TWI835697B - Capillary structure and heat dissipation device thereof - Google Patents

Abstract

A capillary structure and a heat dissipation device thereof are disclosed. The capillary structure is applied to a two-phase fluid heat dissipation device. The capillary structure has a main body having an internal closed space. The main body has a top layer formed with multiple passages in communication with the closed space of the main body. Multiple column bodies are disposed in the closed space. The column bodies and the passages are staggered from each other. The heat dissipation device has an internal airtight chamber. A working fluid is filled in the airtight chamber. The capillary structure is disposed in the airtight chamber. The capillary structure provides respective bypass paths for the vapor working fluid and the liquid working fluid. Accordingly, the liquid working fluid and the vapor working fluid in the capillary structure will not interfere with each other or be interrupted by each other.

Description

Capillary structure and its heat dissipation device

The present invention relates to a capillary structure and its heat dissipation device, and in particular to a capillary structure and its heat dissipation device that can provide working fluids in two states of vapor and liquid to have independent circulation paths without blocking or interfering with each other.

In recent years, with the rapid development of electronic equipment, the corresponding chip technology has also been booming. When the computing speed is required to be faster, if the local high temperature and the heat generated by the chip cannot be dissipated effectively and quickly, the chip will produce accumulated heat. When heat cannot be removed, the performance and service life of the chip will be greatly affected. In order to quickly relieve heat, it is a widely used technology in the industry to conduct heat conduction and heat exchange by using a two-phase change heat dissipation device. Common two-phase flow heat dissipation devices include vapor chambers, heat pipes, loop heat pipes, etc., and it is known that in order to be used with high-heating heat sources, the vapor chamber must increase the water content or water accumulation of the capillary structure in the evaporation area to avoid Insufficient water content in the capillary structure causes dry burning in the evaporation area. Therefore, practitioners use thicker capillary structures or multi-layered capillary structures to increase the water content of the capillary structure in the evaporation area within the vapor chamber. However, When a thicker or multi-layered capillary structure is used for two-phase flow heat exchange, the vapor generated by the evaporated working fluid and the liquid working fluid that refluxes after condensation often travel through the same circulation path or channel. Interfering with or blocking each other and being blocked in the pores in the capillary structure, the vapor cannot diffuse smoothly to the condensation area, and the condensed working fluid cannot flow back to the evaporation area, thus causing the vapor-liquid cycle of the two-phase flow to stop. Choose a thicker Or, although the multi-layered capillary structure can increase the water content, it will cause the vapor and reflux liquid in the capillary structure to crowd out or interfere with each other, resulting in blocked paths or missing channels.

Therefore, how to avoid the cyclic conflicting influence of the phase change of the working fluid between the gas phase and the liquid phase, and provide independent diffusion and return paths for the vapor and liquid that do not interfere with each other, so as to prevent the vapor and liquid phase working fluids in the capillary structure from interacting with each other. Interference and blocking are the primary improvement goals.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a capillary structure that can separate gas and liquid working fluids to prevent the two from interfering with each other and causing mutual exclusion and obstruction, and to use the capillary structure. cooling device.

In order to achieve the above object, the present invention provides a capillary structure, which includes: a body; the body has at least one closed space inside; the body has a top layer; the top layer is provided with a plurality of channels; the channels penetrate the top layer and are connected to the capillary structure. The aforementioned closed space is connected so that the enclosed space and the external space of the body can be connected to each other. A plurality of columns are provided in the closed space. These columns are disposed in a staggered manner with the aforementioned channels, and the two ends of the columns are respectively connected to the The upper and lower surfaces of an enclosed space.

In order to achieve the above object, the present invention provides a heat dissipation device, which has: a heat dissipation device main body and a capillary structure; the interior of the heat dissipation device main body has an airtight chamber, and the airtight chamber is filled with a working fluid, so The main body of the heat dissipation device has a condensation surface and an evaporation surface respectively relative to the inner surface of the airtight chamber. The capillary structure is disposed on the evaporation surface. A two-phase flow cycle is formed between the top layer of the body and the condensation surface. space, the top layer is not in contact with the condensation surface, and the closed space in the body is connected to the two-phase flow circulation space through the channels, and the channels provide the working flow after evaporation and vaporization After the body is converted into a gaseous state, it can quickly diffuse into the two-phase flow circulation space without being interfered and hindered by the liquid working fluid, and the condensed working fluid can be converted into a liquid state and can quickly flow back to the heating area through the body and the aforementioned column for circulation again. , the capillary structure system of the present invention can provide two-phase working fluids of gas and liquid to separate and have independent diffusion and return paths during gas-liquid circulation, so that the two will not hinder or interfere with each other, significantly The two-phase flow circulation efficiency of the heat dissipation device is improved.

1: Ontology

1a:Part 1

1aa: Groove

1ab: open side

1ac: closed side

1b:Part 2

11:Enclosed space

111:Top level

112: Bottom surface

12A:Top layer

12B: Bottom floor

121:Channel

13: Cylinder

2: Main body of cooling device

2a: First plate body

2b: The second plate body

21: Airtight chamber

22:Condensation surface

23: Evaporation surface

3: Working fluid

31: Gaseous working fluid

32: Liquid working fluid

H: Two-phase flow circulation space

Figure 1 is a combined cross-sectional view of the capillary structure of the present invention; Figure 2 is a top view of the capillary structure of the present invention; Figure 3 is a schematic diagram of the capillary structure of the present invention; Figure 4 is a cross-sectional view of the heat dissipation device of the present invention;

The above objects and structural and functional characteristics of the present invention will be explained based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 and 2, which are combined cross-sections and top views of the capillary structure of the present invention. As shown in the figures, the capillary structure has: a body 1; the body 1 is a cubic structure formed by powder sintering. , the body 1 has at least one closed space 11 (or divided into multiple spaces) inside, and the body 1 has a top layer 12A and a bottom layer 12B. The top layer 12A is provided with a plurality of passages 121 that pass through it. These passages 121 and The closed spaces 11 are connected. The upper and lower sides of the closed space 11 have a top side 111 and a bottom side 112 respectively. A plurality of columns 13 (either powder sintered columns or copper columns) are provided in the closed space 11. These columns The two ends of 13 are respectively connected to the top side 111 and the bottom side 112 of the closed space 11 and are arranged upright in the closed space 11 and are arranged in a staggered manner with the aforementioned channel 121 .

Please refer to Figure 3. The body 1 can be divided into a first part 1a and a second part 1b. The thickness of the first part 1a is less than or equal to the second part 1b. The thickness of the first part 1a and the second part 1b is The part 1b can be the same or different types of capillary structures. In this embodiment, the thickness of the first part 1a is thinner than that of the second part 1b. In addition, the first part 1a has at least one groove 1aa, and the groove 1aa has an open side 1ab and a closed side 1ac, and a plurality of columns 13 are arranged on the closed side 1ac or from the closed side of the groove 1aa. Formed by the upward extension of 1ac. The aforementioned channels 121 simultaneously penetrate the upper and lower sides of the second part 1b, and the second part 1b is covered above the first part 1a. The channels 121 are offset from the columns 13, and the second part 1b is disposed in an offset manner. The part 1b and the first part 1a are combined into one body through sintering, so that the second part 1b closes the open side 1ab of the groove 1aa of the first part 1a, thereby forming the closed space 11 inside the body 1 .

Please refer to Figure 4, which is a three-dimensional assembled cross-sectional view of the heat dissipation device of the present invention. As shown in the figure, the heat dissipation device of the present invention has: a heat dissipation device main body 2 and a capillary structure body 1; this embodiment uses the aforementioned capillary structure. body 1, so the detailed structure of the capillary structure will not be described in detail here. Please refer to the foregoing illustrative embodiments and illustrations.

The heat dissipation device of this embodiment is illustrated with a uniform temperature plate, but is not limited thereto. The heat dissipation device main body 2 is composed of a first plate body 2a and a second plate body 2b covering each other. An airtight chamber 21 is formed in the internal space covered by the two and filled with a working fluid 3. The first plate body 2a and the second plate body 2b respectively have a condensation surface relative to the inner surface of the airtight chamber 21. 22 and an evaporation surface 23, the capillary structure body 1 is only disposed on the surface of the evaporation surface 23, and a two-phase flow circulation space H is formed between the top layer 12A of the capillary structure body 1 and the condensation surface 22, Moreover, the top layer 12A of the capillary structure body 1 does not contact the aforementioned condensation surface 22 .

The capillary structure body 1 passes through the plurality of channels 121 on the top layer 12A to connect the closed space 11 with the two-phase flow circulation space H. When the working fluid 3 evaporates and vaporizes in the capillary structure body 1 After that, the evaporated gaseous working fluid 31 quickly diffuses into the closed space 11 and quickly flows from the closed space 11 to the two-phase flow through the channels 121 that connect the closed space 11 and the two-phase flow circulation space H. The flow circulation space H is diffused without being hindered or blocked by the liquid working fluid 32 .

And after the evaporated and vaporized working fluid 3 is condensed on the condensation surface 22, the working fluid 3 drops by gravity onto the top layer 12A of the body 1 of the capillary structure. After being absorbed by the top layer 12A, the working fluid 3 is quickly guided back by the columns 13. The vapor-liquid circulation is carried out again with the evaporation surface 23. In this way, the gaseous working fluid 31 and the liquid working fluid 32 each have a diffusion and return circulation path, thereby improving the diffusion path of the liquid phase in the conventional capillary structure that excludes and blocks the gas phase. The missing one.

1: Ontology

11:Enclosed space

111:Top level

112: Bottom surface

12A:Top layer

12B: Bottom floor

121:Channel

13: Cylinder

Claims (8)

A capillary structure has: a body with at least one closed space inside; the body has a top layer and is provided with a plurality of channels, which pass through the top layer and are connected with the closed space of the body; a plurality of cylinders, located in In the aforementioned enclosed space, it is disposed in a misaligned manner with the aforementioned passage. The capillary structure of claim 1, wherein the body has a first part and a second part, the first part has at least one groove, the groove has an open side and a closed side, and the cylinders The channels are formed by extending upward from the closed side of the groove. The channels pass through the upper and lower sides of the second part. The first part and the second part are sintered into one body and close the groove of the first part. The open side forms the aforementioned closed space, and the first and second parts are sintered into one body to form the aforementioned body. The capillary structure as claimed in claim 1, wherein the closed space has a top side and a bottom side, and the two ends of the columns are respectively connected to the top side and the bottom side of the closed space. The capillary structure of claim 2, wherein the thickness of the first part is thinner than that of the second part. The capillary structure as claimed in claim 2, wherein the first part and the second part may be the same or different types of capillary structures. A heat dissipation device with a capillary structure as claimed in claim 1, which has: a heat dissipation device main body, which has an airtight chamber inside and is filled with a working fluid; the heat dissipation device body has an inner surface relative to the airtight chamber. A condensation surface and an evaporation surface. The capillary structure is provided on the surface of the evaporation surface. The top layer is not in contact with the condensation surface. contact, and a two-phase flow circulation space is formed between the two, and the closed space and the two-phase flow circulation space are connected through the passages. The heat dissipation device of claim 6, wherein the body has a first part and a second part, the first part has at least one groove, the groove has an open side and a closed side, and the column systems Disposed on the closed side, the channels pass through the upper and lower sides of the second part, and the first part and the second part are integrated through sintering. The heat dissipation device of claim 7, wherein the first part and the second part may be the same or different types of capillary structures.

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