TWI853236B - Acoustic output/input device - Google Patents

Abstract

The present disclosure may disclose an acoustic input/output device, including: a speaker element, configured to transmit sound waves by generating a first mechanic vibration; and a microphoe, configured to receive a second mechanic viobration generated when the voice source provides voice signals. The microphone may respectively generate a first signal and a second signal under the action of the first mechanical vibration and the second mechanical vibration, wherein within a certain frequency range, The ratio of the first mechanical vibration to the first signal is greater than the ratio of the second mechanical vibration to the second signal.

Description

Acoustic Input Output Devices

This application relates to the field of acoustics, and in particular to an acoustic input and output device.

This application claims priority to the international patent application number PCT/CN2021/090298 filed on April 27, 2021, the Chinese patent application number 202110460677.3 filed on April 27, 2021, and the Chinese patent application number 202110462049.9 filed on April 27, 2021, all of which are incorporated herein by reference.

The speaker element transmits sound by generating mechanical vibration. The microphone receives the user's voice signal by picking up the vibration of the user's skin and other parts when speaking. When the speaker element and the microphone work at the same time, the mechanical vibration of the speaker element will be transmitted to the microphone, causing the microphone to receive the vibration signal of the speaker element and generate an echo, reducing the quality of the sound signal generated by the microphone and affecting the user's experience.

The present invention provides an acoustic input and output device that can reduce the impact of speaker elements on the microphone, reduce the echo signal strength generated by the microphone, and improve the quality of the voice signal collected by the microphone.

The purpose of the present invention is to provide an acoustic input and output device, the purpose of which is to reduce the influence of the speaker element on the vibration of the bone conduction microphone, reduce the intensity of the echo signal generated by the bone conduction microphone, and improve the quality of the sound signal picked up by the bone conduction microphone.

In order to achieve the purpose of the above invention, the technical solution provided by the present invention is as follows: an acoustic input and output device, comprising: a speaker element, used to transmit sound waves by generating a first mechanical vibration; and a microphone, used to receive a second mechanical vibration generated when a voice signal source provides a voice signal, the microphone generates a first signal and a second signal respectively under the action of the first mechanical vibration and the second mechanical vibration, wherein, within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal.

In some embodiments, the speaker element is a bone conduction speaker element, which includes a housing and a vibration element connected to the housing for generating a first mechanical vibration, and the microphone is directly or indirectly connected to the housing.

In some embodiments, the acoustic input-output device further includes a vibration-damping structure, the microphone is connected to the speaker element through the vibration-damping structure, and the vibration-damping structure includes a vibration-damping material having an elastic modulus less than the first threshold value.

In some embodiments, the first portion of the surface of the microphone is used to conduct the second mechanical vibration, and the second portion of the surface of the microphone is provided with a vibration-damping structure and is connected to the speaker element through the vibration-damping structure.

In some embodiments, a first portion of the surface of the microphone is provided with a vibration-transmitting layer, and the elastic modulus of the material of the vibration-transmitting layer is greater than the second threshold value.

In some embodiments, the speaker element includes a housing and a vibration element, the housing and the vibration element have a first connection, the microphone and the housing have a second connection, the first connection includes a first vibration-damping structure, and the second connection includes a second vibration-damping structure.

In some embodiments, the speaker element includes a first diaphragm and a second diaphragm, and the first diaphragm and the second diaphragm vibrate in opposite directions; the speaker element includes a housing, and the housing includes a first cavity and a second cavity, and the first diaphragm and the second diaphragm are located in the first cavity and the second cavity respectively; the side wall of the first cavity is provided with a first sound-transmitting hole and a second sound-transmitting hole, and the side wall of the second cavity is provided with a third sound-transmitting hole and a fourth sound-transmitting hole, and the phase of the sound emitted by the first sound-transmitting hole is the same as the phase of the sound emitted by the third sound-transmitting hole, and the phase of the sound emitted by the second sound-transmitting hole is the same as the phase of the sound emitted by the fourth sound-transmitting hole.

In some embodiments, the first sound-transmitting hole and the third sound-transmitting hole are arranged on the same side wall of the shell, the second sound-transmitting hole and the fourth sound-transmitting hole are arranged on the same side wall of the shell, the first sound-transmitting hole and the second sound-transmitting hole are arranged on non-adjacent side walls of the shell, and the third sound-transmitting hole and the fourth sound-transmitting hole are arranged on non-adjacent side walls of the shell.

In some embodiments, the speaker element further includes a first magnetic circuit element and a second magnetic circuit element for forming a magnetic field, the first magnetic circuit element is used to vibrate the first diaphragm, and the second magnetic circuit element is used to vibrate the second diaphragm; the first cavity and the second cavity are connected, and the first magnetic circuit element and the second magnetic circuit element are directly or indirectly connected.

One or more embodiments of the present invention also provide an acoustic input-output device, including a speaker element for transmitting sound waves by generating a first mechanical vibration; and a microphone for receiving a second mechanical vibration generated when a voice signal source provides a voice signal, the microphone generates a first signal and a second signal respectively under the action of the first mechanical vibration and the second mechanical vibration; the first angle formed by the vibration direction of the microphone and the direction of the first mechanical vibration is within a set angle range, so that within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal.

100:Acoustic input and output equipment

110: Speaker components

120: Microphone component

130:Fixed element

200:Acoustic input and output equipment

210: Earphone core

231: Ear hook

232: Headphone housing

233:Circuit enclosure

234:Hanging at the back

236: Protective sleeve

237: Shell protector

260: Control circuit

270:Battery

2321:Contact surface

300:Acoustic input and output equipment

310: Speaker components

320: Bone conduction microphone

330:Fixed element

340: User's face

350: Shell

360: Voice signal source

370: First elastic connection

380: Echo signal source

390: Second elastic connection

520: Bone conduction microphone

560: Voice signal source

570: First flexible connection

580:Echo signal source

590: Second flexible connection

620: Bone conduction microphone

660: Voice signal source

680: Echo signal source

810: Strength curve of the first signal

820: Intensity curve of the second signal

910: Strength curve of the first signal

920: Intensity curve of the second signal

1000:Acoustic input and output equipment

1010: Speaker components

1020: Bone conduction microphone

1021: Part 1

1022: Part 2

1023: Vibration layer

1040: User's face

1050: Shell

1100:Vibration-damping structure

1200:Acoustic input and output equipment

1210: Speaker components

1211: Vibration element

1213: Transmission film

1215: Magnetic circuit components

1217: Coil

1220: Bone conduction microphone

1250: Shell

1300:Acoustic input and output equipment

1311: Vibration element

1313: Diaphragm

1315: Magnetic circuit components

1317: Coil

1320: Bone conduction microphone

1350: Shell

1351: First sound hole

1352: Second sound hole

1400:Acoustic input and output equipment

1410: Speaker components

1411: First vibration element

1412: Second vibration element

1413: First diaphragm

1414: Second diaphragm

1415: First magnetic circuit element

1416: Second magnetic circuit element

1417: First coil

1418: Second coil

1450: Shell

1451: First sound hole

1452: Second sound hole

1453: The third sound hole

1454: The fourth sound hole

1455: First cavity

1456: Second cavity

1500:Acoustic input and output equipment

1510: Speaker components

1511: First vibration element

1512: Second vibration element

1513: First diaphragm

1514: Second diaphragm

1515: First magnetic circuit element

1516: Second magnetic circuit element

1517: First coil

1518: Second coil

1550: Shell

1551: First sound hole

1552: Second sound hole

1553: The third sound hole

1554: The fourth sound hole

1555: First cavity

1556: Second cavity

1600:Acoustic input and output equipment

1610: Speaker components

1620: Bone conduction microphone

1630:Fixed element

1631:Earmuffs

1632:Headband

1700:Acoustic input and output equipment

1710: Speaker components

1720: Bone conduction microphone

1730:Fixed element

1731:Earmuffs

1732:Headband

1800:Acoustic input and output equipment

1810: Speaker components

1820: Bone conduction microphone

1830:Fixed elements

1831:Earmuffs

1832:Headband

1833: Sponge bag

1840: User's face

1850: Shell

1900:Acoustic input and output devices

1910: Speaker components

1920: Bone conduction microphone

1930:Fixing elements

1932: Eyeglass frames

1933: Spectacle Legs

1934:Mirror Legs Main Body

1935: Nose bridge

The present invention will be further explained in the form of exemplary embodiments, which will be described in detail through the accompanying drawings. These embodiments are not restrictive. In these embodiments, the same component symbols represent similar structures, wherein: [Figure 1] is a structural module diagram of an acoustic input-output device according to some embodiments of the present invention; [Figure 2A] and [Figure 2B] are structural schematic diagrams of an acoustic input-output device according to some embodiments of the present invention; [Figure 3] is a cross-sectional schematic diagram of a partial structure of an acoustic input-output device according to some embodiments of the present invention; [Figure 4] is a simple schematic diagram of vibration transmission of an acoustic input-output device according to some embodiments of the present invention. FIG. 5 is a schematic diagram of another mechanical vibration transmission model of the acoustic input-output device shown in some embodiments of the present invention; FIG. 6 is another structural schematic diagram of the vibration transmission of the acoustic input-output device shown in some embodiments of the present invention; FIG. 7 is a schematic diagram of the calculation and generation of electrical signals by a two-axis microphone shown in some embodiments of the present invention; FIG. 8 is a strength curve diagram of the second signal and the first signal shown in some embodiments of the present invention; FIG. 9 is another strength curve diagram of the second signal and the first signal shown in some embodiments of the present invention. [Figure 10] is a cross-sectional schematic diagram of a bone conduction microphone connected to a vibration reduction structure according to some embodiments of the present invention; [Figure 11] is a cross-sectional schematic diagram of an acoustic input-output device with a vibration reduction structure according to some embodiments of the present invention; [Figure 12] is a cross-sectional schematic diagram of an acoustic input-output device according to some embodiments of the present invention; [Figure 13] is a cross-sectional schematic diagram of an acoustic input-output device according to some embodiments of the present invention; [Figure 14] is a cross-sectional schematic diagram of an acoustic input-output device with two air conduction speaker elements according to some embodiments of the present invention. [Figure 15] is another cross-sectional schematic diagram of an acoustic input-output device having two air conduction speaker elements according to some embodiments of the present invention; [Figure 16] is a structural schematic diagram of a headset according to some embodiments of the present invention; [Figure 17] is a structural schematic diagram of a single-ear headset according to some embodiments of the present invention; [Figure 18] is a cross-sectional schematic diagram of a binaural headset according to some embodiments of the present invention; [Figure 19] is a structural schematic diagram of a pair of glasses according to some embodiments of the present invention.

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present invention. For those with ordinary knowledge in the relevant technical field, the present invention can also be applied to other similar scenarios based on these drawings without making progressive efforts. It should be understood that these exemplary embodiments are only provided to enable those with ordinary knowledge in the relevant technical field to better understand and implement the present invention, and do not limit the scope of the present invention in any way. Unless it is obvious from the language environment or otherwise explained, the same component symbols in the drawings represent the same structure or operation.

As shown in the specification and patent application, unless the context clearly indicates an exception, the words "a", "an", "a kind" and/or "the" do not refer to the singular, but also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or apparatus may also include other steps or elements. The term "based on" means "based at least in part on". The term "an embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment". The relevant definitions of other terms will be given in the following description. Hereinafter, without loss of generality, when describing the bone conduction related technologies in the present invention, the descriptions of "bone conduction microphone", "bone conduction microphone element", "bone conduction speaker", "bone conduction speaker element" or "bone conduction earphone" will be adopted. When describing the air conduction related technologies in the present invention, the descriptions of "air conduction microphone", "air conduction microphone element", "air conduction speaker", "air conduction speaker element" or "air conduction earphone" will be adopted. This description is only one form of bone conduction application. For those with ordinary knowledge in the relevant technical field, "device" or "earphone" can also be replaced by other similar words, such as "player", "hearing aid", etc. In fact, various implementation methods in the present invention can be easily applied to other non-speaker devices. For example, for professionals in this field, after understanding the basic principle of the device, they may make various modifications and changes in form and details to the specific methods and steps of implementing the device without deviating from this principle. In particular, the device may be equipped with the function of picking up and processing ambient sound so that the device can realize the function of a hearing aid. For example, microphones such as bone conduction microphones can pick up the sound of the user/wearer's surrounding environment, and transmit the processed sound (or generated electrical signal) to the speaker component under a certain algorithm. That is, the bone conduction microphone can be modified to add the function of picking up ambient sound, and after certain signal processing, the sound can be transmitted to the user/wearer through the speaker component, thereby realizing the function of a hearing aid. For example, the algorithms mentioned here may include one or a combination of noise cancellation, automatic gain control, sound feedback suppression, wide dynamic range compression, active environmental recognition, active noise reduction, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howl suppression, volume control, etc.

FIG1 is a structural module diagram of an acoustic input-output device according to some embodiments of the present invention. As shown in FIG1 , the acoustic input-output device 100 may include a speaker element 110, a microphone element 120, and a fixing element 130.

The speaker element 110 can be used to convert a signal containing sound information into an acoustic signal (also referred to as a voice signal). For example, the speaker element 110 can generate mechanical vibrations to transmit sound waves (i.e., acoustic signals) in response to receiving a signal containing sound information. For the convenience of description, the mechanical vibrations generated by the speaker element 110 can be referred to as first mechanical vibrations. In some embodiments, the speaker element can include a vibration element and/or a vibration transmission element connected to the vibration element (e.g., at least a portion of the housing of the acoustic input/output device 100, a vibration transmission sheet). When the speaker element 110 generates the first mechanical vibration, it is accompanied by energy conversion, and the speaker element 110 can realize the conversion of the signal containing sound information into mechanical vibrations. The conversion process may include the coexistence and conversion of multiple different types of energy. For example, an electrical signal (i.e., a signal containing sound information) can be directly converted into a first mechanical vibration through the transducer in the vibration element of the speaker element 110, and the first mechanical vibration is transmitted through the vibration element of the speaker element 110 to transmit the sound wave. For another example, the sound information can be contained in an optical signal, and a specific transducer can realize the process of converting the optical signal into a vibration signal. Other types of energy that can coexist and convert during the operation of the transducer include thermal energy, magnetic field energy, etc. The energy conversion method of the transducer can include dynamic, electrostatic, piezoelectric, moving iron, pneumatic, electromagnetic, etc.

The speaker element 110 may include an air conduction speaker element and/or a bone conduction speaker element. In some embodiments, the speaker element 110 may include a vibration element and a housing. In some embodiments, when the speaker element 110 is a bone conduction speaker element, the housing of the speaker element 110 may be used to contact a certain part of the user's body (e.g., face) and transmit the first mechanical vibration generated by the vibration element to the auditory nerve via the bones, so that the user can hear the sound, and as at least part of the housing of the acoustic input-output device 100, the vibration element and the microphone element 120 are accommodated. In some embodiments, when the speaker element 110 is an air conduction speaker element, the vibration element can change the air density by pushing the air to vibrate, so that the user can hear the sound, and the housing can accommodate the vibration element and the microphone element 120 as at least part of the outer shell of the acoustic input and output device 100. In some embodiments, the speaker element 110 and the microphone element 120 can be located in different housings.

The vibration element can convert the sound signal into a mechanical vibration signal and thereby generate a first mechanical vibration. In some embodiments, the vibration element (i.e., the transducer) may include a magnetic circuit element. The magnetic circuit element may provide a magnetic field. The magnetic field may be used to convert a signal containing sound information into a mechanical vibration signal. In some embodiments, the sound information may include a video or audio file having a specific data format or data or a file that can be converted into sound through a specific path. The signal containing the sound information may come from the storage element of the acoustic input/output device 100 itself, or may come from an information generation, storage or transmission system outside the acoustic input/output device 100. The signal containing the sound information may include one or more combinations of electrical signals, optical signals, magnetic signals, mechanical signals, etc. The signal containing sound information may come from one signal source or multiple signal sources. Multiple signal sources may be related or unrelated. In some embodiments, the acoustic input-output device 100 may obtain the signal containing sound information in a variety of different ways, and the acquisition of the signal may be wired or wireless, and may be instant or delayed. For example, the acoustic input-output device 100 may receive an electrical signal containing sound information in a wired or wireless manner, or may directly obtain data from a storage medium to generate a sound signal. For another example, the acoustic input-output device 100 may include an element with a sound collection function (e.g., an air conduction microphone element), which converts the mechanical vibration of the sound into an electrical signal by picking up the sound in the environment, and obtains the electrical signal that meets specific requirements after being processed by an amplifier. In some embodiments, the wired connection may include metal cables, optical cables, or hybrid cables of metal and optical, such as coaxial cables, communication cables, flexible cables, spiral cables, non-metallic sheathed cables, metal sheathed cables, multi-core cables, twisted pair cables, ribbon cables, shielded cables, telecommunication cables, twin-strand cables, parallel twin-core wires, twisted pair cables, and the like, or a combination of the above. The examples described above are for convenience of explanation only, and the medium of the wired connection may also be other types, such as transmission carriers of other electrical signals or optical signals.

Wireless connections may include radio communications, free space optical communications, acoustic communications, and electromagnetic induction, among others. Radio communications may include IEEE802.11 series standards, IEEE802.15 series standards (such as Bluetooth technology and cellular technology, etc.), first generation mobile communication technology, second generation mobile communication technology (such as FDMA, TDMA, SDMA, CDMA, and SSMA, etc.), general packet radio service technology, third generation mobile communication technology (such as CDMA2000, WCDMA, TD-SCDMA, and WiMAX, etc.), fourth generation mobile communication technology (such as TD-LTE and FDD-LTE, etc.), satellite communication (such as GPS technology, etc.), near field communication (NFC) and other technologies running in the ISM band (such as 2.4GHz, etc.); free space optical communication may include visible light, infrared signals, etc.; acoustic communication may include sound waves, ultrasonic signals, etc.; electromagnetic induction may include near field communication technology, etc. The examples described above are only for the convenience of explanation. The wireless connection medium can also be other types, such as Z-wave technology, other paid civilian radio frequency bands and military radio frequency bands, etc. For example, as some application scenarios of this technology, the acoustic input and output device 100 can obtain signals containing sound information from other acoustic input and output devices through Bluetooth technology.

The microphone element 120 can be used to pick up an acoustic signal (also referred to as a voice signal) and convert the acoustic signal into a signal containing sound information (e.g., an electrical signal). For example, the microphone element 120 picks up the mechanical vibration generated when the voice signal source provides a voice signal and converts it into an electrical signal. For the convenience of description, the mechanical vibration generated when the user provides a voice signal can be referred to as a second mechanical vibration. In some embodiments, the microphone element 120 can include one or more microphones. In some embodiments, the microphone can be divided into a bone conduction microphone and/or an air conduction microphone based on the working principle of the microphone. For the convenience of description, in one or more embodiments of the present invention, a bone conduction microphone will be used as an example for explanation. It should be noted that the bone conduction microphone in one or more embodiments of the present invention can also be replaced by an air conduction microphone.

The bone conduction microphone can be used to collect any mechanical vibrations (e.g., first mechanical vibrations and second mechanical vibrations) conducted by the user's bones, skin, and other tissues that can be sensed by the bone conduction microphone. The received mechanical vibrations will cause the internal components of the bone conduction microphone 120 (e.g., microphone diaphragm) to generate corresponding mechanical vibrations (e.g., third mechanical vibrations and fourth mechanical vibrations), and convert them into electrical signals containing voice information (e.g., first signals and second signals). The first signal can be understood as an echo signal generated by the bone conduction microphone; the second signal can be understood as a voice signal generated by the bone conduction microphone. The air conduction microphone can collect mechanical vibrations (i.e., sound waves) conducted by air and convert the mechanical vibrations into signals containing sound information (e.g., electrical signals). For example, if the speaker element 110 includes an air conduction speaker, the air conduction microphone can receive the echo signal transmitted by the air conduction speaker (transmitted by air conduction). For another example, if the speaker element 110 includes a bone conduction speaker, the air conduction microphone can simultaneously receive the mechanical vibration transmitted by the bone conduction speaker and the echo signal transmitted by the bone conduction speaker through the air conduction pathway. In some embodiments, the microphone element 120 can include a microphone diaphragm and other electronic components. After the mechanical vibration of the voice signal source is transmitted to the microphone diaphragm, it will cause the microphone diaphragm to generate corresponding mechanical vibrations. The electronic components can convert the mechanical vibration signal into a signal containing voice information (e.g., an electrical signal). In some embodiments, the microphone element 120 may include but is not limited to a ribbon microphone, a micro-electromechanical system (MEMS) microphone, a dynamic microphone, a piezoelectric microphone, a capacitive microphone, a carbon microphone, an analog microphone, a digital microphone, etc., or any combination thereof. For another example, the bone conduction microphone may include an omnidirectional microphone, a unidirectional microphone, a bidirectional microphone, a cardioid microphone, etc., or any combination thereof.

In some embodiments, when the speaker element 110 and the microphone element 120 work simultaneously, the microphone element 120 can sense the first mechanical vibration generated by the speaker element 110 and the second mechanical vibration generated by the voice signal source. In response to the first mechanical vibration, the microphone element 120 can generate a third mechanical vibration and convert the third mechanical vibration into a first signal. In response to the second mechanical vibration, the microphone element 120 can generate a fourth mechanical vibration and convert the fourth mechanical vibration into a second signal. In some embodiments, the speaker element 110 can be referred to as an echo signal source. In some embodiments, when the speaker element 110 and the microphone element 120 work simultaneously, within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal. The frequency range may include 200Hz~10kHz, or 200Hz~5000Hz, or 200Hz~2000Hz, or 200Hz~1000Hz, etc.

The fixing element 130 can support the speaker element 110 and the microphone element 120. In some embodiments, the fixing element 130 can include an arc-shaped elastic component that can form a force that rebounds toward the middle of the arc so as to be in stable contact with the human skull. In some embodiments, the fixing element 130 can include one or more connectors. One or more connectors can connect the speaker element 110 and/or the microphone element 120. In some embodiments, the fixing element 130 can be worn in both ears. For example, the two ends of the fixing element 130 can be fixedly connected to two sets of speaker elements 110 respectively. When the user wears the acoustic input and output device 100, the fixing element 130 can fix the two sets of speaker elements 110 near the left and right ears of the user respectively. In some embodiments, the fixing element 130 can also be worn in a single ear. For example, the fixing element 130 can be fixedly connected to only one set of speaker elements 110. When the user wears the acoustic input and output device 100, the fixing element 130 can fix the speaker element 110 near one side of the user's ear. In some embodiments, the fixing element 130 can be any combination of one or more of glasses (e.g., sunglasses, augmented reality glasses, virtual reality glasses), a helmet, a headband, etc., which is not limited here.

The above description of the structure of the acoustic input and output device is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in this field, after understanding the basic principle of the acoustic input and output device 100, it is possible to make various modifications and changes in form and details to the specific methods and steps of implementing the acoustic input and output device 100 without deviating from this principle, but these modifications and changes are still within the scope of the above description. For example, the acoustic input and output device 100 may include one or more processors, and the processors may execute one or more sound signal processing algorithms. The sound signal processing algorithm can modify or enhance the sound signal. For example, the sound signal is subjected to noise reduction, sound feedback suppression, wide dynamic range compression, automatic gain control, active environmental recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, or other similar or any combination of the above processing, and these modifications and changes are still within the scope of protection of the patent application of the present invention. For another example, the acoustic input and output device 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, etc. The sensor may collect user information or environmental information.

FIG. 2A and FIG. 2B are schematic diagrams of the structure of the acoustic input-output device shown in some embodiments of the present invention. In combination with FIG. 2A and FIG. 2B, in some embodiments, the acoustic input-output device 200 may be an ear clip-type earphone, and the ear clip-type earphone may include an earphone core 210, a fixing element 230, a control circuit 240, and a battery 270. The earphone core 210 may include a speaker element (not shown in the figure) and a microphone element (not shown in the figure). The fixing element may include an ear hook 231, an earphone housing 232, a circuit housing 233, and a back hook 234. The earphone housing 232 and the circuit housing 233 can be respectively arranged at the two ends of the ear hook 231, and the back hook 234 can be further arranged at the end of the circuit housing 233 farther from the ear hook 231. The earphone housing 232 can be used to accommodate different earphone cores. The circuit housing 233 can be used to accommodate the control circuit 260 and the battery 270. The two ends of the back hook 234 can be respectively connected to the corresponding circuit housing 233. The ear hook 231 can refer to a structure for hanging the ear clip-type earphone on the user's ear when the user wears the acoustic input and output device 200, and fixing the earphone housing 232 and the earphone core 210 at a predetermined position relative to the user's ear.

In some embodiments, the ear hook 231 may include an elastic metal wire. The elastic metal wire may be configured to keep the ear hook 231 in a shape that matches the user's ear and has a certain elasticity, so that when the user wears the ear clip earphone, it may undergo a certain elastic deformation according to the user's ear shape and head shape to adapt to users with different ear shapes and head shapes. In some embodiments, the elastic metal wire may be made of a memory alloy with good deformation recovery ability. Even if the ear hook 231 is deformed by an external force, it may return to its original shape when the external force is removed, thereby extending the service life of the ear clip earphone. In some embodiments, the elastic metal wire may also be made of a non-memory alloy. Conductive wires may be provided in the elastic metal wire to establish electrical connections between the earphone core 210 and other components (such as the control circuit 260, the battery 270, etc.) to provide power and data transmission for the earphone core 210. In some embodiments, the ear hook 231 may also include a protective sleeve 236 and a housing protector 237 formed integrally with the protective sleeve 236.

In some embodiments, the earphone housing 232 may be configured to accommodate the earphone core 210. The earphone core 210 may include one or more speaker elements and/or one or more microphone elements. The one or more speaker elements may include a bone conduction speaker element, an air conduction speaker element, etc. The one or more microphone elements may include a bone conduction microphone element, an air conduction microphone element, etc. The structure and arrangement of the speaker element and the microphone element may refer to the description elsewhere in the present invention, for example, Figures 3-15 and their detailed description. The number of earphone cores 210 and earphone housings 232 may be two, which may correspond to the left ear and the right ear of the user, respectively.

In some embodiments, the ear hook 231 and the earphone housing 232 can be formed separately and further assembled together, rather than directly forming the two together.

In some embodiments, the earphone housing 232 may be provided with a contact surface 2321. The contact surface 2321 may be in contact with the user's skin. When using the ear clip earphone, the sound waves generated by one or more bone conduction speakers of the earphone core 210 may be transferred to the outside of the earphone housing 232 (for example, to the user's eardrum) through the contact surface 2321. In some embodiments, the material and thickness of the contact surface 2321 may affect the propagation of the bone-conducted sound waves to the user, thereby affecting the sound quality. For example, if the material of the contact surface 2321 is more elastic, the transmission of bone-conducted sound waves in the low-frequency range may be better than the transmission of bone-conducted sound waves in the high-frequency range. On the contrary, if the contact surface 2321 material has less elasticity, the transmission of bone-conducted sound waves in the high-frequency range may be better than the transmission of bone-conducted sound waves in the low-frequency range. It should be noted that the earphone housing 232 in this embodiment and the housing in other embodiments of the present invention are used to refer to the parts of the acoustic input and output device 200 that contact the user.

FIG3 is a cross-sectional schematic diagram of a partial structure of an acoustic input-output device shown in some embodiments of the present invention. As shown in FIG3 , in some embodiments, the acoustic input-output device 300 may include a speaker element 310, which can be used to transmit sound waves by generating a first mechanical vibration; and a bone conduction microphone 320, which can be used to receive a second mechanical vibration generated when a voice signal source provides a voice signal. In some embodiments, the acoustic input-output device 300 may also include a fixing element 330, as shown in FIG3 , the fixing element 330 is fixedly connected to the speaker element 310, and when the user wears the acoustic input-output device 300, the speaker element 310 and the bone conduction microphone 320 are kept in contact with the user's face 340. In some embodiments, when the bone conduction microphone 320 and the speaker element 310 work simultaneously, the bone conduction microphone 320 can receive the first mechanical vibration and the second mechanical vibration, respectively generate the third mechanical vibration and the fourth mechanical vibration under the action of the first mechanical vibration and the second mechanical vibration, and respectively convert the third mechanical vibration and the fourth mechanical vibration into the first signal and the second signal. In some embodiments, within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal. As described herein, the third mechanical vibration may also be referred to as the first mechanical vibration received by the bone conduction microphone 320, i.e., the echo signal received by the bone conduction microphone 320; the fourth mechanical vibration may also be referred to as the second mechanical vibration received by the bone conduction microphone 320, i.e., the voice signal received by the bone conduction microphone 320. In some embodiments, the frequency range may include 200Hz~10kHz. In some embodiments, the frequency range may include 200Hz~9000Hz. In some embodiments, the frequency range may include 200Hz~8000Hz. In some embodiments, the frequency range may include 200Hz~6000Hz. In some embodiments, the frequency range may include 200Hz~5000Hz.

The speaker element 310 can transmit sound waves by generating a first mechanical vibration, so that the user can hear the sound. The speaker element 310 transmits sound waves in two ways: air conduction and bone conduction. Among them, the air conduction speaker element corresponds to the air conduction speaker element, which transmits the sound waves through the air in the form of waves. The sound waves are transmitted to the auditory nerve through the user's eardrum-ossicles-ear coccyx, so that the user can hear the sound. The bone conduction speaker element corresponds to the sound wave transmitted by bone conduction. The bone conduction speaker element transmits mechanical vibration to the skin and bones of the user's face 340 by contacting the user's face 340 (for example, the housing 350 of the bone conduction speaker element contacts the user's face 340) and transmits it to the auditory nerve through the bones, so that the user can hear the sound. Whether it is a bone conduction speaker element or an air conduction speaker element, the bone conduction microphone 320 is directly or indirectly connected to the speaker element 310. Specifically, when the speaker element 310 is a bone conduction speaker element, the housing 350 is one of the vibration elements of the bone conduction speaker element. The vibration element in the bone conduction speaker element needs to be directly or indirectly connected to the housing 350 to transmit the vibration to the user's skin and bones. The bone conduction microphone 320 needs to be directly or indirectly connected to the housing 350 to collect the vibration generated when the user speaks. When the bone conduction speaker transmits sound waves, the housing 350 will be caused to vibrate mechanically, and the housing 350 will transmit the mechanical vibration to the bone conduction microphone 320. After receiving the mechanical vibration, the bone conduction microphone 320 will generate a corresponding third mechanical vibration and generate a first signal containing sound information based on the third mechanical vibration. When the speaker element 310 is an air conduction speaker element, the housing 350 is used to accommodate the air conduction speaker element and the bone conduction microphone 320, which is equivalent to the outer shell of the acoustic input and output device 300. The vibration element in the air conduction speaker element can be directly or indirectly connected to the housing 350 to fix the air conduction speaker element. In summary, the bone conduction microphone 320 needs to be directly or connected to the housing 350 in order to collect the vibrations generated when the user speaks. When the air conduction speaker transmits sound waves, it will cause mechanical vibrations in the housing 350, and the housing 350 will transmit the mechanical vibrations to the bone conduction microphone 320. After receiving the mechanical vibrations, the bone conduction microphone 320 will generate a corresponding third mechanical vibration and generate a first signal containing sound information based on the third mechanical vibration.

Therefore, at least a portion of the first mechanical vibration generated by the speaker element 310 will be transmitted to the bone conduction microphone 320, causing the bone conduction microphone 320 to generate a third mechanical vibration. In addition to the first mechanical vibration transmitted by the speaker element 310, the bone conduction microphone 320 can be in contact with the skin of the user's face 340 to receive the second mechanical vibration (for example, vibration of the skin and bones) generated when the user speaks, causing the bone conduction microphone 320 to generate a fourth mechanical vibration.

When the bone conduction microphone 320 and the speaker element 310 work simultaneously, for example, the bone conduction microphone 320 receives a voice signal (for example, by picking up the vibration of the skin or other parts of the body when the person is speaking, the voice signal of the person speaking) and the speaker element 310 transmits the voice signal (for example, music) through vibration, the bone conduction microphone 320 will receive the first mechanical vibration and the second mechanical vibration at the same time. The microphone diaphragm (not shown in the figure) of the bone conduction microphone 320 will generate a third mechanical vibration and a fourth mechanical vibration corresponding to the first mechanical vibration and the second mechanical vibration respectively, and will convert the third mechanical vibration and the fourth mechanical vibration into the first signal and the second signal respectively. When the microphone diaphragm generates the third mechanical vibration in response to the first mechanical vibration picked up, the bone conduction microphone 320 will receive the voice information transmitted by the first mechanical vibration in addition to the voice information transmitted by the second mechanical vibration, thereby affecting the quality of the sound signal picked up by the microphone. For the convenience of description, the signal transmitted by the first mechanical vibration can be called an echo signal (or a secondary voice signal), and the component that generates and transmits the first mechanical vibration (for example, the speaker element 310, the housing 350) can be called an echo signal source (or a secondary voice signal source). The second mechanical vibration can be called a voice signal (or a main voice signal), and the component that generates and transmits the second mechanical vibration (for example, the user's vocal cords, nasal cavity, mouth, etc.) can be called a voice signal source (or a main voice signal source). Figure 3 shows the vibration direction of the voice signal source, the echo signal source, and the bone conduction microphone, where the direction indicated by arrow A is the direction of the first mechanical vibration, that is, the vibration direction of the echo signal source; the direction indicated by arrow B is the vibration direction of the bone conduction microphone, that is, the direction of the third mechanical vibration and the fourth mechanical vibration; the direction indicated by arrow C is the direction of the second mechanical vibration, that is, the vibration direction of the voice signal source.

Based on the above reasons, it is necessary to reduce the intensity of the echo signal generated by the bone conduction microphone 320 (i.e., the intensity of the first signal) by designing the acoustic input and output device 300. Furthermore, while reducing the intensity of the echo signal generated by the bone conduction microphone 320, the intensity of the voice signal generated by the bone conduction microphone 320 (i.e., the intensity of the second signal) can be increased, thereby achieving the purpose of reducing the intensity of the first signal and increasing the intensity of the second signal, so that the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal, thereby improving the quality of the sound signal generated by the bone conduction microphone.

Fig. 4 is a schematic diagram of the vibration transmission of the acoustic input-output device shown in some embodiments of the present invention. Combining Fig. 3 and Fig. 4, when the bone conduction microphone 320 and the speaker element 310 in the acoustic input-output device 300 work simultaneously, the mechanical vibration transmission model of the acoustic input-output device 300 can be equivalent to the model shown in Fig. 4. Specifically, the intensity of the mechanical vibration (i.e., the second mechanical vibration) of the voice signal source 360 (e.g., the user's bones or vocal cords) is L1; the intensity of the mechanical vibration (i.e., the first mechanical vibration) of the echo signal source 380 (e.g., the speaker element 310) is L2; there may be a first elastic connection 370 between the bone conduction microphone 320 and the voice signal source 360, and the elastic coefficient of the first elastic connection 370 is k1; there may be a second elastic connection 390 between the bone conduction microphone 320 and the echo signal source 380, and the elastic coefficient of the second elastic connection 390 is k2; the mass of the bone conduction microphone 320 is m. The first elastic connection 370 between the voice signal source 360 and the bone conduction microphone 320 may include the contact parts between the bone conduction microphone 320 and the user's face 340 (e.g., a vibration transmission layer, a metal sheet, a part of the housing 350, etc.), the user's skin, etc. The second elastic connection 390 between the bone conduction microphone 320 and the echo signal source 380 is part of the acoustic input and output device 300. For example, the bone conduction microphone 320 and the echo signal source 380 may be physically connected to the housing 350 at the same time, and the second elastic connection 390 may include the housing 350. For another example, the bone conduction microphone 320 and the echo signal source 380 can be physically connected to the housing 350 through a connector, respectively, and the second elastic connection 390 can include the housing 350 and the connector. In the embodiment shown in FIG4 , it can be assumed that the vibration direction of the voice signal source 360 is parallel to the vibration direction of the bone conduction microphone 320, and the vibration direction of the echo signal source 380 is parallel to the vibration direction of the bone conduction microphone 320, and the bone conduction microphone can receive the vibration of the voice signal source 360 and the vibration of the echo signal source 380 to the greatest extent. Among them, the vibration direction of the bone conduction microphone 320 can be understood as the vibration direction of the microphone diaphragm.

According to FIG4 , the strength L of the mechanical vibration received by the bone conduction microphone 320 can be obtained as:

可以表示L1(即第二機械振動)對L的影響；

可以表示L2(即第一機械振動)對L的影響。 Wherein, L1 is the intensity of the second mechanical vibration received by the bone conduction microphone 320 (i.e., the fourth mechanical vibration intensity), L2 is the intensity of the first mechanical vibration received (i.e., the third mechanical vibration intensity), and m is the mass of the bone conduction microphone 320. ω is the angular frequency of the signal, and the signal includes a voice signal and/or an echo signal.

It can express the influence of L1 (i.e. the second mechanical vibration) on L;

The influence of L2 (i.e. the first mechanical vibration) on L can be represented.

It can be seen that the larger the elastic coefficient k1 of the first elastic connection 370, the greater the influence of the vibration intensity L1 of the voice signal source 360 on the intensity L of the mechanical vibration received by the bone conduction microphone 320; the smaller the elastic coefficient k2 of the second elastic connection 390, the smaller the influence of the vibration intensity L2 of the echo signal source 380 on the intensity L of the mechanical vibration received by the bone conduction microphone 320, and the smaller the echo signal received by the bone conduction microphone 320.

Based on formula (1), it can be known that in order to reduce the echo signal received by the bone conduction microphone 320, the acoustic input and output device can be designed from multiple aspects, for example, L1 and/or k1 can be increased as much as possible, and L2 and/or k2 can be reduced as much as possible to increase the influence of L1 on L and reduce the influence of L2 on L, thereby improving the quality of the sound signal generated by the bone conduction microphone.

FIG5 is a schematic diagram of another mechanical vibration transmission model of an acoustic input/output device shown in some embodiments of the present invention. As shown in FIG5 , in some embodiments, the bone conduction microphone 520 may be a uniaxial bone conduction microphone, and the microphone diaphragm of the uniaxial bone conduction microphone can only vibrate in one direction, that is, the microphone diaphragm can only convert the mechanical vibration in this direction into an electrical signal (e.g., a first signal). For example, taking FIG5 as an example, the vibration direction of the bone conduction microphone 520 is the up-and-down direction. When the direction of the mechanical vibration is parallel to the vibration direction of the bone conduction microphone 520 (i.e., both are in the up-and-down direction), the microphone diaphragm can convert the received mechanical vibration into an electrical signal (e.g., a first signal and a second signal) to the greatest extent. Here, converting the received mechanical vibration into an electrical signal to the greatest extent can be understood as that almost all mechanical vibrations except for the loss caused by resistance and the like (for example, a part of the mechanical vibration will be lost when it is transmitted through the first elastic connection 570 and the second elastic connection 590) can be received by the microphone diaphragm and converted into electrical signals. When the direction of the mechanical vibration is perpendicular to the vibration direction of the bone conduction microphone 520 (i.e., the left-right direction), only a small part of the received mechanical vibration can be converted into an electrical signal by the microphone diaphragm, so the intensity of the electrical signal is minimal. In other words, when the vibration direction of the bone conduction microphone 520 is perpendicular to the direction of the mechanical vibration, the intensity of the electrical signal generated by the bone conduction microphone 520 is minimal, and the intensity of the generated sound signal is minimal.

Based on the above principle, in some embodiments, the installation position of the bone conduction microphone 520 can be designed so that the vibration direction of the bone conduction microphone 520 and the vibration direction of the echo signal source 580 (for example, the speaker element 310 shown in Figure 3) (i.e., the first mechanical vibration direction) are within a certain angle range, so as to reduce the intensity of the first signal generated by the bone conduction microphone 520, that is, reduce the intensity of the echo signal generated by the bone conduction microphone 520. Furthermore, in some embodiments, the vibration direction of the bone conduction microphone 520 and the vibration direction of the voice signal source 560 (for example, the user's face 340 shown in FIG. 3 ) are within a certain angle range to increase the strength of the second signal generated by the bone conduction microphone 520, that is, to increase the strength of the voice signal generated by the bone conduction microphone 520.

FIG6 is another structural schematic diagram of the vibration transmission of the acoustic input-output device shown in some embodiments of the present invention. As shown in FIG6, in some embodiments, the angle formed by the vibration direction of the bone conduction microphone 620 and the vibration direction of the echo signal source 680 (for example, the speaker element 310 shown in FIG3) can be a first angle α. In some embodiments, the first angle α can be in the angle range of 20 degrees to 90 degrees. In some embodiments, the first angle α can be in the angle range of 45 degrees to 90 degrees. In some embodiments, the first angle α can be in the angle range of 60 degrees to 90 degrees. In some embodiments, the first angle α can be in the angle range of 75 degrees to 90 degrees. In some embodiments, the first angle α can be 90 degrees. In this embodiment, within the range of 20 degrees to 90 degrees, the larger the first angle α is, the closer the vibration direction of the microphone diaphragm is to the vibration direction of the echo signal source 680, and the smaller the intensity of the first signal converted by the microphone diaphragm. When the first angle α is 90 degrees, the intensity of the first signal converted by the microphone diaphragm is the smallest, that is, the intensity of the echo signal generated by the bone conduction microphone 620 is the smallest.

In some embodiments, according to formula (1), the greater the influence of the vibration intensity L1 of the voice signal source 660 on the intensity L of the mechanical vibration received by the bone conduction microphone 620, that is, the greater the vibration intensity L1 of the voice signal source 660 received by the bone conduction microphone 620, the smaller the influence of the vibration intensity L2 of the echo signal source 680 on the intensity L of the mechanical vibration received by the bone conduction microphone 620. In some embodiments, in order to increase the influence of the vibration intensity L1 of the voice signal source 660 on the sound signal L generated by the bone conduction microphone 620, the angle between the vibration direction of the bone conduction microphone 620 and the vibration direction of the voice signal source 660 can be designed to be within a certain range. The angle between the vibration direction of the bone conduction microphone 620 and the vibration direction of the voice signal source 660 may be a second angle β. In some embodiments, the second angle β may be in the angle range of 0 to 85 degrees. In some embodiments, the second angle β may be in the angle range of 0 to 75 degrees. In some embodiments, the second angle β may be in the angle range of 0 to 60 degrees. In some embodiments, the second angle β may be in the angle range of 0 to 45 degrees. In some embodiments, the second angle β may be in the angle range of 0 to 30 degrees. In some embodiments, the second angle β may be in the angle range of 0 to 15 degrees. In some embodiments, the second angle β may be in the angle range of 0 to 5 degrees. In some embodiments, the second angle β can be 0 degrees, that is, the vibration direction of the bone conduction microphone 620 is parallel to the vibration direction of the voice signal source 660. In this embodiment, within the range of 0 degrees to 90 degrees, the smaller the second angle β is, the closer the vibration direction of the microphone diaphragm is to the vibration direction of the voice signal source 660, and the greater the intensity of the second signal converted by the microphone diaphragm. When the second angle β is 0 degrees, the intensity of the first signal converted by the microphone diaphragm is the largest, and at this time, the intensity of the second signal generated by the bone conduction microphone 620 is the largest, that is, the intensity of the generated voice signal is the largest. As described herein, the angle between two directions refers to the smallest positive angle formed by the intersection of the straight lines in the two directions.

It should be noted that the scheme of controlling the first angle α within a set angle range can be combined with the scheme of controlling the second angle β within a set angle range. In some embodiments, the first angle α can be set to 90 degrees, and the second angle β can be set to 30 degrees. In some embodiments, the first angle α can be set to 90 degrees, and the second angle β can be set to 45 degrees. In some embodiments, the first angle α can be set to 90 degrees, and the second angle β can be set to 60 degrees. In some embodiments, the first angle α can be set to 45 degrees, and the second angle β can be set to 30 degrees. In some embodiments, the first angle α can be set to 90 degrees, and the second angle β can be set to 15 degrees. When the first angle α is set to 90 degrees and the second angle β is set to 0 degrees, FIG. 6 is the same as FIG. 5. In this embodiment, the bone conduction microphone 620 can convert the vibration received from the voice signal source 660 into the second signal to the greatest extent, and the intensity of the generated first signal is minimized, thereby improving the quality of the sound signal generated by the bone conduction microphone 620.

FIG8 is a graph of the intensity of the second signal and the first signal shown in some embodiments of the present invention. FIG8 shows an intensity curve 810 of the first signal and an intensity curve 820 of the second signal converted by the bone conduction microphone based on the mechanical vibration (i.e., the first mechanical vibration) generated by the echo signal source 380 in FIG4 and based on the mechanical vibration (i.e., the second mechanical vibration) generated by the voice signal source 360, wherein the horizontal axis is the frequency and the vertical axis is the sound intensity. In some embodiments, the intensity curves of the first signal and the second signal shown in FIG8 are obtained when the first angle α is 0 degrees and the second angle β is also 0 degrees. Combining Figures 3, 4 and 8, it can be seen that within the frequency range of about 0 to 500 Hz, the intensity of the first signal generated by the bone conduction microphone 320 is less than the intensity of the second signal. When the frequency exceeds 500 Hz, for example, within the frequency range of 500 Hz to 10000 Hz, the intensity of the first signal generated by the bone conduction microphone 320 is greater than the intensity of the second signal, and the echo generated by the bone conduction microphone 320 is larger. Therefore, the intensity of the echo signal generated by the bone conduction microphone 320 can be reduced by designing the installation position of the bone conduction microphone 320 and the speaker element 310.

For example, FIG9 is another intensity curve diagram of the first signal and the second signal shown in some embodiments of the present invention. As shown in FIG9, in this embodiment, the positions of the bone conduction microphone 620 and the echo signal source 680 (for example, the speaker element 310 shown in FIG3) are designed so that the first angle α is 90 degrees and the second angle β is 60 degrees. It can be seen from the intensity curve 810 of the first signal and the intensity curve 910 of the first signal and the intensity curve 820 of the second signal and the intensity curve 920 of the second signal that after the above design (i.e., adjusting the first angle α and the second angle β), the intensity of the first signal generated by the bone conduction microphone 620 is significantly reduced (as shown in FIG9). At the same time, the above design has a small or almost negligible effect on the attenuation of the second signal intensity generated by the bone conduction microphone 620. The intensity of the first signal generated by the bone conduction microphone 620 is significantly less than the intensity of the first signal, so that the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal. In some embodiments, after adopting the above design, within the frequency range of 0-800 Hz, the intensity of the first signal generated by the bone conduction microphone 620 is smaller. Compared with FIG. 8 , within a wider low-frequency range, the intensity of the first signal generated by the bone conduction microphone 620 is smaller, that is, the intensity of the echo signal generated by the bone conduction microphone 620 is smaller, so that the user can hear a clearer voice signal, effectively improve the sound quality, and effectively improve the user experience.

In some embodiments, after the positions of the bone conduction microphone 620 and the echo signal source 680 (e.g., the speaker element 310) are designed in a certain manner, the amplitude of the reduction of the intensity of the second signal is significantly smaller than the amplitude of the reduction of the intensity of the first signal, so that the ratio of the intensity of the second signal to the intensity of the first signal can be greater than the threshold, thereby increasing the proportion of the voice signal in the sound signal generated by the bone conduction microphone 620, making the voice signal clearer and the user experience better. In some embodiments, the ratio of the intensity of the second signal to the intensity of the first signal can be greater than 1/4. In some embodiments, the ratio of the intensity of the second signal to the intensity of the first signal can be greater than 1/3. In some embodiments, the ratio of the intensity of the second signal to the intensity of the first signal can be greater than 1/2. In some embodiments, the ratio of the strength of the second signal to the strength of the first signal may be greater than 2/3.

It should be noted that the solution described in one or more of the above embodiments of increasing the strength of the voice signal received by the microphone element (e.g., the microphone element 320 shown in FIG. 3 ) and reducing the strength of the echo signal by adjusting the first and second angles can also be applied to air conduction microphones.

In some embodiments, a uniaxial bone conduction microphone is only used as an example for illustration. In addition, the bone conduction microphone (e.g., the bone conduction microphone 320 shown in FIG. 3 ) may also be other types of microphones, for example, the bone conduction microphone 320 may be a two-axis microphone, a three-axis microphone, a vibration sensor, an accelerometer, etc.

Continuing to refer to FIG. 3 and FIG. 4, in some embodiments, the bone conduction microphone 320 can be a two-axis microphone, that is, the bone conduction microphone 320 can convert the received mechanical vibrations in two directions into electrical signals. For example, FIG. 7 is a schematic diagram of the two-axis microphone calculation and generation of electrical signals according to some embodiments of the present invention. In some embodiments, the two directions can have a certain angle (i.e., a third angle). The angle range of the third angle is 0 degrees to 90 degrees. As shown in FIG. 7, the two directions are represented as the X-axis direction and the Y-axis direction, and the X-axis is perpendicular to the Y-axis. The angle between the echo signal source 380 and the X-axis of the bone conduction microphone is α(e), the angle between the voice signal source 360 and the X-axis of the bone conduction microphone is β(s), the echo signal (i.e., the first mechanical vibration) generated by the echo signal source 380 is e(t), and the voice signal (i.e., the second mechanical vibration) generated by the voice signal source 360 is s(t), then the vibration components of the echo signal source 380 and the voice signal source 360 on the X-axis of the bone conduction microphone are: x ( t )=e(t)cos(α(e))+s(t)cos(β(s)), (2)

The vibration components of the echo signal source 380 and the voice signal source 360 on the Y axis of the bone conduction microphone are: y ( t ) = e (t) sin (α (e)) + s (t) sin (β (s)), (3)

The echo signal of the bone conduction microphone 320 can be eliminated by weighting the vibration component x(t) of the echo signal source 380 and the voice signal source 360 on the X-axis of the bone conduction microphone and the vibration component y(t) of the echo signal source 380 and the voice signal source 360 on the Y-axis of the bone conduction microphone. Then, the total sound signal of the bone conduction microphone 320 is: out ( t ) = x ( t )sin(α(e))-y(t)cos(α(e))=s(t)sin(α(e)-β(s)), (4)

The weighting coefficient corresponding to the vibration component x(t) of the echo signal source 380 and the voice signal source 360 on the X-axis of the bone conduction microphone is sin(α(e)), and the weighting coefficient corresponding to the vibration component y(t) of the echo signal source 380 and the voice signal source 360 on the Y-axis of the bone conduction microphone is -cos(α(e)). In some embodiments, the angle α(e) between the echo signal source 380 and the X-axis of the bone conduction microphone can be obtained when the acoustic input and output device is assembled. In some embodiments, α(e) can be obtained through the following process, including determining whether the current signal of the bone conduction microphone 320 has a voice signal s(t); when the current signal does not have a voice signal s(t), the size of α(e) is obtained by the following formulas (5)-(7).

x ( t )=e(t)cos(α(e)), (5)

y ( t )=e(t)sin(α(e)), (6)

According to formula (5) and (6), we can get:

In some embodiments, x(t) and y(t) can be weighted and α(e) can be obtained according to formula (7). In some embodiments, after solving α(e) according to formula (7), α(e) can be smoothed in time to obtain a more stable α(e) estimate.

In some embodiments, the bone conduction microphone 320 may also be a three-axis microphone. For example, the microphone may have an X-axis, a Y-axis, and a Z-axis, and the sound signal generated by the three-axis microphone may be calculated based on the weighted components of the speech signal s(t) and the echo signal e(t) on the X-axis, Y-axis, and Z-axis of the bone conduction microphone. Since the principle of calculating and generating the sound signal by the three-axis microphone is similar to that of the two-axis microphone, it will not be elaborated here.

In some embodiments, the vibration direction of the echo signal source 380 may not be a single direction. For example, the vibration direction of the echo signal source 380 may be diffused along a circular arc trajectory. In this case, the vibration generated by the echo signal source 380 that is not perpendicular to the vibration direction of the bone conduction microphone 320 can be received by the bone conduction microphone 320 and converted into a first signal, that is, an echo signal is generated. Therefore, in some embodiments, the speaker element 310 and the bone conduction microphone 320 can be designed so that the position between the bone conduction microphone 320 and the speaker element 310 (for example, the housing 350) is relatively fixed to reduce the vibration transmitted by the echo signal source 380 received by the bone conduction microphone 320.

In some embodiments, in addition to designing the first angle α and the second angle β, the purpose of reducing echo can also be achieved by changing the elastic coefficient k1 of the first elastic connection 370 and the elastic coefficient k2 of the second elastic connection 390.

In some embodiments, the strength of the first mechanical vibration (i.e., the third mechanical vibration) received by the bone conduction microphone 320 can be reduced by reducing the elastic strength k2 of the second elastic connection 390 between the bone conduction microphone 320 and the echo signal source 380.

FIG. 10 is a cross-sectional schematic diagram of a bone conduction microphone connected to a vibration reduction structure shown in some embodiments of the present invention, and FIG. 11 is a cross-sectional schematic diagram of an acoustic input-output device with a vibration reduction structure shown in some embodiments of the present invention. In combination with FIG. 10 and FIG. 11, the acoustic input-output device 1000 may include a bone conduction microphone 1020 and a speaker element 1010. The bone conduction microphone 1020 and the speaker element 1010 may be placed in the same housing. In some embodiments, the acoustic input-output device 1000 may also include a vibration reduction structure 1100, and the bone conduction microphone 1020 may be connected to the speaker element 1010 through the vibration reduction structure 1100. When the bone conduction microphone 1020 and the speaker element 1010 work simultaneously, the speaker element 1010 can transmit a voice signal (sound wave) through a first mechanical vibration, and the bone conduction microphone 1020 can receive or transmit a second mechanical vibration generated when a voice signal source provides a voice signal to pick up the voice signal. The first mechanical vibration of the speaker element 1010 can be transmitted to the bone conduction microphone 1020 through the vibration reduction structure 1100, and the bone conduction microphone 1020 can generate a third mechanical vibration and a fourth mechanical vibration under the action of the first mechanical vibration and the second mechanical vibration. The vibration reduction structure 1100 can reduce the intensity of the first mechanical vibration of the speaker element 1010 (echo signal source) received by the bone conduction microphone 1020, thereby reducing the intensity of the first signal generated by the bone conduction microphone 1020.

The vibration-damping structure 1100 may refer to a structure with a certain elasticity, which reduces the intensity of the mechanical vibration transmitted from the echo signal source 1080 through its elasticity. In some embodiments, the vibration-damping structure 1100 may be an elastic component to reduce the intensity of the transmitted mechanical vibration. The elasticity of the vibration-damping structure 1100 may be determined by the material, thickness, structure, etc. of the vibration-damping structure.

In some embodiments, the vibration-damping structure 1100 may be made of a vibration-damping material having an elastic modulus less than a first threshold. In some embodiments, the first threshold may be 5000 MPa. In some embodiments, the first threshold may be 4000 MPa. In some embodiments, the first threshold may be 3000 MPa. In some embodiments, the elastic modulus of the vibration-damping material may be in the range of 0.01 MPa to 1000 MPa. In some embodiments, the elastic modulus of the vibration-damping material may be in the range of 0.015 MPa to 2500 MPa. In some embodiments, the elastic modulus of the vibration-damping material may be in the range of 0.02 MPa to 2000 MPa. In some embodiments, the elastic modulus of the vibration-damping material may be in the range of 0.025MPa to 1500MPa. In some embodiments, the elastic modulus of the vibration-damping material may be in the range of 0.03MPa to 1000MPa. In some embodiments, the vibration-damping material may include but is not limited to foam, plastic (for example, but not limited to high molecular weight polyethylene, blown nylon, engineering plastics, etc.), rubber, silicone, etc. In some embodiments, the vibration-damping material may be foam.

In some embodiments, the vibration-damping structure 1100 may have a certain thickness. Referring to FIG. 10 , the thickness of the vibration-damping structure 1100 may be understood as the dimension in any one of the X-axis direction, the Y-axis direction, or the Z-axis direction. In some embodiments, the thickness of the vibration-damping structure 1100 may be in the range of 0.5 mm to 5 mm. In some embodiments, the thickness of the vibration-damping structure 1100 may be in the range of 1 mm to 4.5 mm. In some embodiments, the thickness of the vibration-damping structure 1100 may be in the range of 1.5 mm to 4 mm. In some embodiments, the thickness of the vibration-damping structure 1100 may be in the range of 2 mm to 3.5 mm. In some embodiments, the thickness of the vibration-damping structure 1100 may be in the range of 2 mm to 3 mm.

In some embodiments, the elasticity of the vibration-damping structure 1100 can be provided by a design on its structure. For example, the vibration-damping structure 1100 can be an elastic structure, and even if the rigidity of the material used to make the vibration-damping structure 1100 is relatively high, elasticity can be provided by its structure. In some embodiments, the vibration-damping structure 1100 can include but is not limited to a spring-like structure, a ring-shaped or ring-like structure, etc.

In some embodiments, the surface of the bone conduction microphone 1020 may include a first portion 1021 and a second portion 1022, wherein the first portion 1021 may be used to contact the user's face 1040 to conduct the second mechanical vibration provided by the voice signal source, and the second portion 1022 may be used to connect with other components of the acoustic input and output device 1000 (for example, connected with the speaker element 1010), and the second portion 1022 may be provided with a vibration-damping structure 1100 and then connected to the speaker element 1010 through the vibration-damping structure 1100. In this embodiment, the vibration reduction structure 1100 disposed between the speaker element 1010 and the bone conduction microphone 1020 has a certain elasticity, which can reduce the first mechanical vibration transmitted by the speaker element 1010, reduce the intensity of the first mechanical vibration received by the bone conduction microphone 1020, and make the echo signal generated by the bone conduction microphone 1020 smaller. Furthermore, the vibration reduction structure 1100 is not disposed on the first portion 1021 because the first portion 1021 of the surface of the bone conduction microphone 1020 is in contact with the user's face 1040 to conduct the second mechanical vibration. For example, the first part 1021 may be a side close to the microphone diaphragm, and the second mechanical vibration represents the voice signal provided by the voice signal source, so it is necessary to ensure that the second mechanical vibration is not weakened as much as possible. Specifically, in combination with Figures 10 and 11, the vibration reduction structure 1100 may surround the second part 1022 of the surface of the bone conduction microphone 1020, and leave the first part 1021 empty so that the first part 1021 can directly contact the user's face 1040.

In some embodiments, the vibration-damping structure 1100 can be connected to the second portion 1022 of the surface of the bone conduction microphone by adhesive. In some embodiments, the vibration-damping structure 1100 can also be fixed to the bone conduction microphone 1020 by welding, clamping, riveting, threaded connection (for example, connected by components such as screws, screws, screw rods, bolts, etc.), clamp connection, pin connection, wedge key connection, or integral molding.

In some embodiments, the first part 1021 of the surface of the bone conduction microphone 1020 may be provided with a vibration transmission layer 1023. Since the bone conduction microphone 1020 is relatively rigid, if the first part 1021 directly contacts the user's face 1040, the user may feel uncomfortable, which will reduce the user experience. After the first part 1021 is provided with the vibration transmission layer 1023, the touch is better when in contact with the user, which can effectively improve the user experience.

In some embodiments, the vibration transmission layer 1023 needs to maintain a certain elasticity, which can not only reduce the loss of the second mechanical vibration in the conduction process, but also ensure that the user has a good touch after wearing the acoustic input and output device 1000. In some embodiments, if the elastic modulus of the material of the vibration transmission layer 1023 is too small, it means that the elasticity of the material of the vibration transmission layer 1023 is relatively small, which will weaken the intensity of the second mechanical vibration. Therefore, in some embodiments, the elastic modulus of the material used to make the vibration transmission layer 1023 can be greater than the second threshold. In some embodiments, the second threshold can be 0.01Mpa. In some embodiments, the second threshold can be 0.015Mpa. In some embodiments, the second threshold can be 0.02Mpa. In some embodiments, the second threshold value may be 0.025 MPa. In some embodiments, the second threshold value may be 0.03 MPa. In some embodiments, the elastic modulus of the vibration transmission layer 1023 may be in the range of 0.03 MPa to 3000 MPa. In some embodiments, the elastic modulus of the vibration transmission layer 1023 may be in the range of 5 MPa to 2000 MPa. In some embodiments, the elastic modulus of the vibration transmission layer 1023 may be in the range of 10 MPa to 1500 MPa. In some embodiments, the elastic modulus of the vibration transmission layer 1023 may be in the range of 10 MPa to 1000 MPa. In some embodiments, the material used to make the vibration transmission layer 1023 can be silicone (the elastic modulus of silicone is 10Mpa), rubber or plastic (the elastic modulus of plastic is 1000Mpa).

In some embodiments, the loss of the second mechanical vibration during the conduction process can be reduced by reducing the thickness of the vibration transmission layer 1023. When the thickness of the vibration transmission layer 1023 is thin, even if the elastic modulus of the material making the vibration transmission layer 1023 is small, the strength of the second mechanical vibration will not be greatly lost. In some embodiments, the thickness of the vibration transmission layer 1023 can be less than 30 mm. In some embodiments, the thickness of the vibration transmission layer 1023 can be less than 25 mm. In some embodiments, the thickness of the vibration transmission layer 1023 can be less than 20 mm. In some embodiments, the thickness of the vibration transmission layer 1023 can be less than 15 mm. In some embodiments, the thickness of the vibration transmission layer 1023 can be less than 10 mm. In some embodiments, the thickness of the vibration transmission layer 1023 may be less than 5 mm. In some embodiments, the vibration transmission layer 1023 may be made of rubber or silicone with a thickness of 5 mm, which can ensure a good touch while also ensuring the strength of the second mechanical vibration received by the bone conduction microphone 1020.

It should be noted that the above-described embodiment of the acoustic input/output device 1000 is applicable to both bone conduction speaker elements and air conduction speaker elements. For example, in the case of a bone conduction speaker element, the housing 1050 may be a part of the bone conduction speaker element, and the bone conduction microphone 1020 may be connected to the housing of the bone conduction speaker element via the vibration-damping structure 1100. When it is an air conduction speaker element, the air conduction speaker element and the bone conduction microphone 1020 can both be connected to the housing (for example, the diaphragm is connected to the housing, and the bone conduction microphone 1020 is connected to the housing), and a vibration reduction structure is also provided between the bone conduction microphone 1020 and the housing.

In some embodiments, the intensity of the second mechanical vibration (i.e., the fourth mechanical vibration) received by the bone conduction microphone can be increased by increasing the clamping force between the acoustic input and output device 1000 and the user's contact part. It can be understood that the closer the acoustic input and output device 1000 is in contact with the user's contact part (e.g., the user's face 1040), the less the second mechanical vibration is lost during the transmission process. However, if the clamping force between the acoustic input and output device 1000 and the user's contact part is large, the user will feel pain and the user experience will be poor. Therefore, the clamping force needs to be controlled within a certain range. In some embodiments, when the speaker element 1010 is an air conduction speaker element, that is, the acoustic input output device 1000 transmits sound signals to the user through the air conduction speaker element and receives the user's voice signals through the bone conduction microphone 1020, in this case, the clamping force can be set within the range of 0.001N~0.3N. In some embodiments, the clamping force can be set within the range of 0.0025N~0.25N. In some embodiments, the clamping force can be set within the range of 0.005N~0.15N. In some embodiments, the clamping force can be set within the range of 0.0075N~0.1N. In some embodiments, the clamping force can be set within the range of 0.01N to 0.05N. In some embodiments, since the bone conduction speaker element transmits the mechanical vibration generated by the vibration element to the user's face through the housing so that the user can hear the sound, the clamping force is different when the speaker element 1010 is a bone conduction speaker element. For example, when the speaker element 1010 of the acoustic input-output device 1000 includes a bone conduction speaker element, if the clamping force is too small, the intensity of the mechanical vibration transmitted to the user by the bone conduction speaker element will also be too small, that is, the volume of the sound transmitted to the user by the acoustic input-output device 1000 is too small. Therefore, in order to ensure the intensity of the mechanical vibration received by the user, in some embodiments, when the speaker element 1010 of the acoustic input and output device 1000 includes a bone conduction speaker element, the clamping force needs to be set within a certain range. In some embodiments, the clamping force can be set within the range of 0.01N~2.5N. In some embodiments, the clamping force can be set within the range of 0.025N~2N. In some embodiments, the clamping force can be set within the range of 0.05N~1.5N. In some embodiments, the clamping force can be set within the range of 0.075N~1N. In some embodiments, the clamping force can be set within the range of 0.1N~0.5N.

In some embodiments, the speaker element 1010 and the bone conduction microphone 1020 may be directly connected, for example, the bone conduction microphone 1020 is directly connected to the housing 1050 (housing of the bone conduction speaker element) of the speaker element 1010 and is accommodated in the housing 1050. In some embodiments, the bone conduction microphone and the speaker element may be indirectly connected.

FIG. 12 is a schematic cross-sectional view of an acoustic input-output device shown in some embodiments of the present invention. In some embodiments, the acoustic input-output device 1200 includes a speaker element 1210 and a bone conduction microphone 1220. The speaker element 1210 is a bone conduction speaker element. The speaker element 1210 may include a housing 1250 and a vibration element 1211 connected to the housing 1250 for generating a first mechanical vibration in transmitting sound waves. The bone conduction microphone 1220 is connected to the housing 1250. As shown in FIG. 12, the vibration element 1211 may include a vibration plate 1213, a magnetic circuit element 1215, and a coil 1217 (or a voice coil). The magnetic circuit element 1215 can be used to form a magnetic field, and the coil 1217 can generate mechanical vibration in the magnetic field to cause the vibration of the vibration plate 1213. Specifically, when the signal current is passed through the coil 1217, the coil 1217 is in the magnetic field formed by the magnetic circuit element 1215, and is subjected to the Ampere force to generate mechanical vibration. The vibration of the coil 1217 drives the vibration plate 1213 to generate mechanical vibration. And the mechanical rotation of the vibration plate 1213 can be further transmitted to the housing 1250, and then contact with the user through the housing 1250 so that the user can hear the sound.

In some embodiments, the bone conduction microphone 1220 can be disposed at any position on the inner wall of the housing 1250, for example, disposed at the junction of the inner wall on the lower side and the inner wall on the left side of the housing 1250 shown in FIG. 12. For another example, it is disposed on the inner wall on the lower side of the housing 1250 and does not contact the inner wall on the left or right side. The acoustic input-output device 1200 can be combined with one or more of the aforementioned embodiments, for example, a vibration reduction structure is disposed between the bone conduction microphone 1220 and the housing 1250 shown in FIG. 12 to reduce the intensity of the first mechanical vibration received by the bone conduction microphone 1220.

FIG13 is a schematic cross-sectional view of an acoustic input-output device shown in some embodiments of the present invention. The acoustic input-output device 1300 includes a speaker element 1310 and a bone conduction microphone 1320. In some embodiments, the speaker element 1310 is an air conduction speaker element, and the speaker element 1310 may include a housing 1350 and a vibration element 1311. The vibration element 1311 may include a diaphragm 1313, a magnetic circuit element 1315, and a coil 1317. The magnetic circuit element 1315 may be used to form a magnetic field, and the coil 1317 may generate mechanical vibrations in the magnetic field to cause vibrations of the diaphragm 1313. There is a first connection between the housing 1350 and the vibration element 1311. The first connection may include a first vibration reduction structure.

When the air conduction speaker element is working, the diaphragm 1313 will generate mechanical vibrations, and because the diaphragm 1313 and the housing 1350 are directly connected (as shown in FIG13 ), the vibration of the diaphragm 1313 will cause mechanical vibrations of the housing 1350. Unlike the bone conduction speaker element shown in FIG12 , the air conduction speaker element does not need to rely on the vibration of the housing 1350 to transmit sound waves, but relies on a plurality of sound-transmitting holes (e.g., the first sound-transmitting hole 1351 and the second sound-transmitting hole 1352) opened on the housing to transmit sound waves to the user. Therefore, a first vibration reduction structure may be provided between the vibration element 1311 and the housing 1350 to reduce the mechanical vibration of the housing 1350, thereby reducing the intensity of the mechanical vibration transmitted by the housing 1350 and received by the bone conduction microphone 1320.

In some embodiments, the first vibration-damping structure may be arranged in the same or similar manner as the vibration-damping structure 1100 in the aforementioned embodiment. For example, the first vibration-damping structure may be made of the same thickness, the same material, and the same structure as the vibration-damping structure 1100. In some embodiments, the first vibration-damping structure may be different from the vibration-damping structure 1100. For example, the first vibration-damping structure may be a strip-shaped component or a sheet-shaped component with a certain elasticity. The two ends of the strip-shaped component or the sheet-shaped component are respectively connected to the diaphragm 1313 and the housing 1350 to reduce the intensity of the mechanical vibration transmitted from the diaphragm 1313 to the housing 1350. The first vibration-damping structure may also be a ring-shaped component. The middle part of the annular component is connected to the diaphragm, and the outer side of the annular component is connected to the housing 1350, which can also reduce the intensity of the mechanical vibration transmitted from the diaphragm 1313 to the housing 1350.

Continuing with reference to FIG. 13 , in some embodiments, a second connection may be included between the housing 1350 and the bone conduction microphone 1320. The second connection may include a second vibration damping structure. The second vibration damping structure may reduce the intensity of the mechanical vibration (i.e., the third mechanical vibration) transmitted from the housing 1350 to the bone conduction microphone 1320.

In some embodiments, the bone conduction microphone 1320 and the speaker element 1310 can be respectively arranged in different areas of the acoustic input and output device, and then a second vibration-damping structure is arranged between the bone conduction microphone 1320 and the housing 1350 of the speaker element 1310. In some embodiments, the bone conduction microphone 1320 can be arranged separately in other areas of the acoustic input and output device, and then connected to the housing 1350 through the second vibration-damping structure. Taking the embodiment shown in FIG17 as an example, the acoustic input and output device 1700 is a single-ear headset, and the bone conduction microphone 1720 and the speaker element 1710 are respectively disposed in two earmuffs 1731 on both sides of the fixing element 1730, and then connected through the fixing element 1730. In the embodiment shown in FIG17, the second connection includes the fixing element 1730 and the earmuffs 1731 disposed on both sides of the fixing element 1730, and the second vibration-damping structure can be disposed on the fixing element 1730 and the earmuffs 1731. For example, a layer of vibration-damping material is disposed on the outer surface of the fixing element 1730 as the second vibration-damping structure. For another example, in the embodiment shown in FIG18, the acoustic input and output device 1800 is a binaural headset, a sponge sleeve 1833 is provided on the earmuff 1831, and the bone conduction microphone 1820 is provided in the sponge sleeve 1833, and is connected to the housing 1850 of the speaker element 1810 through the sponge sleeve 1833. In this embodiment, the sponge sleeve 1833 can be equivalent to the second vibration reduction structure, which reduces the intensity of the first mechanical vibration transmitted to the bone conduction microphone 1820. For the specific description of the second vibration reduction structure, please refer to other embodiments of the present invention (such as the embodiments of FIG17, FIG18 and FIG19), which will not be repeated here.

The above-mentioned embodiment of the second vibration-damping structure is applicable not only to air conduction speaker elements, but also to bone conduction speaker elements. For example, the speaker elements in the embodiments shown in FIG. 17 and FIG. 18 can be replaced by the bone conduction speaker elements shown in FIG. 12. Taking FIG. 17 as an example, the bone conduction speaker element and the bone conduction microphone 1720 are respectively arranged in two earmuffs 1731, and a layer of vibration-damping material can still be set on the fixing element 1730 as the second vibration-damping structure.

It should be noted that when the bone conduction microphone is disposed inside the housing as shown in FIG13 and the bone conduction microphone is directly connected to the housing, the second vibration reduction structure is the same as the vibration reduction structure in the aforementioned embodiment. For more description, please refer to the relevant contents of FIG10 and FIG11, which will not be elaborated here.

13, in some embodiments, the mechanical vibration intensity of the housing 1350 can be reduced not only by adding a first vibration reduction structure between the vibration element 1311 and the housing 1350, but also by other means. In some embodiments, the mechanical vibration intensity of the housing 1350 can be reduced by reducing the mass of the vibration element 1311 to reduce the impact of the vibration element 1311 on the housing 1350 when it vibrates. The vibration element 1311 may include a diaphragm 1313. The mechanical vibration of the housing 1350 is caused by the vibration of the diaphragm 1313. If the mass of the vibration element 1311 (for example, the diaphragm 1313) is small, then the impact of the vibration element 1311 on the housing 1350 will be smaller when it vibrates, and the intensity of the mechanical vibration generated by the housing 1350 will be small. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.001g~1g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.002g~0.9g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.003g~0.8g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.004g~0.7g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.005g~0.6g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.005g~0.5g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.005g~0.3g.

Similarly, if the mass of the housing 1350 is much greater than the mass of the diaphragm 1313, the mechanical vibration of the diaphragm 1313 will have less impact on the housing 1350. Therefore, in some embodiments, the mechanical vibrator strength of the housing 1350 can be reduced by increasing the mass of the housing 1350. In some embodiments, the mass of the housing 1350 can be controlled within a range of 2g to 20g. In some embodiments, the mass of the housing 1350 can be controlled within a range of 3g to 15g. In some embodiments, the mass of the housing 1350 can be controlled within a range of 4g to 10g. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled so that the mass of the housing 1350 is much greater than the mass of the diaphragm 1313, thereby reducing the influence of the mechanical vibration of the diaphragm 1313 on the housing 1350. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled within a range of 10 to 100. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled within a range of 15 to 80. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled within a range of 20 to 60. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled within a range of 25 to 50. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled within a range of 30 to 50.

FIG. 14 is a schematic cross-sectional view of an acoustic input-output device having two air-conducting speaker elements shown in some embodiments of the present invention, and FIG. 15 is a schematic cross-sectional view of another acoustic input-output device having two air-conducting speaker elements shown in some embodiments of the present invention. In the embodiments shown in FIG. 14 and FIG. 15 , the speaker elements are both air-conducting speaker elements. As shown in FIG. 14 , in some embodiments, the speaker element 1410 may include a first vibration element 1411 and a second vibration element 1412, the first vibration element 1411 includes a first diaphragm 1413, a first magnetic circuit element 1415, and a first coil 1417, and the second vibration element 1412 includes a second diaphragm 1414, a second magnetic circuit element 1416, and a second coil 1418 (or a voice coil). In some embodiments, the first diaphragm 1413 and the second diaphragm 1414 have opposite vibration directions. For example, FIG. 14 shows the vibration directions of the first diaphragm 1413 and the second diaphragm 1414 at a certain moment, wherein the vibration direction of the first diaphragm 1413 is from top to bottom, and the vibration direction of the second diaphragm 1414 is from bottom to top. Since the sound heard by the user does not come from the vibration felt by the user's bones, skin, etc., but the first diaphragm 1413 and the second diaphragm 1414 change the air density by pushing the air to vibrate, so that the user can hear the sound. Therefore, without affecting the volume of the sound signal output by the air conduction speaker element, the strength of the mechanical vibration (i.e., the first mechanical vibration) of the housing 1450 and the component connected to the housing 1450 (i.e., the echo signal source) can be reduced to reduce the strength of the mechanical vibration (i.e., the third mechanical vibration) transmitted by the housing 1450 received by the bone conduction microphone (not shown in the figure), thereby reducing the strength of the first signal generated by the bone conduction microphone. In addition, the speaker element 1410 is also provided with a second diaphragm 1414 having a vibration direction opposite to that of the first diaphragm 1413. Two diaphragms are provided in the air conduction speaker element. The mechanical vibration generated by the first diaphragm 1413 causes the housing 1450 to vibrate, and the mechanical vibration generated by the second diaphragm 1414 also causes the housing 1450 to vibrate. Since the vibration direction of the first diaphragm 1413 is opposite to the vibration direction of the second diaphragm 1414, the two mechanical vibrations generated on the housing cancel each other out, thereby reducing the intensity of the mechanical vibration of the housing. In some embodiments, the two diaphragms may be components in the same air conduction speaker element. In other embodiments, the acoustic input-output device 1400 may include a first air conduction speaker element and a second air conduction speaker element, and the first diaphragm 1413 and the second diaphragm 1414 are components in the first air conduction speaker element and the second air conduction speaker element, respectively. In the embodiment shown in FIG. 14 , it can be considered that there are two air conduction speaker elements, which are respectively located in different areas of the housing 1450, and each air conduction speaker element includes a diaphragm, a magnetic circuit element, and a coil.

In some embodiments, the housing 1450 may include a first cavity 1455 and a second cavity 1456, and the first diaphragm 1413 and the second diaphragm 1414 may be located in the first cavity 1455 and the second cavity 1456, respectively. The housing 1450 may include a first portion corresponding to the first cavity 1455 and a second portion corresponding to the second cavity 1456. The side wall of the first cavity 1455 (i.e., the side wall of the first portion of the housing 1450) may be provided with a first sound-transmitting hole 1451 and a second sound-transmitting hole 1452. In some embodiments, the first sound-transmitting hole 1451 and the second sound-transmitting hole 1452 may be provided on different side walls of the first portion of the housing 1450. In some embodiments, the first sound-transmitting hole 1451 and the second sound-transmitting hole 1452 may be disposed on non-adjacent side walls of the first portion of the housing 1450, that is, the first sound-transmitting hole 1451 and the second sound-transmitting hole 1452 may be disposed on opposite sides of the first portion of the housing 1450 (as shown in FIG. 14 ).

The side wall of the second cavity 1456 (i.e., the side wall of the second part of the shell 1450) may be provided with a third sound-transmitting hole 1453 and a fourth sound-transmitting hole 1454. In some embodiments, the third sound-transmitting hole 1453 and the fourth sound-transmitting hole 1454 may be arranged on different side walls of the second part of the shell 1450. In some embodiments, the third sound-transmitting hole 1453 and the fourth sound-transmitting hole 1454 may be arranged on non-adjacent side walls of the second part of the shell 1450, i.e., the third sound-transmitting hole 1453 and the fourth sound-transmitting hole 1454 may be arranged on opposite sides of the second part of the shell 1450 (as shown in FIG. 14).

As shown in FIG. 14 , in some embodiments, the first sound-transmitting hole 1451 and the third sound-transmitting hole 1453 may be disposed on the same side of the housing 1450. The second sound-transmitting hole 1452 and the fourth sound-transmitting hole 1454 may be disposed on the same side of the housing 1450, so that the phase of the sound emitted by the first sound-transmitting hole 1451 is the same as the phase of the sound emitted by the third sound-transmitting hole 1453, and the phase of the sound emitted by the second sound-transmitting hole 1452 is the same as the phase of the sound emitted by the fourth sound-transmitting hole 1454. In this embodiment, the housing 1450 is divided into two unconnected cavities, namely, a first cavity 1455 and a second cavity 1456, and the first air-conducting speaker element or (the first vibration element 1411) and the second air-conducting speaker element (or the second vibration element 1412) are respectively located in the two cavities. The first cavity 1455 can be divided into a front cavity and a rear cavity by the first diaphragm 1413, and the second cavity 1456 can be divided into a front cavity and a rear cavity by the second diaphragm 1414. The first sound-transmitting hole 1451 and the third sound-transmitting hole 1453 can be equivalent to the front cavity sound-transmitting hole of the first cavity 1455 and the second cavity 1456, and the second sound-transmitting hole 1452 and the fourth sound-transmitting hole 1454 can be equivalent to the rear cavity sound-transmitting hole of the first cavity 1455 and the second cavity 1456. When the sound phases of the front cavity sound-transmitting holes of the first cavity 1455 and the second cavity 1456 are the same, and the sound phases of the rear cavity sound-transmitting holes are also the same, the sound phases emitted by the two diaphragms are the same, so the volume of air conduction will not be reduced.

In some embodiments, when the speaker element 1410 has multiple diaphragms, the structure of the speaker element 1410 can be adjusted to reduce the overall size.

As shown in FIG. 15 , in some embodiments, the speaker element 1510 may include a first vibration element 1511 and a second vibration element 1512. The first vibration element 1511 includes a first diaphragm 1513, a first magnetic circuit element 1515, and a first coil 1517. Similarly, the second vibration element 1512 also includes a second diaphragm 1514, a second magnetic circuit element 1516, and a second coil 1518 (or a voice coil). The first cavity 1555 and the second cavity 1556 may be connected. The first magnetic circuit element 1515 and the second magnetic circuit element 1516 are connected as a whole to reduce the space occupied by the entire speaker element 1510. In some embodiments, the housing 1550 of the speaker element 1510 may include a first sound-transmitting hole 1551, a second sound-transmitting hole 1552, a third sound-transmitting hole 1553, and a fourth sound-transmitting hole 1554. The first sound-transmitting hole 1551, the second sound-transmitting hole 1552, the third sound-transmitting hole 1553, and the fourth sound-transmitting hole 1554 in FIG. 15 may be the same as or similar to the first sound-transmitting hole 1451, the second sound-transmitting hole 1452, the third sound-transmitting hole 1453, and the fourth sound-transmitting hole 1454 in FIG. 14.

In some embodiments, the first air conduction speaker element and the second air conduction speaker element may be two identical speakers. In some embodiments, the first air conduction speaker element and the second air conduction speaker element may be two different speakers. For example, in an acoustic input-output device 1500, a first air conduction speaker element and a second air conduction speaker element are included, wherein the first air conduction speaker element may be used as a main speaker to mainly generate a sound signal heard by a user. The second air conduction speaker element may be used as an auxiliary speaker. By adjusting the intensity of the mechanical vibration of the auxiliary speaker, it generates a force opposite to that of the main speaker on the housing 1550, thereby reducing the vibration intensity of the housing 1550. In some embodiments, the speaker element 1510 may include a main speaker and an auxiliary device for generating vibrations in the opposite direction to the vibration direction of the main speaker on the housing 1550. In some embodiments, the auxiliary device may be a vibration motor, which may generate vibrations in the opposite direction to the vibration direction of the main speaker on the housing 1550, thereby reducing the vibration intensity of the housing 1550. In some embodiments, the intensity of the mechanical vibration generated by the auxiliary speaker may be adjusted. Specifically, the speaker element 1510 may include an auxiliary speaker control device, which can obtain the strength and direction of the mechanical vibration of the main speaker, and adjust the strength and direction of the mechanical vibration generated by the auxiliary speaker based on the strength and direction of the mechanical vibration of the main speaker, so that the force of the auxiliary speaker on the housing and the force of the main speaker on the housing 1550 can offset each other to reduce the vibration of the housing 1550, and further reduce the vibration transmitted from the housing 1550 to the bone conduction microphone 1520 to reduce the strength of the echo signal generated by the bone conduction microphone (not shown in FIG. 15).

It should be noted that the embodiment of setting the vibration directions of the two diaphragms to be opposite can be combined with one or more of the above embodiments. For example, in the embodiment of setting the vibration directions of the two diaphragms to be opposite, a second vibration reduction structure can be set between the first diaphragm (e.g., the first diaphragm 1413) and the housing (e.g., the housing 1450) and between the second diaphragm (e.g., the second diaphragm 1414) and the housing 1450 to reduce the mechanical vibration received by the housing 1450, thereby reducing the intensity of the first mechanical vibration received by the bone conduction microphone.

In some embodiments, the voice signal source can be the vibrating part when providing the voice signal to the user. For example, when the user speaks, the vibration intensity of the vocal cords, mouth, nasal cavity, throat and other parts is obviously higher than that of the ears, eyes and other parts. Therefore, these parts can be used as the voice signal source. In some embodiments, when designing the bone conduction microphone 1920, the bone conduction microphone 1920 can be located near at least one of the user's mouth, nasal cavity or vocal cords. For example, when the acoustic input-output device 1900 is a pair of glasses as shown in FIG. 19 , the bone conduction microphone 1920 can be set in the nose bridge 1935 of the glasses. Since the bone conduction microphone 1920 is close to the user's nose bridge, the intensity of the received second mechanical vibration is greater. More descriptions of the glasses shown in FIG. 19 can be found in other embodiments of the present invention, which will not be repeated here. As shown in FIG. 19 , in some embodiments, the acoustic input-output device 1900 can be set so that when the user wears the acoustic input-output device 1900, the distance between the bone conduction microphone 1920 and the vibration part of the user (not shown in the figure) is less than the third threshold. As described herein, taking the distance between the bone conduction microphone 1920 and the user's throat as an example, in some embodiments, the third threshold may be 20 cm. In some embodiments, the third threshold may be 15 cm. In some embodiments, the third threshold may be 10 cm. In some embodiments, the third threshold may be 2 cm. In this embodiment, since the bone conduction microphone 1920 is closer to the vibration part of the user, the intensity of the received second mechanical vibration (i.e., the fourth mechanical vibration) is greater, and the greater the intensity of the second signal generated by the bone conduction microphone 1920, the more effectively the voice signal intensity can be improved.

FIG. 16 is a schematic diagram of the structure of a headset shown in some embodiments of the present invention. As shown in FIG. 16 , in some embodiments, the acoustic input/output device 1600 may be a headset, including a fixing element 1630. The fixing element 1630 may include a headband 1632 and two earmuffs 1631 connected to both sides of the headband 1632. The headband 1632 may be used to fix the headset to the user's head and fix the two earmuffs 1631 to both sides of the user's head. A bone conduction microphone 1620 and a speaker element 1610 may be provided in each earmuff 1631. In some embodiments, the bone conduction microphone 1620 may be located at any position in the earmuff 1631, for example, the bone conduction microphone 1620 may be located at a position slightly above the earmuff 1631. For another example, the bone conduction microphone 1620 can be located at a position slightly below the earmuff 1631 (as shown in FIG. 16 ). When the user wears the acoustic input and output device 1600 , the distance between the bone conduction microphone 1620 and the vibration part of the user can be shortened. In this embodiment, the bone conduction microphone 1620 is closer to the vibration part of the user when speaking, so that the vibration (i.e., the fourth mechanical vibration) intensity of the vibration part received by the bone conduction microphone 1620 when the user speaks can be greater, and the intensity of the second signal generated by the bone conduction microphone 1620 can be greater. In turn, the ratio of the intensity of the second signal to the intensity of the first signal is greater, the echo signal in the sound signal generated by the bone conduction microphone accounts for a smaller proportion, and the user experience is better.

Fig. 17 is a schematic diagram of the structure of a monaural headset shown in some embodiments of the present invention. As shown in Fig. 17, in some embodiments, the acoustic input and output device 1700 can be a monaural headset, that is, the bone conduction microphone 1720 and the speaker element 1710 can be respectively arranged in two earmuffs 1731, and each earmuff 1731 is only provided with one speaker element 1710 or one bone conduction microphone 1720. In this embodiment, since the bone conduction microphone 1720 and the speaker element 1710 are respectively arranged in different earmuffs 1731, located on both sides of the user's head, the distance between the bone conduction microphone 1720 and the speaker element 1710 is relatively far, so the intensity of the first mechanical vibration generated by the speaker element 1710 received by the bone conduction microphone 1720 is relatively small, that is, the intensity of the third mechanical vibration is relatively small, so that the echo signal in the sound signal generated by the bone conduction microphone 1720 accounts for a smaller proportion, and the user experience is better. In some embodiments, the headband 1732 may include one or more second vibration reduction structures (not shown in the figure) for reducing the intensity of the first mechanical vibration transmitted through the headband 1732. In some embodiments, the headband 1732 may be provided with foam to reduce the intensity of the first mechanical vibration transmitted from the speaker element 1710 to the bone conduction microphone 1720. In other specific embodiments, the headband 1732 may be made of a second vibration-damping material. The vibration-damping material may be the same as the vibration-damping material in one or more of the aforementioned embodiments. For example, the headband 1732 may be made of materials such as silicone or rubber.

In some embodiments, the bone conduction microphone 1720 or the speaker element 1710 may not be disposed in the earmuff 1731. For example, the bone conduction microphone may be disposed at point D on the headband shown in FIGS. 16 and 17, where point D corresponds to the top of the user's head, while the speaker element is disposed in the earmuff. For another example, the speaker element may be disposed at point D on the headband shown in FIGS. 16 and 17, where point D corresponds to the top of the user's head, while the bone conduction microphone is disposed in the earmuff.

FIG18 is a cross-sectional schematic diagram of a binaural headset shown in some embodiments of the present invention. In combination with FIG16 and FIG18 , in some embodiments, the acoustic input/output device 1800 may be a binaural headset, including a fixing element 1830. The fixing element 1830 may include a headband 1832 and two earmuffs 1831 connected to both sides of the headband 1832. A sponge cover 1833 may be provided on the side of each earmuff 1831 that contacts the user's face 1840, and the bone conduction microphone 1820 may be accommodated in the sponge cover 1833. After the sponge cover 1833 is provided, it is equivalent to adding a vibration reduction structure between the bone conduction microphone 1820 and the housing 1850 of the speaker element 1810, that is, the second vibration reduction structure mentioned in the above-mentioned embodiment, which reduces the intensity of the first mechanical vibration generated when the housing 1850 transmits the sound wave transmitted by the speaker element 1810. Furthermore, since the sponge cover 1833 has a large elasticity, it will weaken the intensity of the second mechanical vibration transmitted to the bone conduction microphone 1820 through the user's face 1840. Therefore, in some embodiments, a part of the surface of the sponge cover 1833 can be provided with a vibration structure with a large rigidity. In some embodiments, the vibration transmission structure can be configured as a sheet-like component, for example, a metal sheet or a plastic sheet (the metal sheet and the plastic sheet are not shown in the figure). In some embodiments, the outer side of the sheet-like component can be in contact with the user's face 1840, and the inner side of the sheet-like component is connected to the bone conduction microphone 1820. In this embodiment, the user's face 1840 is in contact with the bone conduction microphone 1820 through a sheet-like component with greater rigidity, so as to minimize the loss of the vibration (i.e., the second mechanical vibration) received by the bone conduction microphone 1820 during the transmission process when the user speaks, increase the strength of the fourth mechanical vibration, and thereby increase the strength of the generated voice signal.

FIG19 is a schematic diagram of the structure of a pair of glasses shown in some embodiments of the present invention. As shown in FIG19 , in some embodiments, the acoustic input and output device 1900 may be a pair of glasses with speaker and microphone functions, and the glasses may include a fixing element 1930, and the fixing element 1930 includes a frame 1931, and the frame 1931 may include a frame 1932 and two legs 1933, and the legs 1933 may include a leg body 1934 connected to the frame 1932, and at least one leg body 1934 may include a speaker element 1910 in the above-mentioned embodiment of the present invention. In some embodiments, the speaker element 1910 may include a bone conduction speaker element. The bone conduction speaker element can be located in the portion of the eyeglass leg 1933 that contacts the user's skin. In some embodiments, the eyeglass frame 1932 can include a nose bridge 1935 for supporting the eyeglass frame 1932 above the user's nose bridge, and the nose bridge 1935 can be provided with a bone conduction microphone 1920 as in the above-mentioned embodiment of the present invention. The nasal cavity is the vibrating part when the user provides voice signals, and its mechanical vibration intensity is relatively large. The advantage of placing the bone conduction microphone in the nose bridge 1935 is that, on the one hand, the mechanical vibration intensity of the voice signal received by the bone conduction microphone 1920 can be increased, and on the other hand, since the bone conduction microphone 1920 and the speaker element 1910 are arranged at different positions of the glasses, the intensity of the first mechanical vibration generated when the speaker element 1910 transmits the sound wave received by the bone conduction microphone 1920 is smaller, and the echo signal generated by the bone conduction microphone 1920 is smaller.

It should be noted that the glasses described in the above embodiments may be various types of glasses, such as sunglasses, myopia glasses, and hyperopia glasses. In some embodiments, the glasses may also be glasses with VR (Virtual Reality) function or AR (Augmented Reality) function.

The beneficial effects that may be brought about by the embodiments of the present invention include but are not limited to: (1) setting the first angle formed by the vibration direction of the bone conduction microphone and the vibration direction of the echo signal source within a set angle range, reducing the vibration intensity of the echo signal source received by the bone conduction microphone, and reducing the intensity of the generated echo signal (i.e., the first signal); (2) setting the second angle formed by the vibration direction of the bone conduction microphone and the vibration direction of the voice signal source within a set angle range, increasing the vibration intensity of the voice signal source received by the bone conduction microphone, and increasing the intensity of the generated voice signal (i.e., the second signal); (3) controlling the clamping force of the acoustic input and output device and the user contact part within a certain range, so that the bone conduction microphone The closer the contact with the user is, the higher the vibration intensity of the received voice signal source (i.e., the fourth mechanical vibration intensity) is; (4) a vibration reduction structure is added between the bone conduction microphone and the housing of the speaker element to reduce the vibration intensity of the received speaker element (i.e., the third mechanical vibration intensity); (5) a vibration reduction structure is added between the vibration element of the speaker element and the housing. Vibration structure, through the vibration reduction structure to reduce the impact of the vibration of the vibrating element on the housing, thereby reducing the intensity of the mechanical vibration generated by the housing, and finally reducing the intensity of the vibration of the speaker element received by the bone conduction microphone; (6) the bone conduction microphone is set closer to the vibration part when the user provides the voice signal, and the intensity of the vibration of the received voice signal source is increased. It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.

The basic concepts have been described above. Obviously, for those with ordinary knowledge in the relevant technical field, the above invention disclosure content is only used as an example and does not constitute a limitation of the present invention. Although it is not explicitly stated here, those with ordinary knowledge in the relevant technical field may make various modifications, improvements and amendments to the present invention. Such modifications, improvements and amendments are suggested in the present invention, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present invention.

At the same time, the present invention uses specific words to describe the embodiments of the present invention. For example, "one embodiment", "an embodiment" and/or "some embodiments" refer to a certain feature, structure or feature related to at least one embodiment of the present invention. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different places in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures or features in one or more embodiments of the present invention can be appropriately combined.

In addition, unless expressly stated in the scope of the patent application, the order of the processing elements and sequences described in the present invention, the use of numerals or other names, is not used to limit the order of the process and method of the present invention. Although the above disclosure discusses some of the invention embodiments currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached patent scope is not limited to the disclosed embodiments. On the contrary, the scope of the patent application is intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of the present invention. For example, although the system elements described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

Similarly, it should be noted that in order to simplify the description of the disclosure of the present invention and thus help understand one or more embodiments of the invention, in the above description of the embodiments of the present invention, multiple features are sometimes incorporated into one embodiment, drawings or description thereof. However, this disclosure does not mean that the invention object requires more features than the features mentioned in the patent application scope. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by modifiers such as "approximately", "approximately" or "substantially" in some examples. Unless otherwise specified, "approximately", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical data used in the specification and the scope of the patent application are approximate values, which may change according to the required features of the individual embodiments. In some embodiments, the numerical data should consider the specified number of significant digits and adopt the general method of retaining digits. Although the numerical domains and data used to confirm the breadth of the scope in some embodiments of the present invention are approximate values, in specific embodiments, the setting of such numerical values is as accurate as possible within the feasible range. Finally, it should be understood that the embodiments described in the present invention are intended only to illustrate the principles of the embodiments of the present invention. Other variations may also fall within the scope of the present invention. Therefore, as an example and not a limitation, alternative configurations of the embodiments of the present invention may be considered consistent with the teachings of the present invention. Accordingly, the embodiments of the present invention are not limited to the embodiments explicitly introduced and described in the present invention.

100:Acoustic input and output equipment

110: Speaker components

120: Microphone component

130:Fixed element

Claims (10)

An acoustic input-output device comprises: a speaker element for transmitting sound waves by generating a first mechanical vibration; and a microphone for receiving a second mechanical vibration generated when a voice signal source provides a voice signal, wherein the microphone generates a first signal and a second signal respectively under the action of the first mechanical vibration and the second mechanical vibration, wherein, within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal. An acoustic input-output device as claimed in claim 1, wherein the speaker element is a bone conduction speaker element, the bone conduction speaker element comprises a housing and a vibration element connected to the housing for generating the first mechanical vibration, and the microphone is directly or indirectly connected to the housing. The acoustic input-output device of claim 1 further includes a vibration-damping structure, wherein the microphone is connected to the speaker element through the vibration-damping structure, wherein the vibration-damping structure includes a vibration-damping material having an elastic modulus less than a first threshold. An acoustic input-output device as claimed in claim 3, wherein a first portion of the surface of the microphone is used to conduct the second mechanical vibration, and a second portion of the surface of the microphone is externally provided with the vibration-damping structure and is connected to the speaker element via the vibration-damping structure. An acoustic input-output device as claimed in claim 3, wherein a first portion of the surface of the microphone is provided with a vibration-transmitting layer, and the elastic modulus of the material of the vibration-transmitting layer is greater than a second threshold. An acoustic input-output device as claimed in claim 1, wherein the speaker element includes a housing and a vibration element, a first connection is formed between the housing and the vibration element, a second connection is formed between the microphone and the housing, the first connection includes a first vibration-damping structure, and the second connection includes a second vibration-damping structure. As in claim 1, the acoustic input-output device, wherein the speaker element comprises a first diaphragm and a second diaphragm, the first diaphragm and the second diaphragm vibrate in opposite directions; The speaker element comprises a housing, the housing comprises a first cavity and a second cavity, the first diaphragm and the second diaphragm are respectively located in the first cavity and the second cavity; The side wall of the first cavity is provided with a first sound-transmitting hole and a second sound-transmitting hole, the side wall of the second cavity is provided with a third sound-transmitting hole and a fourth sound-transmitting hole, the sound phase emitted by the first sound-transmitting hole is the same as the sound phase emitted by the third sound-transmitting hole, and the sound phase emitted by the second sound-transmitting hole is the same as the sound phase emitted by the fourth sound-transmitting hole. An acoustic input-output device as claimed in claim 7, wherein the first sound-transmitting hole and the third sound-transmitting hole are arranged on the same side wall of the shell, the second sound-transmitting hole and the fourth sound-transmitting hole are arranged on the same side wall of the shell, the first sound-transmitting hole and the second sound-transmitting hole are arranged on non-adjacent side walls of the shell, and the third sound-transmitting hole and the fourth sound-transmitting hole are arranged on non-adjacent side walls of the shell. As in claim 7, the acoustic input-output device, wherein the speaker element further comprises a first magnetic circuit element and a second magnetic circuit element for forming a magnetic field, the first magnetic circuit element is used to vibrate the first diaphragm, and the second magnetic circuit element is used to vibrate the second diaphragm; The first cavity and the second cavity are connected, and the first magnetic circuit element and the second magnetic circuit element are directly or indirectly connected. An acoustic input-output device, comprising: a speaker element, used to transmit sound waves by generating a first mechanical vibration; and a microphone, used to receive a second mechanical vibration generated when a voice signal source provides a voice signal, the microphone generates a first signal and a second signal respectively under the action of the first mechanical vibration and the second mechanical vibration; a first angle formed by the vibration direction of the microphone and the direction of the first mechanical vibration is within a set angle range, so that within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal.