TWI747298B - Electronic device and insulating piece thereof - Google Patents
Electronic device and insulating piece thereof Download PDFInfo
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- TWI747298B TWI747298B TW109117659A TW109117659A TWI747298B TW I747298 B TWI747298 B TW I747298B TW 109117659 A TW109117659 A TW 109117659A TW 109117659 A TW109117659 A TW 109117659A TW I747298 B TWI747298 B TW I747298B
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Abstract
Description
本揭示係關於一種電子裝置及其絕緣片。 This disclosure relates to an electronic device and its insulating sheet.
部分電子設備配有絕緣片,在組裝電子設備的過程中,常出現外殼干涉絕緣片造成絕緣片破裂的問題,影響絕緣效果。 Some electronic devices are equipped with insulating sheets. In the process of assembling electronic devices, there is often a problem that the shell interferes with the insulating sheet and causes the insulating sheet to break, which affects the insulation effect.
有鑑於此,本揭示之一目的在於提出一種創新的絕緣片,解決上述技術問題。 In view of this, one purpose of the present disclosure is to provide an innovative insulating sheet to solve the above technical problems.
為達成上述目的,依據本揭示的一些實施方式,一種絕緣片,應用於電子裝置,電子裝置包含第一殼體部件以及第二殼體部件,第一殼體部件包含至少一卡勾部連結第二殼體部件。絕緣片包含第一覆蓋部、第二覆蓋部以及至少一內凹結構。第二覆蓋部與第一覆蓋部延伸方向相異。內凹結構連接於第一覆蓋部以及第二覆蓋部之間,且內凹結構與第二殼體部件之間形成容置空間以容納卡勾部。第一覆蓋部以及第二覆蓋部係分別覆蓋於第一殼體部件以及 第二殼體部件的內側。 To achieve the above objective, according to some embodiments of the present disclosure, an insulating sheet is applied to an electronic device. The electronic device includes a first housing component and a second housing component. The first housing component includes at least one hook portion connected to the Two housing parts. The insulating sheet includes a first covering portion, a second covering portion and at least one concave structure. The extending direction of the second covering portion is different from that of the first covering portion. The concave structure is connected between the first covering portion and the second covering portion, and an accommodating space is formed between the concave structure and the second housing component to accommodate the hook portion. The first covering part and the second covering part are respectively covered on the first housing part and The inside of the second housing part.
於本揭示的一或多個實施方式中,內凹結構包含弧面,弧面連接於第一覆蓋部以及第二覆蓋部之間。 In one or more embodiments of the present disclosure, the concave structure includes an arc surface connected between the first covering portion and the second covering portion.
於本揭示的一或多個實施方式中,絕緣片包含複數個內凹結構,且第一殼體部件包含複數個卡勾部。內凹結構對應卡勾部設置,並彼此分離,第一覆蓋部與第二覆蓋部在內凹結構之間匯聚形成一角落。 In one or more embodiments of the present disclosure, the insulating sheet includes a plurality of concave structures, and the first housing part includes a plurality of hook portions. The concave structure is arranged corresponding to the hook part and separated from each other, and the first covering part and the second covering part converge between the concave structure to form a corner.
於本揭示的一或多個實施方式中,內凹結構的兩端具有圓角。 In one or more embodiments of the present disclosure, both ends of the concave structure have rounded corners.
於本揭示的一或多個實施方式中,第二殼體部件具有至少一限位槽,卡勾部與限位槽滑動配合,且卡勾部彎曲形成凹口,凹口配置以卡合於限位槽的一端。內凹結構對應卡勾部與限位槽設置。 In one or more embodiments of the present disclosure, the second housing component has at least one limiting groove, the hook portion is slidably engaged with the limiting groove, and the hook portion is bent to form a notch, and the notch is configured to be engaged with One end of the limit slot. The concave structure is arranged corresponding to the hook part and the limit slot.
於本揭示的一或多個實施方式中,第二殼體部件具有至少一限位槽,限位槽包含相連通的插入部以及固定部,固定部的寬度小於插入部的寬度。卡勾部配置以由插入部進入限位槽,並旋轉卡合於固定部。內凹結構對應卡勾部與限位槽設置。 In one or more embodiments of the present disclosure, the second housing component has at least one limiting slot, the limiting slot includes a communicating insertion portion and a fixing portion, and the width of the fixing portion is smaller than the width of the insertion portion. The hook part is configured to enter the limiting slot from the insertion part and rotate and engage with the fixing part. The concave structure is arranged corresponding to the hook part and the limit slot.
於本揭示的一或多個實施方式中,內凹結構包含第一延伸部以及第二延伸部,第一延伸部與第二延伸部相連並實質上相互垂直。 In one or more embodiments of the present disclosure, the concave structure includes a first extension portion and a second extension portion, and the first extension portion and the second extension portion are connected and substantially perpendicular to each other.
於本揭示的一或多個實施方式中,內凹結構包含斜面,斜面連接於第一覆蓋部以及第二覆蓋部之間。 In one or more embodiments of the present disclosure, the concave structure includes an inclined surface, and the inclined surface is connected between the first covering portion and the second covering portion.
依據本揭示的一些實施方式,一種電子裝置包含絕 緣片、第一殼體部件以及第二殼體部件。絕緣片包含內凹結構、第一覆蓋部以及第二覆蓋部。第二覆蓋部與第一覆蓋部延伸方向相異,內凹結構連接於第一覆蓋部以及第二覆蓋部之間。第一殼體部件包含至少一卡勾部,第二殼體部件具有至少一限位槽配置以接收卡勾部。第一覆蓋部以及第二覆蓋部係分別覆蓋於第一殼體部件以及第二殼體部件的內側,且內凹結構與第二殼體部件之間形成容置空間以容納卡勾部。 According to some embodiments of the present disclosure, an electronic device includes an insulation The edge piece, the first housing part, and the second housing part. The insulating sheet includes a concave structure, a first covering part and a second covering part. The extension directions of the second covering portion and the first covering portion are different, and the concave structure is connected between the first covering portion and the second covering portion. The first housing component includes at least one hook portion, and the second housing component has at least one limiting slot configured to receive the hook portion. The first covering part and the second covering part respectively cover the inner sides of the first housing part and the second housing part, and an accommodating space is formed between the concave structure and the second housing part to accommodate the hook part.
綜上所述,本揭示之絕緣片具有內凹結構,內凹結構與殼體之間形成容置空間以容納殼體的卡勾部,防止組裝殼體時卡勾部干涉絕緣片造成絕緣片破裂。 In summary, the insulating sheet of the present disclosure has an inner concave structure, and an accommodating space is formed between the inner concave structure and the casing to accommodate the hook portion of the casing, which prevents the hook portion from interfering with the insulating sheet when the casing is assembled. rupture.
100:電子裝置 100: electronic device
101,701,801:容置空間 101,701,801: housing space
102:緊固件 102: Fastener
110,510:殼體 110,510: shell
111:第一殼體部件 111: The first housing part
111a,112a:固定孔 111a, 112a: fixing holes
112,512:第二殼體部件 112, 512: second housing part
113:卡勾部 113: Card Hook
113a:凹口 113a: Notch
113b:頸部 113b: neck
113c:頭部 113c: head
114,514:限位槽 114,514: Limit slot
120:電子元件 120: electronic components
130,730,830:絕緣片 130,730,830: Insulation sheet
131:第一覆蓋部 131: The first covering part
132:第二覆蓋部 132: The second covering part
133,733,833:內凹結構 133,733,833: concave structure
134:弧面 134: Curved Surface
135:圓角 135: Fillet
515:插入部 515: Insertion part
516:固定部 516: fixed part
734a,734b:延伸部 734a, 734b: extension
834:斜面 834: Slope
C:角落 C: corner
D1,D2:方向 D1, D2: direction
L:軸線 L: axis
W1,W2:寬度 W1, W2: width
為使本揭示之上述及其他目的、特徵、優點與實施方式能更明顯易懂,所附圖式之說明如下: In order to make the above and other objectives, features, advantages and implementations of the present disclosure more obvious and understandable, the description of the accompanying drawings is as follows:
第1圖為繪示依據本揭示一實施方式之電子裝置的組合圖。 FIG. 1 is an assembly diagram of an electronic device according to an embodiment of the present disclosure.
第2圖為繪示第1圖所示之電子裝置的爆炸視圖。 Figure 2 is an exploded view of the electronic device shown in Figure 1.
第3圖以及第4圖為繪示第1圖所示之電子裝置的殼體與絕緣片在組裝前後的局部放大剖視圖。 3 and 4 are partial enlarged cross-sectional views showing the housing and insulating sheet of the electronic device shown in FIG. 1 before and after assembly.
第5圖以及第6圖為繪示依據本揭示另一實施方式之殼體與絕緣片在組裝前後的局部放大剖視圖。 Figures 5 and 6 are partial enlarged cross-sectional views illustrating a housing and an insulating sheet according to another embodiment of the present disclosure before and after assembly.
第7圖為繪示依據本揭示另一實施方式之殼體與絕緣 片的局部放大剖視圖。 Figure 7 is a diagram showing the housing and insulation according to another embodiment of the present disclosure A partial enlarged cross-sectional view of the film.
第8圖為繪示依據本揭示另一實施方式之殼體與絕緣片的局部放大剖視圖。 FIG. 8 is a partial enlarged cross-sectional view of the housing and the insulating sheet according to another embodiment of the present disclosure.
為使本揭示之敘述更加詳盡與完備,可參照所附之圖式及以下所述各種實施方式。圖式中之各元件未按比例繪製,且僅為說明本揭示而提供。以下描述許多實務上之細節,以提供對本揭示的全面理解,然而,相關領域具普通技術者應當理解可在沒有一或多個實務上之細節的情況下實施本揭示,因此,該些細節不應用以限定本揭示。 In order to make the description of the present disclosure more detailed and complete, please refer to the attached drawings and the various embodiments described below. The elements in the drawings are not drawn to scale, and are provided only to illustrate the present disclosure. Many practical details are described below to provide a comprehensive understanding of the present disclosure. However, those of ordinary skill in the relevant fields should understand that the present disclosure can be implemented without one or more practical details. Therefore, these details are not Application to limit this disclosure.
請參照第1圖以及第2圖。第1圖為繪示依據本揭示一實施方式之電子裝置100的組合圖,而第2圖為繪示第1圖所示之電子裝置100的爆炸視圖。電子裝置100包含殼體110以及容納於殼體110內的電子元件120以及絕緣片130,殼體110例如是金屬殼體,絕緣片130設置於殼體110以及電子元件120之間,以絕緣殼體110與電子元件120。於一些實施方式中,電子裝置100為電源供應器(power supply unit,PSU),電子元件120包含電路板及其所承載的元件及/或電路。
Please refer to Figure 1 and Figure 2. FIG. 1 is an assembly diagram of the
如第1圖與第2圖所示,殼體110包含第一殼體部件111以及第二殼體部件112。第一殼體部件111包含至少一卡勾部113,第二殼體部件112具有至少一限位槽114配置以接收卡勾部113,使卡勾部113連結第二殼體
部件112。第一殼體部件111以及第二殼體部件112係透過卡勾部113以及限位槽114的配合彼此組裝。絕緣片130設置於第一殼體部件111以及第二殼體部件112的內側,並且部分包覆電子元件120。
As shown in FIGS. 1 and 2, the
如第1圖與第2圖所示,於一些實施方式中,第一殼體部件111具有複數個第一固定孔111a,第一固定孔111a設置於第一殼體部件111遠離卡勾部113的邊緣。第二殼體部件112具有複數個第二固定孔112a,第二固定孔112a設置於第二殼體部件112遠離限位槽114的邊緣,並分別與對應的第一固定孔111a重疊。電子裝置100進一步包含複數個緊固件102(於第1圖與第2圖中係以螺絲為例),緊固件102通過第一固定孔111a以及第二固定孔112a,以固定第一殼體部件111與第二殼體部件112。
As shown in Figures 1 and 2, in some embodiments, the
如第1圖與第2圖所示,絕緣片130包含第一覆蓋部131、第二覆蓋部132以及至少一內凹結構133。第二覆蓋部132與第一覆蓋部131延伸方向相異(例如:第一覆蓋部131與第二覆蓋部132實質上相互垂直),且第一覆蓋部131以及第二覆蓋部132分別覆蓋於第一殼體部件111以及第二殼體部件112的內側。
As shown in FIGS. 1 and 2, the insulating
請一併參照第3圖。內凹結構133連接於第一覆蓋部131以及第二覆蓋部132之間,且內凹結構133與第二殼體部件112之間形成容置空間101以容納卡勾部113。上述配置可防止組裝殼體110時發生卡勾部113干
涉絕緣片130使絕緣片130破裂的情況,確保絕緣片130能達到預期的絕緣效果。
Please refer to Figure 3 together. The
如第2圖與第3圖所示,於一些實施方式中,內凹結構133包含弧面134,弧面134連接於第一覆蓋部131以及第二覆蓋部132之間,且弧面134的凹口面向卡勾部113以及限位槽114。弧面134與第二殼體部件112之間形成截面為四分之一圓的容置空間101。
As shown in Figures 2 and 3, in some embodiments, the
如第2圖與第3圖所示,於一些實施方式中,第一殼體部件111包含複數個卡勾部113,且第二殼體部件112包含複數個限位槽114,絕緣片130包含複數個內凹結構133對應卡勾部113以及限位槽114設置。內凹結構133彼此分離,且第一覆蓋部131與第二覆蓋部132在內凹結構133之間匯聚形成角落C,藉此減小絕緣片130佔用的空間,增加殼體110內部可供佈設電子元件120的空間。
As shown in FIGS. 2 and 3, in some embodiments, the
如第2圖與第3圖所示,於一些實施方式中,內凹結構133的兩端具有圓角135,進一步降低絕緣片130破裂的機會。
As shown in FIGS. 2 and 3, in some embodiments, both ends of the
如第2圖與第3圖所示,於一些實施方式中,卡勾部113與限位槽114滑動配合,且卡勾部113彎曲形成凹口113a,凹口113a配置以卡合於限位槽114的一端。
As shown in Figures 2 and 3, in some embodiments, the
請一併參照第4圖。如第3圖與第4圖所示,組裝殼體110時,可沿著方向D1移動第一殼體部件111,
使卡勾部113通過限位槽114進入容置空間101,再繞軸線L旋轉第一殼體部件111,直到第一殼體部件111的內表面抵靠於第二殼體部件112。接著,可沿著方向D2移動第一殼體部件111,使卡勾部113於容置空間101內滑動,直到卡勾部113的凹口113a卡合於限位槽114的一端,使第一殼體部件111與第二殼體部件112彼此連接。於一些實施方式中,完成上述步驟後,可利用緊固件102(可參考第2圖)來固定第一殼體部件111與第二殼體部件112,完成殼體110的組裝。
Please refer to Figure 4 together. As shown in Figures 3 and 4, when the
請參照第5圖以及第6圖,其為繪示依據本揭示另一實施方式之殼體510與絕緣片130在組裝前後的局部放大剖視圖。於本實施方式中,殼體510的第二殼體部件512的限位槽514包含相連通的插入部515以及固定部516。固定部516的寬度W2小於插入部515的寬度W1。第一殼體部件111的卡勾部113配置以由插入部515進入限位槽514,並旋轉卡合於固定部516。
Please refer to FIG. 5 and FIG. 6, which are partial enlarged cross-sectional views of the
如第6圖所示,卡勾部113包含相連的頸部113b以及頭部113c,其中頭部113c的寬度大於固定部516的寬度W2。組裝殼體510時,可沿著方向D1移動第一殼體部件111,使卡勾部113的頭部113c通過限位槽514的插入部515進入容置空間101,接著繞軸線L旋轉第一殼體部件111,直到卡勾部113的頸部113b進入限位槽514的固定部516,使第一殼體部件111與第二殼體部件512彼此連接。
As shown in FIG. 6, the
請參照第7圖,其為繪示依據本揭示另一實施方式之殼體110與絕緣片730的局部放大剖視圖。於本實施方式中,絕緣片730的內凹結構733包含第一延伸部734a以及第二延伸部734b。第一延伸部734a與第二延伸部734b相連並實質上相互垂直,且第一延伸部734a與第二延伸部734b分別連接第一覆蓋部131與第二覆蓋部132。第一延伸部734a以及第二延伸部734b與第二殼體部件112之間形成截面為矩形的容置空間701。
Please refer to FIG. 7, which is a partial enlarged cross-sectional view of the
請參照第8圖,其為繪示依據本揭示另一實施方式之殼體110與絕緣片830的局部放大剖視圖。於本實施方式中,絕緣片830的內凹結構833包含斜面834,斜面834連接於第一覆蓋部131以及第二覆蓋部132之間,且斜面834與第二殼體部件112之間形成截面為三角形的容置空間801。
Please refer to FIG. 8, which is a partial enlarged cross-sectional view of the
綜上所述,本揭示之絕緣片具有內凹結構,內凹結構與殼體之間形成容置空間以容納殼體的卡勾部,防止組裝殼體時卡勾部干涉絕緣片造成絕緣片破裂。 In summary, the insulating sheet of the present disclosure has an inner concave structure, and an accommodating space is formed between the inner concave structure and the casing to accommodate the hook portion of the casing, which prevents the hook portion from interfering with the insulating sheet when the casing is assembled. rupture.
儘管本揭示已以實施方式揭露如上,然其並非用以限定本揭示,任何熟習此技藝者,於不脫離本揭示之精神及範圍內,當可作各種之更動與潤飾,因此本揭示之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present disclosure has been disclosed in the above manner, it is not intended to limit the present disclosure. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection of this disclosure The scope shall be subject to those defined in the attached patent scope.
101:容置空間 101: accommodating space
111:第一殼體部件 111: The first housing part
112:第二殼體部件 112: second housing part
113:卡勾部 113: Card Hook
114:限位槽 114: limit slot
130:絕緣片 130: Insulation sheet
131:第一覆蓋部 131: The first covering part
132:第二覆蓋部 132: The second covering part
133:內凹結構 133: Concave structure
134:弧面 134: Curved Surface
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TW109117659A TWI747298B (en) | 2020-05-27 | 2020-05-27 | Electronic device and insulating piece thereof |
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TW109117659A TWI747298B (en) | 2020-05-27 | 2020-05-27 | Electronic device and insulating piece thereof |
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TW202145857A TW202145857A (en) | 2021-12-01 |
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EP0489253A2 (en) * | 1990-11-30 | 1992-06-10 | Kabushiki Kaisha Toshiba | Portable electronic apparatus having optional components for function expansion |
US20090040742A1 (en) * | 2007-08-09 | 2009-02-12 | Fujitsu Limited | Electronic device |
TW201536145A (en) * | 2014-03-13 | 2015-09-16 | Delta Electronics Inc | Combined housing and its suitable power supply |
US9591783B2 (en) * | 2014-11-12 | 2017-03-07 | Fujitsu Limited | Electronic device |
WO2019043789A1 (en) * | 2017-08-29 | 2019-03-07 | 三菱電機株式会社 | Operation apparatus |
CN210578224U (en) * | 2019-10-16 | 2020-05-19 | 北京迪赛奇正科技有限公司 | Mounting structure of switching power supply shell |
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