US20070023386A1 - Hollow microneedle array - Google Patents
Hollow microneedle array Download PDFInfo
- Publication number
- US20070023386A1 US20070023386A1 US11/542,974 US54297406A US2007023386A1 US 20070023386 A1 US20070023386 A1 US 20070023386A1 US 54297406 A US54297406 A US 54297406A US 2007023386 A1 US2007023386 A1 US 2007023386A1
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- United States
- Prior art keywords
- array
- hollow microneedle
- cross
- sectional dimension
- bore
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- Abandoned
Links
- 239000011521 glass Substances 0.000 claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- -1 germanium ions Chemical class 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- OUFSPJHSJZZGCE-UHFFFAOYSA-N aluminum lithium silicate Chemical compound [Li+].[Al+3].[O-][Si]([O-])([O-])[O-] OUFSPJHSJZZGCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000005368 silicate glass Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 15
- 238000003491 array Methods 0.000 abstract description 11
- 239000012530 fluid Substances 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 230000006377 glucose transport Effects 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 3
- 241001465754 Metazoa Species 0.000 abstract 1
- 229920000249 biocompatible polymer Polymers 0.000 abstract 1
- 230000003362 replicative effect Effects 0.000 abstract 1
- 239000006090 Foturan Substances 0.000 description 17
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000001878 scanning electron micrograph Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 5
- 239000008280 blood Substances 0.000 description 5
- 210000004369 blood Anatomy 0.000 description 5
- 239000008103 glucose Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002178 crystalline material Substances 0.000 description 3
- 238000012377 drug delivery Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005459 micromachining Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 208000012266 Needlestick injury Diseases 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 210000001124 body fluid Anatomy 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000708 deep reactive-ion etching Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 210000001519 tissue Anatomy 0.000 description 2
- 238000013271 transdermal drug delivery Methods 0.000 description 2
- 241000321453 Paranthias colonus Species 0.000 description 1
- 238000001015 X-ray lithography Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000013060 biological fluid Substances 0.000 description 1
- 230000031018 biological processes and functions Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 206010012601 diabetes mellitus Diseases 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000003722 extracellular fluid Anatomy 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000003306 harvesting Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000002906 microbiologic effect Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013642 negative control Substances 0.000 description 1
- 210000000929 nociceptor Anatomy 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000037368 penetrate the skin Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 231100000245 skin permeability Toxicity 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000008733 trauma Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M37/00—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
- A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/002—Other surface treatment of glass not in the form of fibres or filaments by irradiation by ultraviolet light
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/007—Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M37/00—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
- A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
- A61M2037/0053—Methods for producing microneedles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/055—Microneedles
Definitions
- the present invention relates to hollow microneedle arrays and, in particular, to hollow microneedle array comprising a photoetchable glass, polymer, or metal.
- Hollow microneedle arrays are being developed for transdermal drug delivery and the withdrawal of body fluids for biomedical and other applications.
- the hollow microneedle array can provide a minimally invasive means to transport relatively large molecules into and out of the skin. Microneedles are desirable because their small size and extremely sharp tip reduces insertion pain and tissue trauma to the patient.
- the length of the microneedles can be kept short enough to not penetrate to the pain receptors in the inner layers of the skin.
- the bore of the hollow microneedles can be large enough to provide a relatively rapid rate of drug delivery or withdrawal of bodily fluid.
- microneedle arrays may replace painful hypodermic needles or syringes used for the sampling of biological fluids (e.g., blood or interstitial fluid).
- biological fluids e.g., blood or interstitial fluid.
- biological fluids e.g., blood or interstitial fluid.
- Microneedle arrays may enable the diabetic to routinely sample blood sugar levels in a pain-free manner.
- out-of-plane microneedles With out-of-plane microneedles, the longitudinal axis of the microneedles is perpendicular to the wafer. These microneedles are typically short (e.g., less than a few hundred microns) and only penetrate the outer barrier layers of the skin. Out-of-plane needles can typically be made with a large density of needles per chip. Therefore, two-dimensional arrays of microneedles have been used to obtain adequate fluid flow at reasonable pumping rates. See, e.g., P. Zhang et al., “Micromachined Needles for Microbiological Sample and Drug Delivery System,” Proc. Intl. Conf. MEMS, NANO, and Smart Systems ( ICMENS' 03), Jul.
- microneedles with the correct geometry and physical properties can be inserted into the skin.
- the safety margin for needle breakage, or the ratio of microneedle fracture force to skin insertion force has been found to be optimum for needles having a small tip radius and large wall thickness. See M. R. Prausnitz, “Microneedles for transdermal drug delivery,” Advanced Druq Delivery Reviews 56, 581 (2004).
- Microneedle arrays have been fabricated by a number of micromachining processes. Out-of-plane microneedles have typically been fabricated using bulk micromachining or LIGA techniques (LIGA is the German acronym for X-ray lithography, electrodeposition, and molding). Therefore, most of these microneedles have been made of silicon or metals. Silicon bulk micromachining has used either deep reactive ion etching (DRIE) alone or in combination with KOH etching to form the hollow microneedles.
- DRIE deep reactive ion etching
- the present invention provides a method to fabricate hollow microneedle arrays using a photoetchable glass wafer that solves these problems.
- the present invention is directed to a hollow microneedle array, comprising at least one hollow microneedle, comprising a photoetchable glass, a polymer, or a metal, wherein the at least one hollow microneedle has a height, a bore with a cross-sectional dimension, and a tip with a cross-sectional dimension.
- the height of the hollow microneedle can be less than 1 millimeter
- the bore can have a cross-sectional dimension of greater than 25 microns
- the tip can have a cross-sectional dimension of greater than 100 microns and less than 300 microns.
- the bore can be offset from the center of the tip.
- the photoetchable glass can comprise a lithium-aluminum-silicate glass containing silver and germanium ions.
- the polymer can comprise a cast, hot embossed, or injection molded polymer.
- the metal can comprise an electroplated metal, such as nickel, copper, or gold.
- FIGS. 1A-1E show a schematic illustration of a method to fabricate a glass hollow microneedle array using a photoetchable glass wafer.
- FIG. 2 shows a bottomside view photograph of a heat-treated image of a round bore and a circular patterned photoresist on the topside of a transparent Foturan® glass wafer after a first exposure to UV light.
- FIG. 3 shows a topside view photograph of heat-treated images of the regions between the microneedles and the round bores of a glass microneedle array after a second exposure to UV light.
- FIG. 4 shows a scanning electron micrograph (SEM) of a single glass hollow tapered microneedle.
- FIG. 5 shows a SEM of a portion of a 4 by 11 rectangular array of the glass hollow microneedles.
- FIG. 6 shows a SEM of a glass hollow microneedle piercing a 100-micron-thickness sheet of aluminum foil.
- FIGS. 7A-7E show a schematic illustration of a method to fabricate a negative mold of a hollow microneedle array using a photoetchable glass wafer.
- FIG. 8 shows a graph of glucose extraction rates through porcine skin with and without a hollow microneedle array.
- Photoetchable glasses have several advantages for the fabrication of a wide variety of microsystems components. High-aspect-ratio microstructures can be mass produced relatively inexpensively with these glasses using conventional semiconductor processing equipment. Glasses have high temperature stability, good mechanical properties, are electrically insulating, and have better chemical resistant than plastics and many metals. A particularly attractive photoetchable glass is Foturan®, made by Schott Corporation and imported into the U.S. by Invenios Inc. Foturan® comprises a lithium-aluminum-silicate glass containing traces of silver and germanium ions.
- the germanium When exposed to UV-light within the absorption band of the metal ion dopants in the glass, the germanium acts as a sensitizer, absorbing a photon and stripping an electron that reduces neighboring silver ions to form colloidal silver atoms. These silver colloids provide nucleation sites for crystallization of the surrounding glass. If exposed to UV light through a mask, only the exposed regions of the glass will crystallize during subsequent heat treatment at a temperature greater than the glass transformation temperature (e.g., greater than 450° C. in air for Foturan®). These nucleated lithium metasilicate crystals typically have diameters of 1-10 microns. The crystalline phase is more soluble in hydrofluoric acid (HF) than the unexposed vitreous, amorphous regions.
- HF hydrofluoric acid
- the crystalline regions are preferentially etched about 20 times faster than the amorphous regions in 10% HF, enabling microstructures with aspect ratios of about 20:1 to be formed when the exposed regions are removed. Therefore, this process can produce holes of greater than about 25 microns with a sidewall slope of about 1-4°. See T. R. Dietrich et al., “Fabrication technologies for microsystems utilizing photoetchable glass,” Microelectronic Engineering 30, 497 (1996), which is incorporated herein by reference.
- FIGS. 1A-1E is shown a schematic illustration of a preferred method to fabricate a hollow microneedle array, comprising at least one hollow microneedle, using a photoetchable glass wafer.
- the preferred method comprises exposing the photoetchable glass wafer to ultraviolet light through a patterned mask to define a latent image of a bore of at least one hollow microneedle in the glass wafer; heating the glass wafer to a temperature in excess of the glass transformation temperature to transform the amorphous material in the latent image of the exposed bore of the at least one microneedle to a crystalline material, thereby providing an crystallized image of the bore of the at least one microneedle in the glass wafer; exposing the glass wafer to ultraviolet light through a patterned mask to define a latent image of the regions between the at least one hollow microneedle; heating the glass wafer to a temperature in excess of the glass transformation temperature to transform the amorphous material in the exposed latent image of the between regions to a crystalline material,
- a thick photoetchable glass wafer 11 is exposed to deep UV light through a hard lithography mask 12 to define a latent image 13 of the bore of the at least one hollow microneedle.
- the photoetchable glass wafer 11 preferably comprises Foturan® Microglass (Invenios, Inc).
- the wavelength of the UV light preferably corresponds to the absorption band for the sensitizing ion dopant dispersed in the glass.
- the energy density of the UV light and the exposure time are preferably sufficient to expose the latent image 13 through the thickness of the wafer 11 .
- a deep UV light source (e.g., available from ABM Corp.) can be used and the intensity of the light source at a wavelength of 240 nm can be about 16.5 mw/cm 2 .
- the exposure time can be about 4 hours. Using a more intense light source can shorten the exposure time.
- the mask 12 can be a fused silica photolithography mask, which blocks the deep UV light in the unopen portions of the mask.
- the openings in the mask preferably define at least one circular bore-hole, although other cross-sections can also be used.
- the bores are preferable small enough to provide a microneedle that easily penetrates the skin, yet also large enough to enable adequate fluid flow.
- the diameter of the circular bore-holes is preferably greater than 25 microns and, more preferably, greater than 100 microns.
- the exposed Foturan® wafer 11 is heat treated at a temperature greater than the glass transformation temperature for a time duration sufficient to convert the exposed amorphous latent image regions to the crystalline phase.
- the exposed Foturan® glass wafer can be heat treated at 600° C. for 1 hour. This heat treatment converts the amorphous-phase latent image regions to crystalline-phase image regions 14 that can be etched later to form the through-hole bores 18 of the hollow microneedles 19 .
- a negative acting photoresist e.g., JSR Microposit
- the photoresist mask 15 blocks the areas that will form the walls of the hollow microneedles from exposure to the deep-UV light. Therefore, the UV exposure defines a latent image 16 of the region between the microneedles that are to be removed by etching. If the tip is too small, the microneedle may shear upon insertion into the skin.
- the wall thickness of the body of the microneedle at the tip is preferably about 50 microns or greater.
- the photoresist pattern preferably provides a circular microneedle, after etching, having a tip diameter of greater than 100 microns and, preferably, less than 300 microns. Other microneedle tip cross-sections and dimensions can be used.
- the photoresist mask 15 can be patterned so that the bore 18 is offset from the tip of the microneedle 19 , thereby reducing clogging of the bore which can occur when the fluid outlet is at the tip of the needle.
- the photoresist-masked glass wafer 11 is then exposed again to the deep-UV light for a sufficient period of time to define the height of the microneedles. For example, for 400-500 micron tall microneedles in Foturan®, the second exposure can be 35 minutes using the UV light source described above.
- the exposed glass wafer 11 can be cleaned of the photoresist and heat treated to crystallize the latent image 16 defined by the second exposure.
- Heat treatment of the twice-exposed Foturan® for an additional 1 hour at 600° C. will form crystallized image regions 17 between the microneedles, in addition to the previously formed crystallized images 14 of the bores.
- the surface of the wafer can be lapped.
- the glass wafer 11 is etched to remove the crystallized image regions 14 to form the bores 18 and to remove the crystallized image regions 17 to form the spacings between the hollow microneedles 19 .
- the backside of the wafer can be covered with photoresist (not shown) to prevent etching of the wafer backside.
- the Foturan® glass wafer can be etched for 40 minutes in unbuffered 10:1 HF solution.
- the crystalline material preferentially etches 20:1 times faster then the vitreous material in a 10:1 HF solution, using an ultrasonic bath.
- the wet chemical etch is anisotropic, an array of hollow microneedles 10 with sloped sidewalls and a small tip radius is formed, as is preferred for penetration of the skin.
- the etching time can be adjusted to obtain the desired microneedle height and cross-sectional dimensions.
- both UV exposures can be done sequentially to define the latent images of the regions between the microneedles and the bores, followed by a single heat treatment, albeit while sacrificing mask alignment accuracy.
- a first exposure of the regions between the microneedles can produce enough darkening by itself (apparently due to the formation of isolated silver atoms) to enable alignment of the bore mask to the faintly darkened latent image 16 of the between regions.
- the exposed wafer can be heat treated to crystallize both latent images 16 and 13 simultaneously to form crystallized images of both the between regions 17 and the bores 14 .
- the crystallized images can then be etched to form the glass hollow microneedle array.
- the bores can be defined in a first exposure and the between region mask aligned to the darkened latent image of the bores for a second exposure of the between regions, followed by a single heat treatment.
- FIG. 2 is shown a bottomside view photograph of a dark-shaded, crystallized image 14 of a circular bore and a circular patterned photoresist 15 on the topside of a transparent Foturan® glass wafer after a first exposure to UV light and a first heat treatment, but before the second exposure, according to the preferred method shown in FIGS. 1A and 1B .
- FIG. 3 is shown a topside view photograph of the dark-shaded, crystallized image 17 the spacings between the outsides of the microneedles in an array, in addition to the previously formed dark-shaded crystallized images 14 of the circular bores, after a second exposure to UV light and a second heat treatment, but before etching, according to the preferred method shown in FIGS. 1A to 1 D.
- the light-shaded regions surrounding each dark-shaded bore corresponds to the unexposed vitreous regions underneath the patterned photoresist 15 in FIG. 2 .
- the center-to-center spacing of the light-shaded vitreous regions is about 1 mm.
- Each light-shaded vitreous region has a diameter of about 350 microns, before etching.
- the diameter of each exposed, dark-shaded bore region is about 50 microns, before etching.
- the bores are offset from the center of the microneedle tip by about 50 microns.
- FIG. 4 is shown a scanning electron micrograph (SEM) of a single glass hollow microneedle 19 , after etching.
- the microneedle is about 400-500 micrometers tall with through-holes 18 that are 1 mm deep.
- the outside diameter of the tapered microneedle 19 at the base is about 350 microns and about 200 microns at the tip.
- the diameter of the offset bore 18 at the microneedle tip is about 200 microns.
- FIG. 5 is shown an SEM of a portion of a 4 by 11 rectangular array 10 of the glass hollow microneedles.
- the center-to-center spacing between adjacent microneedles is about 1.0 mm.
- FIG. 6 is shown an SEM of a glass hollow microneedle piercing a 100-micron-thickness sheet of aluminum foil.
- the foil piercing demonstrates the inherent strength of the Foturan® glass microneedles.
- a negative mold can be made by depositing a mold material onto the glass hollow microneedle array.
- a negative mold of Foturan® microneedles can be made by electroplating a metal (e.g., nickel, copper, or gold) onto a sputtered seed layer deposited on the Foturan® microneedles. After the negative plated mold is created and released from the glass array; a liquid polymer, such as Zeonor 1020R, can be cast into the mold.
- the polymeric hollow microneedle array can be easily peeled off the plated negative mold and the mold can be re-used.
- Other plastics that can be hot embossed or injection molded, such as polycarbonate, can also be used.
- a negative mold can be made directly of the photoetchable glass, as shown in FIGS. 7A-7E .
- a photoetchable glass wafer 21 is exposed to the deep UV light through a lithography mask 22 to define a latent image 23 of the regions between the microneedles to a depth partially through the thickness of the wafer 21 .
- the exposed wafer is heat-treated to convert the amorphous-phase latent image regions 23 to crystalline-phase image regions 24 .
- a photoresist 25 is patterned onto the front side of the once heat-treated glass wafer using the darkened crystalline image regions 24 as a reference.
- the photoresist 25 can be patterned to block the areas that will form the bores and regions between the microneedles.
- the UV exposure can be sufficient to define a latent image 26 of the wall regions of the microneedles to a depth that is greater than the first exposure.
- the exposed wafer can be heat treated a second time to crystallize the latent image 26 from the second exposure and provide crystallized images 27 of the wall regions of the microneedles.
- the crystallized image regions 24 and 27 of the glass wafer can be etched to provide a glass negative mold 20 .
- a structural material can then be molded into the negative mold.
- a polymer can be cast or injection molded, or a metal can be electroplated, into the negative mold.
- the negative mold can be removed to provide a microneedle array of the structural material.
- the posts 28 of the negative mold 20 thereby provide the hollow bores and the recessed regions 29 of the negative mold provide the walls of the microneedles.
- both exposures can be done sequentially to define the latent images of the regions between the microneedles 23 and the wall regions 26 .
- the twice-exposed wafer can then be heat treated to crystallize both latent images 23 and 26 simultaneously to form crystallized images of both the in-between regions 24 and the wall regions 27 .
- the crystallized images can then be etched to form the glass negative mold.
- FIG. 8 is shown a graph of glucose extraction rates through porcine skin with and without the glass microneedle array shown in FIG. 5 .
- the present invention has been described as a hollow microneedle array comprising a photoetchable glass, polymer, or metal. It will be understood that the above description is merely illustrative of the applications of the principles of the present invention, the scope of which is to be determined by the claims viewed in light of the specification. Other variants and modifications of the invention will be apparent to those of skill in the art.
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Abstract
An inexpensive and rapid method for fabricating arrays of hollow microneedles uses a photoetchable glass. Furthermore, the glass hollow microneedle array can be used to form a negative mold for replicating microneedles in biocompatible polymers or metals. These microneedle arrays can be used to extract fluids from plants or animals. Glucose transport through these hollow microneedles arrays has been found to be orders of magnitude more rapid than natural diffusion.
Description
- This application is a continuation of U.S. application Ser. No. 10/936,360, filed Sep. 8, 2004, which is incorporated herein by reference.
- This invention was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention.
- The present invention relates to hollow microneedle arrays and, in particular, to hollow microneedle array comprising a photoetchable glass, polymer, or metal.
- Hollow microneedle arrays are being developed for transdermal drug delivery and the withdrawal of body fluids for biomedical and other applications. The hollow microneedle array can provide a minimally invasive means to transport relatively large molecules into and out of the skin. Microneedles are desirable because their small size and extremely sharp tip reduces insertion pain and tissue trauma to the patient. The length of the microneedles can be kept short enough to not penetrate to the pain receptors in the inner layers of the skin. Furthermore, the bore of the hollow microneedles can be large enough to provide a relatively rapid rate of drug delivery or withdrawal of bodily fluid. For drug delivery, the use of micron-size needle arrays increases skin permeability due to the needle's penetration of the outer layer of the skin, enabling the drugs to enter the body at therapeutically useful rates. Likewise, hollow microneedle arrays may replace painful hypodermic needles or syringes used for the sampling of biological fluids (e.g., blood or interstitial fluid). For example, for diabetics it is necessary to monitor and control blood sugar levels during the course of a day. The most common approach to monitor blood sugar is to stick the finger with a small needle and measure sugar level in the blood drop that forms at the site of the needle-stick. As a result, the patient may become sensitized to the frequent, painful needle-sticks, perhaps to the point of avoidance, and the sampling protocol is problematic. Microneedle arrays may enable the diabetic to routinely sample blood sugar levels in a pain-free manner.
- With out-of-plane microneedles, the longitudinal axis of the microneedles is perpendicular to the wafer. These microneedles are typically short (e.g., less than a few hundred microns) and only penetrate the outer barrier layers of the skin. Out-of-plane needles can typically be made with a large density of needles per chip. Therefore, two-dimensional arrays of microneedles have been used to obtain adequate fluid flow at reasonable pumping rates. See, e.g., P. Zhang et al., “Micromachined Needles for Microbiological Sample and Drug Delivery System,” Proc. Intl. Conf. MEMS, NANO, and Smart Systems (ICMENS'03), Jul. 20-23, 2003, Banff, Alberta, Canada. However, only microneedles with the correct geometry and physical properties can be inserted into the skin. In particular, the safety margin for needle breakage, or the ratio of microneedle fracture force to skin insertion force, has been found to be optimum for needles having a small tip radius and large wall thickness. See M. R. Prausnitz, “Microneedles for transdermal drug delivery,” Advanced Druq Delivery Reviews 56, 581 (2004).
- Microneedle arrays have been fabricated by a number of micromachining processes. Out-of-plane microneedles have typically been fabricated using bulk micromachining or LIGA techniques (LIGA is the German acronym for X-ray lithography, electrodeposition, and molding). Therefore, most of these microneedles have been made of silicon or metals. Silicon bulk micromachining has used either deep reactive ion etching (DRIE) alone or in combination with KOH etching to form the hollow microneedles. See H. J. G. E. Gardeniers et al., “Silicon Micromachined Hollow Microneedles for Transdermal Liquid Transport,” J. Microelectromechanical Systems 12(6), 855 (2003) and P. Griss et al., “Side-Opened Out-of-Plane Microneedles for Microfluidic Transdermal Liquid Transfer,” J. Microelectromechanical Systems 12(3), 296 (2003). However, these fabrication processes are long and difficult and can result in inconsistent wall slopes both in inside diameter and outside diameter of the hollow microneedles. Furthermore, the expensive capital equipment required is slow and not well-suited to eventual mass production of microneedles. Finally, at the end of the process, the silicon microneedles require oxidation so that only a biocompatible silicon dioxide surface is in contact with biological processes.
- Therefore, a simple fabrication process using inexpensive equipment, providing repeatable results, and directly producing hollow microneedles in a biocompatible substrate is needed. The present invention provides a method to fabricate hollow microneedle arrays using a photoetchable glass wafer that solves these problems.
- The present invention is directed to a hollow microneedle array, comprising at least one hollow microneedle, comprising a photoetchable glass, a polymer, or a metal, wherein the at least one hollow microneedle has a height, a bore with a cross-sectional dimension, and a tip with a cross-sectional dimension. The height of the hollow microneedle can be less than 1 millimeter, the bore can have a cross-sectional dimension of greater than 25 microns, and the tip can have a cross-sectional dimension of greater than 100 microns and less than 300 microns. The bore can be offset from the center of the tip. The photoetchable glass can comprise a lithium-aluminum-silicate glass containing silver and germanium ions. The polymer can comprise a cast, hot embossed, or injection molded polymer. The metal can comprise an electroplated metal, such as nickel, copper, or gold.
- The accompanying drawings, which are incorporated in and form part of the specification, illustrate the present invention and, together with the description, describe the invention. In the drawings, like elements are referred to by like numbers.
-
FIGS. 1A-1E show a schematic illustration of a method to fabricate a glass hollow microneedle array using a photoetchable glass wafer. -
FIG. 2 shows a bottomside view photograph of a heat-treated image of a round bore and a circular patterned photoresist on the topside of a transparent Foturan® glass wafer after a first exposure to UV light. -
FIG. 3 shows a topside view photograph of heat-treated images of the regions between the microneedles and the round bores of a glass microneedle array after a second exposure to UV light. -
FIG. 4 shows a scanning electron micrograph (SEM) of a single glass hollow tapered microneedle. -
FIG. 5 shows a SEM of a portion of a 4 by 11 rectangular array of the glass hollow microneedles. -
FIG. 6 shows a SEM of a glass hollow microneedle piercing a 100-micron-thickness sheet of aluminum foil. -
FIGS. 7A-7E show a schematic illustration of a method to fabricate a negative mold of a hollow microneedle array using a photoetchable glass wafer. -
FIG. 8 shows a graph of glucose extraction rates through porcine skin with and without a hollow microneedle array. - Photoetchable glasses have several advantages for the fabrication of a wide variety of microsystems components. High-aspect-ratio microstructures can be mass produced relatively inexpensively with these glasses using conventional semiconductor processing equipment. Glasses have high temperature stability, good mechanical properties, are electrically insulating, and have better chemical resistant than plastics and many metals. A particularly attractive photoetchable glass is Foturan®, made by Schott Corporation and imported into the U.S. by Invenios Inc. Foturan® comprises a lithium-aluminum-silicate glass containing traces of silver and germanium ions. When exposed to UV-light within the absorption band of the metal ion dopants in the glass, the germanium acts as a sensitizer, absorbing a photon and stripping an electron that reduces neighboring silver ions to form colloidal silver atoms. These silver colloids provide nucleation sites for crystallization of the surrounding glass. If exposed to UV light through a mask, only the exposed regions of the glass will crystallize during subsequent heat treatment at a temperature greater than the glass transformation temperature (e.g., greater than 450° C. in air for Foturan®). These nucleated lithium metasilicate crystals typically have diameters of 1-10 microns. The crystalline phase is more soluble in hydrofluoric acid (HF) than the unexposed vitreous, amorphous regions. In particular, the crystalline regions are preferentially etched about 20 times faster than the amorphous regions in 10% HF, enabling microstructures with aspect ratios of about 20:1 to be formed when the exposed regions are removed. Therefore, this process can produce holes of greater than about 25 microns with a sidewall slope of about 1-4°. See T. R. Dietrich et al., “Fabrication technologies for microsystems utilizing photoetchable glass,”
Microelectronic Engineering 30, 497 (1996), which is incorporated herein by reference. - In
FIGS. 1A-1E is shown a schematic illustration of a preferred method to fabricate a hollow microneedle array, comprising at least one hollow microneedle, using a photoetchable glass wafer. The preferred method comprises exposing the photoetchable glass wafer to ultraviolet light through a patterned mask to define a latent image of a bore of at least one hollow microneedle in the glass wafer; heating the glass wafer to a temperature in excess of the glass transformation temperature to transform the amorphous material in the latent image of the exposed bore of the at least one microneedle to a crystalline material, thereby providing an crystallized image of the bore of the at least one microneedle in the glass wafer; exposing the glass wafer to ultraviolet light through a patterned mask to define a latent image of the regions between the at least one hollow microneedle; heating the glass wafer to a temperature in excess of the glass transformation temperature to transform the amorphous material in the exposed latent image of the between regions to a crystalline material, thereby providing a crystallized image of the between regions in the glass wafer; and etching the glass wafer in an etchant to remove the crystallized image regions, thereby providing a glass hollow microneedle array comprising the at least one hollow microneedle. - In
FIG. 1A , a thickphotoetchable glass wafer 11 is exposed to deep UV light through ahard lithography mask 12 to define alatent image 13 of the bore of the at least one hollow microneedle. Thephotoetchable glass wafer 11 preferably comprises Foturan® Microglass (Invenios, Inc). The wavelength of the UV light preferably corresponds to the absorption band for the sensitizing ion dopant dispersed in the glass. The energy density of the UV light and the exposure time are preferably sufficient to expose thelatent image 13 through the thickness of thewafer 11. For processing hollow microneedles, a deep UV light source (e.g., available from ABM Corp.) can be used and the intensity of the light source at a wavelength of 240 nm can be about 16.5 mw/cm2. To define alatent image 13 of the bore through the entire thickness of a 1 mm Foturan® wafer at this wavelength and intensity, the exposure time can be about 4 hours. Using a more intense light source can shorten the exposure time. Themask 12 can be a fused silica photolithography mask, which blocks the deep UV light in the unopen portions of the mask. The openings in the mask preferably define at least one circular bore-hole, although other cross-sections can also be used. The bores are preferable small enough to provide a microneedle that easily penetrates the skin, yet also large enough to enable adequate fluid flow. The diameter of the circular bore-holes is preferably greater than 25 microns and, more preferably, greater than 100 microns. - In
FIG. 1B , the exposedFoturan® wafer 11 is heat treated at a temperature greater than the glass transformation temperature for a time duration sufficient to convert the exposed amorphous latent image regions to the crystalline phase. The exposed Foturan® glass wafer can be heat treated at 600° C. for 1 hour. This heat treatment converts the amorphous-phase latent image regions to crystalline-phase image regions 14 that can be etched later to form the through-hole bores 18 of thehollow microneedles 19. - In
FIG. 1C , when heat-treating is completed, a negative acting photoresist (e.g., JSR Microposit) 15 is patterned onto the front side of the Foturan® glass wafer using the darkenedcrystalline image 14 as a reference. Thephotoresist mask 15 blocks the areas that will form the walls of the hollow microneedles from exposure to the deep-UV light. Therefore, the UV exposure defines alatent image 16 of the region between the microneedles that are to be removed by etching. If the tip is too small, the microneedle may shear upon insertion into the skin. Furthermore, the wall thickness of the body of the microneedle at the tip is preferably about 50 microns or greater. If the tip is too large, the microneedle will not penetrate the skin. The photoresist pattern preferably provides a circular microneedle, after etching, having a tip diameter of greater than 100 microns and, preferably, less than 300 microns. Other microneedle tip cross-sections and dimensions can be used. Thephotoresist mask 15 can be patterned so that thebore 18 is offset from the tip of the microneedle 19, thereby reducing clogging of the bore which can occur when the fluid outlet is at the tip of the needle. The photoresist-maskedglass wafer 11 is then exposed again to the deep-UV light for a sufficient period of time to define the height of the microneedles. For example, for 400-500 micron tall microneedles in Foturan®, the second exposure can be 35 minutes using the UV light source described above. - In
FIG. 1D , the exposedglass wafer 11 can be cleaned of the photoresist and heat treated to crystallize thelatent image 16 defined by the second exposure. Heat treatment of the twice-exposed Foturan® for an additional 1 hour at 600° C. will form crystallizedimage regions 17 between the microneedles, in addition to the previously formed crystallizedimages 14 of the bores. The surface of the wafer can be lapped. - In
FIG. 1E , theglass wafer 11 is etched to remove thecrystallized image regions 14 to form thebores 18 and to remove thecrystallized image regions 17 to form the spacings between thehollow microneedles 19. The backside of the wafer can be covered with photoresist (not shown) to prevent etching of the wafer backside. The Foturan® glass wafer can be etched for 40 minutes in unbuffered 10:1 HF solution. The crystalline material preferentially etches 20:1 times faster then the vitreous material in a 10:1 HF solution, using an ultrasonic bath. Since the wet chemical etch is anisotropic, an array ofhollow microneedles 10 with sloped sidewalls and a small tip radius is formed, as is preferred for penetration of the skin. The etching time can be adjusted to obtain the desired microneedle height and cross-sectional dimensions. - Alternatively, both UV exposures can be done sequentially to define the latent images of the regions between the microneedles and the bores, followed by a single heat treatment, albeit while sacrificing mask alignment accuracy. For example, a first exposure of the regions between the microneedles can produce enough darkening by itself (apparently due to the formation of isolated silver atoms) to enable alignment of the bore mask to the faintly darkened
latent image 16 of the between regions. Following a second exposure to define thelatent image 13 of the bores, the exposed wafer can be heat treated to crystallize bothlatent images regions 17 and thebores 14. The crystallized images can then be etched to form the glass hollow microneedle array. Alternatively, the bores can be defined in a first exposure and the between region mask aligned to the darkened latent image of the bores for a second exposure of the between regions, followed by a single heat treatment. - In
FIG. 2 is shown a bottomside view photograph of a dark-shaded, crystallizedimage 14 of a circular bore and a circularpatterned photoresist 15 on the topside of a transparent Foturan® glass wafer after a first exposure to UV light and a first heat treatment, but before the second exposure, according to the preferred method shown inFIGS. 1A and 1B . - In
FIG. 3 is shown a topside view photograph of the dark-shaded, crystallizedimage 17 the spacings between the outsides of the microneedles in an array, in addition to the previously formed dark-shadedcrystallized images 14 of the circular bores, after a second exposure to UV light and a second heat treatment, but before etching, according to the preferred method shown inFIGS. 1A to 1D. The light-shaded regions surrounding each dark-shaded bore corresponds to the unexposed vitreous regions underneath the patternedphotoresist 15 inFIG. 2 . The center-to-center spacing of the light-shaded vitreous regions is about 1 mm. Each light-shaded vitreous region has a diameter of about 350 microns, before etching. The diameter of each exposed, dark-shaded bore region is about 50 microns, before etching. The bores are offset from the center of the microneedle tip by about 50 microns. - In
FIG. 4 is shown a scanning electron micrograph (SEM) of a single glasshollow microneedle 19, after etching. The microneedle is about 400-500 micrometers tall with through-holes 18 that are 1 mm deep. The outside diameter of the taperedmicroneedle 19 at the base is about 350 microns and about 200 microns at the tip. The diameter of the offset bore 18 at the microneedle tip is about 200 microns. - In
FIG. 5 is shown an SEM of a portion of a 4 by 11rectangular array 10 of the glass hollow microneedles. The center-to-center spacing between adjacent microneedles is about 1.0 mm. - In
FIG. 6 is shown an SEM of a glass hollow microneedle piercing a 100-micron-thickness sheet of aluminum foil. The foil piercing demonstrates the inherent strength of the Foturan® glass microneedles. - An even less expensive method of fabricating the microneedles is to replicate them using a negative mold made from the original glass hollow microneedle array structure. A negative mold can be made by depositing a mold material onto the glass hollow microneedle array. For example, a negative mold of Foturan® microneedles can be made by electroplating a metal (e.g., nickel, copper, or gold) onto a sputtered seed layer deposited on the Foturan® microneedles. After the negative plated mold is created and released from the glass array; a liquid polymer, such as Zeonor 1020R, can be cast into the mold. After the Zeonor 1020R is cooled and solidified, the polymeric hollow microneedle array can be easily peeled off the plated negative mold and the mold can be re-used. Other plastics that can be hot embossed or injection molded, such as polycarbonate, can also be used.
- Alternatively, a negative mold can be made directly of the photoetchable glass, as shown in
FIGS. 7A-7E . InFIG. 7A , aphotoetchable glass wafer 21 is exposed to the deep UV light through alithography mask 22 to define alatent image 23 of the regions between the microneedles to a depth partially through the thickness of thewafer 21. InFIG. 7B , the exposed wafer is heat-treated to convert the amorphous-phaselatent image regions 23 to crystalline-phase image regions 24. InFIG. 7C , aphotoresist 25 is patterned onto the front side of the once heat-treated glass wafer using the darkenedcrystalline image regions 24 as a reference. Thephotoresist 25 can be patterned to block the areas that will form the bores and regions between the microneedles. The UV exposure can be sufficient to define alatent image 26 of the wall regions of the microneedles to a depth that is greater than the first exposure. InFIG. 7D , the exposed wafer can be heat treated a second time to crystallize thelatent image 26 from the second exposure and providecrystallized images 27 of the wall regions of the microneedles. InFIG. 7E , thecrystallized image regions negative mold 20. A structural material can then be molded into the negative mold. For example, a polymer can be cast or injection molded, or a metal can be electroplated, into the negative mold. The negative mold can be removed to provide a microneedle array of the structural material. Theposts 28 of thenegative mold 20 thereby provide the hollow bores and the recessedregions 29 of the negative mold provide the walls of the microneedles. - Alternatively, as described previously, both exposures can be done sequentially to define the latent images of the regions between the
microneedles 23 and thewall regions 26. The twice-exposed wafer can then be heat treated to crystallize bothlatent images regions 24 and thewall regions 27. The crystallized images can then be etched to form the glass negative mold. - Extraction studies of the Foturan® microneedles for glucose harvesting were made. For these studies, porcine skin was used as a human skin surrogate. The skin was soaked in a deionized water bath for 4 hours to fully saturate the material. Tests were conducted using a Franz diffusion cell. A Franz diffusion cell has fluid on both sides of the porcine skin. Therefore, this method provides a better representation of diffusion through living tissue than having air on one side.
- In
FIG. 8 is shown a graph of glucose extraction rates through porcine skin with and without the glass microneedle array shown inFIG. 5 . The flux of glucose transport across the porcine skin, for the negative control, using a 21 mM glucose donor solution, was 0.0012 mM/min/cm2. The flux of glucose transport across the porcine skin, using a 21 mM glucose donor solution, with the microneedles inserted, was 0.609 mM/min/cm2, 500 times greater then the transport without the microneedles in place. Because the open area of the microneedle array is much smaller than the open area of the bare skin, a small change in concentration produces a large change in flux across the microneedle array. - The present invention has been described as a hollow microneedle array comprising a photoetchable glass, polymer, or metal. It will be understood that the above description is merely illustrative of the applications of the principles of the present invention, the scope of which is to be determined by the claims viewed in light of the specification. Other variants and modifications of the invention will be apparent to those of skill in the art.
Claims (28)
1. A hollow microneedle array, comprising at least one hollow microneedle comprising a photoetchable glass, wherein the at least one hollow microneedle has a height, a bore with a cross-sectional dimension, and a tip with a cross-sectional dimension.
2. The array of claim 1 , wherein the photoetchable glass comprises a lithium-aluminum-silicate glass containing silver and germanium ions.
3. The array of claim 1 , wherein the at least one hollow microneedle is perpendicular to a photoetchable glass wafer.
4. The array of claim 1 , wherein the height of the at least one hollow microneedle is less than 1 millimeter.
5. The array of claim 1 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 25 microns.
6. The array of claim 1 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.
7. The array of claim 1 , wherein the bore is offset from the center of the tip.
8. The array of claim 1 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.
9. The array of claim 1 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of less than 300 microns.
10. A hollow microneedle array, comprising at least one hollow microneedle comprising a polymer, wherein the at least one hollow microneedle has a height, a bore with a cross-sectional dimension, and a tip with a cross-sectional dimension.
11. The array of claim 10 , wherein the polymer comprises a cast polymer.
12. The array of claim 10 , wherein the polymer comprises a hot embossed polymer.
13. The array of claim 10 , wherein the polymer comprises an injection molded polymer.
14. The array of claim 10 , wherein the height of the at least one hollow microneedle is less than 1 millimeter.
15. The array of claim 10 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 25 microns.
16. The array of claim 10 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.
17. The array of claim 10 , wherein the bore is offset from the center of the tip.
18. The array of claim 10 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.
19. The array of claim 10 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of less than 300 microns.
20. A hollow microneedle array, comprising at least one hollow microneedle comprising a metal, wherein the at least one hollow microneedle has a height, a bore with a cross-sectional dimension, and a tip with a cross-sectional dimension.
21. The array of claim 20 , wherein the metal comprises an electroplated metal.
22. The array of claim 20 , wherein the metal comprises nickel, copper, or gold.
23. The array of claim 20 , wherein the height of the at least one hollow microneedle is less than 1 millimeter.
24. The array of claim 20 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 25 microns.
25. The array of claim 20 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.
26. The array of claim 20 , wherein the bore is offset from the center of the tip.
27. The array of claim 20 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.
28. The array of claim 20 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of less than 300 microns.
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