TWI777616B - Testing fixture for testing semiconductor package with antenna element, testing system and testing method thereof - Google Patents

Abstract

The subject disclosure relates to a testing fixture for testing semiconductor package with antenna element and testing method thereof. The testing fixture comprises a base portion, a cover portion and a clamp. The cover portion is disposed on the base portion, and the cover portion and the base portion define an inner space. The cover portion includes an first portion and an second portion which are moveable related to each other. The clamp connects the first portion and the second portion and has a first end extending into the inner spacer. When the second portion moves related to the first portion, the first end of the clamp is moved in the inner space.

Description

Test jig, test system and test method for testing semiconductor package structure with antenna element

The present disclosure relates to a test fixture and a test method for testing a semiconductor package structure with an antenna element.

OTA (Over-The-Air) test is a set of radiation performance tests developed by CTIA and GCF for wireless mobile communication devices to verify the "radiated transmit power" and "radiated reception power" of products in three-dimensional space. Sensitivity". Its main test items include total radiated power (TRP) and total isotropic sensitivity (TIS).

OTA can be analogous to the transmission scene of the wireless signal of the product in the air. It can also take into account factors such as product internal radiation interference, product structure, antenna factors, RF chip transceiver algorithm, and even human body influence. It is a comprehensive test method to verify the air interface performance of wireless products in free space, which is very close to the actual product. usage.

In some embodiments, the present disclosure provides a test fixture for testing an object to be tested. The test fixture includes: a base, a cover disposed on the base, and a fixture connected to the cover. The cover and the base jointly define an inner space, and the cover includes a device A first part on the base and a second part that cooperates with the first part and can move relative to the first part; the clamp and the first part and the second part of the cover part are connected with the The interior space extends a first end. When the second part moves relative to the first part, the clamp is driven to move the first end in the interior space.

In some embodiments, the present disclosure provides a test fixture for testing an object to be tested. The test fixture includes: a bottom member, a cover member cooperating with the bottom member, and a bottom member and the bottom member. The clamp for connecting the upper cover components. The upper cover member is configured to move relative to the bottom member, and together with the bottom member define an inner space; furthermore, the upper cover member has an opening communicating with the inner space. The clamp includes a first end extending within the interior space, and the first end of the clamp is configured to move as the cover member moves relative to the bottom member.

In some embodiments, the present disclosure provides a test method; providing a test object to a test fixture, wherein the test fixture has an opening configured so that the test object placed on the test fixture A surface of the object is communicated with an outside of the test fixture; press down an upper cover member of the test fixture to make a clamp of the test fixture abut the object to be tested; and test the object to be tested .

1: Test fixture

2: Robotic arm

3: Test box

5: Operation process

10: Semiconductor packaging structure

11: Base

13: Cover

15: Fixtures

17: Elastic components

21: Absorb the module

31: Antenna module

33: Testbed

35: Docking plate

51: Steps

100: Test System

101: Antenna Elements

113: Groove

131: First Part

133: Second Part

135: Opening

151: First End

153: Second End

155: pivot part

331: Probe

1310: Opening

1330: Opening

1332: Groove

1530: Drive shaft

Aspects of the present disclosure will be better understood from the following description, together with the accompanying drawings. It should be noted that in accordance with standard industry practice, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity.

FIG. 1A is a three-dimensional schematic diagram of a test fixture according to an embodiment of the disclosure.

FIG. 1B is an exploded schematic view of the test fixture of the disclosed embodiment.

FIG. 2A is a state in which the cover of the test fixture of the disclosed embodiment is pressed together Schematic side view.

FIG. 2B is a schematic cross-sectional view of the test fixture shown in FIG. 2A .

3A is a schematic side view of the test fixture according to the disclosed embodiment in a state in which the cover portion is not pressed together.

FIG. 3B is a schematic cross-sectional view of the test fixture shown in FIG. 3A .

FIG. 4 is a schematic diagram of a testing system according to an embodiment of the disclosure.

FIG. 5A and FIG. 5B are schematic views of the operation of the test fixture according to the disclosed embodiment.

FIG. 6 is a schematic diagram of testing according to the disclosed embodiment.

FIG. 7 is an operation flowchart of the testing system of the disclosed embodiment.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description, "forming a first member over a second member or on a second member" may include embodiments in which the first member and the second member are formed in direct contact, and may also Embodiments are included in which additional members may be formed between the first member and the second member such that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in various instances. This repetition is intended for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

Furthermore, for convenience of description, spatially relative terms (such as "below," "below," "under," "over," "on," "above," and the like may be used herein to describe an element or component relationship to another element(s) or components as depicted in the figures. In addition to the orientation depicted in the figures, spatially relative terms are also intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the text may be interpreted accordingly Spatially relative descriptors used in the text.

As used herein, terms such as "first", "second", and "third" describe various elements, components, regions, layers and/or sections, such elements, components, regions, layers and/or Sections should not be limited by these terms. These terms may only be used to distinguish an element, component, region, layer or section from one another. Terms such as "first," "second," and "third," when used herein do not imply a sequence or order unless the context clearly dictates otherwise.

As used herein, the terms "substantially," "substantially," "substantially," and "about" are used to describe and explain small variations. When used in conjunction with an event or circumstance, terms can refer to both the exact instance in which the event or circumstance occurs and the instance in which the event or circumstance occurs very closely. For example, when used in conjunction with a numerical value, the term can refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±3% Equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a difference between two values is less than or equal to ±10% of the mean of one of the values (such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then such values may be considered to be "substantially" the same or equal . For example, "substantially" parallel may refer to an angular variation of less than or equal to ±10° relative to 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±3° ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, "substantially" vertical may refer to an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±3° ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

The wireless module with its own antenna has a high degree of directivity, and the directivity and radiation efficiency of the antenna radiation pattern of the DUT (Device Under Test) need to be considered during the test. The power point with the strongest radiation pattern of the DUT with its own antenna will be located in its phase center. When the DUT is measured, the radiation beam accuracy of the antenna structure is easily affected by medium interference and shielding, resulting in microwave radiation. The signal produces the wrong phase difference and received data during the test.

When using a test fixture to measure the object under test with its own antenna, no matter whether the test fixture is used for a manual test machine or an automatic test machine, it is necessary to use an upper cover to press down the object to be tested, so that the test platform can The pogo pins on the top can indeed withstand the electrical connectors (such as solder balls) located on the underside of the object to be tested, so as to obtain the data signal in the IC of the object to be tested; There is the upper cover above the object to be tested; in addition, the antenna elements of the object to be tested are usually disposed adjacent to the upper surface of the object to be tested; therefore, when the upper cover presses the upper surface of the object to be tested, the upper cover It will mask the antenna radiation of the object to be tested, thereby affecting the accuracy of measuring the radiation beam on the surface of the object to be tested.

FIG. 1A is a schematic three-dimensional view of a test fixture 1 according to the disclosed embodiment, and FIG. 1B is an exploded schematic view of the test fixture 1 according to the disclosed embodiment. In some embodiments of the present disclosure, the test fixture 1 is used for measurement of a semiconductor package structure having an antenna element. As shown in FIGS. 1A and 1B , the test fixture 1 has a base 11 , a cover 13 , a fixture 15 and an elastic member 17 .

In some embodiments of the present disclosure, the base 11 is configured to be placed on a test platform. The base 11 has a slot 113, and the slot 113 is configured to accommodate a test object, such as a semiconductor device or a semiconductor package structure with an antenna element or an antenna module to be tested, and is configured to allow the detection of the test platform. The needle extends into it.

The cover portion 13 is disposed on the base 11 , and the cover portion 13 and the base 11 cooperate with each other to form an interior space, and the groove 113 of the base 11 is located in the interior space. in this disclosure In some embodiments, the cover portion 13 has a first part 131 and a second part 133 that cooperate with each other and can move relative to each other; the first part 131 is configured to be fixed on an upper surface of the base 11 , and the first part 131 There is an opening 1310 ; in some embodiments of the present disclosure, the first member 131 is substantially in the shape of a ring-shaped body, and when the first member 131 is fixed on the base 11 , the ring-shaped body substantially surrounds the base 11 slot 113. The second part 133 is configured to cooperate with the first part 131 in a manner movable relative to the first part 131 , in other words, the second part 133 cooperates with the first part 131 and is movable up and down relative to the first part 131 . The second part 133 also has an opening 1330 . In some embodiments of the present disclosure, the second member 133 has an annular body configured to fit over the first member 131 . When the second part 133 and the first part 131 are mated with each other, the openings 1330 of the second part 133 are configured to form the openings 135 of the cover part 13 together with the openings 1310 of the first part 131, such that the cover part The inner space formed by the base 13 and the base 11 can communicate with the outer space through the opening 135 . In some embodiments of the present disclosure, the opening 135 of the cover 13 is substantially aligned with the groove 113 of the base 11 .

In some embodiments of the present disclosure, the test fixture 1 has a pair of clamps 15 for fixing the object to be tested placed in the groove 113 of the base 11 ; the clamps 15 are connected to the cover 13 and extend into the cover 13 and the base 11 This interior space is formed together and is configured to move as the second part 133 of the cover 13 moves relative to the first part 131 . A first end 151 of the clamp 15 is configured to extend into the interior space formed by the cover 13 and the base 11 together. Furthermore, a second end 153 opposite the first end 151 of the clamp 15 is configured to connect with the second part 133 of the cover 13; in some embodiments of the present disclosure, the second end of the clamp 15 The part 153 has a shaft 1530, and the shaft 1530 of the clamp 15 is installed in a groove 1332 of the second part 133, so that the clamp 15 can cooperate with the groove 1332 of the second part 133 through its shaft 1530 And it pivots relative to the second part 133 . In addition, the clamp 15 has a pivot portion 155 between the first end portion 151 and the second end portion 153 thereof, and the clamp 15 is pivotally connected to the first part 131 through a pivot portion 155 . When the second part 133 of the cover 13 moves up and down relative to the first part 131 , the clamp 15 can be driven to move its first end 151 up and down in the inner space formed by the cover 13 and the base 11 together.

Furthermore, the test fixture 1 has one or more elastic members 17 disposed between the second part 133 and the first part 131 . In some embodiments of the present disclosure, the elastic member 17 includes a spring. In some embodiments of the present disclosure, the elastic member 17 can be replaced by other elastic elastic members. When the second part 133 of the cover part 13 is forced to move downward relative to the first part 131 , the second part 133 simultaneously compresses the elastic member 17 between the second part 133 and the first part 131 . When the pressing force is removed, the elastic member 17 located between the second part 133 and the first part 131 will push the second part 133 to move upward relative to the first part 131 with its elastic force, so that the second part 133 Returns to its unforced down position.

As mentioned above, the first part 131 of the cover part 13 is fixed to the base 11 , and the second part 133 of the cover part 13 is movably matched with the first part 131 . Therefore, the base 11 of the test fixture 1 and the first part 131 of the cover 13 fixed thereon can be regarded as a fixed bottom member, and the second part 133 of the cover 13 of the test fixture 1 can be regarded as a The upper cover member cooperates with the bottom member and is movable relative to the bottom member.

In addition, in some embodiments of the present disclosure, the second part 133 of the cover 13 , the first part 131 and the clamp 15 can be collectively regarded as a component that can cooperate with the base 11 .

FIG. 2A is a schematic side view of the test fixture 1 according to the disclosed embodiment in a state where the cover is pressed together. FIG. 2B is a schematic cross-sectional view of the test fixture 1 shown in FIG. 2A . As mentioned above, when the second part 133 of the cover part 13 is pressed down, the second part 133 can be moved downward relative to the first part 131 , that is, the second part 133 can face the first part fixed to the base 11 . 131, and the second part 133 simultaneously compresses the space between the second part 133 and the first part 131 Elastic member 17 . Furthermore, the second end 153 of the clamp 15 is connected with the movable second part 133, and the pivot part 155 thereof is connected with the first part 131 fixed on the base 11; when the second part 133 is opposite to the first part When 131 moves downward, the second end 153 of the clamp 15 will move downward together with the second part 133; however, the pivot part 155 of the clamp 15 is connected with the fixed first part 131, so it is relatively The first end 151 of the end 153 is driven to move upward, that is, the first end 151 of the clamp moves away from the base 11 and the groove 131 of the base 11 ; in this way, the clamp 15 is in an open state. When the clamps 15 are in the open state, the distance between the first ends 151 of the clamps 15 is greater than the width of the semiconductor package structure 10 to be tested, so that the semiconductor package structure 10 to be tested can pass through the cover 13 The opening 133 is inserted into the slot 113 of the base 11 . Furthermore, the semiconductor package structure 10 to be tested has the antenna element 101 disposed adjacent to its upper surface. When the semiconductor package structure 10 is placed in the groove 113 , the upper surface of the semiconductor package structure 10 to be tested with the antenna element 101 is It faces the opening 135 of the test fixture 1 .

3A is a schematic side view of the test fixture 1 according to the disclosed embodiment in a state in which the cover is not pressed together, and FIG. 3B is a cross-sectional schematic view of the test fixture 1 shown in FIG. 3A . As mentioned above, when the pressing force is removed, the elastic member 17 located between the second part 133 and the first part 131 will push the second part 133 to move upward relative to the first part 131 with its elastic force, that is, The second part 133 moves away from the first part 131 . Furthermore, the second end 153 of the clamp 15 is connected with the movable second part 133, and the pivot part 155 thereof is connected with the first part 131 fixed on the base 11; when the second part 133 is opposite to the first part When the 131 moves upward, the second end 153 of the clamp 15 will move upward together with the second part 133; however, the pivot part 155 of the clamp 15 is connected with the fixed first part 131, so it is relatively opposite to the second end 131. The first end 151 of the 153 is driven to move downward, that is, the first end 151 of the clamp 15 moves toward the base 11 and the groove 131 of the base 11 ; in this way, the clamp 15 is in a closed state. When the clamp 15 is in the closed state, the clamp 15 The first end 151 of the two is close to the groove 113 of the base 11 , and the distance between them is slightly smaller than the width of the semiconductor package structure 10 to be tested, so that the first end 151 of the fixture 15 is pressed against The two sides of the semiconductor package structure 10 to be tested are placed in the groove 13 of the base 11 , and the semiconductor package structure 10 to be tested can be pushed and fixed by the clamp 15 , and the pogo pins on the test platform can be connected to the groove 113 of the base 11 with each other. The electrical connections on the bottom surface of the semiconductor package structure 10 to be tested are in contact. In addition, because the fixture 15 only touches the side of the upper surface of the semiconductor package structure 10 to be tested, the antenna element 101 located on the upper surface of the semiconductor package structure 10 to be tested will not be shielded by the fixture 15 .

FIG. 4 is a test system 100 for testing a semiconductor package structure 10 having an antenna unit according to an embodiment of the disclosure. As shown in FIG. 4 , the testing system 100 has a robotic arm 2 capable of controlling a suction module 21 , and the suction module 21 is configured to suck the semiconductor package structure 10 to be tested, which is the same or similar to that of FIGS. 1A and 1B of the present invention. The test fixture 1 of the disclosed embodiment is located in the test box 3 and disposed on the docking plate 35 having the test platform 33 . The robot arm 2 controls the suction module 21 to suction the semiconductor package structure 10 to be tested, and places it in the test fixture 1 located in the test box 3 . In some embodiments of the present disclosure, when the suction module 21 will When the semiconductor package structure 10 to be tested is placed in the test jig 1 , the upper part 133 and the lower part 131 of the cover part 13 of the test jig 1 are pressed together at the same time. Furthermore, an antenna module 31 (Horn Antenna) and related accessories with an operating frequency band corresponding to the semiconductor package structure 10 to be tested are erected on the top of the test box 3; the semiconductor package structure 10 to be tested is put into a test jig After 1, the semiconductor package structure 10 to be tested can be measured by using the antenna module 31 located above the test box 3 . When the robot arm 2 controls the suction module 21 to place the semiconductor package structure 10 to be tested on the test fixture 1, the robot arm 2 and the suction module 21 will move out of the test box 3, so that the antenna module 31 and the There is no barrier between the test fixtures 1, so the antenna module 31 is configured to face the test fixture 1 directly. Furthermore, because the cover 13 of the test fixture 1 has the opening 1330 of the upper part 133 and the Commonly formed by the openings 1310 of the lower portion 131 The opening 135 is formed, so when the semiconductor package structure 10 to be tested is placed in the test fixture 1, the semiconductor package structure 10 to be tested is directly facing the antenna module 31, and the semiconductor package structure 10 to be tested and the antenna There is no barrier between the modules 31; in this way, when using the antenna module 31 to measure the semiconductor package structure 10 to be tested, such as OTA measurement, the radiated power of the antenna elements of the semiconductor package structure 10 to be tested is Will not be blocked and disturbed.

5A and 5B are schematic diagrams of the operation of the test fixture 1 according to the disclosed embodiment. As mentioned above, the robot arm 2 controls the suction module 21 to suck the semiconductor package structure 10 to be tested and places it in the test fixture 1 located in the test box 3; referring to FIG. 5A , the robot arm 2 can control the suction mould The group 21 enters the inner space of the test fixture 1 to place the semiconductor package structure 10 to be tested; in the process of placing the semiconductor package structure 10 to be tested into the test fixture 1 by the suction module 21 , the suction module 21 will press down the cover 13 of the test fixture 1 to push the upper part 133 of the cover 13 to move downward; and when the upper part 133 of the cover 13 moves downward, the fixture 15 of the test fixture 1 will be moved downward. Actuating to move its first end 151 upwards brings the clamp 15 into an open state. When the fixture 15 of the test fixture 1 is in an open state, the suction module 21 can place the semiconductor package structure 10 to be tested that it picks up in the groove 113 located in the base 11 of the test fixture 1 . In addition, when the semiconductor package structure 10 to be tested is placed in the groove 113, the upper surface of the semiconductor package structure 10 to be tested provided with the antenna element 101 faces upward.

5B, after the suction module 21 places the semiconductor package structure 10 to be tested in the groove 113 of the test fixture 1, the robot arm 2 controls the suction module 21 to leave the test fixture 1; once the cover of the test fixture 1 is tested 13 is no longer pressed and pressed by the suction module 21, the elastic member 17 of the test fixture 1 will push the second part 133 of the cover 13 upward with its elastic force; and when the upper part 133 of the cover 13 moves upward , the clamp 15 of the test fixture 1 will be driven to move its first end 151 downward, so that the clamp 15 is in a closed state. When the fixture 15 of the test fixture 1 is in the closed state, the first The end portion 151 is configured to hold the semiconductor package structure 10 under test placed in the groove 113 abutting against it, so that the probes 331 of the test platform 33 pass through the groove 113 of the base 11 and the semiconductor package structure 10 to be tested is firmly connected. The bottom electrical connector contacts. In some embodiments of the present disclosure, the first end portion 151 of the fixture 15 only contacts the adjacent two sides of the upper surface of the semiconductor package structure 10 to be tested, so as to avoid shielding the upper space and the surface of the semiconductor package structure 10 to be tested. The antenna element 101 disposed on the upper surface of the semiconductor package structure 10 to be tested is prevented from being shielded, thereby affecting the measurement of the antenna element 101 of the semiconductor package structure 10 to be tested by the antenna module 31 .

FIG. 6 is a schematic diagram of testing according to the disclosed embodiment. As shown in FIG. 6 , when the semiconductor package structure 10 to be tested is placed in the test fixture 1 , the upper surface of the semiconductor package structure 10 to be tested on which the antenna element 101 is disposed can directly face the antenna mold through the opening 135 Group 31. Therefore, there is no barrier between the antenna module 31 and the upper surface of the conductor package structure 10 on which the antenna element 10 is disposed. In some embodiments of the present disclosure, after the semiconductor package structure 10 to be tested is fixed in the test fixture 1 , the antenna module 31 located above the semiconductor package structure 10 to be tested can be adjusted so that the antenna module 31 is aligned with the semiconductor package structure 10 to be tested. The distance of the semiconductor package structure 10 to be tested is the far-field test condition; furthermore, the angle of the antenna module 31 can be changed to measure the semiconductor package structure 10 to be tested, such as OTA measurement, so as to obtain the semiconductor to be tested The radiated power and S parameters of the package structure 10 . In some embodiments of the present disclosure, when the semiconductor package structure 10 to be tested is fixed in the test fixture 1 by the fixture 15 of the test fixture 1 , the electrical measurement of the semiconductor package structure 10 to be tested can be performed .

FIG. 7 is an operation flow chart of an operation process 5 of performing measurement using the operating system of the embodiment of the present disclosure. In the operation step 51 of the operation flowchart, the suction module 21 can suck the semiconductor package structure 10 to be tested, and the robot arm 2 can be used to move the suction module 21 to the top of the test fixture 10 in the test box 3 ( Refer to Figure 4).

In the operation step 53 of the operation flowchart, the semiconductor package structure 10 to be tested adsorbed on the suction module 21 is placed in the groove 113 of the test fixture 1 . In operation step 531 of the operation flowchart, the suction module 21 moves downward to press the cover 13 of the test fixture 1 together, so that the fixture 15 in the test fixture 1 is moved to the open state, so that the suction module 21 can The absorbed semiconductor package structure 10 to be tested is placed in the groove 113 of the test fixture 1 (refer to FIG. 5A ). In the operation step 532 of the operation flowchart, the suction module 21 is separated from the test fixture 1, the second part 133 of the cover 13 of the test fixture 1 will move upward due to the elastic force of the spring 15, and the test fixture The fixture 15 in 1 is moved to the closed state, so that the first end 151 of the fixture 15 of the test fixture 1 is pressed down against the semiconductor package structure 10 to be tested placed in the groove 113 (refer to FIG. 5B ) . In addition, the suction module 21 is further removed, so that there is no obstruction between the test fixture 1 and the antenna module 31 .

In operation step 55 of the operation flowchart, the distance between the antenna module 31 (Horn Antenna) located directly above the test fixture 1 and the test fixture 1 is adjusted so that the distance between them meets the far-field test conditions, and The operating frequency band of the antenna module 31 is consistent with the antenna element 101 of the semiconductor package structure 10 to be tested. (See Figure 4).

In operation step 57 of the operation flowchart, the antenna element 101 of the semiconductor package structure 10 to be tested placed in the test fixture 1 is measured using the antenna module 31 , such as OTA measurement. In some embodiments of the present disclosure, electrical measurements may be performed on the semiconductor package structure to be tested. In addition, since there is no shield between the antenna module 31 and the test fixture 1, and the cover 13 of the test fixture 1 has the opening 135, the antenna module 31 is performing the antenna measurement of the semiconductor package structure 10. At the same time, it can directly face the upper surface of the semiconductor package structure 10 where the antenna element 101 is disposed, and is not blocked by any object, so the accuracy of the antenna measurement will not be affected. Besides, the user can change the setting angle of the antenna module 31 to adjust the antenna measurement of the semiconductor package structure 10 . Measurement. In addition, the antenna module 31 can measure and obtain the radiated power and S-parameters or other related data of the antenna element 101 of the semiconductor package structure 10 to be tested (refer to FIG. 4 and FIG. 6 ).

In the operation step 59 of the operation flowchart, the measured semiconductor package structure 10 is transported to a large-scale machine for sorting, such as a dispenser. The large-scale machine capable of sorting can classify the measured semiconductor package structures 10 as good products and defective products, and the semiconductor package structures 10 classified as good products will be shipped or transported to other semiconductor manufacturing apparatuses for follow-up process. In some embodiments of the present disclosure, the semiconductor package structures 10 classified as defective products are further subjected to an electrical failure analysis test (EFA test).

Using the test jig for testing a semiconductor package structure with an antenna unit according to the present disclosure can completely clear the top of the semiconductor package structure to be tested in the test jig, so that the antenna unit can be measured without the pressure of the material medium. Influence, improve the accuracy of testing antenna performance.

The foregoing has outlined features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other procedures and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that these equivalent constructions should not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein.

1: Test fixture

11: Base

15: Fixtures

17: Elastic components

113: Groove

131: First Part

133: Second Part

151: First End

153: Second End

155: pivot part

1310: Opening

1330: Opening

1332: Groove

1530: Drive shaft

Claims (19)

A test fixture for testing an object to be tested with an antenna element, comprising: a base; a cover part arranged on the base, wherein the cover part and the base jointly define an inner space, wherein the cover part comprising: a first part mounted on the base; and a second part cooperating with the first part, wherein the second part is configured to move relative to the first part; and a clamp, It includes a first end extending in the interior space; wherein when the second part moves relative to the first part, the clamp is driven to move the first end in the interior space; wherein the cover The portion has an opening that communicates with the interior space, and wherein the opening is configured so that an antenna module (Horn Antenna) conducts the antenna element of the DUT accommodated in the interior space through the opening. test. The test fixture of claim 1, wherein the base has a groove for placing the object to be tested, and wherein the groove is substantially aligned with the opening. 3. The test fixture of claim 2, wherein when the second part moves close to the first part, the fixture is driven to move the first end away from the slot, and wherein when the second part moves away from the first part As the part moves, the clamp is driven to move the first end proximate the slot. The test fixture of claim 3, wherein when the object to be tested is placed in the groove, the antenna element of the object to be tested faces the opening. The test fixture of claim 3, wherein when the second part moves away from the first part, the first end of the fixture is configured to move against the test object placed in the slot , and wherein when the first end of the fixture abuts against the object to be tested placed in the groove, the antenna element of the object to be tested will not be shielded by the fixture. The test fixture of claim 5, wherein the first end of the fixture is configured to abut an edge portion of the object to be tested. The test fixture of claim 3, wherein the fixture has a second end opposite to the first end and a pivot portion located between the first end and the second end, and wherein the pivot The part is connected to the first part, and the second end part is connected to the second part. The test fixture of claim 5, wherein when the first end of the fixture abuts against the object to be tested placed in the groove, a probe can contact the object to be tested through the groove. The test fixture of claim 8, wherein when the antenna module tests the antenna module of the object under test, the probe simultaneously performs an electrical test on the object under test. A test system for testing a test object with an antenna element, comprising: a test fixture, comprising: a first part having an interior space for accommodating the test object; a second part cooperating with the first part, wherein the second part is configured relative to the first part moving, and wherein the second part has an opening communicating with the interior space of the first part; and a clamp connected with the first part or the second part, wherein the clamp has an extension in the interior space a first end portion; wherein the clamp is configured to secure the test object contained in the interior space, and wherein, when the second part is moved relative to the first part, the clamp can be driven to making the first end move; and an antenna module (Horn Antenna) disposed on the test fixture and substantially aligned with the opening of the test fixture; wherein the antenna module is configured to The antenna element of the DUT accommodated in the inner space is tested through the opening. The system of claim 10, wherein when the antenna module tests the antenna element of the DUT, the DUT is fixed in the inner space of the test fixture by the fixture, and the DUT is The antenna element directly faces the antenna module without being shielded by the fixture. The system of claim 10, further comprising a test box, wherein the test fixture is located in the test box. The system of claim 10 further has a test platform disposed below the test fixture , wherein the test platform is configured to perform electrical tests on the object under test while the antenna module tests the antenna element of the object under test. A test method, comprising: fixing an object to be tested with an antenna element in a test fixture; wherein the test fixture is pressed against a side of the object to be tested through a fixture to fix the object to be tested In the test fixture; perform a radiation energy measurement on the antenna element of the object to be tested; and perform the radiation energy measurement on the antenna element of the test object to obtain a radiated power of the object under test and / or an S-parameter. The test method of claim 14, further comprising: when the test fixture is fixed in the test fixture, performing an electrical measurement on the object to be tested. The test method of claim 14, wherein the test fixture is located in a test box. A test method, comprising: fixing an object to be tested with an antenna element in a test fixture; wherein the test fixture is pressed against a side of the object to be tested through a fixture to fix the object to be tested In the test fixture; perform a radiation energy measurement on the antenna element of the object to be tested; and set up an antenna module (Horn Antenna) above the test fixture, wherein an operating frequency band of the antenna module Consistent with the antenna element of the DUT. The test method of claim 17, wherein an upper cover of the test fixture has an opening so that the The antenna module is configured to directly face the DUT fixed in the test fixture. The test method of claim 17, further comprising: adjusting the antenna module so that a distance between the antenna module and the object to be tested conforms to far-field test conditions.

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