M377694 五、新型說明： 【新型所屬之技術領域】 本新型是有關於一種光電元件，特別是指一種發光二 極體封裝結構。 【先前技術】 參閱圖1，以往的一種發光二極體封裝結構1包含一導 線架11、一連接該導線架11的外殼12、一安裝於該外殼 12内並位於該導線架U上的發光二極體晶片13 (led Die )，及一容置於該外殼12内並包覆該發光二極體晶片13的 膠體14，其中，§亥導線· 11包括一供該發光二極體晶片 13設置的表面m，而該外殼12包括一呈斜面的内壁面 121，前述結構中的該外殼12，因為覆蓋該導線架u表面 111的面積小，導致該導線架u與該外殼12間的一接合面 15的剖面距離較短，故水氣易由外界環境經該接合面15進 入到該膠體14與表面111之間，進而影響該膠體14與該導 線架11及外设12之間的密合度，故如何提供一種可以提高 該膠體14雄合度的發光二極體封裝結構丨，為相關產業發 展重點之一。 【新型内容】 因此，本新型之目的，即在提供一種可以提高密合度 與發光效果的發光二極體封裝結構。 於疋本新型發光二極體封裝結構，包含一發光二極 體晶片、一導線架及一外殼，該導線架包括一供該發光二 極體晶片設置的表面，該外殼連接於該導線架，包括一封 3 該内壁面昊有一連接 閉圍繞該發光二極體晶片的内壁 該導線架表面的底緣、一頂緣，及一介於該底、頂緣間的 腰線其中，該底緣圍繞出的面積，j、於垓腰線圍繞出的面 積，該腰線圍繞出的面積小於該頂緣圍繞出的面積，另外 ’該内壁面在該腰線與底緣間的部份為一曲面。 本新型之功效在於：利用該外殼内壁面的该底緣圍繞 出的面積小於s亥腰線圍繞出的面積，及该腰線與底緣間的 部份為一曲面，可增加該外殼覆蓋導線架的面積以延長水 氣由外界環境進入的路徑，達到提高密合度，並藉該曲面 使更多光線得以反射向外，且由於反射光行徑络徑較長， 而得以與一填入該外殼的膠體内螢光粉充分作用，使色座 標分佈更加集中。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合麥考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 參閱圖2與圖3，本新型發光二極體封裝结構之一較隹 實施例包含一導線架2、一外殼3、一發光二極體晶片4與 一膠體5。 該導線架2包括一供該發光二極體晶片4設置的表面 21 ’在本實施例中’該導線架2是#銅材質製成，而該發 光一極體晶片4是利用打線接合（wire bonding)酌方式電性 連結於該導線架2的表面21上，另外，該發光二極體晶片 4還可利用覆晶（flip-chip)方式電性連結於讓導線架2上。 該外殼3連接於該導線架2,為增進光線反射的材質製 成。在本實施例中，該外殼3是由白色塑膠材質製成，以 便達到增進光線反射的目的，且㈣埋人射出成型（i_t Molding)的方式與該導線架2連接。該外殼3包括一與該導 線架2連接的基部31，及—由該基部31延伸的反射杯32 ，其中，該基部31與該導線架2之間有一接合面311，該 反射杯32具有一封閉圍繞該發光二極體晶片4的内壁面 321，如此該膠體5可填入該外殼3内並包覆該發光二極體 晶片4»該内壁面321具有一連接該導線架2表面21的底 緣 322 (bottom edge)、一頂緣 323 (t〇p edge)，及一介於 該底、頂緣322、323間的腰線324,其中，該底緣322可 以在s亥表面21上圍繞出的一面積，如圖3所示，同理，該 腰線324可以在該表面21上某一高度圍繞出的一面積，該 頂緣323可以在該表面21上另一高度圍繞出的一面積如 此本新型發光二極體封裝結構之該底緣322圍繞出的面積 是小於該腰線324圍繞出的面積，該腰線324圍繞出的面 積是小於該頂緣323圍繞出的面積。 另外，該内壁面321在該腰線324與底緣322間的部 份為一内凹的曲面325，該内壁面321在該腰線324與頂緣 323間的邛份為一斜面326，且由於該腰線圍繞出的面 積j於該頂緣323圍繞出的面積，因此該斜面326使入射 光易經該斜面326反射出去，在本較佳實施例中，該曲面 325的曲率半徑為500微米的曲面，而該斜面315形成的 夾角0為50 ，值付說明的是，該曲面325的曲率半徑介 於300〜700微米時，及該斜面326形成的失角Θ介於25。 ~75時，可達到本新型的目的。 該膠體5為一含有螢光粉（Phosphor)的樹脂，例如，含 有纪铭石彳田石（YAG，的樹脂，可以吸收該發光 二極體晶片4發射出的藍光後轉發出黃光。 <密合度測試> 利用該導線架2與外殼3組合成的一空支架進行密合 度測試，先將該空支架以15(rc烘烤去除水氣二小時，放置 降溫一小時，之後，將測試用墨水點入空支架的内壁面321 中，靜置數小時並持續觀察墨水是否由該導線架2與外殼3 間的接合面3 11溢出，其靜置一至四小時的測試結果如下表 可知本新型藉由該曲面314有效降低滲漏比例，而如圖 置時間 滲漏比例 一小時 二小時 三小時 四小時 習知結構 98.3% 100% 100% 100% 本新型結構 8.7% 21.9% 38.2% 52.1% 的 烤去除水氣一小時後放置降溫，將膠體5點入該外殼 内壁面321巾’模擬有膠體5的封裝狀況，依序以將該膝 體5烘烤固化、再以15(rc烘烤三小時，靜置降溫後，利用 向溫迴焊爐烘烤三次，用以模擬老化的狀況，最後置入測 試墨^中高溫煮讳測試，觀察墨水是否會由接合面311滲1 該外殼3 β ’測試結果習知結構的不良率為⑽，而本新 型結構不良率為〇% 。 <光學效果> 由該發光二極體晶片4發射出的光線經該膠體5入射 於該曲面325,並藉該曲面325向外出射，因該外殼3的曲 面325呈内凹狀，相較於習知結構的斜面，提高了入射光 經該曲面325可反射出去的角度範圍，如此，可以讓一部 份原本無法反射出去的光線變成可以，進而提高了發光強 度約1~2% ，本較佳實施例約可提高1 6%的發光強度。 參閱圖4與圖5,是統計2000顆的分佈圖，上述藉由 該曲面325增加反射出去的光線，因為在該膠體5内所行 進的光徑較長，讓該發光二極體晶片4的藍光光線較有機 會與該膠體5内的螢光粉作用，進而產生黃光以與藍光混 和呈現白光，因此，藉由黃光光強度增加，能使習知設計 原本偏於藍光的色座標分佈，如圖5所示，改善為更加集 中的色座標分佈，如圖6所示。 參閱圖6與圖7，本較佳實施例藉由該曲面325可提升 出光刀佈的一半光強之角度（half-intensity angle )，如圖6 所示，沿本新型發光二極體封裝結構一長軸方向的半光強 角度為119° ’與習知結構的半光強角度115。增加了 4。，另 外’沿一短軸的半光強角度則比習知結構丨12。增加4。為 116 ，如圖7所示，故本較佳實施例可滿足加寬角度的需求 〇 值得一提的是，該曲面325也可呈外凸狀，一樣可藉 由邊底緣322圍繞出的面積小於該腰線324圍繞出的面積 ，同樣可達到提高密合度的功效，以外，該内壁面321在 舌亥腰線3 24與頂续q ^ pq & /v丨 貝緣323間的部份也可為多段斜面連接而成 。（圖皆未示） 綜上所述，利用該曲面325增加該外殼3包覆該導線 架2的面積，進而延長水氣由外界環境進入的路徑，避免 該外殼3與該導線羊2間的7匕名v , 〒米木z間的水軋進入，以增加該膠體5與 該導線架2及外殼3之間的密合度，χ，藉由該曲面奶 的曲面設計，使得該發光二極體晶片4向外出光的發光強 又^力12% ，並糟由增加光線於該膠體5中光徑長，有效 =善色座標的分佈，及改善出光分佈的半光強角度，故確 實能達成本新型之目的。 准以上所述者，僅為本新型之較佳實施例而已，當不 月b以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一剖視示意圖，說明以往的一種發光二極體封 裝結構； 圖2是一剖視示意圖’說明本新型發光二極體封裝結 構的一較佳實施例； 圖3是一俯視示意圖，說明本新型發光二極體封裝結 構的一較佳實施例； 圖4是一圖表，說明以往一種發光二極體封襄結構的 色座標分佈； M377694 圖5是一圖表，說明本較佳實施例的色座標分佈； 圖6是一圖表，說明本較佳實施例的一出光分佈圖； 圖7是一圖表，說明本較佳實施例的一出光分佈圖。 M377694 【主要元件符號說明】 2…… …·導線架 323… •…頂緣 21 •.… •…表面 324… •…腰線 3 •… …·外殼 325… —曲面 31 •…. …·基部 326… —斜面 311… •…接合面 4 ....... •…發光二極體晶片 32…· •…反射杯 5 ....... •…膠體 321… —内壁面 Θ … •…夾角 322… …底緣M377694 V. New description: [New technical field] The present invention relates to a photoelectric element, in particular to a light emitting diode package structure. [Previous Art] Referring to FIG. 1 , a conventional LED package structure 1 includes a lead frame 11 , a housing 12 connected to the lead frame 11 , and a light-emitting device mounted in the housing 12 and located on the lead frame U. a diode die 13 (LED Die), and a colloid 14 housed in the outer casing 12 and covering the light emitting diode chip 13, wherein the wiring 11 includes a light emitting diode chip 13 a surface m is provided, and the outer casing 12 includes a beveled inner wall surface 121. The outer casing 12 of the foregoing structure has a small area covering the surface 111 of the lead frame u, resulting in a gap between the lead frame u and the outer casing 12. The cross-sectional distance of the joint surface 15 is short, so that moisture is easily entered by the external environment between the colloid 14 and the surface 111 through the joint surface 15, thereby affecting the tightness between the colloid 14 and the lead frame 11 and the peripheral 12 The degree of integration, so how to provide a light-emitting diode package structure that can improve the maleness of the colloid 14 is one of the key developments of related industries. [New content] Therefore, the object of the present invention is to provide a light-emitting diode package structure which can improve the adhesion and the light-emitting effect. The novel light emitting diode package structure comprises a light emitting diode chip, a lead frame and a casing, the lead frame comprising a surface provided for the LED chip, the casing being connected to the lead frame, The inner wall surface includes a bottom edge of the lead frame surface connected to the inner wall of the light emitting diode chip, a top edge, and a waist line between the bottom and the top edge, wherein the bottom edge surrounds The area of the exit, the area around the waistline, the area around the waistline is smaller than the area surrounded by the top edge, and the portion of the inner wall surface between the waistline and the bottom edge is a curved surface. . The effect of the novel is that the area surrounded by the bottom edge of the inner wall surface of the outer casing is smaller than the area surrounded by the waist line, and the portion between the waist line and the bottom edge is a curved surface, which can increase the outer casing covering the wire. The area of the frame is extended to extend the path of moisture from the external environment, and the adhesion is increased, and the curved surface is used to reflect more light, and the reflected light path length is long, and the outer casing can be filled into the outer casing. The phosphor in the gel body fully acts to make the color coordinate distribution more concentrated. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be apparent from the following detailed description of a preferred embodiment of the invention. Referring to FIG. 2 and FIG. 3, one of the novel light emitting diode package structures includes a lead frame 2, a case 3, a light emitting diode chip 4 and a colloid 5. The lead frame 2 includes a surface 21 ′ for the light-emitting diode wafer 4. In the present embodiment, the lead frame 2 is made of a copper material, and the light-emitting one-pole wafer 4 is bonded by a wire. The bonding diode is electrically connected to the surface 21 of the lead frame 2, and the LED chip 4 can be electrically connected to the lead frame 2 by a flip-chip method. The outer casing 3 is connected to the lead frame 2 and is made of a material for enhancing light reflection. In the present embodiment, the outer casing 3 is made of a white plastic material for the purpose of enhancing light reflection, and (iv) is connected to the lead frame 2 in a manner of i_t Molding. The housing 3 includes a base portion 31 connected to the lead frame 2, and a reflective cup 32 extending from the base portion 31. The base portion 31 and the lead frame 2 have an engaging surface 311. The reflective cup 32 has a The inner wall surface 321 of the light-emitting diode wafer 4 is closed, so that the glue 5 can be filled into the outer casing 3 and enclose the light-emitting diode wafer 4». The inner wall surface 321 has a surface 21 connecting the lead frame 2. a bottom edge 322, a top edge 323 (t〇p edge), and a waist line 324 between the bottom and top edges 322, 323, wherein the bottom edge 322 can surround the s-surface 21 An area is shown in FIG. 3. Similarly, the waist line 324 can be surrounded by an area on the surface 21, and the top edge 323 can be surrounded by another height on the surface 21. The area of the bottom edge 322 of the novel LED package structure is smaller than the area surrounded by the waist line 324. The area surrounded by the waist line 324 is smaller than the area surrounded by the top edge 323. In addition, a portion of the inner wall surface 321 between the waist line 324 and the bottom edge 322 is a concave curved surface 325, and the inner wall surface 321 is a slope 326 between the waist line 324 and the top edge 323. Because the area j around the waistline is around the area of the top edge 323, the slope 326 allows incident light to be reflected through the slope 326. In the preferred embodiment, the radius 525 has a radius of curvature of 500. The curved surface of the micrometer has an angle 0 of 50. The value of the curved surface 325 is between 300 and 700 micrometers, and the angle Θ formed by the inclined surface 326 is 25. At ~75 hours, the purpose of the novel can be achieved. The colloid 5 is a resin containing phosphor powder, for example, a resin containing a yam stone (YAG), which can absorb the blue light emitted from the light-emitting diode wafer 4 and then forward the yellow light. The test of the degree of adhesion is carried out by using an empty bracket formed by the combination of the lead frame 2 and the outer casing 3, and the empty support is firstly cooled by 15 (rc baking to remove water vapor for two hours, and then the test ink is placed. Point into the inner wall surface 321 of the empty bracket, let stand for several hours and continue to observe whether the ink overflows from the joint surface 31 between the lead frame 2 and the outer casing 3, and the test result of standing for one to four hours is as follows. From the curved surface 314, the leakage ratio is effectively reduced, and the leakage time ratio is one hour, two hours, three hours, four hours, and the known structure is 98.3% 100% 100% 100%. The new structure is 8.7% 21.9% 38.2% 52.1% roasted. After removing the water vapor for one hour, the temperature is lowered, and the colloid 5 is put into the inner wall surface of the outer casing 321 to simulate the encapsulation condition of the colloid 5, and the knee body 5 is baked and solidified in order, and then baked at 15 (rc for three hours). After standing and cooling down, It is baked three times in a warm reflow oven to simulate the aging condition. Finally, the test ink is placed in the high temperature boiling test to observe whether the ink will seep from the joint surface 311. The outer shell 3 β 'test result is known. The defect rate is (10), and the novel structure defect rate is 〇%. <Optical effect> The light emitted from the LED chip 4 is incident on the curved surface 325 through the colloid 5, and is outwardly exited by the curved surface 325. Because the curved surface 325 of the outer casing 3 is concave, compared with the inclined surface of the conventional structure, the angle range of incident light that can be reflected by the curved surface 325 is increased, so that a part can not be reflected. The light becomes achievable, thereby increasing the luminous intensity by about 1 to 2%, and the preferred embodiment can increase the luminous intensity by about 6%. Referring to Fig. 4 and Fig. 5, it is a distribution map of 2000, which is obtained by the surface. 325 increases the reflected light, because the light path traveled in the colloid 5 is long, so that the blue light of the LED chip 4 has a chance to interact with the phosphor in the colloid 5, thereby generating yellow light. White light is mixed with blue light, Thus, by increasing the intensity of the yellow light, the conventionally designed color coordinate distribution which is originally biased to blue light, as shown in FIG. 5, is improved to a more concentrated color coordinate distribution, as shown in FIG. 6. Referring to FIG. 6 and FIG. In the preferred embodiment, the curved surface 325 can raise a half-intensity angle of the optical knife cloth, as shown in FIG. 6, a semi-light along a long axis direction of the novel light emitting diode package structure. The strong angle is 119°' and the half-light intensity angle 115 of the conventional structure is increased by 4. In addition, the 'half-intensity angle along a short axis is higher than the conventional structure 丨12. Increase by 4. 116, as shown in FIG. 7, the preferred embodiment can satisfy the requirement of widening the angle. It is worth mentioning that the curved surface 325 can also be convex, and can be surrounded by the bottom edge 322. The area is smaller than the area surrounded by the waist line 324, and the effect of improving the adhesion is also achieved. In addition, the inner wall surface 321 is at the portion between the tongue line 3 24 and the top end q ^ pq & /v丨 edge 323 The parts can also be connected by a plurality of bevels. In the above description, the curved surface 325 is used to increase the area of the outer casing 3 covering the lead frame 2, thereby prolonging the path of water vapor entering from the external environment, and avoiding the outer casing 3 and the wire sheep 2 7匕名v, the water rolling between the glutinous rice woodz enters to increase the adhesion between the colloid 5 and the lead frame 2 and the outer casing 3, and the curved surface design of the curved milk makes the light emitting diode The light emission of the body wafer 4 to the outside is 12%, and the light path length is increased by increasing the light in the colloid 5. The effective distribution of the color coordinates and the half-light intensity of the light distribution are improved. Achieve the purpose of this new type. The above-mentioned ones are only the preferred embodiments of the present invention, and the short-term b is limited to the scope of the present invention, that is, the simple equivalent change made by the novel patent application scope and the new description content. Modifications are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a conventional light emitting diode package structure; FIG. 2 is a cross-sectional view showing a preferred embodiment of the novel light emitting diode package structure; 3 is a top plan view illustrating a preferred embodiment of the novel light emitting diode package structure; FIG. 4 is a diagram illustrating a color coordinate distribution of a conventional light emitting diode package structure; M377694 FIG. 5 is a diagram. The color coordinate distribution of the preferred embodiment is illustrated; FIG. 6 is a diagram illustrating a light distribution profile of the preferred embodiment; and FIG. 7 is a diagram illustrating a light distribution profile of the preferred embodiment. M377694 [Description of main component symbols] 2...... ...· lead frame 323... •... top edge 21 •.... •...surface 324... •...waist line 3 •...·shell 325... —surface 31 •....·base 326... —Bevel 311...•...Joint surface 4............•...Light-emitting diode wafer 32...·•...Reflection cup 5.....................Colloid 321...-Inner wall surface ... •...angle 322... bottom edge