TWI733525B - Vapor chamber wick structure element and manufacturing method thereof - Google Patents

Abstract

A vapor chamber wick structure element includes a first metal sheet and a wick structure layer. The first metal sheet has an upper surface and the upper surface has a grooved structure. The wick structure layer is formed in the groove structure, and the wick structure layer has a first wick structure and a second wick structure. The first wick structure is formed by sintering a first spherical copper powder, and the second wick structure is formed by sintering mixed a second spherical copper powder and a thin sheet copper powder. The vapor chamber wick structure element of the present invention includes two different wick structures, thereby improving the efficiency of the liquid phase and the gas phase circulation of the working fluid in the thin vapor chamber, and further improving heat liberation and heat conduction capability of the vapor chamber. The invention also discloses a manufacturing method thereof.

Description

Capillary structure element of uniform temperature plate and manufacturing method thereof

A temperature equalizing plate element structure, in particular, a capillary structure element of a temperature equalizing plate with a capillary structure, which is used for sealing and processing with a second metal sheet to form a thin equalizing plate element.

The temperature equalizing plate is used for dissipating heat and cooling, and it is a flat closed cavity. The inner wall of the closed cavity has a capillary structure and contains a working fluid. The working principle of the equalizing plate is that when part of the equalizing plate is in contact with the heat source, the working fluid near the Evaporator in the closed cavity of the equalizing plate will absorb the heat energy of the heat source and cause it to boil and change from liquid phase to liquid phase. The gas phase releases latent heat and flows quickly to the condenser. When the working fluid in the gas phase flows to the condensing area in the closed cavity away from the heat source, the working fluid changes from the gas phase to the liquid phase, and returns to the heat absorption end by the capillary force of the capillary structure. Through the phase change and conduction of the above-mentioned working fluid, the uniform temperature plate achieves the function of heat dissipation and cooling of the hot spot.

The continuous high-porosity capillary structure formed by using copper slurry in the groove of the copper sheet in the uniform temperature plate of the present invention to be heated, baked and sintered is a novel technical concept. The shape and composition of the copper powder particles that form the capillary structure affect the horizontal transmission speed of the liquid phase of the working fluid and the vertical escape speed of the gas phase. The capillary structure of a single structure is not easy to meet the optimization requirements of the horizontal liquid phase transportation and the vertical upward gas phase transportation of the working fluid at the same time, so that the uniform temperature plate achieves the optimized heat conduction function. Therefore, how to make the working fluid in the uniform temperature plate level in the capillary structure The optimization of the liquid phase transportation in the direction and the vertical upward vaporization transportation at the heating end is a problem that needs to be solved in the production of high-efficiency ultra-thin uniform temperature plates.

In view of this, the present invention provides a capillary structure element of a uniform temperature plate and a manufacturing method thereof. The capillary structure element of the uniform temperature plate of the present invention is used to form a thin-type uniform temperature plate (Vapor Chamber) after the sealing process with the second metal sheet. The capillary structure element of the temperature equalizing plate includes a first metal sheet and a Wick Structure layer. The first metal sheet has an upper surface, and the upper surface has a groove structure. The capillary structure layer is formed in the groove structure, and the capillary structure layer has continuity and porosity. The capillary structure layer has a first capillary structure and a second capillary structure. The first capillary structure includes a first type of spherical copper powder formed by sintering. The second capillary structure comprises a mixed second type of spherical copper powder and thin flake copper powder formed by sintering. Among them, the first capillary structure is located at the heat-absorbing end of the thin-type uniform temperature plate.

Wherein, the content of the first type spherical copper powder in the first capillary structure is greater than 90%.

Wherein, the content of the thin flake copper powder in the second capillary structure is greater than 15%.

Wherein, the first metal sheet may contain at least one of copper and copper alloy.

Among them, the first type of spherical copper powder can be obtained by heating and baking the first copper paste to remove the organic solvent and polymer contained in the first copper paste. The mixed second type of spherical copper powder and thin flake copper powder can be obtained by heating and baking the second copper paste to remove the organic solvent and polymer contained in the second copper paste.

Among them, the capillary structure layer is a porous structure.

Among them, the capillary structure layer is a continuous structure.

Another category of the present invention is to provide a capillary structure element of the uniform temperature plate The manufacturing method includes the following steps: providing a first metal sheet with a trench structure, wherein the trench structure has a first area and a second area; providing a first copper paste and a second copper paste; laying the first copper The slurry is in the first area; the second copper slurry is laid on the second area; the first copper slurry is heated to solidify; the second copper slurry is heated to solidify; the cured first copper slurry is baked and carried out Sintering to form the first capillary structure located in the first area; baking the solidified second copper paste and sintering to form the second capillary structure located in the second area. Wherein, the first capillary structure and the second capillary structure are continuous structures. The first copper paste includes a first type of spherical copper powder, an organic solvent, and a polymer, and the second copper paste includes a second type of spherical copper powder, a thin flake copper powder, an organic solvent, and a polymer.

Compared with the prior art, the capillary structure element of the uniform temperature plate of the present invention is provided with two microscopically different capillary structures in the groove structure on the upper surface of the first metal sheet, and the working fluid is used in the two different capillary structures The vertical vaporization mechanism is different from the horizontal liquid transport mechanism. The capillary structure elements of the thermal conductive plate formed by the two microscopically different capillary structures improve the efficiency of the liquid and vapor circulation of the working fluid in the thin uniform temperature plate. Improved the anti-heat and heat conduction functions of the thin-type uniform temperature plate.

V: Thin-type uniform temperature plate

1: Capillary structure elements

11: The first metal sheet

111: upper surface

112: groove structure

1121: The first area

1122: second area

12: Capillary structure layer

121: The first capillary structure

1211: The first type of spherical copper powder

122: second capillary structure

1221: The second type of spherical copper powder

1222: thin flake copper powder

131: The first copper paste

132: The second copper paste

2: The second metal sheet

3: Vacuum chamber

41: Endothermic

42: Condensing side

5: Airflow channel

H: heat source

S1-S52: steps

Fig. 1 is a top view of a capillary structure element of a temperature equalization plate according to a specific embodiment of the present invention.

FIG. 2 is a cross-sectional view of a capillary structure element of a temperature equalization plate according to a specific embodiment of the present invention.

FIG. 3 is a schematic diagram showing the circulation of the working fluid of the thin-type uniform temperature plate according to an embodiment of the present invention.

Fig. 3A and Fig. 3B respectively show a partial enlarged schematic diagram of Fig. 3.

FIG. 4 is a flowchart showing the steps of a method for manufacturing a capillary structure element of a temperature equalizing plate according to a specific embodiment of the present invention.

FIG. 5 is a flow chart showing the steps of a method for manufacturing a capillary structure element of a temperature equalizing plate according to another embodiment of the present invention.

6A to 6D are schematic diagrams according to FIG. 5.

FIG. 7 is a flow chart showing the steps of a method for manufacturing a capillary structure element of a uniform temperature plate according to another embodiment of the present invention.

8A to 8E are schematic diagrams according to FIG. 7.

In order to make the advantages, spirit and characteristics of the present invention easier and clearer to understand, the following will use specific embodiments and refer to the accompanying drawings for detailed and discussion. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, each device in the figure is only used to express its relative position and is not drawn according to its actual scale, which is explained first.

Please refer to FIGS. 1 and 2. FIG. 1 shows a top view of a capillary structure element 1 of a temperature equalization plate according to an embodiment of the present invention, and FIG. 2 shows a capillary structure of a temperature equalization plate according to an embodiment of the present invention. Sectional view of structural element 1. For the convenience of description, the subsequent drawings are drawn in accordance with the cross-sectional method of the A-A' cross-sectional line in FIG. 1. As shown in FIGS. 1 and 2, the capillary structure element 1 of the uniform temperature plate of the present invention includes a first metal sheet 11 and a capillary structure layer 12. The first metal sheet 11 has an upper surface 111, and the upper surface 111 has a groove structure 112. The capillary structure layer 12 is formed in the trench structure 112. The capillary structure layer 12 is a continuous structure located in the groove structure 112, so that the working fluid can move in the groove structure 112 by using the capillary structure layer 12. In addition, the capillary structure layer 12 has a porous structure so that the capillary The structure layer 12 provides working fluid to move in the capillary structure layer 12 by capillary action.

Please refer to FIG. 3, FIG. 3A and FIG. 3B together. FIG. 3 is a schematic diagram showing the circulation of the working fluid of the thin-type uniform temperature plate V according to a specific embodiment of the present invention. FIG. 3A and FIG. 3B respectively show the Partially enlarged schematic. The capillary structure element 1 of the temperature uniform plate and the second metal sheet 2 of the present invention are sealed and processed to form a thin uniform temperature plate V. The thin plate V has a vacuum chamber 3 formed between the first metal sheet 11 and the second metal sheet 2. The vacuum chamber 3 serves as an air passage, and the capillary structure layer 12 contains a working fluid. The working fluid transfers heat energy in the way of liquid phase and gas phase cyclic transformation, and then achieves the effect of rapid heat conduction. As shown in FIGS. 1 to 3, the trench structure 112 can be divided into a first region 1121 and a second region 1122. In a specific embodiment, the first region 1121 is located at the heat-absorbing end 41 of the thin-shaped temperature equalizing plate V, namely Close to one end of the heat source H. In another specific embodiment, in the specific embodiment shown in FIG. 3, the first area 1121 is located at the heat-absorbing end 41 of the thin-type uniform temperature plate V, and is also located at the condensation end 42 of the thin-type uniform temperature plate V, that is, far away from the heat source H One end. The second region 1122 is a region other than the first region 1121. In the specific embodiment shown in FIG. 3, the second region 1122 is located between the heat absorbing end 41 and the condensing end 42 of the thin uniform temperature plate V.

The capillary structure layer 12 located in the groove structure 112 has a first capillary structure 121 and a second capillary structure 122. The first capillary structure 121 includes a first type spherical copper powder 1211 formed by sintering. The second capillary structure 122 includes a mixed second-type spherical copper powder 1221 and a thin flake copper powder 1222 formed by sintering. In the specific embodiment of FIG. 3, the first capillary structure 121 is located in the first area 1121, and the second capillary structure 122 is located in the second area 1122. Please refer to FIG. 3A. For clarity, the vertical direction described below is the direction in which the thin-shaped uniform temperature plate V is perpendicular to the heat source H, and the parallel direction is the direction in which the thin-shaped uniform temperature plate V is parallel to the heat source H. The first capillary structure 121 in the first region 1121 is composed of the first type of spherical copper powder 1211 after sintering, and the working fluid is applied to the first hair The flow rates in the vertical direction and the parallel direction in the fine structure 121 are similar, and are not affected by the composition structure of the first capillary structure 121. However, the second capillary structure 122 in the second area 42 is formed by mixing the second type of spherical copper powder 1221 and the thin flake copper powder 1222 after sintering. Due to the lateral printing and laying method and the influence of the shape of the copper powder As a result, the thin flake copper powder 1222 in the second capillary structure 122 is mostly stacked with the second type spherical copper powder 1221 in a parallel direction. As shown in the enlarged view of the second capillary structure 122 in FIG. 3B, the capillary structure layer 12 of such a stacked structure facilitates the rapid transportation of the working fluid in the horizontal direction, but if it is located at the heating end, it will not be conducive to the working fluid after gasification. The submerged zone will be released vertically upwards. Therefore, the first capillary structure 121 is used to replace the second capillary structure 122 at the heat-absorbing end.

Please refer to the arrow indication in Figure 3. The arrow is the moving direction of the working fluid. When the working fluid absorbs the heat energy transferred from the heat source H to the heat-absorbing end 41 of the thin uniform temperature plate V, the working fluid transforms from the liquid phase to the gas phase, and moves vertically from the first capillary structure 121 to the capillary structure 12 and the second metal plate 2 Between the air flow channel 5. Then, the working fluid in the gas phase flows to the condensing end 42 through the gas flow channel 5. In the process of flowing to the condensing end 42, the working fluid exchanges heat with the external environment through heat conduction to release heat, then transforms from the gaseous phase to the liquid phase at the condensing end 42 and moves vertically from the air flow channel 5 into the first capillary of the condensing end 42 Structure 121. Due to the continuity and porosity of the capillary structure 12, the working fluid flows from the first capillary structure 121 of the condensing end 42 through the second capillary structure 122 by capillary action and then reaches the first capillary structure 121 of the heat absorption end 41. In this way, it is the complete heat conduction cycle of the working fluid.

Compared with the capillary structure formed by single copper powder sintering, copper mesh, copper wire, or composite structure, the capillary structure element 1 of the uniform temperature plate of the present invention is designed with different capillary structures 12, so that the gas and liquid phases are The working fluid can move quickly to accelerate the heat transfer rate.

In summary, the composite capillary structure layer 12 of the present invention has an impact on the gas of the working fluid. The phase and liquid phase transport mechanism is not achievable by the capillary structure formed by the sintering of copper powder and the copper mesh structure.

Among them, those skilled in the art can adjust the content of the first type spherical copper powder 1211 in the first capillary structure 121 according to the manufacturing process or their respective requirements. When the content of the spherical copper powder 1211 of the first type is 100% (as in the aforementioned specific embodiment), the vertical and parallel pore structures of the working fluid in the first capillary structure 121 are almost the same. When the content of the spherical copper powder 1211 of the first type decreases, the vertical and parallel porosity of the working fluid in the first capillary structure 121 will be affected by the powders added in other shapes. If the other powder added to the first capillary structure 121 is a thin flake copper powder 1222, the flow rate of the working fluid in the parallel direction in the first capillary structure 121 will be increased, and the vaporization rate in the vertical direction will be reduced. . However, in order to maintain the effect brought by the first capillary structure 121 in the present invention, the content of the first type spherical copper powder 1211 needs to be greater than 90%.

In the same way, the addition ratio of the second type spherical copper powder 1221 and the thin flake copper powder 1222 in the second capillary structure 122 can also be adjusted by those skilled in the art according to the manufacturing process or their respective requirements. When the content of the thin flake copper powder 1222 mixed in the second capillary structure 122 changes, the flow rate of the working fluid in the parallel direction in the second capillary structure 122 also changes. However, if the content of the second type of spherical copper powder 1221 is too low, the thin flake copper powders 1222 will also be stacked too densely, resulting in too small flow porosity of the working fluid, and on the contrary, the flow rate of the working fluid is reduced. In a specific embodiment, the content of the thin flake copper powder 1222 in the second capillary structure 122 needs to be greater than 15%, and the appropriate addition range is between 15% and 50%.

In addition, it should be understood that the above-mentioned first area 1121 and second area 1122 are not limited to the positions depicted in the figure. Those skilled in the art can use the first capillary structure 121 and the second capillary structure 122 according to the present invention. The working principle of the working fluid to design the first area 1121 The position with the second area 1122 is not limited to this.

Please refer to FIG. 4. FIG. 4 is a flow chart of the manufacturing method of the capillary structure element 1 of the uniform temperature plate according to a specific embodiment of the present invention. As shown in FIG. 4, the method for manufacturing the capillary structure element 1 of the temperature equalizing plate of the present invention includes the following steps: Step S1: Provide a first metal sheet 11 having a groove structure 112, wherein the groove structure 112 has a first Area 1121 and the second area 1122; Step S2: Provide the first copper paste 131 and the second copper paste 132; Step S31: Lay the first copper paste 131 on the first region 1121; Step S32: Lay the second copper paste The material 132 is in the second area 1122; Step S41: Heating the first copper paste 131 to cure; Step S42: Heating the second copper paste 132 to cure; Step S51: Baking the cured first copper paste 131 And sintering is performed to form the first capillary structure 121 located in the first region 1121; Step S52: the cured second copper paste 132 is baked and sintered to form the second capillary structure 122 located in the second region 1122. Among them, the first capillary structure 121 and the second capillary structure 122 are continuous structures, and the first capillary structure 121 and the second capillary structure 122 are closely connected to achieve continuity, so that the working fluid can move to the first capillary structure by capillary action. Between the capillary structure 121 and the second capillary structure 122. In the embodiment shown in FIG. 4, step S31 and step S32 can be performed at the same time, step S41 and step S42 can be performed at the same time, and step S51 and step S52 can be performed at the same time to complete the uniform temperature plate capillary structure element 1.

Wherein, the first metal sheet 11 includes at least one of copper and copper-gold. The first copper paste 131 includes a first type of spherical copper powder 1211, an organic solvent and a polymer, and the second copper paste 132 includes a second type of spherical copper powder 1221, a thin flake copper powder 1222, and an organic Solvents and polymers. When heating and baking, the organic solvents and polymers in the first copper paste 131 and the second copper paste 132 will be removed first, and then continue to be heated to the first type of spherical copper powder 1211 and the second type of spherical copper The powder 1221 and the thin flake copper powder 1222 are sintered into the first capillary structure 121 and the second capillary structure, respectively. Structure 122. The organic solvent and the polymer form a colloid, which is used to disperse and suspend copper powder to form a copper paste, so as to be laid in the groove structure 112 of the first metal sheet 11 and processed into a capillary structure layer 12 .

Please refer to FIGS. 5 and 6A to 6D. FIG. 5 shows a flow chart of the method for manufacturing the capillary structure element 1 of the uniform temperature plate according to another specific embodiment of the present invention. FIGS. 6A to 6D are diagrams based on Figure 5 is a schematic diagram. In practical applications, as shown in FIGS. 5 and 6A to 6D, the capillary structure layer 12 can be formed by steel plate printing. Steps S31 and S32 are sequentially performed to combine the first copper paste 131 and the second copper paste 131 with the second copper paste. The slurry 132 is laid in the trench structure 112. At this time, since the first copper paste 131 and the second copper paste 132 have fluidity, they can be tightly combined at the junction of the first copper paste 131 and the second copper paste 132, and then the steps S41 and S41 are performed simultaneously. Step S42, and simultaneously perform step S51 and step S52, to form a continuous capillary structure layer 12 after heating, baking and sintering. It should be noted that the laying order of the first copper paste 131 and the second copper paste 132 is not limited to this.

Please refer to FIGS. 7 and 8A to 8E. FIG. 7 shows a flow chart of a method for manufacturing a capillary structure element 1 of a uniform temperature plate according to another specific embodiment of the present invention, and FIGS. 8A to 8E are diagrams based on Figure 7 is a schematic diagram. In practical applications, with the exception of the implementation shown in Figure 5 and Figures 6A to 6D, the embodiment shown in Figure 7 and Figures 8A to 8E can also be performed after step S31, and then steps S41 and S51 are performed first to remove the first copper The slurry 131 is heated and sintered to form the first capillary structure 121. Then, step S32, step S42 and step S52 are performed to heat and sinter the second copper paste 132 to form the second capillary structure 122. The manufacturing method of the present invention can form the capillary structure layer 12 by sequentially laying and sintering the first copper paste 131, and then laying and sintering the second copper paste 132. In addition to the above-mentioned method of forming the capillary structure layer 12, those of ordinary skill in the art can achieve the purpose of laying the first copper paste 131 on the first area 1121 and laying the second copper paste 132 on the second area 1122. Self-adjust The most suitable manufacturing method is not limited to this.

Wherein, the first type spherical copper powder 1211 and the second type spherical copper powder 1221 can be the same, and the ratio of the maximum inscribed circle radius to the minimum circumscribed circle radius of this kind of spherical copper powder is 0.6 or more. The thickness of the thin flake copper powder 1222 is hundreds of nanometers (nm) in the nanometer level, the average diameter of 910 is in the micrometer level of several tens of micrometers (um), and the diameter-to-thickness ratio is greater than 30. The organic solvent may be an alcohol solvent, and the polymer may be a natural resin (Natural Resin) or a synthetic resin (Synthetic Resin).

Compared with the prior art, the capillary structure element 1 of the temperature equalizing plate of the present invention is provided with two microscopically different capillary structure layers 12 on the upper surface 111 of the first metal sheet 11 in the groove structure 112, and the working fluid is used in the two The vertical vaporization mechanism and the horizontal liquid transport mechanism in the different capillary structure layers 12 are different. The two microscopically different capillary structures form the capillary structure element 1 of the temperature equalizing plate, which improves the working fluid in the thin equalizing plate V The efficiency of the liquid and gas phase circulation, therefore, the heat dissipation and heat conduction functions of the thin uniform temperature plate V are improved.

Through the detailed description of the above preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent for which the present invention is intended. Therefore, the scope of the patent application for the present invention should be interpreted in the broadest way based on the above description, so as to cover all possible changes and equivalent arrangements.

1: Capillary structure elements

11: The first metal sheet

111: upper surface

112: groove structure

1121: The first area

1122: second area

12: Capillary structure layer

121: The first capillary structure

1211: The first type of spherical copper powder

122: second capillary structure

1221: The second type of spherical copper powder

1222: thin flake copper powder

Claims (9)

A capillary structure element of a temperature equalizing plate is used for sealing and processing with a second metal sheet to form a thin temperature equalizing plate. The capillary structure element of the temperature equalizing plate includes: a first metal sheet having an upper surface, and The upper surface has a groove structure; and a capillary structure (Wick Structure) layer formed in the groove structure, the capillary structure layer has: a first capillary structure, including a first type of spherical copper powder through Formed by sintering; and a second capillary structure comprising a mixture of a second type of spherical copper powder and a thin flake copper powder formed by sintering, the thickness of the thin flake copper powder is 100~999nm, The average diameter is 10~99um; wherein, the first capillary structure is located at one end of the heat-absorbing end of the thin-type uniform temperature plate, and the pores of the first capillary structure are larger than the pores of the second capillary structure. According to the capillary structure element of the uniform temperature plate described in the scope of the patent application, the content of the first type spherical copper powder in the first capillary structure is greater than 90%. As for the capillary structure element of the uniform temperature plate described in the scope of the patent application, the content of the thin flake copper powder in the second capillary structure is greater than 15%. The capillary structure element of the uniform temperature plate according to the first item of the scope of patent application, wherein the first metal sheet contains at least one of copper and copper alloy. The capillary structure element of the uniform temperature plate described in the scope of the patent application, wherein the first type of spherical copper powder is heated and baked by a first copper paste to remove one of the components contained in the first copper paste An organic solvent and a polymer are obtained, and the mixed second type of spherical copper powder and the thin flake copper powder are heated and baked from a second copper paste to remove the second copper paste. The organic solvent and the polymer are obtained afterwards. The capillary structure element of the uniform temperature plate as described in item 1 of the scope of patent application, wherein the capillary structure layer is a porous structure. The capillary structure element of the uniform temperature plate as described in item 1 of the scope of patent application, wherein the capillary structure layer is a continuous structure. A method for manufacturing a temperature equalizing plate capillary structure element, which includes the following steps: providing a first metal sheet having a groove structure, wherein the groove structure has a first area and a second area; providing a first Copper slurry and a second copper slurry; laying the first copper slurry on the first area; laying the second copper slurry on the second area; heating the first copper slurry to solidify; heating the The second copper paste is cured; the cured first copper paste is baked and sintered to form a first capillary structure located in the first area; and the second copper paste after curing is baked And sintering to form a second capillary structure located in the second region; wherein the first capillary structure and the second capillary structure are continuous structures, and the pores of the first capillary structure are larger than the pores of the second capillary structure, And the first copper paste includes a first type of spherical copper powder, an organic solvent and a polymer, and the second copper paste includes a The second type of spherical copper powder, a thin flake copper powder, the organic solvent and the polymer, the thin flake copper powder has a thickness of 100-999nm and an average diameter of 10-99um. The method for manufacturing the capillary structure element of the uniform temperature plate described in the scope of the patent application, wherein the cured first copper paste is baked and sintered to form a first capillary structure located in the first region The step and the step of baking and sintering the solidified second copper paste to form a second capillary structure located in the second region are simultaneously performed under the same baking and sintering process conditions.

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