TWM571782U - Alignment wafer grinding structure - Google Patents

Abstract

A align wafer polishing structure comprising a retaining ring and a grinding ring. The fixing ring has a plurality of fixing holes on one side, and at least two joint portions on the other side of the fixing ring; the grinding ring is combined with the fixing ring and is different from the fixing ring, and the grinding ring is arranged on one side There are a plurality of drainage grooves, and the other side of the ring is provided with at least two sets of joints that abut each joint. Thereby, the fixing ring and the grinding ring can be combined with each other by the joint portion and the joint portion, thereby achieving the effects of stable assembly, tight bonding and increased structural strength.

Description

Alignment wafer grinding structure

This creation is about a para-wafer grinding structure, especially one that can be used as a wafer grinding user.

Generally, when the semiconductor wafer is polished, the semiconductor wafer is positioned by using a fixed template, and then the wafer is abutted on a retainer having a polishing cloth, and then the driving mechanism drives the template to rotate and grind, and In order to enable the wafer to be effectively positioned to improve the quality of the wafer, it is usually necessary to make the rotation axis of the fixed template correspond to the center of the wafer, and the center of the wafer must be accurately positioned during the rotation, but When the wafer polishing is performed in the above-mentioned manner, the center of the wafer cannot be stably fixed. Therefore, some related companies have developed a positioning ring structure, which is made up of a combination of two different materials, metal and non-metal. When used, the metal ring can be used. The positioning of the driving mechanism is combined, and the inner diameter of the non-metallic annular body can match the outer diameter of the wafer to be polished, so that the center of the wafer can be accurately positioned during wafer grinding, thereby improving the above-mentioned conventional use. Missing. However, since the metal ring body and the non-metal ring body of the positioning ring are combined by adhesion or screwing, it is often used for a long period of time, due to long-term pressurization, rotation, and work. The influence of the liquid causes a gap or looseness between the metal ring body and the non-metal ring body, resulting in deterioration of structural strength and stability, and even more, the metal ring body is separated from the non-metal ring body. In this case, the conventional wafer grinding positioning ring is less suitable for practical use.

The main purpose of the present invention is to enable the fixing ring and the grinding ring to be combined with each other by using the joint portion and the joint portion, thereby achieving the effects of stable assembly, tight bonding, and increased structural strength. For the above purposes, the present invention relates to a align wafer polishing structure comprising: a fixing ring and a grinding ring. The fixing ring has a plurality of fixing holes on one side, and at least two joint portions on the other side of the fixing ring; the grinding ring is combined with the fixing ring and is different from the fixing ring, and the grinding ring is arranged on one side There are a plurality of drainage grooves, and the other side of the ring is provided with at least two sets of joints that abut each joint. In the above-mentioned alignment wafer polishing structure, the fixing ring is made of a metal material having better rigidity. In the above-mentioned alignment wafer polishing structure, each bonding portion is a groove, a rib, or a combination thereof. In the above-mentioned alignment wafer polishing structure, a protruding portion is disposed between each of the bonding portions, the top surface of the protruding portion has a rough surface, and the other surface of the polishing ring is abutted against the rough surface. . In the above-mentioned alignment wafer polishing structure, the grinding ring is a non-metallic material with high wear resistance and chemical resistance. In the above-mentioned alignment wafer polishing structure, each of the joint portions is a rib, a groove or a combination thereof. In the above-mentioned alignment wafer polishing structure, a recess portion abutting the protruding portion is disposed between each of the connecting portions, and the bottom surface of the concave portion is further provided with a rough surface provided with the protruding portion. Another rough surface. In the above-mentioned alignment wafer polishing structure, each drainage channel is inclined, and the inclination angle of each drainage groove is 35 ^. ~45 ^. Between and 40 ^. For the best.

Please refer to the "Figures 1, 2, 3 and 4" for the appearance of the creation, the exploded view of the creation, the schematic diagram of the profile of the creation, and a partial enlarged view of the part of the third part of the creation. . As shown in the figure: This creation is a aligning wafer polishing structure comprising at least one fixing ring 1 and a grinding ring 2. A plurality of fixing holes 11 are formed on one surface of the fixing ring 1 , and at least two joint portions 12 are provided on the other side of the fixing ring 1 . The grinding ring 2 is combined with the fixing ring 1 and is different from the fixing ring 1 , and a plurality of drainage grooves 21 are formed on one surface of the grinding ring 2, and the other side of the grinding ring 2 is provided with a ring Each of the joint portions 12 abuts at least two of the joint portions 22. When the fixing ring 1 is combined with the grinding ring 2, the joint portion 12 of the fixing ring 1 and the joint portion 22 of the grinding ring 2 can be abutted to each other, so that the fixing ring 1 and the grinding ring 2 can be stably assembled. , tightly combined and increased structural strength. When the present invention is used, the fixing ring 1 can be combined with the fixing mechanism of the fixing member 11 on one side thereof with the required driving mechanism (not shown), and the inner diameter of the grinding ring 2 can be The outer diameter of the wafer to be polished is matched so that the grinding ring 2 is sleeved on the outer edge of the wafer for positioning (not shown), and the fixing ring 1 and the grinding ring 2 are simultaneously driven by the rotation of the driving mechanism. The polishing and the working liquid and the waste particles during the grinding are led out from the respective drain grooves 21 on one side of the grinding ring 2. In one embodiment of the present invention, the fixing ring 1 is made of a metal material having a relatively high rigidity. Thereby, the fixing ring 1 can have a better supporting force to prevent the grinding ring 2 from being deformed. In one embodiment of the present invention, the grinding ring 2 is a non-metallic material that is highly wear resistant and chemically resistant. Thereby, it is possible to avoid scratching the wafer during grinding and to extend the service life of the grinding ring 2. In one embodiment of the present invention, each of the joint portions 12 is a groove, a rib, or a combination thereof, and each of the joint portions 22 is a rib, a groove, or a combination thereof. Thereby, each joint portion 12 and each joint portion 22 can meet the requirements of actual assembly. In the present invention, each of the joint portions 12 is a groove, and each of the joint portions 22 is a rib, respectively, and when the fixing ring 1 is combined with the grinding ring 2, the joint portions 22 of the rib are docked. In each of the joint portions 12 of the groove, the fixing ring 1 and the grinding ring 2 are brought into a stable assembly, a tight bond, and an increase in structural strength. In an embodiment of the present invention, a protruding portion 13 is disposed between each of the joint portions 12, and a top surface of the protruding portion 13 has a rough surface 14; and each of the connecting portions 22 is provided with a The protrusion 13 abuts the recess 23, and the bottom surface of the recess 23 is further provided with another rough surface 24. When the joint portion 12 of the fixing ring 1 and the joint portion 22 of the grinding ring 2 abut each other, the protruding portion 13 is simultaneously engaged in the recess portion 23, and the top surface of the protruding portion 13 is made. The rough surface 14 and the other rough surface 24 of the bottom surface of the recess portion 23 abut against each other to make the biting more stable, so that the fixing ring 1 and the grinding ring 2 can achieve stable assembly, tight bonding and increase structural strength. In one embodiment of the present invention, each of the drain grooves 21 is inclined, and the angle of inclination of each of the drain grooves 21 is 35 ^. ~45 ^. Between and 40 ^. For the best. Thereby, it is possible to achieve the effect of easily discharging the working liquid and the waste particles by using the respective drain grooves 21 provided obliquely at the time of wafer polishing. In summary, the created wafer polishing structure can effectively improve various disadvantages of the conventional use, and the fixing ring and the grinding ring can be combined with each other by the joint portion and the joint portion to achieve stable assembly, tight bonding and increase structural strength. The effect; in order to make the creation of this creation more progressive, more practical, more in line with the needs of consumers, has indeed met the requirements of the creation of patent applications, and filed a patent application according to law. However, the above descriptions are only preferred embodiments of the present invention, and the scope of the present invention cannot be limited by this; therefore, the simple equivalent changes and modifications made by the scope of the patent application and the contents of the new manual are All should remain within the scope of this creation patent.

1‧‧‧Fixed ring

11‧‧‧Fixed holes

12‧‧‧Combination Department

13‧‧‧Protruding

14‧‧‧Rough surface

2‧‧‧ grinding ring

21‧‧‧Drainage trough

22‧‧‧Team

23‧‧‧Depression

24‧‧‧Rough surface

Figure 1 is a schematic diagram of the appearance of this creation. Figure 2 is an exploded view of the creation. Figure 3 is a schematic diagram of the profile state of the creation. Fig. 4 is a partially enlarged schematic view showing a portion of the third drawing of Fig. 3 of the present invention.

Claims (8)

A aligning wafer polishing structure includes: a fixing ring having a plurality of fixing holes on one side, at least two joint portions on the other side of the ring; and a grinding ring coupled with the fixing ring, and The fixing ring is made of different materials, and the grinding ring has a plurality of drainage grooves on one side thereof, and the other side of the grinding ring is provided with at least two connection portions that abut the respective joint portions. The alignment wafer polishing structure according to the first aspect of the patent application, wherein the fixing ring is made of a metal material having a better rigidity. The alignment wafer polishing structure according to claim 1, wherein each of the bonding portions is a groove, a rib, or a combination thereof. The alignment wafer polishing structure according to claim 1, wherein each of the joint portions is provided with a protruding portion, the top surface of the protruding portion has a rough surface, and the grinding ring is another One side is against the rough surface. The alignment wafer polishing structure according to the first aspect of the patent application, wherein the grinding ring is a non-metallic material with high wear resistance and chemical resistance. The alignment wafer polishing structure according to claim 1, wherein each of the sets of the joints is a rib, a groove or a combination thereof. The aligning wafer polishing structure according to the fourth aspect of the patent application, wherein each of the connecting portions is provided with a concave portion abutting the protruding portion, and the bottom surface of the concave portion is further provided with a convex portion. The rough surface of the exit is placed against another rough surface. The alignment wafer polishing structure according to the first aspect of the patent application, wherein each drainage channel is inclined, and the inclination angle of each drainage groove is 35 ^. ~45 ^. Between and 40 ^. For the best.