TWI753744B - Buffer assembly and electronic equipment with buffer assembly - Google Patents

Abstract

A buffer assembly includes a hard shell and a buffer member. The buffer member includes a plurality of buffer grooves, and the buffer member is joined to the hard shell.

Description

Cushioning assembly and electronic equipment with cushioning assembly

The present invention relates to a protective device, in particular to a buffer assembly.

Buffer components are widely used in various products on the market. The buffer components are installed on the outer surface of the product. When the product is impacted by external force, the buffer component absorbs the impact force or deforms, preventing the product from directly bearing the impact force and achieving buffering. Effect.

However, most of the current buffer components make the impact force concentrated in one place, thereby reducing or affecting the buffering effect.

In view of the above, in one embodiment, a buffer assembly is provided, which includes a first buffer member and a second buffer member. The second buffer member includes a plurality of buffer grooves, the second buffer member is joined to the first buffer member, and the hardness of the first buffer member is greater than that of the second buffer member.

In another embodiment, an electronic device is provided, including a casing and a buffer assembly. The buffer assembly includes a first buffer member and a second buffer member. The second buffer member includes a plurality of buffer grooves, the second buffer member is joined between the first buffer member and the housing, and the hardness of the first buffer member is greater than that of the second buffer member.

To sum up, in the buffer assembly of the embodiment of the present invention and the electronic device of another embodiment, through the above configuration and design, when various products (such as electronic equipment) are impacted by external force, the first buffer member of the buffer assembly can The impact force is evenly transmitted to the second buffer member. Since the second buffer member includes a plurality of buffer grooves, the particles on the second buffer member can be displaced to the space formed by each buffer groove and deformed smoothly to absorb the impact force after being stressed. , to achieve the effect of buffering.

Various embodiments are provided below for detailed description. However, the embodiments are only used as examples to illustrate, and do not limit the scope of protection of the present invention. In addition, some elements are omitted in the drawings in the embodiments to clearly show the technical features of the present invention. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.

FIG. 1 is a perspective view of a buffer assembly according to a first embodiment of the present invention, and FIG. 2 is an exploded perspective view of the buffer assembly according to the first embodiment of the present invention. As shown in FIG. 1 , the buffer assembly 1 can be widely used in various products in the market to protect the products from being damaged by direct impact force. In some embodiments, the product to which the buffer assembly 1 is applied may be, for example, electronic equipment, etc., or various objects that may require a drop-resistant buffer function, such as checked luggage, lunch boxes, automobiles, motorcycles, and the like.

As shown in FIGS. 1 to 2 , the buffer assembly 1 includes a first buffer member 10 and a second buffer member 20 . The second buffer member 20 includes a plurality of buffer grooves 21 , and the second buffer member 20 is engaged with the first buffer member 10 . The second buffer member 20 is joined to the first buffer member 10 by, for example, bonding, locking or riveting. Therefore, when the buffer assembly 1 is assembled on various products, when the product is impacted by an external force, the first buffer member 10 of the buffer assembly 1 can receive the impact force at the first time, and then transmit the impact force evenly. to the second buffer member 20 . Furthermore, when the first buffer member 10 with a certain hardness is selected, when it is impacted, it will bear most of the impact force first, so as to reduce the impact on the product to be protected. If only the second buffer member 20 is provided without the first buffer member 10, even though the second buffer member 20 can provide a deformation shock absorption effect, when the impact is too large or too concentrated, the second buffer member 20 can also absorb the impact The strength and cushioning effect provided are also limited, so that the protective effect is still insufficient.

At the same time, since the second buffer member 20 includes a plurality of buffer grooves 21 , the particles on the second buffer member 20 can deform and extend into the space formed by each buffer groove 21 after being subjected to force, so as to better absorb the impact force and avoid the direct impact of the product. Withstands all impacts for better cushioning, where a mass point is a point that has mass but not a fixed shape. For example, when the first buffer member 10 is impacted, the second buffer member 20 is pressed longitudinally by the first buffer member 10 and the casing 30 of the electronic device 3 (as shown in FIG. 5 or FIG. 6 ) and laterally to each buffer groove The space formed by 21 expands to increase the impact force that can be absorbed.

1 to 2, in this embodiment, the hardness of the first buffer member 10 is greater than the hardness of the second buffer member 20, and the material of the first buffer member 10 of the buffer assembly 1 is metal (such as stainless steel) or iron). Through the high rigidity of the metal, the first buffer member 10 is not easily deformed after being impacted by external force, and can evenly transmit the impact force to each area of the second buffer member 20, thereby, in addition to achieving the effect of buffering, it can also avoid the impact on the product. Stress concentration occurs, so that the first buffer member 10 is damaged by long-term impact. In other embodiments, the material of the first buffer member 10 may also be plastic, plastic steel, or wood.

Continuing from FIGS. 1 to 2 , in the present embodiment, the first buffer member 10 of the buffer assembly 1 has at least one bent portion 11 to correspond to the bent corner of the product. In this way, when the position where the product is impacted by external force occurs at a corner, the bent portion 11 of the first buffer member 10 will directly face the impact at the first time, and the bent portion 11 will be bent by the rigidity of the first buffer member 10 at the first time. The force is evenly distributed to each area of the second buffer member 20 covered by the first buffer member 10, and the external force is absorbed through the second buffer member 20, which not only avoids stress concentration at the corners of the product, but also achieves a buffering effect. effect, thereby protecting the product from damage.

As shown in FIG. 1 and FIG. 2 , if the first buffer member 10 is to protect the corners of a rectangle, the bending portion 12 of the first buffer member 10 may be in the shape of three adjacent sides, but the invention is not limited to this. . It can also be changed in design depending on the shape of the device to be covered.

In addition, the shape of the buffer groove 21 has various possible geometric forms. For example, in this embodiment, the buffer groove 21 is a rectangular groove. In this way, the particles on the second buffer member 20 can be displaced to the rectangular space formed by each buffer groove 21 after being subjected to force to produce deformation, so as to achieve the effect of buffering and prevent the product from directly bearing all external force impacts.

As shown in FIG. 1 to FIG. 2 , the characteristic of the second buffer member 20 of the buffer assembly 1 is that it is easily deformed after being subjected to external force, thereby absorbing the external force, thereby protecting the product from being directly impacted by all external forces. After the external force is removed, the second buffer member 20 can also be restored to its original state smoothly. Therefore, if the external force acts again, the second buffer member 20 can absorb the external force again and use it repeatedly. In this embodiment, the material of the second buffer member 20 may be foam, or may be rubber or spring.

As shown in FIG. 1 to FIG. 2 , the second buffer member 20 includes an opposite outer joint surface 22 and an inner joint surface 23 , the outer joint surface 22 is joined to the first buffer member 10 , and the inner joint surface 23 can be joined to the outer surface of the product , the buffer grooves 21 of the second buffer member 20 can be arranged in various ways. For example, in this embodiment, the buffer grooves 21 of the second buffer member 20 penetrate through the outer joint surface 22 and the inner joint of the second buffer member 20 . face 23. Thereby, the degree of freedom of movement of the particles on the second buffer member 20 is increased, thereby improving the ability of the second buffer member 20 to deform easily and increasing the ability of the second buffer member 20 to absorb external force, improving the buffering effect and protecting the product from direct bearing All external shocks.

Next, please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a perspective view of the buffer assembly according to the second embodiment of the present invention, and FIG. 4 is an exploded perspective view of the buffer assembly according to the second embodiment of the present invention. FIG. 3 and FIG. 4 show a second embodiment, which differs from the above-mentioned first embodiment in the structure of the second buffer member, so the other structures can refer to the first embodiment, which will not be repeated here. . In the second embodiment, the second buffer member 20a of the buffer assembly 1a includes an opposite outer joint surface 22a and an inner joint surface 23a, the outer joint surface 22a is joined to the first buffer member 10, and the inner joint surface 23a is joined to the outer surface of the product Each buffer groove 21a of the second buffer member 20a is recessed on the outer joint surface 22a. Thereby, the freedom of movement of the mass points on the second buffer member 20a is increased, thereby improving the ability of the second buffer member 20a to deform easily and increasing the ability of the second buffer member 20a to absorb external force, thereby enhancing the buffer effect. In addition, the rigidity of the second buffer member 20a close to the joint with the product can also be ensured, so that the product can be uniformly stressed, and the stress concentration of the product can be avoided. In other embodiments, each buffer groove 21a may also be recessed in the inner joint surface 23a, and each buffer groove 21a may also be recessed between the outer joint surface 22a and the inner joint surface 23a of the second buffer member 20a, that is, The inside of the second buffer member 20a or each buffer groove 21a may only partially penetrate the outer joint surface 22a or partially penetrate the inner joint surface 23a.

In addition, as shown in FIGS. 3 to 4 , in this embodiment, the buffer groove 21a is a hexagonal groove. In this way, the particles on the second buffer member 20a can be displaced to the hexagonal space formed by each buffer groove 21a after being subjected to force and deformed, thereby achieving the effect of buffering and protecting the product from directly bearing all external forces. In other embodiments, each buffer groove 21a can also be a circular groove, a triangular groove, a rectangular groove or a pentagonal groove, or the shape of each buffer groove 21a can also be different, for example, some of the buffer grooves 21a are triangular The groove, another part of the buffer groove 21a is a pentagonal groove, and the rest of the buffer groove 21a is a rectangular groove and the like.

5 is a perspective view of an electronic device according to a third embodiment of the present invention, and FIG. 6 is a perspective exploded view of the electronic device according to the third embodiment of the present invention. As shown in FIG. 5 , the electronic device can be, for example, a mobile device, a smart phone, a notebook computer, or a power supply.

As shown in FIG. 5 to FIG. 6 , the electronic device 3 includes a housing 30 and at least one buffer assembly 1 . The buffer assembly 1 includes a first buffer member 10 and a second buffer member 20 . The second buffer member 20 includes a plurality of buffer grooves 21 , and the second buffer member 20 is engaged between the first buffer member 10 and the housing 30 . The way of joining can be, for example, gluing, locking or riveting and the like. Therefore, when the electronic device 3 is impacted by an external force, the first buffer member 10 of the buffer assembly 1 can receive the impact force at the first time, and then transmit the impact force to the second buffer member 20 evenly. Furthermore, when the first buffer member 10 with a certain hardness is selected, when it is impacted, it will bear most of the impact force first, so as to reduce the impact on the electronic device 3 . If only the second buffer member 20 is provided without the first buffer member 10, even though the second buffer member 20 can provide the deformation shock absorption effect, when the impact is too large or too concentrated, the second buffer member 20 can also absorb the impact The strength and cushioning effect provided are also limited, so that the protective effect is still insufficient.

At the same time, since the second buffer member 20 includes a plurality of buffer grooves 21 , the particles on the second buffer member 20 can deform and extend into the space formed by each buffer groove 21 after being stressed, so as to better absorb the impact force, and then weaken the The impact force is transmitted to the casing 30 of the electronic device 3 to avoid the internal parts of the electronic device 3 (such as circuit boards, transistors, batteries or microprocessors, etc.) from directly bearing all the shocks to achieve a better buffering effect.

On top of that, as shown in FIGS. 5 to 6 , in this embodiment, the material of the first buffer member 10 of the buffer assembly 1 is metal (eg, stainless steel or iron). Through the high rigidity of the metal, the first buffer member 10 is not easily deformed after being impacted by an external force, and can evenly transmit the impact force to each area of the second buffer member 20 . Stress concentration occurs in the electronic device 3 , so that the first buffer member 10 is damaged due to long-term impact. In other embodiments, the material of the first buffer member 10 may also be plastic, plastic steel, or wood.

Continuing from FIG. 5 to FIG. 6 , in this embodiment, the first buffer member 10 of the buffer assembly 1 has at least one bent portion 11 corresponding to the corner 31 installed on the housing 30 . Specifically, in this embodiment, the housing 30 of the electronic device 3 is a hexahedron and has eight corners 311 adjacent to three sides and twelve corners 312 adjacent to two sides, and the first corners 312 of each buffer assembly 1 A buffer member 10 has three bending parts 11 adjacent to two sides and one bending part 12 adjacent to three sides, each bending part 11 covers each bending corner 31 , and each bending part 12 corresponds to each bending corner 311 . Therefore, when the position where the electronic device 3 is impacted by an external force occurs at the corner 31 , the bent portions 11 and 12 of the first buffer member 10 will directly face the impact at the first time, and the rigidity of the first buffer member 10 will The force of the bending parts 11 and 12 is evenly distributed to each area of the second buffer member 20 covered by the first buffer member 10 , and the external force is absorbed through the second buffer member 20 , in addition to avoiding stress concentration of the electronic device 3 . , which also achieves the effect of buffering, thereby protecting the electronic device 3 from damage. In other embodiments, the housing 30 of the electronic device 3 may also be a heptahedron, or an octahedron, or the like.

In addition, the shape of the buffer groove 21 has various possible geometric forms. For example, in this embodiment, the buffer groove 21 is a rectangular groove. In this way, the particles on the second buffer member 20 can be displaced to the rectangular space formed by each buffer groove 21 after being subjected to force to produce deformation, so as to achieve the effect of buffering and prevent the product from directly bearing all external force impacts.

As shown in FIG. 5 to FIG. 6 , the characteristic of the second buffer member 20 of the buffer assembly 1 is that it is easily deformed by external force, thereby absorbing the external force, thereby protecting the electronic device 3 from being directly impacted by all external forces. After the external force is removed, the second buffer member 20 can also be restored to its original state smoothly. Therefore, if the external force acts again, the second buffer member 20 can absorb the external force again and use it repeatedly. In this embodiment, the material of the second buffer member 20 may be foam, or may be rubber or spring.

As shown in FIG. 5 to FIG. 6 , the second buffer member 20 includes an opposite outer joint surface 22 and an inner joint surface 23 , the outer joint surface 22 is joined to the first buffer member 10 , the inner joint surface 23 is joined to the housing 30 , the second The buffer grooves 21 of the buffer member 20 can be arranged in various ways. For example, in this embodiment, the buffer grooves 21 of the second buffer member 20 penetrate through the outer joint surface 22 and the inner joint surface 23 of the second buffer member 20 . Thereby, the freedom of movement of the mass points on the second buffer member 20 is increased, thereby improving the ability of the second buffer member 20 to deform easily and increasing the ability of the second buffer member 20 to absorb external force, thereby enhancing the buffer effect and protecting the electronic device 3 from Directly withstand all external impact.

Next, please refer to FIGS. 7 to 8 . FIG. 7 is a perspective view of an electronic device according to a fourth embodiment of the present invention, and FIG. 8 is an exploded perspective view of the electronic device according to the fourth embodiment of the present invention. FIG. 7 and FIG. 8 show the fourth embodiment, which differs from the above-mentioned third embodiment in the structure of the second buffer member, so the other structures can refer to the third embodiment, which will not be repeated here. . In the fourth embodiment, the second buffer member 20a of the buffer assembly 1a includes an opposite outer joint surface 22a and an inner joint surface 23a, the outer joint surface 22a is joined to the first buffer member 10, and the inner joint surface 23a is joined to the housing 30, Each buffer groove 21a of the second buffer member 20a is recessed on the outer joint surface 22a. Thereby, the freedom of movement of the mass points on the second buffer member 20a is increased, thereby improving the ability of the second buffer member 20a to deform easily and increasing the ability of the second buffer member 20a to absorb external force, thereby enhancing the buffer effect. In addition, the rigidity of the second buffer member 20a close to the joint with the casing 30 can also be ensured, so that the electronic device 3a can be uniformly stressed, and the stress concentration of the electronic device 3a can be avoided. In other embodiments, each buffer groove 21a may also be recessed in the inner joint surface 23a, and each buffer groove 21a may also be recessed between the outer joint surface 22a and the inner joint surface 23a of the second buffer member 20a, that is, The inside of the second buffer member 20a or each buffer groove 21a may only partially penetrate the outer joint surface 22a or partially penetrate the inner joint surface 23a.

In addition, as shown in FIGS. 7 to 8, in this embodiment, the buffer groove 21a is a hexagonal groove. In this way, the particles on the second buffer member 20a can be displaced to the hexagonal space formed by each buffer groove 21a and deformed after being subjected to force, so as to achieve a buffer effect and protect the electronic device 3a from being directly impacted by all external forces. In other embodiments, each buffer groove 21a can also be a circular groove, a triangular groove, a rectangular groove or a pentagonal groove, or the shape of each buffer groove 21a can also be different, for example, some of the buffer grooves 21a are triangular The groove, another part of the buffer groove 21a is a pentagonal groove, and the rest of the buffer groove 21a is a rectangular groove and the like.

1,1a: Buffer components 10: The first buffer 11,12: Bending part 20,20a: Second buffer 21,21a: Buffer groove 22, 22a: External joint surface 23,23a: Internal joint surface 3,3a: Electronic equipment 30: Shell 31, 311, 312: Corner

[FIG. 1] is a perspective view of the buffer assembly according to the first embodiment of the present invention. [FIG. 2] is an exploded perspective view of the buffer assembly according to the first embodiment of the present invention. [FIG. 3] It is a perspective view of the buffer assembly according to the second embodiment of the present invention. [FIG. 4] is an exploded perspective view of the buffer assembly according to the second embodiment of the present invention. [ Fig. 5 ] is a perspective view of an electronic device according to a third embodiment of the present invention. [FIG. 6] It is an exploded perspective view of the electronic device according to the third embodiment of the present invention. [ Fig. 7 ] is a perspective view of an electronic device according to a fourth embodiment of the present invention. [FIG. 8] is an exploded perspective view of an electronic device according to a fourth embodiment of the present invention.

1: Buffer components

10: The first buffer

11,12: Bending part

20: Second buffer

21: Buffer slot

22: External joint surface

23: Internal joint surface

3: Electronic equipment

30: Shell

31: Corner

Claims (16)

A buffer assembly, comprising: a first buffer; and A second buffer member includes a plurality of buffer grooves, the second buffer member is engaged with the first buffer member, and the hardness of the first buffer member is greater than that of the second buffer member. The buffer assembly of claim 1, wherein the second buffer member includes an outer joint surface and an inner joint surface, the outer joint surface corresponds to the inner joint surface, and the outer joint surface is joined to the first buffer member, And the buffer grooves are recessed on the outer joint surface. The buffer assembly of claim 1, wherein the second buffer member includes an outer joint surface and an inner joint surface, the outer joint surface corresponds to the inner joint surface, and the outer joint surface is joined to the first buffer member, And the buffer grooves penetrate through the outer joint surface and the inner joint surface. The buffer assembly of claim 1, wherein each of the buffer slots is a rectangular slot. The buffer assembly of claim 1, wherein each of the buffer grooves is a hexagonal groove. The buffer assembly according to claim 1, wherein the material of the first buffer member is metal. The buffer assembly according to claim 1, wherein the material of the second buffer member is rubber. The buffer assembly of claim 1, wherein the first buffer member has at least one bent portion. An electronic device comprising: an enclosure; and a buffer assembly, including: a first buffer; and A second buffer member includes a plurality of buffer grooves, the second buffer member is joined between the first buffer member and the housing, and the hardness of the first buffer member is greater than that of the second buffer member. The electronic device of claim 9, wherein the second buffer member comprises an outer joint surface and an inner joint surface, the outer joint surface corresponds to the inner joint surface, and the outer joint surface is joined to the first buffer member, The inner joint surface is joined to the casing, and the buffer grooves are recessed in the outer joint surface. The electronic device of claim 9, wherein the second buffer member comprises an outer joint surface and an inner joint surface, the outer joint surface corresponds to the inner joint surface, and the outer joint surface is joined to the first buffer member, The inner joint surface is joined to the casing, and the buffer grooves penetrate through the outer joint surface and the inner joint surface. The electronic device of claim 9, wherein each of the buffer slots is a rectangular slot. The electronic device of claim 9, wherein each of the buffer slots is a hexagonal slot. The electronic device according to claim 9, wherein the material of the first buffer is metal. The electronic device according to claim 9, wherein the material of the second buffer is rubber. The electronic device according to claim 9, wherein the casing has at least one corner, the first buffer element has at least one bending portion, and the casing and the corner are arranged corresponding to each other.

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