TWI759752B - Composition for encapsulating organic light emitting diode device and display device - Google Patents
Composition for encapsulating organic light emitting diode device and display device Download PDFInfo
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Abstract
Description
本發明涉及一種用於封裝有機發光二極體裝置的組合物和由其製造的有機發光二極體顯示裝置。The present invention relates to a composition for encapsulating an organic light emitting diode device and an organic light emitting diode display device manufactured therefrom.
有機發光二極體顯示裝置是發光型顯示裝置且包含有機發光二極體。有機發光二極體裝置可能在其與外部水分或氧接觸時劣化,因此應該用封裝組合物密封有機發光二極體裝置。用多層結構封裝有機發光二極體裝置,在所述多層結構中,無機阻擋層和有機阻擋層依序形成。無機阻擋層通過電漿沉積形成,且有機阻擋層可能受電漿蝕刻。這種蝕刻可能損害有機阻擋層的封裝功能,且因此,有機發光二極體裝置可能具有較差發光特性和低可靠性。The organic light emitting diode display device is a light emitting type display device and includes organic light emitting diodes. The organic light emitting diode device may deteriorate when it comes into contact with external moisture or oxygen, so the organic light emitting diode device should be sealed with an encapsulation composition. The organic light emitting diode device is encapsulated with a multilayer structure in which an inorganic barrier layer and an organic barrier layer are sequentially formed. The inorganic barrier layer is formed by plasma deposition, and the organic barrier layer may be plasma etched. Such etching may impair the encapsulation function of the organic barrier layer, and thus, the organic light emitting diode device may have poor light emitting characteristics and low reliability.
同時,阻擋層可通過由噴墨印表機施加用於封裝有機發光二極體裝置的組合物來形成。此時,如果組合物聚集或具有較差可鋪展性,那麼可加工性降低,且最終阻擋層的厚度不均勻,這可能在施加於顯示裝置時影響圖像質量。Meanwhile, the barrier layer may be formed by applying the composition for encapsulating the organic light emitting diode device by an ink jet printer. At this time, if the composition aggregates or has poor spreadability, the processability is reduced, and the thickness of the final barrier layer is not uniform, which may affect image quality when applied to a display device.
(專利文獻1)韓國專利公開案第2012-0115841號(Patent Document 1) Korean Patent Publication No. 2012-0115841
一實施例提供一種用於封裝有機發光二極體裝置的組合物,所述組合物具有高折射率和固化速率、提高的可鋪展性,以及在固化之後的低電漿蝕刻速率。An embodiment provides a composition for encapsulating an organic light emitting diode device having a high refractive index and cure rate, improved spreadability, and a low plasma etch rate after curing.
另一實施例提供一種有機發光二極體顯示裝置,包含由根據實施例的用於封裝有機發光二極體裝置的組合物製造的有機阻擋層。Another embodiment provides an organic light emitting diode display device including an organic barrier layer fabricated from the composition for encapsulating an organic light emitting diode device according to an embodiment.
根據實施例的用於封裝有機發光二極體裝置的組合物包含光固化單體和引發劑,其中所述光固化單體不包含矽基光固化單體,所述光固化單體包含由化學式1表示的含芳族基單體以及不含芳族基的單體,且所述不含芳族基的單體具有具有C8到C20伸烷基的二(甲基)丙烯酸酯、具有C1到C7伸烷基的二(甲基)丙烯酸酯,或其組合: (化學式1) 其中,在化學式1中, L1 到L4 獨立地是O、S、CO、COO、NR1 (其中R1 是氫或C1到C5烷基),或C1到C10伸烷基, Ar1 到Ar4 獨立地是經取代或未經取代的C6到C20芳基,且 Z1 到Z4 獨立地是氫、C1到C10烷基或由化學式2表示的基團,前提是Z1 到Z4 中的至少一個是由化學式2表示的基團: (化學式2) 其中,在化學式2中, Y1 是O、S、CO、COO或NR1 (其中R1 是氫或C1到C5烷基), R2 是氫或C1到C5烷基, p和q獨立地是0到10的整數中的一個, k是0或1,且 *是與另一原子的連接位置; m1到m4獨立地是0或1,且 n1到n4獨立地是0或1,前提是n1到n4中的至少一個是1。A composition for encapsulating an organic light emitting diode device according to an embodiment includes a photocurable monomer and an initiator, wherein the photocurable monomer does not include a silicon-based photocurable monomer, and the photocurable monomer includes a chemical formula An aromatic group-containing monomer represented by 1 and an aromatic group-free monomer having a di(meth)acrylate having a C8 to C20 alkylene group, a C1 to C20 alkylene group C7 alkylene di(meth)acrylate, or a combination thereof: (Chemical formula 1) wherein, in Chemical Formula 1, L 1 to L 4 are independently O, S, CO, COO, NR 1 (wherein R 1 is hydrogen or C1 to C5 alkyl), or C1 to C10 alkylene, Ar 1 to Ar 4 is independently a substituted or unsubstituted C6 to C20 aryl group, and Z 1 to Z 4 are independently hydrogen, a C1 to C10 alkyl group, or a group represented by Chemical Formula 2, provided that Z 1 to Z 4 At least one of is a group represented by Chemical Formula 2: (Chemical Formula 2) wherein, in Chemical Formula 2, Y 1 is O, S, CO, COO or NR 1 (wherein R 1 is hydrogen or C1 to C5 alkyl), R 2 is hydrogen or C1 to C5 alkyl, and p and q are independently is one of the integers 0 to 10, k is 0 or 1, and * is the position of attachment to another atom; m1 to m4 are independently 0 or 1, and n1 to n4 are independently 0 or 1, provided that At least one of n1 to n4 is 1.
化學式1中的Ar1 到Ar4 可獨立地是經取代或未經取代的苯基、萘基、蒽基、菲基、䓛基或聯伸三苯基,且n1到n4中的一個或兩個可以是1且其餘的可以是0。Ar 1 to Ar 4 in Chemical Formula 1 may be independently substituted or unsubstituted phenyl, naphthyl, anthracenyl, phenanthrenyl, enyl, or triphenyl, and one or both of n1 to n4 Can be 1 and the rest can be 0.
化學式1中的Z1 到Z4 中的一個可以是由化學式2表示的基團,且其它三個可獨立地是氫或C1到C10烷基。One of Z 1 to Z 4 in Chemical Formula 1 may be a group represented by Chemical Formula 2, and the other three may be independently hydrogen or C1 to C10 alkyl groups.
在化學式2中,Y1 可以是O、S或COO,p可以是0,且q可以是1到4的整數中的一個。In Chemical Formula 2, Y 1 may be O, S or COO, p may be 0, and q may be one of integers of 1 to 4.
在化學式2中,Y1 可以是O、S或COO,p可以是1到4的整數中的一個,且q可以是0。In Chemical Formula 2, Y 1 may be O, S or COO, p may be one of integers of 1 to 4, and q may be 0.
由化學式1表示的所述含芳族基單體可包含由以下化學式表示的單體中的一個或多個: 在以上化學式中,n是1到10的整數中的一個, 。The aromatic group-containing monomer represented by Chemical Formula 1 may include one or more of monomers represented by the following Chemical Formula: In the above chemical formula, n is an integer from 1 to 10, .
具有所述C8到C20伸烷基的所述二(甲基)丙烯酸酯可包含辛二醇二(甲基)丙烯酸酯、壬二醇二(甲基)丙烯酸酯、癸二醇二(甲基)丙烯酸酯、十一烷二醇二(甲基)丙烯酸酯、十二烷二醇二(甲基)丙烯酸酯、十三烷二醇二(甲基)丙烯酸酯、十四烷二醇二(甲基)丙烯酸酯、十五烷二醇二(甲基)丙烯酸酯,或其組合。The di(meth)acrylate having the C8 to C20 alkylene may include octanediol di(meth)acrylate, nonanediol di(meth)acrylate, decanediol di(meth)acrylate ) acrylate, undecanediol di(meth)acrylate, dodecanediol di(meth)acrylate, tridecanediol di(meth)acrylate, tetradecanediol di(meth)acrylate meth)acrylate, pentadecanediol di(meth)acrylate, or a combination thereof.
具有所述C1到C7伸烷基的所述二(甲基)丙烯酸酯可包含甲二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、戊二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯,或其組合。The di(meth)acrylate having the C1 to C7 alkylene may include ethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylic acid ester, butanediol di(meth)acrylate, pentanediol di(meth)acrylate, hexanediol di(meth)acrylate, or a combination thereof.
所述不含芳族基的單體可進一步包含具有C8到C20烷基的單(甲基)丙烯酸酯。The aromatic group-free monomer may further include a mono(meth)acrylate having a C8 to C20 alkyl group.
具有所述C8到C20烷基的所述單(甲基)丙烯酸酯可包含(甲基)丙烯酸癸酯、(甲基)丙烯酸十一酯、(甲基)丙烯酸十二酯、(甲基)丙烯酸十三酯、(甲基)丙烯酸十四酯、(甲基)丙烯酸十五酯、(甲基)丙烯酸十六酯,或其組合。The mono(meth)acrylate having the C8 to C20 alkyl group may include decyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, (meth)acrylate Tridecyl acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, or a combination thereof.
在所述組合物中,由化學式1表示的所述含芳族基單體的量可以是按所述光固化單體和所述引發劑的總重量計大於或等於50重量%。In the composition, the amount of the aromatic group-containing monomer represented by Chemical Formula 1 may be greater than or equal to 50 wt % based on the total weight of the photocurable monomer and the initiator.
在所述組合物中,所述引發劑的量可以是按所述光固化單體和所述引發劑的總重量計小於10重量%。In the composition, the amount of the initiator may be less than 10% by weight based on the total weight of the photocurable monomer and the initiator.
用於封裝所述有機發光二極體裝置的所述組合物可具有通過以下實驗方法根據等式1的140%到170%的可鋪展性: >等式1> 可鋪展性1 = S2 / S1 x 100 在等式1中, S1是通過以13皮升的量將用於封裝所述有機發光二極體裝置的所述組合物滴加到噴墨印表機中且在已經過30秒之後測量滴加物的最大粒徑(單位:微米)3次來獲得的平均值,且 S2是通過以13皮升的量將用於封裝所述有機發光二極體裝置的所述組合物滴加到噴墨印表機中且在已經過300秒之後測量滴加物的最大粒徑(單位:微米)3次來測量的平均值。The composition for encapsulating the organic light emitting diode device may have a spreadability of 140% to 170% according to Equation 1 by the following experimental method: >Equation 1> Spreadability 1 = S2 / S1 x 100 In Equation 1, S1 is by dropping the composition for encapsulating the organic light emitting diode device in an amount of 13 picoliters into an ink jet printer and measuring the maximum particle size of the drop after 30 seconds have elapsed (unit: microns) average value obtained 3 times, and S2 is by dropping the composition for encapsulating the organic light emitting diode device in an amount of 13 picoliters into an ink jet printer and measuring the maximum particle size of the drop after 300 seconds have elapsed (Unit: micrometer) The average value of 3 measurements.
用於封裝所述有機發光二極體裝置的所述組合物可具有通過以下實驗方法根據等式2來測量的小於10%的電漿蝕刻速率: >等式2> 電漿蝕刻速率(%)=(T1-T2)/T1 x 100 在等式2中, T1是在沉積所述組合物之後通過光固化來測量的沉積層的初始高度,且 T2是在所述沉積層經歷電感耦合電漿(inductively coupled plasma;ICP)處理之後所述沉積層的高度,所述電感耦合電漿處理使用ICP功率:2500瓦;RE功率:300瓦;DC偏壓:200伏;Ar流量:50標準立方釐米/分鐘;蝕刻時間:1分鐘;壓強:10毫托;ICP CVD系統:BMR技術。The composition for encapsulating the organic light emitting diode device may have a plasma etch rate of less than 10% as measured by the following experimental method according to Equation 2: >Equation 2> Plasma etch rate (%) = (T1-T2)/T1 x 100 In Equation 2, T1 is the initial height of the deposited layer measured by photocuring after depositing the composition, and T2 is the height of the deposited layer after it has undergone inductively coupled plasma (ICP) treatment using ICP power: 2500 watts; RE power: 300 watts; DC bias Pressure: 200 V; Ar flow: 50 standard cubic centimeters/min; Etching time: 1 minute; Pressure: 10 mTorr; ICP CVD system: BMR technology.
根據另一實施例的有機發光二極體顯示裝置包含:有機發光二極體裝置;以及阻擋疊層,形成於所述有機發光二極體裝置上且包含無機阻擋層和有機阻擋層,其中所述有機阻擋層可使用根據實施例的組合物來製造。An organic light emitting diode display device according to another embodiment includes: an organic light emitting diode device; and a blocking stack formed on the organic light emitting diode device and including an inorganic blocking layer and an organic blocking layer, wherein the The organic barrier layer may be fabricated using the composition according to the embodiment.
在所述阻擋疊層中,所述無機阻擋層與所述有機阻擋層可交替地堆疊。In the barrier stack, the inorganic barrier layers and the organic barrier layers may be alternately stacked.
根據實施例的用於封裝有機發光二極體裝置的組合物具有極佳光固化速率和可鋪展性,由此提高可加工性,且具有高折射率,由此即使其形成於有機發光二極體顯示裝置中的無機膜上也增大正面和/或側面處的亮度值。此外,有可能實施能夠通過因固化之後的較強抗電漿性而保護有機發光二極體裝置來提高裝置的可靠性的有機阻擋層。此外,根據實施例的用於封裝有機發光二極體裝置的組合物具有低模量且可在撓性裝置中使用。The composition for encapsulating an organic light emitting diode device according to the embodiment has an excellent photocuring rate and spreadability, thereby improving workability, and has a high refractive index, thereby even if it is formed on an organic light emitting diode Brightness values at the front and/or sides are also increased on inorganic films in bulk display devices. Furthermore, it is possible to implement an organic barrier layer that can improve the reliability of the device by protecting the organic light emitting diode device due to stronger plasma resistance after curing. In addition, the composition for encapsulating an organic light emitting diode device according to the embodiment has a low modulus and can be used in a flexible device.
參考附圖,詳細地描述本發明,使得本發明所涉及領域的技術人員可通過實施例容易地實行。本發明可以許多不同形式實施且不限於本文中所描述的實施例。在附圖中,省略與描述不相關的部分以便清楚地描述本發明,且貫穿本說明書將相同附圖標號分配給相同或類似元件。With reference to the accompanying drawings, the present invention will be described in detail so that those skilled in the art to which the present invention pertains can be easily practiced by the embodiments. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and the same reference numerals are assigned to the same or similar elements throughout the specification.
在本說明書中,“經取代或未經取代的”中的“經取代”是指由以下置換給定官能團的至少一個氫:C1到C10飽和或不飽和烴基、C6到C20芳烴基、C1到C10烷氧基、C6到C20芳氧基、C7到C20芳基烷氧基、鹵素(氯、氟、溴、碘)、羥基、羧基、氨基、硝基、氰基,或其組合。In this specification, "substituted" in "substituted or unsubstituted" refers to the replacement of at least one hydrogen of a given functional group by: C1 to C10 saturated or unsaturated hydrocarbon group, C6 to C20 aromatic hydrocarbon group, C1 to C20 aromatic hydrocarbon group C10 alkoxy, C6 to C20 aryloxy, C7 to C20 arylalkoxy, halogen (chloro, fluoro, bromo, iodo), hydroxy, carboxyl, amino, nitro, cyano, or a combination thereof.
在本說明書中,“(甲基)丙烯基”可指丙烯基和/或甲基丙烯基。In the present specification, "(meth)propenyl" may refer to propenyl and/or methacryl.
在本說明書中,“芳基”是指其中環狀取代基的所有元素都具有p軌道的官能團,且這些p軌道形成共軛。芳基包含單環官能團、非稠合多環官能團或稠合多環官能團。“稠合”是指其中碳原子共享相鄰對的環。In the present specification, the "aryl group" refers to a functional group in which all elements of the cyclic substituent have p orbitals, and these p orbitals form conjugation. Aryl groups contain monocyclic functional groups, non-fused polycyclic functional groups, or fused polycyclic functional groups. "Fused" refers to rings in which carbon atoms share adjacent pairs.
芳基還包含聯苯基、三聯苯基或四聯苯基,所述聯苯基、三聯苯基或四聯苯基是其中兩個或大於兩個芳基通過σ鍵連接的形式。在實施例中,芳基可指苯基、萘基、蒽基、菲基、並四苯基、芘基或䓛基。Aryl also includes biphenyl, terphenyl, or tetraphenyl, which is a form in which two or more aryl groups are linked by a sigma bond. In an embodiment, aryl may refer to phenyl, naphthyl, anthracenyl, phenanthryl, naphthyl, pyrenyl, or methylene.
C6到C20芳基的具體實例可包含經取代或未經取代的苯基、經取代或未經取代的萘基、經取代或未經取代的蒽基、經取代或未經取代的菲基、經取代或未經取代的並四苯基、經取代或未經取代的芘基、經取代或未經取代的䓛基、經取代或未經取代的聯苯基、經取代或未經取代的對三聯苯基、經取代或未經取代的間三聯苯基、經取代或未經取代的聯伸三苯基、經取代或未經取代的苝基,以及類似物。Specific examples of C6 to C20 aryl groups may include substituted or unsubstituted phenyl, substituted or unsubstituted naphthyl, substituted or unsubstituted anthracenyl, substituted or unsubstituted phenanthryl, Substituted or unsubstituted naphthyl, substituted or unsubstituted pyrenyl, substituted or unsubstituted methylene, substituted or unsubstituted biphenyl, substituted or unsubstituted p-terphenyl, substituted or unsubstituted m-terphenyl, substituted or unsubstituted biphenyl, substituted or unsubstituted perylene, and the like.
在本說明書中,“用於封裝有機發光二極體裝置的組合物”可簡稱為“封裝組合物”。In this specification, "the composition for encapsulating an organic light emitting diode device" may be simply referred to as "encapsulation composition".
有機電致發光單元(有機發光二極體(organic light emitting diode;OLED))具有其中功能性有機材料層插入於陽極與陰極之間的結構,且通過注入到陽極中的電洞與注入到陰極中的電子的複合來產生具有高能量的激子。所形成的激子移動到基態以產生特定波長的光。有機電致發光單元具有優點,例如自發光、高速響應、寬視角、超薄、高清以及耐久性。歸因於這些優點,有機電致發光單元用於液晶的背光等中以獲得低電壓下的高亮度發光,且預期是薄平面顯示裝置。An organic electroluminescence unit (organic light emitting diode (OLED)) has a structure in which a functional organic material layer is interposed between an anode and a cathode, and is passed through holes injected into the anode and injected into the cathode. recombination of electrons to generate excitons with high energy. The formed excitons move to the ground state to generate light of a specific wavelength. Organic electroluminescent units have advantages such as self-luminescence, high-speed response, wide viewing angle, ultra-thin, high-definition, and durability. Due to these advantages, organic electroluminescence cells are used in backlights of liquid crystals and the like to obtain high-brightness light emission at a low voltage, and are expected to be thin flat display devices.
有機電致發光(electroluminescence;EL)裝置可能極易受潮,金屬電場與有機EL層之間的界面可能在水分的影響下剝離,金屬可能氧化且高度耐蝕,有機材料自身可能因水分和氧而劣化,且裝置可能歸因於有機材料和/或電極材料因受從外部或內部產生的釋氣氧化而不發光,且還可能呈現降低的亮度。為瞭解決這一問題,已研發出用可固化組合物封裝有機EL裝置的方法。作為常規封裝方法,已提出用丙烯酸樹脂模塑的方法或通過將吸濕材料添加到有機EL裝置的封裝樹脂來阻止有機EL裝置受潮的方法。Organic electroluminescence (EL) devices can be extremely susceptible to moisture, the interface between the metal electric field and the organic EL layer can peel off under the influence of moisture, metals can oxidize and are highly resistant to corrosion, and organic materials themselves can be degraded by moisture and oxygen , and the device may not emit light due to oxidation of organic materials and/or electrode materials by outgassing generated from outside or inside, and may also exhibit reduced brightness. In order to solve this problem, methods of encapsulating organic EL devices with curable compositions have been developed. As a conventional encapsulation method, a method of molding with an acrylic resin or a method of preventing the organic EL device from getting wet by adding a hygroscopic material to the encapsulation resin of the organic EL device has been proposed.
本發明的發明人已努力研發用於封裝有機發光二極體裝置的組合物,所述組合物具有高折射率和預定範圍內的粘度以在使用噴墨列印時在不產生針孔的情況下形成有機膜,且具有低粘度以通過防止有機膜鋪展來提高可加工性以及以低電漿蝕刻速率實施有機膜。因此,通過確認根據如下文所描述的實施例的組合物可實現所有上述目標來完成本發明。The inventors of the present invention have made efforts to develop a composition for encapsulating an organic light emitting diode device having a high refractive index and a viscosity within a predetermined range to prevent pinholes when using inkjet printing The organic film is formed at a low viscosity to improve processability by preventing the organic film from spreading and to perform the organic film at a low plasma etching rate. Accordingly, the present invention was accomplished by confirming that the compositions according to the Examples as described below can achieve all the above-mentioned objects.
具體來說,根據本發明的實施例的用於封裝有機發光二極體裝置的組合物包含光固化單體和引發劑,其中所述光固化單體不包含矽基光固化單體,所述光固化單體包含由化學式1表示的含芳族基單體以及不含芳族基的單體,且所述不含芳族基的單體具有具有C8到C20伸烷基的二(甲基)丙烯酸酯、具有C1到C7伸烷基的二(甲基)丙烯酸酯,或其組合: (化學式1) 其中,在化學式1中, L1 到L4 獨立地是O、S、CO、COO、NR1 (其中R1 是氫或C1到C5烷基),或C1到C10伸烷基, Ar1 到Ar4 獨立地是經取代或未經取代的C6到C20芳基,且 Z1 到Z4 獨立地是氫、C1到C10烷基或由化學式2表示的基團,前提是Z1 到Z4 中的至少一個是由化學式2表示的基團: (化學式2) 其中,在化學式2中, Y1 是O、S、CO、COO或NR1 (其中R1 是氫或C1到C5烷基), R2 是氫或C1到C5烷基, p和q獨立地是0到10的整數中的一個, k是0或1, *是與另一原子的連接位置; m1到m4獨立地是0或1,且 n1到n4獨立地是0或1,前提是n1到n4中的至少一個是1。Specifically, the composition for encapsulating an organic light emitting diode device according to an embodiment of the present invention includes a photocurable monomer and an initiator, wherein the photocurable monomer does not include a silicon-based photocurable monomer, the The photocurable monomer includes an aromatic group-containing monomer represented by Chemical Formula 1 and an aromatic group-free monomer having a bis(methyl group having a C8 to C20 alkylene group) ) acrylate, di(meth)acrylate with C1 to C7 alkylene, or a combination thereof: (Chemical formula 1) wherein, in Chemical Formula 1, L 1 to L 4 are independently O, S, CO, COO, NR 1 (wherein R 1 is hydrogen or C1 to C5 alkyl), or C1 to C10 alkylene, Ar 1 to Ar 4 is independently a substituted or unsubstituted C6 to C20 aryl group, and Z 1 to Z 4 are independently hydrogen, a C1 to C10 alkyl group, or a group represented by Chemical Formula 2, provided that Z 1 to Z 4 At least one of is a group represented by Chemical Formula 2: (Chemical Formula 2) wherein, in Chemical Formula 2, Y 1 is O, S, CO, COO or NR 1 (wherein R 1 is hydrogen or C1 to C5 alkyl), R 2 is hydrogen or C1 to C5 alkyl, and p and q are independently is one of the integers 0 to 10, k is 0 or 1, * is the position of attachment to another atom; m1 to m4 are independently 0 or 1, and n1 to n4 are independently 0 or 1, provided n1 At least one of n4 is 1.
根據實施例的用於封裝有機發光二極體裝置的組合物可具有高折射率,且可形成即使在形成於無機膜上也能夠提高正表面和/或側表面處的亮度值的有機膜,且可具有適當的粘度以用於使用噴墨等列印以提供液滴的良好鋪展且因此提供極佳可加工性。由所述組合物製造的阻擋層的厚度可以是均勻的且總體上較薄,表面可以是均勻的,且還可提高光固化速率以提供良好可加工性。此外,固化膜可具有較高抗電漿性,且因此具有低電漿蝕刻速率,由此提高裝置的可靠性。此外,所述組合物還可具有低模量且因此其可用於撓性裝置的面板。The composition for encapsulating an organic light emitting diode device according to the embodiment may have a high refractive index, and may form an organic film capable of improving the luminance value at the front surface and/or the side surface even when formed on an inorganic film, And can have an appropriate viscosity for printing using ink jet etc. to provide good spreading of droplets and thus provide excellent processability. The thickness of the barrier layer made from the composition can be uniform and generally thin, the surface can be uniform, and the photocuring rate can also be increased to provide good processability. In addition, the cured film can have higher plasma resistance, and thus a low plasma etch rate, thereby improving the reliability of the device. Furthermore, the composition can also have a low modulus and thus it can be used in panels of flexible devices.
如上文所描述,根據實施例的光固化單體是不包含矽(Si)的非矽基光固化單體。As described above, the photocurable monomer according to the embodiment is a non-silicon-based photocurable monomer that does not contain silicon (Si).
在根據實施例的組合物中,當使用矽基光固化單體而不是由化學式1表示的含芳族基單體、具有C8到C20伸烷基的二(甲基)丙烯酸酯以及具有C1到C7伸烷基的二(甲基)丙烯酸酯中的一種時,組合物的可鋪展性可能較差或組合物的模量可能較高,從而導致低撓性問題。In the composition according to the embodiment, when a silicon-based photocurable monomer is used instead of the aromatic group-containing monomer represented by Chemical Formula 1, the di(meth)acrylate having C8 to C20 alkylene, and the When one of the C7 alkylene di(meth)acrylates, the spreadability of the composition may be poor or the modulus of the composition may be high, resulting in low flexibility problems.
此外,在根據實施例的組合物中,當矽基光固化單體與由化學式1表示的含芳族基單體、具有C8到C20伸烷基的二(甲基)丙烯酸酯和/或具有C1到C7伸烷基的二(甲基)丙烯酸酯一起另外包含時,組合物的可鋪展性可能較差或組合物的模量可能較高,從而導致低撓性問題。Furthermore, in the composition according to the embodiment, when the silicon-based photocurable monomer is combined with the aromatic group-containing monomer represented by Chemical Formula 1, the di(meth)acrylate having a C8 to C20 alkylene and/or having When C1 to C7 alkylene di(meth)acrylates are additionally included together, the spreadability of the composition may be poor or the modulus of the composition may be higher, resulting in low flexibility problems.
在本發明中,由化學式1表示的含芳族基光固化單體、作為不含芳族基的單體的具有C8到C20伸烷基的二(甲基)丙烯酸酯和具有C1到C7伸烷基的二(甲基)丙烯酸酯以及引發劑各自是不同的化合物。所述化合物可各自包含一種或多種材料。In the present invention, an aromatic group-containing photocurable monomer represented by Chemical Formula 1, a di(meth)acrylate having a C8 to C20 alkylene group and a C1 to C7 alkylene group as the aromatic group-free monomer The di(meth)acrylate of the alkyl group and the initiator are each different compounds. The compounds may each comprise one or more materials.
在下文中,詳細地描述根據實施例的組合物的每一組分。( A ) 由化學式 1 表示的含芳族基光固化單體 Hereinafter, each component of the composition according to the embodiment is described in detail. ( A ) Aromatic group-containing photocurable monomer represented by Chemical Formula 1
由化學式1表示的含芳族基光固化單體具有以下效果:將封裝組合物的折射率提高到大於或等於1.50、通過具有抗芳族電漿性來防止有機膜因電漿增強式化學氣相沉積而蝕刻,以及提供封裝組合物的適當的粘度。化學式1的單體可單獨包含或包含在兩個或大於兩個的組合中。The aromatic group-containing photocurable monomer represented by Chemical Formula 1 has the effects of increasing the refractive index of the encapsulation composition to 1.50 or more, preventing the organic film from being phase deposition and etching, as well as to provide the appropriate viscosity of the encapsulating composition. The monomer of Chemical Formula 1 may be contained alone or in a combination of two or more.
在化學式1中,L1 到L4 可獨立地是O、S、CO、COO、NR1 (其中R1 是氫或C1到C5烷基)或C1到C10伸烷基,當m1到m4各自是1時,其作為連接體存在,所述連接體是基團中的一個。在實施例中,L1 到L4 可獨立地是O、S、COO,或C1到C4伸烷基。另一方面,當m1到m4各自是0時,應將L1 到L4 分別理解為單鍵。In Chemical Formula 1, L 1 to L 4 may independently be O, S, CO, COO, NR 1 (wherein R 1 is hydrogen or a C1 to C5 alkyl group) or a C1 to C10 alkylene group, when m1 to m4 are each When it is 1, it exists as a linker, which is one of the groups. In embodiments, L 1 to L 4 may independently be O, S, COO, or C1 to C4 alkylene. On the other hand, when m1 to m4 are each 0, L1 to L4 should be understood as a single bond, respectively.
在化學式1中,Ar1 到Ar4 可獨立地是經取代或未經取代的C6到C20芳基,其中“芳基”與上文所述相同。In Chemical Formula 1, Ar 1 to Ar 4 may independently be substituted or unsubstituted C6 to C20 aryl groups, wherein "aryl" is the same as described above.
舉例來說,化學式1的Ar1 到Ar4 可獨立地是經取代或未經取代的苯基、經取代或未經取代的萘基、經取代或未經取代的蒽基、經取代或未經取代的菲基、經取代或未經取代的䓛基、經取代或未經取代的聯伸三苯基以及類似物,但不限於此。在實施例中,化學式1的Ar1 到Ar4 可獨立地是經取代或未經取代的苯基,或經取代或未經取代的萘基。For example, Ar 1 to Ar 4 of Chemical Formula 1 may independently be substituted or unsubstituted phenyl, substituted or unsubstituted naphthyl, substituted or unsubstituted anthracenyl, substituted or unsubstituted Substituted phenanthrenyl, substituted or unsubstituted methylene, substituted or unsubstituted triphenyl, and the like, but not limited thereto. In embodiments, Ar 1 to Ar 4 of Chemical Formula 1 may independently be a substituted or unsubstituted phenyl group, or a substituted or unsubstituted naphthyl group.
如上文所描述,“經取代”是指由以下置換芳基的至少一個氫:C1到C10飽和或不飽和烴基、C6到C20芳烴基、C1到C10烷氧基、C6到C20芳氧基、C7到C20芳基烷氧基、鹵素(氯、氟、溴、碘)、羥基、羧基、氨基、硝基、氰基,或其組合。As described above, "substituted" refers to the replacement of at least one hydrogen of an aryl group by a C1 to C10 saturated or unsaturated hydrocarbyl group, a C6 to C20 aromatic hydrocarbyl group, a C1 to C10 alkoxy group, a C6 to C20 aryloxy group, C7 to C20 arylalkoxy, halogen (chloro, fluoro, bromo, iodo), hydroxy, carboxyl, amino, nitro, cyano, or a combination thereof.
化學式1的Ar1 到Ar4 還可在n1到n4是0或1時分別為存在或不存在的,但n1到n4中的至少一個是1,且因此,化學式1包含至少一個芳基。在實施例中,n1到n4中的一個或兩個可以是1,且其它的可以是0。也就是說,由化學式1表示的化合物可具有至少一個芳基,或可包含兩個芳基。Ar 1 to Ar 4 of Chemical Formula 1 may also be present or absent when n1 to n4 are 0 or 1, respectively, but at least one of n1 to n4 is 1, and thus Chemical Formula 1 includes at least one aryl group. In an embodiment, one or both of n1 to n4 may be 1 and the others may be 0. That is, the compound represented by Chemical Formula 1 may have at least one aryl group, or may contain two aryl groups.
化學式1中的Z1 到Z4 可獨立地是氫、C1到C10烷基或由化學式2表示的基團,其中Z1 到Z4 中的至少一個是由化學式2表示的基團: (化學式2)。Z 1 to Z 4 in Chemical Formula 1 may independently be hydrogen, a C1 to C10 alkyl group, or a group represented by Chemical Formula 2, wherein at least one of Z 1 to Z 4 is a group represented by Chemical Formula 2: (Chemical formula 2) .
在化學式2中,Y1 、R2 、p、q、k以及*各自與上文所定義相同。In Chemical Formula 2, Y 1 , R 2 , p, q, k and * are each the same as defined above.
由化學式2表示的部分是允許由化學式1表示的化合物通過光經由自由基反應來聚合和固化的部分。也就是說,化學式2對應於光固化部分。因此,由化學式1表示的含芳族基單體可在分子中包含至少一個由化學式2表示的部分。也就是說,化學式1中的Z1 到Z4 中的至少一個是由式2表示的基團。在實施例中,化學式1中的Z1 到Z4 中的一個可以是由化學式2表示的基團,且其它三個可獨立地是氫或C1到C10烷基。The portion represented by Chemical Formula 2 is a portion that allows the compound represented by Chemical Formula 1 to be polymerized and cured by light through radical reaction. That is, Chemical Formula 2 corresponds to the photocurable part. Accordingly, the aromatic group-containing monomer represented by Chemical Formula 1 may contain at least one moiety represented by Chemical Formula 2 in the molecule. That is, at least one of Z 1 to Z 4 in Chemical Formula 1 is a group represented by Formula 2. In an embodiment, one of Z 1 to Z 4 in Chemical Formula 1 may be a group represented by Chemical Formula 2, and the other three may independently be hydrogen or C1 to C10 alkyl groups.
化學式2中的Y1 在k是1時可以是例如O、S或COO的連接基團,且在k是0時應理解為單鍵。Y 1 in Chemical Formula 2 may be a linking group such as O, S or COO when k is 1, and should be understood as a single bond when k is 0.
在實施例中,p可以是0且q可以是從1到4的整數中的一個,或在實施例中,p可以是從1到4的整數中的一個,且q可以是0。In an embodiment, p may be 0 and q may be one of the integers from 1 to 4, or in an embodiment, p may be one of the integers from 1 to 4, and q may be 0.
在實施例中,R2 可以是氫或C1到C4烷基,例如甲基。在本說明書中,如下文所示,當展示由化學式1表示的化合物的特定化學式時,即使僅例示其中R2 是氫或甲基的化學式,本領域的技術人員也應理解,其中在化合物中R2 是氫或甲基的所有化合物都包含在本發明的範圍中。In an embodiment, R 2 can be hydrogen or a C1 to C4 alkyl group such as methyl. In this specification, as shown below, when a specific chemical formula of the compound represented by Chemical Formula 1 is shown, even if only the chemical formula in which R 2 is hydrogen or methyl is exemplified, those skilled in the art will understand that in the compound All compounds in which R2 is hydrogen or methyl are included within the scope of the present invention.
如上文所描述,由化學式1表示的化合物在分子中具有至少一個芳基、兩個芳基、三個芳基或四個芳基。此外,在以上情況中的每一個中,一個由化學式2表示的光固化部分、兩個光固化部分、三個光固化部分或四個光固化部分可包含在分子中。在實施例中,由化學式1表示的含芳族基光固化單體可包含一個光固化部分。As described above, the compound represented by Chemical Formula 1 has at least one aryl group, two aryl groups, three aryl groups, or four aryl groups in the molecule. Furthermore, in each of the above cases, one photocurable moiety, two photocurable moieties, three photocurable moieties, or four photocurable moieties represented by Chemical Formula 2 may be included in the molecule. In an embodiment, the aromatic group-containing photocurable monomer represented by Chemical Formula 1 may include one photocurable moiety.
在實施例中,由化學式1表示的化合物可以是在分子中具有一個或兩個芳基且還包含一個由化學式2表示的光固化部分的光固化單體。在實施例中,由化學式1表示的化合物可以是在分子中包含一個芳基和一個由化學式2表示的光固化部分的光固化單體。或者,由化學式1表示的化合物可以是在分子中包含一個芳基和一個由化學式2表示的光固化部分的光固化單體與在分子中包含兩個或大於兩個芳基(例如,兩個或三個芳基)和一個由化學式2表示的光固化部分的光固化單體的組合。In an embodiment, the compound represented by Chemical Formula 1 may be a photocurable monomer having one or two aryl groups in a molecule and further including one photocurable moiety represented by Chemical Formula 2. In an embodiment, the compound represented by Chemical Formula 1 may be a photocurable monomer including one aryl group and one photocurable moiety represented by Chemical Formula 2 in the molecule. Alternatively, the compound represented by Chemical Formula 1 may be a photocurable monomer containing one aryl group and one photocurable moiety represented by Chemical Formula 2 in the molecule and two or more aryl groups (eg, two aryl groups) in the molecule. or three aryl groups) and a photocurable monomer of the photocurable moiety represented by Chemical Formula 2.
作為由化學式1表示的化合物的具體實例,可示出由以下化學式表示的化合物,但不限於此,且以下化合物可單獨包含或包含在兩個或大於兩個的組合中。 在以上化學式中,n是1到10的整數, 。As specific examples of the compound represented by Chemical Formula 1, the compound represented by the following Chemical Formula can be shown, but is not limited thereto, and the following compounds may be included alone or in a combination of two or more. In the above chemical formula, n is an integer from 1 to 10, .
以上化學式由包含丙烯酸酯基或甲基丙烯酸酯基作為光固化部分的特定化合物例示。然而,如上文所描述,例如,在具有丙烯酸酯基的化合物的情況下,具有甲基丙烯酸酯基而不是丙烯酸基團的化合物(其中化合物的其餘部分具有相同結構)還可作為一種類型的由化學式1表示的光固化單體而包含。此外,相反,在具有甲基丙烯酸酯基的化合物的情況下,具有丙烯酸酯基而不是甲基丙烯酸酯基的化合物(其中化合物的其餘部分具有相同結構)還可作為一種類型的由化學式1表示的光固化單體而包含。此外,由化學式1表示的化合物包含所有包含(甲基)丙烯酸酯基的化合物,所述(甲基)丙烯酸酯基是結構異構體。舉例來說,雖然僅提及2-(甲基)丙烯酸苯乙酯作為由化學式1表示的單體的實例,但3-(甲基)丙烯酸苯乙酯、4-(甲基)丙烯酸苯酯以及類似物可作為包含在本發明的組合物中的由化學式1表示的單體的實例而包含。The above chemical formula is exemplified by a specific compound containing an acrylate group or a methacrylate group as a photocurable moiety. However, as described above, for example, in the case of a compound having an acrylate group, a compound having a methacrylate group instead of an acrylic group (in which the rest of the compound has the same structure) can also serve as a type of The photocurable monomer represented by Chemical Formula 1 is contained. Furthermore, on the contrary, in the case of a compound having a methacrylate group, a compound having an acrylate group instead of a methacrylate group in which the rest of the compound has the same structure can also be represented by Chemical Formula 1 as a type of of photocurable monomers. In addition, the compound represented by Chemical Formula 1 includes all compounds containing a (meth)acrylate group, which is a structural isomer. For example, although only phenethyl 2-(meth)acrylate is mentioned as an example of the monomer represented by Chemical Formula 1, phenethyl 3-(meth)acrylate, phenylethyl 4-(meth)acrylate and the like may be included as examples of the monomer represented by Chemical Formula 1 contained in the composition of the present invention.
在根據實施例的組合物中,由化學式1表示的含芳族基單體的量可以是按光固化單體和引發劑的總重量計大於或等於50重量%。舉例來說,由化學式1表示的含芳族基單體的量可大於或等於51重量%,例如大於或等於52重量%、例如大於或等於55重量%、例如大於或等於60重量%、例如大於或等於62重量%、例如大於或等於63重量%、例如大於或等於65重量%、例如大於或等於68重量%、例如大於或等於70重量%、例如大於或等於72重量%、例如大於或等於75重量%、例如大於或等於77重量%、例如大於或等於80重量%、例如大於或等於85重量%,但不限於此。In the composition according to the embodiment, the amount of the aromatic group-containing monomer represented by Chemical Formula 1 may be greater than or equal to 50 wt % based on the total weight of the photocurable monomer and the initiator. For example, the amount of the aromatic group-containing monomer represented by Chemical Formula 1 may be greater than or equal to 51% by weight, such as greater than or equal to 52% by weight, such as greater than or equal to 55% by weight, such as greater than or equal to 60% by weight, such as greater than or equal to 62% by weight, such as greater than or equal to 63% by weight, such as greater than or equal to 65% by weight, such as greater than or equal to 68% by weight, such as greater than or equal to 70% by weight, such as greater than or equal to 72% by weight, such as greater than or equal to Equal to 75% by weight, such as greater than or equal to 77% by weight, such as greater than or equal to 80% by weight, such as greater than or equal to 85% by weight, but not limited thereto.
當由化學式1表示的含芳族基單體在以上量範圍內包含時,根據實施例的組合物可具有所需折射率、粘度、光固化速率、透光率以及類似物,且由其製造的有機膜具有高電漿蝕刻速率,模量極大減小,因此所述組合物可用作撓性有機發光二極體顯示裝置的有機阻擋層,且同時,所述組合物可呈現高亮度值。( B ) 具有 C8 到 C20 伸烷基的二 ( 甲基 ) 丙烯酸酯 When the aromatic group-containing monomer represented by Chemical Formula 1 is included in the above amount range, the composition according to the embodiment may have desired refractive index, viscosity, photocuring rate, light transmittance, and the like, and be produced therefrom The organic film has a high plasma etch rate, and the modulus is greatly reduced, so the composition can be used as an organic barrier layer for flexible organic light emitting diode display devices, and at the same time, the composition can exhibit high brightness value . ( B ) Di ( meth ) acrylates with C8 to C20 alkylene
根據實施例的組合物可包含具有C8到C20伸烷基的二(甲基)丙烯酸酯作為不含芳族基的光固化單體。The composition according to the embodiment may include a di(meth)acrylate having a C8 to C20 alkylene group as a photocurable monomer having no aromatic group.
具有C8到C20伸烷基的二(甲基)丙烯酸酯包含在封裝組合物中,由此提高有機膜的固化期間的交聯速率,從而降低有機阻擋層的電漿蝕刻速率以提高包含所述有機阻擋層的有機發光二極體顯示裝置的可靠性。當具有伸烷基(其具有大於20個碳原子)的二(甲基)丙烯酸酯包含在根據實施例的組合物中時,組合物的可鋪展性較差,或組合物的模量較高,因此撓性可能降低。Di(meth)acrylates having C8 to C20 alkylene groups are included in the encapsulation composition, thereby increasing the crosslinking rate during curing of the organic film, thereby reducing the plasma etch rate of the organic barrier layer to improve the inclusion of the Reliability of organic light emitting diode display devices with organic barrier layers. When a di(meth)acrylate having an alkylene group having more than 20 carbon atoms is included in the composition according to the embodiment, the spreadability of the composition is poor, or the modulus of the composition is relatively high, Therefore flexibility may be reduced.
具有C8到C20伸烷基的二(甲基)丙烯酸酯可以是不包含矽的非矽基二(甲基)丙烯酸酯。The di(meth)acrylate having a C8 to C20 alkylene group may be a non-silicon-based di(meth)acrylate that does not contain silicon.
具有C8到C20伸烷基的二(甲基)丙烯酸酯可包含在(甲基)丙烯酸酯基之間具有未經取代的C8到C20伸烷基的二(甲基)丙烯酸酯。本文中,伸烷基中的碳原子的數目僅意味著伸烷基自身中的碳原子的數目,不包含二(甲基)丙烯酸酯基中的碳。The di(meth)acrylate having a C8 to C20 alkylene group may include a di(meth)acrylate having an unsubstituted C8 to C20 alkylene group between the (meth)acrylate groups. Herein, the number of carbon atoms in the alkylene group only means the number of carbon atoms in the alkylene group itself, excluding carbon in the di(meth)acrylate group.
在實施例中,具有C8到C20伸烷基的二(甲基)丙烯酸酯可由化學式3表示: (化學式3) 在化學式3中, R3 是C8到C20伸烷基,且 R4 和R5 獨立地是氫或甲基。In an embodiment, the di(meth)acrylate having a C8 to C20 alkylene group may be represented by Chemical Formula 3: (Chemical Formula 3) In Chemical Formula 3, R 3 is a C8 to C20 alkylene group, and R 4 and R 5 are independently hydrogen or methyl.
舉例來說,R3 可以是C8到C15伸烷基,例如C8到C13伸烷基。For example, R3 can be a C8 to C15 alkylene, such as a C8 to C13 alkylene.
具有C8到C20伸烷基的二(甲基)丙烯酸酯的實例可以是辛二醇二(甲基)丙烯酸酯、壬二醇二(甲基)丙烯酸酯、癸二醇二(甲基)丙烯酸酯、十一烷二醇二(甲基)丙烯酸酯、十二烷二醇二(甲基)丙烯酸酯、十三烷二醇二(甲基)丙烯酸酯、十四烷二醇二(甲基)丙烯酸酯、十五烷二醇二(甲基)丙烯酸酯以及類似物,但不限於此。Examples of di(meth)acrylates having C8 to C20 alkylene groups may be octanediol di(meth)acrylate, nonanediol di(meth)acrylate, decanediol di(meth)acrylate ester, undecanediol di(meth)acrylate, dodecanediol di(meth)acrylate, tridecanediol di(meth)acrylate, tetradecanediol di(meth)acrylate ) acrylate, pentadecanediol di(meth)acrylate, and the like, but not limited thereto.
在根據實施例的組合物中,作為不含芳族基的單體的具有C8到C20伸烷基的二(甲基)丙烯酸酯可以按組合物中的光固化單體和引發劑的總重量計小於或等於約42重量%的量包含,例如以小於或等於約40重量%、例如小於或等於約38重量%、例如小於或等於約35重量%、例如小於或等於約32重量%、例如小於或等於約30重量%、例如小於或等於約28重量%、例如小於或等於約25重量%、例如小於或等於約22重量%或例如小於或等於約20重量%,且例如大於或等於約10重量%、例如大於或等於約12重量%或例如大於或等於約15重量%的量包含,但不限於此。In the composition according to the embodiment, the di(meth)acrylate having a C8 to C20 alkylene group as the monomer containing no aromatic group may be based on the total weight of the photocurable monomer and the initiator in the composition In an amount of less than or equal to about 42% by weight, for example, in an amount of less than or equal to about 40% by weight, such as less than or equal to about 38% by weight, such as less than or equal to about 35% by weight, such as less than or equal to about 32% by weight, such as less than or equal to about 30% by weight, such as less than or equal to about 28% by weight, such as less than or equal to about 25% by weight, such as less than or equal to about 22% by weight, or for example less than or equal to about 20% by weight, and for example greater than or equal to about An amount of 10% by weight, such as greater than or equal to about 12% by weight, or such as greater than or equal to about 15% by weight is included, but not limited thereto.
當具有C8到C20伸烷基的二(甲基)丙烯酸酯在以上範圍內包含時,根據實施例的封裝組合物可實施具有低電漿蝕刻速率的有機阻擋層,且在固化之後具有低模量以提供撓性顯示裝置,且可提高封裝有機發光二極體裝置的組合物的可鋪展性。When the di(meth)acrylate having a C8 to C20 alkylene group is included in the above range, the encapsulation composition according to the embodiment can implement an organic barrier layer with a low plasma etch rate and a low mold after curing amount to provide a flexible display device, and can improve the spreadability of the composition encapsulating the organic light emitting diode device.
在實施例中,具有C8到C20伸烷基的二(甲基)丙烯酸酯可以按光固化單體和引發劑的總重量計約15重量%到40重量%的量包含,例如以約20重量%到約35重量%的量包含。In an embodiment, the di(meth)acrylate having a C8 to C20 alkylene group may be included in an amount of about 15 wt % to 40 wt % based on the total weight of the photocurable monomer and initiator, such as about 20 wt % % to about 35% by weight.
具有C8到C20伸烷基的二(甲基)丙烯酸酯可單獨包含或與隨後描述的具有C1到C7伸烷基的二(甲基)丙烯酸酯一起包含,作為組合物中的不含芳族基的光固化單體。( C ) 具有 C1 到 C7 伸烷基的二 ( 甲基 ) 丙烯酸酯 Di(meth)acrylates having C8 to C20 alkylene may be included alone or together with the subsequently described di(meth)acrylates having C1 to C7 alkylenes as non-aromatic components in the composition based photocurable monomers. ( C ) Di ( meth ) acrylates with C1 to C7 alkylene
根據實施例的組合物可包含具有C1到C7伸烷基的二(甲基)丙烯酸酯作為不含芳族基的光固化單體。The composition according to the embodiment may include a di(meth)acrylate having a C1 to C7 alkylene group as an aromatic group-free photocurable monomer.
與具有C8到C20伸烷基的二(甲基)丙烯酸酯相似,具有C1到C7伸烷基的二(甲基)丙烯酸酯包含在封裝組合物中以降低有機阻擋層的電漿蝕刻速率,以及提高包含所述有機阻擋層的有機發光二極體顯示裝置的可靠性。Similar to di(meth)acrylates with C8 to C20 alkylene groups, di(meth)acrylates with C1 to C7 alkylene groups are included in the encapsulation composition to reduce the plasma etch rate of the organic barrier layer, And improve the reliability of the organic light emitting diode display device including the organic barrier layer.
具有C1到C7伸烷基的二(甲基)丙烯酸酯可以是不包含矽的非矽基二(甲基)丙烯酸酯。The di(meth)acrylate having a C1 to C7 alkylene group may be a non-silicon-based di(meth)acrylate that does not contain silicon.
具有C1到C7伸烷基的二(甲基)丙烯酸酯可包含在(甲基)丙烯酸酯基之間具有未經取代的C1到C7伸烷基的二(甲基)丙烯酸酯。本文中,伸烷基中的碳原子的數目僅意味著伸烷基自身中的碳原子的數目,不包含二(甲基)丙烯酸酯基中的碳。The di(meth)acrylate having a C1 to C7 alkylene group may include a di(meth)acrylate having an unsubstituted C1 to C7 alkylene group between the (meth)acrylate groups. Herein, the number of carbon atoms in the alkylene group only means the number of carbon atoms in the alkylene group itself, excluding carbon in the di(meth)acrylate group.
在實施例中,具有C1到C7伸烷基的二(甲基)丙烯酸酯可由化學式4表示: (化學式4) 在化學式4中, R6 是C1到C7伸烷基,且 R7 和R8 獨立地是氫或甲基。In an embodiment, the di(meth)acrylate having a C1 to C7 alkylene group may be represented by Chemical Formula 4: (Chemical Formula 4) In Chemical Formula 4, R 6 is a C1 to C7 alkylene group, and R 7 and R 8 are independently hydrogen or methyl.
舉例來說,R6 可以是C1到C7伸烷基,例如C3到C7伸烷基。For example, R6 can be a C1 to C7 alkylene, such as a C3 to C7 alkylene.
具有C1到C7伸烷基的二(甲基)丙烯酸酯的實例可以是甲二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、戊二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、庚二醇二(甲基)丙烯酸酯以及類似物,但不限於此。Examples of di(meth)acrylates having C1 to C7 alkylene groups may be ethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, Butanediol di(meth)acrylate, pentanediol di(meth)acrylate, hexanediol di(meth)acrylate, heptanediol di(meth)acrylate and the like, but not limited to this.
與具有C8到C20伸烷基的二(甲基)丙烯酸酯相似,當具有C1到C7伸烷基的二(甲基)丙烯酸酯作為不含芳族基的單體單獨包含時,其可以按光固化單體和引發劑的總重量計小於或等於約42重量%的量包含在根據實施例的組合物中,例如以小於或等於約40重量%、例如小於或等於約38重量%、例如小於或等於約35重量%、例如小於或等於約32重量%、例如小於或等於約30重量%、例如小於或等於約28重量%、例如小於或等於約25重量%、例如小於或等於約22重量%或例如小於或等於約20重量%,且例如大於或等於約10重量%、例如大於或等於約12重量%或例如大於或等於約15重量%的量包含在根據實施例的組合物中,但不限於此。Similar to the di(meth)acrylate having an alkylene group of C8 to C20, when the di(meth)acrylate having an alkylene group having C1 to C7 is contained alone as an aromatic group-free monomer, it can be The photocurable monomers and initiators are included in the compositions according to the embodiments in an amount of less than or equal to about 42 wt %, such as less than or equal to about 40 wt %, such as less than or equal to about 38 wt %, such as less than or equal to about 35% by weight, such as less than or equal to about 32% by weight, such as less than or equal to about 30% by weight, such as less than or equal to about 28% by weight, such as less than or equal to about 25% by weight, such as less than or equal to about 22% % by weight or, for example, less than or equal to about 20% by weight, and for example, greater than or equal to about 10% by weight, such as greater than or equal to about 12% by weight, or for example, greater than or equal to about 15% by weight, are included in compositions according to embodiments , but not limited to this.
當具有C1到C7伸烷基的二(甲基)丙烯酸酯在所述範圍內包含時,根據實施例的封裝組合物可實施具有低電漿蝕刻速率的有機阻擋層,且在固化之後具有低模量以提供撓性顯示裝置,且可提高用於封裝有機發光二極體裝置的組合物的可鋪展性。在實施例中,具有C1到C7伸烷基的二(甲基)丙烯酸酯可以按光固化單體和引發劑的總重量計約15重量%到40重量%的量包含,例如以約20重量%到約35重量%的量包含。When the di(meth)acrylate having a C1 to C7 alkylene group is included in the range, the encapsulation composition according to the embodiment may implement an organic barrier layer having a low plasma etch rate and a low plasma etch rate after curing Modulus to provide flexible display devices and can improve the spreadability of compositions for encapsulating organic light emitting diode devices. In an embodiment, the di(meth)acrylate having a C1 to C7 alkylene group may be included in an amount of about 15 wt % to 40 wt % based on the total weight of the photocurable monomer and initiator, such as about 20 wt % % to about 35% by weight.
如上文所描述,根據實施例的組合物中的不含芳族基的單體可包含具有C8到C20伸烷基的二(甲基)丙烯酸酯和/或具有C1到C7伸烷基的二(甲基)丙烯酸酯,其中在當所述兩種組分各自單獨存在時和當所述兩種組分混合時的兩種情況下,所述兩種組分可以預定量包含,只要不含芳族基的單體的總量在按根據本發明的組合物中的光固化單體和引發劑的總重量計小於或等於約42重量%的範圍內即可。換句話說,當僅存在兩種組分中的任一種時,所述一種組分可以按光固化單體和引發劑的總重量計小於或等於約42重量%包含,或當存在所有所述兩種組分時,所述兩種組分的總和可以是按光固化單體和引發劑的總重量計小於或等於約42重量%。在這種情況下,所述兩種組分的混合比不受特定限制。換句話說,當所述兩種組分包含在一起時,所述兩種組分可以在約1:99與約99:1之間的範圍內的任何重量比混合。As described above, the aromatic-free monomers in the compositions according to the embodiments may comprise di(meth)acrylates having C8 to C20 alkylene and/or di(meth)acrylates having C1 to C7 alkylene (Meth)acrylate, wherein the two components may be contained in predetermined amounts in both cases when the two components are each present alone and when the two components are mixed, as long as they are not contained The total amount of aromatic-based monomers may be within a range of less than or equal to about 42% by weight based on the total weight of photocurable monomers and initiators in the composition according to the present invention. In other words, when only either of the two components is present, the one component may be included in less than or equal to about 42% by weight based on the total weight of the photocurable monomer and initiator, or when all of the components are present In the case of two components, the sum of the two components may be less than or equal to about 42 weight percent based on the total weight of the photocurable monomer and initiator. In this case, the mixing ratio of the two components is not particularly limited. In other words, when the two components are included together, the two components may be mixed in any weight ratio in the range between about 1:99 and about 99:1.
具有C1到C7伸烷基的二(甲基)丙烯酸酯和具有C8到C20伸烷基的二(甲基)丙烯酸酯兩者以及由具有二丙烯酸酯表示的化合物和由具有二甲基丙烯酸酯(其具有另一區的相同結構)表示的化合物都涉及根據本發明的化合物的範圍。此外,其所有結構異構體可涉及根據本發明的化合物的範圍。( D ) 具有 C8 到 C20 烷基的單 ( 甲基 ) 丙烯酸酯 Both di(meth)acrylates having C1 to C7 alkylene groups and di(meth)acrylates having C8 to C20 alkylene groups and compounds represented by having diacrylates and by having dimethacrylates The compounds represented (which have the same structure of another region) all relate to the scope of the compounds according to the invention. Furthermore, all structural isomers thereof may relate to the scope of the compounds according to the present invention. ( D ) Mono ( meth ) acrylates with C8 to C20 alkyl groups
另一方面,除了上文所描述的具有C8到C20伸烷基的二(甲基)丙烯酸酯和/或具有C1到C7伸烷基的二(甲基)丙烯酸酯以外,根據實施例的封裝組合物還可進一步包含具有C8到C20烷基的單(甲基)丙烯酸酯作為不含芳族基的光固化單體。On the other hand, in addition to the above-described di(meth)acrylates having C8 to C20 alkylene and/or di(meth)acrylates having C1 to C7 alkylene, the encapsulation according to the embodiment The composition may further comprise a mono(meth)acrylate having a C8 to C20 alkyl group as an aromatic group-free photocurable monomer.
封裝組合物的光固化速率可通過在根據實施例的封裝組合物中進一步包含具有C8到C20烷基的單(甲基)丙烯酸酯來進一步提高。此外,具有C8到C20烷基的單(甲基)丙烯酸酯可提高有機阻擋層的透光率且還降低電漿蝕刻速率。The photocuring rate of the encapsulating composition can be further improved by further including a mono(meth)acrylate having a C8 to C20 alkyl group in the encapsulating composition according to the embodiment. In addition, mono(meth)acrylates with C8 to C20 alkyl groups can increase the light transmittance of the organic barrier layer and also reduce the plasma etch rate.
具有C8到C20烷基的單(甲基)丙烯酸酯可以是不包含矽的非矽基單(甲基)丙烯酸酯。The mono(meth)acrylate having a C8 to C20 alkyl group may be a non-silicon based mono(meth)acrylate that does not contain silicon.
具有C8到C20烷基的單(甲基)丙烯酸酯可以是包含例如C8到C16烷基、且更合乎需要地包含C8到C12烷基的單(甲基)丙烯酸酯。The mono(meth)acrylate having a C8 to C20 alkyl group may be a mono(meth)acrylate containing, for example, a C8 to C16 alkyl group, and more desirably, a C8 to C12 alkyl group.
具有C8到C20烷基的單(甲基)丙烯酸酯的實例可以是(甲基)丙烯酸癸酯、(甲基)丙烯酸十一酯、(甲基)丙烯酸十二酯、(甲基)丙烯酸十三酯、(甲基)丙烯酸十四酯、(甲基)丙烯酸十五酯、(甲基)丙烯酸十六酯以及類似物,但不限於此。Examples of mono(meth)acrylates having C8 to C20 alkyl groups can be decyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, deca (meth)acrylate Triesters, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, and the like, but not limited thereto.
具有C8到C20烷基的單(甲基)丙烯酸酯可以按根據實施例的組合物中的光固化單體和引發劑的總重量計小於或等於約約20重量%的量包含,例如以小於或等於約17重量%、例如小於或等於約15重量%、例如小於或等於約12重量%或例如小於或等於約10重量%,且例如大於或等於約1重量%或例如大於或等於約5重量%的量包含,但不限於此。( E ) 引發劑 The mono(meth)acrylate having a C8 to C20 alkyl group may be included in an amount of less than or equal to about 20% by weight, based on the total weight of the photocurable monomer and initiator in the compositions according to the embodiments, for example, in an amount of less than or equal to about 20% by weight. or equal to about 17% by weight, such as less than or equal to about 15% by weight, such as less than or equal to about 12% by weight, or for example less than or equal to about 10% by weight, and for example greater than or equal to about 1% by weight or such as greater than or equal to about 5% The amount of % by weight includes, but is not limited to. ( E ) Initiator
引發劑可包含但不限於能夠進行光固化反應的常規光聚合引發劑。舉例來說,光聚合引發劑可包含三嗪類、苯乙酮類、二苯甲酮類、噻噸酮類、苯偶姻類、磷系或肟基引發劑,或其混合物。引發劑可單獨包含或包含在兩種或大於兩種的組合中。The initiator may include, but is not limited to, conventional photopolymerization initiators capable of photocuring reaction. For example, the photopolymerization initiator may include triazine-based, acetophenone-based, benzophenone-based, thioxanthone-based, benzoin-based, phosphorus-based or oxime-based initiators, or a mixture thereof. The initiators may be included alone or in a combination of two or more.
磷系引發劑可以是二苯基(2,4,6-三甲基苯甲醯基)氧化膦、苄基(二苯基)氧化膦,或其混合物。舉例來說,當使用磷系引發劑時,本發明的組合物可展示針對長波長的UV的更好的引發性能。The phosphorus-based initiator may be diphenyl(2,4,6-trimethylbenzyl)phosphine oxide, benzyl(diphenyl)phosphine oxide, or a mixture thereof. For example, when a phosphorus-based initiator is used, the compositions of the present invention may exhibit better initiation performance for long wavelength UV.
在根據實施例的封裝組合物中,引發劑的量可以是按光固化單體和引發劑的總重量計小於10重量%。舉例來說,引發劑可以小於或等於8重量%的量包含,例如以小於或等於7重量%或例如小於或等於5重量%,且例如大於或等於0.5重量%、例如大於或等於1重量%、例如大於或等於2重量%、例如或大於或等於3重量%的量包含,但不限於此。當引發劑在以上範圍內包含時,光聚合可在曝光期間充分發生,且有可能防止透射率因光聚合之後剩餘的未反應引發劑而下降。In the encapsulation composition according to the embodiment, the amount of the initiator may be less than 10 wt % based on the total weight of the photocurable monomer and the initiator. For example, the initiator may be included in an amount less than or equal to 8% by weight, such as in an amount less than or equal to 7% by weight or, for example, less than or equal to 5% by weight, and such as greater than or equal to 0.5% by weight, such as greater than or equal to 1% by weight , such as greater than or equal to 2% by weight, such as or greater than or equal to 3% by weight, but not limited thereto. When the initiator is contained within the above range, photopolymerization can sufficiently occur during exposure, and it is possible to prevent a decrease in transmittance due to unreacted initiator remaining after photopolymerization.
根據實施例的封裝組合物可通過混合(A)到(C)以及(E)的所有組分來製備,且在實施例中,進一步包含(D)的組分。舉例來說,用於封裝有機發光二極體裝置的組合物可以不包含溶劑的無溶劑類型形成。The encapsulation composition according to the embodiment can be prepared by mixing all the components of (A) to (C) and (E), and in the embodiment, the component of (D) is further included. For example, the composition for encapsulating an organic light emitting diode device may be formed in a solvent-free type that does not contain a solvent.
用於封裝有機發光二極體裝置的組合物是可通過在UV波長下以10毫瓦/平方釐米到500毫瓦/平方釐米照射1秒到50秒來固化的光固化組合物。The composition for encapsulating the organic light emitting diode device is a photocurable composition curable by irradiation at a UV wavelength of 10 mW/cm 2 to 500 mW/cm 2 for 1 second to 50 seconds.
如在將隨後描述的實例中所展示,根據實施例的用於封裝有機發光二極體裝置的組合物具有大於或等於1.50的折射率,例如大於或等於1.50且小於或等於1.70、大於或等於1.52且小於或等於1.65或大於或等於1.52且小於或等於1.60的折射率,因此當具有在所述範圍內的折射率時,所述組合物可實現即使在形成於有機發光二極體顯示裝置中的無機膜上時也在正表面和/或側表面上具有更高亮度的有機膜。特定來說,當根據本發明的封裝組合物用於其中有機膜與無機膜交替地層合的混合保護層時,即使穿過無機膜的光正穿過有機膜,所述組合物也可防止亮度降低的現象。As shown in examples to be described later, compositions for encapsulating organic light emitting diode devices according to embodiments have a refractive index greater than or equal to 1.50, eg, greater than or equal to 1.50 and less than or equal to 1.70, greater than or equal to 1.70 1.52 and less than or equal to 1.65 or more than or equal to 1.52 and less than or equal to 1.60 refractive index, so when having a refractive index within the range, the composition can be realized even when formed in an organic light emitting diode display device Organic films that also have higher brightness on the front and/or side surfaces while on the inorganic films in the middle. In particular, when the encapsulation composition according to the present invention is used for a hybrid protective layer in which organic films and inorganic films are alternately laminated, the composition can prevent a decrease in brightness even if light passing through the inorganic film is passing through the organic film The phenomenon.
此外,根據本發明的封裝組合物具有大於或等於10厘泊(centi poise)的粘度,例如約12厘泊到30厘泊、約13厘泊到約25厘泊或約13厘泊到約20厘泊的粘度,因此當使用噴墨列印時有機膜可以均勻厚度形成,且還可通過防止有機膜因過低粘度而鋪展的現象來提高可加工性。Furthermore, the encapsulating composition according to the present invention has a viscosity of greater than or equal to 10 centipoise, such as about 12 centipoise to 30 centipoise, about 13 centipoise to about 25 centipoise, or about 13 centipoise to about 20 centipoise Therefore, the organic film can be formed with a uniform thickness when using inkjet printing, and the processability can also be improved by preventing the phenomenon that the organic film spreads due to excessively low viscosity.
通常,可採用具有更高折射率的單體和具有高折射率的粒子來提高封裝組合物的折射率。然而,在這種情況下,可能提高封裝組合物的折射率,但粘度過度提高而不能防止在通過噴墨列印法形成有機膜時的問題。但根據實施例的組合物可同時滿足折射率和粘度的兩個範圍,甚至不包含粒子。In general, monomers with higher refractive index and particles with high refractive index can be used to increase the refractive index of the encapsulating composition. In this case, however, it is possible to increase the refractive index of the encapsulating composition, but the viscosity is excessively increased to prevent the problem in forming the organic film by the ink jet printing method. But the compositions according to the examples can satisfy both ranges of refractive index and viscosity, even without particles.
與提高折射率和粘度一起,根據本發明的封裝組合物通過降低電漿蝕刻速率來提高抗電漿性,使得可容易地形成有機膜和無機膜,且可最小化有機發光二極體裝置受電漿的損壞。可通過電漿沉積來形成無機膜。當有機膜受電漿蝕刻時,有機發光二極體裝置可能因外部水分和/或氧而受損。Along with increasing refractive index and viscosity, the encapsulation composition according to the present invention improves plasma resistance by reducing plasma etching rate, so that organic and inorganic films can be easily formed, and organic light emitting diode devices can be minimized pulp damage. The inorganic film can be formed by plasma deposition. When the organic film is plasma etched, the organic light emitting diode device may be damaged by external moisture and/or oxygen.
如在將隨後描述的實例中所展示,根據實施例的封裝組合物可具有小於或等於7%的電漿蝕刻速率,例如小於或等於6.8%、小於或等於6.7%、小於或等於6.5%、小於或等於6.2%或小於或等於6.0%的電漿蝕刻速率。當電漿蝕刻速率在所述範圍內時,有機發光二極體裝置的損壞可在以薄膜厚度將其沉積在無機膜上時最小化。As shown in the examples to be described later, encapsulation compositions according to embodiments may have a plasma etch rate of less than or equal to 7%, such as less than or equal to 6.8%, less than or equal to 6.7%, less than or equal to 6.5%, A plasma etch rate of less than or equal to 6.2% or less than or equal to 6.0%. When the plasma etch rate is within the range, damage to the organic light emitting diode device can be minimized when it is deposited on the inorganic film at a thin film thickness.
此外,組合物可具有大於或等於85%的光固化速率,例如大於或等於88%、大於或等於89%或大於或等於90%、例如90%到99%(具體來說91%到97%)的光固化速率。在所述範圍內,有機膜具有足夠高的固化度以阻擋滲透外部水分和/或氧以防止損壞有機發光二極體裝置,使得可提高可靠性,且還足夠地減小固化收縮應力以提供其中未出現移位的層,使得可採用所述有機膜以用於封裝裝置。Furthermore, the composition may have a photocuring rate of greater than or equal to 85%, such as greater than or equal to 88%, greater than or equal to 89%, or greater than or equal to 90%, such as 90% to 99% (specifically 91% to 97%) ) of the photocuring rate. Within the range, the organic film has a degree of cure high enough to block penetration of external moisture and/or oxygen to prevent damage to the organic light emitting diode device, so that reliability can be improved, and also reduce cure shrinkage stress sufficiently to provide A layer in which no displacement occurs, makes it possible to employ the organic film for encapsulating a device.
此外,組合物可具有如從將隨後描述的實例中得知的140%到170%的可鋪展性。在所述範圍內,當通過噴墨來列印組合物時,組合物在不堵塞的情況下很好地分散,以便提高可加工性以及提供具有均勻表面的有機阻擋層。Furthermore, the composition may have a spreadability of 140% to 170% as will be known from the examples to be described later. Within the range, when the composition is printed by ink jet, the composition is well dispersed without clogging in order to improve processability and provide an organic barrier layer with a uniform surface.
此外,在沉積於矽晶片上且光固化之後,組合物具有低抗電漿性,其為小於10%的電漿蝕刻速率。在所述範圍內,有機發光二極體裝置的可靠性可能在有機發光二極體裝置的其中由電漿形成的無機阻擋層和有機阻擋層依序形成的封裝結構中是令人滿意的。Furthermore, after deposition on a silicon wafer and photocuring, the composition has low plasma resistance, which is a plasma etch rate of less than 10%. Within the range, the reliability of the organic light emitting diode device may be satisfactory in a package structure of the organic light emitting diode device in which an inorganic barrier layer formed of plasma and an organic barrier layer are sequentially formed.
在固化組合物之後,在25±2℃下的模量可小於或等於約6.5吉帕,且合乎需要地為0.01吉帕到6.5吉帕。在所述範圍內,所述組合物可用於撓性有機發光二極體顯示裝置。After curing the composition, the modulus at 25±2°C can be less than or equal to about 6.5 GPa, and desirably from 0.01 GPa to 6.5 GPa. Within the range, the composition can be used in a flexible organic light emitting diode display device.
在固化之後,組合物可具有大於或等於95%、例如95%到99%的透光率,在所述範圍內,在封裝有機發光二極體裝置時可見度提高,其中在例如550奈米波長的可見區處測量透射率。After curing, the composition may have a light transmittance of greater than or equal to 95%, such as 95% to 99%, within the range of which visibility is improved upon encapsulation of organic light emitting diode devices, wherein, for example, at a wavelength of 550 nanometers The transmittance is measured in the visible region of .
用於封裝有機發光二極體裝置的組合物可用來封裝有機發光二極體裝置。具體來說,有機阻擋層可由所述組合物形成於其中無機阻擋層和有機阻擋層依序形成的封裝結構中。特定來說,用於封裝有機發光二極體裝置的組合物可用於撓性有機發光二極體顯示裝置中。The composition for encapsulating organic light emitting diode devices can be used to encapsulate organic light emitting diode devices. Specifically, an organic barrier layer may be formed from the composition in an encapsulation structure in which an inorganic barrier layer and an organic barrier layer are sequentially formed. In particular, compositions for encapsulating organic light emitting diode devices can be used in flexible organic light emitting diode display devices.
用於封裝有機發光二極體裝置的組合物可用於封裝裝置的可拆卸或由於周圍環境中的氣體或液體(例如大氣中的氧和/或水分和/或水蒸氣以及用於處理電子產品的化學試劑)的滲透而變得有缺陷的構件,作為裝置的構件,尤其是顯示裝置的構件。舉例來說,裝置構件可以是照明裝置、金屬感測器墊、微盤雷射、電致變色裝置、光致變色裝置、微機電系統、太陽能電池、積體電路、電荷耦合裝置、發光聚合物或發光二極體,但不限於此。Compositions for encapsulating organic light emitting diode devices can be used for detachment of encapsulated devices or due to gases or liquids in the surrounding environment such as oxygen and/or moisture and/or water vapor in the atmosphere and for handling electronic products. components that become defective due to penetration of chemical agents) as components of devices, especially display devices. For example, the device components may be lighting devices, metal sensor pads, microdisk lasers, electrochromic devices, photochromic devices, microelectromechanical systems, solar cells, integrated circuits, charge coupled devices, light emitting polymers or light-emitting diodes, but not limited thereto.
本發明的有機發光二極體顯示裝置可包含由本發明的實施例的用於封裝有機發光二極體裝置的組合物形成的有機阻擋層。具體來說,有機發光二極體顯示裝置包含有機發光二極體裝置和阻擋疊層,所述阻擋疊層形成於有機發光二極體裝置上且包含無機阻擋層和有機阻擋層,且所述有機阻擋層由根據本發明的實施例的用於封裝有機發光二極體裝置的組合物形成。因此,可提高有機發光二極體顯示裝置的可靠性。The organic light emitting diode display device of the present invention may include an organic barrier layer formed of the composition for encapsulating an organic light emitting diode device of an embodiment of the present invention. Specifically, an organic light emitting diode display device includes an organic light emitting diode device and a barrier stack, the barrier stack is formed on the organic light emitting diode device and includes an inorganic barrier layer and an organic barrier layer, and the barrier stack is formed on the organic light emitting diode device and includes an inorganic barrier layer and an organic barrier layer, and the The organic barrier layer is formed of the composition for encapsulating an organic light emitting diode device according to an embodiment of the present invention. Therefore, the reliability of the organic light emitting diode display device can be improved.
在下文中,參考圖1描述根據本發明的實施例的有機發光二極體顯示裝置。圖1是根據本發明的實施例的有機發光二極體顯示裝置的橫截面視圖。Hereinafter, an organic light emitting diode display device according to an embodiment of the present invention is described with reference to FIG. 1 . FIG. 1 is a cross-sectional view of an organic light emitting diode display device according to an embodiment of the present invention.
參考圖1,根據本發明的實施例的有機發光二極體顯示裝置100包含基板10、形成於基板10上的有機發光二極體裝置20,以及形成於有機發光二極體裝置20上且包含無機阻擋層31和有機阻擋層32的阻擋疊層30,其中無機阻擋層31與有機發光二極體裝置20接觸,且有機阻擋層32可由根據本發明的實施例的用於封裝有機發光二極體裝置的組合物形成。1, an organic light emitting
基板10不受特定限制,只要其為可在其上形成有機發光二極體裝置的基板即可。舉例來說,其可由例如透明玻璃、塑料薄片、矽的材料製成,或可以是金屬基板。The
有機發光二極體裝置20通常用於有機發光二極體顯示裝置中且未在圖1中示出,但可包含第一電極、第二電極,以及形成於第一電極與第二電極之間的有機發光膜。有機發光膜可以是依序堆疊的電洞注入層、電洞傳輸層、發光層、電子傳輸層或電子注入層,但不限於此。The organic light emitting
阻擋疊層30包含有機阻擋層和無機阻擋層,其中有機阻擋層與無機阻擋層可彼此具有不同組件以提供用於封裝每一有機發光二極體裝置的功能。The barrier stack 30 includes an organic barrier layer and an inorganic barrier layer, wherein the organic barrier layer and the inorganic barrier layer may have different components from each other to provide a function for encapsulating each organic light emitting diode device.
無機阻擋層具有不同於有機阻擋層的組分,因此補充有機阻擋層的效果。無機阻擋層可由具有極佳透光率且具有極佳水分和/或氧阻擋性質的無機材料形成。舉例來說,無機阻擋層可以是金屬、非金屬、金屬間化合物或合金、非金屬間化合物或合金、金屬或非金屬氧化物、金屬或非金屬氟化物、金屬或非金屬氮化物、金屬或非金屬碳化物、金屬或非金屬氮氧化物、金屬或非金屬硼化物、金屬或非金屬硼氧化物、金屬或非金屬矽化物,或其混合物。金屬或非金屬可以是矽(Si)、鋁(Al)、硒(Se)、鋅(Zn)、銻(Sb)、銦(In)、鍺(Ge)、錫(Sn)、鉍(Bi)、過渡金屬、鑭系金屬以及類似物,但不限於此。具體來說,無機阻擋層可以是氧化矽(SiOx )、氮化矽(SiNx )、氮氧化矽(SiOx Ny )、ZnSe、ZnO、Sb2 O3 、AlOx (例如Al2 O3 )、In2 O3 ,或SnO2 。The inorganic barrier layer has a composition different from that of the organic barrier layer, and thus complements the effect of the organic barrier layer. The inorganic barrier layer may be formed of an inorganic material having excellent light transmittance and excellent moisture and/or oxygen barrier properties. For example, the inorganic barrier layer can be a metal, non-metal, intermetallic compound or alloy, non-intermetallic compound or alloy, metal or non-metal oxide, metal or non-metal fluoride, metal or non-metal nitride, metal or Non-metallic carbides, metallic or non-metallic oxynitrides, metallic or non-metallic borides, metallic or non-metallic boron oxides, metallic or non-metallic silicides, or mixtures thereof. The metal or non-metal can be silicon (Si), aluminum (Al), selenium (Se), zinc (Zn), antimony (Sb), indium (In), germanium (Ge), tin (Sn), bismuth (Bi) , transition metals, lanthanide metals, and the like, but not limited thereto. Specifically, the inorganic barrier layer may be silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), ZnSe, ZnO, Sb 2 O 3 , AlO x (eg, Al 2 O ) 3 ), In 2 O 3 , or SnO 2 .
無機阻擋層可通過電漿製程、真空製程來沉積,所述製程例如濺射、化學氣相沉積(chemical vapor deposition;CVD)、電漿化學氣相沉積(CVD)、蒸發、昇華、電子回旋共振-電漿化學氣相沉積,以及其組合。The inorganic barrier layer can be deposited by plasma processes, vacuum processes such as sputtering, chemical vapor deposition (CVD), plasma chemical vapor deposition (CVD), evaporation, sublimation, electron cyclotron resonance - Plasma chemical vapor deposition, and combinations thereof.
當有機阻擋層與無機阻擋層交替地沉積時,可確保無機阻擋層的平坦化特性且可防止無機阻擋層到另一無機阻擋層的鋪展缺陷。When the organic barrier layer and the inorganic barrier layer are alternately deposited, the planarization property of the inorganic barrier layer can be ensured and spreading defects of the inorganic barrier layer to another inorganic barrier layer can be prevented.
有機阻擋層可通過塗布用於封裝有機發光二極體裝置的組合物、沉積、固化以及類似物的組合來形成。舉例來說,用於封裝有機發光二極體裝置的組合物在1微米的厚度上塗布且通過以10毫瓦/平方釐米到500毫瓦/平方釐米照射所述組合物1秒到50秒來固化。The organic barrier layer may be formed by a combination of coating, deposition, curing, and the like of the composition used to encapsulate the organic light emitting diode device. For example, a composition for encapsulating an organic light emitting diode device is coated at a thickness of 1 micron and irradiated by irradiating the composition at 10 mW/cm2 to 500 mW/cm2 for 1 to 50 seconds. cured.
阻擋疊層包含有機阻擋層和無機阻擋層,其中有機阻擋層和無機阻擋層的總數目不受限。有機阻擋層和無機阻擋層的總數目可取決於對氧和/或水分和/或水蒸氣和/或化學材料的傳輸抗性的水平而改變。舉例來說,有機阻擋層和無機阻擋層的總數目是小於或等於10層,例如2層到7層,具體來說,依序形成7層無機阻擋層/有機阻擋層/無機阻擋層/有機阻擋層/無機阻擋層/有機阻擋層/無機阻擋層。The barrier stack includes organic barrier layers and inorganic barrier layers, wherein the total number of organic barrier layers and inorganic barrier layers is not limited. The total number of organic and inorganic barrier layers may vary depending on the level of resistance to transport of oxygen and/or moisture and/or water vapor and/or chemical materials. For example, the total number of organic barrier layers and inorganic barrier layers is less than or equal to 10 layers, such as 2 layers to 7 layers, specifically, 7 layers of inorganic barrier layers/organic barrier layers/inorganic barrier layers/organic barrier layers are formed in sequence Barrier Layer/Inorganic Barrier Layer/Organic Barrier Layer/Inorganic Barrier Layer.
在阻擋疊層中,有機阻擋層與無機阻擋層交替地沉積。這是因為由組合物的性質在有機阻擋層上產生的效果。由此,有機阻擋層和無機阻擋層可補充或增強在封裝裝置時的效果。In the barrier stack, organic barrier layers are deposited alternately with inorganic barrier layers. This is due to the effect on the organic barrier layer produced by the properties of the composition. As such, the organic and inorganic barrier layers may complement or enhance the effect in encapsulating the device.
在下文中,參考圖2描述本發明的另一實施例的有機發光二極體顯示裝置。圖2是根據本發明的另一實施例的有機發光二極體顯示裝置的橫截面視圖。Hereinafter, an organic light emitting diode display device of another embodiment of the present invention is described with reference to FIG. 2 . 2 is a cross-sectional view of an organic light emitting diode display device according to another embodiment of the present invention.
參考圖2,根據本發明的另一實施例的有機發光二極體顯示裝置200可包含基板10、形成於基板10上的有機發光二極體裝置20,以及形成於有機發光二極體裝置20上且包含無機阻擋層31和有機阻擋層32的阻擋疊層30,其中無機阻擋層31封裝容納有機發光二極體裝置20的內空間40,且有機阻擋層32可由根據本發明的實施例的用於封裝有機發光二極體裝置的組合物形成。除了無機阻擋層不接觸到有機發光二極體裝置之外,所述有機發光二極體顯示裝置200大體上等同於根據本發明的實施例的有機發光二極體顯示裝置。Referring to FIG. 2 , an organic light emitting
在下文中,將通過實例和比較例詳細描述本發明。這些實例僅僅是用於解釋本發明的實例,且本發明的範圍不限於此,且本發明的範圍將僅由本說明書隨附的權利要求書限定。實例 Hereinafter, the present invention will be described in detail by way of Examples and Comparative Examples. These examples are merely examples for explaining the present invention, and the scope of the present invention is not limited thereto, and the scope of the present invention will be limited only by the claims appended to this specification. example
用於下文所描述的實例和比較例中的光固化單體和引發劑如下:( A ) 具有 C8 到 C20 伸烷基的二 ( 甲基 ) 丙烯酸酯 : 十二烷二醇二甲基丙烯酸酯(dodecanediol dimethacrylate;DDCDMA)(沙多瑪(Sartomer))( B ) 具有 C8 到 C20 烷基的單 ( 甲基 ) 丙烯酸酯 : 丙烯酸月桂酯(lauryl acrylate;LA)(沙多瑪)( C ) 具有 C1 到 C7 伸烷基的二 ( 甲基 ) 丙烯酸酯 : 己二醇二丙烯酸酯(hexanediol diacrylate;HDDA)(沙多瑪) (D)三羥甲基丙烷三丙烯酸酯(Trimethylolpropane triacrylate;TMPTA)(奧德裡奇(Aldrich))( E ) 由化學式 1 表示的含芳族基光固化單體 (E-1)2-丙烯酸苯基苯氧基乙酯(日立化學(Hitachi Chemical)) (E-2)由以下化學式表示的2-(苯硫基)丙烯酸乙酯(福騰(Chemieliva)): (E-3)由以下化學式表示的2-苯基-2-(苯硫基)丙烯酸乙酯(福騰): (E-4)由以下化學式表示的2-丙烯酸,2-(三苯基甲氧基)乙酯(SDI): (E-5)由以下化學式表示的3-丙烯酸苯氧基苄酯(福騰): (E-6)由以下化學式表示的2-甲基丙烯酸苯氧基乙酯(奧德裡奇公司(Aldrich Co.))(奧德裡奇): (E-7)由以下化學式表示的2-丙烯酸萘基硫代乙酯(福騰): (E-8)由以下化學式表示的2-(1-萘氧基)甲基丙烯酸乙酯(福騰): ( F ) 引發劑 : 磷系引發劑 ( 德牢固 ( Darocure ) TPO , 巴斯夫公司 ( BASF Co. )) 實例 1 : 製備用於封裝有機發光二極體裝置的組合物 The photocurable monomers and initiators used in the Examples and Comparative Examples described below are as follows: ( A ) Di ( meth ) acrylates with C8 to C20 alkylene groups : dodecanediol dimethacrylate (dodecanediol dimethacrylate; DDCDMA) (Sartomer) ( B ) mono ( meth ) acrylate with C8 to C20 alkyl groups : lauryl acrylate (LA) (Sartomer) ( C ) with C1 to C7 alkylene di ( meth ) acrylates : hexanediol diacrylate (HDDA) (sadoxane) (D) Trimethylolpropane triacrylate (TMPTA) ( Aldrich) ( E ) Aromatic group-containing photocurable monomer represented by Chemical Formula 1 (E-1) 2-phenylphenoxyethyl acrylate (Hitachi Chemical) (E-2 ) ethyl 2-(phenylthio)acrylate (Chemieliva) represented by the formula: (E-3) Ethyl 2-phenyl-2-(phenylthio)acrylate (Forton) represented by the following chemical formula: (E-4) 2-Acrylic acid, 2-(triphenylmethoxy)ethyl ester (SDI) represented by the following chemical formula: (E-5) Phenoxybenzyl 3-acrylate (Forton) represented by the following formula: (E-6) Phenoxyethyl 2-methacrylate represented by the following chemical formula (Aldrich Co.) (Aldrich): (E-7) 2-Naphthylthioethyl acrylate (Forton) represented by the following chemical formula: (E-8) 2-(1-Naphthyloxy)ethyl methacrylate (Forton) represented by the following chemical formula: ( F ) Initiator : Phosphorus - based initiator ( Darocure TPO , BASF Co. ) Example 1 : Preparation of a composition for encapsulating organic light-emitting diode devices
將10克的(B)丙烯酸月桂酯(LA)(沙多瑪)、17克的(C)己二醇二丙烯酸酯(HDDA)(沙多瑪)、70克的(E-8)2-(1-萘氧基)甲基丙烯酸乙酯(福騰)以及3克的(F)德牢固TPO添加到125毫升棕色聚丙烯瓶,且在室溫下使用振盪器混合3小時以提供封裝組合物。實例 2 到實例 8 以及比較例 1 到比較例 3 :製備用於封裝有機發光二極體裝置的組合物 Combine 10 grams of (B) Lauryl Acrylate (LA) (Sadol), 17 grams of (C) Hexylene Glycol Diacrylate (HDDA) (Sadol), 70 grams of (E-8) 2- (1-Naphthyloxy)ethyl methacrylate (Forteng) and 3 grams of (F) Durban TPO were added to a 125 ml brown polypropylene bottle and mixed for 3 hours at room temperature using a shaker to provide the encapsulated combination thing. Examples 2 to 8 and Comparative Examples 1 to 3 : Preparation of Compositions for Encapsulating Organic Light Emitting Diode Devices
除了以表1中所繪示的組分和量各自製備組合物之外,根據與實例1中相同的過程各自製備根據實例2到實例8以及比較例1到比較例3的封裝組合物。評估 1 :評估封裝組合物的物理性質 The encapsulation compositions according to Examples 2 to 8 and Comparative Examples 1 to 3 were each prepared according to the same procedure as in Example 1, except that the compositions were each prepared with the components and amounts shown in Table 1. Evaluation 1 : Evaluate the physical properties of the encapsulation composition
根據以下方法測量從實例1到實例8以及比較例1到比較例3獲得的封裝組合物的粘度、折射率以及可鋪展性,且結果繪示於表1中。The viscosity, refractive index, and spreadability of the encapsulation compositions obtained from Examples 1 to 8 and Comparative Examples 1 to 3 were measured according to the following methods, and the results are shown in Table 1.
(1)粘度(單位:厘泊(cps)):在25℃下通過博勒飛(Brookfield)DV-III+流變儀(博勒飛)的粘度測量器以第40號轉子10轉/分鐘測量每一封裝組合物。(1) Viscosity (unit: centipoise (cps)): measured at 25°C by a viscometer of a Brookfield DV-III+ rheometer (Brookfield) with spindle No. 40 at 10 rpm each encapsulation composition.
(2)折射率:在25℃下通過阿貝(Abbe)5的阿貝折射計測量每一封裝組合物。(2) Refractive index: Each encapsulation composition was measured by an Abbe 5 Abbe refractometer at 25°C.
(3)可鋪展性(%):使用噴墨印表機(OMNIJET 300,Unijet)以13皮升的量將每一封裝組合物滴加到基板上,且在30秒之後測量一滴的最大粒徑(S1,單位:微米),所述測量重複3次且平均化。滴加速度是2.5米/秒到3.5米/秒。此外,使用噴墨印表機(OMNIJET 300,Unijet)滴加13皮升的封裝組合物,且在180秒之後,重複測量3次且平均化一滴的最大粒徑(S2,單位:微米)以根據等式1評估可鋪展性:
>等式1>
可鋪展性(%)= S2 / S1 x 100。評估 2 :製造有機封裝層且評估物理性質 (3) Spreadability (%): Using an ink jet printer (OMNIJET 300, Unijet), each encapsulation composition was dropped on the substrate in an amount of 13 picoliters, and the maximum particle size of one drop was measured after 30 seconds. diameter (S1, unit: micrometer), the measurement was repeated 3 times and averaged. The dripping speed is 2.5 m/s to 3.5 m/s. In addition, 13 picoliters of the encapsulation composition was dropped using an ink jet printer (OMNIJET 300, Unijet), and after 180 seconds, the measurement was repeated 3 times and the maximum particle size (S2, unit: micrometer) of one drop was averaged to give Spreadability is assessed according to Equation 1: >Equation 1> Spreadability (%) = S2 /
將從實例1到實例8以及比較例1到比較例3獲得的封裝組合物各自旋塗在矽晶片上以提供有機膜,且將有機膜附著到在其上形成有機發光二極體裝置的面板,且通過以下方法測量相對亮度。The encapsulation compositions obtained from Examples 1 to 8 and Comparative Examples 1 to 3 were each spin-coated on a silicon wafer to provide an organic film, and the organic film was attached to a device on which an organic light emitting diode device was formed. panel, and the relative brightness was measured by the following method.
此外,將從實例1到實例8以及比較例1到比較例3獲得的封裝組合物以預定厚度各自沉積於矽晶片矽晶片上,且光固化以提供有機封裝層,且通過以下方法測量電漿蝕刻速率。測得的電漿蝕刻速率和相對亮度繪示於下表1中。In addition, the encapsulation compositions obtained from Examples 1 to 8 and Comparative Examples 1 to 3 were each deposited on a silicon wafer with a predetermined thickness on a silicon wafer, and photocured to provide an organic encapsulation layer, and plasma was measured by the following method etch rate. The measured plasma etch rates and relative brightness are shown in Table 1 below.
(1)相對亮度(%):將獲得的有機膜附著到在其上形成有機發光二極體裝置的面板,且將面板的正表面設定在0°,且使用EZcontrast(Eldim)來測量0°處的亮度。在這種情況下,根據D/C x 100計算出相對亮度(%),其中C是指比較例1的亮度且D是指對應實例或比較例的亮度。這意味著亮度隨著相對亮度更高而變得更高。據估計,當相對亮度大於或等於105%時亮度較高。(1) Relative brightness (%): The obtained organic film was attached to a panel on which the organic light emitting diode device was formed, and the front surface of the panel was set at 0°, and EZcontrast (Eldim) was used to measure 0° brightness at. In this case, the relative brightness (%) was calculated from D/
(2)電漿蝕刻速率(%):測量獲得的有機封裝層的每一初始高度(T1,單位:微米),且使用ICP-CVD以ICP(電感耦合電漿)功率:2500瓦;射頻(radio frequency;RF)功率:300瓦;DC偏壓:200伏;AR流量:50標準立方釐米/分鐘;蝕刻時間:1分鐘;壓強:10毫托進行電漿處理,且接著測量有機封裝層的高度(T2,單位:微米),且根據等式2評估電漿蝕刻速率。
>等式2>
電漿蝕刻速率(%)=(T1-T2)/T1 x 100
[表1]
如表1中所繪示,根據實施例的包含由化學式1表示的含芳族基二(甲基)丙烯酸酯和具有C8到C20伸烷基的二(甲基)丙烯酸酯和/或具有C1到C7伸烷基的二(甲基)丙烯酸酯的不含芳族基的單體的光固化單體的根據實例1到實例8的封裝組合物在折射率、相對亮度、粘度、電漿蝕刻速率以及可鋪展性的所有數據中都展示優於根據比較例1到比較例3的組合物。As depicted in Table 1, the aromatic group-containing di(meth)acrylate represented by Chemical Formula 1 and the di(meth)acrylate having a C8 to C20 alkylene group and/or having C1 according to an embodiment Encapsulation compositions according to Examples 1 to 8 of photocurable monomers to C7 alkylene di(meth)acrylates of aromatic-free monomers in refractive index, relative brightness, viscosity, plasma etching The compositions according to Comparative Example 1 to Comparative Example 3 are shown to be superior in all data of speed and spreadability.
具體來說,就折射率而言,根據實例1到實例8的所有組合物都展示大於1.50的折射率,但根據比較例1到比較例3的所有組合物都展示小於1.50的折射率。Specifically, in terms of refractive index, all compositions according to Examples 1 to 8 exhibited refractive indices greater than 1.50, but all compositions according to Comparative Examples 1 to 3 exhibited refractive indices of less than 1.50.
就相對亮度而言,參考比較例1的100%亮度,實例1到實例8的最低相對亮度是實例1的106%,且其它實例展示比這更高的相對亮度;另一方面,比較例2和比較例3展示100%或98%,這是等同於或低於比較例1中的相對亮度。In terms of relative brightness, referring to the 100% brightness of Comparative Example 1, the lowest relative brightness of Examples 1 to 8 was 106% of that of Example 1, and the other Examples showed higher relative brightness than this; on the other hand, Comparative Example 2 And Comparative Example 3
就粘度而言,實例7的最低粘度是13.4厘泊,且實例1的最高粘度是17.4厘泊,從而展示實例1到實例8的所有組合物保持適當的粘度範圍。另一方面,在比較例1到比較例3的組合物中,最高粘度是比較例1中的12.9厘泊,且比較例2和比較例3的粘度小於10厘泊,這是非常低的。In terms of viscosity, the lowest viscosity of Example 7 was 13.4 centipoise, and the highest viscosity of Example 1 was 17.4 centipoise, demonstrating that all compositions of Examples 1-8 maintained a suitable viscosity range. On the other hand, in the compositions of Comparative Examples 1 to 3, the highest viscosity was 12.9 cps in Comparative Example 1, and the viscosities of Comparative Examples 2 and 3 were less than 10 cps, which was very low.
就電漿蝕刻速率而言,實例1到實例8都展示小於10%(具體來說,小於7%)的低電漿蝕刻速率,另一方面,比較例1到比較例3展示大於至少15%的高蝕刻速率。In terms of plasma etch rates, Examples 1 to 8 all exhibit low plasma etch rates of less than 10% (specifically, less than 7%), and Comparative Examples 1 to 3, on the other hand, exhibit greater than at least 15% high etch rate.
最後,就組合物的可鋪展性而言,實例1到實例8的組合物展示從158%到160%的範圍,這是對有機膜的可加工性具有良好影響且防止噴墨列印時噴嘴堵塞以及類似物的適當的範圍。另一方面,比較例1的可鋪展性是135%,這明顯低於實例,使得可能由於噴墨列印時噴嘴堵塞或液滴未鋪展而難以提供均勻的膜。同時,比較例2和比較例3的情況,可鋪展性大於或等於190%,這是過高的。在這種情況下,難以提供具有適當厚度的有機膜。Finally, in terms of the spreadability of the compositions, the compositions of Examples 1 to 8 show a range from 158% to 160%, which has a good effect on the processability of organic films and prevents nozzles during inkjet printing Appropriate ranges for clogging and the like. On the other hand, the spreadability of Comparative Example 1 was 135%, which was significantly lower than that of the Examples, making it difficult to provide a uniform film possibly due to clogging of nozzles or non-spreading of droplets during inkjet printing. Meanwhile, in the case of Comparative Example 2 and Comparative Example 3, the spreadability was 190% or more, which was too high. In this case, it is difficult to provide an organic film having an appropriate thickness.
因而,由於根據實施例的組合物包含由化學式1表示的含芳族基二(甲基)丙烯酸酯以及具有C8到C20伸烷基的二(甲基)丙烯酸酯和/或具有C1到C7伸烷基的二(甲基)丙烯酸酯的不含芳族基的二(甲基)丙烯酸酯的光固化單體,所以所提供的用於封裝有機發光二極體裝置的組合物可具有高折射率和高相對亮度、在適當範圍內的粘度、低電漿蝕刻速率以及極佳可鋪展性。Thus, since the composition according to the embodiment includes the aromatic group-containing di(meth)acrylate represented by Chemical Formula 1 and the di(meth)acrylate having the C8 to C20 alkylene and/or the C1 to C7 alkylene The photocurable monomer of alkyl di(meth)acrylate without aromatic group di(meth)acrylate, so the provided composition for encapsulating organic light emitting diode device can have high refractive index high relative brightness, viscosity in the proper range, low plasma etch rate, and excellent spreadability.
雖然上文已描述本發明的實施例,但其僅示出本發明,且應理解,本發明的範圍不受此限制。此外,可通過本領域的技術人員容易地實行對本發明的簡單修改或改變,且可認為所有這些修改或改變包含在本發明的範圍中。While embodiments of the present invention have been described above, they are merely illustrative of the present invention, and it should be understood that the scope of the present invention is not limited thereby. Furthermore, simple modifications or changes to the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.
10:基板
20:有機發光二極體裝置
30:阻擋疊層
31:無機阻擋層
32:有機阻擋層
40:內空間
100、200:有機發光二極體顯示裝置10: Substrate
20: Organic Light Emitting Diode Devices
30: Barrier stack
31: Inorganic barrier layer
32: Organic barrier layer
40:
圖1是根據實施例的有機發光二極體顯示裝置的橫截面視圖。 圖2是根據另一實施例的有機發光二極體顯示裝置的橫截面視圖。FIG. 1 is a cross-sectional view of an organic light emitting diode display device according to an embodiment. FIG. 2 is a cross-sectional view of an organic light emitting diode display device according to another embodiment.
10:基板 10: Substrate
20:有機發光二極體裝置 20: Organic Light Emitting Diode Devices
30:阻擋疊層 30: Barrier stack
31:無機阻擋層 31: Inorganic barrier layer
32:有機阻擋層 32: Organic barrier layer
100:有機發光二極體顯示裝置 100: Organic Light Emitting Diode Display Device
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