TWM429214U - Electrical connector - Google Patents
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- TWM429214U TWM429214U TW100217981U TW100217981U TWM429214U TW M429214 U TWM429214 U TW M429214U TW 100217981 U TW100217981 U TW 100217981U TW 100217981 U TW100217981 U TW 100217981U TW M429214 U TWM429214 U TW M429214U
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M429214 五、 [0001] [0002] [0003] 1101年.01月02日修正 新型說明: 【新型所屬之技術領域】 本創作涉及一種電連接器,尤其涉及一種可電性連接晶 片模組與電路板之電連接器》 【先前技術】 電連接器根據導電端子與晶片模組或電路板之接觸方式 可分為平面栅格陣列(Land Grid Array)電連接器、球 狀柵格陣列(Ball Grid Array)電連接器及針腳柵格陣 列(Pin Grid Array)電連接器。 2〇1〇年3月I6日公告之美國專利第j677”2辱揭示了 一種 與bb片模組之接觸方式為LGA(La'nd Gr/id Array)之電 連接器。該電連接器包括絕緣本體、叙、容於^邑緣本體中 之複數導電端子、圍設於絕緣本體外側之加強件及分別 枢接於加強件相對兩端之壓板與撥桿。在使用時,使用 者首先要依次旋轉開啟撥桿動將晶片模 組放至絕緣本體上,接著板與撥桿。此 時,撥桿會施力下壓壓板,:便遞板向下抵壓晶片模 組以使晶片模組與導電端子接觸,實現電連接器與晶片 模組間電性導通。 隨著電氣設備不斷朝高速化、小型化方向發展,LGA電連 接器之導電端子之密度亦越來越大。惟,在電連接器之 使用過程中使用者需要手動地將晶片模组組裝至絕緣本 體上,若使用者操作不當,則會損壞導電端子。 鑒於此,確有必要提供一改進之電連接器,以克服先前M429214 V. [0001] [0002] [0003] 1101. 01月02日 Revision of the new description: [New technical field] The present invention relates to an electrical connector, and more particularly to an electrically connectable chip module and circuit Electrical connector of the board [Prior Art] The electrical connector can be divided into a planar grid array (Land Grid Array) electrical connector and a spherical grid array (Ball Grid according to the contact manner of the conductive terminal and the chip module or the circuit board). Array) electrical connector and pin grid array (Pin Grid Array) electrical connector. U.S. Patent No. j677", published on March 1st, I6, discloses an electrical connector that contacts the bb chip module in an LGA (La'nd Gr/id Array). The electrical connector includes The insulating body, the plurality of conductive terminals accommodated in the body of the body, the reinforcing members surrounding the outer side of the insulating body, and the pressing plates and the levers respectively pivotally connected to opposite ends of the reinforcing member. Rotate the open lever in turn to place the chip module on the insulative housing, and then the plate and the lever. At this time, the lever will force the pressing plate to press the plate to press the chip module downward to make the chip module Contact with the conductive terminals to achieve electrical conduction between the electrical connector and the chip module. As electrical equipment continues to move toward higher speed and miniaturization, the density of the conductive terminals of the LGA electrical connector is also increasing. During the use of the electrical connector, the user needs to manually assemble the wafer module to the insulating body. If the user operates improperly, the conductive terminal will be damaged. In view of this, it is necessary to provide an improved electrical connector to overcome previously
[0004] [0005] 100217981^單编號 A0101 第4頁/共30頁 1013000158-0 M429214 技術存在之缺陷。 |ι〇ι年 οι.月 【新型内容】 剛本_之目㈣提供—财Μ絲並準衫位晶片模 组,防止於組裝晶片模組時損壞導電端子之電連接器。[0004] [0005] 100217981^Single number A0101 Page 4 of 30 1013000158-0 M429214 Defects in technology. | ι〇ι年 οι.月 [New Content] 刚本_目(四) provides a chip-and-finished wafer module to prevent damage to the electrical terminals of the conductive terminals when assembling the wafer module.
剛本創作之電連接器可藉以下技術方案實現:―種電連接 器,用以電性連接晶片模組與電路板,其包括絕緣本體 、收容於絕緣本财之倾導_子、蓋設㈣緣本體 上方之壓蓋及組設於壓蓋上之固持裝置。壓蓋設有第_ 開口,固持裝置位於絕緣本體與壓蓋之間用以固持晶 片模組並可承載晶片模組至絕,本體上其設有向上凸 伸設置之上對位塊。上對位塊位6 - Ww與壓蓋 貼合。 ,,丨7 / — ------^ [〇_本創作之電連接H還可藉以下技術方案實現:—種電連 接器,用以電性連接晶片模組與電路板,其包括絕緣本 體、收容於絕緣本體中之巍[筹属^鳩·汰設於絕緣本 韹上方並可於開啟位置與^轉動之壓蓋及組 設於壓蓋上並位於絕緣本持裝置。固持裝置 設有向上延伸之複數扣持臂,可扣持於壓蓋上以將固持 裝置固持於壓蓋上。 [0009] 相較於先前技術,本創作之電連接器藉組設於壓蓋上之 固持裝置固定晶片模組並於壓蓋閉合時承載晶片模組至 絕緣本體上,組裝方便’且可準確定位晶片模組,可避 免使用者於手動取放晶片模組至絕緣本體上時因操作不 當而損壞導電端子,進而保證電連接器具有良好電性連 接性能。 1013000158-0 10〇21798产單編號A〇101 第5頁/共3〇頁 M429214 【實施方式】 101年Ol·月0》日修正替換頁| [0010] 請參閱第_圖至第十—圖所示,本創作之電連接器剛, 用以電性連接晶片模組5至電路板8,其包括絕緣本體卜 收容於絕緣本體i中之複數導電端子13、位於絕緣本則 下方之加強板7'位於絕緣本體i兩端並通過螺絲6固定至 加強板7上之第一固定片42和第二固定片44 '組裝在第一 固定片42之第-撥桿41、組裝在第二固定片^之第二撥 桿43、可旋轉地蓋設在絕緣本體!上方之壓蓋3及組裝在 壓蓋3上之固持裝置2。加強板7、第一固定片42、第二固 疋片44及第二撥桿43構成位於絕緣本體1周圍之加強件。 [0011] 絕緣本體1大致呈正方形結構,包凇底壁丨々灰自底壁丨〇向 上延伸之側壁11。底壁10和側壁共#組成桊容晶片模 組5之收容空間102。底壁1〇設着複嶔收^容<電端子13之 收容孔101。侧壁11設有位於收容空間102中之凸柱11() 。晶片模組5設有與絕緣本肆】之"夺柱110對應之凹孔5〇。 所述凸柱110可與晶片模組穿找〇釔合,以將晶片模 組5定位於絕緣本體1中。基板51、由基板 51凸伸設置之凸台52及設於凸‘答52上方之晶圓模塊53。 凹孔50設於基板51上。The electrical connector of the original creation can be realized by the following technical solutions: a kind of electrical connector for electrically connecting the chip module and the circuit board, which comprises an insulating body, and is housed in the insulation. (4) The gland above the edge body and the holding device assembled on the gland. The gland is provided with a first opening, and the holding device is located between the insulating body and the gland for holding the wafer module and can carry the wafer module to the absolute position, and the body is provided with an upwardly convexly disposed upper alignment block. The upper registration block 6 - Ww fits over the gland. ,,丨7 / — ------^ [〇_ The electrical connection H of this creation can also be realized by the following technical solutions: an electrical connector for electrically connecting the chip module and the circuit board, including The insulating body and the cymbal accommodating in the insulating body are arranged on the insulating base and can be turned on in the opening position and assembled on the gland and located in the insulating device. The holding device is provided with a plurality of latching arms extending upwardly and can be fastened to the gland to hold the retaining device on the gland. [0009] Compared with the prior art, the electrical connector of the present invention fixes the wafer module by the holding device disposed on the gland and carries the wafer module to the insulating body when the gland is closed, which is convenient to assemble and can be accurately The positioning of the wafer module can prevent the user from damaging the conductive terminal due to improper operation when manually accessing the wafer module to the insulating body, thereby ensuring good electrical connection performance of the electrical connector. 1013000158-0 10〇21798 Production Order No. A〇101 Page 5/Total 3 Pages M429214 [Embodiment] 101 Years Ol@月0》日 Revision Replacement Page | [0010] Please refer to the figure _ to tenth As shown, the electrical connector of the present invention is used to electrically connect the chip module 5 to the circuit board 8, which comprises an insulating body, a plurality of conductive terminals 13 received in the insulating body i, and a reinforcing plate 7 located below the insulating body. 'The first fixing piece 42 and the second fixing piece 44' which are located at both ends of the insulating body i and fixed to the reinforcing plate 7 by screws 6 are assembled to the first-shift lever 41 of the first fixing piece 42, and assembled to the second fixing piece ^ The second lever 43, rotatably covered in the insulating body! The upper gland 3 and the holding device 2 assembled on the gland 3. The reinforcing plate 7, the first fixing piece 42, the second fixing piece 44, and the second lever 43 constitute a reinforcing member located around the insulating body 1. [0011] The insulative housing 1 has a substantially square structure, and the bottom wall of the bottom wall is covered with the side wall 11 extending upward from the bottom wall. The bottom wall 10 and the side walls share a receiving space 102 of the wafer module 5. The bottom wall 1 is provided with a receiving hole 101 for recuperating and receiving the electric terminal 13. The side wall 11 is provided with a stud 11 () located in the accommodating space 102. The wafer module 5 is provided with a recessed hole 5 corresponding to the insulating pillar 110. The stud 110 can be mated with the wafer module to position the wafer module 5 in the insulative housing 1. The substrate 51, the boss 52 which is protruded from the substrate 51, and the wafer module 53 which is disposed above the bumper Q52. The recess 50 is provided on the substrate 51.
[0012] 第一固定片42包括大致呈“匚”形之第一片體421、第二 片體422及連接第一片體421與第二片體422之第一連接 體420。第一片體421設有向上延伸之第一阻擋部42U, 第二片體422設有向下延伸之第一扣持部4221。第二固定 片44與第一固定片42結構相同,包括大致呈,,形之 第三片體442、第四片體441及連接第三片體442與第四 10〇21798产單编號 Α0101 第6頁/共30頁 1013000158-0 μ^ΛΛλ [^ϊίοΐ月心日按正_頁丨 之第二連接體440。第三片體442設有向上延伸 之第-15且撞部4421,第四片體441設有向下延伸之第二扣 持部4411。 [0013] 第一你細[0012] The first fixing piece 42 includes a first body 421 having a substantially "匚" shape, a second body 422, and a first connecting body 420 connecting the first body 421 and the second body 422. The first sheet body 421 is provided with a first blocking portion 42U extending upward, and the second sheet body 422 is provided with a first holding portion 4221 extending downward. The second fixing piece 44 has the same structure as the first fixing piece 42, and includes a third piece body 442, a fourth piece body 441, and a third piece body 442 connected to the third piece body 442 and a fourth 10〇21798. Page 6 of 30 pages 1013000158-0 μ^ΛΛλ [^ϊίοΐ月心日 Press the second connector 440 of the positive page. The third sheet body 442 is provided with an upwardly extending -15th portion and a collision portion 4421, and the fourth sheet body 441 is provided with a second fastening portion 4411 extending downward. [0013] First you are fine
撥柃41組裝在第一固定片42上,包括第一固定桿4ΐι 2與第—固定桿411大致垂直之第一操作桿412。第一固 定桿411包括固定於第—片體421與第二片體422上之一 對第一固定部41Π及位於第一固定部41u中間之第一壓 接部411〇。第二撥桿43與第一撥桿41結構相同其組裝 在第二固定月44上,包括第二固定桿431及與第二固定桿 431大致垂直之第二操作桿432。第二固定桿431包括固 疋至第三片體4 4 2和第四片_ 4_4丨土-之:i對^^固定部 4311及位於第二固定部431|1‘g之第j壓接>431〇。The dial 41 is assembled on the first fixing piece 42, and includes a first operating lever 412 that is substantially perpendicular to the first fixing rod 4ΐ2 and the first fixing rod 411. The first fixing rod 411 includes a first pressing portion 411A fixed to the first fixing portion 41A and the first fixing portion 41u, which are fixed to the first sheet body 421 and the second sheet body 422. The second lever 43 is identical in structure to the first lever 41 and is assembled on the second fixed month 44, and includes a second fixing rod 431 and a second operating rod 432 substantially perpendicular to the second fixing rod 431. The second fixing rod 431 includes a fixed portion to the third sheet body 4 4 2 and the fourth sheet _ 4_4 - the i-fixing portion 4311 and the j-th crimping portion located at the second fixing portion 431 | 1'g >431〇.
' i \ J' i \ J
1--—--------- - J1------------ - J
[0014] ⑧蓋3蓋設於絕緣本體】上並可於開啟位置與閉合位置之 間轉動,其包括主體板3〇及由主體板3〇之相對兩端延伸 設^樞接勾31與舌片位於其中央 之第一開口 33,可供晶片;|幣色暴塊53穿過。主體 板30之一相對兩側各朝第伸設有一對按壓 部34。所述按壓部34於壓蓋3處於閉合位置時可按壓晶片 模組5之凸台52使晶片模組5與導電端子13接觸,實現晶 片模組5與電連接器1 0 0間電性連接。 [0015]請重點參閱第四圖至第九圖所示,固持裝置2組設於壓蓋 3上並位於壓蓋3與絕緣本體1之間,用以固持晶片模組5 並可於壓蓋3旋轉閉合時將晶片模組5承載至絕緣本體1上 。固持裝置2包括框體20及位於框體2〇中央並與壓蓋3之 第一開口 33相對應之第二開口 21。框體2〇之一相對兩側 1002謂产單编號Α〇101 1013000158-0 第7頁/共30頁 M429214 101年01月02日梭正替换頁 各向上延伸設有一位於第二開口21内之扣持臂22。所述 扣持臂22之兩端分別向上並朝遠離第二開口 21之方向延 伸設有一扣持勾23,可與壓蓋3之第一開〇33之側邊相扣 持,用以將固持裝置2固設於壓蓋3上》所述扣持勾23卡 扣於壓蓋3上後位於壓蓋3之按壓部34之間。所述扣持臂 22係與第二開口 21之側邊間隔一定距離設置。 [0016]固持裝置2還包括由框體2〇之另一相對兩側朝第二開口 21 内凸伸設置之彈性臂24 ^所述彈性臂24與框體20之相應[0014] The cover 3 is disposed on the insulative housing and is rotatable between an open position and a closed position, and includes a main body plate 3 and a hinged hook 31 and a tongue extending from opposite ends of the main body plate 3 The sheet is located at the center of the first opening 33 for the wafer; the coin color block 53 passes through. A pair of pressing portions 34 are formed on opposite sides of one of the main body plates 30. The pressing portion 34 can press the boss 52 of the chip module 5 to contact the pad module 5 and the conductive terminal 13 when the cap 3 is in the closed position, so as to electrically connect the chip module 5 and the electrical connector 100. . [0015] Please refer to the fourth to ninth views. The holding device 2 is disposed on the gland 3 and between the gland 3 and the insulative housing 1 for holding the wafer module 5 and the gland. 3 The wafer module 5 is carried onto the insulative housing 1 when the rotation is closed. The holding device 2 includes a frame body 20 and a second opening 21 located at the center of the frame body 2 and corresponding to the first opening 33 of the gland 3. One of the opposite sides of the frame 2 is 1002, and the number is Α〇101 1013000158-0. Page 7/Total 30 pages M429214 On January 2, 2011, the shuttle replacement pages are each provided with a second opening 21 extending upward. The arm 22 is held. The two ends of the latching arm 22 extend upwardly and away from the second opening 21 to form a latching hook 23, which can be fastened to the side of the first opening 33 of the cap 3 for holding The device 2 is fixed on the gland 3. The buckle hook 23 is fastened between the pressing cover 3 and located between the pressing portions 34 of the gland 3. The latching arms 22 are disposed at a distance from the sides of the second opening 21. [0016] The holding device 2 further includes a resilient arm 24 projecting from the opposite side of the frame 2 to the second opening 21. The corresponding position of the elastic arm 24 and the frame 20
側邊之間具有間隙240,以提供彈性臂24彈性變形之空間 。請重點參閲第八圖至第十圖所示,彈性臂24朝第二開 口 21内凸伸設有抵接部241,可與晶片楱冬凸台52之 侧壁相抵接,以將晶片模組5固定於固‘裝粟^上。請重 點參閲第五圖所示,所述框體2〇還向上、凸/^設有位於彈 性臂24兩側之上對位塊25,T於固持裝置2組設於壓蓋3 上後位於壓蓋3之第一開口 .3 3内並與壓蓋3,辟合。 [0017] + 還向下延伸設有 複數下對位塊26,可與气應側一配合,用以將 固持裝置2定位於絕緣本體1±,防止壓蓋3旋轉閉合時發 生偏移而損壞導«子13。請重點參閱第九圖所示,所 述框體2G之底部還設有位於其四角落之定位塊27,可與 晶片模組5之基板51之側壁抵接,以將晶片模組5定位於 固持裝置2上。所述框體2()上還設有複數尺寸不同之通孔 201及位於通孔2()1内之定位臂2〇2。位於框體2〇同一側 之兩定位臂202之長度不同。所述定位臂2Q2之自由端向 下凸伸設有定位柱203,可與晶片模組5之凹孔5Q配合, 10021798^單编號A0101 第8頁/共30頁 1013000158-0 101年.01月日按正雜頁 用以防止晶片模組5誤裝。所述定位柱203可於壓蓋3旋轉 閉合時受絕緣本體1之凸柱110頂推。 [_]如下將詳細介紹晶片模组5組裝至固持襄置2上之組裝過 程:首先藉固持裝置2—側之定位柱203與晶片模組5之相 應凹孔50配合及固持裝置2之兩定位塊27與晶片模組5之 基板51之側壁貼合,以將晶片模組5之一端定位於固持裝 置2上。然後沿固持裝置2之縱長方向擠推晶片模組5使固 置另側之疋位柱2 0 3插入晶片模組5之相應凹孔5 〇 中’並藉固持裝置2之另外兩定位塊27與晶片模組5之基 板51之側壁貼合,以將晶片模組5之另一端定位於固持裝 置2上。同時,固持裝置2之彈丧臂24£啦^,241抵接晶 片模組5之凸台5 2之側壁以將晶片v模蜂^固持丄固持裝置2 上。 [◦019]、.’_a裝時,首先將導電端子13組設於絕緣本體1中;接著將 ,並 〜第輸ftp1之相對兩端 匕…46固疋於加強^^^#||^第一撥桿41組 設於第-=片42上,將領組設於第二固定片 44上;接著藉固持裝置2之扣持勾23穿過壓蓋3之第一開 口 33並卡扣於壓蓋3位於按壓部以之間之位 置2組設於壓蓋3上;然後藉壓蓋3之樞接仙柄接於第二 撥才干43之第二壓接部4310上以將組設有固持裝置2之壓蓋 3組設於第二固定片44上;最後藉固持裝置2之定位塊27 與晶片模組5之基板51之側壁減及固持裝置2之定位柱 2〇3與晶片模組5之凹孔50配合以將晶片模組5定位於固持 裝置2上,並藉固持裝置2之彈性臂24抵接晶片模組5之側 10_产單編號細1 第9頁/共30頁 1013000158-0 M429214 I皿年〇ι月 壁以將晶片模組5固持於固持裝置2上。此時,固持裝置2 之上對位塊25位於壓蓋3之第一開口 33中並與第一開口 33 之側壁貼合》第一固定片42之第一阻擋部4211可防止第 一撥桿41沿水平方向脫離第一固定片42。第二固定片44 之第二阻擋部4421可防止第二撥桿43沿水平方向脫離第 二固定片44。 [0020] 使用時’首先旋轉閉合壓蓋3 ,然後旋轉閉合第二撥桿43 。此時,第二撥捍43之第二操作桿432末端與第一固定片 42之第一扣持部4221扣持,第二撥桿43之第二壓接部 4310壓接於壓蓋3之主體板30靠近樞接勾31之位置上。 壓蓋3靠近枢接勾31之兩按壓部3令按壓於晶片模組5之凸 台52—端。接著旋轉閉合第一撥‘4丄此時/第一撥桿 41之第一操作桿412與第二固定片Ϊ4之^二扣持部4411There is a gap 240 between the sides to provide a space for the elastic arms 24 to be elastically deformed. Referring to FIG. 8 to FIG. 10 , the elastic arm 24 protrudes toward the second opening 21 and is provided with an abutting portion 241 for abutting against the sidewall of the wafer winter boss 52 to mold the wafer. Group 5 is fixed on the solid 'installed millet'. Please refer to the fifth figure, the frame body 2 is also provided with the alignment block 25 on both sides of the elastic arm 24, and the T is disposed on the gland 3 after the holding device 2 is assembled. It is located in the first opening .3 3 of the gland 3 and is integrated with the gland 3. [0017] + further extending downwardly to provide a plurality of lower alignment blocks 26, which can be matched with the gas side to position the holding device 2 to the insulating body 1±, preventing the gland 3 from being displaced and being damaged when rotated and closed. Guide «子13. Please refer to the ninth figure. The bottom of the frame 2G is further provided with a positioning block 27 at four corners thereof, which can abut against the sidewall of the substrate 51 of the chip module 5 to position the wafer module 5 The device 2 is held. The frame body 2() is further provided with a plurality of through holes 201 having different sizes and positioning arms 2〇2 located in the through holes 2()1. The lengths of the two positioning arms 202 on the same side of the frame 2 are different. The free end of the positioning arm 2Q2 protrudes downwardly and is provided with a positioning post 203, which can be matched with the concave hole 5Q of the wafer module 5, 10021798^single number A0101, page 8/total 30 pages, 1013000158-0, 101 years. 01 The date of the month is used to prevent the chip module 5 from being misloaded. The positioning post 203 can be pushed up by the stud 110 of the insulative housing 1 when the gland 3 is rotated and closed. [_] The assembly process of assembling the wafer module 5 to the holding device 2 will be described in detail as follows: first, the positioning post 203 on the side of the holding device 2 is engaged with the corresponding recessed hole 50 of the wafer module 5 and the holding device 2 The positioning block 27 is bonded to the side wall of the substrate 51 of the wafer module 5 to position one end of the wafer module 5 on the holding device 2. Then, the wafer module 5 is pushed in the longitudinal direction of the holding device 2 to insert the clamping column 2 0 3 on the other side into the corresponding recess 5 〇 of the wafer module 5 and the other two positioning blocks of the holding device 2 27 is bonded to the side wall of the substrate 51 of the wafer module 5 to position the other end of the wafer module 5 on the holding device 2. At the same time, the arm of the holding device 2 is affixed to the side wall of the boss 5 2 of the wafer module 5 to hold the wafer v on the holding device 2. [◦019], .'_a installed, first set the conductive terminals 13 in the insulative body 1; then, and the opposite ends of the first ftp1 匕 ... 46 fixed in the reinforcement ^ ^ ^ # | | ^ The first lever 41 is disposed on the first-shaped piece 42 and the collar is assembled on the second fixing piece 44. Then, the fastening hook 23 of the holding device 2 passes through the first opening 33 of the pressing cover 3 and is buckled The gland 3 is disposed on the gland 3 at a position 2 between the pressing portions; and then is connected to the second crimping portion 4310 of the second dial 43 by the pivoting handle of the pressing cover 3 to set the group The gland 3 of the holding device 2 is assembled on the second fixing piece 44. Finally, the positioning block 27 of the holding device 2 and the side wall of the substrate 51 of the wafer module 5 are reduced by the positioning post 2〇3 and the wafer mold of the holding device 2. The recessed hole 50 of the group 5 cooperates to position the wafer module 5 on the holding device 2, and abuts the side of the wafer module 5 by the elastic arm 24 of the holding device 2_Production number number 1 Page 9 of 30 Page 1013000158-0 M429214 The first month of the moon is used to hold the wafer module 5 on the holding device 2. At this time, the alignment block 25 on the holding device 2 is located in the first opening 33 of the gland 3 and fits the side wall of the first opening 33. The first blocking portion 4211 of the first fixing piece 42 can prevent the first lever The first fixing piece 42 is detached from the horizontal direction 41. The second blocking portion 4421 of the second fixing piece 44 prevents the second lever 43 from being separated from the second fixing piece 44 in the horizontal direction. [0020] When in use, the lid 3 is first rotated and closed, and then the second lever 43 is closed by rotation. At this time, the second end of the second lever 43 is fastened to the first latching portion 4221 of the first fixing piece 42 , and the second crimping portion 4310 of the second lever 43 is crimped to the cap 3 . The main body panel 30 is located close to the pivoting hook 31. The pressing cover 3 is pressed adjacent to the two pressing portions 3 of the pivoting hook 31 to be pressed against the projection 52 end of the wafer module 5. Then, the second latching portion 4411 of the first operating lever 412 and the second fixing tab 4 of the first dialing of the first dialing/the first lever 41 is rotated and closed.
[0021] 相扣持,第一撥桿41之第一壓接部4110抵壓於壓蓋3之舌 片32上。壓蓋3靠近舌片3$之兩梓壓部34锋壓於晶片模組 5之凸台52之另一端。由此、餐缸5與導電端子 13接觸,實現晶片模組5與义霉蕩卷1'〇也間電性導通。 本創作之電連接器藉組設於壓蓋3上之固持裝置2之彈性[0021] The first crimping portion 4110 of the first lever 41 is pressed against the tongue 32 of the cap 3 by the latching. The pressing portion 34 of the gland 3 near the tongue 3$ is pressed against the other end of the boss 52 of the wafer module 5. Thereby, the bowl 5 is in contact with the conductive terminal 13 to electrically connect the wafer module 5 and the mold roll 1'. The elasticity of the holding device 2 of the present invention is set by the holding device 2 provided on the gland 3
臂24夾持晶片模組5將晶片模组5固持於固持裝置2上,並 可於壓蓋3旋轉至閉合位置時將晶片模組5承載至絕緣本 體1上以實現晶片模組5與電連接器1〇〇間電性連接,操作 簡單,組裝方便,可防止使用者於取放晶片模组5時操作 不當而損壞導電端子;且固持裝置2上設有與晶片模組5 之凹孔50配合之定位柱203及與晶片模组5之側壁抵接之 定位塊27 ’可將晶片模組5準確定位於固持裝置2上;固 臓产單编號删1 第10頁/共30頁 1013000158-0 M429214The arm module 24 holds the wafer module 5 to hold the wafer module 5 on the holding device 2, and can carry the wafer module 5 to the insulative housing 1 when the gland 3 is rotated to the closed position to realize the wafer module 5 and the electric device. The electrical connection between the connectors 1 is simple, the assembly is convenient, and the user can prevent the user from damaging the conductive terminals when the wafer module 5 is improperly accessed; and the holding device 2 is provided with a recessed hole with the wafer module 5. The matching positioning post 203 and the positioning block 27' abutting the side wall of the wafer module 5 can accurately position the wafer module 5 on the holding device 2; the solid product number is deleted 1 page 10 / 30 pages 1013000158-0 M429214
[0024] [0025] [ιοί年01月02日梭正 持裝置2同一側之定位柱203至固持裝置2之縱長中心線之 距離不同之設置,可避免將晶片模組5組裝至固持裝置2 上時發生誤裝;另外,固持裝置2藉其扣持勾23穿過壓蓋 3之第一開口33卡扣於壓蓋3上,以將固持裝置2穩定固持 於壓蓋3上,操作簡單,組裝方便》 [0022] 综上所述,本創作符合新型專利要件,爰依法提出專利 申請。惟’以上所述者僅為本創作之較佳實施例,本創 作之範圍並不以上述實施例為限,舉凡熟習本案技藝之 人士援依本創作之精神所作之等效修飾或變化,皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 1 r ' Γ、、 ,I V, / j [0023] 第一圖係本創作電連接器考辱;片冬亨(電之立體組 合圖,其中壓蓋處於閉合位置; 第二圖係本創作電連接器與晶片模組及電路板之立體組 合圖,其中屋蓋處於開啟 第三圖係本創作電連接器電路板之另一視 OHhtm 角之立體組合圖,其中壓蓋處於開啟位置; [0026] 第四圖係本創作電連接器之立體分解圖; [0027] 第五圖係本創作電連接器之壓蓋與固持裝置之立體組合 圖; [0028] 第六圖係第五圖所示之電連接器之壓蓋與固持裝置之另 一視角之立體組合圖; [0029] 第七圖係本創作電連接器之固持裝置之立體圖; ⑽卵#單編號A〇101 第11頁/共30頁 1013000158-0 101年.01月02日梭正替換頁 M429214 [0030] 第八圖係本創作電連接器之固持裝置與晶片模組之立體 組合圖; [0031] 第九圖係本創作電連接器之固持裝置與晶片模組之另一 視角之立體組合圖; [0032] 第十圖係沿第一圖中X-X方向之剖視圖;及 [0033] 第十一圖係沿第一圖中XI-XI方向之剖視圖。 【主要元件符號說明】 [0034] 電連接器: 100 [0035] 絕緣本體· 1 [0036] 底壁:10 [0037] 收容孔:101 [0038] 收容空間: 102 [0039] 側壁:11 [0040] 凸柱:110 [0041] 導電端子: 13 [0042] 固持裝置: 2 [0043] 框體:20 [0044] 通孔:201 [0045] 定位臂:202 [0046] 定位柱:203 ·、 1, · ·. t[0025] [May 02, the setting of the distance between the positioning post 203 of the same side of the shuttle holding device 2 and the longitudinal center line of the holding device 2 is different, and the assembly of the wafer module 5 to the holding device can be avoided. 2, the misloading occurs on the upper side; in addition, the holding device 2 is fastened to the gland 3 through the first opening 33 of the gland 3 by the holding hook 23 to stably hold the holding device 2 on the gland 3, and operate Simple, easy to assemble" [0022] In summary, the creation meets the requirements of new patents, and patent applications are filed according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered by the following patent application. [Simple description of the diagram] 1 r ' Γ, , , IV, / j [0023] The first picture is the insult of the original electrical connector; piece winter Heng (electrical three-dimensional combination picture, in which the gland is in the closed position; The second figure is a three-dimensional combination diagram of the present electrical connector and the chip module and the circuit board, wherein the roof is in a third perspective view of the OHhtm corner of the circuit board of the present invention, wherein the gland is [0026] The fourth figure is an exploded perspective view of the present electrical connector; [0027] The fifth figure is a three-dimensional combination of the gland and the holding device of the present electrical connector; [0028] A perspective view of another view of the gland and the holding device of the electrical connector shown in FIG. 5; [0029] FIG. 7 is a perspective view of the holding device of the present electrical connector; (10) Egg #单号A〇 101 Page 11 of 30 1013000158-0 101. 01月02日 Shuttle replacement page M429214 [0030] The eighth figure is a three-dimensional combination of the holding device and the wafer module of the present invention; [0031] The ninth figure is another view of the holding device and the chip module of the present electrical connector [0032] The tenth drawing is a cross-sectional view along the XX direction in the first drawing; and [0033] The eleventh drawing is a sectional view along the XI-XI direction in the first drawing. [Main component symbol description] [0034] ] Electrical connector: 100 [0035] Insulating body · 1 [0036] Bottom wall: 10 [0037] Receiving hole: 101 [0038] Containing space: 102 [0039] Side wall: 11 [0040] Stud: 110 [0041] Conductive terminal: 13 [0042] Holding device: 2 [0043] Frame: 20 [0044] Through hole: 201 [0045] Positioning arm: 202 [0046] Positioning post: 203 ·, 1, · ·.
Vi - )/ (ri^〇 ;/ .J L; b、;夕 10021798产單编號 A〇101 第12頁/共30頁 1013000158-0 M429214 [0047] 101年.01月02日按正替换頁 第二開口 : 21 [0048] 扣持臂:22 [0049] 扣持勾:23 [0050] 彈性臂:24 [0051] 間隙:240 [0052] 抵接部:241 . [0053] 上對位塊:25 籲[0054] 下對位塊:26 [0055] 定位塊:27 r :/ 1 [0056] 麼蓋· 3 -------- 、夕 [0057] 主體板:30 [0058] 極接勾· 31 [| 『丨1: [0059] ϋ [0060] 舌片:32 Property ..Ο戀 c© 第一開口 : 33 [0061] 按壓部:34 [0062] 第一撥桿:41 [0063] 第一固定桿:411 [0064] 第一壓接部:4110 [0065] 第一固定部:4111 [0066] 第一操作桿:412 100217981^單編號 A〇1〇l M429214 101年01月02日修正替换頁 [0067] 第一固定片 :42 [0068] 第一連接體 :420 [G069] 第一片體: 421 [0070] 第一阻擋部 :4211 [0071] 第二片體:422 [0072] 第一扣持部 :4221 [0073] 第二撥桿: 43 [0074] 第二固定桿 :431 [0075] 第二壓接部 :4310 [0076] 第二固定部 :4311 [0077] 第二操作桿 :432 [0078] 第二固定片 :44 [0079] 第二連接體 :440 [0080] 第四片體: 441 [0081] 第二扣持部 :4411 [0082] 第三片體: 442 [0083] 第二阻擋部 :4421 [0084] 晶片模組· 5 [0085] 凹孔:50 [0086] 基板:51 100217981^單编號 A〇101 /\ :靡::::(&〇1』( '、rr、y、疼产、ij rr^/^ ‘丨、、-π 第14頁/共30頁 1013000158-0 M429214 [0087] 凸台:52 [0088] 晶圓模塊:53 [0089] 螺絲:6 [0090] 加強板:7 [0091] 電路板:8 101年01月曲日核正替换頁Vi - ) / (ri^〇;/ .JL; b,; eve 10021798 production order number A 〇 101 page 12 / total 30 pages 1013000158-0 M429214 [0047] 101 years. January 02, press the replacement page Second opening: 21 [0048] Buckle arm: 22 [0049] Buckle hook: 23 [0050] Elastic arm: 24 [0051] Clearance: 240 [0052] Abutment: 241. [0053] Upper alignment block :25 [[0054] Lower Alignment Block: 26 [0055] Positioning Block: 27 r : / 1 [0056] Cover · 3 -------- , eve [0057] Main Board: 30 [0058] Extremely connected hook · 31 [| 『丨1: [0059] ϋ [0060] tongue: 32 Property .. Ο恋 c© First opening: 33 [0061] Pressing part: 34 [0062] First lever: 41 [0063] First fixing rod: 411 [0064] First crimping portion: 4110 [0065] First fixing portion: 4111 [0066] First operating lever: 412 100217981^ Single number A〇1〇l M429214 101 years 01 Correction replacement page of month 02 [0067] First fixing piece: 42 [0068] First connecting body: 420 [G069] First piece: 421 [0070] First blocking part: 4211 [0071] Second piece: 422 [0072] First fastening portion: 4221 [0073] Second lever: 43 [0074] Second solid Rod: 431 [0075] Second crimping portion: 4310 [0076] Second fixing portion: 4311 [0077] Second operating lever: 432 [0078] Second fixing tab: 44 [0079] Second connecting body: 440 [ 0080] Fourth piece: 441 [0081] Second holding part: 4411 [0082] Third piece: 442 [0083] Second blocking part: 4421 [0084] Wafer module · 5 [0085] Recessed hole: 50 [0086] Substrate: 51 100217981^Single number A〇101 /\ :靡::::(&〇1』( ', rr, y, pain, ij rr^/^ '丨,, -π Page 14 of 30 1013000158-0 M429214 [0087] Boss: 52 [0088] Wafer Module: 53 [0089] Screw: 6 [0090] Reinforcement Plate: 7 [0091] Circuit Board: 8 January 101 Qu Ri nuclear replacement page
1002.1798产單編號歷01 第15頁/共30頁 1013000158-01002.1798 Production order number calendar 01 Page 15 of 30 1013000158-0
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW100217981U TWM429214U (en) | 2011-09-26 | 2011-09-26 | Electrical connector |
US13/626,885 US8834191B2 (en) | 2011-09-26 | 2012-09-26 | Electrical connector having holder for carrying an IC package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW100217981U TWM429214U (en) | 2011-09-26 | 2011-09-26 | Electrical connector |
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TWM429214U true TWM429214U (en) | 2012-05-11 |
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TW100217981U TWM429214U (en) | 2011-09-26 | 2011-09-26 | Electrical connector |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103515788A (en) * | 2013-05-09 | 2014-01-15 | 富士康(昆山)电脑接插件有限公司 | Clamping device and combination thereof |
TWI450455B (en) * | 2012-06-25 | 2014-08-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US9214754B2 (en) | 2013-05-03 | 2015-12-15 | Hon Hai Precision Industry Co., Ltd. | Holding device used for electrical connector |
-
2011
- 2011-09-26 TW TW100217981U patent/TWM429214U/en not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI450455B (en) * | 2012-06-25 | 2014-08-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US8979565B2 (en) | 2012-06-25 | 2015-03-17 | Hon Hai Precision Industry Co., Ltd. | Electrical connector having a holding member and a load plate pivotally assembled to two ends of a stiffener |
US9214754B2 (en) | 2013-05-03 | 2015-12-15 | Hon Hai Precision Industry Co., Ltd. | Holding device used for electrical connector |
CN103515788A (en) * | 2013-05-09 | 2014-01-15 | 富士康(昆山)电脑接插件有限公司 | Clamping device and combination thereof |
CN103515788B (en) * | 2013-05-09 | 2016-02-03 | 富士康(昆山)电脑接插件有限公司 | Clamping device and combination thereof |
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