) is used.
- the transparent conductive material composed of the metal oxide is used, device characteristics are lowered due to damage at the time of sputtering deposition. Further, a sputtering film is strongly characterized by intruding into and adhering to a projection and a defect section of a deposition face. In addition, in order to express the electric conductivity of the metal oxide, the film thickness thereof should be about 15 nm or more. Thus, there is a high possibility that the metal oxide conductive material adheres to a foreign matter or a defect on the lower electrode or a defect section of the organic film, and short circuit between the upper electrode and the lower electrode is generated.
- a conductive film made of a metal film is also used.
- Japanese Unexamined Patent Application Publication No. 2004-164890 exemplifies a simple body or an alloy of aluminum, magnesium, calcium, sodium and the like.
- the metal film has a thickness of about 10 nm, and functions as an electrode.
- the film thickness of the metal film necessary for expressing electric conductivity is small.
- the metal film is deposited by vacuum evaporation method under high vacuum by using resistance heating, evaporation particle scattering caused by collision with gas molecules is hardly generated, and there is a small possibility that the conductive material intrudes into a foreign matter or a defect on the lower electrode or a defect section of the organic film.
- an upper electrode is made of an oxide conductive material, and a transparent Mg—Ag alloy film having a thickness of 2 nm is provided between an organic layer and the upper electrode in order to improve electron injection characteristics.
- the Mg—Ag alloy film does not have a function as an electrode, and has only a function as an electron injection layer.
- the oxide conductive material is responsible for electric conductivity.
- an organic electroluminescence device in which an upper electrode is made of a metal film, and the thickness of the metal film is able to be thinned down to 6 nm or less while electric conductivity of the metal film is retained, and a display unit including the same.
- an organic electroluminescence device includes a first electrode, an organic layer formed on the first electrode and including a light-emitting layer, an intermediate layer formed on the organic layer, and a second electrode formed on the intermediate layer and having a thickness of 6 nm or less.
- the organic layer includes an electron hole injection layer, an electron hole transport layer, the light-emitting layer, an electron transport layer, and an electron injection layer that are layered in that order from a first electrode side.
- the second electrode is made of a metal conductive film including an alloy comprising one or more of aluminum, magnesium, calcium and sodium.
- the alloy of the second electrode is a Mg—Ag alloy or an Al—Li alloy.
- the intermediate layer includes calcium or aluminum.
- sheet resistance of a film comprising the intermediate layer and the second electrode is 10,000 ⁇ / ⁇ or less. In one embodiment, at least a portion of a metal element contained in the intermediate layer is diffused into the second electrode In another embodiment, the intermediate layer is at least substantially diffused into the second electrode.
- a display device includes at least one organic electroluminescent device.
- the organic electroluminescent device includes a first electrode, an organic layer formed on the first electrode and including a light-emitting layer, an intermediate layer formed on the organic layer, and a second electrode formed on the intermediate layer and having a thickness of 6 nm or less.
- an organic electroluminescence device in another embodiment, includes an intermediate layer, and an electrode formed on the intermediate layer and having a thickness of 6 nm or less.
- a sheet resistance of a film comprising the intermediate layer and the electrode is 10,000 ⁇ / ⁇ or less.
- a method of manufacturing an organic electroluminescence device includes: forming a first electrode; forming an organic layer on the first electrode; forming a laminated film including an intermediate layer and a second electrode by forming the intermediate layer on the organic layer, and forming the second electrode on the intermediate film, wherein a thickness of the second electrode is 6 nm or less.
- the method further includes at least substantially diffusing a material of the intermediate layer into the second electrode, such that the laminated film is an integrated electrode layer composed of the intermediate layer and the second electrode.
- an organic electroluminescence device includes an intermediate layer composed of a metal element such as an alkali metal provided between an upper or second electrode and an organic layer in contact with the upper electrode.
- the thickness of the intermediate layer is from 0.1 nm to 5 nm both inclusive.
- an organic electroluminescence device includes an upper or second electrode containing an alloy of magnesium or the like as a main component, and containing a metal element such as an alkali metal.
- the embodiments are suitable for an organic electroluminescence device in which a resonator structure is included, and light generated in the light emitting layer is resonated between the lower electrode and the upper electrode.
- a display unit includes at least one of the above-described embodiments.
- electric conductivity of the upper electrode is maintained, and the organic electroluminescence device is able to be favorably driven.
- FIG. 1 is a diagram illustrating a structure of a display unit according to a first embodiment.
- FIG. 2 is a diagram illustrating an example of the pixel drive circuit illustrated in FIG. 1 .
- FIG. 3 is a cross sectional view illustrating a structure of the organic EL device illustrated in FIG. 1 .
- FIGS. 4A and 4B are diagrams for comparing view angle characteristics of the organic EL device having the resonator structure illustrated in FIG. 3 to an existing example.
- FIG. 5 is a cross sectional view illustrating a structure of an organic EL device according to a first modified example.
- FIG. 6 is a cross sectional view illustrating a structure of an organic EL device according to a second embodiment.
- FIG. 7 is a cross sectional view illustrating another structure of the organic EL device illustrated in FIG. 6 .
- FIG. 8 is a plan view illustrating a schematic structure of a module including the display unit of the foregoing embodiments.
- FIG. 9 is a perspective view illustrating an appearance of a first application example of the display unit of the foregoing embodiments.
- FIG. 10A is a perspective view illustrating an appearance viewed from the front side of a second application example
- FIG. 10B is a perspective view illustrating an appearance viewed from the rear side of the second application example.
- FIG. 11 is a perspective view illustrating an appearance of a third application example.
- FIG. 12 is a perspective view illustrating an appearance of a fourth application example.
- FIG. 13A is an elevation view of a fifth application example unclosed
- FIG. 13B is a side view thereof
- FIG. 13C is an elevation view of the fifth application example closed
- FIG. 13D is a left side view thereof
- FIG. 13E is a right side view thereof
- FIG. 13F is a top view thereof
- FIG. 13G is a bottom view thereof.
- First embodiment (example that a first resonator structure is structured by a lower electrode and an upper electrode)
- Second embodiment (example that a second resonator structure is structured by providing a resonance adjustment layer on an upper electrode)
- FIG. 1 illustrates a structure of a display unit according to a first embodiment.
- the display unit is used as an organic EL television device or the like.
- an after-mentioned plurality of organic EL devices 10 R, 10 G, and 10 B are arranged in a matrix state over a substrate 11 .
- a signal line drive circuit 120 and a scanning line drive circuit 130 that are drivers for displaying a video are provided on the periphery of the display region 110 .
- FIG. 2 illustrates an example of the pixel drive circuit 140 .
- the pixel drive circuit 140 is an active drive circuit that is formed in a layer located lower than an after-mentioned lower electrode 14 . That is, the pixel drive circuit 140 has a drive transistor Tr 1 , a writing transistor Tr 2 , a capacitor (retentive capacity) Cs between the drive transistor Tr 1 and the writing transistor Tr 2 , and the organic EL device 10 R (or 10 G, 10 B) serially connected to the drive transistor Tr 1 between a first power line (Vcc) and a second power line (GND).
- Vcc first power line
- GND second power line
- the drive transistor Tr 1 and the writing transistor Tr 2 are composed of a general thin film transistor (TFT (Thin Film Transistor)).
- TFT Thin Film Transistor
- the structure thereof is not particularly limited, and may be, for example, inversely staggered structure (so-called bottom gate type) or staggered structure (top gate type).
- a plurality of signal lines 120 A are arranged in the column direction, and a plurality of scanning lines 130 A are arranged in the row direction.
- Each cross section between each signal line 120 A and each scanning line 130 A corresponds to one of the organic light emitting devices 10 R, 10 G, and 10 B (sub pixel).
- Each signal line 120 A is connected to the signal line drive circuit 120 .
- An image signal is supplied to a source electrode of the writing transistor Tr 2 from the signal line drive circuit 120 through the signal line 120 A.
- Each scanning line 130 A is connected to the scanning line drive circuit 130 .
- a scanning signal is sequentially supplied to a gate electrode of the writing transistor Tr 2 from the scanning line drive circuit 130 through the scanning line 130 A.
- the organic EL device 10 R generating red light
- the organic EL device 10 G generating green light
- the organic EL device 10 B generating blue light are sequentially arranged in a matrix state as a whole.
- a combination of the organic EL devices 10 R, 10 G, and 10 B adjacent to each other composes one pixel.
- FIG. 3 illustrates a cross sectional structure of the organic EL devices 10 R, 10 G, and 10 B illustrated in FIG. 1 .
- the organic EL devices 10 R, 10 G, and 10 B respectively have a structure in which the drive transistor Tr 1 of the foregoing pixel circuit 140 , a planarizing insulating film 12 , the lower or first electrode 14 as an anode, an inter-electrode insulating film 15 , an organic layer 16 including a light emitting layer 16 C described later, and an upper or second electrode 17 as a cathode are layered in this order from the substrate 11 side.
- the organic EL devices 10 R, 10 G, and 10 B as above are coated with a protective layer 30 . Further, a sealing substrate 50 made of glass or the like is bonded to the whole area of the protective layer 30 with an adhesive layer 40 in between, and thereby the organic EL devices 10 R, 10 G, and 10 B are sealed.
- the substrate 11 is made of glass, a silicon (Si) wafer, a resin or the like.
- the drive transistor Tr 1 is electrically connected to the lower electrode 14 through a connection hole 12 A provided in the planarizing insulating film 12 .
- the planarizing insulating film 12 is intended to planarize a front face of the substrate 11 over which the pixel driving circuit 140 is formed. Since the fine connection hole 12 A is provided, the planarizing insulating film 12 is preferably made of a material having favorable pattern precision. Examples of component materials of the planarizing insulating film 12 include an organic material such as polyimide and an inorganic material such as silicon oxide (SiO 2 ).
- the lower electrode 14 also has a function as a reflecting layer, and desirably has high reflectance as much as possible in order to improve light emission efficiency.
- the lower electrode 14 is desirably made of a material having high electron hole injection characteristics.
- Such a lower electrode 14 has, for example, a lamination direction thickness (hereinafter simply referred to as thickness) from 100 nm to 1000 nm both inclusive.
- Examples of material of the lower electrode 14 include a simple substance or an alloy of metal elements such as chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), and silver (Ag).
- a transparent conductive film composed of an oxide of indium and tin (ITO) or the like may be provided on the surface of the lower electrode 14 . If an appropriate electron hole injection layer is provided, it is able to use a material that has high reflectance but has a disadvantage of an electron hole injection barrier due to existence of an oxide film on the surface and a small work function such as an aluminum (Al) alloy as the lower electrode 14 .
- ITO indium and tin
- the inter-electrode insulating film 15 is intended to secure insulation between the lower electrode 14 and the upper electrode 17 , and to obtain a desired shape of the light emitting region.
- the inter-electrode insulating film 15 is made of a photosensitive resin.
- the inter-electrode insulating film 15 is provided with an aperture correspondingly to the light emitting region. Though the organic layer 16 and the upper electrode 17 are provided not only in the aperture but also over the inter-electrode insulating film 15 , light is emitted only in the aperture of the inter-electrode insulating film 15 .
- the organic layer 16 has, for example, a structure in which an electron hole injection layer 16 A, an electron hole transport layer 16 B, the light emitting layer 16 C, an electron transport layer 16 D, and an electron injection layer 16 E are layered from the lower electrode 14 side.
- the layers other than the light emitting layer 16 C may be provided according to needs.
- the organic layer 16 may have a structure varying according to the light emitting color of the organic EL devices 10 R, 10 G, and 10 B.
- the electron hole injection layer 16 A is intended to improve the electron hole injection efficiency and functions as a buffer layer to prevent leakage.
- the electron hole transport layer 16 B is intended to improve efficiency to transport electron holes into the light emitting layer 16 C.
- the light emitting layer 16 C is intended to generate light due to electron-hole recombination by impressing an electric field.
- the electron transport layer 16 D is intended to improve efficiency to transport electrons into the light emitting layer 16 C.
- the electron injection layer 16 E is intended to improve efficiency to inject electrons.
- the electron hole injection layer 16 A of the organic EL device 10 R has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of the hexaazatriphenylene derivative shown in Chemical formula 1 or Chemical formula 2.
- the electron hole transport layer 16 B of the organic EL device 10 R has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of bis[(N-naphthyl)-N-phenyl]benzidine ( ⁇ -NPD).
- the light emitting layer 16 C of the organic EL device 10 R has, for example, a thickness from 10 nm to 100 nm both inclusive, and is composed of a material in which 40 volume % of 2,6-bis[4-[N-(4-metoxyphenyl)-N-phenyl]aminostyril]naphthalene-1,5-dicarbonitrile (BSN-BCN) is mixed with 8-quinolinol aluminum complex (Alq 3 ).
- the electron transport layer 16 D of the organic EL device 10 R has, for example, a thickness from 5 nm to 300 nm both inclusive, and is made of Alq3.
- the electron injection layer 16 E of the organic EL device 10 R has, for example, a thickness about 0.3 nm, and is made of LiF, Li 2 O or the like.
- R1 to R6 respectively and independently represent hydrogen; halogen; a hydroxyl group; an amino group; an aryl amino group; a substituted/unsubstituted carbonyl group having the carbon number of 20 or less; a substituted/unsubstituted carbonylester group having the carbon number of 20 or less; a substituted/unsubstituted alkyl group having the carbon number of 20 or less; a substituted/unsubstituted alkenyl group having the carbon number of 20 or less; a substituted/unsubstituted alkoxyl group having the carbon number of 20 or less; a substituted/unsubstituted aryl group having the carbon number of 30 or less; a substituted/unsubstituted heterocyclic group having the carbon number of 30 or less; or a substituted group selected from a group consisting of a nitrile group, a cyano group, a nitro group, and a silyl group.
- the electron hole injection layer 16 A of the organic EL device 10 R is preferably made of the material shown in Chemical formula 2.
- the electron hole injection layer 16 A of the organic EL device 10 G has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of the hexaazatriphenylene derivative shown in Chemical formula 1 or Chemical formula 2.
- the electron hole transport layer 16 B of the organic EL device 10 G has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of ⁇ -NPD.
- the light emitting layer 16 C of the organic EL device 10 G has, for example, a thickness from 10 nm to 100 nm both inclusive, and is composed of a material in which 1 volume % of coumarin 6 is mixed with Alq3.
- the electron transport layer 16 D of the organic EL device 10 G has, for example, a thickness from 5 nm to 300 nm both inclusive, and is made of Alq3.
- the electron injection layer 16 E of the organic EL device 10 G has, for example, a thickness about 0.3 nm, and is made of LiF, Li 2 O or the like.
- the electron hole injection layer 16 A of the organic EL device 10 B has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of the hexaazatriphenylene derivative shown in Chemical formula 1 or Chemical formula 2.
- the electron hole transport layer 16 B of the organic EL device 10 B has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of ⁇ -NPD.
- the light emitting layer 16 C of the organic EL device 10 B has, for example, a thickness from 10 nm to 100 nm both inclusive, and is composed of spiro 6 ⁇ .
- the electron transport layer 16 D of the organic EL device 10 B has, for example, a thickness from 5 nm to 300 nm both inclusive, and is made of Alq3.
- the electron injection layer 16 E of the organic EL device 10 B has, for example, a thickness of about 0.3 nm, and is composed of LiF, Li 2 O or the like.
- the upper electrode 17 is made of a metal conductive film. Specific examples thereof include an alloy of aluminum (Al), magnesium (Mg), calcium (Ca), or sodium (Na). Specially, an alloy of magnesium and silver (Mg—Ag alloy) is preferable, since the Mg—Ag alloy has electric conductivity and small absorption in a thin film.
- the ratio of magnesium and silver in the Mg—Ag alloy is not particularly limited, but the film thickness ratio of Mg:Ag is desirably in the range from 20:1 to 1:1.
- the material of the upper electrode 17 may be an alloy of aluminum (Al) and lithium (Li) (Al—Li alloy).
- the thickness of the second or upper electrode 17 is 6 nm or less, and preferably from 2 nm to 6 nm both inclusive. If the thickness thereof is 6 nm or less, it is possible to inhibit the material of the upper electrode 17 from adhering to the surrounding of a foreign matter on the lower electrode 14 , and inhibit generation of non-light emitting defect (so-called lost point) due to electric short circuit between the lower electrode 14 and the upper electrode 17 . Further, if the thickness thereof is 2 nm or more, it is possible to secure the electric conductivity of the upper electrode 17 to the degree at which driving the organic EL devices 10 R, 10 G, and 10 B functions well. Further, the thickness of the upper electrode 17 is more preferably from 2.5 nm to 6 nm both inclusive, since thereby driving the organic EL devices 10 R, 10 G, and 10 B is sufficiently enabled.
- the intermediate layer 18 is provided being contacted with the upper electrode 17 between the upper electrode 17 and the organic layer 16 .
- the intermediate layer 18 has, for example, a thickness from 0.1 nm to 5 nm both inclusive, and contains one selected from the metal element group consisting of an alkali metal, an alkali earth metal, a lanthanoid metal, aluminum, indium, tin, nickel, copper, and zinc. Thereby, in the display unit, the thickness of the upper electrode 17 may be decreased down to 6 nm or less while electric conductivity of the upper electrode 17 is retained.
- Thickness of the upper electrode 17 ” and “thickness of the intermediate layer 18 ” in this specification are obtained by optical method such as spectroscopic ellipsometry. Further, “thickness of the upper electrode 17 ” and “thickness of the intermediate layer 18 ” are measured in a state of a product after being sealed with the sealing substrate 50 and being assembled.
- the intermediate layer 18 has a function as a degeneration preventive layer to inhibit the upper electrode 17 from being directly contacted with the organic layer 16 and losing electric conductivity.
- the intermediate layer 18 desirably has a thickness with which degeneration preventive effect of the upper electrode 17 is obtained.
- the intermediate layer 18 has a thickness of 0.1 nm or more. Further, in the case where the thickness of the intermediate layer 18 is 5 nm or less, lowering of efficiency due to light absorption is able to be small.
- the intermediate layer 18 is preferably made of an electron injection material.
- a material include the alkali metal, the alkali earth metal, and the lanthanoid metal.
- a metal having a larger work function than that of magnesium is able to be used.
- examples of such a metal include a metal such as aluminum, indium, and tin; and a transition metal such as nickel, copper, and zinc.
- the intermediate layer 18 preferably contains calcium.
- Calcium has favorable electron injection characteristics to the organic layer 16 , has high electric conductivity as a film, and has small absorption. Further, calcium as a single material is easily deposited onto the organic layer 16 comparatively, and calcium is not subject to drastic oxidation and hydroxylation reaction in the air differently from other material such as the alkali earth metal and the alkali metal. Thus, handling calcium in manufacturing is comparatively easy.
- the intermediate layer 18 preferably contains aluminum. If aluminum is layered after the appropriate electron injection layer 16 E such as lithium fluoride is formed thinly, aluminum expresses favorable electron injection characteristics. In addition, aluminum has effect to prevent degeneration of the upper electrode 17 further provided thereon.
- the sheet resistance of the film composed of the intermediate layer 18 and the upper electrode 17 is preferably, for example, 10000 ⁇ / ⁇ or less.
- influence of voltage drop is able to be lowered, and drive voltage rise or luminance gradient in the pixel is able to be inhibited.
- one pixel pitch is 1.15 mm. In such a large pixel, if the white display light emitting efficiency is 20 cd/A and the display luminance is 200 cd/m 2 , voltage drop from an end to the other end of the pixel is 0.13V, and there is a small possibility to impair the display quality.
- the intermediate layer 18 and the upper electrode 17 are formed as a laminated film in a manufacturing step as described later. However, after the upper electrode 17 is formed, part of the metal element contained in the intermediate layer 18 may be distributed in the second electrode 17 .
- the upper electrode 17 also has a function as a translucent reflecting layer. That is, the organic EL devices 10 R, 10 G, and 10 B have a resonator structure MC 1 (first resonator structure MC 1 ). Light generated in the light emitting layer 16 C is resonated between the lower electrode 14 and the upper electrode 17 by the resonator structure MC 1 .
- the interface between the lower electrode 14 and the organic layer 16 is a reflecting face P 1
- the interface between the intermediate layer 18 and the electron injection layer 16 E is a translucent reflecting face P 2
- the organic layer 16 is a resonance section.
- the light generated in the light emitting layer 16 C is resonated and is extracted from the translucent reflecting face P 2 side.
- the light generated in the light emitting layer 16 C generates multiple interference, the half bandwidth of spectrum of the light extracted from the translucent reflecting face P 2 side is decreased, and the peak intensity is able to be increased. That is, the light radiation intensity in the front face direction is able to be increased, and the color purity of light emission is able to be improved.
- Outside light entering from the sealing substrate 50 side is also able to be decayed by multiple interference.
- the reflectance of outside light in the organic EL devices 10 R, 10 G, and 10 B is able to be significantly decreased.
- an optical distance L1 between the reflecting face P 1 and the translucent reflecting face P 2 preferably satisfies Mathematical formula 1.
- L1 represents the optical distance between the reflecting face P 1 and the translucent reflecting face P 2 .
- m represents an order (0 or a natural number).
- ⁇ represents a peak wavelength of spectrum of light that is desirably extracted from the translucent reflecting face P 2 side.
- the unit should be unified, and for example, (nm) is used as the unit.
- the organic EL devices 10 R, 10 G, and 10 B having such a resonator structure MC 1 there is a tendency that as the order m become larger, view angle dependence of luminance and chromaticity becomes larger, that is, difference of luminance and chromaticity between a case viewing in the front face direction and in a case viewing in the oblique direction becomes larger.
- luminance lowering and chromaticity change according to view angle are desirably small.
- the spectral radiance ratio measured from 45 deg oblique direction with respect to the spectral radiance ratio measured from the front face is preferably 0.7 or more.
- the thickness of the organic layer 16 of the blue organic EL device 10 B is about 80 nm if m is 0, and is about 190 nm if m is 1, and accordingly generation of short circuit is inhibited.
- the thickness of the upper electrode 17 is decreased down to from 2 nm to 6 nm both inclusive.
- luminance lowering and chromaticity change according to the view angle are able to be more decreased for the following reason. That is, in the case where the thickness of the upper electrode 17 is decreased, the transmittance ratio of the upper electrode 17 is increased and the reflectance is lowered. In the result, out of light emission from the light emitting layer 16 C, the ratio of light reflected by the upper electrode 17 toward the lower electrode 14 side is decreased. Thereby, the resonator structure MC 1 is weakened, and angle dependence of light extracted from the translucent reflecting face P 2 is decreased. Accordingly, for example, under the conditions that the order m is 1 or more, view angle dependence of luminance and chromaticity is able to be decreased, and an organic EL display unit having superior display performance is able to be obtained.
- FIG. 4A illustrates spectrums in the case where the intermediate layer 18 composed of Ca having a thickness of 2 nm and the upper electrode 17 composed of an Mg—Ag alloy having a thickness of 4 nm are provided in the organic EL device having the resonator structure MC 1 .
- the spectrums show results of viewing from the front face and from 45 deg oblique direction by optical simulation.
- FIG. 4B illustrates spectrums similarly obtained by optical simulation in the case where the intermediate layer 18 is not provided and only the upper electrode 17 composed of an Mg—Ag alloy having a thickness of 8 nm is provided. As evidenced by FIG. 4A and FIG.
- the spectrum half bandwidth is wider, the peak intensity is lower, and resonator effect is more modified than in the latter case, but change of light emitting characteristics according to the view angle is more decreased than in the latter case.
- the protective layer 30 illustrated in FIG. 3 is composed of silicon nitride (SiN x ), silicon oxide, a metal oxide or the like.
- the adhesive layer 40 illustrated in FIG. 3 is composed of, for example, a heat-hardening resin or a ultraviolet hardening resin.
- the sealing substrate 50 illustrated in FIG. 3 is located on the upper electrode 17 side of the organic EL devices 10 R, 10 G, and 10 B.
- the sealing substrate 50 seals the organic light EL devices 10 R, 10 G, and 10 B together with the adhesive layer 40 , and is made of a material such as glass transparent to light generated in the organic light EL devices 10 R, 10 G, and 10 B.
- the sealing substrate 50 is, for example, provided with the color filter 51 , which extracts the light generated in the organic light EL devices 10 R, 10 G, and 10 B, and absorbs outside light reflected by the organic EL devices 10 R, 10 G, and 10 B and the wiring in between to improve contrast.
- the color filter 51 may be provided on any face of the sealing substrate 50 , but is preferably provided on the side of the organic EL devices 10 R, 10 G, and 10 B. Thereby, the color filter 51 is not exposed on the surface, and is able to be protected by the adhesive layer 40 . Further, in this case, since the distance between the light emitting layer 16 C and the color filter 51 is narrowed, it is possible to avoid an event that light emitted from the light emitting layer 16 C enters an adjacent color filter 51 of other color to generate mixed color.
- the color filter 51 has a red filter, a green filter, and a blue filter (not illustrated), which are sequentially arranged correspondingly to the organic EL devices 10 R, 10 G, and 10 B.
- the red filter, the green filter, and the blue filter are respectively formed in the shape of, for example, a rectangle with no space in between.
- the red filter, the green filter, and the blue filter are respectively made of a resin mixed with a pigment. Adjustment is made by selecting a pigment so that light transmittance in the intended red, green, or blue wavelength region is high, and light transmittance in the other wavelength regions is low.
- the wavelength range with high transmittance in the color filter 51 corresponds with peak wavelength ⁇ of spectrum of light that is desirably extracted from the resonator structure MC 1 .
- the display unit is able to be manufactured, for example, as follows.
- the pixel drive circuit 140 including the drive transistor Tr 1 is formed on the substrate 11 made of the foregoing material.
- the planarizing insulating film 12 is formed by coating the whole area of the substrate 11 with a sensitive resin, and the planarizing insulating film 12 is patterned into a given shape by exposure and development, the connection hole 12 A is formed, and the resultant is fired.
- the lower electrode 14 made of the foregoing material is formed by, for example, sputtering method, and the lower electrode 14 is selectively removed by wet etching. Thereby, the respective organic light emitting devices 10 R, 10 G, and 10 B are separated individually.
- the whole area of the substrate 11 is coated with a photosensitive resin.
- An aperture is provided correspondingly to the light emitting region by, for example, photolithography method, and the resultant is fired. Accordingly, the inter-electrode insulating film 15 is formed.
- the electron hole injection layer 16 A, the electron hole transport layer 16 B, the light emitting layer 16 C, and the electron transport layer 16 D of the organic layer 16 that have the foregoing thickness and are made of the foregoing material are formed by, for example, evaporation method.
- the laminated film composed of the intermediate layer 18 and the upper electrode 17 that have the foregoing thickness and are made of the foregoing material is deposited by, for example, evaporation method.
- the upper electrode 17 is formed, part of the metal element contained in the intermediate layer 18 may be diffused and distributed in the second electrode 17 . Accordingly, the organic EL devices 10 R, 10 G, and 10 B as illustrated in FIG. 3 are formed.
- the protective layer 30 that is made of the foregoing material is formed on the organic EL devices 10 R, 10 G, and 10 B by, for example, CVD method or sputtering method.
- the sealing substrate 50 made of the foregoing material is coated with a material of the red filter by spin coating or the like, the resultant is provided with patterning by photolithography technology, and fired. Thereby, the red filter is formed. Subsequently, the blue filter and the green filter are sequentially formed in the same manner as that of the red filter.
- the adhesive layer 40 is formed on the protective layer 30 .
- the sealing substrate 50 and the protective layer 30 are bonded with the adhesive layer 40 in between.
- the face of the sealing substrate 50 on which the color filter 51 is formed is preferably arranged on the side of the organic EL devices 10 R, 10 G, and 10 B. Accordingly, the display unit illustrated in FIG. 1 to FIG. 3 is completed.
- the scanning signal is supplied from the scanning line drive circuit 130 to each pixel through the gate electrode of the writing transistor Tr 2 , and the image signal from the signal line drive circuit 120 is retained in the retentive capacity Cs through the writing transistor Tr 2 . That is, the drive transistor Tr 1 is on-off controlled according to the signal retained in the retentive capacity Cs, and thereby a drive current Id is injected into the respective organic light emitting devices 10 R, 10 G, and 10 B. In the result, electron-hole recombination is generated to initiate light emission. The light is multiply reflected between the lower electrode 14 (reflecting face P 1 ) and the upper electrode 17 (translucent reflecting face P 2 ). After that, the light passes through the upper electrode 17 , the color filter 51 , and the sealing substrate 50 , and is extracted.
- the intermediate layer 18 is provided being contacted with the upper electrode 17 between the upper electrode 17 and the organic layer 16 .
- the intermediate layer 18 contains one selected from the metal element group consisting of the foregoing alkali metal and the like, and has a thickness from 0.1 nm to 5 nm both inclusive.
- the organic EL devices 10 R, 10 G, and 10 B have the resonator structure MC 1 , by decreasing the thickness of the upper electrode 17 , the resonator structure MC 1 is weakened, and view angle dependence of light extracted from the translucent reflecting face P 2 is decreased. Accordingly, for example, under the conditions that the order m is 1 or more and view angle dependence of luminance and chromaticity is easily significant, luminance and chromaticity change according to the view angle is moderated.
- the intermediate layer 18 is provided being contacted with the upper electrode 17 between the upper electrode 17 and the organic layer 16 .
- the intermediate layer 18 contains one selected from the metal element group consisting of the alkali metal and the like, and has a thickness from 0.1 nm to 5 nm both inclusive.
- the thickness of the upper electrode 17 may be decreased down to from 2 nm to 6 nm both inclusive.
- the organic EL devices 10 R, 10 G, and 10 B are favorably driven, and non-light emitting defect is able to be decreased.
- the embodiments are suitable for the organic EL devices 10 R, 10 G, and 10 B in which the resonator structure MC 1 is included, and light generated in the light emitting layer 16 C is resonated between the lower electrode 14 and the upper electrode 17 .
- FIG. 5 illustrates a cross sectional structure of the organic EL devices 10 R, 10 G, and 10 B of a display unit according to a first modified example.
- the organic EL devices 10 R, 10 G, and 10 B have a structure similar to that of the foregoing first embodiment, except that a material of the intermediate layer 18 is totally diffused in the upper electrode 17 , and the intermediate layer 18 is integrated with the upper electrode 17 .
- a description will be given by affixing the same referential symbols for the corresponding elements.
- the upper electrode 17 has a thickness from 2 nm to 6 nm both inclusive.
- the upper electrode 17 contains an alloy containing magnesium (Mg), aluminum (Al), calcium (Ca), or sodium (Na) as a main component, and contains one selected from the metal element group consisting of an alkali metal, an alkali earth metal, a lanthanoid metal, aluminum, indium, tin, nickel, copper, and zinc.
- the thickness of the upper electrode 17 may be decreased down to 6 nm or less while electric conductivity of the upper electrode 17 is retained.
- an alloy of magnesium and silver (Mg—Ag alloy) or an alloy of aluminum (Al) and lithium (Li) (Al—Li alloy) is preferable as in the upper electrode 17 of the first embodiment.
- the metal element contained in the upper electrode 17 has a degeneration preventive function to inhibit the upper electrode 17 from being directly contacted with the organic layer 16 and losing electric conductivity as the intermediate layer 18 of the foregoing embodiment does.
- the metal element preferably has electron injection characteristics.
- examples of such a material include the alkali metal, the alkali earth metal, and the lanthanoid metal.
- a metal having a larger work function than that of magnesium is able to be used.
- examples of such a metal include a metal such as aluminum, indium, and tin; and a transition metal such as nickel, copper, and zinc.
- the metal element contained in the upper electrode 17 calcium or aluminum is preferable as in the intermediate layer 18 of the first embodiment.
- the thickness of the upper electrode 17 is more preferably from 2.5 nm to 6 nm both inclusive as in the upper electrode 17 of the first embodiment.
- Thickness of the upper electrode 17 in this specification is obtained by optical method such as spectroscopic ellipsometry. Further, “thickness of the upper electrode 17 ” is measured in a state of a product after being sealed with the sealing substrate 50 and being assembled.
- the sheet resistance of the upper electrode 17 is preferably, for example, 10000 ⁇ / ⁇ or less as in the first embodiment.
- the metal element contained in the upper electrode 17 is, for example, diffused in the upper electrode 17 . Further, the metal element contained in the upper electrode 17 may be chemically changed by being contacted with the electron transport layer 16 D and the electron injection layer 16 E.
- the upper electrode 17 is formed as a laminated film composed of the intermediate layer 18 and the upper electrode 17 in a manufacturing step as in the first embodiment. However, after the upper electrode 17 is formed, the metal element as the material of the intermediate layer 18 is diffused and distributed in the upper electrode 17 , and as a result, an integrated electrode layer composed of the intermediate layer 18 and the upper electrode 17 is structured. Therefore, if a cross section is analyzed, the intermediate layer 18 is not detected as a layer.
- the translucent reflecting face P 2 of the resonator structure MC 1 is the interface between the upper electrode 17 and the electron injection layer 16 E.
- a method of manufacturing the display unit is similar to that of the foregoing first embodiment. That is, the intermediate layer 18 and the upper electrode 17 are formed as a laminated film as in the foregoing first embodiment. At this time, after the upper electrode 17 is formed, the metal element as the material of the intermediate layer 18 is diffused in the upper electrode 17 , and as a result, the upper electrode 17 is formed as the integrated electrode layer composed of the intermediate layer 18 and the upper electrode 17 . Accordingly, the organic EL devices 10 R, 10 G, and 10 B illustrated in FIG. 5 are formed.
- the upper electrode 17 contains the alloy of magnesium (Mg) or the like as a main component, and contains one selected from the metal element group consisting of the foregoing alkali metal and the like.
- Mg the alloy of magnesium
- the organic EL devices 10 R, 10 G, and 10 B are favorably driven, and favorable display performance is obtained for a long term.
- the thickness of the upper electrode 17 is small, generation of non-light emitting defect due to short circuit between the lower electrode 14 and the upper electrode 17 is inhibited.
- the upper electrode 17 contains the alloy of magnesium (Mg) or the like as a main component, and contains one selected from the metal element group consisting of the foregoing alkali metal and the like.
- Mg alloy of magnesium
- the thickness of the upper electrode 17 is able to be decreased down to from 2 nm to 6 nm both inclusive.
- the organic EL devices 10 R, 10 G, and 10 B are favorably driven, and non-light emitting defect is able to be decreased.
- the embodiments are suitable for the organic EL devices 10 R, 10 G, and 10 B in which the resonator structure MC 1 is included, and light generated in the light emitting layer 16 C is resonated between the lower electrode 14 and the upper electrode 17 .
- FIG. 6 illustrates a cross sectional structure of the organic EL devices 10 R, 10 G, and 10 B according to a second embodiment.
- the organic EL devices 10 R, 10 G, and 10 B have a structure similar to that of the foregoing first embodiment, except that a resonance adjustment layer 19 is included between the upper electrode 17 and the protective layer 30 .
- a resonance adjustment layer 19 is included between the upper electrode 17 and the protective layer 30 .
- the resonance adjustment layer 19 is intended to control resonator effect of the resonator structure MC 1 by providing a reflectance interface by using dielectric mirror principle on the upper electrode 17 , and has a refractive index different from the refractive index of the protective layer 30 . That is, the organic EL devices 10 R, 10 G, and 10 B have a resonator structure MC 2 (second resonator structure MC 2 ). Light extracted from the resonator structure MC 1 is resonated between the interference between the resonance adjustment layer 19 and the protective layer 30 and the lower electrode 14 by the resonator structure MC 2 .
- the interface between the lower electrode 14 and the organic layer 16 is the reflecting face P 1
- the interface between the resonance adjustment layer 19 and the protective layer 30 is a translucent reflecting face P 3
- the organic layer 16 , the intermediate layer 18 , the upper electrode 17 , and the resonance adjustment layer 19 are a resonance section.
- the light extracted from the resonator structure MC 1 is resonated and is extracted from the translucent reflecting face P 3 side.
- the resonator structure MC 2 is included as the second resonator structure, if resonator effect of the resonator structure MC 1 is weakened by decreasing the thickness of the upper electrode 17 , resonator effect is able to be controlled.
- An optical distance L2 between the reflecting face P 1 and the translucent reflecting face P 3 preferably satisfies Mathematical formula 2.
- L2 represents the optical distance between the reflecting face P 1 and the translucent reflecting face P 3 .
- m represents an order (0 or a natural number).
- ⁇ represents a peak wavelength of spectrum of light that is desirably extracted from the translucent reflecting face P 3 side.
- the unit should be unified, and for example, (nm) is used as the unit.
- the resonance adjustment layer 19 also has a function as a protective film to prevent deterioration of the upper electrode 17 . That is, if the protective layer 30 is directly layered on the upper electrode 17 by CVD method or sputtering method after the upper electrode 17 is formed, there is a possibility that the upper electrode 17 is degenerated by introduced gas at the time of film forming, oxygen, high energy particles, oxygen in a chamber or mobile environment, moisture or the like, and function as an electrode is not able to be maintained. However, if the resonance adjustment layer 19 is provided by vacuum evaporation method continuously after the upper electrode 17 is formed, the upper electrode 17 is able to be protected.
- the thickness of the resonance adjustment layer 19 is not particularly limited. However, to prevent degeneration of the upper electrode 17 , for example, the thickness of the resonance adjustment layer 19 is desirably 10 nm or more.
- the film thickness setting is able to be adjusted as appropriate by optical design to adjust the intensity of the resonator structure MC 2 .
- the resonance adjustment layer 19 is supposed to be formed common to R, G, and B. Thus, it is desirable that the refractive index and the film thickness are set so that light extraction effect is favorable for all three color.
- a material of the resonance adjustment layer 19 a material having small visible light absorption and having a small possibility to degenerate the upper electrode 17 at the time of film formation is desirable.
- an vacuum evaporative inorganic film or a vacuum evaporative organic film represented by lithium fluoride (refractive index of 1.38 in 460 nm), potassium bromide (refractive index of 1.58), Alq3 (refractive index of 1.84), MoO 3 (refractive index of 2.22), ZnSe (refractive index of 2.6) and the like are able to be used.
- the refractive index of the resonance adjustment layer 19 is preferably smaller than the refractive index of the protective layer 30 for the following reason. That is, the translucent reflecting face P 3 of the resonator structure MC 2 is formed by refractive index difference of the interface between the resonator adjustment layer 19 and the protective layer 30 . Thus, if the refractive index difference is increased, resonator effect is intensified, while if the refractive index difference is decreased, resonator effect is weakened. To intensify the resonator effect by increasing the refractive index difference, the refractive index of the resonance adjustment layer 19 is set smaller than that of the protective layer 30 , or is set larger than that of the protective layer 30 .
- the order m of the resonator structure MC 2 is able to be identical with the order m of the resonator structure MC 1 composed of the lower electrode 14 and the upper electrode 17 .
- each light emitting layer 16 C of the organic light emitting devices 10 R, 10 G, and 10 B is located in the resonance position that is most proximal to the lower electrode 14 , even if the resonance adjustment layer 19 is formed common to the organic light emitting devices 10 R, 10 G, and 10 B, resonance intensity is able to be intensified for all the organic light emitting devices 10 R, 10 G, and 10 B.
- the refractive index of the resonance adjustment layer 19 is able to be set to a value close to the refractive index of the protective layer 30 .
- the refractive index of the organic material represented by Alq3 is about 1.9, and is suitable for the resonance adjustment layer 19 .
- other organic film or other inorganic film may be used.
- the display unit is able to be manufactured in the same manner as that of the first embodiment, except that the resonance adjustment layer 19 made of the foregoing material is formed by vacuum evaporation method continuously after the upper electrode 17 is formed.
- the resonance adjustment layer 19 is provided between the upper electrode 17 and the protective layer 30 , and the resonator structure MC 2 is structured.
- the resonator effect of the resonator structure MC 1 is weakened by decreasing the thickness of the upper electrode 17 , intensity of light extracted from the front face is increased.
- the resonance adjustment layer 19 is provided between the upper electrode 17 and the protective layer 30 , and the resonator structure MC 2 is structured.
- the resonator effect of the resonator structure MC 1 is weakened by decreasing the thickness of the upper electrode 17 , the resonator effect is able to be controlled.
- the metal element as a material of the intermediate layer 18 is diffused and distributed in the upper electrode 17 , and as a result, the upper electrode 17 is structured as an integrated electrode layer composed of the intermediate layer 18 and the upper electrode 17 .
- the display unit of the foregoing embodiments is able to be applied to a display unit of an electronic device in any field for displaying a video signal inputted from outside or a video signal generated inside as an image or a video, such as a television device, a digital camera, a notebook personal computer, a portable terminal device such as a mobile phone, and a video camera.
- the display unit of the foregoing embodiments is incorporated in various electronic devices such as after-mentioned first to fifth application examples as a module as illustrated in FIG. 8 , for example.
- a region 210 exposed from the sealing substrate 50 and the adhesive layer 40 is provided on a side of the substrate 11 , and an external connection terminal (not illustrated) is formed in the exposed region 210 by extending the wirings of the signal line drive circuit 120 and the scanning line drive circuit 130 .
- the external connection terminal may be provided with a Flexible Printed Circuit (FPC) 220 for inputting and outputting a signal.
- FPC Flexible Printed Circuit
- FIG. 9 is an appearance of a television device to which the display unit of the foregoing embodiments is applied.
- the television device has, for example, a video display screen section 300 including a front panel 310 and a filter glass 320 .
- the video display screen section 300 is composed of the display unit according to the foregoing respective embodiments.
- FIGS. 10A and 10B are an appearance of a digital camera to which the display unit of the foregoing embodiments is applied.
- the digital camera has, for example, a light emitting section for a flash 410 , a display section 420 , a menu switch 430 , and a shutter button 440 .
- the display section 420 is composed of the display unit according to the foregoing respective embodiments.
- FIG. 11 is an appearance of a notebook personal computer to which the display unit of the foregoing embodiments is applied.
- the notebook personal computer has, for example, a main body 510 , a keyboard 520 for operation of inputting characters and the like, and a display section 530 for displaying an image.
- the display section 530 is composed of the display unit according to the foregoing respective embodiments.
- FIG. 12 is an appearance of a video camera to which the display unit of the foregoing embodiments is applied.
- the video camera has, for example, a main body 610 , a lens for shooting an object 620 provided on the front side face of the main body 610 , a start/stop switch in shooting 630 , and a display section 640 .
- the display section 640 is composed of the display unit according to the foregoing respective embodiments.
- FIGS. 13A to 13G are an appearance of a mobile phone to which the display unit of the foregoing embodiments is applied.
- a mobile phone for example, an upper package 710 and a lower package 720 are jointed by a joint section (hinge section) 730 .
- the mobile phone has a display 740 , a sub-display 750 , a picture light 760 , and a camera 770 .
- the display 740 or the sub-display 750 is composed of the display unit according to the foregoing respective embodiments.
- the intermediate layer 18 and the upper electrode 17 of the foregoing first embodiment were formed.
- the intermediate layer 18 was composed of calcium (Ca), and the thickness thereof was 2.0 nm.
- the upper electrode 17 was composed of an Mg—Ag alloy, and the thickness thereof was varied as illustrated in Table 1.
- a vacuum evaporated film having a thickness of 20 nm obtained by resistance heating of an electron transport material was formed.
- the upper electrode 17 was deposited at a vapor rate of 0.1 nm/sec by vacuum evaporation method by resistance heating at a high vacuum degree of 1*10 ⁇ 5 Pa or less.
- a lithium fluoride film having a thickness of 40 m was formed by vacuum evaporation on the upper electrode 17 . After that, the resultant was sealed with an ultraviolet hardened resin.
- An upper electrode composed of a Mg—Ag alloy was formed in the same manner as that of the foregoing Examples 1-1 to 1-4, except that the intermediate layer was not provided. At this time, the thickness of the upper electrode was varied as illustrated in Table 1.
- Example 1-1 Ca (2.0 nm)/Mg—Ag (2.0 nm) 585
- Example 1-2 Ca (2.0 nm)/Mg—Ag (3.0 nm) 306
- Example 1-3 Ca (2.0 nm)/Mg—Ag (4.0 nm) 215
- Example 1-4 Ca (2.0 nm)/Mg—Ag (5.0 nm) 162 Comparative Mg—Ag (10.0 nm) 86 example 1-1 Comparative Mg—Ag (4.0 nm) 28500 example 1-2
- the thickness was able to be decreased down to 6 nm or less while electric conductivity of the upper electrode 17 was retained.
- the organic EL device of the first embodiment was fabricated by using the intermediate layer 18 and the upper electrode 17 illustrated in Table 1.
- the lower electrode 14 an aluminum-neodymium alloy film (film thickness: 150 nm) was formed on the substrate 11 made of a glass plate sized 25 mm*25 mm. Further, as a contact with the upper electrode 17 and a connection section to a power line, a pad section (not illustrated) composed of titanium was provided on the substrate 11 .
- the lower electrode 14 was coated with a photosensitive organic insulating material, and an aperture was provided correspondingly to a light emitting region sized 2 mm*2 mm in the central section of the lower electrode 14 . Thereby, the interelectrode insulating film 15 was formed.
- a metal mask having an aperture was prepared.
- the metal mask was arranged in the proximity of the substrate 11 in a state that the aperture of the metal mask was aligned with the light emitting region of the lower electrode 14 .
- the electron hole injection layer 16 A to the electron injection layer 16 E were sequentially formed by vacuum evaporation method under vacuum atmosphere of 1*10 ⁇ 5 Pa or less.
- the optical distance L1 between the reflecting face P 1 and the translucent reflecting face P 2 was adjusted to satisfy Mathematical formula 1 by adjusting the thickness of the electron injection layer 16 A to the electron injection layer 16 E to structure the resonator structure MC 1 .
- a film having a thickness of 20 nm composed of the hexaazatriphenylene derivative shown in Chemical formula 2 was formed.
- a film having a thickness of 25 nm composed of ⁇ -NPD was formed.
- the evaporation rate was 0.1 nm/sec.
- a co-evaporated film having a thickness of 30 nm in which Alq 3 host was doped with 1% coumarin 6 as a green light emitting material was formed.
- the evaporation rate was 0.2 nm/sec.
- a film having a thickness of 175 nm composed of Alq 3 was formed. The evaporation rate was 0.2 nm/sec.
- a metal mask having an aperture corresponding to a pad section was prepared.
- the metal mask was arranged in the proximity of the substrate 11 .
- a film having a thickness of 0.3 nm composed of lithium fluoride was formed.
- the intermediate layer 18 and the upper electrode 17 were formed in the same manner as that of Examples 1-1 to 1-4.
- the film forming conditions were identical with those of Examples 1-1 to 1-4.
- the resonance adjustment layer 19 a film having a thickness of 40 nm composed of Alq 3 was formed on the upper electrode 17 by vacuum evaporation method continuously after the upper electrode 17 was formed.
- the protective layer 30 a silicon nitride film having a thickness of 1 ⁇ m was formed by plasma CVD method.
- the resonance adjustment layer 19 was used as a protective film to inhibit degeneration of the upper electrode 17 , and the resonator structure MC 2 was not structured.
- the sealing substrate 50 made of glass was bonded by using the adhesive layer 40 made of an ultraviolet hardened resin.
- An organic EL device was formed in the same manner as that of the foregoing Examples 2-1 to 2-4, except that the intermediate layer was not formed. At this time, the thickness of the upper electrode was varied as illustrated in Table 2.
- the initial characteristics were measured.
- the result is also illustrated in Table 2.
- the luminance ratio is a ratio of the luminance measured from 45 deg oblique direction with respect to the front face luminance.
- the luminance ratio was 0.7 or more in Examples 2-1 to 2-4, and the view angle characteristics were improved.
- the reason thereof may be as follows. That is, since the thickness of the upper electrode 17 was decreased, the resonator effect of the resonator structure MC 1 was moderated. Further, continuous lighting was made for examples 2-1 to 2-4. In the result, lighting was enabled without any trouble for all examples.
- the thickness of the upper electrode 17 in Examples 2-1 to 2-4 was optically obtained by reflectance measurement. As a result, it is not necessary to optically consider the intermediate layer 18 composed of calcium (Ca) as a metal film. In some cases, the intermediate layer 18 composed of calcium (Ca) is chemically changed by being contacted with the electron transport layer 16 D composed of Alq3 or the electron injection layer 16 E composed of LiF. In some cases, the intermediate layer 18 composed of calcium (Ca) is diffused and distributed in the upper electrode 17 .
- Comparative example 2-1 in which the thickness of the upper electrode was 5.0 nm, the resistance of the upper electrode was high and conduction was not enabled. Similarly, in the case where the thickness of the upper electrode was 5.0 or less, conduction was not enabled. In Comparative examples 2-2 and 2-3 in which the thickness of the upper electrode was 6.0 nm or 7.0 nm, the initial conduction was enabled. However, in this case, continuous lighting resulted in intense rise of a drive voltage, and deterioration was significant. Accordingly, it was found as follows. That is, it was only Comparative example 2-4 having the thickness of the upper electrode of 9.0 nm that both the initial driving and the continuous driving were stably enabled.
- the thickness of the metal film should be at least 9.0 nm.
- the luminance ratio was all 0.70 or less, and light emitting characteristics change according to the view angle was large.
- the intermediate layer 18 composed of calcium (Ca) was provided being contacted with the upper electrode 17 between the upper electrode 17 and the organic layer 16 , even if the thickness of the upper electrode 17 was decreased down to 6 nm or less, electric conductivity was retained, and the organic EL device was favorably driven for a long term.
- An organic EL device was formed in the same manner as that of Examples 2-1 to 2-4, except that the upper electrode was composed of silver (Ag) instead of the Mg—Ag alloy, and the thickness thereof was 7 nm. At this time, the intermediate layer was formed in the same manner as that of Examples 2-1 to 2-4.
- the reflective spectrum of the upper electrode was examined. The result was largely different from the assumed result of the simple silver (Ag). Further, when the organic EL device was tried to be lighted, conduction was not enabled. The reason thereof may be as follows. That is, in the silver (Ag) thin film, the film quality was not stable.
- An organic EL device was formed in the same manner as that of Examples 2-1 to 2-4, except that the upper electrode was composed of aluminum (Al) instead of the Mg—Ag alloy, and the thickness thereof was 7 nm. At this time, the intermediate layer was formed in the same manner as that of Examples 2-1 to 2-4. When the obtained organic EL device was tried to be lighted, conduction was not enabled.
- the organic EL device was able to be favorably driven.
- An organic EL device was formed in the same manner as that of Examples 2-1 to 2-4, except that the thickness of the upper electrode 17 was 5.0 nm, and the thickness of the intermediate layer 18 was varied as illustrated in Table 3.
- Example 3-3 was identical with Example 2-4.
- the initial characteristics were examined. The results thereof are also illustrated in Table 3.
- the organic EL device was able to be favorably driven.
- the resonance adjustment layer 19 a film composed of lithium fluoride having a thickness of 20 nm was formed.
- the thickness of the organic layer was adjusted so that the optical distance L2 between the reflecting face P 1 and the translucent reflecting face P 3 satisfied Mathematical formula 2. Accordingly, the resonator structure MC 2 was structured. At this time, the phase shift ⁇ 3 in the translucent reflecting face P 3 in the resonator structure MC 2 was different from the phase shift ⁇ 2 in the translucent reflecting face P 2 in the resonator structure MC 1 , and thus the optical distance L1 is different from the optical distance L2, but the order m was identical.
- the organic EL device was formed in the same manner as that of Example 2-4 as for the rest.
- the extraction intensity in the front face was examined.
- the extraction intensity was improved than that of Example 2-4 by 6%.
- the resonator structure MC 2 was structured by providing the resonance adjustment layer 19 between the upper electrode 17 and the protective layer 30 , if resonator effect of the resonator structure MC 1 is weakened by decreasing the thickness of the upper electrode 17 , the resonator effect is able to be controlled.
- An active matrix organic EL display unit having a pixel count of 960*540 was fabricated in the same manner as that of Example 2-4, except that the intermediate layer 18 was composed of calcium (Ca) (thickness: 2 nm) and the upper electrode 17 was composed of an Mg—Ag alloy (thickness: 5 nm).
- An active matrix organic EL display unit having a pixel count of 960*540 was fabricated.
- the intermediate layer was not provided, and the upper electrode was composed of an Mg—Ag alloy (thickness: 8 nm).
- Example 5 For the obtained organic EL display units of Example 5 and Comparative example 5, the average number of non-light emitting defects per panel was examined. In Example 5, the result was one twenty-fifth ( 1/25) of Comparative example 5, which means the average number of non-light emitting defects was able to be significantly decreased. The reason thereof may be as follows. That is, in Example 5, the thickness of the upper electrode 17 was small. Thus, in a manufacturing step, the upper electrode 17 intrudes into around a foreign matter on the lower electrode 14 , and thereby a leak pass formation between the lower electrode 14 and the upper electrode 17 was inhibited.
- An organic EL device was formed in the same manner as that of Examples 2-1 to 2-4, except that the intermediate layer 18 was composed of aluminum (Al) (thickness: 1 nm) and the upper electrode 17 was composed of an Mg—Ag alloy (thickness: 5 nm).
- the initial characteristics were examined. The obtained result is illustrated in Table 4.
- the intermediate layer 18 composed of aluminum (Al) was provided being contacted with the upper electrode 17 between the upper electrode 17 and the organic layer 16 , even if the thickness of the upper electrode 17 was decreased down to 6 nm or less, electric conductivity was retained, and the organic EL device was favorably driven for a long term.
- the resonance adjustment layer 19 was provided between the upper electrode 17 and the protective layer 30 , and the interface between the resonance adjustment layer 19 and the protective layer 30 was the translucent reflecting face P 3 .
- the resonance adjustment layer 19 may be provided in other position.
- the resonance adjustment layer 19 is able to be provided between the upper electrode 17 and the adhesive layer 40 .
- the resonance adjustment layer 19 may be provided between the protective layer 30 and the adhesive layer 40 .
- the material, the thickness, the film-forming method, the film-forming conditions and the like of each layer are not limited to those described in the foregoing embodiments and the foregoing examples, but other material, other thickness, other film-forming method, and other film-forming conditions may be adopted.
- the lamination order is reversed, that is, the upper electrode 17 , the organic layer 16 , and the lower electrode 14 are sequentially layered from the substrate 11 side over the substrate 11 , and light is extracted from the substrate 11 side.
- the lower electrode 14 is a cathode
- the upper electrode 17 is an anode.
- the lower electrode 14 is a cathode
- the upper electrode 17 is an anode
- the upper electrode 17 , the organic layer 16 , and the lower electrode 14 are sequentially layered from the substrate 11 side over the substrate 11 , and light is extracted from the substrate 11 side.
- the embodiments are also able to be applied to a passive matrix display unit.
- the structure of the pixel drive circuit for driving the active matrix is not limited to the structure described in the foregoing embodiments and the foregoing examples. If necessary, a capacity device or a transistor may be added. In this case, according to the change of the pixel drive circuit, a necessary drive circuit may be added in addition to the foregoing signal line drive circuit 120 and the foregoing scanning line drive circuit 130 .
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
An organic electroluminescence device includes a first electrode, an organic layer formed on the first electrode and including a light-emitting layer, an intermediate layer formed on the organic layer; and a second electrode formed on the intermediate layer and having a thickness of 6 nm or less.
Description
- The present application is a continuation of U.S. patent application Ser. No. 13/804,162, filed Mar. 14, 2013, which application is a continuation of U.S. patent application Ser. No. 12/815,017, filed Jun. 14, 2010, which application issued as U.S. Pat. No. 8,415,658 on Apr. 9, 2013, which claims priority to Japanese Priority Patent Application JP 2009-148888 filed on Jun. 23, 2009, the entire contents of which is hereby incorporated by reference.
- The present disclosure relates to an organic electroluminescence (EL) device suitable for a device including a resonator structure and a display unit including the same.
- The organic EL device in which electroluminescence of an organic material is used has been already applied to an organic EL display unit as a light emitting device capable of realizing high luminance light emission by low voltage direct current drive. The organic EL device has, for example, a structure in which a lower electrode, an organic layer including a light emitting layer, and an upper electrode are sequentially layered over a substrate. Light generated in the light emitting layer is extracted from one of the lower electrode side and the upper electrode side or both sides. In the case where the light is extracted from the upper electrode, the upper electrode is made of, for example, a transparent conductive film. As a material of the transparent conductive film, for example, a metal oxide conductive material such as an oxide of indium and tin (ITO) and an oxide of indium and zinc (IZO) is used.
- However, in the case where the transparent conductive material composed of the metal oxide is used, device characteristics are lowered due to damage at the time of sputtering deposition. Further, a sputtering film is strongly characterized by intruding into and adhering to a projection and a defect section of a deposition face. In addition, in order to express the electric conductivity of the metal oxide, the film thickness thereof should be about 15 nm or more. Thus, there is a high possibility that the metal oxide conductive material adheres to a foreign matter or a defect on the lower electrode or a defect section of the organic film, and short circuit between the upper electrode and the lower electrode is generated.
- As a material of the upper electrode, a conductive film made of a metal film is also used. For example, in Japanese Unexamined Patent Application Publication No. 2004-164890, a description is given that an electron injection metal having a refractive index of 1 or less and an extinction coefficient of 0.5 or more is preferable as a material of the metal film in order to decrease absorption loss. For example, Japanese Unexamined Patent Application Publication No. 2004-164890 exemplifies a simple body or an alloy of aluminum, magnesium, calcium, sodium and the like.
- The metal film has a thickness of about 10 nm, and functions as an electrode. The film thickness of the metal film necessary for expressing electric conductivity is small. Thus, there is a small possibility that short circuit is generated in a foreign matter or a defect on the lower electrode or a defect section of the organic film. Further, in the case where the metal film is deposited by vacuum evaporation method under high vacuum by using resistance heating, evaporation particle scattering caused by collision with gas molecules is hardly generated, and there is a small possibility that the conductive material intrudes into a foreign matter or a defect on the lower electrode or a defect section of the organic film.
- However, there has been a disadvantage that the electric conductivity of the foregoing metal film is lowered by thinning the metal film. In the case of an alloy of magnesium and silver (Mg—Ag alloy), high electric conductivity is retained even if the film is thinned, but thinning limit has been above 6 nm. That is, in the past, there has been no known successful example that electric conductivity is retained to the degree that an organic EL device is able to be sufficiently driven with the use of a metal film having a thickness of 6 nm or less.
- For example, in Japanese Unexamined Patent Application Publication No. 8-185984, a description is given that an upper electrode is made of an oxide conductive material, and a transparent Mg—Ag alloy film having a thickness of 2 nm is provided between an organic layer and the upper electrode in order to improve electron injection characteristics. The Mg—Ag alloy film does not have a function as an electrode, and has only a function as an electron injection layer. The oxide conductive material is responsible for electric conductivity.
- Therefore, it is desirable to provide an organic electroluminescence device in which an upper electrode is made of a metal film, and the thickness of the metal film is able to be thinned down to 6 nm or less while electric conductivity of the metal film is retained, and a display unit including the same.
- In an embodiment, an organic electroluminescence device includes a first electrode, an organic layer formed on the first electrode and including a light-emitting layer, an intermediate layer formed on the organic layer, and a second electrode formed on the intermediate layer and having a thickness of 6 nm or less. In an embodiment, the organic layer includes an electron hole injection layer, an electron hole transport layer, the light-emitting layer, an electron transport layer, and an electron injection layer that are layered in that order from a first electrode side. In an embodiment, the second electrode is made of a metal conductive film including an alloy comprising one or more of aluminum, magnesium, calcium and sodium. In an embodiment, the alloy of the second electrode is a Mg—Ag alloy or an Al—Li alloy. In an embodiment, the intermediate layer includes calcium or aluminum. In an embodiment, sheet resistance of a film comprising the intermediate layer and the second electrode is 10,000Ω/□ or less. In one embodiment, at least a portion of a metal element contained in the intermediate layer is diffused into the second electrode In another embodiment, the intermediate layer is at least substantially diffused into the second electrode.
- In another embodiment, a display device includes at least one organic electroluminescent device. In this embodiment, the organic electroluminescent device includes a first electrode, an organic layer formed on the first electrode and including a light-emitting layer, an intermediate layer formed on the organic layer, and a second electrode formed on the intermediate layer and having a thickness of 6 nm or less.
- In another embodiment, an organic electroluminescence device includes an intermediate layer, and an electrode formed on the intermediate layer and having a thickness of 6 nm or less. In this embodiment, a sheet resistance of a film comprising the intermediate layer and the electrode is 10,000Ω/□ or less.
- In another embodiment, a method of manufacturing an organic electroluminescence device includes: forming a first electrode; forming an organic layer on the first electrode; forming a laminated film including an intermediate layer and a second electrode by forming the intermediate layer on the organic layer, and forming the second electrode on the intermediate film, wherein a thickness of the second electrode is 6 nm or less. In one embodiment, the method further includes at least substantially diffusing a material of the intermediate layer into the second electrode, such that the laminated film is an integrated electrode layer composed of the intermediate layer and the second electrode.
- According to another embodiment, an organic electroluminescence device includes an intermediate layer composed of a metal element such as an alkali metal provided between an upper or second electrode and an organic layer in contact with the upper electrode. In addition, in one embodiment, the thickness of the intermediate layer is from 0.1 nm to 5 nm both inclusive. According to another embodiment, an organic electroluminescence device includes an upper or second electrode containing an alloy of magnesium or the like as a main component, and containing a metal element such as an alkali metal. Thus, lowering of electric conductivity caused by degeneration of the upper electrode is inhibited, and the thickness of the upper electrode is able to be decreased down to 6 nm or less. In particular, the embodiments are suitable for an organic electroluminescence device in which a resonator structure is included, and light generated in the light emitting layer is resonated between the lower electrode and the upper electrode.
- According to another embodiment, a display unit includes at least one of the above-described embodiments. Thus, electric conductivity of the upper electrode is maintained, and the organic electroluminescence device is able to be favorably driven.
- Additional features and advantages are described herein, and will be apparent from the following Detailed Description and the figures.
-
FIG. 1 is a diagram illustrating a structure of a display unit according to a first embodiment. -
FIG. 2 is a diagram illustrating an example of the pixel drive circuit illustrated inFIG. 1 . -
FIG. 3 is a cross sectional view illustrating a structure of the organic EL device illustrated inFIG. 1 . -
FIGS. 4A and 4B are diagrams for comparing view angle characteristics of the organic EL device having the resonator structure illustrated inFIG. 3 to an existing example. -
FIG. 5 is a cross sectional view illustrating a structure of an organic EL device according to a first modified example. -
FIG. 6 is a cross sectional view illustrating a structure of an organic EL device according to a second embodiment. -
FIG. 7 is a cross sectional view illustrating another structure of the organic EL device illustrated inFIG. 6 . -
FIG. 8 is a plan view illustrating a schematic structure of a module including the display unit of the foregoing embodiments. -
FIG. 9 is a perspective view illustrating an appearance of a first application example of the display unit of the foregoing embodiments. -
FIG. 10A is a perspective view illustrating an appearance viewed from the front side of a second application example, andFIG. 10B is a perspective view illustrating an appearance viewed from the rear side of the second application example. -
FIG. 11 is a perspective view illustrating an appearance of a third application example. -
FIG. 12 is a perspective view illustrating an appearance of a fourth application example. -
FIG. 13A is an elevation view of a fifth application example unclosed,FIG. 13B is a side view thereof,FIG. 13C is an elevation view of the fifth application example closed,FIG. 13D is a left side view thereof,FIG. 13E is a right side view thereof,FIG. 13F is a top view thereof, andFIG. 13G is a bottom view thereof. - Embodiments will be hereinafter described in detail with reference to the drawings. The description will be given in the following order:
- 1. First embodiment (example that a first resonator structure is structured by a lower electrode and an upper electrode)
- 2. First modified example (example that an
intermediate layer 18 and anupper electrode 17 are integrated) - 3. Second embodiment (example that a second resonator structure is structured by providing a resonance adjustment layer on an upper electrode)
- 4. Examples
-
FIG. 1 illustrates a structure of a display unit according to a first embodiment. The display unit is used as an organic EL television device or the like. In the display unit, for example, as adisplay region 110, an after-mentioned plurality oforganic EL devices substrate 11. A signalline drive circuit 120 and a scanningline drive circuit 130 that are drivers for displaying a video are provided on the periphery of thedisplay region 110. - In the
display region 110, apixel drive circuit 140 is provided.FIG. 2 illustrates an example of thepixel drive circuit 140. Thepixel drive circuit 140 is an active drive circuit that is formed in a layer located lower than an after-mentionedlower electrode 14. That is, thepixel drive circuit 140 has a drive transistor Tr1, a writing transistor Tr2, a capacitor (retentive capacity) Cs between the drive transistor Tr1 and the writing transistor Tr2, and theorganic EL device 10R (or 10G, 10B) serially connected to the drive transistor Tr1 between a first power line (Vcc) and a second power line (GND). The drive transistor Tr1 and the writing transistor Tr2 are composed of a general thin film transistor (TFT (Thin Film Transistor)). The structure thereof is not particularly limited, and may be, for example, inversely staggered structure (so-called bottom gate type) or staggered structure (top gate type). - In the
pixel drive circuit 140, a plurality ofsignal lines 120A are arranged in the column direction, and a plurality ofscanning lines 130A are arranged in the row direction. Each cross section between eachsignal line 120A and eachscanning line 130A corresponds to one of the organiclight emitting devices signal line 120A is connected to the signalline drive circuit 120. An image signal is supplied to a source electrode of the writing transistor Tr2 from the signalline drive circuit 120 through thesignal line 120A. Eachscanning line 130A is connected to the scanningline drive circuit 130. A scanning signal is sequentially supplied to a gate electrode of the writing transistor Tr2 from the scanningline drive circuit 130 through thescanning line 130A. - Further, in the
display region 110, theorganic EL device 10R generating red light, theorganic EL device 10G generating green light, and theorganic EL device 10B generating blue light are sequentially arranged in a matrix state as a whole. A combination of theorganic EL devices -
FIG. 3 illustrates a cross sectional structure of theorganic EL devices FIG. 1 . Theorganic EL devices pixel circuit 140, aplanarizing insulating film 12, the lower orfirst electrode 14 as an anode, an inter-electrodeinsulating film 15, anorganic layer 16 including alight emitting layer 16C described later, and an upper orsecond electrode 17 as a cathode are layered in this order from thesubstrate 11 side. - The
organic EL devices protective layer 30. Further, a sealingsubstrate 50 made of glass or the like is bonded to the whole area of theprotective layer 30 with anadhesive layer 40 in between, and thereby theorganic EL devices - The
substrate 11 is made of glass, a silicon (Si) wafer, a resin or the like. The drive transistor Tr1 is electrically connected to thelower electrode 14 through aconnection hole 12A provided in theplanarizing insulating film 12. - The planarizing insulating
film 12 is intended to planarize a front face of thesubstrate 11 over which thepixel driving circuit 140 is formed. Since thefine connection hole 12A is provided, the planarizing insulatingfilm 12 is preferably made of a material having favorable pattern precision. Examples of component materials of theplanarizing insulating film 12 include an organic material such as polyimide and an inorganic material such as silicon oxide (SiO2). - The
lower electrode 14 also has a function as a reflecting layer, and desirably has high reflectance as much as possible in order to improve light emission efficiency. In particular, in the case where thelower electrode 14 is used as an anode, thelower electrode 14 is desirably made of a material having high electron hole injection characteristics. Such alower electrode 14 has, for example, a lamination direction thickness (hereinafter simply referred to as thickness) from 100 nm to 1000 nm both inclusive. Examples of material of thelower electrode 14 include a simple substance or an alloy of metal elements such as chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), and silver (Ag). A transparent conductive film composed of an oxide of indium and tin (ITO) or the like may be provided on the surface of thelower electrode 14. If an appropriate electron hole injection layer is provided, it is able to use a material that has high reflectance but has a disadvantage of an electron hole injection barrier due to existence of an oxide film on the surface and a small work function such as an aluminum (Al) alloy as thelower electrode 14. - The inter-electrode
insulating film 15 is intended to secure insulation between thelower electrode 14 and theupper electrode 17, and to obtain a desired shape of the light emitting region. For example, the inter-electrode insulatingfilm 15 is made of a photosensitive resin. The inter-electrodeinsulating film 15 is provided with an aperture correspondingly to the light emitting region. Though theorganic layer 16 and theupper electrode 17 are provided not only in the aperture but also over the inter-electrode insulatingfilm 15, light is emitted only in the aperture of the inter-electrode insulatingfilm 15. - The
organic layer 16 has, for example, a structure in which an electronhole injection layer 16A, an electronhole transport layer 16B, thelight emitting layer 16C, anelectron transport layer 16D, and anelectron injection layer 16E are layered from thelower electrode 14 side. Of the foregoing layers, the layers other than thelight emitting layer 16C may be provided according to needs. Theorganic layer 16 may have a structure varying according to the light emitting color of theorganic EL devices hole injection layer 16A is intended to improve the electron hole injection efficiency and functions as a buffer layer to prevent leakage. The electronhole transport layer 16B is intended to improve efficiency to transport electron holes into thelight emitting layer 16C. Thelight emitting layer 16C is intended to generate light due to electron-hole recombination by impressing an electric field. Theelectron transport layer 16D is intended to improve efficiency to transport electrons into thelight emitting layer 16C. Theelectron injection layer 16E is intended to improve efficiency to inject electrons. - The electron
hole injection layer 16A of theorganic EL device 10R has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of the hexaazatriphenylene derivative shown inChemical formula 1 or Chemical formula 2. The electronhole transport layer 16B of theorganic EL device 10R has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of bis[(N-naphthyl)-N-phenyl]benzidine (α-NPD). Thelight emitting layer 16C of theorganic EL device 10R has, for example, a thickness from 10 nm to 100 nm both inclusive, and is composed of a material in which 40 volume % of 2,6-bis[4-[N-(4-metoxyphenyl)-N-phenyl]aminostyril]naphthalene-1,5-dicarbonitrile (BSN-BCN) is mixed with 8-quinolinol aluminum complex (Alq3). Theelectron transport layer 16D of theorganic EL device 10R has, for example, a thickness from 5 nm to 300 nm both inclusive, and is made of Alq3. Theelectron injection layer 16E of theorganic EL device 10R has, for example, a thickness about 0.3 nm, and is made of LiF, Li2O or the like. - In
Chemical formula 1, R1 to R6 respectively and independently represent hydrogen; halogen; a hydroxyl group; an amino group; an aryl amino group; a substituted/unsubstituted carbonyl group having the carbon number of 20 or less; a substituted/unsubstituted carbonylester group having the carbon number of 20 or less; a substituted/unsubstituted alkyl group having the carbon number of 20 or less; a substituted/unsubstituted alkenyl group having the carbon number of 20 or less; a substituted/unsubstituted alkoxyl group having the carbon number of 20 or less; a substituted/unsubstituted aryl group having the carbon number of 30 or less; a substituted/unsubstituted heterocyclic group having the carbon number of 30 or less; or a substituted group selected from a group consisting of a nitrile group, a cyano group, a nitro group, and a silyl group. Each Rm (m=1 to 6) adjacent to each other may be bonded with each other through an annular structure. Further, X1 to X6 respectively and independently represent a carbon atom or a nitrogen atom. - Specifically, the electron
hole injection layer 16A of theorganic EL device 10R is preferably made of the material shown in Chemical formula 2. - The electron
hole injection layer 16A of theorganic EL device 10G has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of the hexaazatriphenylene derivative shown inChemical formula 1 or Chemical formula 2. The electronhole transport layer 16B of theorganic EL device 10G has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of α-NPD. Thelight emitting layer 16C of theorganic EL device 10G has, for example, a thickness from 10 nm to 100 nm both inclusive, and is composed of a material in which 1 volume % of coumarin 6 is mixed with Alq3. Theelectron transport layer 16D of theorganic EL device 10G has, for example, a thickness from 5 nm to 300 nm both inclusive, and is made of Alq3. Theelectron injection layer 16E of theorganic EL device 10G has, for example, a thickness about 0.3 nm, and is made of LiF, Li2O or the like. - The electron
hole injection layer 16A of theorganic EL device 10B has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of the hexaazatriphenylene derivative shown inChemical formula 1 or Chemical formula 2. The electronhole transport layer 16B of theorganic EL device 10B has, for example, a thickness from 5 nm to 300 nm both inclusive, and is composed of α-NPD. Thelight emitting layer 16C of theorganic EL device 10B has, for example, a thickness from 10 nm to 100 nm both inclusive, and is composed of spiro 6Φ. Theelectron transport layer 16D of theorganic EL device 10B has, for example, a thickness from 5 nm to 300 nm both inclusive, and is made of Alq3. Theelectron injection layer 16E of theorganic EL device 10B has, for example, a thickness of about 0.3 nm, and is composed of LiF, Li2O or the like. - The
upper electrode 17 is made of a metal conductive film. Specific examples thereof include an alloy of aluminum (Al), magnesium (Mg), calcium (Ca), or sodium (Na). Specially, an alloy of magnesium and silver (Mg—Ag alloy) is preferable, since the Mg—Ag alloy has electric conductivity and small absorption in a thin film. The ratio of magnesium and silver in the Mg—Ag alloy is not particularly limited, but the film thickness ratio of Mg:Ag is desirably in the range from 20:1 to 1:1. Further, the material of theupper electrode 17 may be an alloy of aluminum (Al) and lithium (Li) (Al—Li alloy). - The thickness of the second or
upper electrode 17 is 6 nm or less, and preferably from 2 nm to 6 nm both inclusive. If the thickness thereof is 6 nm or less, it is possible to inhibit the material of theupper electrode 17 from adhering to the surrounding of a foreign matter on thelower electrode 14, and inhibit generation of non-light emitting defect (so-called lost point) due to electric short circuit between thelower electrode 14 and theupper electrode 17. Further, if the thickness thereof is 2 nm or more, it is possible to secure the electric conductivity of theupper electrode 17 to the degree at which driving theorganic EL devices upper electrode 17 is more preferably from 2.5 nm to 6 nm both inclusive, since thereby driving theorganic EL devices - The
intermediate layer 18 is provided being contacted with theupper electrode 17 between theupper electrode 17 and theorganic layer 16. Theintermediate layer 18 has, for example, a thickness from 0.1 nm to 5 nm both inclusive, and contains one selected from the metal element group consisting of an alkali metal, an alkali earth metal, a lanthanoid metal, aluminum, indium, tin, nickel, copper, and zinc. Thereby, in the display unit, the thickness of theupper electrode 17 may be decreased down to 6 nm or less while electric conductivity of theupper electrode 17 is retained. - “Thickness of the
upper electrode 17” and “thickness of theintermediate layer 18” in this specification are obtained by optical method such as spectroscopic ellipsometry. Further, “thickness of theupper electrode 17” and “thickness of theintermediate layer 18” are measured in a state of a product after being sealed with the sealingsubstrate 50 and being assembled. - The
intermediate layer 18 has a function as a degeneration preventive layer to inhibit theupper electrode 17 from being directly contacted with theorganic layer 16 and losing electric conductivity. Thus, theintermediate layer 18 desirably has a thickness with which degeneration preventive effect of theupper electrode 17 is obtained. Specifically, as described above, theintermediate layer 18 has a thickness of 0.1 nm or more. Further, in the case where the thickness of theintermediate layer 18 is 5 nm or less, lowering of efficiency due to light absorption is able to be small. - In the case where the
upper electrode 17 is used as a cathode, theintermediate layer 18 is preferably made of an electron injection material. As described above, examples of such a material include the alkali metal, the alkali earth metal, and the lanthanoid metal. By providing the appropriateelectron injection layer 16E, a metal having a larger work function than that of magnesium is able to be used. Examples of such a metal include a metal such as aluminum, indium, and tin; and a transition metal such as nickel, copper, and zinc. - Specifically, the
intermediate layer 18 preferably contains calcium. Calcium has favorable electron injection characteristics to theorganic layer 16, has high electric conductivity as a film, and has small absorption. Further, calcium as a single material is easily deposited onto theorganic layer 16 comparatively, and calcium is not subject to drastic oxidation and hydroxylation reaction in the air differently from other material such as the alkali earth metal and the alkali metal. Thus, handling calcium in manufacturing is comparatively easy. - Otherwise, the
intermediate layer 18 preferably contains aluminum. If aluminum is layered after the appropriateelectron injection layer 16E such as lithium fluoride is formed thinly, aluminum expresses favorable electron injection characteristics. In addition, aluminum has effect to prevent degeneration of theupper electrode 17 further provided thereon. - The sheet resistance of the film composed of the
intermediate layer 18 and theupper electrode 17 is preferably, for example, 10000Ω/□ or less. Thereby, in a panel structure in which a contact section is arranged in the vicinity of the pixel on the substrate, influence of voltage drop is able to be lowered, and drive voltage rise or luminance gradient in the pixel is able to be inhibited. For example, in a 100 inch full high definition display unit, one pixel pitch is 1.15 mm. In such a large pixel, if the white display light emitting efficiency is 20 cd/A and the display luminance is 200 cd/m2, voltage drop from an end to the other end of the pixel is 0.13V, and there is a small possibility to impair the display quality. - The
intermediate layer 18 and theupper electrode 17 are formed as a laminated film in a manufacturing step as described later. However, after theupper electrode 17 is formed, part of the metal element contained in theintermediate layer 18 may be distributed in thesecond electrode 17. - The
upper electrode 17 also has a function as a translucent reflecting layer. That is, theorganic EL devices light emitting layer 16C is resonated between thelower electrode 14 and theupper electrode 17 by the resonator structure MC1. In the resonator structure MC1, the interface between thelower electrode 14 and theorganic layer 16 is a reflecting face P1, the interface between theintermediate layer 18 and theelectron injection layer 16E is a translucent reflecting face P2, and theorganic layer 16 is a resonance section. The light generated in thelight emitting layer 16C is resonated and is extracted from the translucent reflecting face P2 side. In the case where the resonator structure MC1 is included, the light generated in thelight emitting layer 16C generates multiple interference, the half bandwidth of spectrum of the light extracted from the translucent reflecting face P2 side is decreased, and the peak intensity is able to be increased. That is, the light radiation intensity in the front face direction is able to be increased, and the color purity of light emission is able to be improved. Outside light entering from the sealingsubstrate 50 side is also able to be decayed by multiple interference. By combining with an after-mentionedcolor filter 51, the reflectance of outside light in theorganic EL devices - To this end, an optical distance L1 between the reflecting face P1 and the translucent reflecting face P2 preferably satisfies
Mathematical formula 1. -
(2L1)/λ+Φ)/(2π)=mMathematical formula 1 - In the formula, “L1” represents the optical distance between the reflecting face P1 and the translucent reflecting face P2. “m” represents an order (0 or a natural number). “Φ” represents a sum of phase shift Φ1 of reflected light generated in the reflecting face P1 and phase shift Φ2 of reflected light generated in the translucent reflecting face P2 (Φ=Φ1+Φ2) (rad). “λ” represents a peak wavelength of spectrum of light that is desirably extracted from the translucent reflecting face P2 side. For L1 and λ in the
Mathematical formula 1, the unit should be unified, and for example, (nm) is used as the unit. - Between the reflecting face P1 and the translucent reflecting face P2, a position where the extraction light emitting strength becomes the maximum (resonance face) exists. The number of resonance faces is m+1. Under the conditions of m=1 or more, in the case where the light emitting face exists on a resonance face closest to the reflecting face P1, the half bandwidth of light emitting spectrum becomes widest.
- In the
organic EL devices - In view of only view angle characteristics, conditions m=0 are ideal. However, under such conditions, the thickness of the
organic layer 16 is small, and thus there is a possibility that influence on light emitting characteristics and short circuit between thelower electrode 14 and theupper electrode 17 are generated. Thus, for example, by using the conditions m=1, view angle dependence of luminance and chromaticity is avoided from being increased, and lowering of light emitting characteristics and short circuit generation are inhibited. For example, in the case where thelower electrode 14 is composed of an aluminum alloy and theupper electrode 17 is composed of an Mg—Ag alloy respectively, the thickness of theorganic layer 16 of the blueorganic EL device 10B is about 80 nm if m is 0, and is about 190 nm if m is 1, and accordingly generation of short circuit is inhibited. - Further, in this embodiment, as described above, the thickness of the
upper electrode 17 is decreased down to from 2 nm to 6 nm both inclusive. Thus, luminance lowering and chromaticity change according to the view angle are able to be more decreased for the following reason. That is, in the case where the thickness of theupper electrode 17 is decreased, the transmittance ratio of theupper electrode 17 is increased and the reflectance is lowered. In the result, out of light emission from thelight emitting layer 16C, the ratio of light reflected by theupper electrode 17 toward thelower electrode 14 side is decreased. Thereby, the resonator structure MC1 is weakened, and angle dependence of light extracted from the translucent reflecting face P2 is decreased. Accordingly, for example, under the conditions that the order m is 1 or more, view angle dependence of luminance and chromaticity is able to be decreased, and an organic EL display unit having superior display performance is able to be obtained. -
FIG. 4A illustrates spectrums in the case where theintermediate layer 18 composed of Ca having a thickness of 2 nm and theupper electrode 17 composed of an Mg—Ag alloy having a thickness of 4 nm are provided in the organic EL device having the resonator structure MC1. The spectrums show results of viewing from the front face and from 45 deg oblique direction by optical simulation.FIG. 4B illustrates spectrums similarly obtained by optical simulation in the case where theintermediate layer 18 is not provided and only theupper electrode 17 composed of an Mg—Ag alloy having a thickness of 8 nm is provided. As evidenced byFIG. 4A andFIG. 4B , in the former case in which theintermediate layer 18 is provided, the spectrum half bandwidth is wider, the peak intensity is lower, and resonator effect is more modified than in the latter case, but change of light emitting characteristics according to the view angle is more decreased than in the latter case. - The
protective layer 30 illustrated inFIG. 3 is composed of silicon nitride (SiNx), silicon oxide, a metal oxide or the like. Theadhesive layer 40 illustrated inFIG. 3 is composed of, for example, a heat-hardening resin or a ultraviolet hardening resin. - The sealing
substrate 50 illustrated inFIG. 3 is located on theupper electrode 17 side of theorganic EL devices substrate 50 seals the organiclight EL devices adhesive layer 40, and is made of a material such as glass transparent to light generated in the organiclight EL devices substrate 50 is, for example, provided with thecolor filter 51, which extracts the light generated in the organiclight EL devices organic EL devices - The
color filter 51 may be provided on any face of the sealingsubstrate 50, but is preferably provided on the side of theorganic EL devices color filter 51 is not exposed on the surface, and is able to be protected by theadhesive layer 40. Further, in this case, since the distance between the light emittinglayer 16C and thecolor filter 51 is narrowed, it is possible to avoid an event that light emitted from thelight emitting layer 16C enters anadjacent color filter 51 of other color to generate mixed color. Thecolor filter 51 has a red filter, a green filter, and a blue filter (not illustrated), which are sequentially arranged correspondingly to theorganic EL devices - The red filter, the green filter, and the blue filter are respectively formed in the shape of, for example, a rectangle with no space in between. The red filter, the green filter, and the blue filter are respectively made of a resin mixed with a pigment. Adjustment is made by selecting a pigment so that light transmittance in the intended red, green, or blue wavelength region is high, and light transmittance in the other wavelength regions is low.
- Further, the wavelength range with high transmittance in the
color filter 51 corresponds with peak wavelength λ of spectrum of light that is desirably extracted from the resonator structure MC1. Thereby, out of outside light entering from the sealingsubstrate 50, only light having a wavelength equal to the peak wavelength λ of spectrum of light that is desirably extracted passes through thecolor filter 51, and outside light in other wavelengths is prevented from intruding into the organiclight EL devices - The display unit is able to be manufactured, for example, as follows.
- First, the
pixel drive circuit 140 including the drive transistor Tr1 is formed on thesubstrate 11 made of the foregoing material. After that, the planarizing insulatingfilm 12 is formed by coating the whole area of thesubstrate 11 with a sensitive resin, and theplanarizing insulating film 12 is patterned into a given shape by exposure and development, theconnection hole 12A is formed, and the resultant is fired. - Next, the
lower electrode 14 made of the foregoing material is formed by, for example, sputtering method, and thelower electrode 14 is selectively removed by wet etching. Thereby, the respective organiclight emitting devices - Subsequently, the whole area of the
substrate 11 is coated with a photosensitive resin. An aperture is provided correspondingly to the light emitting region by, for example, photolithography method, and the resultant is fired. Accordingly, the inter-electrode insulatingfilm 15 is formed. - After that, the electron
hole injection layer 16A, the electronhole transport layer 16B, thelight emitting layer 16C, and theelectron transport layer 16D of theorganic layer 16 that have the foregoing thickness and are made of the foregoing material are formed by, for example, evaporation method. - After the
organic layer 16 is formed, the laminated film composed of theintermediate layer 18 and theupper electrode 17 that have the foregoing thickness and are made of the foregoing material is deposited by, for example, evaporation method. After theupper electrode 17 is formed, part of the metal element contained in theintermediate layer 18 may be diffused and distributed in thesecond electrode 17. Accordingly, theorganic EL devices FIG. 3 are formed. - Subsequently, the
protective layer 30 that is made of the foregoing material is formed on theorganic EL devices - Further, for example, the sealing
substrate 50 made of the foregoing material is coated with a material of the red filter by spin coating or the like, the resultant is provided with patterning by photolithography technology, and fired. Thereby, the red filter is formed. Subsequently, the blue filter and the green filter are sequentially formed in the same manner as that of the red filter. - After that, the
adhesive layer 40 is formed on theprotective layer 30. The sealingsubstrate 50 and theprotective layer 30 are bonded with theadhesive layer 40 in between. At this time, the face of the sealingsubstrate 50 on which thecolor filter 51 is formed is preferably arranged on the side of theorganic EL devices FIG. 1 toFIG. 3 is completed. - In the display unit, the scanning signal is supplied from the scanning
line drive circuit 130 to each pixel through the gate electrode of the writing transistor Tr2, and the image signal from the signalline drive circuit 120 is retained in the retentive capacity Cs through the writing transistor Tr2. That is, the drive transistor Tr1 is on-off controlled according to the signal retained in the retentive capacity Cs, and thereby a drive current Id is injected into the respective organiclight emitting devices upper electrode 17, thecolor filter 51, and the sealingsubstrate 50, and is extracted. - In this case, the
intermediate layer 18 is provided being contacted with theupper electrode 17 between theupper electrode 17 and theorganic layer 16. Theintermediate layer 18 contains one selected from the metal element group consisting of the foregoing alkali metal and the like, and has a thickness from 0.1 nm to 5 nm both inclusive. Thus, degeneration of theupper electrode 17 and lowering of electric conductivity caused by direct contact between theupper electrode 17 and theorganic layer 16 are inhibited, theorganic EL devices upper electrode 17 is small, generation of non-light emitting defect due to short circuit between thelower electrode 14 and theupper electrode 17 is inhibited. - Further, in the case where the
organic EL devices upper electrode 17, the resonator structure MC1 is weakened, and view angle dependence of light extracted from the translucent reflecting face P2 is decreased. Accordingly, for example, under the conditions that the order m is 1 or more and view angle dependence of luminance and chromaticity is easily significant, luminance and chromaticity change according to the view angle is moderated. - As described above, in the
organic EL devices intermediate layer 18 is provided being contacted with theupper electrode 17 between theupper electrode 17 and theorganic layer 16. Theintermediate layer 18 contains one selected from the metal element group consisting of the alkali metal and the like, and has a thickness from 0.1 nm to 5 nm both inclusive. Thus, lowering of electric conductivity caused by degeneration of theupper electrode 17 is inhibited, and the thickness of theupper electrode 17 may be decreased down to from 2 nm to 6 nm both inclusive. Thus, in the case where a display unit is structured by using theorganic EL devices upper electrode 17 is retained, theorganic EL devices organic EL devices light emitting layer 16C is resonated between thelower electrode 14 and theupper electrode 17. -
FIG. 5 illustrates a cross sectional structure of theorganic EL devices organic EL devices intermediate layer 18 is totally diffused in theupper electrode 17, and theintermediate layer 18 is integrated with theupper electrode 17. Thus, a description will be given by affixing the same referential symbols for the corresponding elements. - The
upper electrode 17 has a thickness from 2 nm to 6 nm both inclusive. Theupper electrode 17 contains an alloy containing magnesium (Mg), aluminum (Al), calcium (Ca), or sodium (Na) as a main component, and contains one selected from the metal element group consisting of an alkali metal, an alkali earth metal, a lanthanoid metal, aluminum, indium, tin, nickel, copper, and zinc. Thereby, in the display unit, the thickness of theupper electrode 17 may be decreased down to 6 nm or less while electric conductivity of theupper electrode 17 is retained. - As the alloy that is a main component of the
upper electrode 17, for example, an alloy of magnesium and silver (Mg—Ag alloy) or an alloy of aluminum (Al) and lithium (Li) (Al—Li alloy) is preferable as in theupper electrode 17 of the first embodiment. - The metal element contained in the
upper electrode 17 has a degeneration preventive function to inhibit theupper electrode 17 from being directly contacted with theorganic layer 16 and losing electric conductivity as theintermediate layer 18 of the foregoing embodiment does. In the case where theupper electrode 17 is used as a cathode, the metal element preferably has electron injection characteristics. As described above, examples of such a material include the alkali metal, the alkali earth metal, and the lanthanoid metal. By providing the appropriateelectron injection layer 16E, a metal having a larger work function than that of magnesium is able to be used. Examples of such a metal include a metal such as aluminum, indium, and tin; and a transition metal such as nickel, copper, and zinc. - Specifically, as the metal element contained in the
upper electrode 17, calcium or aluminum is preferable as in theintermediate layer 18 of the first embodiment. - The thickness of the
upper electrode 17 is more preferably from 2.5 nm to 6 nm both inclusive as in theupper electrode 17 of the first embodiment. - “Thickness of the
upper electrode 17” in this specification is obtained by optical method such as spectroscopic ellipsometry. Further, “thickness of theupper electrode 17” is measured in a state of a product after being sealed with the sealingsubstrate 50 and being assembled. - The sheet resistance of the
upper electrode 17 is preferably, for example, 10000Ω/□ or less as in the first embodiment. - The metal element contained in the
upper electrode 17 is, for example, diffused in theupper electrode 17. Further, the metal element contained in theupper electrode 17 may be chemically changed by being contacted with theelectron transport layer 16D and theelectron injection layer 16E. Theupper electrode 17 is formed as a laminated film composed of theintermediate layer 18 and theupper electrode 17 in a manufacturing step as in the first embodiment. However, after theupper electrode 17 is formed, the metal element as the material of theintermediate layer 18 is diffused and distributed in theupper electrode 17, and as a result, an integrated electrode layer composed of theintermediate layer 18 and theupper electrode 17 is structured. Therefore, if a cross section is analyzed, theintermediate layer 18 is not detected as a layer. - In this modified example, the translucent reflecting face P2 of the resonator structure MC1 is the interface between the
upper electrode 17 and theelectron injection layer 16E. - A method of manufacturing the display unit is similar to that of the foregoing first embodiment. That is, the
intermediate layer 18 and theupper electrode 17 are formed as a laminated film as in the foregoing first embodiment. At this time, after theupper electrode 17 is formed, the metal element as the material of theintermediate layer 18 is diffused in theupper electrode 17, and as a result, theupper electrode 17 is formed as the integrated electrode layer composed of theintermediate layer 18 and theupper electrode 17. Accordingly, theorganic EL devices FIG. 5 are formed. - In the display unit, driving control is made for each pixel and display is made in the same manner as that described in the first embodiment. In this case, the
upper electrode 17 contains the alloy of magnesium (Mg) or the like as a main component, and contains one selected from the metal element group consisting of the foregoing alkali metal and the like. Thus, lowering of electric conductivity caused by degeneration of theupper electrode 17 is inhibited, theorganic EL devices upper electrode 17 is small, generation of non-light emitting defect due to short circuit between thelower electrode 14 and theupper electrode 17 is inhibited. - As described above, in this modified example, the
upper electrode 17 contains the alloy of magnesium (Mg) or the like as a main component, and contains one selected from the metal element group consisting of the foregoing alkali metal and the like. Thus, lowering of electric conductivity caused by degeneration of theupper electrode 17 is inhibited, and the thickness of theupper electrode 17 is able to be decreased down to from 2 nm to 6 nm both inclusive. Thus, in the case where a display unit is structured by using theorganic EL devices upper electrode 17 is retained, theorganic EL devices organic EL devices light emitting layer 16C is resonated between thelower electrode 14 and theupper electrode 17. -
FIG. 6 illustrates a cross sectional structure of theorganic EL devices organic EL devices resonance adjustment layer 19 is included between theupper electrode 17 and theprotective layer 30. Thus, a description will be given by affixing the same referential symbols for the corresponding elements. - The
resonance adjustment layer 19 is intended to control resonator effect of the resonator structure MC1 by providing a reflectance interface by using dielectric mirror principle on theupper electrode 17, and has a refractive index different from the refractive index of theprotective layer 30. That is, theorganic EL devices resonance adjustment layer 19 and theprotective layer 30 and thelower electrode 14 by the resonator structure MC2. In the resonator structure MC2, the interface between thelower electrode 14 and theorganic layer 16 is the reflecting face P1, the interface between theresonance adjustment layer 19 and theprotective layer 30 is a translucent reflecting face P3, and theorganic layer 16, theintermediate layer 18, theupper electrode 17, and theresonance adjustment layer 19 are a resonance section. The light extracted from the resonator structure MC1 is resonated and is extracted from the translucent reflecting face P3 side. In the case where the resonator structure MC2 is included as the second resonator structure, if resonator effect of the resonator structure MC1 is weakened by decreasing the thickness of theupper electrode 17, resonator effect is able to be controlled. - An optical distance L2 between the reflecting face P1 and the translucent reflecting face P3 preferably satisfies Mathematical formula 2.
-
(2L2)/λ+Φ/(2π)=m Mathematical formula 2 - In the formula, “L2” represents the optical distance between the reflecting face P1 and the translucent reflecting face P3. “m” represents an order (0 or a natural number). “Φ” represents a sum of the phase shift Φ1 of reflected light generated in the reflecting face P1 and a phase shift Φ3 of reflected light generated in the translucent reflecting face P3 (Φ=Φ1+Φ3) (rad). “λ” represents a peak wavelength of spectrum of light that is desirably extracted from the translucent reflecting face P3 side. For L2 and λ in the Mathematical formula 2, the unit should be unified, and for example, (nm) is used as the unit.
- Further, the
resonance adjustment layer 19 also has a function as a protective film to prevent deterioration of theupper electrode 17. That is, if theprotective layer 30 is directly layered on theupper electrode 17 by CVD method or sputtering method after theupper electrode 17 is formed, there is a possibility that theupper electrode 17 is degenerated by introduced gas at the time of film forming, oxygen, high energy particles, oxygen in a chamber or mobile environment, moisture or the like, and function as an electrode is not able to be maintained. However, if theresonance adjustment layer 19 is provided by vacuum evaporation method continuously after theupper electrode 17 is formed, theupper electrode 17 is able to be protected. - The thickness of the
resonance adjustment layer 19 is not particularly limited. However, to prevent degeneration of theupper electrode 17, for example, the thickness of theresonance adjustment layer 19 is desirably 10 nm or more. The film thickness setting is able to be adjusted as appropriate by optical design to adjust the intensity of the resonator structure MC2. However, theresonance adjustment layer 19 is supposed to be formed common to R, G, and B. Thus, it is desirable that the refractive index and the film thickness are set so that light extraction effect is favorable for all three color. As a material of theresonance adjustment layer 19, a material having small visible light absorption and having a small possibility to degenerate theupper electrode 17 at the time of film formation is desirable. It is able to select a material having a refractive index according to adjustment request of the resonator structure MC2. As a specific material, an vacuum evaporative inorganic film or a vacuum evaporative organic film represented by lithium fluoride (refractive index of 1.38 in 460 nm), potassium bromide (refractive index of 1.58), Alq3 (refractive index of 1.84), MoO3 (refractive index of 2.22), ZnSe (refractive index of 2.6) and the like are able to be used. - The refractive index of the
resonance adjustment layer 19 is preferably smaller than the refractive index of theprotective layer 30 for the following reason. That is, the translucent reflecting face P3 of the resonator structure MC2 is formed by refractive index difference of the interface between theresonator adjustment layer 19 and theprotective layer 30. Thus, if the refractive index difference is increased, resonator effect is intensified, while if the refractive index difference is decreased, resonator effect is weakened. To intensify the resonator effect by increasing the refractive index difference, the refractive index of theresonance adjustment layer 19 is set smaller than that of theprotective layer 30, or is set larger than that of theprotective layer 30. If the refractive index of theresonance adjustment layer 19 is set smaller than that of theprotective layer 30, as a result of phase shift in the reflecting face P1, the order m of the resonator structure MC2 is able to be identical with the order m of the resonator structure MC1 composed of thelower electrode 14 and theupper electrode 17. Further, in the case where the light emitting position of each light emittinglayer 16C of the organiclight emitting devices lower electrode 14, even if theresonance adjustment layer 19 is formed common to the organiclight emitting devices light emitting devices - In the case where there is no need to intensify resonator effect, the refractive index of the
resonance adjustment layer 19 is able to be set to a value close to the refractive index of theprotective layer 30. For example, in the case where theprotective layer 30 is composed of silicon nitride (refractive index from 1.8 to 1.9 both inclusive), the refractive index of the organic material represented by Alq3 is about 1.9, and is suitable for theresonance adjustment layer 19. In addition, other organic film or other inorganic film may be used. - The display unit is able to be manufactured in the same manner as that of the first embodiment, except that the
resonance adjustment layer 19 made of the foregoing material is formed by vacuum evaporation method continuously after theupper electrode 17 is formed. - In the display unit, driving control is made for each pixel and display is made in the same manner as that described in the first embodiment. In this case, the
resonance adjustment layer 19 is provided between theupper electrode 17 and theprotective layer 30, and the resonator structure MC2 is structured. Thus, in the case where resonator effect of the resonator structure MC1 is weakened by decreasing the thickness of theupper electrode 17, intensity of light extracted from the front face is increased. - As described above, in the
organic EL devices resonance adjustment layer 19 is provided between theupper electrode 17 and theprotective layer 30, and the resonator structure MC2 is structured. Thus, in the case where resonator effect of the resonator structure MC1 is weakened by decreasing the thickness of theupper electrode 17, the resonator effect is able to be controlled. - In this embodiment, as illustrated in
FIG. 7 , it is possible that the metal element as a material of theintermediate layer 18 is diffused and distributed in theupper electrode 17, and as a result, theupper electrode 17 is structured as an integrated electrode layer composed of theintermediate layer 18 and theupper electrode 17. - A description will be given of application examples of the display unit described in the foregoing embodiments. The display unit of the foregoing embodiments is able to be applied to a display unit of an electronic device in any field for displaying a video signal inputted from outside or a video signal generated inside as an image or a video, such as a television device, a digital camera, a notebook personal computer, a portable terminal device such as a mobile phone, and a video camera.
- Module
- The display unit of the foregoing embodiments is incorporated in various electronic devices such as after-mentioned first to fifth application examples as a module as illustrated in
FIG. 8 , for example. In the module, for example, aregion 210 exposed from the sealingsubstrate 50 and theadhesive layer 40 is provided on a side of thesubstrate 11, and an external connection terminal (not illustrated) is formed in the exposedregion 210 by extending the wirings of the signalline drive circuit 120 and the scanningline drive circuit 130. The external connection terminal may be provided with a Flexible Printed Circuit (FPC) 220 for inputting and outputting a signal. -
FIG. 9 is an appearance of a television device to which the display unit of the foregoing embodiments is applied. The television device has, for example, a videodisplay screen section 300 including afront panel 310 and afilter glass 320. The videodisplay screen section 300 is composed of the display unit according to the foregoing respective embodiments. -
FIGS. 10A and 10B are an appearance of a digital camera to which the display unit of the foregoing embodiments is applied. The digital camera has, for example, a light emitting section for aflash 410, adisplay section 420, amenu switch 430, and ashutter button 440. Thedisplay section 420 is composed of the display unit according to the foregoing respective embodiments. -
FIG. 11 is an appearance of a notebook personal computer to which the display unit of the foregoing embodiments is applied. The notebook personal computer has, for example, amain body 510, akeyboard 520 for operation of inputting characters and the like, and adisplay section 530 for displaying an image. Thedisplay section 530 is composed of the display unit according to the foregoing respective embodiments. -
FIG. 12 is an appearance of a video camera to which the display unit of the foregoing embodiments is applied. The video camera has, for example, amain body 610, a lens for shooting anobject 620 provided on the front side face of themain body 610, a start/stop switch in shooting 630, and adisplay section 640. Thedisplay section 640 is composed of the display unit according to the foregoing respective embodiments. -
FIGS. 13A to 13G are an appearance of a mobile phone to which the display unit of the foregoing embodiments is applied. In the mobile phone, for example, anupper package 710 and alower package 720 are jointed by a joint section (hinge section) 730. The mobile phone has adisplay 740, a sub-display 750, a picture light 760, and acamera 770. Thedisplay 740 or the sub-display 750 is composed of the display unit according to the foregoing respective embodiments. - A description will be given of specific examples.
- The
intermediate layer 18 and theupper electrode 17 of the foregoing first embodiment were formed. At this time, theintermediate layer 18 was composed of calcium (Ca), and the thickness thereof was 2.0 nm. Theupper electrode 17 was composed of an Mg—Ag alloy, and the thickness thereof was varied as illustrated in Table 1. To match with the conditions of the organiclight emitting devices intermediate layer 18, a vacuum evaporated film having a thickness of 20 nm obtained by resistance heating of an electron transport material was formed. Theupper electrode 17 was deposited at a vapor rate of 0.1 nm/sec by vacuum evaporation method by resistance heating at a high vacuum degree of 1*10−5 Pa or less. The co-evaporation ratio of magnesium and silver was Mg:Ag=10:1. To prevent degeneration by air, a lithium fluoride film having a thickness of 40 m was formed by vacuum evaporation on theupper electrode 17. After that, the resultant was sealed with an ultraviolet hardened resin. - An upper electrode composed of a Mg—Ag alloy was formed in the same manner as that of the foregoing Examples 1-1 to 1-4, except that the intermediate layer was not provided. At this time, the thickness of the upper electrode was varied as illustrated in Table 1.
- For the obtained intermediate layer or the obtained upper electrode of Examples 1-1 to 1-4 and Comparative examples 1-1 and 1-2, the thickness was measured by spectroscopic ellipsometry, and the sheet resistance was examined. The results thereof are all illustrated in Table 1.
-
TABLE 1 Material of intermediate layer (thickness)/material of upper Sheet resistance electrode (thickness) (Ω/□) Example 1-1 Ca (2.0 nm)/Mg—Ag (2.0 nm) 585 Example 1-2 Ca (2.0 nm)/Mg—Ag (3.0 nm) 306 Example 1-3 Ca (2.0 nm)/Mg—Ag (4.0 nm) 215 Example 1-4 Ca (2.0 nm)/Mg—Ag (5.0 nm) 162 Comparative Mg—Ag (10.0 nm) 86 example 1-1 Comparative Mg—Ag (4.0 nm) 28500 example 1-2 - As evidenced by Table 1, in Comparative example 1-2 in which the intermediate layer was not provided and the thickness of the upper electrode was decreased, the sheet resistance was significantly deteriorated compared to in Comparative Example 1-1 in which only the thick upper electrode was provided. Meanwhile, in Examples 1-1 to 1-4 in which the thickness of the
upper electrode 17 was decreased and theintermediate layer 18 was provided, the sheet resistance was significantly improved compared to in Comparative example 1-2 in which the intermediate layer was not provided and the thickness of the upper electrode was decreased, and a result close to that of Comparative example 1-1 in which only the thick upper electrode was provided was obtained. - That is, it was found that in the case where the
intermediate layer 18 composed of calcium (Ca) was provided being contacted with theupper electrode 17 between theupper electrode 17 and theorganic layer 16, the thickness was able to be decreased down to 6 nm or less while electric conductivity of theupper electrode 17 was retained. - The organic EL device of the first embodiment was fabricated by using the
intermediate layer 18 and theupper electrode 17 illustrated in Table 1. First, as thelower electrode 14, an aluminum-neodymium alloy film (film thickness: 150 nm) was formed on thesubstrate 11 made of a glass plate sized 25 mm*25 mm. Further, as a contact with theupper electrode 17 and a connection section to a power line, a pad section (not illustrated) composed of titanium was provided on thesubstrate 11. - Next, the
lower electrode 14 was coated with a photosensitive organic insulating material, and an aperture was provided correspondingly to a light emitting region sized 2 mm*2 mm in the central section of thelower electrode 14. Thereby, the interelectrode insulatingfilm 15 was formed. - Subsequently, a metal mask having an aperture was prepared. The metal mask was arranged in the proximity of the
substrate 11 in a state that the aperture of the metal mask was aligned with the light emitting region of thelower electrode 14. After that, the electronhole injection layer 16A to theelectron injection layer 16E were sequentially formed by vacuum evaporation method under vacuum atmosphere of 1*10−5 Pa or less. At this time, the optical distance L1 between the reflecting face P1 and the translucent reflecting face P2 was adjusted to satisfyMathematical formula 1 by adjusting the thickness of theelectron injection layer 16A to theelectron injection layer 16E to structure the resonator structure MC1. - For the electron
hole injection layer 16A, a film having a thickness of 20 nm composed of the hexaazatriphenylene derivative shown in Chemical formula 2 was formed. For the electronhole transport layer 16B, a film having a thickness of 25 nm composed of α-NPD was formed. The evaporation rate was 0.1 nm/sec. For thelight emitting layer 16C, a co-evaporated film having a thickness of 30 nm in which Alq3 host was doped with 1% coumarin 6 as a green light emitting material was formed. The evaporation rate was 0.2 nm/sec. For theelectron transport layer 16D, a film having a thickness of 175 nm composed of Alq3 was formed. The evaporation rate was 0.2 nm/sec. - After the
electron transport layer 16D was formed, a metal mask having an aperture corresponding to a pad section was prepared. The metal mask was arranged in the proximity of thesubstrate 11. As theelectron injection layer 16E, a film having a thickness of 0.3 nm composed of lithium fluoride was formed. Subsequently, theintermediate layer 18 and theupper electrode 17 were formed in the same manner as that of Examples 1-1 to 1-4. The film forming conditions were identical with those of Examples 1-1 to 1-4. -
TABLE 2 (characteristics: value in current density of 10 mA/cm2) Upper Intermedi- electrode Luminance ate layer (nm) Front face Drive ratio (nm) Mg—Ag efficiency voltage (45 deg/front Ca alloy (cd/A) (V) face) Example 2-1 2.0 2.5 12.4 7.60 0.85 Example 2-2 2.0 3.0 12.5 7.49 0.84 Example 2-3 2.0 4.0 13.0 7.32 0.80 Example 2-4 2.0 5.0 13.4 7.38 0.75 Comparative Not 5.0 Not — — example 2-1 applicable conducted Comparative Not 6.0 13.6 9.54 0.70 example 2-2 applicable Comparative Not 7.0 13.8 7.74 0.65 example 2-3 applicable Comparative Not 9.0 13.9 7.58 0.57 example 2-4 applicable - After that, as the
resonance adjustment layer 19, a film having a thickness of 40 nm composed of Alq3 was formed on theupper electrode 17 by vacuum evaporation method continuously after theupper electrode 17 was formed. Subsequently, as theprotective layer 30, a silicon nitride film having a thickness of 1 μm was formed by plasma CVD method. In the examples, theresonance adjustment layer 19 was used as a protective film to inhibit degeneration of theupper electrode 17, and the resonator structure MC2 was not structured. After that, the sealingsubstrate 50 made of glass was bonded by using theadhesive layer 40 made of an ultraviolet hardened resin. - An organic EL device was formed in the same manner as that of the foregoing Examples 2-1 to 2-4, except that the intermediate layer was not formed. At this time, the thickness of the upper electrode was varied as illustrated in Table 2.
- For the obtained organic EL devices of Examples 2-1 to 2-4 and Comparative examples 2-1 to 2-4, the initial characteristics were measured. The result is also illustrated in Table 2. In Table 2, the luminance ratio is a ratio of the luminance measured from 45 deg oblique direction with respect to the front face luminance.
- As evidenced by Table 2, in Examples 2-1 to 2-4 in which the thickness of the
upper electrode 17 was 2.5 nm or more, for all the front face efficiency, the drive voltage, and the luminance ratio, favorable results were obtained. In particular, the luminance ratio was 0.7 or more in Examples 2-1 to 2-4, and the view angle characteristics were improved. The reason thereof may be as follows. That is, since the thickness of theupper electrode 17 was decreased, the resonator effect of the resonator structure MC1 was moderated. Further, continuous lighting was made for examples 2-1 to 2-4. In the result, lighting was enabled without any trouble for all examples. - The thickness of the
upper electrode 17 in Examples 2-1 to 2-4 was optically obtained by reflectance measurement. As a result, it is not necessary to optically consider theintermediate layer 18 composed of calcium (Ca) as a metal film. In some cases, theintermediate layer 18 composed of calcium (Ca) is chemically changed by being contacted with theelectron transport layer 16D composed of Alq3 or theelectron injection layer 16E composed of LiF. In some cases, theintermediate layer 18 composed of calcium (Ca) is diffused and distributed in theupper electrode 17. - Meanwhile, in Comparative example 2-1 in which the thickness of the upper electrode was 5.0 nm, the resistance of the upper electrode was high and conduction was not enabled. Similarly, in the case where the thickness of the upper electrode was 5.0 or less, conduction was not enabled. In Comparative examples 2-2 and 2-3 in which the thickness of the upper electrode was 6.0 nm or 7.0 nm, the initial conduction was enabled. However, in this case, continuous lighting resulted in intense rise of a drive voltage, and deterioration was significant. Accordingly, it was found as follows. That is, it was only Comparative example 2-4 having the thickness of the upper electrode of 9.0 nm that both the initial driving and the continuous driving were stably enabled. In addition, in the case where the intermediate layer was not provided, the thickness of the metal film should be at least 9.0 nm. In Comparative examples 2-1 to 2-4, the luminance ratio was all 0.70 or less, and light emitting characteristics change according to the view angle was large.
- Further, in the case where comparison was made among Examples 2-2 to 2-4, there was a tendency that as the thickness of the
upper electrode 17 was decreased, the front face efficiency was lowered, while the luminance ratio was increased. The reason thereof may be as follows. That is, since the thickness of theupper electrode 17 was decreased, resonator effect of the resonator structure MC1 was weakened. - That is, it was found that in the case where the
intermediate layer 18 composed of calcium (Ca) was provided being contacted with theupper electrode 17 between theupper electrode 17 and theorganic layer 16, even if the thickness of theupper electrode 17 was decreased down to 6 nm or less, electric conductivity was retained, and the organic EL device was favorably driven for a long term. - An organic EL device was formed in the same manner as that of Examples 2-1 to 2-4, except that the upper electrode was composed of silver (Ag) instead of the Mg—Ag alloy, and the thickness thereof was 7 nm. At this time, the intermediate layer was formed in the same manner as that of Examples 2-1 to 2-4. For the obtained organic EL device, the reflective spectrum of the upper electrode was examined. The result was largely different from the assumed result of the simple silver (Ag). Further, when the organic EL device was tried to be lighted, conduction was not enabled. The reason thereof may be as follows. That is, in the silver (Ag) thin film, the film quality was not stable.
- An organic EL device was formed in the same manner as that of Examples 2-1 to 2-4, except that the upper electrode was composed of aluminum (Al) instead of the Mg—Ag alloy, and the thickness thereof was 7 nm. At this time, the intermediate layer was formed in the same manner as that of Examples 2-1 to 2-4. When the obtained organic EL device was tried to be lighted, conduction was not enabled.
- That is, it was found that in the case where the
upper electrode 17 was composed of the Mg—Ag alloy, the organic EL device was able to be favorably driven. - An organic EL device was formed in the same manner as that of Examples 2-1 to 2-4, except that the thickness of the
upper electrode 17 was 5.0 nm, and the thickness of theintermediate layer 18 was varied as illustrated in Table 3. Example 3-3 was identical with Example 2-4. For the obtained organic EL device, the initial characteristics were examined. The results thereof are also illustrated in Table 3. -
TABLE 3 Upper Intermedi- electrode Luminance ate layer (nm) Front face Drive ratio (nm) Mg—Ag efficiency voltage (45 deg/front Ca alloy (cd/A) (V) face) Example 3-1 0.5 5.0 13.9 7.75 0.83 Example 3-2 1.0 5.0 13.8 7.36 0.78 Example 3-3 2.0 5.0 13.4 7.38 0.75 Example 3-4 4.0 5.0 12.9 7.93 0.72 - As evidenced by Table 3, for all the front face efficiency, the drive voltage, and the luminance ratio, favorable results were obtained not depending on the thickness of the
intermediate layer 18. In particular, the luminance ratio was 0.7 or more in Examples 3-1 to 3-4, which was favorable. Further, luminance deterioration characteristics in driving at a certain current was examined. The result was almost equal to that of Comparative example 1-1 in which the thickness of the metal film composed of the Mg—Ag alloy was 10 nm. - That is, it was found that in the case where the thickness of the
intermediate layer 18 was from 0.5 nm to 4 nm both inclusive, the organic EL device was able to be favorably driven. - As the
resonance adjustment layer 19, a film composed of lithium fluoride having a thickness of 20 nm was formed. The thickness of the organic layer was adjusted so that the optical distance L2 between the reflecting face P1 and the translucent reflecting face P3 satisfied Mathematical formula 2. Accordingly, the resonator structure MC2 was structured. At this time, the phase shift Φ3 in the translucent reflecting face P3 in the resonator structure MC2 was different from the phase shift Φ2 in the translucent reflecting face P2 in the resonator structure MC1, and thus the optical distance L1 is different from the optical distance L2, but the order m was identical. The organic EL device was formed in the same manner as that of Example 2-4 as for the rest. - For the obtained organic EL device, the extraction intensity in the front face was examined. In the result, the extraction intensity was improved than that of Example 2-4 by 6%.
- That is, it was found that in the case where the resonator structure MC2 was structured by providing the
resonance adjustment layer 19 between theupper electrode 17 and theprotective layer 30, if resonator effect of the resonator structure MC1 is weakened by decreasing the thickness of theupper electrode 17, the resonator effect is able to be controlled. - An active matrix organic EL display unit having a pixel count of 960*540 was fabricated in the same manner as that of Example 2-4, except that the
intermediate layer 18 was composed of calcium (Ca) (thickness: 2 nm) and theupper electrode 17 was composed of an Mg—Ag alloy (thickness: 5 nm). - An active matrix organic EL display unit having a pixel count of 960*540 was fabricated. The intermediate layer was not provided, and the upper electrode was composed of an Mg—Ag alloy (thickness: 8 nm).
- For the obtained organic EL display units of Example 5 and Comparative example 5, the average number of non-light emitting defects per panel was examined. In Example 5, the result was one twenty-fifth ( 1/25) of Comparative example 5, which means the average number of non-light emitting defects was able to be significantly decreased. The reason thereof may be as follows. That is, in Example 5, the thickness of the
upper electrode 17 was small. Thus, in a manufacturing step, theupper electrode 17 intrudes into around a foreign matter on thelower electrode 14, and thereby a leak pass formation between thelower electrode 14 and theupper electrode 17 was inhibited. - That is, it was found that in the case where a display unit was structured by using the organic EL device in which the
intermediate layer 18 was provided being contacted with theupper electrode 17 between theupper electrode 17 and theorganic layer 16, the thickness of theupper electrode 17 was able to be decreased, and the number of non-light emitting defects was able to be decreased. - An organic EL device was formed in the same manner as that of Examples 2-1 to 2-4, except that the
intermediate layer 18 was composed of aluminum (Al) (thickness: 1 nm) and theupper electrode 17 was composed of an Mg—Ag alloy (thickness: 5 nm). For the obtained organic EL device, the initial characteristics were examined. The obtained result is illustrated in Table 4. -
TABLE 4 Upper Intermedi- electrode Luminance ate layer (nm) Front face Drive ratio (nm) Mg—Ag efficiency voltage (45 deg/front Al alloy (cd/A) (V) face) Example 6 1.0 5.0 12.9 7.35 0.76 - As evidenced by Table 4, in the case where aluminum (Al) was used instead of calcium (Ca) as the
intermediate layer 18, favorable light emission was obtained as well. Further, luminance deterioration characteristics in driving at a certain current were examined. The result was equal to that of Comparative example 2-4. - That is, it was found that in the case where the
intermediate layer 18 composed of aluminum (Al) was provided being contacted with theupper electrode 17 between theupper electrode 17 and theorganic layer 16, even if the thickness of theupper electrode 17 was decreased down to 6 nm or less, electric conductivity was retained, and the organic EL device was favorably driven for a long term. - In the foregoing second embodiment and the foregoing examples, the description has been given of the case that the
resonance adjustment layer 19 was provided between theupper electrode 17 and theprotective layer 30, and the interface between theresonance adjustment layer 19 and theprotective layer 30 was the translucent reflecting face P3. However, theresonance adjustment layer 19 may be provided in other position. For example, if theprotective layer 30 is not provided, theresonance adjustment layer 19 is able to be provided between theupper electrode 17 and theadhesive layer 40. Further, theresonance adjustment layer 19 may be provided between theprotective layer 30 and theadhesive layer 40. - Further, for example, the material, the thickness, the film-forming method, the film-forming conditions and the like of each layer are not limited to those described in the foregoing embodiments and the foregoing examples, but other material, other thickness, other film-forming method, and other film-forming conditions may be adopted.
- Further, for example, in the foregoing embodiments and the foregoing examples, the description has been given of the case that the
lower electrode 14, theorganic layer 16, and theupper electrode 17 are sequentially layered from thesubstrate 11 side over thesubstrate 11, and light is extracted from the sealingsubstrate 50 side. However, it is possible that the lamination order is reversed, that is, theupper electrode 17, theorganic layer 16, and thelower electrode 14 are sequentially layered from thesubstrate 11 side over thesubstrate 11, and light is extracted from thesubstrate 11 side. - In addition, for example, in the foregoing embodiments and the foregoing examples, the description has been given of the case that the
lower electrode 14 is an anode, and theupper electrode 17 is a cathode. However, it is possible that thelower electrode 14 is a cathode, and theupper electrode 17 is an anode. Further, it is possible that thelower electrode 14 is a cathode, theupper electrode 17 is an anode, and theupper electrode 17, theorganic layer 16, and thelower electrode 14 are sequentially layered from thesubstrate 11 side over thesubstrate 11, and light is extracted from thesubstrate 11 side. - Furthermore, in the foregoing embodiments and the foregoing examples, the description has been specifically given of the structure of the organic
light emitting devices - In addition, in the foregoing embodiments and the foregoing examples, the description has been given of the active matrix display unit. However, the embodiments are also able to be applied to a passive matrix display unit. Furthermore, the structure of the pixel drive circuit for driving the active matrix is not limited to the structure described in the foregoing embodiments and the foregoing examples. If necessary, a capacity device or a transistor may be added. In this case, according to the change of the pixel drive circuit, a necessary drive circuit may be added in addition to the foregoing signal
line drive circuit 120 and the foregoing scanningline drive circuit 130. - It should be understood that various changes and modifications to the presently preferred embodiments described herein will be apparent to those skilled in the art. Such changes and modifications can be made without departing from the spirit and scope of the present subject matter and without diminishing its intended advantages. It is therefore intended that such changes and modifications be covered by the appended claims.
Claims (20)
1. An organic electroluminescence device comprising:
a first electrode;
an organic layer formed on the first electrode and including a light-emitting layer;
an intermediate layer formed on the organic layer;
a second electrode formed on the intermediate layer; and
a protective layer formed on the second electrode,
wherein the intermediate layer is disposed between the second electrode and the organic layer,
wherein at least a portion of a metal element contained in the intermediate layer is diffused into the second electrode, and
wherein the intermediate layer includes at least one element selected from the group consisting of an alkali metal, an alkali earth metal, a lanthanide metal, aluminum, indium, tin, nickel, copper and zinc.
2. The organic electroluminescence device according to claim 1 , wherein the second electrode has a thickness of 6 nm or less.
3. The organic electroluminescence device according to claim 1 , wherein the intermediate layer directly contacts the organic layer and the second electrode.
4. The organic electroluminescence device according to claim 1 , wherein the intermediate layer directly contacts the organic layer.
5. The organic electroluminescence device according to claim 1 , wherein the intermediate layer directly contacts the second electrode.
6. The organic electroluminescence device according to claim 1 , wherein at least a portion of a metal element contained in the intermediate layer is diffused into the second electrode.
7. The organic electroluminescence device according to claim 1 , wherein the second electrode is made of a metal conductive film including an alloy comprising one or more of aluminum, magnesium, calcium and sodium.
8. The organic electroluminescence device according to claim 7 , wherein the alloy of the second electrode is a Mg—Ag alloy or an Al—Li alloy.
9. The organic electroluminescence device according to claim 1 , wherein a thickness of the intermediate layer ranges from 0.1 nm to 5 nm.
10. The organic electroluminescence device according to claim 1 , wherein the intermediate layer includes at least one lanthanide metal.
11. A display device comprising at least one organic electroluminescent device including:
a first electrode;
an organic layer formed on the first electrode and including a light-emitting layer;
an intermediate layer formed on the organic layer;
a second electrode formed on the intermediate layer; and
a protective layer formed on the second electrode,
wherein the intermediate layer is disposed between the second electrode and the organic layer,
wherein at least a portion of a metal element contained in the intermediate layer is diffused into the second electrode, and
wherein the intermediate layer includes at least one element selected from the group consisting of an alkali metal, an alkali earth metal, a lanthanide metal, aluminum, indium, tin, nickel, copper and zinc.
12. The display device according to claim 11 , wherein the second electrode has a thickness of 6 nm or less.
13. The display device according to claim 11 , wherein the intermediate layer directly contacts the organic layer and the second electrode.
14. The display device according to claim 11 , wherein the intermediate layer directly contacts the organic layer.
15. The display device according to claim 11 , wherein the intermediate layer directly contacts the second electrode.
16. The display device according to claim 11 , wherein at least a portion of a metal element contained in the intermediate layer is diffused into the second electrode.
17. The display device according to claim 11 , wherein the second electrode is made of a metal conductive film including an alloy comprising one or more of aluminum, magnesium, calcium and sodium.
18. The display device according to claim 17 , wherein the alloy of the second electrode is a Mg—Ag alloy or an Al—Li alloy.
19. The display device according to claim 11 , wherein a thickness of the intermediate layer ranges from 0.1 nm to 5 nm.
20. The display device according to claim 11 , wherein the intermediate layer includes at least one lanthanide metal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/527,167 US20150048355A1 (en) | 2009-06-23 | 2014-10-29 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009148888A JP5453952B2 (en) | 2009-06-23 | 2009-06-23 | ORGANIC ELECTROLUMINESCENCE ELEMENT AND ITS MANUFACTURING METHOD, DISPLAY DEVICE AND ITS MANUFACTURING METHOD |
JP2009-148888 | 2009-06-23 | ||
US12/815,017 US8415658B2 (en) | 2009-06-23 | 2010-06-14 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
US13/804,162 US8916861B2 (en) | 2009-06-23 | 2013-03-14 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
US14/527,167 US20150048355A1 (en) | 2009-06-23 | 2014-10-29 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/804,162 Continuation US8916861B2 (en) | 2009-06-23 | 2013-03-14 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20150048355A1 true US20150048355A1 (en) | 2015-02-19 |
Family
ID=43353490
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/815,017 Expired - Fee Related US8415658B2 (en) | 2009-06-23 | 2010-06-14 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
US13/804,162 Expired - Fee Related US8916861B2 (en) | 2009-06-23 | 2013-03-14 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
US14/527,167 Abandoned US20150048355A1 (en) | 2009-06-23 | 2014-10-29 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/815,017 Expired - Fee Related US8415658B2 (en) | 2009-06-23 | 2010-06-14 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
US13/804,162 Expired - Fee Related US8916861B2 (en) | 2009-06-23 | 2013-03-14 | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device |
Country Status (5)
Country | Link |
---|---|
US (3) | US8415658B2 (en) |
JP (1) | JP5453952B2 (en) |
KR (1) | KR20100138773A (en) |
CN (1) | CN101931057B (en) |
TW (1) | TWI448195B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10062865B2 (en) * | 2016-07-13 | 2018-08-28 | Samsung Display Co., Ltd. | Organic light-emitting display apparatus |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5453952B2 (en) * | 2009-06-23 | 2014-03-26 | ソニー株式会社 | ORGANIC ELECTROLUMINESCENCE ELEMENT AND ITS MANUFACTURING METHOD, DISPLAY DEVICE AND ITS MANUFACTURING METHOD |
JP2011065943A (en) * | 2009-09-18 | 2011-03-31 | Fujifilm Corp | Organic electroluminescent element |
JP5453303B2 (en) * | 2010-02-22 | 2014-03-26 | パナソニック株式会社 | Light emitting device and manufacturing method thereof |
JP2012164600A (en) * | 2011-02-09 | 2012-08-30 | Seiko Epson Corp | Luminous element, and method for manufacturing luminous element |
KR20120106192A (en) * | 2011-03-18 | 2012-09-26 | 삼성디스플레이 주식회사 | Organic light emitting diode device and method of manufacturing the same |
JP6119605B2 (en) * | 2011-08-22 | 2017-04-26 | コニカミノルタ株式会社 | ORGANIC ELECTROLUMINESCENT ELEMENT AND LIGHTING DEVICE |
KR101883848B1 (en) * | 2011-12-28 | 2018-08-02 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and the method for manufacturing the same |
KR20130108026A (en) * | 2012-03-23 | 2013-10-02 | 주식회사 엘지화학 | Organic light emitting device |
WO2013176521A1 (en) * | 2012-05-25 | 2013-11-28 | 주식회사 엘지화학 | Organic light-emitting device and manufacturing method thereof |
JP2013251226A (en) * | 2012-06-04 | 2013-12-12 | Panasonic Corp | Manufacturing method of display panel |
KR20140033867A (en) * | 2012-09-11 | 2014-03-19 | 엘지디스플레이 주식회사 | Organic light emitting display panel |
KR101995920B1 (en) * | 2013-04-17 | 2019-10-02 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
KR20150014312A (en) * | 2013-07-29 | 2015-02-06 | 삼성디스플레이 주식회사 | Method for fabricating sputtering target, sputtering target using the method, and method for manufacturing organic light emitting display apparatus using the sputtering target |
KR102094391B1 (en) * | 2013-09-09 | 2020-03-30 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
WO2016009958A1 (en) * | 2014-07-18 | 2016-01-21 | コニカミノルタ株式会社 | Organic electroluminescent element |
JP2016045979A (en) * | 2014-08-19 | 2016-04-04 | ソニー株式会社 | Display device and electronic apparatus |
CN104393023B (en) * | 2014-12-01 | 2018-01-26 | 京东方科技集团股份有限公司 | A kind of array base palte and preparation method thereof, display device |
JP6439194B2 (en) * | 2014-12-03 | 2018-12-19 | 株式会社Joled | Organic light emitting device |
KR102377366B1 (en) * | 2014-12-12 | 2022-03-21 | 엘지디스플레이 주식회사 | Organic light emitting display device and method for manufacturing the same |
JP6550967B2 (en) * | 2015-06-30 | 2019-07-31 | セイコーエプソン株式会社 | ORGANIC EL DEVICE, METHOD FOR MANUFACTURING ORGANIC EL DEVICE, AND ELECTRONIC DEVICE |
KR102469294B1 (en) * | 2016-02-01 | 2022-11-23 | 삼성디스플레이 주식회사 | Organic light emitting display device |
CN107546251A (en) * | 2017-08-21 | 2018-01-05 | 深圳市华星光电半导体显示技术有限公司 | A kind of OLED display panel and preparation method thereof |
US10985323B2 (en) * | 2017-10-19 | 2021-04-20 | Canon Kabushiki Kaisha | Light-emitting device including a plurality of organic electroluminescent elements |
KR102448066B1 (en) | 2017-12-22 | 2022-09-28 | 엘지디스플레이 주식회사 | Flexible Display Device |
TWI688094B (en) * | 2019-04-17 | 2020-03-11 | 友達光電股份有限公司 | Light emitting device |
KR20210005364A (en) * | 2019-07-03 | 2021-01-14 | 삼성디스플레이 주식회사 | Organic light-emitting diode and light-emitting display apparatus comprising the same |
CN112542489B (en) * | 2019-09-20 | 2024-10-18 | 创王光电股份有限公司 | Light-emitting element |
KR20220131245A (en) * | 2019-12-24 | 2022-09-27 | 오티아이 루미오닉스 인크. | Light emitting device including capping layer and manufacturing method thereof |
CN116648997A (en) * | 2020-12-25 | 2023-08-25 | 株式会社半导体能源研究所 | Light emitting device, light emitting apparatus, electronic device, and lighting apparatus |
US20240147745A1 (en) * | 2021-02-12 | 2024-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Light-Emitting Apparatus and Electronic Device |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4919521A (en) * | 1987-06-03 | 1990-04-24 | Nippon Sheet Glass Co., Ltd. | Electromagnetic device |
JP3560375B2 (en) | 1994-12-27 | 2004-09-02 | 出光興産株式会社 | Organic electroluminescent device |
GB9609282D0 (en) * | 1996-05-03 | 1996-07-10 | Cambridge Display Tech Ltd | Protective thin oxide layer |
US5739545A (en) * | 1997-02-04 | 1998-04-14 | International Business Machines Corporation | Organic light emitting diodes having transparent cathode structures |
EP0966050A3 (en) * | 1998-06-18 | 2004-11-17 | Osram Opto Semiconductors GmbH & Co. OHG | Organic light emitting diode |
JP3824798B2 (en) * | 1999-01-21 | 2006-09-20 | Tdk株式会社 | Organic EL device |
CA2377077A1 (en) * | 1999-07-19 | 2001-01-25 | Uniax Corporation | Long-lifetime polymer light-emitting devices with improved luminous efficiency and radiance |
GB2353400B (en) * | 1999-08-20 | 2004-01-14 | Cambridge Display Tech Ltd | Mutiple-wavelength light emitting device and electronic apparatus |
JP2001265251A (en) * | 2000-03-17 | 2001-09-28 | Minolta Co Ltd | Display device and laminated display device |
JP2003123987A (en) * | 2001-10-11 | 2003-04-25 | Toyota Central Res & Dev Lab Inc | Optical resonator |
KR100567179B1 (en) * | 2002-09-30 | 2006-04-03 | 가부시키가이샤 도요다 지도숏키 | Light-emitting device, display unit and lighting unit |
JP3703028B2 (en) * | 2002-10-04 | 2005-10-05 | ソニー株式会社 | Display element and display device using the same |
JP3944906B2 (en) | 2002-11-11 | 2007-07-18 | ソニー株式会社 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE USING THE SAME |
JP2005011535A (en) * | 2003-04-25 | 2005-01-13 | Victor Co Of Japan Ltd | Manufacturing method of organic electroluminescent element and organic electroluminescent element |
US6917159B2 (en) * | 2003-08-14 | 2005-07-12 | Eastman Kodak Company | Microcavity OLED device |
KR101157579B1 (en) * | 2003-09-19 | 2012-06-19 | 소니 가부시키가이샤 | Organic light emitting device, and manufacturing method thereof, display device |
JP4403399B2 (en) * | 2003-09-19 | 2010-01-27 | ソニー株式会社 | Display device and manufacturing method of display device |
JP2006253015A (en) * | 2005-03-11 | 2006-09-21 | Idemitsu Kosan Co Ltd | Organic electroluminescence color light-emitting device |
US7245065B2 (en) * | 2005-03-31 | 2007-07-17 | Eastman Kodak Company | Reducing angular dependency in microcavity color OLEDs |
JP2006318910A (en) * | 2005-05-11 | 2006-11-24 | Lg Electronics Inc | Electroluminescence display and its manufacturing method, and electroluminescence device and its manufacturing method |
JP4699098B2 (en) * | 2005-06-09 | 2011-06-08 | ローム株式会社 | ORGANIC EL ELEMENT AND ORGANIC EL DISPLAY DEVICE USING THE SAME |
JP2007048571A (en) * | 2005-08-09 | 2007-02-22 | Seiko Epson Corp | Manufacturing method of organic electroluminescence device, and electronic equipment |
KR20070069314A (en) * | 2005-12-28 | 2007-07-03 | 전자부품연구원 | Oled |
KR100753569B1 (en) * | 2005-12-30 | 2007-08-30 | 엘지.필립스 엘시디 주식회사 | Fabricating method of organic electro luminescence display device |
JP5178088B2 (en) * | 2006-09-07 | 2013-04-10 | キヤノン株式会社 | Organic light emitting device |
JP4254856B2 (en) * | 2006-12-22 | 2009-04-15 | ソニー株式会社 | Organic electroluminescence device and display device |
JP5453952B2 (en) * | 2009-06-23 | 2014-03-26 | ソニー株式会社 | ORGANIC ELECTROLUMINESCENCE ELEMENT AND ITS MANUFACTURING METHOD, DISPLAY DEVICE AND ITS MANUFACTURING METHOD |
-
2009
- 2009-06-23 JP JP2009148888A patent/JP5453952B2/en not_active Expired - Fee Related
-
2010
- 2010-05-26 TW TW099116856A patent/TWI448195B/en not_active IP Right Cessation
- 2010-06-13 CN CN201010205290.5A patent/CN101931057B/en not_active Expired - Fee Related
- 2010-06-14 US US12/815,017 patent/US8415658B2/en not_active Expired - Fee Related
- 2010-06-18 KR KR1020100058137A patent/KR20100138773A/en not_active Application Discontinuation
-
2013
- 2013-03-14 US US13/804,162 patent/US8916861B2/en not_active Expired - Fee Related
-
2014
- 2014-10-29 US US14/527,167 patent/US20150048355A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10062865B2 (en) * | 2016-07-13 | 2018-08-28 | Samsung Display Co., Ltd. | Organic light-emitting display apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP2011008958A (en) | 2011-01-13 |
TW201108855A (en) | 2011-03-01 |
US20100320481A1 (en) | 2010-12-23 |
US8415658B2 (en) | 2013-04-09 |
CN101931057A (en) | 2010-12-29 |
US20130200347A1 (en) | 2013-08-08 |
KR20100138773A (en) | 2010-12-31 |
CN101931057B (en) | 2014-08-06 |
US8916861B2 (en) | 2014-12-23 |
TWI448195B (en) | 2014-08-01 |
JP5453952B2 (en) | 2014-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8916861B2 (en) | Organic electroluminescence device, display unit including the same, and method of manufacturing an organic electroluminescence device | |
KR101936345B1 (en) | Display device | |
US9190460B2 (en) | Organic light emitting device and display unit including the same | |
US8368617B2 (en) | Display device and display unit | |
JP4655102B2 (en) | Display element, manufacturing method thereof, and display device | |
US9985250B2 (en) | Organic light emitting device and display unit | |
US8164253B2 (en) | Optically-functional film and method of manufacturing the same, display and method of manufacturing the same | |
JP2014056666A (en) | Display device and manufacturing method thereof, and electronic apparatus | |
JP2010062067A (en) | Method of manufacturing display device, and display device | |
JP5218489B2 (en) | Display element and manufacturing method thereof, display device and manufacturing method thereof | |
JP2012156136A (en) | Organic light emitting display device | |
JP2011081998A (en) | Method for manufacturing organic el element, organic el element, and display device for the element | |
JP2008293962A (en) | Method of manufacturing display device, and display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SONY CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KASHIWABARA, MITSUHIRO;REEL/FRAME:034073/0772 Effective date: 20100330 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |