US20100051236A1 - Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base - Google Patents
Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base Download PDFInfo
- Publication number
- US20100051236A1 US20100051236A1 US12/202,723 US20272308A US2010051236A1 US 20100051236 A1 US20100051236 A1 US 20100051236A1 US 20272308 A US20272308 A US 20272308A US 2010051236 A1 US2010051236 A1 US 2010051236A1
- Authority
- US
- United States
- Prior art keywords
- heat pipes
- evaporator sections
- heat
- fixing base
- juxtaposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/06—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of metal tubes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Definitions
- the present invention relates to a heat-dissipating device, and in particular to a heat-dissipating device having a plurality of heat pipes and a process for making the same.
- heat pipes have many advantageous features such as large heat-conducting capacity, high heat-transferring rate, light weight, simple structure, versatility, capability of transferring large amount of heat without consuming any electricity, low price etc., they are widely used in dissipating the heat generated by electronic elements. Via the heat pipes, the heat generated by electronic heat-generating elements can be dissipated quickly, thereby overcoming the heat accumulation occurring in the electronic heat-generating elements at current stage.
- FIG. 1 When the heat pipe is used in a heat-dissipating device of an electronic product, in order to transfer and dissipate the heat generated by the heat-generating elements more quickly, a plurality of heat pipes 20 a is disposed on a heat-conducting base 10 a to perform the heat dissipation.
- a plurality through slots 101 a is provided at intervals on the heat-conducting base 10 a , so that the evaporator sections 201 a of the heat pipes 20 a can be disposed in the through slots 101 a respectively.
- the heat-conducting base 10 a with the evaporators 201 a of the heat pipes 20 a being disposed therein is adhered to a heat-generating element (not shown), so that the heat-conducting base 10 a and the heat-generating element can be thermally connected with each other.
- Condenser sections 202 a on the other side of the heat pipes 20 a are provided with a plurality of heat-dissipating fins (not shown).
- the heat generated by the heat-generating element can be transferred to each heat-dissipating fin via the heat pipes 20 a , thereby dissipating the heat of the heat-generating element continuously and lowering the temperature thereof.
- the heat accumulated in the respective heat-dissipating fins can be dissipated quickly, thereby achieving a good heat-dissipating effect.
- a separating plate 102 a has to be formed between each through slot 101 a on the heat-conducting base 10 a , so that the heat pipes 20 a can be arranged on the heat-conducting base 10 a at intervals.
- the separating plates 102 a can allow the evaporator sections of the respective heat pipes 20 a to be received in the through slots 101 a , these separating plates 102 a only make the evaporator sections 201 a of the heat pipes 20 a and the heat-generating element to be brought into a line contact but not a surface contact when the evaporator sections 201 a of the heat pipes 20 a are adhered to the heat-generating element.
- the contacting area between the evaporator sections 201 a of the heat pipes 20 a and the heat-generating element is reduced, and in turn, the heat-conducting effect of the heat pipes 20 a on the heat-generating element is affected.
- the heat generated by the heat-generating element cannot be dissipated immediately.
- the present invention is to provide a process and an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base, whereby the contacting area between the evaporator sections of the heat pipes and a heat-generating element can be increased so as to dissipate the heat of the heat-generating element quickly and improve the heat-conducting efficiency.
- the present invention is to provide a process and an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base.
- the process includes the steps of: a) providing a fixing base with its bottom surface having an accommodating trough; b) providing at least two heat pipes each having an evaporator section and a condenser section; c) disposing the evaporator sections of the heat pipes in the accommodating trough; and d) machining the evaporator sections of the juxtaposed heat pipes, thereby forming a plane on the evaporator sections of the heat pipe.
- the present invention is to provide a process and an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base.
- the evaporator sections of the heat pipes With the evaporator sections of the heat pipes being formed into a plane that is higher than or in flush with the bottom surface of the fixing base, the evaporator sections of the heat pipes can be brought into a surface contact with the heat-generating element, thereby dissipating the heat of the heat-generating element quickly.
- FIG. 1 is a schematic view showing the combination of heat pipes and a heat-conducting base in prior art
- FIG. 2 is a perspective view showing the external appearance of the fixing base of the present invention
- FIG. 5 is a schematic view showing a step of machining the evaporator sections of juxtaposed heat pipes by a die according to the present invention
- FIG. 6 is a perspective view showing the external appearance of the present invention.
- FIG. 7 is an assembled cross-sectional view showing the plane formed on the evaporator sections of the heat pipes of the present invention being in flush with the bottom surface of the fixing base;
- FIG. 8 is an assembled cross-sectional view showing the plane formed on the evaporator sections of the heat pipes of the present invention being higher than the bottom surface of the fixing base;
- FIG. 9 is a schematic view showing the operating state of the present invention.
- FIG. 10 is a flow chart showing a process of an embodiment of the present invention.
- the present invention provides a process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base.
- a fixing base 10 is provided.
- a bottom surface 11 of the fixing base 10 is provided with an accommodating trough 12 .
- at least two heat pipes 20 are provided, in which a wick structure and a working fluid are filled.
- evaporator sections 21 of the heat pipes 20 are disposed in the accommodating trough 12 .
- the evaporator section 21 of one of the heat pipes 20 is first disposed in the accommodating trough 12 , and then the evaporator section 21 of at least one heat pipe 20 is pressed into the accommodating trough 12 .
- the evaporator sections 21 of two of the heat pipes 20 are disposed in the accommodating trough 12 , and then the evaporator section 21 of at least one heat pipe 20 is pressed into the accommodating trough 12 .
- the evaporator sections 21 of the heat pipes 20 are juxtaposed on the accommodating trough 12 , and then the evaporator sections 21 of the juxtaposed heat pipes 20 are pressed into the accommodating trough 12 .
- a pressing die 30 is used in the present embodiment to roll the evaporator sections 21 of the juxtaposed heat pipes 20 at least one time, so that a plane 200 can be formed on the evaporator sections 21 of the heat pipes 20 .
- the evaporator sections 21 of the juxtaposed heat pipes 20 can be flush connected into the accommodating trough 12 of the fixing base 10 .
- FIG. 7 is an assembled cross-sectional view showing the assembly for flush connecting the evaporator sections of the juxtaposed heat pipes to the fixing base according to the present invention.
- the bottom surface 11 of the fixing base 10 has an accommodating trough 12 .
- the evaporator sections 21 of at least two heat pipes 20 are juxtaposed in the accommodating trough 12 .
- three heat pipes 20 are provided.
- the evaporator sections 21 of the juxtaposed heat pipes 20 are machined to form a plane 200 .
- the plane 200 formed on the evaporator sections 21 of the heat pipes 20 is in flush with the bottom surface 11 of the fixing base 10 .
- FIG. 8 which is different from FIG. 7 in that: after machining, the plane 200 formed on the evaporator sections 21 of the heat pipes 20 is higher than the bottom surface 11 of the fixing base 10 .
- FIG. 9 is a schematic view showing an operating state of the present invention.
- the evaporator sections 21 of the heat pipes 20 are machined to form a plane 200 , and these heat pipes are juxtaposed flush in the accommodating trough 12 of the fixing base 10 .
- the condenser sections 22 of the heat pipes 20 are connected with a heat-dissipating fins assembly 40 .
- the plane 200 is adhered to the surface of a heat-generating element 50 .
- the heat-generating element 50 is a CPU disposed on a circuit board.
- the heat generated by the heat-generating element 50 can be conducted to the evaporator sections 21 of the heat pipes 20 .
- the heat is transferred from the evaporator sections 21 of the heat pipes 20 to their condenser sections 22 .
- the heat is transferred from the condenser sections 22 of the heat pipes 20 to the heat-dissipating fins assembly 40 having a larger heat-dissipating area. In this way, the heat generated by the heat-generating element 50 can be transferred to the heat-dissipating fins assembly 40 via the heat pipes 20 , thereby dissipating the heat gradually.
- FIG. 10 is a flow chart showing the process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base according to the present invention (also refer to FIGS. 2 to 9 ).
- the process includes the steps as follows. First, in the step 61 , a fixing base 10 is provided with its bottom surface 11 having an accommodating trough 12 . In the step 62 , at least two heat pipes 20 each having an evaporator section 21 and a condenser section 22 are provided. Then, in the step 63 , the evaporator sections 21 of the heat pipes 20 are disposed in the accommodating trough 12 .
- the evaporator sections 21 of the heat pipes 20 are rolled at least one time, thereby forming a plane 200 on the evaporator sections 21 of the heat pipes 20 .
- the plane 200 is higher than or in flush with the bottom surface 11 of the fixing base 10 .
- the step of disposing the evaporator sections 21 of the heat pipes 20 in the accommodating trough 12 can be performed in such a manner that the evaporator section 21 of one of the heat pipes 20 is first disposed in the accommodating trough 12 , and then the evaporator sections 21 of at least one heat pipe 20 are pressed into the accommodating trough 12 .
- the evaporator sections 21 of two of the heat pipes 20 are disposed in the accommodating trough 12 , and then the evaporator section 21 of at least one heat pipes 20 is pressed into the accommodating trough 12 .
- the evaporator sections 21 of the heat pipes 20 are juxtaposed on the accommodating trough 12 , and then the evaporator sections 21 of the juxtaposed heat pipes 20 are pressed into the accommodating trough 12 .
- the evaporator sections 21 of at least two heat pipes 20 can be disposed simultaneously in the accommodating trough 12 of the fixing base 10 , so that the evaporator sections 21 of the heat pipes 20 and the heat-generating element 50 can be brought into a surface contact, thereby increasing the contact area between the evaporator sections 21 of the heat pipes 20 and the heat-generating element 50 .
- the heat of the heat-generating element 50 can be dissipated quickly and the heat-conducting efficiency can be improved.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a heat-dissipating device, and in particular to a heat-dissipating device having a plurality of heat pipes and a process for making the same.
- 2. Description of Prior Art
- Since heat pipes have many advantageous features such as large heat-conducting capacity, high heat-transferring rate, light weight, simple structure, versatility, capability of transferring large amount of heat without consuming any electricity, low price etc., they are widely used in dissipating the heat generated by electronic elements. Via the heat pipes, the heat generated by electronic heat-generating elements can be dissipated quickly, thereby overcoming the heat accumulation occurring in the electronic heat-generating elements at current stage.
- Please refer to
FIG. 1 . When the heat pipe is used in a heat-dissipating device of an electronic product, in order to transfer and dissipate the heat generated by the heat-generating elements more quickly, a plurality ofheat pipes 20 a is disposed on a heat-conductingbase 10 a to perform the heat dissipation. Thus, a plurality throughslots 101 a is provided at intervals on the heat-conductingbase 10 a, so that theevaporator sections 201 a of theheat pipes 20 a can be disposed in the throughslots 101 a respectively. Then, the heat-conductingbase 10 a with theevaporators 201 a of theheat pipes 20 a being disposed therein is adhered to a heat-generating element (not shown), so that the heat-conductingbase 10 a and the heat-generating element can be thermally connected with each other.Condenser sections 202 a on the other side of theheat pipes 20 a are provided with a plurality of heat-dissipating fins (not shown). With the large heat-conducting capacity of theheat pipe 20 a, the heat generated by the heat-generating element can be transferred to each heat-dissipating fin via theheat pipes 20 a, thereby dissipating the heat of the heat-generating element continuously and lowering the temperature thereof. Furthermore, with an associated heat-dissipating fan, the heat accumulated in the respective heat-dissipating fins can be dissipated quickly, thereby achieving a good heat-dissipating effect. - In the above assembly, a
separating plate 102 a has to be formed between each throughslot 101 a on the heat-conductingbase 10 a, so that theheat pipes 20 a can be arranged on the heat-conductingbase 10 a at intervals. Although theseparating plates 102 a can allow the evaporator sections of therespective heat pipes 20 a to be received in the throughslots 101 a, these separatingplates 102 a only make theevaporator sections 201 a of theheat pipes 20 a and the heat-generating element to be brought into a line contact but not a surface contact when theevaporator sections 201 a of theheat pipes 20 a are adhered to the heat-generating element. As a result, the contacting area between theevaporator sections 201 a of theheat pipes 20 a and the heat-generating element is reduced, and in turn, the heat-conducting effect of theheat pipes 20 a on the heat-generating element is affected. Thus, the heat generated by the heat-generating element cannot be dissipated immediately. - Therefore, it is an important issue for the present Inventor to overcome the above problems.
- The present invention is to provide a process and an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base, whereby the contacting area between the evaporator sections of the heat pipes and a heat-generating element can be increased so as to dissipate the heat of the heat-generating element quickly and improve the heat-conducting efficiency.
- The present invention is to provide a process and an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base. The process includes the steps of: a) providing a fixing base with its bottom surface having an accommodating trough; b) providing at least two heat pipes each having an evaporator section and a condenser section; c) disposing the evaporator sections of the heat pipes in the accommodating trough; and d) machining the evaporator sections of the juxtaposed heat pipes, thereby forming a plane on the evaporator sections of the heat pipe.
- The present invention is to provide a process and an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base. With the evaporator sections of the heat pipes being formed into a plane that is higher than or in flush with the bottom surface of the fixing base, the evaporator sections of the heat pipes can be brought into a surface contact with the heat-generating element, thereby dissipating the heat of the heat-generating element quickly.
-
FIG. 1 is a schematic view showing the combination of heat pipes and a heat-conducting base in prior art; -
FIG. 2 is a perspective view showing the external appearance of the fixing base of the present invention; -
FIG. 3 is a cross-sectional view of the present invention showing the evaporator sections of two of the heat pipes being pressed in an accommodating trough; -
FIG. 4 is a cross-sectional view of the present invention showing the evaporator sections of at least two heat pipes being pressed into an accommodating trough; -
FIG. 5 is a schematic view showing a step of machining the evaporator sections of juxtaposed heat pipes by a die according to the present invention; -
FIG. 6 is a perspective view showing the external appearance of the present invention; -
FIG. 7 is an assembled cross-sectional view showing the plane formed on the evaporator sections of the heat pipes of the present invention being in flush with the bottom surface of the fixing base; -
FIG. 8 is an assembled cross-sectional view showing the plane formed on the evaporator sections of the heat pipes of the present invention being higher than the bottom surface of the fixing base; -
FIG. 9 is a schematic view showing the operating state of the present invention; and -
FIG. 10 is a flow chart showing a process of an embodiment of the present invention. - The detailed description and technical contents of the present invention will be explained with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the present invention.
- Please refer to
FIGS. 2 to 6 . The present invention provides a process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base. First, afixing base 10 is provided. Abottom surface 11 of thefixing base 10 is provided with anaccommodating trough 12. Furthermore, at least twoheat pipes 20 are provided, in which a wick structure and a working fluid are filled. In the present embodiment, there are threeheat pipes 20. Next,evaporator sections 21 of theheat pipes 20 are disposed in theaccommodating trough 12. Theevaporator section 21 of one of theheat pipes 20 is first disposed in theaccommodating trough 12, and then theevaporator section 21 of at least oneheat pipe 20 is pressed into theaccommodating trough 12. In the present embodiment, theevaporator sections 21 of two of theheat pipes 20 are disposed in theaccommodating trough 12, and then theevaporator section 21 of at least oneheat pipe 20 is pressed into theaccommodating trough 12. In practice, theevaporator sections 21 of theheat pipes 20 are juxtaposed on theaccommodating trough 12, and then theevaporator sections 21 of the juxtaposedheat pipes 20 are pressed into theaccommodating trough 12. Finally, via a machining step such as rolling, pressing or die-pressing, apressing die 30 is used in the present embodiment to roll theevaporator sections 21 of the juxtaposedheat pipes 20 at least one time, so that aplane 200 can be formed on theevaporator sections 21 of theheat pipes 20. Thus, theevaporator sections 21 of the juxtaposedheat pipes 20 can be flush connected into theaccommodating trough 12 of thefixing base 10. - Please refer to
FIG. 7 , which is an assembled cross-sectional view showing the assembly for flush connecting the evaporator sections of the juxtaposed heat pipes to the fixing base according to the present invention. Thebottom surface 11 of thefixing base 10 has anaccommodating trough 12. Theevaporator sections 21 of at least twoheat pipes 20 are juxtaposed in theaccommodating trough 12. In the present embodiment, threeheat pipes 20 are provided. Theevaporator sections 21 of the juxtaposedheat pipes 20 are machined to form aplane 200. Theplane 200 formed on theevaporator sections 21 of theheat pipes 20 is in flush with thebottom surface 11 of thefixing base 10. Please refer toFIG. 8 , which is different fromFIG. 7 in that: after machining, theplane 200 formed on theevaporator sections 21 of theheat pipes 20 is higher than thebottom surface 11 of thefixing base 10. - Please refer
FIG. 9 , which is a schematic view showing an operating state of the present invention. Theevaporator sections 21 of theheat pipes 20 are machined to form aplane 200, and these heat pipes are juxtaposed flush in theaccommodating trough 12 of thefixing base 10. Thecondenser sections 22 of theheat pipes 20 are connected with a heat-dissipatingfins assembly 40. In use, theplane 200 is adhered to the surface of a heat-generatingelement 50. In the present embodiment, the heat-generatingelement 50 is a CPU disposed on a circuit board. Thus, the heat generated by the heat-generatingelement 50 can be conducted to theevaporator sections 21 of theheat pipes 20. Then, the heat is transferred from theevaporator sections 21 of theheat pipes 20 to theircondenser sections 22. Finally, the heat is transferred from thecondenser sections 22 of theheat pipes 20 to the heat-dissipatingfins assembly 40 having a larger heat-dissipating area. In this way, the heat generated by the heat-generatingelement 50 can be transferred to the heat-dissipatingfins assembly 40 via theheat pipes 20, thereby dissipating the heat gradually. - Please refer to
FIG. 10 , which is a flow chart showing the process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base according to the present invention (also refer toFIGS. 2 to 9 ). The process includes the steps as follows. First, in thestep 61, a fixingbase 10 is provided with itsbottom surface 11 having anaccommodating trough 12. In thestep 62, at least twoheat pipes 20 each having anevaporator section 21 and acondenser section 22 are provided. Then, in thestep 63, theevaporator sections 21 of theheat pipes 20 are disposed in theaccommodating trough 12. Finally, in thestep 64, via the machining of a rollingdie 30, theevaporator sections 21 of theheat pipes 20 are rolled at least one time, thereby forming aplane 200 on theevaporator sections 21 of theheat pipes 20. Theplane 200 is higher than or in flush with thebottom surface 11 of the fixingbase 10. The step of disposing theevaporator sections 21 of theheat pipes 20 in theaccommodating trough 12 can be performed in such a manner that theevaporator section 21 of one of theheat pipes 20 is first disposed in theaccommodating trough 12, and then theevaporator sections 21 of at least oneheat pipe 20 are pressed into theaccommodating trough 12. In the present embodiment, theevaporator sections 21 of two of theheat pipes 20 are disposed in theaccommodating trough 12, and then theevaporator section 21 of at least oneheat pipes 20 is pressed into theaccommodating trough 12. Alternatively, theevaporator sections 21 of theheat pipes 20 are juxtaposed on theaccommodating trough 12, and then theevaporator sections 21 of the juxtaposedheat pipes 20 are pressed into theaccommodating trough 12. - Therefore, according to the present invention, the
evaporator sections 21 of at least twoheat pipes 20 can be disposed simultaneously in theaccommodating trough 12 of the fixingbase 10, so that theevaporator sections 21 of theheat pipes 20 and the heat-generatingelement 50 can be brought into a surface contact, thereby increasing the contact area between theevaporator sections 21 of theheat pipes 20 and the heat-generatingelement 50. In this way, the heat of the heat-generatingelement 50 can be dissipated quickly and the heat-conducting efficiency can be improved. - Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/202,723 US20100051236A1 (en) | 2008-09-02 | 2008-09-02 | Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US12/202,723 US20100051236A1 (en) | 2008-09-02 | 2008-09-02 | Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base |
Publications (1)
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US20100051236A1 true US20100051236A1 (en) | 2010-03-04 |
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US12/202,723 Abandoned US20100051236A1 (en) | 2008-09-02 | 2008-09-02 | Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base |
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Cited By (7)
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US20110000645A1 (en) * | 2009-07-06 | 2011-01-06 | Ping Chen | Heat dissipating board structure and method of manufacturing the same |
US20110179957A1 (en) * | 2010-01-25 | 2011-07-28 | Shyh-Ming Chen | Method for flattening heat dissipating tube and device for performing the same |
US20130008629A1 (en) * | 2011-07-05 | 2013-01-10 | Chun-Ming Wu | Thermal module and method of manufacturing same |
US20130098584A1 (en) * | 2009-09-18 | 2013-04-25 | Golden Sun News Techniques Co., Ltd. | Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith |
US20170151641A1 (en) * | 2015-11-26 | 2017-06-01 | Asia Vital Components Co., Ltd. | Heat dissipation unit manufacturing method |
US20170231116A1 (en) * | 2016-02-05 | 2017-08-10 | Auras Technology Co., Ltd. | Heat dissipating device |
US20200014285A1 (en) * | 2018-07-09 | 2020-01-09 | Chicony Power Technology Co., Ltd. | Inverter integrated motor |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20110000645A1 (en) * | 2009-07-06 | 2011-01-06 | Ping Chen | Heat dissipating board structure and method of manufacturing the same |
US20130098584A1 (en) * | 2009-09-18 | 2013-04-25 | Golden Sun News Techniques Co., Ltd. | Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith |
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US20110179957A1 (en) * | 2010-01-25 | 2011-07-28 | Shyh-Ming Chen | Method for flattening heat dissipating tube and device for performing the same |
US20130008629A1 (en) * | 2011-07-05 | 2013-01-10 | Chun-Ming Wu | Thermal module and method of manufacturing same |
US20170151641A1 (en) * | 2015-11-26 | 2017-06-01 | Asia Vital Components Co., Ltd. | Heat dissipation unit manufacturing method |
US9895778B2 (en) * | 2015-11-26 | 2018-02-20 | Asia Vital Components Co., Ltd. | Heat dissipation unit manufacturing method |
US20170231116A1 (en) * | 2016-02-05 | 2017-08-10 | Auras Technology Co., Ltd. | Heat dissipating device |
US20200014285A1 (en) * | 2018-07-09 | 2020-01-09 | Chicony Power Technology Co., Ltd. | Inverter integrated motor |
US10833566B2 (en) * | 2018-07-09 | 2020-11-10 | Chicony Power Technology Co., Ltd. | Inverter integrated motor |
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