US20110291544A1 - Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof - Google Patents
Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof Download PDFInfo
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- US20110291544A1 US20110291544A1 US12/884,212 US88421210A US2011291544A1 US 20110291544 A1 US20110291544 A1 US 20110291544A1 US 88421210 A US88421210 A US 88421210A US 2011291544 A1 US2011291544 A1 US 2011291544A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/871—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
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- Y10T428/239—Complete cover or casing
Definitions
- the disclosure is related to a gas barrier substrate and a fabricating method thereof, and in particular to a package of an organic electro-luminescent device and a packaging method thereof.
- flexible substrates Compared with general rigid substrates, flexible substrates have applications in a wider range of areas. Flexible substrates have advantages such as flexibility, portability, compliance with safety standards, and wide range of applications, but they also have disadvantages such as inferior heat resistance, inferior water and oxygen resistance, inferior chemical resistance, and greater thermal expansion coefficients. Since conventional flexible substrates cannot completely block water vapor or oxygen, aging of electronic devices on the substrate is accelerated, thereby shorting the lifespan of the electronic devices. Commercial requirements are hence unable to be fulfilled. In order to make flexible substrates have better water vapor and oxygen resistance, conventional art has provided a flexible substrate with a gas barrier layer for enhancing reliability of the electronic devices. FIGS. 1 and 2 are illustrated and conventional flexible gas barrier substrate is described as follow.
- FIG. 1 is a schematic cross-sectional diagram of a conventional flexible gas barrier substrate.
- a conventional flexible gas barrier substrate 100 is generally fabricated on a carrier C and includes a substrate 110 and a gas barrier layer 120 .
- the gas barrier layer 120 only covers a top surface 110 a and a sidewall 110 b of the substrate 110 , and a bottom surface 110 c contacts the carrier C.
- the flexible gas barrier substrate 100 is detached from the carrier C, the bottom surface 110 c of the substrate 110 is exposed. Since the bottom surface 110 c of the substrate 110 is not covered by the gas barrier layer 120 , the flexible gas barrier substrate 100 warps seriously due to imbalance of stress.
- FIG. 2 is a schematic cross-sectional diagram of another conventional flexible gas barrier substrate. Please refer to FIG. 2 .
- a conventional flexible gas barrier substrate 200 is also fabricated on the carrier C and includes a substrate 210 , a first gas barrier layer 220 , and a second gas barrier layer 230 .
- the first gas barrier layer 220 only covers a bottom surface 210 c of the substrate 210
- the second gas barrier layer 230 covers a top surface 210 a and a sidewall 210 b of the substrate 210 and a sidewall 220 a of the first gas barrier layer 220 .
- the second gas barrier layer 230 is bonded with the sidewall 220 a of the first gas barrier layer 220 .
- the bonding strength between the second gas barrier layer 230 and the sidewall 220 a of the first gas barrier layer 220 is insufficient. Therefore, when the flexible gas barrier substrate 200 is bended, the second gas barrier layer 230 which covers the sidewall 210 b may be easily broken. Moreover, if the thickness of the first gas barrier layer 220 is increased for increasing the bonding strength between the second gas barrier layer 230 and the sidewall 220 a of the first gas barrier layer 220 , the overall thickness of the flexible gas barrier substrate 200 may increase.
- one of the issues focused on by developers is how to effectively improve the gas barrier characteristic of the flexible gas barrier substrate without increasing the overall thickness of the flexible gas barrier substrate.
- a gas barrier substrate which has good gas barrier abilities is provided herein.
- a fabricating method of a gas barrier substrate for fabricating a gas barrier substrate with good gas barrier abilities is provided herein.
- a package of an organic electro-luminescent device which has good reliability is also provided herein.
- a packaging method of an organic electro-luminescent device for ensuring good reliability of the organic electro-luminescent device is further provided herein.
- the disclosure provides a gas barrier substrate which includes a first gas barrier layer, a substrate, and a second gas barrier layer.
- the first gas barrier layer has a central bonding surface and a peripheral bonding surface which surrounds the central bonding surface.
- the substrate is bonded with the central bonding surface of the first gas barrier layer, and the second gas barrier layer entirely covers the substrate and the first gas barrier layer.
- the second gas barrier layer is bonded with the substrate and the peripheral bonding surface of the first gas barrier layer. A minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
- the disclosure provides a fabricating method of a gas barrier substrate, including: forming a de-bonding layer on a carrier; forming a lift-off layer on the carrier and the de-bonding layer, forming the first gas barrier layer on the lift-off layer, wherein the first gas barrier layer has the central bonding surface and the peripheral bonding surface which surrounds the central bonding surface; forming the substrate on the central bonding surface of the first gas barrier layer and bonding the substrate with the central bonding surface; and forming the second gas barrier layer to entirely cover the substrate and the first gas barrier layer, wherein the minimum distance from the edge of the substrate to the edge of the first gas barrier layer is greater than the thickness of the first gas barrier layer.
- the disclosure provides a package of an organic electro-luminescent device.
- the package includes a first gas barrier substrate, a second gas barrier substrate, and an organic electro-luminescent device.
- the first gas barrier substrate includes a first gas barrier layer, a first substrate, and a second gas barrier layer, wherein the first gas barrier layer has a first central bonding surface and a first peripheral bonding surface surrounding the first central bonding surface, the first substrate is bonded with the first central bonding surface of the first gas barrier layer, and the second gas barrier layer entirely covers the first substrate and the first gas barrier layer.
- the second gas barrier layer is bonded with the first substrate the first peripheral surface of the first gas barrier layer, and a minimum distance from an edge of the first substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
- the first gas barrier substrate is bonded with the second gas barrier substrate.
- the organic electro-luminescent device is disposed between the first gas barrier substrate and the second gas barrier substrate.
- the disclosure provides a packaging method of an organic electro-luminescent device, including: forming the organic electro-luminescent device on the first gas barrier substrate; providing the second gas barrier substrate; and bonding the first gas barrier substrate with the second gas barrier substrate, so that the organic electro-luminescent device is sealed between the first gas barrier substrate and the second gas barrier substrate, wherein at least one of the first gas barrier substrate and the second gas barrier substrate is fabricated by the above fabricating method of the gas barrier substrate.
- FIG. 1A is a schematic cross-sectional diagram of a conventional flexible gas barrier substrate.
- FIG. 2 is a schematic cross-sectional diagram of another conventional flexible gas barrier substrate.
- FIGS. 3A to 3E are schematic cross-sectional diagrams showing a process of fabricating a gas barrier substrate according to the first embodiment of the disclosure.
- FIGS. 3 D′ to 3 E′ are schematic cross-sectional diagrams showing another process of fabricating a gas barrier substrate.
- FIGS. 4A to 4E are schematic cross-sectional diagrams showing a process of fabricating a gas barrier substrate according to the second embodiment of the disclosure.
- FIGS. 4 D′ to 4 E′ are schematic cross-sectional diagrams showing another process of fabricating a gas barrier substrate.
- FIGS. 5A to 5E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the third embodiment of the disclosure.
- FIGS. 6A to 6E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the fourth embodiment of the disclosure.
- FIGS. 7A to 7E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the fifth embodiment of the disclosure.
- FIGS. 3A to 3E are schematic cross-sectional diagrams showing a process of fabricating a gas barrier substrate according to the first embodiment of the disclosure.
- a de-bonding layer DBL is formed on a carrier C, and a lift-off layer L is formed on the de-bonding layer DBL and the carrier C.
- the material of the de-bonding layer DBL is, for example, a parylene material
- the material of the lift-off layer L is, for example, polyimide or another material which is capable of being lift off from the de-bonding layer DBL.
- the de-bonding layer DBL may be formed by performing a surface treatment on a surface of the carrier C.
- the lift-off layer L may also be peeled off from the carrier C along with the de-bonding layer DBL.
- a first gas barrier layer GB 1 is formed on the lift-off layer L.
- the first gas barrier layer GB 1 has a central bonding surface S 1 and a peripheral bonding surface S 2 surrounding the central bonding surface S 1 .
- the first gas barrier layer GB 1 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by a plurality of thin films.
- the first gas barrier layer GB 1 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one spin-on glass (SOG) layer.
- the first gas barrier layer GB 1 is formed by one or more pairs of a silicon nitride layer and an SOG layer.
- the number and material of the first gas barrier layer GB 1 are not limited to the above configuration.
- a pre-formed substrate SUB is provided, and the pre-formed substrate SUB is bonded with the central bonding surface S 1 .
- the substrate SUB has a sidewall SW which is substantially perpendicular to the central bonding surface S 1 of the first gas barrier layer GB 1 .
- the material of the substrate SUB is, for example, polyimide or another flexible material.
- a second gas barrier layer GB 2 is formed to entirely cover the substrate SUB and the first gas barrier layer GB 1 , wherein the second gas barrier layer GB 2 is bonded with the substrate SUB and a peripheral bonding surface S 2 of the first gas barrier layer GB.
- a minimum distance D from an edge (i.e. the sidewall SW) of the substrate SUB to an edge of the first gas barrier layer GB 1 is greater than a thickness T of the first gas barrier layer GB 1 .
- the second gas barrier layer GB 2 which covers the first gas barrier layer GB 1 and the substrate SUB is, for example, a conformal thin film.
- the second gas barrier layer GB 2 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by multiple thin films.
- the second gas barrier layer GB 2 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer.
- the second gas barrier layer GB 2 is formed by one or more pairs of a silicon nitride layer and an SOG layer.
- the number and material of the second gas barrier layer GB 2 are not limited to the above configuration.
- the bonding strength between the first gas barrier layer GB 1 and the second gas barrier layer GB 2 is effectively improved. If the first gas barrier layer GB 1 and the second gas barrier layer GB 2 have similar materials or the same material, the bonding between the first gas barrier layer GB 1 and the second gas barrier layer GB 2 is a type of homogeneous bonding, which thus provides good bonding strength.
- the minimum distance D is greater than the thickness T of the first gas barrier layer GB 1 , compared with the conventional art ( FIG. 2 ), if water vapor is to permeate into the gas barrier substrate according to the present embodiment, a longer permeation path is required.
- a gas barrier substrate 300 is almost complete.
- the de-bonding layer DBL, the lift-off layer L, the first gas barrier layer GB 1 , and the second gas barrier layer GB 2 may be cut along cutting lines CL (as shown by the dashed lines CL in FIG. 3D ) so that the lift-off layer L is separated from the de-bonding layer DBL.
- the aforementioned cutting process is, for example, a laser cutting process or another suitable cutting process.
- the gas barrier substrate 300 includes the first gas barrier layer GB 1 , the substrate SUB, and the second gas barrier layer GB 2 .
- the first gas barrier layer GB 1 has the central bonding surface S 1 and the peripheral bonding surface S 2 which surrounds the central bonding surface S 1 .
- the substrate SUB is bonded with the central bonding surface S 1 of the first gas barrier layer GB 1 , and the second gas barrier layer GB 2 entirely covers the substrate SUB and the first gas barrier layer GB 1 .
- the second gas barrier layer GB 2 is bonded with the substrate SUB and the peripheral bonding surface S 2 of the first gas barrier layer GB 1 .
- a minimum distance D′ from the edge (which is the sidewall SW) of the substrate SUB to the edge of the first gas barrier layer GB 1 is greater than the thickness T of the first gas barrier layer GB 1 .
- the first gas barrier layer GB 1 and the second gas barrier layer GB 2 are each, for example, a flexible gas barrier layer, and the substrate SUB is, for example, a flexible substrate.
- the edge of the first gas barrier layer GB 1 is substantially aligned with the edge of the second gas barrier layer GB 2 .
- FIGS. 3 D′ to 3 E′ are schematic cross-sectional diagrams showing another process of fabricating a gas barrier substrate. Please refer to FIGS. 3D , 3 E, 3 D′, and 3 E′.
- the second gas barrier layer GB 2 which covers the first gas barrier layer GB 1 and the substrate SUB is a conformal thin film
- the second gas barrier layer GB 2 which covers the first gas barrier layer GB 1 and the substrate SUB is a thin film which has a flat top surface.
- FIGS. 4A to 4E are schematic cross-sectional diagrams showing a process of fabricating a gas barrier substrate according to the second embodiment of the disclosure. Please refer to FIGS. 4A to 4E .
- a fabricating method of a gas barrier substrate 400 is similar to that in the first embodiment. The main difference in between is that a substrate SUB′ according to the present embodiment has a tapered sidewall SW′, and an acute angle ⁇ is included between the tapered sidewall SW′ and the central bonding surface 51 .
- the substrate SUB′ is formed, for example, by coating.
- a material layer may first be coated on the central bonding surface S 1 .
- the material layer is then cured to form the substrate SUB′. Since the substrate SUB′ is formed by coating, the acute angle ⁇ is included between the sidewall SW′ of the substrate SUB′ and the central bonding surface S 1 .
- FIGS. 4 D′ to 4 E′ are schematic cross-sectional diagrams showing another process of fabricating a gas barrier substrate. Please refer to FIGS. 4D , 4 E, 4 D′, and 4 E′.
- the second gas barrier layer GB 2 which covers the first gas barrier layer GB 1 and the substrate SUB′ is a conformal thin film
- the second gas barrier layer GB 2 which covers the first gas barrier layer GB 1 and the substrate SUB′ is a thin film which has a flat top surface.
- FIGS. 5A to 5E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the third embodiment of the disclosure.
- a de-bonding layer DBL is formed on a carrier C, and a lift-off layer L is formed on the de-bonding layer DBL and the carrier C.
- the material of the de-bonding layer DBL is, for example, a parylene material
- the material of the lift-off layer L is, for example, polyimide or another material which is capable of being lift off from the de-bonding layer DBL.
- the de-bonding layer DBL may be formed by performing a surface treatment on the surface of the carrier C.
- the lift-off layer L may also be peeled off from the carrier C along with the de-bonding layer DBL.
- a third gas barrier layer GB 3 is formed on the lift-off layer L.
- the third gas barrier layer GB 3 has a second central bonding surface S 3 and a second peripheral bonding surface S 4 surrounding the second central bonding surface S 4 .
- the third gas barrier layer GB 3 is, for example, a single layer thin film (such as a single layer silicon nitride layer) or a stacked layer formed by multiple thin films.
- the third gas barrier layer GB 3 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer.
- the third gas barrier layer GB 3 is formed by one or more pairs of a silicon nitride layer and an SOG layer.
- the number and material of the third gas barrier layer GB 3 are not limited to the above configuration.
- the second substrate SUB 2 is provided, and the second substrate SUB 2 is bonded with the second central bonding surface S 3 .
- the material of the second substrate SUB 2 is, for example, polyimide or another flexible material.
- the lift-off layer L, the third gas barrier layer GB 3 , and the second substrate SUB 2 form a gas barrier substrate 500 .
- an organic electro-luminescent device OLED is formed on the second substrate SUB 2 .
- the organic electro-luminescent device OLED is, for example, an active organic electro-luminescent device or a passive organic electro-luminescent device.
- the organic electro-luminescent device OLED may be a display or a light source.
- the gas barrier substrate 300 is provided, and the gas barrier substrate 300 is bonded with the gas barrier substrate 500 , so that the organic electro-luminescent device OLED is sealed between the gas barrier substrate 300 and the gas barrier substrate 500 .
- the gas barrier substrate 300 and the gas barrier substrate 500 are bonded with each other by, for example, a frame adhesive 600 .
- a frit such as a glass frit may be used to replace the frame adhesive 600 , so that the gas barrier substrate 300 and the gas barrier substrate 500 are bonded with each other.
- the gas barrier substrate 300 shown in FIG. 3 E′ is used.
- the present embodiment does not limit the gas barrier substrate to be the one shown in FIG. 3 E′.
- the gas barrier substrate 300 or 400 shown in FIG. 3E , 4 E, or 4 E′ may also be used in the present embodiment.
- the de-bonding layer DBL, the lift-off layer L, and the third gas barrier layer GB 3 may be cut along the cutting lines CL (as shown by the dashed lines CL in FIG. 3 D′) so that the lift-off layer L is separated from the de-bonding layer DBL.
- the aforementioned cutting process is, for example, a laser cutting process or another suitable cutting process.
- the package of the organic electro-luminescent includes the gas barrier substrate 300 , the gas barrier substrate 500 , and the organic electro-luminescent device OLED.
- the gas barrier substrate 300 is shown in FIG. 3 E′ and is bonded with the gas barrier substrate 500 , and the organic electro-luminescent device OLED is disposed between the gas barrier substrate 300 and the gas barrier substrate 500 .
- FIGS. 6A to 6E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the fourth embodiment of the disclosure.
- the de-bonding layer DBL is formed on the carrier C, and the lift-off layer L is formed on the de-bonding layer DBL and the carrier C.
- the material of the de-bonding layer DBL is, for example, a parylene material
- the material of the lift-off layer L is, for example, polyimide or another material which is capable of being lift off from the de-bonding layer DBL.
- the de-bonding layer DBL may be formed by performing a surface treatment on the surface of the carrier C.
- the lift-off layer may also be peeled off from the carrier C along with the de-bonding layer DBL.
- the third gas barrier layer GB 3 is formed on the lift-off layer L.
- the third gas barrier layer GB 3 has the second central bonding surface S 3 and the second peripheral bonding surface S 4 surrounding the second central bonding surface S 4 .
- the third gas barrier layer GB 3 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by a plurality of thin films.
- the third gas barrier layer GB 3 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer.
- the third gas barrier layer GB 3 is formed by one or more pairs of a silicon nitride layer and an SOG layer.
- the number and material of the third gas barrier layer GB 3 are not limited to the above configuration.
- the second substrate SUB 2 is provided, and the second substrate SUB 2 is bonded with the second central bonding surface S 3 .
- the material of the second substrate SUB 2 is, for example, polyimide or another flexible material.
- the lift-off layer L, the third gas barrier layer GB 3 , and the second substrate SUB 2 form a gas barrier substrate 500 ′.
- the organic electro-luminescent device OLED is formed on the second substrate SUB 2 .
- the organic electro-luminescent device OLED is, for example, an active organic electro-luminescent device or a passive organic electro-luminescent device.
- the organic electro-luminescent device OLED may be a display or a light source.
- a fourth gas barrier layer GB 4 is formed to entirely cover the organic electro-luminescent device OLED, the second substrate SUB 2 , and the third gas barrier layer GB 3 .
- the fourth gas barrier layer GB 4 is bonded with the organic electro-luminescent device OLED, the second substrate SUB 2 , and the second peripheral bonding surface S 4 of the third gas barrier layer GB 3 , and a minimum distance D′′ from an edge of the second substrate SUB 2 to an edge of the third gas barrier layer GB 3 is greater than a thickness T′ of the third gas barrier layer GB 3 .
- the fourth gas barrier layer GB 4 which covers the third gas barrier layer GB 3 and the second substrate SUB 2 is, for example, a conformal thin film. According to other embodiments, the fourth gas barrier layer GB 4 may be a conformal thin film. As shown in FIG. 6D , the lift-off layer L, the third gas barrier layer GB 3 , the second substrate SUB 2 , and the fourth gas barrier layer GB 4 form the gas barrier substrate 500 ′.
- the fourth gas barrier layer GB 4 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by a plurality of thin films.
- the fourth gas barrier layer GB 4 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer.
- the fourth gas barrier layer GB 4 is formed by one or more pairs of a silicon nitride layer and an SOG layer.
- the number and material of the fourth gas barrier layer GB 4 are not limited to the above configuration.
- the bonding strength between the third gas barrier layer GB 3 and the fourth gas barrier layer GB 4 is effectively improved.
- the bonding between the third gas barrier layer GB 3 and the fourth gas barrier layer GB 4 is a type of homogeneous bonding, which thus provides good bonding strength.
- the gas barrier substrate 300 is provided, and the gas barrier substrate 300 is bonded with the gas barrier substrate 500 ′, so that the organic electro-luminescent device OLED is sealed between the gas barrier substrate 300 and the gas barrier substrate 500 ′.
- the gas barrier substrate 300 and the gas barrier substrate 500 ′ are bonded with each other by, for example, an adhesive layer 700 .
- the second has barrier layer GB 2 and the fourth gas barrier layer GB 4 are bonded with each other through the adhesive layer 700 .
- the gas barrier substrate 300 shown in FIG. 3 E′ is used.
- the present embodiment does not limit the gas barrier substrate to be the one shown in FIG. 3 E′.
- the gas barrier substrate 300 or 400 shown in FIG. 3E , 4 E, or 4 E′ may also be used in the present embodiment.
- the de-bonding layer DBL, the lift-off layer L, the third gas barrier layer GB 3 , and the fourth gas barrier layer GB 4 may be cut (as shown by the dashed lines) so that the lift-off layer L is separated from the de-bonding layer DBL.
- the aforementioned cutting process is, for example, a laser cutting process or another suitable cutting process.
- FIGS. 7A to 7E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the fifth embodiment of the disclosure.
- the de-bonding layer DBL is formed on the carrier C
- the lift-off layer L is formed on the de-bonding layer DBL and the carrier C.
- the material of the de-bonding layer DBL is, for example, a parylene material
- the material of the lift-off layer L is, for example, polyimide or another material which is capable of being lift off from the de-bonding layer DBL.
- the de-bonding layer DBL may be formed by performing a surface treatment on the surface of the carrier C.
- the lift-off layer L may also be peeled off from the carrier C along with the de-bonding layer DBL.
- the third gas barrier layer GB 3 is formed on the lift-off layer L.
- the third gas barrier layer GB 3 has the second central bonding surface S 3 and the second peripheral bonding surface S 4 surrounding the second central bonding surface S 4 .
- the third gas barrier layer GB 3 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by a plurality of thin films.
- the third gas barrier layer GB 3 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer.
- the third gas barrier layer GB 3 is formed by one or more pairs of a silicon nitride layer and an SOG layer.
- the number and material of the third gas barrier layer GB 3 are not limited to the above configuration.
- the second substrate SUB 2 is provided, and the second substrate SUB 2 is bonded with the second central bonding surface S 3 .
- the material of the second substrate SUB 2 is, for example, polyimide or another flexible material.
- the fourth gas barrier layer GB 4 is formed to entirely cover the second substrate SUB 2 and the third gas barrier layer GB 3 , wherein the fourth gas barrier layer GB 4 is bonded with the second substrate SUB 2 and the peripheral bonding surface S 4 of the third gas barrier layer GB 3 , and the minimum distance D′′ from the edge of the second substrate SUB 2 to the edge of the third gas barrier layer GB 3 is greater than the thickness T′ of the third gas barrier layer GB 3 .
- the lift-off layer L, the third gas barrier layer GB 3 , the second substrate SUB 2 , and the fourth gas barrier layer GB 4 form a gas barrier substrate 500 ′′.
- the organic electro-luminescent device OLED is formed on the fourth gas barrier layer GB 4 .
- the organic electro-luminescent device OLED is, for example, an active organic electro-luminescent device or a passive organic electro-luminescent device.
- the organic electro-luminescent device OLED may be a display or a light source.
- the gas barrier substrate 300 is provided, and the gas barrier substrate 300 is bonded with the gas barrier substrate 500 ′′, so that the organic electro-luminescent device OLED is sealed between the gas barrier substrate 300 and the gas barrier substrate 500 ′′.
- the gas barrier substrate 300 and the gas barrier substrate 500 ′′ are bonded with each other by, for example, the frame adhesive 600 .
- a frit such as a glass frit may be used to replace the frame adhesive 600 , so that the gas barrier substrate 300 and the gas barrier substrate 500 ′′ are bonded with each other.
- the gas barrier substrate 300 shown in FIG. 3 E′ is used.
- the present embodiment does not limit the gas barrier substrate to be the one shown in FIG. 3 E′.
- the gas barrier substrate 300 or 400 shown in FIG. 3E , 4 E, or 4 E′ may also be used in the present embodiment.
- the de-bonding layer DBL, the lift-off layer L, the third gas barrier layer GB 3 , and the fourth gas barrier layer GB 4 may be cut (as shown by the dashed lines) so that the lift-off layer L is separated from the de-bonding layer DBL.
- the aforementioned cutting process is, for example, a laser cutting process or another suitable cutting process.
- the gas barrier substrates which have good gas barrier abilities are used for packaging the organic electro-luminescent device, the reliability of the organic electro-luminescent device is ensured.
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Abstract
A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
Description
- This application claims the priority benefit of Taiwan application serial no. 99117433, filed on May 31, 2010. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- 1. Technical Field
- The disclosure is related to a gas barrier substrate and a fabricating method thereof, and in particular to a package of an organic electro-luminescent device and a packaging method thereof.
- 2. Related Art
- Compared with general rigid substrates, flexible substrates have applications in a wider range of areas. Flexible substrates have advantages such as flexibility, portability, compliance with safety standards, and wide range of applications, but they also have disadvantages such as inferior heat resistance, inferior water and oxygen resistance, inferior chemical resistance, and greater thermal expansion coefficients. Since conventional flexible substrates cannot completely block water vapor or oxygen, aging of electronic devices on the substrate is accelerated, thereby shorting the lifespan of the electronic devices. Commercial requirements are hence unable to be fulfilled. In order to make flexible substrates have better water vapor and oxygen resistance, conventional art has provided a flexible substrate with a gas barrier layer for enhancing reliability of the electronic devices.
FIGS. 1 and 2 are illustrated and conventional flexible gas barrier substrate is described as follow. -
FIG. 1 is a schematic cross-sectional diagram of a conventional flexible gas barrier substrate. Please refer toFIG. 1 . A conventional flexible gas barrier substrate 100 is generally fabricated on a carrier C and includes asubstrate 110 and agas barrier layer 120. Thegas barrier layer 120 only covers atop surface 110 a and asidewall 110 b of thesubstrate 110, and abottom surface 110 c contacts the carrier C. As shown inFIG. 1 , when the flexible gas barrier substrate 100 is detached from the carrier C, thebottom surface 110 c of thesubstrate 110 is exposed. Since thebottom surface 110 c of thesubstrate 110 is not covered by thegas barrier layer 120, the flexible gas barrier substrate 100 warps seriously due to imbalance of stress. - In order to resolve the warp problems of the flexible gas barrier substrate, the conventional art has provided a solution, which is illustrated in detail in
FIG. 2 . -
FIG. 2 is a schematic cross-sectional diagram of another conventional flexible gas barrier substrate. Please refer toFIG. 2 . A conventional flexiblegas barrier substrate 200 is also fabricated on the carrier C and includes asubstrate 210, a firstgas barrier layer 220, and a secondgas barrier layer 230. The firstgas barrier layer 220 only covers abottom surface 210 c of thesubstrate 210, and the secondgas barrier layer 230 covers atop surface 210 a and asidewall 210 b of thesubstrate 210 and asidewall 220 a of the firstgas barrier layer 220. As shown inFIG. 2 , the secondgas barrier layer 230 is bonded with thesidewall 220 a of the firstgas barrier layer 220. However, as limited by the thickness of the firstgas barrier layer 220, the bonding strength between the secondgas barrier layer 230 and thesidewall 220 a of the firstgas barrier layer 220 is insufficient. Therefore, when the flexiblegas barrier substrate 200 is bended, the secondgas barrier layer 230 which covers thesidewall 210 b may be easily broken. Moreover, if the thickness of the firstgas barrier layer 220 is increased for increasing the bonding strength between the secondgas barrier layer 230 and thesidewall 220 a of the firstgas barrier layer 220, the overall thickness of the flexiblegas barrier substrate 200 may increase. - In light of the above, one of the issues focused on by developers is how to effectively improve the gas barrier characteristic of the flexible gas barrier substrate without increasing the overall thickness of the flexible gas barrier substrate.
- A gas barrier substrate which has good gas barrier abilities is provided herein.
- A fabricating method of a gas barrier substrate for fabricating a gas barrier substrate with good gas barrier abilities is provided herein.
- A package of an organic electro-luminescent device which has good reliability is also provided herein.
- A packaging method of an organic electro-luminescent device for ensuring good reliability of the organic electro-luminescent device is further provided herein.
- The disclosure provides a gas barrier substrate which includes a first gas barrier layer, a substrate, and a second gas barrier layer. The first gas barrier layer has a central bonding surface and a peripheral bonding surface which surrounds the central bonding surface. The substrate is bonded with the central bonding surface of the first gas barrier layer, and the second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral bonding surface of the first gas barrier layer. A minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
- The disclosure provides a fabricating method of a gas barrier substrate, including: forming a de-bonding layer on a carrier; forming a lift-off layer on the carrier and the de-bonding layer, forming the first gas barrier layer on the lift-off layer, wherein the first gas barrier layer has the central bonding surface and the peripheral bonding surface which surrounds the central bonding surface; forming the substrate on the central bonding surface of the first gas barrier layer and bonding the substrate with the central bonding surface; and forming the second gas barrier layer to entirely cover the substrate and the first gas barrier layer, wherein the minimum distance from the edge of the substrate to the edge of the first gas barrier layer is greater than the thickness of the first gas barrier layer.
- The disclosure provides a package of an organic electro-luminescent device. The package includes a first gas barrier substrate, a second gas barrier substrate, and an organic electro-luminescent device. The first gas barrier substrate includes a first gas barrier layer, a first substrate, and a second gas barrier layer, wherein the first gas barrier layer has a first central bonding surface and a first peripheral bonding surface surrounding the first central bonding surface, the first substrate is bonded with the first central bonding surface of the first gas barrier layer, and the second gas barrier layer entirely covers the first substrate and the first gas barrier layer. The second gas barrier layer is bonded with the first substrate the first peripheral surface of the first gas barrier layer, and a minimum distance from an edge of the first substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer. The first gas barrier substrate is bonded with the second gas barrier substrate. The organic electro-luminescent device is disposed between the first gas barrier substrate and the second gas barrier substrate.
- The disclosure provides a packaging method of an organic electro-luminescent device, including: forming the organic electro-luminescent device on the first gas barrier substrate; providing the second gas barrier substrate; and bonding the first gas barrier substrate with the second gas barrier substrate, so that the organic electro-luminescent device is sealed between the first gas barrier substrate and the second gas barrier substrate, wherein at least one of the first gas barrier substrate and the second gas barrier substrate is fabricated by the above fabricating method of the gas barrier substrate.
- Several exemplary embodiments accompanied with figures are described in detail below to further describe the disclosure in detail.
- The accompanying drawings are included to provide further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments and, together with the description, serve to explain the principles of the disclosure.
-
FIG. 1A is a schematic cross-sectional diagram of a conventional flexible gas barrier substrate. -
FIG. 2 is a schematic cross-sectional diagram of another conventional flexible gas barrier substrate. -
FIGS. 3A to 3E are schematic cross-sectional diagrams showing a process of fabricating a gas barrier substrate according to the first embodiment of the disclosure. - FIGS. 3D′ to 3E′ are schematic cross-sectional diagrams showing another process of fabricating a gas barrier substrate.
-
FIGS. 4A to 4E are schematic cross-sectional diagrams showing a process of fabricating a gas barrier substrate according to the second embodiment of the disclosure. - FIGS. 4D′ to 4E′ are schematic cross-sectional diagrams showing another process of fabricating a gas barrier substrate.
-
FIGS. 5A to 5E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the third embodiment of the disclosure. -
FIGS. 6A to 6E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the fourth embodiment of the disclosure. -
FIGS. 7A to 7E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the fifth embodiment of the disclosure. -
FIGS. 3A to 3E are schematic cross-sectional diagrams showing a process of fabricating a gas barrier substrate according to the first embodiment of the disclosure. Please refer toFIG. 3A . First, a de-bonding layer DBL is formed on a carrier C, and a lift-off layer L is formed on the de-bonding layer DBL and the carrier C. According to the present embodiment, the material of the de-bonding layer DBL is, for example, a parylene material, and the material of the lift-off layer L is, for example, polyimide or another material which is capable of being lift off from the de-bonding layer DBL. According to other embodiments of the disclosure, the de-bonding layer DBL may be formed by performing a surface treatment on a surface of the carrier C. According to the present embodiment, the lift-off layer L may also be peeled off from the carrier C along with the de-bonding layer DBL. - Please refer to
FIG. 3B . A first gas barrier layer GB1 is formed on the lift-off layer L. The first gas barrier layer GB1 has a central bonding surface S1 and a peripheral bonding surface S2 surrounding the central bonding surface S1. According to the present embodiment, the first gas barrier layer GB1 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by a plurality of thin films. For example, the first gas barrier layer GB1 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one spin-on glass (SOG) layer. According to other embodiments, the first gas barrier layer GB1 is formed by one or more pairs of a silicon nitride layer and an SOG layer. However, it should be noted that according to the disclosure, the number and material of the first gas barrier layer GB1 are not limited to the above configuration. - Please refer to
FIG. 3C , a pre-formed substrate SUB is provided, and the pre-formed substrate SUB is bonded with the central bonding surface S1. According to the present embodiment, the substrate SUB has a sidewall SW which is substantially perpendicular to the central bonding surface S1 of the first gas barrier layer GB1. In addition, the material of the substrate SUB is, for example, polyimide or another flexible material. - Next, please refer to
FIG. 3D . A second gas barrier layer GB2 is formed to entirely cover the substrate SUB and the first gas barrier layer GB1, wherein the second gas barrier layer GB2 is bonded with the substrate SUB and a peripheral bonding surface S2 of the first gas barrier layer GB. A minimum distance D from an edge (i.e. the sidewall SW) of the substrate SUB to an edge of the first gas barrier layer GB1 is greater than a thickness T of the first gas barrier layer GB1. In addition, the second gas barrier layer GB2 which covers the first gas barrier layer GB1 and the substrate SUB is, for example, a conformal thin film. - According to the present embodiment, the second gas barrier layer GB2 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by multiple thin films. For example, the second gas barrier layer GB2 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer. According to other embodiments, the second gas barrier layer GB2 is formed by one or more pairs of a silicon nitride layer and an SOG layer. However, it should be noted that according to the disclosure, the number and material of the second gas barrier layer GB2 are not limited to the above configuration.
- As shown in
FIG. 3D , since the minimum distance D is greater than the thickness T of the first gas barrier layer GB1, the bonding strength between the first gas barrier layer GB1 and the second gas barrier layer GB2 is effectively improved. If the first gas barrier layer GB1 and the second gas barrier layer GB2 have similar materials or the same material, the bonding between the first gas barrier layer GB1 and the second gas barrier layer GB2 is a type of homogeneous bonding, which thus provides good bonding strength. In addition, since the minimum distance D is greater than the thickness T of the first gas barrier layer GB1, compared with the conventional art (FIG. 2 ), if water vapor is to permeate into the gas barrier substrate according to the present embodiment, a longer permeation path is required. - Please refer to
FIGS. 3D and 3E . After completing the fabrication of the second gas barrier layer GB2, agas barrier substrate 300 is almost complete. According to the present embodiment, in order to detach the gas barrier substrate from the carrier C, the de-bonding layer DBL, the lift-off layer L, the first gas barrier layer GB1, and the second gas barrier layer GB2 may be cut along cutting lines CL (as shown by the dashed lines CL inFIG. 3D ) so that the lift-off layer L is separated from the de-bonding layer DBL. According to the present embodiment, the aforementioned cutting process is, for example, a laser cutting process or another suitable cutting process. - Still referring to
FIG. 3E , after the lift-off layer L is separated from the de-bonding layer DBL, the singlegas barrier substrate 300 is obtained. Thegas barrier substrate 300 includes the first gas barrier layer GB1, the substrate SUB, and the second gas barrier layer GB2. The first gas barrier layer GB1 has the central bonding surface S1 and the peripheral bonding surface S2 which surrounds the central bonding surface S1. The substrate SUB is bonded with the central bonding surface S1 of the first gas barrier layer GB1, and the second gas barrier layer GB2 entirely covers the substrate SUB and the first gas barrier layer GB1. The second gas barrier layer GB2 is bonded with the substrate SUB and the peripheral bonding surface S2 of the first gas barrier layer GB1. A minimum distance D′ from the edge (which is the sidewall SW) of the substrate SUB to the edge of the first gas barrier layer GB1 is greater than the thickness T of the first gas barrier layer GB1. - According to the present embodiment, the first gas barrier layer GB1 and the second gas barrier layer GB2 are each, for example, a flexible gas barrier layer, and the substrate SUB is, for example, a flexible substrate. In addition, as shown in
FIG. 3E , the edge of the first gas barrier layer GB1 is substantially aligned with the edge of the second gas barrier layer GB2. - FIGS. 3D′ to 3E′ are schematic cross-sectional diagrams showing another process of fabricating a gas barrier substrate. Please refer to
FIGS. 3D , 3E, 3D′, and 3E′. InFIGS. 3D and 3E , the second gas barrier layer GB2 which covers the first gas barrier layer GB1 and the substrate SUB is a conformal thin film, whereas in FIGS. 3D′ and 3E′, the second gas barrier layer GB2 which covers the first gas barrier layer GB1 and the substrate SUB is a thin film which has a flat top surface. -
FIGS. 4A to 4E are schematic cross-sectional diagrams showing a process of fabricating a gas barrier substrate according to the second embodiment of the disclosure. Please refer toFIGS. 4A to 4E . According to the present embodiment, a fabricating method of agas barrier substrate 400 is similar to that in the first embodiment. The main difference in between is that a substrate SUB′ according to the present embodiment has a tapered sidewall SW′, and an acute angle θ is included between the tapered sidewall SW′ and the central bonding surface 51. - It should be noted that according to the present embodiment, the substrate SUB′ is formed, for example, by coating. In detail, according to the present embodiment, a material layer may first be coated on the central bonding surface S1. The material layer is then cured to form the substrate SUB′. Since the substrate SUB′ is formed by coating, the acute angle θ is included between the sidewall SW′ of the substrate SUB′ and the central bonding surface S1.
- FIGS. 4D′ to 4E′ are schematic cross-sectional diagrams showing another process of fabricating a gas barrier substrate. Please refer to
FIGS. 4D , 4E, 4D′, and 4E′. InFIGS. 4D and 4E , the second gas barrier layer GB2 which covers the first gas barrier layer GB1 and the substrate SUB′ is a conformal thin film, whereas in FIGS. 4D′ and 4E′, the second gas barrier layer GB2 which covers the first gas barrier layer GB1 and the substrate SUB′ is a thin film which has a flat top surface. -
FIGS. 5A to 5E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the third embodiment of the disclosure. Please refer toFIG. 5A . First, a de-bonding layer DBL is formed on a carrier C, and a lift-off layer L is formed on the de-bonding layer DBL and the carrier C. According to the present embodiment, the material of the de-bonding layer DBL is, for example, a parylene material, and the material of the lift-off layer L is, for example, polyimide or another material which is capable of being lift off from the de-bonding layer DBL. According to another embodiment of the disclosure, the de-bonding layer DBL may be formed by performing a surface treatment on the surface of the carrier C. According to the present embodiment, the lift-off layer L may also be peeled off from the carrier C along with the de-bonding layer DBL. - Please refer to
FIG. 5B . A third gas barrier layer GB3 is formed on the lift-off layer L. The third gas barrier layer GB3 has a second central bonding surface S3 and a second peripheral bonding surface S4 surrounding the second central bonding surface S4. According to the present embodiment, the third gas barrier layer GB3 is, for example, a single layer thin film (such as a single layer silicon nitride layer) or a stacked layer formed by multiple thin films. For example, the third gas barrier layer GB3 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer. According to other embodiments, the third gas barrier layer GB3 is formed by one or more pairs of a silicon nitride layer and an SOG layer. However, it should be noted that according to the disclosure, the number and material of the third gas barrier layer GB3 are not limited to the above configuration. - Please refer to
FIG. 5C , the second substrate SUB2 is provided, and the second substrate SUB2 is bonded with the second central bonding surface S3. According to the present embodiment, the material of the second substrate SUB2 is, for example, polyimide or another flexible material. As shown inFIG. 5C , the lift-off layer L, the third gas barrier layer GB3, and the second substrate SUB2 form agas barrier substrate 500. - Please refer to
FIG. 5D . After the second substrate SUB2 is formed, an organic electro-luminescent device OLED is formed on the second substrate SUB2. According to the present embodiment, the organic electro-luminescent device OLED is, for example, an active organic electro-luminescent device or a passive organic electro-luminescent device. The organic electro-luminescent device OLED may be a display or a light source. - Please then refer to
FIG. 5E . After the organic electro-luminescent device OLED is fabricated, thegas barrier substrate 300 is provided, and thegas barrier substrate 300 is bonded with thegas barrier substrate 500, so that the organic electro-luminescent device OLED is sealed between thegas barrier substrate 300 and thegas barrier substrate 500. In detail, thegas barrier substrate 300 and thegas barrier substrate 500 are bonded with each other by, for example, aframe adhesive 600. According to other embodiments, a frit such as a glass frit may be used to replace theframe adhesive 600, so that thegas barrier substrate 300 and thegas barrier substrate 500 are bonded with each other. - According to the present embodiment, the
gas barrier substrate 300 shown in FIG. 3E′ is used. However, the present embodiment does not limit the gas barrier substrate to be the one shown in FIG. 3E′. Thegas barrier substrate FIG. 3E , 4E, or 4E′ may also be used in the present embodiment. - After the
gas barrier substrate 300 and thegas barrier substrate 500 are bonded with each other, in order to detach thegas barrier substrate 500 from the carrier C, the de-bonding layer DBL, the lift-off layer L, and the third gas barrier layer GB3 may be cut along the cutting lines CL (as shown by the dashed lines CL in FIG. 3D′) so that the lift-off layer L is separated from the de-bonding layer DBL. According to the present embodiment, the aforementioned cutting process is, for example, a laser cutting process or another suitable cutting process. - As shown in
FIG. 5E , the package of the organic electro-luminescent according to the present embodiment includes thegas barrier substrate 300, thegas barrier substrate 500, and the organic electro-luminescent device OLED. Thegas barrier substrate 300 is shown in FIG. 3E′ and is bonded with thegas barrier substrate 500, and the organic electro-luminescent device OLED is disposed between thegas barrier substrate 300 and thegas barrier substrate 500. -
FIGS. 6A to 6E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the fourth embodiment of the disclosure. Please refer toFIG. 6A . First, the de-bonding layer DBL is formed on the carrier C, and the lift-off layer L is formed on the de-bonding layer DBL and the carrier C. According to the present embodiment, the material of the de-bonding layer DBL is, for example, a parylene material, and the material of the lift-off layer L is, for example, polyimide or another material which is capable of being lift off from the de-bonding layer DBL. According to another embodiment of the disclosure, the de-bonding layer DBL may be formed by performing a surface treatment on the surface of the carrier C. According to the present embodiment, the lift-off layer may also be peeled off from the carrier C along with the de-bonding layer DBL. - Please refer to
FIG. 6B . The third gas barrier layer GB3 is formed on the lift-off layer L. The third gas barrier layer GB3 has the second central bonding surface S3 and the second peripheral bonding surface S4 surrounding the second central bonding surface S4. According to the present embodiment, the third gas barrier layer GB3 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by a plurality of thin films. For example, the third gas barrier layer GB3 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer. According to other embodiments, the third gas barrier layer GB3 is formed by one or more pairs of a silicon nitride layer and an SOG layer. However, it should be noted that according to the disclosure, the number and material of the third gas barrier layer GB3 are not limited to the above configuration. - Please refer to
FIG. 6C , the second substrate SUB2 is provided, and the second substrate SUB2 is bonded with the second central bonding surface S3. According to the present embodiment, the material of the second substrate SUB2 is, for example, polyimide or another flexible material. As shown inFIG. 5C , the lift-off layer L, the third gas barrier layer GB3, and the second substrate SUB2 form agas barrier substrate 500′. - Please refer to
FIG. 6D . After the second substrate SUB2 is formed, the organic electro-luminescent device OLED is formed on the second substrate SUB2. According to the present embodiment, the organic electro-luminescent device OLED is, for example, an active organic electro-luminescent device or a passive organic electro-luminescent device. The organic electro-luminescent device OLED may be a display or a light source. - After fabrication of the organic electro-luminescent device OLED is complete, a fourth gas barrier layer GB4 is formed to entirely cover the organic electro-luminescent device OLED, the second substrate SUB2, and the third gas barrier layer GB3. The fourth gas barrier layer GB4 is bonded with the organic electro-luminescent device OLED, the second substrate SUB2, and the second peripheral bonding surface S4 of the third gas barrier layer GB3, and a minimum distance D″ from an edge of the second substrate SUB2 to an edge of the third gas barrier layer GB3 is greater than a thickness T′ of the third gas barrier layer GB3. In addition, the fourth gas barrier layer GB4 which covers the third gas barrier layer GB3 and the second substrate SUB2 is, for example, a conformal thin film. According to other embodiments, the fourth gas barrier layer GB4 may be a conformal thin film. As shown in
FIG. 6D , the lift-off layer L, the third gas barrier layer GB3, the second substrate SUB2, and the fourth gas barrier layer GB4 form thegas barrier substrate 500′. - According to the present embodiment, the fourth gas barrier layer GB4 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by a plurality of thin films. The fourth gas barrier layer GB4 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer. According to other embodiments, the fourth gas barrier layer GB4 is formed by one or more pairs of a silicon nitride layer and an SOG layer. However, it should be noted that according to the disclosure, the number and material of the fourth gas barrier layer GB4 are not limited to the above configuration.
- As shown in
FIG. 6D , since the minimum distance D″ is greater than the thickness T′ of the third gas barrier layer GB3, the bonding strength between the third gas barrier layer GB3 and the fourth gas barrier layer GB4 is effectively improved. In addition, if the third gas barrier layer GB3 and the fourth gas barrier layer GB4 have similar materials or the same material, the bonding between the third gas barrier layer GB3 and the fourth gas barrier layer GB4 is a type of homogeneous bonding, which thus provides good bonding strength. - Please then to
FIG. 6E . After the organic electro-luminescent device OLED and the fourth gas barrier layer GB4 are fabricated, thegas barrier substrate 300 is provided, and thegas barrier substrate 300 is bonded with thegas barrier substrate 500′, so that the organic electro-luminescent device OLED is sealed between thegas barrier substrate 300 and thegas barrier substrate 500′. In detail, thegas barrier substrate 300 and thegas barrier substrate 500′ are bonded with each other by, for example, anadhesive layer 700. In other words, the second has barrier layer GB2 and the fourth gas barrier layer GB4 are bonded with each other through theadhesive layer 700. - According to the present embodiment, the
gas barrier substrate 300 shown in FIG. 3E′ is used. However, the present embodiment does not limit the gas barrier substrate to be the one shown in FIG. 3E′. Thegas barrier substrate FIG. 3E , 4E, or 4E′ may also be used in the present embodiment. - After the
gas barrier substrate 300 and thegas barrier substrate 500′ are bonded with each other, in order to detach thegas barrier substrate 500′ from the carrier C, the de-bonding layer DBL, the lift-off layer L, the third gas barrier layer GB3, and the fourth gas barrier layer GB4 may be cut (as shown by the dashed lines) so that the lift-off layer L is separated from the de-bonding layer DBL. According to the present embodiment, the aforementioned cutting process is, for example, a laser cutting process or another suitable cutting process. -
FIGS. 7A to 7E are schematic cross-sectional diagrams showing a process of packaging an organic electro-luminescent device according to the fifth embodiment of the disclosure. Please refer toFIG. 7A . First, the de-bonding layer DBL is formed on the carrier C, and the lift-off layer L is formed on the de-bonding layer DBL and the carrier C. According to the present embodiment, the material of the de-bonding layer DBL is, for example, a parylene material, and the material of the lift-off layer L is, for example, polyimide or another material which is capable of being lift off from the de-bonding layer DBL. According to another embodiment of the disclosure, the de-bonding layer DBL may be formed by performing a surface treatment on the surface of the carrier C. According to the present embodiment, the lift-off layer L may also be peeled off from the carrier C along with the de-bonding layer DBL. - Please refer to
FIG. 7B . The third gas barrier layer GB3 is formed on the lift-off layer L. The third gas barrier layer GB3 has the second central bonding surface S3 and the second peripheral bonding surface S4 surrounding the second central bonding surface S4. According to the present embodiment, the third gas barrier layer GB3 is, for example, a single thin film (such as a single silicon nitride layer) or a stacked layer formed by a plurality of thin films. For example, the third gas barrier layer GB3 is, for example, formed by alternately stacking at least one silicon nitride layer and at least one SOG layer. According to other embodiments, the third gas barrier layer GB3 is formed by one or more pairs of a silicon nitride layer and an SOG layer. However, it should be noted that according to the disclosure, the number and material of the third gas barrier layer GB3 are not limited to the above configuration. - Please refer to
FIG. 7C , the second substrate SUB2 is provided, and the second substrate SUB2 is bonded with the second central bonding surface S3. According to the present embodiment, the material of the second substrate SUB2 is, for example, polyimide or another flexible material. - Please then refer to
FIG. 7D . After the second substrate SUB2 is formed, the fourth gas barrier layer GB4 is formed to entirely cover the second substrate SUB2 and the third gas barrier layer GB3, wherein the fourth gas barrier layer GB4 is bonded with the second substrate SUB2 and the peripheral bonding surface S4 of the third gas barrier layer GB3, and the minimum distance D″ from the edge of the second substrate SUB2 to the edge of the third gas barrier layer GB3 is greater than the thickness T′ of the third gas barrier layer GB3. As shown inFIG. 7D , the lift-off layer L, the third gas barrier layer GB3, the second substrate SUB2, and the fourth gas barrier layer GB4 form agas barrier substrate 500″. - Please refer to
FIG. 7D . After the fourth gas barrier layer GB4 is formed, the organic electro-luminescent device OLED is formed on the fourth gas barrier layer GB4. According to the present embodiment, the organic electro-luminescent device OLED is, for example, an active organic electro-luminescent device or a passive organic electro-luminescent device. The organic electro-luminescent device OLED may be a display or a light source. - Please then to
FIG. 7E . After the organic electro-luminescent device OLED is fabricated, thegas barrier substrate 300 is provided, and thegas barrier substrate 300 is bonded with thegas barrier substrate 500″, so that the organic electro-luminescent device OLED is sealed between thegas barrier substrate 300 and thegas barrier substrate 500″. In detail, thegas barrier substrate 300 and thegas barrier substrate 500″ are bonded with each other by, for example, theframe adhesive 600. According to other embodiments, a frit such as a glass frit may be used to replace theframe adhesive 600, so that thegas barrier substrate 300 and thegas barrier substrate 500″ are bonded with each other. - According to the present embodiment, the
gas barrier substrate 300 shown in FIG. 3E′ is used. However, the present embodiment does not limit the gas barrier substrate to be the one shown in FIG. 3E′. Thegas barrier substrate FIG. 3E , 4E, or 4E′ may also be used in the present embodiment. - After the
gas barrier substrate 300 and thegas barrier substrate 500″ are bonded with each other, in order to detach thegas barrier substrate 500″ from the carrier C, the de-bonding layer DBL, the lift-off layer L, the third gas barrier layer GB3, and the fourth gas barrier layer GB4 may be cut (as shown by the dashed lines) so that the lift-off layer L is separated from the de-bonding layer DBL. According to the present embodiment, the aforementioned cutting process is, for example, a laser cutting process or another suitable cutting process. - According to the disclosure, since the gas barrier substrates which have good gas barrier abilities are used for packaging the organic electro-luminescent device, the reliability of the organic electro-luminescent device is ensured.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims and their equivalents.
Claims (23)
1. A gas barrier substrate, comprising:
a first gas barrier layer having a central bonding surface and a peripheral bonding surface which surrounds the central bonding surface;
a substrate bonded with the central bonding surface of the first gas barrier layer; and
a second gas barrier layer covering the substrate and the first gas barrier layer, wherein the second gas barrier layer is bonded with the substrate and the peripheral bonding surface of the first gas barrier layer, and a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
2. The gas barrier substrate as claimed in claim 1 , wherein the first gas barrier layer and the second gas barrier layer are each a flexible gas barrier layer, and the substrate is a flexible substrate.
3. The gas barrier substrate as claimed in claim 1 , wherein the substrate has a sidewall, and the sidewall is substantially perpendicular to the central bonding surface.
4. The gas barrier substrate as claimed in claim 1 , wherein the substrate has a tapered sidewall, and an acute angle is included between the tapered sidewall and the central bonding surface.
5. The gas barrier substrate as claimed in claim 1 , wherein the edge of the first gas barrier layer is substantially aligned with the edge of the second gas barrier layer.
6. The gas barrier substrate as claimed in claim 1 , wherein the first gas barrier layer comprises a silicon nitride layer.
7. The gas barrier substrate as claimed in claim 1 , wherein the first gas barrier layer comprises a stacked layer, and the stacked layer comprises at least one silicon nitride layer and at least one spin-on glass (SOG) layer.
8. The gas barrier substrate as claimed in claim 1 , wherein the second gas barrier layer comprises a silicon nitride layer.
9. The gas barrier substrate as claimed in claim 1 , wherein the second gas barrier layer comprises a stacked layer, and the stacked layer comprises at least one silicon nitride layer and at least one spin-on glass (SOG) layer.
10. The gas barrier layer as claimed in claim 1 , further comprising a lift-off layer disposed on the first gas barrier layer, wherein the lift-off layer and the substrate are respectively located at two sides of the first gas barrier layer.
11. A fabricating method of a gas barrier substrate, comprising:
forming a de-bonding layer on a carrier;
forming a lift-off layer on the carrier;
forming a first gas barrier layer on the lift-off layer, the first gas barrier layer having a central bonding surface and a peripheral bonding surface which surrounds the central bonding surface;
forming a substrate on the central bonding surface of the first gas barrier layerand bonding the substrate with the central bonding surface; and
forming a second gas barrier layer, covering the substrate and the first gas barrier layer, wherein the second gas barrier layer is bonded with the substrate and the peripheral bonding surface of the first gas barrier layer, and a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
12. The fabricating method of the gas barrier substrate as claimed in claim 11 , wherein a method of forming the substrate on the central bonding surface comprises:
coating a material layer on the central bonding surface; and
curing the material layer to form the substrate.
13. The fabricating method of the gas barrier substrate as claimed in claim 11 , wherein a method of forming the substrate on the central bonding surface comprises:
providing a pre-formed substrate and bonding the pre-formed substrate with the central bonding surface.
14. The fabricating method of the gas barrier substrate as claimed in claim 11 , wherein a method of forming the first gas barrier layer comprises:
forming a silicon nitride layer on the lift-off layer.
15. The fabricating method of the gas barrier substrate as claimed in claim 11 , wherein a method of forming the first gas barrier layer comprises:
forming a stacked layer on the lift-off layer, wherein the stacked layer comprises at least one silicon nitride layer and at least one spin-on glass layer.
16. The fabricating method of the gas barrier substrate as claimed in claim 11 , wherein a method of forming the second gas barrier layer comprises:
forming a silicon nitride layer on the lift-off layer.
17. The fabricating method of the gas barrier substrate as claimed in claim 11 , wherein a method of forming the second gas barrier layer comprises:
forming a stacked layer on the lift-off layer, wherein the stacked layer comprises at least one silicon nitride layer and at least one spin-on glass layer.
18. The fabricating method of the gas barrier substrate as claimed in claim 11 , further comprising cutting the de-bonding layer, the lift-off layer, the first gas barrier layer, and the second gas barrier layer, so that the lift-off layer is separated from the de-bonding layer.
19. A package of an organic electro-luminescent device, comprising:
a first gas barrier substrate, comprising:
a first gas barrier layer having a first central bonding surface and a first peripheral bonding surface which surrounds the first central bonding surface;
a first substrate bonded with the first central bonding surface of the first gas barrier layer; and
a second gas barrier layer covering the first substrate and the first gas barrier layer, wherein the second gas barrier layer is bonded with the first substrate and the first peripheral bonding surface of the first gas barrier layer, and a minimum distance from an edge of the first substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer;
a second gas barrier substrate bonded with the first gas barrier substrate; and
an organic electro-luminescent device disposed between the first gas barrier substrate and the second gas barrier substrate.
20. The package of the organic electro-luminescent device as claimed in claim 19 , wherein the second gas barrier substrate comprises:
a third gas barrier layer having a second central bonding surface and a second peripheral bonding surface which surrounds the second central bonding surface;
a second substrate bonded with the second central bonding surface of the third gas barrier layer, wherein the organic electro-luminescent device is disposed on the second substrate.
21. The package of the organic electro-luminescent device as claimed in claim 19 , wherein the second gas barrier substrate comprises:
a third gas barrier layer having a second central bonding surface and a second peripheral bonding surface which surrounds the second central bonding surface;
a second substrate bonded with the second central bonding surface of the third gas barrier layer, wherein the organic electro-luminescent device is disposed on the second substrate; and
a fourth gas barrier layer covering the second substrate, the organic electro-luminescent device, and the third gas barrier layer, wherein the fourth gas barrier layer is bonded with the second substrate, the organic electro-luminescent device, and the second peripheral bonding surface of the third gas barrier layer, and a minimum distance from an edge of the second substrate to an edge of the third gas barrier layer is greater than a thickness of the third gas barrier layer.
22. The package of the organic electro-luminescent device as claimed in claim 19 , wherein the second gas barrier substrate comprises:
a third gas barrier layer having a second central bonding surface and a second peripheral bonding surface which surrounds the second central bonding surface;
a second substrate bonded with the second central bonding surface of the third gas barrier layer; and
a fourth gas barrier layer covering the second substrate and the third gas barrier layer, wherein the fourth gas barrier layer is bonded with the second substrate and the second peripheral bonding surface of the third gas barrier layer, a minimum distance from an edge of the second substrate to an edge of the third gas barrier layer is greater than a thickness of the third gas barrier layer, and the organic electro-luminescent device is disposed on the fourth gas barrier layer.
23. A packaging method of an organic electro-luminescent device, comprising:
forming an organic electro-luminescent device on a first gas barrier substrate;
providing a second gas barrier substrate; and
bonding the first gas barrier substrate and the second gas barrier substrate, so that the organic electro-magnetic device is sealed between the first gas barrier substrate and the second gas barrier substrate, wherein at least one of the first gas barrier substrate and the second gas barrier substrate is fabricated by the fabricating method of the gas barrier substrate as claimed in claim 11 .
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US14/481,924 US9142797B2 (en) | 2010-05-31 | 2014-09-10 | Gas barrier substrate and organic electro-luminescent device |
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Also Published As
Publication number | Publication date |
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US20130295814A1 (en) | 2013-11-07 |
TW201143503A (en) | 2011-12-01 |
US8864540B2 (en) | 2014-10-21 |
TWI543667B (en) | 2016-07-21 |
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