TWI772934B - 生產電解電容器的方法 - Google Patents
生產電解電容器的方法 Download PDFInfo
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- TWI772934B TWI772934B TW109137021A TW109137021A TWI772934B TW I772934 B TWI772934 B TW I772934B TW 109137021 A TW109137021 A TW 109137021A TW 109137021 A TW109137021 A TW 109137021A TW I772934 B TWI772934 B TW I772934B
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- electrolytic capacitor
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- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- HDIXMTIYNOOHBA-UHFFFAOYSA-N phosphane;triphenylene Chemical class P.C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C2=C1 HDIXMTIYNOOHBA-UHFFFAOYSA-N 0.000 description 1
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- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- 229920002050 silicone resin Polymers 0.000 description 1
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- ISXOBTBCNRIIQO-UHFFFAOYSA-N tetrahydrothiophene 1-oxide Chemical compound O=S1CCCC1 ISXOBTBCNRIIQO-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
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- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
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Abstract
本發明公開一種生產電解電容器的方法,將至少一種交聯劑施加在一電容器體上;在施加所述交聯劑以後,施加具有一共軛聚合物的一溶液於電容器體上;除去溶液中的部分溶劑,以於電容器體上形成一聚合物外層。其中,電容器體包括一電極體、一電極材料、一電介質以及一固體電解質,電極材料形成於電極體上,電介質覆蓋電極材料的表面,固體電解質覆蓋電介質。其中,所述電極體或所述固體電解質是由一具有至少一磺酸基的聚噻吩及具有至少一磺酸基的聚硒吩中的至少一種所形成。
Description
本發明涉及一種生產電容器的方法,特別是涉及一種生產電解電容器的方法。
市售固體電解質電容器通常包括:多孔金屬電極、多孔金屬電極表面上的氧化物層、結合在多孔金屬電極的多孔結構內的固體電解質、外部電極(接頭)如銀層以及電接頭和封套(encapsulation)。
固體電解質電容器的例子包括,以鉭、鋁、鈮和鈮氧化物作為材料,利用電荷轉移複合物或軟錳礦或聚合物固體電解質所製備的電容器。使用多孔主體的優點在於,高的表面積可產生較高的電容密度,也就是說,可在小空間內實現高電容的特性。
-共軛聚合物由於具有高導電性而尤其適合用作固體電解質。
-共軛聚合物也稱為導電聚合物或合成金屬。因為聚合物在加工性能、重量以及可通過化學修飾來調節性質的方面上優於金屬,所以它們在經濟上的重要性日益突出。已知的
-共軛聚合物的例子有:聚吡咯、聚噻吩、聚苯胺、聚乙炔、聚亞苯基和聚(
p-亞苯基-亞乙烯基),尤其重要的是聚噻吩,其中工業上應用的為聚3,4-二氧乙基噻吩,常常也稱為聚(3,4-亞乙基二氧代噻吩),且其氧化形式具有非常高的導電性。
電子領域的技術發展越來越需要具有非常低的等效串聯電阻(equivalent series resistance,ESR)的固體電解質電容器,其原因在於邏輯電壓(voltage logic level)降低、集成密度(integrated density)提高和積體電路中的循環頻率增加等。而且,低ESR還能降低能耗,尤其適用於利用移動電池工作的應用。所以,人們希望盡可能降低固體電解質電容器的ESR。
現有技術中公開,從3,4-二氧乙基噻吩製備固體電解質以及通過氧化聚合反應製備的其陽離子聚合物在電解質電容器中作為固體電解質的應用。聚(3,4-二氧乙基噻吩)在固體電解質電容器中用作二氧化錳或電荷轉移複合物的替代品,由於其較高的導電性而能夠降低等效串聯電阻,並改善頻率性質。
除此之外,由聚3,4-二氧乙基噻吩以及聚對苯乙烯磺酸所形成的複合物(poly(3,4-ethylenedioxythiophene)polystyrene sulfonate,PEDOT:PSS),因具有良好的導電性以及較低的聚合速率,而逐漸被重視並廣泛應用。然而,PETDOT:PSS仍具有些許問題尚待克服。
舉例來說,PEDOT:PSS一般是通過原位聚合(in-situ polymerization)產生,利用原位聚合法形成的PEDOT:PSS的粒徑較大,使得PEDOT:PSS無法有效填補於多孔金屬主體內部。因此,當電容器含浸於含有PEDOT:PSS的溶液中時,通常會有含浸率不佳的問題。
並且,PEDOT:PSS本身具有易吸水的特性,但電容器元件又對水氣敏感,一旦PEDOT:PSS吸收了環境中的水氣,使得電容器元件與水氣接觸,則電容器元件的電氣特性可能會被負面影響,或甚至直接故障。因此,當使用PEDOT:PSS作為固態電解質材料時,需搭配阻水性更佳的封裝結構。
本發明所要解決的技術問題在於,針對現有技術的不足提供一種生產電解電容器的方法。
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種生產電解電容器的方法,所述生產電解電容器的方法包括:將至少一種交聯劑(e)施加在一電容器體上;在施加所述交聯劑(e)以後,施加具有共軛聚合物(b)的至少一種溶液(a);除去溶液(a)中的部分溶劑(d),以於所述電容器體上形成一聚合物外層。其中,所述電容器體至少包括:具有一電極材料和覆蓋所述電極材料表面的一電介質的一電極體;以及至少包含完全或部分覆蓋所述電介質表面的一導電材料所形成的一固體電解質。其中,交聯劑(e)包含至少一種二胺、三胺、低聚胺、聚合胺或其衍生物、至少一種陽離子和另外至少一種胺基團或至少一種多價陽離子;或者在施加溶液(a)以後,交聯劑(e)形成至少一種多價陽離子。所述電極體或所述固體電解質是由一具有至少一磺酸基的聚噻吩及具有至少一磺酸基的聚硒吩中的至少一種所形成。
本發明的其中一有益效果在於,本發明所提供的生產電解電容器的方法,其能通過“所述電極體或所述固體電解質是由一具有至少一磺酸基的聚噻吩及具有至少一磺酸基的聚硒吩中的至少一種所形成”的技術特徵,以提升電解電容器的電氣特性。
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明。
以下是通過特定的具體實施例來說明本發明所公開有關“生產電解電容器的方法”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件,但這些元件不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。
本發明的目的是提供一種生產電解電容器的方法。通過於電容器體上先施加交聯劑,再施加具有共軛聚合物的溶液,可製得特性良好的電解電容器。其中,交聯劑包含至少一種二胺、三胺、低聚胺或聚合胺或其衍生物,以及至少一種陽離子和另外至少一種胺基團或至少一種多價陽離子,或者在施加共軛聚合物的溶液之後,該交聯劑形成至少一種多價陽離子。
在施加溶液前施加本發明的交聯劑,可有效改善電容器體的邊緣和錐角不易被共軛聚合物所覆蓋的問題,且溶液中不再需要添加粗固體顆粒的添加劑。值得注意的是,若事先將交聯劑加入溶液中,也就是同時施加交聯劑和溶液於電容器體上,則無法達到如本發明的相同效果。
因此,本發明提供一種生產電解電容器的方法,首先,將至少一種交聯劑(e)施加在一電容器體上,所述電容器體至少包括具有一電極材料的一電極體和覆蓋所述電極材料表面的一電介質,以及至少包含完全或部分覆蓋所述電介質表面的一導電材料所形成的一固體電解質;接著,在施加交聯劑(e)以後,施加具有共軛聚合物(b)的至少一種溶液(a),並通過至少部分除去溶劑(d)而形成一聚合物外層。所述方法的特徵在於,交聯劑(e)包含至少一種二胺、三胺、低聚胺或聚合胺或其衍生物、至少一種陽離子和另外至少一種胺基團或至少一種多價陽離子;或者在施加溶液(a)以後,該交聯劑(e)形成至少一種多價陽離子。所述電極體或所述固體電解質是由一具有至少一磺酸基的聚噻吩及具有至少一磺酸基的聚硒吩中的至少一種所形成。
下面所列舉的用於舉例闡述本發明,並非用以限制本發明。在通過本發明方法生產的電解電容器中,電極材料優選形成具有高表面積的多孔體,例如可以是一多孔燒結體或一粗糙膜,在下文中也簡稱作電極體。
用電介質覆蓋的電極體在下文中也簡稱作氧化電極體。術語“氧化電極體”還包括未通過將電極體氧化而生產的用電介質覆蓋的那些電極體。
用電介質且完全或部分用固體電解質覆蓋的電極體在下文中也簡稱作電容器體。
通過本發明方法由溶液(a)生產的導電層在這裡稱為聚合物外層。
溶液(a)優選包含至少一種平均分子量(重均)大於1000,更優選大於3000,甚至更優選大於10000,格外優選大於20000,在特別優選的實施方案中大於50000的聚合物,以便可更好地通過交聯劑(e)交聯。
平均分子量大於1000的聚合物優選包含至少溶液(a)的共軛聚合物(b)、聚合物陰離子或黏合劑。特別優選聚合物陰離子作為平均分子量大於1000的聚合物。
聚合物的平均分子量(重均),是通過使用合適的洗脫液和陽離子交換柱(MCX柱)組合,以凝膠滲透色譜法(GPC)進行測定,其中,使用折射率偵測器(Refractive Index Detector,RI檢測器)進行檢測,並以25°C下聚苯乙烯磺酸的標定評估信號作為參考。
在本發明方法中有用的交聯劑(e)優選至少包含下列至少一種:
二胺、三胺、低聚胺或聚合胺或其衍生物;
具有至少兩個鏻基團的化合物可以是三苯基鏻化合物,例如(2-二甲基氨基乙基)三苯基溴化鏻或對二甲苯雙(溴化三苯基鏻);
具有一個鏻基團和至少一個胺基團的化合物,例如(2-二甲基氨基乙基)三苯基溴化鏻或其衍生物;
具有至少兩個鋶基團的化合物,例如三芳基鋶鹽,例如式(XX):
式(XX),或可形成多價陽離子的金屬,例如:Mg、Al、Ca、Fe、Cr、Mn、Ba、Ti、Co、Ni、Cu、錫(Sn)、Ce或Zn,或包含這些金屬的合金。
特別優選包含至少一種二胺、三胺、低聚胺或聚合胺或其衍生物,或多價金屬陽離子的交聯劑(e)。
非常特別優選包含至少一種二胺、三胺、低聚胺或聚合胺或其衍生物的交聯劑(e)。
尤其優選包含至少一種二胺、三胺或四胺或其衍生物的交聯劑(e)。
低聚胺應理解為意指含有至少4個或更多個胺基團的那些胺,例如四聚物、五聚物、六聚物、七聚物、八聚物、九聚物、十聚物、十一聚物或十二聚物。
前述的二胺、三胺、低聚胺或聚合胺或其衍生物具有至少兩個胺基。並且,交聯劑(e)可以是碳數為2至10的二胺類、碳數為2至10的三胺類、碳數為4至12的環狀胺類、碳數為4至12的芳香族胺類或其鹽類中的至少一種。
具體來說,碳數為2至10的二胺類可以是乙二胺、丙二胺、丁二胺、戊二胺、己二胺、庚二胺、辛二胺、壬二胺、葵二胺、四甲基乙二胺、四甲基丙二胺、四甲基丁二胺、四甲基戊二胺、四甲基己二胺、四甲基庚二胺、四甲基辛二胺、四甲基壬二胺、四甲基葵二胺、鄰苯二胺、間苯二胺或對苯二胺,但不限於上述。碳數為2至10的三胺類可以是二乙烯三胺,但不限於上述。碳數為4至12的環狀胺類可以是哌嗪、嗎啉、哌啶、咪唑或三聚氰胺。例如:1-(2-羥乙基)哌嗪、1-(2-氨基乙基)哌嗪、4-(2-氨基乙基)嗎啉、1-(2-吡啶基)哌嗪、1-(2-氨基乙基)哌啶、1-(3-氨基丙基)咪唑或三聚氰胺,但不限於上述。碳數為4至12的芳香族胺類可以是苯碸,例如:4,4'-二氨基二苯碸,但不限於上述。
在本發明方法中,在施加溶液(a)後,交聯劑(e)可通過與溶液(a)反應,通過與溶劑(d)反應,或者是通過與溶液(a)中的其它添加劑反應,而形成多價陽離子。
例如,包含上述金屬的交聯劑(e)可在與pH小於7的溶液(a)接觸時形成多價金屬陽離子。例如,包含至少一種上述金屬(例如:Ca)的交聯劑(e)可通過已知方法,例如蒸氣沉積、濺射或昇華施加在電容器體上。當這與pH值小於7的溶液(a)接觸時,形成相應的金屬陽離子(Ca
2+)。這些金屬陽離子(Ca
2+)會使電容器體的角和邊緣可被共軛聚合物所覆蓋。
鹼性交聯劑會損壞固體電解質,特別是包含導電聚合物的鹼性交聯劑。因此,交聯劑(e)會添加於pH值小於10(在25°C的溫度下)的溶液(a)中,優選為pH值小於8,甚至更優選為pH值小於7,格外優選為pH值小於6。在非水溶液的情況下,pH值通過預先用軟化水潤濕的pH試紙測定。溶液的pH值優選大於1,更優選大於2,最優選大於3。對於上述胺,可例如通過加入酸來調整pH值。用以調整pH值的酸可以為無機酸如硫酸、磷酸或硝酸,或有機酸如羧酸或磺酸。優選羧酸或磺酸,例如碳數為1至20的鏈烷磺酸如甲磺酸、乙磺酸、丙磺酸、丁磺酸或更高級磺酸如十二烷磺酸,脂族全氟磺酸如三氟甲磺酸、全氟丁磺酸或全氟辛磺酸,脂族碳數為1至20的羧酸如2-乙基己基甲酸,脂族全氟羧酸如三氟乙酸或全氟辛酸,和任選被碳數為1至20的烷基取代的芳族磺酸如苯磺酸、鄰甲苯磺酸、對甲苯磺酸或十二烷基苯磺酸,和環烷磺酸如樟腦磺酸。
除了一元或單官能酸,下文也稱為單酸如單磺酸或單羧酸外,也可使用二酸、三酸等調整pH值,例如二磺酸、三磺酸、或二羧酸或三羧酸。
也可使用聚合羧酸如聚丙烯酸、聚甲基丙烯酸或聚馬來酸,或聚合磺酸如聚苯乙烯磺酸和聚乙烯基磺酸調整pH值。這些聚羧酸和聚磺酸也可以為乙烯基羧酸和乙烯基磺酸與其它可聚合單體如丙烯酸酯和苯乙烯的共聚物。
交聯劑(e)優選以使交聯劑(e)在施加至電容器體上之後以鹽或鹽溶液的形式存在的方式施加在電容器體上。交聯劑(e)的鹽可以是通過將交聯劑(e)與能與交聯劑(e)形成鹽的合適材料(m)處理而得到。合適材料(m)例如為可用於pH值調整的上述酸。酸可與鹼性交聯劑(e)形成交聯劑(e)的鹽。適於處理交聯劑(e)的材料(m)可以為固體、液體或氣體。合適材料(m)也可以以溶液的形式存在。在用合適材料(m)的溶液處理交聯劑(e)的情況下,使用pH值為優選小於10,更優選小於8,甚至更優選小於7,格外優選小於6的溶液,pH在25°C下測量。在這種情況下,在連續方法中,可首先將交聯劑(e)施加在電容器體上,然後可進行用合適材料(m)的溶液處理,或可將電容器體用合適材料(m)的溶液處理,然後可將交聯劑(e)施加在電容器體上。優選一種方法,其中交聯劑(e)已存在於pH值為優選小於10,更優選小於8,甚至更優選小於7,格外優選小於6的溶液中,將交聯劑(e)的鹽施加在電容器體上。
用於交聯劑(e)的溶劑的實例包括以下有機溶劑:線性或具支鏈且碳數為1至6的醇,例如:甲醇、乙醇、異丙醇、正丙醇、正丁醇、異丁醇和叔丁醇;碳數為3至8環狀醇,例如:環己醇;脂族酮如丙酮和甲乙酮;脂族羧酸酯如乙酸乙酯和乙酸丁酯;芳族烴如甲苯和二甲苯;脂族烴如己烷、庚烷和環己烷;氯烴如二氯甲烷和二氯乙烷;脂族腈如乙腈,脂族亞碸和碸如二甲亞碸和環丁碸;脂族羧醯胺如甲基乙醯胺、二甲基乙醯胺和二甲基甲醯胺;脂族和芳脂族醚如二乙醚和茴香醚。也可使用上述有機溶劑的混合物作為溶劑。另外,也可使用水或水與上述有機溶劑的混合物作為溶劑。
優選的溶劑為水或其它質子溶劑如線性或具支鏈且碳數為1至6的醇,例如:甲醇、乙醇、異丙醇、正丙醇、正丁醇、異丁醇和叔丁醇;碳數為3至8環狀醇,例如:環己醇。特別優選為水與這些醇的混合物,或者為上述醇類的混合物,非常特別優選水與甲醇、乙醇、異丙醇或正丙醇的混合物。
如果合適的話,交聯劑(e)也可充當溶劑。
溶劑中交聯劑(e)的濃度優選為0.0001 M至10 M,更優選為0.001 M至3 M,甚至更優選為0.01 M至1 M,格外優選為0.03 M至0.6 M,非常格外優選為0.05 M至0.3 M。
交聯劑(e)的鹽於溶液(a)中的濃度優選為至少10
-6M,優選至少為10
-5M,更優選至少為10
-4M,最優選至少為10
-3M。
交聯劑(e)可通過已知方法施加於電容器體上,例如:旋塗、浸漬、澆鑄、滴塗、噴塗、氣相沉積、濺射、昇華、刀塗、塗漆或印刷如噴墨印刷、絲網印刷或移印,將交聯劑(e)至少施加在電容器體的角和/或邊緣上。簡單來說,至少將交聯劑(e)施加在電容器體的整個外表面或部分外表面上。另外,還可將交聯劑(e)引入多孔電容器體中。在施加交聯劑(e)以後,可通過熱處理至少部分除去存在於交聯劑(e)中的溶劑,除去溶劑的乾燥溫度優選為15°C至500°C,更優選為25°C至300°C,最優選為50°C至150°C。
在將交聯劑(e)施加在電容器體上並任選除去溶劑以後,將共軛聚合物(b)的至少一種溶液(a)施加在電容器體上。於一較佳實施例中,在施加交聯劑(e)並除去溶劑後,重複施加溶液(a)的步驟,可形成厚度較厚、均勻且緻密的外層。另外,在施加交聯劑(e)以前,也可先施加溶液(a)。
在施加交聯劑(e)後,部分的溶液(a)會與電容器體接觸,但不保留在其上,且再使用的溶液(a)部分優選與一種或多種離子交換劑連續或分期接觸。例如當將電容器體在施加交聯劑(e)以後浸入包含溶液(a)的中時,可能有利的是通過源自交聯劑的陽離子除去溶液(a)中的污染物以防止在浴中發生交聯反應。為此,優選使來自浴的溶液(a)與一種或多種陽離子交換劑連續或分期接觸。另外,還可使溶液(a)與一種或多種陰離子交換劑接觸,以便在除去陽離子之外,還除去任何存在於交聯劑中的陰離子。優選將來自浴的溶液(a)連續或分期泵送通過包含離子交換劑的筒。有用的陽離子和陰離子交換劑包括例如來自Lanxess AG, Leverkusen的Lewatit
®離子交換劑,例如Lewatit MP 62陰離子交換劑和Lewatit S100陽離子交換劑。
溶液(a)的共軛聚合物(b)的比電導率優選大於10 S/cm,更優選大於20 S/cm,甚至更優選大於50 S/cm,格外優選大於100 S/cm,在特別優選的實施方案中大於200 S/cm。
共軛聚合物優選存在於中的顆粒中。
在本發明方法中,中包含共軛聚合物(b)的顆粒的平均直徑優選為1 nm至10000 nm,更優選1 nm至1000 nm,最優選5 nm至500 nm。
溶液(a)優選僅含有少量金屬和過渡金屬。這裡,金屬應理解為指元素週期表主族的金屬或金屬離子或者過渡族金屬。如熟知的,過渡金屬特別容易損害電介質,使得由其所得的提高的殘餘電流顯著降低了電容器的壽命或甚至使得不可能在苛刻條件如高溫和/或高大氣濕度下使用電容器。
在本方法中,溶液(a)的金屬含量優選小於5000 mg/kg,更優選小於1000 mg/kg,最優選小於200 mg/kg。這裡金屬例如包括:Na、K、Mg、Al、Ca、Fe、Cr、Mn、Co、Ni、Cu、Ru、Ce或Zn。
在本方法中,溶液(a)的過渡金屬含量優選小於1000 mg/kg,更優選小於100 mg/kg,最優選小於 20 mg/kg。這裡過渡金屬包括Fe、Cu、Cr、Mn、Ni、Ru、Ce、Zn或Co。
在本方法中,溶液(a)的鐵含量優選小於1000 mg/kg,更優選小於100 mg/kg,最優選小於20 mg/kg。
當溶液(a)中金屬濃度低時,可避免電介質在形成聚合物的過程中或使用電容器時受到損害。
溶液(a)優選包含至少一種聚合物的有機黏合劑(c)。舉例來說,較佳的,有機黏合劑(c)包括:聚乙烯醇、聚乙烯吡咯烷酮、聚氯乙烯、聚乙酸乙烯酯、聚丁酸乙烯酯、聚丙烯酸酯、聚丙烯醯胺、聚甲基丙烯酸酯、聚甲基丙烯醯胺、聚丙烯腈、苯乙烯/丙烯酸酯、乙酸乙烯酯/丙烯酸酯和乙烯/乙酸乙烯酯共聚物、聚丁二烯、聚異戊二烯、聚苯乙烯、聚醚、聚酯、聚碳酸酯、聚氨酯、聚醯胺、聚醯亞胺、聚碸、三聚氰胺甲醛樹脂、環氧樹脂、有機矽樹脂或纖維素。另外,有機黏合劑(c)還優選為通過加入交聯劑如三聚氰胺化合物、封端異氰酸酯或官能矽烷如3-縮水甘油氧丙基三烷氧基矽烷、四乙氧基矽烷和四乙氧基矽烷水解產物或可交聯聚合物,例如聚氨酯、聚丙烯酸酯或聚烯烴。適合作為黏合劑(c)的這類交聯產物也可例如通過使加入的交聯劑與任何存在於溶液(a)中的聚合物陰離子反應而形成。優選對最終電容器後來所暴露的熱應力,例如220°C至260°C的焊接溫度具有足夠熱穩定性的黏合劑(c)。
溶液(a)中黏合劑(c)的固體含量為0.1重量%至90重量%,優選0.3重量%至30重量%,最優選0.5重量%至10重量%。
溶液(a)可包含一種或多種溶劑(d)。溶劑(d)的實例包括例如以下溶劑:脂族醇如甲醇、乙醇、異丙醇和丁醇;脂族酮如丙酮和甲乙酮;脂族羧酸酯如乙酸乙酯和乙酸丁酯;芳族烴如甲苯和二甲苯;脂族烴如己烷、庚烷和環己烷;氯烴如二氯甲烷和二氯乙烷;脂族腈如乙腈,脂族亞碸和碸如二甲亞碸和環丁碸;脂族羧醯胺如甲基乙醯胺、二甲基乙醯胺和二甲基甲醯胺;脂族和芳脂族醚如二乙醚和茴香醚。也可使用上述有機溶劑的混合物作為溶劑。另外,也可使用水或水與上述有機溶劑的混合物作為溶劑(d)。
優選的溶劑(d)為水或其他質子溶劑如醇,例如甲醇、乙醇、異丙醇和丁醇,以及水與這些醇的混合物,其中特別優選的溶劑為水。
如果合適的話,黏合劑(c)也可充當溶劑(d)。
在本發明上下文中,術語“聚合物”包括具有大於一個以上相同或不同重複單元的所有化合物。
共軛聚合物為含有至少一個交替雙鍵和單鍵序列或者芳族或雜芳族環的連續序列的那些聚合物。
這裡,導電聚合物應理解為意指特別是在氧化或還原以後具有電導性的共軛聚合物的化合物類。優選這種共軛聚合物被認為是指在氧化以後電導率數量級為至少1 μS/cm的導電聚合物。
溶液(a)中的共軛聚合物(b)優選含有至少一種任選取代的聚噻吩、聚吡咯或聚苯胺。
溶液(a)優選包含其它提高電導性的添加劑,例如含有醚基團的化合物如四氫呋喃;含有內酯基團的化合物如γ-丁內酯、γ-戊內酯;含有醯胺或內醯胺基團的化合物如己內醯胺、N-甲基己內醯胺、N,N-二甲基乙醯胺、N-甲基乙醯胺、N,N-二甲基甲醯胺(DMF)、N-甲基甲醯胺、N-甲基甲醯苯胺、N-甲基吡咯烷酮(NMP)、N-辛基吡咯烷酮、吡咯烷酮;碸和亞碸如環丁碸(四亞甲基碸)、二甲亞碸(DMSO);糖或糖衍生物如蔗糖、葡萄糖、果糖、乳糖、糖醇如山梨糖醇、甘露糖醇;醯亞胺如琥珀醯亞胺或馬來醯亞胺;呋喃衍生物如2-呋喃甲酸、3-呋喃甲酸,和/或二元醇或多元醇如乙二醇、甘油或者二甘醇或三甘醇。特別優選使用四氫呋喃、N-甲基甲醯胺、N-甲基吡咯烷酮、乙二醇、二甲亞碸或山梨糖醇作為提高電導性的添加劑。其它添加劑可每種情況下單獨或以其任何所需組合存在於溶液(a)中。
溶液(a)的pH值為1至14,pH值優選為1至10,pH值特別優選1至8,pH值是在25°C下測定。
為調整pH值,可將例如鹼或酸加入溶液中。鹼可以為無機鹼如氫氧化鈉、氫氧化鉀、氫氧化鈣或氨,或有機鹼如乙胺、二乙胺、三乙胺、丙胺、二丙胺、三丙胺、異丙胺、二異丙胺、丁胺、二丁胺、三丁胺、異丁胺、二異丁胺、三異丁胺、1-甲基丙胺、甲基乙胺、雙(1-甲基)丙胺、1,1-二甲基乙胺、戊胺、二戊胺、二戊胺、2-戊胺、3-戊胺、2-甲基-丁胺、3-甲基丁胺、雙(3-甲基丁胺)、三(3-甲基丁胺)、己胺、辛胺、2-乙基己胺、癸胺、N-甲基丁胺、N-乙基丁胺、N,N-二甲基乙胺、N,N-二甲基丙基、N-乙基二異丙胺、烯丙胺、二烯丙胺、乙醇胺、二乙醇胺、三乙醇胺、甲基乙醇胺、甲基二乙醇胺、二甲基乙醇胺、二乙基乙醇胺、N-丁基乙醇胺、N-丁基二乙醇胺、二丁基乙醇胺、環己基乙醇胺、環己基二乙醇胺、N-乙基乙醇胺、N-丙基乙醇胺、叔丁基乙醇胺、叔丁基二乙醇胺、丙醇胺、二丙醇胺、三丙醇胺或苄胺。酸可以為無機酸如硫酸、磷酸或硝酸,或有機酸如羧酸或磺酸。優選不損害溶液的膜形成且在相對高溫如焊接溫度下保留在固體電解質中的那些添加劑,鹼例如二甲基乙醇胺、二乙醇胺、氨或三乙醇胺,酸例如聚苯乙烯磺酸。
根據施加方法,溶液的黏度可以為0.1 mPa·s至100000 mPa·s(在20°C和100 s
-1的剪切速率下用流變儀測定)。黏度優選為1 mPa·s至10000 mPa·s,更優選10 mPa·s至1000 mPa·s最優選 30 mPa·s至500 mPa·s。
所述電極體或所述固體電解質是由一具有至少一磺酸基(sulfonyl hydroxide)的聚噻吩(polythiophene),如式(I)所示,或是具有至少一磺酸基(sulfonyl hydroxide)的聚硒吩(selenophene),如式(II)所示。又或者,同時包含式(I)所示的具有至少一磺酸基的聚噻吩以及式(II)所示具有至少一磺酸基的聚硒吩。
式(I); | 式(II)。 |
在式(I)、式(II)中,k為1至50之間的任意整數,X和Y各自獨立選自於由氧原子、硫原子和-NR
1所構成的群組。R
1是選自於由下列所構成的群組:氫原子、經取代或未取代且碳數為1至18的烷基和經取代或未取代且碳數為5至14的芳香基。
前述“碳數為1至18的烷基”可以是甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、1-甲基丁基、2-甲基丁基、3-甲基丁基、1-乙基丙基、1,1-二甲基丙基、1,2-二甲基丙基、2,2-二甲基丙基、正己基、正庚基或正辛基;較佳的,R
1是碳數為1至4的烷基。
在式(I)、式(II)中,Z為-(CH
2)
m-CR
2R
3-(CH
2)
n-,其中,m為0至3的整數,n為0至3的整數。在本發明的說明書中,所述“m為0至3的整數”代表m可以是0、1、2或3;所述“-(CH
2)-”代表亞甲基(methylene)。換句話說,取代基Z的碳數或鏈長會根據m和n的數值而改變。舉例來說,當m、n都為0時,取代基Z為“-CR
2R
3-”,且式(I)中的X、Z、Y和噻吩環狀結構中的第3、4號碳會構成一五環結構。當m和n的總和為1時,取代基Z為“-(CH
2)-CR
2R
3-”,且式(I)中的X、Z、Y和噻吩環狀結構中的第3、4號碳會構成一六環結構(如式(VII)至式(XII)所示)。類似的,式(II)中的X、Z、Y和硒吩環狀結構中的第3、4號碳會構成一六環結構(如式(XIII)至式(XVIII)所示)。
在取代基Z中,R
2是選自於由下列所構成的群組:氫原子、-(CH
2)
p-O-(CH
2)
q-SO
3 -M
+、-(CH
2)
p-NR
4[(CH
2)
q-SO
3 -M
+]、-(CH
2)
p-NR
4[Ar-SO
3 -M
+]和-(CH
2)
p-O-Ar-[(CH
2)
q-SO
3 -M
+]
r。R
3是選自於由下列所構成的群組:-(CH
2)
p-O-(CH
2)
q-SO
3 -M
+、-(CH
2)
p-NR
4[(CH
2)
q-SO
3 -M
+]、-(CH
2)
p-NR
4[Ar-SO
3 -M
+]和-(CH
2)
p-O-Ar-[(CH
2)
q-SO
3 -M
+]
r。並且,在R
2和R
3中,p各自獨立為0至6的整數;q各自獨立為0或1;r各自獨立為1至4的整數;Ar為亞芳基(arylene);R
4是選自於由氫原子、經取代或未取代且碳數為1至18的烷基和經取代或未取代且碳數為5至14的芳香基所構成的群組;M
+為金屬陽離子。於一實施例中,M
+為鋰離子、鈉離子、鉀離子或銨離子。
根據上述,本發明式(I)中的導電聚合物並不包括聚(3,4-乙烯基二氧噻吩)(poly(3,4-ethylenedioxythiophene),PEDOT)。也就是說,本發明使用不同於業界的導電聚合物,仍具有優秀的電性特性。
於一較佳實施例中,式(I)、式(II)中的X和Y都為氧原子,具有至少一磺酸基的聚噻吩如下式(III)所示,具有至少一磺酸基的聚硒吩如下式(V)所示。於另一較佳實施例,式(I)、式(II)中的X和Y中其中一個為氧原子另一個為硫原子,具有至少一磺酸基的聚噻吩如下式(IV)所示,具有至少一磺酸基的聚硒吩如下式(VI)所示。
式(III); | 式(IV); | ||
式(V); | 式(VI)。 |
在式(III)至式(VI)中,k為1至50之間的任意整數,取代基Z為-(CH
2)
m-CR
2R
3-(CH
2)
n-,其中,m為0至3的整數,n為0至3的整數。在取代基Z中,R
2是選自於由下列所構成的群組:氫原子、-(CH
2)
p-O-(CH
2)
q-SO
3 -M
+、-(CH
2)
p-NR
4[(CH
2)
q-SO
3 -M
+]、-(CH
2)
p-NR
4[Ar-SO
3 -M
+]和-(CH
2)
p-O-Ar-[(CH
2)
q-SO
3 -M
+]
r。R
3是選自於由下列所構成的群組:-(CH
2)
p-O-(CH
2)
q-SO
3 -M
+、-(CH
2)
p-NR
4[(CH
2)
q-SO
3 -M
+]、-(CH
2)
p-NR
4[Ar-SO
3 -M
+]和-(CH
2)
p-O-Ar-[(CH
2)
q-SO
3 -M
+]
r。在R
2和R
3中,p各自獨立為0至6的整數,q各自獨立為0或1,r各自獨立為1至4的整數,Ar為亞芳基,R
4是選自於由氫原子、經取代或未取代且碳數為1至18的烷基和經取代或未取代且碳數為5至14的芳香基所構成的群組,M
+為金屬陽離子。於一實施例中,M
+為鋰離子、鈉離子、鉀離子或銨離子。
於一較佳實施例中,X和Y皆為氧原子且m和n的總和為1,具有至少一磺酸基的聚噻吩可以下列式(VII)至式(XII)中的其中一種表示,具有至少一磺酸基的聚硒吩可以下列式(XIII)至式(XVIII)中的其中一種表示:
式(VII); | 式(VIII); |
式(IX); | 式(X); |
式(XI); | 式(XII); |
式(XIII); | 式(XIV); |
式(XV); | 式(XVI); |
式(XVII); | 式(XVIII)。 |
在式(VII)至式(XVIII)中,k為1至50之間的任意整數,所述“
”和“
”代表亞甲基(methylene),與前述“-(CH
2)-”相同,為了簡潔故僅以碳-碳鍵表示。在式(VII)至式(XVIII)中,p各自獨立為0至6的整數,q各自獨立為0或1,r各自獨立為1至4的整數,Ar為亞芳基,R
4是選自於由氫原子、經取代或未取代且碳數為1至18的烷基和經取代或未取代且碳數為5至14的芳香基所構成的群組;M
+為金屬陽離子。於一實施例中,M
+為鋰離子、鈉離子、鉀離子或銨離子。
固體電解質優選在電介質表面上形成厚度小於1000 nm,更優選小於200 nm,最優選小於50 nm的層。
電介質被固體電解質覆蓋的覆蓋度可以如下方式確定:在120 Hz下在乾燥和潮濕狀態下測量電容器的電容。覆蓋度為作為百分數表述的乾燥狀態下電容與潮濕狀態下電容之比。“乾燥狀態”意指在分析以前將電容器在升高的溫度(80°C至120°C)下乾燥數小時。“潮濕狀態”意指在升高的壓力下,例如在蒸汽鍋爐中將電容器暴露在飽和的空氣濕度下數小時。在此過程中,濕氣透過未用固體電解質覆蓋的孔並在那裡充當液體電解質。
固體電解質對電介質的覆蓋度優選大於50%,特別優選大於70%,最特別優選大於80%。
當代替多孔燒結體,使用多孔膜如鋁箔作為電極體時,原則上產生與上述類似的結構。為實現較高的電容,優選將多個膜並聯接觸連接並一起封裝在一個外殼中。
聚合物外層的厚度優選為1 μm至1000 μm,更優選1 μm至100 μm,甚至更優選2 μm至50 μm,非常尤其優選4 μm至20 μm。在外表面上,層厚度可變化。更特別地,在電容器體邊緣的層厚度可比在電容器體側面的更厚或更薄。然而,優選實際上均勻的層厚度。
聚合物外層可為形成電容器體外層的多層體系的一部分。其它功能層也可存在於聚合物外層上。另外,多個聚合物外層可存在於電容器體上。
原則上,本發明這類電解電容器可如下生產:首先例如將具有高表面積的電子管金屬粉壓製並燒結成多孔電極體。這通常還包括將優選由電子管金屬如鉭製成的電接觸線壓入電極體內。作為選擇,也可蝕刻金屬箔以得到多孔膜。
將電極體例如通過電化學氧化而塗覆電介質即氧化物層。然後將導電聚合物例如通過氧化聚合而化學或電化學沉積在電介質上並形成固體電解質。為此,將製備導電聚合物的前體、一種或多種氧化劑和如果合適的話抗衡離子一起或依次施加於多孔電極體的電介質上並化學和氧化聚合,或者使製備導電聚合物的前體和抗衡離子在多孔電極體的電介質上通過電化學聚合而聚合。為形成固體電解質,所用導電材料優選為導電聚合物如任選取代的聚噻吩、聚吡咯或聚苯胺的溶液。
根據本發明,在生產固體電解質以後,將交聯劑(e)和然後包含共軛聚合物(b)和溶劑(d)的溶液(a)施加於電容器體上,並通過至少部分除去溶劑(d)而形成聚合物外層。任選將聚合物外層後處理以提高聚合物外層中共軛聚合物的導電性。後處理可例如由熱後處理組成。任選將其它層施加於聚合物外層上。具有良好導電率的層如石墨和銀的塗層用作放出電流的電極。最後,接觸連接並封裝電容器。
還優選一種生產電解電容器的方法,其特徵在於電極材料為電子管金屬或具有與電子管金屬相當的電性能的化合物。
在本發明上下文中,電子管金屬應理解為意指其氧化物層不允許電流在兩個方向上同等流動的那些金屬:在陽極電壓的情況下,電子管金屬的氧化物層阻止電流流動,而陰極電壓產生可破壞氧化物層的大電流。電子管金屬包括Be、Mg、Al、Ge、Si、Sn、Sb、Bi、Ti、Zr、Hf、V、Nb、Ta和W以及至少一種這些金屬與其它元素的合金或化合物。熟知的電子管金屬的代表為Al、Ta和Nb。具有與電子管金屬相當的電性能的化合物為具有金屬電導性、可氧化且其氧化物層具有上述性能的那些。例如NbO具有金屬電導性,但通常不被認為是電子管金屬。然而,氧化的NbO層具有電子管金屬氧化物層的典型性能,所以NbO或NbO與其它元素的合金或化合物為這種具有與電子管金屬相當的電性能的化合物的典型實例。
優選由鉭、鋁組成的電極材料和基於鈮或鈮氧化物的那些電極材料。
基於鈮或鈮氧化物的電極材料應理解為意指其中鈮或鈮氧化物構成具有最大數量比例的組分的那些材料。基於鈮或鈮氧化物的電極材料優選為鈮,NbO,鈮氧化物NbO
x,其中x可取0.8至1.2的值,鈮氮化物、鈮氧氮化物或這些材料的混合物或這些材料中的至少一種與其它元素的合金或化合物。
優選的合金為包含至少一種電子管金屬如Be、Mg、Al、Ge、Si、Sn、Sb、Bi、Ti、Zr、Hf、V、Nb、Ta或W的合金。
因此,術語“可氧化金屬”不僅指金屬,而且指金屬與其它元素的合金或化合物,條件是它們具有金屬電導性並且可氧化。
例如將可氧化金屬以粉末形式燒結成多孔電極體或賦予金屬體多孔結構。後一種方法可例如通過蝕刻膜進行。
多孔電極體例如在合適的電解質如磷酸中通過施加電壓而氧化。該形成電壓的大小取決於要實現的氧化物層厚度和/或電容器的未來應用電壓。優選形成電壓為1 V至800 V,特別優選1 V至300 V。
為生產電極體,使用優選比電荷為1000 μC/g至1000000 μC/g,更優選比電荷為5000 μC/g至500000 μC/g,甚至更優選比電荷為5000 μC/g至300000 μC/g,格外優選比電荷為10000 μC/g至200000 μC/g的金屬粉。
如下計算金屬粉的比電荷:
金屬粉的比電荷=(電容×陽極化電壓)/氧化電極體的重量。
電容由在120 Hz下在含水電解質中測量的氧化電極體的電容測定。電解質的電導率足夠大,使得由於電解質的電阻率,在120 Hz下仍不存在電容下降。例如使用18%含水硫酸電解質測量。
所用電極體的孔隙率為10%至90%,優選30%至80%,更優選50%至80%。
多孔電極體的平均孔徑為10 nm至10000 nm,優選50 nm至5000 nm,更優選100 nm至3000 nm。
因此,本發明更優選提供一種生產電解電容器的方法,其特徵在於電子管金屬或具有與電子管金屬相當的電性能的化合物為鉭、鈮、鋁、鈦、鋯、鉿、釩、這些金屬中的至少一種與其它元素的合金或化合物、NbO或NbO與其它元素的合金或化合物。
電介質優選由電極材料的氧化物組成。它任選包含其它元素和/或化合物。
電容器的電容不僅取決於電介質的類型,而且取決於電介質的表面積和厚度。比電荷為每單位重量氧化電極體可容納多少電荷的量度。如下計算電容器的比電荷:
電容器的比電荷=(電容×額定電壓)/氧化電極體的重量。
電容由在120 Hz下測量的最終電容器的電容測定,額定電壓為電容器的指定使用電壓。氧化電極體的重量基於電介質塗覆的沒有聚合物、觸點和封裝的多孔電極材料的純重量。
通過所述新方法生產的電解電容器的比電荷優選為500 μC/g至500000 μC/g,更優選比電荷為2500 μC/g至250000 μC/g,甚至更優選比電荷為2500 μC/g至150000 μC/g,格外優選比電荷為5000 μC/g至100000 μC/g。
溶液(a)中共軛聚合物(b)的固體含量為0.1重量%至90重量%,優選0.5重量%至30重量%,最優選0.5重量%至10重量%。
將溶液(a)通過已知方法,例如通過旋塗、浸漬、澆鑄、滴塗、噴霧、刀塗、塗漆或印刷如噴墨印刷、絲網印刷或移印施加在電容器體上。
在施加溶液(a)以後,優選除去溶劑(d)以便溶液(a)中的共軛聚合物(b)和任何其它添加劑可形成聚合物外層。然而,也可將至少一部分溶劑(d)保留在聚合物外層中。根據溶劑(d)的類型,其也可完全固化或者在部分除去以後僅部分仍保留。
可將溶劑(d)在施加溶液以後通過在室溫下簡單蒸發而除去。然而,為實現較高的加工速度,更有利的是在升高的溫度下,例如在20°C至300°C,優選40°C至250°C的溫度下除去溶劑(d)。熱處理可在除去溶劑的同時直接進行,或在塗覆完成以後的不同時間進行。
取決於用於塗覆的溶液類型,熱處理持續時間為5秒至數小時。對於熱處理,也可使用不同溫度和停留時間的溫度曲線。
熱處理可例如以如下方式進行:塗覆的氧化電極體以使在選定溫度下達到所需停留時間的速度在所需溫度下移動通過加熱室,或者在所需溫度下與加熱板接觸所需停留時間。另外,熱處理可例如在烘箱或具有不同溫度的數個烘箱中進行。
在產生聚合物外層以後,可優選將具有良好電導性的其它層,例如石墨和/或銀層施加在電容器上,並將電容器連接在觸點上並封裝。
本發明方法使得可以以特別簡單的方式生產具有聚合物外層的固體電解電容器,所述外層甚至在電容器體的邊緣和角上也是不透的。固體電解電容器由於低ESR、低殘餘電流和高熱穩定性而顯著。通過本發明方法生產的電解電容器因此同樣形成本發明主題的部分。
由於根據本發明生產的電解電容器的低殘餘電流和它們的低ESR,它們顯著適用作電子電路中的元件如用作濾波電容器或去耦電容器。該用途也是本發明主題的部分。優選電子電路,例如存在於電腦(台式、膝上型、伺服器)、電腦週邊設備(例如PC卡)、可擕式電子器件如行動電話、數碼相機或娛樂電子設備、用於娛樂電子設備的器件如CD/DVD播放機和電腦遊戲控制台、導航系統、通訊設備、家用電器、電源或汽車電子設備中。
本發明的其中一有益效果在於,本發明所提供的生產電解電容器的方法,其能通過“所述電極體或所述固體電解質是由一具有至少一磺酸基的聚噻吩所形成”的技術特徵,以提升電解電容器的電氣特性。
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書內容所做的等效技術變化,均包含於本發明的申請專利範圍內。
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Claims (15)
- 一種生產電解電容器的方法,其包括:將至少一種交聯劑(e)施加在一電容器體上;其中,所述交聯劑(e)包含至少一種二胺、三胺、低聚胺、聚合胺或其衍生物,至少一種陽離子和另外至少一種胺基團,或至少一種多價陽離子,或者在施加溶液(a)以後,交聯劑(e)形成至少一種多價陽離子;以及在施加所述交聯劑(e)以後,施加一溶液(a)於所述電容器體上,所述溶液(a)包含一共軛聚合物(b);以及除去溶液(a)中的部分溶劑(d),以於所述電容器體上形成一聚合物外層;其中;所述電容器體包括一電極體、一電極材料、一電介質以及一固體電解質,所述電極材料形成於所述電極體上,所述電介質覆蓋所述電極材料的表面,所述固體電解質完全或部分覆蓋所述電介質的表面,所述固體電解質是由一導電材料所形成,所述電極體或所述固體電解質是由一具有至少一磺酸基的聚噻吩及具有至少一磺酸基的聚硒吩中的至少一種所形成。
- 如請求項1所述的生產電解電容器的方法,其中,所述溶液(a)包含重均分子量大於1000的聚合物。
- 如請求項2所述的生產電解電容器的方法,其中,所述重均分子量大於1000的聚合物包括所述至少一種溶液(a)中的所述共軛聚合物(b)、聚合物陰離子或黏合劑。
- 如請求項3所述的生產電解電容器的方法,其中,所述聚合物陰離子為聚合羧酸或磺酸的陰離子。
- 如請求項1所述的生產電解電容器的方法,其中,所述溶液(a)的pH值小於10。
- 如請求項1所述的生產電解電容器的方法,其中,所述溶液(a)包含水或至少一種有機溶劑。
- 如請求項1所述的生產電解電容器的方法,其中,所述交聯劑(e)為一鹽類或一鹽溶液。
- 如請求項7所述的生產電解電容器的方法,其中,所述交聯劑(e)溶於所述溶液(a)中。
- 如請求項1所述的生產電解電容器的方法,其中,所述交聯劑(e)和所述溶液(a)交替地重複施加。
- 如請求項1所述的生產電解電容器的方法,其中,所述溶液(a)包含至少一種被取代的聚噻吩、被取代的聚苯胺或被取代的聚吡咯作為共軛聚合物(b)。
- 如請求項1所述的生產電解電容器的方法,其中,所述具有至少一磺酸基的聚噻吩的化學結構式如式(I)所示,所述具有至少一磺酸基的聚硒吩的化學結構式如式(II)所示:
- 如請求項1所述的生產電解電容器的方法,其中,所述具有至少一磺酸基的聚噻吩的化學結構式如式(III)或式(IV)所示,所述具有至少一磺酸基的聚硒吩的化學結構式如式(V)或式(VI)所示:
- 如請求項1所述的生產電解電容器的方法,其中,所述導電材料是由所述具有至少一磺酸基的聚噻吩所形成。
- 如請求項1所述的生產電解電容器的方法,其中,所述電極體的所述電極材料是閥金屬或具有閥金屬的電性能的化合物。
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TW201610009A (zh) * | 2014-05-30 | 2016-03-16 | 赫瑞斯德國有限兩合公司 | 作爲用於傳導性聚合物之黏著底漆的二或多官能化合物 |
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