US20130076424A1 - System and method for reducing cross coupling effects - Google Patents
System and method for reducing cross coupling effects Download PDFInfo
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- US20130076424A1 US20130076424A1 US13/242,469 US201113242469A US2013076424A1 US 20130076424 A1 US20130076424 A1 US 20130076424A1 US 201113242469 A US201113242469 A US 201113242469A US 2013076424 A1 US2013076424 A1 US 2013076424A1
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- input signal
- bus line
- inverter
- delay element
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
- G06F13/4072—Drivers or receivers
- G06F13/4077—Precharging or discharging
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/14—Handling requests for interconnection or transfer
- G06F13/20—Handling requests for interconnection or transfer for access to input/output bus
- G06F13/28—Handling requests for interconnection or transfer for access to input/output bus using burst mode transfer, e.g. direct memory access DMA, cycle steal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
- G06F13/4072—Drivers or receivers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
- G06F13/4291—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus using a clocked protocol
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/353—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of field-effect transistors with internal or external positive feedback
- H03K3/356—Bistable circuits
- H03K3/356069—Bistable circuits using additional transistors in the feedback circuit
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/353—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of field-effect transistors with internal or external positive feedback
- H03K3/356—Bistable circuits
- H03K3/356104—Bistable circuits using complementary field-effect transistors
- H03K3/356113—Bistable circuits using complementary field-effect transistors using additional transistors in the input circuit
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
- H03K5/15—Arrangements in which pulses are delivered at different times at several outputs, i.e. pulse distributors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Definitions
- the present disclosure is generally related to reducing cross coupling effects.
- wireless computing devices such as portable wireless telephones, personal digital assistants (PDAs), and paging devices that are small, lightweight, and easily carried by users.
- portable wireless telephones such as cellular telephones and internet protocol (IP) telephones
- IP internet protocol
- wireless telephones can communicate voice and data packets over wireless networks.
- many such wireless telephones include other types of devices that are incorporated therein.
- a wireless telephone can also include a digital still camera, a digital video camera, a digital recorder, and an audio file player.
- such wireless telephones can process executable instructions, including software applications, such as a web browser application, that can be used to access the Internet. As such, these wireless telephones can include significant computing capabilities.
- bus lines e.g., wires
- the energy to charge the coupling capacitance may change due to relative switching activity between the bus lines. For example, when signals on two adjacent bus lines switch in the same direction at the same time, the voltage difference between the bus lines, and thus the energy to charge the coupling capacitance, may be about zero.
- the voltage change may be V and the energy to charge the coupling capacitance may be equal to 1 ⁇ 2C c V 2 Joules, where C c is the effective capacitance between the bus lines and V is the voltage amplitude.
- Systems and methods are disclosed that slow down (e.g., by increasing a switching delay) a rising edge of a switching signal (i.e., producing a delayed low-to-high transition) and speed up (e.g., by reducing a switching delay) a falling edge of a switching signal (i.e., producing a high-to-low transition), or vice versa, on proximately close bus lines.
- a driver circuit may be coupled to one or more such adjacent or proximately close bus lines, where the driver circuit implements a first delay and a second delay.
- the first delay may be in response to a high-to-low transition (e.g., in response to a signal transition from a logical ‘1’ to a logical ‘0’) and the second delay may be in response to a low-to-high transition (e.g., in response to a signal transition from a logical ‘0’ to a logical ‘1’).
- the first and second delays may be chosen such that the difference between the first and second delays is sufficient to reduce power related to transmission of signals over the adjacent bus lines. By varying signal switching delays on adjacent bus lines, the energy dissipation due to the switching may be reduced.
- the driver circuits may include a delay element that implements the first and second delay.
- the delay element may be a skewed inverter, a level shifter, a latch, or a sense amplifier.
- a device may include a plurality of driver circuits coupled to a plurality of bus lines.
- a first driver circuit of the plurality of driver circuits may be coupled to a first bus line of the plurality of bus lines.
- the first driver circuit may include a delay element configured to produce an output signal.
- the output signal may transition after a first delay in response to a first digital value transition of an input signal from high to low and may transition after a second delay in response to a second digital value transition of the input signal from low to high.
- the first delay may be different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line.
- the delay element may prevent signals on the first and second bus lines from switching at the same time, potentially reducing the energy required to switch the bus lines.
- the delay element may include a skewed inverter, a level shifter, a latch, or a sense amplifier.
- a second driver circuit including the delay element may be coupled to the second bus line (i.e., the second bus line may also include the delay element).
- all of the plurality driver circuits coupled to the plurality of bus lines may include the delay element.
- a method may include receiving a first input signal at a delay element coupled to a first bus line of a plurality of bus lines.
- the first input signal has a first digital value transition from high to low.
- the method further includes generating a first output signal at the delay element in response to the first input signal, where the first output signal transitions after a first delay.
- the method further includes receiving a second input signal at the delay element.
- the second input signal has a second digital value transition from low to high.
- the method further includes generating a second output signal at the delay element, where the second output signal transitions after a second delay.
- the delay element is configured to produce the output signal which transitions after the first delay in response to the first digital value transition of the input signal from high to low and transitions after the second delay in response to the second digital value transition of the input signal from low to high.
- the first delay may be different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line.
- the delay element may prevent signals on the first and second bus lines from switching at the same time, potentially reducing the energy required to switch the bus lines.
- the delay element may include a skewed inverter, a level shifter, a latch, or a sense amplifier.
- an apparatus in another particular embodiment, includes means for delaying an output signal at a first bus line of a plurality of bus lines based on a digital value transition of an input signal at the first bus line.
- the output signal transitions after a first delay in response to a first digital value transition of the input signal from high to low and transitions after a second delay in response to a second digital value transition of the input signal from low to high.
- the first delay is different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line.
- the means for delaying comprises a skewed inverter, a level shifter, a latch, or a sense amplifier.
- One particular advantage provided by at least one of the disclosed embodiments is a decrease in power dissipation due to cross coupling at adjacent bus lines or bus lines in close proximity.
- Another particular advantage provided by at least one of the disclosed embodiments is an increase in battery life of an electronic device due to the decrease in power dissipation.
- FIG. 1 is a block diagram of a particular illustrative embodiment of a system to reduce cross coupling effects on bus lines;
- FIG. 2 is a diagram of a particular illustrative embodiment of signal transitions at the system of FIG. 1 ;
- FIG. 3 is a diagram of a particular illustrative embodiment of a skewed inverter circuit that implements the delay element of FIG. 1 ;
- FIG. 4 is a diagram of another particular illustrative embodiment of a skewed inverter circuit that implements the delay element of FIG. 1 ;
- FIG. 5 is a diagram of a particular illustrative embodiment of a level shifter that implements the delay element of FIG. 1 ;
- FIG. 6 is a diagram of another particular illustrative embodiment of a level shifter that implements the delay element of FIG. 1 ;
- FIG. 7 is a diagram of a particular illustrative embodiment of a latch that implements the delay element of FIG. 1 ;
- FIG. 8 is a diagram of a particular illustrative embodiment of a sense amplifier that implements the delay element of FIG. 1 ;
- FIG. 9 is a flow chart of a particular illustrative embodiment of a method to reduce cross coupling effects on bus lines.
- FIG. 10 is a block diagram of a wireless device including a system to reduce cross coupling effects on bus lines.
- the system 100 includes a first component 120 coupled to a second component 130 via a plurality of bus lines 108 .
- Each of the bus lines 108 may be coupled to one of a plurality of driver circuits 104 .
- the first component 120 and the second component 130 are hardware components that are integrated into an electronic device, such as a wireless telephone.
- the first component 120 and the second component 130 may include components of the electronic device described with reference to FIG. 10 .
- a first driver circuit of the plurality of driver circuits 104 may be coupled to a first bus line (designated “1” in FIG. 1 ) of the plurality of bus lines 108 .
- the first driver circuit may include a delay element 106 , receive an input signal 102 , and produce an output signal 110 .
- the input signal 102 may be differential or single-ended.
- the delay element 106 may include one of a skewed inverter, a level shifter, a latch, and a sense amplifier.
- the input signal 102 and the output signal 110 may have the same logical value (e.g., may both be logical ‘1’ or both be logical ‘0’) or may have opposite logical values (e.g., one may be a logical ‘0’ and the other a logical ‘1’).
- the delay element 106 includes a skewed inverter circuit (e.g., as illustrated in FIGS. 3-4 )
- the output signal 110 may be the inverse of the input signal 102 .
- the delay element 106 may also receive a clock signal (not shown) and may produce the output signal 110 in response to a transition in the clock signal (e.g., as further described with reference to the latch of FIG. 7 ).
- the delay element 106 may be configured to produce the output signal 110 such that the output signal 110 transitions after a first delay in response to a first digital value transition of the input signal 102 from high to low and transitions after a second delay in response to a second digital value transition of the input signal 102 from low to high.
- the delay element 106 may have a delay in a transitioning from a logical “0” to a logical “1” that is different than a delay in transitioning from a logical “1” to a logical “0.”
- the first delay may be different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line (designated “2” in FIG. 1 ) in close physical proximity to the first bus line.
- the delay elements may prevent opposite signal transitions at the bus lines from occurring simultaneously, thereby reducing cross coupling effects (e.g., illustrated in phantom at 140 ) at the bus lines.
- FIG. 2 illustrates operation of the system 100 of FIG. 1 and is generally designated 200 .
- the first component 120 may transmit signals to the second component 130 via the plurality of bus lines 108 .
- the first component 120 may transmit the signals 102 , 202 across the adjacent first bus line and second bus line, respectively.
- the signals 102 and 202 may transition in opposite directions, as illustrated in FIG. 2 .
- driver circuits 104 coupled to the bus lines may delay corresponding output signals so as to reduce the effect of cross coupling between the bus lines.
- the driver circuits 104 of FIG. 1 may have a “fast rising” and “slow falling” output, such that a time difference between a transition in an input signal and a corresponding rise in a corresponding output signal is shorter than a time difference between a transition in the input signal and a corresponding fall in the corresponding output signal.
- the output signals 110 A and 210 A depict an implementation having a “fast rising” and “slow falling” output.
- the driver circuits 104 of FIG. 1 may implement “slow rising” and “fast falling” output, such that a time difference between a transition in an input signal and a corresponding rise in a corresponding output signal is longer than a time difference between a transition in the input signal and a corresponding fall in the corresponding output signal.
- the output signals 110 B and 210 B depict an implementation having a “slow rising” and “fast falling” output.
- a time difference T d corresponding to the difference in rising and falling delays may be selected such that the time difference T d is sufficient to reduce the effect of cross coupling between the bus lines.
- the time difference T d may be determined after experimentation during hardware design and based on simulation of an electronic device or system, such as the system 100 of FIG. 1 .
- the energy dissipated due to coupling capacitance may be 2C c V 2 .
- Such a time difference T d may be determined based on simulation and experimentation at adjacent bus lines. It should be noted that the time difference T d should be large enough to prevent signals in adjacent bus lines from switching in opposite directions at the same time, but also not too large as to unnecessarily slow down signals transitioning through the plurality of bus lines.
- the selected time difference T d may be implemented by introducing delay elements into the circuit.
- circuit elements having transistors whose switching delays can implement the time difference T d may be used.
- the time difference T d may be implemented as a number of picoseconds, a number of logic gate delays, or any other measure used by those having skill in the art.
- the system 100 of FIG. 1 may thus decrease power dissipation due to cross coupling at adjacent bus lines or bus lines in close proximity.
- the system 100 of FIG. 1 may provide an increase in battery life of an electronic device that includes the system 100 of FIG. 1 .
- FIG. 3 is a diagram of a particular illustrative embodiment of a skewed inverter circuit 300 that may be used to implement a delay function of the delay element 106 of FIG. 1 .
- the skewed inverter circuit 300 may receive the input signal 102 and may produce the output signal 110 .
- the skewed inverter circuit 300 may include a first inverter 304 , a second inverter 306 , and a NAND gate 308 .
- the first inverter 304 may receive the input signal 102 transmitted from the first component 120 of FIG. 1 .
- the second inverter 306 may receive an output of the first inverter 304 .
- the NAND gate 308 may receive the input signal 102 and an output of the second inverter 306 and may produce the output signal 110 .
- the output signal 110 produced by the skewed inverter circuit 300 i.e., an output at the NAND gate 308
- the NAND gate 308 may receive the input signal 102 via the inverters 304 , 306 at a first input 310 and may receive the input signal 102 directly at a second input 320 . Thus, any rises or falls in the input signal 102 may arrive at the second input 320 prior to arriving at the first input 310 . In response to a fall in the input signal 102 (e.g., from a logical ‘1’ to a logical ‘0’), the NAND gate 308 may produce a corresponding rise in the output signal 110 once the fall of the input signal 102 reaches the second input 320 .
- the NAND gate 308 may not produce a corresponding fall in the output signal 110 until the rise in the input signal 102 reaches both inputs 310 , 320 .
- the skewed inverter circuit 300 may thus produce a “fast rising, slow falling” output.
- the difference between the rise and fall times at the output signal 110 may be based on characteristics of the inverters 304 , 306 .
- FIG. 4 is a diagram of another particular illustrative embodiment of a skewed inverter circuit 400 that may be used to implement functionality of the delay element 106 of FIG. 1 .
- the skewed inverter circuit 400 may receive the input signal 102 and may produce the output signal 110 .
- the skewed inverter circuit 400 may include a first inverter 404 , a second inverter 406 , and a NOR gate 408 .
- the first inverter 404 may receive the input signal 102 transmitted from the first component 120 of FIG. 1 .
- the second inverter 406 may receive an output of the first inverter 404 .
- the NOR gate 408 may receive the input signal 102 and an output of the second inverter 406 and may produce the output signal 110 .
- the output signal 110 may be transmitted to the second component 130 of FIG. 1 via one of the bus lines 108 (e.g., the bus line designated ‘1’ in FIG. 1 ).
- the NOR gate 408 may receive the input signal 102 via the inverters 404 , 406 at a first input 410 and may receive the input signal 102 directly at a second input 420 . Thus, any rises or falls in the input signal 102 may arrive at the second input 420 prior to arriving at the first input 410 . In response to a rise in the input signal 102 (e.g., from a logical ‘0’ to a logical ‘1’), the NOR gate 408 may produce a corresponding fall in the output signal 110 once the rise of the input signal 102 reaches the second input 420 .
- the NOR gate 408 may not produce a corresponding rise in the output signal 110 until the fall in the input signal 102 reaches both inputs 410 , 420 .
- the skewed inverter circuit 400 may thus produce a “slow rising, fast falling” output.
- the difference between the rise and fall times at the output signal 110 may be based on characteristics of the inverters 404 , 406 .
- FIGS. 3-4 depict skewed inverter circuits that introduce 2 gates delay between rising and falling output, any number of gates delay may be implemented by adding or removing inverters and changing the logic gate accordingly. For example, two additional inverters may be inserted into the skewed inverter circuit 400 between the first inverter 404 and the second inverter 406 to implement four gates delay between rising and falling output.
- FIG. 5 is a diagram of a particular illustrative embodiment of a level shifter 500 that may be used to implement functionality of the delay element 106 of FIG. 1 .
- the level shifter 500 may receive the input signal 102 and may produce the output signal 110 .
- the level shifter 500 may include a first p-type field effect transistor (PFET) 506 , a second PFET 504 , a third PFET 516 , and a fourth PFET 514 .
- the level shifter 500 may also include a first n-type field effect transistor (NFET) 508 , a second NFET 518 , a first inverter 512 , and a second inverter 520 .
- the first PFET 506 may be coupled in series between the second PFET 504 and the first NFET 508 .
- the third PFET 516 may be coupled in series between the fourth PFET 514 and the second NFET 518 .
- the first NFET 508 may receive the input signal 102 transmitted from the first component 120 of FIG. 1 at a gate of the first NFET 508 .
- the input signal 102 may be coupled to a gate of the first PFET 506 and an inverse of the input signal 102 may be coupled to a gate of the third PFET 516 and to a gate of the second NFET 518 .
- a gate of the second PFET 504 may be coupled to a terminal of the third PFET 516 and to a terminal of the second NFET 518 .
- a gate of the fourth PFET 514 may be coupled to a terminal of the first PFET 506 , to a terminal of the first NFET 508 , and to the second inverter 520 which may generate the output signal 110 .
- a source voltage (e.g., VDD out ) may be coupled to a terminal of the second PFET 504 and to a terminal of the fourth PFET 514 .
- the same source voltage, VDD out may also be applied to the second inverter 520 .
- a terminal of the first NFET 508 and a terminal of the second NFET 518 may be coupled to ground or to another voltage lower than the source voltage VDD out .
- the output signal 110 produced by the level shifter 500 may be transmitted to the second component 130 of FIG. 1 via one of the bus lines 108 (e.g., the bus line designated ‘1’ in FIG. 1 ).
- the first NFET 604 may receive the input signal 102 transmitted from the first component 120 of FIG. 1 at a gate of the first NFET 604 .
- the input signal 102 may be coupled to an input of the fourth inverter 608
- the second NFET 612 may be coupled to an output of the fourth inverter 608 .
- a terminal of the first NFET 604 may be coupled to an output of the third inverter 606 and to an input of the first inverter 616 .
- An output of the first inverter 616 may be coupled to an input of the second inverter 614 , to an input of the third inverter 606 , and to a terminal of the second NFET 612 .
- the latch 700 may include a first n-type field effect transistor (NFET) 706 and a second NFET 716 . As illustrated in FIG. 7 , the first NFET 706 may be a “slow” NFET and the second NFET 716 may be a “fast” NFET.
- the latch 700 may also include a first inverter 712 , a second inverter 714 , a third inverter 718 , and a fourth inverter 708 . As illustrated in FIG.
- a gate of the fourth PFET 816 may be coupled to a gate of the fourth NFET 824 , a terminal of the sixth PFET 818 , and a terminal of the fifth NFET 826 .
- a gate of the sixth PFET 818 may be coupled to a gate of the fifth NFET 826 , a terminal of the fourth PFET 816 , and a terminal of the fourth NFET 824 .
- the sense amplifier 800 may include cross-coupled NAND gates 880 .
- the cross-coupled NAND gates 880 may include a first NAND gate 881 and a second NAND gate 882 .
- a first input of the first NAND gate 881 may be coupled to a node q 860 and may receive a signal produced at the node q 860 .
- a second input of the first NAND gate 881 may be coupled to an output of the second NAND gate 882 .
- a first input of the second NAND gate 882 may be coupled to an output of the first NAND gate 881 .
- a second input of the second NAND gate 882 may be coupled to a node nq 862 and may receive a signal produced at the node nq 862 .
- the output of the second NAND gate 882 may provide the output signal 110 of the sense amplifier 800 .
- the output signal 110 produced by the sense amplifier 800 i.e., the output at the second NAND gate 882
- the first NAND gate 881 may have a “slow rising” and “fast falling” output
- the second NAND gate 882 may have a “fast rising” and “slow falling” output.
- the cross-coupled NAND gates 880 are part of the sense amplifier 800 and coupled at nodes q 860 and nq 862 , and are shown separately from other components of the sense amplifier 800 merely for ease of illustration.
- the sense amplifier 800 may delay the output signal 110 so as to reduce power dissipation due to cross coupling with an adjacent bus line or bus lines in close proximity.
- the input signal 102 and the inverse 840 of the input signal 102 may be externally held high in a precharge state.
- the nodes q 860 and nq 862 , and internal nodes x 870 and nx 872 may also be precharged high.
- the cross-coupled NAND gates 880 (driven by the nodes q 860 and nq 862 ) may behave as inverters, thereby causing the output signal 110 of the sense amplifier 800 to maintain an initial state.
- the first component 120 may transmit the input signal 102 to the second component 130 via the plurality of bus lines 108 .
- the first bus line may be in close physical proximity to a second bus line.
- a first driver circuit including the delay element 106 may be coupled to the first bus line (e.g., designated ‘1’ in FIG. 1 ) that is in close physical proximity to the second bus line (e.g., designated ‘2’ in FIG. 1 ).
- the delay element 106 may receive the input signal 102 from the first component 120 .
- the delay element is implemented using a clocked circuit (e.g., the latch 700 of FIG. 7 or the sense amplifier 800 of FIG. 8 where the enable signal 850 is a clock signal)
- the method 900 may optionally include receiving a clock signal at the first driver circuit, at 915 .
- the method 900 includes detecting a digital value transition in the input signal 102 , at 920 .
- the delay element 106 may detect a digital value transition in the input signal 102 .
- the method 900 may optionally include detecting a transition on the clock signal, at 925 .
- the method 900 of FIG. 9 may reduce cross coupling at the bus lines by either delaying high to low digital value transitions more than low to high digital value transitions, or vice versa.
- the second bus line referenced in FIG. 9 may be coupled to a second driver circuit having a second delay element.
- the second delay element may receive a second input signal concurrently with the receipt of the input signal at the delay element, at 910 .
- the second delay element may produce a second output signal. Similar to the output signal produced at 940 , the second output signal may transition after the first delay when the second input signal transitions from low to high.
- the second output signal may transition after the second delay when the second input signal transitions from high to low.
- the delay element 1094 may be coupled to a first bus line of the plurality of bus lines 1090 and the delay element 1096 may be coupled to a second bus line of the plurality of bus lines 1090 . It should be noted that the delay elements may be coupled to any bus line (or all bus lines) in the device 1000 that is used to transmit signals between the various components of the device 1000 .
- the delay elements 1094 , 1096 may each be implemented by the skewed inverter circuit 300 of FIG. 3 , the skewed inverter circuit 400 of FIG. 4 , the level shifter 500 of FIG. 5 , the level shifter 600 of FIG. 6 , the latch 700 of FIG. 7 , or the sense amplifier 800 of FIG. 8 .
- FIG. 10 also shows a display controller 1026 that is coupled to the DSP 1064 and to a display 1028 .
- the coder/decoder (CODEC) 1034 can also be coupled to the DSP 1064 .
- a speaker 1036 and a microphone 1038 can be coupled to the CODEC 1034 .
- FIG. 10 also indicates that a wireless controller 1040 can be coupled to the DSP 1064 and to a wireless antenna 1042 .
- the DSP 1064 , the display controller 1026 , the memory 1032 , the CODEC 1034 , the wireless controller 1040 , and the driver circuits 1090 including the delay element 1094 are included in a system-in-package or system-on-chip device 1022 .
- an input device 1030 and a power supply 1044 are coupled to the system-on-chip device 1022 .
- FIG. 10 illustrates that a wireless controller 1040 can be coupled to the DSP 1064 and to a wireless antenna 1042 .
- the DSP 1064 , the display controller 1026 , the memory 1032 , the CODEC 1034 , the wireless controller 1040 , and the driver circuits 1090 including the delay element 1094 are included in a system-in-package or system-on-chip device 1022 .
- an input device 1030 and a power supply 1044 are coupled to the
- an apparatus includes means for delaying an output signal at a first bus line of a plurality of bus lines based on a digital value transition of an input signal at the first bus line.
- the means for delaying may be one of the driver circuits 104 of FIG. 1 , the delay element 106 of FIG. 1 , the skewed inverter circuit 300 of FIG. 3 , the skewed inverter circuit 400 of FIG. 4 , the level shifter 500 of FIG. 5 , the level shifter 600 of FIG. 6 , the latch 700 of FIG. 7 , the sense amplifier 800 of FIG. 8 , one of the driver circuits 1090 of FIG. 10 , the delay element 1094 of FIG. 10 , the delay element 1096 of FIG. 10 , one or more other devices configured to delay the output signal, or any combination thereof.
- the apparatus may also include means for providing the input signal to the means for delaying.
- the means for providing may include the first component 120 of FIG. 1 , a component of the device 1000 of FIG. 10 (e.g., the CODEC 1034 ), one or more devices configured to provide the input signal to the means for delaying, or any combination thereof.
- the output signal may transition after a first delay in response to a first digital value transition of the input signal from high to low and may transition after a second delay in response to a second digital value transition of the input signal from low to high.
- the first delay amount may be different from the second delay amount by an amount sufficient to reduce power related to transmission of a signal over the first bus line and over a second bus line in close physical proximity to the first bus line.
- a software module may reside in random access memory (RAM), flash memory, read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disk, a removable disk, a compact disc read-only memory (CD-ROM), or any other form of storage medium known in the art.
- An exemplary non-transitory (e.g. tangible) storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium.
- the storage medium may be integral to the processor.
- the processor and the storage medium may reside in an application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- the ASIC may reside in a computing device or a user terminal.
- the processor and the storage medium may reside as discrete components in a computing device or user terminal.
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Abstract
A device includes a plurality of driver circuits coupled to a plurality of bus lines. A first driver circuit of the plurality of driver circuits is coupled to a first bus line of the plurality of bus lines. The first driver circuit includes one of a skewed inverter, a level shifter, a latch, and a sense amplifier configured to produce an output signal that transitions after a first delay in response to a first digital value transition of an input signal from high to low and transitions after a second delay in response to a second digital value transition of the input signal from low to high. The first delay is different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line.
Description
- The present disclosure is generally related to reducing cross coupling effects.
- Advances in technology have resulted in smaller and more powerful computing devices. For example, there currently exist a variety of portable personal computing devices, including wireless computing devices, such as portable wireless telephones, personal digital assistants (PDAs), and paging devices that are small, lightweight, and easily carried by users. More specifically, portable wireless telephones, such as cellular telephones and internet protocol (IP) telephones, can communicate voice and data packets over wireless networks. Further, many such wireless telephones include other types of devices that are incorporated therein. For example, a wireless telephone can also include a digital still camera, a digital video camera, a digital recorder, and an audio file player. Also, such wireless telephones can process executable instructions, including software applications, such as a web browser application, that can be used to access the Internet. As such, these wireless telephones can include significant computing capabilities.
- As electronic devices such as wireless telephones become smaller, there may be a tradeoff between scaling technology and power dissipation of on-chip buses in the electronic devices. A substantial portion of the power dissipated by bus lines (e.g., wires) may be due to coupling capacitance between the bus lines (e.g., when the bus lines are adjacent). The energy to charge the coupling capacitance may change due to relative switching activity between the bus lines. For example, when signals on two adjacent bus lines switch in the same direction at the same time, the voltage difference between the bus lines, and thus the energy to charge the coupling capacitance, may be about zero. However, when the signal on one bus line switches while the signal on the other bus line remains the same, the voltage change may be V and the energy to charge the coupling capacitance may be equal to ½CcV2 Joules, where Cc is the effective capacitance between the bus lines and V is the voltage amplitude. Moreover, when the signals on the bus lines switch in opposite directions at the same time, the voltage change may be doubled (i.e. 2V) and the energy to switch the coupling capacitance may be equal to ½Cc(2V)2=2CcV2 Joules.
- Various techniques have been proposed for reducing power dissipated by adjacent bus lines. One technique involves shielding bus lines. However, this may not effectively address the increased power dissipation because line to line capacitance may still occur at supply nodes of the bus lines. Another technique is to increase spacing between bus lines. However, increasing the spacing between bus lines may result in an unacceptable increase in die area. Logical shielding has also been proposed. In logical shielding, adjacent signals that switch in opposite directions may be re-routed based on logical constraints. However, it may be difficult to locate logically mutually exclusive signals.
- Systems and methods are disclosed that slow down (e.g., by increasing a switching delay) a rising edge of a switching signal (i.e., producing a delayed low-to-high transition) and speed up (e.g., by reducing a switching delay) a falling edge of a switching signal (i.e., producing a high-to-low transition), or vice versa, on proximately close bus lines. A driver circuit may be coupled to one or more such adjacent or proximately close bus lines, where the driver circuit implements a first delay and a second delay. The first delay may be in response to a high-to-low transition (e.g., in response to a signal transition from a logical ‘1’ to a logical ‘0’) and the second delay may be in response to a low-to-high transition (e.g., in response to a signal transition from a logical ‘0’ to a logical ‘1’). The first and second delays may be chosen such that the difference between the first and second delays is sufficient to reduce power related to transmission of signals over the adjacent bus lines. By varying signal switching delays on adjacent bus lines, the energy dissipation due to the switching may be reduced. The driver circuits may include a delay element that implements the first and second delay. For example, the delay element may be a skewed inverter, a level shifter, a latch, or a sense amplifier.
- In a particular embodiment, a device may include a plurality of driver circuits coupled to a plurality of bus lines. A first driver circuit of the plurality of driver circuits may be coupled to a first bus line of the plurality of bus lines. The first driver circuit may include a delay element configured to produce an output signal. The output signal may transition after a first delay in response to a first digital value transition of an input signal from high to low and may transition after a second delay in response to a second digital value transition of the input signal from low to high. The first delay may be different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line. For example, the delay element may prevent signals on the first and second bus lines from switching at the same time, potentially reducing the energy required to switch the bus lines. The delay element may include a skewed inverter, a level shifter, a latch, or a sense amplifier. In addition, a second driver circuit including the delay element may be coupled to the second bus line (i.e., the second bus line may also include the delay element). Further, in a particular illustrative implementation, all of the plurality driver circuits coupled to the plurality of bus lines may include the delay element.
- In another particular embodiment, a method may include receiving a first input signal at a delay element coupled to a first bus line of a plurality of bus lines. The first input signal has a first digital value transition from high to low. The method further includes generating a first output signal at the delay element in response to the first input signal, where the first output signal transitions after a first delay. The method further includes receiving a second input signal at the delay element. The second input signal has a second digital value transition from low to high. The method further includes generating a second output signal at the delay element, where the second output signal transitions after a second delay. The delay element is configured to produce the output signal which transitions after the first delay in response to the first digital value transition of the input signal from high to low and transitions after the second delay in response to the second digital value transition of the input signal from low to high. The first delay may be different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line. For example, the delay element may prevent signals on the first and second bus lines from switching at the same time, potentially reducing the energy required to switch the bus lines. The delay element may include a skewed inverter, a level shifter, a latch, or a sense amplifier.
- In another particular embodiment, an apparatus includes means for delaying an output signal at a first bus line of a plurality of bus lines based on a digital value transition of an input signal at the first bus line. The output signal transitions after a first delay in response to a first digital value transition of the input signal from high to low and transitions after a second delay in response to a second digital value transition of the input signal from low to high. The first delay is different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line. The means for delaying comprises a skewed inverter, a level shifter, a latch, or a sense amplifier.
- One particular advantage provided by at least one of the disclosed embodiments is a decrease in power dissipation due to cross coupling at adjacent bus lines or bus lines in close proximity. Another particular advantage provided by at least one of the disclosed embodiments is an increase in battery life of an electronic device due to the decrease in power dissipation.
- Other aspects, advantages, and features of the present disclosure will become apparent after review of the entire application, including the following sections: Brief Description of the Drawings, Detailed Description, and the Claims.
-
FIG. 1 is a block diagram of a particular illustrative embodiment of a system to reduce cross coupling effects on bus lines; -
FIG. 2 is a diagram of a particular illustrative embodiment of signal transitions at the system ofFIG. 1 ; -
FIG. 3 is a diagram of a particular illustrative embodiment of a skewed inverter circuit that implements the delay element ofFIG. 1 ; -
FIG. 4 is a diagram of another particular illustrative embodiment of a skewed inverter circuit that implements the delay element ofFIG. 1 ; -
FIG. 5 is a diagram of a particular illustrative embodiment of a level shifter that implements the delay element ofFIG. 1 ; -
FIG. 6 is a diagram of another particular illustrative embodiment of a level shifter that implements the delay element ofFIG. 1 ; -
FIG. 7 is a diagram of a particular illustrative embodiment of a latch that implements the delay element ofFIG. 1 ; -
FIG. 8 is a diagram of a particular illustrative embodiment of a sense amplifier that implements the delay element ofFIG. 1 ; -
FIG. 9 is a flow chart of a particular illustrative embodiment of a method to reduce cross coupling effects on bus lines; and -
FIG. 10 is a block diagram of a wireless device including a system to reduce cross coupling effects on bus lines. - Referring to
FIG. 1 , a particular illustrative embodiment of a system to reduce cross coupling effects on bus lines is disclosed and generally designated 100. Thesystem 100 includes afirst component 120 coupled to asecond component 130 via a plurality ofbus lines 108. Each of thebus lines 108 may be coupled to one of a plurality ofdriver circuits 104. - In an illustrative embodiment, the
first component 120 and thesecond component 130 are hardware components that are integrated into an electronic device, such as a wireless telephone. For example, thefirst component 120 and thesecond component 130 may include components of the electronic device described with reference toFIG. 10 . - A first driver circuit of the plurality of
driver circuits 104 may be coupled to a first bus line (designated “1” inFIG. 1 ) of the plurality ofbus lines 108. The first driver circuit may include adelay element 106, receive aninput signal 102, and produce anoutput signal 110. Theinput signal 102 may be differential or single-ended. Thedelay element 106 may include one of a skewed inverter, a level shifter, a latch, and a sense amplifier. Depending on thedelay element 106, theinput signal 102 and theoutput signal 110 may have the same logical value (e.g., may both be logical ‘1’ or both be logical ‘0’) or may have opposite logical values (e.g., one may be a logical ‘0’ and the other a logical ‘1’). For example, if thedelay element 106 includes a skewed inverter circuit (e.g., as illustrated inFIGS. 3-4 ), theoutput signal 110 may be the inverse of theinput signal 102. In a particular embodiment, thedelay element 106 may also receive a clock signal (not shown) and may produce theoutput signal 110 in response to a transition in the clock signal (e.g., as further described with reference to the latch ofFIG. 7 ). Thedelay element 106 may be configured to produce theoutput signal 110 such that theoutput signal 110 transitions after a first delay in response to a first digital value transition of the input signal 102 from high to low and transitions after a second delay in response to a second digital value transition of the input signal 102 from low to high. For example, thedelay element 106 may have a delay in a transitioning from a logical “0” to a logical “1” that is different than a delay in transitioning from a logical “1” to a logical “0.” The first delay may be different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line (designated “2” inFIG. 1 ) in close physical proximity to the first bus line. For example, when thedelay element 106 is coupled to the first bus line and another delay element (not shown) is coupled to the second bus line, the delay elements may prevent opposite signal transitions at the bus lines from occurring simultaneously, thereby reducing cross coupling effects (e.g., illustrated in phantom at 140) at the bus lines. -
FIG. 2 illustrates operation of thesystem 100 ofFIG. 1 and is generally designated 200. During operation of thesystem 100 ofFIG. 1 , thefirst component 120 may transmit signals to thesecond component 130 via the plurality ofbus lines 108. For example, thefirst component 120 may transmit thesignals signals FIG. 2 . In response to the transitions in thesignals driver circuits 104 coupled to the bus lines may delay corresponding output signals so as to reduce the effect of cross coupling between the bus lines. - In a particular embodiment, the
driver circuits 104 ofFIG. 1 may have a “fast rising” and “slow falling” output, such that a time difference between a transition in an input signal and a corresponding rise in a corresponding output signal is shorter than a time difference between a transition in the input signal and a corresponding fall in the corresponding output signal. To illustrate, theoutput signals - Alternately, the
driver circuits 104 ofFIG. 1 may implement “slow rising” and “fast falling” output, such that a time difference between a transition in an input signal and a corresponding rise in a corresponding output signal is longer than a time difference between a transition in the input signal and a corresponding fall in the corresponding output signal. To illustrate, the output signals 110B and 210B depict an implementation having a “slow rising” and “fast falling” output. - A time difference Td corresponding to the difference in rising and falling delays may be selected such that the time difference Td is sufficient to reduce the effect of cross coupling between the bus lines. For example, the time difference Td may be determined after experimentation during hardware design and based on simulation of an electronic device or system, such as the
system 100 ofFIG. 1 . To illustrate, if the input signals 102 and 202 resulted in simultaneous opposite transitions in the output signals, the energy dissipated due to coupling capacitance may be 2CcV2. The time difference Td may be selected such that the simultaneous opposite transitions in the output signals instead become two successive instances of one output signal transitioning while the other remains constant (e.g., as illustrated by the output signal pairs 110A, 210A and 110B, 210B). Each of these instances may result in an energy dissipation of ½CcV2. Thus, the total energy due to coupling capacitance may be reduced from 2CcV2 to ½CcV2++½CcV2=CcV2. Such a time difference Td may be determined based on simulation and experimentation at adjacent bus lines. It should be noted that the time difference Td should be large enough to prevent signals in adjacent bus lines from switching in opposite directions at the same time, but also not too large as to unnecessarily slow down signals transitioning through the plurality of bus lines. - The selected time difference Td may be implemented by introducing delay elements into the circuit. For example, circuit elements having transistors whose switching delays can implement the time difference Td may be used. Accordingly, the time difference Td may be implemented as a number of picoseconds, a number of logic gate delays, or any other measure used by those having skill in the art. The
system 100 ofFIG. 1 may thus decrease power dissipation due to cross coupling at adjacent bus lines or bus lines in close proximity. In addition, thesystem 100 ofFIG. 1 may provide an increase in battery life of an electronic device that includes thesystem 100 ofFIG. 1 . -
FIG. 3 is a diagram of a particular illustrative embodiment of askewed inverter circuit 300 that may be used to implement a delay function of thedelay element 106 ofFIG. 1 . The skewedinverter circuit 300 may receive theinput signal 102 and may produce theoutput signal 110. - The skewed
inverter circuit 300 may include afirst inverter 304, asecond inverter 306, and aNAND gate 308. In a particular embodiment, thefirst inverter 304 may receive theinput signal 102 transmitted from thefirst component 120 ofFIG. 1 . Thesecond inverter 306 may receive an output of thefirst inverter 304. TheNAND gate 308 may receive theinput signal 102 and an output of thesecond inverter 306 and may produce theoutput signal 110. Theoutput signal 110 produced by the skewed inverter circuit 300 (i.e., an output at the NAND gate 308) may be transmitted to thesecond component 130 ofFIG. 1 via one of the bus lines of the plurality of bus lines 108 (e.g., the bus line designated ‘1’ inFIG. 1 ). - During operation, the
NAND gate 308 may receive theinput signal 102 via theinverters first input 310 and may receive theinput signal 102 directly at asecond input 320. Thus, any rises or falls in theinput signal 102 may arrive at thesecond input 320 prior to arriving at thefirst input 310. In response to a fall in the input signal 102 (e.g., from a logical ‘1’ to a logical ‘0’), theNAND gate 308 may produce a corresponding rise in theoutput signal 110 once the fall of theinput signal 102 reaches thesecond input 320. However, in response to a rise in the input signal 102 (e.g., from a logical ‘0’ to a logical ‘1’), theNAND gate 308 may not produce a corresponding fall in theoutput signal 110 until the rise in theinput signal 102 reaches bothinputs inverter circuit 300 may thus produce a “fast rising, slow falling” output. The difference between the rise and fall times at theoutput signal 110 may be based on characteristics of theinverters -
FIG. 4 is a diagram of another particular illustrative embodiment of askewed inverter circuit 400 that may be used to implement functionality of thedelay element 106 ofFIG. 1 . The skewedinverter circuit 400 may receive theinput signal 102 and may produce theoutput signal 110. - The skewed
inverter circuit 400 may include afirst inverter 404, asecond inverter 406, and a NORgate 408. In a particular embodiment, thefirst inverter 404 may receive theinput signal 102 transmitted from thefirst component 120 ofFIG. 1 . Thesecond inverter 406 may receive an output of thefirst inverter 404. The NORgate 408 may receive theinput signal 102 and an output of thesecond inverter 406 and may produce theoutput signal 110. Theoutput signal 110 may be transmitted to thesecond component 130 ofFIG. 1 via one of the bus lines 108 (e.g., the bus line designated ‘1’ inFIG. 1 ). - During operation, the NOR
gate 408 may receive theinput signal 102 via theinverters first input 410 and may receive theinput signal 102 directly at asecond input 420. Thus, any rises or falls in theinput signal 102 may arrive at thesecond input 420 prior to arriving at thefirst input 410. In response to a rise in the input signal 102 (e.g., from a logical ‘0’ to a logical ‘1’), the NORgate 408 may produce a corresponding fall in theoutput signal 110 once the rise of theinput signal 102 reaches thesecond input 420. However, in response to a fall in the input signal 102 (e.g., from a logical ‘1’ to a logical ‘0’), the NORgate 408 may not produce a corresponding rise in theoutput signal 110 until the fall in theinput signal 102 reaches bothinputs inverter circuit 400 may thus produce a “slow rising, fast falling” output. The difference between the rise and fall times at theoutput signal 110 may be based on characteristics of theinverters FIGS. 3-4 depict skewed inverter circuits that introduce 2 gates delay between rising and falling output, any number of gates delay may be implemented by adding or removing inverters and changing the logic gate accordingly. For example, two additional inverters may be inserted into the skewedinverter circuit 400 between thefirst inverter 404 and thesecond inverter 406 to implement four gates delay between rising and falling output. -
FIG. 5 is a diagram of a particular illustrative embodiment of alevel shifter 500 that may be used to implement functionality of thedelay element 106 ofFIG. 1 . For example, thelevel shifter 500 may receive theinput signal 102 and may produce theoutput signal 110. - The
level shifter 500 may include a first p-type field effect transistor (PFET) 506, asecond PFET 504, athird PFET 516, and afourth PFET 514. Thelevel shifter 500 may also include a first n-type field effect transistor (NFET) 508, asecond NFET 518, afirst inverter 512, and asecond inverter 520. Thefirst PFET 506 may be coupled in series between thesecond PFET 504 and thefirst NFET 508. Thethird PFET 516 may be coupled in series between thefourth PFET 514 and thesecond NFET 518. - In a particular embodiment, the
first NFET 508 may receive theinput signal 102 transmitted from thefirst component 120 ofFIG. 1 at a gate of thefirst NFET 508. In addition, theinput signal 102 may be coupled to a gate of thefirst PFET 506 and an inverse of theinput signal 102 may be coupled to a gate of thethird PFET 516 and to a gate of thesecond NFET 518. A gate of thesecond PFET 504 may be coupled to a terminal of thethird PFET 516 and to a terminal of thesecond NFET 518. A gate of thefourth PFET 514 may be coupled to a terminal of thefirst PFET 506, to a terminal of thefirst NFET 508, and to thesecond inverter 520 which may generate theoutput signal 110. A source voltage (e.g., VDDout) may be coupled to a terminal of thesecond PFET 504 and to a terminal of thefourth PFET 514. The same source voltage, VDDout may also be applied to thesecond inverter 520. A terminal of thefirst NFET 508 and a terminal of thesecond NFET 518 may be coupled to ground or to another voltage lower than the source voltage VDDout. Theoutput signal 110 produced by the level shifter 500 (i.e., the output at the second inverter 520) may be transmitted to thesecond component 130 ofFIG. 1 via one of the bus lines 108 (e.g., the bus line designated ‘1’ inFIG. 1 ). - During operation of the
level shifter 500, in response to transitions in the input signal 102 (e.g., from a logical ‘1’ to a logical ‘0’ or vice versa), thelevel shifter 500 may delay theoutput signal 110 by an amount of time so as to reduce power dissipation due to cross coupling with an adjacent bus line or bus lines in close proximity. - To illustrate, the
level shifter 500 may detect a rising edge in theinput signal 102. In response, the input to the gate of thefourth PFET 514 and the input to thesecond inverter 520 may fall, resulting in a relatively “fast rising”output signal 110. In contrast, when thelevel shifter 500 detects a falling edge in theinput signal 102, the input to the gates of thesecond NFET 518 and thethird PFET 516 may rise, causing the input to the gate of thesecond PFET 504 to fall. This may result in the input to the gate of thefourth PFET 514 and thesecond inverter 520 to rise, causing a relatively “slow falling”output signal 110. In a particular embodiment, a rise in theinput signal 102 may be a logical ‘0’ to logical ‘1’ transition and a fall in theinput signal 102 may be a logical ‘1’ to logical ‘0’ transition. - Thus, by coupling driver circuits that each include the
level shifter 500 to adjacent bus lines, the effect of cross coupling due to concurrent signal transitions in opposite directions may be reduced. -
FIG. 6 is a diagram of another particular illustrative embodiment of alevel shifter 600 that may be used to implement functionality of thedelay element 106 ofFIG. 1 . For example, thelevel shifter 600 may receive theinput signal 102 and may produce theoutput signal 110. - The
level shifter 600 may include a first n-type field effect transistor (NFET) 604 and asecond NFET 612. As illustrated inFIG. 6 , thefirst NFET 604 may be a “slow” NFET (e.g., may have a relatively long channel, a relatively high threshold voltage, or a relatively narrow width) and thesecond NFET 612 may be a “fast” NFET (e.g., may have a relatively short channel, a relatively low threshold voltage, or a relatively large width). Thelevel shifter 600 may also include afirst inverter 616, asecond inverter 614, athird inverter 606, and afourth inverter 608. As illustrated inFIG. 6 , thefirst inverter 616 may have a “slow rising” output. Thesecond inverter 614 and thefourth inverter 608 may have a “fast rising” and “slow falling” output (e.g., similar to the skewedinverter circuit 300 ofFIG. 3 ). Thefirst inverter 616 may be coupled to thesecond inverter 614. Thethird inverter 606 may be coupled to thefirst inverter 616. Thefourth inverter 608 may be coupled between thefirst NFET 604 and thesecond NFET 612. - In a particular embodiment, the
first NFET 604 may receive theinput signal 102 transmitted from thefirst component 120 ofFIG. 1 at a gate of thefirst NFET 604. Theinput signal 102 may be coupled to an input of thefourth inverter 608, and thesecond NFET 612 may be coupled to an output of thefourth inverter 608. A terminal of thefirst NFET 604 may be coupled to an output of thethird inverter 606 and to an input of thefirst inverter 616. An output of thefirst inverter 616 may be coupled to an input of thesecond inverter 614, to an input of thethird inverter 606, and to a terminal of thesecond NFET 612. An output of thesecond inverter 614 may provide theoutput signal 110 of thelevel shifter 600. A source voltage (e.g., VDDout) may be applied to thefirst inverter 616, to thesecond inverter 614, and to thethird inverter 606. Another source voltage (e.g., VDDin) may be applied to the fourth inverter. A terminal of thefirst NFET 604 and a terminal of thesecond NFET 612 may be coupled to ground or to another voltage lower than either of the source voltages VDDin and VDDout. Theoutput signal 110 produced by the level shifter 600 (i.e., the output at the second inverter 614) may be transmitted to thesecond component 130 ofFIG. 1 via one of the bus lines 108 (e.g., the bus line designated ‘1’ inFIG. 1 ). - During operation of the
level shifter 600, in response to transitions in the input signal 102 (e.g., from a logical ‘1’ to a logical ‘0’ or vice versa), thelevel shifter 600 may delay theoutput signal 110 so as to reduce power dissipation due to cross coupling with an adjacent bus line or bus lines in close proximity. - To illustrate, the
level shifter 600 may detect a falling edge in theinput signal 102. In response, the input to the gate of thesecond NFET 612 may rise, causing the input to thesecond inverter 614 and input to thethird inverter 606 to fall. This may result in a relatively “fast rising”output signal 110. In contrast, when thelevel shifter 600 detects a rising edge in theinput signal 102, the input to thefirst inverter 616 may fall, causing the input to thesecond inverter 614 and input to thethird inverter 606 to rise relatively slowly. This may result in a relatively “slow falling”output signal 110. Thus, by coupling driver circuits that each include thelevel shifter 600 to adjacent bus lines, the effect of cross coupling due to concurrent signal transitions in opposite directions may be reduced. -
FIG. 7 is a diagram of a particular illustrative embodiment of alatch 700 that may be used to implement functionality of thedelay element 106 ofFIG. 1 . For example, thelatch 700 may receive theinput signal 102 and may produce theoutput signal 110. Thelatch 700 may also receive a clock (CLK)signal 704. - The
latch 700 may include a first n-type field effect transistor (NFET) 706 and asecond NFET 716. As illustrated inFIG. 7 , thefirst NFET 706 may be a “slow” NFET and thesecond NFET 716 may be a “fast” NFET. Thelatch 700 may also include afirst inverter 712, asecond inverter 714, athird inverter 718, and afourth inverter 708. As illustrated inFIG. 7 , thesecond inverter 714 may have a “slow rising” output and thethird inverter 718 may have a “fast rising” and “slow falling” output (e.g., similar to the skewedinverter circuit 300 ofFIG. 3 ). - In a particular embodiment, the
second NFET 716 may receive theinput signal 102 transmitted from thefirst component 120 ofFIG. 1 at a terminal of thesecond NFET 716. In addition, an inverse of the input signal from thefourth inverter 708 may be coupled to a terminal of thefirst NFET 706. TheCLK signal 704 may be coupled to a gate of thefirst NFET 706 and to a gate of thesecond NFET 716. Thefirst NFET 706 may be coupled to an output of thefirst inverter 712 and to an input of thesecond inverter 714. Thesecond NFET 716 may be coupled to an output of thesecond inverter 714, to an input of thefirst inverter 712, and to an input of thethird inverter 718. An output of thethird inverter 718 may provide theoutput signal 110 of thelatch 700. Theoutput signal 110 produced by the latch 700 (i.e., the output at the third inverter 718) may be transmitted to thesecond component 130 ofFIG. 1 via one of the bus lines 108 (e.g., the bus line designated ‘1’ inFIG. 1 ). - During operation of the
latch 700, in response to transitions in the input signal 102 (e.g., from a logical ‘1’ to a logical ‘0’ or vice versa), thelatch 700 may delay theoutput signal 110 so as to reduce power dissipation due to cross coupling with an adjacent bus line or bus lines in close proximity. - To illustrate, the
latch 700 may detect a falling edge of theinput signal 102. When thelatch 700 subsequently detects a rising edge in theinput signal 102 while theCLK signal 704 is a logic high (which represents an enable signal for the latch 700), the input to thefirst inverter 712 and the input to thethird inverter 718 may fall, resulting in a relatively “fast rising”output signal 110. In contrast, when thelatch 700 detects a falling edge in theinput signal 102 while theCLK signal 704 is a logic high, the input to thesecond inverter 714 may fall, causing the input to thefirst inverter 712 and the input to thethird inverter 718 to rise relatively slowly. This may result in a relatively “slow falling”output signal 110. Thus, by coupling driver circuits that each include thelatch 700 to adjacent bus lines, the effect of cross coupling due to concurrent signal transitions in opposite directions may be reduced. -
FIG. 8 is a diagram of a particular illustrative embodiment of asense amplifier 800 that may be used to implement functionality of thedelay element 106 ofFIG. 1 . For example, thesense amplifier 800 may receive a differential input (e.g., theinput signal 102 and aninverse 840 of the input signal 102) and may produce theoutput signal 110. Thesense amplifier 800 may also receive an enable signal 850 (e.g., a clock signal). - The
sense amplifier 800 may include a first n-type field effect transistor (NFET) 828 coupled in series between a first p-type field effect transistor (PFET) 812 and asecond NFET 832. The sense amplifier may also include athird NFET 830 coupled in series between asecond PFET 822 and thesecond NFET 832. Athird PFET 814 and afourth PFET 816 may each be coupled in series with thefirst NFET 828 via afourth NFET 824. Afifth PFET 820 and asixth PFET 818 may each be coupled in series with thethird NFET 830 via afifth NFET 826. The enablesignal 850 may be coupled to a gate of thefirst PFET 812, a gate of thesecond PFET 822, a gate of thethird PFET 814, a gate of thefifth PFET 820, and a gate of thesecond NFET 832. Theinput signal 102 may be coupled to a gate of thethird NFET 830, and theinverse 840 of theinput signal 102 may be coupled to a gate of thefirst NFET 828. In a particular embodiment, thethird NFET 830 may receive theinput signal 102 transmitted from thefirst component 120 ofFIG. 1 at a gate of thethird NFET 830. In addition, a gate of thefourth PFET 816 may be coupled to a gate of thefourth NFET 824, a terminal of thesixth PFET 818, and a terminal of thefifth NFET 826. Similarly, a gate of thesixth PFET 818 may be coupled to a gate of thefifth NFET 826, a terminal of thefourth PFET 816, and a terminal of thefourth NFET 824. - In addition, the
sense amplifier 800 may includecross-coupled NAND gates 880. Thecross-coupled NAND gates 880 may include afirst NAND gate 881 and asecond NAND gate 882. A first input of thefirst NAND gate 881 may be coupled to anode q 860 and may receive a signal produced at thenode q 860. A second input of thefirst NAND gate 881 may be coupled to an output of thesecond NAND gate 882. A first input of thesecond NAND gate 882 may be coupled to an output of thefirst NAND gate 881. A second input of thesecond NAND gate 882 may be coupled to anode nq 862 and may receive a signal produced at thenode nq 862. The output of thesecond NAND gate 882 may provide theoutput signal 110 of thesense amplifier 800. Theoutput signal 110 produced by the sense amplifier 800 (i.e., the output at the second NAND gate 882) may be transmitted to thesecond component 130 ofFIG. 1 via one of the bus lines 108 (e.g., the bus line designated ‘1’ inFIG. 1 ). As illustrated inFIG. 8 , thefirst NAND gate 881 may have a “slow rising” and “fast falling” output, and thesecond NAND gate 882 may have a “fast rising” and “slow falling” output. It should be noted that thecross-coupled NAND gates 880 are part of thesense amplifier 800 and coupled atnodes q 860 and nq 862, and are shown separately from other components of thesense amplifier 800 merely for ease of illustration. - During operation of the
sense amplifier 800, in response to transitions in the inputs signal 102 (e.g., from a logical ‘1’ to a logical ‘0’ or vice versa), thesense amplifier 800 may delay theoutput signal 110 so as to reduce power dissipation due to cross coupling with an adjacent bus line or bus lines in close proximity. - To illustrate, when the
sense amplifier 800 detects a ‘0’ value in the enable signal 850, theinput signal 102 and theinverse 840 of theinput signal 102 may be externally held high in a precharge state. Thenodes q 860 and nq 862, and internal nodes x 870 andnx 872 may also be precharged high. The cross-coupled NAND gates 880 (driven by thenodes q 860 and nq 862) may behave as inverters, thereby causing theoutput signal 110 of thesense amplifier 800 to maintain an initial state. During a read operation in which theinput signal 102 begins to discharge (e.g., exhibit a falling edge), the nodes nx 870 and nq 862 may remain high when the enable signal 850 is asserted. This may cause the signal at the node x 870 to fall, which causes the output signal at thenode q 860 to fall. The delay between the assertion of the enable signal 850 and a rise of theoutput signal 110 may be relatively fast, whereas a delay between the assertion of the enable signal 850 and a fall of theoutput signal 110 may be relatively slow. Thus, by coupling driver circuits that each include thesense amplifier 800 to adjacent bus lines, the effect of cross coupling due to concurrent signal transitions in opposite directions may be reduced. - Referring to
FIG. 9 , a particular illustrative embodiment of a method to reduce cross coupling effects on bus lines is disclosed and generally designated 900. In an illustrative embodiment, themethod 900 may be performed at thesystem 100 ofFIG. 1 , and may use any of the skewedinverter circuit 300 ofFIG. 3 , the skewedinverter circuit 400 ofFIG. 4 , thelevel shifter 500 ofFIG. 5 , thelevel shifter 600 ofFIG. 6 , thelatch 700 ofFIG. 7 , and thesense amplifier 800 ofFIG. 8 . - The
method 900 includes receiving an input signal at a first driver circuit of a plurality of driver circuits, at 910. In a particular embodiment, the first driver circuit includes adelay element 106 that is implemented using a skewed inverter circuit (e.g., the skewedinverter circuit 300 ofFIG. 3 or the skewedinverter circuit 400 ofFIG. 4 ), a level shifter (e.g., thelevel shifter 500 ofFIG. 5 or thelevel shifter 600 ofFIG. 6 ), a latch (e.g., thelatch 700 ofFIG. 7 ), or a sense amplifier (e.g., thesense amplifier 800 ofFIG. 8 ). The first driver circuit may be coupled to a first bus line of a plurality of bus lines. For example, inFIG. 1 , thefirst component 120 may transmit theinput signal 102 to thesecond component 130 via the plurality ofbus lines 108. Further, the first bus line may be in close physical proximity to a second bus line. A first driver circuit including thedelay element 106 may be coupled to the first bus line (e.g., designated ‘1’ inFIG. 1 ) that is in close physical proximity to the second bus line (e.g., designated ‘2’ inFIG. 1 ). Thedelay element 106 may receive the input signal 102 from thefirst component 120. When the delay element is implemented using a clocked circuit (e.g., thelatch 700 ofFIG. 7 or thesense amplifier 800 ofFIG. 8 where the enable signal 850 is a clock signal), themethod 900 may optionally include receiving a clock signal at the first driver circuit, at 915. - The
method 900 includes detecting a digital value transition in theinput signal 102, at 920. For example, inFIG. 1 , thedelay element 106 may detect a digital value transition in theinput signal 102. When the first driver circuit receives the clock signal at 915, themethod 900 may optionally include detecting a transition on the clock signal, at 925. - The
method 900 further includes determining the direction of the digital value transition, at 930. When the direction of the digital value transition is from low to high, themethod 900 may include producing an output signal after a first delay, at 940. For example, as illustrated inFIG. 2 , theoutput signal method 900 may include producing the output signal after a second delay that is different from the first delay, at 950. For example, as illustrated inFIG. 2 , theoutput signal FIG. 2 , the time difference Td may be selected to reduce cross coupling between the first and second bus lines. - It should be noted that the
method 900 ofFIG. 9 may reduce cross coupling at the bus lines by either delaying high to low digital value transitions more than low to high digital value transitions, or vice versa. For example, the second bus line referenced inFIG. 9 may be coupled to a second driver circuit having a second delay element. The second delay element may receive a second input signal concurrently with the receipt of the input signal at the delay element, at 910. The second delay element may produce a second output signal. Similar to the output signal produced at 940, the second output signal may transition after the first delay when the second input signal transitions from low to high. In addition, similar to the output signal produced at 950, the second output signal may transition after the second delay when the second input signal transitions from high to low. - Referring to
FIG. 10 , a block diagram of a particular illustrative embodiment of a wireless device that includes a system to reduce cross couplings effect at bus lines is depicted and generally designated 1000. Thedevice 1000 includes a processor, such as a digital signal processor (DSP) 1064, coupled to amemory 1032. The device may also includedriver circuits 1090 includingrespective delay elements delay element 1094 may be coupled to a first bus line of the plurality ofbus lines 1090 and thedelay element 1096 may be coupled to a second bus line of the plurality ofbus lines 1090. It should be noted that the delay elements may be coupled to any bus line (or all bus lines) in thedevice 1000 that is used to transmit signals between the various components of thedevice 1000. In an illustrative embodiment, thedelay elements inverter circuit 300 ofFIG. 3 , the skewedinverter circuit 400 ofFIG. 4 , thelevel shifter 500 ofFIG. 5 , thelevel shifter 600 ofFIG. 6 , thelatch 700 ofFIG. 7 , or thesense amplifier 800 ofFIG. 8 . -
FIG. 10 also shows adisplay controller 1026 that is coupled to theDSP 1064 and to adisplay 1028. The coder/decoder (CODEC) 1034 can also be coupled to theDSP 1064. Aspeaker 1036 and amicrophone 1038 can be coupled to theCODEC 1034. -
FIG. 10 also indicates that awireless controller 1040 can be coupled to theDSP 1064 and to awireless antenna 1042. In a particular embodiment, theDSP 1064, thedisplay controller 1026, thememory 1032, theCODEC 1034, thewireless controller 1040, and thedriver circuits 1090 including thedelay element 1094 are included in a system-in-package or system-on-chip device 1022. In a particular embodiment, aninput device 1030 and apower supply 1044 are coupled to the system-on-chip device 1022. Moreover, in a particular embodiment, as illustrated inFIG. 10 , thedisplay 1028, theinput device 1030, thespeaker 1036, themicrophone 1038, thewireless antenna 1042, and thepower supply 1044 are external to the system-on-chip device 1022. However, each of thedisplay 1028, theinput device 1030, thespeaker 1036, themicrophone 1038, thewireless antenna 1042, and thepower supply 1044 can be coupled to a component of the system-on-chip device 1022, such as an interface or a controller. - In conjunction with the described embodiments, an apparatus is disclosed that includes means for delaying an output signal at a first bus line of a plurality of bus lines based on a digital value transition of an input signal at the first bus line. For example, the means for delaying may be one of the
driver circuits 104 ofFIG. 1 , thedelay element 106 ofFIG. 1 , the skewedinverter circuit 300 ofFIG. 3 , the skewedinverter circuit 400 ofFIG. 4 , thelevel shifter 500 ofFIG. 5 , thelevel shifter 600 ofFIG. 6 , thelatch 700 ofFIG. 7 , thesense amplifier 800 ofFIG. 8 , one of thedriver circuits 1090 ofFIG. 10 , thedelay element 1094 ofFIG. 10 , thedelay element 1096 ofFIG. 10 , one or more other devices configured to delay the output signal, or any combination thereof. - The apparatus may also include means for providing the input signal to the means for delaying. For example, the means for providing may include the
first component 120 ofFIG. 1 , a component of thedevice 1000 ofFIG. 10 (e.g., the CODEC 1034), one or more devices configured to provide the input signal to the means for delaying, or any combination thereof. The output signal may transition after a first delay in response to a first digital value transition of the input signal from high to low and may transition after a second delay in response to a second digital value transition of the input signal from low to high. The first delay amount may be different from the second delay amount by an amount sufficient to reduce power related to transmission of a signal over the first bus line and over a second bus line in close physical proximity to the first bus line. - Those of skill would further appreciate that the various illustrative logical blocks, configurations, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. Various illustrative components, blocks, configurations, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
- The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in random access memory (RAM), flash memory, read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disk, a removable disk, a compact disc read-only memory (CD-ROM), or any other form of storage medium known in the art. An exemplary non-transitory (e.g. tangible) storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an application-specific integrated circuit (ASIC). The ASIC may reside in a computing device or a user terminal. In the alternative, the processor and the storage medium may reside as discrete components in a computing device or user terminal.
- The previous description of the disclosed embodiments is provided to enable a person skilled in the art to make or use the disclosed embodiments. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the principles defined herein may be applied to other embodiments without departing from the scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope possible consistent with the principles and novel features as defined by the following claims.
Claims (20)
1. A device comprising:
a plurality of driver circuits coupled to a plurality of bus lines, wherein a first driver circuit of the plurality of driver circuits is coupled to a first bus line of the plurality of bus lines and wherein the first driver circuit includes a delay element configured to produce an output signal that transitions after a first delay in response to a first digital value transition of an input signal from high to low and transitions after a second delay in response to a second digital value transition of the input signal from low to high, the first delay different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line,
wherein the delay element comprises a skewed inverter, a level shifter, a latch, or a sense amplifier.
2. The device of claim 1 , wherein the first driver circuit receives a clock signal and wherein the delay element is further configured to produce the output signal after detecting a transition in the clock signal.
3. The device of claim 1 , wherein the delay element comprises a skewed inverter.
4. The device of claim 3 , wherein the skewed inverter comprises:
a first inverter that receives the input signal;
a second inverter that receives an output of the first inverter; and
a logic gate that receives the input signal and receives an output of the second inverter to produce the output signal.
5. The device of claim 4 , wherein the logic gate is a NAND gate or a NOR gate.
6. The device of claim 1 , wherein the amount is at least thirty picoseconds.
7. The device of claim 1 , wherein the amount is at least fifty picoseconds.
8. The device of claim 1 , wherein the amount is at least two logic gates delay.
9. The device of claim 1 , wherein the amount is at least three logic gates delay.
10. The device of claim 1 , wherein the delay element comprises a level shifter.
11. The device of claim 1 , wherein the delay element comprises a latch.
12. The device of claim 1 , wherein the delay element is a sense amplifier.
13. A method comprising:
receiving a first input signal at a delay element coupled to a first bus line of a plurality of bus lines, wherein the first input signal has a first digital value transition from high to low;
generating a first output signal at the delay element in response to the first input signal, wherein the first output signal transitions after a first delay;
receiving a second input signal at the delay element, wherein the second input signal has a second digital value transition from low to high; and
generating a second output signal at the delay element, wherein the second output signal transitions after a second delay, wherein the first delay is different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line, and
wherein the delay element comprises a skewed inverter, a level shifter, a latch, or a sense amplifier.
14. The method of claim 13 , further comprising:
receiving a third input signal at a second delay element coupled to the second bus line concurrently with receiving the first input signal at the first delay element; and
generating a third output signal at the second delay element.
15. The method of claim 13 , wherein the amount is at least fifty picoseconds.
16. The method of claim 13 , wherein the amount is at least two logic gates delay.
17. The method of claim 13 , wherein the amount is at least three logic gates delay.
18. An apparatus comprising:
means for delaying an output signal at a first bus line of a plurality of bus lines based on a digital value transition of an input signal at the first bus line; and
wherein the output signal transitions after a first delay in response to a first digital value transition of the input signal from high to low and transitions after a second delay in response to a second digital value transition of the input signal from low to high, the first delay different from the second delay by an amount sufficient to reduce power related to transmission of signals over the first bus line and over a second bus line in close physical proximity to the first bus line,
wherein the means for delaying comprises a skewed inverter, a level shifter, a latch, or a sense amplifier.
19. The apparatus of claim 18 , further comprising means for providing the input signal to the means for delaying, wherein the means for providing comprises a component of an electronic device.
20. The apparatus of claim 18 , wherein the amount is at least fifty picoseconds or at least two logic gates delay.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/242,469 US20130076424A1 (en) | 2011-09-23 | 2011-09-23 | System and method for reducing cross coupling effects |
JP2014532079A JP5930434B2 (en) | 2011-09-23 | 2012-09-24 | System and method for reducing cross-coupling effects |
EP12779196.0A EP2758887B1 (en) | 2011-09-23 | 2012-09-24 | System and method for reducing cross coupling effects |
KR1020147010926A KR101559436B1 (en) | 2011-09-23 | 2012-09-24 | System and method for reducing cross coupling effects |
PCT/US2012/056954 WO2013044254A1 (en) | 2011-09-23 | 2012-09-24 | System and method for reducing cross coupling effects |
CN201280045551.9A CN103814366B (en) | 2011-09-23 | 2012-09-24 | System and method for reducing cross-coupling effect |
JP2015231635A JP6158277B2 (en) | 2011-09-23 | 2015-11-27 | System and method for reducing cross-coupling effects |
US15/045,282 US9785601B2 (en) | 2011-09-23 | 2016-02-17 | System and method for reducing cross coupling effects |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/242,469 US20130076424A1 (en) | 2011-09-23 | 2011-09-23 | System and method for reducing cross coupling effects |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/045,282 Division US9785601B2 (en) | 2011-09-23 | 2016-02-17 | System and method for reducing cross coupling effects |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130076424A1 true US20130076424A1 (en) | 2013-03-28 |
Family
ID=47089126
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/242,469 Abandoned US20130076424A1 (en) | 2011-09-23 | 2011-09-23 | System and method for reducing cross coupling effects |
US15/045,282 Expired - Fee Related US9785601B2 (en) | 2011-09-23 | 2016-02-17 | System and method for reducing cross coupling effects |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/045,282 Expired - Fee Related US9785601B2 (en) | 2011-09-23 | 2016-02-17 | System and method for reducing cross coupling effects |
Country Status (6)
Country | Link |
---|---|
US (2) | US20130076424A1 (en) |
EP (1) | EP2758887B1 (en) |
JP (2) | JP5930434B2 (en) |
KR (1) | KR101559436B1 (en) |
CN (1) | CN103814366B (en) |
WO (1) | WO2013044254A1 (en) |
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US20100037028A1 (en) * | 2008-08-07 | 2010-02-11 | Qualcomm Incorporated | Buffer Management Structure with Selective Flush |
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US9785601B2 (en) | 2011-09-23 | 2017-10-10 | Qualcomm Incorporated | System and method for reducing cross coupling effects |
US20150078096A1 (en) * | 2012-08-01 | 2015-03-19 | Renesas Electronics Corporation | Level shift circuit and semiconductor device |
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US9000821B2 (en) * | 2012-10-23 | 2015-04-07 | Mstar Semiconductor, Inc. | Asymmetric delay circuit |
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Also Published As
Publication number | Publication date |
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US9785601B2 (en) | 2017-10-10 |
WO2013044254A1 (en) | 2013-03-28 |
KR20140081834A (en) | 2014-07-01 |
US20160162432A1 (en) | 2016-06-09 |
EP2758887A1 (en) | 2014-07-30 |
JP6158277B2 (en) | 2017-07-05 |
KR101559436B1 (en) | 2015-10-12 |
CN103814366B (en) | 2017-06-16 |
CN103814366A (en) | 2014-05-21 |
EP2758887B1 (en) | 2018-01-17 |
JP2016042387A (en) | 2016-03-31 |
JP2014531673A (en) | 2014-11-27 |
JP5930434B2 (en) | 2016-06-08 |
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