TWI787508B - Laminated films and foldable devices - Google Patents
Laminated films and foldable devices Download PDFInfo
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- TWI787508B TWI787508B TW108116361A TW108116361A TWI787508B TW I787508 B TWI787508 B TW I787508B TW 108116361 A TW108116361 A TW 108116361A TW 108116361 A TW108116361 A TW 108116361A TW I787508 B TWI787508 B TW I787508B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
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Abstract
本發明之目的在於提供一種具有較高之表面硬度與優異之彎曲耐久性,且適宜作為可折器件之表面保護材之積層膜。 本發明之積層膜具有支持體、及積層於該支持體之至少一面之樹脂層,其特徵在於:該樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足下述(條件1)及(條件2)。 (條件1)上述積層膜之樹脂層表面之JIS K5600-5-4(1999)中所規定的鉛筆硬度試驗(750 g荷重)之鉛筆硬度為F以上。 (條件2)下述彎曲耐久性試驗(1)中之彎曲耐久性(1)為5萬次以上。 彎曲耐久性試驗(1): 將自積層膜展開之狀態,沿樹脂層之面成為凹陷之方向以彎曲半徑成為2.5 mm之方式彎曲180°,並再次展開之動作設為1次,以30〜60次/分鐘之速度進行上述動作時,將直至於積層膜之樹脂層產生龜裂為止之次數設為彎曲耐久性(1)之指標The purpose of the present invention is to provide a laminated film which has high surface hardness and excellent bending durability and is suitable as a surface protection material for foldable devices. The laminated film of the present invention has a support body and a resin layer laminated on at least one side of the support body, and is characterized in that the resin layer (any resin layer in the case of a resin layer layered on both sides of the support body) ) fully satisfy the following (condition 1) and (condition 2). (Condition 1) The pencil hardness of the resin layer surface of the above laminated film in the pencil hardness test (750 g load) stipulated in JIS K5600-5-4 (1999) is F or more. (Condition 2) The bending durability (1) in the following bending durability test (1) is 50,000 times or more. Bending Durability Test (1): In the state where the self-laminated film is unfolded, it is bent 180° along the direction in which the surface of the resin layer becomes a depression with a bending radius of 2.5 mm, and the action of unfolding again is set once, and the above is performed at a speed of 30 to 60 times/min. During operation, the number of times until the resin layer of the laminated film cracks is taken as an index of bending durability (1)
Description
本發明係關於一種具備較高之表面硬度與優異之彎曲耐久性之積層膜及具備上述積層膜之可折器件。The present invention relates to a laminated film with high surface hardness and excellent bending durability and a foldable device with the laminated film.
為了進一步提高智慧型手機或平板等行動資訊終端之攜帶性,可摺疊之顯示器、觸控面板等可折器件之需求提高。可折器件為了提高攜帶性,必須以較小之彎曲半徑(例如彎曲半徑2.5 mm左右)彎曲為180°,而要求極高之彎曲性(可撓性)。又,可折器件係於摺疊之狀態下攜帶,且於使用時打開,使用後再次摺疊而反覆使用,故而亦要求較高之彎曲耐久性,即,即便反覆摺疊亦不會產生龜裂等之耐久性。In order to further improve the portability of mobile information terminals such as smart phones or tablets, the demand for foldable devices such as foldable displays and touch panels has increased. In order to improve portability, foldable devices must be bent to 180° with a small bending radius (for example, a bending radius of about 2.5 mm), which requires extremely high bendability (flexibility). In addition, a foldable device is carried in a folded state, opened during use, folded again after use, and used repeatedly. Therefore, high bending durability is also required, that is, cracks will not occur even if folded repeatedly. durability.
於可折器件中使用有機EL等可撓性較高之圖像顯示裝置,但為了以於使用時於圖像顯示面不產生傷痕之方式賦予耐擦傷性,通常藉由利用於支持體膜形成有硬塗層之積層膜(硬塗膜)進行保護,而提高圖像顯示裝置之圖像顯示面之耐擦傷性(例如專利文獻1)。 [先前技術文獻] [專利文獻]Highly flexible image display devices such as organic EL are used in foldable devices, but in order to impart scratch resistance so as not to cause scratches on the image display surface during use, it is usually formed by using a support film The scratch resistance of the image display surface of an image display device is improved by protecting it with a laminated film (hard coat film) with a hard coat layer (for example, Patent Document 1). [Prior Art Literature] [Patent Document]
專利文獻1:日本特開2014-186210號公報Patent Document 1: Japanese Patent Laid-Open No. 2014-186210
[發明所欲解決之課題][Problem to be Solved by the Invention]
然而,習知之硬塗膜雖然表面硬度與彎曲性優異,但有如下問題:若反覆摺疊則於硬塗層產生龜裂,彎曲耐久性較低,無法用作保護可折器件之表面的構件。However, although the conventional hard coating film has excellent surface hardness and flexibility, it has the following problems: if it is repeatedly folded, cracks will occur in the hard coating layer, and the bending durability is low, so it cannot be used as a member for protecting the surface of a foldable device.
因此,本發明之目的在於提供一種具有較高之表面硬度與優異之彎曲耐久性,且適宜作為可折器件之表面保護材之積層膜。 又,本發明之另一目的在於提供一種具備上述積層膜之可折器件。 [解決課題之技術手段]Therefore, the object of the present invention is to provide a laminated film which has high surface hardness and excellent bending durability and is suitable as a surface protection material for foldable devices. Another object of the present invention is to provide a foldable device including the above-mentioned laminated film. [Technical means to solve the problem]
即,本發明提供一種積層膜(1),其具有支持體、及 積層於該支持體之至少一面之樹脂層,其特徵在於: 該樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足下述(條件1)及(條件2)。 (條件1)上述積層膜之樹脂層表面之JIS K5600-5-4(1999)中所規定的鉛筆硬度試驗(750 g荷重)之鉛筆硬度為F以上。 (條件2)下述彎曲耐久性試驗(1)中之彎曲耐久性(1)為5萬次以上。 彎曲耐久性試驗(1): 將自積層膜展開之狀態,沿樹脂層之面成為凹陷之方向以彎曲半徑成為2.5 mm之方式彎曲180°,並再次展開之動作設為1次,以30〜60次/分鐘之速度進行上述動作時,將直至於積層膜之樹脂層產生龜裂為止之次數設為彎曲耐久性(1)之指標That is, the present invention provides a laminated film (1) having a support, and The resin layer laminated on at least one side of the support is characterized in that: This resin layer (any resin layer when there is a resin layer in the double-sided layer of the above-mentioned support) fully satisfies the following (Condition 1) and (Condition 2). (Condition 1) The pencil hardness of the resin layer surface of the above laminated film in the pencil hardness test (750 g load) stipulated in JIS K5600-5-4 (1999) is F or more. (Condition 2) The bending durability (1) in the following bending durability test (1) is 50,000 times or more. Bending Durability Test (1): In the state where the self-laminated film is unfolded, it is bent 180° along the direction in which the surface of the resin layer becomes a depression with a bending radius of 2.5 mm, and the action of unfolding again is set once, and the above is performed at a speed of 30 to 60 times/min. During operation, the number of times until the resin layer of the laminated film cracks is taken as an index of bending durability (1)
又,本發明提供一種積層膜(2),其具有支持體、及 積層於該支持體之至少一面之樹脂層,其特徵在於: 該樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足下述(條件1)及(條件3)。 (條件1)上述積層膜之樹脂層表面之JIS K5600-5-4(1999)中所規定的鉛筆硬度試驗(750 g荷重)之鉛筆硬度為F以上。 (條件3)下述彎曲耐久性試驗(2)中之彎曲耐久性(2)為1萬次以上。 彎曲耐久性試驗(2): 將自積層膜展開之狀態,沿樹脂層之面凸起之方向以彎曲半徑成為4.0 mm之方式彎曲180°,並再次展開之動作設為1次,以30〜60次/分鐘之速度進行上述動作時,將直至於積層膜之樹脂層產生龜裂為止之次數設為彎曲耐久性(2)之指標Also, the present invention provides a laminated film (2) having a support, and The resin layer laminated on at least one side of the support is characterized in that: This resin layer (any resin layer when there is a resin layer in the double-sided layer of the above-mentioned support) fully satisfies the following (Condition 1) and (Condition 3). (Condition 1) The pencil hardness of the resin layer surface of the above laminated film in the pencil hardness test (750 g load) stipulated in JIS K5600-5-4 (1999) is F or more. (Condition 3) The bending durability (2) in the following bending durability test (2) is 10,000 times or more. Bending durability test (2): In the state where the self-laminated film is unfolded, bend 180° in the direction in which the surface of the resin layer protrudes so that the bending radius becomes 4.0 mm, and then unfold it once again, and perform the above at a speed of 30 to 60 times/min. During operation, the number of times until the resin layer of the laminated film cracks is taken as an index of bending durability (2)
於上述積層膜(1)及(2)中,較佳為上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)進而充分滿足下述(條件4)。 (條件4)於積層膜之樹脂層之面成為凸起之JIS K5600-5-1(1999)中所規定之圓筒形心軸試驗中,彎曲半徑為5 mm,且於樹脂層之面未產生龜裂In the above-mentioned laminated films (1) and (2), it is preferable that the above-mentioned resin layer (in the case where there are resin layers on the double-layered layer of the above-mentioned support, be any one of the resin layers) further satisfies the following (condition 4) . (Condition 4) In the cylindrical mandrel test stipulated in JIS K5600-5-1 (1999) where the surface of the resin layer of the laminated film becomes convex, the bending radius is 5 mm, and there is no protrusion on the surface of the resin layer. Cracks
於上述積層膜(1)及(2)中,較佳為上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)之面的水接觸角為95°以上。In the above-mentioned laminated films (1) and (2), it is preferable that the water contact angle of the surface of the above-mentioned resin layer (when there are resin layers on the double-layered layer of the above-mentioned support) is 95°. above.
於上述積層膜(1)及(2)中,較佳為上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足下述(條件5)。 (條件5)一邊利用#0000號之鋼絲絨施加1 kg/cm2 之荷重,一邊於上述樹脂層之表面往返摩擦30次之耐鋼絲絨試驗中目測未產生傷痕。In the above-mentioned laminated films (1) and (2), it is preferable that the above-mentioned resin layer (either one of the resin layers when there are resin layers on the double-layered layer of the above-mentioned support) fully satisfies the following (condition 5). (Condition 5) While applying a load of 1 kg/cm 2 using #0000 steel wool, no scratches were visually observed in the steel wool resistance test in which the surface of the resin layer was rubbed back and forth 30 times.
於上述積層膜(1)及(2)中,較佳為上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)之霧度為1.0%以下。In the above-mentioned laminated films (1) and (2), it is preferable that the haze of the above-mentioned resin layer (when there are resin layers on the double-layered layer of the above-mentioned support, either resin layer) is 1.0% or less.
於上述積層膜(1)及(2)中,較佳為上述樹脂層係進而含有1種以上之硬化性化合物的硬化性組成物之硬化物,且硬化性化合物之至少1種為聚有機倍半矽氧烷(polyorganosilsesquioxane)。In the above-mentioned laminated films (1) and (2), it is preferable that the above-mentioned resin layer is a cured product of a curable composition containing at least one curable compound, and at least one curable compound is a polyorganic compound. Semisiloxane (polyorganosilsesquioxane).
於上述積層膜(1)及(2)中,較佳為上述硬化性組成物含有分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物。In the above-mentioned laminated films (1) and (2), it is preferable that the above-mentioned curable composition contains a compound having one or more thermally polymerizable functional groups and one or more photopolymerizable functional groups in a molecule.
於上述積層膜(1)及(2)中,較佳為上述硬化性組成物進而含有硬化觸媒。 上述硬化觸媒可為光陽離子聚合起始劑。 上述硬化觸媒可為熱陽離子聚合起始劑。In the above-mentioned laminated films (1) and (2), it is preferable that the above-mentioned curable composition further contains a curing catalyst. The aforementioned hardening catalyst may be a photocationic polymerization initiator. The aforementioned hardening catalyst may be a thermal cationic polymerization initiator.
於上述積層膜(1)及(2)中,較佳為上述硬化性組成物進而含有含氟之光聚合性樹脂。In the above-mentioned laminated films (1) and (2), it is preferable that the above-mentioned curable composition further contains a fluorine-containing photopolymerizable resin.
於上述積層膜(1)及(2)中,較佳為上述支持體為透明支持體。In the above-mentioned laminated films (1) and (2), it is preferable that the above-mentioned support is a transparent support.
又,本發明提供一種可折器件,其具備上述積層膜(1)或(2)。Also, the present invention provides a foldable device including the above-mentioned laminated film (1) or (2).
上述可折器件可為圖像顯示裝置。 於上述可折器件中,上述圖像顯示裝置可為有機電致發光顯示裝置。 [發明之效果]The above-mentioned foldable device may be an image display device. In the above-mentioned foldable device, the above-mentioned image display device may be an organic electroluminescent display device. [Effect of Invention]
本發明之積層膜具有較高之表面硬度與優異之彎曲耐久性。因此,本發明之積層膜可適宜地用作摺疊式圖像顯示裝置等可折器件之表面保護材。The laminated film of the present invention has high surface hardness and excellent bending durability. Therefore, the laminated film of the present invention can be suitably used as a surface protection material for foldable devices such as foldable image display devices.
[積層膜] 本發明之積層膜之一態樣(以下,有時稱為「積層膜(1)」)係具有支持體、及積層於該支持體之至少一面之樹脂層者,其特徵在於:該樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足下述(條件1)及(條件2)。 (條件1)上述積層膜之樹脂層表面之JIS K5600-5-4(1999)中所規定的鉛筆硬度試驗(750 g荷重)之鉛筆硬度為F以上。 (條件2)下述彎曲耐久性試驗(1)中之彎曲耐久性(1)為5萬次以上。 彎曲耐久性試驗(1): 將自積層膜展開之狀態,沿樹脂層之面成為凹陷之方向以彎曲半徑成為2.5 mm之方式彎曲180°,並再次展開之動作設為1次,以30〜60次/分鐘之速度進行上述動作時,將直至於積層膜之樹脂層產生龜裂為止之次數設為彎曲耐久性(1)之指標[laminated film] An aspect of the laminated film of the present invention (hereinafter sometimes referred to as "laminated film (1)") is one having a support and a resin layer laminated on at least one side of the support, and is characterized in that the resin layer (Any resin layer when there is a resin layer in the double-sided layer of the above-mentioned support.) The following (Condition 1) and (Condition 2) are fully satisfied. (Condition 1) The pencil hardness of the resin layer surface of the above laminated film in the pencil hardness test (750 g load) stipulated in JIS K5600-5-4 (1999) is F or more. (Condition 2) The bending durability (1) in the following bending durability test (1) is 50,000 times or more. Bending Durability Test (1): In the state where the self-laminated film is unfolded, it is bent 180° along the direction in which the surface of the resin layer becomes a depression with a bending radius of 2.5 mm, and the action of unfolding again is set once, and the above is performed at a speed of 30 to 60 times/min. During operation, the number of times until the resin layer of the laminated film cracks is taken as an index of bending durability (1)
本發明之積層膜(1)具有極優異之表面硬度及彎曲耐久性,可適宜地用作有機EL顯示裝置等可折器件之表面保護材。 即,於本發明之積層膜(1)中,上述樹脂層充分滿足上述(條件1)及(條件2)。 再者,於本發明之積層膜(1)中,於上述樹脂層積層於上述支持體之雙面之情形時,只要任一樹脂層充分滿足(條件1)及(條件2)即可,另一樹脂層可充分滿足(條件1)及/或(條件2),亦可不充分滿足。The laminated film (1) of the present invention has extremely excellent surface hardness and bending durability, and can be suitably used as a surface protection material for foldable devices such as organic EL display devices. That is, in the laminated film (1) of this invention, the said resin layer fully satisfies the said (condition 1) and (condition 2). Furthermore, in the laminated film (1) of the present invention, when the above-mentioned resin layer is laminated on both sides of the above-mentioned support, any one of the resin layers may sufficiently satisfy (Condition 1) and (Condition 2). A resin layer may or may not fully satisfy (Condition 1) and/or (Condition 2).
上述條件1係表示本發明之積層膜(1)之樹脂層表面具有優異之表面硬度之條件。上述樹脂層表面之JIS K5600-5-4(1999)中所規定的鉛筆硬度試驗(750 g荷重)之鉛筆硬度為F以上,較佳為1 H以上,更佳為2 H以上,更佳為3 H以上,更佳為4 H以上,更佳為5 H以上,更佳為6 H以上,更佳為7 H以上,進而較佳為8 H以上,尤佳為9 H。若上述樹脂層表面之鉛筆硬度未達F,則存在本發明之積層膜(1)之表面硬度變得不充分,難以用作可折器件之表面保護材之情形。The
上述條件2係表示本發明之積層膜(1)具有優異之彎曲耐久性,即,即便反覆摺疊亦不易於樹脂層產生龜裂等不良情況之特性之條件,具體而言,係表示具有以樹脂層之面成為凹陷(內側)之方式反覆摺疊之情形時之耐久性(以下,有時稱為「彎曲耐久性(1)」)之條件。The above-mentioned
圖1係表示上述條件2所表示之彎曲耐久性試驗(1)中之自積層膜(1)(圖1之1)展開之狀態(圖1(1)),以沿樹脂層之面成為凹陷(內側)之方向(省略圖示)彎曲半徑(R)成為2.5 mm之方式彎曲180°,並再次展開之動作之1次之示意圖(側視圖)。圖2為圖1(4)之放大圖,R表示彎曲半徑。於彎曲耐久性試驗(1)中,能夠以彎曲半徑成為2.5 mm之方式將半徑2.5 mm之圓筒形心軸捲繞於積層膜(1)之樹脂層面之彎曲部而進行。於彎曲耐久性試驗(1)中,將於1分鐘內以30〜60次之速度進行上述動作時直至於積層膜(1)之樹脂層產生龜裂為止之次數設為彎曲耐久性(1)之指標。Fig. 1 shows the self-laminated film (1) (1 of Fig. 1) in the unfolded state (Fig. 1 (1)) in the bending durability test (1) represented by the above-mentioned
本發明之積層膜(1)之彎曲耐久性試驗(1)中之彎曲耐久性(1)為5萬次以上,較佳為6萬次以上,更佳為7萬次以上,更佳為8萬次以上,更佳為9萬次以上,更佳為10萬次以上,進而較佳為15萬次以上,尤佳為20萬次以上。若彎曲耐久性(1)未達5萬次,則存在本發明之積層膜(1)之彎曲耐久性(1)變得不充分,難以用作可折器件(尤其是向內側彎曲之顯示裝置等)之表面保護材之情形。The bending durability (1) in the bending durability test (1) of the laminated film (1) of the present invention is 50,000 times or more, preferably 60,000 times or more, more preferably 70,000 times or more, more preferably 8 More than 10,000 times, more preferably 90,000 times or more, more preferably 100,000 times or more, further preferably 150,000 times or more, especially preferably 200,000 times or more. If the bending durability (1) is less than 50,000 times, the bending durability (1) of the multilayer film (1) of the present invention becomes insufficient, and it is difficult to use it as a foldable device (especially a display device that bends inwards) etc.) in the case of surface protection materials.
作為本發明之積層膜之另一態樣(以下,有時稱為「積層膜(2)」),亦較佳為上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足上述(條件1)及下述(條件3)之態樣。 (條件3)下述彎曲耐久性試驗(2)中之彎曲耐久性(2)為1萬次以上。 彎曲耐久性試驗(2): 將自積層膜展開之狀態,沿樹脂層之面凸起之方向以彎曲半徑成為4.0 mm之方式彎曲180°,並再次展開之動作設為1次,以30〜60次/分鐘之速度進行上述動作時,將直至於積層膜之樹脂層產生龜裂為止之次數設為彎曲耐久性(2)之指標As another aspect of the laminated film of the present invention (hereinafter sometimes referred to as "laminated film (2)"), it is also preferable that the above-mentioned resin layer (in the case where there are resin layers on the double-layered layer of the above-mentioned support) Any resin layer) fully satisfies the aspects of the above (Condition 1) and the following (Condition 3). (Condition 3) The bending durability (2) in the following bending durability test (2) is 10,000 times or more. Bending durability test (2): In the state where the self-laminated film is unfolded, bend 180° in the direction in which the surface of the resin layer protrudes so that the bending radius becomes 4.0 mm, and then unfold it once again, and perform the above at a speed of 30 to 60 times/min. During operation, the number of times until the resin layer of the laminated film cracks is taken as an index of bending durability (2)
再者,於本發明之積層膜(2)中,於上述樹脂層積層於上述支持體之雙面之情形時,只要任一樹脂層充分滿足(條件1)及(條件3)即可,另一樹脂層可充分滿足(條件1)及/或(條件3),亦可不充分滿足。Furthermore, in the laminated film (2) of the present invention, in the case where the above-mentioned resin layer is laminated on both sides of the above-mentioned support, it is sufficient that any one of the resin layers satisfies (Condition 1) and (Condition 3). A resin layer may or may not fully satisfy (Condition 1) and/or (Condition 3).
本發明之積層膜(2)之條件1中的鉛筆硬度試驗之測定方法及較佳之鉛筆硬度係與上述積層膜(1)相同。The measurement method of the pencil hardness test and the preferred pencil hardness in the
上述條件3係表示具有本發明之積層膜(2)之彎曲耐久性中之以樹脂層之面成為凸起(外側)之方式反覆摺疊之情形時之耐久性(以下,有時稱為「彎曲耐久性(2)」)之條件。用於彎曲耐久性(2)之彎曲耐久性試驗(2)除設為樹脂層之面成為凸起(外側)之方向,將彎曲半徑(R)設為4.0 mm以外,可於與上述彎曲耐久性試驗(1)相同之條件下進行測定。The
本發明之積層膜(2)之彎曲耐久性試驗(2)中之彎曲耐久性(2)為1萬次以上,更佳為2萬次以上,更佳為3萬次以上,更佳為4萬次以上,更佳為5萬次以上,更佳為6萬次以上,更佳為7萬次以上,更佳為8萬次以上,更佳為9萬次以上,更佳為10萬次以上,進而較佳為15萬次以上,尤佳為20萬次以上。若彎曲耐久性(2)未達1萬次,則存在本發明之積層膜(2)之彎曲耐久性(2)變得不充分,難以用作可折器件(尤其是向外側彎曲之顯示裝置等)之表面保護材之情形。The bending durability (2) in the bending durability test (2) of the laminated film (2) of the present invention is 10,000 times or more, more preferably 20,000 times or more, more preferably 30,000 times or more, more preferably 4 times More than 10,000 times, more preferably 50,000 times, more preferably 60,000 times, more preferably 70,000 times, more preferably 80,000 times, more preferably 90,000 times, more preferably 100,000 times More than above, more preferably at least 150,000 times, especially preferably at least 200,000 times. If the bending durability (2) is less than 10,000 times, the bending durability (2) of the laminated film (2) of the present invention becomes insufficient, and it is difficult to use it as a foldable device (especially a display device that bends outwards) etc.) in the case of surface protection materials.
本發明之積層膜(1)及積層膜(2)(以下,存在僅統稱為「本發明之積層膜」之情形)進而較佳為上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足上述(條件1)〜(條件3)之全部之態樣。The laminated film (1) and laminated film (2) of the present invention (hereinafter, collectively referred to as "the laminated film of the present invention") are more preferably the above-mentioned resin layer (resin layer on the double-layered layer of the above-mentioned support) In the case of a layer, any resin layer) fully satisfies all of the above (Condition 1) to (Condition 3).
本發明之積層膜(包含積層膜(1)及積層膜(2)。下同)較佳為上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)進而滿足以下之(條件4)。 (條件4)於積層膜之樹脂層之面成為凸起之JIS K5600-5-1(1999)中所規定之圓筒形心軸試驗中,彎曲半徑為5 mm,且於樹脂層之面未產生龜裂(以下,例如有時稱為「彎曲性為5 mm以下」)The laminated film of the present invention (including laminated film (1) and laminated film (2). The same below) is preferably the above-mentioned resin layer (any resin layer when there are resin layers on both sides of the above-mentioned support) Furthermore, the following (condition 4) is satisfied. (Condition 4) In the cylindrical mandrel test stipulated in JIS K5600-5-1 (1999) where the surface of the resin layer of the laminated film becomes convex, the bending radius is 5 mm, and there is no protrusion on the surface of the resin layer. Cracks occur (hereinafter, for example, sometimes referred to as "bending less than 5 mm")
再者,於本發明之積層膜中,於上述樹脂層積層於上述支持體之雙面之情形時,只要任一樹脂層充分滿足(條件4)即可,另一樹脂層可充分滿足(條件4),亦可不充分滿足。Furthermore, in the laminated film of the present invention, when the above-mentioned resin layer is laminated on both sides of the above-mentioned support, any one resin layer may fully satisfy (Condition 4), and the other resin layer may fully satisfy (Condition 4). 4), may not be fully satisfied.
上述條件4係表示本發明之積層膜具有優異之彎曲性之條件。本發明之積層膜之彎曲性為5 mm以下,較佳為4.5 mm以下,更佳為4.0 mm以下,更佳為3.5 mm以下,更佳為3.0 mm以下,進而較佳為2.5 mm以下,尤佳為2.0 mm以下。若彎曲性超過5 mm,則存在本發明之積層膜之彎曲性變得不充分,難以用作可折器件(尤其是向外側彎曲之顯示裝置等)之表面保護材之情形。The above-mentioned
本發明之積層膜較佳為上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)進而滿足以下之(條件5)。 (條件5)一邊利用#0000號之鋼絲絨施加1 kg/cm2 之荷重,一邊於上述樹脂層之表面往返摩擦30次之耐鋼絲絨試驗中目測未產生傷痕(以下,例如有時稱為「耐擦傷性為30次以上」)The laminated film of the present invention is preferably the above-mentioned resin layer (any resin layer when there are resin layers on the double-layered layer of the above-mentioned support) and satisfies the following (condition 5). (Condition 5) While applying a load of 1 kg/cm 2 using #0000 steel wool, no scratches were visually observed in the steel wool resistance test in which the surface of the above-mentioned resin layer was rubbed back and forth 30 times (hereinafter, sometimes referred to as "Scratch resistance is 30 times or more")
再者,於本發明之積層膜中,於上述樹脂層積層於上述支持體之雙面之情形時,只要任一樹脂層充分滿足(條件5)即可,另一樹脂層可充分滿足(條件5),亦可不充分滿足。Furthermore, in the laminated film of the present invention, when the above-mentioned resin layer is laminated on both sides of the above-mentioned support, it is sufficient that any one resin layer satisfies (Condition 5) and the other resin layer satisfies (Condition 5). 5), may not be fully satisfied.
上述條件5係表示本發明之積層膜具有優異之耐擦傷性之條件。本發明之積層膜之耐擦傷性為30次以上,較佳為100次以上,更佳為200次以上,更佳為300次以上,更佳為500次以上,更佳為700次以上,進而較佳為1000次以上,尤佳為2000次以上。若耐擦傷性未達30次,則存在本發明之積層膜之耐擦傷性變得不充分,難以用作可折器件之表面保護材之情形。The above-mentioned
本發明之積層膜可具有支持體、樹脂層以外之層、例如錨定層、黏著劑層、低反射層、防污層、撥水層、撥油層、防霧層、保護膜層、印刷層、導電層、電磁波屏蔽層、紫外線吸收層、紅外線吸收層、藍光截止層等。上述樹脂層於上述支持體之表面,可僅形成於一部分表面,亦可形成於整個面。The laminated film of the present invention may have a support, a layer other than a resin layer, such as an anchor layer, an adhesive layer, a low-reflection layer, an antifouling layer, a water-repellent layer, an oil-repellent layer, an antifog layer, a protective film layer, and a printing layer. , conductive layer, electromagnetic wave shielding layer, ultraviolet absorbing layer, infrared absorbing layer, blue light cutting layer, etc. The above-mentioned resin layer may be formed on only a part of the surface of the above-mentioned support, or may be formed on the entire surface.
本發明之積層膜之霧度例如為7%以下,較佳為6%以下,更佳為5%以下,更佳為4%以下,進而較佳為3%以下,尤佳為2%以下,最佳為1%以下。再者,霧度之下限例如為0.1%。尤其藉由將霧度設為7%以下,例如有適於用於要求非常高之透明性之用途(例如觸控面板等顯示器之表面保護片等)之傾向。本發明之霧度例如藉由使用下述透明基材作為支持體,可容易地控制於上述範圍內。再者,於本說明書中,霧度可依據JIS K7136進行測定。The haze of the laminated film of the present invention is, for example, 7% or less, preferably 6% or less, more preferably 5% or less, more preferably 4% or less, further preferably 3% or less, especially preferably 2% or less, The best is below 1%. In addition, the lower limit of the haze is, for example, 0.1%. In particular, by setting the haze to 7% or less, it tends to be suitable for applications requiring very high transparency (for example, surface protection sheets of displays such as touch panels, etc.). The haze of the present invention can be easily controlled within the above range by using, for example, the following transparent substrate as a support. In addition, in this specification, haze can be measured based on JISK7136.
本發明之積層膜之全光線穿透率例如為85%以上,較佳為90%以上。尤其藉由將全光線穿透率設為90%以上,例如有適於用於要求非常高之透明性之用途(例如觸控面板等顯示器之表面保護片等)之傾向。本發明之全光線穿透率例如藉由使用下述透明基材作為支持體,可容易地控制於上述範圍內。再者,於本說明書中,全光線穿透率可依據JIS K7361-1進行測定。The total light transmittance of the laminated film of the present invention is, for example, above 85%, preferably above 90%. In particular, by setting the total light transmittance to 90% or more, it tends to be suitable for applications requiring very high transparency (for example, surface protection sheets of displays such as touch panels, etc.). The total light transmittance of the present invention can be easily controlled within the above range by using the following transparent substrate as a support, for example. In addition, in this specification, total light transmittance can be measured based on JISK7361-1.
本發明之積層膜之厚度(支持體/樹脂層之總厚度)例如可自1〜10000 μm之範圍中適當加以選擇,較佳為10〜1000 μm,更佳為15〜800 μm,進而較佳為20〜700 μm,尤佳為30〜500 μm。The thickness of the laminated film of the present invention (the total thickness of the support body/resin layer) can be appropriately selected, for example, from the range of 1 to 10000 μm, preferably 10 to 1000 μm, more preferably 15 to 800 μm, and even more preferably 20-700 μm, preferably 30-500 μm.
於本發明之積層膜中,樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)之面的水接觸角較佳為95°以上,更佳為96°以上,更佳為97°以上,更佳為98°以上,更佳為99°以上,更佳為100°以上,更佳為101°以上,更佳為102°以上,更佳為103°以上,進而較佳為104°以上,尤佳為105°以上。若水接觸角未達95°,則存在本發明之積層膜之防污性變得不充分,難以用作可折器件之表面保護材之情形。In the laminated film of the present invention, the water contact angle of the surface of the resin layer (when there are resin layers on the double-sided layer of the above-mentioned support) is preferably 95° or more, more preferably 96° Above, more preferably above 97°, more preferably above 98°, more preferably above 99°, more preferably above 100°, more preferably above 101°, more preferably above 102°, more preferably above 103° , and more preferably at least 104°, especially preferably at least 105°. When the water contact angle is less than 95°, the antifouling property of the laminated film of the present invention becomes insufficient, and it may be difficult to use it as a surface protection material for a foldable device.
再者,於本發明之積層膜中,於上述樹脂層積層於上述支持體之雙面之情形時,只要任一樹脂層的水接觸角為95°以上即可,另一樹脂層的水接觸角並無限定,可為95°以上,亦可為未達95°。Furthermore, in the laminated film of the present invention, when the above-mentioned resin layer is laminated on both sides of the above-mentioned support, it is only necessary that the water contact angle of any one resin layer is 95° or more, and the water contact angle of the other resin layer The angle is not limited, and may be greater than or equal to 95°, and may be less than 95°.
具備上述性能之本發明之積層膜可藉由下述支持體之材料之選擇及支持體之厚度之控制、以及控制樹脂層之成分或厚度、向支持體之積層方法而獲得。The laminated film of the present invention having the above properties can be obtained by selecting the material of the support, controlling the thickness of the support, controlling the composition or thickness of the resin layer, and laminating the film on the support as follows.
(支持體) 作為本發明之積層膜中之支持體,可使用塑膠基材、金屬基材、陶瓷基材、半導體基材、玻璃基材、紙基材、木基材(木製基材)、表面為塗裝表面之基材等公知或慣用之支持體,並無特別限定。其中,較佳為塑膠基材。上述支持體可具有單層之構成,亦可具有多層(積層)之構成,其構成(構造)並無特別限定。(support body) As the support in the laminated film of the present invention, plastic substrates, metal substrates, ceramic substrates, semiconductor substrates, glass substrates, paper substrates, wood substrates (wooden substrates), and coated substrates can be used. Known or commonly used supports such as substrates on the surface are not particularly limited. Among them, plastic substrates are preferred. The aforementioned support may have a single-layer configuration or a multi-layer (laminated) configuration, and the configuration (structure) is not particularly limited.
構成上述塑膠基材之塑膠材料並無特別限定,可列舉:聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)等聚酯;聚醯亞胺;聚碳酸酯;聚醯胺;聚縮醛;聚伸苯醚;聚伸苯硫醚;聚醚碸;聚醚醚酮;降莰烯系單體之均聚物(加成聚合物或開環聚合物等)、降莰烯與乙烯之共聚物等降莰烯系單體與烯烴系單體之共聚物(加成聚合物或開環聚合物等環狀烯烴共聚物等)、該等之衍生物等環狀聚烯烴;乙烯基系聚合物(例如聚甲基丙烯酸甲酯(PMMA)等丙烯酸樹脂、聚苯乙烯、聚氯乙烯、丙烯腈-苯乙烯-丁二烯樹脂(ABS樹脂)等);亞乙烯基系聚合物(例如聚偏二氯乙烯等);三乙醯纖維素(TAC)等纖維素系樹脂;環氧樹脂;酚樹脂;三聚氰胺樹脂;脲樹脂;順丁烯二醯亞胺樹脂;聚矽氧等各種塑膠材料。再者,上述塑膠基材可為僅利用1種塑膠材料構成者,亦可為利用2種以上之塑膠材料構成者。The plastic material constituting the above-mentioned plastic substrate is not particularly limited, and examples include: polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN); polyimide; polycarbonate ; Polyamide; Polyacetal; Polyphenylene ether; Polyphenylene sulfide; Polyether; Polyether ether ketone; ), copolymers of norbornene and ethylene, etc., copolymers of norbornene-based monomers and olefinic monomers (cyclic olefin copolymers such as addition polymers or ring-opening polymers, etc.), derivatives thereof, etc. Cyclic polyolefins; vinyl polymers (such as acrylic resins such as polymethyl methacrylate (PMMA), polystyrene, polyvinyl chloride, acrylonitrile-styrene-butadiene resin (ABS resin), etc.); Vinylidene-based polymers (such as polyvinylidene chloride, etc.); cellulose-based resins such as triacetyl cellulose (TAC); epoxy resins; phenol resins; melamine resins; urea resins; maleimide Resin; polysiloxane and other plastic materials. Furthermore, the above-mentioned plastic base material may be composed of only one type of plastic material, or may be composed of two or more types of plastic materials.
其中,作為上述塑膠基材,為了獲得透明性、彎曲耐久性優異之積層膜,較佳為使用透明性、彎曲耐久性優異之支持體(透明支持體),更佳為聚酯膜(尤其是PET、PEN)、聚醯亞胺膜、環狀聚烯烴膜、聚碳酸酯膜、TAC膜、PMMA膜,進而較佳為聚酯膜(尤其是PET、PEN)、聚醯亞胺膜。Among them, as the above-mentioned plastic substrate, in order to obtain a laminated film with excellent transparency and bending durability, it is preferable to use a support (transparent support) with excellent transparency and bending durability, and a polyester film (especially PET, PEN), polyimide film, cyclic polyolefin film, polycarbonate film, TAC film, PMMA film, and more preferably polyester film (especially PET, PEN), polyimide film.
上述支持體(尤其是塑膠基材)視需要亦可含有抗氧化劑、紫外線吸收劑、耐光穩定劑、熱穩定劑、結晶成核劑、難燃劑、難燃助劑、填充劑、塑化劑、耐衝擊性改良劑、補強劑、分散劑、防靜電劑、發泡劑、抗菌劑等其他添加劑。再者,添加劑可單獨使用一種,亦可組合兩種以上而使用。The above-mentioned supports (especially plastic substrates) may also contain antioxidants, ultraviolet absorbers, light-resistant stabilizers, heat stabilizers, crystal nucleating agents, flame retardants, flame retardant additives, fillers, and plasticizers if necessary , Impact resistance modifier, reinforcing agent, dispersant, antistatic agent, foaming agent, antibacterial agent and other additives. In addition, an additive may be used individually by 1 type, and may use it in combination of 2 or more types.
可對上述支持體(尤其是塑膠基材)之表面之一部分或全部實施粗化處理、易接著處理、靜電防止處理、噴砂處理(砂粗化處理)、電暈放電處理、電漿處理、化學蝕刻處理、水粗化處理、火焰處理、酸處理、鹼處理、氧化處理、紫外線照射處理、矽烷偶合劑處理等公知或慣用之表面處理。再者,上述塑膠基材可為未延伸膜,亦可為延伸膜(單軸延伸膜、雙軸延伸膜等)。再者,作為支持體,可使用市售品。Roughening treatment, easy-adhesive treatment, antistatic treatment, sandblasting treatment (sand roughening treatment), corona discharge treatment, plasma treatment, chemical Etching treatment, water roughening treatment, flame treatment, acid treatment, alkali treatment, oxidation treatment, ultraviolet irradiation treatment, silane coupling agent treatment and other known or customary surface treatments. Furthermore, the above-mentioned plastic substrate can be an unstretched film or a stretched film (uniaxially stretched film, biaxially stretched film, etc.). In addition, as a support body, a commercial item can be used.
上述支持體之厚度例如為1〜1000 μm左右,較佳為5〜500 μm,更佳為10〜400 μm,更佳為15〜400 μm,進而較佳為20〜300 μm,尤佳為25〜200 μm。The thickness of the above-mentioned support is, for example, about 1-1000 μm, preferably 5-500 μm, more preferably 10-400 μm, more preferably 15-400 μm, further preferably 20-300 μm, especially preferably 25 μm. ~200 μm.
本發明之支持體之霧度例如為7%以下,較佳為6%以下,更佳為5%以下,更佳為4%以下,進而較佳為3%以下,尤佳為2%以下,最佳為1%以下。再者,霧度之下限例如為0.1%。尤其藉由將霧度設為7%以下,例如有適於用於要求非常高之透明性之用途(例如觸控面板等顯示器之表面保護片等)之傾向。The haze of the support of the present invention is, for example, 7% or less, preferably 6% or less, more preferably 5% or less, more preferably 4% or less, further preferably 3% or less, especially preferably 2% or less, The best is below 1%. In addition, the lower limit of the haze is, for example, 0.1%. In particular, by setting the haze to 7% or less, it tends to be suitable for applications requiring very high transparency (for example, surface protection sheets of displays such as touch panels, etc.).
本發明之支持體之全光線穿透率例如為85%以上,較佳為90%以上。尤其藉由將全光線穿透率設為90%以上,例如有適於用於要求非常高之透明性之用途(例如觸控面板等顯示器之表面保護片等)之傾向。The total light transmittance of the support of the present invention is, for example, above 85%, preferably above 90%. In particular, by setting the total light transmittance to 90% or more, it tends to be suitable for applications requiring very high transparency (for example, surface protection sheets of displays such as touch panels, etc.).
(樹脂層) 於本發明中上述樹脂層係利用下述硬化性組成物之硬化物形成。即,樹脂層係由利用該硬化性組成物形成之硬化物所構成之層,係充分滿足上述(條件1)及(條件2)或(條件3)、較佳為充分滿足上述(條件4)及/或(條件5)之層。再者,上述樹脂層可藉由下述積層膜之製造方法,利用硬化性組成物製作。(resin layer) In the present invention, the above-mentioned resin layer is formed using a cured product of the following curable composition. That is, the resin layer is a layer composed of a cured product formed from the curable composition, and satisfies the above-mentioned (Condition 1) and (Condition 2) or (Condition 3) sufficiently, preferably satisfies the above-mentioned (Condition 4) and/or (Condition 5) layers. In addition, the above-mentioned resin layer can be produced using a curable composition by the production method of the laminated film described below.
關於上述樹脂層之厚度,就表面硬度與耐擦傷性之觀點而言,例如為1〜100 μm,較佳為2〜80 μm,更佳為3〜60 μm,進而較佳為5〜50 μm,最佳為10〜40 μm。於樹脂層之厚度薄於1 μm之情形時,存在無法維持較高之表面硬度之情形。又,於樹脂層之厚度厚於100 μm之情形時,容易發生產生較大之捲曲等不良情況。The thickness of the resin layer is, for example, 1 to 100 μm, preferably 2 to 80 μm, more preferably 3 to 60 μm, and still more preferably 5 to 50 μm from the viewpoint of surface hardness and scratch resistance. , the best is 10~40 μm. When the thickness of the resin layer is thinner than 1 μm, high surface hardness may not be maintained. In addition, when the thickness of the resin layer is thicker than 100 μm, problems such as large curls tend to occur.
上述樹脂層之霧度例如為1.0%以下,較佳為0.5%以下,更佳為0.1%以下。再者,樹脂層之霧度之下限例如為0.1%。尤其藉由將上述樹脂層之霧度設為1.0%以下,例如有適於用於要求非常高之透明性之用途(例如觸控面板等顯示器之表面保護片等)之傾向。樹脂層之霧度可藉由自上述積層膜(支持體/樹脂層)之霧度減去支持體之霧度所得之差而求出。The haze of the resin layer is, for example, 1.0% or less, preferably 0.5% or less, more preferably 0.1% or less. Furthermore, the lower limit of the haze of the resin layer is, for example, 0.1%. In particular, by setting the haze of the resin layer to 1.0% or less, it tends to be suitable for applications requiring very high transparency (for example, surface protection sheets for displays such as touch panels). The haze of the resin layer can be obtained from the difference obtained by subtracting the haze of the support from the haze of the above laminated film (support/resin layer).
上述樹脂層之全光線穿透率例如為85%以上,較佳為90%以上。藉由將全光線穿透率設為85%以上,例如有適於用於要求非常高之透明性之用途(例如觸控面板等顯示器之表面保護片等)之傾向。樹脂層之全光線穿透率例如可藉由如下方法而求出:使於硬化後之厚度成為與本發明之積層膜之樹脂層相同之厚度之方式將上述硬化性組成物塗佈於脫模基材並使之硬化,於剝離硬化膜後,依據JIS K7361-1進行測定。The total light transmittance of the resin layer is, for example, above 85%, preferably above 90%. By making the total light transmittance 85% or more, for example, it tends to be suitable for applications requiring very high transparency (for example, surface protection sheets of displays such as touch panels). The total light transmittance of the resin layer can be obtained, for example, by applying the above curable composition to the release mold so that the thickness after curing becomes the same as the resin layer of the laminated film of the present invention. The substrate was cured, and after the cured film was peeled off, it was measured in accordance with JIS K7361-1.
上述樹脂層之表面之平滑性亦較優異,算術平均粗糙度Ra 於依據JIS B0601之方法中,例如為0.1〜20 nm,較佳為0.1〜10 nm,更佳為0.1〜5 nm。The smoothness of the surface of the above-mentioned resin layer is also excellent, and the arithmetic average roughness Ra is, for example, 0.1-20 nm, preferably 0.1-10 nm, more preferably 0.1-5 nm in the method based on JIS B0601.
上述樹脂層可僅積層於上述支持體之一面,亦可積層於雙面。於樹脂層積層於支持體之雙面之情形時,可為相同之樹脂層,亦可為不同之樹脂層。又,於樹脂層積層於支持體之雙面之情形時,一樹脂層只要充分滿足上述(條件1)及(條件2)或(條件3),較佳為充分滿足上述(條件4)及/或(條件5)即可,另一樹脂層可充分滿足(條件1〜5)中之任一種以上,亦可不充分滿足。The above-mentioned resin layer may be laminated on only one surface of the above-mentioned support, or may be laminated on both surfaces. In the case of resin laminated layers on both sides of the support, the same resin layer may be used, or different resin layers may be used. Also, in the case where the resin layer is laminated on both sides of the support, one resin layer satisfies the above (Condition 1) and (Condition 2) or (Condition 3), preferably fully satisfies the above (Condition 4) and/or Or (Condition 5) may be sufficient, and the other resin layer may fully satisfy any one or more of (
(硬化性組成物) 用以形成本發明之積層膜中之樹脂層之硬化性組成物並無特別限定,可並無特別限定地採用公知之硬塗膜之硬塗層中所使用者,具體而言,可利用含有1種以上之硬化性化合物的硬化性組成物之硬化物而形成。(hardening composition) The curable composition used to form the resin layer in the laminated film of the present invention is not particularly limited, and it can be used in the hard coat layer of known hard coat films without particular limitation. Specifically, it can be used containing It is formed by hardening the hardening composition of one or more hardening compounds.
作為構成上述硬化性組成物之硬化性化合物,可並無特別限定地採用用以形成公知之硬塗膜之硬塗層之成分,例如可列舉:(甲基)丙烯酸酯化合物、陽離子硬化性聚矽氧樹脂、環氧樹脂、三聚氰胺樹脂、乙烯醚樹脂、氧環丁烷樹脂等。為了充分滿足本發明之積層膜之上述性能(條件1〜5),較佳為陽離子硬化性聚矽氧樹脂。As the curable compound constituting the above-mentioned curable composition, components of a hard coat layer for forming a known hard coat film can be used without particular limitation, for example, (meth)acrylate compounds, cationic curable polymer Silicone resin, epoxy resin, melamine resin, vinyl ether resin, oxetane resin, etc. In order to fully satisfy the above-mentioned performances (
上述陽離子硬化性聚矽氧樹脂較佳為含有聚有機倍半矽氧烷之態樣,具體而言,較佳為利用含有「具有下述式(1)所表示之構成單元之聚有機倍半矽氧烷(以下,有時稱為「本發明之聚有機倍半矽氧烷」)」之硬化性組成物(以下,有時稱為「本發明之硬化性組成物」)形成。 [式(1)中,R1 表示含有陽離子聚合性官能基之基]The above-mentioned cation-curable polysiloxane resin is preferably in the form of containing polyorganosilsesquioxane, specifically, it is preferable to use a polyorganosilsesquioxane containing "having a constituent unit represented by the following formula (1) Silicone (hereinafter, sometimes referred to as "polyorganosilsesquioxane of the present invention")" (hereinafter, sometimes referred to as "curable composition of the present invention")" is formed. [In formula (1), R 1 represents a group containing a cationic polymerizable functional group]
本發明之硬化性組成物係含有上述本發明之聚有機倍半矽氧烷作為必需成分之硬化性組成物(硬化性樹脂組成物),係用作用以形成本發明之積層膜中之樹脂層之硬化性組成物者。如下所述,本發明之硬化性組成物可進而含有硬化觸媒(尤其是光陽離子聚合起始劑、自由基聚合性起始劑)、或分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物、含氟之光聚合性樹脂、表面調整劑或表面改質劑等其他成分。The curable composition of the present invention is a curable composition (curable resin composition) containing the polyorganosilsesquioxane of the present invention as an essential component, and is used to form the resin layer in the laminated film of the present invention. sclerosing composition. As described below, the hardening composition of the present invention may further contain a hardening catalyst (especially a photocationic polymerization initiator, a radical polymerization initiator), or have one or more thermally polymerizable functional groups and Compounds with one or more photopolymerizable functional groups, fluorine-containing photopolymerizable resins, surface regulators or surface modifiers, and other components.
(聚有機倍半矽氧烷) 本發明之聚有機倍半矽氧烷之特徵在於:具有上述式(1)所表示之構成單元。 又,本發明之聚有機倍半矽氧烷較佳為具有下述式(1)所表示之構成單元(有時稱為「T3體」)、與下述式(II)所表示之構成單元(有時稱為「T2體」)。 進而,本發明之聚有機倍半矽氧烷較佳為具有下述式(4)所表示之構成單元。 (Polyorganosilsesquioxane) The polyorganosilsesquioxane of the present invention is characterized by having a structural unit represented by the above formula (1). In addition, the polyorganosilsesquioxane of the present invention preferably has a structural unit represented by the following formula (1) (sometimes referred to as "T3 body") and a structural unit represented by the following formula (II) (Sometimes called "T2 body"). Furthermore, it is preferable that the polyorganosilsesquioxane of this invention has the structural unit represented by following formula (4).
上述式(1)所表示之構成單元通常為[RSiO3/2 ]所表示之倍半矽氧烷構成單元(所謂T單位)。再者,上述式中之R表示氫原子或一價有機基,於以下亦相同。上述式(1)所表示之構成單元係藉由對應之水解性三官能矽烷化合物(具體而言,例如,下述式(a)所表示之化合物)之水解及縮合反應而形成。The structural unit represented by the above formula (1) is usually a silsesquioxane structural unit (so-called T unit) represented by [RSiO 3/2 ]. In addition, R in the said formula represents a hydrogen atom or a monovalent organic group, and it is the same below. The structural unit represented by said formula (1) is formed by the hydrolysis and condensation reaction of the corresponding hydrolyzable trifunctional silane compound (specifically, the compound represented by following formula (a), for example).
式(1)中之R1 表示含有陽離子聚合性官能基之基(一價基)。即,本發明之聚有機倍半矽氧烷係分子內至少具有陽離子聚合性官能基之陽離子硬化性化合物(陽離子聚合性化合物)。R 1 in formula (1) represents a group (monovalent group) containing a cationically polymerizable functional group. That is, the polyorganosilsesquioxane-based compound of the present invention is a cation-curable compound (cationically polymerizable compound) having at least a cationically polymerizable functional group in its molecule.
作為上述含有陽離子聚合性官能基之基中的「陽離子聚合性官能基」,只要係具有陽離子聚合性者,則並無特別限定,例如可列舉:環氧基、氧環丁烷基、乙烯醚基、乙烯苯基等。 作為陽離子聚合性官能基,就樹脂層之表面硬度(例如F以上)之觀點而言,尤佳為環氧基。The "cationically polymerizable functional group" in the group containing the above-mentioned cationically polymerizable functional group is not particularly limited as long as it is cationic polymerizable, and examples thereof include epoxy groups, oxetanyl groups, and vinyl ether groups. base, vinyl phenyl, etc. As a cationic polymerizable functional group, an epoxy group is especially preferable from a viewpoint of the surface hardness (for example, F or more) of a resin layer.
作為上述含有陽離子聚合性官能基之基,可列舉具有環氧乙烷環之公知或慣用之基,並無特別限定,就硬化性組成物之硬化性、硬化物(樹脂層)之表面硬度或耐熱性之觀點而言,較佳為下述式(1a)所表示之基、下述式(1b)所表示之基、下述式(1c)所表示之基、下述式(1d)所表示之基,更佳為下述式(1a)所表示之基、下述式(1c)所表示之基,進而較佳為下述式(1a)所表示之基。 Examples of the above-mentioned group containing a cationic polymerizable functional group include known or commonly used groups having an oxirane ring, and are not particularly limited. In terms of the curability of the curable composition, the surface hardness of the cured product (resin layer) or From the viewpoint of heat resistance, a group represented by the following formula (1a), a group represented by the following formula (1b), a group represented by the following formula (1c), and a group represented by the following formula (1d) are preferable. The group represented is more preferably a group represented by the following formula (1a), a group represented by the following formula (1c), and still more preferably a group represented by the following formula (1a).
上述式(1a)中,R1a 表示直鏈或支鏈狀之伸烷基。作為直鏈或支鏈狀之伸烷基,例如可列舉:亞甲基、甲基亞甲基、二甲基亞甲基、伸乙基、伸丙基、三亞甲基、四亞甲基、五亞甲基、六亞甲基、十亞甲基等碳數1〜10之直鏈或支鏈狀之伸烷基。其中,作為R1a ,就硬化物(樹脂層)之表面硬度或硬化性之觀點而言,較佳為碳數1〜4之直鏈狀之伸烷基、碳數3或4之支鏈狀之伸烷基,更佳為伸乙基、三亞甲基、伸丙基,進而較佳為伸乙基、三亞甲基。In the above formula (1a), R 1a represents a linear or branched alkylene group. Examples of linear or branched alkylene groups include methylene, methylmethylene, dimethylmethylene, ethylene, propylene, trimethylene, tetramethylene, Straight-chain or branched alkylene groups having 1 to 10 carbon atoms such as pentamethylene, hexamethylene, and decamethylene. Among them, R 1a is preferably a linear alkylene group having 1 to 4 carbon atoms, or a branched chain having 3 or 4 carbon atoms, from the viewpoint of the surface hardness or curability of the cured product (resin layer). The alkylene group is more preferably an ethylidene group, a trimethylene group, and a propylidene group, and further preferably an ethylidene group or a trimethylene group.
上述式(1b)中,R1b 表示直鏈或支鏈狀之伸烷基,可例示與R1a 同樣之基。其中,作為R1b ,就硬化物(樹脂層)之表面硬度或硬化性之觀點而言,較佳為碳數1〜4之直鏈狀之伸烷基、碳數3或4之支鏈狀之伸烷基,更佳為伸乙基、三亞甲基、伸丙基,進而較佳為伸乙基、三亞甲基。In the above formula (1b), R 1b represents a straight-chain or branched alkylene group, and the same groups as R 1a can be exemplified. Among them, R 1b is preferably a straight-chain alkylene group having 1 to 4 carbons or a branched chain having 3 or 4 carbons from the viewpoint of the surface hardness or curability of the cured product (resin layer). The alkylene group is more preferably an ethylidene group, a trimethylene group, and a propylidene group, and further preferably an ethylidene group or a trimethylene group.
上述式(1c)中,R1c 表示直鏈或支鏈狀之伸烷基,可例示與R1a 同樣之基。其中,作為R1c ,就硬化物(樹脂層)之表面硬度或硬化性之觀點而言,較佳為碳數1〜4之直鏈狀之伸烷基、碳數3或4之支鏈狀之伸烷基,更佳為伸乙基、三亞甲基、伸丙基,進而較佳為伸乙基、三亞甲基。In the above formula (1c), R 1c represents a linear or branched alkylene group, and the same groups as R 1a can be exemplified. Among them, R 1c is preferably a straight-chain alkylene group having 1 to 4 carbons or a branched chain having 3 or 4 carbons from the viewpoint of the surface hardness or curability of the cured product (resin layer). The alkylene group is more preferably an ethylidene group, a trimethylene group, and a propylidene group, and further preferably an ethylidene group or a trimethylene group.
上述式(1d)中,R1d 表示直鏈或支鏈狀之伸烷基,可例示與R1a 同樣之基。其中,作為R1d ,就硬化物(樹脂層)之表面硬度或硬化性之觀點而言,較佳為碳數1〜4之直鏈狀之伸烷基、碳數3或4之支鏈狀之伸烷基,更佳為伸乙基、三亞甲基、伸丙基,進而較佳為伸乙基、三亞甲基。In the above formula (1d), R 1d represents a straight-chain or branched alkylene group, and the same groups as R 1a can be exemplified. Among them, R 1d is preferably a straight-chain alkylene group having 1 to 4 carbons or a branched chain having 3 or 4 carbons from the viewpoint of the surface hardness or curability of the cured product (resin layer). The alkylene group is more preferably an ethylidene group, a trimethylene group, and a propylidene group, and further preferably an ethylidene group or a trimethylene group.
作為式(1)中之R1 ,尤佳為下述基:上述式(1a)所表示之基,且R1a 為伸乙基[其中尤其為,2-(3',4'-環氧環己基)乙基]。As R 1 in the formula (1), the following group is particularly preferable: the group represented by the above formula (1a), and R 1a is an ethylidene group [especially, 2-(3',4'-epoxy cyclohexyl) ethyl].
作為含有上述氧環丁烷基之基,可列舉具有氧環丁烷環之公知或慣用之基,並無特別限定,例如可列舉:氧環丁烷基本身、利用氧環丁烷基取代烷基(較佳為碳數1〜10、更佳為碳數1〜5之烷基)之氫原子(通常為1個以上,且較佳為1個氫原子)而成之基。就硬化性組成物之硬化性、硬化物(樹脂層)之耐熱性之觀點而言,較佳為3-氧環丁基、氧環丁烷-3-基甲基、3-乙基氧環丁烷-3-基甲基、2-(氧環丁烷-3-基)乙基、2-(3-乙基氧環丁烷-3-基)乙基、3-(氧環丁烷-3-基甲氧基)丙基、3-(3-乙基氧環丁烷-3-基甲氧基)丙基等。As the group containing the above-mentioned oxetane group, known or customary groups having an oxetane ring can be mentioned, without particular limitation, for example, oxetanyl itself, an oxetanyl-substituted A group (preferably an alkyl group having 1 to 10 carbons, more preferably an alkyl group having 1 to 5 carbons) containing hydrogen atoms (usually 1 or more, and preferably 1 hydrogen atom). From the viewpoint of the curability of the curable composition and the heat resistance of the cured product (resin layer), 3-oxocyclobutyl, oxetan-3-ylmethyl, 3-ethyloxetane Butane-3-ylmethyl, 2-(oxobutane-3-yl)ethyl, 2-(3-ethyloxybutane-3-yl)ethyl, 3-(oxobutane -3-ylmethoxy)propyl, 3-(3-ethyloxycyclobutan-3-ylmethoxy)propyl and the like.
作為含有上述乙烯醚基之基,可列舉具有乙烯醚基之公知或慣用之基,並無特別限定,例如可列舉:乙烯醚基本身、利用乙烯醚基取代烷基(較佳為碳數1〜10、更佳為碳數1〜5之烷基)之氫原子(通常為1個以上,且較佳為1個氫原子)而成之基。就硬化性組成物之硬化性、硬化物(樹脂層)之耐熱性之觀點而言,較佳為乙烯氧基甲基、2-(乙烯氧基)乙基、3-(乙烯氧基)丙基等。As the group containing the above-mentioned vinyl ether group, known or conventional groups having a vinyl ether group can be mentioned, without particular limitation, for example, a vinyl ether group itself, a vinyl ether group substituted with an alkyl group (preferably a carbon number of 1 ~10, more preferably an alkyl group having 1 to 5 carbon atoms) hydrogen atoms (usually 1 or more, and preferably 1 hydrogen atom) are formed. From the viewpoint of the curability of the curable composition and the heat resistance of the cured product (resin layer), vinyloxymethyl, 2-(ethyleneoxy)ethyl, 3-(ethyleneoxy)propyl are preferred. Base etc.
作為含有上述乙烯苯基之基,可列舉具有乙烯苯基之公知或慣用之基,並無特別限定,例如可列舉:乙烯苯基本身、利用乙烯苯基取代烷基(較佳為碳數1〜10、更佳為碳數1〜5之烷基)之氫原子(通常為1個以上,且較佳為1個氫原子)而成之基。就硬化性組成物之硬化性、硬化物(樹脂層)之耐熱性之觀點而言,較佳為4-乙烯苯基、3-乙烯苯基、2-乙烯苯基等。As the group containing the above-mentioned vinylphenyl group, known or customary groups having vinylphenyl groups can be mentioned, without particular limitation, for example, vinylphenyl itself, vinylphenyl substituted alkyl (preferably
本發明之聚有機倍半矽氧烷可為僅具有1種上述式(1)所表示之構成單元者,亦可為具有2種以上之上述式(1)所表示之構成單元者。The polyorganosilsesquioxane of the present invention may have only one structural unit represented by the above formula (1), or may have two or more structural units represented by the above formula (1).
關於本發明之聚有機倍半矽氧烷,作為倍半矽氧烷構成單元[RSiO3/2 ],除可具有上述式(1)所表示之構成單元以外,亦可具有下述式(2)所表示之構成單元。 Regarding the polyorganosilsesquioxane of the present invention, as the silsesquioxane structural unit [RSiO 3/2 ], in addition to the structural unit represented by the above formula (1), it may also have the following formula (2 ) represents the constituent unit.
上述式(2)所表示之構成單元通常為[RSiO3/2 ]所表示之倍半矽氧烷構成單元(T單位)。即,上述式(2)所表示之構成單元係藉由對應之水解性三官能矽烷化合物(具體而言,例如,下述式(b)所表示之化合物)之水解及縮合反應而形成。The structural unit represented by the above formula (2) is usually a silsesquioxane structural unit (T unit) represented by [RSiO 3/2 ]. That is, the structural unit represented by said formula (2) is formed by the hydrolysis and condensation reaction of the corresponding hydrolyzable trifunctional silane compound (specifically, the compound represented by following formula (b), for example).
上述式(2)中之R2 表示經取代或未經取代之芳基、經取代或未經取代之芳烷基、經取代或未經取代之環烷基、經取代或未經取代之烷基、或經取代或未經取代之烯基。作為上述芳基,例如可列舉:苯基、甲苯基、萘基等。作為上述芳烷基,例如可列舉苄基、苯乙基等。作為上述環烷基,例如可列舉:環丁基、環戊基、環己基等。作為上述烷基,例如可列舉:甲基、乙基、丙基、正丁基、異丙基、異丁基、第二丁基、第三丁基、異戊基等直鏈或支鏈狀之烷基。作為上述烯基,例如可列舉:乙烯基、烯丙基、異丙烯基等直鏈或支鏈狀之烯基。R in the above formula ( 2 ) represents substituted or unsubstituted aryl, substituted or unsubstituted aralkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted alkane group, or substituted or unsubstituted alkenyl group. As said aryl group, a phenyl group, a tolyl group, a naphthyl group etc. are mentioned, for example. As said aralkyl group, a benzyl group, a phenethyl group, etc. are mentioned, for example. As said cycloalkyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group etc. are mentioned, for example. Examples of the above-mentioned alkyl group include linear or branched groups such as methyl, ethyl, propyl, n-butyl, isopropyl, isobutyl, second-butyl, third-butyl, and isopentyl. The alkyl group. As said alkenyl group, linear or branched alkenyl groups, such as vinyl group, allyl group, and isopropenyl group, are mentioned, for example.
作為上述取代芳基、取代芳烷基、取代環烷基、取代烷基、取代烯基,可列舉:上述芳基、芳烷基、環烷基、烷基、烯基之各者中之氫原子或主鏈骨架之一部分或全部經選自由醚基、酯基、羰基、矽氧烷基、鹵素原子(氟原子等)、丙烯酸基、甲基丙烯酸基、巰基、胺基及羥基(hydroxyl)所組成之群中之至少1種取代之基。Examples of the above-mentioned substituted aryl group, substituted aralkyl group, substituted cycloalkyl group, substituted alkyl group, and substituted alkenyl group include hydrogen in each of the above-mentioned aryl group, aralkyl group, cycloalkyl group, alkyl group, and alkenyl group. A part or all of the atoms or main chain skeleton are selected from ether group, ester group, carbonyl group, siloxane group, halogen atom (fluorine atom, etc.), acrylic group, methacrylic group, mercapto group, amino group and hydroxyl group (hydroxyl) At least one substituent group in the group formed.
其中,作為R2 ,較佳為經取代或未經取代之芳基、經取代或未經取代之烷基、經取代或未經取代之烯基,更佳為經取代或未經取代之芳基,進而較佳為苯基。Among them, R 2 is preferably substituted or unsubstituted aryl, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, more preferably substituted or unsubstituted aryl group, more preferably phenyl group.
本發明之聚有機倍半矽氧烷中之上述各倍半矽氧烷構成單元(式(1)所表示之構成單元、式(2)所表示之構成單元)之比率可根據用以形成該等構成單元之原料(水解性三官能矽烷)之組成而適當加以調整。The ratio of each of the above-mentioned silsesquioxane constituent units (the constituent units represented by the formula (1), the constituent units represented by the formula (2)) in the polyorganosilsesquioxane of the present invention can be determined according to the ratio used to form the The composition of the raw material (hydrolyzable trifunctional silane) of the constituent units can be adjusted appropriately.
本發明之聚有機倍半矽氧烷除具有上述式(1)所表示之構成單元及式(2)所表示之構成單元以外,亦可進而具有選自由上述式(1)所表示之構成單元及式(2)所表示之構成單元以外之倍半矽氧烷構成單元[RSiO3/2 ]、[R3 SO1/2 ]所表示之構成單元(所謂M單元)、[R2 SiO2/2 ]所表示之構成單元(所謂D單元)及[SiO4/2] 所表示之構成單元(所謂Q單元)所組成之群中之至少1種矽氧烷構成單元。再者,作為上述式(1)所表示之構成單元及式(2)所表示之構成單元以外之倍半矽氧烷構成單元,例如可列舉下述式(3)所表示之構成單元等。 In addition to the structural units represented by the above formula (1) and the structural units represented by the formula (2), the polyorganosilsesquioxane of the present invention may further have a structural unit selected from the above formula (1) And the structural unit represented by the silsesquioxane structural unit [RSiO 3/2 ], [R 3 SO 1/2 ] other than the structural unit represented by formula (2) (so-called M unit), [R 2 SiO 2 At least one siloxane structural unit in the group consisting of a structural unit represented by [SiO 4/2 ] (so-called D unit) and a structural unit represented by [SiO 4/2] (so-called Q unit). In addition, as a silsesquioxane structural unit other than the structural unit represented by said formula (1) and the structural unit represented by formula (2), the structural unit etc. which are represented by following formula (3) are mentioned, for example.
於本發明之聚有機倍半矽氧烷具有上述式(I)所表示之構成單元(T3體)、與上述式(II)所表示之構成單元(T2體)之情形時,其比率[T3體/T2體]並無特別限定,例如可自5以上(例如5以上且500以下)之範圍中適當加以選擇。本發明之聚有機倍半矽氧烷之一態樣之上述比率[T3體/T2體]之下限值較佳為5,更佳為6,進而較佳為7,且上限值較佳為未達20,更佳為18,更佳為16,進而較佳為14。藉由將上述比率[T3體/T2體]設為5以上,有樹脂層之表面硬度提高之傾向。藉由將上述比率[T3體/T2體]設為未達20(較佳為18以下),與硬化性組成物中之其他成分之相溶性提高,亦抑制黏度,故而容易使用,且容易塗敷。When the polyorganosilsesquioxane of the present invention has the structural unit (T3 body) represented by the above formula (I) and the structural unit (T2 body) represented by the above formula (II), the ratio [T3 body/T2 body] is not particularly limited, for example, can be appropriately selected from the range of 5 or more (for example, 5 or more and 500 or less). The lower limit of the ratio [T3 body/T2 body] of an aspect of the polyorganosilsesquioxane of the present invention is preferably 5, more preferably 6, further preferably 7, and the upper limit is preferably It is less than 20, more preferably 18, more preferably 16, still more preferably 14. There exists a tendency for the surface hardness of a resin layer to improve by making the said ratio [T3 body/T2 body] 5 or more. By setting the above ratio [T3 body/T2 body] to less than 20 (preferably 18 or less), the compatibility with other components in the curable composition is improved, and the viscosity is also suppressed, so it is easy to use and easy to apply apply.
本發明之聚有機倍半矽氧烷之另一態樣之上述比率[T3體/T2體]之下限值較佳為20,更佳為21,更佳為23,進而較佳為25,且上限值較佳為500,更佳為100,更佳為50,進而較佳為40。藉由將上述比率[T3體/T2體]設為20以上,除表面硬度或密接性提高以外,於製成未硬化或半硬化之樹脂層時之表面容易變得不黏著,耐黏連性提高,而容易捲取成輥。另一方面,藉由將上述比率[T3體/T2體]設為500以下,與硬化性組成物中之其他成分之相溶性提高,亦抑制黏度,故而容易使用,且容易塗敷。In another aspect of the polyorganosilsesquioxane of the present invention, the lower limit of the ratio [T3 body/T2 body] is preferably 20, more preferably 21, more preferably 23, and still more preferably 25, And the upper limit is preferably 500, more preferably 100, more preferably 50, and still more preferably 40. By setting the above ratio [T3 body/T2 body] to 20 or more, in addition to improving the surface hardness and adhesion, the surface is easy to become non-adhesive when it is made into an unhardened or semi-hardened resin layer, and the blocking resistance Raised while easily coiled into rolls. On the other hand, by setting the above-mentioned ratio [T3 body/T2 body] to 500 or less, the compatibility with other components in the curable composition is improved, and the viscosity is also suppressed, so it is easy to handle and easy to apply.
再者,若更詳細地記載上述式(I)所表示之構成單元,則係由下述式(I')所表示。又,若更詳細地記載上述式(II)所表示之構成單元,則係由下述式(II')所表示。下述式(I')所表示之結構中所表示之與矽原子鍵結之3個氧原子分別與其他矽原子(式(I')中未表示之矽原子)鍵結。另一方面,下述式(II')所表示之結構中所表示之位於矽原子之上與下之2個氧原子分別與其他矽原子(式(II')中未表示之矽原子)鍵結。即,上述T3體及T2體均為藉由對應之水解性三官能矽烷化合物之水解及縮合反應而形成之構成單元(T單元)。 In addition, when the structural unit represented by said formula (I) is described in more detail, it is represented by following formula (I'). Moreover, when the structural unit represented by said formula (II) is described in more detail, it is represented by following formula (II'). In the structure represented by the following formula (I'), the three oxygen atoms bonded to silicon atoms are respectively bonded to other silicon atoms (silicon atoms not represented in formula (I')). On the other hand, in the structure represented by the following formula (II'), the two oxygen atoms located above and below the silicon atom are respectively bonded to other silicon atoms (silicon atoms not represented in the formula (II') Knot. That is, both the above-mentioned T3 body and T2 body are structural units (T units) formed by hydrolysis and condensation reactions of the corresponding hydrolyzable trifunctional silane compounds.
上述式(I)中之Ra (式(I')中之Ra 亦相同)及式(II)中之Rb (式(II')中之Rb 亦相同)分別表示含有陽離子聚合性官能基之基、經取代或未經取代之芳基、經取代或未經取代之芳烷基、經取代或未經取代之環烷基、經取代或未經取代之烷基、經取代或未經取代之烯基、或氫原子。作為Ra 及Rb 之具體例,可例示與上述式(1)中之R1 、上述式(2)中之R2 相同者。再者,式(I)中之Ra 及式(II)中之Rb 分別源自與用作本發明之聚有機倍半矽氧烷之原料之水解性三官能矽烷化合物中之矽原子鍵結之基(烷氧基及鹵素原子以外之基;例如下述式(a)〜(c)中之R1 、R2 、氫原子等)。R a in the above formula (I) (the R a in the formula (I') is also the same) and R b in the formula (II) ( the R b in the formula (II') is also the same) respectively represent cationic polymerizable Functional group, substituted or unsubstituted aryl, substituted or unsubstituted aralkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted alkyl, substituted or Unsubstituted alkenyl, or a hydrogen atom. Specific examples of R a and R b include the same ones as R 1 in the above formula (1) and R 2 in the above formula (2). Furthermore, R a in formula (I) and R b in formula (II ) are respectively derived from the silicon atom bond in the hydrolyzable trifunctional silane compound used as the raw material of the polyorganosilsesquioxane of the present invention. Groups (groups other than alkoxy groups and halogen atoms; for example, R 1 , R 2 , hydrogen atoms, etc. in the following formulas (a) to (c)).
上述式(II)中之Rc (式(II')中之Rc 亦相同)表示氫原子或碳數1〜4之烷基。作為碳數1〜4之烷基,例如可列舉:甲基、乙基、丙基、異丙基、丁基、異丁基等碳數1〜4之直鏈或支鏈狀之烷基。式(II)中之Rc 中之烷基通常源自形成用作本發明之聚有機倍半矽氧烷之原料之水解性矽烷化合物中之烷氧基(例如作為下述X1 〜X3 之烷氧基等)之烷基。R c in the above formula (II) (the same is true for R c in the formula (II')) represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. Examples of the alkyl group having 1 to 4 carbon atoms include linear or branched chain alkyl groups having 1 to 4 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, and isobutyl. The alkyl group in R in the formula (II) is usually derived from the alkoxy group in the hydrolyzable silane compound used as the raw material of the polyorganosilsesquioxane of the present invention (for example, as the following X 1 to X 3 Alkoxy, etc.) of the alkyl group.
本發明之聚有機倍半矽氧烷之上述比率[T3體/T2體]例如可藉由29 Si-NMR光譜測定而求出。於29 Si-NMR光譜中,上述式(I)所表示之構成單元(T3體)中之矽原子與上述式(II)所表示之構成單元(T2體)中之矽原子於不同之位置(化學位移)顯示訊號(波峰),故而藉由算出該等各波峰之積分比,而求出上述比率[T3體/T2體]。具體而言,例如,於本發明之聚有機倍半矽氧烷係由上述式(1)所表示,且具有R1 為2-(3',4'-環氧環己基)乙基之構成單元之情形時,上述式(I)所表示之結構(T3體)中之矽原子之訊號係於-64〜-70 ppm出現,上述式(II)所表示之結構(T2體)中之矽原子之訊號係於-54〜-60 ppm出現。因此,於該情形時,藉由算出-64〜-70 ppm之訊號(T3體)與-54〜-60 ppm之訊號(T2體)之積分比,可求出上述比率[T3體/T2體]。於R1 為2-(3',4'-環氧環己基)乙基以外之含有陽離子聚合性官能基之基之情形時,亦能夠以同樣之方式求出[T3體/T2體]。The ratio [T3 body/T2 body] of the polyorganosilsesquioxane of the present invention can be obtained, for example, by 29 Si-NMR spectrum measurement. In the 29 Si-NMR spectrum, the silicon atom in the constituent unit (T3 body) represented by the above formula (I) and the silicon atom in the constituent unit (T2 body) represented by the above formula (II) are in different positions ( Chemical shift) shows the signal (peak), so by calculating the integral ratio of these peaks, the above-mentioned ratio [T3 body/T2 body] can be obtained. Specifically, for example, the polyorganosilsesquioxane in the present invention is represented by the above-mentioned formula (1), and has the composition that R 1 is 2-(3',4'-epoxycyclohexyl)ethyl In the case of the unit, the signal of the silicon atom in the structure (T3 body) represented by the above formula (I) appears at -64~-70 ppm, and the signal of the silicon atom in the structure (T2 body) represented by the above formula (II) The atomic signal appears at -54~-60 ppm. Therefore, in this case, by calculating the integral ratio of the signal of -64~-70 ppm (T3 body) and the signal of -54~-60 ppm (T2 body), the above ratio [T3 body/T2 body] can be obtained ]. When R 1 is a group containing a cationically polymerizable functional group other than 2-(3',4'-epoxycyclohexyl)ethyl, [T3 body/T2 body] can be obtained in the same manner.
本發明之聚有機倍半矽氧烷之29 Si-NMR光譜例如可藉由下述裝置及條件進行測定。 測定裝置:商品名「JNM-ECA500NMR」(日本電子股份有限公司製造) 溶劑:氘氯仿 累計次數:1800次 測定溫度:25℃The 29 Si-NMR spectrum of the polyorganosilsesquioxane of the present invention can be measured, for example, by the following equipment and conditions. Measuring device: Trade name "JNM-ECA500NMR" (manufactured by JEOL Ltd.) Solvent: Deuterium chloroform Cumulative number of times: 1800 Measurement temperature: 25°C
於本發明之聚有機倍半矽氧烷之上述比率[T3體/T2體]為上述範圍(例如5以上且500以下)之情形時,係指於本發明之聚有機倍半矽氧烷中相對於T3體存在一定量之T2體。作為此種T2體,例如可列舉:下述式(4)所表示之構成單元、下述式(5)所表示之構成單元、下述式(6)所表示之構成單元等。下述式(4)中之R1 及下述式(5)中之R2 分別與上述式(1)中之R1 及上述式(2)中之R2 相同。下述式(4)〜(6)中之Rc 與式(II)中之Rc 相同,表示氫原子或碳數1〜4之烷基。 When the ratio [T3 body/T2 body] of the polyorganosilsesquioxane of the present invention is within the above range (for example, 5 to 500), it means that in the polyorganosilsesquioxane of the present invention There is a certain amount of T2 bodies relative to T3 bodies. As such a T2 body, the structural unit represented by following formula (4), the structural unit represented by following formula (5), the structural unit represented by following formula (6), etc. are mentioned, for example. R 1 in the following formula (4) and R 2 in the following formula (5) are the same as R 1 in the above formula (1) and R 2 in the above formula (2), respectively. R c in the following formulas (4) to (6) is the same as R c in formula (II), and represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
本發明之聚有機倍半矽氧烷可具有籠型、不完全籠型、梯型、無規型中之任一種倍半矽氧烷結構,亦可組合具有該等倍半矽氧烷結構之2種以上。The polyorganosilsesquioxane of the present invention may have any one of the cage-type, incomplete cage-type, ladder-type, and random-type silsesquioxane structures, and may also be combined with these silsesquioxane structures. 2 or more.
於本發明之聚有機倍半矽氧烷具有上述式(4)所表示之構成單元之情形時,上述式(1)所表示之構成單元及上述式(4)所表示之構成單元相對於矽氧烷構成單元之總量[全部矽氧烷構成單元;M單元、D單元、T單元及Q單元之總量](100莫耳%)之比率(總量)並無特別限定,較佳為55〜100莫耳%,更佳為65〜100莫耳%,進而較佳為80〜99莫耳%。藉由將上述比率設為55莫耳%以上,硬化性組成物之硬化性提高,又,硬化物(樹脂層)之表面硬度或接著性明顯增高。再者,本發明之聚有機倍半矽氧烷中之各矽氧烷構成單元之比率例如可藉由原料之組成或NMR光譜測定等而算出。When the polyorganosilsesquioxane of the present invention has the structural unit represented by the above formula (4), the structural unit represented by the above formula (1) and the structural unit represented by the above formula (4) are relatively The ratio (total amount) of the total amount of oxane constituent units [all siloxane constituent units; the total amount of M units, D units, T units, and Q units] (100 mole %) is not particularly limited, and is preferably 55~100 mol%, more preferably 65~100 mol%, and then preferably 80~99 mol%. By setting the above ratio to 55 mol % or more, the curability of the curable composition is improved, and the surface hardness and adhesiveness of the cured product (resin layer) are significantly increased. In addition, the ratio of each silsesquioxane structural unit in the polyorganosilsesquioxane of this invention can be calculated from the composition of a raw material, NMR spectrum measurement, etc., for example.
本發明之聚有機倍半矽氧烷中之上述式(2)所表示之構成單元及上述式(5)所表示之構成單元相對於矽氧烷構成單元之總量[全部矽氧烷構成單元;M單元、D單元、T單元及Q單元之總量](100莫耳%)之比率(總量)並無特別限定,較佳為0〜70莫耳%,更佳為0〜60莫耳%,進而較佳為0〜40莫耳%,尤佳為1〜15莫耳%。藉由將上述比率設為70莫耳%以下,可相對地增加式(1)所表示之構成單元及式(4)所表示之構成單元之比率,故而有硬化性組成物之硬化性提高,硬化物(樹脂層)之表面硬度或接著性進一步增高之傾向。另一方面,藉由將上述比率設為1莫耳%以上,有硬化物(樹脂層)之阻氣性提高之傾向。The structural unit represented by the above formula (2) and the structural unit represented by the above formula (5) in the polyorganosilsesquioxane of the present invention are relative to the total amount of the siloxane structural units [all siloxane structural units The ratio (total amount) of the total amount of M unit, D unit, T unit and Q unit] (100 mol%) is not particularly limited, is preferably 0~70 mol%, is more preferably 0~60 mol mol%, and then preferably 0 ~ 40 mol%, especially preferably 1 ~ 15 mol%. By setting the above-mentioned ratio to 70 mol% or less, the ratio of the structural unit represented by the formula (1) and the structural unit represented by the formula (4) can be relatively increased, so the curability of the curable composition is improved, The surface hardness or adhesiveness of the cured product (resin layer) tends to increase further. On the other hand, there exists a tendency for the gas barrier property of a hardened|cured material (resin layer) to improve by making the said ratio into 1 mol% or more.
本發明之聚有機倍半矽氧烷中之上述式(1)所表示之構成單元、上述式(2)所表示之構成單元、上述式(4)所表示之構成單元及上述式(5)所表示之構成單元相對於矽氧烷構成單元之總量[全部矽氧烷構成單元;M單元、D單元、T單元及Q單元之總量](100莫耳%)之比率(總量)並無特別限定,較佳為60〜100莫耳%,更佳為70〜100莫耳%,進而較佳為80〜100莫耳%。藉由將上述比率設為60莫耳%以上,有硬化物(樹脂層)之表面硬度或接著性進一步增高之傾向。The structural unit represented by the above formula (1), the structural unit represented by the above formula (2), the structural unit represented by the above formula (4), and the above formula (5) in the polyorganosilsesquioxane of the present invention The ratio (total amount) of the indicated constituent units to the total amount of siloxane constituent units [all siloxane constituent units; the total amount of M units, D units, T units, and Q units] (100 mole%) It is not particularly limited, but it is preferably 60-100 mol%, more preferably 70-100 mol%, and more preferably 80-100 mol%. There exists a tendency for the surface hardness and adhesiveness of a hardened|cured material (resin layer) to further increase by making the said ratio into 60 mol% or more.
本發明之聚有機倍半矽氧烷之利用凝膠滲透層析法之標準聚苯乙烯換算之數量平均分子量(Mn)並無特別限定,例如可自1000〜50000之範圍中適當加以選擇。本發明之聚有機倍半矽氧烷之一態樣之數量平均分子量之下限值較佳為1000,更佳為1100,且上限值較佳為3000,更佳為2800,進而較佳為2600。藉由將數量平均分子量設為1000以上,有硬化物(樹脂層)之耐熱性、耐擦傷性、接著性進一步提高之傾向。藉由將數量平均分子量設為3000以下,有與硬化性組成物中之其他成分之相溶性提高,硬化物(樹脂層)之耐熱性進一步提高之傾向。The polyorganosilsesquioxane of the present invention has a standard polystyrene-equivalent number average molecular weight (Mn) by gel permeation chromatography, which is not particularly limited, and can be appropriately selected from, for example, a range of 1,000 to 50,000. The lower limit of the number average molecular weight of one aspect of the polyorganosilsesquioxane of the present invention is preferably 1000, more preferably 1100, and the upper limit is preferably 3000, more preferably 2800, and more preferably 2600. By setting the number average molecular weight to 1000 or more, the heat resistance, scratch resistance, and adhesiveness of the cured product (resin layer) tend to be further improved. By setting the number average molecular weight to 3000 or less, the compatibility with other components in the curable composition is improved, and the heat resistance of the cured product (resin layer) tends to be further improved.
本發明之聚有機倍半矽氧烷之另一態樣之數量平均分子量之下限值較佳為2500,更佳為2800,進而較佳為3000,且上限值較佳為50000,更佳為10000,進而較佳為8000。藉由將數量平均分子量設為2500以上,除硬化物(樹脂層)之耐熱性、耐擦傷性、接著性提高以外,於製成未硬化或半硬化之樹脂層時之表面容易變得不黏著,耐黏連性提高,容易捲取成輥。藉由將數量平均分子量設為50000以下,有與硬化性組成物中之其他成分之相溶性提高,硬化物(樹脂層)之耐熱性進一步提高之傾向。The lower limit of the number average molecular weight of another aspect of the polyorganosilsesquioxane of the present invention is preferably 2500, more preferably 2800, further preferably 3000, and the upper limit is preferably 50000, more preferably 10000, and more preferably 8000. By setting the number average molecular weight to 2500 or more, in addition to improving the heat resistance, scratch resistance, and adhesiveness of the cured product (resin layer), the surface becomes less sticky when it is made into an uncured or semi-hardened resin layer , the resistance to adhesion is improved, and it is easy to be wound into a roll. By setting the number average molecular weight to 50,000 or less, the compatibility with other components in the curable composition improves, and the heat resistance of the cured product (resin layer) tends to further improve.
本發明之聚有機倍半矽氧烷之利用凝膠滲透層析法之標準聚苯乙烯換算之分子量分散度(Mw/Mn)並無特別限定,可自1.0〜4.0之範圍中適當加以選擇。分子量分散度之下限值較佳為1.0,更佳為1.1,進而較佳為1.2。藉由將分子量分散度設為1.1以上,有容易成為液狀,使用性提高之傾向。另一方面,分子量分散度之上限值較佳為4.0,更佳為3.0,進而較佳為2.5(例如較佳為3.0,更佳為2.0,進而較佳為1.9)。藉由將分子量分散度設為4.0以下(例如3.0以下),有硬化物(樹脂層)之表面硬度或接著性進一步增高之傾向。The molecular weight dispersion (Mw/Mn) of the polyorganosilsesquioxane of the present invention in terms of standard polystyrene by gel permeation chromatography is not particularly limited, and can be appropriately selected from the range of 1.0 to 4.0. The lower limit of the molecular weight dispersion is preferably 1.0, more preferably 1.1, still more preferably 1.2. By making the molecular weight dispersity 1.1 or more, it tends to become liquid easily and usability improves. On the other hand, the upper limit of the molecular weight dispersion is preferably 4.0, more preferably 3.0, still more preferably 2.5 (for example, preferably 3.0, more preferably 2.0, still more preferably 1.9). By making the molecular weight dispersion degree 4.0 or less (for example, 3.0 or less), there exists a tendency for the surface hardness and adhesiveness of a hardened|cured material (resin layer) to further increase.
再者,本發明之聚有機倍半矽氧烷之數量平均分子量、分子量分散度可藉由下述裝置及條件進行測定。 測定裝置:商品名「LC-20AD」(島津製作所股份有限公司製造) 管柱:Shodex KF-801×2根、KF-802及KF-803(昭和電工股份有限公司製造) 測定溫度:40℃ 溶離液:THF、試樣濃度0.1〜0.2重量% 流量:1 mL/min 偵測器:UV-VIS偵測器(商品名「SPD-20A」、島津製作所股份有限公司製造) 分子量:標準聚苯乙烯換算Furthermore, the number average molecular weight and molecular weight dispersion of the polyorganosilsesquioxane of the present invention can be measured by the following devices and conditions. Measuring device: Trade name "LC-20AD" (manufactured by Shimadzu Corporation) String: Shodex KF-801×2, KF-802 and KF-803 (manufactured by Showa Denko Co., Ltd.) Measuring temperature: 40°C Eluent: THF, sample concentration 0.1~0.2% by weight Flow rate: 1 mL/min Detector: UV-VIS detector (trade name "SPD-20A", manufactured by Shimadzu Corporation) Molecular weight: Standard polystyrene conversion
本發明之聚有機倍半矽氧烷於空氣環境下之5%重量減少溫度(Td5 )並無特別限定,較佳為330℃以上(例如330〜450℃),更佳為340℃以上,進而較佳為350℃以上。藉由5%重量減少溫度為330℃以上,有硬化物(樹脂層)之耐熱性進一步提高之傾向。尤其是藉由本發明之聚有機倍半矽氧烷之上述比率[T3體/T2體]為5以上且500以下,數量平均分子量為1000〜50000,分子量分散度為1.0〜4.0者,而將其5%重量減少溫度控制為330℃以上。再者,5%重量減少溫度係以一定之升溫速度加熱時,於減少了加熱前之重量之5%的時間點之溫度,成為耐熱性之指標。上述5%重量減少溫度可藉由TGA(熱重量分析),於空氣環境下,於升溫速度5℃/min之條件下測定。The 5% weight loss temperature (T d5 ) of the polyorganosilsesquioxane of the present invention in air environment is not particularly limited, preferably above 330°C (for example, 330~450°C), more preferably above 340°C, More preferably, it is 350° C. or higher. When the 5% weight loss temperature is 330° C. or higher, the heat resistance of the cured product (resin layer) tends to be further improved. In particular, the ratio [T3 body/T2 body] of the polyorganosilsesquioxane of the present invention is 5 to 500, the number average molecular weight is 1,000 to 50,000, and the molecular weight dispersion is 1.0 to 4.0. 5% weight reduction temperature is controlled above 330°C. Furthermore, the 5% weight loss temperature is the temperature at the time point when the weight before heating is reduced by 5% when heating at a constant heating rate, and becomes an index of heat resistance. The above-mentioned 5% weight loss temperature can be measured by TGA (thermogravimetric analysis) in an air environment at a heating rate of 5° C./min.
本發明之聚有機倍半矽氧烷可藉由公知或慣用之聚矽氧烷之製造方法而製造,並無特別限定,例如可藉由使1種或2種以上之水解性矽烷化合物進行水解及縮合之方法而製造。其中,作為上述水解性矽烷化合物,必須使用用以形成上述式(1)所表示之構成單元之水解性三官能矽烷化合物(下述式(a)所表示之化合物)作為必需之水解性矽烷化合物。The polyorganosilsesquioxane of the present invention can be produced by known or customary polysiloxane production methods without particular limitation, for example, by hydrolyzing one or more hydrolyzable silane compounds and condensation methods. Among them, as the above-mentioned hydrolyzable silane compound, a hydrolyzable trifunctional silane compound (compound represented by the following formula (a)) for forming the structural unit represented by the above-mentioned formula (1) must be used as an essential hydrolyzable silane compound .
更具體而言,例如藉由使作為用以形成本發明之聚有機倍半矽氧烷中之倍半矽氧烷構成單元(T單元)之水解性矽烷化合物的下述式(a)所表示之化合物、進而視需要之下述式(b)所表示之化合物、下述式(c)所表示之化合物進行水解及縮合之方法,可製造本發明之聚有機倍半矽氧烷。 More specifically, for example, represented by the following formula (a) as a hydrolyzable silane compound used to form the silsesquioxane constituent unit (T unit) in the polyorganosilsesquioxane of the present invention The polyorganosilsesquioxane of the present invention can be produced by hydrolyzing and condensing the compound represented by the following formula (b) and the compound represented by the following formula (c) if necessary.
上述式(a)所表示之化合物係形成本發明之聚有機倍半矽氧烷中之式(1)所表示之構成單元之化合物。式(a)中之R1 與上述式(1)中之R1 相同,表示含有陽離子聚合性官能基之基。即,作為式(a)中之R1 ,其係較佳為上述式(1a)所表示之基、上述式(1b)所表示之基、上述式(1c)所表示之基、上述式(1d)所表示之基,更佳為上述式(1a)所表示之基、上述式(1c)所表示之基,進而較佳為上述式(1a)所表示之基,尤佳為上述式(1a)所表示,且R1a 為伸乙基之基[其中尤其為,2-(3',4'-環氧環己基)乙基]。The compound represented by the said formula (a) is a compound which forms the structural unit represented by the formula (1) in the polyorganosilsesquioxane of this invention. R 1 in the formula (a) is the same as R 1 in the above formula (1), and represents a group containing a cationically polymerizable functional group. That is, as R 1 in the formula (a), it is preferably a group represented by the above formula (1a), a group represented by the above formula (1b), a group represented by the above formula (1c), a group represented by the above formula ( The base represented by 1d) is more preferably the base represented by the above formula (1a), the base represented by the above formula (1c), and more preferably the base represented by the above formula (1a), especially the above formula ( 1a), and R 1a is an ethylenyl group [especially, 2-(3',4'-epoxycyclohexyl)ethyl].
上述式(a)中之X1 表示烷氧基或鹵素原子。作為X1 中之烷氧基,例如可列舉:甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、異丁氧基等碳數1〜4之烷氧基等。又,作為X1 中之鹵素原子,例如可列舉:氟原子、氯原子、溴原子、碘原子等。其中,作為X1 ,較佳為烷氧基,更佳為甲氧基、乙氧基。再者,3個X1 可分別相同,亦可不同。X 1 in the above formula (a) represents an alkoxy group or a halogen atom. Examples of the alkoxy group in X include: alkoxy groups having 1 to 4 carbon atoms such as methoxy, ethoxy, propoxy, isopropoxy, butoxy, and isobutoxy. Moreover, examples of the halogen atom in X1 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among them, X 1 is preferably an alkoxy group, more preferably a methoxy group or an ethoxy group. In addition, three X 1 may be respectively the same or different.
上述式(b)所表示之化合物係形成本發明之聚有機倍半矽氧烷中之式(2)所表示之構成單元之化合物。式(b)中之R2 與上述式(2)中之R2 相同,表示經取代或未經取代之芳基、經取代或未經取代之芳烷基、經取代或未經取代之環烷基、經取代或未經取代之烷基、或經取代或未經取代之烯基。即,作為式(b)中之R2 ,較佳為經取代或未經取代之芳基、經取代或未經取代之烷基、經取代或未經取代之烯基,更佳為經取代或未經取代之芳基,進而較佳為苯基。The compound represented by the said formula (b) is a compound which forms the structural unit represented by the formula (2) in the polyorganosilsesquioxane of this invention. R 2 in the formula (b) is the same as R 2 in the above formula (2), and represents a substituted or unsubstituted aryl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted ring Alkyl, substituted or unsubstituted alkyl, or substituted or unsubstituted alkenyl. That is, R 2 in formula (b) is preferably substituted or unsubstituted aryl, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, more preferably substituted or an unsubstituted aryl group, more preferably a phenyl group.
上述式(b)中之X2 表示烷氧基或鹵素原子。作為X2 之具體例,可列舉作為X1 而例示者。其中,作為X2 ,較佳為烷氧基,更佳為甲氧基、乙氧基。再者,3個X2 可分別相同,亦可不同。X 2 in the above formula (b) represents an alkoxy group or a halogen atom. Specific examples of X2 include those exemplified as X1. Among them, X 2 is preferably an alkoxy group, more preferably a methoxy group or an ethoxy group. Furthermore, the three X 2s may be the same or different.
上述式(c)所表示之化合物係形成本發明之聚有機倍半矽氧烷中之式(3)所表示之構成單元之化合物。上述式(c)中之X3 表示烷氧基或鹵素原子。作為X3 之具體例,可列舉作為X1 而例示者。其中,作為X3 ,較佳為烷氧基,更佳為甲氧基、乙氧基。再者,3個X3 可分別相同,亦可不同。The compound represented by the said formula (c) is a compound which forms the structural unit represented by the formula (3) in the polyorganosilsesquioxane of this invention. X 3 in the above formula (c) represents an alkoxy group or a halogen atom. Specific examples of X3 include those exemplified as X1. Among them, X 3 is preferably an alkoxy group, more preferably a methoxy group or an ethoxy group. Furthermore, the three X 3 may be the same or different.
作為上述水解性矽烷化合物,可併用上述式(a)〜(c)所表示之化合物以外之水解性矽烷化合物。例如可列舉:上述式(a)〜(c)所表示之化合物以外之水解性三官能矽烷化合物、形成M單元之水解性單官能矽烷化合物、形成D單元之水解性二官能矽烷化合物、形成Q單元之水解性四官能矽烷化合物等。As the hydrolyzable silane compound, a hydrolyzable silane compound other than the compounds represented by the above formulas (a) to (c) may be used in combination. Examples include: hydrolyzable trifunctional silane compounds other than the compounds represented by the above formulas (a) to (c), hydrolyzable monofunctional silane compounds forming M units, hydrolyzable bifunctional silane compounds forming D units, and hydrolyzable bifunctional silane compounds forming Q units. Unit hydrolyzable tetrafunctional silane compounds, etc.
上述水解性矽烷化合物之使用量或組成可根據所需之本發明之聚有機倍半矽氧烷之結構而適當加以調整。例如,上述式(a)所表示之化合物之使用量並無特別限定,相對於所使用之水解性矽烷化合物之總量(100莫耳%),較佳為55〜100莫耳%,更佳為65〜100莫耳%,進而較佳為80〜99莫耳%。The amount or composition of the above-mentioned hydrolyzable silane compound can be appropriately adjusted according to the desired structure of the polyorganosilsesquioxane of the present invention. For example, the amount of the compound represented by the above formula (a) is not particularly limited, but it is preferably 55 to 100 mol %, more preferably It is 65~100 mol%, and more preferably 80~99 mol%.
又,上述式(b)所表示之化合物之使用量並無特別限定,相對於所使用之水解性矽烷化合物之總量(100莫耳%),較佳為0〜70莫耳%,更佳為0〜60莫耳%,進而較佳為0〜40莫耳%,尤佳為1〜15莫耳%。Also, the amount of the compound represented by the above formula (b) is not particularly limited, but it is preferably 0 to 70 mole %, more preferably 0 to 60 mol%, more preferably 0 to 40 mol%, especially preferably 1 to 15 mol%.
進而,式(a)所表示之化合物與式(b)所表示之化合物相對於所使用之水解性矽烷化合物之總量(100莫耳%)之比率(總量之比率)並無特別限定,較佳為60〜100莫耳%,更佳為70〜100莫耳%,進而較佳為80〜100莫耳%。Furthermore, the ratio (total ratio) of the compound represented by the formula (a) to the compound represented by the formula (b) to the total amount (100 mol%) of the hydrolyzable silane compound used is not particularly limited. It is preferably 60-100 mol%, more preferably 70-100 mol%, and more preferably 80-100 mol%.
又,於併用2種以上作為上述水解性矽烷化合物之情形時,該等水解性矽烷化合物之水解及縮合反應可同時進行,亦可逐次進行。於逐次進行上述反應之情形時,進行反應之順序並無特別限定。Moreover, when using 2 or more types together as said hydrolyzable silane compound, the hydrolysis and condensation reaction of these hydrolyzable silane compounds may be performed simultaneously, and may be performed sequentially. When performing the above reactions sequentially, the order of performing the reactions is not particularly limited.
上述水解性矽烷化合物之水解及縮合反應能夠以1階段進行,亦可分成2階段以上進行。例如,為了高效率地製造上述比率[T3體/T2體]未達20及/或數量平均分子量未達2500之本發明之聚有機倍半矽氧烷(以下,有時稱為「低分子量聚有機倍半矽氧烷」),較佳為以1階段進行水解及縮合反應。又,為了高效率地製造上述比率[T3體/T2體]為20以上及/或數量平均分子量為2500以上之本發明之聚有機倍半矽氧烷(以下,有時稱為「高分子量聚有機倍半矽氧烷」),較佳為以2階段以上(較佳為2階段)進行水解及縮合反應,即,將上述低分子量聚有機倍半矽氧烷作為原料,進而進行1次以上之水解及縮合反應。以下,對藉由以1階段進行水解性矽烷化合物之水解及縮合反應而獲得低分子量聚有機倍半矽氧烷,進而使低分子量聚有機倍半矽氧烷進行水解及縮合反應,而獲得高分子量聚有機倍半矽氧烷之態樣進行說明,但本發明之聚有機倍半矽氧烷之製造方法並不限定於此。The hydrolysis and condensation reaction of the said hydrolyzable silane compound may be performed in 1 stage, and may be divided into 2 or more stages and may be performed. For example, in order to efficiently produce the polyorganosilsesquioxane (hereinafter sometimes referred to as "low molecular weight polysilsesquioxane") of the present invention having the ratio [T3 body/T2 body] of less than 20 and/or a number average molecular weight of less than 2500, Organosilsesquioxane"), it is preferable to carry out the hydrolysis and condensation reaction in one stage. In addition, in order to efficiently produce the polyorganosilsesquioxane (hereinafter, sometimes referred to as "high molecular weight poly Organosilsesquioxane"), it is preferable to carry out the hydrolysis and condensation reaction in two or more stages (preferably two stages), that is, the above-mentioned low molecular weight polyorganosilsesquioxane is used as a raw material, and then carried out more than once hydrolysis and condensation reactions. In the following, low molecular weight polyorganosilsesquioxane obtained by performing hydrolysis and condensation reaction of hydrolyzable silane compound in one stage, and further hydrolysis and condensation reaction of low molecular weight polyorganosilsesquioxane are obtained to obtain high Although the aspect of the molecular weight polyorganosilsesquioxane is demonstrated, the manufacturing method of the polyorganosilsesquioxane of this invention is not limited to this.
於以2階段進行本發明之水解及縮合反應之情形時,較佳為於第1階段之水解及縮合反應中,可獲得上述比率[T3體/T2體]為5以上且未達20,數量平均分子量為1000以上且未達2500之低分子量聚有機倍半矽氧烷,且於第2階段中,藉由進而使該低分子量聚有機倍半矽氧烷進行水解及縮合反應,可獲得上述比率[T3體/T2體]為20以上且500以下,數量平均分子量為2500以上且50000以下之高分子量聚有機倍半矽氧烷。In the case of carrying out the hydrolysis and condensation reaction of the present invention in two stages, it is preferable to obtain the ratio [T3 body/T2 body] of 5 or more and less than 20 in the hydrolysis and condensation reaction of the first stage. A low-molecular-weight polyorganosilsesquioxane having an average molecular weight of not less than 1,000 and not more than 2,500, and in the second stage, the above-mentioned A high molecular weight polyorganosilsesquioxane having a ratio [T3 body/T2 body] of 20 to 500 and a number average molecular weight of 2,500 to 50,000.
第1階段之水解及縮合反應可於溶劑之存在下進行,亦可於非存在下進行。其中較佳為於溶劑之存在下進行。作為上述溶劑,例如可列舉:苯、甲苯、二甲苯、乙基苯等芳香族烴;二乙醚、二甲氧基乙烷、四氫呋喃、二㗁烷等醚;丙酮、甲基乙基酮、甲基異丁基酮等酮;乙酸甲酯、乙酸乙酯、乙酸異丙酯、乙酸丁酯等酯;N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等醯胺;乙腈、丙腈、苯甲腈等腈;甲醇、乙醇、異丙醇、丁醇等醇等。作為上述溶劑,其中,較佳為酮、醚。再者,溶劑可單獨使用一種,亦可組合兩種以上而使用。The hydrolysis and condensation reactions in the first stage may be performed in the presence or non-existence of a solvent. Among them, it is preferably carried out in the presence of a solvent. Examples of the solvent include: aromatic hydrocarbons such as benzene, toluene, xylene, and ethylbenzene; ethers such as diethyl ether, dimethoxyethane, tetrahydrofuran, and dioxane; acetone, methyl ethyl ketone, methyl Ketones such as isobutyl ketone; methyl acetate, ethyl acetate, isopropyl acetate, butyl acetate and other esters; N,N-dimethylformamide, N,N-dimethylacetamide and other amides Amines; Nitriles such as acetonitrile, propionitrile, and benzonitrile; Alcohols such as methanol, ethanol, isopropanol, butanol, etc. Among these solvents, ketones and ethers are preferred. In addition, a solvent may be used individually by 1 type, and may use it in combination of 2 or more types.
第1階段之水解及縮合反應中之溶劑之使用量並無特別限定,可相對於水解性矽烷化合物之總量100重量份,於0〜2000重量份之範圍內,根據所需之反應時間等適當加以調整。The usage amount of the solvent in the hydrolysis and condensation reaction in the first stage is not particularly limited, and it can be in the range of 0 to 2000 parts by weight relative to the total amount of 100 parts by weight of the hydrolyzable silane compound, depending on the required reaction time, etc. Make appropriate adjustments.
第1階段之水解及縮合反應較佳為於觸媒及水之存在下進行。上述觸媒可為酸性觸媒,亦可為鹼性觸媒,為了抑制環氧基等陽離子聚合性官能基之分解,較佳為鹼性觸媒。作為上述酸性觸媒,例如可列舉:鹽酸、硫酸、硝酸、磷酸、硼酸等無機酸;磷酸鹽;乙酸、甲酸、三氟乙酸等羧酸;甲磺酸、三氟甲磺酸、對甲苯磺酸等磺酸;活性白土等固體酸;氯化鐵等路易斯酸等。作為上述鹼性觸媒,例如可列舉:氫氧化鋰、氫氧化鈉、氫氧化鉀、氫氧化銫等鹼金屬之氫氧化物;氫氧化鎂、氫氧化鈣、氫氧化鋇等鹼土金屬之氫氧化物;碳酸鋰、碳酸鈉、碳酸鉀、碳酸銫等鹼金屬之碳酸鹽;碳酸鎂等鹼土金屬之碳酸鹽;碳酸氫鋰、碳酸氫鈉、碳酸氫鈉、碳酸氫鉀、碳酸氫銫等鹼金屬之碳酸氫鹽;乙酸鋰、乙酸鈉、乙酸鉀、乙酸銫等鹼金屬之有機酸鹽(例如乙酸鹽);乙酸鎂等鹼土金屬之有機酸鹽(例如乙酸鹽);甲醇鋰、甲醇鈉、乙醇鈉、異丙醇鈉、乙醇鉀、第三丁醇鉀等鹼金屬之烷氧化物;酚鈉等鹼金屬之酚鹽;三乙基胺、N-甲基哌啶、1,8-二吖雙環[5.4.0]十一-7-烯、1,5-二吖雙環[4.3.0]壬-5-烯等胺類(三級胺等);吡啶、2,2'-聯吡啶、1,10-啡啉等含氮芳香族雜環化合物等。再者,觸媒可單獨使用一種,亦可組合兩種以上而使用。又,觸媒亦可於溶解或分散於水或溶劑等中之狀態下使用。The hydrolysis and condensation reactions in the first stage are preferably carried out in the presence of a catalyst and water. The above-mentioned catalyst may be an acidic catalyst or an alkaline catalyst, and is preferably an alkaline catalyst in order to suppress the decomposition of cationic polymerizable functional groups such as epoxy groups. Examples of the acidic catalyst include: inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and boric acid; phosphates; carboxylic acids such as acetic acid, formic acid, and trifluoroacetic acid; methanesulfonic acid, trifluoromethanesulfonic acid, and p-toluenesulfonic acid Sulfonic acid such as acid; Solid acid such as activated clay; Lewis acid such as ferric chloride, etc. Examples of the alkaline catalyst include: hydroxides of alkali metals such as lithium hydroxide, sodium hydroxide, potassium hydroxide, and cesium hydroxide; hydrogens of alkaline earth metals such as magnesium hydroxide, calcium hydroxide, and barium hydroxide; Oxides; carbonates of alkali metals such as lithium carbonate, sodium carbonate, potassium carbonate, and cesium carbonate; carbonates of alkaline earth metals such as magnesium carbonate; lithium bicarbonate, sodium bicarbonate, sodium bicarbonate, potassium bicarbonate, cesium bicarbonate, etc. Bicarbonates of alkali metals; organic acid salts of alkali metals such as lithium acetate, sodium acetate, potassium acetate, and cesium acetate (e.g. acetate); organic acid salts of alkaline earth metals such as magnesium acetate (e.g. acetate); lithium methoxide, methanol Alkoxides of alkali metals such as sodium, sodium ethoxide, sodium isopropoxide, potassium ethoxide, and potassium tert-butoxide; phenates of alkali metals such as sodium phenoxide; triethylamine, N-methylpiperidine, 1,8 -Diacridine bicyclo[5.4.0]undec-7-ene, 1,5-diacribicyclo[4.3.0]non-5-ene and other amines (tertiary amines, etc.); pyridine, 2,2'- Nitrogen-containing aromatic heterocyclic compounds such as bipyridyl, 1,10-phenanthroline, etc. In addition, a catalyst may be used individually by 1 type, and may use it in combination of 2 or more types. In addition, the catalyst can also be used in a state of being dissolved or dispersed in water, a solvent, or the like.
第1階段之水解及縮合反應中之上述觸媒之使用量並無特別限定,可相對於水解性矽烷化合物之總量1莫耳,於0.002〜0.200莫耳之範圍內適當加以調整。The amount of the catalyst used in the hydrolysis and condensation reaction in the first stage is not particularly limited, and can be appropriately adjusted within the range of 0.002 to 0.200 mol relative to 1 mol of the total amount of the hydrolyzable silane compound.
第1階段之水解及縮合反應時之水之使用量並無特別限定,可相對於水解性矽烷化合物之總量1莫耳,於0.5〜20莫耳之範圍內適當加以調整。The amount of water used in the hydrolysis and condensation reactions in the first stage is not particularly limited, and can be appropriately adjusted within the range of 0.5 to 20 moles relative to 1 mole of the total amount of the hydrolyzable silane compound.
第1階段之水解及縮合反應中之上述水之添加方法並無特別限定,可一次添加所使用之水之總量(全部使用量),亦可逐次地添加。於逐次地添加時,可連續地添加,亦可間斷地添加。The method of adding the above-mentioned water in the hydrolysis and condensation reaction in the first stage is not particularly limited, and the total amount of water used (the total amount used) may be added at one time, or may be added successively. When adding one by one, it may be added continuously or may be added intermittently.
作為第1階段之水解及縮合反應之反應條件,尤其重要的是選擇如低分子量聚有機倍半矽氧烷之上述比率[T3體/T2體]成為5以上且未達20之反應條件。第1階段之水解及縮合反應之反應溫度並無特別限定,較佳為40〜100℃,更佳為45〜80℃。藉由將反應溫度控制為上述範圍,有可更有效率地將上述比率[T3體/T2體]控制為5以上且未達20之傾向。又,第1階段之水解及縮合反應之反應時間並無特別限定,較佳為0.1〜10小時,更佳為1.5〜8小時。又,第1階段之水解及縮合反應可於常壓下進行,亦可於加壓下或於減壓下進行。再者,第1階段之水解及縮合反應時之環境並無特別限定,例如可為氮氣環境、氬氣環境等非活性氣體環境下、空氣下等氧存在下等中之任一種,較佳為非活性氣體環境下。As the reaction conditions for the hydrolysis and condensation reactions in the first stage, it is particularly important to select such reaction conditions that the above-mentioned ratio [T3 body/T2 body] of the low molecular weight polyorganosilsesquioxane becomes 5 or more and less than 20. The reaction temperature of the hydrolysis and condensation reaction in the first stage is not particularly limited, but is preferably 40-100°C, more preferably 45-80°C. By controlling the reaction temperature in the above-mentioned range, the above-mentioned ratio [T3 body/T2 body] tends to be more efficiently controlled to 5 or more and less than 20. Also, the reaction time of the hydrolysis and condensation reaction in the first stage is not particularly limited, but is preferably 0.1 to 10 hours, more preferably 1.5 to 8 hours. In addition, the hydrolysis and condensation reactions in the first stage may be performed under normal pressure, or may be performed under increased pressure or reduced pressure. Moreover, the environment during the hydrolysis and condensation reaction in the first stage is not particularly limited, for example, it can be any one of inert gas environments such as nitrogen atmosphere and argon atmosphere, and the presence of oxygen such as air, etc., preferably In an inert gas environment.
藉由上述第1階段之水解及縮合反應,可獲得低分子量聚有機倍半矽氧烷。於上述第1階段之水解及縮合反應之結束後,為了抑制環氧基之開環等陽離子聚合性官能基之分解,較佳為對觸媒進行中和。又,例如可藉由水洗、酸洗淨、鹼洗淨、過濾、濃縮、蒸餾、萃取、晶析、再結晶、管柱層析法等分離手段、或組合有該等之分離手段等將低分子量聚有機倍半矽氧烷分離精製。Low molecular weight polyorganosilsesquioxane can be obtained through the hydrolysis and condensation reaction in the first stage above. After completion of the hydrolysis and condensation reactions in the first stage, it is preferable to neutralize the catalyst in order to suppress the decomposition of cationic polymerizable functional groups such as ring-opening of epoxy groups. In addition, for example, it can be separated by washing with water, washing with acid, washing with alkali, filtration, concentration, distillation, extraction, crystallization, recrystallization, column chromatography, etc., or a combination of these separation means. Separation and purification of molecular weight polyorganosilsesquioxane.
藉由使藉由第1階段之水解及縮合反應而獲得之低分子量聚有機倍半矽氧烷進行第2階段之水解及縮合反應,可製造高分子量聚有機倍半矽氧烷。 第2階段之水解及縮合反應可於溶劑之存在下進行,亦可於非存在下進行。於在溶劑之存在下進行第2階段之水解及縮合反應之情形時,可使用於第1階段之水解及縮合反應中所列舉之溶劑。作為第2階段之水解及縮合反應之溶劑,可直接使用含有第1階段之水解及縮合反應之反應溶劑、萃取溶劑等之低分子量聚有機倍半矽氧烷、或將一部分蒸餾去除所得者。再者,溶劑可單獨使用一種,亦可組合兩種以上而使用。A high molecular weight polyorganosilsesquioxane can be produced by subjecting the low molecular weight polyorganosilsesquioxane obtained by the first stage hydrolysis and condensation reaction to the second stage hydrolysis and condensation reaction. The hydrolysis and condensation reactions in the second stage may be performed in the presence or non-existence of a solvent. When the second-stage hydrolysis and condensation reaction is performed in the presence of a solvent, the solvents listed for the first-stage hydrolysis and condensation reaction can be used. As the solvent for the hydrolysis and condensation reaction in the second stage, low-molecular-weight polyorganosilsesquioxane containing the reaction solvent and extraction solvent for the hydrolysis and condensation reaction in the first stage can be used as it is, or a part obtained by distillation. In addition, a solvent may be used individually by 1 type, and may use it in combination of 2 or more types.
於在第2階段之水解及縮合反應中使用溶劑之情形時,其使用量並無特別限定,可相對於低分子量聚有機倍半矽氧烷100重量份,於0〜2000重量份之範圍內,根據所需之反應時間等適當加以調整。When the solvent is used in the hydrolysis and condensation reaction of the second stage, its usage amount is not particularly limited, and it can be in the range of 0 to 2000 parts by weight relative to 100 parts by weight of low molecular weight polyorganosilsesquioxane , according to the required response time, etc. to be adjusted appropriately.
第2階段之水解及縮合反應較佳為於觸媒及水之存在下進行。上述觸媒可使用第1階段之水解及縮合反應中所列舉之觸媒,為了抑制環氧基等陽離子聚合性官能基之分解,較佳為鹼性觸媒,進而較佳為氫氧化鈉、氫氧化鉀、氫氧化銫等鹼金屬之氫氧化物;碳酸鋰、碳酸鈉、碳酸鉀、碳酸銫等鹼金屬之碳酸鹽。再者,觸媒可單獨使用一種,亦可組合兩種以上而使用。又,觸媒亦可於溶解或分散於水或溶劑等中之狀態下使用。The hydrolysis and condensation reactions in the second stage are preferably carried out in the presence of a catalyst and water. The above-mentioned catalyst can use the catalyst listed in the hydrolysis and condensation reaction of the first stage. In order to suppress the decomposition of cationic polymerizable functional groups such as epoxy groups, it is preferably an alkaline catalyst, and more preferably sodium hydroxide, Hydroxides of alkali metals such as potassium hydroxide and cesium hydroxide; carbonates of alkali metals such as lithium carbonate, sodium carbonate, potassium carbonate, and cesium carbonate. In addition, a catalyst may be used individually by 1 type, and may use it in combination of 2 or more types. In addition, the catalyst can also be used in a state of being dissolved or dispersed in water, a solvent, or the like.
第2階段之水解及縮合反應中之上述觸媒之使用量並無特別限定,可相對於低分子量聚有機倍半矽氧烷(1000000 ppm),於較佳為0.01〜10000 ppm、更佳為0.1〜1000 ppm之範圍內適當加以調整。The amount of the above-mentioned catalyst used in the hydrolysis and condensation reaction in the second stage is not particularly limited, and it can be preferably 0.01 to 10,000 ppm, more preferably Adjust appropriately within the range of 0.1~1000 ppm.
第2階段之水解及縮合反應時的水之使用量並無特別限定,可相對於低分子量聚有機倍半矽氧烷(1000000 ppm),於較佳為10〜100000 ppm、更佳為100〜20000 ppm之範圍內適當加以調整。若水之使用量大於100000 ppm,則有高分子量聚有機倍半矽氧烷之比率[T3體/T2體]或數量平均分子量不易控制為特定之範圍之傾向。The amount of water used in the hydrolysis and condensation reactions in the second stage is not particularly limited, but it can be preferably 10 to 100,000 ppm, more preferably 100 to Adjust appropriately within the range of 20000 ppm. If the amount of water used exceeds 100,000 ppm, the ratio [T3 body/T2 body] or the number average molecular weight of high molecular weight polyorganosilsesquioxane tends to be difficult to control within a specific range.
第2階段之水解及縮合反應中之上述水之添加方法並無特別限定,可一次添加所使用的水之總量(全部使用量),亦可逐次地添加。於逐次地添加時,可連續地添加,亦可間斷地添加。The method of adding the above-mentioned water in the hydrolysis and condensation reaction in the second stage is not particularly limited, and the total amount of water used (total usage amount) may be added at one time, or may be added successively. When adding one by one, it may be added continuously or may be added intermittently.
作為第2階段之水解及縮合反應之反應條件,尤其重要的是選擇如高分子量聚有機倍半矽氧烷之上述比率[T3體/T2體]成為20以上且500以下,且數量平均分子量成為2500〜50000之反應條件。第2階段之水解及縮合反應之反應溫度係根據所使用之觸媒而變動,並無特別限定,較佳為5〜200℃,更佳為30〜100℃。藉由將反應溫度控制為上述範圍,有可更有效率地將上述比率[T3體/T2體]、數量平均分子量控制為所需之範圍之傾向。又,第2階段之水解及縮合反應之反應時間並無特別限定,較佳為0.5〜1000小時,更佳為1〜500小時。 又,藉由一邊於上述反應溫度之範圍內進行水解及縮合反應,一邊適時進行取樣,並一邊監視上述比率[T3體/T2體]、數量平均分子量,一邊進行反應,亦可獲得具有所需之比率[T3體/T2體]、數量平均分子量之高分子量聚有機倍半矽氧烷。As the reaction conditions for the hydrolysis and condensation reactions in the second stage, it is particularly important to select such that the ratio [T3 body/T2 body] of the high molecular weight polyorganosilsesquioxane is 20 or more and 500 or less, and the number average molecular weight becomes 2500~50000 reaction conditions. The reaction temperature of the hydrolysis and condensation reaction in the second stage varies depending on the catalyst used and is not particularly limited, but is preferably 5 to 200°C, more preferably 30 to 100°C. By controlling the reaction temperature to the above-mentioned range, the above-mentioned ratio [T3 body/T2 body] and the number average molecular weight tend to be more efficiently controlled to a desired range. Also, the reaction time of the hydrolysis and condensation reaction in the second stage is not particularly limited, but is preferably 0.5 to 1000 hours, more preferably 1 to 500 hours. Also, by carrying out the hydrolysis and condensation reactions within the range of the above-mentioned reaction temperature, taking samples in due course, and monitoring the above-mentioned ratio [T3 body/T2 body] and the number average molecular weight while carrying out the reaction, it is also possible to obtain the desired product. The ratio [T3 body/T2 body], high molecular weight polyorganosilsesquioxane with number average molecular weight.
第2階段之水解及縮合反應可於常壓下進行,亦可於加壓下或於減壓下進行。再者,第2階段之水解及縮合反應時之環境並無特別限定,例如可為氮氣環境、氬氣環境等非活性氣體環境下、空氣下等氧存在下等中之任一種,較佳為非活性氣體環境下。The hydrolysis and condensation reactions in the second stage can be performed under normal pressure, or under increased or reduced pressure. Moreover, the environment during the hydrolysis and condensation reaction in the second stage is not particularly limited, for example, it can be any one of inert gas environments such as nitrogen atmosphere and argon atmosphere, and the presence of oxygen such as air, etc., preferably In an inert gas environment.
藉由上述第2階段之水解及縮合反應,可獲得高分子量聚有機倍半矽氧烷。於上述第2階段之水解及縮合反應之結束後,為了抑制環氧基之開環等陽離子聚合性官能基之分解,較佳為對觸媒進行中和。又,例如可藉由水洗、酸洗淨、鹼洗淨、過濾、濃縮、蒸餾、萃取、晶析、再結晶、管柱層析法等分離手段、或組合有該等之分離手段等將高分子量聚有機倍半矽氧烷分離精製。High molecular weight polyorganosilsesquioxane can be obtained through the hydrolysis and condensation reaction in the second stage above. After completion of the hydrolysis and condensation reactions in the second stage, it is preferable to neutralize the catalyst in order to suppress the decomposition of cationic polymerizable functional groups such as ring-opening of epoxy groups. Further, for example, high concentration can be separated by washing with water, washing with acid, washing with alkali, filtration, concentration, distillation, extraction, crystallization, recrystallization, column chromatography, etc., or a combination of these separation means. Separation and purification of molecular weight polyorganosilsesquioxane.
本發明之聚有機倍半矽氧烷由於具有上述構成,故而使含有該聚有機倍半矽氧烷作為必需成分之硬化性組成物硬化而成之樹脂層被賦予較高之表面硬度及優異之彎曲耐久性,容易形成充分滿足上述(條件1〜5)之樹脂層。Since the polyorganosilsesquioxane of the present invention has the above-mentioned constitution, the resin layer obtained by curing the curable composition containing the polyorganosilsesquioxane as an essential component is endowed with high surface hardness and excellent properties. Bending durability, easy to form a resin layer that fully satisfies the above (
於本發明之硬化性組成物中,本發明之聚有機倍半矽氧烷可單獨使用一種,亦可組合兩種以上而使用。In the curable composition of the present invention, the polyorganosilsesquioxane of the present invention may be used alone or in combination of two or more.
本發明之硬化性組成物中之本發明之聚有機倍半矽氧烷之含量(摻合量)並無特別限定,相對於除溶劑以外之硬化性組成物之總量(100重量%),較佳為50重量%以上且未達100重量%,更佳為60〜99重量%,進而較佳為70〜95重量%。藉由將本發明之聚有機倍半矽氧烷之含量設為50重量%以上,有硬化物(樹脂層)之表面硬度或接著性進一步提高之傾向。另一方面,藉由將本發明之聚有機倍半矽氧烷之含量設為未達100重量%(例如95重量%以下),可含有硬化觸媒、下述分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物、環氧化合物或含氟之光聚合性樹脂等,藉此有可更有效率地進行硬化性組成物之硬化,並且表面硬度・彎曲耐久性提高之傾向。The content (blending amount) of the polyorganosilsesquioxane of the present invention in the curable composition of the present invention is not particularly limited, but relative to the total amount (100% by weight) of the curable composition excluding the solvent, It is preferably at least 50% by weight and less than 100% by weight, more preferably 60 to 99% by weight, and still more preferably 70 to 95% by weight. By making content of the polyorganosilsesquioxane of this invention 50 weight% or more, there exists a tendency for the surface hardness and adhesiveness of a hardened|cured material (resin layer) to improve further. On the other hand, by setting the content of the polyorganosilsesquioxane of the present invention to less than 100% by weight (for example, 95% by weight or less), it is possible to contain a hardening catalyst, and to have one or more heat molecules in the following molecules: Compounds of polymerizable functional groups and one or more photopolymerizable functional groups, epoxy compounds, or fluorine-containing photopolymerizable resins, etc., can more efficiently harden the curable composition, and the surface hardness・Tendency to improve bending durability.
本發明之聚有機倍半矽氧烷相對於本發明之硬化性組成物中所含之陽離子硬化性化合物之總量(100重量%)之比率並無特別限定,較佳為60〜99重量%,更佳為65〜98重量%,進而較佳為70〜95重量%。藉由將本發明之聚有機倍半矽氧烷之含量設為60重量%以上,有硬化物(樹脂層)之表面硬度或接著性進一步提高之傾向。另一方面,藉由將本發明之聚有機倍半矽氧烷之含量設為99重量%以下,可含有下述分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物或環氧化合物等,藉此有表面硬度・彎曲耐久性提高之傾向。The ratio of the polyorganosilsesquioxane of the present invention to the total amount (100% by weight) of the cation-curable compound contained in the curable composition of the present invention is not particularly limited, but is preferably 60 to 99% by weight , more preferably 65 to 98% by weight, and more preferably 70 to 95% by weight. By making content of the polyorganosilsesquioxane of this
(硬化觸媒) 本發明之硬化性組成物較佳為進而含有硬化觸媒。其中,就可進一步縮短至變得不黏著為止之硬化時間之方面而言,尤佳為含有陽離子聚合起始劑或自由基聚合起始劑作為硬化觸媒。(hardening catalyst) The curable composition of the present invention preferably further contains a curing catalyst. Among these, it is particularly preferable to contain a cationic polymerization initiator or a radical polymerization initiator as a curing catalyst, since the curing time until the stickiness can be further shortened.
上述陽離子聚合起始劑係可開始或促進本發明之聚有機倍半矽氧烷等陽離子硬化性化合物之陽離子聚合反應之化合物。作為上述陽離子聚合起始劑,並無特別限定,例如可列舉光陽離子聚合起始劑(光酸產生劑)、熱陽離子聚合起始劑(熱酸產生劑)等。The aforementioned cationic polymerization initiator is a compound capable of starting or accelerating the cationic polymerization reaction of the cation-curing compound such as the polyorganosilsesquioxane of the present invention. It does not specifically limit as said cationic polymerization initiator, For example, a photocationic polymerization initiator (photoacid generator), a thermal cationic polymerization initiator (thermal acid generator), etc. are mentioned.
作為上述光陽離子聚合起始劑,可使用公知或慣用之光陽離子聚合起始劑,例如可列舉:鋶鹽(鋶離子與陰離子之鹽)、錪鹽(錪離子與陰離子之鹽)、硒鹽(硒離子與陰離子之鹽)、銨鹽(銨離子與陰離子之鹽)、鏻鹽(鏻離子與陰離子之鹽)、過渡金屬錯合物離子與陰離子之鹽等。該等可單獨使用一種或組合兩種以上而使用。As the above-mentioned photocationic polymerization initiator, well-known or commonly used photocationic polymerization initiators can be used, for example, cite salt (a salt of a ions and anions), a salt of iodonium (a salt of ions and anions), selenium salts (salt of selenium ion and anion), ammonium salt (salt of ammonium ion and anion), phosphonium salt (salt of phosphonium ion and anion), salt of transition metal complex ion and anion, etc. These can be used individually by 1 type or in combination of 2 or more types.
作為上述鋶鹽,例如可列舉:[4-(4-聯苯硫基)苯基]-4-聯苯基苯基鋶三(五氟乙基)三氟磷酸鹽、三苯基鋶鹽、三對甲苯基鋶鹽、三鄰甲苯基鋶鹽、三(4-甲氧基苯基)鋶鹽、1-萘基二苯基鋶鹽、2-萘基二苯基鋶鹽、三(4-氟苯基)鋶鹽、三-1-萘基鋶鹽、三-2-萘基鋶鹽、三(4-羥基苯基)鋶鹽、二苯基[4-(苯硫基)苯基]鋶鹽、4-(對甲苯硫基)苯基二(對苯基)鋶鹽等三芳基鋶鹽;二苯基苯甲醯甲基鋶鹽、二苯基4-硝基苯甲醯甲基鋶鹽、二苯基苄基鋶鹽、二苯基甲基鋶鹽等二芳基鋶鹽;苯基甲基苄基鋶鹽、4-羥基苯基甲基苄基鋶鹽、4-甲氧基苯基甲基苄基鋶鹽等單芳基鋶鹽;二甲基苯甲醯甲基鋶鹽、苯甲醯甲基四氫噻吩鎓(phenacyl tetrahydrothiophenium)鹽、二甲基苄基鋶鹽等三烷基鋶鹽等。Examples of the above-mentioned permeate salts include [4-(4-biphenylsulfanyl)phenyl]-4-biphenylphenyl permetrix tris(pentafluoroethyl)trifluorophosphate, triphenyl permeate, Tri-p-tolyl permeate, tri-o-tolyl permeate, tris(4-methoxyphenyl) permeate, 1-naphthyl diphenyl permeate, 2-naphthyl diphenyl permeate, three (4 -Fluorophenyl) percited salt, tri-1-naphthyl percited salt, tris-2-naphthyl percited salt, tris(4-hydroxyphenyl) percited salt, diphenyl[4-(phenylthio)phenyl ] percited salt, 4-(p-tolylthio)phenyl bis(p-phenyl) percited salt and other triaryl percited salts; diphenylbenzoylmethyl percited salt, diphenyl 4-nitrobenzoylform Diaryl permeate salts such as base permeate, diphenylbenzyl permeate, diphenylmethyl permeate, etc.; phenylmethyl benzyl permeate, 4-hydroxyphenylmethyl benzyl permeate, Monoaryl permeicium salts such as oxyphenylmethyl benzyl permeicium salt; Dimethylbenzoyl methyl permeic acid salt, phenacyl tetrahydrothiophenium (phenacyl tetrahydrothiophenium) salt, dimethylbenzyl permeic acid salt And other trialkyl cobalt salts, etc.
作為上述二苯基[4-(苯硫基)苯基]鋶鹽,例如可使用二苯基[4-(苯硫基)苯基]鋶六氟銻酸鹽、二苯基[4-(苯硫基)苯基]鋶六氟磷酸鹽等。As the above-mentioned diphenyl[4-(phenylthio)phenyl]conium salt, for example, diphenyl[4-(phenylthio)phenyl]percite hexafluoroantimonate, diphenyl[4-( Phenylthio)phenyl]perzium hexafluorophosphate, etc.
作為上述錪鹽,例如可列舉:商品名「UV9380C」(Momentive Performance Materials Japan LLC製造、雙(4-十二烷基苯基)錪=六氟銻酸鹽45%烷基縮水甘油醚溶液)、商品名「RHODORSIL PHOTOINITIATOR 2074」(Rhodia Japan股份有限公司製造、四(五氟苯基)硼酸鹽=[(1-甲基乙基)苯基](甲基苯基)錪)、商品名「WPI-124」(和光純藥工業股份有限公司製造)、二苯基錪鹽、二-對甲苯基錪鹽、雙(4-十二烷基苯基)錪鹽、雙(4-甲氧基苯基)錪鹽等。Examples of the above-mentioned iodonium salts include: trade name "UV9380C" (manufactured by Momentive Performance Materials Japan LLC, bis(4-dodecylphenyl)iodonium=hexafluoroantimonate 45% alkyl glycidyl ether solution), Product name "RHODORSIL PHOTOINITIATOR 2074" (manufactured by Rhodia Japan Co., Ltd., Tetrakis(pentafluorophenyl)borate=[(1-methylethyl)phenyl](methylphenyl)io), product name "WPI -124" (manufactured by Wako Pure Chemical Industries, Ltd.), diphenyliodonium salt, di-p-tolyliodonium salt, bis(4-dodecylphenyl)iodonium salt, bis(4-methoxybenzene) base) salt, etc.
作為上述硒鹽,例如可列舉:三苯基硒鹽、三對甲苯基硒鹽、三鄰甲苯基硒鹽、三(4-甲氧基苯基)硒鹽、1-萘基二苯基硒鹽等三芳基硒鹽;二苯基苯甲醯甲基硒鹽、二苯基苄基硒鹽、二苯基甲基硒鹽等二芳基硒鹽;苯基甲基苄基硒鹽等單芳基硒鹽;二甲基苯甲醯甲基硒鹽等三烷基硒鹽等。Examples of the above-mentioned selenium salts include: triphenylselenium salt, tri-p-tolylselenium salt, tri-o-tolylselenium salt, tris(4-methoxyphenyl)selenium salt, 1-naphthyldiphenylselenide Salt and other triaryl selenide salts; Aryl selenium salts; trialkyl selenium salts such as dimethyl benzoyl methyl selenium salts, etc.
作為上述銨鹽,例如可列舉:四甲基銨鹽、乙基三甲基銨鹽、二乙基二甲基銨鹽、三乙基甲基銨鹽、四乙基銨鹽、三甲基-正丙基銨鹽、三甲基-正丁基銨鹽等四烷基銨鹽;N,N-二甲基吡咯啶鎓鹽、N-乙基-N-甲基吡咯啶鎓鹽等吡咯啶鎓(pyrrolidinium)鹽;N,N'-二甲基咪唑啉鎓鹽、N,N'-二乙基咪唑啉鎓鹽等咪唑啉鎓(imidazolinium)鹽;N,N'-二甲基四氫嘧啶鎓鹽、N,N'-二乙基四氫嘧啶鎓鹽等四氫嘧啶鎓(tetrahydropyrimidinium)鹽;N,N-二甲基嗎福啉鎓鹽、N,N-二乙基嗎福啉鎓鹽等嗎福啉鎓(morpholinium)鹽;N,N-二甲基哌啶鎓鹽、N,N-二乙基哌啶鎓鹽等哌啶鎓(piperidinium)鹽;N-甲基吡啶鎓鹽、N-乙基吡啶鎓鹽等吡啶鎓(pyridinium)鹽;N,N'-二甲基咪唑鎓鹽等咪唑鎓(imidazolium)鹽;N-甲基喹啉鎓鹽等喹啉鎓(quinolium)鹽;N-甲基異喹啉鎓鹽等異喹啉鎓鹽;苄基苯并噻唑鎓鹽等噻唑鎓(thiazonium)鹽;苄基吖啶鎓鹽等吖啶鎓(acridinium)鹽等。Examples of the above-mentioned ammonium salts include tetramethylammonium salts, ethyltrimethylammonium salts, diethyldimethylammonium salts, triethylmethylammonium salts, tetraethylammonium salts, trimethyl- Tetraalkylammonium salts such as n-propylammonium salts and trimethyl-n-butylammonium salts; pyrrolidinium salts such as N,N-dimethylpyrrolidinium salts and N-ethyl-N-methylpyrrolidinium salts Onium (pyrrolidinium) salt; imidazolinium (imidazolinium) salt such as N,N'-dimethylimidazolinium salt, N,N'-diethylimidazolinium salt; N,N'-dimethyltetrahydro Pyrimidinium salts, N,N'-diethyltetrahydropyrimidinium salts and other tetrahydropyrimidinium salts; N,N-dimethylmorpholinium salts, N,N-diethylmorpholine Onium salts and other morpholinium (morpholinium) salts; N,N-dimethylpiperidinium salts, N,N-diethylpiperidinium salts and other piperidinium (piperidinium) salts; N-methylpyridinium salt, N-ethylpyridinium salt and other pyridinium salts; N,N'-dimethylimidazolium salt and other imidazolium salts; N-methylquinolinium salt and other quinolinium (quinolium) salts ) salts; isoquinolinium salts such as N-methylisoquinolinium salts; thiazonium salts such as benzylbenzothiazolium salts; acridinium salts such as benzylacridinium salts, etc.
作為上述鏻鹽,例如可列舉:四苯基鏻鹽、四對甲苯基鏻鹽、四(2-甲氧基苯基)鏻鹽等四芳基鏻鹽;三苯基苄基鏻鹽等三芳基鏻鹽;三乙基苄基鏻鹽、三丁基苄基鏻鹽、四乙基鏻鹽、四丁基鏻鹽、三乙基苯甲醯甲基鏻鹽等四烷基鏻鹽等。Examples of the above-mentioned phosphonium salts include: tetraarylphosphonium salts such as tetraphenylphosphonium salts, tetra-p-tolylphosphonium salts, and tetrakis(2-methoxyphenyl)phosphonium salts; triarylphosphonium salts such as triphenylbenzylphosphonium salts; phosphonium salts; tetraalkylphosphonium salts such as triethylbenzylphosphonium salts, tributylbenzylphosphonium salts, tetraethylphosphonium salts, tetrabutylphosphonium salts, triethylbenzoylmethylphosphonium salts, etc.
作為上述過渡金屬錯合物離子之鹽,例如可列舉:(η5-環戊二烯基)(η6-甲苯)Cr+ 、(η5-環戊二烯基)(η6-二甲苯)Cr+ 等鉻錯合物陽離子之鹽;(η5-環戊二烯基)(η6-甲苯)Fe+ 、(η5-環戊二烯基)(η6-二甲苯)Fe+ 等鐵錯合物陽離子之鹽等。Examples of salts of transition metal complex ions include: (η5-cyclopentadienyl)(η6-toluene)Cr + , (η5-cyclopentadienyl)(η6-xylene)Cr + , etc. Salts of chromium complex cations; salts of iron complex cations such as (η5-cyclopentadienyl)(η6-toluene)Fe + , (η5-cyclopentadienyl)(η6-xylene)Fe + Wait.
作為構成上述鹽之陰離子,例如可列舉:SbF6 - 、PF6 - 、BF4 - 、(CF3 CF2 )3 PF3 - 、(CF3 CF2 CF2 )3 PF3 - 、(C6 F5 )4 B- 、(C6 F5 )4 Ga- 、磺酸根陰離子(三氟甲磺酸根陰離子、五氟乙磺酸根陰離子、九氟丁磺酸根陰離子、甲磺酸根陰離子、苯磺酸根陰離子、對甲苯磺酸根陰離子等)、(CF3 SO2 )3 C- 、(CF3 SO2 )2 N- 、過鹵酸根離子、鹵化磺酸根離子、硫酸根離子、碳酸根離子、鋁酸根離子、六氟鉍酸根離子、羧酸根離子、芳基硼酸根離子、硫氰酸根離子、硝酸根離子等。Examples of anions constituting the above-mentioned salts include: SbF 6 - , PF 6 - , BF 4 - , (CF 3 CF 2 ) 3 PF 3 - , (CF 3 CF 2 CF 2 ) 3 PF 3 - , (C 6 F 5 ) 4 B - , (C 6 F 5 ) 4 Ga - , sulfonate anion (trifluoromethanesulfonate anion, pentafluoroethanesulfonate anion, nonafluorobutanesulfonate anion, methanesulfonate anion, benzenesulfonate anion anion, p-toluenesulfonate anion, etc.), (CF 3 SO 2 ) 3 C - , (CF 3 SO 2 ) 2 N - , perhalogenate ion, halogenated sulfonate ion, sulfate ion, carbonate ion, aluminate ion ions, hexafluorobismuthate ions, carboxylate ions, aryl borate ions, thiocyanate ions, nitrate ions, etc.
作為上述熱陽離子聚合起始劑,例如可列舉:芳基鋶鹽、芳基錪鹽、丙二烯-離子錯合物、四級銨鹽、鋁螯合物、三氟化硼胺錯合物等。Examples of the aforementioned thermal cationic polymerization initiators include: aryl percite salts, aryl peroxide salts, allene-ion complexes, quaternary ammonium salts, aluminum chelate compounds, and boron trifluoride amine complexes. Wait.
作為上述芳基鋶鹽,例如可列舉六氟銻酸鹽等。於本發明之硬化性組成物中,例如可使用商品名「SP-66」、「SP-77」(以上為ADEKA股份有限公司製造);商品名「San-Aid SI-60L」、「San-Aid SI-80L」、「San-Aid SI-100L」、「San-Aid SI-150L」(以上為三新化學工業股份有限公司製造)等市售品。作為上述鋁螯合物,例如可列舉乙醯乙酸乙基鋁二異丙酯、三(乙基乙醯乙酸)鋁等。又,作為上述三氟化硼胺錯合物,例如可列舉:三氟化硼單乙基胺錯合物、三氟化硼咪唑錯合物、三氟化硼哌啶錯合物等。As said aryl permeic acid salt, hexafluoroantimonate etc. are mentioned, for example. In the curable composition of the present invention, for example, trade names "SP-66", "SP-77" (the above are manufactured by ADEKA Co., Ltd.); trade names "San-Aid SI-60L", "San- Commercially available products such as "Aid SI-80L", "San-Aid SI-100L", and "San-Aid SI-150L" (the above are manufactured by Sanshin Chemical Industry Co., Ltd.). Examples of the aluminum chelate compound include ethylaluminum diisopropyl acetoacetate, aluminum tris(ethylacetoacetate), and the like. Moreover, examples of the boron trifluoride amine complex include boron trifluoride monoethylamine complex, boron trifluoride imidazole complex, boron trifluoride piperidine complex, and the like.
再者,於本發明之硬化性組成物中,硬化觸媒可單獨使用一種,亦可組合兩種以上而使用。Furthermore, in the curable composition of the present invention, the curing catalyst may be used alone or in combination of two or more.
本發明之硬化性組成物中之上述硬化觸媒之含量(摻合量)並無特別限定,相對於本發明之聚有機倍半矽氧烷100重量份,較佳為0.01〜3.0重量份,更佳為0.05〜3.0重量份,進而較佳為0.1〜1.0重量份(例如為0.3〜1.0重量份)。藉由將硬化觸媒之含量設為0.01重量份以上,有可有效率地充分地進行硬化反應,硬化物(樹脂層)之表面硬度或接著性進一步提高之傾向。另一方面,藉由將硬化觸媒之含量設為3.0重量份以下,有硬化性組成物之保存性進一步提高,或抑制硬化物(樹脂層)之著色之傾向。The content (blending amount) of the above-mentioned curing catalyst in the curable composition of the present invention is not particularly limited, but is preferably 0.01 to 3.0 parts by weight relative to 100 parts by weight of the polyorganosilsesquioxane of the present invention, More preferably 0.05 to 3.0 parts by weight, further preferably 0.1 to 1.0 parts by weight (for example, 0.3 to 1.0 parts by weight). By making the content of the curing catalyst 0.01 parts by weight or more, the curing reaction can be efficiently and sufficiently advanced, and the surface hardness and adhesiveness of the cured product (resin layer) tend to be further improved. On the other hand, by making content of a hardening catalyst 3.0 weight part or less, there exists a tendency for the storage stability of a curable composition to improve more, or to suppress the coloring of a hardened|cured material (resin layer).
(分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物) 本發明之硬化性組成物較佳含有分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物(以下,有時稱為「化合物A」)。藉由本發明之硬化性組成物含有本發明之聚有機倍半矽氧烷及化合物A,可有效地提高製成硬化物時之交聯密度,容易對硬化物(樹脂層)賦予較高之表面硬度與優異之彎曲耐久性。(Compounds with one or more thermally polymerizable functional groups and one or more photopolymerizable functional groups in the molecule) The curable composition of the present invention preferably contains a compound having one or more thermally polymerizable functional groups and one or more photopolymerizable functional groups in the molecule (hereinafter, sometimes referred to as "compound A"). By containing the polyorganosilsesquioxane and compound A of the present invention in the curable composition of the present invention, the crosslinking density of the cured product can be effectively increased, and it is easy to give the cured product (resin layer) a higher surface Hardness and excellent bending durability.
化合物A所具有之「熱聚合性官能基」只要為藉由熱對化合物A賦予聚合性之官能基,則並無特別限定,例如可列舉:羥基、環氧基、氧環丁基、乙烯醚基等,就本發明之樹脂層之表面硬度、彎曲耐久性之觀點而言,較佳為羥基、環氧基。再者,於化合物A具有2個以上之熱聚合性官能基之情形時,該等熱聚合性官能基可分別相同,亦可不同。The "thermally polymerizable functional group" of compound A is not particularly limited as long as it is a functional group that imparts polymerizability to compound A by heat. Examples include: hydroxyl group, epoxy group, oxetanyl group, vinyl ether The group etc. are preferably a hydroxyl group and an epoxy group from the viewpoint of the surface hardness and bending durability of the resin layer of the present invention. Furthermore, when the compound A has two or more thermally polymerizable functional groups, these thermally polymerizable functional groups may be respectively the same or different.
化合物A所具有之「光聚合性官能基」只要係藉由光(例如紫外線)對化合物A賦予聚合性之官能基,則並無特別限定,例如可列舉(甲基)丙烯醯基、乙烯基等,就本發明之樹脂層之表面硬度、彎曲耐久性之觀點而言,較佳為(甲基)丙烯醯基。再者,於化合物A具有2個以上之光聚合性官能基之情形時,該等光聚合性官能基可分別相同,亦可不同。The "photopolymerizable functional group" of compound A is not particularly limited as long as it is a functional group that imparts polymerizability to compound A by light (such as ultraviolet light). Examples include (meth)acryl, vinyl, etc. Among them, a (meth)acryl group is preferable from the viewpoint of the surface hardness and bending durability of the resin layer of the present invention. Furthermore, when compound A has two or more photopolymerizable functional groups, these photopolymerizable functional groups may be respectively the same or different.
只要化合物A於1分子內所具有之熱聚合性官能基之數量為1個以上即可,並無特別限定,例如較佳為1〜5個,更佳為1〜3個,進而較佳為1個或2個。又,只要化合物A於1分子內所具有之光聚合性官能基之數量為1個以上即可,並無特別限定,例如較佳為1〜5個,更佳為1〜3個,進而較佳為1個或2個。As long as the number of thermally polymerizable functional groups in one molecule of Compound A is 1 or more, it is not particularly limited, for example, it is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1 or 2. Also, as long as the number of photopolymerizable functional groups in one molecule of compound A is one or more, it is not particularly limited, for example, it is preferably 1 to 5, more preferably 1 to 3, and even more preferably Preferably 1 or 2.
化合物A之熱聚合性官能基之官能基當量並無特別限定,較佳為50〜500,更佳為80〜480,進而較佳為120〜450。若上述官能基當量未達50,則存在硬化物(樹脂層)之彎曲耐久性變得不充分之情形。另一方面,若上述官能基當量超過500,則存在硬化物(樹脂層)之表面硬度降低之情形。再者,化合物A之熱聚合性官能基之官能基當量可藉由下述式算出。 [熱聚合性官能基之官能基當量]=[化合物A之分子量]/[化合物A所具有之熱聚合性官能基之數量]The functional group equivalent weight of the thermopolymerizable functional group of Compound A is not particularly limited, but is preferably 50-500, more preferably 80-480, and still more preferably 120-450. When the said functional group equivalent is less than 50, the bending durability of hardened|cured material (resin layer) may become inadequate. On the other hand, when the said functional group equivalent exceeds 500, the surface hardness of hardened|cured material (resin layer) may fall. In addition, the functional group equivalent of the thermopolymerizable functional group of compound A can be computed by the following formula. [The functional group equivalent weight of the thermally polymerizable functional group]=[the molecular weight of the compound A]/[the number of the thermally polymerizable functional groups possessed by the compound A]
化合物A之光聚合性官能基之官能基當量並無特別限定,較佳為50〜500,更佳為80〜480,進而較佳為120〜450。若上述官能基當量未達50,則存在硬化物(樹脂層)之彎曲耐久性變得不充分之情形。另一方面,若上述官能基當量超過500,則存在硬化物(樹脂層)之表面硬度降低之情形。再者,化合物A之光聚合性官能基之官能基當量可藉由下述式算出。 [光聚合性官能基之官能基當量]=[化合物A之分子量]/[化合物A所具有之光聚合性官能基之數量]The functional group equivalent weight of the photopolymerizable functional group of Compound A is not particularly limited, but is preferably 50-500, more preferably 80-480, and still more preferably 120-450. When the said functional group equivalent is less than 50, the bending durability of hardened|cured material (resin layer) may become inadequate. On the other hand, when the said functional group equivalent exceeds 500, the surface hardness of hardened|cured material (resin layer) may fall. In addition, the functional group equivalent of the photopolymerizable functional group of compound A can be computed by the following formula. [The functional group equivalent weight of the photopolymerizable functional group]=[the molecular weight of the compound A]/[the number of the photopolymerizable functional group that the compound A has]
作為化合物A,具體而言,例如可列舉:(甲基)丙烯酸3,4-環氧環己基甲酯、(甲基)丙烯酸縮水甘油酯、三丙二醇二縮水甘油醚二(甲基)丙烯酸酯(使(甲基)丙烯酸與三丙二醇二縮水甘油醚之兩個環氧基反應而獲得之化合物)、三丙二醇二縮水甘油醚半(甲基)丙烯酸酯(使(甲基)丙烯酸與三丙二醇二縮水甘油醚之一個環氧基反應而獲得之化合物)、雙酚A環氧二(甲基)丙烯酸酯(使(甲基)丙烯酸與雙酚A二縮水甘油醚之兩個環氧基反應而獲得之化合物)、雙酚A環氧半(甲基)丙烯酸酯(使(甲基)丙烯酸或其衍生物與雙酚A二縮水甘油醚之一個環氧基反應而獲得之化合物)、雙酚F環氧二(甲基)丙烯酸酯、雙酚F環氧半(甲基)丙烯酸酯、雙酚S環氧二(甲基)丙烯酸酯、雙酚S環氧半(甲基)丙烯酸酯等1分子內具有環氧基及/或羥基與(甲基)丙烯醯基之化合物;(甲基)丙烯酸3-氧環丁基甲酯、(甲基)丙烯酸3-甲基-3-氧環丁基甲酯、(甲基)丙烯酸3-乙基-3-氧環丁基甲酯、(甲基)丙烯酸3-丁基-3-氧環丁基甲酯、(甲基)丙烯酸3-己基-3-氧環丁基甲酯等1分子內具有氧環丁基與(甲基)丙烯醯基之化合物;(甲基)丙烯酸2-乙烯氧基乙酯、(甲基)丙烯酸3-乙烯氧基丙酯、(甲基)丙烯酸1-甲基-2-乙烯氧基乙酯、(甲基)丙烯酸2-乙烯氧基丙酯、(甲基)丙烯酸4-乙烯氧基丁酯、(甲基)丙烯酸1-甲基-3-乙烯氧基丙酯、(甲基)丙烯酸1-乙烯氧基甲基丙酯、(甲基)丙烯酸2-甲基-3-乙烯氧基丙酯、(甲基)丙烯酸1,1-二甲基-2-乙烯氧基乙酯、(甲基)丙烯酸3-乙烯氧基丁酯、(甲基)丙烯酸1-甲基-2-乙烯氧基丙酯、(甲基)丙烯酸2-乙烯氧基丁酯、(甲基)丙烯酸4-乙烯氧基環己酯、(甲基)丙烯酸6-乙烯氧基己酯、(甲基)丙烯酸4-乙烯氧基甲基環己基甲酯、(甲基)丙烯酸3-乙烯氧基甲基環己基甲酯、(甲基)丙烯酸2-乙烯氧基環己基甲酯、(甲基)丙烯酸對乙烯氧基甲基苯基甲酯、(甲基)丙烯酸間乙烯氧基甲基苯基甲酯、(甲基)丙烯酸鄰乙烯氧基甲基苯基甲酯、(甲基)丙烯酸2-(乙烯氧基乙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基)丙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基)異丙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基)丙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基)異丙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基乙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基異丙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基乙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基異丙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基乙氧基)丙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基異丙氧基)丙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基乙氧基)丙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基異丙氧基)丙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基乙氧基)異丙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基異丙氧基)異丙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基乙氧基)異丙酯、(甲基)丙烯酸2-(乙烯氧基異丙氧基異丙氧基)異丙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基乙氧基乙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基乙氧基乙氧基乙氧基)乙酯、(甲基)丙烯酸2-(異丙烯氧基乙氧基)乙酯、(甲基)丙烯酸2-(異丙烯氧基乙氧基乙氧基)乙酯、(甲基)丙烯酸2-(異丙烯氧基乙氧基乙氧基乙氧基)乙酯、(甲基)丙烯酸2-(異丙烯氧基乙氧基乙氧基乙氧基乙氧基)乙酯、(甲基)丙烯酸聚乙二醇單乙烯醚、(甲基)丙烯酸聚丙二醇單乙烯醚等1分子內具有乙烯醚基與(甲基)丙烯醯基之化合物等。Specific examples of compound A include: 3,4-epoxycyclohexylmethyl (meth)acrylate, glycidyl (meth)acrylate, tripropylene glycol diglycidyl ether di(meth)acrylate (a compound obtained by reacting (meth)acrylic acid with two epoxy groups of tripropylene glycol diglycidyl ether), tripropylene glycol diglycidyl ether half (meth)acrylate (by making (meth)acrylic acid and tripropylene glycol A compound obtained by reacting one epoxy group of diglycidyl ether), bisphenol A epoxy di(meth)acrylate (reacting (meth)acrylic acid and two epoxy groups of bisphenol A diglycidyl ether The compound obtained), bisphenol A epoxy half (meth) acrylate (the compound obtained by reacting (meth)acrylic acid or its derivatives with an epoxy group of bisphenol A diglycidyl ether), bisphenol A diglycidyl ether Phenol F Epoxy Di(meth)acrylate, Bisphenol F Epoxy Hemi(meth)acrylate, Bisphenol S Epoxy Di(meth)acrylate, Bisphenol S Epoxy Hemi(meth)acrylate Compounds with epoxy group and/or hydroxyl group and (meth)acryl group in one molecule; 3-oxocyclobutyl methyl (meth)acrylate, 3-methyl-3-oxocyclobutylmethyl (meth)acrylate ester, 3-ethyl-3-oxocyclobutylmethyl (meth)acrylate, 3-butyl-3-oxocyclobutylmethyl (meth)acrylate, 3-hexyl-3-oxocyclobutylmethyl (meth)acrylate Compounds with oxocyclobutyl and (meth)acryl groups in one molecule, such as esters; 2-vinyloxyethyl (meth)acrylate, 3-vinyloxypropyl (meth)acrylate, (meth)acrylate ) 1-methyl-2-vinyloxyethyl acrylate, 2-vinyloxypropyl (meth)acrylate, 4-vinyloxybutyl (meth)acrylate, 1-methyl (meth)acrylate -3-vinyloxypropyl ester, 1-vinyloxymethylpropyl (meth)acrylate, 2-methyl-3-vinyloxypropyl (meth)acrylate, 1,1 (meth)acrylate -Dimethyl-2-vinyloxyethyl ester, 3-vinyloxybutyl (meth)acrylate, 1-methyl-2-vinyloxypropyl (meth)acrylate, (meth)acrylic acid 2 - Vinyloxybutyl, 4-vinyloxycyclohexyl (meth)acrylate, 6-vinyloxyhexyl (meth)acrylate, 4-vinyloxymethylcyclohexylmethyl (meth)acrylate , 3-vinyloxymethylcyclohexylmethyl (meth)acrylate, 2-vinyloxycyclohexylmethyl (meth)acrylate, p-vinyloxymethylphenylmethyl (meth)acrylate, ( m-vinyloxymethylphenylmethyl methacrylate, o-vinyloxymethylphenylmethyl (meth)acrylate, 2-(ethyleneoxyethoxy)ethyl (meth)acrylate, ( 2-(ethyleneoxyisopropoxy)ethyl (meth)acrylate, 2-(ethyleneoxyethoxy)propyl (meth)acrylate, 2-(ethyleneoxyethoxy)(meth)acrylate ) isopropyl ester, 2-(ethyleneoxyisopropoxy)propyl (meth)acrylate, 2-(vinyloxyisopropoxy)isopropyl (meth)acrylate, (meth)acrylic acid 2 -(ethyleneoxyethoxy Ethoxy)ethyl ester, 2-(ethyleneoxyethoxyisopropoxy)ethyl (meth)acrylate, 2-(ethyleneoxyisopropoxyethoxy)ethyl (meth)acrylate , 2-(vinyloxyisopropoxyisopropoxy)ethyl (meth)acrylate, 2-(ethyleneoxyethoxyethoxy)propyl (meth)acrylate, (meth)acrylic acid 2-(vinyloxyethoxyisopropoxy)propyl, 2-(vinyloxyisopropoxyethoxy)propyl (meth)acrylate, 2-(ethyleneoxy)(meth)acrylate Isopropoxyisopropoxy)propyl, 2-(ethyleneoxyethoxyethoxy)isopropyl (meth)acrylate, 2-(ethyleneoxyethoxyisopropyl)(meth)acrylate oxy)isopropyl ester, 2-(vinyloxyisopropoxyethoxy)isopropyl (meth)acrylate, 2-(vinyloxyisopropoxyisopropoxy)(meth)acrylate Isopropyl ester, 2-(vinyloxyethoxyethoxyethoxy)ethyl (meth)acrylate, 2-(vinyloxyethoxyethoxyethoxyethoxyethoxy)(meth)acrylate base) ethyl ester, 2-(isopropenyloxyethoxy)ethyl (meth)acrylate, 2-(isopropenyloxyethoxyethoxy)ethyl (meth)acrylate, (methyl) 2-(isopropenyloxyethoxyethoxyethoxyethoxy)ethyl acrylate, 2-(isopropenyloxyethoxyethoxyethoxyethoxyethoxy)ethyl (meth)acrylate, ( Compounds having vinyl ether groups and (meth)acryl groups in one molecule, such as polyethylene glycol monovinyl methacrylate and polypropylene glycol monovinyl (meth)acrylate, etc.
就硬化物(樹脂層)之彎曲耐久性及表面硬度之觀點而言,作為化合物A,較佳為於1分子內具有作為熱聚合性官能基之環氧基及/或羥基、與作為光聚合性官能基之(甲基)丙烯醯基之化合物,具體而言,較佳為(甲基)丙烯酸3,4-環氧環己基甲酯、(甲基)丙烯酸縮水甘油酯、三丙二醇二縮水甘油醚半(甲基)丙烯酸酯、雙酚A環氧半(甲基)丙烯酸酯、雙酚F環氧半(甲基)丙烯酸酯、雙酚S環氧半(甲基)丙烯酸酯等。From the viewpoint of the bending durability and surface hardness of the cured product (resin layer), it is preferable that the compound A has an epoxy group and/or a hydroxyl group as a thermally polymerizable functional group in one molecule, and an epoxy group as a photopolymerizable functional group. Compounds of (meth)acryloyl groups with sexual functional groups, specifically, 3,4-epoxycyclohexylmethyl (meth)acrylate, glycidyl (meth)acrylate, tripropylene glycol diglycidyl Glyceryl ether half (meth)acrylate, bisphenol A epoxy half (meth)acrylate, bisphenol F epoxy half (meth)acrylate, bisphenol S epoxy half (meth)acrylate, etc.
再者,本發明之硬化性組成物中化合物A可單獨使用一種,亦可組合兩種以上而使用。化合物A可藉由公知之方法而製造,例如可藉由使1分子內具有2個以上之熱聚合性官能基(例如環氧基、羥基)之化合物之該熱聚合性官能基之一部分與具有光聚合性官能基之羧酸(例如丙烯酸、甲基丙烯酸等)或其衍生物反應之方法等而獲得。又,作為上述化合物A,例如可使用商品名「Lightester G」、「Epoxy Ester 200PA」、「Epoxy Ester 200PA-E5」(以上為共榮社化學股份有限公司製造)、商品名「NK OLIGO EA1010N」(新中村化學工業股份有限公司製造)等市售品。In addition, in the curable composition of this invention, compound A may be used individually by 1 type, and may use it in combination of 2 or more types. Compound A can be produced by a known method, for example, by combining a part of the thermally polymerizable functional group of a compound having two or more thermally polymerizable functional groups (such as epoxy groups, hydroxyl groups) in one molecule with It can be obtained by reacting carboxylic acid (such as acrylic acid, methacrylic acid, etc.) or its derivatives with photopolymerizable functional groups. In addition, as the above-mentioned compound A, for example, trade names "Lightester G", "Epoxy Ester 200PA", "Epoxy Ester 200PA-E5" (the above are manufactured by Kyoeisha Chemical Co., Ltd.), trade names "NK OLIGO EA1010N" can be used, for example. (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and other commercially available products.
本發明之硬化性組成物中之上述化合物A之含量(摻合量)並無特別限定,以固形物成分計,相對於本發明之聚有機倍半矽氧烷100重量份,較佳為1〜100重量份,更佳為3〜75重量份,進而較佳為5〜50重量份。藉由將化合物A之含量設為1重量份以上,有硬化物(樹脂層)之彎曲耐久性進一步提高之傾向。另一方面,藉由將化合物A之含量設為100重量份以下,有可維持硬化物(樹脂層)之表面硬度之傾向。The content (blending amount) of the above-mentioned compound A in the curable composition of the present invention is not particularly limited, but in terms of solid content, it is preferably 1 ~100 parts by weight, more preferably 3~75 parts by weight, more preferably 5~50 parts by weight. There exists a tendency for the bending durability of a hardened|cured material (resin layer) to improve more by making content of compound A into 1 weight part or more. On the other hand, there exists a tendency for the surface hardness of hardened|cured material (resin layer) to be maintained by making content of compound A into 100 weight part or less.
(含氟之光聚合性樹脂) 本發明之硬化性組成物較佳含有含氟之光聚合性樹脂。含氟之光聚合性樹脂為分子內具有氟脂肪族烴骨架等含氟之基與光聚合性官能基之樹脂(低聚物)。藉由本發明之硬化性組成物含有本發明之聚有機倍半矽氧烷或化合物A及含氟之光聚合性樹脂,可有效地提高製成硬化物時之樹脂層表面之交聯密度,具有提高硬化物(樹脂層)之表面之平滑性等外觀,提高表面硬度、耐擦傷性及防污性之性質。尤其是藉由將含氟之光聚合性樹脂與化合物A一併摻合至本發明之硬化性組成物中,其效果變得顯著。(fluorine-containing photopolymerizable resin) The curable composition of the present invention preferably contains a fluorine-containing photopolymerizable resin. The fluorine-containing photopolymerizable resin is a resin (oligomer) having a fluorine-containing group such as a fluoroaliphatic hydrocarbon skeleton and a photopolymerizable functional group in the molecule. By containing the polyorganosilsesquioxane or compound A of the present invention and the fluorine-containing photopolymerizable resin in the curable composition of the present invention, the crosslinking density of the surface of the resin layer when it is made into a cured product can be effectively increased, and it has Improve the appearance of the surface of the cured product (resin layer) such as smoothness, improve the surface hardness, scratch resistance and antifouling properties. In particular, by blending the fluorine-containing photopolymerizable resin and the compound A into the curable composition of the present invention, the effect becomes remarkable.
作為含氟之光聚合性樹脂所具有之光聚合性官能基,可列舉與上述化合物A所具有之「光聚合性官能基」相同者,就本發明之樹脂層之耐擦傷性、防污性之觀點而言,較佳為(甲基)丙烯醯基。再者,於含氟之光聚合性樹脂具有2個以上之光聚合性官能基之情形時,該等光聚合性官能基可分別相同,亦可不同。Examples of the photopolymerizable functional group of the fluorine-containing photopolymerizable resin include the same ones as the "photopolymerizable functional group" of the above-mentioned compound A. In terms of the scratch resistance and antifouling properties of the resin layer of the present invention, From this point of view, a (meth)acryloyl group is preferable. Furthermore, when the fluorine-containing photopolymerizable resin has two or more photopolymerizable functional groups, these photopolymerizable functional groups may be respectively the same or different.
只要上述含氟之光聚合性樹脂於1分子內所具有之光聚合性官能基之數量為1個以上即可,並無特別限定,例如較佳為1〜5個,更佳為1〜3個。It is not particularly limited as long as the number of photopolymerizable functional groups in one molecule of the above-mentioned fluorine-containing photopolymerizable resin is one or more, for example, it is preferably 1 to 5, more preferably 1 to 3 indivual.
上述含氟之光聚合性樹脂所具有之「含氟之基」只要係具有氟原子者,則並無特別限定,例如可列舉具有氟脂肪族烴骨架者。作為氟脂肪族烴骨架,例如可列舉:氟甲烷、氟乙烷、氟丙烷、氟異丙烷、氟丁烷、氟異丁烷、氟第三丁烷、氟戊烷、氟己烷等氟C1-10 烷烴等。The "fluorine-containing group" of the fluorine-containing photopolymerizable resin is not particularly limited as long as it has a fluorine atom, and examples thereof include those having a fluoroaliphatic hydrocarbon skeleton. Examples of the fluoroaliphatic hydrocarbon skeleton include fluorocarbons such as fluoromethane, fluoroethane, fluoropropane, fluoroisopropane, fluorobutane, fluoroisobutane, fluorobutane, fluoropentane, and fluorohexane. 1-10 alkanes etc.
該等氟脂肪族烴骨架只要至少一部分氫原子被取代為氟原子即可,就可提高樹脂層之耐擦傷性、滑動性及防污性之觀點而言,較佳為所有氫原子被取代為氟原子之全氟脂肪族烴骨架。These fluoroaliphatic hydrocarbon skeletons only need to have at least a part of the hydrogen atoms substituted with fluorine atoms. From the viewpoint of improving the scratch resistance, sliding properties, and antifouling properties of the resin layer, it is preferred that all the hydrogen atoms be substituted with fluorine atoms. Perfluoroaliphatic hydrocarbon skeleton with fluorine atoms.
進而,氟脂肪族烴骨架可形成作為經由醚鍵之重複單元之聚氟伸烷基醚骨架。作為重複單元之氟脂肪族烴基可為選自由氟亞甲基、氟伸乙基、氟伸丙基、氟伸異丙基等氟C1-4 伸烷基所組成之群中之至少1種。聚氟伸烷基醚單元之重複數(聚合度)例如為10〜3000,較佳為30〜1000,更佳為50〜500。Furthermore, the fluoroaliphatic hydrocarbon skeleton can form a polyfluoroalkylene ether skeleton as a repeating unit via an ether bond. The fluoroaliphatic hydrocarbon group as a repeating unit may be at least one selected from the group consisting of fluoromethylene, fluoroethyl, fluoropropyl, fluoroisopropyl and other fluoro C 1-4 alkylene groups . The repeating number (polymerization degree) of the polyfluoroalkylene ether unit is, for example, 10-3000, preferably 30-1000, more preferably 50-500.
上述含氟之光聚合性樹脂除上述「光聚合性官能基」、「含氟之基」以外,亦可具有含聚矽氧之基。藉由含氟之光聚合性樹脂進而具有含聚矽氧之基,有與本發明之聚有機倍半矽氧烷之親和性提高,進而提高硬化物(樹脂層)之表面硬度、耐擦傷性、防污性之傾向。含聚矽氧之基係具有聚有機矽氧烷骨架之基,只要為由M單元、D單元、T單元、Q單元形成之聚有機矽氧烷即可,通常,較佳地使用由D單元形成之聚有機矽氧烷。作為聚有機矽氧烷之有機基,通常使用C1-4 烷基、芳基,通用的是甲基、苯基(尤其是甲基)。矽氧烷單元之重複數(聚合度)例如為2〜3000,較佳為3〜2000,更佳為5〜1000。The above-mentioned fluorine-containing photopolymerizable resin may have a silicone-containing group in addition to the above-mentioned "photopolymerizable functional group" and "fluorine-containing group". The fluorine-containing photopolymerizable resin further has a polysiloxane-containing group, which improves the affinity with the polyorganosilsesquioxane of the present invention, thereby improving the surface hardness and scratch resistance of the cured product (resin layer) , Antifouling tendency. The polysiloxane-containing group is a group with a polyorganosiloxane skeleton, as long as it is a polyorganosiloxane formed by M units, D units, T units, and Q units. Usually, it is better to use a polyorganosiloxane composed of D units. The formation of polyorganosiloxane. As the organic group of polyorganosiloxane, C 1-4 alkyl group and aryl group are usually used, and methyl group and phenyl group (especially methyl group) are commonly used. The repeating number (polymerization degree) of the siloxane unit is, for example, 2-3000, preferably 3-2000, more preferably 5-1000.
作為上述含氟之光聚合性樹脂,可使用市售品,例如可使用商品名「MEGAFAC RS-56」、「MEGAFAC RS-75」、「MEGAFAC RS-72-K」、「MEGAFAC RS-76-E」、「MEGAFAC RS-76-E」、「MEGAFAC RS-76-NS」、「MEGAFAC RS-78」、「MEGAFAC RS-90」(以上為DIC股份有限公司製造);商品名「Ftergent 601AD」、「Ftergent 601ADH2」、「Ftergent 602A」、「Ftergent 650AC」、「Ftergent 681」(以上為NEOS股份有限公司製造)等。As the above-mentioned fluorine-containing photopolymerizable resin, commercially available products can be used. E", "MEGAFAC RS-76-E", "MEGAFAC RS-76-NS", "MEGAFAC RS-78", "MEGAFAC RS-90" (the above are manufactured by DIC Co., Ltd.); trade name "Ftergent 601AD" , "Ftergent 601ADH2", "Ftergent 602A", "Ftergent 650AC", "Ftergent 681" (the above are manufactured by NEOS Co., Ltd.), etc.
該等含氟之光聚合性樹脂可單獨使用一種,亦可組合兩種以上而使用。These fluorine-containing photopolymerizable resins may be used alone or in combination of two or more.
本發明之硬化性組成物中之上述含氟之光聚合性樹脂之含量(摻合量)並無特別限定,以固形物成分計,相對於本發明之聚有機倍半矽氧烷100重量份,例如為0.01〜15重量份,較佳為0.05〜10重量份,更佳為0.01〜5重量份,進而較佳為0.2〜3重量份。藉由將含氟之光聚合性樹脂之含量設為0.01重量份以上,有硬化物(樹脂層)之耐擦傷性、防污性進一步提高之傾向。The content (blending amount) of the above-mentioned fluorine-containing photopolymerizable resin in the curable composition of the present invention is not particularly limited, and it is based on solid content, relative to 100 parts by weight of the polyorganosilsesquioxane of the present invention , such as 0.01 to 15 parts by weight, preferably 0.05 to 10 parts by weight, more preferably 0.01 to 5 parts by weight, and more preferably 0.2 to 3 parts by weight. By making content of the fluorine-containing photopolymerizable resin 0.01 weight part or more, there exists a tendency for the abrasion resistance of hardened|cured material (resin layer) and antifouling property to improve further.
(環氧化合物) 上述硬化性組成物可含有本發明之聚有機倍半矽氧烷以外之環氧化合物(以下,有時簡稱為「環氧化合物」)。藉由除本發明之聚有機倍半矽氧烷以外還含有環氧化合物,可形成具有較高之表面硬度,柔軟性、可撓性及加工性優異之硬化物(樹脂層)。(epoxy compound) The above-mentioned curable composition may contain epoxy compounds other than the polyorganosilsesquioxane of the present invention (hereinafter, may be simply referred to as "epoxy compounds"). By containing an epoxy compound in addition to the polyorganosilsesquioxane of the present invention, a cured product (resin layer) having high surface hardness and excellent flexibility, flexibility and workability can be formed.
作為上述環氧化合物,可使用分子內具有1個以上之環氧基(環氧乙烷環)之公知慣用之化合物,並無特別限定,可列舉:脂環式環氧化合物(脂環式環氧樹脂)、芳香族環氧化合物(芳香族環氧樹脂)、脂肪族環氧化合物(脂肪族環氧樹脂)等。其中,較佳為脂環式環氧化合物。As the above-mentioned epoxy compound, a well-known and commonly used compound having one or more epoxy groups (oxirane ring) in the molecule can be used, without particular limitation, examples include: alicyclic epoxy compounds (alicyclic rings) Oxygen resin), aromatic epoxy compound (aromatic epoxy resin), aliphatic epoxy compound (aliphatic epoxy resin), etc. Among them, alicyclic epoxy compounds are preferred.
作為上述脂環式環氧化合物,可列舉分子內具有1個以上之脂環與1個以上之環氧基之公知慣用之化合物,並無特別限定,例如可列舉:(1)分子內具有下述環氧基(稱為「脂環環氧基」)之化合物,該環氧基由構成脂環之鄰接之2個碳原子與氧原子所構成;(2)環氧基直接利用單鍵與脂環鍵結之化合物;(3)分子內具有脂環及縮水甘油醚基之化合物(縮水甘油醚型環氧化合物)等。As the above-mentioned alicyclic epoxy compound, there are known and commonly used compounds having one or more alicyclic rings and one or more epoxy groups in the molecule, without particular limitation, for example: (1) having the following compounds in the molecule: The above-mentioned epoxy group (called "alicyclic epoxy group"), the epoxy group is composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring; (2) the epoxy group directly utilizes a single bond and Compounds with alicyclic bonds; (3) Compounds with alicyclic and glycidyl ether groups in the molecule (glycidyl ether type epoxy compounds), etc.
作為上述(1)分子內具有脂環環氧基之化合物,可自公知慣用者之中任意選擇而使用。其中,作為上述脂環環氧基,較佳為環氧環己烷基,尤佳為下述式(i)所表示之化合物。 As the compound having an alicyclic epoxy group in the molecule of the above (1), any compound that is known and used can be used. Among them, the alicyclic epoxy group is preferably an epoxycyclohexyl group, and is particularly preferably a compound represented by the following formula (i).
上述式(i)中,Y表示單鍵或連結基(具有1個以上之原子之二價基)。作為上述連結基,例如可列舉:二價烴基、碳-碳雙鍵之一部分或全部經環氧化之伸烯基、羰基、醚鍵、酯鍵、碳酸酯基、醯胺基、該等複數個連結而成之基等。式(i)中之環己烷環之氫原子之1個以上可經碳數1〜6之烷基等取代基取代。In the above formula (i), Y represents a single bond or a linking group (a divalent group having one or more atoms). Examples of the linking group include: a divalent hydrocarbon group, an alkenylene group in which a part or all of the carbon-carbon double bond is epoxidized, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide group, and a plurality of such groups. The basis of the connection and so on. One or more hydrogen atoms of the cyclohexane ring in formula (i) may be substituted with a substituent such as an alkyl group having 1 to 6 carbon atoms.
作為上述二價烴基,可列舉碳數為1〜18之直鏈或支鏈狀之伸烷基、二價脂環式烴基等。作為碳數為1〜18之直鏈或支鏈狀之伸烷基,例如可列舉:亞甲基、甲基亞甲基、二甲基亞甲基、伸乙基、伸丙基、三亞甲基等。作為上述二價脂環式烴基,例如可列舉:1,2-伸環戊基、1,3-伸環戊基、亞環戊基、1,2-伸環己基、1,3-伸環己基、1,4-伸環己基、亞環己基等二價伸環烷基(包含亞環烷基)等。Examples of the divalent hydrocarbon group include linear or branched alkylene groups having 1 to 18 carbon atoms, divalent alicyclic hydrocarbon groups, and the like. Examples of linear or branched alkylene groups having 1 to 18 carbon atoms include methylene, methylmethylene, dimethylmethylene, ethylidene, propylidene, and trimethylene Base etc. Examples of the divalent alicyclic hydrocarbon group include: 1,2-cyclopentyl, 1,3-cyclopentyl, cyclopentylene, 1,2-cyclohexyl, 1,3-cyclopentyl Divalent cycloalkylene groups (including cycloalkylene groups) such as hexyl, 1,4-cyclohexylene, and cyclohexylene.
作為上述碳-碳雙鍵之一部分或全部經環氧化之伸烯基(有時稱為「環氧化伸烯基」)中之伸烯基,例如可列舉:乙烯基、伸丙烯基、1-伸丁烯基、2-伸丁烯基、伸丁二烯基、伸戊烯基、伸己烯基、伸庚烯基、伸辛烯基等碳數2〜8之直鏈或支鏈狀之伸烯基等。尤其是作為上述環氧化伸烯基,較佳為碳-碳雙鍵之全部經環氧化之伸烯基,更佳為碳-碳雙鍵之全部經環氧化之碳數2〜4之伸烯基。As the alkenylene group in the above-mentioned alkenylene group in which part or all of the carbon-carbon double bond is epoxidized (sometimes referred to as "epoxyalkenyl group"), for example, vinyl group, propenyl group, 1- Butenyl, 2-butenyl, butadienyl, pentenyl, hexenyl, heptenyl, octenyl and other straight or branched chains with 2 to 8 carbon atoms Alkenyl, etc. In particular, the epoxidized alkenylene group is preferably an epoxidized alkenylene group having all carbon-carbon double bonds, more preferably an epoxidized alkenylene group having 2 to 4 carbon atoms having all carbon-carbon double bonds. base.
作為上述式(i)所表示之脂環式環氧化合物之代表性例,可列舉(3,4,3',4'-二環氧基)聯環己烷、下述式(i-1)〜(i-10)所表示之化合物等。再者,下述式(i-5)、(i-7)中之l、m分別表示1〜30之整數。下述式(i-5)中之R'為碳數1〜8之伸烷基,其中,較佳為亞甲基、伸乙基、伸丙基、伸異丙基等碳數1〜3之直鏈或支鏈狀之伸烷基。下述式(i-9)、(i-10)中之n1〜n6分別表示1〜30之整數。又,作為上述式(i)所表示之脂環式環氧化合物,此外例如可列舉:2,2-雙(3,4-環氧環己基)丙烷、1,2-雙(3,4-環氧環己基)乙烷、2,3-雙(3,4-環氧環己基)環氧乙烷、雙(3,4-環氧環己基甲基)醚等。 Representative examples of the alicyclic epoxy compounds represented by the above formula (i) include (3,4,3',4'-diepoxy)bicyclohexane, the following formula (i-1 )~(i-10) represented compounds, etc. Furthermore, l and m in the following formulas (i-5) and (i-7) represent integers of 1 to 30, respectively. R' in the following formula (i-5) is an alkylene group with 1 to 8 carbons, among which, methylene, ethylidene, propylidene, isopropylidene and other carbons with 1 to 3 straight or branched chain alkylene. n1 to n6 in the following formulas (i-9) and (i-10) represent integers of 1 to 30, respectively. In addition, examples of the alicyclic epoxy compound represented by the above formula (i) include 2,2-bis(3,4-epoxycyclohexyl)propane, 1,2-bis(3,4- Epoxycyclohexyl)ethane, 2,3-bis(3,4-epoxycyclohexyl)oxirane, bis(3,4-epoxycyclohexylmethyl)ether, etc.
作為上述(2)環氧基直接利用單鍵與脂環鍵結之化合物,例如可列舉下述式(ii)所表示之化合物等。 As a compound which said (2) epoxy group is directly bonded to an alicyclic ring by a single bond, the compound etc. which are represented by following formula (ii) are mentioned, for example.
式(ii)中,R''表示自p元醇之結構式去除p個羥基(-OH)所得之基(p價有機基),p、n分別表示自然數。作為p元醇[R''(OH)p ],可列舉2,2-雙(羥基甲基)-1-丁醇等多元醇(碳數1〜15之醇等)等。p較佳為1〜6,n較佳為1〜30,於p為2以上之情形時,各()內(外側之括弧內)之基中之n可相同亦可不同。作為上述式(ii)所表示之化合物,具體而言,可列舉:2,2-雙(羥基甲基)-1-丁醇之1,2-環氧-4-(2-環氧乙烷基)環己烷加成物[例如可使用商品名「EHPE3150」(Daicel股份有限公司製造)等]等。In formula (ii), R'' represents a group (p-valent organic group) obtained by removing p hydroxyl groups (-OH) from the structural formula of p-hydric alcohol, and p and n represent natural numbers respectively. Examples of the p-hydric alcohol [R''(OH) p ] include polyalcohols such as 2,2-bis(hydroxymethyl)-1-butanol (alcohols having 1 to 15 carbon atoms, etc.). p is preferably 1 to 6, and n is preferably 1 to 30. When p is 2 or more, the n in the bases in each () (inside parentheses) may be the same or different. As the compound represented by the above formula (ii), specifically, 1,2-epoxy-4-(2-oxirane of 2,2-bis(hydroxymethyl)-1-butanol base) cyclohexane adduct [For example, a trade name "EHPE3150" (manufactured by Daicel Co., Ltd.) etc. can be used] and the like.
作為上述(3)分子內具有脂環及縮水甘油醚基之化合物,例如可列舉脂環式醇(尤其是脂環式多元醇)之縮水甘油醚。更詳細而言,例如可列舉:使2,2-雙[4-(2,3-環氧丙氧基)環己基]丙烷、2,2-雙[3,5-二甲基-4-(2,3-環氧丙氧基)環己基]丙烷等雙酚A型環氧化合物氫化而成之化合物(氫化雙酚A型環氧化合物);使雙[鄰,鄰-(2,3-環氧丙氧基)環己基]甲烷、雙[鄰,對-(2,3-環氧丙氧基)環己基]甲烷、雙[對,對-(2,3-環氧丙氧基)環己基]甲烷、雙[3,5-二甲基-4-(2,3-環氧丙氧基)環己基]甲烷等雙酚F型環氧化合物氫化而成之化合物(氫化雙酚F型環氧化合物);氫化聯苯酚型環氧化合物;氫化苯酚酚醛清漆型環氧化合物;氫化甲酚酚醛清漆型環氧化合物;雙酚A之氫化甲酚酚醛清漆型環氧化合物;氫化萘型環氧化合物;由三酚甲烷獲得之環氧化合物之氫化環氧化合物;下述芳香族環氧化合物之氫化環氧化合物等。Examples of the compound having an alicyclic ring and a glycidyl ether group in the molecule (3) above include glycidyl ethers of alicyclic alcohols (especially alicyclic polyhydric alcohols). More specifically, for example, 2,2-bis[4-(2,3-epoxypropoxy)cyclohexyl]propane, 2,2-bis[3,5-dimethyl-4- (2,3-Epoxypropoxy)cyclohexyl]propane and other bisphenol A type epoxy compounds are hydrogenated (hydrogenated bisphenol A type epoxy compounds); bis[o,o-(2,3 -Glycidoxy)cyclohexyl]methane, bis[o,p-(2,3-glycidoxy)cyclohexyl]methane, bis[p,p-(2,3-glycidoxy )cyclohexyl]methane, bis[3,5-dimethyl-4-(2,3-epoxypropoxy)cyclohexyl]methane and other bisphenol F-type epoxy compounds hydrogenated (hydrogenated bisphenol F type epoxy compounds); hydrogenated biphenol type epoxy compounds; hydrogenated phenol novolac type epoxy compounds; hydrogenated cresol novolak type epoxy compounds; hydrogenated cresol novolak type epoxy compounds of bisphenol A; hydrogenated naphthalene Type epoxy compounds; hydrogenated epoxy compounds of epoxy compounds obtained from trisphenol methane; hydrogenated epoxy compounds of the following aromatic epoxy compounds, etc.
作為上述芳香族環氧化合物,例如可列舉:藉由雙酚類[例如,雙酚A、雙酚F、雙酚S、茀雙酚等]與表鹵醇(epihalohydrin)之縮合反應而獲得之Epi-Bis型縮水甘油醚型環氧樹脂;藉由使該等Epi-Bis型縮水甘油醚型環氧樹脂與上述雙酚類進而進行加成反應而獲得之高分子量Epi-Bis型縮水甘油醚型環氧樹脂;藉由使酚類[例如,苯酚、甲酚、二甲苯酚、間苯二酚、鄰苯二酚、雙酚A、雙酚F、雙酚S等]與醛[例如,甲醛、乙醛、苯甲醛、羥基苯甲醛、柳醛等]進行縮合反應而獲得之多元醇類進而與表鹵醇進行縮合反應所獲得之酚醛清漆・烷基型縮水甘油醚型環氧樹脂;使於茀環之9位鍵結有2個苯酚骨架,且自該等苯酚骨架之羥基去除氫原子所得之氧原子分別直接或經由伸烷氧基鍵結有縮水甘油基之環氧化合物等。Examples of the above-mentioned aromatic epoxy compounds include those obtained by condensation reaction of bisphenols [for example, bisphenol A, bisphenol F, bisphenol S, bisphenol fennel, etc.] and epihalohydrin. Epi-Bis type glycidyl ether type epoxy resin; high-molecular weight Epi-Bis type glycidyl ether obtained by further performing addition reaction of these Epi-Bis type glycidyl ether type epoxy resins with the above-mentioned bisphenols Type epoxy resin; Formaldehyde, acetaldehyde, benzaldehyde, hydroxybenzaldehyde, willow aldehyde, etc.] polyols obtained by condensation reaction and epihalohydrin condensation reaction obtained novolak · alkyl type glycidyl ether type epoxy resin; Two phenol skeletons are bonded to the 9-position of the oxene ring, and the oxygen atoms obtained by removing hydrogen atoms from the hydroxyl groups of the phenol skeletons are respectively bonded to glycidyl groups directly or through alkyleneoxy groups. Epoxy compounds, etc.
作為上述脂肪族環氧化合物,例如可列舉:不具有q價環狀結構之醇(q為自然數)之縮水甘油醚;一元或多元羧酸[例如,乙酸、丙酸、丁酸、硬脂酸、己二酸、癸二酸、順丁烯二酸、伊康酸等]之縮水甘油酯;環氧化亞麻籽油、環氧化大豆油、環氧化蓖麻油等具有雙鍵之油脂之環氧化物;環氧化聚丁二烯等聚烯烴(包含聚二烯烴)之環氧化物等。再者,作為上述不具有q價環狀結構之醇,例如可列舉:甲醇、乙醇、1-丙醇、異丙醇、1-丁醇等一元醇;乙二醇、1,2-丙二醇、1,3-丙二醇、1,4-丁二醇、新戊二醇、1,6-己二醇、二乙二醇、三乙二醇、四乙二醇、二丙二醇、聚乙二醇、聚丙二醇等二元醇;甘油、二甘油、赤藻糖醇、三羥甲基乙烷、三羥甲基丙烷、新戊四醇、二新戊四醇、山梨糖醇等三多以上之多元醇等。又,q元醇可為聚醚多元醇、聚酯多元醇、聚碳酸酯多元醇、聚烯烴多元醇等。As the above-mentioned aliphatic epoxy compounds, for example, glycidyl ethers of alcohols (q is a natural number) not having a q-valent ring structure; monobasic or polycarboxylic acids [for example, acetic acid, propionic acid, butyric acid, stearic acid glycidyl esters of adipic acid, adipic acid, sebacic acid, maleic acid, itaconic acid, etc.]; epoxy resins of oils with double bonds, such as epoxidized linseed oil, epoxidized soybean oil, epoxidized castor oil, etc. compounds; epoxides of polyolefins (including polydienes) such as epoxidized polybutadiene, etc. Furthermore, examples of alcohols that do not have a q-valent ring structure include: monohydric alcohols such as methanol, ethanol, 1-propanol, isopropanol, and 1-butanol; ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,6-hexanediol, diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, polyethylene glycol, Dihydric alcohols such as polypropylene glycol; glycerin, diglycerin, erythritol, trimethylolethane, trimethylolpropane, neopentylthritol, dipenteoerythritol, sorbitol, etc. Alcohol etc. Also, the q-hydric alcohol may be polyether polyol, polyester polyol, polycarbonate polyol, polyolefin polyol, or the like.
上述環氧化合物可單獨使用一種,亦可組合兩種以上而使用。作為環氧化合物,就硬化物(樹脂層)之表面硬度、彎曲性、彎曲耐久性等觀點而言,較佳為脂環式環氧化合物,更佳為(2)環氧基直接利用單鍵與脂環鍵結之化合物,尤佳為上述式(ii)所表示之化合物[例如可使用商品名「EHPE3150」(Daicel股份有限公司製造)等]。The said epoxy compound may be used individually by 1 type, and may use it in combination of 2 or more types. The epoxy compound is preferably an alicyclic epoxy compound from the viewpoint of the surface hardness, flexibility, and bending durability of the cured product (resin layer), and more preferably (2) an epoxy group that utilizes a single bond directly. The compound bonded to the alicyclic ring is particularly preferably a compound represented by the above formula (ii) [for example, a trade name "EHPE3150" (manufactured by Daicel Co., Ltd.) etc. can be used].
關於上述環氧化合物之含量(摻合量),相對於本發明之聚有機倍半矽氧烷之總量100重量份,例如為0.5〜100重量份,較佳為1〜80重量份,更佳為5〜50重量份。藉由將上述環氧化合物之含量設為0.5重量份以上,有硬化物(樹脂層)之表面硬度進一步增高,柔軟性、可撓性、加工性、彎曲耐久性更優異之傾向。另一方面,藉由將上述環氧化合物之含量設為100重量份以下,有硬化物之耐擦傷性進一步提高之傾向。The content (blending amount) of the above-mentioned epoxy compound is, for example, 0.5 to 100 parts by weight, preferably 1 to 80 parts by weight, more preferably 100 parts by weight of the total amount of the polyorganosilsesquioxane of the present invention. Best is 5~50 parts by weight. By setting the content of the epoxy compound to 0.5 parts by weight or more, the surface hardness of the cured product (resin layer) further increases, and the softness, flexibility, workability, and bending durability tend to be more excellent. On the other hand, there exists a tendency for the abrasion resistance of hardened|cured material to improve more by making content of the said epoxy compound into 100 weight part or less.
(表面具有含(甲基)丙烯醯基之基之二氧化矽粒子) 本發明之硬化性組成物可含有「表面具有含(甲基)丙烯醯基之基之二氧化矽粒子」。表面具有含(甲基)丙烯醯基之基之二氧化矽粒子藉由在二氧化矽粒子之表面存在無數羥基(Si-OH基),且於硬化時該羥基與上述本發明之聚有機倍半矽氧烷進行反應,而提高聚有機倍半矽氧烷於硬化後之交聯密度。又,藉由在硬化時複數個上述二氧化矽粒子中之(甲基)丙烯醯基彼此進行鍵結,而提高硬化後之交聯密度。藉由如此提高硬化後之交聯密度,而提高樹脂層中之耐擦傷性。又,若於樹脂層上設置具有防污性或低反射性等功能之層(功能層),則存在樹脂層與功能層之密接性較弱,而產生功能層之剝離之情形,而存在無所謂再塗佈性之情形。然而,若使用上述二氧化矽粒子,則可賦予再塗佈性,又,亦可改善對於樹脂層表面之設置上述功能層時之加工性(加工適性)。(Silicon dioxide particles with (meth)acryl group-containing groups on the surface) The curable composition of the present invention may contain "silicon dioxide particles having a (meth)acryl group-containing group on the surface". The surface of the silicon dioxide particles having (meth)acryl group-containing groups is due to the presence of numerous hydroxyl groups (Si-OH groups) on the surface of the silicon dioxide particles, and the hydroxyl groups are combined with the above-mentioned polyorganic times of the present invention when hardened. The semisiloxane reacts to increase the crosslink density of the polyorganosilsesquioxane after hardening. In addition, the (meth)acryl groups in the plurality of silica particles are bonded to each other during curing, thereby increasing the crosslink density after curing. By increasing the crosslink density after curing in this way, the scratch resistance in the resin layer is improved. Also, if a layer (functional layer) having functions such as antifouling properties or low reflectivity is provided on the resin layer, the adhesion between the resin layer and the functional layer may be weak, and the functional layer may be peeled off, and there may be cases where it does not matter. The condition of recoatability. However, when the above-mentioned silica particles are used, recoatability can be imparted, and processability (processing suitability) when the above-mentioned functional layer is provided on the surface of the resin layer can also be improved.
進而,認為,上述二氧化矽粒子藉由表面具有(甲基)丙烯醯基,可賦予硬化性組成物之穩定性。上述所謂穩定性係指於硬化前之硬化性組成物之製備階段中,上述二氧化矽粒子與聚有機倍半矽氧烷進行反應,硬化性組成物之黏度不會明顯上升(凝膠化)或固化。於使用於表面不具有含(甲基)丙烯醯基之基等官能基之通常之二氧化矽粒子(SiO2 粒子)之情形時,有二氧化矽粒子彼此凝聚,硬化性組成物進行凝膠化之虞。上述二氧化矽粒子可具有(甲基)丙烯醯基以外之官能基(例如聚矽氧改質基)。再者,(甲基)丙烯醯基為丙烯醯基(丙烯酸基)及甲基丙烯醯基(甲基丙烯酸基)之總稱。Furthermore, it is considered that the above-mentioned silica particles can impart stability to the curable composition by having (meth)acryl groups on the surface. The so-called stability mentioned above means that in the preparation stage of the hardening composition before hardening, the above-mentioned silicon dioxide particles react with polyorganosilsesquioxane, and the viscosity of the hardening composition will not increase significantly (gelation) or curing. In the case of using ordinary silica particles ( SiO2 particles) that do not have functional groups such as (meth)acryl group-containing groups on the surface, the silica particles aggregate with each other, and the curable composition gels The risk of transformation. The above-mentioned silica particles may have functional groups other than (meth)acryl groups (such as polysiloxane modification groups). In addition, (meth)acryl is a generic term for acryl (acryl) and methacryl (methacryl).
上述二氧化矽粒子可使用分散於水或有機溶劑等公知或慣用之通常之分散介質之狀態之分散液(dispersion)。又,可使用使具有含(甲基)丙烯醯基之基之矽烷偶合劑與二氧化矽粒子反應而成者作為上述二氧化矽粒子。作為上述二氧化矽粒子,例如可使用商品名「BYK-LPX22699」、「NANOBYK-3650」、「NANOBYK-3651」、「NANOBYK-3652」(以上為BYK-Chemie Japan股份有限公司製造)。The above-mentioned silica particles can be used as a dispersion in a state of being dispersed in a known or customary general dispersion medium such as water or an organic solvent. Moreover, what made the silica particle react with the silane coupling agent which has a (meth)acryl group containing group can be used as said silica particle. As the above-mentioned silica particles, for example, trade names "BYK-LPX22699", "NANOBYK-3650", "NANOBYK-3651", and "NANOBYK-3652" (the above are manufactured by BYK-Chemie Japan Co., Ltd.) can be used.
上述二氧化矽粒子之粒徑例如為1〜100 nm,較佳為3〜50 nm,更佳為5〜30 nm。The particle size of the above-mentioned silicon dioxide particles is, for example, 1-100 nm, preferably 3-50 nm, more preferably 5-30 nm.
於本發明之硬化性組成物含有表面具有含(甲基)丙烯醯基之基之二氧化矽粒子之情形時,其比率相對於本發明之聚有機倍半矽氧烷100重量份,例如為0.01〜20重量份,較佳為0.05〜15重量份,更佳為0.01〜10重量份,進而較佳為0.2〜5重量份。藉由將上述二氧化矽粒子之比率設為0.01重量份以上,可使樹脂層表面之外觀變得良好,可賦予充分之再塗佈性。又,藉由將二氧化矽粒子之比率設為20重量份以下,可提高樹脂層之表面硬度。When the curable composition of the present invention contains silica particles having a (meth)acryl group-containing group on the surface, the ratio is, for example, relative to 100 parts by weight of the polyorganosilsesquioxane of the present invention, 0.01 to 20 parts by weight, preferably 0.05 to 15 parts by weight, more preferably 0.01 to 10 parts by weight, and more preferably 0.2 to 5 parts by weight. By making the ratio of the said silica particle 0.01 weight part or more, the external appearance of the surface of a resin layer can be made favorable, and sufficient recoatability can be provided. Moreover, the surface hardness of a resin layer can be improved by making the ratio of a silica particle into 20 weight part or less.
(矽丙烯酸酯) 本發明之硬化性組成物可含有「矽丙烯酸酯」。矽丙烯酸酯(聚矽氧丙烯酸酯)係至少具有矽原子與(甲基)丙烯醯基之添加劑之一種。上述矽丙烯酸酯可具有(甲基)丙烯醯基以外之官能基(例如羥基)。上述矽丙烯酸酯可為矽二丙烯酸酯、矽三丙烯酸酯、矽四丙烯酸酯、矽五丙烯酸酯、矽六丙烯酸酯、矽七丙烯酸酯、矽八丙烯酸酯。上述矽丙烯酸酯藉由與上述聚有機倍半矽氧烷一併用於硬化性組成物中,可有效地提高製成樹脂層時之樹脂層表面之交聯密度,具有提高樹脂層之表面之平滑性等外觀,提高表面硬度、耐擦傷性及防污性之性質。再者,(甲基)丙烯醯基為丙烯醯基(丙烯酸基)及甲基丙烯醯基(甲基丙烯酸基)之總稱。(silicon acrylate) The curable composition of the present invention may contain "silicon acrylate". Silicon acrylate (polysiloxane acrylate) is one of the additives with at least silicon atom and (meth)acryl group. The silicon acrylate mentioned above may have a functional group (such as a hydroxyl group) other than the (meth)acryl group. The aforementioned silicon acrylate may be silicon diacrylate, silicon triacrylate, silicon tetraacrylate, silicon pentaacrylate, silicon hexaacrylate, silicon heptaacrylate, or silicon octaacrylate. The above-mentioned silicone acrylate can effectively increase the cross-linking density of the resin layer surface when the resin layer is formed by using the above-mentioned polyorganosilsesquioxane together in the curable composition, and can improve the smoothness of the surface of the resin layer. It improves the appearance of hardness, scratch resistance and anti-fouling properties of the surface. In addition, (meth)acryl is a generic term for acryl (acryl) and methacryl (methacryl).
上述矽丙烯酸酯可使用分散於有機溶劑(例如丙酮、甲苯、甲醇、乙醇)等公知或慣用之通常之分散介質之狀態之分散液(dispersion)。作為矽丙烯酸酯,例如可使用商品名「KRM8479」、「EBECRYL 350」、「EBECRYL 1360」(Daicel-allnex股份有限公司製造)。The above-mentioned silicone acrylate can be used as a dispersion in a state of being dispersed in a well-known or customary normal dispersion medium such as an organic solvent (eg, acetone, toluene, methanol, ethanol). As the silicon acrylate, for example, trade names "KRM8479", "EBECRYL 350", and "EBECRYL 1360" (manufactured by Daicel-allnex Co., Ltd.) can be used.
於本發明之硬化性組成物含有上述矽丙烯酸酯之情形時,其比率相對於上述聚有機倍半矽氧烷100重量份,例如為0.01〜15重量份,較佳為0.05〜10重量份,更佳為0.01〜5重量份,進而較佳為0.2〜3重量份。藉由將上述矽丙烯酸酯之比率設為0.01重量份以上,可提高製成樹脂層時之耐擦傷性與防污性。又,藉由將矽丙烯酸酯之比率設為15重量份以下,可進一步提高製成樹脂層時之表面硬度。When the curable composition of the present invention contains the above-mentioned silicone acrylate, its ratio is, for example, 0.01 to 15 parts by weight, preferably 0.05 to 10 parts by weight, relative to 100 parts by weight of the above-mentioned polyorganosilsesquioxane, More preferably 0.01~5 parts by weight, more preferably 0.2~3 parts by weight. When the ratio of the above-mentioned silicon acrylate is 0.01 parts by weight or more, scratch resistance and antifouling property can be improved when it is made into a resin layer. Moreover, by making the ratio of silicon acrylate into 15 weight part or less, the surface hardness at the time of making it into a resin layer can be raised further.
就進一步提高樹脂層之外觀,提高表面硬度,提高耐擦傷性之方面而言,較佳為使用矽丙烯酸酯與表面具有含(甲基)丙烯醯基之基之二氧化矽粒子兩者。關於含有矽丙烯酸酯與上述二氧化矽粒子之兩者之情形時之矽丙烯酸酯與上述二氧化矽粒子之合計之比率,相對於上述聚有機倍半矽氧烷100重量份,例如為0.01〜20重量份,較佳為0.05〜15重量份,更佳為0.01〜10重量份,進而較佳為0.2〜5重量份。藉由將上述比率設為0.01重量份以上,可提高製成樹脂層時之耐擦傷性。又,藉由將上述比率設為20重量份以下,可進一步提高製成樹脂層時之表面硬度。In terms of further improving the appearance of the resin layer, increasing the surface hardness, and improving the scratch resistance, it is preferable to use both silicon acrylate and silicon dioxide particles having a (meth)acryl group-containing group on the surface. Regarding the case where both of the silicon acrylate and the above-mentioned silicon dioxide particles are contained, the ratio of the silicon acrylate to the total of the above-mentioned silicon dioxide particles is, for example, 0.01 to 100 parts by weight of the above-mentioned
(調平劑) 本發明之硬化性組成物可具有調平劑。作為上述調平劑,例如可列舉:聚矽氧系調平劑、氟系調平劑、具有羥基之聚矽氧系調平劑等。其中,調平劑係設為不含上述含氟之光聚合性樹脂者。(leveling agent) The curable composition of the present invention may have a leveling agent. As said leveling agent, the silicone type leveling agent which has a hydroxyl group etc. are mentioned, for example. Among them, the leveling agent is set not to contain the above-mentioned fluorine-containing photopolymerizable resin.
作為上述聚矽氧系調平劑,可使用市售之聚矽氧系調平劑,例如可使用商品名「BYK-300」、「BYK-301/302」、「BYK-306」、「BYK-307」、「BYK-310」、「BYK-315」、「BYK-313」、「BYK-320」、「BYK-322」、「BYK-323」、「BYK-325」、「BYK-330」、「BYK-331」、「BYK-333」、「BYK-337」、「BYK-341」、「BYK-344」、「BYK-345/346」、「BYK-347」、「BYK-348」、「BYK-349」、「BYK-370」、「BYK-375」、「BYK-377」、「BYK-378」、「BYK-UV3500」、「BYK-UV3510」、「BYK-UV3570」、「BYK-3550」、「BYK-SILCLEAN3700」、「BYK-SILCLEAN3720」(以上為BYK-Chemie Japan股份有限公司製造);商品名「AC FS 180」、「AC FS 360」、「ACS 20」(以上為Algin Chemie製造);商品名「Polyflow KL-400X」、「Polyflow KL-400HF」、「Polyflow KL-401」、「Polyflow KL-402」、「Polyflow KL-403」、「Polyflow KL-404」(以上為共榮社化學股份有限公司製造);商品名「KP-323」、「KP-326」、「KP-341」、「KP-104」、「KP-110」、「KP-112」(以上為信越化學工業股份有限公司製造);商品名「LP-7001」、「LP-7002」、「8032 ADDITIVE」、「57 ADDITIVE」、「L-7604」、「FZ-2110」、「FZ-2105」、「67 ADDITIVE」、「8618 ADDITIVE」、「3 ADDITIVE」、「56 ADDITIVE」(以上為Dow Corning Toray股份有限公司製造)等市售品。As the silicone-based leveling agent, commercially available silicone-based leveling agents can be used, for example, the product names "BYK-300", "BYK-301/302", "BYK-306", "BYK -307", "BYK-310", "BYK-315", "BYK-313", "BYK-320", "BYK-322", "BYK-323", "BYK-325", "BYK-330 ", "BYK-331", "BYK-333", "BYK-337", "BYK-341", "BYK-344", "BYK-345/346", "BYK-347", "BYK-348 ", "BYK-349", "BYK-370", "BYK-375", "BYK-377", "BYK-378", "BYK-UV3500", "BYK-UV3510", "BYK-UV3570", "BYK-3550", "BYK-SILCLEAN3700", "BYK-SILCLEAN3720" (the above are manufactured by BYK-Chemie Japan Co., Ltd.); product names "AC FS 180", "AC FS 360", "ACS 20" (the above manufactured for Algin Chemie); trade names "Polyflow KL-400X", "Polyflow KL-400HF", "Polyflow KL-401", "Polyflow KL-402", "Polyflow KL-403", "Polyflow KL-404" ( The above are manufactured by Kyoeisha Chemical Co., Ltd.); trade names "KP-323", "KP-326", "KP-341", "KP-104", "KP-110", "KP-112" ( The above are manufactured by Shin-Etsu Chemical Co., Ltd.); trade names "LP-7001", "LP-7002", "8032 ADDITIVE", "57 ADDITIVE", "L-7604", "FZ-2110", "FZ- 2105", "67 ADDITIVE", "8618 ADDITIVE", "3 ADDITIVE", "56 ADDITIVE" (manufactured by Dow Corning Toray Co., Ltd.).
作為上述氟系調平劑,可使用市售之氟系調平劑,例如可使用商品名「OPTOOL DSX」、「OPTOOL DAC-HP」(以上為Daikin Industries股份有限公司製造);商品名「Surflon S-242」、「Surflon S-243」、「Surflon S-420」、「Surflon S-611」、「Surflon S-651」、「Surflon S-386」(以上為AGC Seimi Chemical股份有限公司製造);商品名「BYK-340」(BYK-Chemie Japan股份有限公司製造);商品名「AC110a」、「AC100a」(以上為Algin Chemie製造);商品名「MEGAFAC F-114」、「MEGAFAC F-410」、「MEGAFAC F-444」、「MEGAFAC EXP TP-2066」、「MEGAFAC F-430」、「MEGAFAC F-472SF」、「MEGAFAC F-477」、「MEGAFAC F-552」、「MEGAFAC F-553」、「MEGAFAC F-554」、「MEGAFAC F-555」、「MEGAFAC R-94」、「MEGAFAC RS-72-K」、「MEGAFAC RS-75」、「MEGAFAC F-556」、「MEGAFAC EXP TF-1367」、「MEGAFAC EXP TF-1437」、「MEGAFAC F-558」、「MEGAFAC EXP TF-1537」(以上為DIC股份有限公司製造);商品名「FC-4430」、「FC-4432」(以上為Sumitomo 3M股份有限公司製造);商品名「Ftergent 100」、「Ftergent 100C」、「Ftergent 110」、「Ftergent 150」、「Ftergent 150CH」、「Ftergent A-K」、「Ftergent 501」、「Ftergent 250」、「Ftergent 251」、「Ftergent 222F」、「Ftergent 208G」、「Ftergent 300」、「Ftergent 310」、「Ftergent 400SW」(以上為NEOS股份有限公司製造);商品名「PF-136A」、「PF-156A」、「PF-151N」、「PF-636」、「PF-6320」、「PF-656」、「PF-6520」、「PF-651」、「PF-652」、「PF-3320」(以上為北村化學產業股份有限公司製造)等市售品。As the above-mentioned fluorine-based leveling agent, a commercially available fluorine-based leveling agent can be used, for example, the trade name "OPTOOL DSX", "OPTOOL DAC-HP" (the above are manufactured by Daikin Industries Co., Ltd.); the trade name "Surflon S-242", "Surflon S-243", "Surflon S-420", "Surflon S-611", "Surflon S-651", "Surflon S-386" (manufactured by AGC Seimi Chemical Co., Ltd.) ; Trade name "BYK-340" (manufactured by BYK-Chemie Japan Co., Ltd.); Trade name "AC110a", "AC100a" (the above are manufactured by Algin Chemie); Trade name "MEGAFAC F-114", "MEGAFAC F-410 ", "MEGAFAC F-444", "MEGAFAC EXP TP-2066", "MEGAFAC F-430", "MEGAFAC F-472SF", "MEGAFAC F-477", "MEGAFAC F-552", "MEGAFAC F-553 ", "MEGAFAC F-554", "MEGAFAC F-555", "MEGAFAC R-94", "MEGAFAC RS-72-K", "MEGAFAC RS-75", "MEGAFAC F-556", "MEGAFAC EXP TF -1367", "MEGAFAC EXP TF-1437", "MEGAFAC F-558", "MEGAFAC EXP TF-1537" (manufactured by DIC Corporation); trade names "FC-4430", "FC-4432" ( The above are manufactured by Sumitomo 3M Co., Ltd.); trade names "Ftergent 100", "Ftergent 100C", "Ftergent 110", "Ftergent 150", "Ftergent 150CH", "Ftergent A-K", "Ftergent 501", "Ftergent 250 ", "Ftergent 251", "Ftergent 222F", "Ftergent 208G", "Ftergent 300", "Ftergent 310", "Ftergent 400SW" (manufactured by NEOS Co., Ltd.); product names "PF-136A", " PF-156A", "PF-151N", "PF-636", "PF-6320", "PF-656", "PF-652 0", "PF-651", "PF-652", "PF-3320" (manufactured by Kitamura Chemical Co., Ltd.) and other commercially available products.
作為上述具有羥基之聚矽氧系調平劑,例如可列舉:於聚有機矽氧烷骨架(聚二甲基矽氧烷等)之主鏈或側鏈導入有聚醚基之聚醚改質聚有機矽氧烷、於聚有機矽氧烷骨架之主鏈或側鏈導入有聚酯基之聚酯改質聚有機矽氧烷、向(甲基)丙烯酸系樹脂中導入有聚有機矽氧烷之聚矽氧改質(甲基)丙烯酸系樹脂等。該等調平劑中,羥基可具有聚有機矽氧烷骨架,亦可具有聚醚基、聚酯基。作為此種調平劑之市售品,例如可使用商品名「BYK-370」、「BYK-SILCLEAN3700」、「BYK-SILCLEAN3720」等。Examples of the above-mentioned polysiloxane-based leveling agent having a hydroxyl group include polyether-modified polyether groups introduced into the main chain or side chain of polyorganosiloxane skeleton (polydimethylsiloxane, etc.) Polyorganosiloxane, polyester-modified polyorganosiloxane with polyester group introduced into the main chain or side chain of polyorganosiloxane skeleton, polyorganosiloxane introduced into (meth)acrylic resin Alkanes polysiloxane modified (meth)acrylic resin, etc. In these leveling agents, the hydroxyl group may have a polyorganosiloxane skeleton, and may also have a polyether group or a polyester group. As a commercial item of such a leveling agent, a brand name "BYK-370", "BYK-SILCLEAN3700", "BYK-SILCLEAN3720" etc. can be used, for example.
於本發明之硬化性組成物含有上述調平劑之情形時,其比率相對於本發明之聚有機倍半矽氧烷100重量份,例如為0.01〜20重量份,較佳為0.05〜15重量份,更佳為0.01〜10重量份,進而較佳為0.2〜5重量份。若調平劑之比率過少,則有樹脂層之表面平滑性降低之虞,若過多則有樹脂層之表面硬度降低之虞。When the curable composition of the present invention contains the aforementioned leveling agent, its ratio is, for example, 0.01 to 20 parts by weight, preferably 0.05 to 15 parts by weight, relative to 100 parts by weight of the polyorganosilsesquioxane of the present invention. part, more preferably 0.01 to 10 parts by weight, and more preferably 0.2 to 5 parts by weight. When there is too little ratio of a leveling agent, the surface smoothness of a resin layer may fall, and when too much, the surface hardness of a resin layer may fall.
本發明之硬化性組成物中,進而,作為其他任意成分,可含有沈澱二氧化矽、濕式二氧化矽、煙製二氧化矽(fumed silica)、焙燒二氧化矽、氧化鈦、氧化鋁、玻璃、石英、鋁矽酸、氧化鐵、氧化鋅、碳酸鈣、碳黑、碳化矽、氮化矽、氮化硼等無機質填充劑、利用有機鹵矽烷、有機烷氧基矽烷、有機矽氮烷等有機矽化合物對該等填充劑進行了處理之無機質填充劑;聚矽氧樹脂、環氧樹脂、氟樹脂等有機樹脂微粉末;銀、銅等導電性金屬粉末等填充劑、硬化助劑、溶劑(有機溶劑等)、穩定劑(抗氧化劑、紫外線吸收劑、耐光穩定劑、熱穩定劑、重金屬減活劑等)、難燃劑(磷系難燃劑、鹵素系難燃劑、無機系難燃劑等)、難燃助劑、補強材(其他填充劑等)、成核劑、偶合劑(矽烷偶合劑等)、潤滑劑、蠟、塑化劑、脫模劑、耐衝擊改良劑、色相改良劑、透明化劑、流變調整劑(流動性改良劑等)、加工性改良劑、著色劑(染料、顏料等)、防靜電劑、分散劑、消泡劑、抗針孔劑、表面改質劑(滑劑(slipping agent)等)、消光劑、消泡劑、抑泡劑、脫泡劑、抗菌劑、防腐劑、黏度調整劑、增黏劑、光敏劑、發泡劑等慣用之添加劑。該等添加劑可單獨使用1種、或組合2種以上而使用。The curable composition of the present invention may further contain, as other optional components, precipitated silica, wet silica, fumed silica, calcined silica, titanium oxide, aluminum oxide, Glass, quartz, aluminosilicate, iron oxide, zinc oxide, calcium carbonate, carbon black, silicon carbide, silicon nitride, boron nitride and other inorganic fillers, using organohalosilane, organoalkoxysilane, organosilazane Inorganic fillers treated with such fillers as organosilicon compounds; fine powders of organic resins such as polysiloxane resins, epoxy resins, and fluororesins; fillers such as conductive metal powders such as silver and copper, hardening aids, Solvents (organic solvents, etc.), stabilizers (antioxidants, ultraviolet absorbers, light-resistant stabilizers, heat stabilizers, heavy metal deactivators, etc.), flame retardants (phosphorus-based flame retardants, halogen-based flame retardants, inorganic-based Flame retardants, etc.), flame retardant additives, reinforcing materials (other fillers, etc.), nucleating agents, coupling agents (silane coupling agents, etc.), lubricants, waxes, plasticizers, mold release agents, impact modifiers , Hue modifiers, clearing agents, rheology modifiers (fluidity modifiers, etc.), processability modifiers, colorants (dyes, pigments, etc.), antistatic agents, dispersants, defoamers, anti-pinhole agents , surface modifier (slipping agent, etc.), matting agent, defoamer, foam suppressor, defoamer, antibacterial agent, preservative, viscosity regulator, tackifier, photosensitizer, foaming agent and other commonly used additives. These additives may be used alone or in combination of two or more.
(硬化性組成物之製造方法) 本發明之硬化性組成物並無特別限定,可藉由將上述各成分一邊於室溫或視需要加熱,一邊攪拌、混合而製備。再者,硬化性組成物可用作直接使用預先混合有各成分者之1液系之組成物,例如亦可用作於使用前以特定之比率混合分別預先保管之2種以上之成分而使用之多液系(例如為2液系)之組成物。(Manufacturing method of curable composition) The curable composition of the present invention is not particularly limited, and can be prepared by stirring and mixing the above-mentioned components while heating at room temperature or if necessary. Furthermore, the curable composition can be used as a one-liquid composition in which each component is pre-mixed as it is, for example, it can also be used as a mixture of two or more components stored in advance at a specific ratio before use. Composition of multi-liquid system (for example, 2-liquid system).
本發明之硬化性組成物並無特別限定,較佳為於常溫(約25℃)為液體。更具體而言,上述硬化性組成物以稀釋為溶劑20%之液體[尤其是甲基異丁基酮之比率為20重量%之硬化性組成物(溶液)]於25℃之黏度計,較佳為300〜20000 mPa・s,更佳為500〜10000 mPa・s,進而較佳為1000〜8000 mPa・s。藉由將上述黏度設為300 mPa・s以上,有樹脂層之耐熱性進一步提高之傾向。另一方面,藉由將上述黏度設為20000 mPa・s以下,有容易進行硬化性組成物之製備或使用,又,於樹脂層中不易殘留氣泡之傾向。再者,硬化性組成物之黏度係使用黏度計(商品名「MCR301」、Anton Paar公司製造),於擺動角5%、頻率0.1〜100(1/s)、溫度:25℃之條件下進行測定。The curable composition of the present invention is not particularly limited, but is preferably liquid at room temperature (about 25°C). More specifically, the above-mentioned curable composition is measured by the viscosity at 25°C of a liquid diluted to 20% of a solvent [especially a curable composition (solution) with a ratio of 20% by weight of methyl isobutyl ketone]. It is preferably 300 to 20000 mPa·s, more preferably 500 to 10000 mPa·s, and still more preferably 1000 to 8000 mPa·s. There exists a tendency for the heat resistance of a resin layer to improve further by making the said viscosity into 300 mPa*s or more. On the other hand, by setting the above-mentioned viscosity to 20000 mPa·s or less, it tends to be easy to prepare or use the curable composition, and it tends to make it difficult for air bubbles to remain in the resin layer. Furthermore, the viscosity of the curable composition was measured using a viscometer (trade name "MCR301", manufactured by Anton Paar Co., Ltd.) under the conditions of a swing angle of 5%, a frequency of 0.1 to 100 (1/s), and a temperature of 25°C. Determination.
本發明中之樹脂層可藉由進行上述硬化性組成物中所含之陽離子硬化性化合物(本發明之聚有機倍半矽氧烷等)之聚合反應,使之硬化而獲得。The resin layer in the present invention can be obtained by polymerizing the cation-curable compound (polyorganosilsesquioxane of the present invention, etc.) contained in the above-mentioned curable composition and curing it.
為了進一步提高樹脂層之再塗佈性,可對樹脂層之表面進行藉由電暈放電照射而使表面改質之電暈放電處理、電漿放電處理、臭氧暴露處理、準分子處理等表面處理。其中,就可容易地提高再塗佈性之方面而言,更佳為電暈放電處理。In order to further improve the recoatability of the resin layer, surface treatments such as corona discharge treatment, plasma discharge treatment, ozone exposure treatment, and excimer treatment can be performed on the surface of the resin layer to modify the surface by corona discharge irradiation. . Among them, corona discharge treatment is more preferable at the point that recoatability can be easily improved.
電暈放電處理係藉由在較尖之電極(針電極)之周圍產生不均勻之電場,產生持續之放電,而對樹脂層表面進行加工之處理。電漿放電處理係藉由在大氣中進行放電,產生活化之正與負之帶電粒子,而對樹脂層表面進行加工之處理。臭氧暴露處理例如係於氧存在下藉由使用低壓水銀燈等之紫外線照射產生臭氧,而對樹脂層表面進行加工之處理。準分子處理係於真空狀態下利用使用準分子燈之紫外線照射或雷射照射,而對樹脂層表面進行加工之處理。Corona discharge treatment is to process the surface of the resin layer by generating an uneven electric field around the sharper electrode (needle electrode) to generate a continuous discharge. Plasma discharge treatment is the process of processing the surface of the resin layer by discharging in the atmosphere to generate activated positive and negative charged particles. The ozone exposure treatment is, for example, a treatment of processing the surface of the resin layer by generating ozone by ultraviolet irradiation using a low-pressure mercury lamp or the like in the presence of oxygen, for example. Excimer treatment is a process of processing the surface of the resin layer by ultraviolet irradiation or laser irradiation using an excimer lamp in a vacuum state.
作為可設置於樹脂層上之功能層,例如可列舉具有耐擦傷性、耐磨耗性、防污性(耐污染性)、防指紋性、抗反射性(低反射性)等功能之層。功能層係於行動電話或智慧型手機等顯示裝置中之樹脂層中所使用之具有上述中所列舉之功能之通常之公知或慣用之功能層。作為構成功能層之材料,例如可列舉:丙烯酸系材料、氟系材料、聚矽氧系材料。作為於樹脂層上設置功能層之方法,可列舉利用與下述積層膜同樣之塗佈之方法、利用蒸鍍或濺鍍等之方法。Examples of the functional layer that can be provided on the resin layer include layers having functions such as scratch resistance, abrasion resistance, stain resistance (stain resistance), fingerprint resistance, and antireflection (low reflection). The functional layer is a commonly known or customary functional layer that has the functions listed above and is used in the resin layer of display devices such as mobile phones or smart phones. Examples of materials constituting the functional layer include: acrylic-based materials, fluorine-based materials, and polysiloxane-based materials. As a method of providing the functional layer on the resin layer, a method using the same coating method as the laminated film described below, a method using vapor deposition or sputtering, and the like are exemplified.
(積層膜之製造方法) 本發明之積層膜可依據公知或慣用之硬塗膜之製造方法而製造,其製造方法並無特別限定,可藉由如下方法而製造:藉由向支持體之至少一面塗佈上述硬化性組成物,使硬化性組成物硬化而形成樹脂層。(Manufacturing method of laminated film) The laminated film of the present invention can be produced according to known or customary hard coating film production methods, and the production method is not particularly limited, and can be produced by the following method: by coating the above-mentioned curable composition on at least one side of the support material to form a resin layer by curing the curable composition.
上述樹脂層之硬化方法可自周知之方法中適當加以選擇,例如可列舉活性能量線之照射及/或加熱之方法。作為上述活性能量線,例如亦可使用紅外線、可見光、紫外線、X射線、電子束、α射線、β射線、γ射線等中之任一種。其中,就使用性優異之方面而言,較佳為紫外線。The curing method of the above-mentioned resin layer can be appropriately selected from known methods, for example, a method of irradiating and/or heating an active energy ray can be mentioned. As the above-mentioned active energy rays, for example, any one of infrared rays, visible light, ultraviolet rays, X-rays, electron beams, α rays, β rays, and γ rays may be used. Among them, ultraviolet rays are preferable in terms of excellent usability.
上述樹脂層之利用活性能量線之照射之硬化條件可根據所照射之活性能量線之種類或能量、樹脂層之形狀或尺寸等而適當加以調整,並無特別限定,於照射紫外線之情形時,例如較佳為設為1〜1000 mJ/cm2 左右。再者,活性能量線之照射例如可使用高壓水銀燈、超高壓水銀燈、氙燈、碳弧、金屬鹵化物燈、太陽光、LED燈、雷射等。於活性能量線之照射後,可進而實施加熱處理(退火、老化)而進而進行硬化反應。The hardening conditions of the above-mentioned resin layer by irradiation of active energy rays can be appropriately adjusted according to the type or energy of the irradiated active energy rays, the shape or size of the resin layer, etc., and are not particularly limited. In the case of ultraviolet ray irradiation, For example, it is preferably about 1 to 1000 mJ/cm 2 . Furthermore, for the irradiation of active energy rays, for example, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, carbon arcs, metal halide lamps, sunlight, LED lamps, lasers, etc. can be used. After the irradiation of active energy rays, heat treatment (annealing, aging) may be further performed to further progress the hardening reaction.
上述樹脂層中之利用加熱之硬化之條件並無特別限定,例如較佳為30〜200℃,更佳為50〜190℃。硬化時間可適當加以設定。Conditions for hardening by heating in the above-mentioned resin layer are not particularly limited, for example, preferably 30 to 200°C, more preferably 50 to 190°C. The hardening time can be appropriately set.
本發明之積層膜由於係由可撓性及加工性優異之樹脂層所構成,故而能夠以輥對輥方式製造。藉由以輥對輥方式製造本發明之積層膜,可顯著提高其生產性。作為以輥對輥方式製造本發明之積層膜之方法,可採用公知或慣用之輥對輥方式之製造方法,並無特別限定,可列舉如下之方法等:包括捲出捲成輥狀之支持體之步驟(步驟A);藉由向所捲出之支持體之至少一表面塗佈硬化性組成物,繼而,視需要藉由乾燥去除溶劑後,使該硬化性組成物硬化而形成樹脂層之步驟(步驟B);及其後,再次將所獲得之積層物捲取為輥之步驟(步驟C)作為必需之步驟,並連續地實施該等步驟(步驟A〜C)。再者,該方法亦可包括步驟A〜C以外之步驟。The laminated film of the present invention can be produced by a roll-to-roll method because it is composed of a resin layer excellent in flexibility and processability. By producing the laminated film of the present invention in a roll-to-roll manner, its productivity can be significantly improved. As a method of manufacturing the laminated film of the present invention in a roll-to-roll manner, a known or conventional manufacturing method of a roll-to-roll manner can be used, and there is no particular limitation, and the following methods can be exemplified: The step of the body (step A); by applying a curable composition to at least one surface of the unrolled support, and then, if necessary, drying the solvent to remove the curable composition to harden to form a resin layer The step (step B); and thereafter, the step of rewinding the obtained laminate into a roll (step C) is taken as a necessary step, and these steps are carried out continuously (steps A~C). Furthermore, the method may also include steps other than steps A to C.
[可折器件] 本發明之積層膜由於具有較高之表面硬度與優異之彎曲耐久性,故而除通常之圖像顯示裝置之表面保護材以外,可適宜地用作反覆摺疊而使用之可折器件之表面保護材。 於可撓性器件中例如包含智慧型手機或平板或可佩戴式終端等行動資訊終端等,例如,本發明之積層膜包含該等可撓性器件用之顯示器(例如觸控面板、可佩戴式終端、有機EL顯示器等中所使用之顯示器)之保護膜、障壁膜、TFT基板等。本發明之可折器件由於具備彎曲耐久性優異之本發明之積層膜,故而即便反覆彎曲-伸展亦不會於樹脂層產生龜裂,可靠性優異。又,具備透明性優異之上述積層膜之行動資訊終端等可折器件之視認性優異。 [實施例][foldable device] Since the laminated film of the present invention has high surface hardness and excellent bending durability, it can be suitably used as a surface protection material for foldable devices that are folded and used in addition to the surface protection materials of ordinary image display devices. . Flexible devices include, for example, mobile information terminals such as smartphones, tablets, or wearable terminals. For example, the laminated film of the present invention includes displays for these flexible devices (such as touch panels, wearable Displays used in terminals, organic EL displays, etc.), protective films, barrier films, TFT substrates, etc. Since the foldable device of the present invention has the laminated film of the present invention having excellent bending durability, no cracks will occur in the resin layer even if it is repeatedly bent and stretched, and it has excellent reliability. In addition, foldable devices such as mobile information terminals provided with the above-mentioned laminated film having excellent transparency have excellent visibility. [Example]
以下,基於實施例更詳細地說明本發明,但本發明並不受該等實施例限定。再者,產物之分子量之測定係利用Alliance HPLC系統 2695(Waters製造)、Refractive Index Detector 2414(Waters製造)、管柱:Tskgel GMHHR -M×2(Tosoh股份有限公司製造)、保護管柱:Tskgel guard column HHR L(Tosoh股份有限公司製造)、管柱烘箱:COLUMN HEATER U-620(Sugai製造)、溶劑:THF、測定條件:40℃而進行。又,產物中之T2體與T3體之比率[T3體/T2體]之測定係藉由利用JEOL ECA500(500 MHz)之29 Si-NMR光譜測定而進行。Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited by these examples. Furthermore, the determination of the molecular weight of the product was performed using Alliance HPLC System 2695 (manufactured by Waters), Refractive Index Detector 2414 (manufactured by Waters), column: Tskgel GMH HR -M×2 (manufactured by Tosoh Co., Ltd.), guard column: Tskgel guard column H HR L (manufactured by Tosoh Co., Ltd.), column oven: COLUMN HEATER U-620 (manufactured by Sugai), solvent: THF, and measurement conditions: 40°C. Also, the ratio [T3 body/T2 body] of the T2 body and the T3 body in the product was measured by 29 Si-NMR spectrum measurement using JEOL ECA500 (500 MHz).
製造例1:含環氧基之低分子量聚有機倍半矽氧烷之製造 向安裝有溫度計、攪拌裝置、回流冷凝器及氮氣導入管之1000毫升之燒瓶(反應容器)中,於氮氣氣流下添加2-(3,4-環氧環己基)乙基三甲氧基矽烷277.2毫莫耳(68.30 g)、苯基三甲氧基矽烷3.0毫莫耳(0.56 g)及丙酮275.4 g,並升溫至50℃。向以上述方式所獲得之混合物中,於5分鐘內添加5%碳酸鉀水溶液7.74 g(以碳酸鉀計為2.8毫莫耳)後,歷時20分鐘添加水2800.0毫莫耳(50.40 g)。再者,於添加之期間未產生顯著之溫度上升。其後,於保持50℃之狀態下,於氮氣氣流下進行縮聚反應5小時。 其後,於將反應溶液冷卻之同時投入甲基異丁基酮137.70 g與5%鹽水100.60 g。將該溶液移至1 L之分液漏斗中,再次投入甲基異丁基酮137.70 g,並進行水洗。分液後,抽出水層,進行水洗直至下層液成為中性,並分取上層液,其後,於1 mmHg、50℃之條件下自上層液中將溶劑蒸餾去除,而獲得75.18 g之含有甲基異丁基酮23重量%之無色透明且液狀之產物(含環氧基之低分子量聚有機倍半矽氧烷)。 對產物進行分析,結果數量平均分子量為2235,分子量分散度為1.54。上述產物之根據29 Si-NMR光譜算出之T2體與T3體之比率[T3體/T2體]為11.9。 分別將所獲得之含環氧基之低分子量聚有機倍半矽氧烷之1 H-NMR圖示於圖3,將29 Si-NMR圖示於圖4。Production example 1: Production of low molecular weight polyorganosilsesquioxane containing epoxy groups Put it in a 1000 ml flask (reaction vessel) equipped with a thermometer, a stirring device, a reflux condenser and a nitrogen gas introduction tube, under a nitrogen stream Add 277.2 millimoles (68.30 g) of 2-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3.0 millimoles (0.56 g) of phenyltrimethoxysilane and 275.4 g of acetone, and heat up to 50°C. After adding 7.74 g (2.8 millimoles as potassium carbonate) of 5% potassium carbonate aqueous solution to the mixture obtained above in 5 minutes, 2800.0 millimoles (50.40 g) of water were added over 20 minutes. Furthermore, no significant temperature rise occurred during the addition. Thereafter, polycondensation reaction was performed for 5 hours under a nitrogen gas flow while maintaining 50°C. Then, while cooling the reaction solution, 137.70 g of methyl isobutyl ketone and 100.60 g of 5% saline were injected. This solution was transferred to a 1 L separating funnel, and 137.70 g of methyl isobutyl ketone was added again, followed by washing with water. After liquid separation, extract the water layer, wash with water until the lower layer becomes neutral, and separate the upper layer, then distill off the solvent from the upper layer under the conditions of 1 mmHg and 50°C to obtain 75.18 g of A colorless, transparent and liquid product of 23% by weight of methyl isobutyl ketone (epoxy group-containing low molecular weight polyorganosilsesquioxane). The product was analyzed, and the number average molecular weight was 2235, and the molecular weight dispersion was 1.54. The ratio [T3 body/T2 body] of the above product calculated from the 29 Si-NMR spectrum was 11.9. The 1 H-NMR chart and the 29 Si-NMR chart of the obtained epoxy group-containing low-molecular-weight polyorganosilsesquioxane obtained are shown in FIG. 3 , respectively.
製造例2:含環氧基之高分子量聚有機倍半矽氧烷之製造
向安裝有溫度計、攪拌裝置、回流冷凝器及氮氣導入管之1000毫升之燒瓶(反應容器)中,於氮氣氣流下添加含有於製造例1中所獲得之含環氧基之低分子量聚有機倍半矽氧烷之混合物(75 g),相對於含環氧基之低分子量聚有機倍半矽氧烷之實質含量添加氫氧化鉀100 ppm(5.6 mg)、水2000 ppm(112 mg),於在80℃加熱18小時之時間點進行取樣並測定分子量,結果數量平均分子量Mn上升至6000,其後冷卻至室溫,添加甲基異丁基酮300 mL,並添加水300 mL,反覆水洗,藉此去除鹼成分並濃縮,如此獲得74.5 g之含有甲基異丁基酮25重量%之無色透明且液狀之產物(含環氧基之高分子量聚有機倍半矽氧烷1)。
對產物進行分析,結果數量平均分子量為6176,分子量分散度為2.31。上述產物之根據29
Si-NMR光譜算出之T2體與T3體之比率[T3體/T2體]為50.2。
分別將所獲得之含環氧基之高分子量聚有機倍半矽氧烷1之1
H-NMR圖示於圖5,將29
Si-NMR圖示於圖6。Production Example 2: Production of High Molecular Weight Polyorganosilsesquioxane Containing Epoxy Groups Into a 1000 ml flask (reaction vessel) equipped with a thermometer, a stirring device, a reflux condenser and a nitrogen introduction tube, under a nitrogen stream Add the mixture (75 g) containing the epoxy-group-containing low-molecular-weight polyorganosilsesquioxane obtained in Production Example 1, relative to the substantial content of the epoxy-group-containing low-molecular-weight polyorganosilsesquioxane Add 100 ppm (5.6 mg) of potassium hydroxide and 2,000 ppm (112 mg) of water, take a sample at 80°C for 18 hours and measure the molecular weight. As a result, the number average molecular weight Mn rises to 6,000, and then cools to room temperature , add 300 mL of methyl isobutyl ketone, and add 300 mL of water, wash with water repeatedly, thereby remove the alkali component and concentrate, thus obtaining 74.5 g of a colorless, transparent and liquid product containing 25% by weight of methyl isobutyl ketone Product (high molecular weight polyorganosilsesquioxane containing epoxy group 1). The product was analyzed, and the number average molecular weight was 6176, and the molecular weight dispersion was 2.31. The ratio [T3 body/T2 body] of the above product calculated from the 29 Si-NMR spectrum was 50.2. The 1 H-NMR chart of the obtained epoxy group-containing high
實施例1:硬塗膜之製造
製作表1所示之摻合比之混合溶液,並使用其作為硬塗液(硬化性組成物)。使用線棒塗佈器#14,將上述中所獲得之硬塗液以硬化後之硬塗層之厚度成為10 μm之方式塗佈至PEN膜(商品名「Teonex Q65 HWA」、帝人股份有限公司製造)之表面後,於150℃之烘箱中放置2分鐘,繼而,使用高壓水銀燈(EYE GRAPHICS股份有限公司製造)以600 mJ/cm2
之照度照射紫外線。其後,在150℃進行60分鐘熱處理,藉此使硬塗液之塗敷膜硬化,而製作具有硬塗層之硬塗膜。Example 1: Production of hard coat film A mixed solution having a blending ratio shown in Table 1 was prepared and used as a hard coat liquid (curable composition). Using a wire
[表1]
實施例2〜5:硬塗膜之製造
將硬塗層之厚度變更為20〜50 μm,除此以外,以與實施例1同樣之方式製作硬塗膜。
實施例6:硬塗膜之製造
使用表2所示之摻合比之硬塗液,將硬塗層之厚度變更為40 μm,除此以外,以與實施例1同樣之方式製作硬塗膜。
[表2]
實施例7:硬塗膜之製造
使用表3所示之摻合比之硬塗液,將硬塗層之厚度變更為40 μm,除此以外,以與實施例1同樣之方式製作硬塗膜。
[表3]
實施例8:硬塗膜之製造
使用表4所示之摻合比之硬塗液,將硬塗層之厚度變更為40 μm,除此以外,以與實施例1同樣之方式製作硬塗膜。
[表4]
比較例1〜3:硬塗膜之製造
使用表5所示之摻合比之硬塗液,將硬塗層之厚度變更為40 μm,除此以外,以與實施例1同樣之方式製作硬塗膜。
[表5]
對實施例、比較例中所獲得之硬塗膜進行以下之評價。將結果示於表6。The following evaluation was performed about the hard coat film obtained by the Example and the comparative example. The results are shown in Table 6.
<霧度及全光線穿透率> 使用霧度計(日本電色工業股份有限公司製造、NDH-5000W)而測定上述中所獲得之硬塗膜之霧度及全光線穿透率。<Haze and total light transmittance> The haze and total light transmittance of the hard coating film obtained above were measured using the haze meter (Nippon Denshoku Industries Co., Ltd. make, NDH-5000W).
<表面硬度(鉛筆硬度)> 依據JIS K5600-5-4(750 g荷重)評價上述中所獲得之硬塗膜中之硬塗層表面之鉛筆硬度。<Surface Hardness (Pencil Hardness)> The pencil hardness of the hard coat surface in the hard coat film obtained above was evaluated based on JIS K5600-5-4 (750-g load).
<耐擦傷性> 對上述中所獲得之硬塗膜中之硬塗層表面,以荷重1000 g/cm2 使#0000鋼絲絨往返,確認於硬塗層表面所產生之傷痕之有無,並以至於硬塗層之表面可確認到傷痕為止之次數評價耐擦傷性。再者,於即便往返1000次以上亦未能確認到傷痕之情形時係表示為「1 K<」。<Scratch resistance> For the hard coat surface of the hard coat film obtained above, #0000 steel wool was reciprocated with a load of 1000 g/cm 2 , and the presence or absence of scratches on the hard coat surface was confirmed. As for the surface of the hard coat layer, scratch resistance was evaluated by the number of times until scratches were confirmed. In addition, when the scar was not confirmed even after 1000 round-trips or more, it is indicated as "1 K<".
<彎曲性(1)(圓筒形心軸法)> 關於上述中所獲得之硬塗膜之彎曲性,藉由硬塗表面成為凹陷(內側)之方式,使用圓筒形心軸,並依據JIS K5600-5-1,以於硬塗層之表面未產生龜裂之彎曲半徑(mm)評價彎曲性(1)。<Bending (1) (cylindrical mandrel method)> Regarding the flexibility of the hard coat film obtained above, the surface of the hard coat layer becomes concave (inside), using a cylindrical mandrel, and according to JIS K5600-5-1, the surface of the hard coat layer is not Bendability (1) was evaluated by the bending radius (mm) of cracks.
<彎曲性(2)(圓筒形心軸法)> 關於上述中所獲得之硬塗膜之彎曲性,藉由硬塗表面成為凸起(外側)之方式,使用圓筒形心軸,並依據JIS K5600-5-1,以於硬塗層之表面未產生龜裂之彎曲半徑(mm)評價彎曲性(2)。<Bending (2) (cylindrical mandrel method)> Regarding the flexibility of the hard coat film obtained above, the hard coat surface becomes convex (outside), using a cylindrical mandrel, and according to JIS K5600-5-1, on the surface of the hard coat Bendability (2) was evaluated by bending radius (mm) without cracks.
<連續彎曲耐久性(1)> 使用面狀體無負載U字伸縮試驗機(YUASA SYSTEM股份有限公司製造、Z-044)而測定上述中所獲得之硬塗膜之連續彎曲耐久性。測定係將硬塗層之面設為凹陷(內側),於彎曲半徑2.5 mm、30〜60次/分鐘之速度進行,將至於硬塗層產生龜裂為止之次數設為彎曲耐久性(1)(參照圖1、2)。再者,於即便為100000次以上亦未產生龜裂之情形時係表示為「100 K<」。<Continuous bending durability (1)> The continuous bending durability of the hard coat film obtained above was measured using the planar object no-load U-shaped stretch tester (made by Yuasa System Co., Ltd., Z-044). The measurement is performed with the surface of the hard coat as a depression (inside), at a bending radius of 2.5 mm, at a speed of 30 to 60 times/minute, and the number of times until the hard coat is cracked is defined as the bending durability (1) (Refer to Figures 1 and 2). In addition, when no cracks occurred even after 100,000 times or more, it was expressed as "100 K<".
<彎曲耐久性(2)> 使用面狀體無負載U字伸縮試驗機(YUASA SYSTEM股份有限公司製造、Z-044)而測定上述中所獲得之硬塗膜之連續彎曲耐久性。測定係將硬塗層之面設為凸起(外側),於彎曲半徑4.0 mm、30〜60次/分鐘之速度進行,將至於硬塗層產生龜裂為止之次數設為彎曲耐久性(2)(參照圖1、2)。再者,於即便為100000次以上亦未產生龜裂之情形時係表示為「100 K<」。<Bending durability (2)> The continuous bending durability of the hard coat film obtained above was measured using the planar object no-load U-shaped stretch tester (made by Yuasa System Co., Ltd., Z-044). The measurement is performed with the surface of the hard coat as convex (outside), at a bending radius of 4.0 mm, at a speed of 30 to 60 times per minute, and the number of times until the hard coat is cracked is defined as the bending durability (2 ) (refer to Figure 1, 2). In addition, when no cracks occurred even after 100,000 times or more, it was expressed as "100 K<".
<水接觸角> 藉由液滴法測定上述中所獲得之硬塗膜之表面(硬塗層之表面)的水接觸角(°)。<Water contact angle> The water contact angle (°) of the surface of the hard coat film obtained above (surface of the hard coat layer) was measured by a droplet method.
[表6]
實施例、比較例中所使用之成分係如下所述。 [樹脂] 製造例1:製造例1中所獲得之含環氧基之低分子量聚有機倍半矽氧烷(本發明之聚有機倍半矽氧烷) 200PA-E5:商品名「Epoxy Ester200PA-E5」、三丙二醇二縮水甘油醚半(甲基)丙烯酸酯(分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物)、共榮社化學股份有限公司製造 Lightester G:商品名「Lightester G」、甲基丙烯酸縮水甘油酯(分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物)、共榮社化學股份有限公司製造 EA-1010N:商品名「NK OLIGO EA1010N」、雙酚A環氧半丙烯酸酯(分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物)、新中村化學工業股份有限公司製造 EHPE3150、商品名「EHPE3150」(環氧基直接利用單鍵與脂環鍵結之化合物)、Daicel股份有限公司製造 Celloxide 2021P:商品名「Celloxide 2021P」、3,4-環氧環己基甲基(3,4-環氧基)環己烷羧酸酯、Daicel股份有限公司製造 [聚合起始劑] CPI-310PG:商品名「CPI-310PG」、光陽離子聚合起始劑、San-Apro股份有限公司製造 CPI-210S:商品名「CPI-210S」、光陽離子聚合起始劑、San-Apro股份有限公司製造 [含氟之光聚合性樹脂] FT601ADH2:商品名「Ftergent 601ADH2」、NEOS股份有限公司製造 RS-76-E:商品名「MEGAFAC RS-76-E」、DIC股份有限公司製造 [表面調整劑] Surflon S243:商品名「Surflon S243」(氟系調平劑)、AGC Seimi Chemical股份有限公司製造 [溶劑] MIBK:甲基異丁基酮 MEK:甲基乙基酮Components used in Examples and Comparative Examples are as follows. [resin] Production Example 1: Epoxy-group-containing low-molecular-weight polyorganosilsesquioxane obtained in Production Example 1 (polyorganosilsesquioxane of the present invention) 200PA-E5: Trade name "Epoxy Ester200PA-E5", tripropylene glycol diglycidyl ether hemi(meth)acrylate (a combination of more than one thermally polymerizable functional group and more than one photopolymerizable functional group in the molecule) Compounds), manufactured by Kyorongsha Chemical Co., Ltd. Lightester G: Trade name "Lightester G", glycidyl methacrylate (a compound having one or more thermally polymerizable functional groups and one or more photopolymerizable functional groups in the molecule), Kyoeisha Chemical Co., Ltd. manufacture EA-1010N: trade name "NK OLIGO EA1010N", bisphenol A epoxy hemiacrylate (compound with more than one thermally polymerizable functional group and more than one photopolymerizable functional group in the molecule), Shin Nakamura Chemical Manufacturing Co., Ltd. EHPE3150, trade name "EHPE3150" (a compound in which the epoxy group is directly bonded to an alicyclic ring using a single bond), manufactured by Daicel Co., Ltd. Celloxide 2021P: Trade name "Celloxide 2021P", 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, manufactured by Daicel Co., Ltd. [polymerization initiator] CPI-310PG: Trade name "CPI-310PG", photocationic polymerization initiator, manufactured by San-Apro Co., Ltd. CPI-210S: Trade name "CPI-210S", photocationic polymerization initiator, manufactured by San-Apro Co., Ltd. [Fluorine-containing photopolymerizable resin] FT601ADH2: Trade name "Ftergent 601ADH2", manufactured by NEOS Co., Ltd. RS-76-E: Trade name "MEGAFAC RS-76-E", manufactured by DIC Co., Ltd. [Surface conditioner] Surflon S243: Trade name "Surflon S243" (fluorine-based leveling agent), manufactured by AGC Seimi Chemical Co., Ltd. [solvent] MIBK: methyl isobutyl ketone MEK: methyl ethyl ketone
將上述中所說明之本發明之變化附記於以下。 [1]一種積層膜,其具有支持體、及 積層於該支持體之至少一面之樹脂層,其特徵在於: 該樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足下述(條件1)及(條件2)。 (條件1)上述積層膜之樹脂層表面之JIS K5600-5-4(1999)中所規定的鉛筆硬度試驗(750 g荷重)之鉛筆硬度為F以上。 (條件2)下述彎曲耐久性試驗(1)中之彎曲耐久性(1)為5萬次以上。 彎曲耐久性試驗(1): 將自積層膜展開之狀態,沿樹脂層之面成為凹陷之方向以彎曲半徑成為2.5 mm之方式彎曲180°,並再次展開之動作設為1次,以30〜60次/分鐘之速度進行上述動作時,將直至於積層膜之樹脂層產生龜裂為止之次數設為彎曲耐久性(1)之指標 [2]如上述[1]中所記載之積層膜,其中,上述鉛筆硬度為1 H以上(較佳為2 H以上,更佳為3 H以上,更佳為4 H以上,更佳為5 H以上,更佳為6 H以上,更佳為7 H以上,進而較佳為8 H以上,尤佳為9 H)。 [3]如上述[1]或[2]中所記載之積層膜,其中,上述彎曲耐久性(1)為6萬次以上(較佳為7萬次以上,更佳為8萬次以上,更佳為9萬次以上,更佳為10萬次以上,進而較佳為15萬次以上,尤佳為20萬次以上)。 [4]一種積層膜,其具有支持體、及 積層於該支持體之至少一面之樹脂層,其特徵在於: 該樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)充分滿足下述(條件1)及(條件3)。 (條件1)上述積層膜之樹脂層表面之JIS K5600-5-4(1999)中所規定的鉛筆硬度試驗(750 g荷重)之鉛筆硬度為F以上。 (條件3)下述彎曲耐久性試驗(2)中之彎曲耐久性(2)為1萬次以上。 彎曲耐久性試驗(2): 將自積層膜展開之狀態,沿樹脂層之面凸起之方向以彎曲半徑成為4.0 mm之方式彎曲180°,並再次展開之動作設為1次,以30〜60次/分鐘之速度進行上述動作時,將直至於積層膜之樹脂層產生龜裂為止之次數設為彎曲耐久性(2)之指標 [5]如上述[4]中所記載之積層膜,其中,上述鉛筆硬度為1 H以上(較佳為2 H以上,更佳為3 H以上,更佳為4 H以上,更佳為5 H以上,更佳為6 H以上,更佳為7 H以上,進而較佳為8 H以上,尤佳為9 H)。 [6]如上述[4]或[5]中所記載之積層膜,其中,上述彎曲耐久性(2)為2萬次以上(較佳為3萬次以上,更佳為4萬次以上,更佳為5萬次以上,更佳為6萬次以上,更佳為7萬次以上,更佳為8萬次以上,更佳為9萬次以上,更佳為10萬次以上,進而較佳為15萬次以上,尤佳為20萬次以上)。 [7]如上述[1]至[6]中任一項所記載之積層膜,其中,上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)進而充分滿足下述(條件4)。 (條件4)於積層膜之樹脂層之面成為凸起之JIS K5600-5-1(1999)中所規定之圓筒形心軸試驗中,彎曲半徑為5 mm(較佳為4.5 mm,更佳為4.0 mm,更佳為3.5 mm,更佳為3.0 mm,進而較佳為2.5 mm,尤佳為2.0 mm),且於樹脂層之面未產生龜裂 [8]如上述[1]至[7]中任一項所記載之積層膜,其中,上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)之面的水接觸角為95°以上(較佳為96°以上,更佳為97°以上,更佳為98°以上,更佳為99°以上,更佳為100°以上,更佳為101°以上,更佳為102°以上,更佳為103°以上,進而較佳為104°以上,尤佳為105°以上)。 [9]如上述[1]至[8]中任一項所記載之積層膜,其中,上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)進而充分滿足下述(條件5)。 (條件5)一邊利用#0000號之鋼絲絨施加1 kg/cm2 之荷重,一邊於上述樹脂層之表面往返摩擦30次(較佳為100次,更佳為200次,更佳為300次,更佳為500次,更佳為700次,進而較佳為1000次,尤佳為2000次)之耐鋼絲絨試驗中目測未產生傷痕。 [10]如上述[1]至[9]中任一項所記載之積層膜,其中,上述樹脂層(於在上述支持體之雙面積層有樹脂層之情形時為任一樹脂層)之霧度為1.0%以下(較佳為0.5%以下,更佳為0.1%以下)。Variations of the present invention described above are described below. [1] A laminated film comprising a support and a resin layer laminated on at least one side of the support, characterized in that: the resin layer (in the case of the resin layer being layered on both sides of the above-mentioned support is optional) A resin layer) fully satisfies the following (Condition 1) and (Condition 2). (Condition 1) The pencil hardness of the resin layer surface of the above laminated film in the pencil hardness test (750 g load) stipulated in JIS K5600-5-4 (1999) is F or more. (Condition 2) The bending durability (1) in the following bending durability test (1) is 50,000 times or more. Bending durability test (1): In the state where the self-laminated film is unfolded, it is bent 180° along the direction in which the surface of the resin layer becomes concave with a bending radius of 2.5 mm, and the action of unfolding it again is set once, and the time is 30~ When the above-mentioned operation is performed at a speed of 60 times/minute, the number of times until the resin layer of the laminated film is cracked is used as an index of bending durability (1) [2] The laminated film described in the above [1], Wherein, the above-mentioned pencil hardness is more than 1H (preferably more than 2H, more preferably more than 3H, more preferably more than 4H, more preferably more than 5H, more preferably more than 6H, more preferably 7H above, more preferably above 8 H, especially preferably above 9 H). [3] The laminated film described in [1] or [2] above, wherein the bending durability (1) is 60,000 or more (preferably 70,000 or more, more preferably 80,000 or more, More preferably, it is at least 90,000 times, more preferably at least 100,000 times, further preferably at least 150,000 times, especially preferably at least 200,000 times). [4] A laminated film comprising a support, and a resin layer laminated on at least one side of the support, characterized in that: the resin layer (in the case of the resin layer being layered on both sides of the above-mentioned support is optional) - resin layer) sufficiently satisfy the following (Condition 1) and (Condition 3). (Condition 1) The pencil hardness of the resin layer surface of the above laminated film in the pencil hardness test (750 g load) stipulated in JIS K5600-5-4 (1999) is F or more. (Condition 3) The bending durability (2) in the following bending durability test (2) is 10,000 times or more. Bending durability test (2): In the state where the self-laminated film is unfolded, it is bent 180° along the convex direction of the surface of the resin layer with a bending radius of 4.0 mm, and the action of unfolding it again is set once, and the time is 30~ When the above-mentioned operation is performed at a speed of 60 times/minute, the number of times until the resin layer of the laminated film is cracked is used as an index of bending durability (2) [5] The laminated film described in the above [4], Wherein, the above-mentioned pencil hardness is more than 1H (preferably more than 2H, more preferably more than 3H, more preferably more than 4H, more preferably more than 5H, more preferably more than 6H, more preferably 7H above, more preferably above 8 H, especially preferably above 9 H). [6] The laminated film described in [4] or [5] above, wherein the bending durability (2) is 20,000 or more (preferably 30,000 or more, more preferably 40,000 or more, More preferably at least 50,000 times, more preferably at least 60,000 times, more preferably at least 70,000 times, more preferably at least 80,000 times, more preferably at least 90,000 times, more preferably at least 100,000 times, and even more preferably The best is more than 150,000 times, and the best is more than 200,000 times). [7] The laminated film according to any one of the above [1] to [6], wherein the resin layer (any resin layer when there are resin layers on the double-sided layer of the support) is further The following (condition 4) is fully satisfied. (Condition 4) In the cylindrical mandrel test specified in JIS K5600-5-1 (1999) where the surface of the resin layer of the laminated film becomes convex, the bending radius is 5 mm (preferably 4.5 mm, more Preferably 4.0 mm, more preferably 3.5 mm, more preferably 3.0 mm, more preferably 2.5 mm, especially 2.0 mm), and no cracks occur on the surface of the resin layer [8] as above [1] to The laminated film according to any one of [7], wherein the water contact angle of the surface of the above-mentioned resin layer (when there are resin layers on both sides of the above-mentioned support) is 95° or more (preferably more than 96°, more preferably more than 97°, more preferably more than 98°, more preferably more than 99°, more preferably more than 100°, more preferably more than 101°, more preferably more than 102°, More preferably, it is 103° or more, further preferably, it is 104° or more, and most preferably, it is 105° or more). [9] The laminated film according to any one of the above [1] to [8], wherein the above-mentioned resin layer (any resin layer when there are resin layers on the double-layered layer of the above-mentioned support) is further The following (condition 5) is fully satisfied. (Condition 5) While using #0000 steel wool to apply a load of 1 kg/cm 2 , rub the surface of the above resin layer back and forth 30 times (preferably 100 times, more preferably 200 times, more preferably 300 times) , more preferably 500 times, more preferably 700 times, further preferably 1000 times, especially preferably 2000 times) in the steel wool resistance test, no scratches were visually observed. [10] The laminated film according to any one of the above [1] to [9], wherein the above-mentioned resin layer (any resin layer when there is a resin layer on the double-layered layer of the above-mentioned support) The haze is 1.0% or less (preferably 0.5% or less, more preferably 0.1% or less).
[11]如上述[1]至[10]中任一項所記載之積層膜,其霧度為7%以下(較佳為6%以下,更佳為5%以下,更佳為4%以下,進而較佳為3%以下,尤佳為2%以下,最佳為1%以下)。 [12]如上述[1]至[11]中任一項所記載之積層膜,其全光線穿透率為85%以上(較佳為90%以上)。 [13]如上述[1]至[12]中任一項所記載之積層膜,其厚度(支持體/樹脂層之總厚度)為1〜10000(較佳為10〜1000 μm,更佳為15〜800 μm,進而較佳為20〜700 μm,尤佳為30〜500 μm)。[11] The laminated film described in any one of [1] to [10] above, which has a haze of 7% or less (preferably 6% or less, more preferably 5% or less, more preferably 4% or less , and more preferably 3% or less, especially preferably 2% or less, most preferably 1% or less). [12] The laminated film according to any one of [1] to [11] above, which has a total light transmittance of 85% or more (preferably 90% or more). [13] The laminated film described in any one of the above [1] to [12], which has a thickness (total thickness of the support/resin layer) of 1 to 10000 (preferably 10 to 1000 μm, more preferably 15 to 800 μm, more preferably 20 to 700 μm, especially preferably 30 to 500 μm).
[14]如上述[1]至[13]中任一項所記載之積層膜,其中,上述支持體為聚酯膜(尤其是PET、PEN)、聚醯亞胺膜、環狀聚烯烴膜、聚碳酸酯膜、TAC膜、或PMMA膜(較佳為聚酯膜(尤其是PET、PEN)、或聚醯亞胺膜)。 [15]如上述[1]至[14]中任一項所記載之積層膜,其中,上述支持體之厚度為1〜1000 μm(較佳為5〜500 μm,更佳為10〜400 μm,更佳為15〜400 μm,進而較佳為20〜300 μm,尤佳為25〜200 μm)。 [16]如上述[1]至[15]中任一項所記載之積層膜,其中,上述支持體之霧度為7%以下(較佳為6%以下,更佳為5%以下,更佳為4%以下,進而較佳為3%以下,尤佳為2%以下,最佳為1%以下)。 [17]如上述[1]至[16]中任一項所記載之積層膜,其中,支持體之全光線穿透率為85%以上(較佳為90%以上)。[14] The laminated film according to any one of the above [1] to [13], wherein the support is a polyester film (especially PET, PEN), a polyimide film, a cyclic polyolefin film , polycarbonate film, TAC film, or PMMA film (preferably polyester film (especially PET, PEN), or polyimide film). [15] The laminated film according to any one of the above [1] to [14], wherein the support has a thickness of 1 to 1000 μm (preferably 5 to 500 μm, more preferably 10 to 400 μm) , more preferably 15-400 μm, further preferably 20-300 μm, especially preferably 25-200 μm). [16] The laminated film according to any one of [1] to [15] above, wherein the support has a haze of 7% or less (preferably 6% or less, more preferably 5% or less, more preferably Preferably it is 4% or less, more preferably 3% or less, especially preferably 2% or less, most preferably 1% or less). [17] The laminated film according to any one of [1] to [16] above, wherein the total light transmittance of the support is 85% or more (preferably 90% or more).
[18]如上述[1]至[17]中任一項所記載之積層膜,其中,上述樹脂層之厚度為1〜100 μm(較佳為2〜80 μm,更佳為3〜60 μm,進而較佳為5〜50 μm,最佳為10〜40 μm)。 [19]如上述[1]至[18]中任一項所記載之積層膜,其中,上述樹脂層之全光線穿透率為85%以上(較佳為90%以上)。 [20]上如上述[1]至[19]中任一項所記載之積層膜,其中,上述樹脂層之算術平均粗糙度Ra 於依據JIS B0601之方法中為0.1〜20 nm(較佳為0.1〜10 nm,更佳為0.1〜5 nm)。[18] The laminated film according to any one of the above [1] to [17], wherein the resin layer has a thickness of 1 to 100 μm (preferably 2 to 80 μm, more preferably 3 to 60 μm) , and more preferably 5~50 μm, most preferably 10~40 μm). [19] The laminated film according to any one of [1] to [18] above, wherein the resin layer has a total light transmittance of 85% or more (preferably 90% or more). [20] The laminated film described in any one of the above [1] to [19], wherein the arithmetic average roughness R a of the resin layer is 0.1 to 20 nm (preferably 0.1~10 nm, more preferably 0.1~5 nm).
[21]如上述[1]至[20]中任一項所記載之積層膜,其中,上述樹脂層係含有1種以上之硬化性化合物的硬化性組成物之硬化物,且硬化性化合物之至少1種為聚有機倍半矽氧烷。 [22]如上述[21]中所記載之積層膜,其中,上述硬化性組成物含有:具有下述式(1)所表示之構成單元之聚有機倍半矽氧烷。 [式(1)中,R1 表示含有陽離子聚合性官能基之基] [23]如上述[22]中所記載之積層膜,其中,上述陽離子聚合性官能基係選自由環氧基、氧環丁烷基、乙烯醚基及乙烯苯基所組成之群中之至少1種(較佳為環氧基)。 [24]如上述[22]或[23]中所記載之積層膜,其中,上述含有陽離子聚合性官能基之基係選自由下述式(1a)所表示之基、下述式(1b)所表示之基、下述式(1c)所表示之基及下述式(1d)所表示之基所組成之群中之至少1種(較佳為選自由下述式(1a)所表示之基及下述式(1c)所表示之基所組成之群中之至少1種,進而較佳為下述式(1a)所表示之基)。 [上述式(1a)中,R1a 表示直鏈或支鏈狀之伸烷基] [上述式(1b)中,R1b 表示直鏈或支鏈狀之伸烷基] [上述式(1c)中,R1c 表示直鏈或支鏈狀之伸烷基] [上述式(1d)中,R1d 表示直鏈或支鏈狀之伸烷基] [25]如上述[22]至[24]中任一項所記載之積層膜,其中,R1 為下述基:上述式(1a)所表示之基,且R1a 為伸乙基[其中尤其為,2-(3',4'-環氧環己基)乙基]。[21] The laminated film according to any one of the above [1] to [20], wherein the resin layer is a cured product of a curable composition containing one or more curable compounds, and the curable compound At least one kind is polyorganosilsesquioxane. [22] The laminated film according to the above [21], wherein the curable composition contains a polyorganosilsesquioxane having a structural unit represented by the following formula (1). [In the formula (1), R 1 represents a group containing a cationic polymerizable functional group] [23] The laminated film described in the above [22], wherein the above cationic polymerizable functional group is selected from epoxy groups, oxygen At least one type (preferably epoxy group) selected from the group consisting of cyclobutanyl group, vinyl ether group and vinylphenyl group. [24] The laminated film as described in [22] or [23] above, wherein the group containing a cationically polymerizable functional group is selected from the group represented by the following formula (1a), the following formula (1b) At least one of the groups represented by the group represented by, the group represented by the following formula (1c) and the group represented by the following formula (1d) (preferably selected from the group represented by the following formula (1a) group and at least one of the groups represented by the following formula (1c), more preferably a group represented by the following formula (1a)). [In the above formula (1a), R 1a represents a linear or branched alkylene group] [In the above formula (1b), R 1b represents a linear or branched alkylene group] [In the above formula (1c), R 1c represents a linear or branched alkylene group] [In the above formula (1d), R 1d represents a linear or branched alkylene group] [25] The laminated film as described in any one of the above [22] to [24], wherein R 1 is the following The group: a group represented by the above formula (1a), and R 1a is an ethylidene group [especially, 2-(3',4'-epoxycyclohexyl)ethyl].
[26]如上述[22]至[25]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷進而具有下述式(2)所表示之構成單元。 [上述式(2)中,R2 表示經取代或未經取代之芳基、經取代或未經取代之芳烷基、經取代或未經取代之環烷基、經取代或未經取代之烷基、或經取代或未經取代之烯基] [27]如上述[26]中所記載之積層膜,其中,上述R2 為經取代或未經取代之芳基、經取代或未經取代之烷基、或經取代或未經取代之烯基(較佳為經取代或未經取代之芳基,更佳為苯基)。 [28]如上述[22]至[27]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷具有下述式(I)所表示之構成單元(有時稱為「T3體」)、與下述式(II)所表示之構成單元(有時稱為「T2體」)。 [上述式(I)中之Ra 及式(II)中之Rb 分別表示含有陽離子聚合性官能基之基、經取代或未經取代之芳基、經取代或未經取代之芳烷基、經取代或未經取代之環烷基、經取代或未經取代之烷基、經取代或未經取代之烯基、或氫原子。上述式(II)中之Rc 表示氫原子或碳數1〜4之烷基] [29]如上述[28]中所記載之積層膜,其中,上述式(I)所表示之構成單元(T3體)與上述式(II)所表示之構成單元(T2體)之比率[T3體/T2體]為5以上(例如5以上且500以下)。 [30]如上述[29]中所記載之積層膜,其中,上述比率[T3體/T2體]之下限值為5(較佳為6,進而較佳為7),且上限值未達20(較佳為18,更佳為16,進而較佳為14)。 [31]如上述[29]中所記載之積層膜,其中,上述比率[T3體/T2體]之下限值為20(較佳為21,更佳為23,進而較佳為25),且上限值為500(較佳為100,更佳為50,進而較佳為40)。 [32]如上述[22]至[31]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷具有下述式(4)所表示之構成單元。 [式(4)中,R1 係與式(1)中者相同。Rc 係與式(II)中者相同] [33]如上述[32]中所記載之積層膜,其中,上述聚有機倍半矽氧烷中之上述式(1)所表示之構成單元及上述式(4)所表示之構成單元相對於矽氧烷構成單元之總量(100莫耳%)之比率(總量)為55〜100莫耳%(較佳為65〜100莫耳%,進而較佳為80〜99莫耳%)。 [34]如上述[22]至[33]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷具有下述式(5)所表示之構成單元。 [式(5)中,R2 係與式(2)中者相同。Rc 係與式(II)中者相同] [35]如上述[34]中所記載之積層膜,其中,上述聚有機倍半矽氧烷中之上述式(2)所表示之構成單元及上述式(5)所表示之構成單元相對於矽氧烷構成單元之總量(100莫耳%)之比率(總量)為0〜70莫耳%(較佳為0〜60莫耳%,更佳為0〜40莫耳%,尤佳為1〜15莫耳%)。 [36]如上述[32]至[35]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷中之上述式(1)所表示之構成單元、上述式(2)所表示之構成單元、上述式(4)所表示之構成單元及上述式(5)所表示之構成單元相對於矽氧烷構成單元之總量(100莫耳%)之比率(總量)為60〜100莫耳%(較佳為70〜100莫耳%,更佳為80〜100莫耳%)。 [37]如上述[21]至[36]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷之數量平均分子量之下限值為1000(較佳為1100),且上限值為3000(較佳為2800,更佳為2600)。 [38]如上述[21]至[36]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷之數量平均分子量之下限值為2500(較佳為2800,更佳為3000),且上限值為50000(較佳為10000,更佳為8000)。 [39]如上述[21]至[38]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷之分子量分散度之下限值為1.0(較佳為1.1,更佳為1.2)。 [40]如上述[21]至[39]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷之分子量分散度之上限值為3.0(較佳為2.0,更佳為1.9)。 [41]如上述[21]至[39]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷之分子量分散度之上限值為4.0(較佳為3.0,更佳為2.5)。 [42]如上述[21]至[41]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷於空氣環境下之5%重量減少溫度(Td5 )為330℃以上(例如330〜450℃,較佳為340℃以上,更佳為350℃以上)。 [43]如上述[21]至[42]中任一項所記載之積層膜,其中,上述硬化性組成物中之上述聚有機倍半矽氧烷之含量(摻合量)相對於除溶劑以外之硬化性組成物之總量(100重量%)為50重量%以上且未達100重量%(較佳為60〜99重量%,更佳為70〜95重量%)。 [44]如上述[21]至[43]中任一項所記載之積層膜,其中,上述聚有機倍半矽氧烷相對於上述硬化性組成物中所含之陽離子硬化性化合物之總量(100重量%)之比率為60〜99重量%(較佳為65〜98重量%,更佳為70〜95重量%)。[26] The laminated film according to any one of the above [22] to [25], wherein the polyorganosilsesquioxane further has a structural unit represented by the following formula (2). [In the above formula (2), R 2 represents substituted or unsubstituted aryl, substituted or unsubstituted aralkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted Alkyl, or substituted or unsubstituted alkenyl] [27] The laminated film as described in the above [26], wherein the above R 2 is substituted or unsubstituted aryl, substituted or unsubstituted Substituted alkyl, or substituted or unsubstituted alkenyl (preferably substituted or unsubstituted aryl, more preferably phenyl). [28] The laminated film according to any one of the above [22] to [27], wherein the polyorganosilsesquioxane has a structural unit represented by the following formula (I) (sometimes referred to as " T3 body"), and a structural unit represented by the following formula (II) (sometimes referred to as "T2 body"). [Ra in the above formula (I) and R b in the formula (II) respectively represent a group containing a cationic polymerizable functional group, a substituted or unsubstituted aryl group, a substituted or unsubstituted aralkyl group , a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, or a hydrogen atom. R c in the above formula (II) represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms] [29] The laminated film as described in the above [28], wherein the constituent unit represented by the above formula (I) ( The ratio [T3 body/T2 body] to the structural unit (T2 body) represented by the above formula (II) is 5 or more (for example, 5 or more and 500 or less). [30] The laminated film described in [29] above, wherein the lower limit of the ratio [T3 bulk/T2 bulk] is 5 (preferably 6, more preferably 7), and the upper limit is Up to 20 (preferably 18, more preferably 16, further preferably 14). [31] The laminated film as described in [29] above, wherein the lower limit of the ratio [T3 body/T2 body] is 20 (preferably 21, more preferably 23, still more preferably 25), And the upper limit is 500 (preferably 100, more preferably 50, further preferably 40). [32] The laminated film according to any one of the above [22] to [31], wherein the polyorganosilsesquioxane has a structural unit represented by the following formula (4). [In formula (4), R 1 is the same as in formula (1). R c is the same as in formula (II)] [33] The laminated film described in [32] above, wherein the structural unit represented by the above formula (1) in the polyorganosilsesquioxane and The ratio (total amount) of the constituent units represented by the above formula (4) relative to the total amount (100 mole %) of the siloxane constituent units is 55-100 mole % (preferably 65-100 mole %, Furthermore, it is preferably 80 to 99 mole %). [34] The laminated film according to any one of the above [22] to [33], wherein the polyorganosilsesquioxane has a structural unit represented by the following formula (5). [In formula (5), R 2 is the same as in formula (2). R c is the same as in the formula (II)] [35] The laminated film described in the above [34], wherein the structural unit represented by the above formula (2) in the polyorganosilsesquioxane and The ratio (total amount) of the constituent units represented by the above formula (5) to the total amount (100 mole %) of the siloxane constituent units is 0 to 70 mole % (preferably 0 to 60 mole %, More preferably 0~40 mole %, most preferably 1~15 mole %). [36] The laminated film according to any one of the above [32] to [35], wherein the structural unit represented by the above formula (1) in the above polyorganosilsesquioxane, the above formula (2) The ratio (total amount) of the structural unit represented, the structural unit represented by the above formula (4), and the structural unit represented by the above formula (5) to the total amount (100 mole %) of the siloxane structural unit is 60-100 mol% (preferably 70-100 mol%, more preferably 80-100 mol%). [37] The laminated film according to any one of [21] to [36] above, wherein the lower limit of the number average molecular weight of the polyorganosilsesquioxane is 1000 (preferably 1100), and The upper limit is 3000 (preferably 2800, more preferably 2600). [38] The laminated film according to any one of the above [21] to [36], wherein the lower limit of the number average molecular weight of the polyorganosilsesquioxane is 2500 (preferably 2800, more preferably is 3000), and the upper limit is 50000 (preferably 10000, more preferably 8000). [39] The laminated film according to any one of the above [21] to [38], wherein the lower limit of the molecular weight dispersion of the polyorganosilsesquioxane is 1.0 (preferably 1.1, more preferably is 1.2). [40] The laminated film according to any one of the above [21] to [39], wherein the upper limit of the molecular weight dispersion of the polyorganosilsesquioxane is 3.0 (preferably 2.0, more preferably is 1.9). [41] The laminated film according to any one of the above [21] to [39], wherein the upper limit of the molecular weight dispersion of the polyorganosilsesquioxane is 4.0 (preferably 3.0, more preferably is 2.5). [42] The laminated film according to any one of [21] to [41] above, wherein the 5% weight loss temperature (T d5 ) of the polyorganosilsesquioxane in an air environment is 330°C or higher (For example, 330~450°C, preferably above 340°C, more preferably above 350°C). [43] The laminated film according to any one of the above [21] to [42], wherein the content (blend amount) of the polyorganosilsesquioxane in the curable composition is The total amount (100% by weight) of other curable compositions is at least 50% by weight and less than 100% by weight (preferably 60 to 99% by weight, more preferably 70 to 95% by weight). [44] The laminated film according to any one of [21] to [43] above, wherein the polyorganosilsesquioxane relative to the total amount of the cation-curable compound contained in the curable composition is (100% by weight) ratio is 60 to 99% by weight (preferably 65 to 98% by weight, more preferably 70 to 95% by weight).
[45]如上述[21]至[44]中任一項所記載之積層膜,其中,上述硬化性組成物進而含有硬化觸媒。 [46]如上述[45]中所記載之積層膜,其中,上述硬化觸媒為光陽離子聚合起始劑。 [47]如上述[45]中所記載之積層膜,其中,上述硬化觸媒為熱陽離子聚合起始劑。 [48]如上述[45]至[47]中任一項所記載之積層膜,其中,上述硬化觸媒之含量(摻合量)相對於上述聚有機倍半矽氧烷100重量份,為0.01〜3.0重量份(較佳為0.05〜3.0重量份,更佳為0.1〜1.0重量份,進而較佳為0.3〜1.0重量份)。[45] The laminated film according to any one of the above [21] to [44], wherein the curable composition further contains a curing catalyst. [46] The laminated film according to the above [45], wherein the curing catalyst is a photocationic polymerization initiator. [47] The laminated film according to the above [45], wherein the curing catalyst is a thermal cationic polymerization initiator. [48] The laminated film according to any one of [45] to [47] above, wherein the content (blend amount) of the curing catalyst is 100 parts by weight of the polyorganosilsesquioxane: 0.01~3.0 parts by weight (preferably 0.05~3.0 parts by weight, more preferably 0.1~1.0 parts by weight, more preferably 0.3~1.0 parts by weight).
[49]如上述[21]至[48]中任一項所記載之積層膜,其中,上述硬化性組成物含有分子內具有1個以上之熱聚合性官能基與1個以上之光聚合性官能基之化合物(以下,有時稱為「化合物A」)。 [50]如上述[49]中所記載之積層膜,其中,上述化合物A所具有之「熱聚合性官能基」係選自由羥基、環氧基、氧環丁基及乙烯醚基所組成之群中之至少1種(較佳為選自由羥基及環氧基所組成之群中之至少1種)。 [51]如上述[49]或[50]中所記載之積層膜,其中,上述化合物A所具有之「光聚合性官能基」係選自由(甲基)丙烯醯基及乙烯基所組成之群中之至少1種(較佳為(甲基)丙烯醯基)。 [52]如上述[49]至[51]中任一項所記載之積層膜,其中,上述化合物A於1分子內所具有之熱聚合性官能基之數量為1〜5個(較佳為1〜3個,更佳為1個或2個)。 [53]如上述[49]至[52]中任一項所記載之積層膜,其中,上述化合物A於1分子內所具有之光聚合性官能基之數量為1〜5個(較佳為1〜3個,更佳為1個或2個)。 [54]如上述[49]至[53]中任一項所記載之積層膜,其中,上述化合物A之熱聚合性官能基之官能基當量為50〜500(較佳為80〜480,更佳為120〜450)。 [55]如上述[49]至[54]中任一項所記載之積層膜,其中,上述化合物A之光聚合性官能基之官能基當量為50〜500(較佳為80〜480,更佳為120〜450)。 [56]如上述[49]至[55]中任一項所記載之積層膜,其中,上述化合物A係於1分子內具有作為熱聚合性官能基之環氧基及/或羥基、與作為光聚合性官能基之(甲基)丙烯醯基之化合物。 [57]如上述[49]至[56]中任一項所記載之積層膜,其中,上述化合物A係選自由(甲基)丙烯酸3,4-環氧環己基甲酯、(甲基)丙烯酸縮水甘油酯、三丙二醇二縮水甘油醚半(甲基)丙烯酸酯、雙酚A環氧半(甲基)丙烯酸酯、雙酚F環氧半(甲基)丙烯酸酯及雙酚S環氧半(甲基)丙烯酸酯所組成之群中之至少1種。 [58]如上述[49]至[57]中任一項所記載之積層膜,其中,上述化合物A之含量(摻合量)以固形物成分計,相對於上述聚有機倍半矽氧烷100重量份,為1〜100重量份(較佳為3〜75重量份,更佳為5〜50重量份)。[49] The laminated film according to any one of [21] to [48] above, wherein the curable composition contains one or more thermally polymerizable functional groups and one or more photopolymerizable functional groups in the molecule. A compound of a functional group (hereinafter, sometimes referred to as "compound A"). [50] The laminated film as described in the above [49], wherein the "thermally polymerizable functional group" of the above-mentioned compound A is selected from the group consisting of hydroxyl group, epoxy group, oxetanyl group and vinyl ether group. At least 1 type in the group (preferably at least 1 type selected from the group consisting of a hydroxyl group and an epoxy group). [51] The laminated film as described in [49] or [50] above, wherein the "photopolymerizable functional group" contained in the compound A is selected from the group consisting of (meth)acryl and vinyl groups. At least one of the group (preferably (meth)acryloyl). [52] The laminated film as described in any one of the above-mentioned [49] to [51], wherein the number of thermally polymerizable functional groups in one molecule of the above-mentioned compound A is 1 to 5 (preferably 1 to 3, preferably 1 or 2). [53] The laminated film according to any one of the above-mentioned [49] to [52], wherein the number of photopolymerizable functional groups contained in the compound A per molecule is 1 to 5 (preferably 1 to 3, preferably 1 or 2). [54] The laminated film described in any one of the above-mentioned [49] to [53], wherein the functional group equivalent weight of the thermopolymerizable functional group of the above-mentioned compound A is 50 to 500 (preferably 80 to 480, more preferably The best is 120~450). [55] The laminated film as described in any one of [49] to [54] above, wherein the functional group equivalent weight of the photopolymerizable functional group of the above compound A is 50 to 500 (preferably 80 to 480, more preferably The best is 120~450). [56] The laminated film according to any one of the above-mentioned [49] to [55], wherein the above-mentioned compound A has an epoxy group and/or a hydroxyl group as a thermally polymerizable functional group in one molecule, and A compound of (meth)acryl group with a photopolymerizable functional group. [57] The laminated film according to any one of the above [49] to [56], wherein the compound A is selected from the group consisting of 3,4-epoxycyclohexylmethyl (meth)acrylate, (methyl) Glycidyl acrylate, tripropylene glycol diglycidyl ether hemi(meth)acrylate, bisphenol A epoxy hemi(meth)acrylate, bisphenol F epoxy hemi(meth)acrylate and bisphenol S epoxy At least 1 sort from the group which consists of a half (meth)acrylate. [58] The laminated film according to any one of the above-mentioned [49] to [57], wherein the content (blend amount) of the above-mentioned compound A is, in terms of solid content, relative to the above-mentioned polyorganosilsesquioxane 100 parts by weight are 1 to 100 parts by weight (preferably 3 to 75 parts by weight, more preferably 5 to 50 parts by weight).
[59]如上述[21]至[58]中任一項所記載之積層膜,其中,上述硬化性組成物進而含有含氟之光聚合性樹脂。 [60]如上述[59]中所記載之積層膜,其中,上述含氟之光聚合性樹脂所具有之光聚合性官能基係選自由(甲基)丙烯醯基及乙烯基所組成之群中之至少1種(較佳為(甲基)丙烯醯基)。 [61]如上述[59]或[60]中所記載之積層膜,其中,上述含氟之光聚合性樹脂於1分子內所具有之光聚合性官能基之數量為1〜5個(較佳為1〜3個)。 [62]如上述[59]至[61]中任一項所記載之積層膜,其中,上述含氟之光聚合性樹脂所具有之含氟之基係具有氟脂肪族烴骨架之基。 [63]如上述[62]中所記載之積層膜,其中,上述氟脂肪族烴骨架形成作為經由醚鍵之重複單元之聚氟伸烷基醚骨架。 [64]如上述[59]至[63]中任一項所記載之積層膜,其中,上述含氟之光聚合性樹脂具有含聚矽氧之基。 [65]如上述[59]至[64]中任一項所記載之積層膜,其中,上述含氟之光聚合性樹脂之含量(摻合量)以固形物成分計,相對於上述聚有機倍半矽氧烷100重量份,為0.01〜15重量份(較佳為0.05〜10重量份,更佳為0.01〜5重量份,進而較佳為0.2〜3重量份)。[59] The laminated film according to any one of the above [21] to [58], wherein the curable composition further contains a fluorine-containing photopolymerizable resin. [60] The laminated film described in [59] above, wherein the photopolymerizable functional group of the fluorine-containing photopolymerizable resin is selected from the group consisting of (meth)acryl and vinyl groups. At least one of them (preferably (meth)acryloyl). [61] The laminated film as described in [59] or [60] above, wherein the number of photopolymerizable functional groups in one molecule of the fluorine-containing photopolymerizable resin is 1 to 5 (compared to preferably 1 to 3). [62] The laminated film according to any one of [59] to [61] above, wherein the fluorine-containing group contained in the fluorine-containing photopolymerizable resin is a group having a fluoroaliphatic hydrocarbon skeleton. [63] The laminated film according to the above [62], wherein the fluoroaliphatic hydrocarbon skeleton forms a polyfluoroalkylene ether skeleton as a repeating unit via an ether bond. [64] The laminated film according to any one of [59] to [63] above, wherein the fluorine-containing photopolymerizable resin has a silicone-containing group. [65] The laminated film according to any one of the above [59] to [64], wherein the content (blending amount) of the above-mentioned fluorine-containing photopolymerizable resin is, in terms of solid content, relative to the above-mentioned polyorganic resin 100 parts by weight of silsesquioxane is 0.01 to 15 parts by weight (preferably 0.05 to 10 parts by weight, more preferably 0.01 to 5 parts by weight, and more preferably 0.2 to 3 parts by weight).
[66]如上述[21]至[65]中任一項所記載之積層膜,其中,上述硬化性組成物進而含有上述聚有機倍半矽氧烷以外之環氧化合物(以下,有時簡稱為「環氧化合物」)。 [67]如上述[66]中所記載之積層膜,其中,上述環氧化合物係選自由脂環式環氧化合物、芳香族環氧化合物及脂肪族環氧化合物所組成之群中之至少1種(較佳為脂環式環氧化合物)。 [68]如上述[67]中所記載之積層膜,其中,上述脂環式環氧化合物係選自由(1)分子內具有下述環氧基(稱為「脂環環氧基」)之化合物,該環氧基由構成脂環之鄰接之2個碳原子與氧原子所構成;(2)環氧基直接利用單鍵與脂環鍵結之化合物;及(3)分子內具有脂環及縮水甘油醚基之化合物(縮水甘油醚型環氧化合物)所組成之群中之至少1種。 [69]如上述[68]中所記載之積層膜,其中,上述(1)分子內具有脂環環氧基之化合物為下述式(i)所表示之化合物。 [上述式(i)中,Y表示單鍵或連結基(具有1個以上之原子之二價基)。式(i)中之環己烷環之氫原子之1個以上可經碳數1〜6之烷基等取代基取代] [70]如上述[69]中所記載之積層膜,其中,上述式(i)所表示之脂環式環氧化合物係選自由(3,4,3',4'-二環氧基)聯環己烷、2,2-雙(3,4-環氧環己基)丙烷、1,2-雙(3,4-環氧環己基)乙烷、2,3-雙(3,4-環氧環己基)環氧乙烷、雙(3,4-環氧環己基甲基)醚及下述式(i-1)〜(i-10)所表示之化合物所組成之群中之至少1種。 [上述式(i-5)、(i-7)中之l、m分別表示1〜30之整數。上述式(i-5)中之R'表示碳數1〜8之伸烷基。上述式(i-9)、(i-10)中之nl〜n6分別表示1〜30之整數] [71]如上述[68]至[70]中任一項所記載之積層膜,其中,上述(2)環氧基直接利用單鍵與脂環鍵結之化合物為下述式(ii)所表示之化合物。 [式(ii)中,R''表示自p元醇之結構式去除p個羥基(-OH)所得之基(p價有機基)。p、n分別表示自然數,於p為2以上之情形時,各()內(外側之括弧內)之基中之n可相同亦可不同] [72]如上述[68]至[71]中任一項所記載之積層膜,其中,上述環氧化合物係(2)環氧基直接利用單鍵與脂環鍵結之化合物(較佳為上述式(ii)所表示之化合物)。 [73]如上述[66]至[72]中任一項所記載之積層膜,其中,上述環氧化合物之含量(摻合量)相對於上述聚有機倍半矽氧烷之總量100重量份,為0.5〜100重量份(較佳為1〜80重量份,更佳為5〜50重量份)。[66] The laminated film according to any one of the above [21] to [65], wherein the curable composition further contains an epoxy compound other than the polyorganosilsesquioxane (hereinafter sometimes referred to as as "epoxy compounds"). [67] The laminated film according to the above [66], wherein the epoxy compound is at least one selected from the group consisting of alicyclic epoxy compounds, aromatic epoxy compounds, and aliphatic epoxy compounds. species (preferably alicyclic epoxy compounds). [68] The laminated film described in the above [67], wherein the alicyclic epoxy compound is selected from (1) having the following epoxy group (referred to as "alicyclic epoxy group") in the molecule Compounds, the epoxy group is composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring; (2) compounds in which the epoxy group is directly bonded to the alicyclic ring through a single bond; and (3) have an alicyclic ring in the molecule and at least one compound of glycidyl ether group (glycidyl ether type epoxy compound). [69] The laminated film according to the above [68], wherein the compound having an alicyclic epoxy group in the molecule of the above (1) is a compound represented by the following formula (i). [In the above formula (i), Y represents a single bond or a linking group (a divalent group having one or more atoms). One or more hydrogen atoms of the cyclohexane ring in the formula (i) may be substituted by a substituent such as an alkyl group having 1 to 6 carbon atoms] [70] The laminated film as described in the above [69], wherein the above The alicyclic epoxy compound represented by formula (i) is selected from (3,4,3',4'-diepoxy) bicyclohexane, 2,2-bis(3,4-epoxy ring Hexyl) propane, 1,2-bis(3,4-epoxycyclohexyl)ethane, 2,3-bis(3,4-epoxycyclohexyl)oxirane, bis(3,4-epoxycyclohexyl) At least one of the group consisting of cyclohexylmethyl) ether and compounds represented by the following formulas (i-1) to (i-10). [1, m in above-mentioned formula (i-5), (i-7) represent the integer of 1~30 respectively. R' in the above formula (i-5) represents an alkylene group having 1 to 8 carbon atoms. n1 to n6 in the above formulas (i-9) and (i-10) respectively represent an integer of 1 to 30] [71] The laminated film according to any one of the above [68] to [70], wherein, The above (2) compound in which the epoxy group is directly bonded to the alicyclic ring through a single bond is a compound represented by the following formula (ii). [In formula (ii), R'' represents a group obtained by removing p hydroxyl groups (-OH) from the structural formula of p-hydric alcohol (p-valent organic group). p and n represent natural numbers respectively. When p is 2 or more, the n in the bases inside each () (in the brackets outside) can be the same or different] [72] as above [68] to [71] The laminated film according to any one of the above, wherein the epoxy compound is (2) a compound in which an epoxy group is directly bonded to an alicyclic ring via a single bond (preferably a compound represented by the above formula (ii)). [73] The laminated film according to any one of the above [66] to [72], wherein the content (blend amount) of the epoxy compound is 100% by weight relative to the total amount of the polyorganosilsesquioxane Parts are 0.5 to 100 parts by weight (preferably 1 to 80 parts by weight, more preferably 5 to 50 parts by weight).
[74]如上述[1]至[73]中任一項所記載之積層膜,其中,上述支持體為透明支持體。 [75]一種可折器件,其具備上述[1]至[74]中任一項所記載之積層膜。 [76]如上述[75]中所記載之可折器件,其為圖像顯示裝置。 [77]如上述[76]中所記載之可折器件,其中,上述圖像顯示裝置為有機電致發光顯示裝置。 [產業上之可利用性][74] The laminated film according to any one of [1] to [73] above, wherein the support is a transparent support. [75] A foldable device comprising the laminated film described in any one of [1] to [74]. [76] The foldable device as described in [75] above, which is an image display device. [77] The foldable device as described in [76] above, wherein the image display device is an organic electroluminescence display device. [Industrial availability]
本發明之積層膜由於具有較高之表面硬度與優異之彎曲耐久性,故而適宜作為有機電致發光顯示裝置等可折器件之表面保護材。The laminated film of the present invention is suitable as a surface protection material for foldable devices such as organic electroluminescent display devices due to its high surface hardness and excellent bending durability.
1‧‧‧積層膜 R‧‧‧彎曲半徑1‧‧‧Laminated film R‧‧‧bending radius
圖1係表示本發明中之彎曲耐久性之試驗方法(R彎曲方法)(以沿樹脂層之面成為凹陷或凸起之方向彎曲半徑(R)成為2.5 mm或4.0 mm之方式將積層膜彎曲180°,並展開1次之動作)之示意圖(側視圖)。 圖2係放大表示圖1之(4)所得之圖。 圖3係於製造例1中所獲得之含環氧基之低分子量聚有機倍半矽氧烷之1 H-NMR圖。 圖4係於製造例1中所獲得之含環氧基之低分子量聚有機倍半矽氧烷之29 Si-NMR圖。 圖5係於製造例2中所獲得之含環氧基之高分子量聚有機倍半矽氧烷之1 H-NMR圖。 圖6係於製造例2中所獲得之含環氧基之高分子量聚有機倍半矽氧烷之29 Si-NMR圖。Fig. 1 shows the test method of bending durability (R bending method) in the present invention (the laminated film is bent so that the bending radius (R) becomes 2.5 mm or 4.0 mm in the direction where the surface of the resin layer becomes concave or convex. 180°, and unfold 1 action) schematic diagram (side view). Fig. 2 is an enlarged view of (4) in Fig. 1. 3 is a 1 H-NMR chart of the epoxy group-containing low molecular weight polyorganosilsesquioxane obtained in Production Example 1. FIG. FIG. 4 is a 29 Si-NMR chart of the epoxy-group-containing low-molecular-weight polyorganosilsesquioxane obtained in Production Example 1. FIG. FIG. 5 is a 1 H-NMR chart of the epoxy group-containing high molecular weight polyorganosilsesquioxane obtained in Production Example 2. FIG. FIG. 6 is a 29 Si-NMR chart of epoxy group-containing high molecular weight polyorganosilsesquioxane obtained in Production Example 2. FIG.
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2019
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Also Published As
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JP7049447B2 (en) | 2022-04-06 |
TW202005802A (en) | 2020-02-01 |
KR20210013087A (en) | 2021-02-03 |
JPWO2019220642A1 (en) | 2021-07-01 |
KR102469951B1 (en) | 2022-11-23 |
CN112135731B (en) | 2023-03-24 |
WO2019220642A1 (en) | 2019-11-21 |
CN112135731A (en) | 2020-12-25 |
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