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TWM496850U - LED package structure - Google Patents

LED package structure Download PDF

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Publication number
TWM496850U
TWM496850U TW103218823U TW103218823U TWM496850U TW M496850 U TWM496850 U TW M496850U TW 103218823 U TW103218823 U TW 103218823U TW 103218823 U TW103218823 U TW 103218823U TW M496850 U TWM496850 U TW M496850U
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TW
Taiwan
Prior art keywords
light
layer
light emitting
package structure
emitting diode
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Application number
TW103218823U
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Chinese (zh)
Inventor
Jing-En Huang
Shao-Ying Ding
Guan-Jie Huang
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Genesis Photonics Inc
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Publication date
Application filed by Genesis Photonics Inc filed Critical Genesis Photonics Inc
Priority to TW103218823U priority Critical patent/TWM496850U/en
Publication of TWM496850U publication Critical patent/TWM496850U/en

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Description

發光二極體封裝結構Light emitting diode package structure

本新型是有關於一種封裝結構,特別是指一種發光二極體封裝結構。The present invention relates to a package structure, and more particularly to a light emitting diode package structure.

發光二極體具有固態照明、高功率、省電等優點,故目前有越來越多照明設備採用發光二極體為光源。已知發光二極體封裝件中,常藉由添加紅色螢光粉來提升演色性(Color Rendering Index)。參閱圖1,為I435479號專利案所提供的一種可發光式封裝件,主要包含一設有一凹槽111的承載件11、一設置在該承載件11上的發光晶片12、一位於該承載件11的一底面112上且具有第一螢光粉14的擋塊13、一形成於該承載件11上以包覆該發光晶片12與擋塊13的第一封裝膠體15,以及一形成於該第一封裝膠體15上且具有第二螢光粉17的第二封裝膠體16。該承載件11具有一圍繞於該凹槽111四周圍的反射面113。該第一螢光粉14為紅色或橙色,該第二螢光粉17為黃色或綠色。藉由摻混該第一螢光粉14,使該第一螢光粉14發出的光與該發光晶片12及該第二螢光粉17發出的光相配合,以提高演色性。Light-emitting diodes have the advantages of solid-state lighting, high power, and power saving. Therefore, more and more lighting devices currently use light-emitting diodes as light sources. In the known light-emitting diode package, the color rendering index is often improved by adding red phosphor powder. Referring to FIG. 1 , an illuminable package provided in the patent application No. I435479 includes a carrier 11 having a recess 111, a luminescent wafer 12 disposed on the carrier 11, and a carrier. a stopper 13 having a first phosphor powder 14 on a bottom surface 112, a first encapsulant 15 formed on the carrier 11 to cover the luminescent wafer 12 and the stopper 13, and a first encapsulant 15 formed thereon The second encapsulant 16 on the first encapsulant 15 and having the second phosphor powder 17. The carrier 11 has a reflective surface 113 surrounding the periphery of the recess 111. The first phosphor 14 is red or orange, and the second phosphor 17 is yellow or green. By blending the first phosphor 14 , the light emitted by the first phosphor 14 is matched with the light emitted from the light-emitting chip 12 and the second phosphor 17 to improve color rendering.

然而,由於含有該第一螢光粉14的該擋塊13僅位於該承載件11的底面112上,並且未抵靠該四面圍繞的反射面113,故該擋塊13的四周未受到任何支撐,加上該擋塊13為直立向上突出有一定高度,該擋塊13的結構較脆弱,較易於受損,且其製作上較為麻煩。當該擋塊13受損或折斷時,會影響到第一螢光粉14受激發光的效果,從而使演色性降低。However, since the stopper 13 containing the first phosphor 14 is located only on the bottom surface 112 of the carrier 11 and does not abut the reflective surface 113 surrounded by the four sides, the periphery of the stopper 13 is not supported. In addition, the stopper 13 has a certain height protruding upward from the upright, and the structure of the stopper 13 is relatively fragile, is relatively easy to be damaged, and is cumbersome to manufacture. When the stopper 13 is damaged or broken, the effect of the first fluorescent powder 14 on the excitation light is affected, so that the color rendering property is lowered.

因此,本新型之目的,即在提供一種結構創新、能維持發光亮度並提升演色性的發光二極體封裝結構。Therefore, the object of the present invention is to provide a light-emitting diode package structure which is structurally innovative, can maintain luminance and enhance color rendering.

於是,本新型發光二極體封裝結構,包含:一包括一承載面的基座、一設置在該承載面上並能發出一第一色光的發光單元、一沿著該承載面設置的紅粉膠層,以及一螢光膠層。該螢光膠層包覆該發光單元,並可受該第一色光激發而發出一第二色光。該紅粉膠層能受到該第一色光與該第二色光的其中至少一個激發而發出紅光。Therefore, the novel LED package structure comprises: a base including a bearing surface, a light-emitting unit disposed on the bearing surface and capable of emitting a first color light, and a red powder disposed along the bearing surface a layer of glue, and a layer of phosphor glue. The phosphor layer covers the light emitting unit and is excited by the first color light to emit a second color light. The layer of red powder can be excited by at least one of the first color light and the second color light to emit red light.

本新型之功效:藉由該紅粉膠層延伸披覆於該承載面上,由於該紅粉膠層為薄片狀,並可受到該承載面之支撐承載,故該紅粉膠層結構穩固、強度佳。該紅粉膠層可全方位地吸收第一色光與第二色光的其中至少一種,進而發出紅光,能提升光線的演色性,而且本新型能維持高亮度、高出光效率之優點。The utility model has the advantages that the red powder adhesive layer is covered on the bearing surface, and the red powder adhesive layer is flaky and can be supported by the bearing surface, so the red powder adhesive layer has stable structure and good strength. The red powder layer can absorb at least one of the first color light and the second color light in an all-round manner, thereby emitting red light, which can improve the color rendering of the light, and the novel can maintain the advantages of high brightness and high light extraction efficiency.

2‧‧‧基座2‧‧‧Base

21‧‧‧承載面21‧‧‧ bearing surface

3‧‧‧發光單元3‧‧‧Lighting unit

30‧‧‧外部電極30‧‧‧External electrode

301‧‧‧導線301‧‧‧ wire

31‧‧‧發光本體31‧‧‧Lighting body

32‧‧‧電極32‧‧‧ electrodes

4‧‧‧紅粉膠層4‧‧‧Red powder layer

5‧‧‧螢光膠層5‧‧‧Fluorescent rubber layer

51‧‧‧第一層部51‧‧‧First Department

52‧‧‧第二層部52‧‧‧Second floor

53‧‧‧第三層部53‧‧‧ Third Floor

54‧‧‧第四層部54‧‧‧Fourth Department

6‧‧‧封裝膠體6‧‧‧Package colloid

7‧‧‧反射層7‧‧‧reflective layer

8‧‧‧絕緣層8‧‧‧Insulation

本新型之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一種已知的可發光式封裝件的剖視示意圖;圖2是本新型發光二極體封裝結構的一第一實施例的剖視示意圖;圖3是本新型發光二極體封裝結構的一第二實施例的剖視示意圖;圖4是本新型發光二極體封裝結構的一第三實施例的剖視示意圖;及圖5是本新型發光二極體封裝結構的一第四實施例的剖視示意圖。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a schematic cross-sectional view of a known illuminable package; FIG. 2 is a novel light-emitting diode of the present invention. FIG. 3 is a cross-sectional view showing a second embodiment of the present invention; FIG. 3 is a cross-sectional view showing a second embodiment of the novel LED package structure; FIG. 4 is a third embodiment of the novel LED package structure. A cross-sectional view of an embodiment; and FIG. 5 is a cross-sectional view of a fourth embodiment of the novel light emitting diode package structure.

在本新型被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

參閱圖2,本新型發光二極體封裝結構之第一實施例包含:一基座2、一發光單元3、一紅粉膠層4、一螢光膠層5,以及一封裝膠體6。Referring to FIG. 2, a first embodiment of the novel LED package structure includes a base 2, a light emitting unit 3, a red powder layer 4, a phosphor layer 5, and an encapsulant 6.

該基座2材質可以為陶瓷材料,具有良好的散熱性。該基座2包括一水平且朝上的承載面21。The base 2 can be made of a ceramic material and has good heat dissipation properties. The base 2 includes a horizontal and upwardly facing bearing surface 21.

該發光單元3設置在該承載面21上,並能發出一第一色光。本實施例的發光單元3為一個藍光發光二極體,該第一色光為藍光。該發光單元3包括一發光本體31,以及二位於該發光本體31底部的電極32,該等電極 32分別與二個設置在該基座2上的外部電極30接觸,使該發光單元3可經由該等外部電極30連接外部電路。本實施例的發光單元3是採用覆晶(Flip Chip)LED之封裝方式。覆晶LED於封裝上,由於倒裝使電極直接接觸下方的散熱基板,故散熱性佳、可延長LED晶片壽命,並且可通大電流使用。而且由於其封裝時免打線,能避免斷線風險,此外還具有利於小尺寸設計之優點。The light emitting unit 3 is disposed on the carrying surface 21 and can emit a first color light. The light emitting unit 3 of this embodiment is a blue light emitting diode, and the first color light is blue light. The illuminating unit 3 includes a illuminating body 31, and two electrodes 32 at the bottom of the illuminating body 31. The electrodes 32 is respectively in contact with two external electrodes 30 disposed on the susceptor 2, so that the illuminating unit 3 can be connected to an external circuit via the external electrodes 30. The light emitting unit 3 of the present embodiment is a package using a flip chip LED. The flip-chip LED is on the package, and since the flip-chip directly contacts the lower heat-dissipating substrate, the heat dissipation is good, the life of the LED chip can be prolonged, and the current can be used. Moreover, since it is free from wire during packaging, it can avoid the risk of wire breakage, and it also has the advantage of facilitating small-sized design.

該紅粉膠層4沿著該承載面21設置而披覆於該承載面21上,且該紅粉膠層4位於該承載面21與該封裝膠體6間,也位於該承載面21與該發光單元3間。該紅粉膠層4實際上是由紅色螢光粉摻混於一可透光的膠體中混合形成,該膠體例如矽膠、環氧樹脂。The red powder layer 4 is disposed on the bearing surface 21 along the bearing surface 21 , and the red powder layer 4 is located between the bearing surface 21 and the encapsulant 6 , and is also located on the bearing surface 21 and the light emitting unit. 3 rooms. The red powder layer 4 is actually formed by mixing red luminescent powder in a permeable colloid, such as silicone or epoxy.

該螢光膠層5包覆該發光單元3,並可受該第一色光激發而發出一第二色光,該第二色光不同於該第一色光。該螢光膠層5包括一覆蓋於該發光單元3上方的第一層部51、一自該第一層部51周緣朝下延伸且圍繞該發光單元3的第二層部52,以及一位於該發光單元3的該等電極32間的第三層部53。該螢光膠層5實際上是由螢光粉摻混於一可透光的膠體中混合形成,該膠體例如矽膠、環氧樹脂。本實施例的螢光膠層5的螢光粉為黃色螢光粉,該第二色光為黃光。The phosphor layer 5 covers the light-emitting unit 3 and is excited by the first color light to emit a second color light, the second color light being different from the first color light. The phosphor layer 5 includes a first layer portion 51 covering the light emitting unit 3, a second layer portion 52 extending downward from the periphery of the first layer portion 51 and surrounding the light emitting unit 3, and a The third layer portion 53 between the electrodes 32 of the light-emitting unit 3. The phosphor layer 5 is actually formed by mixing a phosphor powder in a permeable colloid, such as silicone or epoxy. The phosphor powder of the phosphor layer 5 of the present embodiment is a yellow phosphor powder, and the second color light is yellow light.

該封裝膠體6位於該紅粉膠層4及該螢光膠層5上,並且包覆該螢光膠層5及該發光單元3。該封裝膠體6為可透光材料製成,例如矽膠、環氧樹脂。The encapsulant 6 is disposed on the red powder layer 4 and the phosphor layer 5, and covers the phosphor layer 5 and the light emitting unit 3. The encapsulant 6 is made of a light transmissive material such as silicone or epoxy.

本實施例使用時,該發光單元3發出的第一色光(例如藍光)可激發該螢光膠層5發出該第二色光(例如黃光),而且由於該螢光膠層5包覆該發光單元3,使該發光單元3無論是向上或向側邊發出的光,都有部分光線可被該螢光膠層5吸收而激發出該第二色光,可達到良好的受激發光效果。而該紅粉膠層4能受到該第一色光與該第二色光的其中至少一個激發而發出紅光,也就是說,該紅粉膠層4發出紅光,可以是吸收該發光單元3之部分向下射出的第一色光而受激發光,也可以是吸收該第二色光而受激發光,且該紅粉膠層4吸收的第二色光,主要是來自於該螢光膠層5的第二層部52。其中,本實施例的第一色光與該第二色光可以混合形成白光,另外再透過該紅粉膠層4的紅光與該白光混合,可以提升光線演色性。最後光線會向上經由該封裝膠體6發射出。由於該紅粉膠層4沿著該基座2的承載面21而呈大面積披覆,其吸光範圍廣闊,進而具有良好的受激發光效果。而且該紅粉膠層4可利用塗布方式形成於該承載面21上,其製程簡單、易於進行。When the embodiment is used, the first color light (for example, blue light) emitted by the light emitting unit 3 can excite the fluorescent glue layer 5 to emit the second color light (for example, yellow light), and the fluorescent glue layer 5 covers the light. The light-emitting unit 3 causes the light-emitting unit 3 to absorb light from the phosphor layer 5 to excite the second color light regardless of whether the light is emitted upward or toward the side, thereby achieving a good excited light effect. The red powder layer 4 can be excited by at least one of the first color light and the second color light to emit red light, that is, the red powder layer 4 emits red light, which may be part of absorbing the light emitting unit 3. The first color light emitted downward is excited light, or the second color light is absorbed by the second color light, and the second color light absorbed by the red powder layer 4 is mainly from the first layer of the phosphor layer 5 The second floor portion 52. The first color light and the second color light of the embodiment can be mixed to form white light, and the red light transmitted through the red powder layer 4 is mixed with the white light to improve the color rendering of the light. Finally, the light will be emitted upward through the encapsulant 6. Since the red powder layer 4 is covered with a large area along the bearing surface 21 of the susceptor 2, it has a wide absorption range and thus has a good excitation light effect. Moreover, the red powder layer 4 can be formed on the bearing surface 21 by coating, and the process is simple and easy to carry out.

綜上所述,藉由該紅粉膠層4延伸披覆於該承載面21上,僅透過簡單的塗布製程即可完成,具有易於製作之優點,而且該紅粉膠層4為薄片狀結構,其整體皆受到該承載面21支撐承載,故層體結構穩固、強度佳。該紅粉膠層4可全方位地吸收第一色光與第二色光的其中至少一種,進而發出紅光,能提升光線的演色性,而且本新型能維持高亮度、高出光效率之優點。In summary, the red powder adhesive layer 4 is extended on the bearing surface 21, and can be completed only by a simple coating process, which has the advantages of being easy to manufacture, and the red powder adhesive layer 4 is a sheet-like structure. The whole body is supported by the bearing surface 21, so the layer structure is stable and the strength is good. The red powder layer 4 can absorb at least one of the first color light and the second color light in an all-round manner, thereby emitting red light, which can enhance the color rendering of the light, and the novel can maintain the advantages of high brightness and high light extraction efficiency.

參閱圖3,本新型發光二極體封裝結構之第二實施例,與該第一實施例大致相同,不同的地方在於:本實施例還包含一設置於該基座2的承載面21與該紅粉膠層4間的反射層7。該反射層7沿著該承載面21而延伸披覆。該反射層7可由具有良好光反射作用的材質製成,其材質例如金屬、金屬氧化物或白膠,且該反射層7可由單一層體或數層層體堆疊而成。該反射層7用於將該發光單元3發出的光朝出光方向反射,在本實施例中相當於將光線朝上反射,進而提升光利用率。Referring to FIG. 3, the second embodiment of the present invention is substantially the same as the first embodiment. The difference is that the embodiment further includes a bearing surface 21 disposed on the base 2 and the A reflective layer 7 between the red powder layers 4. The reflective layer 7 extends along the bearing surface 21 to extend. The reflective layer 7 can be made of a material having good light reflection, such as a metal, a metal oxide or a white glue, and the reflective layer 7 can be formed by stacking a single layer or a plurality of layers. The reflective layer 7 is used to reflect the light emitted by the light-emitting unit 3 in the light-emitting direction. In the present embodiment, the light is reflected upward, thereby improving the light utilization efficiency.

參閱圖4,本新型發光二極體封裝結構之第三實施例,與該第二實施例大致相同,不同的地方在於:本實施例的螢光膠層5延伸範圍更廣,該螢光膠層5更披覆於該紅粉膠層4上,該螢光膠層5還包括一連接於該第二層部52底部周緣且位於該紅粉膠層4頂面的第四層部54。藉由該第四層部54直接披覆於該紅粉膠層4上,使該第四層部54發出的第二色光可直接被該紅粉膠層4吸收,使該紅粉膠層4之受激發光效果良好,並且能發出紅光,有利於提升光線演色性。Referring to FIG. 4, the third embodiment of the novel LED package structure is substantially the same as the second embodiment. The difference is that the phosphor layer 5 of the embodiment has a wider extension range, and the phosphor paste is wider. The layer 5 is further coated on the red powder layer 4, and the phosphor layer 5 further includes a fourth layer portion 54 connected to the bottom periphery of the second layer portion 52 and located on the top surface of the red powder layer 4. The second layer portion 54 is directly coated on the red powder layer 4, so that the second color light emitted by the fourth layer portion 54 can be directly absorbed by the red powder layer 4, so that the red powder layer 4 is excited. The light effect is good, and it can emit red light, which is beneficial to improve the color rendering of light.

參閱圖5,本新型發光二極體封裝結構之第四實施例,與該第一實施例大致相同,不同的地方在於:本實施例的基座2材質為金屬材料,且該基座2上方具有一絕緣層8。而且本實施例包含一位於該基座2上方的外部電極30,該外部電極30實際上可分成兩部位,分別與該發光單元3的電極32接觸,且該兩部位再分別連接一導線301 ,以連接外部電路。而該絕緣層8設置於該基座2與該外部電極30之間。Referring to FIG. 5 , the fourth embodiment of the novel LED package structure is substantially the same as the first embodiment. The difference is that the susceptor 2 of the embodiment is made of a metal material and the pedestal 2 is above. There is an insulating layer 8. Moreover, the present embodiment includes an external electrode 30 located above the susceptor 2, and the external electrode 30 can be actually divided into two parts, respectively contacting the electrode 32 of the illuminating unit 3, and the two parts are respectively connected with a wire 301. To connect external circuits. The insulating layer 8 is disposed between the susceptor 2 and the external electrode 30.

惟以上所述者,僅為本新型之實施例而已,當不能以此限定本新型實施之範圍,即大凡依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。However, the above description is only for the embodiments of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent changes and modifications made by the present patent application scope and the contents of the patent specification are still It is within the scope of this new patent.

2‧‧‧基座2‧‧‧Base

21‧‧‧承載面21‧‧‧ bearing surface

3‧‧‧發光單元3‧‧‧Lighting unit

30‧‧‧外部電極30‧‧‧External electrode

31‧‧‧發光本體31‧‧‧Lighting body

32‧‧‧電極32‧‧‧ electrodes

4‧‧‧紅粉膠層4‧‧‧Red powder layer

5‧‧‧螢光膠層5‧‧‧Fluorescent rubber layer

51‧‧‧第一層部51‧‧‧First Department

52‧‧‧第二層部52‧‧‧Second floor

53‧‧‧第三層部53‧‧‧ Third Floor

6‧‧‧封裝膠體6‧‧‧Package colloid

Claims (10)

一種發光二極體封裝結構,包含:一基座,包括一承載面;一發光單元,設置在該承載面上,並能發出一第一色光;一紅粉膠層,沿著該承載面設置;及一螢光膠層,包覆該發光單元,並可受該第一色光激發而發出一第二色光;該紅粉膠層能受到該第一色光與該第二色光的其中至少一個激發而發出紅光。A light emitting diode package structure comprising: a base comprising a bearing surface; a light emitting unit disposed on the bearing surface and capable of emitting a first color light; a red powder layer disposed along the bearing surface And a phosphor layer covering the light emitting unit and being excited by the first color light to emit a second color light; the red powder adhesive layer being capable of receiving at least one of the first color light and the second color light Excite and emit red light. 如請求項1所述的發光二極體封裝結構,更包含一設置於該紅粉膠層與該承載面間的反射層。The light emitting diode package structure of claim 1, further comprising a reflective layer disposed between the red powder layer and the bearing surface. 如請求項2所述的發光二極體封裝結構,其中,該反射層材質為金屬、金屬氧化物或白膠。The light emitting diode package structure according to claim 2, wherein the reflective layer is made of metal, metal oxide or white glue. 如請求項2所述的發光二極體封裝結構,其中,該反射層係由一層以上之層體堆疊而成。The light emitting diode package structure according to claim 2, wherein the reflective layer is formed by stacking more than one layer. 如請求項2所述的發光二極體封裝結構,其中,該螢光膠層更披覆於該紅粉膠層上。The light emitting diode package structure of claim 2, wherein the phosphor layer is further coated on the red powder layer. 如請求項1所述的發光二極體封裝結構,其中,該基座材質為陶瓷材料。The light emitting diode package structure according to claim 1, wherein the base material is a ceramic material. 如請求項1所述的發光二極體封裝結構,其中,該基座材質為金屬材料,且該基座上方具有一絕緣層。The light emitting diode package structure of claim 1, wherein the base material is made of a metal material, and an insulating layer is disposed above the base. 如請求項7所述的發光二極體封裝結構,還包含一位於該基座上方的外部電極,而該絕緣層設置於該基座與 該外部電極之間。The LED package structure of claim 7, further comprising an external electrode above the pedestal, wherein the insulating layer is disposed on the pedestal Between the external electrodes. 如請求項1所述的發光二極體封裝結構,其中,該第一色光為藍光。The light emitting diode package structure of claim 1, wherein the first color light is blue light. 如請求項1所述的發光二極體封裝結構,更包含一設置於該承載面上且包覆該發光單元的封裝膠體。The light emitting diode package structure of claim 1, further comprising an encapsulant disposed on the carrying surface and covering the light emitting unit.
TW103218823U 2014-10-23 2014-10-23 LED package structure TWM496850U (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568029B (en) * 2015-03-20 2017-01-21 White LED manufacturing method
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12040436B2 (en) 2018-12-27 2024-07-16 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
TWI851637B (en) * 2018-12-27 2024-08-11 日商電化股份有限公司 Phosphor substrate, light-emitting substrate, and lighting device
US12068438B2 (en) 2018-12-27 2024-08-20 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12107196B2 (en) 2018-12-27 2024-10-01 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568029B (en) * 2015-03-20 2017-01-21 White LED manufacturing method
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12040436B2 (en) 2018-12-27 2024-07-16 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
TWI851637B (en) * 2018-12-27 2024-08-11 日商電化股份有限公司 Phosphor substrate, light-emitting substrate, and lighting device
US12068438B2 (en) 2018-12-27 2024-08-20 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12100788B2 (en) 2018-12-27 2024-09-24 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12107196B2 (en) 2018-12-27 2024-10-01 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device

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