TWI740367B - Multi-pin structured probe and probe card - Google Patents

Abstract

[Question] It becomes possible to cope with the narrowing of the pitch between the electrode terminals of the semiconductor integrated circuit. [Solution] The multi-pin structure probe body of the present invention is characterized in that it is provided with a plurality of contact portions, which are formed by conductive materials, and are made for the first contact object and the second contact object Electrical contact; and the base, which is mounted on the substrate and formed by a synthetic resin material, and supports each of the aforementioned plural contact parts. The aforementioned base is provided with: a mounting part; and a plurality of The load part is separately provided at the lower part of the mounting part, and the contact part is held by the front end side of the arm part extending in the longitudinal direction, and the contact part is elastically supported.

Description

Multi-pin structure probe body and probe card

The present invention relates to a multi-pin structure probe body and a probe card. For example, it is a multi-pin structure probe capable of making electrical contact with the electrode terminals of the test object during the energization test of the test object. Body and probe card as applicable.

After a plurality of semiconductor integrated circuits are formed on the semiconductor wafer, an inspection device is used to conduct electrical tests of each semiconductor integrated circuit (object to be inspected) on the semiconductor wafer.

In the electrical inspection, the inspected body is placed on the top of the fixture, and the inspected body on the top of the fixture is pressed against the probe card installed in the inspection device. The probe card is equipped with a plurality of probes in such a way that the front end of each probe protrudes from under the probe card. By pushing the inspected body against the probe card, Make electrical contact between the front end of each probe and the corresponding electrode terminal of the object to be inspected. After that, the electrical signal from the inspection device is supplied to the inspected body via the probe, and the signal from the inspected body is introduced to the inspection device side via the probe. Conduct electrical inspection of the inspected body.

In the prior art, under the probe substrate, there is a substrate electrode for connecting the wiring pattern to each probe, and bonding materials such as solder are used to bond the probe to the substrate electrode (refer to the patent Literature 1).

More specifically, as shown in FIG. 9(A) and FIG. 9(B), the bonding material such as solder is melted by laser, and the substrate electrode 52 of the probe substrate 43 is in electrical contact with The method of fixing the element (probe) 9 by the joint 60 is a general method. At this time, due to the narrowing of the pitch between the probes, it is required to arrange the spacing between the probes as narrow as possible. However, it is also required to be able to prevent adjacent probes from contacting each other and become incompatible. The joints of welding materials and other parts will come into contact with each other. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2009-63395 A

[The problem to be solved by the invention]

However, in recent years, along with the ultra-miniaturization and ultra-high integration of semiconductor integrated circuits, the narrow pitch system between the electrode terminals of semiconductor integrated circuits has progressed, and there is a need for further narrowing of the probe system. Pitching. Under this requirement, if a bonding material melted by a laser is used, the bonding parts of adjacent probes may come into contact with each other or the bonding material may be bonded when the bonding material is melted by laser. The part receives radiant heat and melts slightly, causing the fixed position of the probe to change.

Therefore, there is a need for a multi-pin structure probe body and a probe card that can correspond to the narrower pitch between the electrode terminals of the semiconductor integrated circuit. [Means to solve the problem]

In order to solve this problem, the first multi-pin structure probe body of the present invention is characterized in that it is provided with a plurality of contact portions, which are formed by a conductive material, and are used for the first contact object and the second contact portion. Make electrical contact with the contact object; and the base is mounted on the substrate and formed by a synthetic resin material, and each of the aforementioned plural contact parts is supported. The aforementioned base is provided with: a mounting part ; And the plurality of load parts are separately provided at the lower part of the mounting part, and the contact part is held by the front end side of the arm part extending toward the longitudinal direction, and the contact part is made Flexible support.

The second probe card of the present invention is a probe card that electrically connects the inspection device and the electrode terminals of the object to be inspected. The aforesaid inspection device is used as a wiring circuit electrically connected, and on one side thereof, a plurality of substrate electrodes connected to the foregoing wiring circuit are provided; and the first plurality of pin structure probe bodies of the present invention are The non-electrode area on one of the aforementioned surfaces of the probe substrate is bonded with the base of the aforementioned multi-pin structure probe body by using an adhesive material. [Effects of Invention]

According to the present invention, it can correspond to the narrowing of the pitch between the electrode terminals of the semiconductor integrated circuit.

(A) Main implementation form

Hereinafter, the embodiments of the multi-pin structure probe body and the probe card of the present invention will be described in detail with reference to the drawings.

(A-1) The composition of the implementation form (A-1-1) Electrical connection device Fig. 2 is a configuration diagram showing the configuration of the electrical connection device of this embodiment.

In FIG. 2, the electrical connection device 1 of the present embodiment is provided with a flat support member 44, a flat wiring board 41 held below the support member 44, and the wiring board 41 The electrical connection unit 42 electrically connected to the substrate 41 and the probe that is electrically connected to the aforementioned electrical connection unit 42 and has a plurality of electrical contact elements (hereinafter, also referred to as "probes") 3板43。 Board 43.

In addition, the electrical connection device 1 in FIG. 2 is shown for the main constituent members, but it is not limited to these constituent members. In fact, it also has a configuration that is not shown in FIG. 2 member. In addition, the following is regarded as focusing on the up and down direction in Fig. 2, and there are references to "up" and "down".

The electrical connection device 1 is, for example, a semiconductor integrated circuit or the like formed on a semiconductor wafer as an object 2 to be inspected, and an electrical inspection of the object 2 is performed. Specifically, the inspected body 2 is pushed toward the probe substrate 43, so that the front end of each electrical contact element 3 of the probe substrate 43 is in electrical contact with the electrode terminal 51 of the inspected body 2, and A testing machine (inspection device) not shown in the figure supplies electrical signals to the electrode terminals 51 of the inspected body 2, and then applies the electrical signals from the electrode terminals 51 of the inspected body 2 to the testing machine side, In this way, the electrical inspection of the subject 2 is performed. The electrical connection device 1 is also called a probe card, for example.

The object to be inspected 2, which is the object of inspection, is placed on the top 5 of the jig. The top 5 of the fixture can be adjusted in the horizontal X-axis direction, the Y-axis direction perpendicular to the X-axis direction on the horizontal plane, and the Z-axis direction perpendicular to the horizontal plane (XY plane). In addition, the rotation posture can be adjusted in the θ direction around the Z axis. When the electrical inspection of the inspected body 2 is carried out, a jig that can be raised and lowered in the vertical direction (Z-axis direction) is moved. The front end of the sexual contact element 3 makes electrical contact to move in such a way that the underside of the probe substrate 43 of the electrical connection device 1 and the object under inspection 2 on the upper surface of the fixture top 5 are relatively approached.

The supporting member 44 is one that suppresses the deformation (for example, bending, etc.) of the wiring board 41. The wiring board 41 is formed of, for example, a resin material such as polyimide, and is, for example, a printed circuit board formed in a substantially circular plate shape. At the peripheral edge of the upper surface of the wiring board 41, there are arranged a plurality of electrode terminals (not shown) for electrical connection with the test head (not shown) of the tester (inspection device). In addition, on the underside of the wiring board 41, a wiring pattern not shown is formed, and the connection terminals of the wiring pattern are the upper ends of a plurality of connecting elements (not shown) provided at the electrical connection unit 42 Make electrical connections.

Furthermore, a wiring circuit (not shown) is formed inside the wiring substrate 41, and the wiring pattern on the lower surface of the wiring substrate 41 and the electrode terminals on the upper surface of the wiring substrate 41 become a wiring circuit that can pass through the inside of the wiring substrate 41 To make connections. Therefore, via the wiring circuit in the wiring board 41, it is possible to connect the "connecting elements of the electrical connection unit 42 electrically connected to the connection terminal of the wiring pattern under the wiring board 41" and "to be connected to the wiring board 41". The upper electrode terminal is used as the connection between the test head" to make the electrical signal conduct. On the upper surface of the wiring board 41, a plurality of electronic components necessary for the electrical inspection of the inspected body 2 are also arranged.

The electrical connection unit 42 is provided with a plurality of general connection elements such as pogo pins. In the assembled state of the electrical connection device 1, the upper end of each connection element is electrically connected to the connection terminal of the wiring pattern under the wiring board 41, and the lower end of each connection element is connected to The pads on the probe base plate 43 are used for connection. Since the front end of the electrical contact element 3 is in electrical contact with the electrode terminal 51 of the inspected body 2, the electrode terminal 51 of the inspected body 2 is connected to the testing machine ( The inspection device) is electrically connected, so the inspected body 2 is capable of performing the electrical inspection by the testing machine (inspection device).

The probe substrate 43 is a substrate provided with a plurality of electrical contact elements 3, and is formed into a slightly circular or polygonal shape (for example, a 16-angle shape, etc.). The probe substrate 43 is supported by the probe substrate support portion 18 at its peripheral edge. In addition, the probe substrate 43 is provided with a substrate member 431 formed of, for example, a ceramic plate, and a multilayer wiring substrate 432 formed under the substrate member 431.

Inside the substrate member 431, which is a ceramic substrate, a plurality of conductive paths (not shown) penetrating the thickness direction of the plate are formed, and on the upper surface of the substrate member 431, a spacer is formed. The substrate member 431 One end of the inner conductive path is formed to be connected to the connection terminal of the corresponding wiring pattern on the upper surface of the substrate member 431. Furthermore, under the substrate member 431, the other end of the conductive path in the substrate member 431 is formed to be connected to the connection terminal provided on the upper surface of the multilayer wiring substrate 432.

The multilayer wiring board 432 is formed by, for example, a plurality of multilayer substrates formed of a synthetic resin material such as polyimide, and is formed with wiring paths (not shown) between the plurality of multilayer substrates By. One end of the wiring path of the multilayer wiring board 432 is connected to the other end of the conductive path on the side of the substrate member 431, which is a ceramic substrate. Make the connection with the connection terminal below. The connection terminals provided under the multilayer wiring board 432 are electrically connected to the plurality of electrical contact elements 3, and the plurality of electrical contact elements 3 of the probe substrate 43 are electrically connected via the electrical connection unit 42 The connection terminals corresponding to the wiring board 41 are electrically connected.

(A-1-2) Electrical contact element

Next, the structure of the electrical contact element 3 of this embodiment will be described in detail with reference to the drawings.

On the lower surface side of the probe substrate 43, a plurality of multi-pin structure probe bodies 30 illustrated in FIG. 1 are provided. As shown in FIG. 1, the multi-pin structure probe body 30 can be roughly divided into a base 10 formed by a synthetic resin material and a plurality of contact parts 20 formed by a conductive material.

As described later, the base 10 of the multi-pin structure probe body 30 is provided with a plurality of load parts 100 that elastically support each of the plural (two in FIG. 1) contact parts 20. The load portion 100 and the contact portion 20 of one set function as one electrical contact element 3.

In other words, the multi-pin structure probe body 30 is provided with a state in which a plurality of electrical contact elements 3 are mutually replaced, and one multi-pin structure probe body 30 is fixed to the bottom surface of the probe substrate 43. On the side, a plurality of electrical contact members 3 can be stably fixed under the probe substrate 43 Side.

In addition, in FIG. 1, although the case where one multi-pin structure probe body 30 is provided with two electrical contact elements 3 is exemplified, the single multi-pin structure probe body 30 is It may be configured to include three or more electrical contact elements 3, and in this case, it may include three or more sets of the load portion 100 and the contact portion 20.

Each contact portion 20 of the multi-pin structure probe body 30 functions as an energizing portion for energizing between the substrate electrode 52 provided on the lower surface of the probe substrate 43 and the electrode terminal 51 of the subject 2.

The base portion 10 of the multi-pin structure probe body 30 is mounted on the lower surface side of the probe substrate 43, and functions as a load portion that elastically supports each of the plurality of contact portions 20. Specifically, when the contact portion 20 of the electrical contact element 3 is in contact with the electrode terminal 51 of the inspected body 2, the electrical contact element 3 receives a contact load acting from the lower side to the upper side (that is, The load acting from the side of the object 2 to the side of the probe substrate 43), however, the base 10 is elastically deformed and functions as a load portion that receives the contact load.

As described above, the multi-pin structure probe body 30 is provided with a plurality of load parts 100 arranged separately from each other, and a contact part 20 is attached to each load part 100. Therefore, one set of load points and contact portions 20 function as one electrical contact element 3.

In other words, one multi-pin structure probe body 30 can be regarded as having a plurality of electrical contact elements 3, and further, one electrical contact element 3 can be regarded as being formed by a synthetic resin material The load-bearing part (loading part) 100 and the contact part (current-carrying part) 20 formed of a conductive material are formed of mutually independent elements.

[Base] The base 10 is provided with a mounting portion 11 fixed to the lower surface side of the probe substrate 43, and a plurality of plate-shaped plates arranged separately from each other under the mounting portion 11 (in FIG. 1, For example, there are two load-bearing parts 100. Furthermore, each load portion 100 is provided with a base portion 12, an upper arm portion 13, a lower arm portion 14, and a support portion 15.

The base 10 is formed by a high-strength synthetic resin material (for example, engineering plastic) with heat resistance. The material forming the base 10 is not particularly limited as long as it is a high-strength synthetic resin material with heat resistance, and a wide variety of synthetic resin materials can be used. For example, polycarbonate can be used. Ester, polyimide, etc. as materials. In addition, the synthetic resin material forming the base portion 10 may be provided with insulation properties, or may be provided with conductivity properties. In this embodiment, a case where the base 10 is formed of a synthetic resin material with insulating properties will be exemplified and described. In addition, it is also possible to make the base 10 function as an insulating member by covering a part or all of the surface of the base 10 with a film of an insulating material.

The mounting portion 11 is a portion mounted on the lower surface side of the probe substrate 43, and is formed in a general block shape such as a substantially cubic or a substantially rectangular parallelepiped. In addition, the shape of the mounting portion 11 is not particularly limited, as long as it is a shape capable of forming a plurality of load portions 100, it is not particularly limited.

The base part 12 is a part formed integrally connected from the lower side of the mounting part 11, and is a part that supports the upper arm part 13 and the lower arm part 14. As shown in FIG. 3, a case where the base portion 12 is formed in a slightly trapezoidal shape is exemplified. The reason is that by setting the length of the bottom 121 above the base 12 (the length in the left-right direction in FIG. 3) to be greater than the length of the bottom 122 below the base 12, it is possible to keep fixed to The elasticity of the base 10 at the lower surface of the probe substrate 43 is not limited as long as the elasticity of the base 10 can be maintained.

The upper arm portion 13 and the lower arm portion 14 are as shown in FIG. 3 and are elastic support members that elastically support the support portion 15 that supports the contact portion 20. When the electrode terminal 51 of the inspected body 2 is in contact with the electrical contact element 3, the upper arm portion 13 and the lower arm portion 14 are members that allow the contact portion 20 and the support portion 15 to move up and down .

The upper arm portion 13 is formed as a linear rod, for example. The base end portion 131 of the upper arm portion 13 is formed integrally with the root base 12, and the front end portion 132 of the upper arm portion 13 is slightly curved into an arc shape (a convex arc shape facing upward). It is formed integrally with the support part 15.

The lower arm portion 14 is also the same as the upper arm portion 13, and is formed, for example, as a linear rod. The base end portion 141 of the lower arm portion 14 is formed integrally with the root base 12. The front end portion 142 of the side arm portion 14 is slightly curved into an arc shape (a downwardly convex arc shape) and is formed integrally with the support portion 15.

By setting the upper arm portion 13 and the lower arm portion 14 to the above-mentioned structure, if the electrical contact element 3 receives a contact load from the lower side toward the upper side, the upper arm portion 13 and the lower arm portion 14 act as By elastic deformation, the electrode terminal 51 of the subject 2 can be reduced in needle pressure.

The support part 15 is a current-carrying member support part that stably supports the contact part 20 that functions as a current-carrying part. The connecting portion 151 of the supporting portion 15 is integrally connected with the front end portion 132 of the upper arm portion 13 and the front end portion 142 of the lower arm portion 14.

Above the support portion 15, a scratch correction portion 153 is provided. When the upper end 201 of the contact portion 20 is in contact with the substrate electrode 52, it is opposite to the upper end of the substrate electrode 52. The scraping action of the part 201 is corrected. Since the upper portion of the scratch correcting portion 153 is formed flat, when the upper end 201 of the contact portion 20 is in contact with the substrate electrode 52, the scratch correcting portion 153 can also come into contact with the substrate electrode 52. , The contact of the upper end portion 201 of the contact portion 20 with respect to the substrate electrode 52 can be corrected.

[Contact Department] The contact portion 20 is formed of, for example, a conductive material such as copper, platinum, and nickel. For example, the contact portion 20 is formed by processing a plate-shaped member, and the thickness of the contact portion 20 is thinner than the thickness of the base portion 10, for example, it can be set to about several tens of μm.

The contact portion 20 functions as an energizing portion for energizing between the substrate electrode 52 provided on the lower surface of the probe substrate 43 and the electrode terminal 51 of the subject 2. The upper end 201 of the contact portion 20 is a portion that is in contact with the substrate electrode 52 of the wiring pattern provided on the lower surface of the probe substrate 43. At the lower front end of the lower end 202 of the contact portion 20, a front end contact portion 203 is provided for making contact with the electrode terminal 51 of the object 2 to be inspected.

The contact portion 20 has its upper end portion 201 in contact with the substrate electrode 52, and the front end contact portion 203 of the lower end portion 202 in contact with the electrode terminal 51 of the object 2 to be inspected. The path length of the energization path is set to be shorter than the length of the energization path when the electrical contact element of the prior art is used.

[Interval between electrical contact elements] FIG. 5(A) is an explanatory diagram for explaining the interval between the electrical contact elements 3 of the multi-pin structure probe body 30 of the embodiment. Fig. 5(A) is the right side view of Fig. 3.

The multi-pin structure probe body 30 can be formed of different materials for the load-bearing part formed by synthetic resin material and the current-carrying part formed by the conductive material, so that the load-bearing part and the current-carrying part can be formed The parts are formed by mutually independent projects.

Regarding the base 10 that functions as a load portion, for example, it can be formed by processing a plate-shaped member or a block-shaped member formed of a synthetic resin material. Therefore, for example, by processing a plate-shaped or block-shaped synthetic resin material, the load portions 100 separated from each other can be formed. More specifically, the interval length (pitch width) X of the load portion 100 (electric contact element 3) can be formed in accordance with the pitch width between the electrode terminals of the object 2 to be inspected. Furthermore, each The thickness Y of the load portion 100 can be formed in accordance with the size of the electrode terminal 51 of the subject 2 or the size of the contact load.

[Assembly of electrical contact components] FIG. 5(B) is a diagram showing an example of the method of assembling the electrical contact element 3 of this embodiment. Fig. 5(B) is a view when the multi-pin structure probe body 30 of Fig. 3 is observed from above.

As shown in FIG. 5(B), one of the surfaces of the plate-shaped supporting portion 15 (the surface on which the contact portion 20 is installed) is provided with 1 or a plurality of fixings for fixing the contact portion 20部152. For example, on one surface of the support portion 15, two fixing portions 152 formed in the shape of protrusions are provided, and at the contact portion 20, two fixing portions are provided for fitting with each fixing portion. The fitting portion 21 of the supporting portion 15 is fitted with each fixing portion 152 of the supporting portion 15 and each fitting portion 21 of the contact portion 20, so that the contact portion 20 can be installed at the supporting portion 15 of the base 10.

In addition, the fixing portion 152, which is two protrusions, is preferably arranged on the Y axis (upper and lower in Fig. 3) that is perpendicular to the X-axis (the left-right direction in Fig. 3) of the contact portion 20 The axis of the direction) is generally parallel, and the fitting parts 21 of the two contact parts 20 are also provided on one of the surfaces of the support part 15 at a position corresponding to the position of each fixing part 152 . By this, the posture of the contact portion 20 installed at the base 10 can be stably maintained. As a result, even when the electrode terminal 51 of the test body 2 is brought into contact with the electrical contact element 3, the alignment of the contact portion 20 with the electrode terminal 51 of the test body 2 can also be improved.

Furthermore, as shown in FIG. 5(B), the thickness of the plate-shaped support portion 15 is formed to be slightly larger than the thickness of the mounting portion 11, the base portion 12, the upper arm portion 13, and the lower arm portion 14. Thin. Therefore, when the contact portion 20 is installed at the supporting portion 15, the thickness of the installation area of the contact portion 20 at the electrical contact element 3 can also be suppressed. In other words, even if the contact portion 20 is installed at the support portion 15 of the base 10, the thickness of the electrical contact element 3 itself can be set to be approximately the same thickness. As a result, even if the pitch width between the electrode terminals 51 of the subject 2 is narrow, it becomes possible to make reliable contact.

In addition, FIG. 5(B) is an example of a method of mounting the contact portion 20 on the support portion 15 of the base 10, as long as the support portion 15 and the contact portion of the base 10 can be made of different materials. The method of 20-phase combination is not limited to this.

[Fixing method of multi-pin structure probe body] Next, the fixing method (bonding method) of the multi-pin structure probe body 30 of the present embodiment to the lower surface side of the probe substrate 43 will be described in detail with reference to the drawings.

The multi-pin structure probe body 30 of the present embodiment has the base 10 as the load portion and the contact portion 20 as the energized portion as separate members using different materials. Therefore, the probe can be The relative positional relationship between the substrate electrode 52 on the lower surface of the needle substrate 43 and the electrode terminal 51 of the object 2 to be inspected is set to be different from the prior art.

Therefore, in the following, the arrangement position of the multi-pin structure probe body on the lower side of the probe substrate 43 will be described first, and then the fixing method of the multi-pin structure probe body 30 will be described.

[Configuration of multi-pin structure probe body] As shown in FIG. 9(A), for example, the electrical contact element 9 of the cantilever probe of the prior art is arranged in such a way that the mounting portion 91 and the substrate electrode 52 can be electrically connected. Therefore, it is arranged in such a way that the substrate electrode 52 of the probe substrate 43 and the position of the mounting portion 91 of the electrical contact element 9 correspond to each other.

On the other hand, the multi-pin structure probe body 30 of the present embodiment has the base 10 as the load part and the contact part 20 as the energization part as different members, so that only the electrical contact elements 3 can be made. The components of the contact portion 20 are in electrical contact with the substrate electrode 52 and the electrode terminal 51 of the inspected body 2.

For example, as illustrated in FIG. 8(A), above the electrode terminal 51 of the test object 2, the substrate electrode 52 of the probe substrate 43 is arranged, as long as the posture of the contact portion 20 can be maintained up and down. Direction, during electrical inspection, it is possible to electrically connect the substrate electrode 52 and the electrode terminal 51 of the inspected body 2 only through the members of the contact portion 20 in each electrical contact element 3.

In this way, it is not necessary to connect the mounting portion 11 of the probe body 30 with the multi-pin structure to the substrate electrode 52. On the lower side of the probe substrate 43, it is possible to connect the substrate electrode 52 where the substrate electrode 52 is not arranged. At the electrode area (that is, the area where the probe land is not applied), the mounting portion 11 of the multi-pin structure probe body 30 is fixed, and the multi-pin structure probe body 30 is erected set up.

＜Fixing method＞ As shown in FIG. 9(B), in the prior art, when the electrical contact element 9 is fixed on the lower side of the probe substrate 43, a bonding material such as solder is used, and one electrical contact element The mounting portion 91 of the sexual contact element 9 is joined to the surface of the corresponding substrate electrode 52 (in FIG. 9(B), it is the lower surface and upper surface), and is fixed. In addition, the electrical contact elements 9 are fixed one by one to the corresponding substrate electrode 52.

At this time, the bonding material is arranged on both sides of one electrical contact element 9 so as to be able to be bonded to the surface of the substrate electrode 52, and the bonding material is melted by laser or the like, so that the electrical The contact element 9 and the surface of the substrate electrode 52 are fixed.

However, in order to correspond to the narrower pitch between the electrode terminals 51 of the inspected body 2, it is necessary to arrange the interval between the electrical contact elements 9 and the interval between the contact elements 52 at a narrow pitch, and furthermore It is also necessary to prevent the adjacent joining parts 60 from contacting each other.

Furthermore, when the bonding material provided on the side surface of a certain electrical contact element 9 is melted by laser or the like, the junction portion 60 of the adjacent electrical contact element 9 is slightly caused by radiant heat. It is softened, and the position of the electrical contact element 9 may also change.

In contrast, in the present embodiment, a multi-pin structure probe body 30 provided with a plurality of electrical contact elements 3 is fixed to the lower surface of the probe substrate 43 by a single structure. By this, it is possible to fix a plurality of (for example, two) electrical contact elements 3 separated from each other at the same time.

Here, the method of fixing the probe body 30 with the multi-pin structure of the present embodiment to the lower surface of the probe substrate 43 will be described.

[step 1] As shown in FIG. 8(B), at the lower surface of the probe substrate 43, at the position where the multi-pin structure probe body 30 is installed, the upper surface of the mounting portion 11 of the multi-pin structure probe body 30 is brought into contact.

At this time, under the probe substrate 43, the position of the probe 11 of the multi-pin structure probe body 30 is an area where the substrate electrode 52 is not arranged and is configured to make the multi-pin structure probe The position of the upper end 201 of each contact portion 20 of the needle body 30 becomes a position corresponding to the position of the substrate electrode 52.

[Step 2] When the mounting portion 11 of the multi-pin structure probe body 30 is in contact with the bottom surface of the probe substrate 43, the bottom surface of the probe substrate 43 and the mounting portion 11 of the multi-pin structure probe body 30 are in contact with each other At the location, set the adhesive material. After that, the adhesive material is hardened. In this way, the multi-pin structure probe body 30 is fixed to the lower surface of the probe substrate 43 by the hardened bonding portion 70 of the adhesive material.

Here, the bonding material may be a soldering material, an bonding agent made of synthetic resin material, or an bonding material containing metal and synthetic resin material, etc. The adhesive may be an adhesive made of resin, or may be an adhesive that is cured by heat or light (for example, ultraviolet rays, etc.). In addition, as long as the multi-pin structure probe body 30 can be joined to the probe substrate 43, it may be configured to be joined by welding. Furthermore, the adhesive is preferably an adhesive having all or some functions of insulation, heat resistance, and moisture resistance (water resistance).

The position where the adhesive material is applied can be a position where the adhesive material is used to fix the multi-pin structure probe body 30 to the joint part under the probe substrate 43. For example, as shown in FIG. 8(A) and FIG. 8(B), it can be set as "the bottom surface of the probe substrate 43" and "the body that is erected in the vertical direction with respect to the bottom surface is one. All or part of the boundary area between the two side surfaces of the mounting portion 11 of the multi-pin structure probe body 30 of the structure. As a result, when the adhesive is used for bonding, the multi-pin structure probe body 30 can be fixed to the lower surface of the probe substrate 43 in a state where it is erected relative to the probe substrate 43.

Here, if Fig. 8(B) and Fig. 9(B) are used, the distance between the plurality of electrical contact elements 3 of the multi-pin structure probe body 30 (pitch width) X and the plural number of the prior art Comparing the interval length (pitch width) X1 of the electrical contact member 9, the pitch width X of the multi-pin structure probe body 30 can be compared with the pitch width of the electrical contact element 9 of the prior art X1 is set to be smaller.

This is because, in the prior art, in order to avoid the contact between the joint parts 60, it is necessary to first ensure the pitch width X1 of the electrical contact element 9 to have a certain interval length, and then combine the plural electrical The contact element 9 is fixed. On the other hand, in this embodiment, by fixing a single multi-pin structure probe body 30 to the probe substrate 43, it is possible to simultaneously perform a plurality of electrical contact members 3 For fixed reasons. In this way, according to this embodiment, by fixing the multi-pin structure probe body 30 provided with a plurality of electrical contact elements 3 under the probe substrate 43, it is possible to realize the narrowness of the electrical contact elements 3 Pitching.

In addition, the method of fixing the multi-pin structure probe body 30 to the lower surface of the probe substrate 43 using an adhesive is not limited to the above-mentioned method. For example, it may be configured such that an adhesive material is applied to the lower surface of the probe substrate 43, and the upper surface of the mounting portion 11 of the multi-pin structure probe body 30 is provided on the adhesive material. That is, it may be configured such that the upper surface of the mounting portion 11 of the multi-pin structure probe body 30 and the lower surface of the probe substrate 43 are bonded via an adhesive. In this case, it can be configured so that the joint portion 70 does not appear on both sides of the mounting portion 11 of the multi-pin structure probe body 30. Therefore, when a plurality of multi-pin structure probe bodies 30 are provided, it is possible to avoid contact between the joining parts 70 of adjacent multi-pin structure probe bodies 30.

[Power Path] Hereinafter, one aspect deals with the current conduction path between the electrode terminal 51 and the substrate electrode 52 of the test object 2 when the electrical contact element 3 of the embodiment is used, and the current conduction path when the prior art electrical contact element is used. For comparison, explain on one side.

Fig. 6 is a diagram showing the state when the electrical contact element 9 of the prior art is brought into contact with the electrode terminal 51 of the object 2 to be inspected. The state when the contact element 3 is in contact with the electrode terminal 51 of the object 2 to be inspected is shown as a diagram.

As shown in FIG. 6, when the electrical contact element 9 of the prior art is electrically contacted with the electrode terminal 51 and the substrate electrode 52 of the inspected body 2 and the electrical inspection of the inspected body 2 is performed, the intermediary The conduction path between the substrate electrode 52 of the electrical contact element 9 and the electrode terminal 51 of the test object 2 is the same as R21 and R22.

On the other hand, as shown in FIG. 7, when the electrical contact element 3 is used for the electrical inspection of the inspected body 2, the substrate electrode 52 of the electrical contact element 3 and the inspected body 2 are interposed. The energization path between the electrode terminals 51 becomes the same as R1.

Here, the electrical contact element 3 of the present embodiment has the base 10 as the load portion and the contact portion 20 as the energized portion as separate members using different materials. Therefore, it is possible to make The relative positional relationship between the substrate electrode 52 on the lower surface of the probe substrate 43 and the electrode terminal 51 of the object 2 to be inspected is set to be different from the prior art.

For example, the electrical contact element 9 of the cantilever probe of the prior art is provided in such a way that the mounting portion 91 and the substrate electrode 52 can be electrically connected. Therefore, the probe substrate 43 is The substrate electrode 52 is arranged in a manner corresponding to the position of the mounting portion 91 of the electrical contact element 9 (refer to FIG. 6).

On the other hand, the electrical contact element 3 of this embodiment has the contact portion 20 as the energized portion and the base portion 10 as the load portion as different members, so that only the electrical contact element 3 can be contacted. The components of the portion 20 make electrical contact with the substrate electrode 52 and the electrode terminal 51 of the object 2 to be inspected.

For example, as illustrated in FIG. 7, if the posture of the contact portion 20 can be maintained in the vertical direction, the substrate electrode 52 can be arranged above the electrode terminal 51 of the subject 2. In this way, when the electrical contact element 3 is used for the electrical inspection of the inspected body 2, it is possible to make only the members of the contact portion 20 in the electrical contact element 3 and the substrate electrode 52 and the inspected body The electrode terminal 51 of 2 is electrically connected, so the path length of the energizing path R1 can be shortened.

That is, since the electrical contact element 9 of the prior art is formed by a conductive material as a whole, the substrate electrode 52 of the electrical contact element 9 and the electrode terminal 51 of the inspected body 2 are interposed. The path length of the energization paths R21 and R22 between them becomes longer. On the other hand, the path length of the energizing path R1 between the substrate electrode 52 of the electrical contact element 3 of this embodiment and the electrode terminal 51 of the subject 2 can be made shorter.

In addition, the path length of the energization path R1 is shorter than the path lengths of the energization paths R21 and R22 of the prior art. Therefore, the resistance value of the energization path R1 can be made smaller than that of the energization path of the prior art. The value (that is, the sum of the resistance values of the energization paths R21 and R22 (combined resistance value)) is lower. As a result, it becomes possible to flow a large current (a current having a large value) between the substrate electrode 52 and the electrode terminal 51 of the subject 2.

Furthermore, the electrical contact element 3 is formed by being able to distinguish the functions of the load-carrying part and the energizing part. Therefore, it is possible to reduce the cross-sectional area of the base part 10 that functions as the load-carrying part in order to reduce the needle pressure. Or, in order to maximize the current, the cross-sectional area of the contact portion 20 that functions as an energized portion is reduced. In particular, in order to maximize the current, for example, the length of the contact portion 20 illustrated in FIG. 1 in the X-axis direction (the left-right direction in FIG. 1) may be increased to be wide, or The thickness of the plate-shaped contact portion 20 is increased. With this, it becomes possible to flow a large current to the electrical contact element 3 during inspection. In addition, in order to correspond to the narrower pitch between the electrode terminals 51 of the inspected body 2, there may be restrictions on the increase in the thickness of the electrical contact element 3 (or the thickness of the contact portion 20). However, even in this case, the widening of the contact portion 20 becomes effective.

In addition, since the electrical contact element 3 is provided with the base 10 of the load part independently of the contact part 20 of the energized part, it can be separated from the increase in the cross-sectional area of the contact part 20. The cross-sectional area of 10 is reduced. As a result, it is possible to achieve a low needle pressure that suppresses the load of the electrode terminal 51 of the subject 2 during the inspection.

(A-2) Effect of implementation form As described above, according to this embodiment, since one multi-pin structure probe system has a structure with a plurality of electrical contact elements, by fixing the multi-pin structure probe body to the wiring board, the system is It can correspond to a semiconductor integrated circuit that realizes a narrower pitch between electrode terminals.

In addition, according to this embodiment, since the multi-pin structure probe system can design the base as the load part and the contact part as the energization part independently of each other, it is possible to design the contact parts between a plurality of electrical contact elements independently of each other. The adjustment of the separation length, etc. are taken into consideration, so that the design and construction of the multi-pin structure probe body with a plurality of electrical contact element structures becomes simple. Therefore, it is possible to reduce the distance between the electrical contact elements at the probe body of a multi-pin structure corresponding to the narrowing of the pitch between the electrode terminals of the object to be inspected.

Furthermore, according to this embodiment, by fixing the multi-pin structure probe body provided with a plurality of electrical contact elements to the probe substrate, it becomes possible to fix the plurality of contact elements in a batch. It can be helpful to the improvement of productivity.

Therefore, even if the multi-pin structure probe body, which is a single structure, is fixed under the probe substrate, it is because the multiple electrical contact elements of the single multi-pin structure probe body are connected to each other. There are no joints, so the contact between the joints can be suppressed. Furthermore, when a certain joining site is melted by a laser or the like, it is also possible to suppress the position change of the electrical contact element caused by the adjacent joining site being softened by radiant heat.

(B) Other implementation forms In the above-mentioned embodiment, although various modified embodiments have been mentioned, the present invention can also correspond to the following general modified embodiments.

(B-1) In the above-mentioned embodiment, the base 10 of the electrical contact element 3 is provided with two arms (upper arm 13 and lower arm 14) as an elastic support part. Illustrated. However, the elastic support part may also be a single arm part 13A as illustrated in FIG. 10. In addition, although not shown in the figure, the elastic support part may be provided with three or more arms.

As illustrated in FIG. 10, by providing the base portion 10A of the electrical contact element 3A with one arm portion 13A, when the substrate electrode 52 and the contact portion 20 are electrically connected, the electrical contact can be made The elastic force of the element 3A becomes soft. That is, it is possible to increase the scratching action in the vertical direction (Y-axis direction in FIG. 10) and left-right direction (X-axis direction in FIG. 10) of the contact portion 20 with respect to the substrate electrode 52. As a result, the upper end portion 201 of the contact portion 20 can be reliably brought into contact with the substrate electrode 52.

(B-2) FIG. 11 is a configuration diagram showing the configuration of the contact element of the multi-pin structure probe body of the modified embodiment. Fig. 12 is a diagram showing the state when the probe body of the multi-pin structure of the modified embodiment is brought into contact with the electrode terminal of the object to be inspected.

In the electrical contact element 3B illustrated in FIG. 11 and FIG. 12, the support portion 15B of the base portion 10B is provided with a scratch correction member 155. The scratch correction member 155 may be a curved arm member extending toward the mounting portion 11 side of the base 10B. In addition, the scratch correction member 155 is not limited to the one illustrated in FIG. 12.

Upon receiving the contact load, the upper arm portion 13 and the lower arm portion 14 are elastically deformed, and the upper end portion 201 of the contact portion 20 is brought into contact with the substrate electrode 52 at the same time. At this time, the guide portion 156 of the curved scratch correction member 155 is guided by the upper end 201 of the contact portion 20 to the substrate electrode 52 while making contact with the substrate electrode 52 as necessary, so that the upper end The portion 201 is in contact with the substrate electrode 52. Furthermore, at this time, since the bending support portion 157 of the scratch correction member 155 is in elastic contact with the lower surface of the probe substrate 43, it is possible to achieve a further reduction in needle pressure.

1: Electrical connection device 2: Subject 3, 3A, 3B: electrical contact components 10, 10A, 10B: base 30: Multi-pin structure probe body 100: load part 11: Installation Department 12: Root 13: Upper arm 13A: Arm 14: Lower arm 15, 15B: Support Department 151: Connection 152: Fixed part 153: Scratch Correction Department 155: Scratch correction component 18: Probe substrate support part 20: Contact 201: upper end 202: lower end 203: Front end contact 51: Electrode terminal 52: substrate electrode 70: Joint 4: Probe card 41: Wiring board 42: Electrical connection unit 43: Probe substrate 431: Substrate component 432: Multilayer wiring board 44: Supporting member 5: The top of the fixture

[Fig. 1] is a perspective view showing the structure of the multi-pin structure probe body of the embodiment. [Fig. 2] is a configuration diagram showing the configuration of the electrical connection device of the embodiment. [Fig. 3] is a front view showing the structure of the multi-pin structure probe body of the embodiment. [Fig. 4] is a rear view showing the structure of the multi-pin structure probe body of the embodiment. [Fig. 5] is a right side view and a plan view showing the structure of the multi-pin structure probe body of the embodiment. [Fig. 6] is an explanatory diagram for explaining the energization path of the electrical contact element in the prior art. [Fig. 7] is an explanatory diagram for explaining the energization path of the multi-pin structure probe body with the embodiment interposed therebetween. Fig. 8 is an explanatory diagram for explaining the fixing method of fixing the probe body with the multi-pin structure of the embodiment to the lower surface of the probe substrate. [Fig. 9] is an explanatory diagram for explaining the fixing method of the electric contact element in the prior art. [Fig. 10] is a configuration diagram (part 1) showing the configuration of the contact element of the multi-pin structure probe body of the modified embodiment. [Fig. 11] is a configuration diagram (part 2) showing the configuration of the contact element of the multi-pin structure probe body of the modified embodiment. [Fig. 12] is a diagram showing the state when the probe body of the multi-pin structure of the modified embodiment is brought into contact with the electrode terminal of the object to be inspected.

3: Electrical contact element

10: Base

30: Multi-pin structure probe body

100: load part

11: Installation Department

12: Root

13: Upper arm

14: Lower arm

15: Support Department

20: Contact

203: Front end contact

Claims (6)

A probe body with a multi-pin structure, characterized in that it is provided with: a plurality of contact portions, which are formed by a conductive material, and are provided on the bottom of the substrate and connected to the electrodes connected to the wiring pattern, and the inspected The electrode terminals of the body are electrically contacted; and the base part is mounted on the substrate and formed by a synthetic resin material, and each of the aforementioned plural contact parts is supported. The aforementioned base part is provided with ：Mounting part; and plural load parts are separately provided at the lower part of the aforementioned mounting part, and the contact part is held by the front end side of the arm part extending toward the longitudinal direction, and the aforementioned The contact part is elastically supported. The multi-pin structure probe body described in claim 1, wherein the posture of each contact portion is erected in the vertical direction with respect to the longitudinal direction, and each contact portion is provided with The electrode connected to the wiring pattern arranged on the bottom of the substrate makes electrical contact with the lower end and the upper end electrically connects with the electrode terminal of the object to be inspected. A probe card is a probe card that electrically connects an inspection device and an electrode terminal of an object to be inspected. Connect with Wire circuit, and on one side, is provided with a plurality of substrate electrodes connected with the aforementioned wiring circuit; and a plurality of multi-pin structure probe bodies as described in claim 1, on one of the aforementioned probe substrates In the non-electrode area of, the base of the probe body with the aforementioned multi-pin structure is attached by using an adhesive material. The probe card according to claim 3, wherein the mounting portion of the base of each of the multi-pin structure probe bodies arranged in the vertical direction with respect to the lower surface of the probe substrate, and these All or part of the boundary area between them is bonded by using the aforementioned bonding material. The probe card according to claim 4, wherein the boundary area includes the bottom surface of the mounting portion of the probe body of each multi-pin structure. The probe card according to claim 4 or 5, wherein one of the surfaces of the probe substrate is at a position corresponding to the position of the electrode terminal of the object to be inspected, and the substrates are arranged The electrodes are connected to the contact portions of the probe bodies of the multi-pin structure on one of the surfaces of the probe substrate, and make electrical contact with the corresponding substrate electrodes and the electrode terminals of the object to be inspected. .

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