M397595 五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種發光二極體結構，特別是指一種藉由一基 板、一板體、複數個發光晶片以及複數個封裝體之組合設計的發光二 極體結構，藉此使本創作之發光二極體結構可適用於各式發光裝置。 【先前技術】 由於發光二極體具有體積小、低耗電、使用壽命長、反應速率快 等特性，十分符合目前的環保政策，因此即有業者致力於研發與發光 二極體相關的電子產品，致使該發光二極體的應用領域，由手錶及計 算機等產品市場’逐漸擴大至照明器具、汽車、通訊產業、電腦、交 通號誌、顯示器等產品領域，導致發光二極體的需求也日漸增加，然 而在製造方面’傳統發光二極體結構的製造方式，不易滿足現今日漸 增加的使用需求量’其主要原因之一，在於傳統發光二極體的結構中， 會以切削刀具’在與發光晶片搭配的金屬板板面，銑出供發光晶片容 置的凹槽結構’之後再結合絕緣層並設置線路等工序，以形成傳統發 光二極體結構，但是該種結構於製造方面，卻不易使製造技術自動化， 且同一金屬板銑出的數凹槽，也會有凹槽槽面之表面平整度與一致性 不佳的情形發生。 有鑑於此，本創作人乃潛心研思、設計組製，其能提供一種具有 一基板、一板體、複數個發光晶片以及複數個封裝體之組合設計、且 無絕緣層之導熱設計的發光二極體結構，藉以提高其使用便利性，為 本創作所欲研創之創作動機者。 3 M397595 【新型内容】 本創作之主要目的，在於提供一種具有一基板、一板體、複數個 發光晶片以及複數個封裝體之組合設計'且無絕緣層之導熱設計的發 光二極體結構。 為達上述目的，本創作為一種發光二極體結構，其包括：一基板； -板體，其-端表面係與絲板之板面結合，並在該_上形成複數 個呈間隔設置的反肋，每-反射杯之侧雜形成斜邊反射面，且該 板體另端表面上係配設有線路；複數個發光晶片，分別無反射杯配 對設置並置人其中’而每-航晶片係電性連接至贿體另端表面上 之線路；錢複數觸裝體，每—封裝齡設置肢射杯巾且與發光 晶片結合。據此，本創作藉由將作為金屬材f的基板，搭配作為非金 属材質的板體實施，使該基板上不需設置絕緣層，以達到散熱快之功 效’進而降低熱阻、提升發光晶片之運作效率；再者，本創作藉由在 該板體上⑽彻賊出_具有斜邊反射面的反射杯，如此能使該 反射杯内之反射表面，較傳統金屬板上之凹槽槽面平紅具一致性， 也能延長刀具的使用壽命。 -特徵、特點和技術内容，請參閱 ’惟所附圖式僅提供參考與說明 為了能夠更進一步瞭解本創作之特徵 以下有關本創作之詳細說明與附圖， 用，非用以限制本創作。 【實施方式】 係為本創作發光二極體之第-實施例的剖面 本創作之第一實施例 晴參閱第1圖所示， 4 M397595 視圖。該發光二極體結構係包括有一基板l〇、一與該基板1〇結合的 板體20、複數個設置在該板體20上的發光晶片30以及複數個設置在 該板體20上且與該發光晶片30結合的封裝體4〇。 該板體20的一端表面21a係與該基板10之板面u結合，並在該 板體20上形成複數個呈間隔設置的反射杯22，每一反射杯22之側壁 係形成斜邊反射面23 ’且該板體20另端表面2ib上係配設有線路（圖 未示）。 母一發光晶片30係分別與該反射杯22配對設置並置入其中，而 每一發光晶片30係電性連接至該板體2〇另端表面21b上之線路。 每一封裝體40係設置於反射杯22中且與發光晶片3〇結合。 在上述實施例中，該基板10係為金屬材質，而該板體2〇係採以 非金屬材f實施’丨物魏賴麟板、歸射A件等。該板體2〇 的板厚D係在(Umm至lram之間，以獲得最佳實施效果。又在該板體 20之每-反射杯22的斜邊反射面23，係進一步設有一電鍵層，藉以 增加發光效率。 又，該發光晶片30係配設有第一導線31與第二導線32，該第一 導線31與第二導線32均延伸出反射杯22外，並電性連接於板體2〇 另端表面21b上之線路，並於該板體2〇之另端表面2化，且在每一反 射杯22的週緣係分別設置有一擋牆5Q ;而該反射杯22之斜邊反射面 23係與該擋牆50連接形成階級狀。 藉此’本創作透過將-基板10、一板體2〇、複數個發光晶片3〇 及複數個雜體40等峨娜，謂分開製造雜簡組化實施，以 5 利於自動化大量生絲f具在物_#f的板㈣切削加 工’也能延長刀具的使用壽命。 其次，在該板體20與基板10結合後，能使該反射杯泣之斜邊反 射面23較為平整’而該斜邊反射面23還能再進_步增設—電錄層（圖 未示），藉以增加發光效率；另-方面，由於該板體20與基板10之結 合係以壓合方式實施’且該板㈣上係配設有線路較傳統發光二極 體結構而言’本創作於該基錢上不需設置纟_，所以能達到散熱 快之功效’進崎低齡、提升發光晶片之運作效率。 再者，本創作透過在該板體20之另端表面21b設置擋牆5〇，能 在製造時，將溢出反射杯22的封裝體4〇分隔，並與該撞牆5〇固結成 密閉構造。 本創作之第二實施例 請參閱第2圖所示，係為本創作發光二極體之第二實施例的剖面 視圖。該圖中揭示出本創作之第二實施例與第-實施例的差異處，在 於該板體20上之擋牆5〇側壁係呈傾斜狀，因而使該反射杯22之斜邊 反射面23在與5亥擋牆5〇連接後，會形成漸次收傲的階級狀；而該發 光晶片30除了透過第一導線31與第二導線32來與該板體2〇上之線 路電性連接外’也能以覆晶技術(Flip-Chip)實施。 藉此’本創作之第二實施例的板體20，透過將該擋牆50之側壁 设计呈傾斜狀，再搭配該反射杯22之斜邊反射面23，能形成雙層反 射功效’以提升該發光晶片30的發亮效果。 以上所述僅為本創作之較佳可行實施例，非因此即侷限本創作之 M397595 專利範圍，舉凡運用本創作說明書及圖式内容所為之等效結構變化， 均理同包含於本創作之範圍内，合予陳明。 M397595 【圖式簡單說明】 第1圖係為本創作發光二極體之第一實施例的剖面視圖。 第2圖係為本創作發光二極體之第二實施例的剖面視圖。 【主要元件符號說明】 10 基板 11 板面 20 板體 21a、 21b表面 22 反射杯 23 斜邊反射面 30 發光晶片 31 第一導線 32 第二導線 40 封裝體 50 擋牆 D 板厚M397595 V. New Description: [New Technology Field] This creation is about a light-emitting diode structure, especially a combination design of a substrate, a plate, a plurality of light-emitting chips and a plurality of packages. The light-emitting diode structure, thereby making the light-emitting diode structure of the present invention applicable to various types of light-emitting devices. [Prior Art] Since the light-emitting diode has the characteristics of small size, low power consumption, long service life, and fast reaction rate, it is in line with the current environmental protection policy, so that the industry is committed to research and development of electronic products related to light-emitting diodes. The application field of the light-emitting diode has gradually expanded from the market for watches and computers to the lighting equipment, automotive, communication industry, computers, traffic signs, displays and other product fields, resulting in the growing demand for light-emitting diodes. Increased, however, in manufacturing, 'the traditional way of manufacturing LED structures is not easy to meet the increasing demand for today's use.' One of the main reasons is that in the structure of traditional light-emitting diodes, the cutting tools will be The metal plate surface of the light-emitting chip is matched with the groove structure for accommodating the light-emitting chip, and then the insulating layer is combined and the circuit is arranged to form a conventional light-emitting diode structure, but the structure is manufactured. It is not easy to automate the manufacturing technology, and the number of grooves milled by the same metal plate will also have the surface of the groove groove surface. Consistency of the whole situation and poor happen. In view of this, the present author is a research and design system, which can provide a combination of a substrate, a plate body, a plurality of light-emitting chips and a plurality of packages, and a heat-conducting design without an insulating layer. The structure of the diode is used to improve the convenience of its use, and it is the creative motive for the creative research. 3 M397595 [New Content] The main purpose of this creation is to provide a light-emitting diode structure having a substrate, a plate body, a plurality of light-emitting chips, and a combination design of a plurality of packages, and having a heat-conducting design without an insulating layer. In order to achieve the above object, the present invention is a light-emitting diode structure comprising: a substrate; a plate body whose end surface is combined with the plate surface of the wire plate, and a plurality of spaced apart spaces are formed on the plate In the opposite rib, the side of each of the reflective cups forms a beveled reflecting surface, and the other end surface of the plate is provided with a line; a plurality of light emitting chips are respectively arranged without a reflecting cup and placed in each of them. It is electrically connected to the line on the other end surface of the bribe; the plurality of touch bodies are provided with a limb cup towel and a combination with the illuminating wafer. Accordingly, the present invention is implemented by using a substrate as a metal material f as a non-metallic material, so that an insulating layer is not required on the substrate to achieve a fast heat dissipation function, thereby reducing thermal resistance and improving the light-emitting chip. In addition, the creation of the present invention enables the reflective surface in the reflective cup to be more reflective than the groove on the conventional metal plate by means of a thief on the plate (10). The flat red color is consistent and can extend the life of the tool. - Features, Features and Technical Contents, please refer to the 'Details' for reference only and for illustrative purposes. In order to provide a better understanding of the features of this creation, the following detailed description and drawings of the present invention are used to limit the creation. [Embodiment] A section of the first embodiment of the present invention is a first embodiment of the present invention. Referring to Fig. 1, a view of 4 M397595 is shown. The LED structure includes a substrate 10, a board 20 coupled to the substrate 1 , a plurality of illuminating wafers 30 disposed on the board 20, and a plurality of boards 20 disposed on the board 20 and The light-emitting chip 30 is bonded to the package 4A. One end surface 21a of the plate body 20 is combined with the plate surface u of the substrate 10, and a plurality of reflective cups 22 are formed on the plate body 20, and the side walls of each of the reflective cups 22 form a beveled reflecting surface. 23' and the other end surface 2ib of the plate body 20 is provided with a line (not shown). The mother-emitting light-emitting chips 30 are respectively disposed in pair with the reflective cup 22 and placed therein, and each of the light-emitting chips 30 is electrically connected to the line on the other end surface 21b of the plate body 2. Each package 40 is disposed in the reflective cup 22 and bonded to the light-emitting wafer 3A. In the above embodiment, the substrate 10 is made of a metal material, and the plate body 2 is made of a non-metal material f. The plate thickness D of the plate body 2 is between (Umm to lram for best implementation effect). Further, in each of the plate body 20, the beveled reflection surface 23 of the reflector cup 22 is further provided with an electric key layer. In addition, the illuminating chip 30 is provided with a first wire 31 and a second wire 32. The first wire 31 and the second wire 32 both extend out of the reflector cup 22 and are electrically connected to the board. The line on the other end surface 21b of the body 2 is formed on the other end surface of the plate body 2, and a retaining wall 5Q is respectively disposed on the periphery of each of the reflecting cups 22; and the oblique side of the reflecting cup 22 is provided The reflecting surface 23 is connected to the retaining wall 50 to form a step shape. Thus, the present invention is manufactured separately by using the substrate 10, a plate body 2, a plurality of light-emitting wafers 3, and a plurality of miscellaneous bodies 40. The implementation of the heterogeneous grouping, in order to facilitate the automation of a large number of raw materials, and the cutting of the plate (4) of the object _#f can also extend the service life of the tool. Secondly, after the plate body 20 is combined with the substrate 10, the reflection can be made. The beveled beveling surface 23 of the cup weep is relatively flat' and the beveled reflecting surface 23 can be further added to the _step recording layer ( (not shown), in order to increase the luminous efficiency; on the other hand, since the combination of the plate body 20 and the substrate 10 is carried out by pressing, and the board (four) is provided with a line than the conventional light-emitting diode structure. This creation does not need to be set up on the base money, so it can achieve the effect of fast heat dissipation. 'Imported to the younger age and improve the operational efficiency of the light-emitting chip. Moreover, the present invention sets the block on the other end surface 21b of the plate body 20. When the wall is 5 inches, the package 4 of the overflow reflector cup 22 can be separated at the time of manufacture, and the structure can be consolidated with the collision wall 5 。. The second embodiment of the present invention is shown in FIG. A cross-sectional view of a second embodiment of the light-emitting diode is created. The difference between the second embodiment of the present invention and the first embodiment is disclosed in that the side wall of the retaining wall 5 on the plate body 20 is inclined. Thus, the beveled reflecting surface 23 of the reflecting cup 22 is connected to the 5H barrier wall 5, and forms a progressively arrogant class shape; and the illuminating wafer 30 passes through the first wire 31 and the second wire 32. It can be electrically connected to the line on the board 2 The Flip-Chip is implemented by the Flip-Chip. The plate body 20 of the second embodiment of the present invention is designed such that the side wall of the retaining wall 50 is inclined, and then the oblique reflecting surface 23 of the reflecting cup 22 is matched. The double-layer reflection effect can be formed to enhance the brightening effect of the light-emitting chip 30. The above description is only a preferred embodiment of the present invention, and thus does not limit the scope of the M397595 patent of the present creation, and the use of the present specification and drawings The equivalent structural changes of the content are included in the scope of this creation and are combined with Chen Ming. M397595 [Simple description of the diagram] Figure 1 is a section of the first embodiment of the luminous diode. Fig. 2 is a cross-sectional view showing a second embodiment of the present light-emitting diode. [Main component symbol description] 10 Substrate 11 Board surface 20 Board body 21a, 21b surface 22 Reflecting cup 23 Beveled reflecting surface 30 Illuminated wafer 31 First wire 32 Second wire 40 Package 50 Retaining wall D Thickness