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US20140002684A1 - Solid-state image sensing device and image sensing system - Google Patents

Solid-state image sensing device and image sensing system Download PDF

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Publication number
US20140002684A1
US20140002684A1 US14/016,857 US201314016857A US2014002684A1 US 20140002684 A1 US20140002684 A1 US 20140002684A1 US 201314016857 A US201314016857 A US 201314016857A US 2014002684 A1 US2014002684 A1 US 2014002684A1
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United States
Prior art keywords
signal
image capturing
capturing mode
readout circuit
image sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US14/016,857
Inventor
Akira Okita
Hiroki Hiyama
Masaru Fujimura
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to US14/016,857 priority Critical patent/US20140002684A1/en
Publication of US20140002684A1 publication Critical patent/US20140002684A1/en
Abandoned legal-status Critical Current

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    • H04N5/23241
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/667Camera operation mode switching, e.g. between still and video, sport and normal or high- and low-resolution modes
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/42Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by switching between different modes of operation using different resolutions or aspect ratios, e.g. switching between interlaced and non-interlaced mode
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/709Circuitry for control of the power supply
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75Circuitry for providing, modifying or processing image signals from the pixel array
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters

Definitions

  • the present invention relates to a solid-state image sensing device and an image sensing system and, more particularly, to a solid-state image sensing device which can capture a moving image and a still image and an image sensing system having the same.
  • a digital camera using a solid-state image sensing device which can capture both a still image and a moving image has become popular nowadays.
  • To meet a demand for still image capturing with high image quality/high resolution information on pixels in a number larger than that of pixels read out in moving image capturing is necessary.
  • moving image capturing requires pixels fewer than those in still image capturing, a specific number of frames (e.g., 30 frames per second according to the NTSC standard) need to be recorded in one second.
  • moving image capturing generally consumes a relatively large power.
  • the number of pixels to be read out is specified by the readout standard in moving image readout (moving image capturing), so the thinning ratio cannot deviate from the readout standard. If the clock rate is dropped in moving image readout, it is necessary to provide an oscillator for generating a still image readout clock and an oscillator for generating a moving image readout clock. It is also necessary to provide a complicated circuit to prevent any trouble upon frequency switching.
  • the present invention has been made in consideration of the above-described problems, and has as its object to suppress the power consumption in the moving image capturing mode without changing, e.g., the clock rate between the moving image capturing mode and the still image capturing mode.
  • a solid-state image sensing device which can capture a moving image and a still image, comprising a first readout circuit configured to read out a signal from a pixel array including a plurality of pixels, a signal holding unit configured to hold the signal read out from the first readout circuit, a second readout circuit configured to read out the signal held in the signal holding unit, and a current control unit configured to control an electric current flowing through at least part of the first readout circuit while the first readout circuit reads out the signal, wherein the current control unit controls an electric current flowing through the at least part of the first readout circuit in a moving image capturing mode to be smaller than an electric current flowing through the at least part of the first readout circuit in a still image capturing mode.
  • a solid-state image sensing device which can capture a moving image and a still image, comprising a pixel array including a plurality of pixels, a vertical scanning circuit configured to select a row of the pixel array, a horizontal scanning circuit configured to select a column of the pixel array, a plurality of first amplification circuits configured to amplify signals from the pixel array, a plurality of constant current sources configured to determine electric currents flowing through the plurality of first amplification circuits, a plurality of signal holding units configured to hold the signals from the plurality of first amplification circuits, a plurality of switches configured to transfer the signals, which are held in the plurality of signal holding units, in accordance with a signal sent from the horizontal scanning circuit, a second amplification circuit configured to amplify the signals transferred by the plurality of switches and output the amplified signals, and a current control unit configured to control the electric currents flowing through the plurality of constant current sources, wherein the current
  • a solid-state image sensing device which can capture a moving image and a still image, comprising a pixel array including a plurality of pixels, a vertical scanning circuit configured to select a row of the pixel array, a horizontal scanning circuit configured to select a column of the pixel array, a plurality of column signal lines to which signals from the pixel array are output, a plurality of constant current sources each of which are connected between the ground and a corresponding one of the plurality of column signal lines, and a current control unit configured to control electric currents flowing through the plurality of constant current sources, wherein the current control unit controls an electric current flowing through each of the constant current sources in a moving image capturing mode to be smaller than an electric current flowing through each of the constant current sources in a still image capturing mode.
  • a solid-state image sensing device which can capture a moving image and a still image, comprising a pixel array including a plurality of pixels, a vertical scanning circuit configured to select a row of the pixel array, a horizontal scanning circuit configured to select a column of the pixel array, a plurality of column signal lines to which signals from the pixel array are output, a plurality of first amplification units configured to amplify the signals output from the pixel array to the plurality of column signal lines, a plurality of signal holding units configured to hold the signals from the plurality of first amplification units, a plurality of switches configured to transfer the signals, which are held in the plurality of signal holding units, in accordance with a signal sent from the horizontal scanning circuit, a second amplification unit configured to amplify the signals transferred by the plurality of switches and output the amplified signals, a plurality of bypass routes configured to bypass the plurality of first amplification units between the plurality of column signal lines
  • an image sensing system comprising a solid-state image sensing device as defined above, and a signal processing unit configured to process a signal output from the solid-state image sensing device.
  • the present invention it is possible to suppress the power consumption in the moving image capturing mode without changing, e.g., the clock rate between the moving image capturing mode and the still image capturing mode.
  • FIG. 1 is a block diagram showing the schematic arrangement of a solid-state image sensing device according to the first embodiment of the present invention
  • FIG. 2 is a circuit diagram illustrating an example of the detailed arrangement of the solid-state image sensing device shown in FIG. 1 ;
  • FIG. 3 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the first embodiment of the present invention
  • FIG. 4 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the second embodiment of the present invention.
  • FIG. 5 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the second embodiment of the present invention.
  • FIG. 6 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the third embodiment of the present invention.
  • FIG. 7 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the third embodiment of the present invention.
  • FIG. 8 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the fourth embodiment of the present invention.
  • FIG. 9 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the fourth embodiment of the present invention.
  • FIG. 10 is a block diagram showing the schematic configuration of an image sensing system according to a preferred embodiment of the present invention.
  • a solid-state image sensing device can capture a moving image and a still image.
  • This solid-state image sensing device can be suitably mounted in a digital camera which captures an object image as an electrical signal, and thereby records the image on a memory medium, displays the image on a display device (e.g., a liquid crystal display device), or transmits the image to other devices.
  • a display device e.g., a liquid crystal display device
  • FIG. 1 is a block diagram showing the schematic arrangement of a solid-state image sensing device according to the first embodiment of the present invention.
  • the solid-state image sensing device comprises a pixel array A, vertical scanning circuit 104 , first readout circuits (column readout circuits) 120 , signal holding units 107 , switches 109 , horizontal scanning circuit 108 , second readout circuit 130 , and current control unit 112 .
  • the pixel array A is formed by two-dimensionally arraying a plurality of pixel units 101 into a plurality of rows and a plurality of columns.
  • a pixel array A is formed by 3 ⁇ 3 pixel units 101 in FIG. 1 .
  • the arrangement of the pixel array A is not particularly limited to this.
  • the first readout circuit 120 reads out a signal from the pixel array A, and can include, e.g., a column signal line 102 , first amplification unit 106 , and constant current source 105 .
  • the signal holding unit 107 holds the signal read out by the first readout circuit 120 .
  • the second readout circuit 130 reads out the signal held in the signal holding unit 107 via the switch 109 , and can include, e.g., a second amplification unit 110 .
  • the first amplification unit 106 and signal holding unit 107 can be set for every other column or every plurality of columns.
  • the vertical scanning circuit 104 typically includes a shift register and selects a row in the pixel array A.
  • the horizontal scanning circuit 108 typically includes a shift register and selects a column in the pixel array A. In this example, a column in the pixel array A can be selected by selectively activating the switch 109 so that the signal is transferred from the signal holding unit 107 to the second readout circuit 130 .
  • the current control unit 112 controls an electric current flowing through at least part of the first readout circuit 120 while the first readout circuit 120 reads out the signal.
  • the current control unit 112 controls an electric current flowing through the at least part of the first readout circuit 120 in the moving image capturing mode to be smaller than that flowing through the at least part of the first readout circuit 120 in the still image capturing mode.
  • the second readout circuit 130 (second amplification unit 110 ) outputs an image signal at the same clock rate in moving image capturing and still image capturing.
  • FIG. 2 is a circuit diagram showing an example of the detailed arrangement of the pixel unit 101 , first amplification unit 106 (first readout circuit 120 ), signal holding unit 107 , and current control unit 112 .
  • FIG. 3 is a timing chart illustrating an example of the operation of the solid-state image sensing device shown in FIGS. 1 and 2 .
  • the pixel unit 101 can include, e.g., a photodiode (photoelectric conversion unit) 201 , transfer transistor 202 , amplification transistor (source follower transistor) 203 , reset transistor 204 , and selection transistor 205 .
  • An electric charge generated by photoelectric conversion in the photodiode 201 is transferred to a floating diffusion (to be referred to as an FD hereinafter) 217 by the transfer transistor 202 .
  • the potential of the FD 217 is determined in accordance with this electric charge.
  • the FD 217 is a node common to the gate of the amplification transistor 203 .
  • a signal based on the electric charge transferred to the FD 217 is amplified by the amplification transistor 203 and output to the column signal line 102 via the selection transistor 205 .
  • the column signal line 102 is connected to the constant current source 105 to form a source follower circuit.
  • the first amplification unit 106 can include, e.g., a clamp capacitance 206 , inverting amplifier 207 , feedback capacitance 208 , and clamp switch 209 .
  • the column signal line 102 is connected to one end of the clamp capacitance 206 of the first amplification unit 106 .
  • the feedback capacitance 208 and clamp switch 209 are connected in parallel between the input end and output end of the inverting amplifier 207 .
  • the output end of the first amplification unit 106 (first readout circuit 120 ) is connected to the signal holding unit 107 .
  • the signal holding unit 107 can include, e.g., switches 211 and 212 and holding capacitances 213 and 214 .
  • the holding capacitances 213 and 214 preferably have the same capacitance value.
  • the output end of the first amplification unit 106 (first readout circuit 120 ) is connected to the holding capacitances 213 and 214 via the switches 211 and 212 , respectively.
  • Signals held in the holding capacitances 213 and 214 are transferred to the second amplification unit 110 (second readout circuit 130 ) by turning on column selection switches 215 and 216 in accordance with a pulse PH sent from the horizontal scanning circuit 108 .
  • the holding capacitances 213 and 214 respectively hold an N output and an S output.
  • the second amplification unit 110 amplifies the difference between the N output and the S output. This operation is called the CDS (Correlated Double Sampling) operation.
  • a selection signal PSEL input to the gate of the selection transistor 205 changes to high level.
  • the amplification transistor 203 is thus activated.
  • the FD 217 is reset by a reset voltage SVDD.
  • a clamp pulse PC0R changes to high level.
  • the inverting amplifier 207 then enters a unity gain buffer state and outputs a voltage VC0R.
  • a reset signal PRES input to the gate of the reset transistor 204 changes to low level.
  • the potential of the FD 217 is then fixed to black signal level, and a reference voltage VN of the column signal line 102 is determined.
  • the clamp pulse PC0R changes to low level and the reference voltage VN of the column signal line 102 is clamped.
  • a pulse PTN changes to high level.
  • the switch 211 of the signal holding unit 107 is then turned on to start writing the sum of the voltage VC0R and the offset voltage of the inverting amplifier 207 into the holding capacitance 213 .
  • this write is ended.
  • a transfer pulse PTX input to the gate of the transfer transistor 202 of the pixel unit 101 changes to high level.
  • the signal charge of the photodiode 201 is then transferred to the FD 217 .
  • a pulse PTS changes to high level.
  • the switch 212 of the signal holding unit 107 is then turned on to write a signal into the holding capacitance 214 .
  • the potential of the column signal line 102 changes from VN to VS as the transfer pulse PTX is activated to high level. If the signal charge is an electron, VS ⁇ VN.
  • the reset signal PRES changes to high level.
  • the reset transistor 204 of the pixel unit 101 is then turned on to reset the FD 217 .
  • the selection signal PSEL changes to low level to turn off the selection transistor 205 . With this operation, row selection is canceled.
  • the column selection switches 215 and 216 are turned on in accordance with a pulse PH sent from the horizontal scanning circuit 108 .
  • the second amplification unit 110 calculates the difference between an N output and an S output, and outputs an image signal.
  • this operation is ended and signals in the columns are sequentially output in synchronism with the pulse PH.
  • the current control unit 112 controls an electric current flowing through at least part of the first readout circuit 120 .
  • the clock rate of an image signal output from the second amplification unit 110 in synchronism with a pulse PH remains the same between the moving image capturing mode and the still image capturing mode.
  • a quartz oscillator needs to be switched between the moving image capturing mode and the still image capturing mode.
  • this method requires a complicated frequency switching operation, resulting in an increase in the number of components.
  • the current control unit 112 controls an electric current flowing through at least part (the first amplification unit 106 in this embodiment) of the first readout circuit 120 in the moving image capturing mode to be smaller than that flowing through the at least part of the first readout circuit 120 in the still image capturing mode.
  • I1 be the magnitude of an electric current flowing through the first amplification unit 106 in the still image capturing mode
  • I2 be the magnitude of an electric current flowing through the first amplification unit 106 in the moving image capturing mode
  • the current control unit 112 controls the gate voltage of a constant current transistor 218 of the first amplification unit 106 to control an electric current flowing through the constant current transistor 218 , i.e., an electric current flowing through the first amplification unit 106 .
  • the current control unit 112 can include, e.g., a transistor 112 a having its gate and drain connected to each other, and the gate of the transistor 112 a can be connected to that of the constant current transistor 218 . With this arrangement, the constant current transistor 218 is biased so that an electric current with the same magnitude as that of an electric current flowing through the transistor 112 a flows through the constant current transistor 218 . Such an arrangement is called a current mirror circuit.
  • the value I1 is determined such that signal voltages can be sufficiently written into the holding capacitances 213 and 214 within the period between time t9 and t10.
  • the required write times are determined in accordance with, e.g., the capacitance values of the holding capacitances 213 and 214 , the ON resistances of the switches 211 and 212 , and the output impedance and inverting gain of the inverting amplifier 207 .
  • the driving capacity of the inverting amplifier 207 is basically changed by changing a tail current flowing through the constant current transistor 218 of the inverting amplifier 207 . This makes it possible to change the times taken to write signal voltages into the holding capacitances 213 and 214 .
  • the magnitude I1 of an electric current flowing through the first amplification unit 106 is determined such that a level corresponding to, e.g., 5 ⁇ is written. This makes it possible to sufficiently write signal voltages into the holding capacitances 213 and 214 , thus obtaining a high-quality output image.
  • the output amplitude of the first amplification unit 106 decreases slightly, and sufficient voltages cannot be written into the holding capacitances 213 and 214 as an electric current flowing through the first amplification unit 106 decreases.
  • Signal waveforms VN and VS in FIG. 3 schematically show these states.
  • the still image capturing mode is indicated by solid lines
  • the moving image capturing mode is indicated by dotted lines.
  • the image quality improves.
  • Setting the reference currents to satisfy I2 ⁇ I1 greatly reduces the current consumption per first amplification unit 106 (e.g., per column).
  • a digital camera which uses a total of more than 10,000,000 pixels will be taken as an example. If the number of columns exceeds 4,000 and the current consumption is reduced by 5 ⁇ A per column, the overall current consumption can be decreased by 20 mA. Assuming that the power supply voltage is 5V, the overall power consumption can be decreased by 100 mW. Heat generated by a power consumption of this amount changes the image quality significantly.
  • the moving image capturing mode instantaneously switches to the still image capturing mode. For this reason, a still image is captured before heat generated in the moving image capturing mode dies down. This may noticeably deteriorate the quality of the still image as random noise due to the heat generated in the moving image capturing mode has a large adverse influence on still image capturing in the still image capturing mode. Suppressing the current consumption in the moving image capturing mode can therefore improve the quality of a still image.
  • FIG. 4 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the second embodiment of the present invention. Details which are not particularly referred to in the arrangement according to the second embodiment can be the same as in the first embodiment.
  • the second embodiment is different from the first embodiment in that a current control unit 112 controls a constant current source 105 connected to a column signal line 102 .
  • Letting 13 be the magnitude of an electric current flowing through the constant current source 105 in the still image capturing mode
  • 14 be the magnitude of an electric current flowing through the constant current source 105 in the moving image capturing mode, I3>I4.
  • FIG. 5 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the second embodiment.
  • the basic operation of the solid-state image sensing device according to the second embodiment is the same as that according to the first embodiment shown in FIG. 3 .
  • the timing charts shown in FIGS. 5 and 3 are different in a change in voltage VN.
  • the write speeds of both voltages VN and VS in the moving image capturing mode are lower than those in the still image capturing mode.
  • an electric current flowing through the column signal line 102 in the moving image capturing mode is smaller than that in the still image capturing mode.
  • a first amplification unit 106 determines the speed at which a voltage is written into a holding capacitance 213 . This prevents a drop in write speed.
  • the write speed of a voltage VS in the moving image capturing mode drops, like the first embodiment, as can be seen from a change in voltage VS indicated by a dotted line in FIG. 5 . This is because the charge/discharge speed of a clamp capacitance (C0) 206 drops.
  • C0 clamp capacitance
  • the current control unit 112 may control both electric currents flowing through the first amplification unit 106 and constant current source 105 in the moving image capturing mode to be smaller than those in the still image capturing mode by combining the first and second embodiments.
  • FIG. 6 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the third embodiment of the present invention. Details which are not particularly referred to in the arrangement according to the third embodiment can be the same as in the first embodiment.
  • a bypass route 610 for bypassing a first amplification unit 106 is additionally connected between a column signal line 102 and a signal holding unit 107 , and a transistor 602 is additionally inserted in an inverting amplifier 207 .
  • a current control unit 603 is provided in place of the current control unit 112 .
  • the current control unit 603 deactivates the first amplification unit 106 and bypasses the first amplification unit 106 via the bypass route 610 .
  • the current control unit 603 activates the first amplification unit 106 and shuts off the bypass route 610 .
  • the first amplification unit 106 is activated by activating the transistor 602 and deactivated by deactivating the transistor 602 under the control of the current control unit 603 .
  • the bypass route 610 is activated by activating a transistor 601 inserted in the bypass route 610 , and then the first amplification unit 106 is bypassed via the bypass route 610 .
  • the bypass route 610 is shut off by deactivating the transistor 601 . This operation is controlled by the current control unit 603 .
  • FIG. 7 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the third embodiment. Referring to FIG. 7 , the operation in the still image capturing mode is indicated by solid lines, and the operation in the moving image capturing mode is indicated by broken lines.
  • Mode signals PMS and /PMS are generated by the current control unit 603 .
  • the mode signal /PMS is obtained by inverting the mode signal PMS.
  • the mode signal PMS is set at low level in the still image capturing mode, while it is set at high level in the moving image capturing mode.
  • the transistor 601 which controls the bypass route 610 is OFF, while the transistor 602 which controls the activation/deactivation of the inverting amplifier 207 is ON. Therefore, in the still image capturing mode, the solid-state image sensing device shown in FIG. 6 operates in substantially the same manner as in the solid-state image sensing device shown in FIG. 2 .
  • the transistor 601 which controls the bypass route 610 is ON, while the transistor 602 which controls the activation/deactivation of the inverting amplifier 207 is OFF. Therefore, in the moving image capturing mode, no electric current flows through the inverting amplifier 207 so that the current consumption can be greatly reduced.
  • the column signal line 102 is directly connected to the signal holding unit 107 .
  • a pulse PC0R is not used. Also in the moving image capturing mode, signals written into holding capacitances 213 and 214 are not inverted and amplified by the inverting amplifier 207 .
  • a selection signal PSEL input to the gate of a selection transistor 205 changes to high level.
  • An amplification transistor 203 is thus activated.
  • an FD 217 is reset by a reset voltage SVDD.
  • a reset signal PRES input to the gate of a reset transistor 204 changes to low level.
  • the potential of the FD 217 is then fixed to black signal level, and a reference voltage VN of the column signal line 102 is determined.
  • a pulse PTS changes to high level.
  • a switch 212 of the signal holding unit 107 is then turned on to start writing a reference signal VN into the holding capacitance 214 .
  • this write is ended.
  • a reference signal VN N output
  • a signal VS S output
  • a transfer pulse PTX input to the gate of a transfer transistor 202 in a pixel unit 101 changes to high level.
  • the signal charge of a photodiode 201 is then transferred to the FD 217 .
  • a pulse PTN changes to high level.
  • the switch 211 of the signal holding unit 107 is then turned on to start writing a signal VS into the holding capacitance 213 .
  • the potential of the column signal line 102 changes from VN to VS as the transfer pulse PTX is activated to high level. If the signal charge is an electron, VS ⁇ VN. The voltage value VS is directly written into the holding capacitance 213 .
  • this write is ended.
  • the reset signal PRES changes to high level.
  • the reset transistor 204 of the pixel unit 101 is then turned on to reset and the FD 217 .
  • the selection signal PSEL changes to low level to turn off the selection transistor 205 . With this operation, row selection is canceled.
  • column selection switches 215 and 216 are turned on in accordance with a pulse PH sent from a horizontal scanning circuit 108 .
  • a second amplification unit 110 calculates the difference between an N output and an S output, and outputs an image signal.
  • this operation is ended and signals in the columns are sequentially output in synchronism with the pulse PH.
  • the first amplification unit is not used in the moving image capturing mode, so the gain is relatively low.
  • the second amplification unit 110 may multiply the image signal by a gain as needed.
  • the third embodiment it is possible to greatly reduce the current consumption of the first amplification unit in the moving image capturing mode.
  • the arrangement according to the third embodiment can be implemented by providing two switches for each first readout circuit without largely changing the circuitry.
  • the arrangement according to the third embodiment can be used together with that according to the second embodiment.
  • FIG. 8 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the fourth embodiment of the present invention.
  • FIG. 9 is a timing chart illustrating an example of the operation of the solid-state image sensing device.
  • the fourth embodiment has an arrangement in which the first amplification unit 106 is omitted from the solid-state image sensing device according to the second embodiment shown in FIG. 4 .
  • the current consumption in the moving image capturing mode it is possible to suppress the current consumption in the moving image capturing mode to be smaller than that in the still image capturing mode without changing the clock rate or readout rate between the moving image capturing mode and the still image capturing mode.
  • FIG. 10 is a block diagram showing the schematic configuration of an image sensing system according to a preferred embodiment of the present invention.
  • This image sensing system has the solid-state image sensing device 4 according to each of the above-described first to fourth embodiments.
  • An optical object image is formed on the image sensing plane of a solid-state image sensing device 4 by a lens 2 .
  • a barrier 1 which serves both as a main switch and a protection of the lens 2 can be set outside the lens 2 .
  • a stop 3 for adjusting the amount of light which emerges from the lens 2 can be provided to the lens 2 .
  • Image sensing signals output from the solid-state image sensing device 4 via a plurality of channels undergo various processes such as correction and clamp by an image sensing signal processing circuit 5 .
  • the image sensing signals output from the image sensing signal processing circuit 5 via the plurality of channels are A/D-converted by an A/D converter 6 .
  • the image data output from the A/D converter 6 undergo various processes such as correction and data compression by a signal processing unit 7 .
  • the solid-state image sensing device 4 , image sensing signal processing circuit 5 , A/D converter 6 , and signal processing unit 7 operate in accordance with timing signals generated by a timing generation unit 8 .
  • the blocks 5 to 8 and the solid-state image sensing device 4 may be formed on the same chip.
  • An overall control/arithmetic processing unit 9 controls the blocks of the image sensing system.
  • the image sensing system comprises a memory unit 10 for temporarily storing image data, and a recording medium control interface unit 11 for recording or reading out an image on or from a recording medium.
  • a detachable recording medium 12 includes, e.g., a semiconductor memory.
  • the image sensing system may comprise an external interface (I/F) unit 13 for communicating with, e.g., an external computer.
  • I/F external interface
  • a main power supply, a power supply of a control system, and power supplies of image sensing system circuits such as the A/D converter 6 are sequentially turned on in accordance with the opening of the barrier 1 .
  • the overall control/arithmetic processing unit 9 sets the stop 3 to a full-aperture state to control the exposure amount.
  • a signal output from the solid-state image sensing device 4 is sent to the A/D converter 6 through the image sensing signal processing circuit 5 .
  • the A/D converter 6 A/D-converts the signal, and outputs the converted signal to the signal processing unit 7 .
  • the signal processing unit 7 processes the received data and sends the processed data to the overall control/arithmetic processing unit 9 .
  • the overall control/arithmetic processing unit 9 performs arithmetic exposure amount determination processing.
  • the overall control/arithmetic processing unit 9 controls the stop 3 on the basis of the determined exposure amount.
  • the overall control/arithmetic processing unit 9 extracts high-frequency components from the signal which is output from the solid-state image sensing device 4 and processed by the signal processing unit 7 , and calculates the distance to an object on the basis of the high-frequency components. After that, the overall control/arithmetic processing unit 9 drives the lens 2 to determine whether it is in focus. If the lens 2 is out of focus, the overall control/arithmetic processing unit 9 drives the lens 2 again, and calculates the distance.
  • an image sensing signal output from the solid-state image sensing device 4 undergoes various processes such as correction by the image sensing signal processing circuit 5 , is A/D-converted by the A/D converter 6 , and is processed by the signal processing unit 7 .
  • the image data processed by the signal processing unit 7 is accumulated in the memory unit 10 by the overall control/arithmetic processing unit 9 .
  • the image data accumulated in the memory unit 10 is recorded on the recording medium 12 via the recording medium control I/F unit 11 under the control of the overall control/arithmetic processing unit 9 .
  • the image data can also be sent to, e.g., a computer via the external I/F unit 13 and processed by it.

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Abstract

A solid-state image sensing device comprises a first readout circuit configured to read out a signal from a pixel array including a plurality of pixels, a signal holding unit configured to hold the signal read out from the first readout circuit, a second readout circuit configured to read out the signal held in the signal holding unit, and a current control unit configured to control an electric current flowing through at least part of the first readout circuit while the first readout circuit reads out the signal. The current control unit controls an electric current flowing through the at least part of the first readout circuit in a moving image capturing mode to be smaller than an electric current flowing through the at least part of the first readout circuit in a still image capturing mode.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a solid-state image sensing device and an image sensing system and, more particularly, to a solid-state image sensing device which can capture a moving image and a still image and an image sensing system having the same.
  • 2. Description of the Related Art
  • A digital camera using a solid-state image sensing device which can capture both a still image and a moving image has become popular nowadays. To meet a demand for still image capturing with high image quality/high resolution, information on pixels in a number larger than that of pixels read out in moving image capturing is necessary. Although moving image capturing requires pixels fewer than those in still image capturing, a specific number of frames (e.g., 30 frames per second according to the NTSC standard) need to be recorded in one second. For this purpose, moving image capturing generally consumes a relatively large power. To cope with this, there is a method of reducing the power consumption by thinning upon reading out pixels from a solid-state image sensing device or dropping the readout clock rate in the moving image capturing mode (Japanese Patent Laid-Open No. 2004-158958).
  • However, the number of pixels to be read out is specified by the readout standard in moving image readout (moving image capturing), so the thinning ratio cannot deviate from the readout standard. If the clock rate is dropped in moving image readout, it is necessary to provide an oscillator for generating a still image readout clock and an oscillator for generating a moving image readout clock. It is also necessary to provide a complicated circuit to prevent any trouble upon frequency switching.
  • SUMMARY OF THE INVENTION
  • The present invention has been made in consideration of the above-described problems, and has as its object to suppress the power consumption in the moving image capturing mode without changing, e.g., the clock rate between the moving image capturing mode and the still image capturing mode.
  • According to the first aspect of the present invention, there is provided a solid-state image sensing device which can capture a moving image and a still image, comprising a first readout circuit configured to read out a signal from a pixel array including a plurality of pixels, a signal holding unit configured to hold the signal read out from the first readout circuit, a second readout circuit configured to read out the signal held in the signal holding unit, and a current control unit configured to control an electric current flowing through at least part of the first readout circuit while the first readout circuit reads out the signal, wherein the current control unit controls an electric current flowing through the at least part of the first readout circuit in a moving image capturing mode to be smaller than an electric current flowing through the at least part of the first readout circuit in a still image capturing mode.
  • According to the second aspect of the present invention, there is provided a solid-state image sensing device which can capture a moving image and a still image, comprising a pixel array including a plurality of pixels, a vertical scanning circuit configured to select a row of the pixel array, a horizontal scanning circuit configured to select a column of the pixel array, a plurality of first amplification circuits configured to amplify signals from the pixel array, a plurality of constant current sources configured to determine electric currents flowing through the plurality of first amplification circuits, a plurality of signal holding units configured to hold the signals from the plurality of first amplification circuits, a plurality of switches configured to transfer the signals, which are held in the plurality of signal holding units, in accordance with a signal sent from the horizontal scanning circuit, a second amplification circuit configured to amplify the signals transferred by the plurality of switches and output the amplified signals, and a current control unit configured to control the electric currents flowing through the plurality of constant current sources, wherein the current control unit controls an electric current flowing through each of the constant current sources in a moving image capturing mode to be smaller than an electric current flowing through each of the constant current sources in a still image capturing mode, so that each of the first amplification circuits operates with a lower driving capability in the moving image capturing mode than in the still image capturing mode.
  • According to the third aspect of the present invention, there is provided a solid-state image sensing device which can capture a moving image and a still image, comprising a pixel array including a plurality of pixels, a vertical scanning circuit configured to select a row of the pixel array, a horizontal scanning circuit configured to select a column of the pixel array, a plurality of column signal lines to which signals from the pixel array are output, a plurality of constant current sources each of which are connected between the ground and a corresponding one of the plurality of column signal lines, and a current control unit configured to control electric currents flowing through the plurality of constant current sources, wherein the current control unit controls an electric current flowing through each of the constant current sources in a moving image capturing mode to be smaller than an electric current flowing through each of the constant current sources in a still image capturing mode.
  • According to the fourth aspect of the present invention, there is provided a solid-state image sensing device which can capture a moving image and a still image, comprising a pixel array including a plurality of pixels, a vertical scanning circuit configured to select a row of the pixel array, a horizontal scanning circuit configured to select a column of the pixel array, a plurality of column signal lines to which signals from the pixel array are output, a plurality of first amplification units configured to amplify the signals output from the pixel array to the plurality of column signal lines, a plurality of signal holding units configured to hold the signals from the plurality of first amplification units, a plurality of switches configured to transfer the signals, which are held in the plurality of signal holding units, in accordance with a signal sent from the horizontal scanning circuit, a second amplification unit configured to amplify the signals transferred by the plurality of switches and output the amplified signals, a plurality of bypass routes configured to bypass the plurality of first amplification units between the plurality of column signal lines and the plurality of signal holding units, and a control unit configured to deactivate the first amplification units and bypass the first amplification units via the bypass routes in a moving image capturing mode, and to activate the first amplification units and shut off the bypass routes in a still image capturing mode.
  • According to the fifth aspect of the present invention, there is provided an image sensing system comprising a solid-state image sensing device as defined above, and a signal processing unit configured to process a signal output from the solid-state image sensing device.
  • According to the present invention, it is possible to suppress the power consumption in the moving image capturing mode without changing, e.g., the clock rate between the moving image capturing mode and the still image capturing mode.
  • Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a block diagram showing the schematic arrangement of a solid-state image sensing device according to the first embodiment of the present invention;
  • FIG. 2 is a circuit diagram illustrating an example of the detailed arrangement of the solid-state image sensing device shown in FIG. 1;
  • FIG. 3 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the first embodiment of the present invention;
  • FIG. 4 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the second embodiment of the present invention;
  • FIG. 5 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the second embodiment of the present invention;
  • FIG. 6 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the third embodiment of the present invention;
  • FIG. 7 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the third embodiment of the present invention;
  • FIG. 8 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the fourth embodiment of the present invention;
  • FIG. 9 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the fourth embodiment of the present invention; and
  • FIG. 10 is a block diagram showing the schematic configuration of an image sensing system according to a preferred embodiment of the present invention.
  • DESCRIPTION OF THE EMBODIMENTS
  • Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
  • A solid-state image sensing device according to a preferred embodiment of the present invention can capture a moving image and a still image. This solid-state image sensing device can be suitably mounted in a digital camera which captures an object image as an electrical signal, and thereby records the image on a memory medium, displays the image on a display device (e.g., a liquid crystal display device), or transmits the image to other devices.
  • FIG. 1 is a block diagram showing the schematic arrangement of a solid-state image sensing device according to the first embodiment of the present invention. The solid-state image sensing device comprises a pixel array A, vertical scanning circuit 104, first readout circuits (column readout circuits) 120, signal holding units 107, switches 109, horizontal scanning circuit 108, second readout circuit 130, and current control unit 112.
  • The pixel array A is formed by two-dimensionally arraying a plurality of pixel units 101 into a plurality of rows and a plurality of columns. For the sake of descriptive simplicity, a pixel array A is formed by 3×3 pixel units 101 in FIG. 1. However, the arrangement of the pixel array A is not particularly limited to this.
  • The first readout circuit 120 reads out a signal from the pixel array A, and can include, e.g., a column signal line 102, first amplification unit 106, and constant current source 105. The signal holding unit 107 holds the signal read out by the first readout circuit 120. The second readout circuit 130 reads out the signal held in the signal holding unit 107 via the switch 109, and can include, e.g., a second amplification unit 110. The first amplification unit 106 and signal holding unit 107 can be set for every other column or every plurality of columns.
  • The vertical scanning circuit 104 typically includes a shift register and selects a row in the pixel array A. The horizontal scanning circuit 108 typically includes a shift register and selects a column in the pixel array A. In this example, a column in the pixel array A can be selected by selectively activating the switch 109 so that the signal is transferred from the signal holding unit 107 to the second readout circuit 130.
  • The current control unit 112 controls an electric current flowing through at least part of the first readout circuit 120 while the first readout circuit 120 reads out the signal. The current control unit 112 controls an electric current flowing through the at least part of the first readout circuit 120 in the moving image capturing mode to be smaller than that flowing through the at least part of the first readout circuit 120 in the still image capturing mode.
  • In the solid-state image sensing device according to this embodiment, the second readout circuit 130 (second amplification unit 110) outputs an image signal at the same clock rate in moving image capturing and still image capturing.
  • FIG. 2 is a circuit diagram showing an example of the detailed arrangement of the pixel unit 101, first amplification unit 106 (first readout circuit 120), signal holding unit 107, and current control unit 112. FIG. 3 is a timing chart illustrating an example of the operation of the solid-state image sensing device shown in FIGS. 1 and 2.
  • The pixel unit 101 can include, e.g., a photodiode (photoelectric conversion unit) 201, transfer transistor 202, amplification transistor (source follower transistor) 203, reset transistor 204, and selection transistor 205. An electric charge generated by photoelectric conversion in the photodiode 201 is transferred to a floating diffusion (to be referred to as an FD hereinafter) 217 by the transfer transistor 202. The potential of the FD 217 is determined in accordance with this electric charge. The FD 217 is a node common to the gate of the amplification transistor 203. A signal based on the electric charge transferred to the FD 217 is amplified by the amplification transistor 203 and output to the column signal line 102 via the selection transistor 205. The column signal line 102 is connected to the constant current source 105 to form a source follower circuit.
  • The first amplification unit 106 can include, e.g., a clamp capacitance 206, inverting amplifier 207, feedback capacitance 208, and clamp switch 209. The column signal line 102 is connected to one end of the clamp capacitance 206 of the first amplification unit 106. The feedback capacitance 208 and clamp switch 209 are connected in parallel between the input end and output end of the inverting amplifier 207.
  • The output end of the first amplification unit 106 (first readout circuit 120) is connected to the signal holding unit 107. The signal holding unit 107 can include, e.g., switches 211 and 212 and holding capacitances 213 and 214. The holding capacitances 213 and 214 preferably have the same capacitance value. The output end of the first amplification unit 106 (first readout circuit 120) is connected to the holding capacitances 213 and 214 via the switches 211 and 212, respectively.
  • Signals held in the holding capacitances 213 and 214 are transferred to the second amplification unit 110 (second readout circuit 130) by turning on column selection switches 215 and 216 in accordance with a pulse PH sent from the horizontal scanning circuit 108. The holding capacitances 213 and 214 respectively hold an N output and an S output. The second amplification unit 110 amplifies the difference between the N output and the S output. This operation is called the CDS (Correlated Double Sampling) operation.
  • The operation of the solid-state image sensing device will be explained with reference to FIG. 3. At T=t1, a selection signal PSEL input to the gate of the selection transistor 205 changes to high level. The amplification transistor 203 is thus activated. In this state, the FD 217 is reset by a reset voltage SVDD.
  • At T=t2, a clamp pulse PC0R changes to high level. The inverting amplifier 207 then enters a unity gain buffer state and outputs a voltage VC0R.
  • At T=t3, a reset signal PRES input to the gate of the reset transistor 204 changes to low level. The potential of the FD 217 is then fixed to black signal level, and a reference voltage VN of the column signal line 102 is determined.
  • At T=t4, the clamp pulse PC0R changes to low level and the reference voltage VN of the column signal line 102 is clamped.
  • At T=t5, a pulse PTN changes to high level. The switch 211 of the signal holding unit 107 is then turned on to start writing the sum of the voltage VC0R and the offset voltage of the inverting amplifier 207 into the holding capacitance 213. At T=t6, this write is ended.
  • At T=t7, a transfer pulse PTX input to the gate of the transfer transistor 202 of the pixel unit 101 changes to high level. The signal charge of the photodiode 201 is then transferred to the FD 217. This transfer is completed before T=t8. At time T=t9, a pulse PTS changes to high level. The switch 212 of the signal holding unit 107 is then turned on to write a signal into the holding capacitance 214.
  • The potential of the column signal line 102 changes from VN to VS as the transfer pulse PTX is activated to high level. If the signal charge is an electron, VS<VN. A voltage obtained by inverting a voltage change amount (VS−VN) by a ratio (C0/Cf) between the clamp capacitance (C0) 206 and the feedback capacitance (Cf) 208, the voltage VC0R, and the offset voltage of the inverting amplifier 207 add up. The sum of these voltages is written into the holding capacitance 214 via the switch 211 of the signal holding unit 107. At T=t10, this write is ended.
  • At T=t11, the reset signal PRES changes to high level. The reset transistor 204 of the pixel unit 101 is then turned on to reset the FD 217. At the same time, the selection signal PSEL changes to low level to turn off the selection transistor 205. With this operation, row selection is canceled.
  • At T=t12, the column selection switches 215 and 216 are turned on in accordance with a pulse PH sent from the horizontal scanning circuit 108. The second amplification unit 110 calculates the difference between an N output and an S output, and outputs an image signal. At T=t13, this operation is ended and signals in the columns are sequentially output in synchronism with the pulse PH.
  • In this embodiment, there is no difference between the moving image capturing mode and the still image capturing mode except that the current control unit 112 controls an electric current flowing through at least part of the first readout circuit 120. For this reason, the clock rate of an image signal output from the second amplification unit 110 in synchronism with a pulse PH remains the same between the moving image capturing mode and the still image capturing mode. Normally, when this clock rate is changed between the moving image capturing mode and the still image capturing mode, a quartz oscillator needs to be switched between the moving image capturing mode and the still image capturing mode. However, this method requires a complicated frequency switching operation, resulting in an increase in the number of components.
  • In this embodiment, the current control unit 112 controls an electric current flowing through at least part (the first amplification unit 106 in this embodiment) of the first readout circuit 120 in the moving image capturing mode to be smaller than that flowing through the at least part of the first readout circuit 120 in the still image capturing mode.
  • More specifically, in this embodiment, letting I1 be the magnitude of an electric current flowing through the first amplification unit 106 in the still image capturing mode, and I2 be the magnitude of an electric current flowing through the first amplification unit 106 in the moving image capturing mode, I1>I2.
  • The current control unit 112 controls the gate voltage of a constant current transistor 218 of the first amplification unit 106 to control an electric current flowing through the constant current transistor 218, i.e., an electric current flowing through the first amplification unit 106. The current control unit 112 can include, e.g., a transistor 112 a having its gate and drain connected to each other, and the gate of the transistor 112 a can be connected to that of the constant current transistor 218. With this arrangement, the constant current transistor 218 is biased so that an electric current with the same magnitude as that of an electric current flowing through the transistor 112 a flows through the constant current transistor 218. Such an arrangement is called a current mirror circuit.
  • The value I1 is determined such that signal voltages can be sufficiently written into the holding capacitances 213 and 214 within the period between time t9 and t10. The required write times are determined in accordance with, e.g., the capacitance values of the holding capacitances 213 and 214, the ON resistances of the switches 211 and 212, and the output impedance and inverting gain of the inverting amplifier 207. However, the driving capacity of the inverting amplifier 207 is basically changed by changing a tail current flowing through the constant current transistor 218 of the inverting amplifier 207. This makes it possible to change the times taken to write signal voltages into the holding capacitances 213 and 214.
  • The level at which a signal voltage is written into each of the holding capacitances 213 and 214 by consuming an infinite time is assumed to be 100%. Letting t be a time constant, (1−exp(5τ))=0.993, i.e., 99.3% can be written for 5τ. In the still image capturing mode, the magnitude I1 of an electric current flowing through the first amplification unit 106 is determined such that a level corresponding to, e.g., 5τ is written. This makes it possible to sufficiently write signal voltages into the holding capacitances 213 and 214, thus obtaining a high-quality output image.
  • In the moving image capturing mode, the magnitude I2 of an electric current flowing through the first amplification unit 106 is determined such that a written signal voltage is suppressed to a level corresponding to 4τ, i.e., (1−exp(4τ))=0.982 (98.2%). In the moving image capturing mode, the output amplitude of the first amplification unit 106 decreases slightly, and sufficient voltages cannot be written into the holding capacitances 213 and 214 as an electric current flowing through the first amplification unit 106 decreases. These factors can increase noise. This, however, poses no serious problem because the allowable noise level range of a moving image to continuously view a plurality of images is wider than that of a still image.
  • That is, even when the written voltage in the moving image capturing mode is lower than that in the still image capturing mode, the image quality does not visually significantly deteriorate. Signal waveforms VN and VS in FIG. 3 schematically show these states. The still image capturing mode is indicated by solid lines, and the moving image capturing mode is indicated by dotted lines.
  • Conversely, when the current consumption is suppressed relatively small in the moving image capturing mode, the image quality improves. Setting the reference currents to satisfy I2<I1 greatly reduces the current consumption per first amplification unit 106 (e.g., per column). A digital camera which uses a total of more than 10,000,000 pixels will be taken as an example. If the number of columns exceeds 4,000 and the current consumption is reduced by 5 μA per column, the overall current consumption can be decreased by 20 mA. Assuming that the power supply voltage is 5V, the overall power consumption can be decreased by 100 mW. Heat generated by a power consumption of this amount changes the image quality significantly.
  • Especially when a still image is captured while capturing a moving image, or when the so-called Live View photography in which a still image is captured while the photographer views a moving image in an electronic viewfinder, the moving image capturing mode instantaneously switches to the still image capturing mode. For this reason, a still image is captured before heat generated in the moving image capturing mode dies down. This may noticeably deteriorate the quality of the still image as random noise due to the heat generated in the moving image capturing mode has a large adverse influence on still image capturing in the still image capturing mode. Suppressing the current consumption in the moving image capturing mode can therefore improve the quality of a still image.
  • According to this embodiment, it is also possible to smoothly switch between the moving image capturing mode and the still image capturing mode because the clock rate remains the same.
  • FIG. 4 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the second embodiment of the present invention. Details which are not particularly referred to in the arrangement according to the second embodiment can be the same as in the first embodiment. The second embodiment is different from the first embodiment in that a current control unit 112 controls a constant current source 105 connected to a column signal line 102. Letting 13 be the magnitude of an electric current flowing through the constant current source 105 in the still image capturing mode, and 14 be the magnitude of an electric current flowing through the constant current source 105 in the moving image capturing mode, I3>I4.
  • FIG. 5 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the second embodiment. The basic operation of the solid-state image sensing device according to the second embodiment is the same as that according to the first embodiment shown in FIG. 3. The timing charts shown in FIGS. 5 and 3 are different in a change in voltage VN. In the first embodiment, the write speeds of both voltages VN and VS in the moving image capturing mode are lower than those in the still image capturing mode. In the second embodiment, an electric current flowing through the column signal line 102 in the moving image capturing mode is smaller than that in the still image capturing mode. Since a change in the voltage of the column signal line 102 is very small during the write of a voltage VN, a first amplification unit 106 determines the speed at which a voltage is written into a holding capacitance 213. This prevents a drop in write speed. In contrast, the write speed of a voltage VS in the moving image capturing mode drops, like the first embodiment, as can be seen from a change in voltage VS indicated by a dotted line in FIG. 5. This is because the charge/discharge speed of a clamp capacitance (C0) 206 drops. This, however, poses no serious problem because the allowable noise level range of a moving image to continuously view a plurality of images is wider than that of a still image, as described in the first embodiment. Like the first embodiment, suppressing the current consumption of the column signal line in the moving image capturing mode makes it possible to improve the image quality in the still image capturing mode.
  • The current control unit 112 may control both electric currents flowing through the first amplification unit 106 and constant current source 105 in the moving image capturing mode to be smaller than those in the still image capturing mode by combining the first and second embodiments.
  • FIG. 6 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the third embodiment of the present invention. Details which are not particularly referred to in the arrangement according to the third embodiment can be the same as in the first embodiment.
  • In the third embodiment, a bypass route 610 for bypassing a first amplification unit 106 is additionally connected between a column signal line 102 and a signal holding unit 107, and a transistor 602 is additionally inserted in an inverting amplifier 207. In the third embodiment, a current control unit 603 is provided in place of the current control unit 112. In the moving image capturing mode, the current control unit 603 deactivates the first amplification unit 106 and bypasses the first amplification unit 106 via the bypass route 610. In the still image capturing mode, the current control unit 603 activates the first amplification unit 106 and shuts off the bypass route 610.
  • The first amplification unit 106 is activated by activating the transistor 602 and deactivated by deactivating the transistor 602 under the control of the current control unit 603. The bypass route 610 is activated by activating a transistor 601 inserted in the bypass route 610, and then the first amplification unit 106 is bypassed via the bypass route 610. The bypass route 610 is shut off by deactivating the transistor 601. This operation is controlled by the current control unit 603.
  • FIG. 7 is a timing chart illustrating an example of the operation of the solid-state image sensing device according to the third embodiment. Referring to FIG. 7, the operation in the still image capturing mode is indicated by solid lines, and the operation in the moving image capturing mode is indicated by broken lines.
  • The basic operation of the solid-state image sensing device according to the third embodiment is the same as that according to the first embodiment shown in FIG. 3. Mode signals PMS and /PMS are generated by the current control unit 603. The mode signal /PMS is obtained by inverting the mode signal PMS. The mode signal PMS is set at low level in the still image capturing mode, while it is set at high level in the moving image capturing mode.
  • In the still image capturing mode, the transistor 601 which controls the bypass route 610 is OFF, while the transistor 602 which controls the activation/deactivation of the inverting amplifier 207 is ON. Therefore, in the still image capturing mode, the solid-state image sensing device shown in FIG. 6 operates in substantially the same manner as in the solid-state image sensing device shown in FIG. 2.
  • In the moving image capturing mode, the transistor 601 which controls the bypass route 610 is ON, while the transistor 602 which controls the activation/deactivation of the inverting amplifier 207 is OFF. Therefore, in the moving image capturing mode, no electric current flows through the inverting amplifier 207 so that the current consumption can be greatly reduced. By turning on the transistor 601, the column signal line 102 is directly connected to the signal holding unit 107. In the moving image capturing mode, since the inverting amplifier 207 is not used, a pulse PC0R is not used. Also in the moving image capturing mode, signals written into holding capacitances 213 and 214 are not inverted and amplified by the inverting amplifier 207.
  • An example of the operation in the moving image capturing mode will be explained below. Referring to FIG. 7, at T=t1, a selection signal PSEL input to the gate of a selection transistor 205 changes to high level. An amplification transistor 203 is thus activated. In this state, an FD 217 is reset by a reset voltage SVDD.
  • At T=t3, a reset signal PRES input to the gate of a reset transistor 204 changes to low level. The potential of the FD 217 is then fixed to black signal level, and a reference voltage VN of the column signal line 102 is determined.
  • At T=t5, a pulse PTS changes to high level. A switch 212 of the signal holding unit 107 is then turned on to start writing a reference signal VN into the holding capacitance 214. At T=t6, this write is ended. In this embodiment, a reference signal VN (N output) is written into the holding capacitance 214 and a signal VS (S output) is written into the holding capacitance 213 in the moving image capturing mode.
  • At T=t7, a transfer pulse PTX input to the gate of a transfer transistor 202 in a pixel unit 101 changes to high level. The signal charge of a photodiode 201 is then transferred to the FD 217. This transfer is completed before T=t8. At time T=t9, a pulse PTN changes to high level. The switch 211 of the signal holding unit 107 is then turned on to start writing a signal VS into the holding capacitance 213.
  • The potential of the column signal line 102 changes from VN to VS as the transfer pulse PTX is activated to high level. If the signal charge is an electron, VS<VN. The voltage value VS is directly written into the holding capacitance 213.
  • At T=t10, this write is ended. At T=t11, the reset signal PRES changes to high level. The reset transistor 204 of the pixel unit 101 is then turned on to reset and the FD 217. At the same time, the selection signal PSEL changes to low level to turn off the selection transistor 205. With this operation, row selection is canceled.
  • At T=t12, column selection switches 215 and 216 are turned on in accordance with a pulse PH sent from a horizontal scanning circuit 108. A second amplification unit 110 calculates the difference between an N output and an S output, and outputs an image signal. At T=t13, this operation is ended and signals in the columns are sequentially output in synchronism with the pulse PH.
  • In the third embodiment, the first amplification unit is not used in the moving image capturing mode, so the gain is relatively low. To cope with this situation, the second amplification unit 110 may multiply the image signal by a gain as needed.
  • According to the third embodiment, it is possible to greatly reduce the current consumption of the first amplification unit in the moving image capturing mode. On the other hand, the arrangement according to the third embodiment can be implemented by providing two switches for each first readout circuit without largely changing the circuitry.
  • The arrangement according to the third embodiment can be used together with that according to the second embodiment.
  • FIG. 8 is a circuit diagram showing the schematic arrangement of a solid-state image sensing device according to the fourth embodiment of the present invention. FIG. 9 is a timing chart illustrating an example of the operation of the solid-state image sensing device. The fourth embodiment has an arrangement in which the first amplification unit 106 is omitted from the solid-state image sensing device according to the second embodiment shown in FIG. 4.
  • According to the first to fourth embodiments, it is possible to suppress the current consumption in the moving image capturing mode to be smaller than that in the still image capturing mode without changing the clock rate or readout rate between the moving image capturing mode and the still image capturing mode.
  • FIG. 10 is a block diagram showing the schematic configuration of an image sensing system according to a preferred embodiment of the present invention. This image sensing system has the solid-state image sensing device 4 according to each of the above-described first to fourth embodiments.
  • An optical object image is formed on the image sensing plane of a solid-state image sensing device 4 by a lens 2. A barrier 1 which serves both as a main switch and a protection of the lens 2 can be set outside the lens 2. A stop 3 for adjusting the amount of light which emerges from the lens 2 can be provided to the lens 2. Image sensing signals output from the solid-state image sensing device 4 via a plurality of channels undergo various processes such as correction and clamp by an image sensing signal processing circuit 5. The image sensing signals output from the image sensing signal processing circuit 5 via the plurality of channels are A/D-converted by an A/D converter 6. The image data output from the A/D converter 6 undergo various processes such as correction and data compression by a signal processing unit 7. The solid-state image sensing device 4, image sensing signal processing circuit 5, A/D converter 6, and signal processing unit 7 operate in accordance with timing signals generated by a timing generation unit 8.
  • The blocks 5 to 8 and the solid-state image sensing device 4 may be formed on the same chip. An overall control/arithmetic processing unit 9 controls the blocks of the image sensing system. In addition to these blocks, the image sensing system comprises a memory unit 10 for temporarily storing image data, and a recording medium control interface unit 11 for recording or reading out an image on or from a recording medium. A detachable recording medium 12 includes, e.g., a semiconductor memory. The image sensing system may comprise an external interface (I/F) unit 13 for communicating with, e.g., an external computer.
  • The operation of the image sensing system shown in FIG. 10 will be explained next. A main power supply, a power supply of a control system, and power supplies of image sensing system circuits such as the A/D converter 6 are sequentially turned on in accordance with the opening of the barrier 1. After that, the overall control/arithmetic processing unit 9 sets the stop 3 to a full-aperture state to control the exposure amount. A signal output from the solid-state image sensing device 4 is sent to the A/D converter 6 through the image sensing signal processing circuit 5. The A/D converter 6 A/D-converts the signal, and outputs the converted signal to the signal processing unit 7. The signal processing unit 7 processes the received data and sends the processed data to the overall control/arithmetic processing unit 9. The overall control/arithmetic processing unit 9 performs arithmetic exposure amount determination processing. The overall control/arithmetic processing unit 9 controls the stop 3 on the basis of the determined exposure amount.
  • The overall control/arithmetic processing unit 9 extracts high-frequency components from the signal which is output from the solid-state image sensing device 4 and processed by the signal processing unit 7, and calculates the distance to an object on the basis of the high-frequency components. After that, the overall control/arithmetic processing unit 9 drives the lens 2 to determine whether it is in focus. If the lens 2 is out of focus, the overall control/arithmetic processing unit 9 drives the lens 2 again, and calculates the distance.
  • After the lens 2 is confirmed to be in focus, final exposure is started. After the exposure is ended, an image sensing signal output from the solid-state image sensing device 4 undergoes various processes such as correction by the image sensing signal processing circuit 5, is A/D-converted by the A/D converter 6, and is processed by the signal processing unit 7. The image data processed by the signal processing unit 7 is accumulated in the memory unit 10 by the overall control/arithmetic processing unit 9.
  • The image data accumulated in the memory unit 10 is recorded on the recording medium 12 via the recording medium control I/F unit 11 under the control of the overall control/arithmetic processing unit 9. The image data can also be sent to, e.g., a computer via the external I/F unit 13 and processed by it.
  • While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
  • This application claims the benefit of Japanese Patent Application No. 2007-121838, filed May 2, 2007, which is hereby incorporated by reference herein in its entirety.

Claims (2)

1. A solid-state image sensing device which can capture a moving image and a still image, comprising:
a first readout circuit configured to read out a signal from a pixel array including a plurality of pixels;
a signal holding unit configured to hold the signal read out from said first readout circuit;
a second readout circuit configured to read out the signal held in said signal holding unit; and
a current control unit configured to control an electric current flowing through at least part of said first readout circuit while said first readout circuit reads out the signal,
wherein said current control unit controls an electric current flowing through said at least part of said first readout circuit in a moving image capturing mode to be smaller than an electric current flowing through said at least part of said first readout circuit in a still image capturing mode.
2-18. (canceled)
US14/016,857 2007-05-02 2013-09-03 Solid-state image sensing device and image sensing system Abandoned US20140002684A1 (en)

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US12/102,294 US8106955B2 (en) 2007-05-02 2008-04-14 Solid-state image sensing device and image sensing system
US13/354,658 US8553101B2 (en) 2007-05-02 2012-01-20 Solid-state image sensing device and image sensing system
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Cited By (6)

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US9147708B2 (en) 2012-01-18 2015-09-29 Canon Kabushiki Kaisha Solid-state image sensor and camera
US9288415B2 (en) 2013-09-17 2016-03-15 Canon Kabushiki Kaisha Solid-state imaging apparatus and imaging system
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US10319765B2 (en) 2016-07-01 2019-06-11 Canon Kabushiki Kaisha Imaging device having an effective pixel region, an optical black region and a dummy region each with pixels including a photoelectric converter
US10347679B2 (en) 2016-05-26 2019-07-09 Canon Kabushiki Kaisha Imaging device

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4110193B1 (en) 2007-05-02 2008-07-02 キヤノン株式会社 Solid-state imaging device and imaging system
JP2009141631A (en) * 2007-12-05 2009-06-25 Canon Inc Photoelectric conversion device and image pickup device
JP5111140B2 (en) * 2008-02-06 2012-12-26 キヤノン株式会社 Solid-state imaging device driving method, solid-state imaging device, and imaging system
JP5268389B2 (en) * 2008-02-28 2013-08-21 キヤノン株式会社 Solid-state imaging device, driving method thereof, and imaging system
JP5156434B2 (en) * 2008-02-29 2013-03-06 キヤノン株式会社 Imaging apparatus and imaging system
JP5094498B2 (en) * 2008-03-27 2012-12-12 キヤノン株式会社 Solid-state imaging device and imaging system
JP5279352B2 (en) 2008-06-06 2013-09-04 キヤノン株式会社 Solid-state imaging device
JP5089514B2 (en) * 2008-07-11 2012-12-05 キヤノン株式会社 Imaging apparatus and imaging system
JP4617372B2 (en) * 2008-08-29 2011-01-26 キヤノン株式会社 Imaging apparatus and imaging system
JP5203913B2 (en) * 2008-12-15 2013-06-05 キヤノン株式会社 Photoelectric conversion device, imaging system, and driving method of photoelectric conversion device
JP2010147614A (en) * 2008-12-16 2010-07-01 Panasonic Corp Solid-state imaging apparatus and method for driving the same, imaging apparatus
JP4891308B2 (en) * 2008-12-17 2012-03-07 キヤノン株式会社 Solid-state imaging device and imaging system using solid-state imaging device
US8913166B2 (en) 2009-01-21 2014-12-16 Canon Kabushiki Kaisha Solid-state imaging apparatus
JP5511220B2 (en) 2009-05-19 2014-06-04 キヤノン株式会社 Solid-state imaging device
JP5430380B2 (en) * 2009-12-11 2014-02-26 キヤノン株式会社 Solid-state imaging device and driving method of solid-state imaging device
JP5538876B2 (en) * 2009-12-25 2014-07-02 キヤノン株式会社 Solid-state imaging device
JP5751766B2 (en) 2010-07-07 2015-07-22 キヤノン株式会社 Solid-state imaging device and imaging system
JP5656484B2 (en) 2010-07-07 2015-01-21 キヤノン株式会社 Solid-state imaging device and imaging system
JP5697371B2 (en) 2010-07-07 2015-04-08 キヤノン株式会社 Solid-state imaging device and imaging system
JP5885401B2 (en) 2010-07-07 2016-03-15 キヤノン株式会社 Solid-state imaging device and imaging system
JP5645513B2 (en) 2010-07-07 2014-12-24 キヤノン株式会社 Solid-state imaging device and imaging system
JP5643555B2 (en) 2010-07-07 2014-12-17 キヤノン株式会社 Solid-state imaging device and imaging system
JP5506586B2 (en) 2010-07-30 2014-05-28 キヤノン株式会社 Solid-state imaging device and driving method of solid-state imaging device
JP5762199B2 (en) 2011-07-28 2015-08-12 キヤノン株式会社 Solid-state imaging device
JP5901186B2 (en) 2011-09-05 2016-04-06 キヤノン株式会社 Solid-state imaging device and driving method thereof
JP5858695B2 (en) 2011-09-08 2016-02-10 キヤノン株式会社 Solid-state imaging device and driving method of solid-state imaging device
JP5806566B2 (en) 2011-09-15 2015-11-10 キヤノン株式会社 A / D converter and solid-state imaging device
JP5801665B2 (en) 2011-09-15 2015-10-28 キヤノン株式会社 Solid-state imaging device, A / D converter and control method thereof
JP5864990B2 (en) 2011-10-03 2016-02-17 キヤノン株式会社 Solid-state imaging device and camera
JP5930651B2 (en) 2011-10-07 2016-06-08 キヤノン株式会社 Solid-state imaging device
JP5484422B2 (en) 2011-10-07 2014-05-07 キヤノン株式会社 Solid-state imaging device
JP5901212B2 (en) 2011-10-07 2016-04-06 キヤノン株式会社 Photoelectric conversion system
JP5967915B2 (en) 2011-12-09 2016-08-10 キヤノン株式会社 Driving method of solid-state imaging device
JP6023437B2 (en) 2012-02-29 2016-11-09 キヤノン株式会社 Solid-state imaging device and camera
JP6319946B2 (en) 2013-04-18 2018-05-09 キヤノン株式会社 Solid-state imaging device and imaging system
JP6100074B2 (en) 2013-04-25 2017-03-22 キヤノン株式会社 Photoelectric conversion device and imaging system
JP6274788B2 (en) 2013-08-28 2018-02-07 キヤノン株式会社 Imaging apparatus, imaging system, and driving method of imaging apparatus
JP6230343B2 (en) 2013-09-06 2017-11-15 キヤノン株式会社 Solid-state imaging device, driving method thereof, and imaging system
JP6239975B2 (en) 2013-12-27 2017-11-29 キヤノン株式会社 Solid-state imaging device and imaging system using the same
JP6351404B2 (en) 2014-07-02 2018-07-04 キヤノン株式会社 Imaging apparatus and imaging system
JP6109125B2 (en) 2014-08-20 2017-04-05 キヤノン株式会社 Semiconductor device, solid-state imaging device, and imaging system
US9979916B2 (en) 2014-11-21 2018-05-22 Canon Kabushiki Kaisha Imaging apparatus and imaging system
US10742920B2 (en) 2015-09-30 2020-08-11 Nikon Corporation Image sensor, image-capturing apparatus, and electronic device
WO2017057382A1 (en) * 2015-09-30 2017-04-06 株式会社ニコン Image-capturing element and image-capturing device
JP6642105B2 (en) * 2016-02-26 2020-02-05 セイコーエプソン株式会社 Image reading device and semiconductor device
US10771719B2 (en) * 2016-07-28 2020-09-08 Sony Semiconductor Solutions Corporation Imaging element
FR3084545B1 (en) 2018-07-27 2021-05-14 Soc Fr De Detecteurs Infrarouges Sofradir SAMPLING DEVICE WITH ELECTRICAL CONSUMPTION MANAGEMENT
US11310455B2 (en) * 2020-01-17 2022-04-19 Sony Semiconductor Solutions Corporation Tail current boost circuit
CN115550579B (en) * 2022-10-09 2023-09-26 成都微光集电科技有限公司 Image sensor reading method and image sensor

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2798805B2 (en) 1990-11-13 1998-09-17 キヤノン株式会社 Photoelectric conversion device and multi-chip sensor device using the same
JP3335365B2 (en) * 1991-05-22 2002-10-15 ソニー株式会社 Solid-state imaging device
JP2897106B2 (en) * 1994-07-01 1999-05-31 株式会社ニコン Solid-state imaging device
JP3809205B2 (en) * 1995-09-08 2006-08-16 キヤノン株式会社 Imaging device
JPH09200633A (en) * 1996-01-24 1997-07-31 Sony Corp Solid-state image pickup device, output circuit for solid-state image pickup device, amplifier circuit and electronic device
JPH1083874A (en) 1996-09-09 1998-03-31 Maspro Denkoh Corp Branching unit
TW421962B (en) 1997-09-29 2001-02-11 Canon Kk Image sensing device using mos type image sensing elements
JPH11261046A (en) 1998-03-12 1999-09-24 Canon Inc Solid-state image pickup device
JP4058791B2 (en) 1998-03-18 2008-03-12 ソニー株式会社 Solid-state imaging device, driving method thereof, and camera system
JP2000115642A (en) 1998-10-09 2000-04-21 Honda Motor Co Ltd Image sensor
FI112892B (en) * 1999-04-14 2004-01-30 Nokia Corp A method and receiver for receiving and decoding signals modulated by various modulation methods
JP2001257946A (en) 2000-03-14 2001-09-21 Canon Inc Solid-state image pickup device and image pickup system
GB0020280D0 (en) * 2000-08-18 2000-10-04 Vlsi Vision Ltd Modification of column fixed pattern column noise in solid image sensors
JP2002094862A (en) 2000-09-12 2002-03-29 Chinon Ind Inc Image pickup apparatus
JP2002223393A (en) * 2000-11-27 2002-08-09 Sanyo Electric Co Ltd Electronic charge transfer element
JP3984814B2 (en) * 2001-10-29 2007-10-03 キヤノン株式会社 Imaging device, radiation imaging apparatus using the imaging device, and radiation imaging system using the imaging device
EP1341377B1 (en) 2002-02-27 2018-04-11 Canon Kabushiki Kaisha Signal processing device for image pickup apparatus
JP3728260B2 (en) 2002-02-27 2005-12-21 キヤノン株式会社 Photoelectric conversion device and imaging device
JP2003258230A (en) * 2002-02-28 2003-09-12 Canon Inc Semiconductor device and semiconductor imaging device
CN1317568C (en) * 2002-05-28 2007-05-23 佳能株式会社 Optical detecting device x-ray photographic method and apparatus and photo-electric conversion components
JP3751931B2 (en) 2002-11-05 2006-03-08 ローム株式会社 Area image sensor
US7317903B2 (en) * 2003-09-30 2008-01-08 Sharp Kabushiki Kaisha Wireless communication circuit, wireless communication apparatus, and wireless communication system
JP4418720B2 (en) * 2003-11-21 2010-02-24 キヤノン株式会社 Radiation imaging apparatus and method, and radiation imaging system
JP2005286501A (en) * 2004-03-29 2005-10-13 Fuji Photo Film Co Ltd Camera system
JP2006068512A (en) * 2004-08-06 2006-03-16 Canon Inc Imaging apparatus, imaging system, imaging method, and computer program
JP5089017B2 (en) 2004-09-01 2012-12-05 キヤノン株式会社 Solid-state imaging device and solid-state imaging system
JP4971586B2 (en) 2004-09-01 2012-07-11 キヤノン株式会社 Solid-state imaging device
JP4459064B2 (en) 2005-01-14 2010-04-28 キヤノン株式会社 Solid-state imaging device, control method thereof, and camera
JP2006197392A (en) 2005-01-14 2006-07-27 Canon Inc Solid-state imaging device, camera, and method of driving solid-state imaging device
JP4416668B2 (en) 2005-01-14 2010-02-17 キヤノン株式会社 Solid-state imaging device, control method thereof, and camera
JP4459099B2 (en) 2005-03-18 2010-04-28 キヤノン株式会社 Solid-state imaging device and camera
JP5005179B2 (en) * 2005-03-23 2012-08-22 ソニー株式会社 Solid-state imaging device
JP4792934B2 (en) * 2005-11-17 2011-10-12 ソニー株式会社 Physical information acquisition method and physical information acquisition device
JP4804254B2 (en) 2006-07-26 2011-11-02 キヤノン株式会社 Photoelectric conversion device and imaging device
JP5123601B2 (en) 2006-08-31 2013-01-23 キヤノン株式会社 Photoelectric conversion device
JP5043388B2 (en) 2006-09-07 2012-10-10 キヤノン株式会社 Solid-state imaging device and imaging system
JP5066996B2 (en) * 2007-04-23 2012-11-07 ソニー株式会社 Solid-state imaging device, signal processing method for solid-state imaging device, and imaging device
JP4110193B1 (en) * 2007-05-02 2008-07-02 キヤノン株式会社 Solid-state imaging device and imaging system

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