TWI795468B - Method and apparatus for joining adhesive tape - Google Patents

Abstract

To provide an adhesive tape attaching method and an adhesive tape that can more reliably eliminate the tension difference in each area that occurs when the adhesive tape is cut into a predetermined shape corresponding to the workpiece in the construction of attaching the adhesive tape to the workpiece Attachment device.

The 2nd tension mechanism 37 is provided with the 1st tension mechanism 53 and the 2nd tension mechanism 55 juxtaposed in the delivery direction L. The first stretching mechanism 53 and the second stretching mechanism 55 are controlled to move in the width direction independently so as to stretch the adhesive tape DT in the width direction. The first stretching mechanism 53 holds the region L1 closer to the cut-off region C, and applies a large tension P1 to the region L1 in the width direction. The second stretching mechanism 55 grasps the region L2 farther from the cutting region C, and applies a small tension P2 to the region L2 in the width direction.

Description

Adhesive tape attaching method and adhesive tape attaching device

The present invention relates to an adhesive tape attaching method and an adhesive tape attaching device, which cover the back surface of a semiconductor wafer (hereinafter, appropriately referred to as "wafer") placed in the center of a ring frame and the ring frame. Take the operation of integrating the range attachment support with an adhesive tape as an example.

After the circuit pattern is formed on the surface of the wafer, the back surface of the wafer is ground by the back grinding process, and then the wafer is divided into a plurality of chip parts by the dicing process. In this case, in order to prevent the chip parts separated from the wafer from flying during the dicing process, a method of closely adhering an adhesive tape for support to the range covering the ring frame and the back surface of the wafer is proposed to integrate them.

In the case of carrying out such an attaching process, a strip-shaped adhesive tape is fed out for supply, and after the adhesive tape is attached to a range covering the ring frame and the back surface of the wafer, the adhesive tape is cut into a circle along the ring frame. As a result, the strip-shaped adhesive tape DT (FIG. 16(a)) fed out in the direction indicated by symbol L is cut into a circle at the portion indicated by symbol C (FIG. 16(b)).

In order to prevent wrinkles or undulations from being generated on the adhesive tape DT when the adhesive tape DT is unwound, tension is uniformly applied to the long side direction (the unwinding direction L) of the adhesive tape DT. However, when a part of the adhesive tape DT is cut, as shown in FIG. Especially when the adhesive tape DT is made of a soft material, the generation of wrinkles F becomes conspicuous.

The reason for this is considered to be that the tension is not uniform due to the formation of the cut-out area C, or the like. That is, in the adhesive tape DT, the adhesive tape DT is continuous at both end sides in the width direction, and conversely, the adhesive tape DT is discontinuous by the cutout region C in the center portion in the width direction. As a result, a large tension is applied in the delivery direction L at both ends in the width direction, and wrinkles F are generated due to the tension difference between the both ends and the central portion.

Then, in recent years, an adhesive tape attaching method that applies tension to the width direction of the adhesive tape DT every time the adhesive tape DT is cut has been proposed (for example, refer to Patent Documents 1 and 2). That is, as shown in FIG. 16( d ), after the adhesive tape DT is cut, the adhesive tape DT is held within a range of a predetermined length covering the release direction L by the plate-shaped clamping member 103 provided in the tension mechanism 101. both ends of the width direction.

Next, the clamping members 103 are each stretched in the width direction R by the cylinder 105 included in the tension mechanism 101 , and tension is applied to the adhesive tape DT in the width direction R. Ideally, as shown in FIG. 16( d ), the wrinkles F are completely removed by applying tension in the width direction, and the adhesive tape DT is flattened so that the adhesive tape DT can be adhered closely to the wafer again.

prior art literature

Patent Document 1 Japanese Unexamined Patent Publication No. 2008-205363

Patent Document 2 Japanese Patent Laid-Open No. 2013-135053

However, there are the following problems in the above known devices.

That is, the conventional configuration is different from the ideal, and it is actually difficult to reliably remove the wrinkles F generated on the adhesive tape DT. That is, as shown in FIG. 17( b ), even if tension is applied by the conventional tension mechanism 101 to reduce the wrinkles F, they frequently remain without being completely removed. In addition, when tension is applied using a conventional tension mechanism 101, as shown in FIG. 17(c), there is also a concern that new wrinkles G extending in the width direction R may be generated.

Adhesive tape DT in the part where wrinkles remain is not suitable as an object that is closely attached to a wafer and cut out. As a result, since it is necessary to set the next cutout region C while avoiding the wrinkled portion, the pitch of the cutout region C becomes large. Therefore, the waste amount of the adhesive tape DT increases.

For this kind of problem, through the result of the inventor's efforts to review repeatedly, the following conclusions are made. That is, as shown in FIG. 17( a ), the wrinkles F are not uniformly generated in the discharge direction L, but are generated more in the region L1 close to the cut-off region C. As shown in FIG. On the other hand, with regard to the pay-out direction L of the adhesive tape DT, the number of wrinkles F generated in the area L2 deviated from the cut-out area C is small.

That is, it is conceivable that the amount of shrinkage in the width direction R due to the wrinkles F is large in the area L1, and the amount of shrinkage in the width direction R due to the wrinkles F is small in the area L2. That is, in the state where the wrinkles F are being generated, the tension T1 acting on the region L1 is smaller than the tension T2 acting on the region L2. Therefore, in order to reliably remove the wrinkles F and flatten the entire adhesive tape, it is necessary to apply a larger tension force to the region L1 than to the region L2, and to uniformize the acting tension as a whole.

However, as far as the conventional stretching mechanism 103 is concerned, it can be known that a uniform tension is applied to the region L1 close to the cut-off region C and the region L2 away from the cut-off region C. That is, in the case where the tension mechanism 101 applies a tension J1 of a size that can suitably remove the wrinkles F in the area L2, the tension J1 is not sufficient to remove the wrinkles F in the area L1. As a result, as shown in FIG. 17( b ), the wrinkles F still remain in the area L1.

On the one hand, when the tension mechanism 101 applies a larger stretching force J2 in order to reliably remove the wrinkles F in the region L1, the magnitude of the stretching force J2 in the region L1 is appropriate to remove the wrinkles F. However, in the region L2, the tensile force J2 is an excessively large force, and although the wrinkles F running along the release direction can be removed, as a result of applying an excessive force in the width direction R, new wrinkles extending in the width direction may be generated. The case of wrinkle G (Fig. 17(c)). Also, due to the application of excessive tension, the adhesive tape DT may be deformed such that it spreads in the width direction in the area L2 or the like, or the adhesive tape DT may be damaged such as cracks.

The present invention is made in view of this situation, and its main purpose is to provide a structure for attaching the adhesive tape to the workpiece, which can more reliably eliminate the problem of the adhesive tape being cut into a predetermined shape corresponding to the workpiece. The adhesive tape attachment method and the adhesive tape attachment device of the actual tension difference in each region.

The present invention adopts the following configurations to achieve the above object.

That is, a method for attaching an adhesive tape, which is characterized in that it includes: an attaching process, attaching a strip-shaped adhesive tape to a workpiece; a cutting process, cutting the aforementioned adhesive tape attached to the aforementioned workpiece corresponding to the aforementioned workpiece. Predetermined shape; and tension imparting process, when attaching the aforementioned adhesive tape to the aforementioned workpiece, tension is applied to the width direction of the aforementioned adhesive tape at the attached portion of the aforementioned adhesive tape, and the aforementioned tension imparting process is applied to the aforementioned adhesive tape At least two areas arranged in the longitudinal direction of the adhesive tape, that is, the first area close to the cut area cut into the predetermined shape in the previous cutting process, and the cut area farther away from the first area than the first area Different tensions are applied to the width direction of the aforementioned adhesive tape for each of the second regions.

(Function and Effect) According to this configuration, when the adhesive tape is attached to the workpiece, a tension applying process is provided for applying tension in the width direction of the adhesive tape to the portion where the adhesive tape is attached. In the tension application process, different tensions are applied in the width direction of the adhesive tape to each of the first region and the second region arranged in the longitudinal direction of the adhesive tape. The first region is close to the cutout region cut into a predetermined shape in the previous cutting process, and the second region is further away from the cutout region than the first region.

Therefore, even in the state where different tensions act on each of the first region and the second region, the tension between the first region and the second region can still be adjusted. Each of the regions imparts a different tension respectively. As a result, the magnitude of the tension acting on each of the first region and the second region can be reliably uniformized through the tension imparting process.

Also, in the above invention, it is preferable that the tension applying process includes: a holding process of holding the first region from both sides in the width direction of the adhesive tape by using a first holding mechanism, and holding the first region by using a second holding mechanism. The second area is grasped from both sides of the width direction of the aforementioned adhesive tape; and in the stretching process, the aforementioned first grasping mechanism is stretched toward the width direction of the aforementioned adhesive tape with the first force, and the aforementioned second grasping mechanism is combined with the aforementioned The second force different from the first force is stretched in the width direction of the aforementioned adhesive tape.

(Function and Effect) According to this configuration, the first region and the second region are gripped by respective different gripping mechanisms, and are stretched in the width direction of the adhesive tape with respective different forces. Therefore, it can control so that the tension|tensile_strength given to the width direction of the adhesive tape in the 1st area|region and the tension|tensile_strength given to the widthwise direction of the adhesive tape in the 2nd area will become different reliably.

Also, in the above invention, preferably, the tension imparting process includes: a holding process of holding the first region and the second region from both sides in the width direction of the adhesive tape using a holding mechanism; and a stretching process, Stretching the portion of the holding mechanism holding the first region in the width direction of the adhesive tape with a first force, and pulling the portion of the holding mechanism holding the second region with a second force different from the first force. Stretch in the width direction of the aforementioned adhesive tape.

(Function and Effect) According to this configuration, the first region and the second region are gripped from both sides in the width direction of the adhesive tape using the gripping mechanism. Then stretch the part of the holding mechanism that holds the first region to the width direction of the adhesive tape with the first force, and stretch the part of the holding mechanism that holds the second region to the width of the adhesive tape with a second force different from the first force. direction stretch. In this case, it is possible to control such that the tension applied to the first region and the tension applied to the second region are definitely different without separating the gripping mechanism.

Also, in the above invention, preferably, the tension applying process includes: a holding process of holding the first region and the second region from both sides in the width direction of the adhesive tape by using a holding mechanism; and stretching in an oblique direction. In the process, the aforementioned holding mechanism is stretched from the width direction of the aforementioned adhesive tape to the direction oblique to the long side direction of the aforementioned adhesive tape.

(Function and Effect) According to this configuration, the first region and the second region are gripped from both sides in the width direction of the adhesive tape using the gripping mechanism. Then, the holding mechanism is pulled in a direction inclined from the width direction of the adhesive tape toward the long side direction of the adhesive tape. Even with such a configuration, it is possible to control such that the tension applied to the first region and the tension applied to the second region are definitely different.

In addition, in the above invention, preferably, the tension applying process includes: a holding process of holding the first region and the second region from both sides in the width direction of the adhesive tape using a holding mechanism; and In the stretching process, the gripping mechanism is adhered to the aforementioned gripping mechanism through a stretching member provided on the side of the gripping mechanism that grips the first region and the portion gripping the second region that grips the first region. The belt is stretched in the width direction.

(Function and Effect) According to this configuration, the first region and the second region are gripped from both sides in the width direction of the adhesive tape using the gripping mechanism. Then, the gripping mechanism is stretched in the width direction of the adhesive tape through the stretching member provided on the side of the portion gripping the first region among the portion gripping the first region and the portion gripping the second region. In this case, the force to stretch the stretch member in the width direction acts more strongly on the side of the first region. Therefore, the tension applied to the first region and the tension applied to the second region can be controlled so that the tension applied to the first region and the tension applied to the second region are definitely different without having a plurality of separate gripping mechanisms and a plurality of stretching mechanisms.

In addition, in the above invention, it is preferable to include: a two-end detection process for detecting the positions of the two ends of the adhesive tape in the width direction in the first region and the positions of the two ends of the adhesive tape in the second region in the width direction. The positions of the ends are detected respectively; and the tension calculation process is based on each of the detected positions of the two ends, the tension applied to the first area in the width direction of the adhesive tape and the tension applied to the second area to the adhesive tape The tension applied in the width direction was calculated separately.

(Function and Effect) According to this configuration, the positions of both ends of the width direction of the adhesive tape in the first area and the positions of both ends of the width direction of the adhesive tape in the second area are respectively detected. Then, according to the detected positions of the two ends, respectively, calculate the sheet assigned to the first area Force and tension imparted to the second area. In this case, by appropriately detecting the position change of both ends, it is possible to accurately and precisely calculate whether the tension applied to the first region and the tension applied to the second region are appropriate. Therefore, the tension acting on the first region and the tension acting on the second region can be uniformed more reliably and precisely.

In order to achieve such an object, the present invention may also take the following configurations.

That is, an adhesive tape attaching device is characterized by comprising: an attaching mechanism for attaching a strip-shaped adhesive tape to a workpiece; a cutting mechanism for cutting the aforementioned adhesive tape attached to the aforementioned workpiece into pieces corresponding to the aforementioned workpiece. a predetermined shape; and a tension imparting mechanism, when the aforementioned adhesive tape is attached to the aforementioned workpiece, tension is applied to the width direction of the aforementioned adhesive tape at the attachment portion of the aforementioned adhesive tape, and the aforementioned tension imparting mechanism is applied to the aforementioned adhesive tape At least two areas arranged in the longitudinal direction of the adhesive tape, that is, the first area close to the cut area cut into the predetermined shape in the previous cutting process, and the cut area farther away from the first area than the first area Each of the second regions of the regions applies different tensions in the width direction of the adhesive tape.

(Functions and Effects) According to this configuration, when the adhesive tape is attached to the work, the tension applying mechanism is provided for applying tension in the width direction of the adhesive tape to the sticking portion of the adhesive tape. In the tension imparting process, different tensions are applied in the width direction of the adhesive tape to each of the first region and the second region arranged in the longitudinal direction of the adhesive tape. The first region is close to the cutout region cut into a predetermined shape in the previous cutting process, and the second region is farther away from the cutout region than the first region.

Therefore, even in a state where different tensions are applied to each of the first region and the second region, different tensions can be applied to each of the first region and the second region. As a result, the magnitude of the tension acting on each of the first region and the second region can be reliably uniformized through the tension imparting process.

Also, in the above invention, it is preferable that the tension imparting mechanism includes: a first gripping mechanism for gripping the first region from both sides in the width direction of the adhesive tape; a second gripping mechanism for gripping the second region from The two sides of the width direction of the aforementioned adhesive tape are gripped; the first tensile member is used to stretch the aforementioned first gripping mechanism to the width direction of the aforementioned adhesive tape with a first force; and the second tensile member is used to stretch the aforementioned second gripping mechanism It is stretched in the width direction of the said adhesive tape with the 2nd force different from the said 1st force.

(Function and Effect) According to this configuration, the first region and the second region are gripped by respective different gripping mechanisms, and are stretched in the width direction of the adhesive tape with respective different forces. Therefore, it can control so that the tension|tensile_strength given to the width direction of an adhesive tape in a 1st area|region and the tension|tensile_strength given to a widthwise direction of an adhesive tape in a 2nd area|region will differ reliably.

Further, in the above invention, preferably, the tension imparting means includes: a gripping mechanism for gripping the first region and the second region from both sides in the width direction of the adhesive tape; The first stretching member stretches the portion of the gripping mechanism gripping the first region in the width direction of the adhesive tape with a first force; and the second stretching member stretches the gripping mechanism gripping the second region. The portion is stretched in the width direction of the adhesive tape by a second force different from the first force.

(Function and Effect) According to this configuration, the tension applied to the first region and the tension applied to the second region can be controlled so that the tension applied to the first region and the tension applied to the second region are definitely different using a single gripping mechanism.

Further, in the above invention, it is preferable that the tension imparting mechanism includes: a holding mechanism for holding the first region and the second region from both sides in the width direction of the adhesive tape; The holding mechanism is stretched in a direction inclined from the width direction of the adhesive tape to the long side direction of the adhesive tape.

(Function and Effect) According to this configuration, the tension applied to the first region and the tension applied to the second region can be controlled so that the tension applied to the first region and the tension applied to the second region are definitely different by using a single gripping mechanism and a single stretching mechanism.

Also, in the above invention, it is preferable that the tension imparting mechanism includes: a holding mechanism for holding the first region and the second region from both sides in the width direction of the adhesive tape; The gripping mechanism is stretched in the width direction of the adhesive tape on the side of the portion gripping the first region and the portion gripping the second region of the gripping mechanism.

(Function and Effect) According to this configuration, the first region and the second region are gripped from both sides in the width direction of the adhesive tape using the gripping mechanism. Then, the gripping mechanism is stretched in the width direction of the adhesive tape through the stretching member provided on the side of the portion gripping the first region among the portion gripping the first region and the portion gripping the second region. In this case, the force of stretching the tensile member toward the width direction will act more strongly on the side of the first region, so the tension applied to the first region can be equal to the tension applied to the second region without separating the holding mechanism. The tension is indeed controlled in different ways.

In addition, in the above invention, it is preferable to include: both end detection means for detecting the positions of both ends of the adhesive tape in the width direction in the first area and the positions of both ends of the adhesive tape in the width direction in the second area. The positions of the ends are detected respectively; and the tension calculation mechanism, based on each of the detected positions of the two ends, compares the tension applied to the first area to the width direction of the adhesive tape and the tension applied to the second area to the adhesive tape. The tension applied in the width direction was calculated separately.

(Function and Effect) According to this configuration, by appropriately detecting the position change of both ends, it is possible to accurately and precisely calculate whether the tension applied to the first region and the tension applied to the second region are appropriate. Therefore, the tension acting on the first region and the tension acting on the second region can be uniformed more reliably and precisely.

According to the adhesive tape attaching method and the adhesive tape attaching device of the present invention, after attaching the adhesive tape to a work piece and cutting it into a pre-set corresponding to the work piece, In the formation of a fixed shape, the difference in tension in each area that occurs when the adhesive tape is cut can be more reliably resolved.

1‧‧‧Adhesive tape attaching device

3‧‧‧With supply department

4‧‧‧1st tension mechanism

5‧‧‧Holding table

7‧‧‧With attachment unit

9‧‧‧with cutting unit

11‧‧‧with stripping unit

13‧‧‧with recycling department

15‧‧‧Recycling department of isolation zone

27‧‧‧Cylinder

28‧‧‧idler roller

29‧‧‧tension roller

31‧‧‧Wafer Holder

33‧‧‧Frame holding part

37‧‧‧Second tension mechanism

40‧‧‧Control Department

43‧‧‧Cutter

45‧‧‧Press roller

47‧‧‧Nip roller

50‧‧‧Input Unit

53‧‧‧The first stretching mechanism

51‧‧‧The second stretching mechanism

61‧‧‧Controlling components

63‧‧‧Cylinder

65‧‧‧motor

71‧‧‧Sensor

DT‧‧‧adhesive tape

S‧‧‧isolation zone

C‧‧‧Removal area

F, G‧‧‧wrinkles

Fig. 1 is a front view showing the basic configuration of an adhesive tape sticking device according to Embodiment 1.

Fig. 2 is a diagram showing the configuration of the second tension mechanism of the first embodiment. Fig. 2 (a) is a plane view of the second tension mechanism, and Fig. 2 (b) is a left side view of the second tension mechanism.

Fig. 3 is a diagram showing the operation of the adhesive tape sticking device of the first embodiment. Fig. 3(a) is a flow chart showing the outline of the process of manufacturing the mounting frame, and Fig. 3(b) is a perspective view showing the structure of the mounting frame.

FIG. 4 is an operation diagram showing step S3 of the first embodiment. FIG. 4( a ) is a state diagram before the adhesive tape is attached, and FIG. 4( b ) is a state diagram after the adhesive tape is attached to the wafer and the ring frame.

FIG. 5 is an operation diagram showing step S4 of the first embodiment.

FIG. 6 is an operation diagram showing step S5 of the first embodiment.

FIG. 7 is an operation diagram showing step S6 of the first embodiment.

FIG. 8 is an operation diagram showing step S7 of the first embodiment. Fig. 8(a) is a plan view showing the state of the adhesive tape before step S7 is started, and Fig. 8(b) is a plan view showing the state of the adhesive tape after step S7 is executed.

FIG. 9 is an operation diagram showing step S8 of the first embodiment. Fig. 9(a) is a plan view showing a state in which the second tension mechanism holds the adhesive tape, and Fig. 9(b) is a left side view showing a state in which the second tension mechanism holds the adhesive tape.

FIG. 10 is a diagram showing the operation of step S8 in the first embodiment. Fig. 10(a) is a left side view showing a state in which tension is applied by the second tension mechanism, and Fig. 10(b) is a plan view showing a state in which tension is applied by the second tension mechanism.

FIG. 11 is a schematic diagram illustrating step S8 of the first embodiment. Figure 11(a) is a plan view showing the width of the original adhesive tape, Figure 11(b) is a schematic plan view showing the width of the adhesive tape after step S4 is completed, and Figure 11(c) is a plan view showing the width of the adhesive tape after step S8 is completed A schematic plan view of the width of the adhesive tape.

Fig. 12 is a diagram showing the configuration of the second tension mechanism of the second embodiment. Fig. 12 (a) is a plan view of the second tension mechanism, and Fig. 12 (b) is a front view of the second tension mechanism.

Fig. 13 is an operation diagram showing step S8 of the second embodiment. Fig. 13(a) is a plan view showing a state in which the adhesive tape is gripped by the second tension mechanism, and Fig. 13(b) is a plan view showing a state in which tension is applied by the second tension mechanism.

FIG. 14 is an operation diagram showing step S8 of the modified example. Fig. 14(a) is a plan view showing a state where tension is applied by the second tension mechanism of the first modification, and Fig. 14(b) is a plan view showing a state where tension is applied by the second tension mechanism of the second modification.

Fig. 15 is a diagram illustrating an adhesive tape sticking device according to a modified example. Fig. 15 (a) is a perspective view showing the structure of a wafer used in a modified example, and Fig. 15 (b) is a front view showing an example of a preferred configuration of a holding table and a tape cutting unit in a modified example. 15(c) is a front view illustrating the action of step S4 of the modified example. FIG. 15(d) is a plan view showing an example of the cutting track where the adhesive tape is cut in the modified example. FIG. In the example, the plan view of the different examples of the cutting track where the adhesive tape is cut off, Fig. 15(f) is a front view showing a different example of the structure of the preferred holding table in the modified example.

Fig. 16 is a diagram illustrating a conventional adhesive tape sticking device. Figure 16(a) shows the state before the adhesive tape is cut, Figure 16(b) shows the state after the adhesive tape is cut, and Figure 16(c) shows the adhesive tape is cut to produce wrinkles State diagram, Fig. 16 (d) is a diagram showing the ideal state of removing wrinkles by a known tension mechanism.

Fig. 17 is a diagram illustrating problems of the conventional adhesive tape sticking device. Fig. 17(a) is a diagram showing the direction of the formed wrinkles, Fig. 17(b) is a diagram showing problem points when a weak tension is given, and Fig. 17(c) is a diagram showing when a strong tension is given A diagram of the problem points of the situation.

[Example 1]

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view showing the basic configuration of an adhesive tape applying device 1 according to Example 1. As shown in FIG. In addition, in the figure which shows the adhesive tape sticking apparatus 1, illustration of the support means which supports various structures, the drive means which drives various structures, etc. is abbreviate|omitted.

The adhesive tape sticking device 1 of Example 1 is used to stick the adhesive tape DT for support on one side of the semiconductor wafer W (hereinafter, simply referred to as "wafer W") and the ring frame f, and produce the adhesive tape DT shown in Fig. 3(b). ) shown in the installation frame MF for the purpose. In addition, in this embodiment, the wafer W that has been processed by back grinding is used.

In addition, "upstream" and "downstream" in this embodiment are defined along the release direction L of the adhesive tape DT. That is, "upstream" means the side closer to the tape supply unit 3 described later in the discharge direction L of the adhesive tape DT.

<Description of overall composition>

The adhesive tape sticking device 1 of the present embodiment is as shown in FIG. Belt recovery unit 13 , spacer belt recovery unit 15 and second tension mechanism 37 .

The tape supply unit 3 includes a supply bobbin 19, a peeling roller 21, and the like. The raw material roll 20 is loaded in the supply bobbin 19 . The adhesive tape DT for support is wound up on the raw material roll 20 in the state to which the separator tape S was added.

The supply bobbin 19 is interlocked with the electromagnetic brake 23 and is given moderate rotational resistance. The electromagnetic brake 23 prevents the adhesive tape DT from being fed out and supplied excessively from the supply bobbin 19 .

The peeling roller 21 peels the separator tape S from the adhesive tape DT, and guides the peeled separator tape S toward the separator tape recovery unit 15 .

The first tension mechanism 4 is, as shown in FIG. 1 , provided with a cylinder 27 for vibrating the swing arm 25 . The swing arm 25 is supported by a shaft of an idler roller 28 by a support shaft of a fixed shaft, and has a tension roller (dancer roller) 29 on the free end side. The first tension mechanism 4 is configured such that the tension roller 29 on the free end side of the swing arm 25 that swings in conjunction with the operation of the cylinder 27 descends to push down the adhesive tape DT and apply tension in the release direction L.

As shown in FIG. 1 , the holding table 5 includes a wafer holding portion 31 , a frame holding portion 33 , and a base portion 17 . The wafer holding unit 31 places and holds the wafer W on which the protective adhesive tape PT is attached to the circuit formation surface with the circuit formation surface facing down. In the present embodiment, although a chuck table for sucking and holding the wafer W is used as the wafer holding unit 31 , the configuration of the wafer holding unit 31 is not limited to this.

The frame holding unit 33 is constituted by a ring-shaped base erected so as to surround the wafer holding unit 31 , and places and holds the ring frame f. Furthermore, the wafer holding unit 31 and the frame holding unit 33 are configured such that the upper surface of the wafer W placed on the wafer holding unit 31 and the upper surface of the ring frame f placed on the frame holding unit 33 are in the same plane. The base portion 17 is connected to the lower portion of each of the wafer holding portion 31 and the frame holding portion 33, and is configured to be movable up and down.

The tape attaching unit 7 attaches an adhesive tape DT to the circuit surface of the wafer W placed on the holding table 5 and held by suction. The tape attaching unit 7 includes, as shown in FIG. 1 , a movable table 34 horizontally reciprocable left and right along an unshown rail, and an attaching roller 35 whose shaft is supported by a bracket connected to the movable table 34 .

The tape cutting unit 9 is arranged above the holding table 5 and includes a frame 38 , a support shaft 39 , a support arm 41 , a cutter 43 , and a pressing roller 45 .

The supporting shaft 39 is configured to be movable up and down along the frame 38 and driven to rotate around the longitudinal axis P located at the center of the holding table 5 . A plurality of support arms 41 extend in the radial direction around the support shaft 39 . The cutter 43 is arranged at the front end of the support arm 41a, and cuts the adhesive tape DT attached to the ring frame f and the wafer W along the ring frame f. The pressing roller 45 is provided at the front end of the support arm 41b, and presses the cut tape portion on the ring frame f while rotating.

The tape peeling unit 11 cuts the adhesive tape DTw and the adhesive tape DTw attached to the surface of the wafer W after being cut by the cutter 43 to become an unnecessary adhesive tape DT, that is, separates it from the unnecessary tape DTn. The tape peeling unit 11 is provided with the guide roller 46 which maintains the tension|tensile_strength of the adhesive tape DT in cooperation with the 1st tension mechanism 4, and the pinch roller 47.

The nip roller 47 is composed of a press roller 47a that can move up and down and a feed roller 47b driven by a motor. The tape peeling unit 11 is configured so as to be horizontally reciprocable in the left and right along an unillustrated rail.

The tape recovery unit 13 is disposed downstream of the tape peeling unit 11, and forms a recovery bobbin 49 for winding up unnecessary tape DTn to be rotationally driven in the winding direction. The spacer tape collection part 15 forms the collection|recovery bobbin 51 which winds up the spacer tape S peeled off from the adhesive tape DT, and rotates and drives in the winding direction. Each of the recovery bobbins 49 and 51 is controlled to be rotatably driven forward and reverse by a motor not shown.

In addition, the adhesive tape sticking device 1 further includes a control unit 40 and an input unit 50 . The control part 40 is equipped with CPU (Central Processing Unit) etc., and controls various operations of the adhesive tape sticking apparatus 1 collectively. Examples of the input unit 50 include a console panel, a keyboard, and the like, and the operator can use the input unit 50 to input various instructions. The instruction content input to the input part 50 is sent to the control part 40, and the control part 40 can perform various general control according to this instruction.

<The composition of the second tension mechanism>

Here, the configuration of the second tension mechanism 37 will be described. The second tension mechanism 37 holds both ends in the width direction R in a predetermined region H in the adhesive tape DT. The second tension mechanism 37 is composed of a plurality of tension mechanisms independently driven and controlled. In this embodiment, it is set to be composed of two stretching mechanisms, that is, the first stretching mechanism 53 and the second stretching mechanism 55 . The first stretching mechanism 53 and the second stretching mechanism 55 are arranged in parallel in the release direction L of the adhesive tape DT. The second tension mechanism 37 corresponds to the tension applying mechanism in the present invention.

The first stretching mechanism 53 is provided on the downstream side of the second stretching mechanism 55 as shown in FIG. The second stretching mechanism 55 is constituted by a pair of grasping units 55A and 55B arranged so as to face each other in the clamp holding table 5 .

The holding units 53A and 53B hold both ends of the width direction R of the adhesive tape DT, respectively, and move to the width direction R by a predetermined distance. Through this movement, tension P1 of a predetermined magnitude is applied in the width direction R in the region gripped by the first stretching mechanism 53 in the adhesive tape DT. Moreover, holding|grip units 55A and 55B hold both ends of the width direction R of the adhesive tape DT, respectively, and move to width direction R by predetermined distance similarly. Through this movement, tension P2 of a predetermined magnitude is applied to the width direction R in the region gripped by the second stretching mechanism 55 in the adhesive tape DT.

The gripping units 53A, 53B, 55A, and 55B have the same configuration, and each includes a gripping member 61 , a cylinder 63 , and a motor 65 . The holding member 61 holds the adhesive tape DT from both sides in the thickness direction (y direction in this embodiment). And the holding member 61 is configured so that the holding can be appropriately released.

The cylinder 63 is connected to the grasping member 61, and is configured to expand and contract in the width direction R in conjunction with forward and reverse rotation of the motor 65. As shown in FIG. That is, the gripping member 61 can move in the width direction R in the state gripping the adhesive tape DT along with the expansion-contraction operation of the cylinder 63 . The distance and direction of movement of the holding member 61 in the width direction R are determined according to the rotation amount and the rotation direction of the motor 65 .

As shown in FIG. 2( b ), the holding member 61 includes a fixed receiving piece 67 , a movable piece 68 , a cylinder 69 , and a motor 70 . The cylinder 69 is connected to the movable piece 68, and expands and contracts in the thickness direction of the adhesive tape DT in conjunction with the normal and reverse rotation of the motor 70. That is, the movable piece 68 moves up and down in the thickness direction of the adhesive tape DT along with the expansion and contraction of the cylinder body 69 . The holding member 61 is configured to open and close by fixing the receiving piece 67 and the movable piece 68, and stably holds the adhesive tape DT by being in the closed state, and is released by being in the open state.

The rotation of the motor 65 provided in each of the holding units 53A, 53B, 55A, and 55B is independently controlled by the control unit 40 . In particular, the rotation of the motor 65 provided to each of the holding units 53A and 53B and the rotation of the motor 65 provided to each of the holding units 55A and 55B are independently controlled. In this embodiment, by independently controlling the rotation of the motor 65, the magnitude of the tension P1 imparted by the first stretching mechanism 53 and the magnitude of the tension P2 imparted by the second stretching mechanism 55 can be different respectively. way to control.

In Example 1, the holding member 61 provided in each of the holding units 53A and 53B corresponds to the first holding mechanism in the present invention. The holding member 61 provided in each of the holding units 55A and 55B corresponds to the second holding mechanism in the present invention. The cylinder 63 and the motor 65 provided in each of the holding units 53A and 53B correspond to the first tensile member in the present invention. The cylinder 63 and the motor 65 provided in each of the holding units 55A and 55B correspond to the second tensile member in the present invention.

In addition, the adhesive tape sticking device 1 includes a sensor 71 . Sensor 71 is as shown in Figure 1, by the sensor that is arranged side by side in releasing direction L device 71a and sensor 71b. Each of the sensor 71a and the sensor 71b is constituted by a pair of sensors.

The sensor 71a and the sensor 71b detect the position of both ends in the width direction R of the adhesive tape DT, as shown in FIG.10(a) etc. That is, the sensor 71a detects the position of both ends of the width direction R of the adhesive tape DT with respect to the area gripped by the 1st stretching mechanism 53 among the adhesive tape DT. The sensor 71b detects the position of the both ends of the width direction R of the adhesive tape DT with respect to the area gripped by the 2nd stretching mechanism 55 among the adhesive tape DT.

As the structure of the sensor 71, the structure which can detect the edge part position of the adhesive tape DT, such as an optical sensor and a pressure sensor, can also be used suitably. The control unit 40 calculates the tension P1 applied by the first stretching mechanism 53 and the tension P2 applied by the second stretching mechanism 55 based on the end position of the adhesive tape DT detected by the sensor 71 . The calculation method will be described in detail later. The sensor 71 corresponds to both end detection means in the present invention, and the control unit 40 corresponds to the tension calculation means in the present invention.

<Summary of Taping Action>

Here, a series of basic operations for producing the mounting frame MF using the adhesive tape sticking device 1 will be described. FIG. 3 is a flow chart illustrating the process of attaching the adhesive tape DT for support over the wafer W and the ring frame f.

At this time, each of the holding table 5, the tape sticking unit 7, the tape cutting unit 9 and the tape peeling unit 11 moves to the initial position shown in FIG. 4(a). That is, the tape attaching unit 7 moves to the right of the holding table 5 , and the tape peeling unit 11 moves to the left of the holding table 5 . Again, the belt cutting unit 9 is in the The top of the platform 5 is on standby. The holding table 5 moves the base 17 downward so as not to interfere with the adhesive tape DT even if the ring frame f and the wafer W are placed thereon.

In addition, in the tape supply unit 3 , the adhesive tape DT to which the separator tape S is added is fed out from the raw material roll 20 loaded on the bobbin 19 downstream for supply, and is peeled by the peeling roller 21 into the adhesive tape DT and the separator tape. S. Then the adhesive tape DT is guided to the tape sticking unit 7 and the tape peeling unit 11 . Moreover, moderate tension is applied to the adhesive tape DT in the feeding direction L by the first tension mechanism 4 , the guide roller 46 , and the nip roller 47 .

When a sticking command is issued, the wafer W stored in the predetermined wafer storage section is aligned on the alignment table, and then placed on the wafer holding section of the holding table 5 by a wafer transfer mechanism not shown. 31. The wafer W placed on the wafer holding unit 31 is rotated and sucked and held while being aligned so that the center of the wafer W is above the center of the wafer holding unit 31 . (step S1).

Next, the ring frame f stored in the predetermined frame storage unit is placed on the frame holding unit 33 by a frame transfer mechanism not shown after the alignment stage is aligned. The upper surface of the ring frame f placed on the frame holding unit 33 is flush with the upper surface of the wafer W (step S2 ).

Next, as shown in FIG. 4( b ), the base 17 of the holding table 5 moves up and moves, and the upper surfaces of the wafer W and the ring frame f become substantially the same height as the adhesive tape DT. Next, the attaching roller 35 of the tape attaching unit 7 rotates forward (leftward in FIG. 4 ) on the wafer W while pressing the adhesive tape DT downward, from the initial position shown by the dotted line toward the position shown by the solid line. The displayed end positions are moved. Thereby, the adhesive tape DT is closely attached to the covering wafer The entire rear surface of W and the range of frame f are used to manufacture mounting frame MF (step S3).

After the adhesive tape DT is attached to the wafer W and the ring frame f, the tape cutting unit 9 operates to start cutting the adhesive tape DT. That is, as shown in FIG. 5 , the supporting shaft 39 is lowered to a predetermined height through the action of the tape cutting unit 9 on standby above, and the cutting knife 43 is pierced into the adhesive tape DT.

In this state, the support shaft 39 is rotated about the axis of the longitudinal axis P. Through this rotation, the support arm 41 rotates around the longitudinal axis P as the rotation center. The cutter 43 rotates on the ring frame f along with the rotation of the support arm 41, and cuts the adhesive tape DT into a circle along the ring frame f (step S4). At this time, the pressing roller 45 rotates behind the rotating cutter 43 . That is, since the portion of the adhesive tape DT cut by the cutter 43 is pressed by the pressing roller 45, the cut portion can be prevented from floating from the upper surface of the ring frame f.

When cutting the adhesive tape DT along the ring frame f is completed, the tape cutting unit 9 is raised to the original standby position. Then, the tape attaching unit 7 returns to the initial position from the terminal position. The tape attaching unit 7 returns to the original position, as shown in FIG. 6, and the tape peeling unit 11 moves forward (right direction in FIG. 6). That is, the tape peeling unit 11 moves rightward from the initial position shown by the dotted line in FIG. 6 toward the final position shown by the solid line while slightly raising the pressure roller 47 .

The tape peeling unit 11 winds up and peels off the unnecessary tape DTn remaining after being cut on the wafer W out of the adhesive tape DT while moving toward the terminal position (step S5 ). In addition, the symbol DTw is attached to the part of the adhesive tape DT attached to the surface of the wafer W to distinguish it from the part without DTn.

At this time, the adhesive tape DT peeled off from the ring frame f and the wafer W is cut circularly at the portion C (cut region C) cut by the cutter 43 as shown in FIG. 8( a ). Furthermore, by forming the cut-out area C, especially in the vicinity of the upstream of the cut-out area C, wrinkles F extending toward the release direction L are generated at high frequency on the adhesive tape DT. In the present example, the wrinkles F are generated in the two regions L1 and L2 aligned in the discharge direction L. As shown in FIG.

Since the wrinkles F are generated, the width of the adhesive tape DT in plan view becomes narrower than the width M of the case where the adhesive tape DT is flat. At this time, more wrinkles F are generated in the area L1 closer to the cut-off area C than in the area L2 slightly upstream of the area L1. That is, the width M1 of the adhesive tape DT in the region L1 where wrinkles F are generated is substantially narrower than the width M2 of the adhesive tape DT in the region L2 where wrinkles F are generated less ( FIG. 11( b )). In addition, at this time, the tension T1 in the width direction acting on the area L1 where wrinkles F are generated much becomes smaller than the tension T2 in the width direction acting on the area L2 where wrinkles F are generated less. In Example 1, the region L1 corresponds to the first region in the present invention, and the region L2 corresponds to the second region in the present invention.

When the tape peeling unit 11 reaches the terminal position of the peeling operation and each process up to step S5 is completed, as shown in FIG. . When the holding table 5 descends to the initial position shown by the solid line in FIG. 7, the suction in the holding table 5 is released. After the suction is released, the mounting frame MF to which the adhesive tape DTw is stuck is conveyed by the mounting frame conveying mechanism and collected by a mounting frame collecting unit not shown (step S6).

When the mounting frame MF is collected, a certain amount of unnecessary tape DTn is wound up and guided toward the tape collecting section 13, and a certain amount of adhesive tape DT is fed out from the tape supply section 3 (step S7). After a certain amount of adhesive tape DT is released, as shown in FIG. 8( b ), the cut-off region C located above the wafer holding portion 31 moves downstream by a predetermined distance.

After the adhesive tape DT is unwound and the cut-off area C located above the wafer holder 31 is moved downstream, the adhesive tape DT is corrected in step S8 to remove the wrinkles F formed on the adhesive tape DT. Hereinafter, the process of step S8 will be described.

When step S8 is started, first, the holding member 61 is driven to hold the adhesive tape DT for each of the first stretching mechanism 53 and the second stretching mechanism 55 . That is, as shown in FIG. 9( a ), each of the holding units 53A and 53B is appropriately moved inward in the width direction R. As shown in FIG. Through this movement, the end portions in the width direction of the adhesive tape DT enter between the fixed receiving piece 67 and the movable portion 68 .

Next, the control part 40 rotates the motor 70 in the state which entered the edge part of the width direction of the adhesive tape DT. By the rotation of the motor 70, as shown in FIG. 9(b), the cylinder 69 extends downward. Through the elongation of the cylinder body 69, the movable part 68 moves downward. As a result, the distance between the fixed holder 67 and the movable part 68 becomes short, and the end of the adhesive tape DT in the area L1 is gripped by the fixed holder 67 and the movable part 68 .

In addition, FIG. 9( b ) shows the operation of the grasping units 53A and 53B constituting the first stretching mechanism 53 , but the movement of the grasping units 55A and 55B constituting the second stretching mechanism 55 is also the same.

As shown in Figure 9(a). The first stretching mechanism 53 and the second stretching mechanism 55 grip both ends of the adhesive tape DT in the vicinity of the upstream of the cutting area C. The holding units 53A and 53B of the first stretching mechanism 53 hold both ends of the width direction R of the adhesive tape DT in the region L1 closer to the cut-off region C. The holding units 55A and 55B of the second stretching mechanism 55 hold both ends of the width direction R of the adhesive tape DT in the region L2 slightly upstream of the region L1.

When both ends in the width direction of the adhesive tape DT are gripped by each of the first stretching mechanism 53 and the second stretching mechanism 55 , the control unit 40 rotates each of the motors 65 . Through the rotation of each of the motors 65 , as shown in FIG. 10( a ), the holding member 61 of the holding unit 53A and the holding member 61 of the holding unit 53B move outward in the width direction R and in opposite directions to each other.

By each of the holding members 61 moving toward the width direction R, the adhesive tape DT held by each of the holding members 61 is stretched toward both outer sides in the width direction. The adhesive tape DT is stretched, and the tension in the width direction R is further applied to the adhesive tape DT provided with the tension in the release direction L. As a result, the wrinkles F generated on the adhesive tape DT are removed, and the adhesive tape DT becomes flat.

FIG. 10( a ) shows the operation of the grasping units 53A and 53B constituting the first stretching mechanism 53 . Moreover, the holding units 55A and 55B constituting the second stretching mechanism 55 also apply tension in the width direction R to the adhesive tape DT by moving the holding members 61 outward in the width direction R and in opposite directions.

As a feature of the present invention, the control unit 40 independently controls the rotation of each of the motors 65 provided in the first stretching mechanism 53 and the rotation of each of the motors 65 provided in the second stretching mechanism 55 . Specifically, the moving distance of the holding units 53A and 53B in the width direction R is longer than the moving distance of the holding units 55A and 55B in the width direction R. FIG. As a result, the tension P1 applied to the region L1 gripped and stretched by the first stretching mechanism 53 becomes larger than the tension P2 applied to the region L2 gripped and stretched by the second stretching mechanism 55. .

As described above, when wrinkles F are being generated, the width of the adhesive tape DT in the region L1 where wrinkles F are generated is substantially narrower than the width of the adhesive tape DT in the region L2 where wrinkles F are generated less (see FIG. 11(b)). Therefore, the motors 65 are independently controlled so that the moving distance of the first stretching mechanism 53 is longer than the moving distance of the second stretching mechanism 55 . And by performing this independent control, the second tension mechanism 37 can make the width of the adhesive tape DT in the area L1 and the width of the adhesive tape DT in the area L2 become the same length, and the respective different tensions P1 and P2 can be extended to the width. Direction R conferred.

By applying a large tension P1, many wrinkles F generated in the region L1 are reliably removed. And by applying a small tension P2, the small number of wrinkles F generated in the area L2 are also reliably removed, and new wrinkles can be prevented from being generated in the area L2.

In other words, the region L1 where the smaller tension T1 acts is given the larger tension P1, and the region L2 where the larger tension T2 acts is given the smaller tension P2. Therefore, by applying different tensions P1 and P2 by the second tension mechanism 37, the tension acting on the region L1 can be The magnitude T1 is made substantially the same as the tension T2 acting on the region L2 (see FIG. 11( c )).

Therefore, by the second tension mechanism 37, all the regions L1 and L2 in the adhesive tape DT are flattened with high precision. As a result, the area near the cut-off area C, that is, the areas L1 and L2 can be used as the area attached to the ring frame f and wafer W in the next attaching process, that is, as the next cut-out area C. By flattening the adhesive tape DT by the second tension mechanism 37, the process of step S8 is completed. Through a series of processes constituted by the above steps S1 to S8, one cycle of adhesive tape attaching process is completed.

Thereafter, the process from step S1 to step S8 is repeated until a predetermined number of mounting frames MF are produced. In addition, the state where the second tension mechanism 37 applies the tensions P1 and P2 in the width direction R to the adhesive tape DT is maintained until the process of attaching the adhesive tape DT (step S3) is completed in the adhesive tape attaching process of the next cycle. Execution is better.

Here, an example of the process of separately calculating the tension P1 and the tension P2 will be described. In this embodiment, each of the tension P1 and the tension P2 is determined by calculating the moving distances of the first stretching mechanism 53 and the second stretching mechanism 55 in step S8 using the sensor 71 .

That is, when the adhesive tape DT is flat, both ends of the width direction R of the adhesive tape DT extend in parallel to the release direction L. Therefore, the width of the adhesive tape DT in the plan view is the same length M in any region ( FIG. 11( a )). However, when wrinkles F are generated due to the formation of the cut-out region C, the length of the width V is shortened according to the amount of wrinkles F generated. Therefore, in the plan view, in the region L1 with many wrinkles F The length M1 of the width is shorter than the length M2 of the width in the region L2 (FIG. 11(b)).

Therefore, the sensor 71 is used to constantly detect the positions of both ends of the adhesive tape DT in the plan view, and the first stretching is determined so that the length of the width in the area L1 and the length of the width in the area L2 are both the same length. The moving distance of the mechanism 53 and the second stretching mechanism 55.

The width of the adhesive tape DT in the area L1 is timely detected by the sensor 71a. The width of the adhesive tape DT in the area L2 is timely detected by the sensor 71b. Therefore, the control unit 40 can accurately calculate the magnitude of the tension P1 and the magnitude of the tension P2 according to the information detected by the sensor 71a and the sensor 71b, so that the width of the adhesive tape DT in the area L1 and The widths of the adhesive tapes DT in the area L2 become equal.

Specifically, since the difference between M and M1 is greater than the difference between M and M2, the moving distance of the first stretching mechanism 53 is calculated to be longer than the moving distance of the second stretching mechanism 55 . The magnitude of the tension applied in the width direction of the adhesive tape DT varies depending on the moving distance of the first stretching mechanism 53 or the second stretching mechanism 55 that grips the adhesive tape DT and moves in the width direction R. As a result of moving the first stretching mechanism 53 and the second stretching mechanism 55 by the calculated distances, the length of the width of the adhesive tape DT in the plan view is equal to the length of the width of the adhesive tape DT in each of the regions L1 and L2 before the wrinkles F are generated. The same length M (Fig. 11(c)).

Thus, by detecting the end of the adhesive tape DT using the sensor 71, the moving distance of the first stretching mechanism 53 and the moving distance of the second stretching mechanism 55 in step S8 can be accurately calculated. Furthermore, excessive tension P1 and P2 given to the adhesive tape DT can be avoided.

In addition, especially when the adhesive tape DT is made of a soft material, it is preferable to determine the moving distances of the first stretching mechanism 53 and the second stretching mechanism 55 in consideration of the stretch rate of the adhesive tape DT. In this case, the length of the width direction of the adhesive tape DT after tension|tensile force P1 and P2 is given becomes longer than M according to this expansion-contraction rate.

<Effect of the configuration of the embodiment>

In the case of applying tension to the width direction of the adhesive tape in the conventional adhesive tape sticking device, a fixed area of both ends of the adhesive tape is held by clamping members or the like. Then, uniform tension is applied in the width direction over the entire range of the grasped region. Specifically, as shown in FIG. 15( d ), the conventional stretching mechanism 101 applies a uniform force to both the region L1 and the region L2 holding the adhesive tape DT and stretches it.

Therefore, in the known method, an equal tension is applied to each of the area close to the area where the adhesive tape is cut (cut-out area) and the area distant from the cut-out area. The tension acting on the area L1 close to the resection area and having many wrinkles is low, and the tension acting on the area L2 far from the resection area and having few wrinkles is high.

That is, after the adhesive tape DT is stretched by the conventional stretching mechanism 101 , there is a large difference between the tension acting on the region L1 and the tension acting on the region L2 . As a result, even if tension is applied in the width direction, the wrinkles generated in the adhesive tape cannot be reliably removed, and the distance between portions that can be set as the cutout area becomes large.

On the one hand, in the adhesive tape sticking device of this embodiment, the second tension mechanism 37 has a first stretching mechanism 53 and a second stretching mechanism 55. And in the area L1 of the adhesive tape DT that is closer to the cut-off area C, a larger tension P1 is applied to the width direction using the first stretching mechanism 53, and the first stretching mechanism 53 is used in the area L2 that is farther from the cut-off area C. A small tension P2 is applied in the width direction. That is, the expansion force of the adhesive tape DT by the first stretching mechanism 53 and the expansion force of the adhesive tape DT by the second stretching mechanism 55 can be independently controlled.

A large tension P1 is applied by the first stretching mechanism 53 in the region L1 in which wrinkles F are generated more in the adhesive tape DT extending in the release direction L in a belt shape. Therefore, since the adhesive tape DT is stretched toward both end sides in the width direction R with a sufficiently large force, many wrinkles F that are generated are reliably removed. As a result, the surface of the adhesive tape DT in the region L1 can be surely made flat ( FIG. 10( b )).

On the one hand, in the region L2 where wrinkles F are less generated, a small tension P2 is applied by the second stretching mechanism 55 . Since there are few wrinkles F generated in the area L2, the force required to remove the wrinkles F in the area L2 is small. Therefore, the wrinkles F in the area L2 can also be reliably removed.

Furthermore, by setting the tension P2 smaller than the tension P1, it is possible to prevent excessive tension from continuing to be applied in the width direction regardless of whether the wrinkles F have been removed in the region L2. Therefore, it is possible to avoid the problem of newly generating wrinkles G extending in the width direction R in the region L2 due to application of excessive tension (see FIG. 15( d )).

Thus, as a result of expanding (correcting) the adhesive tape DT in the width direction using the second tension mechanism 37 of this embodiment, after the expansion, the tension acting on the width direction of the adhesive tape DT is spread throughout the second sheet. The range of the area controlled by the force mechanism 37 becomes more uniform. That is, by completing the process of step S8, each of the area L1 close to the cut-off area C and the area L2 distant from the cut-off area C in the area held by the second tension mechanism 37, the tension acting on the width direction R becomes Much the same.

Therefore, the adhesive tape DT can be reliably flattened by using the second tension mechanism 37 even in the region where wrinkles are likely to occur, that is, the region near the upstream of the cut-off region C. As a result, the upstream vicinity area can be used as an area to be attached to the workpiece and cut off in the next cycle. Therefore, the distance between the cut-off regions C can be shortened to reduce the waste amount of the adhesive tape DT.

[Example 2]

Next, Embodiment 2 of the present invention will be described. In addition, the same code|symbol is attached|subjected to the same structure as the adhesive tape sticking apparatus of Example 1, and the structure of a different component, ie, the structure of a 2nd tension mechanism is demonstrated in detail.

The second tension mechanism 37 of the first embodiment is provided with a first tension mechanism 53 and a second tension mechanism 55 which are a plurality of independent tension mechanisms arranged in parallel in the release direction L. That is, the second tension mechanism 37 includes a plurality of pairs of holding units. On the other hand, the second tension mechanism 80 of the second embodiment is constituted by a pair of holding units 81A and 81B holding a predetermined area H in the adhesive tape DT as shown in FIG. 12 . The gripping units 81A and 81B are arranged to face each other across the holding table 5 . Holding units 81A and 81B hold both ends of the width direction R of the adhesive tape DT, respectively, and move to the width direction R by a predetermined distance.

Each of the holding units 81A and 81B includes a holding member 82 , a first cylinder 83 , and a second cylinder 84 . The holding member 82 holds the edge part of the width direction R of the adhesive tape DT over the predetermined area|region H. As shown in FIG.

Each of the first cylinder 83 and the second cylinder 84 is connected to the holding member 82 . The first cylinder 83 and the second cylinder 84 are arranged in parallel in the discharge direction L of the adhesive tape DT, and the first cylinder 83 is arranged on the downstream side of the second cylinder 84 in the discharge direction L. It is preferable that the first cylinder 83 and the second cylinder 84 are disposed at positions symmetrical to the center line Q of the holding member 82 in the pinch release direction L. As shown in FIG.

A first motor 86 is connected to the first cylinder 83 , and a second motor 87 is connected to the second cylinder 84 . The first cylinder 83 expands and contracts in the width direction R in conjunction with the forward and reverse rotation of the first motor 86 , and the second cylinder 84 expands and contracts in the width direction R in conjunction with the forward and reverse rotation of the second motor 87 . Then, the holding member 82 becomes movable in the width direction R while holding the adhesive tape DT in accordance with the expansion and contraction operation of the first cylinder 83 and the second cylinder 84 . Depending on the amount and direction of rotation of each of the first motor 86 and the second motor 87, the distance and direction of movement of the holding member 82 in the width direction R are determined.

The first cylinder 83 and the second cylinder 84 are expanded and contracted while the predetermined area H of the adhesive tape DT is held by the holding member 82. On the downstream side of the predetermined area H, the difference between the expansion and contraction of the first cylinder 83 Tension P1 of magnitude is added to the width direction R. And on the upstream side in the predetermined area H, a tension P2 corresponding to the magnitude of the expansion and contraction amount of the second cylinder 84 is added to the width direction R. As shown in FIG.

As a feature of the present invention, the control unit 40 independently controls the rotation of the first motor 86 and the rotation of the second motor 87 . That is, the telescopic movement of the first cylinder 83 and the telescopic movement of the second cylinder 84 are also independently controlled. Therefore, the magnitude of the tension P1 applied to the downstream side in the predetermined region H and the magnitude of the tension P2 applied to the upstream side in the predetermined region H can be adjusted independently.

In Example 2, the holding member 82 corresponds to the holding mechanism in the present invention. The first cylinder 83 and the first motor 86 correspond to the first tensile member in the present invention. The second cylinder 84 and the second motor 87 correspond to the second tensile member in the present invention.

In the second embodiment, the process of attaching the adhesive tape DT to the workpiece (the ring frame f and the wafer W) is the same as that of the first embodiment shown in FIG. 3 except for step S8. In step S8 of Example 2, first, as shown in FIG. 13( a ), each of the holding units 81A and 81B is appropriately moved inward in the width direction R. As shown in FIG.

Next, the control unit 40 rotates the motor 70 in a state where the end portion in the width direction of the adhesive tape DT has entered between the fixed piece 67 and the movable portion 68 . Through the rotation of the motor 70, the cylinder 69 extends downward, so that the end of the adhesive tape DT is held by the fixed support piece 67 and the movable part 68 (refer to FIG. 9( b )).

Driven by the motor 70, both ends of the adhesive tape DT in the width direction R are gripped over a predetermined region H including the regions L1 and L2. At this time, as shown in FIG. 13( a), the downstream part of the holding member 82 holds both ends of the adhesive tape DT in the region L1 close to the cut-off region C, and the downstream part is connected to the second end of the adhesive tape DT. 1 cylinder Body 83. On the other hand, the upstream portion of the holding member 82 holds both ends of the adhesive tape DT in the area L2 upstream of the area L1, and the second cylinder 84 is connected to the upstream portion.

When the adhesive tape DT is gripped by each of the grip members 82 , the control unit 40 rotates each of the first motor 86 and the second motor 87 . When each of the first motor 86 and the second motor 87 rotates, as shown in FIG. 13( b ), the holding members 82 of the holding units 81A and 81B move in opposite directions in the width direction R, respectively.

At this time, the control unit 40 independently controls the first motor 86 and the second motor 87 . Specifically, it is controlled so that the amount of rotation of the first motor 86 is greater than the amount of rotation of the second motor 87 .

Through this control, since the expansion and contraction amount of the first cylinder 83 is large, the movement distance in the width direction R of the downstream side part connected to the first cylinder 83 in the holding member 82 becomes long. On the one hand, since the amount of expansion and contraction of the second cylinder 84 is small, the movement distance in the width direction R of the upstream portion connected to the second cylinder 84 of the holding member 82 becomes short.

As a result of controlling in such a way that the moving distance of the upstream side part and the moving distance of the downstream side part in the holding member 82 are different, as shown in FIG. Tensions of different magnitudes are applied in the width direction R. That is, in the region L1 gripped by the downstream side portion of the gripping member 82 , a large tension P1 is applied in the width direction R under the influence of the amount of expansion and contraction of the first cylinder 83 . On the other hand, a small tension P2 is applied in the width direction R in the region L2 gripped by the upstream portion of the grip member 82 , influenced by the amount of expansion and contraction of the second cylinder 84 .

By applying tensions P1 and P2 of different magnitudes to the respective regions L1 and L2 in the delivery direction L, the wrinkles F generated in the adhesive tape DT are reliably removed, and the adhesive tape DT becomes flat. That is, in the region L1 where many wrinkles F are generated, since a larger tension P1 is applied, the wrinkles F can be reliably removed. On the one hand, since the small tension P2 is applied to the region L2 where wrinkles F are rarely generated, the wrinkles F can be sufficiently removed, and the generation of wrinkles due to excessive tension can be prevented.

In this way, with respect to the second tension mechanism of Embodiment 2, each of the gripping units 81A and 81B is formed to use the first cylinder body 83 and the second cylinder body 84, and utilize a plurality of positions arranged in the release direction L to separate a single tension mechanism. The holding member 82 is stretched. Then, by independently controlling the stretching force at each site, the tensions P1 and P2 applied to each site are adjusted so as to have different magnitudes, respectively.

As a result of applying the tensions P1 and P2 in the width direction by the second tension mechanism 80, the adhesive tape DT can be accurately flattened over a wide range in the delivery direction L in the configuration of the second embodiment as in the first embodiment.

Before step S8 starts, the difference between the tension T1 acting in the width direction of the area L1 and the tension T2 acting in the width direction of the area L2 is eliminated by the belt straightening process in step S8. That is, the tension P1 is given to the small tension T1, and the tension P2 is given to the large tension T2. Therefore, after the tension is applied (after step S8 is completed), the variation in tension in the width direction of the adhesive tape DT can be reduced. As a result, since the regions L1 and L2 in the vicinity of the cut-off region C can be used as regions to be attached to the next work, the amount of discarded adhesive tape DT can be reduced.

The present invention is not limited to the above-described embodiments, and can be implemented with the following modifications.

(1) In Embodiment 1, although it is illustrated that the second tension mechanism 37 is equipped with two independent stretch mechanisms parallel in the release direction L of the adhesive tape DT, that is, the first stretch mechanism 53 and the second stretch mechanism 55 configuration, but it can also be a configuration with more than 3 stretching mechanisms. Similarly, three or more cylinders arranged in the release direction L may be connected to the holding member 82 of the second embodiment, and each cylinder may be stretched in the width direction R with different forces.

(2) In each embodiment and each modified example, as an example of the adhesive tape DT to which the tension in the width direction is applied, the adhesive tape for support (dicing tape) for supporting the semiconductor wafer in the range covering the ring frame is mentioned. belt) as an example, but not limited thereto. That is, in addition to the dicing tape, if it is an adhesive tape (protective tape) for protecting the circuit surface of the semiconductor wafer or a long-shaped adhesive tape such as an adhesive tape for peeling off the protective tape, the adhesive tape of the present invention can be applied. The composition of the attached device.

(3) In the present invention, if a plurality of areas of the adhesive tape DT arranged in the release direction L can be provided with different tensions in the width direction of the adhesive tape DT, the configuration of the second tension mechanism is not limited to each area. Examples can also be appropriately changed. As other examples of the configuration in which different tensions are applied to the width direction R of each of the plurality of regions L1 and L2 aligned in the release direction L, the following can be given.

The second tension mechanism 90 of the modified example is constituted by a pair of holding units 90A and 90B holding a predetermined area H in the adhesive tape DT, as shown in FIG. 14( a ). The holding units 90A and 90B respectively have The holding member 91 , the cylinder 92 and the motor 93 . The holding member 91 holds the adhesive tape DT in a range covering a predetermined region H. As shown in FIG. The cylinder 92 is connected to a downstream portion of the holding member 91 . The cylinder 92 expands and contracts in the width direction R as the motor 93 rotates, and moves the holding member 91 in the width direction R. As shown in FIG.

The area L1 is closer to the portion where the cylinder 92 is connected to the holding member 91 , and the area L2 is farther from the portion where the cylinder 92 is connected to the holding member 91 . That is, compared with the region L2, the force generated by the expansion and contraction of the cylinder 92 is more efficiently transmitted in the region L1. Therefore, when the cylinder 92 expands and contracts to move the grasping member 91, a larger tension P1 is applied to the region L1, and conversely, the magnitude of the tension P2 applied to the region L2 becomes smaller.

In this way, it is not limited to the configuration of Example 1 in which a plurality of separated holding members 61 are aligned in the release direction L, or the configuration of Example 2 in which a single holding member 82 is stretched at plural locations. Like this modification, even if a single holding member 91 is stretched at a single location, different tensions P1 and P2 for the release direction L can be applied in the width direction R as in the respective embodiments.

In other modified examples, as shown in FIG. 14( b ), a cylinder that telescopically moves in the direction D toward the upstream side of the release direction L and inclined to the width direction R for a pair of holding units 95A and 95B may also be used. The body 97 is connected to the holding member 96 . By expanding and contracting the cylinder 97 in the direction D with the rotation of the motor 98, tensions P1 and P2 of different magnitudes can be applied to the regions L1 and L2 in the width direction, respectively. The cylinder 97 and the motor 98 correspond to the inclination direction tension member in this invention.

In each embodiment and modification, in step S8, the sensor 71 is used to detect the end of the width direction R of the adhesive tape DT in each area, and the magnitude of the tension P1 applied to the area L1 and the tension P1 applied to the area L2 are calculated. The magnitude of the tension P2. This is an example of the configuration for calculating the magnitude of the tension P1 applied to the region L1 and the magnitude of the tension P2 applied to the region L2 , but is not limited to the configuration using the sensor 71 .

In other examples, the distances that each of the first stretching mechanism 53 and the second stretching mechanism 55 that can remove the wrinkles F and flatten the entire adhesive tape DT in the width direction R can also be obtained in advance through simulation. , and then calculate the tension P1 and P2 based on the calculation result. Also, the sensor 71 can be used to monitor the surface of the adhesive tape DT, and the tensions P1 and P2 can be imparted through the disappearance of wrinkles or undulations.

(4) In the embodiment and each modified example, although the adhesive tape attaching device that uses the ring frame f and the wafer W as the workpiece and attaches the adhesive tape DT to the workpiece is illustrated, the workpiece to which the adhesive tape is attached The system is not limited to the ring frame f and the wafer W. In other examples, the wafer W may also be used as the workpiece. That is, a configuration in which the adhesive tape T for circuit protection is attached to the circuit surface of the wafer and then cut into a predetermined shape (such as a circle) can be mentioned. In addition, the configuration of the present invention can also be applied to configurations in which the ring frame f is used as a workpiece.

Here, a modified example in a case where the workpiece is different from that of the embodiment will be described using diagrams. In this modified example, as shown in FIG. 15( a ), a wafer Wa on which notches N for positioning are formed is used as a workpiece. In addition, the notch N formed in the wafer Wa is V-shaped, but the shape of the notch N is not limited to the V-shape, and may be U-shaped, for example. Also, you can use As the wafer Wa on which an orientation flat is formed, a circular wafer W on which no notch or the like is formed can also be used as in each embodiment.

In the modified example in which the wafer Wa is used as the workpiece, the configurations different from those of the respective embodiments are given different symbols, and the holding table 5 a and the tape cutting unit 9 a are shown in FIG. 15( b ). The holding table 5 a omits the frame holding portion 33 and includes a wafer holding portion 31 a on which the wafer Wa is placed. Furthermore, the diameter of the wafer holding portion 31a is configured to be shorter than the diameter of the wafer Wa.

The tape cutting unit 9a is provided with a supporting arm 12 that can be driven and rotated around the longitudinal axis P located at the center of the holding table 5a at the lower part of the movable table 10 that can be driven up and down. In addition, the free end side of the support arm 12 is provided with a cutting knife 14 facing downward. That is, in this modified example, the cutter 14 moves along the outer periphery of the wafer W and cuts off the adhesive tape T through the rotation of the support arm 12 with the longitudinal axis P as the rotation center.

Here, the process of attaching the adhesive tape T to the wafer Wa which is the workpiece in the modified example of (4) will be described. First, in step S1 , the wafer Wa is placed on the wafer holder 31 a according to the position of the notch N in the rotation direction determined. In addition, since the frame f is not used, the process of step S2 is omitted. Then, in step S3 , the adhesive tape T is attached over the entire surface of the wafer Wa using the tape attaching unit 7 (see FIG. 4( b )).

The operation of step S4 in this modified example is as shown in FIG. 15(c). That is, the tape cutting unit 9a on standby is lowered so that the cutter 14 penetrates into the adhesive tape T. As shown in FIG. When the cutter 14 penetrates into the adhesive tape T, the support arm 12 rotates around the longitudinal axis P as the rotation center. The cutter 14 rotates and moves along the outer periphery of the wafer Wa along with this rotation.

Through this rotational movement, the adhesive tape T is cut into a circle along the cutting track K as shown in FIG. 15( d ). In this way, the process of step S4 is completed by cutting the adhesive tape T into a predetermined shape corresponding to the wafer Wa. Each engineering department of steps S5-S8 is the same as that of each embodiment, so the following description is omitted.

In addition, if the adhesive tape T is cut into a predetermined shape corresponding to the workpiece, the cutting locus K of the adhesive tape T is not limited to a circle. For example, as shown in FIG. 15( e ), the cutting track K may also be a track where the adhesive tape T corresponding to the notch N is also cut, that is, the shape along the outer shape of the wafer Wa. Furthermore, as long as the adhesive tape T is cut into a predetermined shape corresponding to the workpiece, the configurations of the holding table 5a and the tape cutting unit 9a can also be appropriately changed. For example, the cutter blade 14 is not limited to a configuration in which it rotates and moves along the outer peripheral edge of the wafer Wa.

That is, as shown in FIG. 15( f), when the diameter of the wafer holding portion 31a is larger than the diameter of the wafer Wa, the cutting knife 14 pierced into the adhesive tape T is along the outer peripheral edge of the wafer holding portion 31a. Turning movers are better. In this case, the adhesive tape T is cut into a circular shape slightly larger than the diameter of the wafer Wa according to the wafer Wa.

(5) In each of the embodiments and modifications, the workpiece is not limited to a circular shape or a substantially circular shape. As an example, the configuration of the present invention can also be applied to a configuration in which the adhesive tape T is attached to a rectangular or polygonal substrate as a workpiece.

(6) In each embodiment and each modified example, in terms of the structure of independently controlling the magnitude of the tension P1 and the tension P2, although it is exemplified that the rotation of various motors such as the motor 65 is independently controlled to independently Adjust the position of each holding unit. However, as long as the magnitudes of the tension P1 and the tension P2 are independently controlled, it is not limited to the configuration controlled by a motor.

As another example of the configuration in which the magnitudes of the tension P1 and the tension P2 are independently controlled, a configuration in which the cylinders 63 are individually controlled can be mentioned. That is, by supplying relatively high-pressure air (for example, about 0.4 MPa) to the cylinders 63 of the holding units 53A and 53B that hold the area L1 close to the cut-off area C, the area L1 is pulled with a strong force. stretch. On the one hand, by supplying relatively low-pressure air (for example, about 0.2 MPa) to the cylinders 63 of the holding units 55A and 55B provided in the holding area L2, the area L2 is stretched with a weak force.

In this way, by controlling the cylinder 63, the tension force in the area L1 and the tension force in the area L2 are independently controlled, and the tension P1 and the tension P2 can also be different in magnitude. With this configuration, various motors such as the motor 65 can be reduced.

(7) In each embodiment and each modified example, although the configuration in which the adhesive tape DT is attached by the vertical movement of the holding table 5 is exemplified, the holding table 5 is not limited to the configuration that can move up and down. That is, as another example, the sticking of the adhesive tape DT may be performed by moving up and down the tape sticking unit 7 and the tape peeling unit 11 .

5‧‧‧Holding table

31‧‧‧Wafer Holder

33‧‧‧Frame holding part

35‧‧‧Pasting roller

53‧‧‧The first stretching mechanism

53A, 53B‧‧‧Control unit

55A, 55B‧‧‧Control unit

61‧‧‧Controlling components

63‧‧‧Cylinder

65‧‧‧motor

67‧‧‧Fixed bearing piece

68‧‧‧movable part

69‧‧‧Cylinder

70‧‧‧motor

71a‧‧‧Sensor

C‧‧‧Removal area

DT‧‧‧adhesive tape

L1, L2‧‧‧area

M‧‧‧Width

P1, P2‧‧‧tension

Claims (12)

A method for attaching an adhesive tape, characterized by comprising: an attaching process of attaching a strip-shaped adhesive tape to a workpiece; a cutting process of cutting the aforementioned adhesive tape attached to the aforementioned workpiece into a predetermined shape corresponding to the aforementioned workpiece and a tension imparting process, when the aforementioned adhesive tape is attached to the aforementioned workpiece, tension is applied to the width direction of the aforementioned adhesive tape at the attached portion of the aforementioned adhesive tape, and the aforementioned tension imparting process is arranged in the aforementioned adhesive tape. At least two areas in the longitudinal direction of the adhesive tape, namely, the first area close to the cut-out area cut into the predetermined shape in the previous cutting process, and the second area farther away from the cut-out area than the first area. Different tensions are respectively applied to the width direction of the said adhesive tape for each area|region. The adhesive tape sticking method according to claim 1, wherein the tension imparting process comprises: a holding process, using the first holding mechanism to hold the first region from both sides of the width direction of the adhesive tape, and using the second holding mechanism to hold The aforementioned second region is grasped from both sides of the width direction of the aforementioned adhesive tape; and in the stretching process, the aforementioned first grasping mechanism is stretched toward the width direction of the aforementioned adhesive tape with the first force, and the aforementioned second grasping mechanism is The second force different from the first force is stretched in the width direction of the adhesive tape. The adhesive tape attaching method according to claim 1, wherein the tension imparting process includes: a holding process, using a holding mechanism to hold the first area and the second area from both sides of the width direction of the adhesive tape; and a stretching process Stretching the portion of the gripping mechanism holding the first region in the width direction of the adhesive tape with a first force, and pulling the portion of the gripping mechanism gripping the second region with a second force different from the first force. Stretch in the width direction of the aforementioned adhesive tape. The adhesive tape sticking method according to claim 1, wherein the tension imparting process includes: a holding process, using a holding mechanism to hold the first area and the second area from both sides of the width direction of the adhesive tape; and pulling in an oblique direction In the stretching process, the aforementioned holding mechanism is stretched in a direction inclined from the width direction of the aforementioned adhesive tape to the direction of the long side of the aforementioned adhesive tape. The adhesive tape attaching method according to claim 1, wherein the tension imparting process includes: a holding process, using a holding mechanism to hold the first area and the second area from both sides of the width direction of the adhesive tape; and a stretching process , through the tensile member provided on the side of the part holding the first region and the part holding the second region in the holding mechanism, the holding mechanism is extended to the width of the adhesive tape direction stretch. The adhesive tape attaching method according to any one of claims 1 to 5, wherein: The two-end detection process is to detect the positions of the two ends of the width direction of the aforementioned adhesive tape in the first area and the positions of the two ends of the width direction of the aforementioned adhesive tape in the second area; and the tension calculation process is based on the detection The tension applied to the first region in the width direction of the adhesive tape and the tension applied to the second region in the width direction of the adhesive tape are calculated for each of the positions of the two ends. An adhesive tape attaching device, characterized by comprising: an attaching mechanism for attaching a strip-shaped adhesive tape to a workpiece; a cutting mechanism for cutting the aforementioned adhesive tape attached to the aforementioned workpiece into a predetermined shape corresponding to the aforementioned workpiece. shape; and a tension imparting mechanism, when attaching the aforementioned adhesive tape to the aforementioned workpiece, tension is applied to the width direction of the aforementioned adhesive tape at the attached portion of the aforementioned adhesive tape, and the aforementioned tension imparting mechanism is arranged in the aforementioned adhesive tape At least two areas in the longitudinal direction of the adhesive tape, that is, a first area that is close to the cut area that was cut into the predetermined shape in the previous cutting process, and a second area that is further away from the cut area than the first area. Different tensions are applied to each of the two regions in the width direction of the adhesive tape. The adhesive tape sticking device according to claim 7, wherein the tension imparting mechanism includes: a first gripping mechanism for gripping the first region from both sides in the width direction of the adhesive tape; The second gripping mechanism grips the second region from both sides in the width direction of the adhesive tape; the first stretching member stretches the first gripping mechanism in the width direction of the adhesive tape with a first force; and 2. A stretching member that stretches the second gripping mechanism in the width direction of the adhesive tape with a second force different from the first force. The adhesive tape attaching device according to claim 7, wherein the tension imparting mechanism includes: a holding mechanism for holding the first region and the second region from both sides of the adhesive tape in the width direction; The part of the holding mechanism holding the first region is stretched in the width direction of the adhesive tape with the first force; and the second stretching member is the part of the holding mechanism holding the second region with the first force. The different second force stretches the adhesive tape in the width direction. The adhesive tape sticking device according to claim 7, wherein the tension imparting mechanism includes: a gripping mechanism for gripping the first region and the second region from both sides in the width direction of the adhesive tape; and a stretching member in an oblique direction, Stretch the holding mechanism in a direction inclined from the width direction of the adhesive tape to the long side direction of the adhesive tape. The adhesive tape attaching device according to claim 7, wherein the aforementioned tension imparting mechanism has: a holding mechanism for holding the first region and the second region from both sides in the width direction of the adhesive tape; On the side of the portion holding the first region, the holding mechanism is stretched in the width direction of the adhesive tape. The adhesive tape sticking device according to any one of claims 7 to 11, which includes: a two-end detection mechanism for detecting the positions of both ends of the adhesive tape in the width direction in the first area and the positions of the two ends in the second area. The positions of both ends in the width direction of the adhesive tape are detected respectively; and the tension calculation mechanism, based on each of the detected positions of the two ends, compares the tension applied to the first area in the width direction of the adhesive tape with the tension applied to the first area. The tension applied in the width direction of the above-mentioned adhesive tape by the 2 regions was calculated separately.

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