TWI863199B - Cover tape for packaging electronic components and electronic component package - Google Patents

Abstract

A cover tape for packaging electronic components, which is in the form of a strip with a width of less than 3 mm and a breaking strength of more than 10N measured in accordance with JIS K 6734. Also, an electronic component packaging body, which comprises: a carrier tape for storing electronic components; and the cover tape for packaging electronic components, which is connected to the carrier tape to seal the electronic components.

Description

Cover tape for electronic parts packaging and electronic parts packaging body

The present invention relates to a cover tape for packaging electronic components and an electronic component packaging body.

When transporting and storing electronic components, carrier tape and cover tape are sometimes used. Specifically, first, the electronic components (semiconductor chips, etc.) are placed in the recesses formed in the carrier tape, and then the cover tape is heat-sealed to the top surface of the carrier tape to encapsulate the electronic components. The carrier tape-cover tape composite encapsulating the electronic components obtained in this way is wound on a reel for transportation/storage.

As the prior art of cover tape for packaging electronic parts, there are, for example, the following patent documents 1 to 3. [Prior art document] [Patent document]

[Patent Document 1] Japanese Patent Publication No. 2003-508253 [Patent Document 2] Japanese Patent Publication No. 2007-45513 [Patent Document 3] Japanese Patent Publication No. 2017-171393

[The problem that the invention wants to solve]

Electronic components that can be packaged with cover tapes come in a variety of sizes. In the recent trend of miniaturization of electronic components, for example, it is considered to use cover tapes to package small electronic components that are 1005 (1.0 mm × 0.5 mm) or smaller, specifically 0603 (0.6 mm × 0.3 mm) or smaller, and more specifically 0402 (0.4 mm × 0.2 mm) or smaller. However, according to the opinions of the inventors of the present invention, the development of cover tapes suitable for packaging small electronic components has not been sufficient so far. That is, there is still room for improvement in cover tapes suitable for packaging small electronic components.

The present invention was made in view of this situation. One of the purposes of the present invention is to provide a cover tape suitable for packaging small electronic parts. [Technical means to solve the problem]

The inventors of the present invention have completed the invention provided below to solve the above-mentioned problems.

According to the present invention, a cover tape for packaging electronic parts is provided, which is in the form of a strip with a width of less than 3 mm, and has a breaking strength of more than 10N measured in accordance with JIS K 6734.

Furthermore, according to the present invention, an electronic component package is provided, which comprises: a carrier tape for storing electronic components; and the above-mentioned electronic component packaging cover tape, which is connected to the above-mentioned carrier tape to seal the above-mentioned electronic components. [Effect of the invention]

According to the present invention, a cover tape for electronic component packaging suitable for packaging small electronic components is provided.

Hereinafter, the implementation of the present invention will be described in detail with reference to the drawings. In all drawings, the same components are marked with the same symbols, and the description is omitted as appropriate. To avoid redundancy, there are two cases: (i) when there are multiple identical components in the same drawing, only one of them is marked with a symbol, not all of them; or (ii) especially after Figure 2, the same components as Figure 1 are not re-marked with symbols. All drawings are for illustrative purposes only. The shapes or size ratios of the components in the drawings do not necessarily correspond to the actual items.

In this specification, unless otherwise specified, the notation "X to Y" in the description of a numerical range means greater than X and less than Y. For example, "1 to 5 mass %" means "greater than 1 mass % and less than 5 mass %".

<Cover tape> FIG. 1 schematically shows an example of a cover tape for packaging electronic components (also simply labeled as "cover tape") according to the present embodiment. The cover tape preferably has a base layer 1 and a sealant layer 3 present on one side of the base layer 1. In addition, the cover tape can have an intermediate layer 2 between the base layer 1 and the sealant layer 3. In FIG. 1, the intermediate layer 2 is clearly shown. The sealant layer 3 is generally present on the outermost surface of the cover tape. The sealant layer 3 is generally provided on the entire surface of the one side of the base layer 1. In other words, the sealant layer 3 generally exists on one side of the substrate layer 1 without any break or division, with a width and length that are approximately the same as those of the substrate layer 1. Generally, the sealant layer 3 of the cover tape is connected to the carrier tape. In other words, the bottom side of the cover tape shown in FIG. 1 is generally connected to the carrier tape. The cover tape is in the shape of a long strip.

The width of the cover tape (indicated by symbol W in FIG. 1 ) is 3 mm or less, preferably 2.4 to 3 mm, and more preferably 2.5 to 3 mm. In addition, the breaking strength of the cover tape measured in accordance with JIS K 6734 is 10 N or more, preferably 10 to 30 N, and more preferably 12 to 25 N.

Since the width is 3 mm or less, the cover tape of this embodiment is easily connected to a narrow carrier tape for accommodating small electronic components. On the other hand, when the width of the cover tape is small, there is a possibility that the cover tape is easily broken when the cover tape is peeled off from the carrier tape when the electronic components are used. In order to reduce this possibility, in this embodiment, the cover tape is designed in such a way that the breaking strength measured in accordance with JIS K 6734 becomes 10N or more. As described above, the cover tape of this embodiment is suitable for packaging small electronic components.

As a supplement for the sake of caution, the breaking strength measured according to JIS K 6734 is generally the strength "per unit cross-sectional area" of the tape being measured. However, in this embodiment, as an indicator related to the degree of resistance to breaking of the cover tape itself, the breaking strength of the cover tape itself is determined to be 10N or more, not per unit cross-sectional area.

By the way, in order to make the breaking strength measured according to JIS K 6734 to be 10N or more, it is better to appropriately select the material or layer structure constituting the cover tape. The details will be explained below, for example, it can be cited as selecting appropriate materials as the materials of the base layer or the intermediate layer or appropriately adjusting the thickness of these layers.

The description related to the cover tape of this embodiment continues.

[Base layer 1] There is no particular limitation on the material constituting the base layer 1. Typically, a material having a mechanical strength sufficient to withstand the conditions when making the cover tape, when attaching the cover tape to the carrier tape, when peeling the cover tape during the installation step, and when external force is applied is preferred. Also, a material having heat resistance sufficient to withstand the heat when attaching the cover tape to the carrier tape is preferred. From the perspective of ease of processing, the material constituting the base layer 1 is preferably in the form of a film.

Specific examples of the material constituting the base layer 1 include polyester resin, nylon resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, ABS resin, and the like.

As specific examples of polyester resins, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), etc. can be cited. Among them, polyethylene terephthalate is preferred from the perspective of the balance between cost and strength. As specific examples of nylon resins, nylon 6, nylon 66, etc. can be cited. As specific examples of polyolefin resins, polyethylene, polypropylene, etc. can be cited.

From the viewpoint of improving the breaking strength or making it difficult to break, it is preferred that the base layer contains at least one selected from the group consisting of nylon resin, polyester resin and polypropylene resin. In particular, it is preferred that the base layer contains nylon resin. As shown in the embodiment described below, by containing nylon resin in the base layer, it is possible to further suppress breaking.

The base layer 1 may be a single layer or may be two or more layers. For example, the base layer 1 may be formed of a multi-layer thin film formed by laminating the above-mentioned materials.

As a preferred example, the base layer includes at least two layers, a layer containing a nylon resin and a layer containing a polyester resin. In this case, it is preferred that the layer containing the polyester resin is the outermost layer of the cover tape. By using a polyester resin, the breaking strength or heat resistance can be improved. Polyester resin withstands the external force when peeling the cover tape or the heat of the sealing pliers, so it is suitable for the outermost layer. Nylon resin is not as heat-resistant as polyester resin, but has appropriate flexibility and high breaking strength. Therefore, the heat or pressure from the sealing pliers can be appropriately transmitted to the middle layer or the sealant layer. This means that the cover tape can be attached to the carrier tape in a shorter heating time. In addition, nylon resin can withstand external forces during peeling. By combining a polyester resin with particularly high heat resistance and a nylon resin that can properly transfer heat or pressure from the sealing clamp to the intermediate layer or sealant layer, the cover tape can be attached to the carrier tape in a shorter heating time while suppressing deformation caused by heat. This is a good feature for "packaging small electronic parts where deformation of the carrier tape bag caused by heat can easily lead to poor installation."

As another preferred example, the substrate layer may be formed by laminating polyethylene resins having different densities. Specifically, the substrate layer is preferably formed by laminating two or more layers of (i) a layer comprising high-density polyethylene and (ii) a layer comprising linear low-density polyethylene and/or low-density polyethylene. By laminating the substrate layer with polyethylene resins having different densities, it is sometimes possible to adjust the rigidity of the film and control the processability during lamination.

The substrate layer 1 may or may not contain additives such as lubricants. The film used to form the substrate layer 1 may be an unstretched film or a film stretched along a uniaxial direction or a biaxial direction. From the perspective of further improving the mechanical strength of the cover tape, a film stretched along a uniaxial direction or a biaxial direction is preferred.

There is no particular limitation on the thickness of the substrate layer 1. The thickness of the substrate layer 1 is preferably 3 μm or more, and more preferably 5 μm or more. Furthermore, the thickness of the substrate layer 1 is preferably 30 μm or less, and more preferably 25 μm or less. By making the thickness of the substrate layer 1 30 μm or less, the rigidity of the cover tape will not become too high. Thus, even when a torsional stress is applied to the carrier tape after sealing, the cover tape can easily follow the deformation of the carrier tape. Therefore, it is possible to suppress the cover tape from accidentally peeling off from the carrier tape. By making the thickness of the substrate layer 1 3 μm or more, the mechanical strength of the cover tape can be sufficiently good. Therefore, even when the cover tape is peeled off from the carrier tape at high speed, for example, the cover tape can be prevented from breaking.

[Middle layer 2] Since the cover tape has the middle layer 2, the cushioning property and impact resistance of the cover tape can be improved. As materials for forming the middle layer 2, olefin resins, styrene resins, cyclic olefin resins, etc. can be cited. Among them, from the perspective of improving the cushioning property of the cover tape as a whole, olefin resins are preferred. As olefin resins, polyethylene, polypropylene, etc. can be cited, and polyethylene is preferred. In particular, from the aspect of cushioning property, low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is better. In the present embodiment, the middle layer 2 preferably includes linear low-density polyethylene. Although the details are not yet clear, it is possible that the appropriate cushioning of the linear low-density polyethylene matches the cover tape of the present embodiment having a width of ³ mm or less. Here, based on the density of polyethylene called "linear low-density polyethylene" and circulated in the market, in this specification, linear polyethylene having a density of 0.880 g/cm3 or more and less than 0.930 g/ ^cm3 is defined as linear low-density polyethylene. The intermediate layer 2 may be composed of (i) linear low-density polyethylene only, or may be composed of (ii) linear low-density polyethylene and other polyethylene such as low-density polyethylene or high-density polyethylene. More specifically, the following aspects can be cited for (ii): (ii-1) the intermediate layer 2 is a multi-layered structure including a layer composed of linear low-density polyethylene and a layer composed of other polyethylenes; and (ii-2) the intermediate layer 2 is a layer composed of a mixture of linear low-density polyethylene and other polyethylenes (single layer or multi-layered), etc. By refining the structure of the intermediate layer 2, it is sometimes possible to suppress "curling" during the manufacture of the cover tape and control the strength of the cover tape.

From another point of view, by using a material with a small dimensional change rate when heated as the intermediate layer 2, it is possible to suppress the cover tape from "floating" from the carrier tape. As a result, it is possible to suppress the entry of very small parts into the floating part. Specifically, by having the intermediate layer have the following characteristics, the cover tape can be more suitable for packaging small electronic parts.

When the size of the intermediate layer at 23°C is T ₀ and the size after heating at 80°C for 2 hours is T ₁ , the size change rate of the intermediate layer in the flow direction (machine direction, MD) represented by the following formula (1) is, for example, -4 to 4%, preferably -3 to 3%, and the size change rate in the width direction (transverse direction, TD) is, for example, 0 to 2%, preferably 0.1 to 1%. Size change rate (%) = {(T ₀ -T ₁ )/T ₀ } × 100 Formula (1)

The intermediate layer 2 may be only one layer or may be two or more layers. For example, the intermediate layer 2 may be formed by a multi-layer film formed by laminating the above-mentioned materials. The intermediate layer 2 may contain various additives or not. When the intermediate layer is provided, from the perspective of improving the cushioning property of the cover tape as a whole, its thickness is preferably 10 to 55 μm, more preferably 15 to 50 μm, and further preferably 20 to 45 μm.

[Sealing agent layer 3] There is no particular limitation on the material constituting the sealing agent layer 3. The sealing agent layer 3 may be made of a material that can be bonded to the carrier tape by applying heat.

Specific examples of the material for constituting the sealant layer 3 include (meth) acrylic resins, styrene resins, olefin resins, urethane resins, ester resins, and copolymers thereof. Among them, from the viewpoint of obtaining good heat-sealability to the carrier tape, it is preferred to include at least one of styrene resins, (meth) acrylic resins, and ester resins. In particular, in the present embodiment, it is preferred to use a styrene resin and a (meth) acrylic resin in combination.

From the viewpoint of reducing the surface resistance value of the sealant layer 3 to suppress the generation of static electricity during peeling and maintaining the sealing property, the sealant layer 3 can further contain an antistatic agent. In the sealant layer 3, the antistatic agent is preferably dissolved or dispersed in the resin.

As antistatic agents, for example, (i) particulate metal-containing substances or (ii) conductive polymers can be cited. Specific examples of antistatic agents include metal oxide particles such as antimony-doped tin oxide, phosphorus-doped tin oxide, and fluorine-doped tin oxide, conductive polymers, and carbon nanotubes. Based on good compatibility with the resin, it is preferred that the antistatic agent contains one or more of the group consisting of antimony-doped tin oxide (ATO), phosphorus-doped tin oxide, fluorine-doped tin oxide, and conductive polymers. As conductive polymers, polythiophene or polythiophene derivatives can be preferably cited. More specifically, polythiophene, poly(3,4)-ethylenedioxythiophene, poly(3-thiophene-β-ethanesulfonic acid), etc. can be cited. Among them, poly(3,4-ethylenedioxythiophene) or its derivatives are preferred from the perspective of further maintaining good antistatic properties and sealing properties.

As other additives, the sealant layer 3 may contain a dispersant for improving the dispersibility of the antistatic agent, silica sol, a leveling agent, a conductive agent, and the like.

From the viewpoint of better sealing and stripping operations, the thickness of the sealant layer 3 is preferably 0.02 to 20 μm, more preferably 0.03 to 15 μm.

[Other layers] The cover tape may also have an additional layer other than the base layer 1, the intermediate layer 2, and the sealant layer 3. As an additional layer, for example, a bonding layer formed by bonding two layers can be cited.

[Overall thickness] From the perspective of ensuring a balance between film strength and operability, the thickness of the cover tape is preferably 25 to 80 μm, and more preferably 35 to 70 μm.

<Electronic component package/electronic component to be packaged> According to the above-mentioned cover tape and the carrier tape in which the electronic component is accommodated in the recess, an electronic component package can be obtained. This will be explained with reference to FIG. 2.

In FIG. 2 , the cover tape 10 is used as a cover material of a strip-shaped carrier tape 20 having a concave bag 21 continuously provided in accordance with the shape of the electronic component. Specifically, the cover tape 10 is connected (generally heat-sealed) to the surface of the carrier tape 20 to cover the entire opening of the bag 21 of the carrier tape 20. In addition, hereinafter, the structure obtained by connecting the cover tape 10 and the carrier tape 20 is referred to as an electronic component package 100.

The electronic component package 100 can be produced, for example, by the following sequence. First, electronic components are contained in the bag 21 of the carrier tape 20. Then, the cover tape 10 is attached to the surface of the carrier tape 20 by heat sealing to cover the entire opening of the bag 21 of the carrier tape 20. At this time, the sealant layer 3 in the cover tape 10 is brought into contact with the carrier tape 20 (that is, heat sealing is performed so that the "back side" of the cover tape 10 in FIG. 2 becomes the sealant layer 3). In this way, a structure (electronic component package 100) that seals and contains electronic components can be obtained. There is no particular limitation on the specific operation method or conditions of heat sealing as long as the cover tape 10 is sufficiently firmly attached to the carrier tape 20. Typically, it can be performed using a known tape loading machine within a temperature range of 100 to 240°C, a load of 0.1 to 10 kgf, and a time range of 0.0001 to 1 second.

The material of the carrier tape 20 is not particularly limited as long as it can be connected to the cover tape 10 by heat sealing. It is generally made of resin or paper, preferably resin. As an example, the carrier tape 20 is composed of a material containing a polystyrene resin, a material containing a polycarbonate resin, a material containing a polyethylene terephthalate resin, etc.

The electronic component package 100 is wound on a reel, for example, and then transported to a work area where the electronic component is mounted on an electronic circuit board, etc. The reel can be made of metal, paper, plastic, etc.

After the electronic component package 100 is transported to the work area, the cover tape 10 is peeled off from the carrier tape 20 to take out the contained electronic components.

As described above, in this embodiment, it is preferred to package small electronic components in the electronic component package 100. In other words, the above-mentioned cover tape is particularly suitable for packaging small electronic components. If the size of the electronic component is specifically described, it is, for example, less than 1005 (1.0 mm × 0.5 mm), preferably less than 0603 (0.6 mm × 0.3 mm), and more preferably less than 0402 (0.4 mm × 0.2 mm).

There is no particular limitation on the types of electronic parts. All parts used in the manufacture of electrical and electronic equipment can be listed, including semiconductor chips, transistors, diodes, capacitors, piezoelectric devices, optical devices, LED-related components, connectors, electrodes, etc.

The above describes the embodiments of the present invention, but these are only examples of the present invention, and various configurations other than the above can be adopted. In addition, the present invention is not limited to the above embodiments, and modifications and improvements within the scope of the purpose of the present invention are also included in the present invention. [Example]

The embodiments of the present invention are described in detail based on the embodiments and comparative examples. However, it is explained in advance for the sake of caution, but the present invention is not limited to the embodiments.

First, the materials used to form the sealant layer are described. (A) Styrene resin Styrene-butadiene copolymer: Asahi Kasei Corporation, "Tuftec H1517" (styrene content (PS ratio): 43%, MFR (230°C, 2.16kg): 3g/10min) (B) Poly(meth)acrylic acid derivative DIC Corporation "A450A" (C-1) Antistatic agent Antimony-doped tin oxide (Mitsubishi Materials Corporation "T-1")

<Example 1> In Example 1, a cover tape having a two-layer structure of a base layer of a PET film and a nylon film, an intermediate layer, and a sealant layer was manufactured. The specific manufacturing procedure is as follows.

First, a 12μm thick biaxially stretched polyester film (Toyobo Co., Ltd., trade name: T6140) was prepared. A laminating agent (Mitsui Chemicals Co., Ltd., TAKELAC A-520) was applied to one side of the film, and a 12μm thick biaxially stretched nylon film (Kolon Industries, trade name: NT02) was laminated by dry lamination. Thus, a two-layer substrate layer was obtained. Then, a laminating agent (Mitsui Chemicals Co., Ltd., TAKELAC A-520) was applied to the biaxially stretched nylon film side of the substrate layer, and a 30μm thick polyethylene film (TAMAPOLY Co., Ltd., trade name: SE605M) was laminated by dry lamination to form an intermediate layer. Thereafter, a coating liquid containing tin oxide doped with antimony was applied to the exposed surface of the intermediate layer by gravure coating. As the coating liquid, 60% by mass of (C-1) antistatic agent, 24% by mass of (B) poly(meth)acrylic acid derivative, and 16% by mass of (A) styrene resin were uniformly mixed. A sealant layer with a thickness of 0.5 μm was formed. A laminate having a substrate layer, an intermediate layer, and a sealant layer was obtained. The obtained laminate was cut into strips with a width of 2.6 mm to obtain a long cover tape.

<Example 2> A cover tape was obtained in the same manner as in Example 1 except that a biaxially stretched nylon film with a thickness of 15 μm (Toyobo Co., Ltd., trade name: N1202) was used instead of a biaxially stretched nylon film with a thickness of 12 μm (Kolon Industries, trade name: NT02).

<Example 3> A cover tape was obtained in the same manner as in Example 1 except that a polyethylene film with a thickness of 25 μm (LM-015 manufactured by Wako Co., Ltd.) was used instead of a polyethylene film with a thickness of 30 μm (manufactured by TAMAPOLY Co., Ltd.).

<Example 4> A cover tape was obtained in the same manner as in Example 1 except that a polyethylene film with a thickness of 40 μm (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M) was used instead of a polyethylene film with a thickness of 30 μm (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M).

<Example 5> A cover tape was obtained in the same manner as in Example 1 except that a 30 μm thick polyethylene film (manufactured by Tamapolyi Co., Ltd., trade name: SE605M) was used instead of a 30 μm thick polyethylene film. The laminated film used here has a layer structure of linear low-density polyethylene/high-density polyethylene/linear low-density polyethylene, each layer having a thickness of 10 μm and a total thickness of 30 μm. The linear low-density polyethylene is UMERIT 0540F manufactured by Ube Maruzen Co., Ltd., and the high-density polyethylene is Novatec HF111K manufactured by Japan Polyethylene Co., Ltd. In addition, the laminated film used here is manufactured by laminated extrusion at an extrusion temperature of 200°C using a coextrusion inflation molding machine.

<Example 6> A cover tape was obtained in the same manner as in Example 1 except that the base layer was a single layer of biaxially stretched polybutylene terephthalate (manufactured by Kojin Film & Chemical Co., Ltd., BOBLET ST) with a thickness of 20 μm.

<Example 7> A cover tape was obtained in the same manner as in Example 1 except that the base layer was a single layer of biaxially stretched polyethylene terephthalate (FE2301, Futamura Chemical Co., Ltd.) with a thickness of 25 μm.

<Comparative Example 1> A cover tape was obtained in the same manner as in Example 1 except that the base layer was a single layer of biaxially stretched polyethylene terephthalate (Toyobo Co., Ltd., trade name: T6140) with a thickness of 12 μm.

<Comparative Example 2> A cover tape was obtained in the same manner as in Example 1 except that the base layer was a single layer of biaxially stretched polyethylene terephthalate (Toyobo Co., Ltd., trade name: E7415) with a thickness of 16 μm.

<Measurement of breaking strength> The breaking strength of the cover tapes of each embodiment and comparative example was measured in accordance with JIS K 6734. For the measurement, a Shimadzu autograph was used to perform a tensile test on the cover tapes cut into 2.6 mm width at a tensile strength of 50 mm/min. Then, the load at the time of breaking was determined as the breaking strength.

<Measurement of dimensional change rate of intermediate layer> The polyethylene film used as the intermediate layer was cut into 400 mm square at 23°C and 50% relative humidity. The size of the test film was set as T ₀ . After heating the test film in an oven set at 80°C for 2 hours, the film was taken out and the dimensions corresponding to the flow direction and the width direction were measured respectively and set as T ₁ . The dimensional change rate in each direction was calculated according to the following formula (1). Dimensional change rate (%) = [(T ₀ -T ₁ )/T ₀ ] × 100 Formula (1)

<Fracture evaluation using a tape feeder> The evaluation was performed in the following order. (1) Using a tape attacher, the sealing surface of the sealant layer of the obtained evaluation cover tape (2.6 mm width) was heat-sealed to the surface of a 4 mm wide polystyrene resin carrier tape at 170°C, 4 kgf, and 0.005 seconds to produce a tape-shaped package. (2) Using a tape feeder (manufactured by Panasonic Corporation, product name: Intelligent Tape Feeder), the evaluation cover tape was continuously peeled off from the carrier tape at a feed speed (peeling speed): 2400 mm/min and a peeling angle: approximately 170°. Then, we evaluated whether the peeled cover tape would break when it was caught between two gears in the tape feeder. In the table below, the case of no breakage was recorded as good, and the case of breakage was recorded as bad.

<Evaluation of cover tape lifting> (1) Using a tape machine, the sealing surface of the sealant layer of the evaluation cover tape (2.6 mm width) was heat-sealed to the surface of a 4 mm wide polystyrene resin carrier tape at 170°C, 4 kgf, and 0.005 seconds to produce a tape-shaped package. (2) The package was cut and the cross section was observed under a microscope to measure the lifting amount of the cover tape. The so-called lifting amount is the size of x in Figure 3.

<Evaluation of peel strength> (1) Using a tape machine, the sealing surface of the sealant layer of the obtained evaluation cover tape (2.6 mm width) was heat-sealed to the surface of a 4 mm wide polystyrene resin carrier tape at 170°C, 4 kgf, and 0.005 seconds to produce a tape-shaped package. (2) Using the obtained sample, the peel strength (unit: gf) of the electronic component packaging cover tape against the above polystyrene resin carrier tape was measured. The peel strength was measured using a peel tester (EPI "PTS-5000") at a peel speed of 300 mm/min, a peel angle of 170°, and a measurement temperature of 25°C.

The above results are summarized and shown in Table 1.

[Table 1] Embodiment Comparison Example 1 2 3 4 5 6 7 1 2 Breaking strength (N) (2.6mm width) 15 20 14 16 16 13 13 7 8 Dimensional change rate of the middle layer in the MD direction (%) -2.5 -2.5 -2.6 -2.5 -2.8 -2.5 -2.5 -2.5 -2.5 Dimensional change rate of the middle layer in the TD direction (%) +0.20 +0.20 +0.30 +0.20 +0.50 +0.20 +0.20 +0.20 +0.20 Fracture evaluation using a belt feeder good good good good good good good bad bad Cover tape floating evaluation (μm) twenty one 17 20 20 18 17 17 twenty two twenty one Peel strength (gf) 32 30 30 35 33 twenty three twenty four 33 28

The breaking strength of the cover tapes of Examples 1 to 7 measured in accordance with JIS K 6734 is 10N or more. Then, no breaking occurred in the breaking evaluation using a belt feeder. That is, the cover tapes of Examples 1 to 7 are not easy to break even if they are narrow, and can be said to be suitable for packaging small electronic parts. In addition, in the cover tapes of Examples 1 to 7, the "floating amount" is relatively small. It is believed that this is because the dimensional change rate of the intermediate layer is relatively small. In addition, in the <Evaluation of Peeling Strength>, the cover tapes of Examples 1 to 5 all show values of more than 30gf, showing better peeling strength than the cover tapes of Examples 6 and 7. It is believed that this is due to the different base material layers.

This application claims priority based on Japanese application No. 2022-055535 filed on March 30, 2022, and all the contents disclosed therein are incorporated into this specification.

1: Base layer 2: Intermediate layer 3: Sealant layer 10: Cover tape 20: Carrier tape 21: Bag 100: Electronic component package W: Width x: Floating amount

[Figure 1] is a diagram schematically showing an example of a cover tape (cover tape for electronic component packaging) of the present embodiment. [Figure 2] is a diagram showing an example of a state where the cover tape for electronic component packaging is connected (heat-sealed) to a carrier tape. [Figure 3] is a diagram for explaining the "floating amount" of the cover tape.

1: Base material layer

2: Middle layer

3: Sealant layer

W: Width

Claims (10)

A cover tape for packaging electronic parts, which is in the form of a strip with a width of less than 3 mm, has a breaking strength of more than 10N measured according to JIS K 6734, and has at least a base layer, an intermediate layer, and a sealant layer in order, wherein the intermediate layer only contains an olefin resin as a resin. A cover tape for packaging electronic parts, which is in the form of a strip with a width of less than 3 mm, has a breaking strength of more than 10N measured according to JIS K 6734, and has at least a base layer, an intermediate layer and a sealant layer in sequence, wherein the intermediate layer is a single layer containing an olefin resin. For example, the cover tape for electronic parts packaging in claim 1 or 2 is used for packaging electronic parts with a size below 1005. As in claim 1 or 2, the cover tape for electronic component packaging, wherein the base layer comprises at least one selected from the group consisting of nylon resin, polyester resin and polypropylene resin. As in claim 1 or 2, the cover tape for electronic component packaging, wherein the base material layer comprises nylon resin. As in claim 1 or 2, the cover tape for electronic component packaging, wherein the base layer includes at least two layers, a layer containing a nylon resin and a layer containing a polyester resin. As in claim 1 or 2, the cover tape for electronic component packaging, wherein the middle layer comprises low-density polyethylene. In the cover tape for packaging electronic components of claim 1 or 2, when the dimension of the intermediate layer at 23°C is set to T ₀ and the dimension after heating at 80°C for 2 hours is set to T ₁ , the dimensional change rate of the intermediate layer in the flow direction, i.e., MD direction, represented by the following formula (1) is -4 to 4%, and the dimensional change rate in the width direction, i.e., TD direction, is 0 to 2%. Dimensional change rate (%) = {(T ₀ -T ₁ )/T ₀ } × 100 Formula (1). An electronic component package, comprising: a carrier tape for storing electronic components; and a cover tape for electronic component packaging according to claim 1 or 2, connected to the carrier tape to seal the electronic components. As in claim 9, the electronic component package, wherein the electronic component is an electronic component with a size below 0402.

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