[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

US20060138247A1 - Fan control system and method and heat dissipation system of electronic equipment - Google Patents

Fan control system and method and heat dissipation system of electronic equipment Download PDF

Info

Publication number
US20060138247A1
US20060138247A1 US11/217,363 US21736305A US2006138247A1 US 20060138247 A1 US20060138247 A1 US 20060138247A1 US 21736305 A US21736305 A US 21736305A US 2006138247 A1 US2006138247 A1 US 2006138247A1
Authority
US
United States
Prior art keywords
logic
temperature
control
signal
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/217,363
Inventor
Hung-Ping Shen
Han-Tun Chen
Ho-Ching Yeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
First International Computer Inc
Original Assignee
First International Computer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by First International Computer Inc filed Critical First International Computer Inc
Assigned to FIRST INTERNATIONAL COMPUTER, INC. reassignment FIRST INTERNATIONAL COMPUTER, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, HAN-TUN, SHEN, HUNG-PING, YEH, HO-CHING
Publication of US20060138247A1 publication Critical patent/US20060138247A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209Thermal management, e.g. fan control
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops

Definitions

  • the present invention relates in general to a fan control system, and more particularly, to a fan control system that performs heat dissipation according to various temperature curves in an electronic device or an information-processing device.
  • the rotation speed of fan is controlled to provide adequate heat dissipation.
  • the rotation speed of the fan rotation is often governed by temperature control. In a typical system, only one fan is used for heat dissipation.
  • the rotation speed can be determined from a pre-determined relationship between the temperature and the rotation speed.
  • the operation range of the temperature curve is normally between the lowest 4.5-5 DCV (direct current voltage) and the highest 12-13 DCV.
  • the operation system when the user intends to watch a multi-medium film, the operation system is normally in stand-by state with a reduced heat source.
  • the fan is low-speed rotating. In other words, after the computer system is switched on, the continuous rotation of the fan is maintained.
  • a fan control system and a fan control method are provided to resolve the drawbacks as mentioned above.
  • the fan control system for an electronic apparatus includes one or more temperature sensors, a temperature control module, a first logic, a second logic, at least one control circuit and at least one fan.
  • the electronic apparatus includes a motherboard, a power supply for supplying operation power of the system and one or more integrated circuits installed in the motherboard for assisting the system operation.
  • the temperature sensor is used to detect the operation temperature of at least one component of the integrated circuit.
  • the temperature control module in communication with the temperature sensor is used to output a first logic signal corresponding to the detected temperature and a first control signal corresponding to operation status of the electronic apparatus.
  • the first logic in communication with the temperature control module is used to output a second logic signal corresponding to the first logic signal and the first control signal.
  • the second logic in communication with the first logic includes at least one relationship of fan rotation speed and operation temperature and is operative to output a second control signal according to the relationship of fan rotation speed and operation temperature corresponding to the first logic signal and the first control signal.
  • the control circuit is used to receive the second control signal and to output a voltage corresponding to the second control signal.
  • the fan is driven to rotate by the voltage.
  • the fan is installed in a power supply of the electronic apparatus, which provides power to the fan.
  • a plurality of fans is installed at various heat-generating components of the electronic apparatus, and the motherboard provides power to the fans.
  • the fan control method of an electronic apparatus includes detecting the operation temperature of the integrated circuit, generating a first logic signal according to the operation temperature and a first control signal according to operation status of the integrated circuit, generating a second logic signal according to the first logic signal and the first control signal, selecting a relationship between fan rotation speed and temperature according to the second logic signal and generating a second control signal by the relationship, and outputting a voltage according to the second control signal to make a fan to rotating.
  • the first logic outputs a second logic signal.
  • One or more than one operation relationship between the fan rotation speed and operation temperature is set up in the second logic.
  • a curve showing the relationship between the fan rotation speed and the operation temperature is selected, and a second control signal is output.
  • the control circuit can thus output a voltage to make the fan to rotating, responding to the second control signal.
  • FIG. 1 is a block diagram of a fan control system of an electronic apparatus
  • FIG. 2A shows a voltage-temperature curve used for the fan control system
  • FIG. 2B shows another voltage-temperature curve used for the fan control system
  • FIG. 2C shows another voltage-temperature curve used for the fan control system
  • FIG. 2D shows another voltage-temperature curve used for the fan control system
  • FIG. 3 shows the configuration of operation signal for the fan control system.
  • the fan control system of an electronic device includes one or more temperature sensors, a temperature control module 10 , a first logic 20 , a second logic 30 and one or more control circuits 40 .
  • the temperature sensors are referred to as the first, the second and the third temperature sensors, and the signals output thereby are referred as the first, the second and the third temperature signals, respectively.
  • the temperature module 10 and the first logic 20 are installed on a motherboard 100 of the electronic device, while the second logic 30 and the control circuit 40 are installed in a power supply 200 of the system.
  • the motherboard 100 includes a central processing unit, serving as a system operation core, memory, display card, sound card, network card and other integrated circuit chips for assisting the system operation.
  • the television card or video card and others can also be installed to provide more functions of the system.
  • the motherboard 100 may include more than one integrated circuit as the operation core.
  • the motherboard 100 may be installed in a housing that comprises a power supply 200 for supplying operation power of the system.
  • a plurality of heat dissipation fans may be installed in the housing for dissipating heat generated during operation.
  • the heat dissipation fan is also easily installed at the integrated circuit, to generate heat, such as the central processing unit.
  • the power source of the fan is provided from the power supply or the source supply module on the motherboard, for example.
  • the heat dissipation fan rotates with a speed according to the temperature, detected by the temperature sensor.
  • the electronic device includes a personal computer, a server, a video game, a multimedia computer, a multimedia player, or a personal video recording system (PVR), for example.
  • a personal computer a server, a video game, a multimedia computer, a multimedia player, or a personal video recording system (PVR), for example.
  • PVR personal video recording system
  • One or more temperature sensors may be installed on the display card, the television card, the central processing unit and the power source.
  • one or more temperature sensors are used to detect the operation temperatures of the integrated circuit such as the central processing unit and the television card.
  • the temperature control module 10 is in communication with the temperature sensor to receive the temperature detected thereby. Upon receiving the detected temperature, a first logic signal TEMP 1 - 3 is generated and output by the temperature control module 10 .
  • the number of the first logic signals corresponds to the number of temperature sensors.
  • the temperature control module 10 includes an input/output chip (super I/O) and more than one thermal control integrated circuit (IC) for receiving the temperature, detected by the temperature sensors. Alternatively, the temperature control module 10 may include either the super I/O or the thermal control IC.
  • the super I/O is operative to output a detection source circuit signal to the first logic 20 to aid the first logic 20 , to determine whether the received temperature is output from the super I/O or the thermal control IC.
  • the thermal control module 10 may also output a first control signal S 1 to the first logic 20 to inform the first logic 20 with the current operation mode.
  • the bit number of the first control signal S 1 determines the number of operation modes for the system. When the first control signal S 1 includes only one bit, the system includes two operation modes. When the first control signal S 1 includes two bits, there are four operation modes available for the system. Therefore, the bit number of the first control signals S 1 can be configured according to the system complexity and specific requirement.
  • the first control signal S 1 output by the temperature control module 10 is controlled by a basic input/output system (BIOS) of the system. It is known in the art that the temperature control module 10 can be connected to the BIOS via system management (SM bus).
  • BIOS basic input/output system
  • the first logic 20 is in communication with the temperature control module 10 to output a second logic signal L 1 in response to the first logic signal TEMP 1 - 3 and the first control signal S 1 .
  • the second logic 30 is connected to the first logic 20 .
  • a rotation speed-temperature relationship for one or more than one fan is installed in the second logic 30 .
  • a second control signal S 2 is output by the second logic 30 .
  • the control circuit 40 is connected to the second logic 30 to drive the fan rotation in response to the second control signal S 2 .
  • Each control circuit corresponds to one specific voltage-temperature curve.
  • the voltage includes the applied voltage for making the fan to rotating.
  • the first logic 20 , the second logic 30 and the control circuit 40 can be assembled by any electronic devices such as transistors and logic gates.
  • the first logic 20 and the second logic 30 include an independent electronic circuit or integrated circuit. Or alternatively, the first and second logics 20 and 30 can be integrated into a single circuit or integrated circuit.
  • the second logic 30 and the control circuit 40 include independent circuits or integrated circuits.
  • the second logic 30 and the control circuit 40 can be integrated into a single circuit or integrated circuit as desired.
  • FIGS. 2A to 2 D show several exemplary voltage-temperature curves for the control circuits 40 .
  • FIG. 2A a two-step voltage-temperature curve with a smooth transition is illustrated.
  • FIG. 2B the control circuit 40 corresponds to a linear voltage-temperature curve.
  • FIG. 2C a two-step voltage-temperature curve with abrupt transition is illustrated.
  • FIG. 2D the multiple-step voltage-temperature curve is illustrated. It will be appreciated that the voltage-temperature curve may vary according to specific requirements.
  • FIG. 3 illustrates the relationship between the temperature sensor and the control signal.
  • the electronic device includes one or more than one temperature sensor installed in the central processing unit and television card, for example.
  • a first control signal S 1 such as the signal “0” as shown in FIG. 3
  • the temperature sensor installed at the central processing unit and the temperature sensor installed at the television card will receive different temperatures received by the temperature control module 10 .
  • the detected temperatures are output to the first logic 20 , which then convert the detected temperatures into detection logic signals.
  • four temperature sensors are installed to generate four different temperature signals, converted into the detection logic signals by the first logic 20 .
  • the first logic 20 When the signals detected by the temperature sensor are ⁇ X° C., ⁇ Y1° C., ⁇ Y2° C. and ⁇ Z° C., the first logic 20 generates a second logic signal as “00” corresponding to the first logic signal “0”, such, that the second logic 30 is operative to output a second control S 2 , responding to the second logic signal “00”.
  • the first logic 20 When the signals detected by the temperature sensor are >X° C., ⁇ Y1° C., ⁇ Y2° C. and ⁇ Z° C., the first logic 20 generates a second logic signal as “11” corresponding to the first logic signal “1”, such that the second logic 30 is operative to output a second control S 2 responding to the second logic signal “11”.
  • the second logic 30 includes various temperature-voltage curves stored therein.
  • the temperature-voltage curves correspond to respective second logic signal. For example, when the second logic signal is “00”, the second control signal corresponding to “00” will be output by the second logic, to provide a corresponding voltage allowing the control circuit 40 to drive the fan to rotate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Temperature (AREA)

Abstract

A fan control system having a temperature sensor, a temperature control module, a first logic, a second logic and a fan control circuit is provided to resolve the heat problem and the noise problem. The temperature sensor is used to detect the operation temperature of an integrated circuit, and the temperature control module receives the detected temperature to output a first logic signal. According to the first logic signal, the first logic outputs a second logic signal. One or more than one operation relationship between the fan rotation speed and operation temperature is set up in the second logic. According to the second logic signal, a curve showing the relationship between the fan rotation speed and the operation temperature is selected, and a second control signal is output. The control circuit can thus output a voltage to make the fan rotating, in responding to the second control signal.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of Invention
  • The present invention relates in general to a fan control system, and more particularly, to a fan control system that performs heat dissipation according to various temperature curves in an electronic device or an information-processing device.
  • 2. Related Art
  • The advancement of computer technology has consequently increased the energy consumption. Currently, large-size heat sinks have been used to dissipate heat by natural convection or large-size fans have been used to aid in air convection. Alternatively, small- or medium-size heat sinks have been used in combination with small-size fans to dissipate heat by air convection within an enclosure. Other dissipation systems such as a water-cooling heat dissipation system or a heat pipe have been proposed as well. In the typical personal computer, the electronic apparatus or information processing devices, combination of heat sink and fan are mostly frequently used for heat dissipation. Therefore, the flow amount, pressure and bearing type are all factors that affect heat dissipation.
  • In the current heat dissipation system, the rotation speed of fan is controlled to provide adequate heat dissipation. The rotation speed of the fan rotation is often governed by temperature control. In a typical system, only one fan is used for heat dissipation. By detecting the temperature, the rotation speed can be determined from a pre-determined relationship between the temperature and the rotation speed. The operation range of the temperature curve is normally between the lowest 4.5-5 DCV (direct current voltage) and the highest 12-13 DCV.
  • As the functions provided by the computer system become more and more versatile, the noise problem caused by the fan rotation becomes more significant.
  • For example, when the user intends to watch a multi-medium film, the operation system is normally in stand-by state with a reduced heat source. According to the current fan control technique, the fan is low-speed rotating. In other words, after the computer system is switched on, the continuous rotation of the fan is maintained.
  • Most of the fans start rotation at a minimum speed or according to a single temperature curve. As the complexity or the operation mode of the system increases, a single temperature curve is insufficient to meet with the requirements of electronic products. The single temperature curve can't resolve the noise problem either.
  • It is therefore a substantially need to provide a fan operation system, operative to work in a more complex operation environment without causing significant noise.
  • BRIEF SUMMARY OF THE INVENTION
  • A fan control system and a fan control method are provided to resolve the drawbacks as mentioned above.
  • The fan control system for an electronic apparatus includes one or more temperature sensors, a temperature control module, a first logic, a second logic, at least one control circuit and at least one fan. The electronic apparatus includes a motherboard, a power supply for supplying operation power of the system and one or more integrated circuits installed in the motherboard for assisting the system operation. The temperature sensor is used to detect the operation temperature of at least one component of the integrated circuit. The temperature control module in communication with the temperature sensor is used to output a first logic signal corresponding to the detected temperature and a first control signal corresponding to operation status of the electronic apparatus. The first logic in communication with the temperature control module is used to output a second logic signal corresponding to the first logic signal and the first control signal. The second logic in communication with the first logic includes at least one relationship of fan rotation speed and operation temperature and is operative to output a second control signal according to the relationship of fan rotation speed and operation temperature corresponding to the first logic signal and the first control signal. The control circuit is used to receive the second control signal and to output a voltage corresponding to the second control signal. The fan is driven to rotate by the voltage.
  • According to the present invention, the fan is installed in a power supply of the electronic apparatus, which provides power to the fan.
  • According to the present invention, a plurality of fans is installed at various heat-generating components of the electronic apparatus, and the motherboard provides power to the fans.
  • Furthermore, the fan control method of an electronic apparatus includes detecting the operation temperature of the integrated circuit, generating a first logic signal according to the operation temperature and a first control signal according to operation status of the integrated circuit, generating a second logic signal according to the first logic signal and the first control signal, selecting a relationship between fan rotation speed and temperature according to the second logic signal and generating a second control signal by the relationship, and outputting a voltage according to the second control signal to make a fan to rotating.
  • According to the first logic signal, the first logic outputs a second logic signal. One or more than one operation relationship between the fan rotation speed and operation temperature is set up in the second logic. According to the second logic signal, a curve showing the relationship between the fan rotation speed and the operation temperature is selected, and a second control signal is output. The control circuit can thus output a voltage to make the fan to rotating, responding to the second control signal.
  • The objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
  • It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • These, as well as other features of the present invention, will become more apparent upon reference to the drawings therein:
  • FIG. 1 is a block diagram of a fan control system of an electronic apparatus;
  • FIG. 2A shows a voltage-temperature curve used for the fan control system;
  • FIG. 2B shows another voltage-temperature curve used for the fan control system;
  • FIG. 2C shows another voltage-temperature curve used for the fan control system;
  • FIG. 2D shows another voltage-temperature curve used for the fan control system; and
  • FIG. 3 shows the configuration of operation signal for the fan control system.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Detailed reference will now be made to the preferred embodiments of the present invention, examples which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or similar parts.
  • Referring to FIG. 1, the fan control system of an electronic device includes one or more temperature sensors, a temperature control module 10, a first logic 20, a second logic 30 and one or more control circuits 40. For the convenience of discussion, the temperature sensors are referred to as the first, the second and the third temperature sensors, and the signals output thereby are referred as the first, the second and the third temperature signals, respectively.
  • As shown, the temperature module 10 and the first logic 20 are installed on a motherboard 100 of the electronic device, while the second logic 30 and the control circuit 40 are installed in a power supply 200 of the system.
  • Typically, the motherboard 100 includes a central processing unit, serving as a system operation core, memory, display card, sound card, network card and other integrated circuit chips for assisting the system operation. In addition, the television card or video card and others can also be installed to provide more functions of the system. In one embodiment, the motherboard 100 may include more than one integrated circuit as the operation core. For example, the motherboard 100 may be installed in a housing that comprises a power supply 200 for supplying operation power of the system. In addition, a plurality of heat dissipation fans may be installed in the housing for dissipating heat generated during operation. In addition to the power supply, the heat dissipation fan is also easily installed at the integrated circuit, to generate heat, such as the central processing unit. The power source of the fan is provided from the power supply or the source supply module on the motherboard, for example. The heat dissipation fan rotates with a speed according to the temperature, detected by the temperature sensor.
  • The electronic device includes a personal computer, a server, a video game, a multimedia computer, a multimedia player, or a personal video recording system (PVR), for example.
  • One or more temperature sensors may be installed on the display card, the television card, the central processing unit and the power source.
  • As shown in FIG. 1, one or more temperature sensors are used to detect the operation temperatures of the integrated circuit such as the central processing unit and the television card.
  • The function and operation for each of the above devices are described as follows.
  • The temperature control module 10 is in communication with the temperature sensor to receive the temperature detected thereby. Upon receiving the detected temperature, a first logic signal TEMP1-3 is generated and output by the temperature control module 10. The number of the first logic signals corresponds to the number of temperature sensors. The temperature control module 10 includes an input/output chip (super I/O) and more than one thermal control integrated circuit (IC) for receiving the temperature, detected by the temperature sensors. Alternatively, the temperature control module 10 may include either the super I/O or the thermal control IC. The super I/O is operative to output a detection source circuit signal to the first logic 20 to aid the first logic 20, to determine whether the received temperature is output from the super I/O or the thermal control IC.
  • The thermal control module 10 may also output a first control signal S1 to the first logic 20 to inform the first logic 20 with the current operation mode. The bit number of the first control signal S1 determines the number of operation modes for the system. When the first control signal S1 includes only one bit, the system includes two operation modes. When the first control signal S1 includes two bits, there are four operation modes available for the system. Therefore, the bit number of the first control signals S1 can be configured according to the system complexity and specific requirement.
  • In one embodiment, the first control signal S1 output by the temperature control module 10 is controlled by a basic input/output system (BIOS) of the system. It is known in the art that the temperature control module 10 can be connected to the BIOS via system management (SM bus).
  • The first logic 20 is in communication with the temperature control module 10 to output a second logic signal L1 in response to the first logic signal TEMP1-3 and the first control signal S1.
  • The second logic 30 is connected to the first logic 20. A rotation speed-temperature relationship for one or more than one fan is installed in the second logic 30. According to the relationship corresponding to the second logic signal L1, a second control signal S2 is output by the second logic 30.
  • The control circuit 40 is connected to the second logic 30 to drive the fan rotation in response to the second control signal S2. Each control circuit corresponds to one specific voltage-temperature curve. The voltage includes the applied voltage for making the fan to rotating. The first logic 20, the second logic 30 and the control circuit 40 can be assembled by any electronic devices such as transistors and logic gates.
  • In one embodiment, the first logic 20 and the second logic 30 include an independent electronic circuit or integrated circuit. Or alternatively, the first and second logics 20 and 30 can be integrated into a single circuit or integrated circuit.
  • In the embodiment as shown in FIG. 1, the second logic 30 and the control circuit 40 include independent circuits or integrated circuits. However, the second logic 30 and the control circuit 40 can be integrated into a single circuit or integrated circuit as desired.
  • FIGS. 2A to 2D show several exemplary voltage-temperature curves for the control circuits 40. In FIG. 2A, a two-step voltage-temperature curve with a smooth transition is illustrated. In FIG. 2B, the control circuit 40 corresponds to a linear voltage-temperature curve. In FIG. 2C, a two-step voltage-temperature curve with abrupt transition is illustrated. In FIG. 2D, the multiple-step voltage-temperature curve is illustrated. It will be appreciated that the voltage-temperature curve may vary according to specific requirements.
  • The operation of the fan control system will be further explained herein, with reference to FIG. 3 that illustrates the relationship between the temperature sensor and the control signal.
  • As mentioned above, the electronic device includes one or more than one temperature sensor installed in the central processing unit and television card, for example. In the normal operation module of the system, a first control signal S1, such as the signal “0” as shown in FIG. 3, is output from the temperature control module 10 to the first logic 20. The temperature sensor installed at the central processing unit and the temperature sensor installed at the television card will receive different temperatures received by the temperature control module 10. The detected temperatures are output to the first logic 20, which then convert the detected temperatures into detection logic signals. In the embodiment as shown in FIG. 3, four temperature sensors are installed to generate four different temperature signals, converted into the detection logic signals by the first logic 20.
  • When the signals detected by the temperature sensor are <X° C., <Y1° C., <Y2° C. and <Z° C., the first logic 20 generates a second logic signal as “00” corresponding to the first logic signal “0”, such, that the second logic 30 is operative to output a second control S2, responding to the second logic signal “00”.
  • When the signals detected by the temperature sensor are >X° C., <Y1° C., <Y2° C. and <Z° C., the first logic 20 generates a second logic signal as “11” corresponding to the first logic signal “1”, such that the second logic 30 is operative to output a second control S2 responding to the second logic signal “11”.
  • The second logic 30 includes various temperature-voltage curves stored therein. The temperature-voltage curves correspond to respective second logic signal. For example, when the second logic signal is “00”, the second control signal corresponding to “00” will be output by the second logic, to provide a corresponding voltage allowing the control circuit 40 to drive the fan to rotate.
  • While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those of ordinary skill in the art that the various changes in form and details may be made herein without departing from the spirit and scope of the present invention as defined by the appended claims.

Claims (22)

1. A fan control system for an electronic apparatus that includes one or at least one integrated circuits, the system comprising:
at least one temperature sensor arranged correspondingly to some or all of the integrated circuits, for detecting operation temperature of the corresponding integrated circuits;
a temperature control module connected to the temperature sensors, the temperature control module being operative to output a first logic signal corresponding to the detected temperature, and a first control signal corresponding to the electronic apparatus;
a first logic connected to the temperature control module, the first logic being operative to output a second logic signal corresponding to the first control signal;
a second logic connected to the first logic, including at least one fan rotation speed-operation temperature relationship stored therein, the second logic being operative to output a second control signal based on the corresponding fan rotation speed-operation temperature relationship; and
at least one control circuit to receive the second control signal and provide a voltage corresponding to the second control signal.
2. The system of claim 1, wherein the temperature control module and the first logic are arranged on a motherboard, and the second logic and the control circuit are arranged in a power supply of the electronic apparatus.
3. The system of claim 1, wherein the temperature control module comprises a super input/output chip.
4. The system of claim 1, wherein the temperature control module comprises a super input/output chip and at least one thermal control integrated circuit operative to receive the temperature detected by the temperature sensors.
5. The system of claim 1, wherein the temperature control module comprises at least one thermal control integrated circuit operative to receive the temperature detected by the temperature sensors.
6. The system of claim 1, wherein the bit number of the first logic signal corresponds to the number of the temperature sensors.
7. The system of claim 1, wherein the first and second logics are independent electronic or integrated circuits.
8. The system of claim 1, wherein the first and second logics are integrated into a single electronic or integrated circuit.
9. The system of claim 1, wherein the second logic and the control circuit are independent electronic or integrated circuits.
10. The system of claim 1, wherein the second logic and the control circuit are integrated into a single electronic or integrated circuit.
11. A heat dissipation system of an electronic apparatus having one or at least one integrated circuits, comprising:
at least one temperature sensor arranged correspondingly to some or all of the integrated circuits, for detecting the operation temperature of the corresponding integrated circuits;
a temperature control module in communication with the temperature sensor to output a first logic signal corresponding to the detected temperature and a first control signal corresponding to operation status of the electronic apparatus;
a first logic in communication with the temperature control module to output a second logic signal corresponding to the first logic signal and the first control signal;
a second logic in communication with the first logic, the second logic including at least one relationship of fan rotation speed and operation temperature and being operative to output a second control signal according to the relationship of fan rotation speed and operation temperature corresponding to the first logic signal and the first control signal;
at least one control circuit to receive the second control signal and to output a voltage corresponding to the second control signal; and
at least one fan, each connected to the corresponding control circuit, driven to rotate by the corresponding voltage.
12. The system of claim 11, wherein the temperature control module and the first logic are arranged on a motherboard of the electronic apparatus, and the second logic and the control circuit are arranged in a power supply of the electronic apparatus.
13. The system of claim 11, wherein the fan is arranged in a power supply of the electronic apparatus which provides power to the fan.
14. The system of claim 11, wherein the fans selectively arranged correspondingly to some or all of the integrated circuits, and a motherboard of the electronic apparatus provides power to the fans.
15. The system of claim 11, wherein the temperature control module comprises a super input/output chip.
16. The system of claim 11, wherein the temperature control module comprises a super input/output chip and a thermal control integrated circuit operative to receive the detected temperature.
17. The system of claim 11, wherein the bit number of the first logic signal corresponds to the number of the temperature sensors.
18. The system of claim 11, wherein the first logic and the second logic are independent electronic or integrated circuits.
19. The system of claim 11, wherein the first and second logics are integrated into a signal electronic or integrated circuit.
20. The system of claim 11, wherein the second logic and the control circuit are independent electronic or integrated circuits.
21. The system of claim 11, wherein the second logic and the control circuit are integrated into the same electronic or integrated circuit.
22. A fan control method for an electronic apparatus that has at least one integrated circuit, the method comprising:
detecting the operation temperature of the at least one integrated circuit;
generating a first logic signal according to the operation temperature and a first control signal according to operation status of the integrated circuit;
generating a second logic signal according to the first logic signal and the first control signal;
selecting a relationship between fan rotation speed and temperature according to the second logic signal and generating a second control signal by the relationship; and
outputting a voltage according to the second control signal to drive a fan to rotate.
US11/217,363 2004-12-27 2005-09-02 Fan control system and method and heat dissipation system of electronic equipment Abandoned US20060138247A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW93140751 2004-12-27
TW093140751A TW200622564A (en) 2004-12-27 2004-12-27 Fan control system, method and heat dissipation system for electronic device

Publications (1)

Publication Number Publication Date
US20060138247A1 true US20060138247A1 (en) 2006-06-29

Family

ID=36610266

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/217,363 Abandoned US20060138247A1 (en) 2004-12-27 2005-09-02 Fan control system and method and heat dissipation system of electronic equipment

Country Status (2)

Country Link
US (1) US20060138247A1 (en)
TW (1) TW200622564A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060101833A1 (en) * 2004-11-12 2006-05-18 International Business Machines (Ibm) Corporation Cooling system control with clustered management services
US20080065912A1 (en) * 2006-09-07 2008-03-13 Bodner James T Controlling fan speed in electronic system
US20090174718A1 (en) * 2008-01-04 2009-07-09 Asustek Computer Inc. Setting methods and motherboard for display parameters
CN102062460A (en) * 2011-01-20 2011-05-18 四川依米康环境科技股份有限公司 Accurate air supply system of air conditioning unit and realizing method thereof
US20140121852A1 (en) * 2012-10-25 2014-05-01 Inhon International Co., Ltd Heat dissipation control system for portable electrical device and control method thereof
CN104881096A (en) * 2014-02-27 2015-09-02 鸿富锦精密工业(武汉)有限公司 Heat dissipation system
US20160029519A1 (en) * 2014-07-28 2016-01-28 Super Micro Computer, Inc. Cooling system and circuit layout with multiple nodes
CN114153294A (en) * 2021-11-30 2022-03-08 联想(北京)有限公司 Control method and device and electronic equipment
US11925008B2 (en) * 2018-10-31 2024-03-05 Illinois Tool Works Inc. Methods and apparatus for multi-directional fan

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562715B (en) * 2014-02-18 2016-12-11 Wistron Corp Heat dissipation system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6349385B1 (en) * 1998-11-20 2002-02-19 Compaq Computer Corporation Dual power supply fan control—thermistor input or software command from the processor
US6545438B1 (en) * 2000-03-31 2003-04-08 Ljm Products, Inc. Cooling module and related control circuits useful therefor incorporating a communication port for receiving digital command signals to control module
US6927978B2 (en) * 2003-02-10 2005-08-09 Kabushiki Kaisha Toshiba Electronic apparatus and method of cooling the electronic apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6349385B1 (en) * 1998-11-20 2002-02-19 Compaq Computer Corporation Dual power supply fan control—thermistor input or software command from the processor
US6545438B1 (en) * 2000-03-31 2003-04-08 Ljm Products, Inc. Cooling module and related control circuits useful therefor incorporating a communication port for receiving digital command signals to control module
US6927978B2 (en) * 2003-02-10 2005-08-09 Kabushiki Kaisha Toshiba Electronic apparatus and method of cooling the electronic apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060101833A1 (en) * 2004-11-12 2006-05-18 International Business Machines (Ibm) Corporation Cooling system control with clustered management services
US7287708B2 (en) * 2004-11-12 2007-10-30 International Business Machines Corporation Cooling system control with clustered management services
US20080065912A1 (en) * 2006-09-07 2008-03-13 Bodner James T Controlling fan speed in electronic system
US7721120B2 (en) 2006-09-07 2010-05-18 Hewlett-Packard Development Company, L.P. Controlling fan speed in electronic system
US20090174718A1 (en) * 2008-01-04 2009-07-09 Asustek Computer Inc. Setting methods and motherboard for display parameters
CN102062460A (en) * 2011-01-20 2011-05-18 四川依米康环境科技股份有限公司 Accurate air supply system of air conditioning unit and realizing method thereof
US20140121852A1 (en) * 2012-10-25 2014-05-01 Inhon International Co., Ltd Heat dissipation control system for portable electrical device and control method thereof
US9223364B2 (en) * 2012-10-25 2015-12-29 Inhon International Co., Ltd. Heat dissipation control system for portable electrical device and control method thereof
CN104881096A (en) * 2014-02-27 2015-09-02 鸿富锦精密工业(武汉)有限公司 Heat dissipation system
US20160029519A1 (en) * 2014-07-28 2016-01-28 Super Micro Computer, Inc. Cooling system and circuit layout with multiple nodes
US9999162B2 (en) * 2014-07-28 2018-06-12 Super Micro Computer, Inc. Cooling system and circuit layout with multiple nodes
US11925008B2 (en) * 2018-10-31 2024-03-05 Illinois Tool Works Inc. Methods and apparatus for multi-directional fan
CN114153294A (en) * 2021-11-30 2022-03-08 联想(北京)有限公司 Control method and device and electronic equipment

Also Published As

Publication number Publication date
TW200622564A (en) 2006-07-01

Similar Documents

Publication Publication Date Title
KR100508352B1 (en) Information processing unit and method for cooling same
JP4384182B2 (en) Fan speed control method
US6785829B1 (en) Multiple operating frequencies in a processor
US5884049A (en) Increased processor performance comparable to a desktop computer from a docked portable computer
US7791301B2 (en) Apparatus and method for fan auto-detection
US7836717B2 (en) Method and system of temperature-control for electronic component
US5483102A (en) Employing on die temperature sensors and fan-heatsink failure signals to control power dissipation
US8412968B2 (en) Circuit, system and method for selectively turning off internal clock drivers
US6751094B2 (en) Computer system cooling using temperature monitoring
US20070096665A1 (en) Method and circuit for controlling motor speed
US7545617B2 (en) Slave mode thermal control with throttling and shutdown
JP2001056724A (en) Cooling system for personal computer
US7949233B2 (en) Method and device for controlling a heat-dissipating fan for an electronic component
JP2005064186A (en) Electronic apparatus equipped with cooling system
US9360904B2 (en) Mapped fan zone cooling system
JP2007095067A (en) Method and system for managing power distribution among devices (selective on-die termination for improved power management and thermal distribution)
US20060138247A1 (en) Fan control system and method and heat dissipation system of electronic equipment
US7789130B2 (en) System air fans in integrated control apparatus
US7615946B2 (en) Fan speed control device
CN100413391C (en) Control system and method for fan of electronic device and radiating system thereof
US6972952B2 (en) Computer system and control method thereof
US7152013B2 (en) Heat dissipating method
US6534995B1 (en) Circuit for detecting a cooling device in a computer system
JP2011106364A (en) Electronic equipment and fan control method
JPH10326125A (en) Electronic equipment

Legal Events

Date Code Title Description
AS Assignment

Owner name: FIRST INTERNATIONAL COMPUTER, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SHEN, HUNG-PING;CHEN, HAN-TUN;YEH, HO-CHING;REEL/FRAME:016952/0485

Effective date: 20050727

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION