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TWM386486U - Soldering type copper-aluminum heat dissipation device - Google Patents

Soldering type copper-aluminum heat dissipation device

Info

Publication number
TWM386486U
TWM386486U TW98221532U TW98221532U TWM386486U TW M386486 U TWM386486 U TW M386486U TW 98221532 U TW98221532 U TW 98221532U TW 98221532 U TW98221532 U TW 98221532U TW M386486 U TWM386486 U TW M386486U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation device
aluminum heat
type copper
soldering type
Prior art date
Application number
TW98221532U
Other languages
Chinese (zh)
Inventor
Bo-Yong Zeng
Original Assignee
Bo-Yong Zeng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bo-Yong Zeng filed Critical Bo-Yong Zeng
Priority to TW98221532U priority Critical patent/TWM386486U/en
Publication of TWM386486U publication Critical patent/TWM386486U/en

Links

TW98221532U 2006-11-06 2006-11-06 Soldering type copper-aluminum heat dissipation device TWM386486U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98221532U TWM386486U (en) 2006-11-06 2006-11-06 Soldering type copper-aluminum heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98221532U TWM386486U (en) 2006-11-06 2006-11-06 Soldering type copper-aluminum heat dissipation device

Publications (1)

Publication Number Publication Date
TWM386486U true TWM386486U (en) 2010-08-11

Family

ID=50603229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98221532U TWM386486U (en) 2006-11-06 2006-11-06 Soldering type copper-aluminum heat dissipation device

Country Status (1)

Country Link
TW (1) TWM386486U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707116B (en) * 2019-08-19 2020-10-11 大陸商深圳市研派科技有限公司 Liquid cooling device
US11391520B2 (en) 2019-08-13 2022-07-19 Shenzhen APALTEK Co., Ltd. Liquid cooling device with water tank structure
TWI790540B (en) * 2020-12-07 2023-01-21 黃崇賢 Multi-channel high-efficiency heat dissipation water cooling radiator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11391520B2 (en) 2019-08-13 2022-07-19 Shenzhen APALTEK Co., Ltd. Liquid cooling device with water tank structure
TWI707116B (en) * 2019-08-19 2020-10-11 大陸商深圳市研派科技有限公司 Liquid cooling device
TWI790540B (en) * 2020-12-07 2023-01-21 黃崇賢 Multi-channel high-efficiency heat dissipation water cooling radiator

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees