TWI748166B - Electronic device and manufacturing method of the same - Google Patents

Abstract

An electronic device and manufacturing method of the same are disclosed. The manufacturing method includes: providing a substrate; forming a thin film circuit on the substrate, the thin film circuit comprises at least one thin film transistor and at least one conductive trace; forming at least one first connection pad on the substrate, the first connection pad is electrically connected with the thin film transistor through the conductive trace; disposing the substrate on a driving circuit board, the driving circuit board comprises at least one second connection pad. Wherein, the second connection pad is adjacent to the first connection pad and corresponding to the first connection pad; and forming a conductive member covered at least partial of the second connection pad and the first connection pad. Wherein, the second connection pad is electrically connected with the first connection pad through the conductive member.

Description

Electronic device and manufacturing method thereof

The invention relates to an electronic device and a manufacturing method thereof.

In the manufacture of traditional optoelectronic devices, multiple thin film transistors are fabricated on a substrate to form a thin film transistor substrate, and then the thin film transistors are used to drive the corresponding optoelectronic elements. Take the organic light-emitting diode display device as an example. This method of using thin-film transistors to drive the organic light-emitting diode to emit light, if there are multiple different product sizes or functions, must be tailored to the product size of each organic light-emitting diode device Or the thin-film process corresponding to the functional design, and the use of expensive thin-film transistor process/mask/substrate/materials is not conducive to the needs of diverse products, and the application is quite inflexible.

The purpose of the present invention is to provide an electronic device and a manufacturing method thereof. The present invention does not need to design the manufacturing process for each product size and function. In addition to the simple manufacturing process and lower cost, the present invention is more flexible in application and can be applied to diverse product requirements.

To achieve the above objective, a method of manufacturing an electronic device according to the present invention includes: providing a substrate, wherein the substrate has a first surface and a second surface opposite to each other; forming a thin film circuit on the first surface of the substrate, wherein The thin film circuit includes at least one thin film transistor and at least one conductive circuit; at least one first connection pad is formed on the first surface of the substrate, wherein the first connection pad is electrically connected to the thin film transistor through the conductive circuit; The substrate is disposed on a driving circuit board, wherein the driving circuit board includes at least one second connection pad, the second connection pad is adjacent to the first connection pad and is disposed corresponding to the first connection pad; and a conductive member is formed to cover at least part of the The second connection pad is electrically connected to the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member.

In some embodiments, the substrate is a rigid board or a flexible board.

In some embodiments, before the step of arranging the substrate on a driving circuit board, the method further includes: removing the rigid carrier board.

In some embodiments, the conductive member is covered on at least part of the second connection pad and the first connection pad by spray printing or coating.

In some embodiments, the material of the conductive element includes solder paste, silver paste, or anisotropic conductive paste, or a combination thereof.

In some embodiments, after the step of forming a thin film circuit on the substrate, the method further includes: forming a protective layer to cover the thin film circuit.

In some embodiments, the manufacturing method further includes: disposing a surface mount component on the drive circuit board, wherein the drive circuit board further includes at least one third connection pad, and the surface mount component is electrically connected to the thin film transistor through the second connection pad. It is electrically connected to the circuit of the driving circuit board through the third connection pad.

In some embodiments, the manufacturing method further includes: forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected to the thin film transistor through the conductive circuit; and disposing a surface mount component on the On the first surface of the substrate, the surface mount component is electrically connected to the thin film transistor through the fourth connection pad.

In some embodiments, the manufacturing method further includes: forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected to the thin film transistor through the conductive circuit; and disposing at least one functional chip on the substrate On the first surface, the functional chip is electrically connected to the thin film transistor through the fourth connection pad.

In some embodiments, the manufacturing method further includes: forming a protective layer to cover the thin film circuit and the functional wafer.

In some embodiments, the surface mount device includes at least one light emitting diode or micro light emitting diode.

In some embodiments, the functional chip includes at least one light emitting diode chip or micro light emitting diode chip.

In some embodiments, the manufacturing method further includes: arranging a plurality of substrate arrays on the driving circuit board; wherein each substrate has a plurality of thin film circuits and a plurality of first connection pads, and each thin film circuit is associated with a plurality of corresponding first connection pads. The connection pads are electrically connected; the driving circuit board has a plurality of second connection pads; there are a plurality of conductive members, and one of the first connection pads corresponding to each thin film circuit and one of the second connection pads of the driving circuit board pass through one of the conductive members And are electrically connected to each other; and the two thin film circuits respectively provided on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and two conductive members.

In some embodiments, the manufacturing method further includes: arranging a plurality of substrate arrays on the driving circuit board; wherein each substrate has a plurality of thin film circuits and a plurality of first connection pads, and each thin film circuit is associated with a plurality of corresponding first connection pads. The connection pads are electrically connected; the driving circuit board has a plurality of second connection pads; there are a plurality of conductive members, and one of the first connection pads corresponding to each thin film circuit and one of the second connection pads of the driving circuit board pass through one of the conductive members And are electrically connected to each other; and the two thin film circuits respectively provided on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and a conductive member.

To achieve the above objective, an electronic device according to the present invention includes a substrate, a thin film circuit, at least one first connection pad, a driving circuit board, and a conductive element. The substrate has a first surface and a second surface opposite to each other. The thin film circuit is arranged on the first surface of the substrate, and the thin film circuit includes at least one thin film transistor and at least one conductive circuit. The first connection pad is arranged on the first surface of the substrate, and the first connection pad is electrically connected to the thin film transistor through the conductive circuit. The driving circuit board includes at least one second connection pad, wherein the substrate is disposed on the driving circuit board through the second surface, and the second connection pad is adjacent to the first connection pad and is disposed corresponding to the first connection pad. The conductive member covers at least part of the second connection pad and the first connection pad, and the second connection pad is electrically connected to the first connection pad through the conductive member.

In some embodiments, the electronic device further includes a protective layer covering the thin film circuit.

In some embodiments, the electronic device further includes a surface mount component disposed on the driving circuit board. The driving circuit board further includes at least one third connection pad. The surface mount component is electrically connected to the thin film transistor through the second connection pad. It is electrically connected to the circuit of the driving circuit board through the third connection pad.

In some embodiments, the electronic device further includes at least one fourth connection pad and a surface mount component. The fourth connection pad is arranged on the first surface of the substrate, and the fourth connection pad is electrically connected to the thin film transistor through the conductive circuit. The surface mount component is arranged on the first surface of the substrate, and the surface mount component is electrically connected to the thin film transistor through the fourth connection pad.

In some embodiments, the electronic device further includes at least one fourth connection pad and at least one functional chip. The fourth connection pad is arranged on the first surface of the substrate, and the fourth connection pad is electrically connected to the thin film transistor through the conductive circuit. The functional chip is arranged on the first surface of the substrate, and the functional chip is electrically connected to the thin film transistor through the fourth connection pad.

In some embodiments, the electronic device further includes a protective layer covering the thin film circuit and the functional chip.

In some embodiments, a plurality of substrate arrays are arranged on the driving circuit board; each substrate has a plurality of thin film circuits and a plurality of first connection pads, and each thin film circuit is electrically connected to a corresponding plurality of first connection pads; driving The circuit board has a plurality of second connection pads; there are a plurality of conductive members, and one of the first connection pads corresponding to each thin film circuit and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members; wherein , The two thin film circuits respectively provided on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and two conductive members.

In some embodiments, a plurality of substrate arrays are arranged on the driving circuit board; each substrate has a plurality of thin film circuits and a plurality of first connection pads, and each thin film circuit is electrically connected to a corresponding plurality of first connection pads; driving The circuit board has a plurality of second connection pads; there are a plurality of conductive members, and one of the first connection pads corresponding to each thin film circuit and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members; wherein , The two thin film circuits respectively provided on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and a conductive element.

As mentioned above, in the electronic device and the manufacturing method thereof of the present invention, a thin film circuit including at least one thin film transistor and at least one conductive circuit and at least one first connection pad are formed on a substrate, and the conductive member is used to cover the At least part of the second connection pad of the drive circuit board is connected to the first connection pad of the substrate, so that the second connection pad can be electrically connected to the first connection pad through the conductive member, so that the present invention does not need to be specific to each product size and Function design and its manufacturing process, so in addition to simple manufacturing process and lower cost, it is more flexible in application and can be adapted to the needs of diverse products.

Hereinafter, the electronic device and the manufacturing method thereof according to the preferred embodiment of the present invention will be described with reference to related drawings, in which the same components will be described with the same reference signs.

FIG. 1 is a schematic diagram of the process steps of a manufacturing method of an electronic device according to an embodiment of the present invention. As shown in FIG. 1, the manufacturing method of the electronic device of the present invention may include: providing a substrate, wherein the substrate has a first surface and a second surface opposite to each other (step S01); forming a thin film circuit on the first surface of the substrate Above, wherein the thin film circuit includes at least one thin film transistor and at least one conductive circuit (step S02); at least one first connection pad is formed on the first surface of the substrate, wherein the first connection pad is electrically connected to the thin film transistor through the conductive circuit Connection (step S03); the substrate is placed on a driving circuit board by the second surface, wherein the driving circuit board includes at least one second connection pad, the second connection pad is adjacent to the first connection pad and corresponds to the first connection pad Setting (step S04); and forming a conductive member to cover at least part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member (step S05).

In some embodiments, the substrate may be an insulating substrate, or a conductive substrate plus an insulating layer. In some embodiments, the substrate may be a rigid board or a soft board. If the substrate is a soft board, in order to make the subsequent components can be smoothly formed on the soft board through the subsequent process, and to facilitate the operation of the soft board, the soft board needs to be formed on a rigid carrier first, and then Remove the rigid carrier board in the step of. If the substrate is a rigid board, this process is not required.

Please refer to FIG. 1 in conjunction with FIG. 2A to FIG. 2K to illustrate the detailed technical content of each step described above. 2A, FIG. 2C, FIG. 2D, FIG. 2H, FIG. 2I, and FIG. 2J respectively show a schematic layout of the manufacturing process of an electronic device according to an embodiment of the present invention, and FIG. 2B shows a schematic cross-sectional view of a substrate of an embodiment 2E to 2G respectively show the cross-sectional schematic diagrams along the 2E-2E, 2F-2F, and 2G-2G cut lines in Fig. 2D. Fig. 2H shows the driving circuit board of an embodiment. Schematic diagram of the layout, FIG. 2I is a schematic diagram of the layout of the surface mount component of an embodiment, and FIG. 2K shows a schematic diagram of the circuit of the embodiment of FIG. 2J.

First, as shown in FIG. 2A, step S01 is: providing a substrate 21, wherein the substrate 21 has a first surface S1 and a second surface S2 opposite to each other. Here, the first surface S1 may be referred to as the upper surface of the substrate 21, and the second surface S2 may be referred to as the lower surface. The material of the substrate 21 can be glass, resin, metal or ceramic, or a composite material. Among them, the resin material is flexible and can contain organic polymer materials. The glass transition temperature (Tg) of the organic polymer materials can be between 250 degrees Celsius and 600 degrees Celsius, for example, a preferred temperature The range may be between 300 degrees Celsius and 500 degrees Celsius, for example. With such a high glass transition temperature, the thin film process can be directly performed on the substrate 21 in the subsequent process to form thin film transistors and other components or circuits. The aforementioned organic polymer materials can be thermoplastic materials, such as polyimide (PI), polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), acrylic (propylene , Acrylic, Fluoropolymer, polyester or nylon.

In some embodiments, please refer to FIG. 2B. For example, a soft material (such as PI) may be formed on a rigid carrier 4 by coating (or gluing) first, and after curing (thermal curing or light curing) The substrate 21 (soft board) can then be formed. In addition, before the step S04 of placing the substrate 21 (soft board) on the driving circuit board, the rigid carrier board 4 may be removed. The rigid carrier 4 is, for example, but not limited to, a glass plate, a ceramic plate, a metal plate, or a quartz plate.

Next, referring to FIG. 2A again, proceed to step S02: forming a thin film circuit 22 on the first surface S1 of the substrate 21, wherein the thin film circuit 22 includes at least one thin film transistor and at least one conductive circuit 222. In this embodiment, two thin film transistors 221 a and 221 b and a plurality of conductive circuits 222 are formed on the substrate 21, and the thin film transistors 221 a and 221 b are electrically connected to each other through the conductive circuit 222 as an example. Here, the thin film circuit 22 and the conductive circuit 222 can be formed on the substrate 21 by, for example, a thin film process. The thin film transistors 221a, 221b and the conductive circuit 222 can be directly formed on the substrate 21; alternatively, the thin film transistors 221a, 221b and the conductive circuit 222 can also be formed on the substrate 21 indirectly, for example, a buffer layer is included between the two Or the insulating layer is not limited. The aforementioned thin film process may include a low temperature polysilicon (LTPS) process, an amorphous silicon (a-Si) process, or a metal oxide (such as IGZO) semiconductor process, etc., and the present invention is not limited. The material of the conductive circuit 222 can be a single-layer or multi-layer structure composed of metals (such as aluminum, copper, silver, molybdenum, titanium) or alloys thereof, and a part of the thin-film transistors 221a, 221b, such as the source or drain, can be combined with The conductive circuit 222 is made of the same material and process to save cost. In some embodiments, the conductive circuit 222 can be directly or indirectly electrically connected to the thin film transistors 221a, 221b through other conductive layers; or the conductive circuit 222 can also be electrically connected between two thin film transistors 221a, 221b. Or, the conductive circuit 222 can also be a wire that electrically connects the thin film transistors 221a, 221b and other components; or, the two conductive circuits 222 can be separated by an insulating layer to avoid short circuits, which is not limited by the present invention. The aforementioned conductive circuit 222 is a general term. As long as there is a conductive film or circuit in the thin film circuit 22 formed on the substrate 21, it can be referred to as the conductive circuit 222. In some embodiments, the conductive circuit 222 may also include a circuit for transmitting a scan signal (scan line) or a circuit for transmitting a data signal (data line), depending on the function and purpose of the electronic device.

Next, as shown in FIG. 2C, proceed to step S03: forming at least one first connection pad 23 on the first surface S1 of the substrate 21, wherein the first connection pad 23 is electrically connected to the thin film transistors 221a, 221b through the conductive line 222 . In this embodiment, four first connection pads 23 are formed on the first surface S1 of the substrate 21. The four first connection pads 23 are located on the edge of the substrate 21 and respectively cover part of the conductive lines 222, so that the first As an example, the connection pad 23 may be electrically connected to the thin film transistors 221a and 221b through the conductive circuit 222, respectively. The material of the first connection pad 23 is, for example, but not limited to, copper, silver, or gold, or a combination thereof, or other suitable conductive materials. In some embodiments, in order to make the first connecting pad 23 thicker, the first connecting pad 23 may be made on the conductive circuit 222 using a process such as electroplating, printing, or evaporation and lift-off patterning (Lift-off patterning). In other embodiments, a thin film process can also be used to make the first connection pad 23, which is not limited. In addition, the manufacturing process of the first connection pad 23 (step S03) and the manufacturing process of the thin film circuit 22 (step S02) can be reversed. In other words, the process of manufacturing the thin film transistors 221a, 221b and the conductive circuit 222 can be performed first, and then the process of manufacturing the first connection pad 23, or vice versa, and the present invention is not limited.

2D, after the step S02 of forming the thin film circuit 22 on the substrate 21, the manufacturing method of this embodiment may further include: forming a protective layer 24 to cover the thin film circuit 22 to form a thin film circuit substrate 2. Here, the protective layer 24 can be covered on the film circuit 22 by resin transfer molding (Resin Transfer Molding) or sealant dispensing or other appropriate methods to protect moisture or foreign matter from entering the film circuit 22 and damaging it. characteristic. In some embodiments, the protective layer 24 can be formed at the same time as the thin film circuit 22 is fabricated by the LTPS process to save cost. In some embodiments, the protective layer 24 can also be formed after the step S03 of forming the first connection pad 23, which is not limited in the present invention.

The protective layer 24 of this embodiment covers part of the first connection pad 23, and the part of the first connection pad 23 that is not covered by the protective layer 24 can be used for subsequent electrical connection with the corresponding second connection pad via the conductive member . In addition, in some embodiments, if there is a protective layer 24 on the periphery of the first connection pad 23, the subsequent conductive member and the adjacent first connection pad 23 with different signals can also be prevented from being short-circuited due to the diffusion of the conductive member. . In addition, in this embodiment, as shown in FIGS. 2E to 2G, in addition to forming thin film transistors 221a, 221b, conductive lines 222, first connection pads 23, and protective layer 24 on the substrate 21, the thin film circuit 22 can be more It includes other film layers, such as insulating layers 27 and 28, and/or other buffer film layers.

After that, proceed to step S04, as shown in FIG. 2D and FIG. 2H, the substrate 21 is disposed on a driving circuit board 3 by the second surface S2, wherein the driving circuit board 3 includes at least one second connection pad 31, and the second surface S2 The connection pad 31 is adjacent to the first connection pad 23 and is arranged corresponding to the first connection pad 23. The driving circuit board 3 can be a flexible circuit board or a rigid circuit board, and is not limited. Here, the second surface S2 of the substrate 21, that is, the lower surface of the thin film circuit substrate 2 in FIG. 2D, can be arranged on the driving circuit board 3 in FIG. 2H by means of adhesive or other suitable methods, for example but not limited to. As shown in FIG. 2H, the driving circuit board 3 of this embodiment includes four second connection pads 31, and the material and manufacturing process of the second connection pads 31 can be the same as or different from those of the first connection pads 23. In addition, when making the layout position of the second connection pad 31, it is necessary to refer to the layout position of the thin film circuit 22 of the thin film circuit board 2 and the first connection pad 23, so that when the thin film circuit board 2 is placed on the drive circuit board 3, The second connection pads 31 are respectively adjacent to the corresponding first connection pads 23 (FIG. 2J ).

Please refer to FIG. 2H again, the driving circuit board 3 of this embodiment may further include two conductive circuits 32, and three second connection pads 31 are provided and partially cover the two conductive circuits 32, but there are only two conductive circuits 32. Each of the second connection pads 31 is electrically connected to the corresponding conductive circuit 32 through a conductive hole H (the conductive hole H can be filled with conductive material, such as but not limited to copper glue). In FIG. 2H, although a second connection pad 31 is provided (partially covered) on the conductive circuit 32, since there is no conductive hole, it means that the second connection pad 31 is not electrically connected to the two conductive circuits 32 underneath. (The two can be separated by an insulating layer). In addition, the driving circuit board 3 of this embodiment may further include at least one third connection pad 33. The third connection pad 33 is provided and partially covered on the conductive circuit 32, but is not electrically connected to the conductive circuit 32.

Next, proceed to step S05: forming a conductive member 11 to cover at least part of the second connection pad 31 and the first connection pad 23, wherein the second connection pad 31 is electrically connected to the first connection pad 23 through the conductive member 11. As shown in FIG. 2J, the conductive member 11 may be formed to cover at least part of the second connection pad 31 and the first connection pad 23 by spray printing or coating, so that the two can be electrically connected. The material of the conductive member 11 may include, but is not limited to, solder paste, silver glue, or anisotropic conductive glue, or a combination thereof, or other suitable materials, and is not limited. The number of conductive elements 11 in this embodiment is 4, which are respectively arranged and partially covered on the second connection pad 31 and the first connection pad 23, so that the second connection pad 31 can be connected to the corresponding first connection through the conductive element 11 The pad 23 is electrically connected.

In addition, as shown in FIGS. 2I and 2J, the manufacturing method of the electronic device 1 of this embodiment may further include: disposing a surface mount component 12 on the driving circuit board 3. Here, the surface mount component 12 is installed on the driving circuit board 3 using surface mount technology (SMT). The surface mount device 12 may be, for example, a two-electrode device, such as but not limited to including at least one light emitting diode (LED) or micro light emitting diode (μLED). In some embodiments, for example, the solder can be melted by heating, so that the electrodes of the surface mount component 12 can be electrically connected to the electrodes on the driving circuit board 3 respectively.

Please refer to FIG. 2K first. FIG. 2K is a schematic diagram of the circuit of the electronic device 1 of FIG. The architecture, for example, can be 4T2C or 5T1C, and is not limited.

In FIG. 2K, in addition to two thin film transistors 221a and 221b and a plurality of conductive circuits 222, the thin film circuit 22 may also include a capacitor C. The connection relationship of the components of the thin film circuit 22 can be referred to FIG. 2K, and no further description is provided here. The plurality of conductive lines 222 in this embodiment may include a scan line SL, a data line DL, wires connecting the thin film transistors 221a and 221b, and wires connecting the thin film transistors 221a and 221b and the first connection pad 23, respectively. Therefore, when the scan signal transmitted by the scan line SL turns on the thin film transistor 221a, the data signal can be transmitted to the gate of the thin film transistor 221b through the data line DL through the thin film transistor 221a, so that the thin film transistor 221b is turned on, so that the voltage Vdd It can be transmitted to the light emitting diode 123 through the thin film transistor 221b, so that the light emitting diode 123 can emit light.

In conclusion, in this embodiment, as shown in FIGS. 2J and 2K, the electronic device 1 includes a substrate 21, a thin film circuit 22, a plurality of first connection pads 23, a driving circuit board 3, and a plurality of conductive members 11. The substrate 21 has a first surface S1 and a second surface S2 opposed to each other. The thin film circuit 22 is disposed on the first surface S1 of the substrate 21, and includes thin film transistors 221a, 221b and conductive circuits 222 (for the sake of simplicity, Figure 2J 221a, 221b, and 222 are not marked). The first connection pad 23 is disposed on the first surface S1 of the substrate 21, and the first connection pad 23 is electrically connected to the thin film transistors 221a and 221b through the conductive circuit 222. The driving circuit board 3 includes a plurality of second connection pads 31, and the substrate 21 is disposed on the driving circuit board 3 through the second surface S2, and each second connection pad 31 is adjacent to the corresponding first connection pad 23 and is connected to the first connection pad. A connecting pad 23 is correspondingly arranged. In addition, the conductive member 11 covers at least part of the second connection pad 31 and the first connection pad 23 so that the second connection pad 31 can be electrically connected to the corresponding first connection pad 23 through the conductive member 11.

In addition, the electronic device 1 may further include a surface mount component 12, and the surface mount component 12 may include a light emitting diode 123 and two connection pads 121 and 122. The surface mount component 12 is electrically connected to the thin film transistor 221b through the connection pad 121 and the second connection pad 31, and is electrically connected to the driving circuit board 3 through the connection pad 122 and the third connection pad 33. Here, the third connection pad 33 can be electrically connected to the voltage Vss, such as ground (0V), so that the driving circuit of the driving circuit board 3 can pass through its conductive line 32, the second connection pad 31, the conductive member 11, and the first connection pad. 23. The thin film transistors 221a, 221b and the conductive circuit 222 of the thin film circuit 22 transmit corresponding scan signals and data signals, and pass through the conductive circuit 32, the second connection pad 31, the conductive member 11, the first connection pad 23, and the third The connection pad 33 is electrically connected to the voltage Vdd or the voltage Vss, thereby driving the light emitting diode 123 of the surface mount device 12 to emit light. In some embodiments, the light emitting diode 123 can emit, for example, red light, or blue light, or green light, or ultraviolet light, or infrared light, or light of other wavelengths.

Please refer to FIG. 3A and FIG. 3B, which are schematic diagrams of the layout of the thin film circuit substrates 2a, 2b according to different embodiments of the present invention, respectively.

As shown in FIG. 3A, the manufacturing process of the thin film circuit substrate 2a of this embodiment and the thin film circuit substrate 2 of the previous embodiment and the component composition and the connection relationship of each component are substantially the same. The difference is that the manufacturing method of the thin film circuit substrate 2a of this embodiment may further include: forming at least one fourth connection pad 25 on the first surface S1 of the substrate 21, wherein the fourth connection pad 25 is connected to the first surface S1 of the substrate 21 through the conductive circuit 222. The thin film transistor 221b is electrically connected; and, a surface mount component 12a is arranged on the first surface S1 of the substrate 21, wherein the surface mount component 12a is electrically connected to the thin film transistor 221b through the fourth connection pad 25, the conductive circuit 222 and the thin film transistor 221b. By this, the thin film circuit 22 can drive the light emitting diode 123 of the surface mount device 12a to emit light. Wherein, a sixth connection pad 35 connected to the cathode of the light-emitting diode 123 may be electrically connected to the ground terminal through the conductive line 222, for example. It is also mentioned that because the surface mount component 12 needs to be electrically connected to the fourth connection pad 25 and the sixth connection pad 35 on the first surface S1 of the substrate 21, therefore, on the first surface S1 of the substrate 21, The place where the surface mount component 12a is installed is not covered with the protective layer 24; or, in different embodiments, after the surface mount component 12a is provided, a protective layer 24 can be provided to cover the film circuit 22 and the surface mount component On 12a, to protect the thin film circuit 22 and the surface mount component 12a, the present invention is not limited.

In addition, as shown in FIG. 3B, the manufacturing process of the thin-film circuit board 2b of this embodiment and the thin-film circuit board 2a of the previous embodiment and the component composition and the connection relationship of the components are substantially the same. The difference is that the aforementioned thin film circuit substrate 2a has only one thin film circuit 22, but the thin film circuit substrate 2b of this embodiment includes three thin film circuits 22 arranged side by side and electrically connected as an example. In accordance with the layout of the three thin film circuits 22, the number of the first connection pads 23 in this embodiment is ten. Of course, the conductive lines of the driving circuit board, the second connection pads and the conductive elements (none of which are shown) should also be arranged corresponding to the layout of the thin film circuit substrate 2b. In addition, the surface mount device 12b of this embodiment includes three light-emitting diodes 123 and four connection pads 121, 122, 124, and 125. Wherein, the connection pad 121 is arranged on the fourth connection pad 25, and is electrically connected to the thin film transistor 221b of the first thin film circuit 22 through the fourth connection pad 25, and the connection pad 122 is arranged on the sixth connection pad 35 to connect with The sixth connection pad 35 is electrically connected (the sixth connection pad 35 can be electrically connected to the first connection pad 23 through the conductive line 222, for example, to the ground terminal), and the connection pad 124 is disposed on the other fourth connection pad 25 and passes through the The four connection pads 25 are electrically connected to the thin film transistor 221b of the second thin film circuit 22, and the connection pad 125 is arranged on the fifth connection pad 34 and is connected to the third connection pad 34 and the conductive circuit 222. The thin film transistor 221b of the thin film circuit 22 is electrically connected.

In some embodiments, the surface mount device 12b may include three sub-pixels, each sub-pixel includes one light-emitting diode 123, and the three light-emitting diodes 123 of the three sub-pixels may be red and blue respectively. And green LEDs to form a full-color pixel unit, which can form a full-color LED display. Of course, in different embodiments, less than or more than three thin film circuits 22 can also be used to form a thin film circuit substrate, and the corresponding surface mount components and driving circuit boards can be matched, and the present invention is not limited.

Please refer to FIGS. 4A to 4C, which are schematic layout diagrams of electronic devices 1c, 1d, and 1e according to different embodiments of the present invention, respectively.

As shown in FIG. 4A, the manufacturing process of the electronic device 1c of this embodiment and the electronic device 1 of the previous embodiment and the composition of the components and the connection relationship of the components are substantially the same. The difference is that the thin film circuit substrate 2 of the electronic device 1 has only one thin film circuit 22, but the thin film circuit substrate 2c of the electronic device 1c of this embodiment includes three thin film circuits 22 arranged side by side and electrically connected as an example. In addition, the conductive circuit 32 of the driving circuit board 3c is also arranged corresponding to the layout of the three thin film circuits 22. According to the layout of the three thin film circuits 22, the number of the first connection pad 23, the second connection pad 31 and the conductive element 11 in this embodiment are all 11, and they are arranged corresponding to each other. In addition, the surface mount device 12c of this embodiment includes three light-emitting diodes 123 and four connection pads 121, 122, 124, and 125. The connection pad 121 is electrically connected to the thin film transistor 221b of the first thin film circuit 22 through the second connection pad 31, and the connection pad 122 is electrically connected to the third connection pad 33 (the third connection pad 33 can be connected to Grounding terminal), the connection pad 124 is electrically connected to the thin film transistor 221b of the second thin film circuit 22 through another second connection pad 31, and the connection pad 125 is electrically connected to the thin film transistor 221b of the second thin film circuit 22 through the fifth connection pad 34, the conductive circuit 32, and the second The two connection pads 31 are electrically connected to the thin film transistor 221b of the third thin film circuit 22. Therefore, the driving circuit of the driving circuit board 3c can drive the surface through the conductive circuit 32, the second connection pad 31, the conductive member 11, the first connection pad 23, the thin film transistors 221a, 221b and the conductive circuit 222 of the three thin film circuits 22. The three light-emitting diodes 123 corresponding to the mounting element 12c emit light.

In some embodiments, the surface mount component 12c of the electronic device 1c may include three sub-pixels, and the three light-emitting diodes 123 in the three sub-pixels may be red, blue, and green LEDs, respectively, to form a whole A pixel unit of color can constitute a full-color LED display, and the electronic device 1c can be driven to display images through the driving circuit board 3c. Of course, in different embodiments, less than or more than three thin film circuits 22 can also form a thin film circuit substrate, and the present invention is not limited.

In addition, as shown in FIG. 4B, the manufacturing process of the electronic device 1d of this embodiment and the electronic device 1 of the foregoing embodiment and the composition of the components and the connection relationship of the components are substantially the same. The difference is that in addition to the thin film circuit substrate 2d of the electronic device 1d of this embodiment, the manufacturing method of this embodiment may further include: disposing at least one functional chip 26 on the first surface S1 of the substrate 21, The functional chip 26 is electrically connected to the thin film transistor 221 b through the fourth connection pad 25, thereby driving the functional chip 26 through the thin film circuit 22. Here, the functional chip 26 includes, for example, but not limited to, at least one light emitting diode chip, micro light emitting diode chip, or other functional chips, and is arranged on the first surface of the substrate 21 by, for example, a flip chip. On S1, it is electrically connected to the thin film circuit 22. In different embodiments, the functional chip 26 can also be wire bonding, eutectic bonding (such as Au-Sn), anisotropic conductive film (ACF) bonding, and anisotropic conductive film. The methods such as anisotropic conductive paste (ACP) bonding, solder ball bonding, or ultrasonic bonding are provided on the first surface S1 of the substrate 21, which are not limited. In accordance with the layout of the thin film circuit substrate 2d, the conductive lines of the driving circuit board (not shown) are also provided corresponding to the layout of the thin film circuit substrate 2d. In addition, after the functional chip 26 is set, a protective layer 24 is formed to cover the thin film circuit 22 and the functional chip 26 to protect the thin film circuit 22 and the functional chip 26 of the thin film circuit substrate 2d from contamination by foreign matter or moisture. characteristic.

In addition, as shown in FIG. 4C, the manufacturing process of the electronic device 1e of this embodiment and the electronic device 1d of the previous embodiment and the component composition and the connection relationship of the components are substantially the same. The difference is that the thin-film circuit substrate 2e of the electronic device 1e of this embodiment includes three thin-film circuits 22 arranged side by side and electrically connected as an example. In addition, the conductive circuit 32 of the driving circuit board 3e is also arranged corresponding to the layout of the three thin film circuits 22. According to the layout of the three thin film circuits 22, the number of the first connection pad 23, the second connection pad 31 and the conductive element 11 in this embodiment are all 10, and they are arranged corresponding to each other. In addition, corresponding to the number of thin film circuits 22, the number of functional chips 26 in this embodiment is also three, and each functional chip 26 is electrically connected to the thin film transistor 221b of the corresponding thin film circuit 22 through the fourth connection pad 25. The corresponding functional chips 26 are driven by the thin film transistors 221b of the thin film circuit 22 respectively. Therefore, the driving circuit of the driving circuit board 3e can be driven by the conductive circuit 32, the second connection pad 31, the conductive member 11, the first connection pad 23, the thin film transistors 221a, 221b and the conductive circuit 222 of the three thin film circuits 22, respectively. The light-emitting diode of the corresponding functional chip 26 emits light.

In some embodiments, the three functional chips 26 of the electronic device 1e may include three sub-pixels, and the three light-emitting diode chips in the three sub-pixels may be red, blue, and green LED chips to form A full-color pixel unit can form a full-color LED display. Of course, in different embodiments, less than or more than three thin film circuits 22 can also form the thin film circuit substrate 2e to drive the corresponding functional chip 26, which is not limited by the present invention.

Please refer to FIG. 5 and FIG. 6, which are schematic layout diagrams of electronic devices 1f and 1g according to another embodiment of the present invention, respectively.

As shown in FIG. 5, the manufacturing process of the electronic device 1f of this embodiment and the electronic device of the previous embodiment and the component composition and the connection relationship of the components are substantially the same. The difference lies in that, in the electronic device 1f of this embodiment, a plurality of thin film circuit substrates 2e having a thin film circuit 22 and a substrate 21 of the first connection pad 23 are arrayed on the driving circuit board 3f. Among them, in the horizontal direction (the extension direction of the scan line) in FIG. 5, the two thin film circuits 22 provided on two adjacent substrates 21 respectively pass through two first connection pads 23 and their corresponding second connection pads. 31. And two conductive members 11 are electrically connected to each other; in the vertical direction (the extension direction of the data line) in FIG. A connection pad 23, its corresponding second connection pad 31, and two conductive members 11 are electrically connected to each other. Specifically, the two adjacent substrates 21 each have a plurality of thin film circuits 22 and a plurality of first connection pads 23, and each thin film circuit 22 is electrically connected to the corresponding one or more first connection pads 23; the drive circuit board 3f has a plurality of second connection pads 31; the electronic device 1f of this embodiment has conductive elements 11 correspondingly; which are respectively provided on two thin film circuits 22 of two adjacent substrates 21, in the horizontal direction (the scanning line of FIG. 5). It can be seen from the extension direction) that the thin film circuit 22 on one substrate 21 passes through one of the first connection pads 23, and corresponds to a first connection pad 23 of the thin film circuit 22 on the other substrate 21. The aforementioned two first connection pads 23 respectively correspond to two adjacently arranged second connection pads 31, each first connection pad 23 can be electrically connected to its corresponding second connection pad 31 through a conductive member 11; therefore, two adjacent substrates 21 are adjacent to each other. The thin film circuit 22 can be electrically connected through the two first connection pads 23, the two second connection pads 31, and the two conductive members 11. It must be noted here that this embodiment is only an example. The second connecting pad 31 exposed on the driving circuit board 3f adopts a dog-bone-shaped connecting pad. In the embodiment, both ends of the dog-bone-shaped connecting pad It can be defined as two second connection pads 31, but the form of the second connection pad does not stop there; for example, the second connection pad exposed by the driving circuit board 3f may be single and uniform in shape. In this case, Two adjacent thin-film circuits 22 of two adjacent substrates 21 will be electrically connected with two conductive members 11 through two first connection pads 23, one second connection pad, and In other embodiments in this case, the number and configuration of the second connection pads 31 should not be limited. Here, the thin film circuits 22 that are electrically connected to the functional chips 26 can form a matrix circuit and are electrically connected to the driving circuit board 3f to drive the functional chips in the matrix circuit by the driving circuit board 3f 26. The multiple thin film circuit substrates 2e of this embodiment are arranged in rows and columns to form an active matrix (AM) electronic device, such as but not limited to active matrix LED displays and active matrix Micro LED displays. Or other functional active matrix electronic devices.

In some embodiments, a plurality of thin film circuit substrates 2e may be arranged on the driving circuit board 3f at intervals (according to the needs of the client, they may be arranged in a straight row, or a horizontal column, or a matrix of rows and columns, or arranged It is polygonal or irregular), and the first connection pad 23 through which two adjacent thin film circuits 22 can pass is electrically connected to each other through the conductive member 11, the second connection pad 31 (and the conductive circuit 32). In other words, the manufacturer can design the required size of the driving circuit board 3f by itself, and then electrically connect the corresponding thin film circuit board 2e to complete the electronic device 1f. Therefore, the desired size can be spliced according to the application requirements of the product, and the application flexibility is quite large.

In addition, as shown in FIG. 6, the manufacturing process of the electronic device 1g of the present embodiment and the electronic device 1e of the previous embodiment and the component composition and the connection relationship of the components are substantially the same. The difference is that in the electronic device 1g of this embodiment, in the horizontal direction (the extension direction of the scanning line) in FIG. 6, two thin film circuits 22 provided on two adjacent substrates 21 pass through two The first connection pad 23, the corresponding second connection pad 31, and a conductive member 11' are electrically connected to each other to drive the functional chips 26 in the matrix circuit by the driving circuit board 3g. Specifically, the thin film circuit 22 on one substrate 21 passes through one of the first connection pads 23, and corresponds to a first connection pad 23 of the thin film circuit 22 on the other substrate 21, and the aforementioned two first connection pads 23 each correspond to each other. Corresponding to the two adjacently disposed second connection pads 31, the two first connection pads 23 are electrically connected to the two corresponding second connection pads 31 through a single conductive member 11'. Since the electronic device 1g only uses one conductive member 11' to cover the two adjacent first connection pads 23 and one second connection pad 31, the two adjacent thin film circuits 22 can be electrically connected. Therefore, one time can be reduced. In the process of forming the conductive member 11', the distance between the two thin film transistor substrates 2e can also be reduced, so that the size and cost of the electronic device 1g can be reduced under the same resolution.

It is worth mentioning that the design concepts of the electronic device 1f of FIG. 5 and the electronic device 1g of FIG. 6 can also be applied to the above-mentioned embodiments, namely, applied to the films of FIGS. 2J, 3A, 3B, 4A, and 4B. For the specific technical content of the circuit substrates 2, 2a, 2b, 2c, and 2d, reference may be made to the foregoing, and no further description will be given here.

In conclusion, in the traditional method of driving optoelectronic components with thin film transistors, for example, when thin film transistors on a thin film transistor substrate drive light-emitting diodes to emit light, it is necessary to design for the size or function of each product and use expensive thin film transistors. The crystal manufacturing process, photomask, substrate and materials are very unfavorable to the diverse product demands. However, the present invention does not need to be designed for the size or function of each product and uses expensive thin film transistor manufacturing process, photomask, substrate and materials, so it has the advantages of simple manufacturing process and lower cost, and it is also more flexible in application. It can be applied to changing product requirements.

In summary, in the electronic device and the manufacturing method thereof of the present invention, a thin film circuit including at least one thin film transistor and at least one conductive circuit and at least one first connection pad are formed on a substrate, and the conductive member is used to cover the At least part of the second connection pad of the drive circuit board is connected to the first connection pad of the substrate, so that the second connection pad can be electrically connected to the first connection pad through the conductive member, so that the present invention does not need to be specific to each product size and Function design and its manufacturing process, so in addition to simple manufacturing process and lower cost, it is more flexible in application and can be adapted to the needs of diverse products.

The above description is only illustrative, and not restrictive. Any equivalent modifications or alterations that do not depart from the spirit and scope of the present invention shall be included in the scope of the appended patent application.

1. 1c～1g‧‧‧Electronic device 11, 11’‧‧‧Conducting parts 12, 12a, 12b, 12c‧‧‧Surface mount components 121, 122, 124, 125‧‧‧Connecting pad 123‧‧‧Light Emitting Diode 2. 2a～2e‧‧‧Thin film circuit board 21‧‧‧Substrate 22‧‧‧Thin Film Circuit 221a, 221b‧‧‧Thin Film Transistor 222、32‧‧‧Conductive circuit 23‧‧‧First connection pad 24‧‧‧Protection layer 25‧‧‧Fourth connecting pad 26‧‧‧Functional chip 27、28‧‧‧Insulation layer 3. 3c～3g‧‧‧Drive circuit board 31‧‧‧Second connection pad 33‧‧‧Third connection pad 34‧‧‧Fifth connecting pad 35‧‧‧The sixth connection pad 4‧‧‧Rigid carrier board 2E-2E, 2F-2F, 2G-2G‧‧‧Cutting thread C‧‧‧Capacitor DL‧‧‧Data line H‧‧‧Conductive hole S1‧‧‧First surface S2‧‧‧Second surface Steps S01 to S05‧‧‧ SL‧‧‧Scan line Vdd, Vss‧‧‧Voltage

FIG. 1 is a schematic diagram of the process steps of a manufacturing method of an electronic device according to an embodiment of the present invention. FIG. 2A, FIG. 2C, and FIG. 2D respectively show schematic layouts of the manufacturing process of an electronic device according to an embodiment of the present invention. 2B is a schematic cross-sectional view of a substrate according to an embodiment of the invention. Figures 2E to 2G respectively show schematic cross-sectional views of Figure 2D along the 2E-2E cutting line, 2F-2F cutting line, and 2G-2G cutting line. FIG. 2H is a schematic diagram of the layout of the driving circuit board according to an embodiment. FIG. 2I is a schematic diagram of the layout of surface mount components according to an embodiment. 2J is a schematic diagram of the layout of an electronic device according to an embodiment of the invention. Fig. 2K shows a schematic circuit diagram of the embodiment of Fig. 2J. 3A and 3B are respectively schematic diagrams of the layout of thin film circuit substrates according to different embodiments of the present invention. 4A to 4C are schematic diagrams of the layout of electronic devices according to different embodiments of the present invention. 5 and 6 are respectively schematic diagrams of the layout of an electronic device according to another embodiment of the present invention.

Steps S01 to S05‧‧‧

Claims (24)

A method for manufacturing an electronic device includes: providing a substrate, wherein the substrate has a first surface and a second surface opposite to each other; forming a thin film circuit on the first surface of the substrate, wherein the thin film circuit includes at least one thin film Transistor and at least one conductive circuit; forming at least one first connection pad on the first surface of the substrate, wherein the first connection pad is electrically connected to the thin film transistor through the conductive circuit; by the second surface Disposing the substrate on a driving circuit board, wherein the driving circuit board includes at least one second connecting pad, the second connecting pad is adjacent to the first connecting pad and corresponding to the first connecting pad; and forming a conductive The member covers at least part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member; wherein, the substrate is a flexible board formed with a rigid Before the step of disposing the substrate on a driving circuit board, the method further includes: removing the rigid carrier. According to the manufacturing method described in item 1 of the scope of the patent application, the conductive member is covered on at least part of the second connection pad and the first connection pad by spray printing or coating. According to the manufacturing method described in item 1 of the scope of the patent application, the material of the conductive member includes solder paste, silver glue, or anisotropic conductive glue, or a combination thereof. According to the manufacturing method described in item 1 of the scope of patent application, after the step of forming a thin film circuit on the substrate, it further comprises: forming a protective layer to cover the thin film circuit. The manufacturing method described in item 1 of the scope of patent application further includes: disposing a surface mount component on the drive circuit board, wherein the drive circuit board further includes at least one third connection pad, and the surface mount component passes through the The second connection pad is electrically connected with the thin film transistor, and is electrically connected with the circuit of the driving circuit board through the third connection pad. The manufacturing method described in item 1 of the scope of patent application further includes: Forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected to the thin film transistor through the conductive circuit; and a surface mount component is disposed on the first surface of the substrate On the surface, the surface mount component is electrically connected to the thin film transistor through the fourth connection pad. The manufacturing method described in item 1 of the scope of patent application further includes: forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected to the thin film transistor through the conductive circuit. Connecting; and arranging at least one functional chip on the first surface of the substrate, wherein the functional chip is electrically connected to the thin film transistor through the fourth connection pad. The manufacturing method described in item 7 of the scope of patent application further includes: forming a protective layer to cover the thin film circuit and the functional chip. According to the manufacturing method described in item 5 or item 6 of the scope of patent application, the surface mount device includes at least one light emitting diode or micro light emitting diode. According to the manufacturing method described in item 7 of the scope of patent application, the functional chip includes at least one light-emitting diode chip or micro-light-emitting diode chip. The manufacturing method described in item 1 of the scope of patent application further includes: arranging a plurality of the substrate arrays on the driving circuit board; wherein, each of the substrates has a plurality of the thin film circuits and a plurality of the first connection pads, each The thin film circuit is electrically connected to the corresponding plurality of the first connection pads; the driving circuit board has a plurality of the second connection pads; there are a plurality of the conductive members, and each of the thin film circuits corresponds to one of the first connections The pad and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members; and the two thin film circuits respectively provided on two adjacent substrates are connected through two first connections The pad, the corresponding second connection pad, and the two conductive members are electrically connected to each other. The manufacturing method described in item 1 of the scope of the patent application further includes: a plurality of the substrate arrays are arranged on the driving circuit board; wherein each of the substrates has a plurality of the thin film circuits and a plurality of the first connection pads, and each The thin film circuit is electrically connected to the corresponding plurality of the first connection pads; the driving circuit board has a plurality of the second connection pads; there are a plurality of the conductive members, and each of the thin film circuits corresponds to another One of the first connection pads and one of the second connection pads of the drive circuit board are electrically connected to each other through one of the conductive members; and the two thin film circuits respectively provided on two adjacent substrates pass through The two first connection pads, the corresponding second connection pad, and one conductive element are electrically connected to each other. An electronic device includes: a substrate having a first surface and a second surface opposite to each other; a thin film circuit arranged on the first surface of the substrate, the thin film circuit including at least one thin film transistor and at least one conductive Circuit; at least one first connection pad, disposed on the first surface of the substrate, the first connection pad is electrically connected to the thin film transistor through the conductive circuit; a driving circuit board, including at least one second connection pad , Wherein the substrate is disposed on the driving circuit board through the second surface, and the second connection pad is adjacent to the first connection pad and is disposed corresponding to the first connection pad; and a conductive element covering at least part of the The second connection pad is on the first connection pad, and the second connection pad is electrically connected to the first connection pad through the conductive member. As for the electronic device described in item 13 of the scope of patent application, the substrate is a rigid board or a flexible board. The electronic device according to item 13 of the scope of patent application, wherein the material of the conductive member includes solder paste, silver glue, or anisotropic conductive glue, or a combination thereof. The electronic device described in item 13 of the scope of the patent application further includes: a protective layer covering the thin film circuit. The electronic device described in item 13 of the scope of patent application further includes: a surface mount component disposed on the drive circuit board, the drive circuit board further includes at least one third connection pad, and the surface mount component passes through the The second connection pad is electrically connected with the thin film transistor, and is electrically connected with the circuit of the driving circuit board through the third connection pad. The electronic device described in item 13 of the scope of patent application further includes: at least one fourth connection pad disposed on the first surface of the substrate, and the fourth connection pad is electrically connected to the thin film transistor through the conductive circuit. Connection; and A surface mount component is arranged on the first surface of the substrate, and the surface mount component is electrically connected to the thin film transistor through the fourth connection pad. The electronic device described in item 13 of the scope of patent application further includes: at least one fourth connection pad disposed on the first surface of the substrate, and the fourth connection pad is electrically connected to the thin film transistor through the conductive circuit. Connection; and at least one functional chip disposed on the first surface of the substrate, and the functional chip is electrically connected to the thin film transistor through the fourth connection pad. As described in item 19 of the scope of patent application, the electronic device further includes: a protective layer covering the thin film circuit and the functional chip. The electronic device according to item 17 or item 18 of the scope of patent application, wherein the surface mount device includes at least one light emitting diode or micro light emitting diode. The electronic device according to item 19 of the scope of patent application, wherein the functional chip includes at least one light-emitting diode chip or micro-light-emitting diode chip. The electronic device according to item 13 of the scope of patent application, wherein a plurality of the substrate arrays are arranged on the driving circuit board; each of the substrates has a plurality of the thin film circuits and a plurality of the first connection pads, and each of the thin film circuits Are electrically connected to the corresponding plurality of the first connection pads; the driving circuit board has a plurality of the second connection pads; there are a plurality of the conductive elements, and one of the first connection pads corresponding to each of the thin film circuits is connected to the One of the second connection pads of the driving circuit board is electrically connected to each other through one of the conductive members; wherein, the two thin film circuits respectively provided on two adjacent substrates pass through the two first connection pads and The corresponding second connection pad and the two conductive members are electrically connected to each other. The electronic device according to item 13 of the scope of patent application, wherein a plurality of the substrate arrays are arranged on the driving circuit board; each of the substrates has a plurality of the thin film circuits and a plurality of the first connection pads, and each of the thin film circuits Are electrically connected to the corresponding plurality of the first connection pads; the driving circuit board has a plurality of the second connection pads; there are a plurality of the conductive elements, and one of the first connection pads corresponding to each of the thin film circuits is connected to the One of the second connection pads of the driving circuit board is electrically connected to each other through one of the conductive members; wherein, the two thin film circuits respectively provided on two adjacent substrates pass through the two first connection pads and Corresponding to the second connection pad and one of the conductive elements are electrically connected to each other.

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