TWI846809B - Sealant for organic EL display components - Google Patents
Sealant for organic EL display components Download PDFInfo
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- TWI846809B TWI846809B TW109102786A TW109102786A TWI846809B TW I846809 B TWI846809 B TW I846809B TW 109102786 A TW109102786 A TW 109102786A TW 109102786 A TW109102786 A TW 109102786A TW I846809 B TWI846809 B TW I846809B
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- TW
- Taiwan
- Prior art keywords
- organic
- sealant
- display element
- weight
- parts
- Prior art date
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- 239000000565 sealant Substances 0.000 title claims abstract description 94
- 150000001875 compounds Chemical class 0.000 claims abstract description 109
- 239000004593 Epoxy Substances 0.000 claims abstract description 63
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 41
- 125000002091 cationic group Chemical group 0.000 claims abstract description 22
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 22
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 21
- 150000001925 cycloalkenes Chemical class 0.000 claims abstract description 21
- -1 3-ethyl-3-(((3-ethylcyclohexane-3-yl)methoxy)methyl)cyclohexane Chemical compound 0.000 claims description 81
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 10
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 8
- 150000001450 anions Chemical class 0.000 claims description 5
- USGYMDAUQBQWFU-UHFFFAOYSA-N 1,2,5,6-diepoxycyclooctane Chemical compound C1CC2OC2CCC2OC12 USGYMDAUQBQWFU-UHFFFAOYSA-N 0.000 claims 1
- LFKLPJRVSHJZPL-UHFFFAOYSA-N 1,2:7,8-diepoxyoctane Chemical compound C1OC1CCCCC1CO1 LFKLPJRVSHJZPL-UHFFFAOYSA-N 0.000 claims 1
- 238000010943 off-gassing Methods 0.000 abstract description 20
- 239000011248 coating agent Substances 0.000 abstract description 18
- 238000000576 coating method Methods 0.000 abstract description 18
- 238000000605 extraction Methods 0.000 abstract description 17
- 239000000758 substrate Substances 0.000 description 40
- 230000001699 photocatalysis Effects 0.000 description 19
- 239000003795 chemical substances by application Substances 0.000 description 17
- 239000010410 layer Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 14
- 229920001187 thermosetting polymer Polymers 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000006087 Silane Coupling Agent Substances 0.000 description 9
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 9
- 239000003607 modifier Substances 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 229910010272 inorganic material Inorganic materials 0.000 description 7
- 239000011147 inorganic material Substances 0.000 description 7
- 230000001678 irradiating effect Effects 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical class CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- NIYNIOYNNFXGFN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound OCC1CCC(CO)CC1.C1C(C(=O)O)CCC2OC21.C1C(C(=O)O)CCC2OC21 NIYNIOYNNFXGFN-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 3
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 3
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000001868 cobalt Chemical class 0.000 description 3
- 239000012954 diazonium Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000002309 gasification Methods 0.000 description 3
- 150000002496 iodine Chemical class 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000012552 review Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- XWJBRBSPAODJER-UHFFFAOYSA-N 1,7-octadiene Chemical compound C=CCCCCC=C XWJBRBSPAODJER-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 2
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical class OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 238000005341 cation exchange Methods 0.000 description 2
- 125000004956 cyclohexylene group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 239000003456 ion exchange resin Substances 0.000 description 2
- 229920003303 ion-exchange polymer Polymers 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- ZNGSVRYVWHOWLX-KHFUBBAMSA-N (1r,2s)-2-(methylamino)-1-phenylpropan-1-ol;hydrate Chemical compound O.CN[C@@H](C)[C@H](O)C1=CC=CC=C1.CN[C@@H](C)[C@H](O)C1=CC=CC=C1 ZNGSVRYVWHOWLX-KHFUBBAMSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- NQEJEMZJOBCYOD-UHFFFAOYSA-N (4-methoxyphenyl)methyl-dimethyl-phenylazanium Chemical compound C1=CC(OC)=CC=C1C[N+](C)(C)C1=CC=CC=C1 NQEJEMZJOBCYOD-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- HIYIGPVBMDKPCR-UHFFFAOYSA-N 1,1-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1(COC=C)CCCCC1 HIYIGPVBMDKPCR-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- QLGYTJLZFZUDFL-UHFFFAOYSA-N 1,3-bis[1-(1h-imidazol-2-yl)propyl]urea Chemical compound N=1C=CNC=1C(CC)NC(=O)NC(CC)C1=NC=CN1 QLGYTJLZFZUDFL-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 description 1
- RQJCIXUNHZZFMB-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxypropoxy)propane Chemical compound C=COCC(C)OCC(C)OC=C RQJCIXUNHZZFMB-UHFFFAOYSA-N 0.000 description 1
- FOWNZLLMQHBVQT-UHFFFAOYSA-N 1-ethenoxy-2-[2-(2-ethenoxypropoxy)propoxy]propane Chemical compound C=COCC(C)OCC(C)OCC(C)OC=C FOWNZLLMQHBVQT-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- VDAIJDKQXDCJSI-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)ethylurea Chemical compound CC1=NC=CN1CCNC(N)=O VDAIJDKQXDCJSI-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- RQZUWSJHFBOFPI-UHFFFAOYSA-N 2-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COCC1CO1 RQZUWSJHFBOFPI-UHFFFAOYSA-N 0.000 description 1
- FVCHRIQAIOHAIC-UHFFFAOYSA-N 2-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COCC1CO1 FVCHRIQAIOHAIC-UHFFFAOYSA-N 0.000 description 1
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- UWQPDVZUOZVCBH-UHFFFAOYSA-N 2-diazonio-4-oxo-3h-naphthalen-1-olate Chemical class C1=CC=C2C(=O)C(=[N+]=[N-])CC(=O)C2=C1 UWQPDVZUOZVCBH-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- YATIYDNBFHEOFA-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-ol Chemical compound CO[Si](OC)(OC)CCCO YATIYDNBFHEOFA-UHFFFAOYSA-N 0.000 description 1
- RRXFVFZYPPCDAW-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethoxymethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1COCC1CC2OC2CC1 RRXFVFZYPPCDAW-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- ZYOUJMRZDQJUMP-UHFFFAOYSA-N CCC(C=1NC=CN1)NCCCCCCN Chemical compound CCC(C=1NC=CN1)NCCCCCCN ZYOUJMRZDQJUMP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical group C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- MOOIXEMFUKBQLJ-UHFFFAOYSA-N [1-(ethenoxymethyl)cyclohexyl]methanol Chemical compound C=COCC1(CO)CCCCC1 MOOIXEMFUKBQLJ-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 238000005349 anion exchange Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- AENNXXRRACDJAY-UHFFFAOYSA-N bis(2-dodecylphenyl)iodanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC AENNXXRRACDJAY-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- NKWPZUCBCARRDP-UHFFFAOYSA-L calcium bicarbonate Chemical compound [Ca+2].OC([O-])=O.OC([O-])=O NKWPZUCBCARRDP-UHFFFAOYSA-L 0.000 description 1
- 229910000020 calcium bicarbonate Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000001995 cyclobutyl group Chemical class [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- HYVNJCOHGOONJK-UHFFFAOYSA-N dibenzyl-methyl-phenylazanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(C)CC1=CC=CC=C1 HYVNJCOHGOONJK-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
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- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
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- GELSOTNVVKOYAW-UHFFFAOYSA-N ethyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 GELSOTNVVKOYAW-UHFFFAOYSA-N 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- GTWJETSWSUWSEJ-UHFFFAOYSA-N n-benzylaniline Chemical compound C=1C=CC=CC=1CNC1=CC=CC=C1 GTWJETSWSUWSEJ-UHFFFAOYSA-N 0.000 description 1
- 125000006502 nitrobenzyl group Chemical group 0.000 description 1
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- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
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- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- Polyethers (AREA)
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Abstract
本發明之目的為提供一種低排氣性及塗布性優異,且可得到光擷取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。 本發明為一種含有陽離子聚合性化合物與陽離子聚合起始劑之有機EL顯示元件用密封劑,上述陽離子聚合性化合物包含環烯烴氧化物(cycloalkene oxide)型脂環式環氧化合物與茀型環氧化合物。The purpose of the present invention is to provide a sealant for an organic EL display element that has low outgassing and excellent coating properties and can obtain an organic EL display element with excellent light extraction efficiency. The present invention is a sealant for an organic EL display element containing a cationic polymerizable compound and a cationic polymerization initiator, wherein the cationic polymerizable compound includes a cycloalkene oxide type alicyclic epoxy compound and a fluorene type epoxy compound.
Description
本發明係關於一種低排氣性及塗布性優異,且可得到光擷取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。The present invention relates to a sealant for an organic EL display element which has low outgassing properties and excellent coating properties and can obtain an organic EL display element with excellent light extraction efficiency.
有機電致發光(以下,亦稱為「有機EL」)顯示元件具有於相互對向之一對電極間夾持有有機發光材料層的積層體構造,於此有機發光材料層從一電極注入電子且從另一電極注入電洞,藉此使電子與電洞於有機發光材料層內結合而發光。如此般有機EL顯示元件由於進行自發光,因此與需要背光源之液晶顯示元件等相較之下,具有下述優點:目視辨認性佳、可更加薄型化且可進行直流低電壓驅動。An organic electroluminescent (hereinafter referred to as "organic EL") display element has a laminate structure in which an organic luminescent material layer is sandwiched between a pair of electrodes facing each other. Electrons are injected from one electrode and holes are injected from the other electrode into the organic luminescent material layer, thereby causing the electrons and holes to combine in the organic luminescent material layer to emit light. Since such an organic EL display element is self-luminescent, it has the following advantages over liquid crystal display elements that require a backlight: good visual recognition, thinner design, and DC low voltage drive.
構成有機EL顯示元件之有機發光材料層或電極,具有特性容易因水分或氧等而劣化之問題。因此,為了得到實用之有機EL顯示元件,必須將有機發光材料層或電極與大氣阻斷,謀求長壽命化。作為將有機發光材料層或電極與大氣阻斷之方法,一直是使用密封劑將有機EL顯示元件加以密封(例如,專利文獻1)。當以密封劑將有機EL顯示元件加以密封之情形時,通常為了充分抑制水分或氧等之透過,而使用下述方法:於具有有機發光材料層之積層體上設置被稱為鈍化膜之無機材料膜,以密封劑密封該無機材料膜上。The organic light-emitting material layer or electrode constituting the organic EL display element has the problem that its characteristics are easily degraded by moisture, oxygen, etc. Therefore, in order to obtain a practical organic EL display element, the organic light-emitting material layer or electrode must be blocked from the atmosphere to extend its life. As a method of blocking the organic light-emitting material layer or electrode from the atmosphere, the organic EL display element has been sealed with a sealant (for example, Patent Document 1). When the organic EL display element is sealed with a sealant, the following method is usually used to fully suppress the penetration of moisture, oxygen, etc.: an inorganic material film called a passivation film is provided on a laminate having an organic light-emitting material layer, and the inorganic material film is sealed with a sealant.
近年來,代替下發射(bottom-emission)型有機EL顯示元件之上發射(top-emission)型有機EL顯示元件受到矚目,該下發射型有機EL顯示元件係從形成有發光元件之基板面側擷取從有機發光材料層發出之光者,而該上發射型有機EL顯示元件則是從有機發光層之上面側擷取光者。此方式由於開口率高,為低電壓驅動,因此具有利於長壽命化之優點。於此種上發射型有機EL顯示元件,由於發光層之上面側必須為透明,因此係透過透明之密封層將玻璃等透明防濕性基材積層於發光元件之上面側,藉此而密封(例如,專利文獻2)。然而,於上發射型有機EL顯示元件,即使為使用透明性夠高者作為透明防濕性基材或密封劑之情形,亦具有下述問題:有時會因電極或鈍化膜與密封劑之折射率差,而使得從積層體發出之光的擷取效率差。又,以往之密封劑具有發生排氣使元件劣化,或塗布性差之問題。 [先前技術文獻] [專利文獻]In recent years, top-emission organic EL display elements have attracted attention, replacing bottom-emission organic EL display elements, which extract light emitted from an organic luminescent material layer from the substrate surface side on which the luminescent element is formed, while top-emission organic EL display elements extract light from the upper side of the organic luminescent layer. This method has the advantage of long life due to its high aperture ratio and low voltage drive. In such top-emission organic EL display elements, since the upper side of the luminescent layer must be transparent, a transparent moisture-proof substrate such as glass is laminated on the upper side of the luminescent element through a transparent sealing layer to seal it (for example, Patent Document 2). However, even when using a transparent moisture-proof substrate or sealant with high transparency, the top-emitting organic EL display element has the following problems: sometimes the efficiency of extracting light emitted from the laminate is poor due to the difference in refractive index between the electrode or passivation film and the sealant. In addition, conventional sealants have the problem of outgassing and deteriorating the element, or poor coating properties. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本特開2007-115692號公報 [專利文獻2]日本特開2009-051980號公報[Patent Document 1] Japanese Patent Publication No. 2007-115692 [Patent Document 2] Japanese Patent Publication No. 2009-051980
[發明所欲解決之課題][The problem that the invention wants to solve]
本發明之目的為提供一種低排氣性及塗布性優異,且可得到光擷取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。 [用以解決課題之手段]The purpose of the present invention is to provide a sealant for an organic EL display element that has low outgassing properties and excellent coating properties, and can obtain an organic EL display element with excellent light extraction efficiency. [Means for solving the problem]
本發明為一種含有陽離子聚合性化合物與陽離子聚合起始劑之有機EL顯示元件用密封劑,上述陽離子聚合性化合物包含環烯烴氧化物(cycloalkene oxide)型脂環式環氧化合物與茀型環氧化合物。 以下詳述本發明。The present invention is a sealant for an organic EL display element containing a cationic polymerizable compound and a cationic polymerization initiator, wherein the cationic polymerizable compound includes a cycloalkene oxide type alicyclic epoxy compound and a fluorene type epoxy compound. The present invention is described in detail below.
本發明人研究了藉由對有機EL顯示元件用密封劑使用環烯烴氧化物型脂環式環氧化合物作為陽離子聚合性化合物,以提升塗布性,且防止排氣發生。然而,此種使用環烯烴氧化物型脂環式環氧化合物之密封劑雖然防止排氣發生之效果優異,但是由於與電極或鈍化膜之折射率差大,故具有因電極或鈍化膜與密封劑之界面的反射而使得光擷取效率降低之問題。因此本發明人研究了將該環烯烴氧化物型脂環式環氧化合物與茀型環氧化合物加以組合來使用而作為陽離子聚合性化合物。其結果,發現可得到低排氣性及塗布性優異,且能使所得到之有機EL顯示元件為光擷取效率優異者的有機EL顯示元件用密封劑,而完成了本發明。The inventors of the present invention have studied the use of cycloolefin oxide type alicyclic epoxy compounds as cationically polymerizable compounds in sealants for organic EL display elements to improve coating properties and prevent outgassing. However, although such sealants using cycloolefin oxide type alicyclic epoxy compounds are excellent in preventing outgassing, they have a problem of reduced light extraction efficiency due to reflection at the interface between the electrode or passivated film and the sealant due to the large difference in refractive index with the electrode or passivated film. Therefore, the inventors of the present invention have studied the use of a combination of the cycloolefin oxide type alicyclic epoxy compounds and fluorene type epoxy compounds as cationically polymerizable compounds. As a result, the inventors have found that it is possible to obtain a sealing agent for an organic EL display element which has low outgassing properties and excellent coating properties and can make the obtained organic EL display element excellent in light extraction efficiency, thereby completing the present invention.
本發明之有機EL顯示元件用密封劑含有陽離子聚合性化合物。上述陽離子聚合性化合物包含環烯烴氧化物型脂環式環氧化合物。藉由含有上述環烯烴氧化物型脂環式環氧化合物,本發明之有機EL顯示元件用密封劑為低排氣性及塗布性優異者。The sealant for an organic EL display element of the present invention contains a cationically polymerizable compound. The cationically polymerizable compound includes an cycloolefin oxide type alicyclic epoxy compound. By containing the cycloolefin oxide type alicyclic epoxy compound, the sealant for an organic EL display element of the present invention has low outgassing and excellent coating properties.
作為上述環烯烴氧化物型脂環式環氧化合物,例如可列舉3’,4’-環氧環己基甲基3,4-環氧環己烷羧酸酯、雙(3,4-環氧環己基甲基)醚等。Examples of the cycloolefin oxide type alicyclic epoxy compounds include 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate and bis(3,4-epoxycyclohexylmethyl)ether.
作為上述環烯烴氧化物型脂環式環氧化合物之中市售者,可舉celloxide2021P(大賽璐公司製)等。Among the above-mentioned cycloolefin oxide type alicyclic epoxy compounds, commercially available ones include celloxide 2021P (manufactured by Daicellul Corporation) and the like.
上述陽離子聚合性化合物整體100重量份中之上述環烯烴氧化物型脂環式環氧化合物的含量較佳下限為10重量份,較佳上限為90重量份。藉由上述環烯烴氧化物型脂環式環氧化合物之含量為10重量份以上,使得所得到之有機EL顯示元件用密封劑為低排氣性及塗布性更加優異者。藉由上述環烯烴氧化物型脂環式環氧化合物之含量為90重量份以下,使得所得到之有機EL顯示元件為光擷取效率更加優異者。上述環烯烴氧化物型脂環式環氧化合物之含量的更佳下限為15重量份,更佳上限為70重量份,再更佳之下限為20重量份,再更佳之上限為65重量份,尤佳之下限為60重量份。The content of the above-mentioned cycloolefin oxide type alicyclic epoxy compound in the total 100 parts by weight of the above-mentioned cationically polymerizable compound is preferably 10 parts by weight at the lower limit and 90 parts by weight at the upper limit. When the content of the above-mentioned cycloolefin oxide type alicyclic epoxy compound is 10 parts by weight or more, the obtained sealant for the organic EL display element has low outgassing and better coating properties. When the content of the above-mentioned cycloolefin oxide type alicyclic epoxy compound is 90 parts by weight or less, the obtained organic EL display element has better light extraction efficiency. The better lower limit of the content of the cycloolefin oxide type alicyclic epoxy compound is 15 parts by weight, the better upper limit is 70 parts by weight, the further better lower limit is 20 parts by weight, the further better upper limit is 65 parts by weight, and the particularly better lower limit is 60 parts by weight.
上述陽離子聚合性化合物包含茀型環氧化合物。藉由含有上述茀型環氧化合物,本發明之有機EL顯示元件用密封劑為與電極或鈍化膜之折射率差小者,其結果,所得到之有機EL顯示元件為光擷取效率優異者。The cationically polymerizable compound includes a fluorene-type epoxy compound. By including the fluorene-type epoxy compound, the sealant for an organic EL display element of the present invention has a small refractive index difference with an electrode or a passivation film, and as a result, the obtained organic EL display element has excellent light extraction efficiency.
作為上述茀型環氧化合物,若為具有茀骨格之環氧化合物即可,從黏度、折射率、光硬化性等觀點,可適當選擇各種茀型環氧化合物。The fluorene-based epoxy compound may be any epoxy compound having a fluorene skeleton, and various fluorene-based epoxy compounds may be appropriately selected from the viewpoints of viscosity, refractive index, photocurability, and the like.
上述茀型環氧化合物之環氧當量的較佳下限為200,較佳上限為400。藉由上述茀型環氧化合物之環氧當量為此範圍,使得所得到之有機EL顯示元件用密封劑為接著性、低排氣性及塗布性更加優異者。 另,於本說明書中,上述茀型環氧化合物之環氧當量意指(茀型環氧化合物之分子量)/(茀型環氧化合物1分子中之環氧基的數目)。The preferred lower limit of the epoxy equivalent of the fluorene-type epoxy compound is 200, and the preferred upper limit is 400. By setting the epoxy equivalent of the fluorene-type epoxy compound to be within this range, the obtained sealant for the organic EL display element has better adhesion, low outgassing and coating properties. In addition, in this specification, the epoxy equivalent of the fluorene-type epoxy compound means (molecular weight of the fluorene-type epoxy compound)/(the number of epoxy groups in one molecule of the fluorene-type epoxy compound).
作為上述茀型環氧化合物之中市售者,例如可列舉新日鐵住金化學公司製之茀型環氧化合物、長瀨化成公司製之茀型環氧化合物、大阪瓦斯化學公司製之茀型環氧化合物等。 作為上述新日鐵住金化學公司製之茀型環氧化合物,例如可舉ESF-300等。 作為上述長瀨化成公司製之茀型環氧化合物,例如可舉ONCOAT EX-1010等。 作為上述大阪瓦斯化學公司製之茀型環氧化合物,例如可列舉OGSOL PG-100、EG-200等。 此等茀型環氧化合物可單獨使用,亦可將2種以上組合來使用。Among the above-mentioned fluorene-type epoxy compounds, commercially available ones include, for example, fluorene-type epoxy compounds manufactured by Nippon Steel & Sumitomo Chemicals, fluorene-type epoxy compounds manufactured by Nagase Chemicals, and fluorene-type epoxy compounds manufactured by Osaka Gas Chemicals. As the above-mentioned fluorene-type epoxy compounds manufactured by Nippon Steel & Sumitomo Chemicals, for example, ESF-300, etc. can be mentioned. As the above-mentioned fluorene-type epoxy compounds manufactured by Nagase Chemicals, for example, ONCOAT EX-1010, etc. can be mentioned. As the above-mentioned fluorene-type epoxy compounds manufactured by Osaka Gas Chemicals, for example, OGSOL PG-100, EG-200, etc. can be mentioned. These fluorene-type epoxy compounds can be used alone or in combination of two or more.
上述陽離子聚合性化合物整體100重量份中之上述茀型環氧化合物的含量較佳下限為10重量份,較佳上限為80重量份。藉由上述茀型環氧化合物之含量為10重量份以上,使得所得到之有機EL顯示元件為光擷取效率更加優異者。藉由上述茀型環氧化合物之含量為80重量份以下,使得所得到之有機EL顯示元件用密封劑為低排氣性及塗布性更加優異者。上述茀型環氧化合物之含量的更佳下限為15重量份,更佳上限為75重量份,再更佳之下限為20重量份,再更佳之上限為70重量份。又,從使所得到之有機EL顯示元件為光擷取效率進而更加優異者的觀點,上述茀型環氧化合物之含量的較佳下限為30重量份,更佳下限為35重量份,再更佳之下限為40重量份。The preferred lower limit of the content of the fluorene-type epoxy compound in 100 parts by weight of the total cationic polymerizable compound is 10 parts by weight, and the preferred upper limit is 80 parts by weight. When the content of the fluorene-type epoxy compound is 10 parts by weight or more, the obtained organic EL display element has a better light extraction efficiency. When the content of the fluorene-type epoxy compound is 80 parts by weight or less, the obtained sealant for the organic EL display element has a better low outgassing property and coating property. The preferred lower limit of the content of the fluorene-type epoxy compound is 15 parts by weight, the preferred upper limit is 75 parts by weight, the further preferred lower limit is 20 parts by weight, and the further preferred upper limit is 70 parts by weight. Furthermore, from the viewpoint of making the obtained organic EL display element have a further improved light extraction efficiency, the lower limit of the content of the fluorene-type epoxy compound is preferably 30 parts by weight, more preferably 35 parts by weight, and still more preferably 40 parts by weight.
上述陽離子聚合性化合物除了上述環烯烴氧化物型脂環式環氧化合物及上述茀型環氧化合物外,亦可包含其他之陽離子聚合性化合物。 作為上述其他之陽離子聚合性化合物,例如可列舉上述環烯烴氧化物型脂環式環氧化合物及上述茀型環氧化合物以外之其他的環氧化合物、氧環丁烷化合物、乙烯醚化合物等。The above-mentioned cationically polymerizable compound may include other cationically polymerizable compounds in addition to the above-mentioned cycloolefin oxide type alicyclic epoxy compounds and the above-mentioned fluorene type epoxy compounds. As the above-mentioned other cationically polymerizable compounds, for example, other epoxide compounds, cyclobutane compounds, vinyl ether compounds, etc. other than the above-mentioned cycloolefin oxide type alicyclic epoxy compounds and the above-mentioned fluorene type epoxy compounds can be listed.
作為上述其他之環氧化合物,例如可列舉1,7-辛二烯二環氧化合物、新戊二醇二環氧丙基醚、乙二醇二環氧丙基醚、二乙二醇二環氧丙基醚、聚乙二醇二環氧丙基醚、丙二醇二環氧丙基醚、二丙烯甘醇二環氧丙基醚、三伸丙二醇二環氧丙基醚、聚丙二醇二環氧丙基醚、1,6-己二醇二環氧丙基醚、甘油二環氧丙基醚、三羥甲基丙烷三環氧丙基醚、苯基環氧丙基醚、伸苯基二環氧丙基醚等。Examples of the other epoxy compounds include 1,7-octadiene diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, dipropylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerol diglycidyl ether, trihydroxymethylpropane triglycidyl ether, phenyl glycidyl ether, and phenylene diglycidyl ether.
作為上述氧環丁烷化合物,例如可列舉3-乙基-3-(((3-乙基氧環丁烷-3-基)甲氧基)甲基)氧環丁烷、3-乙基-3-((2-乙基己氧基)甲基)氧環丁烷、3-乙基-3-((3-(三乙氧基矽基)丙氧基)甲基)氧環丁烷、苯酚酚醛清漆氧環丁烷、1,4-雙(((3-乙基-3-氧環丁烷基)甲氧基)甲基)苯等。Examples of the cyclohexane compound include 3-ethyl-3-(((3-ethylcyclohexane-3-yl)methoxy)methyl)cyclohexane, 3-ethyl-3-((2-ethylhexyloxy)methyl)cyclohexane, 3-ethyl-3-((3-(triethoxysilyl)propoxy)methyl)cyclohexane, phenol novolac cyclohexane, and 1,4-bis(((3-ethyl-3-cyclohexane-3-yl)methoxy)methyl)benzene.
作為上述乙烯醚化合物,例如可列舉苄基乙烯醚、環己烷二甲醇單乙烯醚、二環戊二烯乙烯醚、1,4-丁二醇二乙烯醚、環己烷二甲醇二乙烯醚、二乙二醇二乙烯醚、三乙二醇二乙烯醚、二丙烯甘醇二乙烯醚、三伸丙二醇二乙烯醚等。Examples of the vinyl ether compound include benzyl vinyl ether, cyclohexanedimethanol monovinyl ether, dicyclopentadiene vinyl ether, 1,4-butanediol divinyl ether, cyclohexanedimethanol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, dipropylene glycol divinyl ether, and tripropylene glycol divinyl ether.
其中,作為上述其他之陽離子聚合性化合物,較佳為選自由3-乙基-3-(((3-乙基氧環丁烷-3-基)甲氧基)甲基)氧環丁烷、1,2:7,8-二環氧辛烷及1,2:5,6-二環氧環辛烷組成之群中的至少1種,更佳為3-乙基-3-(((3-乙基氧環丁烷-3-基)甲氧基)甲基)氧環丁烷。Among them, as the other cationically polymerizable compound, at least one selected from the group consisting of 3-ethyl-3-(((3-ethylcyclohexyl-3-yl)methoxy)methyl)cyclohexylene, 1,2:7,8-diexyloxyoctane and 1,2:5,6-diexyloxyoctane is preferred, and 3-ethyl-3-(((3-ethylcyclohexyl-3-yl)methoxy)methyl)cyclohexylene is more preferred.
當上述陽離子聚合性化合物含有上述其他之陽離子聚合性化合物的情形時,上述陽離子聚合性化合物100重量份中之上述其他之陽離子聚合性化合物的含量較佳下限為10重量份,較佳上限為50重量份。藉由上述其他之陽離子聚合性化合物的含量為此範圍,使得所得到之有機EL顯示元件用密封劑為接著性及塗布性更加優異者。上述其他之陽離子聚合性化合物的含量更佳上限為45重量份,再更佳之上限為40重量份。 又,當上述陽離子聚合性化合物含有上述其他之陽離子聚合性化合物的情形時,上述陽離子聚合性化合物100重量份中之上述環烯烴氧化物型脂環式環氧化合物與上述其他之陽離子聚合性化合物的合計含量較佳下限為20重量份。藉由上述環烯烴氧化物型脂環式環氧化合物與上述其他之陽離子聚合性化合物的合計含量為20重量份以上,使得所得到之有機EL顯示元件用密封劑為塗布性更加優異者。上述環烯烴氧化物型脂環式環氧化合物與上述其他之陽離子聚合性化合物的合計含量更佳下限為30重量份,再更佳之下限為40重量份。When the above-mentioned cationic polymerizable compound contains the above-mentioned other cationic polymerizable compounds, the content of the above-mentioned other cationic polymerizable compounds in 100 parts by weight of the above-mentioned cationic polymerizable compounds is preferably 10 parts by weight, and the preferably upper limit is 50 parts by weight. By having the content of the above-mentioned other cationic polymerizable compounds in this range, the obtained sealant for organic EL display elements has better adhesion and coating properties. The content of the above-mentioned other cationic polymerizable compounds is more preferably 45 parts by weight, and the more preferably upper limit is 40 parts by weight. Furthermore, when the above-mentioned cationically polymerizable compound contains the above-mentioned other cationically polymerizable compounds, the combined content of the above-mentioned cycloolefin oxide type alicyclic epoxy compound and the above-mentioned other cationically polymerizable compounds in 100 parts by weight of the above-mentioned cationically polymerizable compound is preferably 20 parts by weight. By making the combined content of the above-mentioned cycloolefin oxide type alicyclic epoxy compound and the above-mentioned other cationically polymerizable compounds more than 20 parts by weight, the obtained sealant for organic EL display elements has better coating properties. The combined content of the above-mentioned cycloolefin oxide type alicyclic epoxy compound and the above-mentioned other cationically polymerizable compounds is more preferably 30 parts by weight, and the further more preferably 40 parts by weight.
本發明之有機EL顯示元件用密封劑含有陽離子聚合起始劑。 作為上述陽離子聚合起始劑,可列舉熱陽離子聚合起始劑或光陽離子聚合起始劑。The sealant for the organic EL display element of the present invention contains a cationic polymerization initiator. As the above-mentioned cationic polymerization initiator, a thermal cationic polymerization initiator or a photo-cationic polymerization initiator can be cited.
作為上述熱陽離子聚合起始劑,可列舉陰離子部分由BF4 - 、PF6 - 、SbF6 - 或(BX4 )- (其中,X表示經至少2個以上之氟或三氟甲基取代的苯基)構成之鋶鹽、鏻鹽、銨鹽、重氮鹽、錪鹽等。其中,較佳為鋶鹽。As the above-mentioned thermal cationic polymerization initiator, there can be mentioned coronium salts, phosphonium salts, ammonium salts, diazonium salts, iodonium salts, etc., whose anion part is composed of BF4- , PF6- , SbF6- or ( BX4 ) - (wherein X represents a phenyl group substituted with at least two fluorine or trifluoromethyl groups). Among them, coronium salts are preferred.
作為上述鋶鹽,可列舉三苯基鋶四氟硼酸鹽、三苯基鋶六氟銻酸鹽等。Examples of the coronium salt include triphenylcoronium tetrafluoroborate and triphenylcoronium hexafluoroantimonate.
作為上述鏻鹽,可列舉乙基三苯基鏻六氟銻酸鹽、四丁基鏻六氟銻酸鹽等。Examples of the phosphonium salt include ethyltriphenylphosphonium hexafluoroantibonate and tetrabutylphosphonium hexafluoroantibonate.
作為上述銨鹽,例如可列舉二甲基苯基(4-甲氧基苄基)銨六氟磷酸鹽、二甲基苯基(4-甲氧基苄基)銨六氟銻酸鹽、二甲基苯基(4-甲氧基苄基)銨肆(五氟苯基)硼酸鹽、二甲基苯基(4-甲基苄基)銨六氟磷酸鹽、二甲基苯基(4-甲基苄基)銨六氟銻酸鹽、二甲基苯基(4-甲基苄基)銨六氟肆(五氟苯基)硼酸鹽、甲基苯基二苄基銨六氟磷酸鹽、甲基苯基二苄基銨六氟銻酸鹽、甲基苯基二苄基銨肆(五氟苯基)硼酸鹽、苯基三苄基銨肆(五氟苯基)硼酸鹽、二甲基苯基(3,4-二甲基苄基)銨肆(五氟苯基)硼酸鹽、N,N-二甲基-N-苄基苯胺(benzyl anilinium)六氟銻酸鹽、N,N-二乙基-N-苄基苯胺四氟硼酸鹽、N,N-二甲基-N-苄基吡啶鎓六氟銻酸鹽、N,N-二乙基-N-苄基吡啶鎓三氟甲磺酸等。Examples of the ammonium salt include dimethylphenyl (4-methoxybenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methoxybenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methoxybenzyl) ammonium tetrakis (pentafluorophenyl) borate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methylbenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methylbenzyl) ammonium tetrakis (pentafluorophenyl) borate, Benzyl)ammonium hexafluorotetrafluoroborate, methylphenyldibenzylammonium hexafluorophosphate, methylphenyldibenzylammonium hexafluoroantimonylate, methylphenyldibenzylammonium tetra(pentafluorophenyl)borate, phenyltribenzylammonium tetra(pentafluorophenyl)borate, dimethylphenyl (3,4-dimethylbenzyl)ammonium tetra(pentafluorophenyl)borate, N,N-dimethyl-N-benzylaniline (benzyl anilinium) hexafluoroantimonylate, N,N-diethyl-N-benzylaniline tetrafluoroborate, N,N-dimethyl-N-benzylpyridinium hexafluoroantimonylate, N,N-diethyl-N-benzylpyridinium trifluoromethanesulfonic acid, etc.
作為上述熱陽離子聚合起始劑之中市售者,例如可列舉三新化學工業公司製之熱陽離子聚合起始劑、King Industries公司製之熱陽離子聚合起始劑等。 作為上述三新化學工業公司製之熱陽離子聚合起始劑,例如可列舉SAN-AID SI-60、SAN-AID SI-80、SAN-AID SI-B3、SAN-AID SI-B3A、SAN-AID SI-B4等。 作為上述King Industries公司製之熱陽離子聚合起始劑,例如可列舉CXC-1612、CXC-1821等。As the thermal cationic polymerization initiator, commercially available ones include, for example, the thermal cationic polymerization initiator manufactured by Sanshin Chemical Industry Co., Ltd. and the thermal cationic polymerization initiator manufactured by King Industries, etc. As the thermal cationic polymerization initiator manufactured by Sanshin Chemical Industry Co., Ltd., for example, SAN-AID SI-60, SAN-AID SI-80, SAN-AID SI-B3, SAN-AID SI-B3A, SAN-AID SI-B4, etc. As the thermal cationic polymerization initiator manufactured by King Industries, for example, CXC-1612, CXC-1821, etc.
上述光陽離子聚合起始劑若為會因照光而產生質子酸或路易士酸者,則並無特別限定,可為離子性光酸產生型,亦可為非離子性光酸產生型。The photocatalytic ion polymerization initiator is not particularly limited as long as it generates a protonic acid or a Lewis acid when exposed to light, and may be an ionic photoacid generating type or a non-ionic photoacid generating type.
作為上述離子性光酸產生型光陽離子聚合起始劑之陰離子部分,例如可列舉BF4 - 、PF6 - 、SbF6 - 、(BX4 )- (其中,X表示經至少2個以上之氟或三氟甲基取代的苯基)等。又,作為上述陰離子部分,亦可舉PFm (Cn F2n+1 )6-m - (其中,式中之m為0以上且5以下之整數,n為1以上且6以下之整數)等。 作為上述離子性光酸產生型光陽離子聚合起始劑,例如可列舉具有上述陰離子部分之芳香族鋶鹽、芳香族錪鹽、芳香族重氮鹽、芳香族銨鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe鹽等。Examples of the anion part of the ionic photoacid generating type photocatalytic polymerization initiator include BF4- , PF6- , SbF6- , ( BX4 ) - (wherein X represents a phenyl group substituted with at least two fluorine or trifluoromethyl groups), etc. Examples of the anion part include PFm ( CnF2n +1 ) 6 -m- ( wherein m is an integer of 0 to 5, and n is an integer of 1 to 6), etc. Examples of the ionic photoacid generating type photocatalytic polymerization initiator include aromatic cobalt salts, aromatic iodine salts, aromatic diazonium salts, aromatic ammonium salts, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe salts, etc. having the above-mentioned anionic moiety.
作為上述芳香族鋶鹽,例如可列舉雙(4-(二苯基二氫硫基)苯基)硫醚雙六氟磷酸鹽、雙(4-(二苯基二氫硫基)苯基)硫醚雙六氟銻酸鹽、雙(4-(二苯基二氫硫基)苯基)硫醚雙四氟硼酸鹽、雙(4-(二苯基二氫硫基)苯基)硫醚肆(五氟苯基)硼酸鹽、二苯基-4-(苯硫基)苯基鋶六氟磷酸鹽、二苯基-4-(苯硫基)苯基鋶六氟銻酸鹽、二苯基-4-(苯硫基)苯基鋶四氟硼酸鹽、二苯基-4-(苯硫基)苯基鋶肆(五氟苯基)硼酸鹽、三苯基鋶六氟磷酸鹽、三苯基鋶六氟銻酸鹽、三苯基鋶四氟硼酸鹽、三苯基鋶肆(五氟苯基)硼酸鹽、雙(4-(二(4-(2-羥乙氧))苯基二氫硫基)苯基)硫醚雙六氟磷酸鹽、雙(4-(二(4-(2-羥乙氧))苯基二氫硫基)苯基)硫醚雙六氟銻酸鹽、雙(4-(二(4-(2-羥乙氧))苯基二氫硫基)苯基)硫醚雙四氟硼酸鹽、雙(4-(二(4-(2-羥乙氧))苯基二氫硫基)苯基)硫醚肆(五氟苯基)硼酸鹽、參(4-(4-乙醯基苯基)苯硫基)鋶肆(五氟苯基)硼酸鹽等。其中,較佳為三苯基鋶肆(五氟苯基)硼酸鹽等三芳基鋶肆(五氟苯基)硼酸鹽。Examples of the aromatic thionium salt include bis(4-(diphenyldihydrothio)phenyl) sulfide bis(hexafluorophosphate), bis(4-(diphenyldihydrothio)phenyl) sulfide bis(hexafluoroantimonate), bis(4-(diphenyldihydrothio)phenyl) sulfide bis(tetrafluoroborate), bis(4-(diphenyldihydrothio)phenyl) sulfide bis(tetrafluoroborate), and bis(4-(diphenyldihydrothio)phenyl) sulfide bis(hexafluoroantimonate). Thioether tetrakis(pentafluorophenyl)borate, diphenyl-4-(phenylthio)phenylcopperamide hexafluorophosphate, diphenyl-4-(phenylthio)phenylcopperamide hexafluoroantimonate, diphenyl-4-(phenylthio)phenylcopperamide tetrafluoroborate, diphenyl-4-(phenylthio)phenylcopperamide tetrakis(pentafluorophenyl)borate, triphenylcopperamide hexafluorophosphate 、Triphenylsiron hexafluoroantimonylate、Triphenylsiron tetrafluoroborate、Triphenylsiron tetrakis(pentafluorophenyl)borate、Bis(4-(bis(4-(2-hydroxyethoxy))phenyldihydrosulfide)phenyl)sulfide bis(hexafluorophosphate)、Bis(4-(bis(4-(2-hydroxyethoxy))phenyldihydrosulfide)phenyl)sulfide bis(hexafluoroantimonylate) , bis(4-(bis(4-(2-hydroxyethoxy))phenyldihydrothio)phenyl)sulfide bistetrafluoroborate, bis(4-(bis(4-(2-hydroxyethoxy))phenyldihydrothio)phenyl)sulfide tetrakis(pentafluorophenyl)borate, tris(4-(4-acetylphenyl)phenylthio)copper tetrakis(pentafluorophenyl)borate, etc. Among them, triarylsirconium tetrakis(pentafluorophenyl)borates such as triphenylsirconium tetrakis(pentafluorophenyl)borates are preferred.
作為上述芳香族錪鹽,例如可列舉二苯基錪鎓六氟磷酸鹽、二苯基錪鎓六氟銻酸鹽、二苯基錪鎓四氟硼酸鹽、二苯基錪鎓肆(五氟苯基)硼酸鹽、雙(十二基苯基)錪鎓六氟磷酸鹽、雙(十二基苯基)錪鎓六氟銻酸鹽、雙(十二基苯基)錪鎓四氟硼酸鹽、雙(十二基苯基)錪鎓肆(五氟苯基)硼酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪鎓六氟磷酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪鎓六氟銻酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪鎓四氟硼酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪鎓肆(五氟苯基)硼酸鹽等。Examples of the aromatic iodonium salt include diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonylate, diphenyliodonium tetrafluoroborate, diphenyliodonium tetrakis(pentafluorophenyl)borate, bis(dodecylphenyl)iodonium hexafluorophosphate, bis(dodecylphenyl)iodonium hexafluoroantimonylate, bis(dodecylphenyl)iodonium tetrafluoroborate, bis(dodecylphenyl)iodonium tetrakis(pentafluorophenyl)borate, and bis(dodecylphenyl)iodonium hexafluorophosphate. (pentafluorophenyl)borate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium hexafluorophosphate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium hexafluoroantimonate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium tetrafluoroborate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium tetrakis(pentafluorophenyl)borate, and the like.
作為上述芳香族重氮鹽,例如可列舉苯基重氮鎓六氟磷酸鹽、苯基重氮鎓六氟銻酸鹽、苯基重氮鎓四氟硼酸鹽、苯基重氮鎓肆(五氟苯基)硼酸鹽等。Examples of the aromatic diazonium salt include phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, and phenyldiazonium tetrakis(pentafluorophenyl)borate.
作為上述芳香族銨鹽,例如可列舉1-苄基-2-氰基吡啶鎓六氟磷酸鹽、1-苄基-2-氰基吡啶鎓六氟銻酸鹽、1-苄基-2-氰基吡啶鎓四氟硼酸鹽、1-苄基-2-氰基吡啶鎓肆(五氟苯基)硼酸鹽、1-(萘基甲基)-2-氰基吡啶鎓六氟磷酸鹽、1-(萘基甲基)-2-氰基吡啶鎓六氟銻酸鹽、1-(萘基甲基)-2-氰基吡啶鎓四氟硼酸鹽、1-(萘基甲基)-2-氰基吡啶鎓肆(五氟苯基)硼酸鹽等。Examples of the aromatic ammonium salt include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, 1-benzyl-2-cyanopyridinium tetrafluoroborate, 1-benzyl-2-cyanopyridinium tetrakis(pentafluorophenyl)borate, 1-(naphthylmethyl)-2-cyanopyridinium hexafluorophosphate, 1-(naphthylmethyl)-2-cyanopyridinium hexafluoroantimonate, 1-(naphthylmethyl)-2-cyanopyridinium tetrakis(pentafluorophenyl)borate, and the like.
作為上述(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe鹽,例如可列舉(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe(II)六氟磷酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe(II)六氟銻酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe(II)四氟硼酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe(II)肆(五氟苯基)硼酸鹽等。Examples of the (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe salt include (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) hexafluorophosphate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) hexafluoroantimonate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) tetrafluoroborate, and (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II) tetrakis(pentafluorophenyl)borate.
作為上述非離子性光酸產生型光陽離子聚合起始劑,例如可列舉硝基苄基酯、磺酸衍生物、磷酸酯、苯酚磺酸酯、重氮萘醌、N-羥基醯亞胺磺酸酯等。Examples of the non-ionic photoacid generating type photocatalytic polymerization initiator include nitrobenzyl esters, sulfonic acid derivatives, phosphoric acid esters, phenolsulfonates, diazonaphthoquinones, and N-hydroxyimidesulfonates.
作為上述光陽離子聚合起始劑之中市售者,例如可列舉Midori Kagaku公司製之光陽離子聚合起始劑、Union Carbide公司製之光陽離子聚合起始劑、艾迪科公司製之光陽離子聚合起始劑、3M公司製之光陽離子聚合起始劑、BASF公司製之光陽離子聚合起始劑、Solvay公司製之光陽離子聚合起始劑、三亞普羅公司製之光陽離子聚合起始劑等。 作為上述Midori Kagaku公司製之光陽離子聚合起始劑,例如可舉DTS-200等。 作為上述Union Carbide公司製之光陽離子聚合起始劑,例如可列舉UVI6990、UVI6974等。 作為上述艾迪科公司製之光陽離子聚合起始劑,例如可列舉SP-150、SP-170等。 作為上述3M公司製之光陽離子聚合起始劑,例如可列舉FC-508、FC-512等。 作為上述BASF公司製之光陽離子聚合起始劑,例如可列舉IRGACURE261、IRGACURE290等。 作為上述Solvay公司製之光陽離子聚合起始劑,例如可舉PI2074等。 作為上述三亞普羅公司製之光陽離子聚合起始劑,例如可列舉CPI-100P、CPI-200K、CPI-210S等。Examples of the above-mentioned photocatalytic polymerization initiators that are commercially available include photocatalytic polymerization initiators manufactured by Midori Kagaku, photocatalytic polymerization initiators manufactured by Union Carbide, photocatalytic polymerization initiators manufactured by Aidico, photocatalytic polymerization initiators manufactured by 3M, photocatalytic polymerization initiators manufactured by BASF, photocatalytic polymerization initiators manufactured by Solvay, and photocatalytic polymerization initiators manufactured by Sanya Pro. Examples of the above-mentioned photocatalytic polymerization initiators manufactured by Midori Kagaku include DTS-200, etc. Examples of the photocatalytic polymerization initiator manufactured by the Union Carbide Company include UVI6990 and UVI6974. Examples of the photocatalytic polymerization initiator manufactured by the Adecco Company include SP-150 and SP-170. Examples of the photocatalytic polymerization initiator manufactured by the 3M Company include FC-508 and FC-512. Examples of the photocatalytic polymerization initiator manufactured by the BASF Company include IRGACURE261 and IRGACURE290. Examples of the photocatalytic polymerization initiator manufactured by the Solvay Company include PI2074. Examples of the photocatalytic ion polymerization initiators manufactured by the above-mentioned Sanya Pro Corporation include CPI-100P, CPI-200K, and CPI-210S.
上述陽離子聚合起始劑之中,較適合使用相對陰離子(counter anion)為硼酸鹽系之四級銨鹽(以下,亦稱為「硼酸鹽系四級銨鹽」)。 上述硼酸鹽系四級銨鹽之相對陰離子較佳為BF4 - 或(BX4 )- (其中,X表示經至少2個以上之氟或者三氟甲基取代的苯基)。Among the above cationic polymerization initiators, a borate-based quaternary ammonium salt (hereinafter also referred to as "borate-based quaternary ammonium salt") is more suitable. The counter anion of the borate-based quaternary ammonium salt is preferably BF 4 - or (BX 4 ) - (where X represents a phenyl group substituted with at least two fluorine or trifluoromethyl groups).
上述陽離子聚合起始劑之含量相對於上述陽離子聚合性化合物100重量份,較佳下限為0.05重量份,較佳上限為10重量份。藉由上述陽離子聚合起始劑之含量為此範圍,使得所得到之有機EL顯示元件用密封劑為硬化性、保存穩定性及硬化物之耐濕性更加優異者。上述陽離子聚合起始劑之含量的更佳下限為0.1重量份,更佳上限為5重量份。The content of the cationic polymerization initiator is preferably 0.05 parts by weight and 10 parts by weight relative to 100 parts by weight of the cationic polymerizable compound. When the content of the cationic polymerization initiator is within this range, the obtained sealant for organic EL display elements has better curability, storage stability and moisture resistance of the cured product. The better lower limit of the content of the cationic polymerization initiator is 0.1 parts by weight and the better upper limit is 5 parts by weight.
本發明之有機EL顯示元件用密封劑亦可含有熱硬化劑。 作為上述熱硬化劑,例如可列舉醯肼化合物、咪唑衍生物、酸酐、二氰二胺(dicyandiamide)、胍衍生物、改質脂肪族多胺、各種胺與環氧樹脂之加成生成物等。 作為上述醯肼化合物,例如可列舉1,3-雙(肼基碳基乙基(hydrazinocarbonoethyl))-5-異丙基尿囊素、癸二酸二醯肼、異酞酸二醯肼、己二酸二醯肼、丙二酸二醯肼等。 作為上述咪唑衍生物,例如可列舉1-氰乙基-2-苯基咪唑、N-(2-(2-甲基-1-咪唑基)乙基)脲、2,4-二胺基-6-(2’-甲基咪唑基-(1’))-乙基-對稱三𠯤、N,N’-雙(2-甲基-1-咪唑基乙基)脲、N,N’-(2-甲基-1-咪唑基乙基)-己二醯胺、2-苯基-4-甲基-5-羥甲基咪唑、2-苯基-4,5-二羥甲基咪唑等。作為上述酸酐,例如可列舉四氫酞酸酐、乙二醇雙(脫水偏苯三酸酯(anhydrotrimellitate))等。 此等之熱硬化劑可單獨使用,亦可將2種以上組合來使用。The sealant for the organic EL display element of the present invention may also contain a thermosetting agent. As the above-mentioned thermosetting agent, for example, hydrazide compounds, imidazole derivatives, acid anhydrides, dicyandiamide, guanidine derivatives, modified aliphatic polyamines, addition products of various amines and epoxy resins, etc. can be listed. As the above-mentioned hydrazide compounds, for example, 1,3-bis (hydrazinocarbonoethyl) -5-isopropylalantoin, sebacic acid dihydrazide, isophthalic acid dihydrazide, adipic acid dihydrazide, malonic acid dihydrazide, etc. can be listed. Examples of the above-mentioned imidazole derivatives include 1-cyanoethyl-2-phenylimidazole, N-(2-(2-methyl-1-imidazolyl)ethyl)urea, 2,4-diamino-6-(2'-methylimidazolyl-(1'))-ethyl-symmetric tris(imidazolyl), N,N'-bis(2-methyl-1-imidazolylethyl)urea, N,N'-(2-methyl-1-imidazolylethyl)-hexamethylenediamide, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4,5-dihydroxymethylimidazole. Examples of the above-mentioned acid anhydride include tetrahydrophthalic anhydride and ethylene glycol bis(anhydrotrimellitate). These thermosetting agents may be used alone or in combination of two or more.
作為上述熱硬化劑之中市售者,例如可列舉大塚化學公司製之熱硬化劑、Ajinomoto Fine-Techno公司製之熱硬化劑等。 作為上述大塚化學公司製之熱硬化劑,例如可列舉SDH、ADH等。 作為上述Ajinomoto Fine-Techno公司製之熱硬化劑,例如可列舉Ajicure VDH、Ajicure VDH-J、Ajicure UDH等。Examples of the thermosetting agents commercially available include thermosetting agents manufactured by Otsuka Chemical Co., Ltd. and thermosetting agents manufactured by Ajinomoto Fine-Techno Co., Ltd. Examples of the thermosetting agents manufactured by Otsuka Chemical Co., Ltd. include SDH and ADH. Examples of the thermosetting agents manufactured by Ajinomoto Fine-Techno Co., Ltd. include Ajicure VDH, Ajicure VDH-J, and Ajicure UDH.
上述熱硬化劑之含量相對於上述陽離子聚合性化合物100重量份,較佳下限為0.5重量份,較佳上限為30重量份。藉由上述熱硬化劑之含量為0.5重量份以上,使得所得到之有機EL顯示元件用密封劑為熱硬化性更加優異者。藉由上述熱硬化劑之含量為30重量份以下,使得所得到之有機EL顯示元件用密封劑為保存穩定性更加優異者,且使得硬化物為耐濕性更加優異者。上述熱硬化劑之含量的更佳下限為1重量份,更佳上限為15重量份。The content of the above-mentioned thermosetting agent is preferably 0.5 parts by weight and the upper limit is 30 parts by weight relative to 100 parts by weight of the above-mentioned cationic polymerizable compound. When the content of the above-mentioned thermosetting agent is 0.5 parts by weight or more, the obtained sealant for the organic EL display element has better thermosetting properties. When the content of the above-mentioned thermosetting agent is 30 parts by weight or less, the obtained sealant for the organic EL display element has better storage stability and the cured product has better moisture resistance. The better lower limit of the content of the above-mentioned thermosetting agent is 1 part by weight and the better upper limit is 15 parts by weight.
本發明之有機EL顯示元件用密封劑較佳含有穩定劑。藉由含有上述穩定劑,使得本發明之有機EL顯示元件用密封劑為保存穩定性更加優異者。The sealant for an organic EL display element of the present invention preferably contains a stabilizer. By containing the stabilizer, the sealant for an organic EL display element of the present invention has a more excellent storage stability.
作為上述穩定劑,可適用芳香族胺化合物。 作為上述芳香族胺化合物,例如可列舉苄基胺、胺苯酚型環氧樹脂等。 作為上述胺苯酚型環氧樹脂,可舉三環氧丙基對胺苯酚等。 其中,較佳為苄基胺。 此等之穩定劑可單獨使用,亦可將2種以上組合來使用。As the above-mentioned stabilizer, an aromatic amine compound can be used. As the above-mentioned aromatic amine compound, for example, benzylamine, amine phenol type epoxy resin, etc. can be listed. As the above-mentioned amine phenol type epoxy resin, triepoxypropyl para-aminophenol, etc. can be listed. Among them, benzylamine is preferred. These stabilizers can be used alone or in combination of two or more.
上述穩定劑之含量相對於上述陽離子聚合性化合物100重量份,較佳下限為0.001重量份,較佳上限為2重量份。藉由上述穩定劑之含量為此範圍,使得所得到之有機EL顯示元件用密封劑為在維持優異之硬化性下保存穩定性更加優異者。上述穩定劑之含量的更佳下限為0.005重量份,更佳上限為1重量份。The content of the stabilizer is preferably 0.001 parts by weight and 2 parts by weight relative to 100 parts by weight of the cationic polymerizable compound. When the content of the stabilizer is within this range, the obtained sealant for an organic EL display element has a better stability while maintaining excellent curability. The better lower limit of the content of the stabilizer is 0.005 parts by weight and the better upper limit is 1 part by weight.
本發明之有機EL顯示元件用密封劑亦可含有矽烷偶合劑。上述矽烷偶合劑具有提升本發明之有機EL顯示元件用密封劑與基板等之接著性的作用。The sealant for organic EL display element of the present invention may also contain a silane coupling agent. The silane coupling agent has the function of improving the adhesion between the sealant for organic EL display element of the present invention and a substrate or the like.
作為上述矽烷偶合劑,例如可列舉3-胺基丙基三甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-異氰酸酯丙基三甲氧基矽烷等。此等矽烷偶合劑可單獨使用,亦可將2種以上組合來使用。Examples of the silane coupling agent include 3-aminopropyltrimethoxysilane, 3-hydroxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatepropyltrimethoxysilane, etc. These silane coupling agents may be used alone or in combination of two or more.
上述矽烷偶合劑之含量相對於上述陽離子聚合性化合物100重量份,較佳下限為0.1重量份,較佳上限為10重量份。藉由上述矽烷偶合劑之含量為此範圍,以抑制剩餘之矽烷偶合劑溢出,且同時使提升接著性之效果更加優異。上述矽烷偶合劑之含量的更佳下限為0.5重量份,更佳上限為5重量份。 又,從低排氣性之觀點,上述矽烷偶合劑之含量相對於上述陽離子聚合性化合物100重量份,較佳上限為0.5重量份,更佳上限為0.1重量份,再更佳之上限為0.01重量份。The content of the above-mentioned silane coupling agent relative to 100 parts by weight of the above-mentioned cationic polymerizable compound is preferably 0.1 parts by weight and the upper limit is preferably 10 parts by weight. By setting the content of the above-mentioned silane coupling agent within this range, the overflow of the excess silane coupling agent can be suppressed, and at the same time, the effect of improving the adhesion can be made more excellent. The lower limit of the content of the above-mentioned silane coupling agent is more preferably 0.5 parts by weight, and the upper limit is more preferably 5 parts by weight. In addition, from the perspective of low outgassing, the content of the above-mentioned silane coupling agent relative to 100 parts by weight of the above-mentioned cationic polymerizable compound is preferably 0.5 parts by weight, more preferably 0.1 parts by weight, and even more preferably 0.01 parts by weight.
本發明之有機EL顯示元件用密封劑亦可進一步於不阻礙本發明之目的的範圍內,含有表面改質劑。藉由含有上述表面改質劑,可提升本發明之有機EL顯示元件用密封劑之塗膜的平坦性。 作為上述表面改質劑,例如可列舉界面活性劑或調平劑等。The sealant for the organic EL display element of the present invention may further contain a surface modifier within the scope that does not hinder the purpose of the present invention. By containing the above-mentioned surface modifier, the flatness of the coating film of the sealant for the organic EL display element of the present invention can be improved. As the above-mentioned surface modifier, for example, a surfactant or a leveling agent can be listed.
作為上述表面改質劑,例如可列舉聚矽氧系、丙烯酸系、氟系等者。 作為上述表面改質劑之中市售者,例如可列舉BYK-Chemie japan公司製之表面改質劑、AGC清美化學公司製之表面改質劑等。 作為上述BYK-Chemie japan公司製之表面改質劑,例如可列舉BYK-330、BYK-340、BYK-345等。 作為上述AGC清美化學公司製之表面改質劑,例如可舉Surflon S-611等。Examples of the surface modifier include silicone-based, acrylic-based, and fluorine-based agents. Among the surface modifiers listed above, commercially available agents include surface modifiers manufactured by BYK-Chemie Japan and surface modifiers manufactured by AGC Seimei Chemical Co., Ltd. Examples of surface modifiers manufactured by BYK-Chemie Japan include BYK-330, BYK-340, and BYK-345. Examples of surface modifiers manufactured by AGC Seimei Chemical Co., Ltd. include Surflon S-611.
本發明之有機EL顯示元件用密封劑亦可於不阻礙本發明之目的的範圍內,為了提升元件電極之耐久性,而含有與有機EL顯示元件用密封劑中所產生之酸反應的化合物或離子交換樹脂。The sealant for an organic EL display element of the present invention may also contain a compound or ion exchange resin that reacts with the acid generated in the sealant for an organic EL display element in order to improve the durability of the element electrode within the scope that does not hinder the purpose of the present invention.
作為上述與所產生之酸反應的化合物,可舉與酸中和之物質,例如鹼金屬之碳酸鹽或者碳酸氫鹽,或鹼土金屬之碳酸鹽或者碳酸氫鹽等。具體而言,例如可使用碳酸鈣、碳酸氫鈣、碳酸鈉、碳酸氫鈉等。As the compound that reacts with the generated acid, there can be mentioned substances that neutralize with the acid, such as carbonates or bicarbonates of alkali metals, or carbonates or bicarbonates of alkali earth metals, etc. Specifically, for example, calcium carbonate, calcium bicarbonate, sodium carbonate, sodium bicarbonate, etc. can be used.
作為上述離子交換樹脂,亦可使用陽離子交換型、陰離子交換型、兩性離子交換型之任一者,特別是可吸附氯化物離子之陽離子交換型或陰陽離子交換型為較適合。As the ion exchange resin, any of cation exchange type, anion exchange type, and zwitterionic ion exchange type can be used, and in particular, cation exchange type or anion-cation ion exchange type capable of adsorbing chloride ions is more suitable.
本發明之有機EL顯示元件用密封劑亦可為了調整黏度等而含有溶劑,但由於有可能發生因殘存之溶劑而導致有機發光材料層劣化或產生排氣等問題,故較佳為不含有溶劑,或溶劑之含量為0.05重量%以下。The sealant for the organic EL display element of the present invention may contain a solvent for adjusting the viscosity, etc., but since the residual solvent may cause the organic light-emitting material layer to deteriorate or produce outgassing, it is preferably free of solvent, or the solvent content is less than 0.05 weight %.
又,本發明之有機EL顯示元件用密封劑亦可視需要而含有硬化延遲劑、強化劑、軟化劑、塑化劑、黏度調節劑、紫外線吸收劑、抗氧化劑等公知的各種添加劑。Furthermore, the sealant for an organic EL display element of the present invention may contain various known additives such as a curing retarder, a reinforcing agent, a softener, a plasticizer, a viscosity regulator, an ultraviolet absorber, and an antioxidant as required.
本發明之有機EL顯示元件用密封劑使用E型黏度計於25℃、2.5rpm之條件下測得的黏度較佳上限為250Pa・s。藉由上述黏度為250Pa・s以下,使得所得到之有機EL顯示元件用密封劑為塗布性優異者。上述黏度之較佳上限為100Pa・s,更佳上限為10Pa・s。 又,上述黏度之較佳下限為5mPa・s。 上述黏度例如可使用VISCOMETER TV-22(東機產業公司製)作為E型黏度計,以CP1之錐板進行測定。The viscosity of the sealant for organic EL display elements of the present invention measured by an E-type viscometer at 25°C and 2.5 rpm preferably has an upper limit of 250 Pa·s. By keeping the viscosity below 250 Pa·s, the sealant for organic EL display elements obtained has excellent coating properties. The upper limit of the viscosity is preferably 100 Pa·s, and the upper limit is more preferably 10 Pa·s. In addition, the lower limit of the viscosity is preferably 5 mPa·s. The viscosity can be measured, for example, using VISCOMETER TV-22 (manufactured by Toki Sangyo Co., Ltd.) as an E-type viscometer and a cone plate of CP1.
關於本發明之有機EL顯示元件用密封劑,硬化物於25℃之鈉D線的折射率較佳下限為1.55。藉由上述折射率為此範圍,使得與電極或鈍化膜之折射率差變小,其結果,所得到之有機EL顯示元件成為光擷取效率優異者。上述折射率之更佳下限為1.56。 上述「鈉D線之折射率」可使用Abbe型折射計進行測定。 又,作為測定上述折射率之硬化物,例如可使用長度20mm、寬度10mm、厚度0.5~1mm左右之測定片。關於測定上述折射率之硬化物,若為熱硬化性密封劑,則可藉由以100℃加熱30分鐘而得,若為光熱硬化性密封劑,則可藉由在照射2000mJ/cm2 左右之紫外線後以100℃加熱30分鐘而得。Regarding the sealant for organic EL display elements of the present invention, the preferred lower limit of the refractive index of the cured product at the sodium D line at 25°C is 1.55. By setting the refractive index within this range, the refractive index difference with the electrode or passivation film becomes smaller, and as a result, the obtained organic EL display element has excellent light extraction efficiency. The more preferred lower limit of the refractive index is 1.56. The above-mentioned "refractive index of the sodium D line" can be measured using an Abbe refractometer. In addition, as a cured product for measuring the above-mentioned refractive index, for example, a measuring piece with a length of 20 mm, a width of 10 mm, and a thickness of about 0.5 to 1 mm can be used. The hardened material for measuring the refractive index can be obtained by heating at 100°C for 30 minutes if it is a thermosetting sealant, and by heating at 100°C for 30 minutes after irradiating with ultraviolet rays of about 2000mJ/ cm2 if it is a photothermosetting sealant.
本發明之有機EL顯示元件用密封劑,尤其適用作為將具有有機發光材料層之積層體被覆加以密封的面內密封劑。 又,本發明之有機EL顯示元件用密封劑適用於上發射型有機EL顯示元件之密封。The sealant for organic EL display elements of the present invention is particularly suitable as an in-plane sealant for covering and sealing a laminate having an organic light-emitting material layer. In addition, the sealant for organic EL display elements of the present invention is suitable for sealing top-emitting organic EL display elements.
作為使用本發明之有機EL顯示元件用密封劑將有機EL顯示元件加以密封的方法,例如可舉具有下述步驟之方法等:於有機EL顯示元件基板面,藉由印刷、分配法(dispense method)或噴墨法等,將本發明之有機EL顯示元件用密封劑塗布於基材,及藉由加熱及/或照光,使所塗布之有機EL顯示元件用密封劑硬化。As a method for sealing an organic EL display element using the sealant for an organic EL display element of the present invention, for example, there can be cited a method having the following steps: applying the sealant for an organic EL display element of the present invention to a substrate by printing, dispensing, or inkjet method, and curing the applied sealant for an organic EL display element by heating and/or irradiating with light.
於將本發明之有機EL顯示元件用密封劑塗布於基材的步驟中,本發明之有機EL顯示元件用密封劑可塗布於基材之整面,亦可塗布於基材之一部分。作為藉由塗布所形成之本發明之有機EL顯示元件用密封劑的密封部形狀,若為可保護具有有機發光材料層之積層體免受外界氣體侵襲的形狀,則並無特別限定,可為將該積層體完全被覆之形狀,亦可將封閉之圖案形成於該積層體之周邊部,或亦可將設有一部分開口部之形狀的圖案形成於該積層體之周邊部。In the step of applying the sealant for the organic EL display element of the present invention to the substrate, the sealant for the organic EL display element of the present invention may be applied to the entire surface of the substrate or may be applied to a portion of the substrate. The shape of the sealant for the organic EL display element of the present invention formed by applying is not particularly limited as long as it is a shape that can protect the laminate having the organic light-emitting material layer from the invasion of external gas. It may be a shape that completely covers the laminate, a closed pattern may be formed on the periphery of the laminate, or a pattern with a partially opened portion may be formed on the periphery of the laminate.
當藉由加熱使上述有機EL顯示元件用密封劑硬化之情形時,從減少對具有有機發光材料層之積層體的損害且同時充分使其硬化之觀點,較佳於50℃以上且120℃以下進行加熱。When the sealant for the organic EL display element is cured by heating, it is preferably heated at 50° C. or higher and 120° C. or lower in order to reduce damage to the laminate having the organic light-emitting material layer and to sufficiently cure the laminate.
當藉由照光使本發明之有機EL顯示元件用密封劑硬化的情形時,本發明之有機EL顯示元件用密封劑,可藉由照射300nm以上且400nm以下之波長及300mJ/cm2 以上3000mJ/cm2 以下之累積光量之光適當地使之硬化。When the sealant for the organic EL display element of the present invention is cured by irradiation with light, the sealant for the organic EL display element of the present invention can be appropriately cured by irradiating light with a wavelength of 300nm to 400nm and a cumulative light amount of 300mJ/ cm2 to 3000mJ/ cm2 .
作為使用於上述照光之光源,例如可列舉低壓水銀燈、中壓水銀燈、高壓水銀燈、超高壓水銀燈、準分子雷射、化學燈、黑光燈、微波激發水銀燈、金屬鹵素燈、鈉燈、鹵素燈、氙燈、LED燈、螢光燈、陽光、電子束照射裝置等。此等光源可單獨使用,亦可合併使用2種以上。 此等光源可配合上述光陽離子聚合起始劑之吸收波長作適當選擇。As the light source used for the above-mentioned illumination, for example, there can be listed low-pressure mercury lamp, medium-pressure mercury lamp, high-pressure mercury lamp, ultra-high-pressure mercury lamp, excimer laser, chemical lamp, black light lamp, microwave-excited mercury lamp, metal halogen lamp, sodium lamp, halogen lamp, xenon lamp, LED lamp, fluorescent lamp, sunlight, electron beam irradiation device, etc. These light sources can be used alone or in combination of two or more. These light sources can be appropriately selected in accordance with the absorption wavelength of the above-mentioned photo-cationic polymerization initiator.
作為對本發明之有機EL顯示元件用密封劑之光的照射手段,例如可列舉各種光源之同時照射、間隔時間差之逐次照射、同時照射與逐次照射之組合照射等,可使用任一照射手段。As means for irradiating the sealant for an organic EL display element of the present invention with light, for example, there can be cited simultaneous irradiation with various light sources, sequential irradiation with time intervals, and a combination of simultaneous irradiation and sequential irradiation, and any irradiation means can be used.
藉由以加熱及/或照光使上述有機EL顯示元件用密封劑硬化之步驟所得到的硬化物,亦可進一步經無機材料膜被覆。 作為構成上述無機材料膜之無機材料,可使用以往公知者,例如可列舉氮化矽(SiNx )或氧化矽(SiOx )等。上述無機材料膜可為由1層構成者,亦可為將複數種之層加以積層而成者。又,亦可將上述無機材料膜與由本發明之有機EL顯示元件用密封劑構成之樹脂膜交替重複而被覆上述積層體。The cured product obtained by the step of curing the sealant for the organic EL display element by heating and/or irradiating with light may be further coated with an inorganic material film. As the inorganic material constituting the inorganic material film, conventionally known materials may be used, such as silicon nitride ( SiNx ) or silicon oxide ( SiOx ). The inorganic material film may be composed of a single layer or may be a laminate of multiple layers. Furthermore, the laminate may be coated with the inorganic material film and the resin film composed of the sealant for the organic EL display element of the present invention by alternating and repeating.
製造上述有機EL顯示元件之方法,亦可具有將塗布有本發明之有機EL顯示元件用密封劑的基材(以下,亦稱為「一基材」)與另一基材貼合之步驟。 塗布本發明之有機EL顯示元件用密封劑的基材(以下,亦稱為「一基材」),可為形成有具有有機發光材料層之積層體的基材,亦可為未形成有該積層體的基材。 當上述一基材為上述未形成有積層體之基材的情形時,於貼合上述另一基材時,以可保護上述積層體免受外界氣體侵襲之方式將本發明之有機EL顯示元件用密封劑塗布於上述一基材即可。亦即,可於貼合另一基材時,塗布於成為上述積層體之位置處整面,或於貼合另一基材時,將封閉之圖案的密封劑部形成為完全圍繞住成為上述積層體之位置處的形狀。 又,作為密封上述有機EL顯示元件之方法,可使用所謂之圍堰填充(dam fill)密封的方法。亦即,首先以圍繞顯示部周緣之方式將硬化性糊塗布於有機EL顯示元件之基板上。接著,將本發明之有機EL顯示元件用密封劑塗布於所塗布之硬化性糊的內側,藉由周緣之硬化性糊來防止密封劑溢出,且同時將對向之密封基板貼合。然後,可使用藉由加熱及/或照光使周緣之硬化性糊與被擠壓擴散至內側的本發明之有機EL顯示元件用密封劑硬化的方法。The method for manufacturing the above-mentioned organic EL display element may also include a step of bonding a substrate coated with the sealant for organic EL display element of the present invention (hereinafter, also referred to as "a substrate") to another substrate. The substrate coated with the sealant for organic EL display element of the present invention (hereinafter, also referred to as "a substrate") may be a substrate having a laminate having an organic light-emitting material layer formed thereon, or may be a substrate not having the laminate formed thereon. When the above-mentioned one substrate is the above-mentioned substrate not having a laminate formed thereon, when bonding the above-mentioned other substrate, the sealant for organic EL display element of the present invention may be applied to the above-mentioned one substrate in a manner that can protect the above-mentioned laminate from external gas attack. That is, when bonding another substrate, the sealant portion of the closed pattern can be applied to the entire surface of the position to be the above-mentioned laminate, or when bonding another substrate, the sealant portion of the closed pattern can be formed into a shape that completely surrounds the position to be the above-mentioned laminate. In addition, as a method for sealing the above-mentioned organic EL display element, a so-called dam fill sealing method can be used. That is, first, a curable paste is applied to the substrate of the organic EL display element in a manner surrounding the periphery of the display portion. Then, the organic EL display element of the present invention is coated with a sealant on the inner side of the applied curable paste, and the sealant is prevented from overflowing by the peripheral curable paste, and at the same time, the opposite sealing substrate is bonded. Then, a method of curing the curable paste at the periphery and the sealant for an organic EL display element of the present invention that has been squeezed and diffused to the inside can be used by heating and/or irradiating light.
藉由加熱及/或照光使上述有機EL顯示元件用密封劑硬化之步驟,可於將上述一基材與上述另一基材貼合之步驟前進行,亦可於將上述一基材與上述另一基材貼合之步驟後進行。 當於將上述一基材與上述另一基材貼合之步驟前進行藉由加熱及/或照光使上述有機EL顯示元件用密封劑硬化之步驟的情形時,本發明之有機EL顯示元件用密封劑較佳為加熱及/或照光後至硬化反應進行而無法接著之可使用時間在1分鐘以上。藉由上述可使用時間在1分鐘以上,可於將上述一基材與上述另一基材貼合前,在硬化不過度進行下,得到更高之接著強度。The step of curing the sealant for the organic EL display element by heating and/or irradiation can be performed before or after the step of laminating the one substrate to the other substrate. When the step of curing the sealant for the organic EL display element by heating and/or irradiation is performed before the step of laminating the one substrate to the other substrate, the sealant for the organic EL display element of the present invention is preferably usable for more than 1 minute after heating and/or irradiation until the curing reaction proceeds and the sealant cannot be continued. By having the usable time of more than 1 minute, a higher bonding strength can be obtained without excessive curing before laminating the one substrate to the other substrate.
於將上述一基材與上述另一基材貼合之步驟中,使上述一基材與上述另一基材貼合之方法並無特別限定,較佳於減壓環境下貼合。 上述減壓環境下之真空度的較佳下限為0.01kPa,較佳上限為10kPa。藉由上述減壓環境下之真空度為此範圍,而可不會因真空裝置之氣密性與真空泵之能力而花費很長時間於達成真空狀態,更有效率地將貼合上述一基材與上述另一基材時之本發明之有機EL顯示元件用密封劑中的氣泡去除。 [發明之效果]In the step of bonding the one substrate to the other substrate, the method of bonding the one substrate to the other substrate is not particularly limited, and it is preferred to bond them in a reduced pressure environment. The preferred lower limit of the vacuum degree in the reduced pressure environment is 0.01 kPa, and the preferred upper limit is 10 kPa. By setting the vacuum degree in the reduced pressure environment to this range, it is possible to more efficiently remove bubbles in the sealant for the organic EL display element of the present invention when bonding the one substrate to the other substrate without taking a long time to achieve a vacuum state due to the airtightness of the vacuum device and the capacity of the vacuum pump. [Effect of the invention]
若根據本發明,可提供一種低排氣性及塗布性優異,且能得到光擷取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。According to the present invention, a sealant for an organic EL display element can be provided which has low outgassing properties, excellent coating properties, and can obtain an organic EL display element with excellent light extraction efficiency.
以下揭示實施例進一步詳細說明本發明,但本發明並不限定於此等實施例。The following disclosed embodiments further illustrate the present invention in detail, but the present invention is not limited to these embodiments.
(實施例1~14,比較例1~3) 根據表1~3記載之摻合比,使用攪拌混合機以攪拌速度2000rpm將各材料攪拌混合,藉此製作實施例1~14、比較例1~3之各有機EL顯示元件用密封劑。作為攪拌混合機,係使用AR-250(新基公司製)。(Examples 1 to 14, Comparative Examples 1 to 3) The materials were stirred and mixed at a stirring speed of 2000 rpm using a stirring mixer according to the blending ratios listed in Tables 1 to 3, thereby preparing the sealing agents for the organic EL display elements of Examples 1 to 14 and Comparative Examples 1 to 3. AR-250 (manufactured by Shinki Corporation) was used as the stirring mixer.
<評價> 對於實施例及比較例所得到之各有機EL顯示元件用密封劑進行以下之評價。將結果表示於表1~3。<Evaluation> The following evaluation was performed on each of the sealants for organic EL display elements obtained in the examples and comparative examples. The results are shown in Tables 1 to 3.
(1)黏度 對於實施例及比較例所得到之各有機EL顯示元件用密封劑,使用E型黏度計,測定於25℃、2.5rpm之條件下的黏度。作為E型黏度計,係使用VISCOMETER TV-22(東機產業公司製)。 另,比較例2所得到之有機EL顯示元件用密封劑由於在25℃為固態,故無法進行黏度之測定。(1) Viscosity The viscosity of each organic EL display element sealant obtained in the embodiment and the comparative example was measured at 25°C and 2.5 rpm using an E-type viscometer. VISCOMETER TV-22 (manufactured by Toki Sangyo Co., Ltd.) was used as the E-type viscometer. In addition, the viscosity of the organic EL display element sealant obtained in Comparative Example 2 could not be measured because it was solid at 25°C.
(2)保存穩定性 對實施例及比較例所得到之各有機EL顯示元件用密封劑,使用E型黏度計,於25℃測定剛製造後之初期黏度與測定以25℃保管1週後之黏度,導出(以25℃保管1週後之黏度)/(初期黏度)作為黏度變化率。作為E型黏度計,係使用VISCOMETER TV-22(東機產業公司製)。 使黏度變化率未達1.2之情形為「◎」,1.2以上但未達1.5之情形為「○」,1.5以上但未達2.0之情形為「△」,2.0以上之情形為「×」,來評價保存穩定性。 另,比較例2所得到之有機EL顯示元件用密封劑由於在25℃為固態,故無法進行保存穩定性之評價。(2) Storage stability For each sealant for an organic EL display element obtained in the embodiment and the comparative example, the initial viscosity immediately after manufacture and the viscosity after storage at 25°C for one week were measured at 25°C using an E-type viscometer, and (viscosity after storage at 25°C for one week)/(initial viscosity) was derived as the viscosity change rate. As an E-type viscometer, VISCOMETER TV-22 (manufactured by Toki Sangyo Co., Ltd.) was used. The storage stability was evaluated by assigning "◎" to a viscosity change rate of less than 1.2, "○" to a viscosity change rate of 1.2 or more but less than 1.5, "△" to a viscosity change rate of 1.5 or more but less than 2.0, and "×" to a viscosity change rate of 2.0 or more. In addition, since the sealant for an organic EL display element obtained in Comparative Example 2 is solid at 25°C, the storage stability cannot be evaluated.
(3)塗布性 對實施例及比較例所得到之各有機EL顯示元件用密封劑100重量份,加入平均粒徑10μm之聚合物珠粒0.3重量份,藉由行星式攪拌裝置使之均勻分散。作為聚合物珠粒,係使用Micro pearl SP(積水化學工業公司製)。準備2片長度5cm,寬度5cm之玻璃基板,將所得到之分散液0.1mL置於其中一片玻璃基板之中央部,重疊另一片玻璃基板。將100g之砝碼置於另一片玻璃基板上,擠壓擴散密封劑,放置於60℃之熱板上10分鐘後,將砝碼去除,測定在玻璃基板間滲暈之直徑。使該直徑為30mm以上之情形為「◎」,25mm以上但未達30mm之情形為「○」,20mm以上但未達25mm之情形為「△」,未達20mm之情形為「×」,來評價塗布性。(3) Coating properties For each of the 100 parts by weight of the sealant for the organic EL display element obtained in the embodiment and the comparative example, 0.3 parts by weight of polymer beads with an average particle size of 10 μm were added and uniformly dispersed using a planetary stirring device. Micro pearl SP (manufactured by Sekisui Chemical Industries) was used as the polymer beads. Two glass substrates with a length of 5 cm and a width of 5 cm were prepared, and 0.1 mL of the obtained dispersion was placed in the center of one of the glass substrates and overlapped with the other glass substrate. A 100 g weight was placed on the other glass substrate to squeeze and diffuse the sealant, and after being placed on a hot plate at 60°C for 10 minutes, the weight was removed and the diameter of the diffusion between the glass substrates was measured. The coating properties were evaluated by marking "◎" for a diameter of 30 mm or more, "○" for a diameter of 25 mm or more but less than 30 mm, "△" for a diameter of 20 mm or more but less than 25 mm, and "×" for a diameter less than 20 mm.
(4)硬化性 對實施例及比較例所得到之各有機EL顯示元件用密封劑,以100℃加熱30分鐘使之硬化,使用紅外線光譜儀測定此時之環氧基的反應率(來自環氧基之波峰的減少率)。另,對實施例13所得到之有機EL顯示元件用密封劑,使用UV-LED照射波長365nm之紫外線1500mJ/cm2 後,以90℃加熱30分鐘使之硬化。作為紅外線光譜儀,係使用UMA600(安捷倫科技公司製)。 使環氧基之反應率為90%以上的情形為「◎」,80%以上但未達90%之情形為「○」,60%以上但未達80%之情形為「△」,未達60%之情形為「×」,來評價硬化性。(4) Curability The encapsulants for organic EL display elements obtained in the examples and comparative examples were cured by heating at 100°C for 30 minutes, and the reaction rate of the epoxy group (the reduction rate of the peak from the epoxy group) at that time was measured using an infrared spectrometer. In addition, the encapsulant for organic EL display elements obtained in Example 13 was cured by irradiating the encapsulant with ultraviolet light of 1500 mJ/ cm2 at a wavelength of 365 nm using a UV-LED. The encapsulant was then cured by heating at 90°C for 30 minutes. As the infrared spectrometer, UMA600 (manufactured by Agilent Technologies) was used. The curability was evaluated by making the case where the reaction rate of the epoxy group was 90% or more "◎", the case where it was 80% or more but less than 90% "○", the case where it was 60% or more but less than 80% "△", and the case where it was less than 60% "×".
(5)折射率及光擷取效率 將厚度1mm之矽氧橡膠片挖出成長度20mm、寬度10mm的長方形,製作模具。將此模具放置於離型PET膜上,將實施例及比較例所得到之各有機EL顯示元件用密封劑填充於模具中後,以不殘留氣泡之方式用另1片離型PET膜覆蓋而得到積層體。將所得到之積層體夾入於2片玻璃板加以固定,於100℃之烘箱加熱30分鐘,藉此使密封劑硬化後,將PET膜剝離,從矽氧橡膠片取出密封劑之硬化物,而得到長度10mm,寬度20mm,厚度1mm之試驗片。另,對實施例13所得到之有機EL顯示元件用密封劑,使用UV-LED,照射波長365nm之紫外線1500mJ/cm2 後,以90℃加熱30分鐘使之硬化。對所得到之試驗片,使用Abbe型折射計,測定於25℃之鈉D線的折射率。作為Abbe型折射計,係使用NAR-4T(愛宕公司製)。 又,考慮與電極或鈍化膜之折射率差,使折射率為1.55以上之情形為「○」,1.53以上但未達1.55之情形為「△」,未達1.53之情形為「×」,來評價光擷取效率。(5) Refractive index and light extraction efficiency A 1 mm thick silicone rubber sheet was hollowed out into a rectangular shape of 20 mm in length and 10 mm in width to prepare a mold. This mold was placed on a release PET film, and each organic EL display element obtained in the embodiment and the comparative example was filled into the mold with a sealant. The mold was then covered with another release PET film in a manner that did not leave any bubbles to obtain a laminate. The obtained laminate was sandwiched between two glass plates and fixed. The sealant was cured by heating in an oven at 100°C for 30 minutes. The PET film was then peeled off and the cured sealant was taken out from the silicone rubber sheet to obtain a test piece of 10 mm in length, 20 mm in width and 1 mm in thickness. In addition, the sealant for the organic EL display element obtained in Example 13 was irradiated with 1500mJ/ cm2 of ultraviolet light with a wavelength of 365nm using a UV-LED, and then heated at 90°C for 30 minutes to cure. The refractive index of the obtained test piece was measured at 25°C using an Abbe refractometer. As the Abbe refractometer, NAR-4T (manufactured by Atago Co., Ltd.) was used. In addition, considering the refractive index difference with the electrode or the passivated film, the case where the refractive index is 1.55 or more is "○", the case where it is 1.53 or more but less than 1.55 is "△", and the case where it is less than 1.53 is "×" to evaluate the light extraction efficiency.
(6)低排氣性 將實施例及比較例所得到之各有機EL顯示元件用密封劑計量300mg封入於小玻璃瓶(vial bottle)中後,以100℃進行加熱30分鐘使之硬化。另,對實施例13所得到之有機EL顯示元件用密封劑,使用UV-LED照射波長365nm之紫外線1500mJ/cm2 後,以90℃加熱30分鐘使之硬化。並且將此小玻璃瓶於85℃之恆溫烘箱加熱100小時,使用氣相層析質譜儀測定小玻璃瓶中之氣化成分量。作為氣相層析質譜儀,係使用JMS-Q1050(日本電子公司製)。 使氣化成分量未達50ppm之情形為「○」,50ppm以上但未達100ppm之情形為「△」,100ppm以上之情形為「×」,來評價低排氣性。(6) Low outgassing property 300 mg of each organic EL display element sealant obtained in the examples and comparative examples was sealed in a vial, and then heated at 100°C for 30 minutes to cure. In addition, the organic EL display element sealant obtained in Example 13 was irradiated with 1500 mJ/ cm2 of ultraviolet light with a wavelength of 365 nm using a UV-LED, and then heated at 90°C for 30 minutes to cure. The vial was heated in a constant temperature oven at 85°C for 100 hours, and the amount of vaporized components in the vial was measured using a gas chromatography mass spectrometer. As a gas chromatography mass spectrometer, JMS-Q1050 (manufactured by NEC Corporation) was used. The low outgassing property was evaluated by marking "○" for a gasification component amount of less than 50 ppm, "△" for a gasification component amount of 50 ppm or more but less than 100 ppm, and "×" for a gasification component amount of more than 100 ppm.
[表1]
[表2]
[表3]
若根據本發明,可提供一種低排氣性及塗布性優異,且能得到光擷取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。According to the present invention, a sealant for an organic EL display element can be provided which has low outgassing properties, excellent coating properties, and can obtain an organic EL display element with excellent light extraction efficiency.
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