TWM473040U - Heat sink and circuit module using the same - Google Patents

Abstract

The present invention provides a heat sink, and the heat sink includes a first element disposing area and a second element disposing area. At least one first opening is formed between the first element disposing area and the second element disposing area. The first opening is used to block a heat transfer between the first element disposing area and the second element disposing area. A width of the first opening is less than or equal to 1.5 times the thickness of the heat sink. Various heat-resistant element disposing areas are separated by elongated openings in the present invention, thus lessening the heat conduction thereof. Therefore, an object that heat sources of various heat-resistant requirements can be heat-dissipated without increasing the area of the heat sink is realized and safety requirements are achieved, so as to reduce the area of the heat sink for minimizing material costs. Furthermore, one heat sink can be shared amongst element groups of various heat-resistant requirements, thereby the number of the heat sinks required is reduced as well as minimizing the layout space, and thus an object of simple manufacturing can be achieved.

Description

Heat sink and circuit module using the same

The present invention relates to the field of electronic components, and more particularly to a heat dissipation plate capable of satisfying the temperature resistance of components of the respective temperature-resistant range by the same heat dissipation plate, saving the heat dissipation plate area, reducing the material cost, and using the heat dissipation plate. Circuit module.

With the development of electronic product integration technology, a plurality of components are often integrated on a printed circuit board. The components that are required for temperature resistance are different in heat during operation. In order to meet the safety requirements, heat dissipation is generally adopted to set the heat dissipation plate.

Please refer to FIG. 1 , which is a schematic diagram of an embodiment of a heat dissipation plate in a prior art, in which respective temperature-resistant crystals are grouped on the same heat dissipation plate. For example, the temperature of the crystal 11 is relatively low at 90 ° C; the temperature of the crystal group (including the crystals 12 and 13) is relatively high at 110 ° C. Due to heat conduction, the temperature of the two crystal regions is equal when the device is operating. In order to meet the safety requirements, the overall heat sink temperature needs to be controlled within the temperature range of the lower temperature resistant crystal. In this embodiment, the temperature resistance range needs to be controlled within 90 °C. Since the temperature of the overall heat dissipation plate is required to be low in this way, a large area of the heat dissipation plate is required in a case where the wind flow rate is constant, thereby reducing the heat dissipation efficiency and increasing the cost of the heat dissipation material.

Another way to solve the heat dissipation is to lock the individual temperature-resistant crystals to different ones. On the heat sink. However, this method will increase the number of parts and increase the manufacturing cost. Moreover, due to the increase in the number of parts, manufacturing difficulty and error rate will increase; in addition, because the current product density is greatly improved, the Layout space is small, this method will occupy a lot of space and increase the difficulty of Layout design.

One object of the present invention is to provide a heat sink that enables the same heat sink to meet the temperature resistance requirements of components in different temperature ranges while saving heat sink area and material cost.

In order to achieve the above object, the present invention provides a heat dissipation plate including a first component placement area and a second component placement area, and at least one is disposed between the first component placement area and the second component placement area. a first opening for blocking heat conduction between the first component seating region and the second component seating region.

In an embodiment of the present creation, the first opening is a strip opening.

In an embodiment of the present invention, the width of the first opening is less than or equal to 1.5 times the thickness of the heat sink.

In an embodiment of the present invention, the temperature of the first component placement zone differs from the temperature of the second component placement zone by at least 5 °C.

In an embodiment of the present invention, the heat dissipation plate further includes a third component placement area adjacent to the second component placement area, and the third component placement zone and the first component placement zone are respectively located at the first component Two sides of the two component placement area.

In an embodiment of the present invention, at least a second opening is formed between the second component placement area and the third component placement area, the second opening is configured to block the second component placement area and the first Heat transfer between the three component placement areas.

In an embodiment of the present invention, the second opening is a strip opening.

In an embodiment of the present invention, the width of the second opening is less than or equal to 1.5 times the thickness of the heat sink.

Another object of the present invention is to provide a circuit module capable of enabling the same heat sink to meet the temperature resistance requirements of components in different temperature ranges while saving heat sink area and material cost.

In order to achieve the above object, the present invention provides a circuit module including a heat dissipation plate including a first component placement area and a second component placement area, wherein the first component placement area is provided with a first component. a second component is disposed on the second component placement area, and at least a first opening is disposed between the first component placement area and the second component placement zone, the first opening is configured to block the first component The second component is thermally conductive on the heat sink.

In an embodiment of the present invention, the heat dissipation plate further includes a third component placement area adjacent to the second component placement area, the third component placement area is provided with a third component, and the second component is disposed At least a second opening is formed between the region and the third component seating region for blocking heat conduction of the second component and the third component on the heat dissipation plate.

The advantage of this creation is that the heat-insulating components are separated by the elongated opening, so that the conduction heat disappears, so that it is possible to dissipate heat on a heat sink without increasing the heat sink area. The required heat source and the safety requirements are met, thereby saving the heat sink area and reducing the material cost; in addition, the component groups of different temperature resistance requirements can share a heat dissipation plate, thereby reducing the number of heat dissipation plates and thereby saving the layout space. Achieve easy manufacturing.

11, 12, 13‧‧‧ crystal

20‧‧‧heat plate

21‧‧‧First component placement area

22‧‧‧Second component placement area

23‧‧‧ Third component placement area

41‧‧‧ first component

42‧‧‧second component

43‧‧‧ third component

201‧‧‧First opening

202‧‧‧Second opening

D1, D2‧‧‧ distance

H0, H1‧‧‧ width

L1‧‧‧ length

Figure 1 is a schematic illustration of an embodiment of a heat sink in the prior art.

Figure 2 is a schematic view showing the structure of the first embodiment of the heat dissipation plate in the present creation.

Figure 3 is a schematic view showing the structure of a second embodiment of the heat dissipation plate in the present creation.

Figure 4 is a schematic structural view of a specific implementation of the circuit module in the present creation.

The specific embodiments of the heat dissipation plate and the circuit module using the heat dissipation plate provided by the present invention will be described in detail below with reference to the accompanying drawings.

First, a first embodiment of the heat dissipation plate of the present invention will be given with reference to the accompanying drawings.

Please refer to FIG. 2 , which is a schematic structural view of the heat dissipation plate 20 provided by the embodiment. The heat dissipation plate 20 is provided with a first component placement area 21 and a second component placement area 22 . The first component seating area 21 can be used to place a first temperature resistant component group, and at least one first temperature resistant component (not shown) can be placed. The second component seating area 22 can be used to place a second temperature resistant component set, and at least one second temperature resistant component (not shown) can be placed. Wherein, the temperature resistance range of the first temperature resistant component and the second temperature resistant component are different, and the temperature difference between the two is at least 5 °C. For example, the first temperature-resistant component has a temperature resistance range of 90 ° C, and the second temperature-resistant component has a temperature resistance range of 110 ° C. At least one first opening 201 is disposed between the first component seating area 21 and the second component seating area 22 for separating the respective component placement regions to function to block heat conduction.

The first opening 201 can be an elongated opening, and the width H1 is less than or equal to 1.5 times the thickness of the heat dissipation plate 20. The narrower the better, as far as the actual mold requirements are concerned, so as to separate the components. Open and play a role in blocking heat. A plurality of strip openings may be disposed between the two component placement regions according to the width of the heat dissipation plate 20, and to ensure the strength of the heat dissipation plate 20, the first opening The length L1 of 201 is smaller than the width H0 of the heat sink 20. For example, if the width H0 of the heat dissipation plate 20 is 30 mm, the length L1 of the first opening 201 does not exceed 25 mm, and a plurality of openings may be provided as needed.

By separating the temperature-receiving component placement areas by the elongated opening, the conduction heat disappears, so that heat sources with different temperature resistance requirements can be dissipated on one heat dissipation plate, especially for the use of the chip heat dissipation plate. Switching power supply. The components of the respective temperature-resistant components are grouped on the same heat dissipation plate, and the respective temperature-resistant component placement areas are separated by the elongated opening to achieve the purpose of different temperature and heat dissipation in the respective regions, thereby realizing each component. Independent heat dissipation to meet the different temperature requirements of individual components. In the case of a certain wind flow, it is possible to achieve different temperature-resistant safety requirements without increasing the heat sink area, thereby saving the heat sink area and reducing the material cost; in addition, the component groups for each temperature-resistant requirement can share a heat sink. Thereby reducing the number of heat sinks, thereby saving Layout space and achieving easy manufacturing.

Next, a second embodiment of the heat sink of the present invention will be given with reference to the accompanying drawings.

Please refer to FIG. 3 , which is a schematic structural diagram of a heat dissipation plate provided by this embodiment. Unlike the first embodiment, the heat dissipation plate 20 is further provided with at least one of the second component placement regions 22 . The adjacent third component seating area 23, and the third component seating zone 23 and the first component seating zone 21 are respectively located on opposite sides of the second component seating zone 22. The third component placement area 23 can be used to place a third temperature resistant component group, and at least one third temperature resistant component (not shown) can be placed; the temperature resistance of the third temperature resistant component and the second temperature resistant component The range is different, for example, at least 5 °C. At least a second opening 202 is defined between the third component seating area 23 and the second component seating area 22 for separating the second component seating zone 22 from the third component seating zone 23 to provide a barrier The role of heat conduction. The second opening 202 is also an elongated opening having a width equal to or less than the heat dissipation plate. 15 times the thickness of 20.

In this embodiment, the distance D1 from the second opening 202 to the second component seating area 22 is greater than the distance D2 from the third component seating area 23, thereby increasing the second component seating area 22. Cooling area.

When there are two different temperature zones on the same heat sink board, a row of strip-shaped openings may be used. When there are N different temperature zones, the N-1 row strip-shaped openings may be used. The position of the strip opening can be adjusted according to the temperature data to adjust the required heat sink area in each temperature zone.

Next, a specific implementation manner of the circuit module board of the present invention will be given with reference to the accompanying drawings.

Please refer to FIG. 4 , which is a schematic structural diagram of a circuit module provided by the embodiment. The circuit module includes a heat dissipation plate 20 , and the heat dissipation plate 20 includes a first component placement area (not shown). And a second component placement area (not shown), the first component placement area is provided with a first component 41, the second component placement area is provided with a second component 42, the first component placement area and the At least one first opening 201 is disposed between the second component seating area for blocking heat conduction of the first component 41 and the second component 42 on the heat dissipation plate 20. The temperature resistance range of the first element 41 and the second element 42 is different.

The first opening 201 may be an elongated opening having a width equal to or less than 1.5 times the thickness of the heat dissipation plate 20, and the narrower the better as far as the actual mold requirements are concerned, so that the first opening 201 is disposed on the heat dissipation plate 20. The individual components are separated to function as a heat block. A plurality of strip openings may be disposed between the two components according to the width of the heat dissipation plate 20. To ensure the strength of the heat dissipation plate 20, the length of the first opening 201 (refer to the vertical direction in the figure) is smaller than the heat dissipation plate. The width of 20 (refers to the measure of the vertical direction in the figure).

The heat dissipation plate 20 may further include a first layer adjacent to the second component placement area a third component placement area (not shown), the third component placement area is provided with a third component 43. In this embodiment, the second component 42 and the third component 43 have the same temperature resistance range. The heat dissipation plate 20 may not be provided with an opening. In other embodiments, if the temperature resistance range of the second component 42 and the third component 43 are different, the heat dissipation plate 20 between the two components may also be provided with at least one second opening (not shown) ) to block the heat conduction of the two on the heat sink 20. The second opening is also an elongated opening having a width equal to or less than 1.5 times the thickness of the heat dissipation plate 20.

By analogy, when there are N components with different temperature resistance ranges on the same heat sink, you can use N-1 strips to open the holes.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes without departing from the spirit and scope of the present invention. Retouching, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

20‧‧‧heat plate

21‧‧‧First component placement area

22‧‧‧Second component placement area

201‧‧‧First opening

H0, H1‧‧‧ width

L1‧‧‧ length

Claims (12)

a heat dissipating plate, comprising: a first component placement area and a second component placement area, wherein the first component placement area and the second component placement area are provided with at least one first opening, the first The opening serves to block heat conduction between the first component seating region and the second component seating region. The heat dissipation plate of claim 1, wherein the first opening is a strip opening. The heat dissipation plate of claim 2, wherein the width of the first opening is less than or equal to 1.5 times the thickness of the heat dissipation plate. The heat dissipation plate of claim 1, wherein a temperature of the first component seating region differs from a temperature of the second component placement region by at least 5 °C. The heat dissipation plate of claim 1, wherein the heat dissipation plate further includes a third component placement area adjacent to the second component placement area, and the third component placement area and the first component placement area are respectively located The two components are disposed on both sides of the zone. The heat dissipation plate of claim 5, wherein at least a second opening is provided between the second component seating area and the third component seating area, the second opening is configured to block the second component placement area Thermal conduction between the third component placement regions. The heat dissipation plate of claim 6, wherein the second opening is a strip opening. The heat dissipation plate of claim 7, wherein the width of the second opening is less than or equal to 1.5 times the thickness of the heat dissipation plate. A circuit module includes a heat dissipation plate including a first component placement area and a second component placement area, wherein the first component placement area is provided with a first element a second component is disposed on the second component placement area, wherein at least one first opening is disposed between the first component placement area and the second component placement area, the first opening is configured to block the first opening Thermal conduction of an element and the second element on the heat sink. The circuit module of claim 9, wherein the first opening is a strip opening. The circuit module of claim 10, wherein the width of the first opening is less than or equal to 1.5 times the thickness of the heat sink. The circuit module of claim 9, wherein the heat dissipation plate further comprises a third component placement area adjacent to the second component placement area, and the third component placement area is provided with a third component, the third component Between the two component placement area and the third component placement zone, at least one second opening is provided, the second opening is configured to block heat conduction of the second component and the third component on the heat dissipation plate.