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US20100258282A1 - Heat dissipation device having fan holders - Google Patents

Heat dissipation device having fan holders Download PDF

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Publication number
US20100258282A1
US20100258282A1 US12/506,211 US50621109A US2010258282A1 US 20100258282 A1 US20100258282 A1 US 20100258282A1 US 50621109 A US50621109 A US 50621109A US 2010258282 A1 US2010258282 A1 US 2010258282A1
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US
United States
Prior art keywords
heat sink
dissipation device
operating plate
fan
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/506,211
Inventor
Cheng Kong
Hong-Cheng Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONG, Cheng, YANG, HONG-CHENG
Publication of US20100258282A1 publication Critical patent/US20100258282A1/en
Abandoned legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates generally to a heat dissipation device, and more particularly to a heat dissipation device having a heat sink and fan holders for facilitating a mounting of a fan on the heat sink.
  • a heat dissipation device is used to dissipate heat generated by the electronic device.
  • a conventional heat dissipation device includes a heat sink and a fan attached on the heat sink to improve a heat-dissipation capacity of the heat sink.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 3 is a front view of the heat dissipation device of FIG. 1 in an unlocked state.
  • FIG. 4 is a front view of the heat dissipation device of FIG. 1 in a locked state.
  • FIGS. 1 and 2 illustrate a heat dissipation device in accordance with an embodiment of the present disclosure.
  • the heat dissipation device is adapted for removing heat from a heat-generating component such as a CPU (not shown).
  • the heat dissipation device comprises a heat sink 10 , a fan 30 and two fan holders 20 fastened to two opposite lateral sides of the heat sink 10 and fixing the fan 30 on a top of the heat sink 10 .
  • the heat sink 10 is integrally formed of a material with a good heat conductivity such as aluminum and copper and comprises a base plate 12 , a plurality of fins 14 extending upwardly from the base plate 12 and two side plates 16 extending upwardly from two opposite lateral sides of the base plate 12 .
  • the fins 14 located between the two side plates 16 are spaced from each other and parallel to the two opposite lateral sides of the base plate 12 .
  • Each side plate 16 is sidestep-shaped and has a first vertical part 160 extending upwardly and perpendicularly from a lateral side of the base plate 12 , a horizontal part 162 extending outwardly and horizontally from a top edge of the first vertical part 160 , a second vertical part 164 extending upwardly and perpendicularly from an outer side of the horizontal part 162 , a supporting part 166 extending outwardly and horizontally from a top edge of the second vertical part 164 , and a restricting part 168 extending upwardly from an outer side of the supporting part 166 .
  • Two locking parts are respectively provided at the two lateral sides of the heat sink 10 .
  • each locking part can be two engaging protrusions formed at the two lateral sides of the heat sink 10 or two receiving recessions defined in the two lateral sides of the heat sink 10 .
  • each locking part includes an engaging groove 167 defined in a bottom surface of each supporting part 166 of each side plate 16 .
  • Each receiving groove 167 is elongated, extends along the outer side of the supporting part 166 of the side plate 16 and is substantially inverted V-shaped in cross section.
  • a plurality of flakes 165 extend upwardly and perpendicularly from top surfaces of the two horizontal parts 162 of the side plates 16 and have top ends coplanar with top ends of the fins 14 .
  • the flakes 165 are spaced from each other and parallel to the fins 14 .
  • the fan 30 is located over a top of fins 14 and the flakes 165 of the heat sink 10 , supported by the two supporting parts 166 of the two side plates 166 and located between the two restricting parts 168 of the two side plates 16 .
  • the fan 30 has a rectangular frame 32 having a size matching that of the top of the heat sink 10 and defines four fixing holes 34 in four corners thereof.
  • Each fan holder 20 comprises an operating plate 22 fastened to a locking part (i.e., the engaging groove 167 ) of the heat sink 10 and a wire clip 24 connected with the operating plate 22 and fastened to the fan 30 .
  • the operating plate 22 comprises an operating part 221 and two connecting parts 223 at two opposite ends of the operating part 221 .
  • the operating part 221 has a width smaller than that of the two connecting parts 223 and is connected to two facing middle parts of the two connecting parts 223 .
  • the operating part 221 of each operating plate 22 has a pressing plate 222 extending perpendicularly and outwardly from a top edge thereof.
  • a plurality of protrusions are formed on a top surface of the pressing plate 222 for facilitating manipulation of the pressing plate 222 .
  • Each connecting part 223 of the operating plate 22 has a first fastening part 224 formed at an upper edge thereof and a second fastening part 226 formed at a lower end thereof.
  • the first fastening part 224 is pivotally connected to the wire clip 24 , while the second part 226 is fastened to the corresponding locking part (i.e., the engaging groove 167 ) of the heat sink 10 .
  • the first fastening part 224 extends inwardly and downwardly from the top edge of the connecting part 223 and is then curved outwardly to define an engaging slot 2240 therein.
  • the engaging slot 2240 is opened forwardly, rearwards and downwardly.
  • the second fastening part 226 extends perpendicularly and inwardly from the lower edge of the connecting part 223 and has an engaging tab 2260 protruding upwardly from a distal end thereof.
  • the first and second parts 224 , 226 are located at the same side of the operating plate 22 and opposite to the corresponding pressing plate 222 of the operating part 221 .
  • the tab 2260 of the second fastening part 226 is V-shaped, decreasing in size upwardly and directly faces the engaging slot 2240 of the first fastening part 224 .
  • Each wire clip 24 is integrally formed by bending an elastic metallic wire and comprises a tensile part 242 and two latching arms 244 extending upwardly from two opposite ends of the tensile part 242 .
  • the tensile part 242 is bent to form a restricting protrusion 2420 projecting upwardly from a middle thereof.
  • Each latching arm 244 extends upwardly away from an end of the tensile part 242 and is curved back downwardly to form a hook 2440 at a top end thereof.
  • the tensile part 242 is engagingly received in the engaging slots 2240 of the operating plate 22 to enable the operating plate 22 to pivot relative to the tensile part 242 .
  • the restricting protrusion 2420 is located between the two connecting parts 223 of the operating plate 22 and thus restricts the operating plate 22 to move along the tensile part 242 .
  • the fan 30 is firstly placed on the top of the heat sink 10 .
  • the hooks 2440 of the two wire clips 24 are then inserted into the fixing holes 34 of the fan 30 to suspend the two fan holders 20 at the two lateral sides of the heat sink 10 .
  • the pressing plates 222 of the operating parts 221 of the two operating plates 22 are finally pressed downwardly to rotate the operating plates 22 and force the engaging tabs 2260 of the second fastening parts 226 of the operating plate 22 to be engagingly received into locking parts (i.e., the engaging grooves 167 ) of the heat sink 10 .
  • the fan 30 is thus conveniently secured on the heat sink 10 .
  • a detachment of the fan 30 from the heat sink 10 can be easily attained by directly taking the fan 30 away from the heat sink 10 after pulling the pressing plates 222 of the operating plates 22 outwardly upwardly to disengage the engaging tabs 2260 of the operating plates 22 from the locking parts (i.e., the engaging grooves 167 ) of the heat sink 10 .

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a heat sink, a fan and two fan holders securing the fan on a top of the heat sink. Two locking parts are defined at two opposite lateral sides of the heat sink. Each fan holder includes an operating plate and a wire clip. The operating plate has first fastening parts formed at an upper edge of the operating plate and second fastening parts formed at a lower edge of the operating plate. The wire clip has a tensile part pivotally connected to the first fastening parts of the operating plate and two latching arms extending upwardly from two opposite ends of the tensile part. Upper ends of the latching arms of the wire clips are fastened to the fan. The second fastening parts of the operating plate engage with one of the two locking parts of the heat sink.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates generally to a heat dissipation device, and more particularly to a heat dissipation device having a heat sink and fan holders for facilitating a mounting of a fan on the heat sink.
  • 2. Description of Related Art
  • Generally, in order to ensure the normal running of an electronic device, a heat dissipation device is used to dissipate heat generated by the electronic device. A conventional heat dissipation device includes a heat sink and a fan attached on the heat sink to improve a heat-dissipation capacity of the heat sink.
  • When installing the fan to the heat sink, it is generally to fix the fan to a side of the heat sink via a fan holder with screws. However, using the screws requires a lot of manpower and material resources. Furthermore, it is necessary to remove the fan at first by unscrewing the screws when disassembling and maintaining the heat dissipation device. Such unscrewing operation is tiresome for a user. In addition, it is also possible that the unscrewed screws may fall into a computer in which the heat dissipation device is mounted to cause damages to components of the computer.
  • What is need therefore is a heat dissipation device having a design which makes assembling and disassembling of a fan to/from a heat sink of the heat dissipation device be convenient and easy.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.
  • FIG. 3 is a front view of the heat dissipation device of FIG. 1 in an unlocked state.
  • FIG. 4 is a front view of the heat dissipation device of FIG. 1 in a locked state.
  • DETAILED DESCRIPTION
  • FIGS. 1 and 2 illustrate a heat dissipation device in accordance with an embodiment of the present disclosure. The heat dissipation device is adapted for removing heat from a heat-generating component such as a CPU (not shown). The heat dissipation device comprises a heat sink 10, a fan 30 and two fan holders 20 fastened to two opposite lateral sides of the heat sink 10 and fixing the fan 30 on a top of the heat sink 10.
  • The heat sink 10 is integrally formed of a material with a good heat conductivity such as aluminum and copper and comprises a base plate 12, a plurality of fins 14 extending upwardly from the base plate 12 and two side plates 16 extending upwardly from two opposite lateral sides of the base plate 12. The fins 14 located between the two side plates 16 are spaced from each other and parallel to the two opposite lateral sides of the base plate 12.
  • Each side plate 16 is sidestep-shaped and has a first vertical part 160 extending upwardly and perpendicularly from a lateral side of the base plate 12, a horizontal part 162 extending outwardly and horizontally from a top edge of the first vertical part 160, a second vertical part 164 extending upwardly and perpendicularly from an outer side of the horizontal part 162, a supporting part 166 extending outwardly and horizontally from a top edge of the second vertical part 164, and a restricting part 168 extending upwardly from an outer side of the supporting part 166. Two locking parts are respectively provided at the two lateral sides of the heat sink 10. The two locking parts can be two engaging protrusions formed at the two lateral sides of the heat sink 10 or two receiving recessions defined in the two lateral sides of the heat sink 10. In this embodiment of the present disclosure, each locking part includes an engaging groove 167 defined in a bottom surface of each supporting part 166 of each side plate 16. Each receiving groove 167 is elongated, extends along the outer side of the supporting part 166 of the side plate 16 and is substantially inverted V-shaped in cross section.
  • A plurality of flakes 165 extend upwardly and perpendicularly from top surfaces of the two horizontal parts 162 of the side plates 16 and have top ends coplanar with top ends of the fins 14. The flakes 165 are spaced from each other and parallel to the fins 14.
  • The fan 30 is located over a top of fins 14 and the flakes 165 of the heat sink 10, supported by the two supporting parts 166 of the two side plates 166 and located between the two restricting parts 168 of the two side plates 16. The fan 30 has a rectangular frame 32 having a size matching that of the top of the heat sink 10 and defines four fixing holes 34 in four corners thereof.
  • Each fan holder 20 comprises an operating plate 22 fastened to a locking part (i.e., the engaging groove 167) of the heat sink 10 and a wire clip 24 connected with the operating plate 22 and fastened to the fan 30. The operating plate 22 comprises an operating part 221 and two connecting parts 223 at two opposite ends of the operating part 221. The operating part 221 has a width smaller than that of the two connecting parts 223 and is connected to two facing middle parts of the two connecting parts 223. The operating part 221 of each operating plate 22 has a pressing plate 222 extending perpendicularly and outwardly from a top edge thereof. A plurality of protrusions (not labeled) are formed on a top surface of the pressing plate 222 for facilitating manipulation of the pressing plate 222.
  • Each connecting part 223 of the operating plate 22 has a first fastening part 224 formed at an upper edge thereof and a second fastening part 226 formed at a lower end thereof. The first fastening part 224 is pivotally connected to the wire clip 24, while the second part 226 is fastened to the corresponding locking part (i.e., the engaging groove 167) of the heat sink 10. The first fastening part 224 extends inwardly and downwardly from the top edge of the connecting part 223 and is then curved outwardly to define an engaging slot 2240 therein. The engaging slot 2240 is opened forwardly, rearwards and downwardly. The second fastening part 226 extends perpendicularly and inwardly from the lower edge of the connecting part 223 and has an engaging tab 2260 protruding upwardly from a distal end thereof. The first and second parts 224, 226 are located at the same side of the operating plate 22 and opposite to the corresponding pressing plate 222 of the operating part 221. The tab 2260 of the second fastening part 226 is V-shaped, decreasing in size upwardly and directly faces the engaging slot 2240 of the first fastening part 224.
  • Each wire clip 24 is integrally formed by bending an elastic metallic wire and comprises a tensile part 242 and two latching arms 244 extending upwardly from two opposite ends of the tensile part 242. The tensile part 242 is bent to form a restricting protrusion 2420 projecting upwardly from a middle thereof. Each latching arm 244 extends upwardly away from an end of the tensile part 242 and is curved back downwardly to form a hook 2440 at a top end thereof. In assembly of each fan holder 20, the tensile part 242 is engagingly received in the engaging slots 2240 of the operating plate 22 to enable the operating plate 22 to pivot relative to the tensile part 242. The restricting protrusion 2420 is located between the two connecting parts 223 of the operating plate 22 and thus restricts the operating plate 22 to move along the tensile part 242.
  • Referring to FIGS. 3 and 4, to assemble the fan 30 of the heat dissipation device, the fan 30 is firstly placed on the top of the heat sink 10. The hooks 2440 of the two wire clips 24 are then inserted into the fixing holes 34 of the fan 30 to suspend the two fan holders 20 at the two lateral sides of the heat sink 10. The pressing plates 222 of the operating parts 221 of the two operating plates 22 are finally pressed downwardly to rotate the operating plates 22 and force the engaging tabs 2260 of the second fastening parts 226 of the operating plate 22 to be engagingly received into locking parts (i.e., the engaging grooves 167) of the heat sink 10. The fan 30 is thus conveniently secured on the heat sink 10.
  • A detachment of the fan 30 from the heat sink 10 can be easily attained by directly taking the fan 30 away from the heat sink 10 after pulling the pressing plates 222 of the operating plates 22 outwardly upwardly to disengage the engaging tabs 2260 of the operating plates 22 from the locking parts (i.e., the engaging grooves 167) of the heat sink 10.
  • It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.

Claims (16)

1. A heat dissipation device comprising:
a heat sink defining two locking parts at two opposite lateral sides thereof;
a fan placed on a top of the heat sink; and
two fan holders each comprising an operating plate having first fastening parts formed at an upper edge of the operating plate and second fastening parts formed at a lower edge of the operating plate, and a wire clip having a tensile part pivotally connected to the first fastening parts of the operating plate and two latching arms extending upwardly from two opposite ends of the tensile part;
wherein upper ends of the latching arms of the wire clips are fastened to the fan and the second fastening parts of the operating plates engage with the two locking parts of the heat sink to thus secure the fan onto the heat sink.
2. The heat dissipation device as claimed in claim 1, wherein the first fastening parts of the operating plate of each fan holder are extended inwardly and downwardly from the upper edge of the operating plate and then curved back to embrace the tensile part of a corresponding wire clip therein.
3. The heat dissipation device as claimed in claim 2, wherein an engaging slot is defined in each first fastening part and engagingly receives the tensile part therein.
4. The heat dissipation device as claimed in claim 1, wherein each second fastening part extends toward the heat sink from the bottom edge of the operating plate and have an engaging tab which protrudes upwardly from a distal end thereof and catches a corresponding locking part of the heat sink.
5. The heat dissipation device as claimed in claim 4, wherein each locking part includes a receiving groove which defined in a lateral side of the heat sink and engagingly receives the engaging tabs of the second fastening parts.
6. The heat dissipation device as claimed in claim 1, wherein the operating plate comprises two connecting parts and an operating part having a width smaller than that of the two connecting parts and connected to two facing middle parts of the two connecting parts.
7. The heat dissipation device as claimed in claim 6, wherein a pressing plate extends outwardly from an upper edge of the operating part of the operating plate, and wherein the first and second fastening parts are respectively formed at upper and lower edges of each connecting part and located at the same side of the operating plate opposite to the pressing plate.
8. The heat dissipation device as claimed in claim 1, wherein each latching arm extends upwardly from an end of the tensile part and is curved back downwardly to form a hook at an upper end thereof, the hook being inserted into a fixing hole defined in a corner of the fan.
9. The heat dissipation device as claimed in claim 1, wherein a restricting protrusion protrudes upwardly from a middle of the tensile part of each wire clip and located between the two first fastening parts of the operating plate.
10. The heat dissipation device as claimed in claim 1, wherein at least two supporting parts extend outwardly from the two lateral sides of the heat sink and support the fan thereon, each supporting part defining a receiving groove in a bottom surface thereof, the receiving groove engagingly receiving the second fastening parts of the operating plate.
11. The heat dissipation device as claimed in claim 10, wherein the heat sink comprises a base plate, a plurality of fins extending upwardly from the base plate and two side plates extending upwardly from two opposite lateral sides of the base plate, the at least two supporting parts extending outwardly from the two side plates, respectively.
12. The heat dissipation device as claimed in claim 11, wherein each side plate is sidestep-shaped and has a first vertical part extending upwardly and perpendicularly from one of the opposite lateral sides of the base plate, a horizontal part extending outwardly and horizontally from a top edge of the first vertical part and a second vertical part extending upwardly and perpendicularly from an outer side of the horizontal part, wherein the supporting part extending outwardly and horizontally from a top edge of the second vertical part and having a restricting part extending upwardly from an outer side of the supporting part and abutting against a lateral side of the fan.
13. A heat dissipation device comprising:
a heat sink having two supporting parts extending outwardly from two opposite lateral sides thereof;
a fan placed on the two supporting parts of the heat sink; and
two fan holders each comprising an operating plate having first fastening parts formed at an upper edge of the operating plate and second fastening parts formed at a lower edge of the operating plate, and a wire clip having a tensile part pivotally connected to the first fastening parts of the operating plate and two latching arms extending upwardly from two opposite ends of the tensile part, each latching arm having a hook formed at distal end thereof;
wherein the hooks of the latching arms of the wire clips engages with the fan and the second fastening parts of the operating plates engage with the two supporting parts of the heat sink to thus secure the fan onto the heat sink.
14. The heat dissipation device as claimed in claim 13, wherein the first fastening parts of the operating plate are extended inwardly and downward from the upper edge of the operating plate and then curved back to embrace the tensile part of a corresponding wire clip therein.
15. The heat dissipation device as claimed in claim 14, wherein an engaging slot is defined in each first fastening part and engagingly receives the tensile part therein.
16. The heat dissipation device as claimed in claim 13, wherein the second fastening parts extend toward the heat sink from the bottom edge of the operating plate and each have an engaging tab which protrudes upwardly from a distal end thereof and is engagingly received in a receiving groove formed in a bottom surface of a corresponding supporting part of the heat sink.
US12/506,211 2009-04-10 2009-07-20 Heat dissipation device having fan holders Abandoned US20100258282A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910301482A CN101861080A (en) 2009-04-10 2009-04-10 Heat radiating device
CN200910301482.3 2009-04-10

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104411143A (en) * 2014-11-26 2015-03-11 无锡鸿声铝业有限公司 Aluminum-profile radiator
CN108135109B (en) * 2017-12-20 2024-03-29 珠海英搏尔电气股份有限公司 Fan assembly, motor controller and electric vehicle
CN111014579B (en) * 2019-12-31 2022-01-04 浙江嘉兴南湖电子器材集团有限公司 Magnetic steel blank forming device

Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323845A (en) * 1993-05-17 1994-06-28 Kin Shon Lu Heat sink clip assembly
US5371652A (en) * 1993-11-15 1994-12-06 Thermalloy, Inc. Spring clamp assembly with electrically insulating shoe
US5430610A (en) * 1994-06-15 1995-07-04 Hung; Chin-Ping Separable positioning device for the heat sink on computer chips
US5448449A (en) * 1993-12-20 1995-09-05 The Whitaker Corporation Retainer for securing a heat sink to a socket
US5475564A (en) * 1994-12-20 1995-12-12 Chiou; Ming D. CPU heat sink holding-down device
US5495392A (en) * 1995-03-06 1996-02-27 Shen; Tsan-Jung CPU heat dissipating apparatus
US5509465A (en) * 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US20010009187A1 (en) * 2000-01-25 2001-07-26 Lin Shih-Jen Heat sink and fan arrangment
US6407919B1 (en) * 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module
US20020139518A1 (en) * 2001-02-23 2002-10-03 Dongyun Lee Fan holder
US20020189789A1 (en) * 2001-06-18 2002-12-19 Global Win Technology Co., Ltd CPU cooling arrangement
US6507491B1 (en) * 2001-10-23 2003-01-14 Huey Shyang Ent. Co., Ltd. Pull/latch type fixing device for heat-radiating fin body
US6600650B1 (en) * 2002-06-11 2003-07-29 Cheng-Ping Lee Fastening device of CPU heat sink
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan
US20040000398A1 (en) * 2002-06-28 2004-01-01 Lee Hsieh Kun Heat dissipation assembly with fan mounting device
US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US20040130873A1 (en) * 2003-01-08 2004-07-08 Ma Laboratories, Inc. Structure for removable cooler
US6867975B2 (en) * 2002-08-06 2005-03-15 Fujitsu Limited Heat sink, fixing method thereof and electronic apparatus using heat sink
US6924984B2 (en) * 2002-12-31 2005-08-02 Hon Hai Precision Ind. Co., Ltd. Heat sink clip with pivoting locking portions
US7063136B2 (en) * 2004-08-25 2006-06-20 Hon Hai Precision Industry Co., Ltd Heat dissipation device having cap for protecting thermal interface material thereon
US7106591B2 (en) * 2003-04-11 2006-09-12 Hon Hai Precision Ind. Co., Ltd. Locking device for heat sink
US7180744B2 (en) * 2004-07-02 2007-02-20 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink mounting device
US20070246189A1 (en) * 2006-04-19 2007-10-25 Hon Hai Precision Industry Co., Ltd. Heat sink
US7349210B2 (en) * 2005-05-29 2008-03-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Grease cover for heat dissipating apparatus
US20080130229A1 (en) * 2006-12-01 2008-06-05 Delta Electronics Inc. Heat dissipating module and heat sink thereof
US7423873B2 (en) * 2006-09-22 2008-09-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fan holder for attachment of a fan
US20090020262A1 (en) * 2007-07-16 2009-01-22 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with clip for mounting a fan to a heat sink thereof
US20090147475A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device having a fan mounted thereon
US20090288803A1 (en) * 2008-05-21 2009-11-26 Comptake Technology Inc. Heat sink for chips
US20090288804A1 (en) * 2008-05-23 2009-11-26 Comptake Technology Inc. Heat sink for chips
US7643293B2 (en) * 2007-12-18 2010-01-05 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
US20100101756A1 (en) * 2008-10-24 2010-04-29 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Liquid-cooling device
US7746645B2 (en) * 2008-07-04 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a clip

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2736848Y (en) * 2004-09-15 2005-10-26 鸿富锦精密工业(深圳)有限公司 Fan fixing device

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323845A (en) * 1993-05-17 1994-06-28 Kin Shon Lu Heat sink clip assembly
US5371652A (en) * 1993-11-15 1994-12-06 Thermalloy, Inc. Spring clamp assembly with electrically insulating shoe
US5448449A (en) * 1993-12-20 1995-09-05 The Whitaker Corporation Retainer for securing a heat sink to a socket
US5430610A (en) * 1994-06-15 1995-07-04 Hung; Chin-Ping Separable positioning device for the heat sink on computer chips
US5475564A (en) * 1994-12-20 1995-12-12 Chiou; Ming D. CPU heat sink holding-down device
US5495392A (en) * 1995-03-06 1996-02-27 Shen; Tsan-Jung CPU heat dissipating apparatus
US5509465A (en) * 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US6308773B2 (en) * 2000-01-25 2001-10-30 Global Win Technology Co., Ltd. Heat sink and fan arrangement
US20010009187A1 (en) * 2000-01-25 2001-07-26 Lin Shih-Jen Heat sink and fan arrangment
US6407919B1 (en) * 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module
US20020139518A1 (en) * 2001-02-23 2002-10-03 Dongyun Lee Fan holder
US20020189789A1 (en) * 2001-06-18 2002-12-19 Global Win Technology Co., Ltd CPU cooling arrangement
US6507491B1 (en) * 2001-10-23 2003-01-14 Huey Shyang Ent. Co., Ltd. Pull/latch type fixing device for heat-radiating fin body
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US6600650B1 (en) * 2002-06-11 2003-07-29 Cheng-Ping Lee Fastening device of CPU heat sink
US20040000398A1 (en) * 2002-06-28 2004-01-01 Lee Hsieh Kun Heat dissipation assembly with fan mounting device
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan
US6867975B2 (en) * 2002-08-06 2005-03-15 Fujitsu Limited Heat sink, fixing method thereof and electronic apparatus using heat sink
US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US6924984B2 (en) * 2002-12-31 2005-08-02 Hon Hai Precision Ind. Co., Ltd. Heat sink clip with pivoting locking portions
US20040130873A1 (en) * 2003-01-08 2004-07-08 Ma Laboratories, Inc. Structure for removable cooler
US7106591B2 (en) * 2003-04-11 2006-09-12 Hon Hai Precision Ind. Co., Ltd. Locking device for heat sink
US7180744B2 (en) * 2004-07-02 2007-02-20 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink mounting device
US7063136B2 (en) * 2004-08-25 2006-06-20 Hon Hai Precision Industry Co., Ltd Heat dissipation device having cap for protecting thermal interface material thereon
US7349210B2 (en) * 2005-05-29 2008-03-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Grease cover for heat dissipating apparatus
US20070246189A1 (en) * 2006-04-19 2007-10-25 Hon Hai Precision Industry Co., Ltd. Heat sink
US7423873B2 (en) * 2006-09-22 2008-09-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fan holder for attachment of a fan
US20080130229A1 (en) * 2006-12-01 2008-06-05 Delta Electronics Inc. Heat dissipating module and heat sink thereof
US20090020262A1 (en) * 2007-07-16 2009-01-22 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with clip for mounting a fan to a heat sink thereof
US20090147475A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device having a fan mounted thereon
US7643293B2 (en) * 2007-12-18 2010-01-05 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
US20090288803A1 (en) * 2008-05-21 2009-11-26 Comptake Technology Inc. Heat sink for chips
US20090288804A1 (en) * 2008-05-23 2009-11-26 Comptake Technology Inc. Heat sink for chips
US7746645B2 (en) * 2008-07-04 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a clip
US20100101756A1 (en) * 2008-10-24 2010-04-29 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Liquid-cooling device

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