散熱裝置Heat sink
一種散熱裝置，尤指一種透過以雷射加工於鈦材質上成型毛細結構的散熱裝置。A heat dissipating device, especially a heat dissipating device for forming a capillary structure by laser processing on a titanium material.
均溫板係為一種常見且常被應用於散熱領域使用的散熱裝置，並常被使用來製成均溫板的材料有銅、鋁、不銹鋼等材質，該等材料於製造時容易產生電位差而發生電位差腐蝕等現象：此外若傳統以銅、鋁、不銹鋼等材質製成之均溫應用於大型工業設備上則均溫板為求足夠強度其體積龐大且重量極重龐；若應用於智慧手機或平板或該等手持裝置上，又因為需要極薄化造成均溫板之厚度過薄產生強度不足之問題，故近年來亦有業者將鈦材質進階應用於散熱領域之散熱裝置製造所使用。 鈦係為一種具有質量輕、結構強度強、耐腐蝕等特性之金屬材料，現行鈦已被廣泛應用於各領域當中，雖然鈦具有許多優點，又因其結構強度強，故使得加工並不容易。 對鈦材質無法使用一般傳統加工，需使用特殊加工或非傳統加工等工法進行，使得鈦並無法適用於各個地方使用，已有業者透過放電加工或濕式蝕刻加工對鈦進行除料加工，但放電加工之加工速度相當緩慢且不適合需要大量生產或需要大量除料之處，而濕式蝕刻所加工所形成之溝槽深度並不易控制且加工中使用之溶劑及氣體具有毒性容易造成環境污染相當不環保，並鈦在高溫環境下所生成之氧化物同時要再透過高溫還原則甚為困難。 故如何選用鈦作為均溫板之材質使用，以及如何解決鈦材質不易加工之缺失則為首重之目標者。The uniform temperature plate is a common heat sink used in the field of heat dissipation, and is often used to make the temperature plate. The materials are made of copper, aluminum, stainless steel, etc. These materials are prone to potential difference during manufacturing. Potential difference corrosion occurs: In addition, if the average temperature made of copper, aluminum, stainless steel, etc. is applied to large industrial equipment, the uniform temperature plate is sufficient for its strength and its weight is extremely heavy; if it is applied to smart phones In the case of flat panels or such handheld devices, the thickness of the temperature equalizing plate is too thin to cause insufficient strength because of the need for extremely thinning. Therefore, in recent years, there has also been a use of titanium materials for advanced heat sink manufacturing. . Titanium is a kind of metal material with light weight, strong structural strength and corrosion resistance. Currently, titanium has been widely used in various fields. Although titanium has many advantages, it is not easy to process due to its strong structural strength. . Titanium cannot be used for general processing, and special processing or non-traditional processing is required. Titanium is not suitable for use in various places. In the prior art, titanium is removed by electric discharge machining or wet etching, but The processing speed of electric discharge machining is quite slow and is not suitable for places where mass production or large amount of material removal is required, and the groove depth formed by wet etching is not easy to control and the solvent and gas used in processing are toxic and easily cause environmental pollution. It is not environmentally friendly, and it is difficult to pass the oxide generated by titanium in a high temperature environment at the same time. Therefore, how to use titanium as the material of the temperature equalizing plate, and how to solve the problem that the titanium material is difficult to process is the first priority.
爰此，為解決上述習知技術之缺點，本創作之主要目的，係提供一種選用鈦材質作為散熱裝置材質並透過雷射加工於該鈦材質上形成毛細結構的散熱裝置。 為達上述之目的，本創作係提供一種散熱裝置，係包含：一本體、一管體； 所述本體具有一腔室，並所述腔室表面內具有一由雷射加工製成之毛細結構及一工作液體，所述本體一側為冷凝側另一側為吸熱側，所述毛細結構與該吸熱側對應設置，所述本體之吸熱側材質為鈦材質，該冷凝側之材質係為鈦材質或金屬材質其中任一；所述管體對應與該本體插接。 透過本創作之散熱裝置係透過以鈦取代習知均溫板以銅或鋁材質使用壽命不佳等問題，並且提出改善習知無法對鈦材質進行加工之缺失者。Therefore, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a heat dissipating device which uses a titanium material as a material of a heat dissipating device and forms a capillary structure on the titanium material by laser processing. For the purpose of the above, the present invention provides a heat dissipating device comprising: a body and a tube body; the body has a chamber, and the surface of the chamber has a capillary structure made by laser processing. And a working liquid, the other side of the body is a condensation side and the other side is a heat absorption side, the capillary structure is corresponding to the heat absorption side, the heat absorption side of the body is made of titanium, and the material of the condensation side is titanium. Any one of a material or a metal material; the pipe body is correspondingly inserted into the body. The heat sink of this creation is based on the problem of poor service life of copper or aluminum by replacing the conventional temperature equalizing plate with titanium, and proposes to improve the lack of processing of titanium materials.
請參閱第1、2圖，係為本創作散熱裝置之第一實施例立體分解及組合剖視圖，如圖所示，本創作散熱裝置1，係包含：一本體11、一管體12； 所述本體11具有一腔室111，並所述腔室111表面內具有一由雷射加工製成之毛細結構112及一工作液體2，所述本體11一側為冷凝側113另一側為吸熱側114，所述毛細結構112與該吸熱側114對應設置，所述本體11之吸熱側114材質為鈦材質，所述鈦材質係為商業純鈦或鈦合金其中任一，該冷凝側113之材質係為鈦材質或金屬材質或陶瓷其中任一，所述金屬材質係為金、銀或銅或鋁或不銹鋼其中任一，所述管體12對應與該本體11插接，並所述管體12與該本體11內部之腔室111連通。 所述本體11具有一上板11a及一下板11b，所述冷凝側113位於該上板11a之一側，所述吸熱側114位於該下板11b之一側，所述上、下板11a、11b對應蓋合並與該管體12共同界定前述腔室111，所述毛細結構112設置於該下板11b之吸熱側114的另一側，所述毛細結構112係為微溝槽或由複數凸體或凹體間隔排列所組成之結構其中任一並不引以為限，本實施例係以微溝槽作為說明實施例，所述管體12設於該上、下板11a、11b之間，並上、下板11a、11b疊合後進行封邊，同時該管體12亦與該上、下板11a、11b結合並且令本體11保持氣密性。 本創作散熱裝置主要透過雷射加工作為主要製造毛細結構之加工方式，因本案係透過利用鈦材質作為取代其他材質作為均溫板之材料，故透過雷射加工之方式可解決鈦材質不易加工以及高溫時產生氧化物不易還原等問題。 所述散熱裝置並不侷限於均溫板亦可為平板式熱管或其他選用鈦材質作為基座材料需進行設置毛細結構之加工者。 選用鈦材質則可解決習知均溫板使用其他材質易受腐蝕及結構強度不佳與質量較重等缺失者。1 and 2 are a perspective exploded view and a combined cross-sectional view of a first embodiment of the present invention. As shown in the figure, the heat sink 1 includes a body 11 and a tube 12; The body 11 has a chamber 111, and the surface of the chamber 111 has a capillary structure 112 and a working liquid 2 which are processed by laser processing. The body 11 has a condensation side 113 on one side and a heat absorption side on the other side. 114, the capillary structure 112 is disposed corresponding to the heat absorbing side 114, the heat absorbing side 114 of the body 11 is made of titanium material, and the titanium material is any one of commercial pure titanium or titanium alloy, and the material of the condensation side 113 Any one of a titanium material or a metal material or a ceramic material, the metal material is any one of gold, silver or copper or aluminum or stainless steel, and the tube body 12 is correspondingly inserted into the body 11 and the tube body 12 is in communication with the chamber 111 inside the body 11. The body 11 has an upper plate 11a and a lower plate 11b. The condensation side 113 is located on one side of the upper plate 11a, and the heat absorption side 114 is located on one side of the lower plate 11b. The upper and lower plates 11a, 11b corresponds to the cover and cooperates with the tube body 12 to define the chamber 111. The capillary structure 112 is disposed on the other side of the heat absorption side 114 of the lower plate 11b, and the capillary structure 112 is a micro groove or a plurality of convex The structure of the body or the concave arrangement is not limited, and the embodiment adopts a micro-groove as an illustrative embodiment, and the tube 12 is disposed between the upper and lower plates 11a and 11b. The upper and lower plates 11a and 11b are overlapped and then sealed, and the tubular body 12 is also combined with the upper and lower plates 11a and 11b and the body 11 is kept airtight. The heat sink of the present invention mainly uses laser processing as the main processing method for manufacturing the capillary structure. Since the titanium material is used as the material for the temperature equalizing plate instead of other materials, the processing of the titanium material can be solved by the laser processing method. When the temperature is high, the oxide is not easily reduced. The heat dissipating device is not limited to the temperature equalizing plate, and may be a flat heat pipe or other processor that uses a titanium material as a base material to set a capillary structure. The use of titanium material can solve the problem of the use of other materials that are susceptible to corrosion, structural strength and heavy quality.
1‧‧‧散熱裝置
11‧‧‧本體
11a‧‧‧上板
11b‧‧‧下板
111‧‧‧腔室
112‧‧‧毛細結構
113‧‧‧冷凝側
114‧‧‧吸熱側
2‧‧‧工作液體1‧‧‧heating device
11‧‧‧Ontology
11a‧‧‧Upper board
11b‧‧‧ Lower board
111‧‧‧ chamber
112‧‧‧Capillary structure
113‧‧‧ Condensation side
114‧‧‧heat side
2‧‧‧Working liquid
第1圖係為本創作散熱裝置之第一實施例立體分解圖； 第2圖係為本創作散熱裝置之第一實施例組合剖視圖。1 is a perspective exploded view of a first embodiment of the heat sink device of the present invention; and FIG. 2 is a cross-sectional view of the first embodiment of the heat sink device.