TWI830291B - Circuit board with embedded capacitance and manufacturing method thereof - Google Patents

Abstract

The application proposes a manufacturing method of a circuit board with embedded capacitance, which includes the following steps: providing a substrate, the substrate includes a substrate body and a body to be removed, the body to be removed is arranged on one side of the substrate body, and the body to be removed includes an inner surface and an outer surface relatively arranged. A circuit structure is arranged on the substrate body. The circuit structure includes a structure body and a plurality of conductive electrodes, which are relatively spaced on one side of the structure body. The structure body is penetrated with a plurality of openings, the body to be removed passes through the openings, the conductive electrodes are arranged on the inner and outer surfaces, and the body to be removed is removed to form a dielectric space to obtain a circuit board with embedded capacitance. The capacitance includes two conducting electrodes arranged at relative intervals and a dielectric space between the two conducting electrodes arranged at relative intervals. In addition, the application also provides a circuit board with embedded capacitance.

Description

Circuit board with built-in capacitor and manufacturing method thereof

The present application relates to the field of circuit boards, and in particular to a circuit board with built-in capacitors and a manufacturing method thereof.

Embedding passive components (such as resistors, capacitors, etc.) inside the printed circuit board can not only reduce the area and weight of the printed circuit board, but also improve the reliability of electronic products.

Generally, the way to embed capacitors in printed circuit boards is to embed conventional discrete capacitors into the substrate of the printed circuit board to achieve miniaturization of passive devices. Its structure is similar to that of parallel plate capacitors. The side is a metal layer, and the middle is a dielectric layer with high dielectric constant (DK) and low dielectric loss.

However, in the entire circuit board, not all areas require a high dielectric constant (DK) and low dielectric loss dielectric layer. Using this dielectric layer material on the entire board will not only cause a waste of resources, but is also not conducive to printing. The thickness of the circuit board is reduced.

In order to solve the problems in the background technology, the present application also provides a method for manufacturing a circuit board with embedded capacitors.

In addition, this application also provides a circuit board with built-in capacitors.

A method of manufacturing a circuit board with embedded capacitors, including the steps of: providing a substrate, the substrate includes a substrate body and a body to be removed, the body to be removed is provided on one side of the substrate body, the body to be removed The removal body includes an inner surface and an outer surface arranged oppositely; a circuit structure is provided on the substrate body, the circuit structure includes a structural body and a plurality of conductive electrodes, and a plurality of the conductive electrodes are relatively spaced apart from the structural body. On one side, the structural body is provided with a plurality of openings, the object to be removed passes through the openings, and the conductive electrode is provided on the inner surface and the outer surface; and remove the to-be-removed object The body is formed to form a dielectric space to obtain the circuit board with embedded capacitor, wherein the capacitor includes two conductive electrodes arranged at opposite intervals and a dielectric space between the two conductive electrodes arranged at opposite intervals.

A method of manufacturing a circuit board with embedded capacitors, including the steps of: providing a first substrate, the first substrate including a first substrate body and a plurality of outer bodies to be removed, the outer bodies to be removed are provided on the On one side of the first substrate body, each outer body to be removed includes an inner surface and an outer surface opposite to the inner surface; a first circuit structure is provided on the first substrate, and the first The circuit structure includes a first structural body and a plurality of outer conductive electrodes. The two outer conductive electrodes are relatively spaced apart from the first structural body. The first structural body is provided with a plurality of openings, and the openings are provided in Between the two outer conductive electrodes, the outer body to be removed passes through the opening, one of the outer conductive electrodes is provided on one of the inner surfaces, and the other outer conductive electrode is provided on the other of the inner surfaces. Outer surface: A first covering body is provided on the first circuit structure, and the first covering body covers the outer body to be removed and the outer conductive electrode.

The outer body to be removed is removed to form an outer dielectric space, and the capacitor plate with embedded capacitor is obtained, wherein the capacitor includes the outer conductive electrode and the outer dielectric space.

Further, the outer body to be removed includes a first outer body to be removed and a second outer body to be removed. The first outer body to be removed and the second outer body to be removed are relatively spaced apart from each other. On one side of the first substrate body, the first outer body to be removed includes a first inner surface and a first outer surface opposite to the first inner surface, and the second outer body to be removed includes a first inner surface. two inner surfaces and a second outer surface opposite to the second inner surface; the first structural body is provided with a first opening and a second opening, and the outer conductive electrode includes two first outer conductive electrodes and two a second outer conductive electrode, the first opening is disposed between the two first outer conductive electrodes, the second opening is disposed between the two second outer conductive electrodes; step "in "Providing the first circuit structure on the first substrate" also includes: passing the two first outer conductive electrodes and the first outer body to be removed between the two first outer conductive electrodes through the first opening. ; Pass the two second outer conductive electrodes and the second outer body to be removed between the two second outer conductive electrodes through the second opening; place one of the first outer conductive electrodes in The first inner surface, another first outer conductive electrode is provided on the first outer surface; and one second outer conductive electrode is provided on the second inner surface, and the other second outer conductive electrode is provided on the first inner surface. The outer conductive electrode is provided on the second outer surface.

Further, the capacitor includes a first capacitor and a second capacitor, the outer dielectric space includes a first outer dielectric space and a second outer dielectric space, and the step "removing the outer object to be removed" includes: Remove the first outer body to be removed to form the first outer dielectric space, wherein the first capacitor includes two first outer conductive electrodes and the first outer dielectric space; and The second outer body to be removed is removed to form a second outer dielectric space, wherein the second capacitor includes two second outer conductive electrodes and the second outer dielectric space.

Further, the first covering body includes a first elastic connecting body and a first covering film. The first elastic connecting body connects the two first outer conductive electrodes, and the first covering film connects the two first outer conductive electrodes. A second outer conductive electrode, the first capacitor includes two first outer conductive electrodes, the first outer dielectric space, and a first elastic connection connected between the two first outer conductive electrodes. body.

Further, the method further includes the step of arranging a first filling body in the second outer dielectric space, the second capacitor further includes the first filling body, and the second capacitor includes two second outer conductors. An electrode, the second outer dielectric space, and the first filling body filled in the second outer dielectric space.

Further, the manufacturing method of the first circuit structure includes: providing a first copper-clad substrate, the first copper-clad substrate includes a first base material layer and a first copper foil layer, the first copper foil layer is provided On one side of the first base material layer, the first copper foil layer is etched to form a first circuit layer to obtain a circuit intermediate body; two first slits and two first slits are provided through the circuit intermediate body. a second slit, and two third slits. The two first slits are relatively parallel to each other. One third slit is connected between the two first slits. The two first slits are connected to each other. Two slits are arranged relatively parallel, and the other third slit is connected between the two second slits; the middle part of the first line between the two first slits is bent to one side. body to form two first conductive electrodes; and bend the portion of the first circuit intermediate body between the two second slits toward one side to form two second conductive electrodes to obtain a first circuit structure.

Further, the manufacturing method of the first substrate includes: providing a first substrate body, the first substrate body includes a release film, a peeling carrier plate, and a metal layer, the peeling carrier plate and the metal layer are respectively provided On the two opposite side surfaces of the release film; A first outer body to be removed and a second outer body to be removed are provided on a side of the metal layer facing away from the release film to obtain the first substrate; wherein the first outer body to be removed includes a first inner surface and a first outer surface opposite to the first inner surface; the second outer body to be removed includes a second inner surface and a second outer surface opposite to the second inner surface; The first inner surface is opposite to the second inner surface.

Further, before the step of "setting a first circuit structure on the first substrate", the step further includes: setting a first adhesive layer on the metal layer, the first adhesive layer having a first opening and a second opening. hole, the first outer body to be removed passes through the first opening, and the second outer body to be removed passes through the second opening; between the first inner surface and the first A first adhesive sheet is provided on each outer surface; and a second adhesive sheet is provided on each of the second inner surface and the second outer surface; the step "providing a circuit structure on the substrate body" includes: The first structural body is provided on the first adhesive layer; the first outer conductive electrode is provided on the first adhesive sheet; and the second outer conductive electrode is provided on the second adhesive sheet. .

Further, the step "removing the outer body to be removed to form an outer dielectric space" also includes: removing the release film to separate the peeling carrier plate from the metal layer; and etching to remove the release film. The metal layer.

Further, the method further includes the step of: arranging a first solder resist layer on a side of the first adhesive layer away from the first circuit layer, and the first solder resist layer is provided with a first opening and a second opening. The first window is arranged corresponding to the first capacitor, and the second window is arranged corresponding to the second capacitor.

A method of manufacturing a circuit board with embedded capacitors, including the steps of: providing a second substrate, the second substrate includes a second substrate body and a plurality of inner to-be-removed bodies, and the inner to-be-removed bodies are provided on the On one side of the second substrate body, each inner body to be removed includes an inner surface and an outer surface opposite to the inner surface; a second circuit structure is provided on the second substrate, and the second The circuit structure includes a second structural body and a plurality of inner conductive electrodes. The two inner conductive electrodes are relatively spaced apart from each other on the second structural body. The second structural body is provided with a plurality of openings, and the openings are provided on Between each two inner conductive electrodes, the inner body to be removed passes through the opening, one inner conductive electrode is provided on one of the inner surfaces, and the other inner conductive electrode is provided on the other inner surface. The outer surface; a first covering film is provided on a side of the second substrate facing away from the second structural body, and a second covering film is provided on a side of the second structural body facing away from the second substrate; and The inner body to be removed is removed to form an inner dielectric space, and the capacitor plate with embedded capacitor is obtained, wherein the capacitor includes the inner conductive electrode and the inner dielectric space.

Further, the inner body to be removed includes two first inner bodies to be removed and two second inner bodies to be removed, the first inner body to be removed and the second inner body to be removed Relatively spaced on one side of the second substrate body, the first inner body to be removed includes a third inner surface and a third outer surface opposite to the third inner surface, and the second inner body to be removed is The body includes a fourth inner surface and a fourth outer surface opposite to the fourth inner surface. The opening includes a third opening and a fourth opening, the inner conductive electrode includes two first inner conductive electrodes and two second inner conductive electrodes, and the third opening is provided on the two first inner conductive electrodes. The fourth opening is provided between the two second inner conductive electrodes. The step of "providing a second circuit structure on the second substrate" also includes: disposing one of the first inner conductive electrodes on the third inner surface, and disposing the other first inner conductive electrode on the third inner surface. Three outer surfaces, one of the second inner conductive electrodes is provided on the fourth inner surface, and the other second inner conductive electrode is provided on the fourth outer surface.

Further, the capacitor includes a third capacitor and a fourth capacitor, the inner dielectric space includes a first inner dielectric space and a second inner dielectric space, and the step "removing the inner object to be removed" includes: The first inner body to be removed is removed to form the first inner dielectric space, wherein the third capacitor includes two first inner conductive electrodes and the first inner dielectric space and a moving The second inner body to be removed is removed to form the second inner dielectric space, wherein the fourth capacitor includes two second inner conductive electrodes and the second inner dielectric space.

Further, the manufacturing method of the second substrate includes the step of: providing a second copper-clad substrate, the second copper-clad substrate includes a second base material layer, a second copper foil layer, and a third copper foil layer, so The second copper foil layer and the third copper foil layer are respectively provided on two opposite surfaces of the second base material layer. The second copper foil layer is etched to form a first inner circuit layer to form the second substrate body. A first inner body to be removed and a second inner body to be removed are arranged on the second substrate body to obtain the second substrate.

Further, before the step of "setting a second circuit structure on the second substrate", the step further includes: setting a second adhesive layer on the first inner circuit layer, and the second adhesive layer is provided with a third opening therethrough. hole and a fourth opening, the first inner body to be removed passes through the third opening, and the second inner body to be removed passes through the fourth opening. A third adhesive sheet is respectively provided on the third inner surface and the third outer surface, and a fourth adhesive sheet is respectively provided on the fourth inner surface and the fourth outer surface.

Further, the step of "setting a second circuit structure on the second substrate" also includes: setting the first inner conductive electrode on the third adhesive sheet, and setting a second inner conductive electrode on the fourth adhesive sheet. Inner conductive electrode.

Further, after the step of "arranging a second circuit structure on the second substrate" and before the step of "arranging a second covering film on a side of the second structural body facing away from the second substrate", it also includes: etching Part of the second structural body is used to form a second inner circuit layer; a third adhesive layer is provided on the second inner circuit layer, and a third copper-clad substrate is provided on the third adhesive layer. The copper-clad substrate includes a third base material layer and a fourth copper foil layer provided on the third base material layer. The third base material layer is provided on the fourth copper foil layer and the third adhesive layer. between. Etch the second copper foil layer to form a first outer circuit layer and etching the fourth copper foil layer to form a second outer circuit layer.

Further, the method further includes the steps of: arranging a lower window on the first covering film, the lower window being arranged corresponding to the first inner dielectric space, and arranging a second elastic connector on the lower window, wherein, The third capacitor includes two first inner conductive electrodes, the first inner dielectric space and the second elastic connector.

Further, the method further includes the steps of: arranging an upper window on the second covering film, the upper window being arranged corresponding to the second inner dielectric space, and arranging a second filling in the second inner dielectric space. body, wherein the fourth capacitor includes two second inner conductive electrodes, the second inner dielectric space and the second filling body.

Further, the method further includes the step of removing the portion of the second base material layer corresponding to the second elastic connector.

A circuit board with embedded capacitors, including a circuit structure. The circuit structure includes a structural body, two first conductive electrodes, and two second conductive electrodes. The two first conductive electrodes are relatively spaced apart from the structure. On one side of the body, two second conductive electrodes are arranged relatively spaced apart on one side of the circuit structure. The circuit structure is provided with a first opening, and the first opening is provided on the two first conductive electrodes. A first outer dielectric space is formed between the electrodes. The two first conductive electrodes and the first outer dielectric space form a first capacitor. A second opening is provided through the circuit structure. The second opening It is disposed between the two second conductive electrodes to form a second outer dielectric space, and the two second conductive electrodes and the second outer dielectric space form a second capacitor.

Furthermore, it also includes an elastic connector and a filling body, the elastic connector is provided between the two first conductive electrodes, and the filling body is provided between the two second conductive electrodes.

Compared with the prior art, the manufacturing method of a circuit board with embedded capacitor provided by the present application has the following advantages: (1) By first forming the first outer body to be removed and the second outer body to be removed, and then forming the first outer body to be removed, and then forming the second outer body to be removed. First conductive electrodes are formed on both sides of an outer body to be removed, second conductive electrodes are formed on both sides of the second outer body to be removed, and finally the first conductive electrode and the second conductive electrode are removed to form a circuit board The first capacitor and the second capacitor are embedded. The capacitor manufactured by this method does not need to be provided with dielectric materials on the entire circuit board, which is beneficial to the thickness of the circuit board and saves the materials required for manufacturing the capacitor. At the same time, this method has The position of the capacitor is flexible and adaptable to most circuit boards that require embedded capacitors. (2) By disposing a first elastic connector between the two first conductive electrodes, the distance between the two first conductive electrodes can be changed, so that the capacitance value of the first capacitor can be variable; A first filling body is disposed between the second conductive electrodes so that the distance between the second conductive electrodes cannot be changed, that is, the capacitance value of the second capacitor is a fixed value.

100: Capacitor

101: First capacitor

102: Second capacitor

10: Object to be removed

11:Surface

20: Conductive electrode

21:Air

22: Elastic connector

23: Filling body

30: First substrate body

31: Release film

32: Peel off the carrier board

33:Metal layer

34: The first outer body to be removed

341: First inner surface

342: First outer surface

35: The second outer body to be removed

351: Second inner surface

352:Second outer surface

36: First bonding layer

36a: First opening

36b: Second opening

362: First bonding piece

363:Second bonding piece

366:First intermediate

39:First substrate

40: First line structure

41:First structural ontology

411:First opening

412:Second opening

42: First conductive electrode

43: Second conductive electrode

44: The first copper-clad substrate

441: First base material layer

442: First copper foil layer

443: First line layer

444:First line intermediate

444a: first slit

444b: Second slit

444c: Third slit

45: First elastic connector

451: First elastic part

452: First connection part

453: Second connection part

46:First covering film

47: First solder mask

471:First window opening

472: Second window opening

48: First filling body

200, 300: circuit board

211: First outer dielectric space

212: Second outer dielectric space

50: Second copper-clad substrate

501: Second substrate body

502: Second substrate

521: First inside line layer

51: Second base material layer

52: Second copper foil layer

53: The third copper foil layer

531: First outside line layer

54: The first inner body to be removed

541:Third inner surface

542:Third outer surface

543: First inner dielectric space

55: The second inner body to be removed

551:Fourth inner surface

552:Fourth outer surface

553: Second inner dielectric space

56:Second bonding layer

56a:Third opening

56b: The fourth opening

561:Third bonding piece

562: The fourth adhesive piece

563:Second intermediate

60: Second line structure

61:Second structural ontology

61a:The third opening

61b:The fourth opening

611: The third base material layer

612: The fifth copper foil layer

62: The third conductive electrode

63: The fourth conductive electrode

64:Third bonding layer

65: The third copper-clad substrate

651: The third base material layer

652: The fourth copper foil layer

653: First through hole

654: Second through hole

655: Second outside line layer

66: First covering film

661: Bottom opening window

67: Second covering film

671: Top opening window

70: Second elastic connector

71: Second elastic part

72: The third connection part

73: The fourth connection part

75: The third capacitor

76: The fourth capacitor

761:Second filling body

A:First direction

B:Second direction

C:Third direction

D:Fourth direction

Figure 1 is a schematic cross-sectional view of an object to be removed according to an embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of the body to be removed shown in FIG. 1 after being provided with conductive electrodes.

FIG. 3 is a schematic cross-sectional view of a capacitor provided by an embodiment of the present application.

FIG. 4 is a schematic cross-sectional view of the capacitor shown in FIG. 3 after being provided with an elastic connector.

FIG. 5 is a schematic cross-sectional view of the capacitor shown in FIG. 3 after being provided with a filling body.

FIG. 6 is a schematic cross-sectional view of the first substrate body provided by an embodiment of the present application.

FIG. 7 is a schematic cross-sectional view of the first substrate body shown in FIG. 6 after being provided with a first outer body to be removed.

FIG. 8 is a schematic cross-sectional view of the first outer body to be removed shown in FIG. 7 after being provided with a first adhesive sheet.

FIG. 9 is a schematic cross-sectional view of the first adhesive sheet shown in FIG. 8 after being provided with a first conductive electrode.

FIG. 10 is a schematic cross-sectional view of a first copper-clad substrate provided by an embodiment of the present application.

FIG. 11 is a schematic cross-sectional view after etching the first copper foil layer of the copper-clad substrate shown in FIG. 10 to form a first circuit intermediate body.

FIG. 12 is a top view of the first circuit intermediate body shown in FIG. 11 after two first slits are provided.

FIG. 13 is a schematic cross-sectional view of the first circuit structure formed after bending part of the first circuit intermediate body between the two first slits shown in FIG. 12 .

FIG. 14 is a schematic cross-sectional view of the first adhesive sheet shown in FIG. 9 after being provided with the first conductive electrode shown in FIG. 13 .

FIG. 15 is a schematic cross-sectional view of the first substrate body shown in FIG. 14 with part thereof removed.

FIG. 16 is a schematic cross-sectional view after removing the first outer body to be removed shown in FIG. 14 .

FIG. 17 is a schematic cross-sectional view of a circuit board with built-in capacitors provided by an embodiment of the present application.

FIG. 18 is a schematic cross-sectional view of a second copper-clad substrate provided by another embodiment of the present application.

FIG. 19 is a schematic cross-sectional view after etching the second copper-clad substrate shown in FIG. 18 to form a second substrate body.

FIG. 20 is a schematic cross-sectional view of the second substrate body shown in FIG. 19 after being provided with a first inner body to be removed to form a second substrate.

FIG. 21 is a schematic cross-sectional view of the second intermediate body formed after the second substrate shown in FIG. 20 is provided with a second adhesive layer.

FIG. 22 is a schematic cross-sectional view of the second intermediate body shown in FIG. 21 provided with a second circuit structure.

FIG. 23 is a schematic cross-sectional view of etching the fifth copper foil layer shown in FIG. 22 to form a second inner circuit layer.

FIG. 24 is a schematic cross-sectional view after a third copper-clad substrate is disposed on the second inner circuit layer shown in FIG. 23 .

FIG. 25 is a schematic cross-sectional view of the third copper-clad substrate shown in FIG. 24 after etching to form a second outer side.

FIG. 26 is a schematic cross-sectional view of the second outer circuit layer shown in FIG. 25 after being provided with a second covering film.

FIG. 27 is a schematic cross-sectional view of the second elastic connector shown in FIG. 26 after opening a window under the first covering film.

FIG. 28 is a schematic cross-sectional view after removing the first inner body to be removed and the second inner body to be removed shown in FIG. 27 .

FIG. 29 is a schematic cross-sectional view after the second filling body is disposed in the second inner dielectric space shown in FIG. 28 .

FIG. 30 is a schematic cross-sectional view of a circuit board with built-in capacitors according to another embodiment of the present application.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments.

Note that when an element is said to be "connected" to another element, it can be directly connected to the other element or it may also be present on an intervening element. When an element is said to be "disposed on" another element, it can be directly located on the other element or it may also be present on a centered element.

Referring to Figures 1 to 5, one embodiment of the present application provides a method for manufacturing a capacitor 100, which includes the steps:

S1: Referring to Figure 1, a body 10 to be removed is provided. The body 10 to be removed includes two surfaces 11 that are relatively spaced apart. In this embodiment, the object 10 to be removed is a copper block. In other embodiments of the present application, the material of the object 10 to be removed may be metal, resin, or a composite of metal and resin.

S2: Referring to FIG. 2 , one conductive electrode 20 is provided on one of the surfaces 11 , and another conductive electrode 20 is provided on the other surface 11 .

S2: Please refer to Figure 3. The body 10 to be removed is removed by etching to obtain the capacitor 100. The capacitor 100 is a parallel plate capacitor, and the capacitor 100 includes two conductive electrodes 20 arranged relatively spaced apart, and the air 21 between the two conductive electrodes 20 .

In some embodiments, the manufacturing method of the capacitor 100 further includes the steps:

S3: Refer to FIG. 4 , connect the elastic connector 22 between the two conductive electrodes 20 . The elastic connector 22 can be stretched and compressed, thereby facilitating adjustment of the distance between the two conductive electrodes 20 (ie, adjustment of the thickness of the air), based on the calculation formula of parallel plate capacitance: C=S×Dk/T , where, C: capacitance value; S: effective overlapping area of the two conductive electrodes 20, Dk: dielectric constant of air; T: thickness of air 21. It can be seen that the capacitance value of the capacitor 100 can be changed by changing the relative distance between the two conductive electrodes 20 , and thus the capacitance value of the capacitor 100 can be adjusted.

In other embodiments, the manufacturing method of the capacitor 100 further includes the steps:

S4: Referring to FIG. 5 , a filling body 23 is filled between the two conductive electrodes 20 . The filling body 23 is made of at least one of epoxy resin and polyimide, so that the capacitor 100 The capacitance value is fixed.

Compared with the conventional technology, the manufacturing method of the capacitor 100 provided by the present application has the following advantages: the capacitor is formed by respectively arranging conductive electrodes 20 on opposite sides of the object 10 to be removed, and then removing the object 10 to be removed. 100. This method is not only simple and reliable, but also a variable capacitance can be obtained by arranging the elastic connector 22 between the two conductive electrodes 20, and a fixed capacitance can be obtained by arranging the filling body 23 between the two conductive electrodes 20. Not only It won't take up too much space and won't waste materials.

Referring to Figures 6 to 17, one embodiment of the present application provides a method of manufacturing a circuit board 200 with embedded capacitors, including the steps:

S101: Refer to Figure 6 to provide a first substrate body 30. The first substrate body 30 includes a release film 31 , a release carrier 32 , and a metal layer 33 . The release carrier 32 and the metal layer 33 are respectively provided on two opposite side surfaces of the release film 31 . The thickness direction of the first substrate body 30 is defined as the first direction A, and the extension direction of the first substrate body 30 is defined as the second direction B.

S102: Referring to FIG. 7 , a first outer body to be removed 34 and a second outer body to be removed 35 are provided on a side of the metal layer 33 away from the release film 31 to obtain a first substrate 39 . Among them, all The first outer body to be removed 34 and the second outer body to be removed 35 are spaced apart along the second direction B. The first outer body to be removed 34 includes a first inner surface 341 and the The first inner surface 341 is opposite to the first outer surface 342 . The second outer body to be removed 35 includes a second inner surface 351 and a second outer surface 352 opposite to the second inner surface 351 . The first inner surface 341 is opposite to the second inner surface 351 . Specifically, the first outer body to be removed 34 and the second outer body to be removed 35 are copper blocks formed on the metal layer 33 by electroplating.

S103: Referring to FIG. 8 , a first adhesive layer 36 , a first adhesive sheet 362 , and a second adhesive sheet 363 are provided on the first substrate 39 . Specifically, the first adhesive layer 36 is provided in the area of the metal layer 33 where the first outer body to be removed 34 and the second outer body to be removed 35 are not provided. The first adhesive layer 36 has a first opening 36a and a second opening 36b. The first outer body to be removed 34 passes through the first opening 36a. The second outer body to be removed 35 passes through the second opening 36b. At the same time, a first adhesive piece 362 is provided on each of the first inner surface 341 and the first outer surface 342 . At the same time, a second adhesive piece 363 is provided on each of the second inner surface 351 and the second outer surface 352 to obtain a first intermediate body 366. The first adhesive layer 36, the two first adhesive sheets 362, and the two second adhesive sheets 363 are of an integrated structure. The first adhesive layer 36 , the first adhesive sheet 362 and the second adhesive sheet 363 are made of pure glue.

S104: Refer to FIG. 9 , set the first circuit structure 40 on the first intermediate body 366 . The first circuit structure 40 includes a first structural body 41 , two first conductive electrodes 42 , and two second conductive electrodes 43 . The two first conductive electrodes 42 are spaced apart along the first direction A on one side of the first structural body 41 , and the two second conductive electrodes 43 are spaced apart along the first direction A on one side of the first structural body 41 . One side of the first structural body 41. The first structural body 41 is provided with a first opening 411 and a second opening 412 therethrough. The first opening 411 is provided between the two first conductive electrodes 42 that are spaced apart, and the second opening 412 is provided between the two second conductive electrodes 43 that are spaced apart. The first structural body 41 is disposed on the first adhesive layer 36, the first outer body to be removed 34 passes through the first opening 411, and the two first conductive electrodes 42 are respectively disposed on The two first adhesive pieces 362 are on one side facing away from the first outer body to be removed 34 . The second outer body 35 to be removed passes through the second opening 412, and the two second conductive electrodes 43 are respectively disposed on the two second adhesive sheets 363 facing away from the second outer body 35 to be removed. One side of body 35.

In some embodiments, please refer to Figures 10 to 12. In step S104, the manufacturing method of the first circuit structure 40 includes the steps:

S1041: Referring to Figure 10, a first copper-clad substrate 44 is provided. The first copper-clad substrate 44 includes a first base material layer 441 and a first copper foil layer 442. The first copper foil layer 442 is provided on one side of the first base material layer 441.

S1042: Referring to FIG. 11, the first copper foil layer 442 is etched to form a first circuit layer 443 to obtain a first circuit intermediate 444.

S1043: Referring to FIG. 12, two first slits 444a, two second slits 444b, and two third slits 444c are provided through the first line intermediate body 444. Two first slits 444a are arranged opposite each other along the second direction B, and one third slit 444c is connected between the two first slits 444a. The two second slits 444b are arranged opposite each other along the second direction B, and the other third slit 444c is connected between the two second slits 444b.

S1044: Refer to FIG. 13 , bend the portion of the first circuit intermediate body 444 between the two first slits 444 a to one side to form two first conductive electrodes 42 . and bending a portion of the first circuit intermediate body 444 between the two second slits 444b toward one side to form two second conductive electrodes 43 to obtain the first circuit structure 40 . Each of the first conductive electrodes 42 includes part of the first base material layer 441 and part of the first circuit layer 443 . Each second conductive electrode 43 includes part of the first base material layer 441 and part of the first circuit layer 443 .

In other embodiments, the first circuit layer 443 is provided between the first base material layer 441 and the first adhesive layer 36 .

S105: Please refer to FIG. 14. A first elastic connector 45 is provided on the first circuit structure 40. The first elastic connector 45 includes a first elastic part 451, a first connection part 452, and a second connection part 453. . The first connection part 452 and the second connection part 453 are respectively provided at opposite ends of the first elastic part 451. The first elastic part 451 covers the first outer body to be removed 34 and the two first conductive electrodes 42 . The second connection part 453 is connected to the first base material layer 441 of one of the first conductive electrodes 42 , and the second connection part 453 is connected to the first base material of the other first conductive electrode 42 Layer 441. During use, external force pulling the first elastic part 451 can cause the distance between the two first conductive electrodes 42 to change, thereby changing the capacitance value.

In some embodiments, step S105 also includes:

S1051: Please refer to FIG. 14. A first covering film 46 is provided on the first circuit structure 40. The first covering film 46 covers the second outer body to be removed 35 and the two second conductive electrodes 43. .

S106: Refer to FIG. 15 , remove the release film 31 to separate the release carrier 32 from the metal layer 33 .

S107: Refer to FIG. 16 , etching and removing the metal layer 33 and the first outer body to be removed 34 and the second outer body to be removed 35 provided on the metal layer 33 . The circuit board 200 includes a first capacitor 101 and a second capacitor 102 . The first capacitor 101 is a variable capacitor. The first capacitor 101 includes two first conductive electrodes 42, a first elastic connector 45 connected to the two first conductive electrodes 42, and a The first outer dielectric space 211 between the two first conductive electrodes 42 . The second capacitor 102 includes two second conductive electrodes 43 and a second outer dielectric space 212 formed between the two second conductive electrodes 43 .

In some embodiments, step S107 also includes:

S108: Please refer to Figure 16. A first solder mask 47 is provided on a side of the first adhesive layer 36 away from the first circuit layer 443. The first solder mask 47 is provided with a first window 471. With the second opening 472, the first opening 471 is arranged corresponding to the first capacitor 101, and the second opening 472 is arranged corresponding to the second capacitor 102.

S109: Referring to FIG. 17 , fill the first filling body 48 between the two second conductive electrodes 43 of the second capacitor 102 to obtain the circuit board 200 . Wherein, the first filling body 48 is polyimide with high dielectric constant and low dielectric loss. That is, the second capacitor 102 is a fixed capacitor.

Compared with the conventional technology, the manufacturing method of the circuit board 200 with built-in capacitor provided by the present application has the following advantages:

(1) By first forming the first outer body to be removed 34 and the second outer body to be removed 35, and then forming the first conductive electrode 42 on both sides of the first outer body to be removed 34, and the second outer body to be removed. Second conductive electrodes 43 are formed on both sides of the removal body 35, and finally the first conductive electrode 42 and the second conductive electrode 43 are removed, thereby forming the first capacitor 101 and the second capacitor 102 embedded in the circuit board 200. This method The manufactured capacitor does not need to be provided with dielectric material on the entire circuit board 200, which is beneficial to the thickness of the circuit board 200 and saves the materials required for manufacturing the capacitor. At the same time, this method has flexible locations for manufacturing the capacitor and is suitable for most needs. Circuit board 200 with built-in capacitors.

(2) By disposing the first elastic connector 45 between the two first conductive electrodes 42 so that the distance between the two first conductive electrodes 42 can change, the capacitance value of the first capacitor 101 can be variable. ; By disposing the first filling body 48 between the two second conductive electrodes 43, the distance between the second conductive electrodes 43 cannot be changed, that is, the capacitance value of the second capacitor 102 is a fixed value.

In addition, please refer to FIG. 17 . The present application also provides a circuit board 200 with built-in capacitors. The circuit board 200 with built-in capacitors includes a first circuit structure 40 . The first circuit structure 40 includes a first structural body 41 , two first conductive electrodes 42 , and two second conductive electrodes 43 . The two second conductive electrodes 43 are relatively spaced apart from one side of the first structural body 41 . The two second conductive electrodes 43 are relatively spaced apart from one side of the first structural body 41 .

Please refer to FIG. 13 as well. The first structural body 41 is provided with a first opening 411 therethrough. The first opening 411 is provided between the two first conductive electrodes 42 to form a first outer dielectric space 211 . The two first conductive electrodes 42 and the first outer dielectric space 211 form the first capacitor 101 .

The first structural body 41 is provided with a second opening 412 therethrough. The second opening 412 is disposed between the two second conductive electrodes 43 to form a second outer dielectric space 212 . The two second conductive electrodes 43 and the second outer dielectric space 212 form the second capacitor 102 .

Referring to Figures 18 to 30, another embodiment of the present application provides a method of manufacturing a circuit board 300 with embedded capacitors, including the steps:

S201: Refer to FIG. 18 to provide a second copper-clad substrate 50. The second copper-clad substrate 50 includes a second base material layer 51, a second copper foil layer 52, and a third copper foil layer 53. The second copper foil layer 52 and the third copper foil layer 53 are respectively provided on two opposite surfaces of the second base material layer 51 . The thickness direction of the second copper-clad substrate 50 is defined as the third direction C, and the extending direction of the second copper-clad substrate 50 is defined as the fourth direction D.

S202: Referring to FIG. 19 , the second copper foil layer 52 is etched to form a first inner circuit layer 521 to obtain a second substrate body 501 . The second substrate body 501 includes a second base material layer 51, a first inner circuit layer 521 and a second copper foil layer 52. The first inner circuit layer 521 and the second copper foil layer 52 are respectively provided with on opposite sides of the second base material layer 51 .

S203: Refer to FIG. 20 , set the first inner body to be removed 54 and the second inner body to be removed 55 on the second substrate body 501 to obtain the second substrate 502 . Specifically, a first inner body to be removed 54 and a second inner body to be removed 55 are provided on the first inner circuit layer 521 . The first inner body to be removed 54 and the second inner body to be removed 55 are spaced apart from the first inner circuit layer 521 along the fourth direction D. The first inner body to be removed 54 and the second inner body to be removed 55 extend along the third direction C.

The first inner body to be removed 54 has a third inner surface 541 and a third outer surface 542 opposite to the third inner surface 541. The third inner surface 541 faces the second inner body to be removed. 55. The second inner body to be removed 55 has a fourth inner surface 551 and a fourth outer surface 552 opposite to the fourth inner surface 551 . The fourth inner surface 551 is disposed toward the third inner surface 541 . Specifically, the first inner body to be removed 54 and the second inner body to be removed 55 are copper blocks formed on the first inner circuit layer 521 by electroplating. It can be understood that in other embodiments of the present application, the first inner body to be removed 54 and the second inner body to be removed 55 can also be made of other materials, such as plastic, ceramics, nickel alloy, etc.

S204: Referring to FIG. 21, a second adhesive layer 56 is provided on the second substrate 502. Specifically, the second adhesive layer 56 is provided in the area of the first inner circuit layer 521 where the first inner body to be removed 54 and the second inner body to be removed 55 are not provided. The second adhesive layer 56 is provided with a third opening 56a and a fourth opening 56b. The first inner side to be removed 54 passes through the third opening 56a. The second inner side to be removed is The removing body 55 passes through the fourth opening 56b. At the same time, one third adhesive piece 561 is provided on the third inner surface 541 and the third outer surface 542 respectively. At the same time, one fourth adhesive piece 562 is respectively provided on the fourth inner surface 551 and the fourth outer surface 552 to obtain a second intermediate body 563 . The second adhesive layer 56, the third adhesive sheet 561, and the fourth adhesive sheet 562 are of an integrated structure. The second adhesive layer 56, the third adhesive sheet 561, and the fourth adhesive sheet 562 are made of pure glue.

S205: Refer to Figure 22, set the second circuit structure 60 on the second intermediate body 563. The second circuit structure 60 includes a second structural body 61 , two third conductive electrodes 62 , and two fourth conductive electrodes 63 .

The two third conductive electrodes 62 are spaced apart along the third direction C on one side of the second structural body 61 . The two fourth conductive electrodes 63 are spaced apart along the third direction C on one side of the second structural body 61 . The second structural body 61 is provided with a third opening 61 a and a fourth opening 61 b, and the third opening 61 a is provided between the two third conductive electrodes 62 that are spaced apart. The fourth opening 61b is provided between the two fourth conductive electrodes 63 that are spaced apart.

The first inner body to be removed 54 and the two third adhesive sheets 561 pass through the third opening 61a. The second inner body to be removed 55 and the two fourth adhesive sheets 562 pass through the fourth opening 61b.

The two third conductive electrodes 62 are respectively disposed on a side of the two third adhesive sheets 561 facing away from the first inner body to be removed 54 . The two fourth conductive electrodes 63 are respectively disposed on a side of the two fourth adhesive sheets 562 facing away from the second inner body to be removed 55 .

The manufacturing methods of the second circuit structure 60 and the first circuit structure 40 are the same and will not be described again. The second structural body 61 includes part of the third base material layer 611 and part of the fifth copper foil layer 612 . The third conductive electrode 62 also includes part of the third base material layer 611 and part of the fifth copper foil layer 612 . The fourth conductive electrode 63 also includes part of the third base material layer 611 and part of the fifth copper foil layer 612 .

The difference from other embodiments is that the third base material layer 611 is provided between the fifth copper foil layer 612 and the second adhesive layer 56. In other embodiments, the first circuit Layer 443 is provided between the first base material layer 441 and the first adhesive layer 36 .

S206: Referring to FIG. 23, part of the fifth copper foil layer 612 of the second structural body 61 is etched to form a second inner circuit layer 613.

S207: Referring to FIG. 24, a third adhesive layer 64 is provided on the second inner circuit layer 613, and a third copper-clad substrate 65 is provided on the third adhesive layer 64. The third copper-clad substrate 65 includes a third base material layer 651 and a fourth copper foil layer 652 provided on the third base material layer 651 . The third base material layer 651 is provided between the fourth copper foil layer 652 and the third adhesive layer 64 . The third copper-clad substrate 65 is provided with first through holes 653 and second through holes 654 . The first through hole 653 and the second through hole 654 penetrate the fourth copper foil layer 652 and the third base material layer 651 along the third direction C.

The first inner body to be removed 54 and the two third conductive electrodes 62 pass through the first through hole 653 . A side of the first inner body to be removed 54 facing away from the first inner circuit layer 521 is flush with a side of the third copper foil layer 53 facing away from the third base material layer 651 . The adhesive layer 64 also fills the gap between the first through hole 653 and the third conductive electrode 62 . Similarly, the second inner body to be removed 55 and the two fourth conductive electrodes 63 pass through the second through hole 654 . The side of the second inner body to be removed 55 facing away from the first inner circuit layer 521 is flush with the side of the third copper foil layer 53 facing away from the third base material layer 651 . The adhesive layer 64 also fills the gap between the second through hole 654 and the fourth conductive electrode 63 .

S208: Referring to FIG. 25 , the third copper foil layer 53 is etched to form a first outer circuit layer 531 , and the fourth copper foil layer 652 is etched to form a second outer circuit layer 655 .

S209: Referring to FIG. 26, a first covering film 66 is provided on the first outer circuit layer 531, and a second covering film 67 is provided on the second outer circuit layer 655. The first covering film 66 is provided with a lower opening window 661 , and part of the second base material layer 51 is exposed at the bottom of the lower opening window 661 . (the first outer circuit layer 531 has a wire trough, and the second base material layer 51 is exposed at the bottom of the wire trough and the lower opening window 661), the second covering film 67 is provided with two upper opening windows 671. .

Along the third direction C, the front projection of the first inner body to be removed 54 is located in the lower window 661 . One of the upper opening windows 671 is provided corresponding to the first inner body to be removed 54 , and the other upper opening window 671 is provided corresponding to the second inner body to be removed 55 .

S210: Refer to FIG. 27 , a second elastic connection body 70 is provided in the lower window 661 . The second elastic connection body 70 includes a second elastic part 71 , a third connection part 72 and a fourth connection part 73 . The second elastic part 71 is connected between the third connection part 72 and the fourth connection part 73 . The second elastic portion 71 is connected to the portion of the second base material layer 51 that exposes the lower window 661 . The third connection part 72 and the fourth connection part 73 connect the first cover film 66 and the second base material layer 51 .

S211: Referring to Figure 28, remove the first inner body to be removed 54 to form a first inner dielectric space 543, and remove the second inner body to be removed 55 to form a second inner dielectric space. 553. The two third conductive electrodes 62 and the first inner dielectric space 543 form a third capacitor 75 . The two fourth conductive electrodes 63 and the second inner dielectric space 553 form a fourth capacitor 76 . In specific use, by stretching the second elastic part 71 with external force, the size of the first inner dielectric space 543 can be changed, thereby changing the capacitance value of the third capacitor 75 .

S212: Please refer to Figure 29. A second filling body 761 is provided in the second inner dielectric space 553. The material of the second filling body 761 is polyimide with high dielectric constant and low dielectric loss. Polyimide as a dielectric material can improve the stability of the fourth capacitor 76 .

S213: Referring to FIG. 30 , remove the portion of the second base material layer 51 corresponding to the first inner dielectric space 543 to obtain the circuit board 300 with embedded capacitor. Wherein, removing part of the second base material layer 51 can stretch or compress part of the second elastic connector 70 .

In addition, please refer to Figure 23 and Figure 30 together. The present application also provides a circuit board 300 with embedded capacitor. The circuit board 300 with embedded capacitor includes a second circuit structure 60. The second circuit structure 60 includes The second structural body 61 , two third conductive electrodes 62 , and two fourth conductive electrodes 63 . The two third conductive electrodes 62 are relatively spaced apart from one side of the second structural body 61 . The two fourth conductive electrodes 63 are relatively spaced apart from one side of the second structural body 61 .

The second structural body 61 is provided with a third opening 61a. The third opening 61 a is provided between the two third conductive electrodes 62 to form a first inner dielectric space 543 . The two third conductive electrodes 62 and the first inner dielectric space 543 form a third capacitor 75 .

The second structural body 61 is provided with a fourth opening 61b. The fourth opening 61 b is provided between the two fourth conductive electrodes 63 to form a second inner dielectric space 553 . The two fourth conductive electrodes 63 and the second inner dielectric space 553 form a fourth capacitor 76 .

In addition, those of ordinary skill in the art should realize that the above embodiments are only used to illustrate the present invention and are not used to limit the present invention. Only within the scope of the essential spirit of the present invention, the above embodiments Appropriate changes and changes are made within the scope of protection claimed by the present invention.

200:Circuit board

45: First elastic connector

451: First elastic part

452: First connection part

453: Second connection part

362: First bonding piece

41:First structural ontology

40: First line structure

36: First bonding layer

101: First capacitor

42: First conductive electrode

102: Second capacitor

43: Second conductive electrode

212: Second outer dielectric space

47: First solder mask

443: First line layer

411:First opening

48: First filling body

363:Second bonding piece

46:First covering film

211: First outer dielectric space

A:First direction

B:Second direction

Claims (20)

A method of manufacturing a circuit board with embedded capacitors, which includes the steps of: providing a substrate, the substrate includes a substrate body and a body to be removed, the body to be removed is provided on one side of the substrate body, the The body to be removed includes an inner surface and an outer surface arranged oppositely; a circuit structure is provided on the substrate body, the circuit structure includes a structural body and a plurality of conductive electrodes, and the plurality of conductive electrodes are relatively spaced on the structure On one side of the body, the structural body is provided with a plurality of openings, the object to be removed passes through the openings, the conductive electrode is provided on the inner surface and the outer surface; and the body to be removed is The body is removed to form a dielectric space, and the circuit board with embedded capacitor is obtained, wherein the capacitor includes two conductive electrodes arranged at opposite intervals and a dielectric space between the two conductive electrodes arranged at opposite intervals. A method of manufacturing a circuit board with embedded capacitors, which includes the step of: providing a first substrate, the first substrate includes a first substrate body and a plurality of outer bodies to be removed, and the outer bodies to be removed are provided on On one side of the first substrate body, each outer body to be removed includes an inner surface and an outer surface opposite to the inner surface; a first circuit structure is provided on the first substrate, the The first circuit structure includes a first structural body and a plurality of outer conductive electrodes. The two outer conductive electrodes are relatively spaced apart from the first structural body. The first structural body is provided with a plurality of openings. The openings is provided between the two outer conductive electrodes, the outer body to be removed passes through the opening, one of the outer conductive electrodes is provided on one of the inner surfaces, and the other outer conductive electrode is provided on the other The outer surface; a first covering body is provided on the first circuit structure, the first covering body covers the outer body to be removed and the outer conductive electrode; and the outer body to be removed is removed to An outer dielectric space is formed to obtain the circuit board with embedded capacitor, wherein the capacitor includes the outer conductive electrode and the outer dielectric space. The manufacturing method of claim 2, wherein the outer body to be removed includes a first outer body to be removed and a second outer body to be removed, and the first outer body to be removed and the second outer body to be removed The outer body to be removed is relatively spaced on one side of the first substrate body. The first outer body to be removed includes a first inner surface and a first outer surface opposite to the first inner surface. The second outer body to be removed includes a second inner surface and a second outer surface opposite to the second inner surface; The first structural body is provided with a first opening and a second opening. The outer conductive electrodes include two first outer conductive electrodes and two second outer conductive electrodes. The first opening is provided on the two outer conductive electrodes. Between the first outer conductive electrodes, the second opening is provided between the two second outer conductive electrodes; the step of "setting the first circuit structure on the first substrate" also includes: connecting the two second outer conductive electrodes The first outer conductive electrode and the first outer body to be removed between the two first outer conductive electrodes pass through the first opening; connect the two second outer conductive electrodes and the two second outer conductive electrodes. The second outer body to be removed between the outer conductive electrodes passes through the second opening; one of the first outer conductive electrodes is disposed on the first inner surface, and the other first outer conductive electrode is disposed on the first inner surface. The first outer surface; and one of the second outer conductive electrodes is provided on the second inner surface, and the other second outer conductive electrode is provided on the second outer surface. The manufacturing method of claim 3, wherein the capacitor includes a first capacitor and a second capacitor, the outer dielectric space includes a first outer dielectric space and a second outer dielectric space, and the step "removing all "The outer body to be removed" includes: removing the first outer body to be removed to form the first outer dielectric space, wherein the first capacitor includes two first outer conductive electrodes and the the first outer dielectric space; and removing the second outer body to be removed to form a second outer dielectric space, wherein the second capacitor includes two second outer conductive electrodes and the third Two outer dielectric spaces. The manufacturing method according to claim 4, wherein the first covering body includes a first elastic connector and a first covering film, the first elastic connector connects the two first outer conductive electrodes, and the The first covering film connects the two second outer conductive electrodes, and the first capacitor includes the two first outer conductive electrodes, the first outer dielectric space, and is connected to the two first outer conductive electrodes. The first elastic connector between the conductive electrodes. The manufacturing method according to claim 5, further comprising the step of arranging a first filling body in the second outer dielectric space, the second capacitor further includes the first filling body, and the second capacitor It includes two second outer conductive electrodes, the second outer dielectric space, and the first filling body filled in the second outer dielectric space. The manufacturing method according to claim 3, wherein the manufacturing method of the first circuit structure includes: A first copper-clad substrate is provided. The first copper-clad substrate includes a first base material layer and a first copper foil layer. The first copper foil layer is provided on one side of the first base material layer; etching the The first copper foil layer is used to form a first circuit layer to obtain a circuit intermediate body; two first slits, two second slits, and two third slits are provided through the circuit intermediate body. The first slits are arranged relatively parallel, one third slit is connected between the two first slits, the two second slits are arranged relatively parallel, and the other third slit is connected between the two first slits. The slit is connected between the two second slits; bending a portion of the circuit intermediate body between the two first slits toward one side to form two first conductive electrodes; and bending the two first slits toward one side. A portion of the circuit intermediate body between the two second slits forms two second conductive electrodes to obtain a first circuit structure. The manufacturing method according to claim 4, wherein the manufacturing method of the first substrate includes: providing a first substrate body, the first substrate body includes a release film, a peeling carrier plate, and a metal layer, and the peeling The carrier plate and the metal layer are respectively provided on two opposite side surfaces of the release film; a first outer body to be removed and a second outer body to be removed are provided on a side of the metal layer away from the release film. Remove the body to obtain the first substrate; wherein the first outer body to be removed includes a first inner surface and a first outer surface opposite to the first inner surface, and the second outer body to be removed The body includes a second inner surface and a second outer surface opposite to the second inner surface, and the first inner surface is opposite to the second inner surface. The manufacturing method according to claim 8, wherein before the step of "setting a first circuit structure on the first substrate", it further includes: setting a first adhesive layer on the metal layer, the first adhesive layer It has a first opening and a second opening, the first outer body to be removed passes through the first opening, and the second outer body to be removed passes through the second opening; in the Each of the first inner surface and the first outer surface is provided with a first adhesive sheet; and the second inner surface and the second outer surface are each provided with a second adhesive sheet; step "on the substrate "Providing a circuit structure on the body" includes: arranging the first structural body on the first adhesive layer; arranging the first outer conductive electrode on the first adhesive sheet; and The second outer conductive electrode is provided on the second adhesive sheet. The manufacturing method according to claim 9, wherein the step of "removing the outer body to be removed to form an outer dielectric space" further includes: removing the release film so that the release carrier plate is separated from the outer dielectric space. Separating the metal layer; and etching to remove the metal layer. A method of manufacturing a circuit board with embedded capacitors, which includes the step of: providing a second substrate, the second substrate includes a second substrate body and a plurality of inner to-be-removed bodies, and the inner to-be-removed bodies are provided on On one side of the second substrate body, each inner body to be removed includes an inner surface and an outer surface opposite to the inner surface; a second circuit structure is provided on the second substrate, the The second circuit structure includes a second structural body and a plurality of inner conductive electrodes. The two inner conductive electrodes are relatively spaced apart from the second structural body. The second structural body is provided with a plurality of openings. The openings Disposed between each two inner conductive electrodes, the inner body to be removed passes through the opening, one inner conductive electrode is disposed on one of the inner surfaces, and the other inner conductive electrode is disposed on the other One of the outer surfaces; a first covering film is provided on a side of the second substrate facing away from the second structural body, and a second covering film is provided on a side of the second structural body facing away from the second substrate. ; And remove the inner body to be removed to form an inner dielectric space to obtain the circuit board with embedded capacitor, wherein the capacitor includes the inner conductive electrode and the inner dielectric space. The manufacturing method of claim 11, wherein the inner body to be removed includes two first inner bodies to be removed and two second inner bodies to be removed, and the first inner body to be removed and The second inner body to be removed is relatively spaced on one side of the second substrate body, and the first inner body to be removed includes a third inner surface and a third outer surface opposite to the third inner surface. surface, the second inner body to be removed includes a fourth inner surface and a fourth outer surface opposite to the fourth inner surface; the opening includes a third opening and a fourth opening, and the inner conductive electrode includes two a first inner conductive electrode and two second inner conductive electrodes, the third opening is provided between the two first inner conductive electrodes, the fourth opening is provided between the two second inner conductive electrodes between; the step "providing a second circuit structure on the second substrate" also includes: disposing one of the first inner conductive electrodes on the third inner surface, and disposing the other first inner conductive electrode on the third outer surface; and disposing one of the second inner conductive electrodes on the fourth inner surface, and the other of the second inner conductive electrodes Electrodes are provided on the fourth outer surface. The manufacturing method of claim 12, wherein the capacitor includes a third capacitor and a fourth capacitor, the inner dielectric space includes a first inner dielectric space and a second inner dielectric space, and the step "removing all "The inner body to be removed" includes: removing the first inner body to be removed to form the first inner dielectric space, wherein the third capacitor includes two first inner conductive electrodes and the the first inner dielectric space; and removing the second inner body to be removed to form the second inner dielectric space, wherein the fourth capacitor includes two second inner conductive electrodes and the The second inner dielectric space. The manufacturing method according to claim 12, wherein the manufacturing method of the second substrate includes the step of: providing a second copper-clad substrate, the second copper-clad substrate includes a second base material layer and a second copper foil layer , and a third copper foil layer, the second copper foil layer and the third copper foil layer are respectively provided on two opposite surfaces of the second base material layer; the second copper foil layer is etched to form a third copper foil layer. An inner circuit layer is used to form the second substrate body; a first inner body to be removed and a second inner body to be removed are arranged on the second substrate body to obtain the second substrate. The manufacturing method according to claim 14, wherein before the step of "setting a second circuit structure on the second substrate", it further includes: setting a second adhesive layer on the first inner circuit layer, and the second The adhesive layer is provided with a third opening and a fourth opening, the first inner body to be removed passes through the third opening, and the second inner body to be removed passes through the fourth opening. holes; respectively disposing a third adhesive piece on the third inner surface and the third outer surface; and disposing a fourth adhesive piece on the fourth inner surface and the fourth outer surface respectively; steps "Providing the second circuit structure on the second substrate" also includes: arranging the first inner conductive electrode on the third adhesive sheet, and arranging the second inner conductive electrode on the fourth adhesive sheet. The manufacturing method according to claim 15, wherein, after the step of "setting a second circuit structure on the second substrate", and the step of "setting a third circuit structure on a side of the second structure body away from the second substrate" "Second Covering Film" also includes: etching part of the second structural body to form a second inner circuit layer; A third adhesive layer is provided on the second inner circuit layer; a third copper-clad substrate is provided on the third adhesive layer, and the third copper-clad substrate includes a third base material layer and is provided on the third adhesive layer. The fourth copper foil layer of the three base material layers, the third base material layer is provided between the fourth copper foil layer and the third adhesive layer; the second copper foil layer is etched to form a first The outer circuit layer; and etching the fourth copper foil layer to form a second outer circuit layer. The manufacturing method according to claim 14, further comprising the steps of: arranging a lower window on the first cover film, the lower window being arranged corresponding to the first inner dielectric space, and arranging the lower window on the first covering film. The window is provided with a second elastic connector, wherein the third capacitor includes two first inner conductive electrodes, the first inner dielectric space and the second elastic connector; remove the second elastic connector The second base material layer corresponds to the portion of the connector. The manufacturing method according to claim 13, further comprising the steps of: providing an upper window on the second covering film, the upper window being provided corresponding to the second inner dielectric space, and the second covering film being provided with an upper window corresponding to the second inner dielectric space. A second filling body is disposed in the inner dielectric space, wherein the fourth capacitor includes two second inner conductive electrodes, the second inner dielectric space and the second filling body. A circuit board with built-in capacitors, which includes a circuit structure. The circuit structure includes a structural body, two first conductive electrodes, and two second conductive electrodes. The two first conductive electrodes are arranged relatively spaced apart from each other. On one side of the structure body, two second conductive electrodes are arranged relatively spaced apart on one side of the circuit structure. The circuit structure is provided with a first opening, and the first opening is provided on the two second conductive electrodes. A first outer dielectric space is formed between a conductive electrode, the two first conductive electrodes and the first outer dielectric space form a first capacitor, the circuit structure is provided with a second opening, and the first outer dielectric space forms a first capacitor. Two openings are provided between the two second conductive electrodes to form a second outer dielectric space, and the two second conductive electrodes and the second outer dielectric space form a second capacitor. The circuit board according to claim 19, further comprising an elastic connector and a filler, the elastic connector is provided between the two first conductive electrodes, and the filler is provided between the two first conductive electrodes. between two conductive electrodes.

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