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US20120067550A1 - Heat sink structure embedded with heat pipes - Google Patents

Heat sink structure embedded with heat pipes Download PDF

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Publication number
US20120067550A1
US20120067550A1 US12/887,953 US88795310A US2012067550A1 US 20120067550 A1 US20120067550 A1 US 20120067550A1 US 88795310 A US88795310 A US 88795310A US 2012067550 A1 US2012067550 A1 US 2012067550A1
Authority
US
United States
Prior art keywords
heat
groove
sink structure
heat pipe
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/887,953
Inventor
David Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIA CHERNE INDUSTRY Co Ltd
Original Assignee
CHIA CHERNE INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIA CHERNE INDUSTRY Co Ltd filed Critical CHIA CHERNE INDUSTRY Co Ltd
Priority to US12/887,953 priority Critical patent/US20120067550A1/en
Assigned to CHIA CHERNE INDUSTRY CO., LTD. reassignment CHIA CHERNE INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIH, DAVID
Publication of US20120067550A1 publication Critical patent/US20120067550A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink structure and particularly to a heat sink structure embedded with heat pipes.
  • a conventional heat sink includes a heat dissipation seat 1 and at least one heat pipe 3 .
  • the heat dissipation seat 1 is caved to form at least one groove 2 mating the number of the heat pipe 3 .
  • the groove 2 is plated with a layer of nickel through an electroless nickel process or sprayed with a layer of copper powder 5 (shown in the drawings).
  • the heat pipe 3 is filled with fluid (not shown in the drawings) which generates convection when being heated.
  • the convectional fluid provides excellent heat conductivity for the heat pipe 3 .
  • the heat pipe 3 is held in the groove 2 which is filled with a metal-filling adhesive 4 such as tin liquor to cover the heat pipe 3 .
  • Nickel or copper powder 5 serves as a bonding medium to increase adhesion force to allow the heat pipe 3 to be boned to the groove 2 through the metal-filling adhesive 4 .
  • the heat dissipation seat 1 embedded with the heat pipe 3 thus formed can quickly dissipate heat through rapid heat conduction of the heat pipe 3 and the large area of the heat dissipation seat 1 to prevent high temperature from occurring in local area and improve heat dissipation.
  • one side of the heat dissipation seat 1 that holds the heat pipe 3 (i.e. where the groove 2 is formed) usually is treated by polishing to remove the metal-filling adhesive 4 or copper powder 5 that is inadvertently attached thereon so that a smooth surface is formed to increase contact area and improve heat conduction.
  • the metal-filling adhesive 4 is a softer material (generally is formed by cooling and solidifying the heated and molten tin liquor), it cannot effectively protect the heat pipe 3 .
  • the heat pipe 3 is prone to be damaged during the polishing process and results in leakage of the fluid held in the heat pipe 3 that loses the rapid heat conduction capability. This could make the conventional heat sink dysfunctional for heat dissipation and not meeting requirement when in use.
  • the primary object of the present invention is to provide a protection means to prevent the heat pipe from being damaged by polishing and enable the heat pipe to perform rapid heat conduction function to maintain cooling effect of a heat sink.
  • the present invention provides a heat sink structure embedded with a heat pipe that includes a heat dissipation seat, at least one heat pipe, at least one covering sheet and a metal-filling adhesive.
  • the heat dissipation seat has a heat absorption surface and a heat dissipation surface.
  • the heat absorption surface is caved to form at least one groove to hold a bonding medium.
  • the heat pipe is held in the groove.
  • the groove is covered by the covering sheet.
  • the metal-filling adhesive is filled with the groove to securely bond the heat pipe and covering sheet through the bonding medium with enhanced adhesion force.
  • the heat pipe held in the groove and covered by the covering sheet, when the heat absorption surface of the heat dissipation seat is treated by polishing process, the heat pipe is protected by the covering sheet without being damaged.
  • the heat pipe can provide rapid heat conduction characteristic, and the heat sink embedded with the heat pipe can provide desired cooling effect to meet requirement when in use.
  • FIG. 1 is a schematic view of a conventional heat sink.
  • FIG. 2 is a perspective view of a conventional heat sink after polished.
  • FIG. 3 is a schematic view of the heat sink structure of the invention.
  • FIG. 4 is a perspective view of the heat sink of the invention after polished.
  • FIG. 5 is a sectional view taken on line A-A in FIG. 4 .
  • FIG. 6 is a schematic view of another embodiment of the invention.
  • FIG. 7 is a schematic view of yet another embodiment of the invention.
  • the present invention aims to provide a heat sink structure embedded with a heat pipe.
  • the heat sink structure includes a heat dissipation seat 10 , at least one heat pipe 20 A, at least one covering sheet 30 A and a metal-filling adhesive 40 .
  • the heat dissipation seat 10 has a heat absorption surface 11 and a heat dissipation surface 12 .
  • the heat dissipation surface 12 has a plurality of radiation fins 14 positioned upright thereon in a juxtaposed manner and spaced from each other with a gap 141 .
  • the radiation fins 14 have at least a notch 142 .
  • the heat absorption surface 11 is caved to form at least one groove 13 A.
  • two grooves 13 A are formed, but this is not the limitation.
  • Each groove 13 A is formed in a curved shape.
  • the grooves 13 A are arranged in a crossed fashion.
  • the groove 13 A on the heat absorption surface 11 holds a bonding medium 15 that may be made of copper powders (as shown in the drawings) or a nickel plating layer.
  • the copper powders are sprayed and laid uniformly on the heat absorption surface 11 and groove 13 A through a sand blasting process.
  • the nickel plating layer is formed on the heat absorption surface 11 and groove 13 A by immersing the heat dissipation seat 10 in nickel liquor through an electroless nickel process.
  • the heat pipe 20 A is formed in a semicircular shape with two sides formed respectively a circular surface 21 and a flat surface 22 .
  • the heat pipe 20 A is held in the groove 13 A with the circular surface 21 facing downwards to contact with the groove 13 A and the flat surface 22 facing upwards.
  • the covering sheet 30 A covers the groove 13 A.
  • the metal-filling adhesive 40 is filled with the groove 13 A and adhesion force thereof is enhanced through the bonding medium 15 to bond the heat pipe 20 A and the covering sheet 30 A securely.
  • the metal-filling adhesive 40 may be heated and molten tin liquor that is cooled and solidified to bond and firmly hold the heat pipe 20 A and covering sheet 30 A.
  • FIG. 6 for another embodiment of the invention in which the three grooves 13 B are juxtaposed on the heat absorption surface 11 to hold the heat pipes 20 B with corresponding shape and to be covered by the covering sheets 30 B with corresponding shape as well.
  • FIG. 7 for yet another embodiment of the invention in which the three grooves 13 C are juxtaposed on the heat absorption surface 11 .
  • Two of the three grooves 13 C on outer sides are formed in a curved shape concaved outwards.
  • the grooves 13 C hold the heat pipes 20 C with corresponding shape and are covered by covering sheets 30 C with corresponding shape as well.
  • the invention provides covering sheets 30 A, 30 B and 30 C above the heat pipes 20 A, 20 B and 20 C.
  • the covering sheets 30 A, 30 B and 30 C are made of harder material to protect the heat pipes 20 A, 20 B and 20 C from being damaged during polishing process.
  • the heat pipes 20 A, 20 B and 20 C can maintain their sealing characteristics to perform rapid heat conduction function.
  • the heat sink embedded with the heat pipes 20 A, 20 B and 20 C can achieve desired cooling effect to meet use requirement.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink structure embedded with a heat pipe includes a heat dissipation seat, at least one heat pipe, a metal-filling adhesive and at least one covering sheet. The heat dissipation seat has a heat absorption surface and a heat dissipation surface. The heat absorption surface has at least one groove to hold the heat pipe and a bonding medium. The groove is covered by the covering sheet. The metal-filling adhesive is filled with the groove to bond the heat pipe and covering sheet through the bonding medium that can increase adhesion force. The covering sheet covers the heat pipe from being damaged during polishing the heat absorption surface to maintain sealing characteristic of the heat pipe. Therefore, the heat pipe can provide rapid heat conduction effect to meet use requirement.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat sink structure and particularly to a heat sink structure embedded with heat pipes.
    • BACKGROUND OF THE INVENTION
  • Please refer to FIGS. 1 and 2, a conventional heat sink includes a heat dissipation seat 1 and at least one heat pipe 3. The heat dissipation seat 1 is caved to form at least one groove 2 mating the number of the heat pipe 3. The groove 2 is plated with a layer of nickel through an electroless nickel process or sprayed with a layer of copper powder 5 (shown in the drawings). The heat pipe 3 is filled with fluid (not shown in the drawings) which generates convection when being heated. The convectional fluid provides excellent heat conductivity for the heat pipe 3. The heat pipe 3 is held in the groove 2 which is filled with a metal-filling adhesive 4 such as tin liquor to cover the heat pipe 3. Nickel or copper powder 5 serves as a bonding medium to increase adhesion force to allow the heat pipe 3 to be boned to the groove 2 through the metal-filling adhesive 4.
  • The heat dissipation seat 1 embedded with the heat pipe 3 thus formed can quickly dissipate heat through rapid heat conduction of the heat pipe 3 and the large area of the heat dissipation seat 1 to prevent high temperature from occurring in local area and improve heat dissipation.
  • In the aforesaid conventional structure, in order to enhance heat conduction, one side of the heat dissipation seat 1 that holds the heat pipe 3 (i.e. where the groove 2 is formed) usually is treated by polishing to remove the metal-filling adhesive 4 or copper powder 5 that is inadvertently attached thereon so that a smooth surface is formed to increase contact area and improve heat conduction.
  • However, during the polishing process, due to the metal-filling adhesive 4 is a softer material (generally is formed by cooling and solidifying the heated and molten tin liquor), it cannot effectively protect the heat pipe 3. Hence the heat pipe 3 is prone to be damaged during the polishing process and results in leakage of the fluid held in the heat pipe 3 that loses the rapid heat conduction capability. This could make the conventional heat sink dysfunctional for heat dissipation and not meeting requirement when in use.
    • SUMMARY OF THE INVENTION
  • Therefore, the primary object of the present invention is to provide a protection means to prevent the heat pipe from being damaged by polishing and enable the heat pipe to perform rapid heat conduction function to maintain cooling effect of a heat sink.
  • To achieve the foregoing object, the present invention provides a heat sink structure embedded with a heat pipe that includes a heat dissipation seat, at least one heat pipe, at least one covering sheet and a metal-filling adhesive. The heat dissipation seat has a heat absorption surface and a heat dissipation surface. The heat absorption surface is caved to form at least one groove to hold a bonding medium. The heat pipe is held in the groove. The groove is covered by the covering sheet. The metal-filling adhesive is filled with the groove to securely bond the heat pipe and covering sheet through the bonding medium with enhanced adhesion force.
  • Therefore, with the heat pipe held in the groove and covered by the covering sheet, when the heat absorption surface of the heat dissipation seat is treated by polishing process, the heat pipe is protected by the covering sheet without being damaged. As a result, the heat pipe can provide rapid heat conduction characteristic, and the heat sink embedded with the heat pipe can provide desired cooling effect to meet requirement when in use.
  • The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic view of a conventional heat sink.
  • FIG. 2 is a perspective view of a conventional heat sink after polished.
  • FIG. 3 is a schematic view of the heat sink structure of the invention.
  • FIG. 4 is a perspective view of the heat sink of the invention after polished.
  • FIG. 5 is a sectional view taken on line A-A in FIG. 4.
  • FIG. 6 is a schematic view of another embodiment of the invention.
  • FIG. 7 is a schematic view of yet another embodiment of the invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 3, 4 and 5, the present invention aims to provide a heat sink structure embedded with a heat pipe. The heat sink structure includes a heat dissipation seat 10, at least one heat pipe 20A, at least one covering sheet 30A and a metal-filling adhesive 40. The heat dissipation seat 10 has a heat absorption surface 11 and a heat dissipation surface 12. The heat dissipation surface 12 has a plurality of radiation fins 14 positioned upright thereon in a juxtaposed manner and spaced from each other with a gap 141. The radiation fins 14 have at least a notch 142.
  • The heat absorption surface 11 is caved to form at least one groove 13A. In an embodiment, two grooves 13A are formed, but this is not the limitation. Each groove 13A is formed in a curved shape. The grooves 13A are arranged in a crossed fashion. The groove 13A on the heat absorption surface 11 holds a bonding medium 15 that may be made of copper powders (as shown in the drawings) or a nickel plating layer. The copper powders are sprayed and laid uniformly on the heat absorption surface 11 and groove 13A through a sand blasting process. The nickel plating layer is formed on the heat absorption surface 11 and groove 13A by immersing the heat dissipation seat 10 in nickel liquor through an electroless nickel process. The heat pipe 20A is formed in a semicircular shape with two sides formed respectively a circular surface 21 and a flat surface 22. The heat pipe 20A is held in the groove 13A with the circular surface 21 facing downwards to contact with the groove 13A and the flat surface 22 facing upwards.
  • The covering sheet 30A covers the groove 13A. The metal-filling adhesive 40 is filled with the groove 13A and adhesion force thereof is enhanced through the bonding medium 15 to bond the heat pipe 20A and the covering sheet 30A securely. In this embodiment, the metal-filling adhesive 40 may be heated and molten tin liquor that is cooled and solidified to bond and firmly hold the heat pipe 20A and covering sheet 30A.
  • Refer to FIG. 6 for another embodiment of the invention in which the three grooves 13B are juxtaposed on the heat absorption surface 11 to hold the heat pipes 20B with corresponding shape and to be covered by the covering sheets 30B with corresponding shape as well.
  • Refer to FIG. 7 for yet another embodiment of the invention in which the three grooves 13C are juxtaposed on the heat absorption surface 11. Two of the three grooves 13C on outer sides are formed in a curved shape concaved outwards. The grooves 13C hold the heat pipes 20C with corresponding shape and are covered by covering sheets 30C with corresponding shape as well.
  • As a conclusion, the invention provides covering sheets 30A, 30B and 30C above the heat pipes 20A, 20B and 20C. The covering sheets 30A, 30B and 30C are made of harder material to protect the heat pipes 20A, 20B and 20C from being damaged during polishing process. Thus the heat pipes 20A, 20B and 20C can maintain their sealing characteristics to perform rapid heat conduction function. As a result, the heat sink embedded with the heat pipes 20A, 20B and 20C can achieve desired cooling effect to meet use requirement.

Claims (8)

What is claimed is:
1. A heat sink structure embedded with a heat pipe, comprising:
a heat dissipation seat which includes a heat absorption surface and a heat dissipation surface, the heat absorption surface being caved to form at least one groove to hold a bonding medium;
at least one heat pipe held in the groove;
at least one covering sheet to cover the corresponding groove; and
a metal-filling adhesive filled with the groove to bond the heat pipe and the covering sheet through the bonding medium which increases adhesion force.
2. The heat sink structure of claim 1, wherein the heat dissipation surface includes a plurality of radiation fins located thereon.
3. The heat sink structure of claim 2, wherein the radiation fins are spaced from each other with a gap and positioned upright on the heat dissipation surface in a juxtaposed fashion.
4. The heat sink structure of claim 3, wherein the radiation fins are caved to form at least one notch.
5. The heat sink structure of claim 1, wherein the heat pipe is formed in a semicircular shape and includes a circular surface and a flat surface on two opposite sides, the circular surface facing downwards to contact with the groove and the flat surface facing upwards.
6. The heat sink structure of claim 1, wherein the groove includes two sets formed in a crossed fashion, each of the grooves being formed in a curved shape.
7. The heat sink structure of claim 1, wherein the groove includes three sets formed on the heat absorption surface in a juxtaposed fashion.
8. The heat sink structure of claim 7, wherein two of the three sets of the grooves on outer sides are respectively formed in a curved fashion concaved outwards.
US12/887,953 2010-09-22 2010-09-22 Heat sink structure embedded with heat pipes Abandoned US20120067550A1 (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130284406A1 (en) * 2011-01-07 2013-10-31 Nhk Spring Co., Ltd. Temperature control device and method of manufacturing the same
US20140217870A1 (en) * 2013-02-01 2014-08-07 Emerson Network Power - Embedded Computing, Inc. Method and device to provide uniform cooling in rugged environments
WO2014131589A1 (en) * 2013-02-26 2014-09-04 Siemens Aktiengesellschaft Converter cooling with phase change memory
US20150303866A1 (en) * 2012-10-25 2015-10-22 Anycasting Co., Ltd. Concentrating solar cell module panel having stiffness and concentrating photovoltaic generation system comprising same
JP2017072354A (en) * 2015-10-09 2017-04-13 崇賢 ▲黄▼ Heat sink
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20230320034A1 (en) * 2022-03-22 2023-10-05 Baidu Usa Llc Thermal management device for high density processing unit
US20230345669A1 (en) * 2022-04-20 2023-10-26 Quanta Computer Inc. Heat-Absorbing Chassis For Fan-Less Electronic Component
US20240074114A1 (en) * 2022-08-31 2024-02-29 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Heat dissipation device and manufacturing method therefor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6987668B2 (en) * 2000-12-20 2006-01-17 Hitachi, Ltd. Liquid cooling system and personal computer using thereof
US20070086196A1 (en) * 2005-10-18 2007-04-19 National Tsing Hua University Heat dissipation devices for and LED lamp set
US20070217153A1 (en) * 2006-03-14 2007-09-20 Cheng-Tien Lai Heat dissipation device
US20110005727A1 (en) * 2009-07-07 2011-01-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6987668B2 (en) * 2000-12-20 2006-01-17 Hitachi, Ltd. Liquid cooling system and personal computer using thereof
US20070086196A1 (en) * 2005-10-18 2007-04-19 National Tsing Hua University Heat dissipation devices for and LED lamp set
US20070217153A1 (en) * 2006-03-14 2007-09-20 Cheng-Tien Lai Heat dissipation device
US20110005727A1 (en) * 2009-07-07 2011-01-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and manufacturing method thereof

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130284406A1 (en) * 2011-01-07 2013-10-31 Nhk Spring Co., Ltd. Temperature control device and method of manufacturing the same
US20150303866A1 (en) * 2012-10-25 2015-10-22 Anycasting Co., Ltd. Concentrating solar cell module panel having stiffness and concentrating photovoltaic generation system comprising same
US11006548B2 (en) * 2013-02-01 2021-05-11 Smart Embedded Computing, Inc. Method and device to provide uniform cooling in rugged environments
US20140217870A1 (en) * 2013-02-01 2014-08-07 Emerson Network Power - Embedded Computing, Inc. Method and device to provide uniform cooling in rugged environments
WO2014131589A1 (en) * 2013-02-26 2014-09-04 Siemens Aktiengesellschaft Converter cooling with phase change memory
JP2017072354A (en) * 2015-10-09 2017-04-13 崇賢 ▲黄▼ Heat sink
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20230320034A1 (en) * 2022-03-22 2023-10-05 Baidu Usa Llc Thermal management device for high density processing unit
US12089370B2 (en) * 2022-03-22 2024-09-10 Baidu Usa Llc Thermal management device for high density processing unit
US20230345669A1 (en) * 2022-04-20 2023-10-26 Quanta Computer Inc. Heat-Absorbing Chassis For Fan-Less Electronic Component
US20240074114A1 (en) * 2022-08-31 2024-02-29 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Heat dissipation device and manufacturing method therefor

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Legal Events

Date Code Title Description
AS Assignment

Owner name: CHIA CHERNE INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHIH, DAVID;REEL/FRAME:025030/0849

Effective date: 20100823

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION