US20090301690A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20090301690A1 US20090301690A1 US12/406,087 US40608709A US2009301690A1 US 20090301690 A1 US20090301690 A1 US 20090301690A1 US 40608709 A US40608709 A US 40608709A US 2009301690 A1 US2009301690 A1 US 2009301690A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- fan
- holder
- dissipation device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to heat dissipation for electronic components and, more particularly, to a heat dissipation device utilizing a fastener to fix a fan thereof.
- Computer electronic components such as central processing units (CPUs) generate large amounts of heat during normal operation. If the heat is not properly dissipated, it can adversely affect operational stability of the electronic components and damage associated electronic devices.
- CPUs central processing units
- a heat dissipation device is attached to a top surface of a CPU to dissipate heat therefrom.
- a typical heat dissipation device includes a heat sink attached to the CPU.
- the heat sink includes a plurality of fins.
- a fan is mounted on a top of the fins of the heat sink. It is known that the fan generates vibration when operating.
- the fins, on which the fan is mounted by a clip will vibrate with the fan since the fan is directly attached thereto, whereby considerable noise is generated during operation.
- FIG. 1 is an exploded, isometric view of a heat dissipation device in accordance with the disclosure.
- FIG. 2 is a partially assembled, isometric view of the heat dissipation device in FIG. 1 .
- FIG. 3 is an enlarged isometric view of a fastener for securing a fan of the heat dissipation device in FIG. 1 .
- FIG. 4 is an inverted, assembled, isometric view of the heat dissipation device in FIG. 1 .
- a heat dissipation device in accordance with an embodiment of the disclosure dissipates heat generated by an electronic component (not shown), such as a CPU.
- the heat dissipation device comprises a substrate 10 attached to the electronic component, a fan 20 fixed on the substrate 10 by a securing device 30 , a plurality of first heat pipes 40 and a second heat pipe 50 , and a fin assembly 60 located on the substrate 10 .
- the substrate 10 comprises a substantially square main body 12 , and a supporting bar 14 angles upwardly from a lateral side of the main body 12 .
- a slot 142 is defined between the main body 12 and the supporting bar 14 .
- a step 146 is formed on a top of the supporting bar 14 .
- the main body 12 defines a rectangular hatch (not labeled) receiving a base 122 therein.
- the base 122 is near an opposite lateral side of the main body 12 and far from the supporting bar 14 .
- a bottom surface of the base 122 is attached to the electronic component.
- Three grooves 124 are defined in a top surface of the base 122 receiving the first heat pipes 40 therein. The grooves 124 are parallel to each other and parallel to the slot 142 .
- the fan 20 comprises a fan frame 22 .
- the fan frame 22 is substantially rectangular in shape.
- Four positioning holes 24 are defined in four corners of the fan frame 24 , respectively.
- the securing device 30 comprises a substantially U-shaped holder 32 and a plurality of fasteners 34 fixing the holder 32 onto the fan 20 .
- the holder 32 comprises a rectangular top plate 320 and two side plates 322 extending downwardly from two ends of the top plate 320 .
- the top and side plates 320 , 322 are wider than the fan frame 22 of the fan 20 .
- a cutout 3220 is defined in a bottom end of a lateral side, away from the substrate 10 , of each side plate 322 .
- Two first ears 3222 extend perpendicularly from top and bottom ends of another lateral side, opposite to the previous lateral side and near the substrate 10 , of each side plate 322 , respectively.
- the first ears 3222 are substantially rectangular and have four straight edges.
- the first ears 3222 of one side plate 322 extend towards the first ears 3222 of another side plate 322 , and the first ears 3222 are coplanar.
- a round hole 3223 is defined in each first ear 3222 through which the fastener 34 extends.
- a horizontal first fixing tab 3224 extends from a bottom edge of the first ear 3222 at the bottom end of each side plate 322 .
- the first fixing tab 3224 is perpendicular to the first ear 3222 and extends towards the substrate 10 .
- a second ear 3226 extends from the bottom end of the lateral side of each side plate 322 .
- Each of the second ears 3226 is located above a corresponding cutout 3220 .
- the second ears 3226 are substantially rectangular and extend towards each other, parallel to the first ears 3222 .
- a horizontal second fixing tab 3228 extends outwardly from a top edge of each of the second ears 3226 .
- the second fixing tabs 3228 are parallel and extend opposite to the first fixing tabs 3224
- a threaded hole 3229 is defined in each of the first and second fixing tabs 3224 , 3228 receiving fasteners (not shown) therein.
- each fastener 34 is integrally made of elastic material, such as rubber, and comprises a head portion 340 , a first connecting portion 341 , a sandwiched portion 342 , a second connecting portion 343 , an abutting portion 344 and an inserting portion 345 in series.
- the head portion 340 is a discal plate.
- the sandwiched portion 342 has a configuration similar with the head portion 340 , but is cut to define two parallel lateral sides 3420 . It is to be understood that, in alternative embodiments, a configuration of the sandwiched portion 342 can be a discal plate or the likes.
- the first and second connecting portions 341 , 343 and the inserting portion 345 are columned. A diameter of the first and second connecting portions 341 , 343 is less than that of the head portion 340 .
- First connecting portion 341 is shorter than second connecting portion 343 and smaller than a thickness of the first ears 3222 .
- Second connecting portion 343 is shorter than a depth of the positioning holes 24 of the fan 20 .
- the abutting portion 344 is tapered, with a diameter decreasing from the second connecting portion 343 to the inserting portion 345 .
- the maximum diameter of the abutting portion 344 matches that of the head portion 340 , and its smallest diameter matches that of the inserting portion 345 and is less than that of the second connecting portion 343 .
- the abutting portion 344 facilitates reception of the fasteners 34 in the holes 3223 of the first ears 3222 and the positioning holes 24 of the fan 20 .
- the number of first heat pipes 40 is three, all U-shaped.
- Each of the first heat pipes 40 comprises a horizontal heat absorption portion 42 and two heat dissipation portions 44 extending upwardly from two opposite ends of the heat absorption portion 42 .
- the heat absorption portions 42 of the heat pipes 40 are close to each other and received in the grooves 124 of the base 122 , absorbing heat from the electronic component.
- the heat dissipation portions 44 are parallel and received in the fin assembly 60 .
- the second heat pipe 50 is U-shaped, and comprises a horizontal heat absorption portion 52 and two heat dissipation portions 54 extending upwardly from two opposite ends thereof.
- the heat absorption portion 52 of the second heat pipe 50 is parallel to and apart from the heat absorption portions 42 of the first heat pipes 40 .
- the heat absorption portion 52 is received in the slot 142 of the substrate 10 , absorbing heat from the electronic component.
- the heat dissipation portions 54 are parallel to each other and to the heat dissipation portions 44 of the first heat pipes 40 .
- the heat dissipation portions 54 are received in the fin assembly 60 .
- the fin assembly 60 comprises a first fin unit 62 , a second fin unit 64 , a third fin unit 66 and a fourth fin unit 68 .
- the fourth fin unit 68 is arranged on the substrate 10 .
- the third fin unit 66 is arranged on the fourth fin unit 68 .
- the second fin unit 64 is arranged on the third fin unit 66 .
- the first fin unit 62 covers the second fin unit 64 .
- the first, second and third fin units 62 , 64 , 66 are substantially rectangular, with a plurality of channels (not labeled) defined therebetween.
- the first fin unit 62 comprises a first main body 620 and two first flanges 6622 extending downwardly from two lateral sides thereof.
- the second fin unit 64 comprises a plurality of parallel fins each having a rectangular second main body 640 and two second flanges 642 extending downwardly from two lateral sides thereof.
- the third fin unit 66 comprises a third main body 660 and two third flanges 662 extending downwardly from two lateral sides thereof.
- the fourth fin unit 68 comprises a fourth main body 680 and two lateral walls 682 extending downwardly from two lateral sides thereof.
- the first, second, third and fourth main bodies 620 , 640 , 660 , 680 are of an identical size and longer than the substrate 10 .
- the first flanges 622 of the same height as the second and third flanges 642 , 662 , and the walls 682 are taller than the first, second and third flanges 622 , 642 , 662 .
- a bottom of one of the walls 682 is located on the step 146 of the supporting bar 14 .
- a receiving hole 69 is defined in an end, which extrudes out of the substrate 10 , of each of the third and fourth main bodies 660 , 680 .
- the receiving holes 69 cooperate to define a receiving space 690 receiving the fan 20 and the securing device 30 therein.
- a plurality of openings 61 are defined in the first, second, third and fourth main bodies 620 , 640 , 660 , 680 , for cooling air impelled by the fan 20 flowing therethrough.
- a plurality of first holes 63 are defined in the second, third and fourth main bodies 640 , 660 , 680 , receiving the heat dissipation portions 44 of the first heat pipes 40 .
- Two second holes 641 are defined in a lateral side of the second main bodies 640 corresponding to the supporting bar 14 of the substrate 10 , receiving the heat dissipation portions 54 of the second heat pipe 50 .
- a hole 602 is defined in each of the third and fourth main bodies 660 , 680 corresponding to one of the second holes 641 of the second main bodies 640 , receiving one of the heat dissipation portions 54 of the second heat pipe 50 therein.
- Another heat dissipation portion 54 of the second heat pipe 50 is received in the receiving space 690 and is attached to the third and fourth main bodies 660 , 680 .
- the heat absorption portions 42 of the first heat pipes 40 are fixed in the grooves 124 of the base 122 by solder.
- the heat absorption portion 52 of the second heat pipe 50 is fixed in the slot 142 of the substrate 10 .
- the first, second, third and fourth fin units 62 , 64 , 66 , 68 are arranged on the substrate 10 in series, with one of the lateral walls 682 of the fourth fin unit 68 positioned on the step 142 of the supporting bar 14 , whereby the fin assembly 60 is supported by the supporting bar 14 .
- the heat dissipation portions 44 of the first heat pipes 40 are received in the first holes 63 of the second, third and fourth fin units 64 , 66 , 68 , and attached to the first main body 620 of the first fin unit 62 .
- One of the heat dissipation portions 54 of the second heat pipe 50 is received in the holes 602 of the fourth and third fin units 68 , 66 and corresponding second holes 641 of the second fin unit 64 in series and is attached to the first main body 620 of the first fin unit 62 .
- Another heat dissipation portion 54 of the second heat pipe 50 passes through the receiving space 690 and is received in other corresponding second holes 641 of the second fin unit 64 in series and is attached to the first main body 620 of the first fin unit 62 .
- the fan 20 is fixed in the holder 32 by the fasteners 34 .
- each fastener 34 is received in each hole 3223 of each first ear 3222 and each positioning hole 24 of the fan 20 .
- the frame 22 is sandwiched between the abutting portion 344 and the sandwiched portion 342 of the fastener 34 .
- the first ear 3222 is sandwiched between the sandwiched portion 342 and the head portion 340 of the fastener 34 .
- the frame 22 of the fan 20 is segregated from the first ears 3222 of the holder 32 by the sandwiched portions 342 of the fasteners 34 .
- the fastener 34 undergoes elastic distortion and generates a force to fittingly engage the first ears 3222 of the holder 32 with the fan 20 .
- the second ears 3226 of the holder 32 are spaced from the fan 20 .
- the fan 20 with the holder 32 is received in the receiving space 390 , with the first fixing tabs 3224 fixed to a bottom surface of the main body 12 of the substrate 10 by fasteners (not shown), and the second fixing tabs 3228 fixed to a bottom surface of the main body 680 of the fourth fin unit 68 by fasteners.
- cooling air generated by the fan 20 flows not only through the channels of the fin assembly 60 , but also through the holes 61 of the fin assembly 60 . Since the fan 20 and the holder 32 are elastically segregated by the sandwiched portions 342 of the fasteners 34 , and the fan 20 is spaced from the second ears 3226 , the vibration of the fan 20 is not directly transmitted to the fin assembly 60 via the holder 32 . Thus, vibration of the fin assembly 60 from the fan 20 is lessened, and undesirable noise generated thereby eliminated.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Field of the Invention
- The present disclosure relates to heat dissipation for electronic components and, more particularly, to a heat dissipation device utilizing a fastener to fix a fan thereof.
- 2. Description of Related Art
- Computer electronic components, such as central processing units (CPUs), generate large amounts of heat during normal operation. If the heat is not properly dissipated, it can adversely affect operational stability of the electronic components and damage associated electronic devices.
- Usually, a heat dissipation device is attached to a top surface of a CPU to dissipate heat therefrom. A typical heat dissipation device includes a heat sink attached to the CPU. The heat sink includes a plurality of fins. A fan is mounted on a top of the fins of the heat sink. It is known that the fan generates vibration when operating. The fins, on which the fan is mounted by a clip, will vibrate with the fan since the fan is directly attached thereto, whereby considerable noise is generated during operation.
- What is needed, therefore, is an improved heat dissipation device which can overcome the described limitations.
- Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of a heat dissipation device in accordance with the disclosure. -
FIG. 2 is a partially assembled, isometric view of the heat dissipation device inFIG. 1 . -
FIG. 3 is an enlarged isometric view of a fastener for securing a fan of the heat dissipation device inFIG. 1 . -
FIG. 4 is an inverted, assembled, isometric view of the heat dissipation device inFIG. 1 . - Referring to
FIG. 1 , a heat dissipation device in accordance with an embodiment of the disclosure dissipates heat generated by an electronic component (not shown), such as a CPU. The heat dissipation device comprises asubstrate 10 attached to the electronic component, afan 20 fixed on thesubstrate 10 by asecuring device 30, a plurality offirst heat pipes 40 and asecond heat pipe 50, and afin assembly 60 located on thesubstrate 10. - Also referring to
FIG. 2 , thesubstrate 10 comprises a substantially squaremain body 12, and a supportingbar 14 angles upwardly from a lateral side of themain body 12. Aslot 142 is defined between themain body 12 and the supportingbar 14. Astep 146 is formed on a top of the supportingbar 14. Themain body 12 defines a rectangular hatch (not labeled) receiving abase 122 therein. Thebase 122 is near an opposite lateral side of themain body 12 and far from the supportingbar 14. A bottom surface of thebase 122 is attached to the electronic component. Threegrooves 124 are defined in a top surface of thebase 122 receiving thefirst heat pipes 40 therein. Thegrooves 124 are parallel to each other and parallel to theslot 142. - The
fan 20 comprises afan frame 22. Thefan frame 22 is substantially rectangular in shape. Fourpositioning holes 24 are defined in four corners of thefan frame 24, respectively. - The
securing device 30 comprises a substantiallyU-shaped holder 32 and a plurality offasteners 34 fixing theholder 32 onto thefan 20. - The
holder 32 comprises arectangular top plate 320 and twoside plates 322 extending downwardly from two ends of thetop plate 320. The top andside plates fan frame 22 of thefan 20. Acutout 3220 is defined in a bottom end of a lateral side, away from thesubstrate 10, of eachside plate 322. Twofirst ears 3222 extend perpendicularly from top and bottom ends of another lateral side, opposite to the previous lateral side and near thesubstrate 10, of eachside plate 322, respectively. Thefirst ears 3222 are substantially rectangular and have four straight edges. Thefirst ears 3222 of oneside plate 322 extend towards thefirst ears 3222 of anotherside plate 322, and thefirst ears 3222 are coplanar. Around hole 3223 is defined in eachfirst ear 3222 through which thefastener 34 extends. A horizontalfirst fixing tab 3224 extends from a bottom edge of thefirst ear 3222 at the bottom end of eachside plate 322. Thefirst fixing tab 3224 is perpendicular to thefirst ear 3222 and extends towards thesubstrate 10. Asecond ear 3226 extends from the bottom end of the lateral side of eachside plate 322. Each of thesecond ears 3226 is located above acorresponding cutout 3220. Thesecond ears 3226 are substantially rectangular and extend towards each other, parallel to thefirst ears 3222. A horizontalsecond fixing tab 3228 extends outwardly from a top edge of each of thesecond ears 3226. Thesecond fixing tabs 3228 are parallel and extend opposite to the first fixing tabs 3224 A threadedhole 3229 is defined in each of the first andsecond fixing tabs - Corresponding to the number of the
first ears 3222, the number offasteners 34 is four. Referring toFIG. 3 , eachfastener 34 is integrally made of elastic material, such as rubber, and comprises ahead portion 340, a first connectingportion 341, a sandwichedportion 342, a second connectingportion 343, anabutting portion 344 and aninserting portion 345 in series. - The
head portion 340 is a discal plate. The sandwichedportion 342 has a configuration similar with thehead portion 340, but is cut to define two parallellateral sides 3420. It is to be understood that, in alternative embodiments, a configuration of the sandwichedportion 342 can be a discal plate or the likes. The first and second connectingportions inserting portion 345 are columned. A diameter of the first and second connectingportions head portion 340. First connectingportion 341 is shorter than second connectingportion 343 and smaller than a thickness of thefirst ears 3222. Second connectingportion 343 is shorter than a depth of thepositioning holes 24 of thefan 20. Theabutting portion 344 is tapered, with a diameter decreasing from the second connectingportion 343 to theinserting portion 345. The maximum diameter of the abuttingportion 344 matches that of thehead portion 340, and its smallest diameter matches that of theinserting portion 345 and is less than that of the second connectingportion 343. The abuttingportion 344 facilitates reception of thefasteners 34 in theholes 3223 of thefirst ears 3222 and thepositioning holes 24 of thefan 20. - Referring to
FIGS. 1 and 2 , the number offirst heat pipes 40 is three, all U-shaped. Each of thefirst heat pipes 40 comprises a horizontalheat absorption portion 42 and twoheat dissipation portions 44 extending upwardly from two opposite ends of theheat absorption portion 42. Theheat absorption portions 42 of theheat pipes 40 are close to each other and received in thegrooves 124 of thebase 122, absorbing heat from the electronic component. Theheat dissipation portions 44 are parallel and received in thefin assembly 60. - The
second heat pipe 50 is U-shaped, and comprises a horizontalheat absorption portion 52 and twoheat dissipation portions 54 extending upwardly from two opposite ends thereof. Theheat absorption portion 52 of thesecond heat pipe 50 is parallel to and apart from theheat absorption portions 42 of thefirst heat pipes 40. Theheat absorption portion 52 is received in theslot 142 of thesubstrate 10, absorbing heat from the electronic component. Theheat dissipation portions 54 are parallel to each other and to theheat dissipation portions 44 of thefirst heat pipes 40. Theheat dissipation portions 54 are received in thefin assembly 60. - The
fin assembly 60 comprises afirst fin unit 62, asecond fin unit 64, athird fin unit 66 and afourth fin unit 68. Thefourth fin unit 68 is arranged on thesubstrate 10. Thethird fin unit 66 is arranged on thefourth fin unit 68. Thesecond fin unit 64 is arranged on thethird fin unit 66. Thefirst fin unit 62 covers thesecond fin unit 64. - The first, second and
third fin units first fin unit 62 comprises a firstmain body 620 and two first flanges 6622 extending downwardly from two lateral sides thereof. Thesecond fin unit 64 comprises a plurality of parallel fins each having a rectangular secondmain body 640 and twosecond flanges 642 extending downwardly from two lateral sides thereof. Thethird fin unit 66 comprises a thirdmain body 660 and twothird flanges 662 extending downwardly from two lateral sides thereof. Thefourth fin unit 68 comprises a fourthmain body 680 and twolateral walls 682 extending downwardly from two lateral sides thereof. The first, second, third and fourthmain bodies substrate 10. Thefirst flanges 622 of the same height as the second andthird flanges walls 682 are taller than the first, second andthird flanges walls 682 is located on thestep 146 of the supportingbar 14. - A receiving
hole 69 is defined in an end, which extrudes out of thesubstrate 10, of each of the third and fourthmain bodies space 690 receiving thefan 20 and the securingdevice 30 therein. A plurality ofopenings 61 are defined in the first, second, third and fourthmain bodies fan 20 flowing therethrough. A plurality offirst holes 63 are defined in the second, third and fourthmain bodies heat dissipation portions 44 of thefirst heat pipes 40. Twosecond holes 641 are defined in a lateral side of the secondmain bodies 640 corresponding to the supportingbar 14 of thesubstrate 10, receiving theheat dissipation portions 54 of thesecond heat pipe 50. Ahole 602 is defined in each of the third and fourthmain bodies second holes 641 of the secondmain bodies 640, receiving one of theheat dissipation portions 54 of thesecond heat pipe 50 therein. Anotherheat dissipation portion 54 of thesecond heat pipe 50 is received in the receivingspace 690 and is attached to the third and fourthmain bodies - During assembly, the
heat absorption portions 42 of thefirst heat pipes 40 are fixed in thegrooves 124 of the base 122 by solder. Theheat absorption portion 52 of thesecond heat pipe 50 is fixed in theslot 142 of thesubstrate 10. The first, second, third andfourth fin units substrate 10 in series, with one of thelateral walls 682 of thefourth fin unit 68 positioned on thestep 142 of the supportingbar 14, whereby thefin assembly 60 is supported by the supportingbar 14. Theheat dissipation portions 44 of thefirst heat pipes 40 are received in thefirst holes 63 of the second, third andfourth fin units main body 620 of thefirst fin unit 62. One of theheat dissipation portions 54 of thesecond heat pipe 50 is received in theholes 602 of the fourth andthird fin units second holes 641 of thesecond fin unit 64 in series and is attached to the firstmain body 620 of thefirst fin unit 62. Anotherheat dissipation portion 54 of thesecond heat pipe 50 passes through the receivingspace 690 and is received in other correspondingsecond holes 641 of thesecond fin unit 64 in series and is attached to the firstmain body 620 of thefirst fin unit 62. - The
fan 20 is fixed in theholder 32 by thefasteners 34. Specifically, eachfastener 34 is received in eachhole 3223 of eachfirst ear 3222 and eachpositioning hole 24 of thefan 20. Theframe 22 is sandwiched between the abuttingportion 344 and the sandwichedportion 342 of thefastener 34. Thefirst ear 3222 is sandwiched between the sandwichedportion 342 and thehead portion 340 of thefastener 34. Theframe 22 of thefan 20 is segregated from thefirst ears 3222 of theholder 32 by the sandwichedportions 342 of thefasteners 34. Since the first connectingportion 341 is slightly shorter than the thickness of thefirst ear 3222, and the second connectingportion 343 is slightly shorter than the depth of thepositioning hole 24 of thefan 20, thefastener 34 undergoes elastic distortion and generates a force to fittingly engage thefirst ears 3222 of theholder 32 with thefan 20. Thesecond ears 3226 of theholder 32 are spaced from thefan 20. Thefan 20 with theholder 32 is received in the receiving space 390, with thefirst fixing tabs 3224 fixed to a bottom surface of themain body 12 of thesubstrate 10 by fasteners (not shown), and thesecond fixing tabs 3228 fixed to a bottom surface of themain body 680 of thefourth fin unit 68 by fasteners. - In use, cooling air generated by the
fan 20 flows not only through the channels of thefin assembly 60, but also through theholes 61 of thefin assembly 60. Since thefan 20 and theholder 32 are elastically segregated by the sandwichedportions 342 of thefasteners 34, and thefan 20 is spaced from thesecond ears 3226, the vibration of thefan 20 is not directly transmitted to thefin assembly 60 via theholder 32. Thus, vibration of thefin assembly 60 from thefan 20 is lessened, and undesirable noise generated thereby eliminated. - It is believed that the present disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN200810067578.3 | 2008-06-04 | ||
CNA2008100675783A CN101600319A (en) | 2008-06-04 | 2008-06-04 | Heat abstractor |
Publications (1)
Publication Number | Publication Date |
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US20090301690A1 true US20090301690A1 (en) | 2009-12-10 |
Family
ID=41399221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/406,087 Abandoned US20090301690A1 (en) | 2008-06-04 | 2009-03-17 | Heat dissipation device |
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US (1) | US20090301690A1 (en) |
CN (1) | CN101600319A (en) |
Families Citing this family (2)
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CN102196707A (en) * | 2010-03-08 | 2011-09-21 | 富准精密工业(深圳)有限公司 | Heat radiating device |
CN102213984A (en) * | 2010-04-09 | 2011-10-12 | 鸿富锦精密工业(深圳)有限公司 | Heat radiating system |
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- 2008-06-04 CN CNA2008100675783A patent/CN101600319A/en active Pending
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