TWI849543B - Narrow border reflective display device - Google Patents

Abstract

A narrow border reflective display device includes an IC driver substrate, a TFT substrate, a front plane laminate, multiple conductive wires, a cover, and a glue. The TFT substrate is located on the IC driver substrate. The TFT substrate is located between the IC driver substrate and the front plane laminate. The conductive wires are electrically connected with the IC driver substrate and the front plane laminate. The cover is located on the front plane laminate. The glue surrounds the IC driver substrate, the front plane laminate, the front plane laminate, and the conductive wires.

Description

Narrow bezel reflective display

The present disclosure relates to a reflective display device with a narrow bezel.

The current driving method in display devices requires the FPC and driver integrated circuit (IC) to be electrically connected to the TFT substrate through a chip-on-film process. However, the bending area of the FPC and the bonding pads used to bond the FPC make it difficult to reduce the size of the border area of the display device. In addition, the appearance requirements of wearable display devices vary, and the above manufacturing method is difficult to meet the requirements of display devices with arbitrary shapes.

In view of this, how to provide a display device that can solve the above problems is still a goal of research and development in this field.

One technical aspect of the present disclosure is a narrow-frame reflective display device.

In one embodiment of the present disclosure, a narrow-frame reflective display device includes a driving circuit substrate, a thin film transistor array substrate, a front panel stack, a conductive wire, a cover plate, and a sealing adhesive. The thin film transistor array substrate is located on the driving circuit substrate. The thin film transistor array substrate is located between the driving circuit substrate and the front panel stack. The conductive wire electrically connects the driving circuit substrate and the thin film transistor array substrate. The cover plate is located on the front panel stack. The sealing adhesive surrounds the driving circuit substrate, the thin film transistor array substrate, the front panel stack, and the conductive wire.

In an embodiment of the present disclosure, the cover has a first surface facing the driving circuit substrate, and a vertical projection of the driving circuit substrate on the first surface is located within the range of the first surface.

In an embodiment of the present disclosure, the thin film transistor array substrate includes a display area and a peripheral area surrounding the display area, the display area and the peripheral area have a boundary, and the cover plate has an edge. In a top view, the distance from the vertical projection of the boundary of the thin film transistor array substrate on the cover plate to the edge of the cover plate is less than 2.5 mm.

In an embodiment of the present disclosure, the thin film transistor array substrate further includes a plurality of first conductive pads, the driving circuit substrate further includes a plurality of second conductive pads, and the conductive lines electrically connect the first conductive pads and the second conductive pads respectively.

In one embodiment of the present disclosure, the driving circuit substrate has a second surface facing the thin film transistor array substrate, the first conductive pad is located on the second surface, and the first conductive pad surrounds the thin film transistor array substrate.

In an embodiment of the present disclosure, the thin film transistor array substrate has a third surface facing the front panel stacking structure, the second conductive pad is located on the third surface, and the second conductive pad surrounds the front panel stacking structure.

In one embodiment of the present disclosure, the material of the thin film transistor array substrate includes a protective layer, a polyimide film, and an adhesive layer between the protective layer and the polyimide film.

In one embodiment of the present disclosure, the material of the thin film transistor array substrate includes glass.

In one embodiment of the present disclosure, the material of the driving circuit substrate includes a protective layer, a polyimide film, and an adhesive layer between the protective layer and the polyimide film.

In an embodiment of the present disclosure, the material of the driving circuit substrate includes glass.

In an embodiment of the present disclosure, the driving circuit substrate has a second surface facing the thin film transistor array substrate, and the narrow frame reflective display device further includes a flexible circuit board and a chip, wherein the flexible printed circuit board (FPC) is bonded to the second surface of the driving circuit substrate, and the chip is bonded to the flexible circuit board.

In one embodiment of the present disclosure, the cover has a first surface facing the driving circuit substrate, and in a top view, the vertical projections of the flexible circuit board and the chip on the first surface of the cover are located within the range of the first surface.

In an embodiment of the present disclosure, the driving circuit substrate has a fourth surface facing away from the thin film transistor array substrate. The driving circuit substrate is a printed circuit board (PCB) or a flexible circuit board, and the narrow frame reflective display device further includes a chip bonded to the fourth surface of the driving circuit substrate.

In one embodiment of the present disclosure, the encapsulant surrounds and covers the side surface of the driving circuit substrate.

In the above embodiment, by stacking the thin film transistor array substrate and the driving circuit substrate, and electrically connecting the first conductive pad and the second conductive pad distributed in the frame area through conductive lines, the flexible circuit board does not need to be bonded to the thin film transistor array substrate. In other words, the width of the frame area only needs to consider the distance between the first conductive pad and the second conductive pad, so the width of the frame area of the narrow frame reflective display device can be reduced. In addition, the shape of the frame area can be determined according to the shape of the display area, so the narrow frame reflective display device can have a customized shape.

The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, in order to simplify the drawings, some commonly used structures and components will be depicted in the drawings in a simple schematic manner. And for the sake of clarity, the thickness of the layers and regions in the drawings may be exaggerated, and the same element symbols represent the same elements in the description of the drawings.

FIG. 1 is a top view of a narrow-frame reflective display device 100 according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view along line segment 2-2' in FIG. 1. Refer to FIG. 1 and FIG. 2 simultaneously. The frame area BR on the left side of FIG. 2 is a diagram of an electrical connection area having a conductive line 140, and the frame area BR on the right side is a diagram of a bonding area of a flexible circuit board 180. The narrow-frame reflective display device 100 includes a driving circuit substrate 110, a thin film transistor (TFT) array substrate 120, a front panel laminate (FPL) 130, a conductive line 140, a cover plate 150, and a sealing glue 160. The thin film transistor array substrate 120 is located on the driving circuit substrate 110, and the front panel stack 130 is located on the thin film transistor array substrate 120. The thin film transistor array substrate 120 is located between the driving circuit substrate 110 and the front panel stack 130. The conductive line 140 electrically connects the driving circuit substrate 110 and the thin film transistor array substrate 120. The cover plate 150 is located on the front panel stack 130. The encapsulant 160 surrounds the driving circuit substrate 110, the thin film transistor array substrate 120, the front panel stack 130 and the conductive line 140, and the encapsulant 160 is located between the cover plate 150 and the driving circuit substrate 110 and between the cover plate 150 and the thin film transistor array substrate 120. The encapsulant 160 surrounds and covers a side surface 1101 of the driving circuit substrate 110.

Refer to FIG. 1 and FIG. 2 at the same time. The area of the cover plate 150 is larger than the area of the driving circuit substrate 110. The cover plate 150 has an edge 1002, and the edge 1002 of the cover plate 150 is the edge of the narrow frame reflective display device 100. In other words, the area of the cover plate 150 is also larger than the area of the thin film transistor array substrate 120 and the area of the front panel stack 130.

Refer to FIG. 2. The cover plate 150 has a first surface 1502 facing the driving circuit substrate 110. The vertical projection of the driving circuit substrate 110 on the first surface 1502 is within the range of the first surface 1502. The vertical projections of the thin film transistor array substrate 120 and the front panel stack 130 on the first surface 1502 are within the range of the first surface 1502. In other words, the driving circuit substrate 110, the thin film transistor array substrate 120, the front panel stack 130, the conductive line 140 and the sealing glue 160 completely overlap with the cover plate 150 in the vertical direction Y.

Refer to FIG. 2 . The narrow frame reflective display device 100 further includes another adhesive layer 170 located between the driving circuit substrate 110 and the thin film transistor array substrate 120 . The adhesive layer 170 is a double-sided adhesive configured to bond the driving circuit substrate 110 and the thin film transistor array substrate 120 . The material of the adhesive layer 170 can be an organic material or an inorganic material.

Refer to FIG. 2. In this embodiment, the narrow-frame reflective display device 100 is a flexible reflective display device. The driving circuit substrate 110 and the thin film transistor array substrate 120 are flexible. The driving circuit substrate 110 includes a polyimide film 112, a protective layer 114, and an adhesive layer 116. The adhesive layer 116 is located between the protective layer 114 and the polyimide film 112. The adhesive layer 116 is configured to bond the protective layer 114 and the polyimide film 112. For example, the narrow-frame reflective display device 100 is a watch, and the driving circuit substrate 110 integrates system components used in the watch, such as a motor, a battery, etc.

The thin film transistor array substrate 120 includes a polyimide film 122, a protective layer 124, and an adhesive layer 126. The adhesive layer 126 is located between the protective layer 124 and the polyimide film 122. The adhesive layer 126 is configured to bond the protective layer 124 and the polyimide film 122. The thin film transistor array substrate 120 also includes structures such as a gate, a drain/source, an insulating layer, and a pixel electrode formed on the polyimide film 122 (not shown).

The front panel stack 130 includes a display medium layer 132, a transparent conductive film 134, and an optical adhesive layer 136. The transparent conductive film 134 is located between the display medium layer 132 and the optical adhesive layer 136. The display medium layer 132 is, for example, an electronic ink layer.

The protective layer 114 of the driving circuit substrate 110 and the protective layer 124 of the thin film transistor array substrate 120 are configured to provide support for the polyimide film 112 and the polyimide film 122. The material of the protective layers 114 and 124 may include stainless steel, titanium alloy, ceramic material or glass, etc., but the present disclosure is not limited thereto. The protective layers 114 and 124 are flexible, and the hardness of the protective layers 114 and 124 is greater than or equal to the hardness of glass. For example, the protective layers 114 and 124 can be glass with a thickness of about 0.1 mm. The adhesive layer 116 of the driving circuit substrate 110 and the adhesive layer 126 of the thin film transistor array substrate 120 are double-sided tape. The material of the adhesive layers 116 and 126 can be an organic material or an inorganic material.

FIG. 3 is a top view of the narrow-frame reflective display device 100 in FIG. 1 without the cover plate 150 and the sealant 160. Refer to FIG. 2 and FIG. 3 at the same time. The thin film transistor array substrate 120 has a display area AA and a peripheral area PA surrounding the display area AA. The display area AA and the peripheral area PA of the thin film transistor array substrate 120 have a boundary 1204. The area of the driving circuit substrate 110 is larger than the area of the thin film transistor array substrate 120, and the area of the thin film transistor array substrate 120 is larger than the area of the front panel stack 130. As shown in FIG. 1 and FIG. 2 , the vertical projection of the boundary 1204 on the cover plate 150 to the edge 1002 of the cover plate 150 is the frame area BR of the narrow-frame reflective display device 100 .

Refer to FIG. 2 and FIG. 3 simultaneously. The driving circuit substrate 110 further includes a plurality of first conductive pads 118, and the thin film transistor array substrate 120 further includes a plurality of second conductive pads 128. The conductive lines 140 electrically connect the first conductive pads 118 and the second conductive pads 128, respectively. The driving circuit substrate 110 has a second surface 1102 facing the thin film transistor array substrate 120. The first conductive pad 118 is located on the second surface 1102. The vertical projection of the thin film transistor array substrate 120 on the driving circuit substrate 110 does not overlap with the first conductive pad 118. The first conductive pad 118 surrounds the thin film transistor array substrate 120. The TFT array substrate 120 has a third surface 1202 facing the front panel stack 130. The second conductive pad 128 is located on the third surface 1202. The vertical projection of the front panel stack 130 on the TFT array substrate 120 does not overlap with the second conductive pad 128. The second conductive pad 128 surrounds the front panel stack 130.

Referring to FIG. 2 , the narrow-frame reflective display device 100 further includes a flexible printed circuit board (FPC) 180 and a chip 182. The flexible printed circuit board 180 is bonded to the second surface 1102 of the driving circuit substrate 110, and the chip 182 is bonded to the flexible printed circuit board 180. The thin film transistor array substrate 120 is electrically connected to the chip 182 through the conductive wire 140 and the flexible printed circuit board 180 to drive the narrow-frame reflective display device 100. The flexible printed circuit board 180 is bent to the bottom of the driving circuit substrate 110. The vertical projections of the flexible printed circuit board 180 and the chip 182 on the first surface 1502 of the cover plate 150 are located within the range of the first surface 1502. In other words, the flexible circuit board 180 does not protrude from the edge 1002 of the cover board 150 .

In addition, the bending area BD of the flexible circuit board 180 is located below the thin film transistor array substrate 120, and the vertical projection of the flexible circuit board 180 on the thin film transistor array substrate 120 overlaps with the peripheral area PA. Therefore, the bending area BD of the flexible circuit board 180 does not occupy the space outside the thin film transistor array substrate 120. In addition, the above design does not need to set a significantly protruding bonding area on the third surface 1202 of the thin film transistor array substrate 120 to bond the flexible circuit board 180. Therefore, the above configuration can reduce the width of the peripheral area PA of the thin film transistor array substrate 120.

In some embodiments, a portion of the flexible circuit board 180 may overlap the display area AA in a vertical projection on the thin film transistor array substrate 120. Since the driving circuit substrate 110 is located below the thin film transistor array substrate 120, the design of the flexible circuit board 180 does not affect the display effect of the display area AA.

In FIG. 3, only a portion of the conductive line 140 is shown for example. The size and spacing of the first conductive pad 118 and the second conductive pad 128 are not limited to those shown in FIG. 3. In some embodiments, a dummy conductive pad may be provided, and the dummy conductive pad is not electrically connected to the conductive line.

In the present embodiment, the first conductive pad 118 and the second conductive pad 128 are evenly distributed in the frame area BR of the narrow-frame reflective display device 100. In other words, the first conductive pad 118 and the second conductive pad 128 surround the display area AA. As shown in FIG. 3 , in the present embodiment, the distribution range of the first conductive pad 118 is close to a ring (e.g., 330 degrees). The flexible circuit board 180 is set above the narrow-frame reflective display device 100, but the present disclosure is not limited thereto. For example, in other embodiments, the distribution range of the first conductive pad 118 is smaller (e.g., 180 degrees), and the flexible circuit board can be set at any position without the first conductive pad 118.

As can be seen from the above, by stacking the thin film transistor array substrate 120 and the driving circuit substrate 110, and electrically connecting the first conductive pad 118 and the second conductive pad 128 distributed in the frame area BR through the conductive line 140, the flexible circuit board 180 does not need to be bonded to the thin film transistor array substrate 120. In other words, the width of the frame area BR only needs to consider the distance between the first conductive pad 118 and the second conductive pad 128, so the width of the frame area BR of the frame reflective display device 100 can be narrowed. Taking the embodiment of FIG. 1 as an example, the radial distance D1 from the boundary 1204 to the edge 1002 of the cover plate 150 is less than 2.5 mm, that is, the width of the frame region BR of the narrow-frame reflective display device 100 is less than 2.5 mm. In other words, through the above configuration, the narrow-frame reflective display device 100 disclosed in the present disclosure can have a narrow frame.

Refer to FIG. 2. In this embodiment, the thickness T between the first surface 1502 of the cover plate 150 and the third surface 1202 of the thin film transistor array substrate 120 is less than about 0.255 mm. The distance D2 from the interface 1204 to the side wall of the front panel stack 130 is about 0.5 mm, and the distance D3 from the side wall of the front panel stack 130 to the side wall of the driving circuit substrate 110 is about 1.8 mm.

FIG. 4 is a cross-sectional view of a narrow-frame reflective display device 100a according to another embodiment of the present disclosure. The cross-sectional position of FIG. 4 is the same as the cross-sectional position shown in FIG. 2. The narrow-frame reflective display device 100a is substantially the same as the narrow-frame reflective display device 100, the difference being that the narrow-frame reflective display device 100a is an inflexible display device. The thin film transistor array substrate 120a has a substrate 122a. The material of the substrate 122a of the driving circuit substrate 110a and the thin film transistor array substrate 120a is glass. For example, the thickness of the glass is approximately 0.5 mm to 0.7 mm. The above-mentioned structural dimensions are merely examples and are not intended to limit the present disclosure.

The narrow-frame reflective display device 100a has the same technical effects as the narrow-frame reflective display device 100, and will not be described in detail herein.

FIG. 5 is a cross-sectional view along line 5-5 in FIG. 1. The narrow-frame reflective display device 100 does not have the first conductive pad 118, the second conductive pad 128, and the conductive line 140 in the position shown in FIG. 5. In this area, the narrow-frame reflective display device 100 includes a silver paste 190 disposed between the display medium layer 132 and the encapsulant 160. The silver paste 190 is configured to electrically connect the transparent conductive film 134 and the pins on the thin film transistor array substrate 120.

The distance D4 from the junction 1204 to the side wall of the display medium layer 132 is approximately 0.6 mm. The distance D5 from the side wall of the front panel stack 130 to the side wall of the display medium layer 132 is approximately 0.7 mm. The distance D6 from the side wall of the front panel stack 130 to the side wall of the drive circuit substrate 110 is approximately 1.2 mm. The above structural dimensions are only examples and are not intended to limit the present disclosure.

FIG. 6 is a cross-sectional view along line 6-6 in FIG. 1. The narrow-frame reflective display device 100 does not have the first conductive pad 118, the second conductive pad 128, and the conductive line 140 in the position shown in FIG. 6. In this area, the distance D7 from the junction 1204 to the side wall of the front panel stack 130 is approximately 1.3 mm. The distance D6 from the side wall of the front panel stack 130 to the side wall of the drive circuit substrate 110 is approximately 1.2 mm. The above structural dimensions are only examples and are not intended to limit the present disclosure.

According to the structural dimensions shown in FIG. 2, FIG. 5, and FIG. 6, the distance D1 between the boundary 1204 and the edge 1002 can be reduced to less than 2.5 mm according to the structural configuration of different regions. In addition, the shape of the frame area BR can be determined according to the shape of the display area AA. According to the above, the narrow frame reflective display device disclosed in the present disclosure can have a customized shape and have a frame area BR less than 2.5 mm.

FIG. 7A to FIG. 7D are top views of narrow-frame reflective display devices according to some embodiments of the present disclosure. FIG. 7A to FIG. 7D are top views of narrow-frame reflective display devices 100b, 100c, 100d, and 100e, respectively. As shown in the figures, the display area AA of the narrow-frame reflective display device can have any shape, and the frame area BR can be determined according to the shape of the display area AA.

FIG. 8 is a cross-sectional view of a narrow-frame reflective display device 100f according to another embodiment of the present disclosure. The narrow-frame reflective display device 100f has the same cross-sectional position as the narrow-frame reflective display device 100 shown in FIG. 2, wherein the frame region BR on the right side is omitted in FIG. 8. The narrow-frame reflective display device 100f is substantially the same as the narrow-frame reflective display device 100, and the difference is that the driving circuit substrate 110c of the narrow-frame reflective display device 100f is a printed circuit board (PCB) or a flexible circuit board. The driving circuit substrate 110c has a fourth surface 1104 facing away from the thin film transistor array substrate 120. In this embodiment, the chip 182 of the narrow-frame reflective display device 110f is bonded to the fourth surface 1104 of the driving circuit substrate 110c. The vertical projection of the chip 182 on the thin film transistor array substrate 120 can overlap with the display area AA and/or the peripheral area PA without affecting the display effect of the display area AA. In other words, the narrow-frame reflective display device 100f is equivalent to integrating the driving circuit substrate 110 and the flexible circuit board 180 in the narrow-frame reflective display device 100 into the driving circuit substrate 110c. With such a design, the narrow-frame reflective display device 100f can be made thinner and smaller. In addition, such a design can omit the chip on film (COF) process, making the process of the narrow frame reflective display device 100f more concise. The narrow frame reflective display device 100f has the same technical effects as the narrow frame reflective display device 100, and will not be repeated here. In another embodiment of the present invention, the chip 182 can also be bonded to the second surface 1102 of the driving circuit substrate 110c.

FIG. 9 is a cross-sectional view of a narrow-frame reflective display device 100g according to another embodiment of the present disclosure. The narrow-frame reflective display device 100g has the same cross-sectional position as the narrow-frame reflective display device 100 shown in FIG. 2, wherein the frame region BR on the right side is omitted in FIG. 9. The narrow-frame reflective display device 100g is substantially the same as the narrow-frame reflective display device 100f, the difference being that the narrow-frame reflective display device 100g is an inflexible display device. In other words, the thin film transistor array substrate 120a of the narrow-frame reflective display device 100g has a substrate 122a, and the material of the substrate 122a is glass. The narrow-frame reflective display device 100g has the same technical effects as the narrow-frame reflective display device 100f, which will not be described in detail herein.

In summary, the thin film transistor array substrate is electrically connected to the chip through conductive wires and a flexible circuit board to drive a narrow frame reflective display device. Therefore, there is no need to set a significantly protruding bonding area on the thin film transistor array substrate to bond the flexible circuit board. The above configuration can reduce the width of the peripheral area of the thin film transistor array substrate. The present disclosure stacks the thin film transistor array substrate and the driving circuit substrate, and electrically connects the first conductive pad and the second conductive pad distributed in the frame area through conductive wires, so that the flexible circuit board does not need to be bonded to the thin film transistor array substrate. In other words, the width of the border area only needs to consider the distance between the first conductive pad and the second conductive pad, so the width of the border area of the narrow border reflective display device can be reduced. In addition, the shape of the border area can be determined according to the shape of the display area, so the narrow border reflective display device can have a customized shape.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the attached patent application.

100,100a,100b,100c,100d,100e,100f,100g: narrow frame reflective display device 1002: edge 110,110a,110c: drive circuit substrate 1101: side surface 1102: second surface 1104: fourth surface 112,122: polyimide film 114,124: protective layer 116,126: adhesive layer 118: first conductive pad 120,120a: thin film transistor array substrate 1202: third surface 1204: junction 122a: substrate 128: second conductive pad 130: front panel stack 132: Display medium layer 134: Transparent conductive film 136: Optical adhesive layer 140: Conductive wire 150: Cover plate 1502: First surface 160: Sealing glue 170: Adhesive layer 180: Flexible circuit board 182: Chip 190: Silver paste AA: Display area PA: Peripheral area BR: Frame area BD: Bending area D1, D2, D3, D4, D5, D6, D7: Distance 2-2’, 5-5, 6-6: Line segment Y: Vertical direction T: Thickness

FIG. 1 is a top view of a narrow-frame reflective display device according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view along line segment 2-2 in FIG. 1. FIG. 3 is a top view of the narrow-frame reflective display device in FIG. 1 with the cover plate and the sealant omitted. FIG. 4 is a cross-sectional view of a narrow-frame reflective display device according to another embodiment of the present disclosure. FIG. 5 is a cross-sectional view along line segment 5-5 in FIG. 1. FIG. 6 is a cross-sectional view along line segment 6-6 in FIG. 1. FIG. 7A to FIG. 7D are top views of narrow-frame reflective display devices according to some embodiments of the present disclosure. FIG. 8 is a cross-sectional view of a narrow-frame reflective display device according to another embodiment of the present disclosure. FIG. 9 is a cross-sectional view of a narrow-frame reflective display device according to another embodiment of the present disclosure.

100: Narrow-frame reflective display device

1002: Edge

110: Drive circuit substrate

1101: Side surface

1102: Second surface

1104: Fourth Surface

112,122: Polyimide film

114,124: Protective layer

116,126: Adhesive layer

118: First conductive pad

120: Thin film transistor array substrate

1202: Third surface

1204: Junction

128: Second conductive pad

130: Front panel stacking structure

132: Display media layer

134: Transparent conductive film

136: Optical glue layer

140: Conductive wire

150: Cover plate

1502: First surface

160: Sealing glue

170: Adhesive layer

180: Flexible circuit board

182: Chip

AA: Display area

PA: Peripheral Area

BR: Border area

BD: Bend area

D1,D2,D3:Distance

Y: vertical direction

T:Thickness

2-2’: Line segment

Claims (14)

A narrow-frame reflective display device includes: a driving circuit substrate; a thin film transistor array substrate located on the driving circuit substrate; a front panel stack, wherein the thin film transistor array substrate is located between the driving circuit substrate and the front panel stack; a plurality of conductive wires electrically connecting the driving circuit substrate and the thin film transistor array substrate, and the conductive wires surround the thin film transistor array substrate and the front panel stack; a cover plate located on the front panel stack; and a sealant surrounding the driving circuit substrate, the thin film transistor array substrate, the front panel stack and the conductive wires. A narrow-frame reflective display device as described in claim 1, wherein the cover has a first surface facing the driving circuit substrate, and the vertical projection of the driving circuit substrate on the first surface is within the range of the first surface. A narrow-frame reflective display device as described in claim 1, wherein the thin film transistor array substrate comprises a display area and a peripheral area surrounding the display area, the display area and the peripheral area have a boundary, and the cover plate has an edge, and wherein in a top view, the distance from the vertical projection of the boundary of the thin film transistor array substrate on the cover plate to the edge of the cover plate is less than 2.5 mm. The narrow-frame reflective display device as described in claim 1, wherein the thin film transistor array substrate further includes a plurality of first conductive pads, the driving circuit substrate further includes a plurality of second conductive pads, and the conductive lines electrically connect the first conductive pads and the second conductive pads respectively. A narrow-frame reflective display device as described in claim 4, wherein the driving circuit substrate has a second surface facing the thin film transistor array substrate, the first conductive pads are located on the second surface, and the first conductive pads surround the thin film transistor array substrate. A narrow-frame reflective display device as described in claim 4, wherein the thin film transistor array substrate has a third surface facing the front panel stack, the second conductive pads are located on the third surface, and the second conductive pads surround the front panel stack. The narrow-frame reflective display device as described in claim 1, wherein the material of the thin-film transistor array substrate includes a protective layer, a polyimide film, and an adhesive layer between the protective layer and the polyimide film. A narrow-frame reflective display device as described in claim 1, wherein the material of the thin-film transistor array substrate includes glass. A narrow-frame reflective display device as described in claim 1, wherein the material of the driving circuit substrate includes a protective layer, a polyimide film, and an adhesive layer between the protective layer and the polyimide film. A narrow-frame reflective display device as described in claim 1, wherein the material of the driving circuit substrate includes glass. The narrow-frame reflective display device as described in claim 1 further includes a flexible circuit board and a chip, wherein the driving circuit substrate has a second surface facing the thin film transistor array substrate, the flexible printed circuit board (FPC) is bonded to the second surface of the driving circuit substrate, and the chip is bonded to the flexible circuit board. A narrow-frame reflective display device as described in claim 11, wherein the cover plate has a first surface facing the driving circuit substrate, and in a top view, the vertical projections of the flexible circuit board and the chip on the first surface of the cover plate are within the range of the first surface. A narrow-frame reflective display device as described in claim 1, wherein the driving circuit substrate has a fourth surface facing away from the thin film transistor array substrate, the driving circuit substrate is a printed circuit board (PCB) or a flexible circuit board, and the narrow-frame reflective display device also includes a chip bonded to the fourth surface of the driving circuit substrate. A narrow-frame reflective display device as described in claim 1, wherein the encapsulant surrounds and covers a side surface of the drive circuit substrate.

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