TWI719648B - A resin stripper - Google Patents

Abstract

This invention provides a resin stripper, comprising an aprotic solvent, a non-quaternary ammonium cationic organic base, an aromatic alcohol having one hydroxyl group, a corrosion inhibitor selected from at least one of the group consisting of alkylene glycols and poly-alkylene glycols, wherein the content of the corrosion inhibitor is 0.5~5 folds of the content of the non-quaternary ammonium cationic organic base, and the sum of the content of the corrosion inhibitor and the content of the non-quaternary ammonium cationic organic base is no less than 30 weight percent of total content of the resin stripper.

Description

A resin cleaning agent

The present invention relates to a cleaning agent, in particular to a resin cleaning agent, and in particular to a resin cleaning agent for cleaning a resin composition containing at least one of polyamide acid, polyimide or copolymers thereof, especially Suitable for semiconductor manufacturing process.

Generally, resin adhesives that have been completely dried and cured are difficult to achieve the goal of rapid dissolution and cleaning with a single solvent. Therefore, acids or alkalis are often added to the solvent to increase the cleaning efficiency, but it will also increase the metal corrosion rate and cause the metal to go away. There is a risk of line short circuit, so a resin cleaning agent with high cleaning efficiency and low metal corrosion rate at the same time is eagerly expected in the industry.

One object of the present invention is to provide a resin cleaning agent, comprising: aprotic solvents, non-quaternary ammonium salts organic bases, aromatic alcohols with one hydroxyl group, and containing selected from the group of alkylene glycols or polyalkylene glycols At least one corrosion inhibitor; wherein the weight percentage of the aforementioned corrosion inhibitor is 0.5-5 times the weight percentage of the aforementioned non-quaternary ammonium salt organic base, and the corrosion inhibitor and the non-quaternary ammonium salt organic base The total weight shall not be less than 30% of the total weight of the resin cleaning agent.

Another object of the present invention is to provide a resin cleaning agent including the resin cleaning agent disclosed in paragraph [0003], which is used to clean a resin composition containing at least one of polyamide acid, polyimide or a copolymer thereof.

According to an embodiment of the present invention, the resin cleaner disclosed includes: aprotic solvents, non-quaternary ammonium salt organic bases, aromatic alcohols with one hydroxyl group, and a group selected from the group consisting of alkanediol or polyalkylene glycol At least one corrosion inhibitor; wherein the weight percentage of the aforementioned corrosion inhibitor is 0.5-5 times the weight percentage of the aforementioned non-quaternary ammonium salt organic base, and the corrosion inhibitor and the non-quaternary ammonium salt organic base The total weight of the resin cleaning agent should not be less than 30% of the total weight of the resin cleaning agent, which can provide a good resin cleaning rate and maintain the integrity of the metal surface; when the weight of the corrosion inhibitor and the non-quaternary ammonium salt organic base The total weight is less than 30% of the total weight of the resin cleaning agent, or the weight percentage of the corrosion inhibitor is less than 0.5 times or more than 5 times of the weight percentage of the non-quaternary ammonium salt organic alkali, the corrosion of the resin cleaning agent to the metal increase.

其中，R₁為C_xH_2x或

；R₂為氫或烷基，x、y分別為1~4之間的整數；舉例來說，具有一個羥基的芳族醇可為包含選自苯甲醇、苯乙醇、苯丙醇、苯丁醇、苯氧乙醇、苯氧丙醇、苯氧丁醇、苯氧戊醇以及苯基環氧乙烷之群的其中之一或其組合。 The above-mentioned resin cleaning agent contains an aromatic alcohol with one hydroxyl group, which can be specifically a structural formula having formula (I):

Where R ₁ is C _x H _2x or

; R ₂ is hydrogen or an alkyl group, x and y are respectively an integer between 1 and 4; for example, an aromatic alcohol with one hydroxyl group may be selected from benzyl alcohol, phenethyl alcohol, phenylpropanol, phenbutyl One or a combination of alcohol, phenoxyethanol, phenoxypropanol, phenoxybutanol, phenoxypentanol, and phenyloxirane.

The corrosion inhibitor in the above-mentioned resin cleaning agent may specifically be a structural formula having formula (II):

Wherein, R _{3 is} each independently hydrogen or an alkyl group, and n is an integer between 1 and 45; for example, the aforementioned alkanediol is selected from ethylene glycol, propylene glycol, butylene glycol, pentanediol or Hexylene glycol; the above-mentioned polyalkylene glycols are polyethylene glycol, polypropylene glycol, polybutylene glycol, polypentylene glycol, polyethylene glycol, ethylene glycol-propylene glycol copolymer, ethylene glycol-butanediol copolymer Substance, ethylene glycol-pentanediol copolymer, ethylene glycol-hexanediol copolymer, propylene glycol-butanediol copolymer, propylene glycol-pentanediol copolymer, propylene glycol-hexanediol copolymer, butanediol- One or a combination of pentanediol copolymer, butanediol-hexanediol copolymer, and pentanediol-hexanediol copolymer.

The aprotic solvent in the above-mentioned resin cleaning agent may specifically include selected from esters, benzenes, ethers, nitriles, ketones, amides, carbon tetrachloride, pyridine, stubbles, stubbles, and furans. One of the group or a combination thereof; for example, the aprotic solvent may include selected from ethyl acetate, benzene, diethyl ether, acetonitrile, acetone, n-methylpyrrolidone (NMP), 1,3-di Methyl-2-imidazolinone (DMI), N,N~dimethylformamide (DMF), N,N-dimethylacetimide (DMAc), N,N-diethylformamide One or a combination of amine (DEF), hexamethylphosphoryl triamine (HMPA), carbon tetrachloride, pyridine, dimethyl sulfide (DMSO), and tetrahydrofuran (THF).

The non-quaternary ammonium salt organic base in the above-mentioned resin cleaner may specifically include one selected from the group consisting of primary amines, secondary amines, tertiary amines, primary alcohol amines, secondary alcohol amines, and tertiary alcohol amines. One or a combination thereof; for example, the non-quaternary ammonium salt organic base may comprise selected from propylene diamine, diethylaminopropylamine, dimethylaminopropylamine, ethanolamine, diethanolamine, triethanolamine, isopropanolamine, One or a combination of methylethanolamine, methyldiethanolamine, dimethylethanolamine, aminoethylethanolamine, hydroxyethylethylenediamine, diethylenetriamine, diglycolamine, or isobutanolamine.

According to another embodiment of the present invention, the resin cleaning agent disclosed includes one of the above-mentioned resin cleaning agents, and the above-mentioned resin cleaning agent is used for cleaning containing polyamide acid, polyimide or copolymers thereof At least one of the resin composition is particularly suitable for semiconductor manufacturing processes.

The above content of the invention aims to provide a simplified summary of the content of the disclosure, so that readers have a basic understanding of the content of the disclosure. This summary is not a complete summary of the present disclosure, and its intention is not to point out important/key elements of the embodiments of the present invention or to define the scope of the present invention. After referring to the following embodiments, those with ordinary knowledge in the technical field to which the present invention belongs can easily understand the basic spirit of the present invention, as well as the technical means and implementation modes adopted by the present invention.

In order to make the above-mentioned content of the invention and other objectives, features, and advantages of the present invention more obvious and understandable, preferred embodiments are described below in detail.

Example

In the following embodiments and comparative examples, the inventors configured various resin cleaning agents according to the ingredients and contents (weight percentages) in Table 1 and Table 2, and evaluated the effect of these resin cleaning agents on resin adhesives according to the following methods The cleaning rate and the inhibition of the melting effect on the metal.

Resin cleaning agent cleaning rate & resin adhesive residue evaluation method: The resin adhesive used in the examples/comparative examples is purchased from Daxing Materials, the trade name is TBA-208S, which is a kind of amide acid/diabetic Temporary resin adhesive of amine copolymer or polyimide series. First, apply the aforementioned resin adhesive TBA-208S on a glass substrate sample to form a resin adhesive film, and place it on a hot plate for heating. The heating conditions are as follows: heating at 50°C for 10 minutes, heating at 90°C for 10 minutes Minutes, heating at 120°C for 10 minutes, heating at 150°C for 60 minutes, and heating at 180°C for 30 minutes. Next, cut the aforementioned glass substrate sample into 6*1 cm2 test pieces, and measure the resin adhesion The initial thickness of the agent film. Next, weigh 12 grams of the resin cleaning agent of the formula to be tested (Examples 1-19, Comparative Examples 1-20) in a 20 ml glass sample bottle, and immerse the aforementioned test piece in the test formula (Examples 1-19, Comparative Example 1~20) In the resin cleaning agent, take out the sample every 3~5 minutes and rinse with deionized water. Observe the cleaning condition of the resin adhesive film on the test piece until the resin adhesive film is completely cleaned, record The required time is calculated and the cleaning rate is calculated, where the cleaning rate is less than 2μm/min, marked as X. In addition, if the resin adhesive can be dissolved and cleaned by the resin cleaning agent, the cleaning mode is marked as ○; if the resin adhesive cannot be dissolved and cleaned by the resin cleaning agent, the cleaning mode is marked as insoluble; the resin adhesive is being cleaned by the resin cleaning agent For strippers during the cleaning process, the cleaning mode is marked as X. In addition, visually inspect the resin adhesive residue on the surface of the test piece after cleaning with the resin cleaner, and indicate the amount of resin adhesive residue on the surface of the test piece: obvious residue, partial residue, slight residue or no residue.

Evaluation method of the effect of resin cleaning agent on inhibiting metal dissolution: The evaluation method of resin cleaning agent’s inhibiting effect on metal dissolution is based on the copper foil commonly used in semiconductor manufacturing processes to form metal wires or metal electrodes in different formulations (Examples 1-19, comparative examples) 1~20) The dissolution rate in the resin cleaning agent is evaluated. First, take a copper foil with a thickness of 10μm, clean the surface with 0.5% nitric acid, water and alcohol, and obtain a round copper foil test piece of the same size with a 15mm diameter hole puncher, and record each copper foil separately with a micro balance The weight of the foil test piece. Secondly, weigh 4 grams of the resin cleaning agent of the formula to be tested (Examples 1-19, Comparative Examples 1-20) into a 20 ml glass sample bottle. Then, the aforementioned copper foil test piece was immersed in the resin cleaning agent of different formulations (Examples 1 to 19, Comparative Examples 1 to 20), and after standing for about 90 hours, the copper foil test piece was taken out, and deionized water and alcohol were used. Cleaned and micro The weighing scale records the weight of each copper foil test piece after the test. After calculating the weight change, the dissolution of the copper foil test piece in the resin cleaning agent of various formulations (Examples 1-19, Comparative Examples 1-20) can be obtained. rate. Among them, if the dissolution rate is less than 0.8mg/hr, the inhibitory effect on metal dissolution is marked as ◎; if the dissolution rate is between 0.8~1mg/hr, the inhibitory effect on metal dissolution is marked as ○; the dissolution rate is between 1~1.2mg/hr Where, the inhibitory effect on metal dissolution is marked as △; if the dissolution rate is greater than 1.2mg/hr, the inhibitory effect on metal dissolution is marked as X. The faster the metal dissolution rate, the more serious the corrosion to the metal.

In addition, the full abbreviations used in Table 1, Table 2 and this manual are listed as follows:

As shown in Table 1, the resin cleaning agents disclosed in Examples 1-19 use DEF, DMSO and NEP as aprotic solvents respectively; the resin cleaning agents disclosed in Examples 1-19 use MEA, AEAA, DETA and DGA is used as an organic base; the resin cleaning agents disclosed in Examples 1-19 use BZA and EO-ph as aromatic alcohols with one hydroxyl group respectively; the resin cleaning agents disclosed in Examples 1-19 use PEG-200, respectively , PEG-400, PEG~600, PEG-1000, PEG-2000, EG, PPG-1000 are used as corrosion inhibitors, and the resin cleaning agent disclosed in Example 14 further contains 5 weight percent water.

As shown in Table 1, the total content of corrosion inhibitors and non-quaternary ammonium salt organic bases in the resin cleaning agents disclosed in Examples 1-19 is between 30-50% by weight, and the corrosion inhibitor has a The weight percentage is between 0.8 and 4 times the weight percentage of the non-quaternary ammonium salt organic base. In addition, as shown in Table 1, the cleaning rate of the resin cleaning agent to the resin adhesive disclosed in Examples 1 to 19 is between 1.6 and 3.9 μm/min. It is visually inspected that there is no residue on the surface of the test piece after cleaning. The resin adhesive residue or the peeling phenomenon of the resin adhesive occurs during the cleaning process, and the resin cleaning agent disclosed in Examples 1 to 19 has an excellent inhibitory effect on the dissolution of copper foil. The results show that the resin cleaning disclosed in the present invention The agent can effectively clean the resin composition and does not cause corrosion to the metal. It is suitable as a cleaning agent for cleaning the resin adhesive in the semiconductor manufacturing process.

As shown in Table 2, the resin cleaning agent of Comparative Example 1 only contains 90% by weight of the aprotic solvent DEF and 10% by weight of the non-quaternary ammonium salt organic base MEA, and does not contain any corrosion inhibitors and aromatic alcohols, although The resin cleaning agent of Comparative Example 1 has a relatively fast cleaning efficiency of 5.2 μm/min for the resin adhesive, but it is visually detected that there is residue on the surface of the test piece after cleaning, and the resin cleaning agent has severe corrosion to copper, so The resin cleaning agent of Comparative Example 1 is not suitable as a cleaning agent for cleaning the resin adhesive in the semiconductor manufacturing process.

As shown in Table 2, the resin cleaning agents of Comparative Examples 2 to 6 respectively contain 60 to 80 weight percent of aprotic solvent DEF, 5 to 10 weight percent of non-quaternary ammonium salt organic base MEA, and 10 weight percent of a hydroxyl group. Aromatic alcohol BZA and 5-25 weight percent corrosion inhibitor PEG-400, wherein the total content of the corrosion inhibitor and non-quaternary ammonium salt organic base in the resin cleaning agent of Comparative Examples 2 and 6 is equal to 30 The weight percentage, but the weight percentage of the corrosion inhibitor is 0.5 times and 5 times the weight percentage of the non-quaternary ammonium salt organic base; the weight percentage of the corrosion inhibitor in the resin cleaning agent of Comparative Examples 3 to 5 is the weight percentage of the non-quaternary ammonium salt organic base. Although the weight percentages of ammonium salt organic bases fall within the range of 0.5 to 5 times, the total content of corrosion inhibitors and non-quaternary ammonium salt organic bases is less than 30 weight percentages. Although the cleaning rate of the resin cleaning agent of Comparative Examples 2-6 to the resin adhesive is between 2.5-4.5μm/min, as shown in Table 2, the resin cleaning agent of Comparative Examples 2-6 dissolves the copper foil It has no inhibitory effect, so the resin cleaning agents of Comparative Examples 2 to 6 are not suitable as cleaning agents for cleaning resin adhesives in the semiconductor manufacturing process.

As shown in Table 2, the resin cleaning agent of Comparative Example 7 contains 80% by weight of aprotic solvent DEF, 10% by weight of non-quaternary ammonium salt organic base MEA, and 10% by weight of BZA, which is an aromatic alcohol with one hydroxyl group. The resin cleaning agent of Comparative Example 7 does not contain any corrosion inhibitor. Although the resin cleaning agent of Comparative Example 7 has an excellent and easy cleaning efficiency of 4.9 μm/min for the resin adhesive, the resin cleaning agent does not have an inhibitory effect on the dissolution of copper foil, so the resin cleaning agent of Comparative Example 7 is not suitable for semiconductors The cleaning agent used to clean the resin adhesive during the manufacturing process.

As shown in Table 2, the resin cleaning agent of Comparative Example 8 contains 60% by weight of aprotic solvent DEF, 10% by weight of non-quaternary ammonium salt organic base MEA, and 30% by weight of corrosion inhibitor PEG-400. Comparative Example The resin cleaning agent of 8 does not contain any aromatic alcohol, and the total content of the corrosion inhibitor and non-quaternary ammonium salt organic base in the resin cleaning agent of Comparative Example 8 is 40% by weight, and the weight of the corrosion inhibitor The percentage is 3 times the weight percentage of the non-quaternary ammonium salt organic base, and falls within the range of 0.5 to 5 times. Although the resin cleaning agent of Comparative Example 8 has a cleaning efficiency of 3.2 μm/min for the resin adhesive, and the resin cleaning agent has a good inhibitory effect on the dissolution of copper foil, it is visually detected that there is residue on the surface of the test piece after cleaning. Therefore, the resin cleaning agent of Comparative Example 8 is not suitable as a cleaning agent for cleaning the resin adhesive in the semiconductor manufacturing process.

As shown in Table 2, the resin cleaning agent of Comparative Example 9 contains 50% by weight of aprotic solvent DEF, 10% by weight of non-quaternary ammonium salt organic base MEA, 30% by weight of corrosion inhibitor PEG-400, and 10% by weight Percentage of Catechol with two hydroxyl groups of aromatic alcohol, and the total content of corrosion inhibitor and non-quaternary ammonium salt organic base in the resin cleaning agent of Comparative Example 9 is 40% by weight, and the weight of the corrosion inhibitor The percentage is 3 times the weight percentage of the non-quaternary ammonium salt organic base, falling within the range of 0.5 to 5 times. As shown in Table 2, the resin cleaning agent of Comparative Example 9 uses Catechol, which is an aromatic alcohol with two hydroxyl groups, instead of having one hydroxyl group. Therefore, the cleaning rate of the resin cleaning agent to the resin adhesive of Comparative Example 9 is less than 2μm/min, the cleaning efficiency is not good, and the surface of the test piece is visually detected that there is still obvious residue after cleaning, and the resin cleaning agent It has no inhibitory effect on the dissolution of copper foil, so the resin cleaning agent of Comparative Example 9 is not suitable as a cleaning agent for cleaning the resin adhesive in the semiconductor manufacturing process.

As shown in Table 2, the resin cleaning agents of Comparative Examples 10 and 11 respectively contain 50% by weight of aprotic solvent DEF, 10% by weight of non-quaternary ammonium salt organic base MEA, and 10% by weight of aromatic alcohol with one hydroxyl group. In addition, the resin cleaning agents of Comparative Examples 10 and 11 further contained 30% by weight of corrosion inhibitors MDEG and PGME. The total content of the corrosion inhibitor and the non-quaternary ammonium salt organic base in the resin cleaning agent of Comparative Examples 10 and 11 is 40% by weight, and the weight percentage of the corrosion inhibitor is the weight of the non-quaternary ammonium salt organic base 3 times the percentage falls within the range of 0.5 to 5 times. As shown in Table 2, although the resin cleaning agents of Comparative Examples 10 and 11 have cleaning efficiencies of 3.9 and 3.2 μm/min for the resin adhesive, respectively, as shown in Table 2, because of the cleaning agents belonging to Comparative Examples 10 and 11 The corrosion inhibitor used is not alkanediol or polyalkylene glycol. The resin cleaning agent of Comparative Examples 10 and 11 has a poor inhibitory effect on the dissolution of copper foil, indicating that the corrosion to the metal is serious. Therefore, the comparative examples 10 and 11 Resin cleaning agents are not suitable as cleaning agents for cleaning resin adhesives in the semiconductor manufacturing process.

As shown in Table 2, the resin cleaning agents of Comparative Examples 12-17 contain 76-78 weight percent of aprotic solvent DEF, 10 weight percent of non-quaternary ammonium salt organic base MEA, and 10 weight percent of aromatic with one hydroxyl group. Group alcohol BZA, and the resin cleaning agent of Comparative Examples 12-17 further contains 2 to 4 weight percent of corrosion inhibitors SABT, PTBBA, TTA, TTA+BTA, DTPA, CYS, and the resin cleaning of Comparative Examples 12-17 The total content of corrosion inhibitor and non-quaternary ammonium salt organic base in the agent is 12 and 14 weight percent respectively, which is less than 30 weight percent. The weight percentage of the corrosion inhibitor is respectively 0.2 times and 0.4 times of the weight percentage of the non-quaternary ammonium salt organic base, which falls outside the range of 0.5 to 5 times. As shown in Table 2, the resin cleaning agents of Comparative Examples 12-15 have a cleaning efficiency of 2~2.2μm/min for the resin adhesive, respectively. The resin cleaning agents disclosed in Comparative Examples 12 and 13 do not inhibit the dissolution of copper foil. Effects: The resin cleaning agents disclosed in Comparative Examples 14 and 15 have an inhibitory effect on the dissolution of copper foil. However, as shown in Table 2, Comparative Examples 12 to 15 visually inspected the surface of the test piece with obvious residual residue after cleaning. In addition, as shown in Table 2, the resin cleaning agents disclosed in Comparative Examples 16 and 17 cannot be used to dissolve resin adhesives at all, let alone as cleaning agents for cleaning resins; it shows that metal corrosion inhibitors commonly used in the market, including azoles In the resin cleaning agent of the present invention, the cleaning efficiency will be greatly reduced. Therefore, there are obvious residues on the glass surface after cleaning, and some metal corrosion inhibitors cannot inhibit the metal. Therefore, the resin cleaning agents disclosed in Comparative Examples 12 to 17 are not suitable for cleaning resin adhesives in the semiconductor manufacturing process.

The resin cleaning agents of Comparative Examples 18 and 19 respectively contained 52 and 40 weight percent of DEF as an aprotic solvent, 2, 5 weight percent of quaternary ammonium salt organic base TMAH, and 10 weight percent of aromatic alcohol BZA with one hydroxyl group. , 30 weight percent of corrosion inhibitor PEG-400 and 6, 15 weight percent of water, wherein the total content of corrosion inhibitor and quaternary ammonium salt organic base in the resin cleaning agent of Comparative Examples 18 and 19 is 32, 35 weight The percentages are greater than 30% by weight, and the weight percentage of the corrosion inhibitor in the resin cleaning agent of Comparative Examples 18 and 19 is 15 times and 6 times the weight percentage of the quaternary ammonium salt organic base, respectively, falling within 0.5 ~5 times out of range. As shown in Table 2, the cleaning rates of the resin cleaning agent in Comparative Examples 18 and 19 to the resin adhesive are 1.3 and 2.1 μm/min, respectively, and the resin cleaning agent in Comparative Examples 18 and 19 can inhibit copper corrosion, but as shown in Table 2. As shown, the resin cleaning agents of Comparative Examples 18 and 19 caused tree damage during the cleaning of the resin adhesive. The grease adhesive peels off in flakes instead of dissolving, which can cause pipeline blockage in the process. Therefore, the resin cleaning agents of Comparative Examples 18 and 19 are not suitable as cleaning agents for cleaning resin adhesives in the semiconductor manufacturing process.

The resin cleaning agent of Comparative Example 20 only contains 40% by weight of DEF as an aprotic solvent, 10% by weight of non-quaternary ammonium salt organic base hydroxylamine, 10% by weight of aromatic alcohol BZA with one hydroxyl group, 30% by weight Corrosion inhibitor PEG-400 and 10 weight percent water, wherein the total content of the corrosion inhibitor and non-quaternary ammonium salt organic base in the resin cleaning agent of Comparative Example 20 is 40 weight percent, which is greater than 30 weight percent, and The weight percentage of the corrosion inhibitor is 3 times the weight percentage of the non-quaternary ammonium salt organic base, falling within the range of 0.5 to 5 times. As shown in Table 2, the cleaning rate of the resin cleaning agent to the resin adhesive of Comparative Example 20 is less than 2μm/min. It is visually detected that the surface of the test piece still has obvious residual residue after cleaning, and the resin cleaning agent of Comparative Example 20 is There is no inhibitory effect on the dissolution of copper foil. Therefore, the resin cleaning agent of Comparative Example 20 is not suitable as a cleaning agent for cleaning the resin adhesive in the semiconductor manufacturing process.

In summary, the resin cleaning agent disclosed according to the present invention includes aprotic solvents, non-quaternary ammonium salt organic bases, aromatic alcohols with one hydroxyl group, and a group selected from alkylene glycols or polyalkylene glycols. At least one of the corrosion inhibitors; wherein the weight percentage of the aforementioned corrosion inhibitor is 0.5 to 5 times the weight percentage of the aforementioned non-quaternary ammonium salt organic base, and the corrosion inhibitor and the non-quaternary ammonium salt organic base The total weight of the alkali is not less than 30% of the total weight of the resin cleaning agent, which not only provides excellent cleaning efficiency for the resin adhesives commonly used in the semiconductor manufacturing process, but also does not cause the resin adhesive to peel off or produce on the substrate surface during the cleaning process Residual glue, and has a good anti-corrosion effect on common metal wires or metal electrodes in semiconductor components. It is suitable for cleaning common resin adhesives in semiconductor manufacturing processes, such as but not limited to amide acid/imine copolymers or polyamides. Temporary resin adhesive of the imide series.

In addition, the resin cleaning agent disclosed in the present invention can be used to clean the resin composition of at least one of polyamide acid, polyimide or their copolymers commonly used in semiconductor manufacturing processes, and will not be repeated here.

Although the present invention has been disclosed as above in the preferred embodiment, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can change and combine the above various implementations without departing from the spirit and scope of the present invention. example.

Claims (10)

A resin cleaning agent, comprising: an aprotic solvent; a non-quaternary ammonium salt organic base; an aromatic alcohol having a hydroxyl group; and a corrosion inhibitor, comprising a group selected from alkylene glycol or polyalkylene glycol Wherein the weight percentage of the corrosion inhibitor is 0.5 to 5 times the weight percentage of the non-quaternary ammonium salt organic base, and the total weight of the corrosion inhibitor and the non-quaternary ammonium salt organic base does not Less than 30% of the total weight of the cleaning agent. The resin cleaning agent according to claim 1, wherein the aromatic alcohol having one hydroxyl group has the structural formula (I):

Where R ₁ is C _x H _2x or

; R ₂ is hydrogen or alkyl, x and y are each an integer between 1 and 4. The resin cleaning agent according to claim 2, wherein the aromatic alcohol having one hydroxyl group contains selected from benzyl alcohol, phenethyl alcohol, phenylpropanol, phenbutanol, phenoxyethanol, phenoxypropanol, phenoxybutanol, One or a combination of phenoxypentanol and phenyloxirane. The resin cleaning agent according to claim 1, wherein the corrosion inhibitor has a structural formula of formula (II):

R _{3 is} each independently hydrogen or an alkyl group, and n is an integer between 1 and 45. The resin cleaning agent according to claim 4, wherein the alkanediol is selected from ethylene glycol, propylene glycol, butylene glycol, pentanediol or hexylene glycol, and the polyalkylene glycol is polyethylene glycol, poly Propylene glycol, polybutylene glycol, polypentylene glycol, polyethylene glycol, ethylene glycol-propylene glycol copolymer, ethylene glycol-butylene glycol copolymer, ethylene glycol-pentane glycol copolymer, ethylene glycol-hexane Glycol copolymer, propylene glycol-butanediol copolymer, propylene glycol-pentanediol copolymer, propylene glycol-hexanediol copolymer, butanediol-pentanediol copolymer, butanediol-hexanediol copolymer and pentane One or a combination of diol-hexanediol copolymers. The resin cleaning agent according to claim 1, wherein the aprotic solvent contains selected from esters, benzenes, ethers, nitriles, ketones, amines, carbon tetrachloride, pyridine, sulfites, sulfites, and One or a combination of furans. The resin cleaning agent according to claim 6, wherein the aprotic solvent contains selected from ethyl acetate, benzene, ether, acetonitrile, acetone, n-methylpyrrolidone (NMP), 1,3-dimethyl-2- Imidazolinone (DMI), N,N-dimethylformamide (DMF), N,N-dimethylacetimide (DMAc), N,N-diethylformamide (DEF), One or a combination of hexamethylphosphoryl triamine (HMPA), carbon tetrachloride, pyridine, dimethyl sulfide (DMSO), and tetrahydrofuran (THF). The resin cleaning agent according to claim 1, wherein the non-quaternary ammonium salt organic base comprises one selected from the group consisting of primary amines, secondary amines, tertiary amines, primary alcohol amines, secondary alcohol amines and tertiary alcohol amines One or a combination. The resin cleaning agent according to claim 8, wherein the non-quaternary ammonium salt organic base comprises selected from the group consisting of propylene diamine, diethylaminopropylamine, dimethylaminopropylamine, ethanolamine, diethanolamine, triethanolamine, and isopropanolamine , Methylethanolamine, methyldiethanolamine, dimethylethanolamine, aminoethylethanolamine, hydroxyethylethylenediamine, diethylenetriamine, diethyleneglycolamine or isobutanolamine . A resin cleaning agent, comprising the resin cleaning agent according to any one of claims 1 to 9, and the resin cleaning agent is used for cleaning at least one of polyamide acid, polyimide or copolymers thereof Resin composition.