TWI805344B - Temperature testing system and temperature testing method thereof - Google Patents

Abstract

A temperature testing system and a temperature testing method thereof are provided. In the temperature testing system, a standard sensor senses a standard ambient temperature to generate a reference value. A device under test senses an operating temperature to generate a test value. A processor obtains a first offset value according to a difference between the reference value and a corresponding standard ambient temperature, and generates a first calibration curve according to the first offset value and the reference value. The processor adjusts the test value according to the first offset value to obtain a second calibration value. The processor calculates a predicted temperature value according to the second calibration value and the standard ambient temperature. The processor calculates a difference between the predicted temperature value and a corresponding standard ambient temperature to generate a second offset value. The processor adjusts the predicted temperature value according to the second offset value, and generates a second calibration curve according to the adjusted predicted temperature value.

Description

Temperature testing system and temperature testing method thereof

The present invention relates to a temperature testing technology, and in particular to a temperature testing system and a temperature testing method thereof.

For the temperature testing technology of integrated circuits, conventional temperature testing systems usually only use temperature sensors to sense the ambient temperature, and according to the sensed ambient temperature, the device to be tested (that is, the IC to be tested circuit) to correct the temperature curve.

However, as the requirement for temperature accuracy is getting higher and higher, the conventional temperature testing method still has a relatively large temperature error, which further reduces the yield rate of the temperature testing technology. In view of this, how to effectively implement an accurate temperature testing technology for integrated circuits to reduce the yield loss of temperature testing will be an important subject for those skilled in the art.

The invention provides a temperature testing system and a temperature testing method thereof, which can effectively improve the yield rate of a device to be tested when performing temperature testing.

The temperature testing system of the present invention includes a standard sensor, a device to be tested and a processor. The standard sensor senses a plurality of standard ambient temperatures to generate a plurality of reference values respectively. The device under test senses multiple operating temperatures to generate multiple test values. The processor is coupled to the device under test and the temperature sensor, wherein the processor is configured to: obtain a second temperature based on the difference between one of the plurality of reference values and the corresponding standard ambient temperature. an offset value, and generate a first calibration curve according to the first offset value and the plurality of reference values; adjust the plurality of test values according to the first offset value to obtain a plurality of second Correction value; calculate a plurality of predicted temperature values according to the plurality of second correction values and the plurality of standard ambient temperatures; calculate one of the plurality of predicted temperature values and the corresponding standard environment temperature difference to generate a second offset value; and adjust the plurality of predicted temperature values according to the second offset value, and generate a second calibration curve according to the adjusted plurality of predicted temperature values.

The temperature testing method in the temperature testing system of the present invention includes: providing a standard sensor to sense a plurality of standard ambient temperatures to generate a plurality of reference values respectively; providing a device to be tested to sense a plurality of operating temperatures to generate a plurality of test values; The processor obtains a first offset value according to the difference between one of the plurality of reference values and the corresponding standard ambient temperature, and obtains a first offset value according to the first offset value and the plurality of reference values to generating a first correction curve; adjusting the plurality of test values by the processor according to the first offset value to obtain a plurality of second correction values; by the processor according to the plurality of second correction values and the plurality of standard ambient temperatures to calculate a plurality of predicted temperature values; the difference between one of the plurality of predicted temperature values and the corresponding standard ambient temperatures is calculated by the processor to generate a second an offset value; and adjusting the plurality of predicted temperature values by the processor according to the second offset value, and generating a second calibration curve according to the adjusted plurality of predicted temperature values.

Based on the above, in the temperature testing system and its temperature testing method described in various embodiments of the present invention, the processor can further base on the second correction value, the third correction value and the device under test after completing the first temperature correction action. The multiple test values generated are used to generate a second calibration curve through the objective function, so as to perform a second temperature calibration action on the temperature testing system. In this way, the processor can make the second calibration curve closer to the standard temperature curve, so as to improve the yield rate of the temperature test system and reduce the yield loss during the temperature test.

The term "coupled (or connected)" used throughout the specification of this case (including the scope of claims) may refer to any direct or indirect means of connection. For example, if it is described in the text that a first device is coupled (or connected) to a second device, it should be interpreted that the first device can be directly connected to the second device, or the first device can be connected to the second device through other devices or certain A connection means indirectly connected to the second device. In addition, wherever possible, elements/components/steps using the same reference numerals in the drawings and embodiments represent the same or similar parts. Elements/components/steps using the same symbols or using the same terms in different embodiments can refer to related descriptions.

FIG. 1 is a schematic diagram illustrating a temperature testing system according to an embodiment of the present invention. Referring to FIG. 1 , the temperature testing system 100 includes a standard sensor 110 , a device under test 120 , a memory 130 and a processor 140 . Wherein, the standard sensor 110 in this embodiment may be, for example, a temperature sensor, and the device under test 120 may be, for example, an integrated circuit (Integrated Circuit) to be tested for temperature, but is not limited thereto.

In this embodiment, the standard sensor 110 can be used to sense a plurality of standard ambient temperatures T1˜TN in the environment (that is, the actual ambient temperature), and based on the sensed plurality of standard ambient temperatures T1˜TN A plurality of reference values RF1 ˜ RFN are correspondingly generated. The device under test 120 can be used to sense multiple operating temperatures of the device under test 120 , and generate a plurality of test values TS1 -TSN correspondingly according to the sensed multiple operating temperatures. Wherein, the device under test 120 can obtain multiple corresponding operating temperatures by inputting multiple different voltages, and its implementation details and related operations are well known to those skilled in the art, so details will not be repeated here. Wherein, the aforementioned N is a positive integer.

The memory 130 is coupled to the standard sensor 110 and the device under test 120 . The memory 130 can be used to store a plurality of reference values RF1 ˜ RFN and a plurality of test values TS1 ˜ TSN. The memory 130 can be disposed inside the device under test 120 or outside the device under test 120 , which is not particularly limited in the present invention. The memory 130 in this embodiment may be, for example, a variable resistance memory (Resistive random-access memory, RRAM), a ferroelectric random-access memory (Ferroelectric RAM, FeRAM), a magnetoresistive random-access memory (magnetoresistiveRAM, MRAM), phase change random access memory (Phase changeRAM, PRAM), conduction micro channel memory (Conductive bridge RAM, CBRAM), any type of fixed or removable random access memory (random access memory , RAM), read-only memory (read-only memory, ROM) or flash memory (flash memory).

On the other hand, the processor 140 is coupled to the memory 130 . The processor 140 can receive (or read) the reference values RF1 -RFN and the test values TS1 -TSN from the memory 130 . In this embodiment, the processor 140 can analyze and operate the reference values RF1 -RFN and the test values TS1 -TSN to generate the calibration curve CV1 and the calibration curve CV2 associated with the device under test 120 .

2A to 2C are schematic diagrams of multiple temperature curves according to an embodiment of the present invention shown in FIG. 1 . Please refer to FIG. 1 and FIG. 2A at the same time. In this embodiment, the processor 140 can obtain the standard temperature between the working temperature of the temperature testing system 100 and the working voltage of the temperature testing system 100 according to multiple standard ambient temperatures T1˜TN. Curve STC. After the standard sensor 110 stores the reference values RF1-RFN in the memory 130, the processor 140 can obtain the first temperature curve TC1 between the operating temperature and the operating voltage according to these reference values RF1-RFN .

Wherein, in FIG. 2A , the standard temperature curve STC can be used to represent the ideal temperature state in the environment, and the first temperature curve TC1 can be used to represent the actual temperature state sensed by the standard sensor 110 in the environment.

Next, please refer to FIG. 1 and FIG. 2B at the same time. The processor 140 can be based on the difference between one of the reference values RF1-RFN on the first temperature curve TC1 and the standard ambient temperature T1-TN on the corresponding standard temperature curve STC. difference to obtain a first offset value OFFSET1 between the first temperature curve TC1 and the standard temperature curve STC. For example, the processor 140 may use the standard ambient temperature of 25 degrees (°C) on the standard temperature curve STC as a reference value, and determine that the temperature corresponding to the standard ambient temperature of 25°C on the first temperature curve TC1 and subtracting the reference value from the reference value to obtain an offset value OFFSET1 between the first temperature curve TC1 and the standard temperature curve STC.

Further, after calculating the first offset value OFFSET1, the processor 140 can subtract the reference values RF1-RFN on the first temperature curve TC1 from the first offset value OFFSET1 respectively, so that the first temperature curve TC1 is shifted downward by the unit amount of the first offset value OFFSET1 toward the direction of the standard temperature curve STC, so that the first temperature curve TC1 approaches the standard temperature curve STC.

Therefore, the processor 140 can perform the first temperature calibration action on the temperature testing system 100 according to the standard ambient temperatures T1-TN, the reference values RF1-RFN and the first offset value OFFSET1, and obtain the operating temperature and the The first calibration curve CV1 between the operating voltages (as shown in FIG. 2B ).

On the other hand, please refer to FIG. 1 and FIG. 2C at the same time. After the processor 140 generates the first calibration curve CV1 , the processor 140 may continuously receive (read) the test values TS1 -TSN from the memory 130 . In this embodiment, the processor 140 can perform a second temperature calibration operation on the temperature testing system 100 according to the test values TS1-TSN, the first offset value OFFSET1, and the standard ambient temperature T1-TN, and through the objective function ML. , so as to obtain a second calibration curve CV2 between the operating temperature and the operating voltage (as shown in FIG. 2C ).

In this way, the processor 140 of this embodiment can make the second calibration curve CV2 closer to the standard temperature curve STC through two temperature calibration operations, so as to improve the performance of the temperature testing system 100 when performing temperature testing on the device 120 to be tested. Rate.

The implementation details of the correction action of the temperature curve will be described with the example presented in FIG. 3A and FIG. 3B . 3A to 3B are schematic diagrams of multiple temperature curves according to another embodiment of FIG. 1 of the present invention.

In this regard, for the convenience of description, as shown in Table (1), in this embodiment, it is assumed that the processor 140 samples the standard ambient temperatures of 10°C, 25°C and 70°C in the environment.

The standard sensor 110 can generate reference values of 11°C, 27°C and 67°C correspondingly according to these standard ambient temperatures (10°C, 25°C and 70°C). The device under test 120 can generate 12°C, 28°C, and 74°C correspondingly according to the operating temperature of the device under test 120 at these standard ambient temperatures (10°C, 25°C, and 70°C). test value. Temperature sample Tn (n=3) T1 T2 T3 Standard ambient temperature (°C) 10 25 70 Reference value (°C) 11 27 67 Test value (°C) 12 28 74 Table 1)

Please refer to FIG. 1 and FIG. 3A at the same time. Specifically, the processor 140 may receive reference values of 11°C, 27°C and 67°C from the memory 130, and obtain the first temperature curve TC1 based on these reference values. . Next, the processor 140 may use the standard ambient temperature of 25°C on the standard temperature curve STC as a reference value, and compare the reference value of 27°C on the first temperature curve TC1 with the standard ambient temperature of 25°C. subtract, to calculate the first offset value OFFSET1 between the first temperature curve TC1 and the standard temperature curve STC is 2°C.

After the processor 140 calculates the first offset value OFFSET1, the processor 140 can compare the multiple reference values (11°C, 27°C and 67°C) on the first temperature curve TC1 with 2°C respectively. The first offset value OFFSET1 is subtracted to obtain a plurality of first correction values CC1 (9°C, 25°C and 65°C) as shown in Table (2). Moreover, the processor 140 can generate the first calibration curve CV1 according to the first calibration value CC1 of 9°C, 25°C and 65°C. First correction value (first offset value=2) 9 25 65 Second correction value (first offset value=2) 10 26 72 Third correction value (second offset value=0.7) 9.55 25 71.35 Table 2)

In other words, in this embodiment, the temperature testing system 100 can perform the first temperature calibration action on the temperature testing system 100 according to the first calibration value CC1 and a plurality of reference values generated by the standard sensor 110 .

On the other hand, after the temperature testing system 100 completes the first temperature calibration action, the processor 140 may continuously receive the test values of 12°C, 28°C and 74°C from the memory 130 . Next, the processor 140 may subtract the test values of 12°C, 28°C, and 74°C from the first offset value OFFSET1 (2°C) respectively to obtain the multiple values shown in Table (2). a second correction value CC2 (10°C, 26°C and 72°C). At this time, the processor 140 can obtain the second temperature curve TC2 according to the second correction value CC2 of 10°C, 26°C and 72°C.

In particular, in this embodiment, the processor 140 can base on a plurality of second correction values CC2 (10°C, 26°C and 72°C) and a plurality of standard ambient temperatures (10°C, 25°C C and 70°C) to generate the objective function ML.

In this embodiment, the objective function ML may be, for example, a linear regression function (linear regression). The processor 140 can use the least square method ( least squares method) to generate the objective function ML.

For example, the objective function ML of this embodiment can be, for example, the following formula (1), wherein, X in the following formula (1) is the standard ambient temperature, and Y in the following formula (1) is the predicted temperature value, and n in the following formula (1) is the number of temperature samples: Y=a+bX （1）

Among them, the parameter b=((the sum of the products of X and the corresponding Y)-n*(the average of X)*(the average of Y))/((the sum of the squares of X)-n*(the average of X square)) =(10 * 10 + 25 * 26 + 70 * 72 - 3 * 35 * 36) / (10 * 10 + 25 * 25 + 70 * 70 - 3 * 35 * 35) =2010/1950 =1.03

Among them, the parameter a=(average of Y)-(average of b*X) =36-1.03*35 =-0.05

According to the above analysis and calculation, it can be known that the processor 140 can be based on multiple second correction values CC2 (10°C, 26°C and 72°C) and multiple standard ambient temperatures (10°C, 25°C and 70°C) °C) to obtain the objective function ML of Y=1.03X-0.05 by means of least squares analysis.

Further, after the processor 140 obtains the objective function ML, the processor 140 can calculate multiple predicted temperature values PT1 according to multiple standard ambient temperatures (10°C, 25°C, and 70°C) and the objective function ML ~PTN.

For example, as shown in Table (3), the processor 140 can respectively input these standard ambient temperatures (10°C, 25°C and 70°C) into the parameter X in the objective function ML to obtain correspondingly Predicted temperature values of 10.25°C, 25.7°C, and 72.05°C. Moreover, the processor may obtain the third temperature curve TC3 according to these predicted temperature values (10.25°C, 25.7°C and 72.05°C).

Next, the processor 140 may use the standard ambient temperature of 25°C on the standard temperature curve STC as a reference value, and compare the predicted temperature value of 25.7°C on the third temperature curve TC3 with the standard ambient temperature of 25°C. Subtracting them to calculate the second offset value OFFSET2 between the third temperature curve TC3 and the standard temperature curve STC is 0.7°C.

After the processor 140 calculates the second offset value OFFSET2, the processor 140 can compare the multiple predicted temperature values (10.25°C, 25.7°C and 72.05°C) on the third temperature curve TC3 with 0.7°C respectively. The second offset value OFFSET2 is subtracted to obtain a plurality of third correction values CC3 (9.55°C, 25°C and 71.35°C) as shown in Table (3). Moreover, the processor 140 can generate the second calibration curve CV2 according to the third calibration value CC3 of 9.55°C, 25°C and 71.35°C. Standard ambient temperature (°C) 10 25 70 Predicted temperature value (°C) 10.25 25.7 72.05 Third correction value (offset value=0.7) 9.55 25 71.35 table 3)

In other words, as shown in FIG. 3B , after completing the first temperature correction action (that is, after generating the first correction curve CV1), the processor 140 of this embodiment can further correct the temperature according to the second correction value CC2 and the third correction The value CC3 and a plurality of test values generated by the device under test 120 are used to generate a second calibration curve CV2 through the objective function ML, so as to perform a second temperature calibration operation on the temperature testing system 100 .

In this way, through the processor 140 performing two temperature calibration actions on the temperature testing system 100, the second calibration curve CV2 can be closer to the standard temperature curve STC, thereby increasing the temperature of the temperature testing system 100 for the device 120 to be tested. yield during testing and reduce yield loss during temperature testing.

FIG. 4 is a flowchart illustrating a temperature testing method according to an embodiment of the present invention. Please refer to FIG. 1 and FIG. 4 at the same time. In step S410 , the temperature testing system provides a standard sensor to sense a plurality of standard ambient temperatures to generate a plurality of reference values respectively. In step S420, the temperature testing system provides the device under test to sense a plurality of operating temperatures to generate a plurality of test values. In step S430, the processor of the temperature testing system obtains the first offset value according to the difference between one of the multiple reference values and the corresponding standard ambient temperature, and generates first calibration curve.

In step S440, the processor of the temperature testing system adjusts a plurality of test values according to the first offset value to obtain a plurality of second calibration values. In step S450, the processor of the temperature testing system calculates a plurality of predicted temperature values according to a plurality of second calibration values and a plurality of standard ambient temperatures. In step S460, the processor of the temperature testing system calculates the difference between one of the plurality of predicted temperature values and the corresponding standard ambient temperature to generate a second offset value. In step S470, the processor of the temperature testing system adjusts a plurality of predicted temperature values according to the second offset value, and generates a second calibration curve according to the adjusted plurality of predicted temperature values.

The implementation details of each step have been described in detail in the aforementioned embodiments and implementation manners, and will not be repeated here.

To sum up, in the temperature testing system and its temperature testing method described in the various embodiments of the present invention, the processor can further base on the second correction value, the third correction value and the waiting time after completing the first temperature correction action. The multiple test values generated by the measuring device are used to generate a second calibration curve through the objective function, so as to perform a second temperature calibration action on the temperature testing system. In this way, the processor can make the second calibration curve closer to the standard temperature curve, so as to improve the yield rate of the temperature test system and reduce the yield loss during the temperature test.

100:Temperature test system 110: Standard sensor 120: device under test 130: memory 140: Processor CV1: first calibration curve CV2: second calibration curve RF1～RFN: Reference value STC: standard temperature curve S410～S470: Steps TS1～TSN: Test value TC1: The first temperature curve TC2: second temperature curve TC3: The third temperature curve

FIG. 1 is a schematic diagram illustrating a temperature testing system according to an embodiment of the present invention. 2A to 2C are schematic diagrams of multiple temperature curves according to an embodiment of the present invention shown in FIG. 1 . 3A to 3B are schematic diagrams of multiple temperature curves according to another embodiment of FIG. 1 of the present invention. FIG. 4 is a flowchart illustrating a temperature testing method according to an embodiment of the present invention.

100:Temperature test system

110: Standard sensor

120: device under test

130: memory

140: Processor

CV1: first calibration curve

CV2: second calibration curve

RF1~RFN: Reference value

TS1~TSN: Test value

Claims (10)

A temperature testing system, comprising: a standard sensor, which senses a plurality of standard ambient temperatures to generate a plurality of reference values respectively; a device under test, which senses a plurality of operating temperatures to generate a plurality of test values; and a processor coupled to to the device under test and the standard sensor, wherein the processor is configured to: obtain a first offset value according to the difference between one of the plurality of reference values and the corresponding standard ambient temperature , and generate a first calibration curve according to the first offset value and the plurality of reference values; adjust the plurality of test values according to the first offset value to obtain a plurality of second calibration values; The plurality of second correction values and the plurality of standard ambient temperatures are used to generate an objective function; the plurality of predicted temperature values are calculated according to the plurality of standard ambient temperatures and the objective function; the plurality of predicted temperature values are calculated; The difference between one of the predicted temperature values and the corresponding standard ambient temperature to generate a second offset value; and adjust the plurality of predicted temperature values according to the second offset value, and adjust according to the adjusted The plurality of predicted temperature values to generate a second calibration curve, wherein the plurality of reference values, the plurality of test values, the first offset value, the second offset value, and the The plurality of second calibration values are temperature values, and the first calibration curve and the second calibration curve are voltage-temperature curves. The temperature test system as described in claim 1, wherein the temperature test system further includes: a memory, coupled between the standard sensor, the device under test and the processor, for storing the The plurality of reference values and the plurality of test values. The temperature testing system according to claim 1, wherein the processor is further configured to: adjust the multiple reference values according to the first offset value to obtain multiple first correction values; and adjust the multiple reference values according to the multiple a first calibration value to generate the first calibration curve. The temperature testing system as claimed in claim 3, wherein the processor is further configured to: subtract the plurality of reference values from the first offset values to obtain the plurality of first calibration values. The temperature testing system according to claim 1, wherein the processor is further configured to: subtract the plurality of predicted temperature values from the second offset value to obtain a plurality of third correction values, and The second calibration curve is generated according to the plurality of third calibration values. A temperature testing method for a temperature testing system, comprising: providing a standard sensor to sense a plurality of standard ambient temperatures to generate a plurality of reference values respectively; providing a device to be tested to sense a plurality of operating temperatures to generate a plurality of test values; The processor obtains a first offset value according to the difference between one of the plurality of reference values and the corresponding standard ambient temperature, and obtains a first offset value according to the first offset value and the plurality of reference values to generating a first correction curve; adjusting the plurality of test values by the processor according to the first offset value to obtain a plurality of second correction values; by the processor according to the plurality of second correction values and the plurality of standard ambient temperatures to generate an objective function; the processor calculates the plurality of predicted temperature values according to the plurality of standard ambient temperatures and the objective function; the processor calculates the The difference between one of the plurality of predicted temperature values and the corresponding standard ambient temperature to generate a second offset value; and the processor adjusts the plurality of predicted temperature values according to the second offset value Predict the temperature value, and generate a second calibration curve according to the adjusted plurality of predicted temperature values, wherein the plurality of reference values, the plurality of test values, the first offset value, the second The two offset values and the plurality of second calibration values are temperature values, and the first calibration curve and the second calibration curve are voltage-temperature curves. The temperature testing method as claimed in claim 6, further comprising: providing a memory to store the reference values and the test values. The temperature testing method according to claim 6, wherein the step of generating the first calibration curve according to the first offset value and the plurality of reference values includes: adjusting the plurality of reference values by the processor according to the first offset value to obtain a plurality of first correction values; and generating the first correction value by the processor according to the plurality of first correction values a calibration curve. The temperature testing method according to claim 8, wherein the step of adjusting the multiple reference values by the processor according to the first offset value to obtain the multiple first correction values includes: by the The processor subtracts the plurality of reference values from the first offset values respectively to obtain the plurality of first correction values. The temperature testing method according to claim 6, wherein the processor adjusts the multiple predicted temperature values according to the second offset value, and generates the multiple predicted temperature values according to the adjusted multiple predicted temperature values The step of using the second correction curve includes: subtracting the plurality of predicted temperature values from the second offset value by the processor to obtain a plurality of third correction values, and according to the plurality of first Three calibration values to generate the second calibration curve.

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