TWI755908B - Separate printed circuit board assembly - Google Patents

Abstract

A separate printed circuit board assembly is disclosed in the present invention. The separate printed circuit board assembly includes a first circuit board, a second circuit board, a plurality of first function modules, and a plurality of second functional modules. The first circuit board is near the second circuit board. The first function modules are disposed on the first circuit board. The second function modules are disposed on the second circuit board. The signal speed of any first function modules is higher than the signal speed of any second function modules.

Description

Discrete Printed Circuit Board Assemblies

The present invention relates to an assembly, in particular to a discrete printed circuit board assembly.

The motherboard of an electronic device, also known as a printed circuit board, contains a number of electronic components. Please refer to the first figure, the first figure is a schematic diagram showing a printed circuit board of the prior art. As shown in the figure, a printed circuit board PA1 is used for arranging a plurality of electronic components. The electronic components include a Central Processing Unit (CPU) PA11, a Platform Controller Hub (PCH) PA12, a Dual In-line Memory Module (DIMM) PA13, a Baseboard Management Controller (BMC) PA14, a Complex Programmable Logic Device (CPLD) PA15 and a Peripheral Component Interconnect Express (PCIE) connector PA16.

Different electronic components transmit and receive signals at different transmission speed ranges. The transmission speed range of the signals transmitted and received by the central processing unit PA11, the dual in-line memory module PA13 and the fast peripheral interconnection standard connector PA16 will be greater than 8GT/s. In addition, the transmission speed range of the signals transmitted and received by the platform controller hub PA12 and the baseboard management controller PA14 will be less than or equal to 8GT/s.

However, with the increase of the signal bandwidth, the requirements for the board of the printed circuit board PA1 are also higher, which leads to the problem that the cost also increases. It should be noted that the printed circuit board PA1 must allow all electronic components to transmit signals smoothly, so a board that can meet the requirements of electronic components with faster transmission speed must be used. In addition, all the electronic components are arranged on one printed circuit board PA1, and there is also a risk that the entire printed circuit board PA1 needs to be replaced because one of the electronic components is damaged.

In view of the problem of cost increase caused by the increase of signal bandwidth in the prior art, and the risk problem derived from arranging all electronic components on a single circuit board. One of the main objectives of the present invention is to provide a discrete printed circuit board assembly for solving at least one of the problems in the prior art.

In order to solve the problems of the prior art, the present invention adopts the necessary technical means to provide a separate printed circuit board assembly, comprising a first circuit board, a second circuit board, a plurality of first function modules and a plurality of second circuit boards function module.

The second circuit board is adjacent to the first circuit board. The first function modules are arranged on the first circuit board, and each of the first function modules is used for transmitting a first signal within a first transmission speed range. The second function modules are arranged on the second circuit board, and each of the second function modules is used for transmitting a second signal within a second transmission speed range. Wherein, the upper limit transmission speed of the second transmission speed range is smaller than the lower limit transmission speed of the first transmission speed range.

On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the first circuit board in the detachable printed circuit board assembly be directly electrically connected to the second circuit board.

On the basis of the above necessary technical means, an auxiliary technical means derived from the present invention is to make the separate printed circuit board assembly further include a connection module, and the connection module is electrically connected to the first circuit board and the second circuit board.

On the basis of the above necessary technical means, an auxiliary technical means derived from the present invention is to make the first functional module in the detachable printed circuit board assembly at least include a central processing unit.

On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the first functional module in the detachable printed circuit board assembly at least include a memory.

On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the first functional module in the discrete printed circuit board assembly at least include a pair of in-line memory modules.

On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the first functional module in the detachable printed circuit board assembly at least include a standard connector for quick peripheral interconnection.

On the basis of the above necessary technical means, an auxiliary technical means derived from the present invention is to make the second functional module in the detachable printed circuit board assembly at least include a platform controller hub.

On the basis of the above necessary technical means, an auxiliary technical means derived from the present invention is to make the second functional module in the detachable printed circuit board assembly at least include a baseboard management controller.

Based on the above, the separated printed circuit board assembly provided by the present invention utilizes different types of first circuit boards and second circuit boards, and the first functional module and the second functional module are respectively arranged on the first circuit board according to the transmission speed. A circuit board and a second circuit board, compared with the prior art, the present invention can achieve the effect of reducing the manufacturing cost. In addition, in the present invention, since the first functional module and the second functional module with different transmission speeds are respectively arranged on the first circuit board and the second circuit board, it is possible to avoid any one of the first functional module or the second functional module. Risk of needing to replace the entire discrete printed circuit board assembly when the group is damaged.

The specific embodiments of the present invention will be described in more detail below with reference to the schematic diagrams. The advantages and features of the present invention will become more apparent from the following description and the scope of the claims. It should be noted that the drawings are all in a very simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.

Please refer to the second figure. The second figure is a schematic diagram of the detachable printed circuit board assembly provided by the first embodiment of the present invention. As shown in the figure, a separate printed circuit board assembly 1 includes a first circuit board 11, a second circuit board 12, a plurality of first functional modules 13a, 13b, 13c, 13d (drawing and marking four schematic) and a plurality of second functional modules 14a, 14b (two schematics are drawn and marked in the drawing).

The first circuit board 11 is directly electrically connected to the second circuit board 12 . The first functional modules 13 a , 13 b , 13 c and 13 d are disposed on the first circuit board 11 . The second functional modules 14 a and 14 b are disposed on the second circuit board 12 .

Each of the first functional modules 13a, 13b, 13c, 13d is used to transmit a first signal within a first transmission speed range. Each of the second functional modules 14a, 14b is used for transmitting a second signal within a second transmission speed range. Wherein, an upper limit transmission speed of the second transmission speed range is smaller than a lower limit transmission speed of the first transmission speed range. In this embodiment, the upper limit transmission speed is 8GT/s. That is to say, the transmission speed of the first functional modules 13a, 13b, 13c, 13d is greater than the transmission speed of the second functional modules 14a, 14b.

For example, the first functional module 13a is a central processing unit (CPU); the first functional module 13b is a memory (Memory), which is a pair of in-line memory modules ( Dual In-line Memory Module; DIMM); the first functional module 13c is a Peripheral Component Interconnect Express (PCIE) connector. The first functional modules 13a, 13b, 13c, and 13d all transmit the first signal within the higher-speed first transmission speed range.

The second functional module 14a is a platform controller hub (Platform Controller Hub; PCH); the second functional module 14b is a baseboard management controller (Baseboard Management Controller; BMC). Both the second functional modules 14a and 14b transmit the second signal in a second transmission speed range lower than the first transmission speed range.

Therefore, the first circuit board 11 disposed on the first functional modules 13a, 13b, 13c, and 13d needs to use a board with low loss and can meet the requirements of the integrity of the first signal transmission.

Because the transmission speed of the second signal of the second functional modules 14a, 14b is lower than that of the first functional modules 13a, 13b, 13c, 13d, the second circuit board 12 provided by the second functional modules 14a, 14b The requirements of the second circuit board 12 can be lower than that of the first circuit board 11 , so the manufacturing cost of the second circuit board 12 can be lower than that of the first circuit board 11 . Therefore, compared with the printed circuit board PA1 in the prior art, the separated printed circuit board assembly 1 of the present invention can achieve the effect of reducing the manufacturing cost.

Furthermore, since the first functional modules 13a, 13b, 13c, 13d and the second functional modules 14a, 14b are respectively disposed on different first circuit boards 11 and second circuit boards 12, if any one of the first functional modules Or damage to any second functional module does not cause the entire detachable printed circuit board assembly 1 to need to be replaced.

For example, if the first functional module 13 b is damaged, the worst case is to replace the entire first circuit board 11 , but the second circuit board 12 and any second functional module on the second circuit board 12 do not need to be replaced 14a, 14b. On the other hand, if the second functional module 14a is damaged, the worst case is only to replace the entire second circuit board 12, and there is no need to replace the relatively expensive first circuit board 11 and any first functional module 13a, 13b, 13c, 13d.

Therefore, in the detachable printed circuit board assembly 1 provided by the present invention, when the first functional modules 13a, 13b, 13c, 13d or the second functional modules 14a, 14b are damaged, only the corresponding first functional module 13a can be replaced , 13b, 13c, 13d of the first circuit board 11 or the second circuit board 12 corresponding to the second functional modules 14a, 14b, and the prior art, any damage to any electronic component requires replacement of the entire printed circuit board Risk of PA1.

Finally, please refer to the third figure. The third figure is a schematic diagram of the separate printed circuit board assembly provided by the second embodiment of the present invention. As shown in the figure, a separate printed circuit board assembly 1a includes a first circuit board 11a, a second circuit board 12a, a plurality of first functional modules 13a, 13b, 13c, 13d (drawing and marking four diagram), a plurality of second function modules 14a, 14b (two diagrams are drawn and marked in the drawing), and a connection module 15a.

It should be noted that, the first functional modules 13a, 13b, 13c, and 13d and the second functional modules 14a and 14b are completely the same as those in the first embodiment, so they will not be repeated here.

In this embodiment, the first circuit board 11a is electrically connected to the second circuit board 12a by the connection module 15a. The connection module 15a may be a high-speed connector, a cable, or other device or device for signal transmission.

Because in this embodiment, the separate printed circuit board assembly 1a still includes different and separate first circuit boards 11a and second circuit boards 12a, and the first functional modules 13a, 13b, 13c, 13d and the second functional modules The modules 14a and 14b are also respectively disposed on the first circuit board 11a and the second circuit board 12a according to the transmission speed. Therefore, compared with the prior art, the present embodiment can still achieve the effect of reducing the manufacturing cost and avoiding the replacement of the entire printed circuit board. risks of.

To sum up, in the detachable printed circuit board assembly provided by the present invention, different types of first circuit boards and second circuit boards are used, and the first functional module and the second functional module are respectively arranged in the corresponding transmission speed. Compared with the prior art, the present invention can achieve the effect of reducing the manufacturing cost of the first circuit board and the second circuit board. In addition, in the present invention, since the first functional module and the second functional module with different transmission speeds are respectively arranged on the first circuit board and the second circuit board, it is possible to avoid any one of the first functional module or the second functional module. Risk of needing to replace the entire discrete printed circuit board assembly when the group is damaged. Furthermore, the potential risk that the lower-priced second functional module needs to be replaced with the higher-priced first functional module due to damage to the lower-priced second functional module can also be avoided.

Through the detailed description of the preferred embodiments above, it is hoped that the features and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the claimed scope of the present invention.

PA1: Printed Circuit Board PA11: CPU PA12: Platform Controller Hub PA13: Dual in-line memory module PA14: Baseboard Management Controller PA15: Complex Programmable Logic Elements PA16: Fast peripheral interconnect standard connector 1,1a: Separate printed circuit board assemblies 11,11a: First circuit board 12,12a: Second circuit board 13a, 13b, 13c, 13d: The first functional module 14a, 14b: Second function module 15a: Connection module

The first figure is a schematic diagram showing a printed circuit board of the prior art; The second figure is a schematic diagram showing the separate printed circuit board assembly provided by the first embodiment of the present invention; and FIG. 3 is a schematic diagram showing the separate printed circuit board assembly provided by the second embodiment of the present invention.

1: Separate printed circuit board assembly

11: The first circuit board

12: Second circuit board

13a, 13b, 13c, 13d: The first functional module

14a, 14b: Second function module

Claims (9)

A discrete printed circuit board assembly comprising: a first circuit board; a second circuit board adjacent to the first circuit board; a plurality of first function modules are disposed on the first circuit board, and each of the first function modules is used for transmitting a first signal within a first transmission speed range; and a plurality of second function modules are arranged on the second circuit board, and each of the second function modules is used for transmitting a second signal within a second transmission speed range; Wherein, the upper limit transmission speed of the second transmission speed range is smaller than the lower limit transmission speed of the first transmission speed range. The detachable printed circuit board assembly of claim 1, wherein the first circuit board is directly electrically connected to the second circuit board. The detachable printed circuit board assembly of claim 1 further comprises a connection module, and the connection module is electrically connected to the first circuit board and the second circuit board. The detachable printed circuit board assembly of claim 1, wherein the first functional modules at least include a central processing unit. The detachable printed circuit board assembly of claim 1, wherein the first functional modules at least include a memory. The separate printed circuit board assembly of claim 1, wherein the first functional modules at least comprise a Dual In-line Memory Module (DIMM). The detachable printed circuit board assembly of claim 1, wherein the first functional modules at least include a Peripheral Component Interconnect Express (PCIE) connector. The detachable printed circuit board assembly of claim 1, wherein the second functional modules at least comprise a platform controller hub (Platform Controller Hub; PCH). The detachable printed circuit board assembly of claim 1, wherein the second functional modules at least comprise a baseboard management controller (BMC).

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