US20130288591A1 - Heat dissipating device - Google Patents
Heat dissipating device Download PDFInfo
- Publication number
- US20130288591A1 US20130288591A1 US13/744,562 US201313744562A US2013288591A1 US 20130288591 A1 US20130288591 A1 US 20130288591A1 US 201313744562 A US201313744562 A US 201313744562A US 2013288591 A1 US2013288591 A1 US 2013288591A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipating
- side plates
- plate
- bottom plate
- dissipating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
Definitions
- the present disclosure relates to a heat dissipating device.
- Many heat exchangers are provided to a server container to dissipate heat generated from electronic components in the server container.
- Many drain pans are needed to collect water when the heat exchanger is in operation.
- the number of drain pans provided in a server container is usually equal to the number of the exchangers.
- FIG. 1 is an exploded, isometric view of a heat dissipating device in accordance with an embodiment.
- FIG. 2 is similar to FIG. 1 , but viewed from a different aspect.
- FIG. 3 is similar to FIG. 2 , but showing a retaining plate and a separated plate secured in a chassis.
- FIG. 4 is an isometric view of an assembly of the heat dissipating device of FIG. 1 .
- FIG. 5 is an isometric view of an assembly of the heat dissipating device of FIG. 2 .
- FIG. 6 is similar to FIG. 5 , but viewed from a different aspect.
- FIGS. 1-3 illustrate one embodiment of a heat dissipating device.
- the heat dissipating device can be secured to an electronic device, such as a server computer, to dissipate heat generated from the electronic device.
- the heat dissipating device comprises a chassis 10 and a first heat dissipating member 20 .
- the chassis 10 comprises a bottom plate 11 , two side plates 13 , and a first support plate 17 .
- the two side plates 13 are located on the bottom plate 11 at opposite sides.
- the chassis 10 defines an input opening 19 and an output opening 14 between the two side plates 13 .
- the first support plate 17 defines a first ventilation opening 175 located between the two side plates 13 and between the input opening 19 and the output opening 14 .
- the first heat dissipating member 20 is secured to the first support plate 17 .
- the bottom plate 11 is concave, a through hole 112 (shown in FIG. 6 ) is defined in a bottom of the bottom plate 11 , and the water flows out of the chassis 10 via the through hole 112 .
- the two side plates 13 are substantially parallel to each other and perpendicular to the bottom plate 11
- the first support plate 17 is substantially perpendicular to the two side plates 13
- the first support plate 17 is slanted relative to the bottom plate 11
- a support flange 12 is located on each of the two side plates 13 above the bottom plate 11 , to support the first heat dissipating member 20 .
- the support flange on each of the two side plates 13 is substantially perpendicular to each of the two side plates 13 and parallel to the bottom plate 11 .
- the heat dissipating device further comprises a retaining plate 30 .
- the retaining plate 30 is located on the support flange 12 on each of the two side plates 13 , for supporting the first heat dissipating member 20 .
- Each of the support flange 12 defines a plurality of first fixing holes 1211 (shown in FIG. 2 ), and the retaining plate 30 defines a plurality of second fixing holes 312 at opposite ends.
- a space 100 (shown in FIGS. 1 and 6 ) is defined between the retaining plate 30 and the bottom plate 11 .
- the retaining plate 30 defines a plurality of drain holes 315 . When water drops to the retaining plate 30 , the accumulated water flows from the retaining plate 30 to the bottom plate 11 via the plurality of drain holes 315 .
- Two installing pieces 33 extend from opposite ends of the retaining plate 30 .
- Each of the two installing pieces 33 comprises a piece body 34 slantingly extending from the retaining plate 30 and a mounting portion 35 substantially perpendicularly extending from the piece body 34 .
- the mounting portion 35 of each of the two installing pieces 33 defines two first mounting holes 351
- each of the two side plates 13 defines two second mounting holes 133 .
- the heat dissipating device further comprises a separated plate 50 .
- the separated plate 50 is slanted relative to the retaining plate 30 .
- Two locking flanges 52 extend in opposite directions from a bottom edge and a top edge of the separated plate 50 .
- Each of the two locking flanges 52 define a plurality of first installing holes 521
- the retaining plate 30 defines a plurality of second installing holes 311 .
- Two mounting pieces 21 are located on the first heat dissipating member 20 at opposite sides. Each of the two mounting pieces 21 defines two first fastening holes 211 , and each of the two side plates 13 defines two second fastening holes 131 .
- two fourth fasteners 23 such as screws, are fastened into the two second fastening holes 131 of each of the two mounting pieces 21 and the two second fastening holes 131 of each of the two side plates 13 , the first heat dissipating member 20 is thereby secured to the two side plates 13 .
- the chassis 10 further comprises a second support plate 18 .
- the second support plate 18 is substantially parallel to the first support plate 17 and extends to the bottom plate 11 .
- the second support plate 18 and the bottom plate 11 secure a second heat dissipating member 40 , which is same as the first dissipating member 20 .
- the first heat dissipating member 20 and the second heat dissipating member 40 are heat exchangers.
- the separated plate 50 is located between the first support plate 17 and the second support plate 18 .
- a handgrip 16 is secured to the two side plates 13 , to conveniently move the chassis 10 , and the handgrip 16 is located between the first support plate 17 and the second support plate 18 .
- air also flows from the input opening 19 , and through the space 100 and a second ventilation opening 183 of the second support plate 18 , via the second heat dissipating member 40 , to the output opening 14 .
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipating device includes a chassis and a heat dissipating member. The chassis includes a bottom plate, two side plates, and a support plate. The two side plates are located on the bottom plate. The chassis defines an input opening and an output opening between the two side plates. The bottom plate defines a through hole. The support plate defines a ventilation opening and is located between the two side plates and between the input opening and the output opening. The heat dissipating member is secured to the support plate. An air flow path is defined from the input opening, the ventilation opening, via the heat dissipating member, to the output opening, and an water exit path is defined from the heat dissipating member to the bottom plate and configured to flow water from the heat dissipating member out of the chassis via the through hole.
Description
- 1. Technical Field
- The present disclosure relates to a heat dissipating device.
- 2. Description of Related Art
- Many heat exchangers are provided to a server container to dissipate heat generated from electronic components in the server container. Many drain pans are needed to collect water when the heat exchanger is in operation. The number of drain pans provided in a server container is usually equal to the number of the exchangers.
- Therefore, there is room for improvement within the art.
- Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of a heat dissipating device in accordance with an embodiment. -
FIG. 2 is similar toFIG. 1 , but viewed from a different aspect. -
FIG. 3 is similar toFIG. 2 , but showing a retaining plate and a separated plate secured in a chassis. -
FIG. 4 is an isometric view of an assembly of the heat dissipating device ofFIG. 1 . -
FIG. 5 is an isometric view of an assembly of the heat dissipating device ofFIG. 2 . -
FIG. 6 is similar toFIG. 5 , but viewed from a different aspect. - The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
-
FIGS. 1-3 illustrate one embodiment of a heat dissipating device. The heat dissipating device can be secured to an electronic device, such as a server computer, to dissipate heat generated from the electronic device. The heat dissipating device comprises achassis 10 and a firstheat dissipating member 20. - The
chassis 10 comprises abottom plate 11, twoside plates 13, and afirst support plate 17. The twoside plates 13 are located on thebottom plate 11 at opposite sides. Thechassis 10 defines aninput opening 19 and an output opening 14 between the twoside plates 13. Thefirst support plate 17 defines afirst ventilation opening 175 located between the twoside plates 13 and between theinput opening 19 and the output opening 14. - Referring to
FIGS. 4-5 , the firstheat dissipating member 20 is secured to thefirst support plate 17. When the heat dissipating device works, air flows from the input opening 19, through the first ventilation opening 175, via the firstheat dissipating member 20, to the output opening 14, and water condensed from the atmosphere drops from the firstheat dissipating member 20 to thebottom plate 11 and flows out of thechassis 10 along thebottom plate 11. In an embodiment, thebottom plate 11 is concave, a through hole 112 (shown inFIG. 6 ) is defined in a bottom of thebottom plate 11, and the water flows out of thechassis 10 via the throughhole 112. - In an embodiment, the two
side plates 13 are substantially parallel to each other and perpendicular to thebottom plate 11, and thefirst support plate 17 is substantially perpendicular to the twoside plates 13. Thefirst support plate 17 is slanted relative to thebottom plate 11. Asupport flange 12 is located on each of the twoside plates 13 above thebottom plate 11, to support the firstheat dissipating member 20. In an embodiment, the support flange on each of the twoside plates 13 is substantially perpendicular to each of the twoside plates 13 and parallel to thebottom plate 11. - The heat dissipating device further comprises a
retaining plate 30. Theretaining plate 30 is located on thesupport flange 12 on each of the twoside plates 13, for supporting the firstheat dissipating member 20. Each of thesupport flange 12 defines a plurality of first fixing holes 1211 (shown inFIG. 2 ), and theretaining plate 30 defines a plurality ofsecond fixing holes 312 at opposite ends. When a plurality of first fasteners, such as screws, are fixed into the plurality offirst fixing holes 1211 and the plurality ofsecond fixing holes 312, theretaining plate 30 is secured to thesupport flanges 12. A space 100 (shown inFIGS. 1 and 6 ) is defined between theretaining plate 30 and thebottom plate 11. Theretaining plate 30 defines a plurality ofdrain holes 315. When water drops to theretaining plate 30, the accumulated water flows from theretaining plate 30 to thebottom plate 11 via the plurality ofdrain holes 315. - Two installing
pieces 33 extend from opposite ends of theretaining plate 30. Each of the two installingpieces 33 comprises apiece body 34 slantingly extending from theretaining plate 30 and amounting portion 35 substantially perpendicularly extending from thepiece body 34. Themounting portion 35 of each of the two installingpieces 33 defines twofirst mounting holes 351, and each of the twoside plates 13 defines twosecond mounting holes 133. When two second fasteners, such as screws, are fixed into the twofirst mounting holes 351 of each of the two installingpieces 33 and the twosecond mounting holes 133 of each of the twoside plates 13, each of the two installingpieces 33 is thereby secured to each of the twoside plates 13. - The heat dissipating device further comprises a
separated plate 50. Theseparated plate 50 is slanted relative to theretaining plate 30. Twolocking flanges 52 extend in opposite directions from a bottom edge and a top edge of theseparated plate 50. Each of the twolocking flanges 52 define a plurality offirst installing holes 521, and theretaining plate 30 defines a plurality ofsecond installing holes 311. When a plurality of third fasteners, such as screws, is inserted into the plurality of first installingholes 521 of one of the twolocking flanges 52 at the bottom edge and the plurality of second installingholes 311, theseparated plate 50 is thereby secured to theretaining plate 30. - Two
mounting pieces 21 are located on the firstheat dissipating member 20 at opposite sides. Each of the twomounting pieces 21 defines twofirst fastening holes 211, and each of the twoside plates 13 defines twosecond fastening holes 131. When twofourth fasteners 23, such as screws, are fastened into the twosecond fastening holes 131 of each of the twomounting pieces 21 and the twosecond fastening holes 131 of each of the twoside plates 13, the firstheat dissipating member 20 is thereby secured to the twoside plates 13. - The
chassis 10 further comprises asecond support plate 18. Thesecond support plate 18 is substantially parallel to thefirst support plate 17 and extends to thebottom plate 11. Thesecond support plate 18 and thebottom plate 11 secure a secondheat dissipating member 40, which is same as the first dissipatingmember 20. In an embodiment, the firstheat dissipating member 20 and the secondheat dissipating member 40 are heat exchangers. Theseparated plate 50 is located between thefirst support plate 17 and thesecond support plate 18. Ahandgrip 16 is secured to the twoside plates 13, to conveniently move thechassis 10, and thehandgrip 16 is located between thefirst support plate 17 and thesecond support plate 18. - Referring to
FIGS. 4-6 , when the heat dissipating device works, air also flows from theinput opening 19, and through thespace 100 and a second ventilation opening 183 of thesecond support plate 18, via the secondheat dissipating member 40, to the output opening 14. - It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
1. A heat dissipating device comprising:
a chassis comprising a bottom plate, two side plates located on the bottom plate, and a support plate; the chassis defining an input opening and an output opening between the two side plates; the bottom plate defining a through hole; the support plate defining a ventilation opening and being located between the two side plates and between the input opening and the output opening; and
a heat dissipating member being secured to the support plate, wherein
an air flow path is defined from the input opening, the ventilation opening, via the heat dissipating member, to the output opening, and an water exit path is defined from the heat dissipating member to the bottom plate and configured to flow water from the heat dissipating member out of the chassis via the through hole.
2. The heat dissipating device of claim 1 , wherein the bottom plate is concave, and the through hole is defined in a bottom of the bottom plate.
3. The heat dissipating device of claim 1 , wherein the support plate is slanted relative to the bottom plate.
4. The heat dissipating device of claim 1 , wherein the two side plates are substantially parallel to each other and perpendicular to the bottom plate, and the support plate is substantially perpendicular to the two side plates.
5. The heat dissipating device of claim 1 , wherein a support flange is located on each of the two side plates above the bottom plate, and the heat dissipating member is located on the support flange of each of the two side plates.
6. The heat dissipating device of claim 5 , wherein the support flange is substantially perpendicular to each of the two side plates and parallel to the bottom plate.
7. The heat dissipating device of claim 5 , further comprising a retaining plate, the retaining plate is located on the support flange of each of the two side plates, and the retaining plate supports the heat dissipating member.
8. The heat dissipating device of claim 7 , further comprising a separated plate secured to the retaining plate, wherein the separated plate is slanted relative to the retaining plate.
9. The heat dissipating device of claim 7 , wherein each of two installing pieces extends from each opposite edge of the retaining plate and is secured to each of the two side plates.
10. The heat dissipating device of claim 9 , wherein each of the two installing pieces comprises a piece body aslant extends from the retaining plate and a mounting portion substantially perpendicularly extends from the piece body, and the mounting portion of each of the two installing pieces is secured to each of the two side plates.
11. A heat dissipating device comprising:
a chassis comprising a bottom plate, two side plates located on the bottom plate, and a support plate; the chassis defining an input opening and an output opening between the two side plates; the support plate defining a ventilation opening and being located between the two side plates and between the input opening and the output opening; and
a heat dissipating member located on the support plate and the bottom plate, wherein
air is capable of flowing from the input opening, the ventilation opening, via the heat dissipating member, to the output opening, and water drops from the heat dissipating member to the bottom plate and flows out of the chassis along the bottom plate.
12. The heat dissipating device of claim 11 , wherein the bottom plate is concave, a through hole is defined in a bottom of the bottom plate, and the water flows out of the chassis via the through hole.
13. The heat dissipating device of claim 11 , wherein the support plate is slanted relative to the bottom plate.
14. The heat dissipating device of claim 11 , wherein the two side plates are substantially parallel to each other and perpendicular to the bottom plate, and the support plate is substantially perpendicular to the two side plates.
15. The heat dissipating device of claim 11 , wherein a support flange is located on each of the two side plates above the bottom plate, and the heat dissipating member is located on the support flange on each of the two side plates.
16. The heat dissipating device of claim 15 , wherein the support flange is substantially perpendicular to each of the two side plates and parallel to the bottom plate.
17. The heat dissipating device of claim 15 , further comprising a retaining plate, the retaining plate is located on the support flange on each of the two side plates, and the retaining plate supports the heat dissipating member.
18. The heat dissipating device of claim 17 , further comprising a separated plate secured to the retaining plate, wherein the separated plate is slanted relative to the retaining plate.
19. The heat dissipating device of claim 17 , wherein each of two installing pieces extends from each opposite edge of the retaining plate and is secured to each of the two side plates.
20. The heat dissipating device of claim 19 , wherein each of the two installing pieces comprises a piece body aslant extends from the retaining plate and a mounting portion substantially perpendicularly extends from the piece body, and the mounting portion of each of the two installing pieces is secured to each of the two side plates.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101268140A CN103379800A (en) | 2012-04-27 | 2012-04-27 | Radiating device |
CN201210126814.0 | 2012-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130288591A1 true US20130288591A1 (en) | 2013-10-31 |
Family
ID=49464175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/744,562 Abandoned US20130288591A1 (en) | 2012-04-27 | 2013-01-18 | Heat dissipating device |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130288591A1 (en) |
CN (1) | CN103379800A (en) |
TW (1) | TW201344140A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11357137B2 (en) * | 2020-07-02 | 2022-06-07 | Fang-Shou LEE | One-chambered constant pressure apparatus for liquid immersion cooling of servers |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3299660A (en) * | 1965-07-19 | 1967-01-24 | American Radiator & Standard | Air conditioner |
US3306070A (en) * | 1965-10-24 | 1967-02-28 | Carrier Corp | Air conditioning unit |
US3313120A (en) * | 1966-05-02 | 1967-04-11 | Carier Corp | Evaporative condenser |
US4403648A (en) * | 1979-06-11 | 1983-09-13 | Caterpillar Tractor Co. | Engine radiator support and guard assembly |
US6206085B1 (en) * | 1998-06-22 | 2001-03-27 | Carrier Corporation | Mounting of a heat exchanger in an air conditioner |
US6298906B1 (en) * | 1997-12-02 | 2001-10-09 | Caterpillar Inc. | Apparatus for securing and sealing a radiator to an engine cowling of a work machine |
US20040107723A1 (en) * | 2002-12-10 | 2004-06-10 | Lg Electronics Inc. | Air conditioner |
US6895770B1 (en) * | 2002-12-23 | 2005-05-24 | Kenneth J. Kaminski | Condensate secondary pan for a central air conditioning system |
US20070193562A1 (en) * | 2006-02-17 | 2007-08-23 | Betcher Scott A | Air heater with one-piece housing |
US7540320B1 (en) * | 2006-02-10 | 2009-06-02 | Thomas Middleton Semmes | High efficiency conditioning air apparatus |
US7793514B2 (en) * | 2006-01-20 | 2010-09-14 | Carrier Corporation | Method and system for horizontal coil condensate disposal |
US20110036541A1 (en) * | 2008-04-16 | 2011-02-17 | Mitsubishi Electric Corporation | Heat exchange ventilator |
US20120205068A1 (en) * | 2010-10-14 | 2012-08-16 | William Robert Martindale | High efficiency cascade-style heat exchanger |
US20140311175A1 (en) * | 2013-04-19 | 2014-10-23 | Lg Electronics Inc. | Air conditioner |
-
2012
- 2012-04-27 CN CN2012101268140A patent/CN103379800A/en active Pending
- 2012-05-02 TW TW101115651A patent/TW201344140A/en unknown
-
2013
- 2013-01-18 US US13/744,562 patent/US20130288591A1/en not_active Abandoned
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3299660A (en) * | 1965-07-19 | 1967-01-24 | American Radiator & Standard | Air conditioner |
US3306070A (en) * | 1965-10-24 | 1967-02-28 | Carrier Corp | Air conditioning unit |
US3313120A (en) * | 1966-05-02 | 1967-04-11 | Carier Corp | Evaporative condenser |
US4403648A (en) * | 1979-06-11 | 1983-09-13 | Caterpillar Tractor Co. | Engine radiator support and guard assembly |
US6298906B1 (en) * | 1997-12-02 | 2001-10-09 | Caterpillar Inc. | Apparatus for securing and sealing a radiator to an engine cowling of a work machine |
US6206085B1 (en) * | 1998-06-22 | 2001-03-27 | Carrier Corporation | Mounting of a heat exchanger in an air conditioner |
US20040107723A1 (en) * | 2002-12-10 | 2004-06-10 | Lg Electronics Inc. | Air conditioner |
US6895770B1 (en) * | 2002-12-23 | 2005-05-24 | Kenneth J. Kaminski | Condensate secondary pan for a central air conditioning system |
US7793514B2 (en) * | 2006-01-20 | 2010-09-14 | Carrier Corporation | Method and system for horizontal coil condensate disposal |
US7540320B1 (en) * | 2006-02-10 | 2009-06-02 | Thomas Middleton Semmes | High efficiency conditioning air apparatus |
US20070193562A1 (en) * | 2006-02-17 | 2007-08-23 | Betcher Scott A | Air heater with one-piece housing |
US20110036541A1 (en) * | 2008-04-16 | 2011-02-17 | Mitsubishi Electric Corporation | Heat exchange ventilator |
US20120205068A1 (en) * | 2010-10-14 | 2012-08-16 | William Robert Martindale | High efficiency cascade-style heat exchanger |
US20140311175A1 (en) * | 2013-04-19 | 2014-10-23 | Lg Electronics Inc. | Air conditioner |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11357137B2 (en) * | 2020-07-02 | 2022-06-07 | Fang-Shou LEE | One-chambered constant pressure apparatus for liquid immersion cooling of servers |
Also Published As
Publication number | Publication date |
---|---|
TW201344140A (en) | 2013-11-01 |
CN103379800A (en) | 2013-10-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8514574B2 (en) | Heat dissipating apparatus | |
US20120327589A1 (en) | Computer system with airflow guiding duct | |
US8749975B2 (en) | Computer system with airflow guiding duct | |
US8462497B2 (en) | Computer system | |
US8248786B2 (en) | Heat sink type module | |
US8144459B2 (en) | Heat dissipating system with fan module | |
US8659894B2 (en) | Computer system with heat dissipation apparatus | |
US8941986B2 (en) | Computer system | |
US8757970B2 (en) | Fan bracket and fan fixing apparatus using the same | |
US8811013B2 (en) | Mounting apparatus for fan | |
US20130163191A1 (en) | Computer system with air duct | |
US9155222B2 (en) | Electronic device | |
US8737060B2 (en) | Computer system with airflow guiding duct | |
US20120120595A1 (en) | Computer system with airflow guiding duct | |
US9058159B2 (en) | Electronic device with air guiding duct | |
US20130148297A1 (en) | Electronic device with air duct | |
US20120044641A1 (en) | Electronic device | |
US8587942B2 (en) | Heat dissipating apparatus and electronic device with heat dissipating apparatus | |
US9030816B2 (en) | Mounting apparatus for fan | |
US20130288591A1 (en) | Heat dissipating device | |
US8804329B2 (en) | Computer system including a heat dissipating apparatus | |
US20140102670A1 (en) | Heat dissipating apparatus | |
US20130010420A1 (en) | Bracket for expansion card and electronic device having the same | |
US20140185236A1 (en) | Cooling module and computer enclosure using the same | |
US8240363B2 (en) | Heat dissipation apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YANG, XU;REEL/FRAME:029654/0267 Effective date: 20130116 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YANG, XU;REEL/FRAME:029654/0267 Effective date: 20130116 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |