TWM591709U - CSP light emitting diode packaging device - Google Patents

Abstract

This creation relates to a CSP light-emitting diode packaging device, including: light-emitting diode crystal grains, a first phosphorescent medium layer, at least including a first phosphor with a first phosphor powder layer; a conductive layer; a second phosphorescent medium The layer includes at least a second encapsulant with a second phosphor layer and a matching substrate including an electrode layer, wiring, a solder paste layer and an insulating layer. In this creation, the wires are integrated into the conductive layer in the LED structure to reduce the space required for wire bonding and to solve the problem that the wires are fragile and easily broken, thereby improving product yield.

Description

CSP light emitting diode packaging device

This creation relates to a CSP light-emitting diode packaging device. The light-emitting diode die, the first phosphor dielectric layer, the conductive layer, the second phosphor dielectric layer, the substrate, the wiring, the solder paste layer and the insulating layer By integrating the wires into the conductive layer in the LED structure, a certain amount of space is required for wire bonding, which not only solves the yield problem caused by wire bonding, but also reduces the size of the overall CSP light-emitting diode packaging device.

In recent years, thanks to the rapid development of technology, the emergence of white light-emitting diodes has gradually replaced traditional incandescent light bulbs and fluorescent lamps. White light-emitting diodes have small size, less heat radiation, low power consumption, and use. Long life and other advantages, while solving the problem of traditional incandescent light bulbs that consume a lot of power and are easily broken due to high temperature. In recent years, due to the continuous rise of green energy and environmental protection issues, white light-emitting diodes are recyclable, pollution-free, and easy Developed into light, thin and short products, the white light-emitting diode has become one of the most widely used lighting devices in the world.

As shown in FIGS. 1 and 2, the conventional light-emitting diode system has a layer of a first colloid containing a corresponding red phosphor (C) fixed on the bottom of a blue light-emitting chip (A) ( D), and a second colloid (E) containing a corresponding green phosphor (B) is fixed on the top of the blue light-emitting chip (A), which becomes a white multi-wavelength light-emitting diode The grain monomer, using the first colloid (D) as a part for coating a die-bonding glue (F), fixes the grain monomer on a carrier (G), and consists of a gold wire (H) The blue light-emitting chip (A) is composed of circuit connections, and the conventional light-emitting diode lighting devices generally reduce the width of the gold wire (H) during the wire bonding process to reduce the gold The resistance value of the wire (H), but it tends to make the gold wire (H) fragile and easily broken, which can not improve the yield and increase the manufacturing cost.

Therefore, how to effectively provide a chip-scale package (CSP) technology combined with a light-emitting diode die, a first phosphor dielectric layer, a conductive layer, a second phosphor dielectric layer, and a substrate through innovative design , Wiring, solder paste layer and insulating layer of CSP light-emitting diode packaging devices to reduce the problem of fragile wires that are easily broken during wire bonding and resulting in poor yield. Related industry developers and related researchers need to continue efforts to overcome and The problem solved.

In view of this, there are still many innovations and improvements in the conventional light-emitting diodes during actual implementation. Therefore, the creators have improved them with the help of their rich professional knowledge and practical experience, and researched accordingly Create this creation.

The main purpose of this creation is to provide a CSP light-emitting diode packaging device, which includes: a light-emitting diode die; a first phosphorescent medium layer, at least including a first phosphor powder layer with a first Encapsulating colloid and the first phosphorescent medium layer is formed under the light-emitting diode grains; a conductive layer is formed under the light-emitting diode grains respectively, and the conductive layers are respectively disposed on the first phosphorescence Two sides of the dielectric layer; a second phosphorescent dielectric layer, which at least includes a second encapsulating colloid with a second phosphor powder layer, and the second phosphorescent dielectric layer is formed above the light-emitting diode die; a substrate, An electrode layer is formed on the substrate; a wiring is formed on the same layer as the electrode layer to connect the electrode layer; a solder paste layer is connected to the conductive layer and the electrode layer; and an insulating layer is used to Cover this wiring.

The present invention further provides a CSP light emitting diode packaging device, which includes: a light emitting diode die; a first phosphorescent medium layer, which at least includes a first encapsulating colloid with a first phosphor powder layer and the A first phosphorescent dielectric layer is formed above the light-emitting diode grains; a conductive layer is formed under the light-emitting diode grains respectively, and the conductive layers are disposed on both sides of the first phosphorescent medium layer A second phosphorescent medium layer, at least comprising a second encapsulant with a second phosphor powder layer, and the second phosphorescent medium layer is formed above the first phosphorescent medium layer; a substrate on which a substrate is formed An electrode layer; a wiring formed on the same layer as the electrode layer to connect the electrode layer; a solder paste layer connecting the conductive layer and the electrode layer; and an insulating layer covering the wiring .

According to the CSP light emitting diode packaging device described in the above technical features, the light emitting diode grains are blue grains.

According to the CSP light emitting diode packaging device described in the above technical features, the first phosphor layer is a red phosphor layer.

According to the CSP light emitting diode packaging device described in the above technical features, the second phosphor layer is a green phosphor layer.

According to the CSP light emitting diode packaging device described in the above technical features, the light emitting diode crystal grains are near ultraviolet crystal grains.

According to the CSP light emitting diode packaging device described in the above technical features, the first phosphor layer is a red phosphor layer.

According to the CSP light emitting diode packaging device described in the above technical features, the second phosphor layer is a mixed green phosphor layer and blue phosphor layer.

According to the above technical features, the CSP light emitting diode packaging device further includes a solid hemispherical dome fixed on the substrate and surrounding the light emitting diode die, the first phosphor dielectric layer and the first Two phosphorescent dielectric layers, and the solid hemispherical dome is composed of a light-transmitting material.

The CSP light emitting diode packaging device according to the above technical features further includes a light reflecting layer disposed between the light emitting diode die and the substrate.

In this way, the author provides a CSP light emitting diode package device, which includes a light emitting diode die, a first phosphor dielectric layer, a conductive layer, a second phosphor dielectric layer, a substrate, wiring, a solder paste layer and an insulating layer, Through the LED structure of the CSP light emitting diode packaging device through the chip-scale package (CSP) process and the substrate used together, the wire bonding is integrated into the conductive layer in the LED structure to solve the wire bonding (Wire bonding) ) In the manufacturing process, the resistance value of the wire is reduced, and the wire width of the wire is reduced, which causes the problem that the wire is fragile and easily broken, and improves the product yield rate, thereby reducing the manufacturing cost.

In order to better understand the technical characteristics, content and advantages of this creation and the effects it can achieve, the expressions of this creation in conjunction with the drawings are described in detail below, and the drawings used therein are only for illustration and auxiliary instructions. For the purpose of this, it may not be the true proportion and precise configuration after the creation of the creation, so it should not be interpreted and limited to the relationship between the proportion and configuration of the attached drawings.

In order to make the narrative of the disclosure of this creation more detailed and complete, the following provides an illustrative description of the implementation form and specific embodiments of the creation; but this is not the only form of implementing or using the specific embodiments of the creation.

Please refer to Figures 2 to 4 for the CSP light-emitting diode structure diagram, structure diagram and schematic diagram of the CSP light-emitting diode packaging device of the present invention. The CSP light-emitting diode packaging device of this creation includes a light-emitting diode die (1), a first phosphorescent dielectric layer (2), a conductive layer (3), a second phosphorescent dielectric layer (4), A substrate (5), a wiring (52), a solder paste layer (53) and an insulating layer (54).

The light-emitting diode grain (1); the first phosphorescent medium layer (2) at least includes a first encapsulating colloid (22) having a first phosphorescent powder layer (21) and the first phosphorescent medium layer (2) formed under the light-emitting diode grains (1); the conductive layer (3), the conductive layer (3) are formed under the light-emitting diode grains (1), the conductive layer (3 ) Are disposed on both sides of the first phosphorescent medium layer (2); the second phosphorescent medium layer (4) at least includes a second encapsulant (42) having a second phosphor powder layer (41), And the second phosphorescent medium layer (4) is formed above the light-emitting diode grains (1); the substrate (5), an electrode layer (51) is formed on the substrate (5); the wiring (52), It is formed on the same layer as the electrode layer (51) to connect the electrode layer (51); the solder paste layer (53) connects the conductive layer (3) and the electrode layer (51); and the insulation The layer (54) covers the wiring (52).

In one embodiment, the light-emitting diode grains (1) are blue grains, the first phosphor layer (21) is a red phosphor layer, and the second phosphor layer (41) is A green phosphor layer, two conductive layers (3) are formed under the light-emitting diode grains (1), the two conductive layers (3) are respectively disposed on both sides of the red phosphor layer, the blue grain system The electrical energy provided by the conductive layer (3) can be converted to light wavelength, and the red phosphor powder layer and the green phosphor powder layer can convert part of the light wavelength emitted by the blue crystal grain to another light wavelength, so that The wavelengths of each light are mixed to form the expected white light.

In another embodiment, the light-emitting diode crystal grains (1) are near ultraviolet crystal grains, the first phosphor powder layer (21) is a red phosphor powder layer, and the second phosphor powder layer (41) It is a mixture of green phosphor powder layer and blue phosphor powder layer, two conductive layers (3) are formed under the light-emitting diode crystal grains (1) respectively, and the two conductive layers (3) are respectively disposed on the red phosphor powder On both sides of the layer, the near-ultraviolet crystal grains can convert the electrical energy provided by the conductive layer (3) to the light wavelength, and the near-ultraviolet crystal can be converted by the red phosphor layer and the mixed green phosphor layer and the blue phosphor layer The proportion of the light wavelength emitted by the granules is converted to another light wavelength, so that the light wavelengths are mixed to form the expected white light.

This creative department additionally provides a CSP light emitting diode package device comprising a light emitting diode die (1), a first phosphorescent dielectric layer (2), a conductive layer (3), and a second phosphorescent dielectric layer ( 4), a substrate (5), a wiring (52), a solder paste layer (53) and an insulating layer (54).

The light-emitting diode grain (1); the first phosphorescent medium layer (2) at least includes a first encapsulating colloid (22) having a first phosphorescent powder layer (21) and the first phosphorescent medium layer (2) formed above the light-emitting diode grains (1); the conductive layer (3), the conductive layer (3) are formed under the light-emitting diode grains (1), the conductive layer (3) ) Are disposed on both sides of the first phosphorescent medium layer (2); the second phosphorescent medium layer (4) at least includes a second encapsulant (42) having a second phosphor powder layer (41), And the second phosphorescent dielectric layer (4) is formed above the first phosphorescent dielectric layer (2); the substrate (5), an electrode layer (51) is formed on the substrate (5); the wiring (52) is Formed on the same layer as the electrode layer (51) to connect the electrode layer (51); the solder paste layer (53) connects the conductive layer (3) and the electrode layer (51); and the insulating layer (54), covering the wiring (52).

In one embodiment, the light-emitting diode grains (1) are blue grains, the first phosphor layer (21) is a red phosphor layer, and the second phosphor layer (41) is A green phosphor layer, two conductive layers (3) are formed under the light-emitting diode grains (1) respectively, and the two conductive layers (3) are disposed on both sides of the light-emitting diode grains (1) respectively , The blue crystal can convert the electrical energy provided by the conductive layer (3) to the wavelength of light, and the red phosphor powder layer and the green phosphor powder layer can convert part of the light wavelength emitted by the blue crystal grain to At the other light wavelength, the light wavelengths are mixed to form the desired white light.

In another embodiment, the light-emitting diode crystal grains (1) are near ultraviolet crystal grains, the first phosphor powder layer (21) is a red phosphor powder layer, and the second phosphor powder layer (41) It is a mixture of green phosphor powder layer and blue phosphor powder layer. Two conductive layers (3) are formed under the light-emitting diode crystal grains (1) respectively. The two conductive layers (3) are respectively arranged on the light-emitting diodes. On both sides of the polar body grains (1), the near-ultraviolet grains can convert the electrical energy provided by the conductive layer (3) to the light wavelength, and through the red phosphor powder layer and the mixed green phosphor powder layer and the blue phosphorescence The powder layer converts a portion of the light wavelength emitted by the near-ultraviolet crystal grains to another light wavelength, so that each light wavelength is mixed to form the desired white light.

The substrate (5), an electrode layer (51) is formed on the substrate (5), in an embodiment, the substrate (5) is selected from one of glass, quartz, ceramic, circuit board or metal thin plate and Forming, the electrode layer (51) is an anode electrode or a cathode electrode, in another embodiment, an alignment mark on the same side of the light emitting diode grain (1) is further formed on the substrate (5), When manufacturing the CSP light emitting diode packaging device (100), the arrangement relationship of the alignment marks on the substrate (5) is used to improve the accuracy of the arrangement position of each component and make the CSP light emitting diode The reliability of the packaging device (100) is improved. In an embodiment, the substrate (5) further includes a heat dissipation portion formed in or on the surface of the substrate (5), and the heat dissipation portion is selected from insulation One of thermally conductive solder, insulating thermally conductive ink or insulating thermally conductive adhesive, the heat dissipating portion helps to dissipate the heat generated from the CSP light emitting diode packaging device (100), reduce the continuous high temperature, and maintain stable working efficiency.

The wiring (52) is formed on the same layer as the electrode layer (51) to connect the electrode layer (51), and the wiring (52) is a metal line segment to electrically connect the electrode layer (51) And forming two wirings (52) having mutually different electrical characteristics, the wiring (52) may further form a plurality of patterned metal line segments, and one end of the patterned metal line segments is electrically connected to the anode electrode or the cathode The other end of the electrode can be connected to other metal line segments in series or parallel to electrically connect the adjacent CSP light emitting diode packaging device (100) or other components.

The solder paste layer (53) is electrically connected to the conductive layer (3) and the electrode layer (51), and the solder paste layer (53) is connected to the conductive layer (3) and the electrode layer by baking (51).

The insulating layer (54) covers the wiring (52), the insulating layer (54) may cover the wiring (52) entirely, or the insulating layer (54) may partially cover the wiring (52) 52), to selectively expose the wiring (52) as an electrical connection to other components in the future.

Please refer to FIG. 4 again. The CSP light emitting diode packaging device further includes a hemispherical dome (6), which is fixed on the substrate (5) and surrounds the light emitting diode die (1) ), the first phosphorescent dielectric layer (2) and the second phosphorescent dielectric layer (4), the solid hemispherical dome (6) is formed by molding or another technique, in one embodiment, The solid hemispherical dome (6) is composed of a light-transmitting material, and has high optical transmittance, preferably the transparent light-transmitting material.

As shown in Figures 2 to 4, the manufacturing process of the CSP light emitting diode packaging device is as shown in Figure 5, which includes at least the following steps: a CSP light emitting diode forming step (S1), a substrate forming step (S2), a substrate cutting step (S3), a solder paste layer forming step (S4), and a mounting step (S5).

The CSP light emitting diode forming step (S1): Provide a light-emitting diode die (1) of a predetermined light color, and configure a first phosphor layer (2) and a conductive layer (3) on the light-emitting diode die (1) in a configuration relationship And a second phosphorescent dielectric layer (4) to form a CSP light emitting diode.

The creation provides that the configuration relationship is a first phosphorescent medium layer (2), which at least includes a first encapsulating colloid (22) having a first phosphorescent powder layer (21) and the first phosphorescent medium layer (2) Formed under the light emitting diode grains (1); a conductive layer (3), the conductive layers (3) are formed under the light emitting diode grains (1), the conductive layers (3) are respectively Disposed on both sides of the first phosphorescent dielectric layer (2); a second phosphorescent dielectric layer (4) at least includes a second encapsulating colloid (42) having a second phosphorescent powder layer (41), and the first A phosphorescent dielectric layer (4) is formed above the light-emitting diode crystal grains (1).

The present invention further provides that the configuration relationship may be a first phosphorescent medium layer (2), which at least includes a first encapsulating colloid (22) having a first phosphorescent powder layer (21) and the first phosphorescent medium layer ( 2) Formed above the light-emitting diode grains (1); a conductive layer (3), the conductive layer (3) is formed under the light-emitting diode grains (1), the conductive layer (3) They are respectively arranged on both sides of the light-emitting diode die (1); a second phosphorescent medium layer (4) at least includes a second encapsulating colloid (42) with a second phosphor powder layer (41), And the second phosphorescent dielectric layer (4) is formed above the first phosphorescent dielectric layer (2).

The substrate forming step (S2): an electrode layer (51) connected to the outside is formed on a substrate (5) in advance, and the electrode layer (51) connects two wirings (52) having mutually different electrical characteristics, and An insulating layer (54) is formed to cover the wiring (52).

The substrate cutting step (S3): a mechanical knife (56) is used to cut a cutting lane (55) of the substrate (5) to form a plurality of independent CSP light-emitting diodes. Please refer to Figures 6 to 8 together, which are the pre-cutting substrate diagram, the cutting substrate step diagram, and the post-cutting substrate diagram of the CSP light emitting diode packaging device of this creation, as shown in the pre-cutting substrate diagram, the substrate ( 5) In addition to the area (58) of a plurality of CSP light emitting diode packaging devices (100), a mechanical knife (56) is also reserved for cutting a cutting path (55); as shown in the step of cutting a substrate The cutting path (55) of the substrate (5) is cut by the mechanical knife (56) to separate the area (58) of the single CSP light emitting diode packaging device (100); As shown in the rear substrate diagram, the cutting path (55) of the substrate (5) has been cut by the mechanical knife (56), and the regions (58) of each of the CSP light emitting diode packaging devices (100) are separated from each other.

The solder paste layer forming step (S4): forming a steel mesh (57) with a hole position (571) at the position of the electrode layer (51) of the substrate (5), and making the hole of the steel mesh (57) The position (571) is aligned and covered on the electrode layer (51) of the substrate (5), and then a solder paste is coated on the steel mesh (57), and a solder paste layer (53) is formed on the electrode layer (51) 51), and finally scrape off the excess solder paste on the steel mesh (57), as shown in Figures 9 to 11, it is the step of forming the solder paste layer of the CSP light-emitting diode packaging device of this creation (1 ), solder paste layer forming step (2), solder paste layer forming step (3).

The mounting step (S5): align the conductive layer (3) of the CSP light-emitting diode on the solder paste layer (53) covering the substrate (5), and bake is completed, as shown in Figure 12, This is the installation step of the CSP light-emitting diode package device created by the author.

Please also refer to FIG. 13 for the configuration of the reflective layer of the CSP light emitting diode packaging device of the present invention, the CSP light emitting diode packaging device (100) further includes a reflective layer (7), the reflective layer (7 ) Located between the light-emitting diode die (1) and the substrate (5), the reflective layer (7) has a high reflectivity performance requirement, which assists in enhancing the expected white light performance and brightness effect.

In summary, compared with the existing technology and products, this creation has one of the following advantages:

One of the purposes of this creation is to use the LED structure of the CSP light emitting diode packaging device through the chip-scale package (CSP) process and the substrate used together, by integrating the wires into the conductive layer in the LED structure, Reducing the amount of space required for wire bonding not only solves the yield problem caused by wire bonding, but also reduces the overall volume of the CSP light-emitting diode packaging device, making the product thinner and lighter.

One of the purposes of this creation is to form multiple CSP light-emitting diode packaging devices by cutting from a single substrate, and mass-produce a single CSP light-emitting diode packaging device and use a single CSP light-emitting diode package The device is redistributed on the substrate to meet the needs of the product, and then fully exert its functions.

In summary, the CSP light-emitting diode packaging device of this creation can indeed achieve the expected use effect through the embodiments disclosed above, and this creation has not been disclosed before the application, and it has fully complied with the patent law Regulations and requirements. I filed an application for a new type of patent in accordance with the law, and pleaded for the review and granted the patent.

However, the illustrations and descriptions disclosed above are not intended to limit the scope of protection of this creation; anyone who is familiar with this skill, other equivalent changes or modifications made according to the characteristic category of this creation should be deemed Do not deviate from the design scope of this creation

[Prior art] (A): Blue light-emitting chip (B): Green phosphor (C): Red phosphor (D): The first colloid (E): second colloid (F): solid crystal glue (G): carrier (H): Gold thread [This creation] (100): CSP light emitting diode packaging device (1): LED grains (2): First phosphorescent dielectric layer (21): First phosphor layer (22): The first packaging colloid (3): conductive layer (4): Second phosphorescent dielectric layer (41): Second phosphor layer (42): Second packaging colloid (5): substrate (51): electrode layer (52): Wiring (53): solder paste layer (54): Insulation layer (55): Cutting road (56): Mechanical knife (57): Steel mesh (571): Hole position (58): area (6): Solid hemispherical dome (7): reflective layer (S1): CSP light emitting diode forming step (S2): Substrate formation step (S3): Step of cutting substrate (S4): Step of forming solder paste layer (S5): Installation steps

Figure 1 is a schematic diagram of a conventional light-emitting diode. Figure 2 is a structural diagram of the CSP light emitting diode package device (1). Figure 3 is a structural diagram (2) of the CSP light emitting diode packaging device of this creation. Figure 4 is a schematic diagram of the CSP light emitting diode packaging device of the present creation. Figure 5 is a flow chart of the creation of the CSP light emitting diode packaging device of this creation. Figure 6 is a diagram of the substrate before cutting of the CSP light emitting diode packaging device of the present invention. Fig. 7 is a step diagram of the cutting substrate of the CSP light emitting diode packaging device of the present invention. Figure 8 is a cut-away substrate view of the CSP light-emitting diode packaging device of this creation. Figure 9 is the step (1) of forming the solder paste layer of the CSP light-emitting diode packaging device of this creation. Fig. 10 is the step (2) of forming the solder paste layer of the CSP light emitting diode packaging device of this creation. Figure 11 is the step (3) of forming the solder paste layer of the CSP light-emitting diode packaging device of this creation. Figure 12 shows the installation steps of the CSP light-emitting diode packaging device of this creation. Figure 13 is a layout diagram of the reflective layer of the CSP light-emitting diode packaging device of this creation.

(100): CSP light emitting diode packaging device

(1): LED grains

(2): First phosphorescent dielectric layer

(21): First phosphor layer

(22): The first packaging colloid

(3): conductive layer

(4): Second phosphorescent dielectric layer

(41): Second phosphor layer

(42): Second packaging colloid

(5): substrate

(51): electrode

(52): Wiring

(53): solder paste layer

(54): Insulation layer

Claims (10)

A CSP light emitting diode packaging device, including: A light-emitting diode grain (1); A first phosphor layer (2) includes at least a first encapsulant (22) with a first phosphor layer (21) and the first phosphor layer (2) is formed on the light-emitting diode crystal Below the grain (1); A conductive layer (3), the conductive layer (3) is formed under the light-emitting diode grains (1), the conductive layers (3) are disposed on each side of the first phosphorescent medium layer (2); A second phosphor layer (4) includes at least a second encapsulant (42) with a second phosphor layer (41), and the second phosphor layer (4) is formed on the light emitting diode Above the grain (1); A substrate (5), an electrode layer (51) is formed on the substrate (5); A wiring (52) is formed on the same layer as the electrode layer (51) for connecting the electrode layer (51); A solder paste layer (53) connecting the conductive layer (3) and the electrode layer (51); and An insulating layer (54) covers the wiring (52). A CSP light emitting diode packaging device, including: A light-emitting diode grain (1); A first phosphor layer (2) includes at least a first encapsulant (22) with a first phosphor layer (21) and the first phosphor layer (2) is formed on the light-emitting diode crystal Above the grain (1); A conductive layer (3), the conductive layer (3) is formed under the light-emitting diode grains (1), the conductive layers (3) are disposed on each side of the light-emitting diode grains (1) ; A second phosphorescent medium layer (4) includes at least a second encapsulant (42) having a second phosphorescent powder layer (41), and the second phosphorescent medium layer (4) is formed on the first phosphorescent medium Above layer (2); A substrate (5), an electrode layer (51) is formed on the substrate (5); A wiring (52) is formed on the same layer as the electrode layer (51) for connecting the electrode layer (51); A solder paste layer (53) connecting the conductive layer (3) and the electrode layer (51); and An insulating layer (54) covers the wiring (52). According to the CSP light emitting diode packaging device described in item 1 or 2 of the patent application scope, the light emitting diode die (1) is a blue die. According to the CSP light emitting diode packaging device described in item 2 of the patent application scope, the first phosphor layer (21) is a red phosphor layer. According to the CSP light emitting diode packaging device described in item 3 of the patent application scope, the second phosphor layer (41) is a green phosphor layer. According to the CSP light emitting diode packaging device as described in item 1 or 2 of the patent application scope, the light emitting diode die (1) is a near ultraviolet light die. According to the CSP light emitting diode packaging device described in item 6 of the patent application scope, the first phosphor layer (21) is a red phosphor layer. According to the CSP light emitting diode packaging device described in item 7 of the patent application range, the second phosphor layer (41) is a mixed green phosphor layer and a blue phosphor layer. The CSP light emitting diode packaging device as described in item 1 or 2 of the patent application scope further includes a solid hemispherical dome (6), which is fixed on the substrate (5) and surrounds the light emitting diode crystal The particles (1), the first phosphorescent medium layer (2) and the second phosphorescent medium layer (4), and the solid hemispherical dome (6) are composed of a light-transmitting material. The CSP light emitting diode packaging device as described in item 9 of the patent application scope further includes a light reflecting layer (7), the light reflecting layer (7) is disposed between the light emitting diode die (1) and the substrate (5 )between.

Images