TWI762745B - A substrate holding table - Google Patents
A substrate holding table Download PDFInfo
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- TWI762745B TWI762745B TW107143380A TW107143380A TWI762745B TW I762745 B TWI762745 B TW I762745B TW 107143380 A TW107143380 A TW 107143380A TW 107143380 A TW107143380 A TW 107143380A TW I762745 B TWI762745 B TW I762745B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本發明屬於半導體行業基板濕法處理領域,具體的說是一種基板夾持承載台,包括電機、承載台、升降杯及固定杯,電機的輸出端與承載台相連,電機週邊設有固定杯,固定杯的週邊設有可升降的升降杯;承載臺上沿圓周方向分別安裝有隨承載台轉動的轉動柱及固定柱,轉動柱與固定柱均包括柱體及夾持塊,固定柱的柱體固接在承載臺上,轉動柱的柱體轉動安裝在承載臺上,轉動柱和固定柱的夾持塊均偏心設置在柱體頂部,轉動柱的底部安裝有轉動磁石;固定杯內設有內磁石,升降杯內設有外磁石,內磁石與外磁石分別位於轉動磁石的內外兩側。本發明對基板正面與背面無磨損、污染,能夠帶動基板旋轉,完成基板工藝處理。 The invention belongs to the field of wet processing of substrates in the semiconductor industry, in particular to a substrate clamping bearing table, comprising a motor, a bearing table, a lifting cup and a fixing cup, an output end of the motor is connected with the bearing table, and a fixing cup is arranged around the motor, The periphery of the fixed cup is provided with a lifting cup that can be lifted and lowered; a rotating column and a fixed column that rotate with the bearing platform are respectively installed on the bearing platform along the circumferential direction, and the rotating column and the fixed column both include a column body and a clamping block. The body is fixed on the bearing platform, the cylinder of the rotating column is rotatably installed on the bearing platform, the clamping blocks of the rotating column and the fixed column are eccentrically arranged on the top of the column, and a rotating magnet is installed at the bottom of the rotating column; There is an inner magnet, an outer magnet is arranged in the lifting cup, and the inner magnet and the outer magnet are respectively located on the inner and outer sides of the rotating magnet. The invention has no wear and pollution to the front and back of the substrate, can drive the substrate to rotate, and complete the substrate processing.
Description
本發明屬於半導體行業基板濕法處理領域,具體的說是一種基板夾持承載台。 The invention belongs to the field of wet processing of substrates in the semiconductor industry, in particular to a substrate clamping support table.
目前,半導體領域基板潔淨度要求越來越高。在基板的濕法處理設備中,避免基板正面、背面與設備其它部件接觸,造成基板的磨損與污染十分重要。因此,設計一種僅與基板側面、稄邊接觸,對基板正面與背面無磨損、污染,並且能夠帶動基板旋轉,完成基板工藝處理的基板夾持承載台十分重要。 At present, the requirements for the cleanliness of substrates in the semiconductor field are getting higher and higher. In the wet processing equipment for substrates, it is very important to avoid the front and back surfaces of the substrates from contacting other components of the equipment, causing wear and contamination of the substrates. Therefore, it is very important to design a substrate holding table that only contacts the side and edge of the substrate, does not wear and contaminate the front and back of the substrate, and can drive the substrate to rotate and complete the substrate processing.
為了滿足基板潔淨度的要求,完成基板濕法處理工藝,本發明的目的在於提供一種基板夾持承載台。 In order to meet the requirements of the cleanliness of the substrate and complete the substrate wet processing process, the purpose of the present invention is to provide a substrate holding table.
本發明的目的是通過以下技術方案來實現的:本發明包括電機、承載台、升降杯及固定杯,其中電機的輸出端與承載台相連、驅動承載台旋轉,該電機週邊設有固定杯,該固定杯的週邊設有可升降的升降杯;該承載臺上沿圓周方向分別安裝有隨承載台轉動的轉 動柱及固定柱,該轉動柱與固定柱均包括柱體及夾持塊,該固定柱的柱體固接在承載臺上,轉動柱的柱體轉動安裝在承載臺上,該轉動柱和固定柱的夾持塊均偏心設置在柱體頂部,該轉動柱的底部安裝有轉動磁石;該固定杯內設有內磁石,升降杯內設有外磁石,該內磁石與外磁石分別位於該轉動磁石的內外兩側;其中:該外磁石的數量與轉動柱的數量相同,且外磁石在該升降杯上的安裝位置與轉動柱在該承載臺上的安裝位置一一對應;該升降杯位於上升狀態時,轉動柱通過該轉動磁石與固定杯上的內磁石的磁力作用向夾緊基板的方向旋轉,進而夾緊基板;該升降杯位於下降狀態時,該升降杯上的外磁石與轉動磁石之間的磁力大於該內磁石與轉動磁石之間的磁力,該轉動柱向放開基板的方向旋轉,進而放開基板;該轉動柱及固定柱的柱體頂部的支撐面與基板邊緣的稄邊接觸,該夾持塊的側表面為夾持面,該夾持面與該基板的側面接觸;該轉動柱及固定柱的柱體頂部的支撐面為斜面;該內磁石為多個,沿該固定杯頂部內表面圓周方向均布;該轉動柱及固定柱沿承載台邊緣的圓周方向均布;該升降杯頂部內徑大於承載台的外直徑,該升降杯與該承載台的安裝位置同心,該外磁石安裝於升降杯頂部的內表面;該固定杯位於承載台的下方,該固定杯與承載台的安裝位置同心,該內磁石安裝於固定杯頂部的內表面。 The purpose of the present invention is achieved through the following technical solutions: the present invention includes a motor, a bearing platform, a lifting cup and a fixed cup, wherein the output end of the motor is connected with the bearing platform to drive the bearing platform to rotate, and the motor periphery is provided with a fixed cup, The periphery of the fixed cup is provided with a lifting cup that can be lifted and lowered; A moving column and a fixed column, the rotating column and the fixed column both include a column body and a clamping block, the column body of the fixed column is fixed on the bearing platform, the column body of the rotating column is rotatably installed on the bearing platform, the rotating column and The clamping blocks of the fixed column are all eccentrically arranged on the top of the column, and a rotating magnet is installed at the bottom of the rotating column; the fixed cup is provided with an inner magnet, the lifting cup is provided with an outer magnet, and the inner magnet and the outer magnet are respectively located in the The inner and outer sides of the rotating magnet; wherein: the number of the outer magnets is the same as the number of the rotating columns, and the installation positions of the outer magnets on the lifting cup are in one-to-one correspondence with the installation positions of the rotating columns on the bearing platform; the lifting cups When in the ascending state, the rotating column rotates in the direction of clamping the substrate through the magnetic force of the rotating magnet and the inner magnet on the fixed cup, and then clamps the substrate; when the lifting cup is in the descending state, the outer magnet on the lifting cup and the The magnetic force between the rotating magnets is greater than the magnetic force between the inner magnet and the rotating magnet, the rotating column rotates in the direction of releasing the base plate, and then the base plate is released; the supporting surface of the top of the column body of the rotating column and the fixed column and the edge of the base plate The side surface of the clamping block is a clamping surface, and the clamping surface is in contact with the side surface of the base plate; the supporting surfaces of the tops of the cylinders of the rotating column and the fixed column are inclined surfaces; the inner magnet is a plurality of , evenly distributed along the circumferential direction of the inner surface of the top of the fixed cup; the rotating column and the fixed column are evenly distributed along the circumferential direction of the edge of the bearing platform; the inner diameter of the top of the lifting cup is larger than the outer diameter of the bearing platform, and the distance between the lifting cup and the bearing platform The installation position is concentric, the outer magnet is installed on the inner surface of the top of the lifting cup; the fixed cup is located below the bearing table, the fixing cup is concentric with the installation position of the bearing table, and the inner magnet is installed on the inner surface of the top of the fixing cup.
本發明的優點與積極效果為: 1.本發明的內磁石與轉動柱的轉動磁石之間的磁力,使轉動柱旋轉並與固定柱共同夾緊基板,基板所受夾緊力恒定,基板在工藝過程中不同轉速及加速度下旋轉時與固定柱之間無相對轉動,對基板是一種很好的保護;2.本發明的外磁石隨升降杯下降時,外磁石與轉動磁石的磁力大於內磁石與轉動磁石間的磁力,轉動柱隨轉動磁石旋轉放開基板,傳送機構可進行基板的取送操作,結構簡單;3.本發明在帶動基板旋轉進行工藝處理過程中,僅轉動柱及固定柱與基板稄邊及側面接觸,基板的正面、背面不與任何部件接觸,可有效防止基板正面及背面損傷。 The advantages and positive effects of the present invention are: 1. The magnetic force between the inner magnet of the present invention and the rotating magnet of the rotating column makes the rotating column rotate and clamps the base plate together with the fixed column. The clamping force on the base plate is constant. There is no relative rotation between the fixed columns, which is a good protection for the substrate; 2. When the outer magnet of the present invention descends with the lifting cup, the magnetic force between the outer magnet and the rotating magnet is greater than the magnetic force between the inner magnet and the rotating magnet, the rotating column rotates with the rotating magnet to release the substrate, the conveying mechanism can carry out the operation of taking and conveying the substrate, and the structure is simple 3. During the process of driving the substrate to rotate, only the rotating column and the fixed column are in contact with the edge and side of the substrate, and the front and back of the substrate are not in contact with any components, which can effectively prevent the front and back of the substrate from being damaged.
1‧‧‧電機 1‧‧‧Motor
2‧‧‧承載台 2‧‧‧Place
3‧‧‧升降杯 3‧‧‧Lifting Cup
4‧‧‧固定杯 4‧‧‧Fixed Cup
5‧‧‧轉動柱 5‧‧‧Rotating column
501‧‧‧轉動磁石 501‧‧‧Rotating Magnet
502‧‧‧支撐面A 502‧‧‧Support surface A
503‧‧‧夾持面A 503‧‧‧Clamping surface A
504‧‧‧柱體A 504‧‧‧Cylinder A
505‧‧‧夾持塊A 505‧‧‧Clamping block A
6‧‧‧固定柱 6‧‧‧Fixing column
601‧‧‧支撐面B 601‧‧‧Support surface B
602‧‧‧夾持面B 602‧‧‧Clamping surface B
603‧‧‧柱體B 603‧‧‧Cylinder B
604‧‧‧夾持塊B 604‧‧‧Clamping block B
7‧‧‧外磁石 7‧‧‧Outer magnet
8‧‧‧內磁石 8‧‧‧Inner Magnet
9‧‧‧基板 9‧‧‧Substrate
901‧‧‧棱邊 901‧‧‧Edge
902‧‧‧側面 902‧‧‧Side
903‧‧‧正面 903‧‧‧Front
904‧‧‧背面 904‧‧‧Back
圖1為本發明中升降杯處於下降狀態的整體結構示意圖;圖2為本發明中升降杯處於升起狀態的整體結構示意圖;圖3為本發明基板被夾緊的結構示意圖;圖4為本發明基板被放開的結構示意圖;圖5為本發明內磁石在固定杯上的分佈示意圖;圖6為本發明基板被夾緊時、轉動柱與基板相對位置的結構示意圖;圖7為本發明基板被夾緊時、固定柱與基板相對位置的結構示意圖。 1 is a schematic diagram of the overall structure of the lifting cup in the present invention in a lowered state; FIG. 2 is a schematic diagram of the overall structure of the lifting cup in a raised state in the present invention; FIG. 3 is a schematic structural diagram of the substrate of the present invention being clamped; Figure 5 is a schematic diagram of the distribution of the inner magnets on the fixed cup of the present invention; Figure 6 is a schematic structural diagram of the relative position of the rotating column and the substrate when the substrate of the present invention is clamped; Figure 7 is a schematic diagram of the present invention Schematic diagram of the structure of the relative position of the fixed column and the substrate when the substrate is clamped.
下面結合附圖對本發明作進一步詳述。 The present invention will be described in further detail below in conjunction with the accompanying drawings.
如圖1~7所示,本發明包括電機1、承載台2、升降杯3、固定杯4、轉動柱5、固定柱6、外磁石7及內磁石8,其中電機1的輸出端與承載台2相連、驅動承載台2旋轉,電機週邊設有位於承載台2下方的固定杯4,該固定杯4的週邊設有可升降的升降杯3。
As shown in Figures 1 to 7, the present invention includes a
承載台2上沿圓周方向分別安裝有隨承載台2轉動的轉動柱5及固定柱6,轉動柱5及固定柱6沿承載台2邊緣的圓周方向均布。轉動柱5與固定柱6均包括圓柱形的柱體及圓柱形的夾持塊,固定柱6的柱體B603固接在承載台2上,在柱體B603的頂部偏心設有夾持塊B604,即夾持塊B604的軸向中心線與柱體B603的軸向中心線平行。轉動柱5的柱體A504轉動安裝在承載台2上,在柱體A504的頂部偏心設有夾持塊A505,即夾持塊A505的軸向中心線與柱體A504的軸向中心線平行。轉動柱5的底部安裝有轉動磁石501。
The
固定杯4內設有內磁石8,升降杯3內設有外磁石7,該內磁石8與外磁石7分別位於轉動磁石501的內外兩側。固定杯4位於承載台2的下方,該固定杯4與承載台2的安裝位置同心,內磁石8為多個、安裝於固定杯4頂部的內表面,沿固定杯4頂部內表面圓周方向均布。升降杯3可進行升降動作(此為現有技術,在此不再贅述。),頂部內徑大於承載台2的外直徑,該升降杯3與承載台2的安裝位置同心,外磁石7安裝於升降杯3頂部的內表面,並隨升降杯3升降。外磁石7的數量與轉動柱5的數量相同,且外磁石7在升降杯3上的安裝位置與轉動柱5在承載台2上的安裝位置一一對應。
The
轉動柱5的柱體A504頂部的支撐面A502及固定柱6的柱體B603頂部的支撐面B601均為斜面,分別僅與基板9邊緣的稄邊901接觸,避免對基板9的正面903或背面904產生磨損或者污染。夾持塊A505的側表面為夾持面A503,夾持塊B604的側表面為夾持面B602,夾持面A503及夾持面B602分別僅與基板9的側面902接觸。
The supporting surface A502 at the top of the column body A504 of the rotating
升降杯3位於上升狀態時,轉動柱5通過轉動磁石501與固定杯4上的內磁石8的磁力作用向夾緊基板9的方向旋轉,進而夾緊基板9。升降杯3位於下降狀態時,該升降杯3上的外磁石7與轉動磁石501之間的磁力大於內磁石8與轉動磁石501之間的磁力,轉動柱5向放開基板9的方向旋轉,進而放開基板9。
When the
本發明的工作原理為:承載台2與電機1的輸出軸連接。轉動柱5與固定柱6圓周均布於承載台2之上。轉動柱5與固定柱6的支撐面為斜面,用於支撐基板9。轉動柱5與固定柱6的支撐面僅與基板9的邊緣接觸,避免對基板9的正面903或背面904產生磨損或者污染。每片基板9完成工藝後,承載台2在電機1的帶動下進行一次回零動作,確保固定柱6的位置保持不變。
The working principle of the present invention is as follows: the
外磁石7安裝於升降杯3頂部的內表面,隨升降杯3一同升降。外磁石7的數量與轉動柱5的數量相同,且外磁石7在升降杯3的安裝位置與轉動柱5在承載台2上的安裝位置對應。當升降杯3處於上升位置,外磁石7與轉動柱5內的轉動磁石501無磁力作用;當升降杯3處於下降位置,外磁石7與轉動磁石501間產生磁力,該磁力使轉動柱5旋轉,轉動柱5上的夾持塊A505具有向放開基板9的方向轉動的趨勢。
The
內磁石8圓周均布於固定杯4頂部的內表面。內磁石8與轉動磁石501間的磁力使轉動柱5旋轉,轉動柱5上的夾持塊A505具有向夾緊基板9的方向轉動的趨勢。
The
當傳送機構準備將基板9傳送到工藝單元中的承載台2上時,升降杯3處於下降位置,外磁石7與轉動磁石501間的磁力大於內磁石8與轉動磁石501間的磁力,轉動柱5向放開基板9的方向旋轉,傳送機構將基板9放置於轉動柱5的支撐面A502及固定柱6的支撐面B601上。隨後,傳送機構退出工藝腔體,升降杯3升起,轉動柱5僅與內磁石8之間具有相互磁力,該磁力使轉動柱5旋轉,轉動柱5上的夾持塊A505向夾緊基板9的方向旋轉。基板9在轉動柱5與固定柱6之間的夾緊力作用下,隨承載台2在電機1的帶動下旋轉,進行基板9的工藝處理。內磁石8圓周均勻布於固定杯4頂部的內表面,內磁石8與轉動磁石501間的磁力在轉動磁石501隨承載台2旋轉的過程中保持不變,即基板9在旋轉的過程中所受夾持力保持不變,基板9與轉動柱5、固定柱6之間無相對滑動,避免基板9的磨損與污染。
When the transfer mechanism is ready to transfer the
1‧‧‧電機 1‧‧‧Motor
2‧‧‧承載台 2‧‧‧Place
3‧‧‧升降杯 3‧‧‧Lifting Cup
4‧‧‧固定杯 4‧‧‧Fixed Cup
5‧‧‧轉動柱 5‧‧‧Rotating column
501‧‧‧轉動磁石 501‧‧‧Rotating Magnet
6‧‧‧固定柱 6‧‧‧Fixing column
7‧‧‧外磁石 7‧‧‧Outer magnet
8‧‧‧內磁石 8‧‧‧Inner Magnet
9‧‧‧基板 9‧‧‧Substrate
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CN111960313A (en) * | 2020-07-21 | 2020-11-20 | 沈阳芯源微电子设备有限公司 | Substrate lifting mechanism |
CN115042139A (en) * | 2021-03-08 | 2022-09-13 | 沈阳芯源微电子设备股份有限公司 | Substrate clamping bearing table |
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