TWM484145U - Touch panel - Google Patents
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- TWM484145U TWM484145U TW102224250U TW102224250U TWM484145U TW M484145 U TWM484145 U TW M484145U TW 102224250 U TW102224250 U TW 102224250U TW 102224250 U TW102224250 U TW 102224250U TW M484145 U TWM484145 U TW M484145U
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Abstract
Description
本創作乃是關於一種觸控技術,特別是指一種觸控面板。This creation is about a touch technology, especially a touch panel.
如圖1所示,是一種傳統的觸控面板結構示意圖。該觸控面板10包括垂直交錯設置的第一電極1和第二電極2。第一電極1和第二電極2的兩端通過導線3引出並彙聚到控制器4。外界導電物體對電極的觸摸會導致某些第一電極1和第二電極2上的電參數發生變化,電參數發生變化的電信號傳送到控制器4中,經過計算得到觸摸的位置,從而進一步實現觸控功能。可以理解,隨著觸控面板尺寸增大,導線3從一端彙聚到控制器4所經過的路徑也會變長,依據電阻定律R=ρL/S(ρ為導線3材料的電阻率、L為導線3的長度、S為導線3的截面面積),在ρ和S不變的情況下,導線3長度的增加會導致線阻變大,引起觸控信號的衰減。通常的解決方案,可以通過增加導線3的寬度以增大導線3的截面面積,進而平衡導線3變長下的線阻,進而改善觸控信號的衰減問題。但由於增加了導線3的寬度,後續將觸控面板應用於觸控顯示裝置時,為了避免導線3可視,觸控顯示裝置的邊框遮蔽區域(如常見觸控手 機的不可視區)亦將變寬,如此不能滿足窄邊框觸控顯示裝置的產品需求。As shown in FIG. 1 , it is a schematic diagram of a conventional touch panel structure. The touch panel 10 includes a first electrode 1 and a second electrode 2 that are vertically staggered. Both ends of the first electrode 1 and the second electrode 2 are taken out by the wires 3 and concentrated to the controller 4. The touch of the external conductive object on the electrode may cause some electrical parameters on the first electrode 1 and the second electrode 2 to change, and the electrical signal whose electrical parameter changes is transmitted to the controller 4, and the touched position is calculated, thereby further Implement touch function. It can be understood that as the size of the touch panel increases, the path through which the wires 3 converge from one end to the controller 4 also becomes longer, according to the resistance law R=ρL/S (ρ is the resistivity of the material of the wire 3, L is The length of the wire 3, S is the cross-sectional area of the wire 3), and in the case where ρ and S are constant, an increase in the length of the wire 3 causes the wire resistance to become large, causing attenuation of the touch signal. In the conventional solution, the width of the wire 3 can be increased to increase the cross-sectional area of the wire 3, thereby balancing the wire resistance of the wire 3, thereby improving the attenuation of the touch signal. However, since the width of the wire 3 is increased, when the touch panel is subsequently applied to the touch display device, in order to avoid the visible view of the wire 3, the frame of the touch display device is shielded (such as a common touch hand). The invisible area of the machine will also be widened, which will not meet the product requirements of the narrow-frame touch display device.
基於此,有必要提供一種減少觸控信號衰減的觸控面板及其製造方法,可在滿足窄邊框的產品需求下,仍能改善大面板的信號衰減問題。Based on this, it is necessary to provide a touch panel and a method for manufacturing the same that can reduce the attenuation of the touch signal, and can still improve the signal attenuation problem of the large panel while satisfying the demand of the narrow frame.
本創作實施例提供一種觸控面板,界定有感測區與位於所述感測區邊緣的線路區,其中所述觸控面板包括電極層、第一導線層、第二導線層及絕緣層。電極層位於感測區內。第一導線層位於線路區內且與電極層電性連接。第二導線層與第一導線層於線路區內電性連接。絕緣層於線路區內是設置在第一導線層與第二導線層之間並設有多個第一貫穿孔,第一導線層與第二導線層通過第一貫穿孔電性連接。The present invention provides a touch panel that defines a sensing area and a line area located at an edge of the sensing area, wherein the touch panel includes an electrode layer, a first wire layer, a second wire layer, and an insulating layer. The electrode layer is located within the sensing region. The first wire layer is located in the wiring region and is electrically connected to the electrode layer. The second wire layer and the first wire layer are electrically connected in the circuit region. The insulating layer is disposed between the first wire layer and the second wire layer in the circuit region and is provided with a plurality of first through holes, and the first wire layer and the second wire layer are electrically connected through the first through hole.
綜上所述,本創作實施例所提出之觸控面板,通過雙層的導線層設計,在不增加導線層的寬度下,變相加大電阻面積,進而平衡了電阻值,藉此在不增加觸控面板邊框遮蔽區域寬度下,同時改善大尺寸面板所產生的信號衰減的問題,使得觸控面板可以應用到尺寸較大的觸控產品中。In summary, the touch panel proposed in the present embodiment has a double-layered wire layer design, and the resistance area is increased in phase-variation without increasing the width of the wire layer, thereby balancing the resistance value, thereby not increasing The problem that the touch panel is shielded from the width of the area and the signal attenuation caused by the large-sized panel is improved, so that the touch panel can be applied to a larger touch product.
為使能更進一步瞭解本創作之特徵及技術內容,請參閱以下有關本創作之詳細說明與附圖,但是此等說明與所附圖式僅係用來說明本創作,而非對本創作的權利範圍作任何的限制。In order to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings of this creation, but these descriptions and drawings are only used to illustrate this creation, not the right to this creation. The scope is subject to any restrictions.
1‧‧‧第一電極1‧‧‧first electrode
2‧‧‧第二電極2‧‧‧second electrode
3‧‧‧兩端通過導線3‧‧‧ Both ends through the wire
4‧‧‧控制器4‧‧‧ Controller
10、100、200‧‧‧觸控面板10, 100, 200‧‧‧ touch panels
102、202‧‧‧感測區102, 202‧‧‧ Sensing area
104、204‧‧‧線路區104, 204‧‧‧ line area
110、210‧‧‧基板110, 210‧‧‧ substrate
120、220‧‧‧電極層120, 220‧‧‧ electrode layer
122‧‧‧第一方向電極單元122‧‧‧First direction electrode unit
124‧‧‧第二方向電極單元124‧‧‧second direction electrode unit
126‧‧‧連接線126‧‧‧Connecting line
130、230‧‧‧第一導線層130, 230‧‧‧ first wire layer
132、232‧‧‧第一導線132, 232‧‧‧ first wire
140、240‧‧‧絕緣層140, 240‧‧‧ insulation
142、242‧‧‧第一貫穿孔142, 242‧‧‧ first through hole
143‧‧‧第二貫穿孔143‧‧‧second through hole
150、250‧‧‧第二導線層150, 250‧‧‧ second wire layer
152、252‧‧‧第二導線152, 252‧‧‧ second conductor
154‧‧‧橋接線154‧‧‧Bridge wiring
S101~S106、S201~S206‧‧‧步驟S101~S106, S201~S206‧‧‧ steps
圖1為傳統的觸控面板結構示意圖。FIG. 1 is a schematic structural view of a conventional touch panel.
圖2為根據本創作一實施例的觸控面板的爆炸圖。2 is an exploded view of a touch panel in accordance with an embodiment of the present invention.
圖3為根據本創作另一實施例的觸控面板的爆炸圖。3 is an exploded view of a touch panel according to another embodiment of the present creation.
圖4為根據本創作又一實施例的觸控面板的爆炸圖。4 is an exploded view of a touch panel according to still another embodiment of the present invention.
圖5為根據本創作一實施例的觸控面板的製造方法流程圖。FIG. 5 is a flow chart of a method of manufacturing a touch panel according to an embodiment of the present invention.
圖6a~圖6c為圖5所示流程圖中於不同步驟之觸控面板的俯視圖。6a-6c are top views of the touch panel in different steps in the flow chart shown in FIG. 5.
圖6d是圖6c沿A-A’剖面線的剖視圖。Figure 6d is a cross-sectional view taken along line A-A' of Figure 6c.
圖7為根據本創作另一實施例的觸控面板的製造方法流程圖。FIG. 7 is a flow chart of a method of manufacturing a touch panel according to another embodiment of the present invention.
圖8a~圖8c為圖7所示流程圖中於不同步驟的觸控面板的俯視圖。8a-8c are top views of the touch panel in different steps in the flow chart shown in FIG. 7.
圖8d是圖8c沿B-B’剖面線的剖視圖。Figure 8d is a cross-sectional view taken along line B-B' of Figure 8c.
請參閱圖2,圖2為根據本創作一實施例的觸控面板的爆炸圖。觸控面板100界定有感測區102與位於感測區102邊緣的線路區104,觸控面板100包括電極層120、第一導線層130、絕緣層140以及第二導線層150。線路區104位置和數量可根據電極層120的具體結構和第一導線層130所包含的第一導線132的數目作調整,例如,線路區104可位於電極層120的一側或一側以上。電極層120位於感測區102內,第一導線層130位於線路區104內且與電極層120電性連接。第二導線層150與第一導線層130於線路區 104內電性連接。絕緣層140於線路區104內可設置在第一導線層130與第二導線層150之間,且在線路區104內的絕緣層140上設有多個第一貫穿孔142,而前述的第一導線層130與第二導線層150通過設於絕緣層140上的第一貫穿孔142彼此電性連接。Please refer to FIG. 2. FIG. 2 is an exploded view of a touch panel according to an embodiment of the present invention. The touch panel 100 defines a sensing area 102 and a line area 104 at an edge of the sensing area 102. The touch panel 100 includes an electrode layer 120, a first wire layer 130, an insulating layer 140, and a second wire layer 150. The position and number of the line regions 104 may be adjusted according to the specific structure of the electrode layer 120 and the number of the first wires 132 included in the first wire layer 130. For example, the line region 104 may be located on one side or more sides of the electrode layer 120. The electrode layer 120 is located in the sensing region 102 , and the first wire layer 130 is located in the circuit region 104 and electrically connected to the electrode layer 120 . The second wire layer 150 and the first wire layer 130 are in the line region 104 internal electrical connection. The insulating layer 140 may be disposed between the first wire layer 130 and the second wire layer 150 in the line region 104, and the plurality of first through holes 142 are disposed on the insulating layer 140 in the circuit region 104, and the foregoing The one wire layer 130 and the second wire layer 150 are electrically connected to each other through the first through holes 142 provided on the insulating layer 140.
在本實施例中,觸控面板100更包括基板110,第一導線層130與電極層120設置在基板100上,絕緣層140於感測區102內可設置在電極層120上,絕緣層140於線路區104內則可設置在第一導線層130上,其中設置在電極層120上的絕緣層140可用以保護電極層120。In this embodiment, the touch panel 100 further includes a substrate 110. The first wire layer 130 and the electrode layer 120 are disposed on the substrate 100. The insulating layer 140 may be disposed on the electrode layer 120 in the sensing region 102. The insulating layer 140 The wiring layer 104 may be disposed on the first wiring layer 130, and the insulating layer 140 disposed on the electrode layer 120 may be used to protect the electrode layer 120.
基板110可以是玻璃基板或者聚對苯二甲酸類塑膠(Polyethylene terephthalate,PET)等透明基板。基板110可為平面形狀、曲面形狀,或兩者之組合的形狀,進而適應不同的觸控產品需要。基板110還可為硬質基板或可擾式基板。The substrate 110 may be a glass substrate or a transparent substrate such as a polyethylene terephthalate (PET). The substrate 110 can be a planar shape, a curved shape, or a combination of the two, thereby adapting to different touch product needs. The substrate 110 can also be a rigid substrate or a disturbable substrate.
電極層120可以採用奈米銀絲(Silver Nano-Wire,SNW)層、碳奈米管(Carbon nanotube,CNT)層、石墨烯(Graphene)層、高分子導電(Conductive Polymer)層以及氧化金屬(ITO、AZO......Gel)層等。較特別地,當電極層120採用奈米銀絲等易被氧化的材料,設置於電極層120上的絕緣層140還隔絕部分空氣,提高電極層的抗氧化能力。The electrode layer 120 may be a Silver Nano-Wire (SNW) layer, a Carbon nanotube (CNT) layer, a Graphene layer, a Conductive Polymer layer, and an oxidized metal ( ITO, AZO...Gel) layers, etc. More specifically, when the electrode layer 120 is made of a material that is easily oxidized such as nanosilver, the insulating layer 140 disposed on the electrode layer 120 also isolates part of the air, thereby improving the oxidation resistance of the electrode layer.
第一導線層130包含多條第一導線132,第二導線層150包含多條分別與第一導線132對應的第二導線152。上述的第一貫穿孔142在絕緣層140上的位置與第一導線132及第二導線152的 位置相對應。The first wire layer 130 includes a plurality of first wires 132, and the second wire layer 150 includes a plurality of second wires 152 respectively corresponding to the first wires 132. The position of the first through hole 142 on the insulating layer 140 and the first wire 132 and the second wire 152 are The location corresponds.
第一導線層130與電極層120可採用相同的透明導電材料,例如第一導線層130和電極層120可以採用奈米銀絲(Silver Nano-Wire,SNW)、碳奈米管(Carbon nanotube,CNT)、石墨烯(Graphene)、高分子導電(Conductive Polymer)以及氧化金屬(ITO、AZO......Gel)等製成,因兩者採用相同的透明導電材料,因此兩者可同時形成,但視情況,亦可不同時形成,另外第一導線層130與電極層120亦可採用不同的導電材料,例如電極層120仍為上述的透明導電材料,但第一導線層130可採用鋁、銀、銅等金屬材料、鉬鋁鉬等合金材料、氧化銦錫等透明材料,或前述之組合,其中,優先地,第一導線層130採用金屬材料,金屬材料具有較佳的導電率。The first wire layer 130 and the electrode layer 120 may be made of the same transparent conductive material. For example, the first wire layer 130 and the electrode layer 120 may be a Silver Nano-Wire (SNW) or a carbon nanotube (Carbon nanotube). CNT), graphene (Graphene), polymer conductive (Conductive Polymer), and oxidized metal (ITO, AZO...Gel), etc., because both use the same transparent conductive material, so both can simultaneously The first wire layer 130 and the electrode layer 120 may also be made of different conductive materials. For example, the electrode layer 120 is still the above transparent conductive material, but the first wire layer 130 may be made of aluminum. A metal material such as silver or copper, an alloy material such as molybdenum aluminum molybdenum, or a transparent material such as indium tin oxide, or a combination thereof, wherein, preferentially, the first wire layer 130 is made of a metal material, and the metal material has a preferable electrical conductivity.
絕緣層140於線路區104內可設置在第一導線層130與第二導線層150之間,其上的第一貫穿孔142與第一導線132的位置對應,第一貫穿孔142的數量可根據第一導線132的長度確定,即,與較長的第一導線132對應的位置上可具有較多的第一貫穿孔142,與較短的第一導線132對應的位置上可具有較少的第一貫穿孔142,但其形成數量並不以此為限,可視不同設計而有不同的對應數量或位置。絕緣層140可為透明絕緣層,可以採用壓克力聚合物(Acrylate Polymer)和環氧樹脂(Epoxide Resin)等透明絕緣材料製成。在一個實施例中,絕緣層140於感測區102內可設置在電極層120上,更甚者,由於電極層120內部為間隔設置的電極單 元,因此電極單元之間存在空隙,而絕緣層140在此狀況下亦可填充於這些空隙而設置在基板110上。另,通過調整絕緣層140的折射率,可減少電極層120可能存在的可視問題,更詳細地說,根據電極層120材料的不同,絕緣層140可選用折射率大於電極層120折射率0.1的材料,或者選用折射率小於電極層120折射率0.1的材料。在另一實施例中,絕緣層140為不同折射率材料所構成的疊層結構,即可通過調節不同疊層材料的折射率,達到調節整體觸控電極結構光學外觀的目的。The insulating layer 140 may be disposed between the first conductive layer 130 and the second conductive layer 150 in the line region 104. The first through hole 142 on the first conductive layer 140 corresponds to the position of the first conductive line 132. The number of the first through holes 142 may be It is determined according to the length of the first wire 132, that is, there may be more first through holes 142 at positions corresponding to the longer first wires 132, and may have fewer positions corresponding to the shorter first wires 132. The first through hole 142, but the number of formation thereof is not limited thereto, and may have different corresponding numbers or positions depending on different designs. The insulating layer 140 may be a transparent insulating layer and may be made of a transparent insulating material such as Acrylate Polymer and Epoxide Resin. In one embodiment, the insulating layer 140 may be disposed on the electrode layer 120 in the sensing region 102, and moreover, because the electrode layer 120 is internally disposed at intervals Therefore, there is a gap between the electrode units, and the insulating layer 140 may be filled in the spaces to be disposed on the substrate 110 in this case. In addition, by adjusting the refractive index of the insulating layer 140, the visible problem that the electrode layer 120 may exist may be reduced. In more detail, depending on the material of the electrode layer 120, the insulating layer 140 may have a refractive index greater than 0.1 of the refractive index of the electrode layer 120. The material is either a material having a refractive index less than 0.1 of the refractive index of the electrode layer 120. In another embodiment, the insulating layer 140 is a laminated structure composed of different refractive index materials, that is, the optical appearance of the overall touch electrode structure can be adjusted by adjusting the refractive index of different laminated materials.
第二導線層150可採用鋁、銀、銅等金屬材料、鉬鋁鉬等合金材料、氧化銦錫等透明材料,或前述之組合,其中,優先地,第二導線層150採用金屬材料,金屬材料具有較佳的導電率。The second wire layer 150 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum, or a transparent material such as indium tin oxide, or a combination thereof, wherein, preferentially, the second wire layer 150 is made of a metal material or a metal. The material has a good electrical conductivity.
請參閱圖3,圖3為根據本創作另一實施例的觸控面板的爆炸圖。在此實施例中,電極層120包括間隔排列的第一方向電極單元122和第二方向電極單元124,以及連接相鄰第二方向電極單元124的連接線126,且第一方向電極單元122位於連接線126兩側。第一方向電極單元122沿第一方向排列,第二方向電極單元124沿第二方向排列,較佳地,第一方向和第二方向相互垂直。第二方向電極單元124由連接線126電性連接形成第二方向電極。Please refer to FIG. 3. FIG. 3 is an exploded view of a touch panel according to another embodiment of the present invention. In this embodiment, the electrode layer 120 includes a first direction electrode unit 122 and a second direction electrode unit 124 that are spaced apart, and a connection line 126 that connects the adjacent second direction electrode units 124, and the first direction electrode unit 122 is located. Both sides of the connecting line 126. The first direction electrode units 122 are arranged in the first direction, and the second direction electrode units 124 are arranged in the second direction. Preferably, the first direction and the second direction are perpendicular to each other. The second direction electrode unit 124 is electrically connected by the connection line 126 to form a second direction electrode.
相應地,在本實施例中,位於感測區104內的絕緣層140上設有多個第二貫穿孔143,且第二貫穿孔143裸露部分第一方向電極單元122。第二貫穿孔143與第一貫穿孔142可在同一步驟中形成。值得注意的是,對應於各第一方向電極單元122的第二貫穿 孔143的數量可不限定(如圖3中的單一個數,且其形狀亦可為方形等各種形狀)。同時,第二導線層150還包括複數橋接線154,橋接線154設置於位於感測區102內的絕緣層140上,且橋接線154通過第二貫穿孔143電性連接相鄰的第一方向電極單元122。通過橋接線154的連接,在第一方向上排列的間隔的第一方向電極單元122被連接起來形成第一方向電極。較佳地,第二導線152與橋接線154採用相同的導電材料並同時形成,但兩者亦可採用不同的材料。Correspondingly, in the embodiment, the insulating layer 140 located in the sensing region 104 is provided with a plurality of second through holes 143, and the second through holes 143 expose a portion of the first direction electrode units 122. The second through hole 143 and the first through hole 142 may be formed in the same step. It is worth noting that the second through-corresponding to each of the first-direction electrode units 122 The number of the holes 143 may not be limited (as in the case of a single number in FIG. 3, and the shape may be various shapes such as a square shape). At the same time, the second wire layer 150 further includes a plurality of bridge wires 154. The bridge wires 154 are disposed on the insulating layer 140 located in the sensing region 102, and the bridge wires 154 are electrically connected to the adjacent first direction through the second through holes 143. Electrode unit 122. By the connection of the bridge wires 154, the spaced first direction electrode units 122 arranged in the first direction are joined to form the first direction electrodes. Preferably, the second wire 152 and the bridge wire 154 are formed of the same conductive material and simultaneously formed, but the two may also be made of different materials.
除以上描述外,本實施例與前一實施例在其它元件的連接關係與材料使用、製造程式上大體相似,在此不再加以贅述。Except for the above description, the connection relationship between the present embodiment and the previous embodiment in the other components is substantially similar to the material use and manufacturing procedure, and will not be further described herein.
在其他實施例中,可再進一步利用觸控面板線路區的縱向空間,例如在線路區104內可以在第二導線層150上疊設形成第三導線層(圖未示),以進一步增強導線層傳輸信號的效果。In other embodiments, the longitudinal space of the touch panel line region can be further utilized. For example, a third wire layer (not shown) can be stacked on the second wire layer 150 in the line region 104 to further enhance the wire. The effect of the layer transmission signal.
另,在圖2和圖3的實施例中,觸控面板依序為基板110、第一導線層130、絕緣層140、第二導線層150,但各元件的堆疊結構不限於上述順序。請參閱圖4,圖4為根據本創作又一實施例的觸控面板的爆炸圖。如圖4所示,觸控面板200的第二導線層250於線路區204內是設置在基板210上;絕緣層240於感測區202內是設置在基板210上,絕緣層240於線路區204內是設置在第二導線層250上,且位於線路區204內的絕緣層240上設有多個第一貫穿孔242,第一貫穿孔242的位置與第二導線層250的位置相對應;電極層220和第一導線層230設置於絕緣層240上,且第一導線層230 與第二導線層250通過第一貫穿孔電性連接。電極層220亦可採用如圖3的雙軸向電極結構,或其它類型的電極結構,本領域具有通常知識者應不難理解,當電極層220採用如圖3的電極結構時,設置於基板210上的第二導線層250亦可包含複數位於感測區202內的橋接線,同時位於感測區202內的絕緣層240上亦可對應地設有多個第二貫穿孔。In addition, in the embodiment of FIG. 2 and FIG. 3, the touch panel is sequentially the substrate 110, the first wire layer 130, the insulating layer 140, and the second wire layer 150, but the stack structure of each element is not limited to the above sequence. Please refer to FIG. 4. FIG. 4 is an exploded view of a touch panel according to still another embodiment of the present invention. As shown in FIG. 4, the second wire layer 250 of the touch panel 200 is disposed on the substrate 210 in the circuit region 204. The insulating layer 240 is disposed on the substrate 210 in the sensing region 202, and the insulating layer 240 is disposed in the circuit region. The first through hole 242 is disposed on the insulating layer 240 in the circuit region 204. The position of the first through hole 242 corresponds to the position of the second wire layer 250. The electrode layer 220 and the first wire layer 230 are disposed on the insulating layer 240, and the first wire layer 230 The second wire layer 250 is electrically connected to the first through hole. The electrode layer 220 can also adopt the biaxial electrode structure as shown in FIG. 3 or other types of electrode structures. It should be understood by those skilled in the art that when the electrode layer 220 adopts the electrode structure of FIG. 3, it is disposed on the substrate. The second wire layer 250 on the 210 may also include a plurality of bridge wires in the sensing region 202, and a plurality of second through holes may be correspondingly disposed on the insulating layer 240 in the sensing region 202.
除以上描述外,本實施例與前述實施例在其它元件的連接關係與材料使用、製造程式上大體相似,在此不再加以贅述。Except for the above description, the connection relationship between the present embodiment and the foregoing embodiments in other components is substantially similar to the material usage and manufacturing procedure, and will not be further described herein.
另,本實用新型提供一種形成上述觸控面板的製造方法,包括以下步驟:形成電極層於感測區內;形成第一導線層於線路區內,且第一導線層與電極層電性連接;形成第二導線層,且第二導線層與第一導線層於線路區內電性連接;以及形成絕緣層,絕緣層於線路區內是設置在第一導線層與第二導線層之間並設有多個第一貫穿孔,第一導線層與第二導線層通過第一貫穿孔電性連接。In addition, the present invention provides a method for manufacturing the above touch panel, comprising the steps of: forming an electrode layer in the sensing region; forming a first wire layer in the circuit region, and electrically connecting the first wire layer and the electrode layer Forming a second wire layer, and the second wire layer is electrically connected to the first wire layer in the circuit region; and forming an insulating layer, the insulating layer is disposed between the first wire layer and the second wire layer in the circuit region And a plurality of first through holes, wherein the first wire layer and the second wire layer are electrically connected through the first through hole.
上述步驟可依據不同順序形成,更具體地,可採用以下方式形成上述實施例的觸控面板。The above steps may be formed in different orders, and more specifically, the touch panel of the above embodiment may be formed in the following manner.
請參閱圖5,圖5為根據本創作一實施例的觸控面板的製造方法流程圖。如圖5所示,所述方法包括如下步驟。Please refer to FIG. 5. FIG. 5 is a flow chart of a method for manufacturing a touch panel according to an embodiment of the present invention. As shown in FIG. 5, the method includes the following steps.
步驟S101:提供基板。基板110可以是玻璃基板或者聚對苯二甲酸類塑膠(Polyethylene terephthalate,PET)等透明基 板。基板110可為平面形狀、曲面形狀,或兩者之組合的形狀,進而適應不同的觸控產品需要。基板110還可為硬質基板或可擾式基板。Step S101: providing a substrate. The substrate 110 may be a transparent substrate such as a glass substrate or a polyethylene terephthalate (PET). board. The substrate 110 can be a planar shape, a curved shape, or a combination of the two, thereby adapting to different touch product needs. The substrate 110 can also be a rigid substrate or a disturbable substrate.
步驟S102:在基板上形成透明導電層。透明導電層可以採用奈米銀絲(Silver Nano-Wire,SNW)層、碳奈米管(Carbon nanotube,CNT)層、石墨烯(Graphene)層、高分子導電(Conductive Polymer)層以及氧化金屬(ITO、AZO......Gel)層等。形成透明導電層的方式可以採用印刷、沉積、濺射等工藝。Step S102: forming a transparent conductive layer on the substrate. The transparent conductive layer may be a silver nano-wire (SNW) layer, a carbon nanotube (CNT) layer, a graphene layer, a conductive polymer layer, and a metal oxide layer ( ITO, AZO...Gel) layers, etc. The manner of forming the transparent conductive layer may be a process such as printing, deposition, sputtering, or the like.
步驟S103:蝕刻透明導電層形成電極層和第一導線層。請參閱圖6a,第一導線層130與電極層120形成於基板110上,且第一導線層130位於線路區104內,電極層位於感測區102內。第一導線層130包含多條第一導線132,所述第一導線132分別與電極層120中的不同電極電性連接。在本實施例中,第一導線層130與電極層120採用相同的透明導電材料,且兩者同時形成,但視情況,亦可不同時形成,另外第一導線層130與電極層120亦可採用不同的導電材料,例如電極層120仍為上述的透明導電材料,但第一導線層130可採用鋁、銀、銅等金屬材料、鉬鋁鉬等合金材料、氧化銦錫等透明材料,或前述之組合,其中,優先地,第一導線層130採用金屬材料,金屬材料具有較佳的導電率。Step S103: etching the transparent conductive layer to form an electrode layer and a first wiring layer. Referring to FIG. 6 a , the first wire layer 130 and the electrode layer 120 are formed on the substrate 110 , and the first wire layer 130 is located in the line region 104 , and the electrode layer is located in the sensing region 102 . The first wire layer 130 includes a plurality of first wires 132 electrically connected to different electrodes in the electrode layer 120, respectively. In this embodiment, the first conductive layer 130 and the electrode layer 120 are formed of the same transparent conductive material, and both are formed at the same time, but may be formed at different times, and the first conductive layer 130 and the electrode layer 120 may also be used. Different conductive materials, for example, the electrode layer 120 is still the above transparent conductive material, but the first conductive layer 130 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum, a transparent material such as indium tin oxide, or the like. In combination, the first wire layer 130 is preferably made of a metal material having a preferred electrical conductivity.
步驟S104:在第一導線層上形成絕緣層。請參閱圖6b,絕緣層140形成於第一導線層130上。在本實施例中,絕緣層140同時形成於電極層120上,亦即絕緣層140於感測區102內是形 成於電極層120上,絕緣層於線路區104內是形成於第一導線層130上。絕緣層140可以採用壓克力聚合物(Acrylate Polymer)和環氧樹脂(Epoxide Resin)等透明絕緣材料製成。Step S104: forming an insulating layer on the first wire layer. Referring to FIG. 6b, an insulating layer 140 is formed on the first wiring layer 130. In the present embodiment, the insulating layer 140 is simultaneously formed on the electrode layer 120, that is, the insulating layer 140 is shaped in the sensing region 102. Formed on the electrode layer 120, an insulating layer is formed on the first wiring layer 130 in the wiring region 104. The insulating layer 140 may be made of a transparent insulating material such as Acrylate Polymer or Epoxide Resin.
步驟S105:在絕緣層上形成第一貫穿孔。絕緣層140上形成有第一貫穿孔142,且第一貫穿孔142的位置與第一導線132的位置相對應。在另一實施例中,可採用印刷工藝直接形成具第一貫穿孔142的絕緣層。請再參閱圖3,當電極層120採用如圖3的電極結構,即電極層120包括間隔排列的第一方向電極單元122和第二方向電極單元124,以及連接相鄰第二方向電極單元122的連接線126,且第一方向電極單元122位於連接線124兩側,此時,位於感測區102內的絕緣層140上還形成有多個第二貫穿孔143,且第二貫穿孔143裸露部分第一方向電極單元122。第一貫穿孔142和第二貫穿孔143可在同一步驟中形成。Step S105: forming a first through hole on the insulating layer. A first through hole 142 is formed in the insulating layer 140, and a position of the first through hole 142 corresponds to a position of the first wire 132. In another embodiment, the insulating layer having the first through holes 142 may be directly formed using a printing process. Referring to FIG. 3 again, when the electrode layer 120 adopts the electrode structure of FIG. 3, that is, the electrode layer 120 includes the first direction electrode unit 122 and the second direction electrode unit 124 which are arranged at intervals, and connects the adjacent second direction electrode unit 122. The connecting line 126 is disposed, and the first direction electrode unit 122 is located at two sides of the connecting line 124. At this time, the insulating layer 140 located in the sensing area 102 is further formed with a plurality of second through holes 143, and the second through holes 143 are formed. The exposed portion of the first direction electrode unit 122 is exposed. The first through hole 142 and the second through hole 143 may be formed in the same step.
步驟S106:在絕緣層上形成第二導線層,並使第二導線層通過第一貫穿孔與第一導線層電性連接。請參閱圖6c,在絕緣層140上與第一導線層130相應的位置形成第二導線層150。第二導線層150可採用鋁、銀、銅等金屬材料、鉬鋁鉬等合金材料、氧化銦錫等透明材料,或前述之組合。其中,優先地,第二導線層150採用金屬材料等導電率較好的材料。當電極層120採用如圖3的電極結構時,第二導線層150還包括複數橋接線154,橋接線154形成於位於感測區102內的絕緣層140上,且橋接線154通過第二貫穿孔143電性連接相鄰的第一方向電極單元122。Step S106: forming a second wire layer on the insulating layer, and electrically connecting the second wire layer to the first wire layer through the first through hole. Referring to FIG. 6c, a second wiring layer 150 is formed on the insulating layer 140 at a position corresponding to the first wiring layer 130. The second wire layer 150 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum or a transparent material such as indium tin oxide, or a combination thereof. Preferably, the second wire layer 150 is made of a material having a good electrical conductivity such as a metal material. When the electrode layer 120 adopts the electrode structure of FIG. 3, the second wire layer 150 further includes a plurality of bridge wires 154 formed on the insulating layer 140 located in the sensing region 102, and the bridge wires 154 pass through the second through The hole 143 is electrically connected to the adjacent first direction electrode unit 122.
請參閱圖6d,圖6d是圖6c中沿A-A’剖面線的剖視圖(即位於線路區104的堆迭結構)。絕緣層140覆蓋於第一導線層130及基板110上,第二導線層150通過開設於絕緣層140上的第一貫穿孔142與第一導線層130電性連接。Referring to Figure 6d, Figure 6d is a cross-sectional view taken along line A-A' of Figure 6c (i.e., the stacked structure at line region 104). The first conductive layer 140 is electrically connected to the first conductive layer 140 and the first conductive layer 140 . The second conductive layer 140 is electrically connected to the first conductive layer 140 .
在其他的實施例中,也可以先在基板上形成第二導線層,然後再依次形成絕緣層和第一導線層及電極層。In other embodiments, the second wire layer may be formed on the substrate, and then the insulating layer and the first wire layer and the electrode layer are sequentially formed.
請參閱圖7,圖7為根據本創作另一實施例的觸控面板的製造方法流程圖。如圖7所示,所述方法包括如下步驟。Please refer to FIG. 7. FIG. 7 is a flow chart of a method for manufacturing a touch panel according to another embodiment of the present invention. As shown in Figure 7, the method includes the following steps.
步驟S201:提供基板。基板210可以是玻璃基板或者聚對苯二甲酸類塑膠(Polyethylene terephthalate,PET)基板。Step S201: providing a substrate. The substrate 210 may be a glass substrate or a polyethylene terephthalate (PET) substrate.
步驟S202:在基板上形成第二導線層。請參閱圖8a,在基板210上形成第二導線層250於線路區104內。第二導線層250包括多條第二導線252。第二導線層250可採用鋁、銀、銅等金屬材料、鉬鋁鉬等合金材料、氧化銦錫等透明材料,或前述之組合。其中,優先地,第二導線層250採用金屬材料等導電率較好的材料。Step S202: forming a second wire layer on the substrate. Referring to FIG. 8a, a second wiring layer 250 is formed on the substrate 210 in the wiring region 104. The second wire layer 250 includes a plurality of second wires 252. The second wire layer 250 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum or a transparent material such as indium tin oxide, or a combination thereof. Preferably, the second wire layer 250 is made of a material having a good electrical conductivity such as a metal material.
步驟S203:在第二導線層上形成絕緣層。請參閱圖8b,在第二導線層250上覆蓋形成絕緣層240。在此步驟中,絕緣層240亦可延伸至感測區202而形成在基板210上,亦即絕緣層240於感測區202內是形成於基板210上,絕緣層240於線路區204內是形成於第二導線層250上。絕緣層240可以採用壓克力聚合物(Acrylate Polymer)和環氧樹脂(Epoxide Resin)等透明絕緣材料製成。Step S203: forming an insulating layer on the second wire layer. Referring to FIG. 8b, an insulating layer 240 is formed on the second wiring layer 250. In this step, the insulating layer 240 may also extend to the sensing region 202 to be formed on the substrate 210. That is, the insulating layer 240 is formed on the substrate 210 in the sensing region 202, and the insulating layer 240 is in the wiring region 204. Formed on the second wire layer 250. The insulating layer 240 may be made of a transparent insulating material such as Acrylate Polymer and Epoxide Resin.
步驟S204:在線路區的絕緣層上形成第一貫穿孔。位於線路區104的絕緣層240上形成有第一貫穿孔242,且第一貫穿孔242的位置與第二導線252的位置相對應。在另一實施例中,可採用印刷工藝直接形成具第一貫穿孔242的絕緣層。Step S204: forming a first through hole on the insulating layer of the line region. A first through hole 242 is formed in the insulating layer 240 of the wiring region 104, and the position of the first through hole 242 corresponds to the position of the second wire 252. In another embodiment, the insulating layer having the first through holes 242 may be directly formed using a printing process.
步驟S205:在感測區與線路區的絕緣層上形成透明導電層。透明導電層可以採用奈米銀絲(Silver Nano-Wire,SNW)層、碳奈米管(Carbon nanotube,CNT)層、石墨烯(Graphene)層、高分子導電(Conductive Polymer)層以及氧化金屬(ITO、AZO......Gel)層等。形成透明導電層的方式可以採用印刷、沉積、濺射等工藝。Step S205: forming a transparent conductive layer on the insulating layer of the sensing region and the wiring region. The transparent conductive layer may be a silver nano-wire (SNW) layer, a carbon nanotube (CNT) layer, a graphene layer, a conductive polymer layer, and a metal oxide layer ( ITO, AZO...Gel) layers, etc. The manner of forming the transparent conductive layer may be a process such as printing, deposition, sputtering, or the like.
步驟S206:蝕刻透明導電層形成電極層和第一導線層,並使第二導線層通過第一貫穿孔與第一導線層電性連接。請參閱圖8c,在位於感測區202內的絕緣層240上形成電極層220,在位於線路區204內的絕緣層240上形成第一導線層230。第一導線層230包含多條第一導線232,分別與電極層220中的不同電極電性連接。在本實施例中,第一導線層230與電極層220採用相同的透明導電材料同時形成,但視情況,亦可不同時形成,另外第一導線層230與電極層220亦可採用不同的導電材料,例如電極層220仍為上述的透明導電材料,但第一導線層230可採用鋁、銀、銅等金屬材料、鉬鋁鉬等合金材料、氧化銦錫等透明材料,或前述之組合,其中,優先地,第一導線層230採用金屬材料,金屬材料具有較佳的導電率。Step S206: etching the transparent conductive layer to form the electrode layer and the first wire layer, and electrically connecting the second wire layer to the first wire layer through the first through hole. Referring to FIG. 8c, an electrode layer 220 is formed on the insulating layer 240 located in the sensing region 202, and a first wiring layer 230 is formed on the insulating layer 240 located in the wiring region 204. The first wire layer 230 includes a plurality of first wires 232 electrically connected to different electrodes in the electrode layer 220. In this embodiment, the first conductive layer 230 and the electrode layer 220 are simultaneously formed by using the same transparent conductive material, but may be formed at different times, and the first conductive layer 230 and the electrode layer 220 may also be made of different conductive materials. For example, the electrode layer 220 is still the above transparent conductive material, but the first wire layer 230 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum, a transparent material such as indium tin oxide, or a combination thereof. Preferably, the first wire layer 230 is made of a metal material, and the metal material has a preferable electrical conductivity.
請參閱圖8d,圖8d是圖8c中沿B-B’剖面線的剖視圖(即位於線路區204的堆迭結構)。絕緣層240覆蓋於第二導線層250及基板210上,第一導線層230通過開設於絕緣層240上的第一貫穿孔242與第二導線層250電性連接。Referring to Figure 8d, Figure 8d is a cross-sectional view taken along line B-B' of Figure 8c (i.e., the stacked structure at line region 204). The first conductive layer 240 is electrically connected to the second conductive layer 240 and the second conductive layer 240 . The first conductive layer 240 is electrically connected to the second conductive layer 240 .
另,在本實施例中,本領域具有通常知識者應不難理解,當電極層220採用如圖3或圖4的電極結構時,第二導線層250亦需對應形成橋接線於步驟S202中,延伸至感測區202的絕緣層240亦可在步驟S204中對應形成第二貫穿孔。In addition, in the present embodiment, those skilled in the art should understand that when the electrode layer 220 adopts the electrode structure as shown in FIG. 3 or FIG. 4, the second wire layer 250 also needs to form a bridge wire in step S202. The insulating layer 240 extending to the sensing region 202 may also form a second through hole correspondingly in step S204.
依據上述各實施例,通過雙層的導線層設計,在不增加導線層的寬度下,變相加大導線面積,進而平衡了電阻值,藉此在不增加觸控面板邊框遮蔽區域寬度下,同時改善大尺寸面板所產生的信號衰減的問題,使得該觸控面板可以應用到尺寸較大的觸控產品中。According to the above embodiments, the double-layered wire layer design increases the wire area in a phase-changing manner without increasing the width of the wire layer, thereby balancing the resistance value, thereby not increasing the width of the shielding area of the touch panel frame. The problem of signal attenuation caused by large-sized panels is improved, so that the touch panel can be applied to a larger touch product.
以上所述實施例僅表達了本實用新型的幾種實施方式,其描述較為具體和詳細,但並不能因此而理解為對本實用新型專利範圍的限制。應當指出的是,對於本領域具有通常知識者來說,在不脫離本實用新型構思的前提下,還可以做出若干變形和改進,這些都屬於本實用新型的專利保護範圍。因此,本新型專利的保護範圍應以所附請求項為准。The above-mentioned embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of this new patent shall be subject to the attached request.
100‧‧‧觸控面板100‧‧‧ touch panel
102‧‧‧感測區102‧‧‧Sensing area
104‧‧‧線路區104‧‧‧Line area
110‧‧‧基板110‧‧‧Substrate
120‧‧‧電極層120‧‧‧electrode layer
130‧‧‧第一導線層130‧‧‧First wire layer
132‧‧‧第一導線132‧‧‧First wire
140‧‧‧絕緣層140‧‧‧Insulation
142‧‧‧第一貫穿孔142‧‧‧First through hole
150‧‧‧第二導線層150‧‧‧Second wire layer
152‧‧‧第二導線152‧‧‧second wire
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CN105446565A (en) * | 2015-11-13 | 2016-03-30 | 业成光电(深圳)有限公司 | Bezel region narrowing type touch panel and touch display apparatus |
TWI562036B (en) * | 2014-08-21 | 2016-12-11 | Tpk Touch Solutions Xiamen Inc | Touch panel |
TWI581146B (en) * | 2015-09-24 | 2017-05-01 | 恆顥科技股份有限公司 | Touch panel |
TWI623862B (en) * | 2014-08-29 | 2018-05-11 | 寶宸(廈門)光學科技有限公司 | Touch panel |
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CN106155403B (en) * | 2015-04-27 | 2023-05-02 | 安徽精卓光显技术有限责任公司 | Touch control element |
CN107229360B (en) * | 2016-03-23 | 2020-03-10 | 群创光电股份有限公司 | Touch panel, manufacturing method thereof and touch display device |
CN107340941A (en) * | 2017-06-28 | 2017-11-10 | 昆山国显光电有限公司 | A kind of capacitive touch screen and preparation method thereof |
CN110377179B (en) * | 2019-06-27 | 2023-07-14 | 云谷(固安)科技有限公司 | Touch panel, preparation method of touch panel and display device |
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TWI261718B (en) * | 2004-07-07 | 2006-09-11 | Au Optronics Corp | Method for manufacturing thin film transistors array panel |
CN101216642B (en) * | 2008-01-08 | 2011-04-06 | 京东方科技集团股份有限公司 | Flat-panel display lead wire structure |
TWM345294U (en) * | 2008-05-28 | 2008-11-21 | Young Fast Optoelectronics Co | Structure improvement of capacitive touch panel |
CN101661355A (en) * | 2008-08-25 | 2010-03-03 | 时纬科技股份有限公司 | Touch panel and manufacturing method thereof |
CN201327634Y (en) * | 2008-12-26 | 2009-10-14 | 宸阳光电科技(厦门)有限公司 | Baseplate capable of uniformly distributing arithmetic voltages on surface and high visible range resistance-type touch screen |
KR20110137550A (en) * | 2010-06-17 | 2011-12-23 | (주)플라웍스 | Transparent conductive stacked film and touch panel having the same |
CN103019423A (en) * | 2011-09-21 | 2013-04-03 | 宸鸿科技(厦门)有限公司 | Touch panel structure and manufacturing method thereof |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI562036B (en) * | 2014-08-21 | 2016-12-11 | Tpk Touch Solutions Xiamen Inc | Touch panel |
TWI623862B (en) * | 2014-08-29 | 2018-05-11 | 寶宸(廈門)光學科技有限公司 | Touch panel |
TWI581146B (en) * | 2015-09-24 | 2017-05-01 | 恆顥科技股份有限公司 | Touch panel |
CN105446565A (en) * | 2015-11-13 | 2016-03-30 | 业成光电(深圳)有限公司 | Bezel region narrowing type touch panel and touch display apparatus |
TWI567614B (en) * | 2015-11-13 | 2017-01-21 | Interface Optoelectronics (Shenzhen) Co Ltd | Border area narrowed touch panel and its touch display device |
CN105446565B (en) * | 2015-11-13 | 2018-03-06 | 业成光电(深圳)有限公司 | Rim area narrows formula contact panel and its touch control display apparatus |
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TWI626567B (en) | 2018-06-11 |
CN103902082A (en) | 2014-07-02 |
TW201426459A (en) | 2014-07-01 |
CN103902082B (en) | 2019-03-15 |
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