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TWI801778B - Probe card - Google Patents

Probe card Download PDF

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Publication number
TWI801778B
TWI801778B TW109141385A TW109141385A TWI801778B TW I801778 B TWI801778 B TW I801778B TW 109141385 A TW109141385 A TW 109141385A TW 109141385 A TW109141385 A TW 109141385A TW I801778 B TWI801778 B TW I801778B
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TW
Taiwan
Prior art keywords
circuit board
probe card
contacts
accommodating space
electronic component
Prior art date
Application number
TW109141385A
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Chinese (zh)
Other versions
TW202124974A (en
Inventor
林丈棖
陳俊吉
李宗潤
盧彥宏
Original Assignee
新特系統股份有限公司
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Publication of TW202124974A publication Critical patent/TW202124974A/en
Application granted granted Critical
Publication of TWI801778B publication Critical patent/TWI801778B/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

A probe card for coupling a test machine and a number of probe needles. The probe card comprises a circuit board having a first surface and a second surface on both sides in the axial direction. The circuit board has a plurality of first contacts and a plurality of second contacts. The first contacts are electrically connected to the test machine and the second contacts are electrically connected to the probe needles. The first surface faces toward the test machine and the second surface faces toward the probe needles. The circuit board is provided with a cavity on the second surface and an electronic component is arranged in the cavity. By providing a cavity on the second surface of the circuit board leads to a larger usable surface.

Description

探針卡probe card

本發明關於一種探針卡，尤其是在電路板表面設有電子元件的探針卡。The invention relates to a probe card, especially a probe card with electronic components on the surface of a circuit board.

在積體電路元件的製造過程中，晶粒切割或元件封裝之前會進行電性測試，這通常藉由探針卡(Probe Card)將測試機(Tester)所提供的電源訊號與測試訊號傳輸給待測元件(Device Under Testing，簡稱DUT)，以對待測元件進行檢測。In the manufacturing process of integrated circuit components, electrical testing will be carried out before die cutting or component packaging. This usually uses a probe card (Probe Card) to transmit the power signal and test signal provided by the tester (Tester) to DUT (Device Under Testing, referred to as DUT) is used to test the DUT.

習知技術的探針卡可參閱第一圖，其結構主體為一印刷電路板9。該印刷電路板9具有數個第一接點91及數個第二接點92。該些第一接點91經由連接構造T電性連接測試機，該連接構造T常見為彈簧連接器/頂針(Pogo Pin)，以分別連接測試機和位於印刷電路板9外側的第一接點91。位於印刷電路板9內側的該些第二接點92電性連接導電探針P，導電探針P係藉由探針座固定於印刷電路板9上，且導電探針P可向下接觸一待測元件D的測試墊片(Testing pad)。Referring to the first figure, the probe card of the prior art is mainly composed of a printed circuit board 9 . The printed circuit board 9 has a plurality of first contacts 91 and a plurality of second contacts 92 . The first contacts 91 are electrically connected to the testing machine via a connection structure T, which is usually a spring connector/thimble (Pogo Pin), to respectively connect the testing machine and the first contacts located on the outside of the printed circuit board 9 91. The second contacts 92 located on the inner side of the printed circuit board 9 are electrically connected to the conductive probes P, and the conductive probes P are fixed on the printed circuit board 9 by the probe base, and the conductive probes P can contact a downward direction. The testing pad of DUT.

請一併參照第二圖所示，係該印刷電路板9的一局部區域9’放大圖。一般而言會需要在印刷電路板9上設置電子元件1，該電子元件1可能為電晶體、二極體等主動元件，也可能是電阻、電容等被動元件。印刷電路板9通常由多層電路板組成，且印刷電路板9設有電路線93或導通孔94以耦接各個元件。電路板9兩側分別為一第一表面9a及一第二表面9b，該第二表面9b係朝向晶圓上的待測元件，無法讓電子元件1設置，故該電子元件1係設置於朝向測試機的第一表面9a。然而，印刷電路板9位在該些第一接點91外側的區域A被第一接點91隔開，難以讓電子元件1設置；另一方面，印刷電路板9位在該些第二接點92內側的區域B通常供數量繁多的探針走線，也難以用來設置電子元件1。Please also refer to the second figure, which is an enlarged view of a partial area 9' of the printed circuit board 9. Generally speaking, it is necessary to arrange electronic components 1 on the printed circuit board 9 , and the electronic components 1 may be active components such as transistors and diodes, or passive components such as resistors and capacitors. The printed circuit board 9 is generally composed of multilayer circuit boards, and the printed circuit board 9 is provided with circuit lines 93 or via holes 94 for coupling various components. The two sides of the circuit board 9 are respectively a first surface 9a and a second surface 9b. The second surface 9b is facing the component to be tested on the wafer, and the electronic component 1 cannot be arranged, so the electronic component 1 is arranged facing The first surface 9a of the testing machine. However, the printed circuit board 9 is separated by the first contact 91 in the area A outside the first contacts 91, which makes it difficult for the electronic component 1 to be arranged; The area B inside the point 92 is usually used for routing a large number of probes, and it is also difficult to place the electronic component 1 .

也就是說，習知技術的探針卡真正可讓電子元件1設置的區域，只有印刷電路板9的第一表面9a位於該些第一接點91和該些第二接點92之間的狹小部分。更何況現有積體電路晶片越趨精密，探針卡為了滿足輸入/輸出訊號數量變多、運作速度提升或功能增加的晶片檢測需求，勢必需要設置數目更多且更複雜的電子元件。That is to say, in the probe card of the prior art, only the first surface 9a of the printed circuit board 9 is located between the first contact points 91 and the second contact points 92 in the region where the electronic component 1 can be installed. small part. What's more, as the existing integrated circuit chips are becoming more and more sophisticated, in order to meet the chip inspection requirements of increasing the number of input/output signals, increasing the operating speed, or increasing the functions, the probe card must be equipped with more and more complex electronic components.

綜上所述，在習知技術中印刷電路板9上可供設置電子元件1的區域面積不足，伴隨著半導體技術的演進已經到了不敷使用的地步，亟需提供一種進一步改良的探針卡以解決上述問題。To sum up, in the prior art, the area on which the electronic components 1 can be placed on the printed circuit board 9 is insufficient, and with the evolution of semiconductor technology, it has reached the point where it is not enough for use, and it is urgent to provide a further improved probe card to solve the above problems.

本發明之目的，在於提供一種探針卡，其供耦接一測試機及數個導電探針，該探針卡包含：一電路板，該電路板於軸向兩側分別為一第一表面及一第二表面，該電路板具有數個第一接點及數個第二接點，該些第一接點供電性連接該測試機，該些第二接點供電性連接該些導電探針。其中，該第一表面係朝向該測試機，該第二表面係朝向該些導電探針，該電路板於該第二表面設置一容置空間，該容置空間中設置一電子元件。The object of the present invention is to provide a probe card for coupling a testing machine and several conductive probes, the probe card includes: a circuit board, the circuit board is respectively a first surface on both axial sides and a second surface, the circuit board has a plurality of first contacts and a plurality of second contacts, the first contacts are connected to the testing machine for power supply, and the second contacts are connected to the conductive probes for power supply Needle. Wherein, the first surface is facing the testing machine, the second surface is facing the conductive probes, the circuit board is provided with an accommodating space on the second surface, and an electronic component is arranged in the accommodating space.

本發明之探針卡透過於電路板朝向導電探針的第二表面上設置容置空間，以供設置電子元件，可以有效解決習知技術供設置電子元件的區域面積不足之問題，進而得以容納更多或者更大的電子元件，並可同時避免電子元件過度占用電路板面積，使電路板具有更大的可利用表面。The probe card of the present invention provides an accommodating space on the second surface of the circuit board facing the conductive probes for arranging electronic components, which can effectively solve the problem of insufficient area for arranging electronic components in the prior art, and thus can be accommodated More or larger electronic components, while avoiding excessive occupation of the circuit board area by the electronic components, so that the circuit board has a larger usable surface.

在說明書及請求項當中使用了某些詞彙指稱特定的元件，然，所屬本發明技術領域中具有通常知識者應可理解，製造商可能會用不同的名詞稱呼同一個元件，而且，本說明書及請求項並不以名稱的差異作為區分元件的方式，而是以元件在整體技術上的差異作為區分的準則。在通篇說明書及請求項當中所提及的「包含」為一開放式用語，故應解釋成「包含但不限定於」。再者，「耦接」一詞在此包含直接及間接的連接手段。因此，若文中描述一第一裝置耦接一第二裝置，則代表第一裝置可直接連接第二裝置，或可透過其他裝置或其他連接手段間接地連接至第二裝置。Some terms are used in the specification and claims to refer to specific components. However, those with ordinary knowledge in the technical field of the present invention should understand that manufacturers may use different terms to refer to the same component. Moreover, this specification and The claim item does not use the difference in name as the way to distinguish the components, but the difference in the overall technology of the components as the criterion for distinguishing. "Includes" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to". Furthermore, the term "coupled" herein includes both direct and indirect means of connection. Therefore, if it is described that a first device is coupled to a second device, it means that the first device may be directly connected to the second device, or may be indirectly connected to the second device through other devices or other connection means.

為方便說明，請參閱第三圖，其為本發明之探針卡第一實施例的剖面結構局部放大示意圖。如圖所示，在該第一實施例中包含一電路板2，電路板2兩側分別為一第一表面2a及一第二表面2b。該第一表面2a係朝向測試機，該第二表面2b係朝向導電探針(圖未示)。電路板2具有數個第一接點21及數個第二接點22，且電路板2設有電路線23或導通孔24以耦接各個元件。該些第一接點22位於電路板2的徑向外側，且該第一接點22裸露於該第一表面2a，以供經由連接構造T電性連接測試機，該連接構造T常見為彈簧連接器/頂針。該些第二接點22位於電路板2的徑向內側，且該些第二接點22至少裸露於該第二表面2b，以供電性連接導電探針。電路板2於該第二表面2b上設置一個或數個容置空間R，容置空間R係供設置電子元件1。For convenience of description, please refer to FIG. 3 , which is a partially enlarged schematic diagram of the cross-sectional structure of the first embodiment of the probe card of the present invention. As shown in the figure, the first embodiment includes a circuit board 2, and two sides of the circuit board 2 are respectively a first surface 2a and a second surface 2b. The first surface 2a is facing the testing machine, and the second surface 2b is facing the conductive probe (not shown). The circuit board 2 has a plurality of first contacts 21 and a plurality of second contacts 22 , and the circuit board 2 is provided with circuit lines 23 or via holes 24 for coupling various components. The first contact points 22 are located on the radially outer side of the circuit board 2, and the first contact points 22 are exposed on the first surface 2a, so as to be electrically connected to the testing machine through the connection structure T, and the connection structure T is usually a spring. Connector/thimble. The second contacts 22 are located on the inner side of the circuit board 2 in the radial direction, and the second contacts 22 are at least exposed on the second surface 2 b to connect the conductive probes with power supply. The circuit board 2 is provided with one or several accommodating spaces R on the second surface 2 b, and the accommodating spaces R are used for arranging the electronic components 1 .

詳言之，在本實施例中，該電路板2可由多層印刷電路板組成，其可包含相互堆疊之一第一電路板25、一第二電路板26及一第三電路板27。該第一電路板25係朝向測試機而具有該第一表面2a，該第三電路板27係朝向導電探針而具有該第二表面2b。該第三電路板27可以開設一容置空間R以供設置一電子元件1。該容置空間R沿著該探針卡呈環狀凹槽，或者也可呈矩形、圓形或橢圓形的孔槽。此外，該容置空間R較佳於徑向上設置於該些第二接點22外側。Specifically, in this embodiment, the circuit board 2 can be composed of multi-layer printed circuit boards, which can include a first circuit board 25 , a second circuit board 26 and a third circuit board 27 stacked on each other. The first circuit board 25 has the first surface 2a facing the testing machine, and the third circuit board 27 has the second surface 2b facing the conductive probes. The third circuit board 27 can define an accommodating space R for disposing an electronic component 1 . The accommodating space R is in the form of an annular groove along the probe card, or may also be in the form of a rectangular, circular or elliptical hole. In addition, the accommodating space R is preferably disposed radially outside the second contacts 22 .

該容置空間R可以沿軸向貫穿該第三電路板27，故在本實施例中該電子元件1可以設置於該第二電路板26裸露於該容置空間R的一表面，惟本發明並不以此為限。該電子元件1係經由該電路板2的電路線23或導通孔24以耦接其他元件。The accommodating space R can pass through the third circuit board 27 in the axial direction, so in this embodiment, the electronic component 1 can be disposed on a surface of the second circuit board 26 exposed in the accommodating space R, but the present invention It is not limited to this. The electronic component 1 is coupled to other components via the circuit wire 23 or the via hole 24 of the circuit board 2 .

藉此，本發明之探針卡第一實施例透過於電路板2的第二表面2b上設置容置空間R以供設置電子元件1，可以有效解決習知技術的探針卡只有印刷電路板9局部的第一表面9a供設置電子元件的問題，進而得以容納更多或者更大的電子元件；本發明第一實施例並可同時減少電子元件1占用電路板2的面積，使電路板2具有更大的可利用表面。In this way, the first embodiment of the probe card of the present invention can effectively solve the problem that the probe card in the prior art only has a printed circuit board by providing an accommodating space R on the second surface 2b of the circuit board 2 for setting the electronic components 1. 9 Partial first surface 9a is provided for the problem of arranging electronic components, thereby being able to accommodate more or larger electronic components; the first embodiment of the present invention can simultaneously reduce the area occupied by electronic components 1 on circuit board 2, making circuit board 2 have a larger usable surface.

請參閱第四圖，其為本發明之探針卡第二實施例的剖面結構局部放大示意圖。如圖所示，與前述第一實施例差異之處在於，該電路板2除了包含多層印刷電路板（例如相互堆疊之一第一電路板25及一第二電路板26）外，還可於該電路板2的第二表面2b設置一增高板28，該增高板28的材質和印刷電路板可以相同。增高板28係供墊高該電路板2的軸向高度，使其符合探針卡的預定規格。且該增高板28上可以預留孔位，使其結合於該第二表面2b後形成容置空間R。同樣地，容置空間R係供設置電子元件1。Please refer to FIG. 4 , which is a partially enlarged schematic diagram of the cross-sectional structure of the second embodiment of the probe card of the present invention. As shown in the figure, the difference from the aforementioned first embodiment is that the circuit board 2, in addition to comprising a multi-layer printed circuit board (such as a first circuit board 25 and a second circuit board 26 stacked on each other), can also be used on The second surface 2b of the circuit board 2 is provided with a riser board 28, and the material of the riser board 28 can be the same as that of the printed circuit board. The heightening plate 28 is used to pad the axial height of the circuit board 2 to meet the predetermined specification of the probe card. Moreover, holes can be reserved on the heightening plate 28 to form the accommodating space R after being combined with the second surface 2b. Likewise, the accommodating space R is for setting the electronic components 1 .

請一併參照第四A圖所示，其係本發明探針卡第二實施例的元件關係示意圖。在本實施例中，該電路板2係設有數個容置空間R，且設置於不同容置空間R中的電子元件1係經由該電路板2（如該第二電路板26）的電路線23或導通孔24以相互耦接。或者，請參照第四B圖所示，其係本發明探針卡第二實施例的另一元件關係示意圖。設置於容置空間R中的電子元件1和設置於該電路板2之第一表面2a上的電子元件1可以經由該第一電路板25及該第二電路板26的電路線23或導通孔24以相互耦接。據此，本實施例的探針卡除了同樣設置容置空間R以供設置電子元件1外，還可有效提升電子元件1的擺放設計彈性。Please also refer to FIG. 4 , which is a schematic diagram of the relationship between components of the second embodiment of the probe card of the present invention. In this embodiment, the circuit board 2 is provided with several accommodating spaces R, and the electronic components 1 arranged in different accommodating spaces R pass through the circuit lines of the circuit board 2 (such as the second circuit board 26 ). 23 or via holes 24 to couple with each other. Alternatively, please refer to FIG. 4 B , which is a schematic diagram of another component relationship of the second embodiment of the probe card of the present invention. The electronic components 1 disposed in the accommodating space R and the electronic components 1 disposed on the first surface 2a of the circuit board 2 can pass through the circuit lines 23 or via holes of the first circuit board 25 and the second circuit board 26 24 to couple with each other. Accordingly, the probe card of this embodiment not only provides the accommodating space R for arranging the electronic components 1 , but also effectively enhances the design flexibility of placing the electronic components 1 .

請參閱第五圖，其為本發明之探針卡第三實施例的剖面結構局部放大示意圖。如圖所示，與前述二實施例差異之處在於，該電路板2在多層印刷電路板（例如相互堆疊之一第一電路板25及一第二電路板26）外，係於該電路板2的第二表面2b設置一增強板29，該增強板29的材質和印刷電路板不同。增強板29係供加固及強化電路板2的結構強度，且該增強板29上可以預留孔位，使其結合於該第二表面2b後形成容置空間R，以供設置電子元件1。值得注意的是，該增強板29還可以結合一蓋板291，以遮蔽該容置空間R進而保護該電子元件1和晶圓表面。Please refer to FIG. 5 , which is a partially enlarged schematic diagram of the cross-sectional structure of the third embodiment of the probe card of the present invention. As shown in the figure, the difference with the foregoing two embodiments is that the circuit board 2 is tied to the circuit board outside the multilayer printed circuit board (such as a first circuit board 25 and a second circuit board 26 stacked on each other). A reinforcement board 29 is provided on the second surface 2b of 2, and the material of the reinforcement board 29 is different from that of the printed circuit board. The reinforcing plate 29 is used to reinforce and strengthen the structural strength of the circuit board 2 , and holes can be reserved on the reinforcing plate 29 to combine with the second surface 2 b to form an accommodating space R for arranging the electronic components 1 . It should be noted that the reinforcing plate 29 can also be combined with a cover plate 291 to cover the accommodating space R to protect the electronic component 1 and the surface of the wafer.

請參閱第六圖，其為本發明之探針卡第四實施例的剖面結構局部放大示意圖。如圖所示，與前述第三實施例差異之處在於，設置於容置空間R中的電子元件1可以耦接貫穿該電路板2的導通孔24’，該導通孔24’係電性連接至該電路板2之第一表面2a。藉此，原先設置於該電路板2之第一表面2a上的電子元件1均可直接移動至該容置空間R中而無須重新設計走線，大幅提升本發明實施例的實用性。Please refer to FIG. 6 , which is a partially enlarged schematic diagram of the cross-sectional structure of the fourth embodiment of the probe card of the present invention. As shown in the figure, the difference from the aforementioned third embodiment is that the electronic component 1 disposed in the accommodating space R can be coupled to the via hole 24' penetrating the circuit board 2, and the via hole 24' is electrically connected. to the first surface 2a of the circuit board 2 . Thereby, the electronic components 1 originally arranged on the first surface 2a of the circuit board 2 can be directly moved into the accommodating space R without redesigning the wiring, which greatly improves the practicability of the embodiment of the present invention.

綜上所述，本發明提供一種探針卡，該探針卡之各個實施例透過於電路板朝向導電探針的第二表面上設置容置空間，以供設置電子元件，可以有效解決習知技術的探針卡只有印刷電路板局部的第一表面可供設置電子元件的問題，進而得以容納更多或者更大的電子元件；本發明各實施例並可同時減少電子元件占用電路板的面積，使電路板具有更大的可利用表面。To sum up, the present invention provides a probe card. Various embodiments of the probe card provide accommodating space for electronic components on the second surface of the circuit board facing the conductive probes, which can effectively solve the conventional problem. The probe card of the technology only has the problem that the first surface of the printed circuit board can be provided with electronic components, so as to accommodate more or larger electronic components; various embodiments of the present invention can also reduce the area occupied by electronic components on the circuit board , so that the circuit board has a larger usable surface.

以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

1:電子元件 2:電路板 2a:第一表面 2b:第二表面 21:第一接點 22:第二接點 23:電路線 24:導通孔 24’:導通孔 25:第一電路板 26:第二電路板 27:第三電路板 28:增高板 29:增強板 291:蓋板 T:連接構造 R:容置空間 P:導電探針 D:待測元件 9:印刷電路板 9’:局部區域 9a:第一表面 9b:第二表面 91:第一接點 92:第二接點 93:電路線 94:導通孔 A:區域 B:區域1: Electronic components 2: circuit board 2a: first surface 2b: second surface 21: The first contact 22: Second contact 23: circuit line 24: Via hole 24': Via hole 25: First circuit board 26: Second circuit board 27: The third circuit board 28: Heightening board 29: reinforcement board 291: cover plate T: connection structure R: storage space P: conductive probe D: Component to be tested 9: Printed circuit board 9': local area 9a: first surface 9b: second surface 91: first contact 92: Second contact 93: circuit line 94: Via hole A: area B: area

第一圖：習知技術一探針卡的剖面結構示意圖； 第二圖：習知技術探針卡的剖面結構局部放大示意圖； 第三圖：本發明探針卡第一實施例的剖面結構局部放大示意圖； 第四圖：本發明探針卡第二實施例的剖面結構局部放大示意圖； 第四A圖：本發明探針卡第二實施例的元件關係示意圖； 第四B圖：本發明探針卡第二實施例的另一元件關係示意圖； 第五圖：本發明探針卡第三實施例的剖面結構局部放大示意圖；及 第六圖：本發明探針卡第四實施例的剖面結構局部放大示意圖。The first figure: a schematic cross-sectional structure diagram of a conventional technology-probe card; The second figure: a partially enlarged schematic diagram of a cross-sectional structure of a conventional probe card; The third figure: a partially enlarged schematic diagram of the cross-sectional structure of the first embodiment of the probe card of the present invention; Figure 4: a partially enlarged schematic diagram of the cross-sectional structure of the second embodiment of the probe card of the present invention; The fourth figure A: a schematic diagram of the relationship between components of the second embodiment of the probe card of the present invention; The fourth figure B: a schematic diagram of another component relationship of the second embodiment of the probe card of the present invention; Figure 5: a partially enlarged schematic diagram of the cross-sectional structure of the third embodiment of the probe card of the present invention; and Figure 6: a partially enlarged schematic diagram of the cross-sectional structure of the fourth embodiment of the probe card of the present invention.

1:電子元件 1: Electronic components

2:電路板 2: circuit board

2a:第一表面 2a: first surface

2b:第二表面 2b: second surface

21:第一接點 21: The first contact

22:第二接點 22: Second contact

23:電路線 23: circuit line

24:導通孔 24: Via hole

25:第一電路板 25: First circuit board

26:第二電路板 26: Second circuit board

27:第三電路板 27: The third circuit board

T:連接構造 T: connection structure

R:容置空間 R: storage space

Claims (8)

一種探針卡，供耦接一測試機及數個導電探針，該探針卡包含：一電路板，該電路板於軸向兩側分別為一第一表面及一第二表面，該電路板具有數個第一接點及數個第二接點，該些第一接點裸露於該第一表面，以供電性連接該測試機，該些第二接點裸露於該第二表面，以供電性連接該些導電探針；其中，該第一表面係朝向該測試機，該第二表面係朝向該些導電探針，該電路板由多層印刷電路板組成，其包含相互堆疊之數個印刷電路板，且其中一個印刷電路板朝向該些導電探針而具有該第二表面，該印刷電路板於該第二表面設置一容置空間，該容置空間為開設於該第二表面的凹槽或孔槽，該容置空間中設置一電子元件。 A probe card for coupling a testing machine and several conductive probes, the probe card includes: a circuit board, the circuit board is respectively a first surface and a second surface on both axial sides, the circuit The board has a plurality of first contacts and a plurality of second contacts, the first contacts are exposed on the first surface to connect the testing machine with power supply, the second contacts are exposed on the second surface, The conductive probes are connected with power supply; wherein, the first surface is facing the testing machine, the second surface is facing the conductive probes, and the circuit board is composed of a multi-layer printed circuit board, which includes a number of stacked a printed circuit board, and one of the printed circuit boards has the second surface facing the conductive probes, the printed circuit board is provided with an accommodating space on the second surface, and the accommodating space is opened on the second surface A groove or a hole, and an electronic component is arranged in the accommodating space. 如請求項1所述之探針卡，其中，該電子元件經由該電路板的電路線或導通孔以耦接其他元件。 The probe card as claimed in claim 1, wherein the electronic component is coupled to other components through a circuit line or a via hole of the circuit board. 如請求項2所述之探針卡，其中，該電路板係設有數個容置空間，且設置於不同容置空間中的電子元件係經由該電路板的電路線或導通孔相互耦接。 The probe card according to claim 2, wherein the circuit board is provided with several accommodating spaces, and the electronic components disposed in different accommodating spaces are coupled to each other through circuit wires or via holes of the circuit board. 如請求項2所述之探針卡，其中，設置於容置空間中的該電子元件和設置於該電路板之第一表面上的另一電子元件經由該電路板的電路線或導通孔相互耦接。 The probe card according to claim 2, wherein the electronic component disposed in the accommodating space and another electronic component disposed on the first surface of the circuit board communicate with each other through circuit lines or via holes of the circuit board coupling. 如請求項2所述之探針卡，其中，該電子元件耦接貫穿該電路板的一導通孔。 The probe card as claimed in claim 2, wherein the electronic component is coupled to a via hole penetrating the circuit board. 如請求項1所述之探針卡，其中，該些第一接點位於該電路板的徑向外側，該些第二接點位於該電路板的徑向內側。 The probe card according to claim 1, wherein the first contacts are located radially outside the circuit board, and the second contacts are located radially inside the circuit board. 如請求項6所述之探針卡，其中，該容置空間於徑向上設置於該些第二接點外側。 The probe card as claimed in claim 6, wherein the accommodating space is arranged radially outside the second contacts. 如請求項1所述之探針卡，其中，該些第一接點經由彈簧連接器電性連接該測試機。 The probe card as claimed in claim 1, wherein the first contacts are electrically connected to the testing machine via a spring connector.
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