TWI801050B - 圖像感測器基板 - Google Patents
圖像感測器基板 Download PDFInfo
- Publication number
- TWI801050B TWI801050B TW110147990A TW110147990A TWI801050B TW I801050 B TWI801050 B TW I801050B TW 110147990 A TW110147990 A TW 110147990A TW 110147990 A TW110147990 A TW 110147990A TW I801050 B TWI801050 B TW I801050B
- Authority
- TW
- Taiwan
- Prior art keywords
- image sensor
- sensor substrate
- substrate
- image
- sensor
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Lens Barrels (AREA)
- Adjustment Of Camera Lenses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0014398 | 2019-02-07 | ||
| KR1020190014398A KR20200097086A (ko) | 2019-02-07 | 2019-02-07 | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202215137A TW202215137A (zh) | 2022-04-16 |
| TWI801050B true TWI801050B (zh) | 2023-05-01 |
Family
ID=71948329
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109103933A TWI754214B (zh) | 2019-02-07 | 2020-02-07 | 圖像感測器基板 |
| TW112100632A TW202321804A (zh) | 2019-02-07 | 2020-02-07 | 圖像感測器基板 |
| TW110147990A TWI801050B (zh) | 2019-02-07 | 2020-02-07 | 圖像感測器基板 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109103933A TWI754214B (zh) | 2019-02-07 | 2020-02-07 | 圖像感測器基板 |
| TW112100632A TW202321804A (zh) | 2019-02-07 | 2020-02-07 | 圖像感測器基板 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12132065B2 (zh) |
| EP (1) | EP3923332A4 (zh) |
| JP (2) | JP7299991B2 (zh) |
| KR (3) | KR20200097086A (zh) |
| CN (2) | CN118398633A (zh) |
| TW (3) | TWI754214B (zh) |
| WO (1) | WO2020162688A1 (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220092109A (ko) * | 2020-12-24 | 2022-07-01 | 엘지이노텍 주식회사 | 센서 구동 장치 |
| KR20220109674A (ko) * | 2021-01-29 | 2022-08-05 | 엘지이노텍 주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
| JP2022122057A (ja) * | 2021-02-09 | 2022-08-22 | 日本電産サンキョー株式会社 | 光学ユニット |
| EP4084586A1 (en) * | 2021-04-21 | 2022-11-02 | LG Innotek Co., Ltd. | A circuit board, an image sensor module, a lens driving device, and a camera module including the same |
| US20240098348A1 (en) * | 2022-07-21 | 2024-03-21 | Meta Platforms Technologies, Llc | Camera module on flexible interconnect tape |
| TWI827505B (zh) * | 2022-08-03 | 2023-12-21 | 大立光電股份有限公司 | 可移動式電子感光模組、相機模組及電子裝置 |
| WO2024075398A1 (ja) * | 2022-10-06 | 2024-04-11 | ソニーセミコンダクタソリューションズ株式会社 | カメラモジュール、および、撮像装置 |
| JP2024085328A (ja) | 2022-12-14 | 2024-06-26 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201423972A (zh) * | 2012-12-07 | 2014-06-16 | Sony Corp | 固態影像拾取器件及其製造方法，以及電子裝置 |
| KR20180081087A (ko) * | 2015-11-05 | 2018-07-13 | 멤스 드라이브, 인크. | Mems 액튜에이터 패키지 구조 |
| CN108474924A (zh) * | 2016-01-19 | 2018-08-31 | Lg伊诺特有限公司 | 透镜驱动装置、相机模组及光学设备 |
| CN108780207A (zh) * | 2016-03-11 | 2018-11-09 | 苹果公司 | 具有用于移动图像传感器的音圈电机的光学图像稳定 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126545A1 (ja) * | 2005-05-24 | 2006-11-30 | Matsushita Electric Industrial Co., Ltd. | カメラモジュール |
| KR100646560B1 (ko) | 2005-07-08 | 2006-11-14 | 자화전자(주) | 이미지센서를 이용한 시프트 방식의 손 떨림 보정장치 |
| KR100845333B1 (ko) | 2005-07-11 | 2008-07-10 | 주식회사 모비너스 | 소형 광학렌즈의 자동초점조절장치용 판스프링 |
| WO2013005360A1 (ja) | 2011-07-01 | 2013-01-10 | パナソニック株式会社 | 撮像装置 |
| JP5405622B2 (ja) * | 2011-08-12 | 2014-02-05 | シャープ株式会社 | カメラモジュール |
| JP5624529B2 (ja) * | 2011-09-27 | 2014-11-12 | 株式会社東芝 | 手振れ補正装置及び撮像装置 |
| US8817116B2 (en) | 2011-10-28 | 2014-08-26 | Lg Innotek Co., Ltd. | Camera module |
| KR102029783B1 (ko) | 2012-12-06 | 2019-10-08 | 엘지이노텍 주식회사 | 멤스 소자 및 흔들림 보정 장치 |
| KR101504024B1 (ko) | 2013-08-27 | 2015-03-18 | 삼성전기주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
| EP3260898B1 (en) | 2014-01-28 | 2021-09-15 | LG Innotek Co., Ltd. | Lens moving unit and camera module having the same |
| US9621775B2 (en) | 2014-05-06 | 2017-04-11 | Mems Drive, Inc. | Electrical bar latching for low stiffness flexure MEMS actuator |
| KR102388119B1 (ko) | 2015-08-18 | 2022-04-20 | 엘지이노텍 주식회사 | 카메라 장치 및 광학기기 |
| JP6708920B2 (ja) | 2015-11-16 | 2020-06-10 | ミツミ電機株式会社 | レンズ駆動装置、カメラモジュール及びカメラ搭載装置 |
| US20190033404A1 (en) | 2016-03-15 | 2019-01-31 | Koninklijke Philips N.V. | Articulated guide tube |
| KR102504333B1 (ko) | 2016-03-30 | 2023-02-28 | 엘지이노텍 주식회사 | 카메라 모듈 및 이를 포함하는 광학 기기 |
| EP3885829A1 (en) * | 2016-10-05 | 2021-09-29 | LG Innotek Co., Ltd. | Lens driving device, and camera module and optical device comprising same |
| JP2020515881A (ja) * | 2016-12-16 | 2020-05-28 | ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ | 光学画像安定化サスペンションにおけるセンサシフト構造 |
| US10863094B2 (en) * | 2017-07-17 | 2020-12-08 | Apple Inc. | Camera with image sensor shifting |
| KR102522700B1 (ko) | 2019-01-08 | 2023-04-18 | 엘지이노텍 주식회사 | 카메라 모듈 및 이를 포함하는 카메라 장치 |
-
2019
- 2019-02-07 KR KR1020190014398A patent/KR20200097086A/ko active IP Right Grant
-
2020
- 2020-02-06 CN CN202410416877.2A patent/CN118398633A/zh active Pending
- 2020-02-06 WO PCT/KR2020/001704 patent/WO2020162688A1/ko unknown
- 2020-02-06 US US17/426,763 patent/US12132065B2/en active Active
- 2020-02-06 CN CN202080013169.4A patent/CN113474892B/zh active Active
- 2020-02-06 JP JP2021546371A patent/JP7299991B2/ja active Active
- 2020-02-06 EP EP20752924.9A patent/EP3923332A4/en active Pending
- 2020-02-07 TW TW109103933A patent/TWI754214B/zh active
- 2020-02-07 TW TW112100632A patent/TW202321804A/zh unknown
- 2020-02-07 TW TW110147990A patent/TWI801050B/zh active
-
2023
- 2023-01-18 JP JP2023005689A patent/JP7556991B2/ja active Active
- 2023-05-25 KR KR1020230067498A patent/KR102723447B1/ko active Application Filing
-
2024
- 2024-10-23 KR KR1020240145981A patent/KR20240156350A/ko active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201423972A (zh) * | 2012-12-07 | 2014-06-16 | Sony Corp | 固態影像拾取器件及其製造方法，以及電子裝置 |
| KR20180081087A (ko) * | 2015-11-05 | 2018-07-13 | 멤스 드라이브, 인크. | Mems 액튜에이터 패키지 구조 |
| CN108474924A (zh) * | 2016-01-19 | 2018-08-31 | Lg伊诺特有限公司 | 透镜驱动装置、相机模组及光学设备 |
| CN108780207A (zh) * | 2016-03-11 | 2018-11-09 | 苹果公司 | 具有用于移动图像传感器的音圈电机的光学图像稳定 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020162688A1 (ko) | 2020-08-13 |
| KR102723447B1 (ko) | 2024-10-30 |
| EP3923332A4 (en) | 2022-12-28 |
| KR20200097086A (ko) | 2020-08-18 |
| CN113474892A (zh) | 2021-10-01 |
| KR20240156350A (ko) | 2024-10-29 |
| KR20230078623A (ko) | 2023-06-02 |
| JP2023052464A (ja) | 2023-04-11 |
| JP2022520370A (ja) | 2022-03-30 |
| US20220102417A1 (en) | 2022-03-31 |
| TW202101104A (zh) | 2021-01-01 |
| TWI754214B (zh) | 2022-02-01 |
| JP7556991B2 (ja) | 2024-09-26 |
| JP7299991B2 (ja) | 2023-06-28 |
| TW202321804A (zh) | 2023-06-01 |
| CN118398633A (zh) | 2024-07-26 |
| EP3923332A1 (en) | 2021-12-15 |
| CN113474892B (zh) | 2024-04-30 |
| US12132065B2 (en) | 2024-10-29 |
| TW202215137A (zh) | 2022-04-16 |
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