US20040245858A1 - Rectifier utilizing a grounded antenna - Google Patents
Rectifier utilizing a grounded antenna Download PDFInfo
- Publication number
- US20040245858A1 US20040245858A1 US10/880,892 US88089204A US2004245858A1 US 20040245858 A1 US20040245858 A1 US 20040245858A1 US 88089204 A US88089204 A US 88089204A US 2004245858 A1 US2004245858 A1 US 2004245858A1
- Authority
- US
- United States
- Prior art keywords
- electronic device
- antenna element
- media
- substructure
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 63
- 230000035699 permeability Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 16
- 230000008878 coupling Effects 0.000 abstract description 22
- 238000010168 coupling process Methods 0.000 abstract description 22
- 238000005859 coupling reaction Methods 0.000 abstract description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 230000008901 benefit Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/02—Conversion of AC power input into DC power output without possibility of reversal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
- G06K19/0715—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including means to regulate power transfer to the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
Definitions
- This invention relates in general to signal rectification, and more particularly, to a rectifier circuit utilizing a grounded antenna.
- Radio frequency identification (RFID) transponders are usually used in conjunction with an RFID base station, typically in applications such as inventory control, security, access cards, and personal identification.
- the base station transmits a carrier signal that powers circuitry in the RFID tag when the RFID tag is brought within a read range of the base station.
- Data communication between the tag and the station is achieved by modulating the amplitude of the carrier signal with a binary data pattern, usually amplitude shift keying.
- RFID tags are typically integrated circuits that include, among other components, antenna elements for coupling the radiated field, rectifiers to convert the AC carrier signal to dc power, and demodulators to extract the data pattern from the envelope of the carrier signal.
- RFID tags can also be useful in cost-sensitive applications such as product pricing, baggage tracking, parcel tracking, asset identification, authentication of paper money, and animal identification, to mention just a few application.
- RFID tags could provide significant advantages over systems conventionally used for such applications, such as bar code identification systems. For example, a basket full of items marked with RFID tags could be read rapidly without having to handle each item, whereas they would have to be handled individually when using a bar code system. Unlike bar codes, RFID tags provide the ability to update information on the tag. However, the RFID technology of today is too expensive for dominant use in such applications. There are several factors that drive up the cost of RFID tags, the most significant of which is the size of the silicon integrated circuit that makes up the tag.
- FIG. 1 shows a conventional rectifier utilizing a diode bridge 2 .
- Antenna element 4 requires two connections 6 , 8 on opposite sides of diode bridge 2 .
- the rectified signal is output at node 10 .
- FIG. 2 shows another conventional rectifier utilizing a MOSFET bridge 12 .
- Antenna element 4 also requires two connections 6 , 8 on opposite sides of MOSFET bridge 12 .
- conventional RFID tags require at least two pads large enough to bond wire for the attachment of an external antenna coil 4 . Since RFID tag chips are generally relatively small, these pads consume a significant percentage of the integrated circuit area of a conventional RFID tag.
- a rectifier generates a rectified output and a dc power output.
- the rectifier has an antenna element, a tuning capacitor, a coupling capacitor, first and second rectifying diodes, and a storage capacitor.
- the antenna element and the tuning capacitor are coupled in parallel and grounded at one terminal.
- the first rectifying diode is grounded at its anode terminal and the storage capacitor is grounded at one terminal.
- the coupling capacitor is coupled between the ungrounded terminal of the antenna element and the cathode terminal of the first rectifying diode.
- the anode terminal of the second rectifying diode is coupled to the cathode terminal of the first rectifying diode.
- the cathode terminal of the second rectifying diode is coupled to the ungrounded terminal of the storage capacitor.
- the rectified output is generated between the rectifying diodes.
- the dc power output is generated between the second rectifying diode and the storage capacitor.
- a diode stack is coupled between the second terminal of the coupling capacitor and ground.
- the diode stack limits the voltage rectified signal to the breakdown voltage of the diode stack.
- FIG. 1 is a schematic circuit drawing showing prior art design of a conventional rectifier utilizing diodes.
- FIG. 2 is a schematic circuit drawing showing prior art design of a conventional rectifier utilizing MOSFETs.
- FIG. 3 is a schematic diagram illustrating one embodiment of the present invention.
- FIG. 4 is a circuit schematic drawing of an alternative embodiment of the present invention.
- FIG. 5 is a timing diagram of selected nodes in the schematic circuit diagram presented in FIGS. 3 and 4.
- FIG. 6 is a circuit diagram of another embodiment of the present invention.
- FIG. 7 is a diagram showing one embodiment of an integrated circuit chip and external antenna element of the present invention.
- Base station 16 Illustrated in FIG. 3 are base station 16 and rectifier circuit 18 .
- Base station 16 is included by way of illustration, but is not an integral part of the invention.
- rectifier circuit 18 is embodied at least partially in an integrated circuit chip. Additional circuitry (not shown) may also be embodied in the integrated circuit with rectifier circuit 18 . In one embodiment, rectifier circuit 18 is included as a rectifier for a radio frequency identification (RFID) transponder (tag). Other uses for rectifier circuit 18 are possible.
- RFID radio frequency identification
- the input of rectifier circuit 18 is a carrier frequency radiated from base station 16 wherein the carrier amplitude is enveloped by a data pattern.
- One example of a carrier amplitude enveloped by a data pattern is amplitude shift keying.
- One output of rectifier circuit 18 is rectified output 20 , which may be fed into a demodulator (not shown) to extract the envelope signal.
- Another output of rectifier circuit 18 is power output 22 , which may be used as a dc power source.
- Rectifier circuit 18 includes antenna element 24 , tuning capacitor 26 , coupling capacitor 28 , first rectifying diode 30 , second rectifying diode 32 , and storage capacitor 34 .
- antenna element 24 has first and second terminals.
- the first terminal of antenna element 24 is coupled to a resonating node 36 .
- the second terminal of antenna element 24 is connected to ground 38 .
- antenna element 24 is an inductor.
- Inductor 24 and capacitor 26 are chosen as to resonate the carrier frequency.
- Inductor- 24 is external to the integrated circuit chip in this embodiment, but could also be internal to the integrated circuit. Further, the integrated circuit process could include a high magnetic permeability layer to increase the inductance of the antenna element.
- antenna element 24 is conductive ink printed on print media, such as paper, plastic or other media. In alternative embodiments, antenna element 24 is any other type of inductive element.
- Tuning capacitor 26 is connected in parallel with antenna 24 between resonating node 36 and ground 38 .
- tuning capacitor 26 has first and second terminals. The first terminal of tuning capacitor 26 is connected to the first terminal of antenna 24 and the second terminal of tuning capacitor 26 is connected to the second terminal of antenna 24 .
- rectifier circuit 18 When rectifier circuit 18 is brought within reading range of base station 16 radiating the appropriate carrier frequency, the voltage on node 36 will resonate.
- Capacitor 26 is internal to the integrated circuit in one embodiment, but could also be external to the integrated circuit.
- tuning capacitor 26 is conductive ink printed on print media. In alternative embodiments, tuning capacitor 26 is any other type of capacitive element.
- Coupling capacitor 28 is connected to resonating node 36 , coupling the voltage to node 20 .
- coupling capacitor 28 has first and second terminals. The first terminal of coupling capacitor 28 is connected to the first terminal of antenna element 24 and the second terminal of coupling capacitor 28 is connected to first rectifying diode 30 and second rectifying diode 32 .
- coupling capacitor 28 is conductive ink printed on print media. In alternative embodiments, coupling capacitor 28 is any other type of capacitive element.
- First rectifying diode 30 is coupled between the second terminal of coupling capacitor and ground 38 .
- first rectifying diode has an anode terminal and a cathode terminal. The anode terminal is connected to ground and the cathode terminal is connected to the second terminal of the coupling capacitor. The rectified output is generated at the cathode terminal.
- First rectifying diode 30 will forward-bias when a negative voltage is coupled to node 20 , thereby keeping the voltage on node 20 no lower than one diode drop below ground 38 .
- the voltage on node 20 can achieve the same peak-to-peak amplitude as resonating node 36 , twice the peak-to-peak amplitude of the rectified output of a conventional rectifier.
- One skilled in the-art can then feed the rectified output at node 20 into a demodulator to extract the binary data pattern that envelops the carrier signal.
- Second rectifying diode 32 is connected between the rectified output node 20 and the power output at node 22 .
- second rectifying diode 32 has an anode terminal and a cathode terminal. The anode is connected to the second terminal of the coupling capacitor and the cathode terminal is connected to storage capacitor 34 .
- Storage capacitor 34 is coupled between power output node 22 and ground.
- storage capacitor 34 has first and second terminals. The first terminal is connected to the cathode terminal of the second rectifying diode and the second terminal is connected to ground.
- second rectifying diode 32 When the voltage on node 20 is more positive than the voltage on power output node 22 , second rectifying diode 32 will forward-bias, thereby charging capacitor 34 to the peak voltage of node 20 less one diode drop.
- the charge on capacitor 34 may be used as power for other circuitry, and is refreshed at the carrier frequency.
- FIG. 4 illustrates an embodiment of the present invention including a diode stack 40 connected between rectified output node 20 and ground 38 .
- Diode stack 40 limits the maximum rectifying voltage.
- diode stack 40 includes diodes 46 , 48 , 50 , and MOSFET 52 with the gate connected to the drain.
- FIG. 5 shows the corresponding voltages of some nodes of rectifying circuit 18 .
- rectifier 18 When rectifying circuit 18 is brought within read distance of an RFID station 16 radiating the appropriate carrier signal, typically 13.56 Mhz, rectifier 18 will generate dc power on node 22 .
- Other carrier frequencies may also be used.
- the amplitude of the carrier signal is modulated by a binary bit data pattern, such as ASK or amplitude shift keying, generally at a frequency of 105.9 KHz.
- the carrier signal may also be modulated at other data frequencies.
- Node 36 will oscillate with the frequency of the carrier frequency, and will swing both negative and positive. Waveform 42 in FIG. 5 shows the signal on node 36 .
- coupling capacitor 28 will couple this voltage to node 20 .
- Coupling capacitor 28 is internal to the chip in this embodiment, but could be designed to be external as well.
- the signal on node 20 is unable to go more negative than one diode drop below ground 38 due to shunting (rectifying) diode 30 . Therefore, when node 36 first swings negative, node 20 will remain one diode drop below ground 38 , as shown in waveform 44 in FIG. 5.
- the carrier signal on node 36 swings up again, the full peak-to-peak voltage is coupled to node 20 . The magnitude of this swing depends on the proximity of rectifying circuit 18 to the modulated carrier source radiating from base station 10 .
- the voltages generated could be so large as to damage circuit components.
- the voltage is limited through diode stack 40 .
- diode stack 40 When sufficient voltage is generated on node 20 , diode stack 40 will conduct, thereby clamping the voltage at a level determined by the breakdown of stack 40 .
- diode 32 When the voltage on node 20 is more positive than the voltage on node 22 , diode 32 is forward-biased bringing node 22 to the same voltage as node 20 . When the voltage on node 20 is less positive than the voltage on node 22 , then diode 32 is reverse-biased, causing node 22 to float at the peak voltage of node 20 . This charge is stored on storage capacitor 34 .
- the charge on node 22 may be used to supply Vdd power. In one embodiment, the Vdd power may be supplied to the entire chip.
- Waveform 45 shows the signal on node 22 .
- FIG. 6 is a schematic of another embodiment of the present invention, useful when building the present invention in a semiconductor process wherein the back surface is not coupled to ground, but rather Vdd.
- the back surface is not coupled to ground, but rather Vdd.
- an embodiment is required wherein one terminal of the antenna is connected to the dc power output.
- node 20 When resonating node 36 goes negative, node 20 is kept more positive than one diode drop above chip ground 38 by rectifying diode 32 .
- coupling capacitor 28 couples node 20 high.
- Rectifying diode 30 turns on, bringing node 22 one diode drop below the peak voltage of node 20 .
- rectifying diode 30 turns off, thereby trapping charge on node 22 .
- Node 22 represents the dc power output of this circuit.
- Node 20 represents the rectified output.
- a significant advantage of the rectifier design described herein over conventional designs is that the invention operates using an antenna 24 whereby one of its two terminals is connected to chip ground 38 , as shown in FIG. 7.
- This is a significant advantage since the connection of the external antenna element 24 can now be made by connecting one of the terminals to the back surface 38 of the silicon. The other connection is made on front surface of the silicon to a bonding pad 54 . Consequently, only one pad 54 is needed for the connection of the external antenna 24 rather than two pads required in a conventional design. Since the size of a pad is large relative to RFID circuitry, the savings of this pad constitutes a significant savings of silicon area, which translates to a significant reduction in fabrication cost.
- connection could be made utilizing a second layer of metal above the integrated circuitry, thereby providing a larger connection surface without increasing silicon area.
- the larger connection surface enables the use of lower cost connection technologies than wire bonding such as flip chip and conductive epoxy. These bonding technologies are particularly important in bar code replacement applications wherein the antenna consists of printed conductive ink on print media.
- Another advantage of this invention is that the rectified signal swings at the full peak-to-peak voltage of the resonant node voltage.
- the rectified signal in a conventional design swings only one half of this amplitude. Consequently, the design described in this invention will enhance the maximum read distance between the RFID tag and the base station 16 while reducing production costs.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Near-Field Transmission Systems (AREA)
- Rectifiers (AREA)
- Emergency Protection Circuit Devices (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Direct Current Feeding And Distribution (AREA)
Abstract
A rectifier generates a rectified output and a dc power output. The rectifier has an antenna element, a tuning capacitor, a coupling capacitor, first and second rectifying diodes, and a storage capacitor. The antenna element and the tuning capacitor are coupled in parallel and grounded at one terminal. The first rectifying diode is grounded at its anode terminal and the storage capacitor is grounded at one terminal. The coupling capacitor is coupled between the ungrounded terminal of the antenna element and the cathode terminal of the first rectifying diode. The anode terminal of the second rectifying diode is coupled to the cathode terminal of the first rectifying diode. The cathode terminal of the second rectifying diode is coupled to the ungrounded terminal of the storage capacitor. The rectified output is generated between the rectifying diodes. The dc power output is generated between the second rectifying diode and the storage capacitor.
Description
- This invention relates in general to signal rectification, and more particularly, to a rectifier circuit utilizing a grounded antenna.
- Radio frequency identification (RFID) transponders (tags) are usually used in conjunction with an RFID base station, typically in applications such as inventory control, security, access cards, and personal identification. The base station transmits a carrier signal that powers circuitry in the RFID tag when the RFID tag is brought within a read range of the base station. Data communication between the tag and the station is achieved by modulating the amplitude of the carrier signal with a binary data pattern, usually amplitude shift keying. To that end, RFID tags are typically integrated circuits that include, among other components, antenna elements for coupling the radiated field, rectifiers to convert the AC carrier signal to dc power, and demodulators to extract the data pattern from the envelope of the carrier signal.
- If fabricated at sufficiently low cost, RFID tags can also be useful in cost-sensitive applications such as product pricing, baggage tracking, parcel tracking, asset identification, authentication of paper money, and animal identification, to mention just a few application. RFID tags could provide significant advantages over systems conventionally used for such applications, such as bar code identification systems. For example, a basket full of items marked with RFID tags could be read rapidly without having to handle each item, whereas they would have to be handled individually when using a bar code system. Unlike bar codes, RFID tags provide the ability to update information on the tag. However, the RFID technology of today is too expensive for dominant use in such applications. There are several factors that drive up the cost of RFID tags, the most significant of which is the size of the silicon integrated circuit that makes up the tag.
- FIG. 1 shows a conventional rectifier utilizing a
diode bridge 2. Antenna element 4 requires twoconnections diode bridge 2. The rectified signal is output atnode 10. - FIG. 2 shows another conventional rectifier utilizing a
MOSFET bridge 12. Antenna element 4 also requires twoconnections MOSFET bridge 12. In order to accommodate theseconnections - Another concern with conventional RFID tags is the maximum operating reading distance from the base station. In both examples of prior art shown in FIGS. 1 and 2, the rectified output signals at
node 10 are only one half the peak-to-peak voltage of the correspondingresonating nodes 6. The amplitudes of the signals onoutput nodes 10 are related to the maximum operational distance between the RFID tag and the base station. - According to principles of the present invention, a rectifier generates a rectified output and a dc power output. The rectifier has an antenna element, a tuning capacitor, a coupling capacitor, first and second rectifying diodes, and a storage capacitor. The antenna element and the tuning capacitor are coupled in parallel and grounded at one terminal. The first rectifying diode is grounded at its anode terminal and the storage capacitor is grounded at one terminal. The coupling capacitor is coupled between the ungrounded terminal of the antenna element and the cathode terminal of the first rectifying diode. The anode terminal of the second rectifying diode is coupled to the cathode terminal of the first rectifying diode. The cathode terminal of the second rectifying diode is coupled to the ungrounded terminal of the storage capacitor. The rectified output is generated between the rectifying diodes. The dc power output is generated between the second rectifying diode and the storage capacitor.
- According to further principles of the present invention, a diode stack is coupled between the second terminal of the coupling capacitor and ground. The diode stack limits the voltage rectified signal to the breakdown voltage of the diode stack.
- FIG. 1 is a schematic circuit drawing showing prior art design of a conventional rectifier utilizing diodes.
- FIG. 2 is a schematic circuit drawing showing prior art design of a conventional rectifier utilizing MOSFETs.
- FIG. 3 is a schematic diagram illustrating one embodiment of the present invention.
- FIG. 4 is a circuit schematic drawing of an alternative embodiment of the present invention.
- FIG. 5 is a timing diagram of selected nodes in the schematic circuit diagram presented in FIGS. 3 and 4.
- FIG. 6 is a circuit diagram of another embodiment of the present invention.
- FIG. 7 is a diagram showing one embodiment of an integrated circuit chip and external antenna element of the present invention.
- Illustrated in FIG. 3 are
base station 16 andrectifier circuit 18.Base station 16 is included by way of illustration, but is not an integral part of the invention. - In one embodiment,
rectifier circuit 18 is embodied at least partially in an integrated circuit chip. Additional circuitry (not shown) may also be embodied in the integrated circuit withrectifier circuit 18. In one embodiment,rectifier circuit 18 is included as a rectifier for a radio frequency identification (RFID) transponder (tag). Other uses forrectifier circuit 18 are possible. - The input of
rectifier circuit 18 is a carrier frequency radiated frombase station 16 wherein the carrier amplitude is enveloped by a data pattern. One example of a carrier amplitude enveloped by a data pattern is amplitude shift keying. One output ofrectifier circuit 18 is rectifiedoutput 20, which may be fed into a demodulator (not shown) to extract the envelope signal. Another output ofrectifier circuit 18 ispower output 22, which may be used as a dc power source.Rectifier circuit 18 includesantenna element 24,tuning capacitor 26,coupling capacitor 28, first rectifyingdiode 30, second rectifyingdiode 32, andstorage capacitor 34. - In one
embodiment antenna element 24 has first and second terminals. The first terminal ofantenna element 24 is coupled to aresonating node 36. The second terminal ofantenna element 24 is connected toground 38. - In one embodiment,
antenna element 24 is an inductor.Inductor 24 andcapacitor 26 are chosen as to resonate the carrier frequency. Inductor-24 is external to the integrated circuit chip in this embodiment, but could also be internal to the integrated circuit. Further, the integrated circuit process could include a high magnetic permeability layer to increase the inductance of the antenna element. - In one embodiment,
antenna element 24 is conductive ink printed on print media, such as paper, plastic or other media. In alternative embodiments,antenna element 24 is any other type of inductive element. - Tuning
capacitor 26 is connected in parallel withantenna 24 betweenresonating node 36 andground 38. In one embodiment, tuningcapacitor 26 has first and second terminals. The first terminal of tuningcapacitor 26 is connected to the first terminal ofantenna 24 and the second terminal of tuningcapacitor 26 is connected to the second terminal ofantenna 24. Whenrectifier circuit 18 is brought within reading range ofbase station 16 radiating the appropriate carrier frequency, the voltage onnode 36 will resonate.Capacitor 26 is internal to the integrated circuit in one embodiment, but could also be external to the integrated circuit. - In one embodiment, tuning
capacitor 26 is conductive ink printed on print media. In alternative embodiments, tuningcapacitor 26 is any other type of capacitive element. - Coupling
capacitor 28 is connected to resonatingnode 36, coupling the voltage tonode 20. In one embodiment,coupling capacitor 28 has first and second terminals. The first terminal ofcoupling capacitor 28 is connected to the first terminal ofantenna element 24 and the second terminal ofcoupling capacitor 28 is connected tofirst rectifying diode 30 andsecond rectifying diode 32. - In one embodiment,
coupling capacitor 28 is conductive ink printed on print media. In alternative embodiments,coupling capacitor 28 is any other type of capacitive element. - First rectifying
diode 30 is coupled between the second terminal of coupling capacitor andground 38. In one embodiment, first rectifying diode has an anode terminal and a cathode terminal. The anode terminal is connected to ground and the cathode terminal is connected to the second terminal of the coupling capacitor. The rectified output is generated at the cathode terminal. - First rectifying
diode 30 will forward-bias when a negative voltage is coupled tonode 20, thereby keeping the voltage onnode 20 no lower than one diode drop belowground 38. The voltage onnode 20 can achieve the same peak-to-peak amplitude as resonatingnode 36, twice the peak-to-peak amplitude of the rectified output of a conventional rectifier. One skilled in the-art can then feed the rectified output atnode 20 into a demodulator to extract the binary data pattern that envelops the carrier signal. -
Second rectifying diode 32 is connected between the rectifiedoutput node 20 and the power output atnode 22. In one embodiment,second rectifying diode 32 has an anode terminal and a cathode terminal. The anode is connected to the second terminal of the coupling capacitor and the cathode terminal is connected tostorage capacitor 34. -
Storage capacitor 34 is coupled betweenpower output node 22 and ground. In one embodiment,storage capacitor 34 has first and second terminals. The first terminal is connected to the cathode terminal of the second rectifying diode and the second terminal is connected to ground. - When the voltage on
node 20 is more positive than the voltage onpower output node 22,second rectifying diode 32 will forward-bias, thereby chargingcapacitor 34 to the peak voltage ofnode 20 less one diode drop. The charge oncapacitor 34 may be used as power for other circuitry, and is refreshed at the carrier frequency. - Depending on the amplitude of the carrier signal, the proximity of
rectifier circuit 18 tobase station 16, and the coupling efficiency of the radiated field, voltages on resonatingnode 36 and rectifiedoutput node 20 can become sufficiently large as to cause permanent damage to the integrated circuit components. Accordingly, FIG. 4 illustrates an embodiment of the present invention including adiode stack 40 connected between rectifiedoutput node 20 andground 38.Diode stack 40 limits the maximum rectifying voltage. In one embodiment,diode stack 40 includesdiodes MOSFET 52 with the gate connected to the drain. - FIGS. 3 and 4 are further described with the assistance of FIG. 5, showing the corresponding voltages of some nodes of rectifying
circuit 18. When rectifyingcircuit 18 is brought within read distance of anRFID station 16 radiating the appropriate carrier signal, typically 13.56 Mhz,rectifier 18 will generate dc power onnode 22. Other carrier frequencies may also be used. The amplitude of the carrier signal is modulated by a binary bit data pattern, such as ASK or amplitude shift keying, generally at a frequency of 105.9 KHz. The carrier signal may also be modulated at other data frequencies.Node 36 will oscillate with the frequency of the carrier frequency, and will swing both negative and positive.Waveform 42 in FIG. 5 shows the signal onnode 36. - Referring again to FIGS. 3 and 4,
coupling capacitor 28 will couple this voltage tonode 20. Couplingcapacitor 28 is internal to the chip in this embodiment, but could be designed to be external as well. However, the signal onnode 20 is unable to go more negative than one diode drop belowground 38 due to shunting (rectifying)diode 30. Therefore, whennode 36 first swings negative,node 20 will remain one diode drop belowground 38, as shown inwaveform 44 in FIG. 5. When the carrier signal onnode 36 swings up again, the full peak-to-peak voltage is coupled tonode 20. The magnitude of this swing depends on the proximity of rectifyingcircuit 18 to the modulated carrier source radiating frombase station 10. In certain proximity ranges, the voltages generated could be so large as to damage circuit components. For this purpose, the voltage is limited throughdiode stack 40. When sufficient voltage is generated onnode 20,diode stack 40 will conduct, thereby clamping the voltage at a level determined by the breakdown ofstack 40. - When the voltage on
node 20 is more positive than the voltage onnode 22,diode 32 is forward-biased bringingnode 22 to the same voltage asnode 20. When the voltage onnode 20 is less positive than the voltage onnode 22, thendiode 32 is reverse-biased, causingnode 22 to float at the peak voltage ofnode 20. This charge is stored onstorage capacitor 34. The charge onnode 22 may be used to supply Vdd power. In one embodiment, the Vdd power may be supplied to the entire chip.Waveform 45 shows the signal onnode 22. - As power is supplied from
node 22, the charge onnode 22 is depleted causing the voltage onnode 22 to drop. On the next rising edge of 42,diode 38 will become forward-biased again, when the voltage onnode 20 is more positive than onnode 22. Through this action, the voltage onnode 22 is refreshed to its full voltage on each rising edge ofnode 20. Accordingly,capacitor 34 must be sufficiently large to supply Vdd current without causing a significant voltage drop onnode 22 between carrier pulses. - FIG. 6 is a schematic of another embodiment of the present invention, useful when building the present invention in a semiconductor process wherein the back surface is not coupled to ground, but rather Vdd. In order to gain the advantage of using the back surface as one contact of the antenna, an embodiment is required wherein one terminal of the antenna is connected to the dc power output.
- When resonating
node 36 goes negative,node 20 is kept more positive than one diode drop abovechip ground 38 by rectifyingdiode 32. When the resonatingnode 36 goes positive,coupling capacitor 28couples node 20 high. Rectifyingdiode 30 turns on, bringingnode 22 one diode drop below the peak voltage ofnode 20. Whennode 20 is coupled low again by resonatingnode 36, rectifyingdiode 30 turns off, thereby trapping charge onnode 22.Node 22 represents the dc power output of this circuit.Node 20 represents the rectified output. - A significant advantage of the rectifier design described herein over conventional designs is that the invention operates using an
antenna 24 whereby one of its two terminals is connected to chipground 38, as shown in FIG. 7. This is a significant advantage since the connection of theexternal antenna element 24 can now be made by connecting one of the terminals to theback surface 38 of the silicon. The other connection is made on front surface of the silicon to abonding pad 54. Consequently, only onepad 54 is needed for the connection of theexternal antenna 24 rather than two pads required in a conventional design. Since the size of a pad is large relative to RFID circuitry, the savings of this pad constitutes a significant savings of silicon area, which translates to a significant reduction in fabrication cost. Further savings can be achieved by covering the front surface of the silicon, in part or whole, with a metal layer that is electrically insulated from all other conductors on the integrated circuit, and coupling that metal layer tobonding pad 54. The contact surface area to which the terminal ofantenna 24 is attached is thereby significantly expanded, permitting the use of relatively low cost bonding methods, such as conductive epoxy. - Nevertheless, it is also possible to connect the
antenna element 24 on two pads on the silicon surface, just as one would connect theantenna 24 when utilizing a conventional rectified design. - A further advantage of having to make only one connection on the top surface of the silicon is that the mechanics of making the connection to the
external antenna element 24 is significantly simplified. For example, the connection could be made utilizing a second layer of metal above the integrated circuitry, thereby providing a larger connection surface without increasing silicon area. The larger connection surface enables the use of lower cost connection technologies than wire bonding such as flip chip and conductive epoxy. These bonding technologies are particularly important in bar code replacement applications wherein the antenna consists of printed conductive ink on print media. - Another advantage of this invention is that the rectified signal swings at the full peak-to-peak voltage of the resonant node voltage. The rectified signal in a conventional design swings only one half of this amplitude. Consequently, the design described in this invention will enhance the maximum read distance between the RFID tag and the
base station 16 while reducing production costs. - The foregoing description is only illustrative of the invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the invention. In particular, wherever a device is connect or coupled to another device, additional devices may be present between the two connected devices. Accordingly, the present invention embraces all such alternatives, modifications, and variances that fall within the scope of the appended claims.
Claims (44)
1. An electronic device comprising:
an integrated circuit chip having an integrated circuit, a chip ground, and a substrate with the integrated circuit on one surface of the substrate and the chip ground on another surface of the substrate; and
an antenna element formed upon substructure media, the antenna element connected between the integrated circuit and the chip ground.
2. The electronic device of claim 1 further comprising a tuning capacitor connected with the antenna element.
3. The electronic device of claim 2 wherein the tuning capacitor is formed upon the substructure media.
4. The electronic device of claim 3 wherein the tuning capacitor is formed of at least one electrically conductive layer on the substructure media.
5. The electronic device of claim 4 wherein the electrically conductive layer includes conductive ink.
6. The electronic device of claim 2 wherein the tuning capacitor is connected in parallel with the antenna element.
7. The electronic device of claim 2 wherein the tuning capacitor is connected in series with the antenna element.
8. The electronic device of claim 1 wherein the antenna element is formed of an electrically conductive layer on the substructure media.
9. The electronic device of claim 8 wherein the electrically conductive layer includes conductive ink.
10. The electronic device of claim 1 wherein the substructure media is print media.
11. The electronic device of claim 1 further including a high magnetic permeability layer to increase the inductance of the antenna element.
12. The electronic device of claim 1 wherein the substrate includes a back surface of the integrated circuit.
13. An electronic device comprising:
an integrated circuit chip having an integrated circuit including a bonding pad, a chip ground, and a substrate with the integrated circuit on one surface of the substrate and the chip ground on another surface of the substrate; and
an antenna element formed upon a substructure media, the antenna element having a first terminal connected to the bonding pad and a second terminal connected to the chip ground.
14. The electronic device of claim 13 further comprising a tuning capacitor coupled between the first terminal of the antenna element and ground.
15. The electronic device of claim 14 wherein the tuning capacitor is formed upon the substructure media.
16. The electronic device of claim 15 wherein the tuning capacitor is formed of at least one electrically conductive layer on the substructure media.
17. The electronic device of claim 16 wherein the electrically conductive layer includes conductive ink.
18. The electronic device of claim 13 wherein the antenna element is formed of an electrically conductive layer on the substructure media.
19. The electronic device of claim 18 wherein the electrically conductive layer includes conductive ink.
20. The electronic device of claim 13 wherein the substructure media is print media.
21. The electronic device of claim 13 further including a high magnetic permeability layer to increase the inductance of the antenna element.
22. The electronic device of claim 13 wherein the substrate includes a back surface of the integrated circuit.
23. An electronic device comprising:
an integrated circuit chip having an integrated circuit, a power output, and a substrate with the integrated circuit on one surface of the substrate and the power output on another surface of the substrate; and
an antenna element formed upon a substructure media, the antenna element connected between the integrated circuit and the power output.
24. The electronic device of claim 23 further including a tuning capacitor connected with the antenna element.
25. The electronic device of claim 24 wherein the tuning capacitor is formed upon the substructure media.
26. The electronic device of claim 25 wherein the tuning capacitor is formed of at least one electrically conductive layer on the substructure media.
27. The electronic device of claim 26 wherein the electrically conductive layer includes conductive ink.
28. The electronic device of claim 24 wherein the tuning capacitor is connected in parallel with the antenna element.
29. The electronic device of claim 24 wherein the tuning capacitor is connected in series with the antenna element.
30. The electronic device of claim 23 wherein the antenna element is formed of an electrically conductive layer on the substructure media.
31. The electronic device of claim 30 wherein the electrically conductive layer includes conductive ink.
32. The electronic device of claim 23 wherein the substructure media is print media.
33. The electronic device of claim 23 further including a high magnetic permeability layer to increase the inductance of the antenna element.
34. The electronic device of claim 23 wherein the substrate includes a back surface of the integrated circuit.
35. An electronic device comprising:
an integrated circuit chip having an integrated circuit including a bonding pad, a power output, and a substrate with the integrated circuit on one surface of the substrate and the power output on another surface of the substrate; and
an antenna element formed upon a substructure media, the antenna element having a first terminal connected to the bonding pad and a second terminal connected to the power output.
36. The electronic device of claim 35 further comprising a tuning capacitor coupled between the first terminal of the antenna element and the power output.
37. The electronic device of claim 36 wherein the tuning capacitor is formed upon the substructure media.
38. The electronic device of claim 37 wherein the tuning capacitor is formed of at least one electrically conductive layer on the substructure media.
39. The electronic device of claim 38 wherein the electrically conductive layer includes conductive ink.
40. The electronic device of claim 35 wherein the antenna element is formed of an electrically conductive layer on the substructure media.
41. The electronic device of claim 40 wherein the electrically conductive layer includes conductive ink.
42. The electronic device of claim 35 wherein the substructure media is print media.
43. The electronic device of claim 35 further including a high magnetic permeability layer to increase the inductance of the antenna element.
44. The electronic device of claim 35 wherein the substrate includes a back surface of the integrated circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/880,892 US20040245858A1 (en) | 2002-03-13 | 2004-06-30 | Rectifier utilizing a grounded antenna |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/097,846 US6777829B2 (en) | 2002-03-13 | 2002-03-13 | Rectifier utilizing a grounded antenna |
US10/880,892 US20040245858A1 (en) | 2002-03-13 | 2004-06-30 | Rectifier utilizing a grounded antenna |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/097,846 Division US6777829B2 (en) | 2002-03-13 | 2002-03-13 | Rectifier utilizing a grounded antenna |
Publications (1)
Publication Number | Publication Date |
---|---|
US20040245858A1 true US20040245858A1 (en) | 2004-12-09 |
Family
ID=28039261
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/097,846 Expired - Fee Related US6777829B2 (en) | 2002-03-13 | 2002-03-13 | Rectifier utilizing a grounded antenna |
US10/879,379 Expired - Fee Related US7109934B2 (en) | 2002-03-13 | 2004-06-29 | Rectifier utilizing a grounded antenna |
US10/880,892 Abandoned US20040245858A1 (en) | 2002-03-13 | 2004-06-30 | Rectifier utilizing a grounded antenna |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/097,846 Expired - Fee Related US6777829B2 (en) | 2002-03-13 | 2002-03-13 | Rectifier utilizing a grounded antenna |
US10/879,379 Expired - Fee Related US7109934B2 (en) | 2002-03-13 | 2004-06-29 | Rectifier utilizing a grounded antenna |
Country Status (12)
Country | Link |
---|---|
US (3) | US6777829B2 (en) |
EP (1) | EP1509986A4 (en) |
JP (1) | JP2005520428A (en) |
KR (1) | KR20050005427A (en) |
CN (1) | CN100359782C (en) |
AR (1) | AR038952A1 (en) |
AU (2) | AU2003222275A1 (en) |
BR (1) | BR0308388A (en) |
MX (1) | MXPA04010052A (en) |
MY (1) | MY128031A (en) |
TW (1) | TWI292249B (en) |
WO (1) | WO2003079524A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080083969A1 (en) * | 2006-10-06 | 2008-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Rectifier circuit, semiconductor device using the rectifier circuit, and driving method thereof |
US9673335B2 (en) | 2010-03-05 | 2017-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Rectifier circuit including transistor whose channel formation region includes oxide semiconductor |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6628237B1 (en) | 2000-03-25 | 2003-09-30 | Marconi Communications Inc. | Remote communication using slot antenna |
US7446663B2 (en) * | 2004-04-20 | 2008-11-04 | Alcoa Closure Systems International, Inc. | Method of forming an RF circuit assembly having multiple antenna portions |
US20060012482A1 (en) * | 2004-07-16 | 2006-01-19 | Peter Zalud | Radio frequency identification tag having an inductively coupled antenna |
DE102004063435A1 (en) * | 2004-12-23 | 2006-07-27 | Polyic Gmbh & Co. Kg | Organic rectifier |
JP2009507460A (en) * | 2005-09-02 | 2009-02-19 | エヌエックスピー ビー ヴィ | Charge pump circuit for RFID integrated circuit |
KR100659272B1 (en) * | 2005-12-15 | 2006-12-20 | 삼성전자주식회사 | Tag for wireless authentication capable of overvoltage control and its overvoltage control method |
US20080068132A1 (en) * | 2006-05-16 | 2008-03-20 | Georges Kayanakis | Contactless radiofrequency device featuring several antennas and related antenna selection circuit |
JP5138327B2 (en) * | 2006-10-06 | 2013-02-06 | 株式会社半導体エネルギー研究所 | Rectifier circuit and semiconductor device using the rectifier circuit |
US20080084311A1 (en) * | 2006-10-06 | 2008-04-10 | Texas Instruments | Inductance enhancement by magnetic material introduction |
US7317303B1 (en) * | 2006-11-30 | 2008-01-08 | Celis Semiconductor Corp. | Rectified power supply |
JP5412034B2 (en) * | 2006-12-26 | 2014-02-12 | 株式会社半導体エネルギー研究所 | Semiconductor device |
JP2008199753A (en) * | 2007-02-09 | 2008-08-28 | Yoshiyasu Mutou | Power supply circuit |
US8164933B2 (en) * | 2007-04-04 | 2012-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Power source circuit |
US8035484B2 (en) * | 2007-05-31 | 2011-10-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and IC label, IC tag, and IC card provided with the semiconductor device |
KR100979515B1 (en) * | 2008-04-03 | 2010-09-02 | (주) 파루 | RF Printing Rectifier Using Roll-to-Roll Printing |
US8629650B2 (en) | 2008-05-13 | 2014-01-14 | Qualcomm Incorporated | Wireless power transfer using multiple transmit antennas |
US8878393B2 (en) | 2008-05-13 | 2014-11-04 | Qualcomm Incorporated | Wireless power transfer for vehicles |
US20100201312A1 (en) | 2009-02-10 | 2010-08-12 | Qualcomm Incorporated | Wireless power transfer for portable enclosures |
US8854224B2 (en) | 2009-02-10 | 2014-10-07 | Qualcomm Incorporated | Conveying device information relating to wireless charging |
US9312924B2 (en) | 2009-02-10 | 2016-04-12 | Qualcomm Incorporated | Systems and methods relating to multi-dimensional wireless charging |
KR20100109765A (en) * | 2009-04-01 | 2010-10-11 | 삼성전자주식회사 | Current balancing apparatus, power supply apparatus, lighting apparatus, and current balancing method thereof |
US20110063089A1 (en) * | 2009-09-11 | 2011-03-17 | Hynix Semiconductor Inc. | Radio frequency identification (rfid) system |
KR101439039B1 (en) | 2013-06-27 | 2014-09-05 | 고려대학교 산학협력단 | Microwave RF rectifier and rectification methods |
KR101412232B1 (en) | 2013-07-17 | 2014-06-25 | 고려대학교 산학협력단 | Method and system for rectification control |
DE102015012617A1 (en) * | 2014-10-16 | 2016-04-21 | Giesecke & Devrient Gmbh | Safe element with LED |
US11030591B1 (en) * | 2016-04-01 | 2021-06-08 | Wells Fargo Bank, N.A. | Money tracking robot systems and methods |
GB2550115B (en) * | 2016-05-04 | 2020-11-04 | Advanced Risc Mach Ltd | An energy harvester |
US11862983B1 (en) | 2019-03-28 | 2024-01-02 | Roger W. Graham | Earth energy systems and devices |
FR3151925A1 (en) * | 2023-07-31 | 2025-02-07 | Idemia France | CONTACTLESS ELECTRONIC CARD INCLUDING A VOLTAGE RECTIFIER CIRCUIT |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4745401A (en) * | 1985-09-09 | 1988-05-17 | Minnesota Mining And Manufacturing Company | RF reactivatable marker for electronic article surveillance system |
US5138436A (en) * | 1990-11-16 | 1992-08-11 | Ball Corporation | Interconnect package having means for waveguide transmission of rf signals |
US5327148A (en) * | 1993-02-17 | 1994-07-05 | Northeastern University | Ferrite microstrip antenna |
US5422650A (en) * | 1992-08-28 | 1995-06-06 | U.S. Philips Corporation | Loop antenna with series resonant circuit and parallel reactance providing dual resonant frequencies |
US6437426B1 (en) * | 1999-01-27 | 2002-08-20 | Nec Corporation | Semiconductor integrated circuit having an improved grounding structure |
US6480110B2 (en) * | 2000-12-01 | 2002-11-12 | Microchip Technology Incorporated | Inductively tunable antenna for a radio frequency identification tag |
US20030012006A1 (en) * | 2001-07-11 | 2003-01-16 | Silverman Lawrence H. | Pocket mounted chip having microstrip line |
US6714113B1 (en) * | 2000-11-14 | 2004-03-30 | International Business Machines Corporation | Inductor for integrated circuits |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4086074A (en) | 1976-01-22 | 1978-04-25 | Corning Glass Works | Antireflective layers on phase separated glass |
US5187115A (en) | 1977-12-05 | 1993-02-16 | Plasma Physics Corp. | Method of forming semiconducting materials and barriers using a dual enclosure apparatus |
US4622735A (en) | 1980-12-12 | 1986-11-18 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing a semiconductor device utilizing self-aligned silicide regions |
JPS60235745A (en) | 1984-05-07 | 1985-11-22 | Hoya Corp | Porous antireflection film and its manufacture |
CA1216962A (en) | 1985-06-28 | 1987-01-20 | Hussein M. Naguib | Mos device processing |
US4766090A (en) | 1986-04-21 | 1988-08-23 | American Telephone And Telegraph Company, At&T Bell Laboratories | Methods for fabricating latchup-preventing CMOS device |
EP0270274A3 (en) * | 1986-12-05 | 1990-01-24 | Meridian Micro-Systems Limited | Transponder and interrogator |
JPH0834242B2 (en) | 1988-12-08 | 1996-03-29 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
US5236865A (en) | 1991-01-16 | 1993-08-17 | Micron Technology, Inc. | Method for simultaneously forming silicide and effecting dopant activation on a semiconductor wafer |
KR950007478B1 (en) | 1992-06-17 | 1995-07-11 | 금성일렉트론주식회사 | Anti reflective method in metal mask step |
ZA941671B (en) * | 1993-03-11 | 1994-10-12 | Csir | Attaching an electronic circuit to a substrate. |
US5430441A (en) * | 1993-10-12 | 1995-07-04 | Motorola, Inc. | Transponding tag and method |
US5444024A (en) | 1994-06-10 | 1995-08-22 | Advanced Micro Devices, Inc. | Method for low energy implantation of argon to control titanium silicide formation |
US5693971A (en) | 1994-07-14 | 1997-12-02 | Micron Technology, Inc. | Combined trench and field isolation structure for semiconductor devices |
FR2729259A1 (en) * | 1995-01-11 | 1996-07-12 | Bouvier Jacky | METHOD AND DEVICE FOR CONTROLLING THE OPERATION OF THE ELECTRONIC MEANS OF A PORTABLE OBJECT SUPPLIED FROM THE ENERGY RECEIVED AT ITS ANTENNA |
JP3761001B2 (en) * | 1995-11-20 | 2006-03-29 | ソニー株式会社 | Contactless information card and IC |
US5708419A (en) * | 1996-07-22 | 1998-01-13 | Checkpoint Systems, Inc. | Method of wire bonding an integrated circuit to an ultraflexible substrate |
FR2758003B1 (en) | 1996-12-27 | 1999-06-18 | France Telecom | ANTI-REFLECTIVE TREATMENT OF REFLECTIVE SURFACES |
US6037239A (en) | 1997-04-23 | 2000-03-14 | Elantec, Inc. | Method for making a contact structure for a polysilicon filled trench isolation |
US6096621A (en) | 1997-04-23 | 2000-08-01 | Elantec, Inc. | Polysilicon filled trench isolation structure for soi integrated circuits |
US6277728B1 (en) | 1997-06-13 | 2001-08-21 | Micron Technology, Inc. | Multilevel interconnect structure with low-k dielectric and method of fabricating the structure |
US6268796B1 (en) * | 1997-12-12 | 2001-07-31 | Alfred Gnadinger | Radio frequency identification transponder having integrated antenna |
SG79961A1 (en) * | 1998-02-07 | 2001-04-17 | Ct For Wireless Communications | A rectifying antenna circuit |
KR100285701B1 (en) | 1998-06-29 | 2001-04-02 | 윤종용 | Manufacturing method and structure of trench isolation |
US6480699B1 (en) * | 1998-08-28 | 2002-11-12 | Woodtoga Holdings Company | Stand-alone device for transmitting a wireless signal containing data from a memory or a sensor |
US6383723B1 (en) | 1998-08-28 | 2002-05-07 | Micron Technology, Inc. | Method to clean substrate and improve photoresist profile |
DE19840220A1 (en) * | 1998-09-03 | 2000-04-20 | Fraunhofer Ges Forschung | Transponder module and method for producing the same |
US6281100B1 (en) | 1998-09-03 | 2001-08-28 | Micron Technology, Inc. | Semiconductor processing methods |
US6380611B1 (en) | 1998-09-03 | 2002-04-30 | Micron Technology, Inc. | Treatment for film surface to reduce photo footing |
US20010006759A1 (en) | 1998-09-08 | 2001-07-05 | Charles R. Shipley Jr. | Radiation sensitive compositions |
US6156674A (en) | 1998-11-25 | 2000-12-05 | Micron Technology, Inc. | Semiconductor processing methods of forming insulative materials |
US6291363B1 (en) | 1999-03-01 | 2001-09-18 | Micron Technology, Inc. | Surface treatment of DARC films to reduce defects in subsequent cap layers |
JP2000299440A (en) * | 1999-04-15 | 2000-10-24 | Hitachi Ltd | Field effect transistor and integrated voltage generating circuit using the same |
US6133105A (en) | 1999-04-27 | 2000-10-17 | United Microelectronics Corp. | Method of manufacturing borderless contact hole including a silicide layer on source/drain and sidewall of trench isolation structure |
US6368901B2 (en) * | 1999-07-15 | 2002-04-09 | Texas Instruments Incorporated | Integrated circuit wireless tagging |
US6388575B1 (en) * | 1999-11-05 | 2002-05-14 | Industrial Technology, Inc. | Addressable underground marker |
FR2802684B1 (en) * | 1999-12-15 | 2003-11-28 | Gemplus Card Int | DISPOSABLE INTEGRATED CIRCUIT CHIP DEVICE AND METHOD FOR MANUFACTURING SUCH A METHOD |
US6277709B1 (en) | 2000-07-28 | 2001-08-21 | Vanguard International Semiconductor Corp. | Method of forming shallow trench isolation structure |
KR100379612B1 (en) | 2000-11-30 | 2003-04-08 | 삼성전자주식회사 | Shallow trench isolation type semiconductor device and method of forming the same |
US6440793B1 (en) | 2001-01-10 | 2002-08-27 | International Business Machines Corporation | Vertical MOSFET |
US6466126B2 (en) * | 2001-01-19 | 2002-10-15 | Motorola, Inc. | Portable data device efficiently utilizing its available power and method thereof |
US6465325B2 (en) | 2001-02-27 | 2002-10-15 | Fairchild Semiconductor Corporation | Process for depositing and planarizing BPSG for dense trench MOSFET application |
US20020196651A1 (en) | 2001-06-22 | 2002-12-26 | Rolf Weis | Memory cell layout with double gate vertical array transistor |
KR100428806B1 (en) | 2001-07-03 | 2004-04-28 | 삼성전자주식회사 | Structure of Trench Isolation and Method of Forming The Same |
US6580321B1 (en) * | 2001-08-24 | 2003-06-17 | Anadigics, Inc. | Active clamping circuit for power amplifiers |
US6780728B2 (en) | 2002-06-21 | 2004-08-24 | Micron Technology, Inc. | Semiconductor constructions, and methods of forming semiconductor constructions |
-
2002
- 2002-03-13 US US10/097,846 patent/US6777829B2/en not_active Expired - Fee Related
-
2003
- 2003-03-12 AU AU2003222275A patent/AU2003222275A1/en not_active Abandoned
- 2003-03-12 AR ARP030100862A patent/AR038952A1/en active IP Right Grant
- 2003-03-12 WO PCT/US2003/007474 patent/WO2003079524A2/en active Application Filing
- 2003-03-12 JP JP2003577406A patent/JP2005520428A/en active Pending
- 2003-03-12 MY MYPI20030860A patent/MY128031A/en unknown
- 2003-03-12 TW TW092105369A patent/TWI292249B/en active
- 2003-03-12 CN CNB038083310A patent/CN100359782C/en not_active Expired - Fee Related
- 2003-03-12 MX MXPA04010052A patent/MXPA04010052A/en active IP Right Grant
- 2003-03-12 KR KR10-2004-7014964A patent/KR20050005427A/en not_active Application Discontinuation
- 2003-03-12 BR BR0308388-8A patent/BR0308388A/en not_active IP Right Cessation
- 2003-03-12 EP EP03717959A patent/EP1509986A4/en not_active Withdrawn
-
2004
- 2004-06-29 US US10/879,379 patent/US7109934B2/en not_active Expired - Fee Related
- 2004-06-30 US US10/880,892 patent/US20040245858A1/en not_active Abandoned
-
2009
- 2009-06-11 AU AU2009202318A patent/AU2009202318A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4745401A (en) * | 1985-09-09 | 1988-05-17 | Minnesota Mining And Manufacturing Company | RF reactivatable marker for electronic article surveillance system |
US5138436A (en) * | 1990-11-16 | 1992-08-11 | Ball Corporation | Interconnect package having means for waveguide transmission of rf signals |
US5422650A (en) * | 1992-08-28 | 1995-06-06 | U.S. Philips Corporation | Loop antenna with series resonant circuit and parallel reactance providing dual resonant frequencies |
US5327148A (en) * | 1993-02-17 | 1994-07-05 | Northeastern University | Ferrite microstrip antenna |
US6437426B1 (en) * | 1999-01-27 | 2002-08-20 | Nec Corporation | Semiconductor integrated circuit having an improved grounding structure |
US6714113B1 (en) * | 2000-11-14 | 2004-03-30 | International Business Machines Corporation | Inductor for integrated circuits |
US6480110B2 (en) * | 2000-12-01 | 2002-11-12 | Microchip Technology Incorporated | Inductively tunable antenna for a radio frequency identification tag |
US20030012006A1 (en) * | 2001-07-11 | 2003-01-16 | Silverman Lawrence H. | Pocket mounted chip having microstrip line |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080083969A1 (en) * | 2006-10-06 | 2008-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Rectifier circuit, semiconductor device using the rectifier circuit, and driving method thereof |
US8351226B2 (en) | 2006-10-06 | 2013-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Rectifier circuit, semiconductor device using the rectifier circuit, and driving method thereof |
US9673335B2 (en) | 2010-03-05 | 2017-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Rectifier circuit including transistor whose channel formation region includes oxide semiconductor |
Also Published As
Publication number | Publication date |
---|---|
AU2009202318A1 (en) | 2009-07-02 |
US7109934B2 (en) | 2006-09-19 |
KR20050005427A (en) | 2005-01-13 |
US20040233591A1 (en) | 2004-11-25 |
EP1509986A2 (en) | 2005-03-02 |
MXPA04010052A (en) | 2005-08-16 |
US6777829B2 (en) | 2004-08-17 |
WO2003079524A3 (en) | 2004-05-27 |
AR038952A1 (en) | 2005-02-02 |
CN1647341A (en) | 2005-07-27 |
BR0308388A (en) | 2005-01-11 |
WO2003079524A2 (en) | 2003-09-25 |
CN100359782C (en) | 2008-01-02 |
US20030184163A1 (en) | 2003-10-02 |
TW200304265A (en) | 2003-09-16 |
EP1509986A4 (en) | 2006-02-15 |
TWI292249B (en) | 2008-01-01 |
MY128031A (en) | 2007-01-31 |
JP2005520428A (en) | 2005-07-07 |
AU2003222275A1 (en) | 2003-09-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7109934B2 (en) | Rectifier utilizing a grounded antenna | |
US7119693B1 (en) | Integrated circuit with enhanced coupling | |
US6570490B1 (en) | Contactless IC card | |
US8258958B2 (en) | Dual antenna RFID tag | |
US6848620B2 (en) | Semiconductor integrated circuit | |
EP0855064A1 (en) | Remotely powered electronic tag and associated exciter/reader and related method | |
JP2009537886A (en) | Non-contact radio frequency device having a plurality of antennas and an antenna selection circuit associated therewith | |
JPH09147070A (en) | Noncontact type information card | |
JP2011022923A (en) | Contactless ic card and wireless system | |
JPH11510597A (en) | Radio frequency interface device for transponder | |
US7453360B2 (en) | Identification-data media | |
WO2002099764A1 (en) | Capacitively powered data communication system with tag and circuit carrier apparatus for use therein | |
US20070075147A1 (en) | Circuits for preventing overvoltage conditions on antenna terminals and method | |
KR100730490B1 (en) | IC Chip In-Power Power Supply Circuit for Contactless IC Cards | |
JP2005339275A (en) | Communication state confirmation device for noncontact ic card | |
JP2005151386A (en) | Power supply circuit in ic chip for non-contact ic card |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |