TWM553329U - Roll-to-roll non-contact colloidal metal chemical plating equipment - Google Patents

Description

Roll-to-roll non-contact colloidal metal electroless plating equipment

The present invention relates to a roll-to-roll non-contact colloidal metal electroless plating apparatus, and more particularly to a roll-to-roll non-contact colloidal metal electroless plating apparatus applied to a colloidal metal electroless plating process on a flexible circuit board.

As electronic products become thinner and lighter, the line width and line spacing of line patterns made on flexible circuit boards must also shrink. Therefore, current circuit board manufacturers are actively investing in the development and application of high-order boards such as fine lines and micro-pitch.

At present, when a circuit is formed on a flexible circuit board, a compound containing a plurality of metal trigger particles is first coated on a polyimine (PI) substrate by printing, thereby forming a polyimine (PI) substrate. A trigger layer is formed on the upper layer. Then, after the trigger layer is cured by irradiating ultraviolet light, the trigger layer is thickened by a plating process to form a metal wiring layer.

Referring to Figure 1, a schematic diagram of a conventional electroless plating apparatus is shown. In the conventional electroless plating apparatus 1, when the flexible circuit board F having a thin line is continuously transferred in the plating tank 10 filled with the syrup L, the transport roller 11 is directly in contact with the flexible circuit board F. Since the line on the flexible circuit board F is thin, when the transmission roller 11 contacts the flexible circuit board F, it is easy to cause the fine circuit to have indentation, defects or disconnection, thereby affecting the quality of the line, resulting in a decrease in the yield of the product.

The technical problem to be solved by the present invention is to provide a roll-to-roll non-contact colloidal metal electroless plating apparatus for the defects of the prior art, which can avoid the mechanism and softness of transmission in the colloidal metal electroless plating process of the flexible circuit board. The board is in direct contact.

One of the technical solutions adopted by the present invention is to provide a roll-to-roll non-contact colloidal metal electroless plating apparatus for continuously transferring a flexible circuit board for colloidal metal electroless plating. The roll-to-roll non-contact colloidal metal electroless plating apparatus includes a reaction tank for holding the plating solution and a transport assembly disposed in the reaction tank. The transmission component is configured to transport the flexible circuit board in the reaction tank, and the transmission component comprises a plurality of jet flow guiding mechanisms disposed along a transmission path and separated from each other, each of the jet flow guiding mechanisms having at least one for facing the flexible circuit The plate ejects a fluid orifice. When the flexible circuit board is transported by the plurality of jet guiding mechanisms, at least one of the nozzles of each of the jet guiding mechanisms sprays a fluid toward the flexible circuit board to maintain the flexible circuit board and the plurality of jet guiding mechanisms not in contact.

The beneficial effect of the present invention is that by providing a plurality of jet-type guiding mechanisms in the reaction tank to eject a fluid to the flexible circuit board, the flexible circuit board and the jet-flow guiding mechanism can be made between each other during the colloidal metal electroless plating process. The flexible boards are transmitted in a floating manner without touching each other. Since the flexible circuit board is not in contact with the transmission component during transmission, it can avoid embossing or disconnection of fine lines on the flexible circuit board, thereby improving product yield.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings. However, the drawings are provided for reference and description only, and are not intended to limit the present invention.

1‧‧‧Knowledge electroless plating equipment

10‧‧‧chemical plating tank

11‧‧‧Transfer wheel

F, F’‧‧‧soft circuit board

L‧‧‧ Potion

2‧‧‧Colloidal metal electroless plating equipment

20‧‧‧Reel-type feeding module

201‧‧‧ Feeding wheel

202‧‧‧ drive shaft

21‧‧‧Reaction tank

22‧‧‧Transport components

220‧‧‧Spray guiding mechanism

221‧‧‧ tube body

222‧‧‧ orifice

223‧‧‧Connected shaft

23‧‧‧Fluid Circulation Unit

24‧‧‧Reel-type receiving module

241‧‧‧ receiving wheel

242‧‧‧Control axis

25‧‧‧Supply piping

S1‧‧‧feeding side

S2‧‧‧ discharge side

L1‧‧‧ plating solution

Figure 1 is a partial schematic view of a prior art electroless plating apparatus.

2 is a partial schematic view of a roll-to-roll non-contact colloidal metal electroless plating apparatus according to an embodiment of the present invention.

Fig. 3 is a partial enlarged view of a region III of Fig. 2;

Fig. 4 is a partial schematic view showing a jet flow guiding mechanism of an embodiment of the present invention.

The following is a description of an embodiment of the "roll-to-roll non-contact colloidal metal electroless plating apparatus" disclosed in the present application by a specific embodiment. The present embodiment The roll-to-roll non-contact colloidal metal electroless plating apparatus provided can be used to continuously transfer a flexible circuit board for a colloidal metal electroless plating process. Further, the roll-to-roll non-contact colloidal metal electroless plating apparatus of the presently-created embodiment can be used to fabricate a flexible circuit board having fine wiring.

Please refer to Figure 2. 2 is a partial schematic view of a roll-to-roll non-contact colloidal metal electroless plating apparatus according to an embodiment of the present invention. The roll-to-roll non-contact colloidal metal electroless plating apparatus 2 includes a tape take-up module 20, a reaction tank 21, a transfer unit 22, a fluid circulation unit 23, and a tape take-up module 24. The tape feeding module 20, the reaction tank 21 and the tape take-up module 24 are separated from each other and disposed on the same production processing line, wherein the tape feeding module 20 and the tape take-up module 24 are respectively It is located at a feed side S1 and a discharge side S2 of the reaction tank 21.

Specifically, the tape feed module 20 is configured to transfer the flexible circuit board F into the reaction tank 21. The tape take-up module 20 can include a feed wheel 201 and a drive shaft 202 coupled to the axis of the feed wheel 201. The flexible circuit board F to be processed is wound around the feed wheel 201. The drive shaft 202 drives the feed wheel 201 to rotate, and the flexible circuit board F wound around the feed wheel 201 is continuously transferred into the reaction tank 21 for the plating process.

The flexible circuit board F may be a full-length uncut flexible circuit board, or may be a roll of a plurality of cut flexible circuit boards that are sequentially joined before and after being wound on the feed wheel 201. In an embodiment, the tape feed module 20 may further include a tension adjusting wheel (not shown) to adjust the tension of the flexible circuit board F.

It should be noted that in the embodiment, a trigger compound has been formed in advance on the flexible circuit board F to be processed. In one embodiment, the triggering compound is a rubber material containing metal particles, and the triggering compound has a pre-formed wiring pattern. Further, the step of forming the triggering compound may include first coating the metal particle-containing glue on a flexible substrate according to the pre-formed circuit pattern; then, the triggering compound is cured to form a to-be-processed Soft board F.

The reaction tank 21 is for holding a plating solution L1. The aforementioned softness with triggering compound After the circuit board F enters the reaction tank 21, the triggering compound on the flexible circuit board F reacts with the plating solution L1 in the reaction tank 21 to form a metal wiring pattern layer. In one embodiment, the plurality of lines in the predetermined formed metal line pattern layer have a line width of only about 20 to 30 μm, and the line spacing between two adjacent lines may be only 60 μm.

The flexible circuit board F enters the reaction tank 21 from the feed side S1 of the reaction tank 21, and is immersed in the plating solution L1 to form a metal wiring pattern layer on the flexible circuit board F. Subsequently, the flexible circuit board F' which completes the colloidal metal electroless plating process leaves the reaction vessel 21 from the discharge side S2.

Further, the roll-to-roll non-contact colloidal metal electroless plating apparatus 2 of the present embodiment further includes a supply line 25 fluidly connected to the reaction tank 21. The plating solution L1 can be transported and replenished into the reaction tank 21 through the supply line 25. When the colloidal metal electroless plating process is performed, since the plating solution L1 is continuously consumed and reacted with the triggering compound on the flexible circuit board F, the plating solution L1 in the reaction tank 21 can be continuously replenished through the supply line 25. In order to maintain the concentration of metal ions in the plating bath L1 in the reaction tank.

As shown in FIG. 2, in the present embodiment, the transport unit 22 is disposed in the reaction tank 21 for transporting the flexible circuit board F in the reaction tank 21. It should be noted that the transmission component 22 in the present embodiment is hardly in contact with the flexible circuit board F during the transmission of the flexible circuit board F. Therefore, the tension of the flexible circuit board F located in the reaction tank 21 is low.

In particular, the transport assembly 22 of the presently-created embodiment includes a plurality of jet-type guide mechanisms 220 disposed along a transport path and separated from one another. That is, a plurality of jet flow guiding mechanisms 220 are respectively disposed on the transport path to react the flexible circuit board F and the plating solution L1 in the reaction tank 21 while advancing along the transport path.

When the flexible circuit board F enters the reaction bath 21 for the colloidal metal electroless plating process, the flexible circuit board F is completely immersed in the plating solution L1. In addition, since the flexible circuit board F is advanced along the transport path while reacting with the plating solution L1, and the flexible circuit board F leaves the reaction bath 21, the metal wiring pattern layer must be thickened to a predetermined thickness, so that the transmission is performed. The path affects the time during which the flexible board F and the plating solution L1 react.

In the present embodiment, the transmission path is a transmission path, that is, includes a plurality of straight segments connected to each other and a plurality of curved segments to increase the flexible circuit board F under the condition that the size of the reaction tank 21 is reduced as much as possible. The time of immersion in the plating solution L1. In addition, at least two jet flow guiding mechanisms 220 are respectively located on opposite sides of the meandering transport path. That is, the flexible circuit board F will bypass between the jet flow guiding mechanisms 220.

It should be noted that, in other embodiments, if the preformed circuit layer on the plating solution L1 and the flexible circuit board F reacts faster, the transmission path can also be changed to reduce the contact between the flexible circuit board F and the plating solution L1. time. Therefore, the transfer path can be adjusted according to the formulation of the plating solution L1 and the predetermined thickness of the metal wiring pattern layer, and the creation is not limited. In addition, the number of the flow guiding mechanisms 220 and the laying position can be determined according to actual needs, and is not limited to the embodiment shown in FIG. 2.

Please refer to FIG. 2 to FIG. 4 together, wherein FIG. 3 is a partial enlarged view of the area III of FIG. 2. Fig. 4 is a partial schematic view showing a jet flow guiding mechanism of an embodiment of the present invention. Each of the jet flow guiding mechanisms 220 has at least one orifice 222 for injecting a fluid toward the flexible circuit board F.

As shown in FIG. 3, when the flexible circuit board F is transported by the plurality of jet guiding mechanisms 220, at least one of the nozzle holes 222 of each of the jet guiding mechanisms 220 sprays a fluid toward the flexible circuit board F to make the softness The circuit board F and the plurality of jet flow guiding mechanisms 220 remain untouched. As shown in FIG. 3 and FIG. 4 , each of the spray guiding mechanisms 220 has a tubular body 221 and a plurality of spray holes 222 , and a plurality of spray holes 222 are circumferentially located on the tubular body 221 .

In another embodiment, the plurality of nozzle holes 222 may also be distributed only on the partial side surface of the tube body 221 facing the flexible circuit board F. As long as the nozzle holes 222 are disposed in such a manner that the fluid ejected by the jet flow guiding mechanism 220 pushes away the flexible circuit board F, the position and shape of the nozzle holes 222 are not limited in the present creation. In the present embodiment, the injection holes 222 are a plurality of small holes. In other embodiments, the orifice 222 may also be a wave-shaped opening, a strip-shaped opening extending along the long axis of the tubular body 221, or surrounding the tubular body 221 Threaded opening in the side wall surface.

Referring to FIG. 4 , in one embodiment, each of the spray guiding mechanisms 220 further includes a connecting shaft 223 , and the tubular body 221 is disposed in the reaction tank 21 through the connecting shaft 223 . In an embodiment, the connecting shaft 223 may be a fixed shaft. Therefore, when the flexible circuit board F is bypassed between the jet flow guiding mechanisms 220, the jet flow guiding mechanism 220 does not rotate.

In another embodiment, the connecting shaft 223 of the jet guiding mechanism 220 may be a linking shaft, and the tubular body 221 is pivotally fixed in the reaction tank 21 through the interlocking shaft. In other words, in this case, when the flexible circuit board F is bypassed between the jet flow guiding mechanisms 220, the jet flow guiding mechanism 220 may rotate due to the ejection of fluid or due to fluid disturbance, but the jet flow type The guiding mechanism 220 itself is not provided with a drive element.

In the present embodiment, the fluid ejected by the jet guide mechanism 220 may be a liquid or a gas. In a preferred embodiment, the fluid ejected by the jet flow guiding mechanism 220 is the plating solution L1. Specifically, referring to FIG. 2 , the fluid circulation unit 23 fluidly communicates the reaction tank 21 and the plurality of jet flow guiding mechanisms 220 such that the plating solution L1 in the reaction tank 21 is separately transported to the plurality of fluid circulating units 23 through the fluid circulation unit 23 The jet guide mechanism 220.

In one embodiment, the fluid circulation unit 23 is a pneumatic pump for extracting the plating solution L1 in the reaction tank 21, and then pressurizing the extracted plating solution L1 into the tube of the jet flow guiding mechanism 220. Within 221. Thus, the speed at which the triggering rubber and the plating solution L1 react on the flexible circuit board F can be accelerated, so that the metal wiring pattern layer deposited on the flexible circuit board F can have a specific thickness in a short time.

In one embodiment, in the colloidal metal electroless plating process, the plating solution L1 is extracted by the fluid circulation unit 23, and then ejected by the jet guiding mechanism 220 to form a metal wiring pattern layer, and the plating rate is at least 1.5 μm per hour. . When the roll-to-roll non-contact colloidal metal electroless plating apparatus 2 of the present embodiment is used for copper plating on the flexible circuit board F, the average plating rate can reach 4.5 μm per hour.

The fluid ejected by the jet guiding mechanism 220 can assist in pushing the flexible circuit board F moves along the transmission path. Compared with the existing electroless plating apparatus 1, since the flexible circuit board F is not in contact with the plurality of jet guiding mechanisms 220 during the transmission in the reaction tank 21, the metal pattern circuit layer on the flexible circuit board F can be avoided. A problem that causes compression, defects, or breakage.

Further, in the conventional electroless plating apparatus 1, the place where the flexible circuit board F and the roller 10 are in contact with each other cannot be sufficiently contacted with the plating solution L1, and the plating rate is also lowered. In contrast, in the roll-to-roll non-contact colloidal metal electroless plating apparatus 2 of the present embodiment, since the flexible circuit board F and the plurality of jet flow guiding mechanisms 220 are kept out of contact, the flexible circuit board F can be sufficiently Contact plating solution L1. In addition, the fluid ejected by the jet flow guiding mechanism 220 can also accelerate the reaction rate between the plating solution L1 and the trigger rubber, thereby increasing the plating rate.

Referring to FIG. 2, the tape take-up module 24 is disposed on the discharge side S2 of the reaction tank 21 to wind up the flexible circuit board F through the plating process. Further, the tape take-up module 24 includes a receiving wheel 241 and a control shaft 242 that controls the rotational speed of the receiving wheel 241. The flexible circuit board F' having the metal wiring pattern layer is wound up on the receiving wheel 241 after leaving the reaction bath 21.

In the present embodiment, since the transfer unit 22 and the flexible circuit board F in the reaction tank 21 have almost no contact, there is no friction. Therefore, by the feeding of the tape feeding module 20 and the receiving of the tape take-up module 24, the flexible circuit board F located in the reaction tank 21 can be strained, and the flexible circuit board F can be transported along the transmission. The path goes forward.

It should be noted that the tension generated by the flexible circuit board F by the feeding of the tape feeding module 20 and the receiving of the tape take-up module 24 only allows the flexible circuit board F to continuously enter and leave the reaction tank. 21, the influence on the metal wiring pattern layer formed on the flexible circuit board F is small. Moreover, when the flexible circuit board F' leaves the reaction bath 21 from the discharge side S2, the metal wiring pattern layer already has a certain thickness, so even if it is wound up on the receiving wheel 241, the metal wiring pattern layer is not caused. defect.

Through the above settings, the roll-to-roll non-contact colloidal metal electroless plating apparatus 2 can be connected The colloidal metal electroless plating process is continuously performed on the flexible circuit board F, which can increase the production efficiency and shorten the man-hour.

The present invention has an advantageous effect in that the roll-to-roll non-contact colloidal metal electroless plating apparatus 2 of the present embodiment sprays a fluid onto the flexible circuit board F by providing a plurality of jet flow guiding mechanisms 220 in the reaction tank 21. Thus, in the colloidal metal electroless plating process, the flexible circuit board F and the jet flow guiding mechanism 220 are not in contact with each other, and the flexible circuit board F is suspended in the reaction tank 21 in a floating manner. Since the flexible circuit board F is not in contact with the transmission unit 22 during transmission, embossing or disconnection of the thin lines on the flexible circuit board F' can be prevented, thereby improving the product yield.

In particular, when a metal pattern wiring layer having a thin line width and a narrow line pitch is formed on the flexible circuit board F, the colloidal metal electroless plating process is performed by the roll-to-roll non-contact colloidal metal electroless plating apparatus 2 of the present embodiment. Significant efficacy in increasing product yield. In addition, the fluid ejected by the jet guiding mechanism 220 can also accelerate the reaction rate between the plating solution L1 and the trigger compound, thereby increasing the plating rate.

The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the drawings are included in the application for this creation. Within the scope of the patent.

2‧‧‧Colloidal metal electroless plating equipment

20‧‧‧Reel-type feeding module

201‧‧‧ Feeding wheel

202‧‧‧ drive shaft

21‧‧‧Reaction tank

22‧‧‧Transport components

220‧‧‧Spray guiding mechanism

221‧‧‧ tube body

222‧‧‧ orifice

223‧‧‧Connected shaft

23‧‧‧Fluid Circulation Unit

24‧‧‧Reel-type receiving module

241‧‧‧ receiving wheel

242‧‧‧Control axis

25‧‧‧Supply piping

S1‧‧‧feeding side

S2‧‧‧ discharge side

L1‧‧‧ plating solution

F, F’‧‧‧soft circuit board

Claims (9)

A roll-to-roll non-contact colloidal metal electroless plating apparatus for continuously transmitting a flexible circuit board for a colloidal metal electroless plating process, the roll-to-roll non-contact colloidal metal electroless plating apparatus comprising: a reaction tank, And a transfer assembly disposed in the reaction tank for transporting the flexible circuit board in the reaction tank, wherein the transport assembly includes a plurality of a jet guiding mechanism disposed at a distance from each other and separated from each other, each of the jet guiding mechanisms having at least one orifice for injecting a fluid toward the flexible circuit board; wherein, when the flexible circuit board passes When a plurality of the jet guiding mechanisms are transmitted, at least one of the nozzle holes of each of the jet guiding mechanisms sprays a fluid toward the flexible circuit board, so that the flexible circuit board and the plurality of The jet flow guiding mechanism remains untouched. The roll-to-roll non-contact colloidal metal electroless plating apparatus according to claim 1, wherein each of the jet flow guiding mechanisms has a tube body and a plurality of other injection holes, and at least one of the nozzle holes and the other A plurality of the orifices are circumferentially located on the tubular body. The roll-to-roll non-contact colloidal metal electroless plating apparatus according to claim 2, wherein each of the jet flow guiding mechanisms further comprises a connecting shaft, the connecting shaft is a linking shaft, and the tubular body passes The linkage shaft is pivotally fixed in the reaction tank. The roll-to-roll non-contact colloidal metal electroless plating apparatus according to claim 2, wherein each of the jet flow guiding mechanisms further includes a connecting shaft, the connecting shaft is a fixed shaft, and the tubular body passes The fixing shaft is fixed in the reaction tank. The roll-to-roll non-contact colloidal metal electroless plating apparatus according to claim 1, further comprising: a fluid circulation unit, wherein the fluid circulation unit is in fluid communication with the reaction tank and the plurality of the spray guide mechanisms The plating solution in the reaction tank is separately transported to the plurality of the jet flow guiding mechanisms through the fluid circulation unit. The roll-to-roll non-contact colloidal metal electroless plating apparatus according to claim 1, wherein the transmission path is a transmission path, and at least two of the jet flow guiding mechanisms are respectively located in the transmission The opposite side of the path. The roll-to-roll non-contact colloidal metal electroless plating apparatus according to claim 1, further comprising: a tape feeding module located on a feeding side of the reaction tank to convey the flexible circuit board Enter the reaction tank. The roll-to-roll non-contact colloidal metal electroless plating apparatus according to claim 1, further comprising: a tape take-up module disposed on a discharge side of the reaction tank for winding through the The flexible circuit board of the reaction tank. The roll-to-roll non-contact colloidal metal electroless plating apparatus according to claim 1, further comprising: a supply line fluidly connected to the reaction tank to transport the plating solution into the reaction tank .