TWI765313B - Backlight module and display device therewith - Google Patents

Abstract

A backlight module includes an optical plate, a light source and a prism sheet. The optical plate includes a light-emitting surface, a bottom surface and a side surface. The bottom surface is opposite to the light-emitting surface. The side surface is connected between the light-emitting surface and the bottom surface. The light source is disposed on the bottom surface or the side surface. The prism sheet is disposed above the optical plate. The prism sheet is formed with a plurality of first strip-shaped microstructures. The plurality of first strip-shaped microstructures face the optical plate. Each of the first strip-shaped microstructures includes a ridge portion. The ridge portion is formed with a concave structure and/or a convex structure.

Description

Backlight module and display device

The present invention relates to a backlight module and a display device, and more particularly, to a backlight module and a display device including the backlight module which can improve the overall optical properties by improving the structure of the wafer.

With the advancement of science and technology, electronic devices equipped with liquid crystal display (LCD) panels, such as mobile phones, tablets, notebook computers, vehicle display devices, etc., have become indispensable items in modern life. Since the liquid crystal itself does not emit light, the LCD panel needs to use a backlight module as a backlight source. However, the existing backlight module is prone to lack of uneven brightness and darkness, thereby affecting the image quality of the LCD panel.

How to overcome the lack of uneven brightness and darkness of the backlight module to improve the overall optical properties of the backlight module has become the goal of the relevant industry.

The purpose of the present invention is to provide a backlight module and a display device to solve the above problems.

According to an embodiment of the present invention, a backlight module is provided, which includes an optical plate, a light source, and a wafer. The optical plate includes a light-emitting surface, a bottom surface and a side surface, the bottom surface is opposite to the light-emitting surface, and the side surface is connected between the light-emitting surface and the bottom surface. The light source is arranged on the bottom surface or the side surface of the optical plate. The wafer is arranged above the optical plate, wherein the wafer is formed with a plurality of first strip-shaped microstructures, the first strip-shaped microstructures face the optical plate, the first strip-shaped microstructure includes an edge, and the edge is A concave structure and/or a convex structure are formed.

According to the aforementioned backlight module, a plurality of second strip-shaped microstructures may be formed on the light-emitting surface of the optical plate, and the second strip-shaped microstructures may include an edge portion, and the edge portion may be formed with a concave structure and/or a convex structure up the structure.

According to the aforementioned backlight module, the first strip-shaped microstructures extend along a first direction, the second strip-shaped microstructures extend along a second direction, and the first direction may be substantially perpendicular to the second direction.

According to the aforementioned backlight module, the light source can be disposed on the side surface of the optical plate, the first direction can be substantially parallel to a length direction of the side surface, and the second direction can be substantially perpendicular to the length direction of the side surface.

According to the aforementioned backlight module, the size of the second strip-shaped microstructures can be the same.

According to the aforementioned backlight module, the edges of the first strip-shaped microstructure and/or the second strip-shaped microstructure may be formed with a plurality of recessed structures, and the recessed structures are arranged at equal intervals.

According to the aforementioned backlight module, a plurality of protruding structures may be formed on the edges of the first strip-shaped microstructure and/or the second strip-shaped microstructure, and the protruding structures are arranged at equal intervals.

According to the aforementioned backlight module, the edges of the first strip-shaped microstructure and/or the second strip-shaped microstructure are formed with a plurality of concave structures and a plurality of convex structures, and the concave structures and the convex structures are arranged at intervals .

According to the aforementioned backlight module, the recessed structure may be an arc-shaped recessed structure, an angular recessed structure or a square recessed structure.

According to the aforementioned backlight module, the protruding structure can be an arc-shaped protruding structure, an angular protruding structure or a square-shaped protruding structure.

According to an embodiment of the present invention, a display device is provided, which includes the aforementioned backlight module or a display panel disposed above the backlight module.

Compared with the prior art, in the backlight module of the present invention, a plurality of first strip-shaped microstructures are formed on the wafer, the first strip-shaped microstructures face the optical plate, and the first strip-shaped microstructures A recessed structure and/or a protruding structure is formed on the ridge, which is beneficial to reduce the contact area between the wafer and the element arranged under it, and can avoid the adsorption between the wafer and the element arranged under it due to the large contact area. In order to improve the problem of uneven brightness and darkness caused by the adsorption phenomenon, the backlight module has better light output uniformity, which is beneficial to improve the overall optical properties of the backlight module.

10,10a: Backlight module

20: Display device

100,100a: Optical Board

110,110a: light-emitting surface

120,120a: Bottom

130, 130a: side

140a: Second strip microstructure

145a: Rib

150a: Recessed Structure

151a: first concave surface

152a: Second recessed surface

200: light source

210: LED

300, 300a, 300b, 300c, 300d, 300e: Pills

310, 310a, 310b, 310c, 310d, 310e: The first stripe microstructure

315, 315a, 315b, 315c, 315d, 315e: Ribs

320, 320a, 320d, 320e: recessed structures

321, 321a, 321e: First recessed surface

322, 322a, 322e: Second recessed surface

323a: Third recessed surface

330b, 330c, 330d: Raised structures

400: Display panel

A: Line of sight

D1: first direction

D2: Second direction

L: length direction

FIG. 1 is an exploded schematic diagram of a backlight module according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the backlight module of FIG. 1 in an assembled state.

FIG. 3 is a partial three-dimensional schematic diagram of a hibiscus sheet according to an embodiment of the present invention.

Fig. 4 is a schematic side view of the hibiscus plate in the line of sight direction A in Fig. 3 .

FIG. 5 is a schematic side view of a diaphanous sheet according to another embodiment of the present invention.

FIG. 6 is a schematic side view of a crystal sheet according to another embodiment of the present invention.

FIG. 7 is a schematic side view of a diaphanous sheet according to another embodiment of the present invention.

FIG. 8 is a schematic side view of a diaphanous sheet according to another embodiment of the present invention.

FIG. 9 is a schematic three-dimensional view of a crystal sheet according to another embodiment of the present invention.

FIG. 10 is an exploded schematic diagram of a backlight module according to another embodiment of the present invention.

FIG. 11 is a schematic cross-sectional view of the backlight module of FIG. 10 in an assembled state.

FIG. 12 is an exploded schematic diagram of a display device according to an embodiment of the present invention.

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front, rear, bottom, top, etc., are only for referring to the directions of the attached drawings. Accordingly, the directional terms used are intended to illustrate, but not to limit the invention. Furthermore, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.

In the present invention, “edge portion” refers to a portion including a ridge line, wherein a ridge line refers to a plurality of prismatic elongated microstructures or a plurality of cylindrical elongated microstructures disposed on a substrate, the same prismatic elongated microstructure. The collection of all highest points of a structure or of the same cylindrical elongated microstructure.

In the present invention, the two elements are substantially parallel means that there is an included angle between the two elements, and the included angle is 0°±10°, preferably 0°±5°, more preferably 0°±3°, or the included angle is 180°±10°, preferably 180°±5°, more preferably 180° ±3 degrees. In the present invention, the two elements are substantially vertical means that there is an included angle between the two elements, and the included angle is 90°±10°, preferably 90°±5°, more preferably 90°±3°.

In the present invention, the backlight module can be used to provide a light source for a liquid crystal display (LCD) panel. Each element in the backlight module includes a bottom surface and a top surface. The definitions of the bottom surface and the top surface are based on the LCD panel. Benchmark, each component takes the side away from the LCD panel as the bottom surface, and the side facing the LCD panel as the top surface. In addition, in the present invention, that an element is disposed above another element means disposed on the top surface of the other element or above the top surface of the other element.

Please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic exploded view of the backlight module 10 according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the backlight module 10 of FIG. 1 in an assembled state. The backlight module 10 includes an optical plate 100 , a light source 200 , and a wafer 300 .

The optical plate 100 includes a light emitting surface 110 , a bottom surface 120 and a side surface 130 . The bottom surface 120 is opposite to the light emitting surface 110 , and the side surface 130 is connected between the light emitting surface 110 and the bottom surface 120 . The optical plate 100 is used for guiding the light emitted by the light source 200 to the light emitting surface 110 for emission.

The light source 200 is disposed on the side surface 130 of the optical plate 100 . Based on the configuration of the light source 200 , the backlight module 10 is an edge type backlight module. In other embodiments, the light source 200 may be disposed on the bottom surface 120 of the optical plate 100 . At this time, the backlight module 10 is a direct type backlight module. The light source 200 is exemplified by a light emitting diode (Light Emitting Diode, LED) light bar. The LED light bar includes a plurality of LEDs 210. However, the present invention is not limited to this. In other embodiments, the light source 200 may be But not limited to Cold Cathode Fluorescent Lamp (CCFL).

The wafer 300 is disposed above the optical plate 100 , the wafer 300 is formed with a plurality of first strip-shaped microstructures 310 , and the first strip-shaped microstructures 310 face the optical plate 100 . Therefore, the wafer 300 is different from the general wafer 300 . The microstructures of the wafers are designed to face upward and away from the optical plate 100 , and the wafers 300 are generally referred to as inverse wafers. The first strip-shaped microstructures 310 extend along a first direction D1, and the first direction D1 is substantially parallel to a length direction L of the side surface 130a, wherein the side surface 130a may be a rectangular surface, and the rectangular surface (ie, the side surface 130a) The long side is parallel to the length direction L. In this embodiment, the first strip-shaped microstructures 310 are angular column-shaped elongated microstructures (V-cut), but the invention is not limited to this, and the first strip-shaped microstructures 310 may also be cylindrical elongated microstructures. Structure (R-cut). Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a partial three-dimensional schematic view of the iris sheet 300 according to an embodiment of the present invention, and FIG. The first strip-shaped microstructure 310 includes an edge portion 315 , and the edge portion 315 is formed with a concave structure 320 . In this embodiment, the recessed structure 320 includes a first recessed surface 321 and a second recessed surface 322, the first recessed surface 321 and the second recessed surface 322 are connected to each other and have an included angle (not marked), so that the recessed The cross-section of the structure 320 is triangular (as shown in FIG. 4 ), that is, the recessed structure 320 is an angular recessed structure. The aforementioned angular recessed structure means that the recessed structure 320 includes an included angle. In this embodiment, the ridges 315 of each first strip-shaped microstructure 310 are provided with a plurality of concave structures 320 , and the plurality of concave structures 320 on the same first strip-shaped microstructure 310 are continuously disposed. However, the present invention is not limited to this, and the shape, quantity and configuration of the recessed structures 320 can be adjusted according to actual needs. For example, in other embodiments, the recessed structures 320 can be replaced by a curved surface instead of the aforementioned first recessed surface 321 and the first recessed surface 320 . The two concave surfaces 322 , that is, the concave structure 320 is an arc-shaped concave structure. The aforementioned arc-shaped concave structure means that the concave surface of the concave structure 320 is arc-shaped. For another example, the concave structures 320 may be provided only on one or some of the edges 315 of the first strip-shaped microstructures 310 . For another example, the number of the recessed structures 320 on the same first strip-shaped microstructure 310 may be plural, and the plurality of recessed structures 320 are arranged at fixed distance intervals (equidistantly arranged) or arranged at irregular distance intervals (not evenly spaced settings). In other words, the plurality of recessed structures 320 may be arranged regularly or randomly.

Please refer to FIG. 2 to FIG. 4 , at the point where the first strip-shaped microstructure 310 contacts the optical plate 100 , the light path is easily damaged and a bright spot is generated, which often occurs in a small area and looks like a small stall. Water stains, this is the adsorption phenomenon, in other words, the adsorption phenomenon will lead to the problem of uneven light and dark. However, by disposing the concave structures 320 on the first strip-shaped microstructures 310, the first strip-shaped microstructures 310 are not in contact with the optical plate 100 at the concave structures 320, so that the number of the first strip-shaped microstructures 310 and the optical plate can be reduced. The contact area of 100 can further avoid the adsorption phenomenon between the first strip-shaped microstructure 310 and the optical plate 100, and can improve the problem of uneven brightness and darkness accompanying the adsorption phenomenon. In other embodiments, as shown in FIG. 6 to FIG. 8, protruding structures 330b, 330c, 330d may be disposed on the first strip-shaped microstructures 310b, 310c, 310d, respectively, so that the first strip-shaped microstructures 310b , 310c, 310d are respectively contacted with the optical board 100 by the protruding structures 330b, 330c, 330d, and the places without the protruding structures 330b, 330c, 330d are not in contact with the optical board 100, and the first strip-shaped microstructure 310 can be reduced The contact area with the optical plate 100 can further avoid the adsorption phenomenon and improve the problem of uneven brightness and darkness.

The backlight module 10 can optionally further include other optical elements, such as a reflection sheet, a diffusion sheet, etc., to improve the optical properties.

The light emitting surface 110 of the optical plate 100 may generally be a full plane without microstructures. In addition, as shown in FIG. 10 , a plurality of second strip-shaped microstructures 140a can also be formed on the light-emitting surface 110a of the optical plate 100a. In this embodiment, the sizes of the second strip-shaped microstructures 140a are the same, and the second strip-shaped microstructures 140a are rectangular elongated microstructures. However, the invention is not limited to this, and the second strip-shaped microstructures 140a are also Can be cylindrical elongated microstructures.

In the backlight module of the present invention, a plurality of first strip-shaped microstructures are formed on the top plate, The first strip-shaped microstructure faces the optical plate, and a concave structure and/or a protruding structure is formed on the edge of the first strip-shaped microstructure, which is beneficial to reduce the contact area between the iris sheet and the element disposed below it. , which can avoid the adsorption phenomenon caused by the large contact area between the wafer and the components arranged below it, so as to improve the problem of uneven brightness and darkness accompanying the adsorption phenomenon, so that the backlight module has better uniformity of light output, which is beneficial to To improve the overall optical properties of the backlight module.

Please refer to FIG. 5 , which is a schematic side view of a wafer 300 a according to another embodiment of the present invention. The viewing angle of FIG. 5 is the same as that of FIG. 4 . The wafer 300a is formed with a plurality of first strip-shaped microstructures 310a, the first strip-shaped microstructures 310a face the optical plate, the first strip-shaped microstructure 310a includes an edge portion 315a, and the edge portion 315 is formed with a plurality of recessed structures 320a, The plurality of recessed structures 320a are arranged at equal intervals. The recessed structure 320a includes a first recessed surface 321a, a second recessed surface 322a and a third recessed surface 323a. The first recessed surface 321a and the second recessed surface 322a are connected to each other and have a first included angle (not marked otherwise), The second concave surface 322a and the third concave surface 323a are connected to each other and have a second included angle (not marked), the first included angle and the second included angle are both 90 degrees so that the cross-section of the recessed structure 320a is rectangular, that is, the recessed The structure 320a is a square recessed structure. In other embodiments, one of the first included angle or the second included angle can be configured to be an angle other than 90 degrees, so that the cross-section of the recessed structure 320a is a trapezoid, or the recessed structure 320a can be added with other The concave surface makes the cross section of the concave structure 320a be other polygons, such as pentagons and hexagons. For other details about the high-density film 300a, reference may be made to the high-density glass 300, which will not be repeated here.

Please refer to FIG. 6 , which is a schematic side view of a wafer 300 b according to another embodiment of the present invention. The viewing angle of FIG. 6 is the same as that of FIG. 4 . The wafer 300b is formed with a plurality of first strip-shaped microstructures 310b, the first strip-shaped microstructures 310b face the optical plate, the first strip-shaped microstructure 310b includes an edge portion 315b, and the edge portion 315b is formed with a plurality of protruding structures 330b , a plurality of protruding structures 330b are arranged at equal intervals. And the convex structure 330b is an arc-shaped convex structure. The aforementioned arc-shaped convex structure means that the convex surface of the convex structure 330b is arc. However, the present invention is not limited to this, and the shape, quantity and configuration of the protruding structures 330b can be adjusted according to actual needs. For example, in other embodiments, the protruding structures 330b can be configured as angular protruding structures. The structure means that the protruding structure 330b includes an included angle. For another example, the protruding structures 330b may be disposed on the edges 315b of one, some or all of the first strip-shaped microstructures 310b of the wafer 300b, for another example, the protruding structures 330b on the same first strip-shaped microstructure 310b The number can be plural, and the plurality of protruding structures 330b are arranged at irregular intervals, or the plurality of protruding structures 330b are continuously arranged. In other words, the plurality of protruding structures 330b can be arranged regularly or randomly. The other details about the high-density film 300b may be the same as those of the high-density film 300 and 300a under the condition that no contradiction occurs, and will not be repeated here.

Please refer to FIG. 7 , which is a schematic side view of a wafer 300 c according to another embodiment of the present invention. The viewing angle of FIG. 7 is the same as that of FIG. 4 . The wafer 300c is formed with a plurality of first strip-shaped microstructures 310c, the first strip-shaped microstructures 310c face the optical plate, the first strip-shaped microstructure 310c includes an edge portion 315c, and the edge portion 315c is formed with a plurality of protruding structures 330c , a plurality of protruding structures 330c are arranged at equal intervals, the protruding structure 330c is a square protruding structure, and the cross-section of the protruding structure 330c is a rectangle. The other details about the high-density film 300c can be the same as those of the high-density film 300, 300a, and 300b under the condition of no contradiction, and will not be repeated here.

Please refer to FIG. 8 , which is a schematic side view of a wafer 300d according to another embodiment of the present invention. The viewing angle of FIG. 8 is the same as that of FIG. 4 . The wafer 300d is formed with a plurality of first strip-shaped microstructures 310d. The first strip-shaped microstructures 310d face the optical plate. The first strip-shaped microstructure 310d includes an edge portion 315d. The edge portion 315d is formed with a plurality of recessed structures 320d and The plurality of protruding structures 330d, the recessed structures 320d and the protruding structures 330d are arranged at intervals, that is, the recessed structures 320d and the protruding structures 330d are staggered with each other, the recessed structure 320d is an arc-shaped recessed structure, and the protruding structure 330d is an arc-shaped protrusion structure. In addition, in this embodiment, the recessed structures 320d and the protruding structures 330d are continuously and staggered. In other embodiments, there may be an interval between the recessed structures 320d and the protruding structures 330d. Other details about the slivers 300d are in no spear In the case of the shield, it can be the same as that of the hi-chips 300, 300a, 300b, and 300c, and will not be repeated here.

Please refer to FIG. 9 , which is a three-dimensional schematic diagram of a diaphanous wafer 300e according to another embodiment of the present invention. A plurality of first strip-shaped microstructures 310e are formed on the wafer 300e, and the first strip-shaped microstructures 310e face the optical plate 100. In this embodiment, the first strip-shaped microstructures 310e are cylindrical elongated microstructures. The first strip-shaped microstructure 310e includes an edge portion 315e, the edge portion 315e is formed with a recessed structure 320e, the recessed structure 320e includes a first recessed surface 321e and a second recessed surface 322e, the first recessed surface 321e and the second recessed surface 322e are connected to each other and have an included angle (not marked otherwise), so that the cross-section of the recessed structure 320e is triangular, that is, the recessed structure 320e is an angular recessed structure, and other details about the wafer 300e can be used without conflict. It is the same as the hibiscus film 300, 300a, 300b, 300c, and 300d, and will not be repeated here.

Please refer to FIG. 10 and FIG. 11. FIG. 10 is a schematic exploded view of a backlight module 10a according to another embodiment of the present invention. FIG. 11 is a schematic cross-sectional view of the backlight module 10a of FIG. 10 in an assembled state. The backlight module 10a includes an optical plate 100a , a light source 200 and a wafer 300 . The details of the light source 200 and the iris sheet 300 can be referred to the above, and will not be repeated here.

The optical plate 100a includes a light emitting surface 110a, a bottom surface 120a and a side surface 130a. The bottom surface 120a is opposite to the light emitting surface 110a, and the side surface 130a is connected between the light emitting surface 110a and the bottom surface 120a. The optical plate 100a is used to guide the light emitted by the light source 200 to the light emitting surface 110a to be emitted.

A plurality of second strip-shaped microstructures 140a are formed on the light emitting surface 110a of the optical plate 100a. In this embodiment, the sizes of the second strip-shaped microstructures 140a are the same, and the second strip-shaped microstructures 140a are rectangular elongated microstructures. However, the invention is not limited to this, and the second strip-shaped microstructures 140a are also Can be cylindrical elongated microstructures. The second strip-shaped microstructure 140a includes an edge portion 145a, and the edge portion 145 is formed with a concave structure 150a. exist In this embodiment, the recessed structure 150a includes a first recessed surface 151a and a second recessed surface 152a, the first recessed surface 151a and the second recessed surface 152a are connected to each other and have an included angle (not marked), so that the recessed structure The cross section of 152a is triangular, that is, the recessed structure 152a is an angular recessed structure. In this embodiment, the ridges 145a of each second strip-shaped microstructure 140a are provided with a plurality of concave structures 150a, and the plurality of concave structures 150a on the same second strip-shaped microstructure 140a are arranged at equal intervals. However, the present invention is not limited to this, and the shape, quantity and arrangement of the recessed structures 150a can be adjusted according to actual needs. In other embodiments, the second strip-shaped microstructures 140a may be formed with protruding structures, or, the second strip-shaped microstructures 140a may be formed with concave structures 150a and protruding structures at the same time, and the second strip-shaped microstructures 140a are recessed For the configuration of the structures 150a and/or the protruding structures, reference may be made to the related descriptions of the first strip-shaped microstructures 310, 310a, 310b, 310c, 310d, and 310e.

In this embodiment, the backlight module 10a is a side-lit backlight module, the first strip-shaped microstructures 310 extend along a first direction D1, and the second strip-shaped microstructures 140a extend along a second direction D2 , the first direction D1 is substantially perpendicular to the second direction D2. More specifically, the first direction D1 is substantially parallel to a length direction L of the side surface 130a, and the second direction D2 is substantially perpendicular to the length direction L of the side surface 130a. Compared with the design without the second strip-shaped microstructures 140a, the first strip-shaped microstructures 310 and the full plane are in contact with each other, and the contact area has not yet been optimized and minimized. The first strip-shaped microstructures 310 and the second strip-shaped microstructures 140a are arranged to cross each other to avoid full-plane contact with each other, so that the contact area of this embodiment can be further reduced, and the overall optical properties of the backlight module 10a can be further improved.

Compared with the prior art, in the backlight module of the present invention, a plurality of first strip-shaped microstructures are formed on the wafer, the first strip-shaped microstructures face the optical plate, and the first strip-shaped microstructures The edge portion is formed with a concave structure and/or a protruding structure, which is beneficial to reduce the contact area between the wafer and the element arranged under it, and can avoid the contact area between the wafer and the element arranged under it due to the large contact area. The adsorption phenomenon can improve the problem of uneven brightness and darkness caused by the adsorption phenomenon, so that the backlight module has better light output uniformity, which is beneficial to improve the overall optical properties of the backlight module.

The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

10: Backlight module

100: Optical Board

110: light-emitting surface

120: Bottom

130: side

200: light source

300: Pills

310: First strip microstructure

315: Rib

322: Second recessed surface

Claims (11)

A backlight module, comprising: an optical plate, including: a light-emitting surface; a bottom surface, opposite to the light-emitting surface; and a side surface, connected between the light-emitting surface and the bottom surface; a light source, arranged on the optical plate the side surface; and a sliver plate disposed above the optical plate, wherein the sliver plate is formed with a plurality of first strip-shaped microstructures, the first strip-shaped microstructures face the optical plate, and the first strip-shaped microstructures face the optical plate. The microstructure includes an edge, and the edge is formed with a concave structure and/or a protruding structure; wherein the first strip-shaped microstructure extends along a first direction, the light source is disposed on the side surface of the optical plate, and The first direction is substantially parallel to a length direction of the side surface. The backlight module of claim 1, wherein a plurality of second strip-shaped microstructures are formed on the light-emitting surface of the optical plate, the second strip-shaped microstructures include an edge, and the edge is formed with a concave structure and/or a raised structure. The backlight module of claim 2, wherein the second strip-shaped microstructure extends along a second direction, and the first direction is substantially perpendicular to the second direction. The backlight module of claim 2, wherein the sizes of the second strip-shaped microstructures are the same. The backlight module according to any one of claims 2 to 4, wherein the ridges of the first strip-shaped microstructure and/or the second strip-shaped microstructure are formed with a plurality of recessed structures, the recessed structures, etc. Spacing settings. The backlight module according to any one of claims 2 to 4, wherein the ridges of the first strip-shaped microstructure and/or the second strip-shaped microstructure are formed with a plurality of protruding structures, and the protruding structures are structure equal distance setting. The backlight module according to any one of claims 2 to 4, wherein a plurality of concave structures and a plurality of protruding structures are formed on the ridges of the first strip-shaped microstructure and/or the second strip-shaped microstructure , the concave structures and the protruding structures are arranged at intervals. The backlight module according to any one of claims 1 to 4, wherein the recessed structure is an arc-shaped recessed structure, an angular recessed structure or a square recessed structure. The backlight module according to any one of claims 1 to 4, wherein the protruding structure is an arc-shaped protruding structure, an angular protruding structure or a square-shaped protruding structure. A backlight module, comprising: an optical plate, including: a light-emitting surface; a bottom surface, opposite to the light-emitting surface; and a side surface, connected between the light-emitting surface and the bottom surface; a light source, arranged on the optical plate the bottom surface; and a thin plate, disposed above the optical plate, wherein the thin plate is formed with a plurality of first strip-shaped microstructures, and the first strip-shaped microstructures face the optical plate, and the first strip-shaped microstructures face the optical plate. The microstructure includes an edge, and the edge is formed with a concave structure and/or a convex structure. A display device, comprising: a backlight module as described in any one of claims 1 to 10; and a display panel disposed above the backlight module.

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