TWI639671B - Adhesive tape attaching method and adhesive tape attaching apparatus - Google Patents

Abstract

Adhesive tape which is larger than the inner diameter of the chamber is attached to one of the upper casing and the lower casing, and the adhesive tape is preheated by the heater after forming the chamber through the adhesive tape. . Thereafter, the adhesive surface of the adhesive tape is brought close to the wafer and opposed to each other, and the pressure of the space in which the lower casing of the wafer is held is lowered to be lower than the air pressure in the space of the upper casing, and the adhesive tape is attached to the crystal. circle. The surface of the adhesive tape attached to the circuit formation surface of the wafer is pressed and flattened by the flat surface of the pressurizing member.

Description

Adhesive tape sticking method and adhesive tape sticking device

The present invention relates to an adhesive tape comprising a protective tape for protecting a circuit pattern formed on a semiconductor wafer, a cross-ring frame, and a dicing tape attached to a back surface of a semiconductor wafer placed at a center of the ring frame. Method and adhesive tape attachment device.

Generally, a semiconductor wafer (hereinafter, referred to as "wafer" as appropriate) is a circuit pattern in which a plurality of elements are formed on the surface. For example, a bump or a fine circuit is formed on the surface of the wafer. Thus, a protective tape is attached to protect the circuit surface.

The same unevenness is generated on the surface of the attached protective tape due to the influence of irregularities such as bumps on the surface of the wafer. Then, after the attachment treatment of the protective tape, the surface of the protective tape is pressed to planarize the surface of the base material constituting the protective tape (see Patent Document 1).

Advanced technical literature Patent literature

Patent Document 1 JP-A-2010-45189

However, the following problems occur in the above conventional methods.

In recent years, it has been formed by a package such as TSV (Through-Silicon Via), IGBT (Insulated Gate Bipolar Transistor) or MEMS (Micro Electro Mechanical System). The circuit on the wafer surface is required to achieve the miniaturization of the projections and the towering projections which are narrower than the conventional ones. Also, different protective bands are used separately for these packages to be manufactured. For example, it is difficult to handle the hardness of the substrate, or the increase in the thickness of the adhesive tape including the substrate and the adhesive, or the adhesive tape having both of these characteristics.

The conventional device described in Patent Document 1 causes a protective tape to be attached to the surface of a wafer in an atmospheric state. At this time, the tape-shaped protective tape is applied to the surface of the wafer by applying tension to the conveyance direction and rotating the attachment roller on the surface of the protective tape and pressing it. Therefore, the tension in the longitudinal direction of the protective tape is stronger than the width direction, and the protective tape is attached to the surface of the wafer in a state where wrinkles are likely to occur. Therefore, the adhesive cannot follow and intrude into the irregularities formed by the narrow intervals of the projections on the wafer surface or the like. In other words, the protective tape cannot be intimately attached to the surface of the wafer, and the uneven shape of the bumps on the surface of the wafer also appears on the surface of the protective tape.

Then, in order to flatten the surface of the protective tape, after the protective tape is attached to the wafer, the pressing member having a flat surface is pressurized while being heated.

However, at the time of attaching the protective tape, since the adhesive layer is not softened, it is impossible to invade between the banks, and there is even a problem that the bubbles are wound into the subsequent interface of the wafer and the protective tape.

Further, when the adhesive tape is attached, the surface of the adhesive tape is flattened to heat the protective tape, and the thickness of the adhesive and the hardness of the base material of the protective tape are increased to soften the adhesive or the like, and it takes longer than the conventional treatment time. Not ideal.

The present invention has been made in view of such circumstances, and a main object thereof is to provide an adhesive tape which can adhere to an adhesive tape with high precision irrespective of a state of a circuit formed on a semiconductor wafer and can be attached efficiently. Attachment method and adhesive tape attachment device.

The present invention has the following constitution for achieving such a purpose.

That is, an adhesive tape attaching method is an adhesive tape attaching method in which an adhesive tape is attached to a circuit forming surface of a semiconductor wafer, and is characterized in that: a first attaching process is performed on a pair of first chambers constituting the chamber The bonding portion of one of the housing and the second housing is attached to the adhesive tape larger than the inner diameter of the chamber; during the preheating process, the adhesive tape is preheated by the heater after the adhesive tape is formed in the chamber The second attaching process is such that the semiconductor wafer is brought closer to the adhesive surface of the adhesive tape and faces the adhesive film, and the air pressure of the space in which the second casing of the semiconductor wafer is held is reduced to be smaller than that of the first casing. The pressure of the space is also low, and the adhesive tape is attached to the semiconductor wafer; and the surface of the adhesive tape attached to the circuit forming surface of the semiconductor wafer is pressurized and flattened by the flat surface of the pressing member. Chemical.

According to this method, the adhesive tape can be preheated to a predetermined temperature while the adhesive tape is attached to the semiconductor wafer after the adhesive tape is attached to the joint portion of one of the casings. Therefore, since the adhesive is softening at the point of attachment of the adhesive tape, even if the pressing member or the like is not used and the light is caused by the differential pressure in the two spaces in the chamber partitioned by the adhesive tape, uniformity can be obtained. The pressing force acts on the entire surface of the adhesive tape to attach the adhesive tape to the surface of the semiconductor wafer. In other words, the adhesive tape can be attached to the semiconductor wafer without being damaged by excessive pressing of the surface. Further, the air bubbles can be degassed from the concave portion on the surface of the semiconductor wafer by the decompression action, and the adhesive can follow the uneven shape on the surface of the semiconductor wafer and be in close contact with each other. Moreover, the preheating system of the adhesive tape can be performed in the decompression process in the chamber immediately before the adhesive tape is attached, so that the treatment can be shortened compared with the case where the adhesive tape is heated by flattening the surface of the adhesive tape. time.

Further, in the above method, it is preferable that the preheating process is performed by, for example, bringing the pressing surface of the pressing member in which the heater is embedded into contact with the adhesive tape for preheating.

In this case, since the pressing surface of the pressing member is flat, it is in close contact with the adhesive tape. Therefore, the entire surface of the adhesive tape can be heated on average.

Further, in the above method, it is preferable that the pressurizing process is performed by pressing the adhesive tape while being heated by the pressing member.

In this case, the unevenness of the base material constituting the adhesive tape can be efficiently planarized.

Further, the present invention adopts the following configuration for achieving such a purpose.

That is, an adhesive tape attaching device is an adhesive tape attaching device for attaching an adhesive tape for surface protection to a circuit forming surface of a semiconductor wafer, and is characterized in that: a holding table for holding the semiconductor wafer; a chamber comprising: a pair of first housings and a second housing that house the holding table; a tape supply unit that supplies the adhesive tape larger than an inner diameter of the chamber; and a tape attaching mechanism that adheres a bonding portion attached to one of the housings; a heater that preheats the adhesive tape attached to the joint portion; and a pressurizing mechanism to generate two spaces in the chamber partitioned by the adhesive tape Differential pressure, and pressing the adhesive tape attached to the semiconductor wafer by a pressing member provided in the chamber; the cutting mechanism cuts the adhesive tape along the outer shape of the semiconductor wafer; the peeling mechanism will cut The adhesive tape to the shape of the semiconductor wafer is peeled off; and the tape recovery portion collects the peeled adhesive tape.

Further, an adhesive tape attaching device is an adhesive tape attaching device for attaching an adhesive tape for supporting a semiconductor wafer and a ring frame, and is characterized by comprising: a wafer holding table that holds the semiconductor wafer; a holding frame that holds the ring frame; a chamber that is formed by a pair of first and second housings that house the wafer holding table; a tape supply unit that supplies the adhesive tape; and a tape attaching mechanism The adhesive tape is attached to one of the joint portions of the ring frame and the casing; the heater is preheated and adhered to the adhesive tape of the ring frame and the joint portion; and the pressing mechanism is disposed by the adhesive tape. The two spaces in the compartments generate a differential pressure, and pressurize the surface of the adhesive tape attached to the semiconductor wafer by the flat surface of the pressing member provided in the chamber; the cutting mechanism is in the ring frame The adhesive tape is cut upward, the peeling mechanism is peeled off from the cut adhesive tape, and the tape collecting portion is used to collect the peeled adhesive tape.

In any of the above devices, the adhesive tape can be preheated to a predetermined temperature during decompression of the chamber before attaching the adhesive tape to the semiconductor wafer. Therefore, even if the state of the semiconductor wafer at the time of attaching the adhesive tape is different, the above method can be suitably performed.

Further, in the above apparatus, it is preferable that the pressurizing member of the pressurizing means is provided with a heating means.

According to this configuration, since the flat pressing surface of the pressing member can be brought into contact with the adhesive tape, the entire surface of the adhesive tape can be heated uniformly.

According to the adhesive tape attaching device and the adhesive tape attaching method of the present invention, the adhesive tape can be attached to the semiconductor wafer with high precision and efficiency irrespective of the state of the circuit formed on the surface of the semiconductor wafer.

4‧‧‧With the supply department

5‧‧‧ Attachment unit

6‧‧‧With cutting mechanism

7‧‧‧ chamber

8‧‧‧ Pressurizing unit

9‧‧‧ peeling unit

10‧‧‧With recycling department

20‧‧‧Exfoliation members

22‧‧‧ Attachment roller

23‧‧‧cutting unit

33A‧‧‧Upper casing

33B, 33C‧‧‧ lower case

36‧‧‧Rotating arm

37‧‧‧ Keeping the table

49‧‧‧heater

60‧‧‧Control Department

61‧‧‧ Pressurized components

63‧‧‧heater

77‧‧‧Box holding table

PT‧‧‧Adhesive tape for surface protection

W‧‧‧Semiconductor Wafer

F‧‧‧ ring frame

DT‧‧‧Adhesive tape for support

Fig. 1 is a front elevational view showing the entire adhesive tape attaching device for surface protection.

Fig. 2 is a front elevational view showing the entire adhesive tape attaching device for surface protection.

Fig. 3 is a front view showing the configuration of the rotary drive mechanism.

Figure 4 shows a front view of the construction of the chamber.

Figure 5 shows a longitudinal section of the configuration of the chamber.

Figure 6 shows a front view of the action of the embodiment device.

Figure 7 shows a front view of the action of the embodiment device.

Figure 8 shows a front view of the action of the embodiment device.

Figure 9 shows a top view of the action of the embodiment device.

Figure 10 shows a front view of the action of the embodiment device.

Figure 11 shows a top view of the action of the embodiment device.

Figure 12 shows a front view of the action of the embodiment device.

Figure 13 is an enlarged front elevational view showing the action of attaching an adhesive tape to a wafer by the embodiment device.

Figure 14 is an enlarged front elevational view showing the action of attaching an adhesive tape to a wafer by the embodiment device.

Figure 15 shows a front view of the action of the embodiment device.

Figure 16 shows a front view of the action of the embodiment device.

Figure 17 shows a front view of the action of the embodiment device.

Figure 18 shows a front view of the action of the embodiment device.

Figure 19 shows a front view of the action of the embodiment device.

Figure 20 shows a front view of the adhesive tape attaching device for support.

Figure 21 shows a top view of the adhesive tape attachment device for support.

Figure 22 shows a front view of the configuration of the chamber.

Fig. 23 is a front view showing the action of the modification device.

Fig. 24 is a front view showing the action of the modification device.

Fig. 25 is an enlarged front elevational view showing the action of attaching the adhesive tape to the wafer by the modification device.

Fig. 26 is an enlarged front elevational view showing the action of the adhesive tape for attaching the support to the wafer by the modification device.

Fig. 27 is a front view showing the action of the modification device.

Fig. 28 is a front view showing the action of the modification device.

Fig. 29 is a front view showing the action of the modification device.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Further, in the present embodiment, a case where an adhesive tape for surface protection is attached to a circuit forming surface of a semiconductor wafer (hereinafter, simply referred to as "wafer") will be described as an example.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing the entire configuration of an adhesive tape attaching device, and Fig. 2 is a top view of an adhesive tape attaching device, in accordance with an embodiment of the present invention.

The adhesive tape attaching device includes a wafer supply/recovery unit 1, a wafer transport mechanism 2, a calibration table 3, a tape supply unit 4, a attaching unit 5, a tape cutting mechanism 6, a chamber 7, and a pressurizing unit 8, The peeling unit 9 and the belt collecting unit 10 and the like. Hereinafter, specific configurations of the above-described respective structural portions, mechanisms, and the like will be described.

Two wafer bodies C1 and C2 are placed in parallel in the wafer supply/recovery unit 1. The wafer W of a plurality of wafers is inserted into each of the cartridges C in a plurality of layers in a horizontal posture in which the circuit forming surface (surface) faces upward.

The wafer transport mechanism 2 includes two robot arms 11A and 11B. The two mechanical arms 11A, 11B are constructed to move horizontally forward and backward, and can be rotated and lifted as a whole. Further, a vacuum suction type wafer holding portion having a horseshoe shape is provided at the tip end of the robot arms 11A and 11B. The wafer holding portion is inserted into a gap between the wafers W accommodated in the plurality of stages of the wafer C, and the wafer W is sucked and held from the back surface. The wafer W that has been adsorbed and held is pulled out from the cartridge C and transported in the order of the calibration table 3, the holding table 37, and the wafer supply/recovery unit 1.

The calibration table 3 carries the wafer W placed thereon by the wafer transfer mechanism 2, and is aligned in accordance with the notch or the orientation surface formed on the outer periphery thereof.

As shown in FIG. 1, the tape supply unit 4, the attaching unit 5, the separator collecting unit 12, and the cutting unit 23 are attached to the same vertical plate 14. The vertical plate 14 is horizontally moved along the upper frame 16 by the movable table 15.

The wide adhesive tape PT in which the tape supply portion 4 is wound into a roll is loaded in the supply bobbin 17, and is configured to wind the protective tape PT with the spacer s drawn from the supply bobbin 17 around the guide roller. The group of 18 is guided and guides the protective tape PT of the peeled spacer s to the attaching unit 5. Further, the configuration is such that the supply bobbin 17 is given a moderate rotational resistance without excessive extraction.

The separator collecting portion 12 is a driving bobbin 19 in which the separator s which is separated from the protective tape PT is rotatably driven in the winding direction.

As shown in FIG. 3, the attaching unit 5 is provided with the peeling member 20, the elevation roller 21, and the attaching roller 22. Further, the attaching unit 5 corresponds to the tape attaching mechanism of the present invention.

The peeling member 20 has a sharp end edge. The peeling member 20 which is obliquely downward with the end edge folds the spacer s and peels off the adhesive tape PT. That is, the adhesive tape PT is protruded forward from the peeling member 20.

The lifting roller 21 cooperates with the peeling member 20 to hold the adhesive tape PT in a timely manner.

The attaching roller 22 presses the distal end of the adhesive tape PT protruding from the distal end of the peeling member 20 and continues to be attached to the joint portion 70 of the lower casings 33B and 33C to be described later.

The cutting unit 23 includes a movable table 25 that moves along a frame 24 provided on the front side of the peeling member 20, and a cutter 26 that is provided with a tool holder at a lower portion of the movable table 25. That is, the cutting unit 23 cuts the adhesive tape PT in the width direction.

As shown in FIGS. 1 and 2, the tape cutting mechanism 6 includes a cutter unit that is provided with a support arm 29 that extends in the radial direction from a lower end portion of the front end of the arm that can be supported by the movable table 28 that can be lifted and lowered along the frame 27. 30. The tool 31 with the blade tip facing down is mounted to the cutter unit 30 through the tool holder. Further, the cutter unit 30 can adjust the swirl radius through the support arm 29. Further, the tape cutting mechanism 6 corresponds to the cutting mechanism of the present invention.

The chamber 7 is composed of a pair of outer casings having an inner diameter smaller than the width of the adhesive tape T. In the present embodiment, one upper casing 33A and two lower casings 33B and 33C are provided.

As shown in FIGS. 3 and 4, the lower casings 33B and 33C are respectively provided at both ends of a swing arm 36 that is coupled and fixed to a rotating shaft 35 of a rotary drive machine 34 such as a motor. That is, for example, when the lower casing 33B and the upper casing 33A which constitute one side form the chamber 7, the other lower casing 33C is the tape attachment position on the side of the attachment unit 5. Further, the upper and lower surfaces of the lower casings 33B and 33C are subjected to a release treatment such as fluorine processing.

A holding table 37 that can be raised and lowered is provided in the two lower casings 33B and 33C. The holding table 37 is coupled to a rod 38 that penetrates the lower casings 33B and 33C. The other end of the rod 38 is drivably coupled to an actuator 39 constituted by a motor or the like. Therefore, the holding table 37 is raised and lowered in the lower casings 33B, 33C. Further, a heater 49 is embedded in the holding table 37.

The upper casing 33A is provided to the elevation drive mechanism 40. The elevation drive mechanism 40 includes a movable table 43 that can be raised and lowered along a rail 42 that is disposed on the back of the vertical wall 41 in the longitudinal direction, a movable frame 44 that is height-supported to the movable table 43, and a movable frame 44 from the movable frame 44 An arm 45 extending forward. The upper casing 33A is attached to a support shaft 46 that extends downward from the front end portion of the arm 45.

The movable table 43 is formed such that the screw 47 is reversely rotated by the motor 48 to be screwed up and down.

As shown in FIG. 5, the upper and lower casings 33A to 33C are connected to each other via a flow path 50 and a vacuum device 51. Further, the flow path 50 on the side of the upper casing 33A is provided with a solenoid valve 52. Further, each of the casings 33A to 33C is connected to a flow path 55 having electromagnetic valves 53 and 54 for opening the atmosphere. Further, the upper casing 33A is connected to a flow path 57 provided with a solenoid valve 56, and the electromagnetic valve 56 is leaked to adjust the internal pressure of the temporary decompression. Further, the opening and closing operations of the electromagnetic valves 52, 53, 54, and 56 and the operation of the vacuum device 51 are performed by the control unit 60.

The pressurizing unit 8 is provided with a pressurizing member 61 in the upper casing 33A. The pressing member 61 is a plate having a flat bottom surface. The cylinder 62 is coupled to the upper portion of the pressurizing member, and is raised and lowered in the upper casing 33A. Further, the heater 63 is placed in the pressing member 61. Further, the pressurizing unit 8 is equivalent to the pressurizing mechanism of the present invention.

As shown in Fig. 1, Fig. 2, and Fig. 18, the peeling unit 9 includes a movable table 65 that horizontally moves left and right along the guide rail 64, and a fixed piece 66 that moves up and down on the movable table 65. The movable piece 68 of the cylinder 67 is opened and closed. That is, the stripping unit 9 is a belt cutting mechanism 6 One end side of the unnecessary adhesive tape PT in which the shape of the wafer W is cut is held by the fixing blade 66 and the movable piece 68 and continuously peeled off. Further, the peeling unit 9 corresponds to the peeling mechanism of the present invention.

The collection container 10 is provided with a recovery container 69 which is positioned on the side of the peeling end of the peeling unit 9, and collects the adhesive tape PT peeled off by the peeling unit 9.

Next, an operation of attaching the adhesive tape PT to one of the wafers W by the apparatus of the above-described embodiment will be described.

First, the wafer W is carried out from the body C1 by the robot arm 11A, and placed on the calibration table 3. After the alignment table 3 is aligned, the robot arm 11A carries the holding tape 37 in the tape attachment position.

As shown in FIG. 6, the holding table 37 is higher than the top (joining portion) 70 of the lower case 33B, and the plurality of support pins 71 are topped up to receive the wafer W. The support pin 71 that has received the wafer W is lowered, and the wafer W is adsorbed and held on the holding surface of the holding stage 37. At this time, the surface of the wafer W is at a position lower than the joint portion 70.

As shown in Fig. 7, the attaching unit 5 is moved to the attachment start end. The adhesive tape PT is protruded from the peeling member 20 by a predetermined length while synchronizing the supply of the adhesive tape PT with the winding. The attaching roller 22 is lowered and the leading end of the adhesive tape PT is attached to the joint portion 70 of the lower casing 33B. Thereafter, the attaching unit 5 is continuously attached to the entire surface of the joint portion 70 while moving. At this time, the surface of the wafer W and the adhesive surface of the adhesive tape PT are close to each other and opposed to each other with a predetermined gap.

The attaching unit 5 is stopped at a position beyond the predetermined distance from the joint portion 70 on the attaching terminal side. The cutting unit 23 is actuated as shown in FIG. As shown in Fig. 9, the cutter 26 cuts the rear end side of the adhesive tape PT in the width direction. In addition, FIGS. 7 and 8 and FIG. 13 which will be described later are easy to understand the tape attaching operation by the attaching unit 5, and the lower case 33B described on the left side is rotated by 90 degrees.

As shown in FIGS. 10 and 11, the rotary drive unit 34 is operative to rotate the lower casing 33B to the lower side of the upper casing 33A. At this time, the lower casing 31C is attached to the other end side of the rotary arm 36 to move to the tape attachment position.

As shown in FIG. 12, the upper casing 33A is lowered and the lower casing 33B is sandwiched by the adhesive tape PT to form the chamber 7.

The control unit 60 is an actuating heater 49 that heats the wafer W on the holding stage 37 to a predetermined temperature, and performs preheating of the adhesive tape PT and decompression in the chamber 7 substantially simultaneously.

The preheat treatment was carried out as follows. The heater 63 is maintained at a predetermined temperature as the operation of the device begins. In other words, the temperature at which the adhesive tape is softened at the timing of contact of the adhesive tape PT with the wafer W and infiltrated into the gap of the bump of the wafer W, and the substrate is appropriately deformed by the adhesive tape PT. The way to control the temperature. Therefore, at the same time as the formation of the chamber 7, the pressing member 61 is lowered to a predetermined height and the pressing surface abuts against the adhesive tape PT to start preheating. Further, the temperature of the preheating is appropriately changed depending on the characteristics of the adhesive tape to be used.

The pressure reduction in the chamber 7 is started while maintaining the pressing member 61 against the adhesive tape PT. That is, in a state where the solenoid valves 53, 54, 56 are closed, the vacuum device 51 is actuated and the inner and lower casings of the upper casing 33A are opened. Decompression in 33B. At this time, the opening degree of the electromagnetic valve 52 is adjusted so that the pressure can be continuously reduced at the same speed in the two casings 33A and 33B.

When the inside of the two casings 33A, 33B is decompressed to a predetermined air pressure, the control unit 60 closes the electromagnetic valve 52 and stops the operation of the vacuum device 51.

Thereafter, the opening degree of the electromagnetic valve 56 is adjusted while leaking, and the inside of the upper casing 33A is gradually raised to a predetermined air pressure. At this time, the air pressure in the lower casing 33B becomes lower than the air pressure in the upper casing 33A, and the differential pressure is applied. As shown in FIGS. 13 and 14, the adhesive tape PT is continuously pulled closer to the lower casing 33B from the center thereof. The inside is gradually attached to the outer periphery from the center of the wafer W to be equipped.

When the preset air pressure is reached in the upper casing 33A, the control unit 60 adjusts the opening degree of the electromagnetic valve 54 so that the air pressure in the lower casing 33B is set to be the same as the air pressure in the upper casing 33A. In response to this air pressure adjustment, the holding table 37 is raised, and the surface of the joint portion 70 of the lower casing 33B is set to the same height as the upper surface of the wafer W.

As shown in Fig. 15, the pressing member 61 heated by the heater 63 is further lowered to a predetermined height, and the entire surface of the adhesive tape PT is heated while being heated for a predetermined period of time. This height is preset to a height at which the circuit containing the bump does not break depending on the thickness of the adhesive tape PT, the height of the bump on the wafer W, and the like.

When the pressurization process is completed, the control unit 60 raises the upper casing 33A so that the inside of the upper casing 33A is opened to the atmosphere, and the electromagnetic valve 54 is fully opened, so that the lower casing 33B side is also opened to the atmosphere.

Further, during the attachment of the adhesive tape PT to the wafer W in the chamber 7, the wafer W carried out from the cartridge C2 by the robot arm 11B is used. The holding table 37 in the lower casing 33C is attached to the joint portion 70 of the lower casing 33C while being held by suction.

When the attaching process and the pressurizing process of attaching the adhesive tape PT to the wafer W in the chamber 7 and the attaching process of attaching the adhesive tape PT to the lower casing 33C by the attaching and attaching unit 5 are completed, as shown in FIG. The rotation arm 36 is reversed. That is, one of the lower casings 33B is moved to the tape attachment position on the side of the attachment unit 5, and the other lower casing 33C is moved to the engagement position below the upper casing 33A.

As shown in Fig. 17, the operating belt cutting mechanism 6 lowers the cutter unit 30 to a predetermined height, and the cutter 31 is inserted into the adhesive tape PT between the wafer W and the lower casing 33B. In its state, the adhesive tape PT is cut along the outer periphery of the wafer W. At this time, the surface of the adhesive tape PT is kept horizontal. When the cutting of the adhesive tape PT is completed, the cutter unit 30 is raised and returned to the standby position.

The peeling unit 9 is moved to the peeling start position. As shown in FIG. 18, both ends of the adhesive tape PT protruding from the lower case 33B are sandwiched by the fixing piece 66 and the movable piece 68. As shown in Fig. 19, after moving a predetermined distance obliquely upward in the state, the adhesive tape PT having the wafer shape cut off is continuously peeled off while moving horizontally.

When the peeling unit 9 reaches the belt collecting portion 10, the holding of the adhesive tape PT is released, and the adhesive tape PT is dropped to the recovery container 69.

The wafer W to which the adhesive tape PT is attached is stored in the original position of the body C1 through the robot arm 11A.

Further, during the cutting and peeling process of the adhesive tape PT on the lower casing 33B side, the wafer is attached to the lower casing 33C side. The attachment process of the adhesive tape PT is in progress. As described above, the attaching operation of attaching one wheel of the adhesive tape T to the wafer W is completed, and then the same processing is repeated.

According to the apparatus of the above-described embodiment, since the distal end side of the adhesive tape PT is attached to the joint portion 70 of the lower casings 33B and 33C in a free state, the adhesive tape PT can be attached while suppressing the tension in the attaching direction. Therefore, by applying a differential pressure to the adhesive tape PT having no deviation in tension, a radial average tension can be applied to the adhesive tape PT. Therefore, the adhesive tape PT can be attached to the surface of the wafer W without wrinkles or the like.

Moreover, the heater 63 of the pressurizing member 61 provided in the chamber 7 is controlled at a predetermined temperature. Therefore, while the chamber 7 is formed, the pressing surface of the pressing member 61 can be brought into contact with the adhesive tape PT and the adhesive tape PT can be directly preheated to a predetermined temperature. Further, the adhesive tape PT can be preheated to a predetermined temperature while the two spaces of the chamber 7 partitioned by the adhesive tape PT are decompressed at the same speed or the vacuum is at the same gas pressure. Therefore, the attachment time of the adhesive tape PT can be shortened compared to the conventional method of heating the adhesive tape PT by the heater 63 at the same time as the pressurization treatment.

Further, by causing a differential pressure in the two spaces in the chamber 7, the adhesive tape PT in a moderately softened state can be continuously attached radially from the center of the wafer W.

Therefore, as in the case of using the attaching member such as the attaching roller or the like, since the wafer W is not excessively pressed, the circuit including the bump or the like is not damaged. Further, the air bubbles can be degassed from the concave portion of the wafer W by the decompression action, and the adhesive can follow the uneven shape of the surface of the wafer W and be in close contact with each other.

Moreover, after the adhesion treatment of the adhesive tape PT, since the pressure treatment is performed again, the surface of the base material constituting the adhesive tape PT is flattened. Therefore, the thickness unevenness of the wafer W after the back surface polishing can be suppressed. That is, the surface of the adhesive tape PT can be flattened regardless of the characteristics of the adhesive tape PT or the state of the circuit formation surface of the wafer W.

Further, during the process of applying the adhesive tape PT to the wafer W and the pressure treatment in the chamber 7, the adhesive tape PT may be attached to the other lower case in parallel or strip-cut. Broken and stripped. Therefore, the tact time can be shortened.

Further, the present invention can also be carried out in the following aspects.

(1) In the above embodiment, the case of attaching the adhesive tape PT for surface protection is described as an example, and it is also applicable to the adhesive tape for attaching the support to the wafer W on which the circuit is formed on the back surface of the watch and the ring frame ( The case of cutting tape). Therefore, the same configurations as those of the above-described embodiment are denoted by the same reference numerals, and the different components will be described in detail.

As shown in FIGS. 20 and 21, the adhesive tape attaching device further includes a frame supply unit 75, a robot arm 76, a frame holding base 77, and a cutting unit 78.

The frame supply unit 75 is provided in the lateral direction of the body C1. A truck-type transport vehicle 79 in which the ring frames f are stacked and stored is connected to the space. Construction: The truck 78 has a lifting platform inside. The ring frame f is stacked on the elevating table, and the ring frame f is delivered to the robot arm 76 one at a time from the upper opening while raising and lowering at a predetermined interval.

The robot arm 76 sucks and holds the upper surface of the ring frame f in a horseshoe-shaped holding portion and carries it.

The frame holding base 77 is formed in a ring shape surrounding the outer circumference of the lower casings 33B and 33C, and is provided on the swing arm 36. Therefore, it is rotated integrally with the lower casings 33B and 33C. When the frame frame f is placed on the frame holding table 77, the height of the joint surfaces of the lower casings 33B and 33C and the surface of the ring frame f are the same plane.

The cutting unit 78 is provided in the elevation drive mechanism 40 that moves the upper casing 33A up and down. That is, the valley portion 80 that is rotated around the support shaft 46 through the bearing 79 shown in FIG. 22 is provided. This valley portion 80 has four support arms 81 to 84 extending in the radial direction at the center.

At the front end of one of the support arms 81, a cutter bracket that horizontally supports the disk-shaped cutter 85 that can move up and down is attached, and the front end of the other support arms 82-84 is provided with a swing arm. 88 push roller 87 that can move up and down.

The upper portion of the valley portion 80 has a coupling portion 89 that is rotatably coupled to the rotation shaft of the motor 90 provided in the arm 45.

The operation of attaching the adhesive tape DT to one of the ring frame f and the wafer W by the apparatus of the next embodiment will be described.

While the wafer W is carried out from the cartridge C1 by the robot arm 11A and aligned by the calibration table 3, the ring frame f is carried out by the robot arm 76 and placed on the frame holding table 77 positioned at the tape attachment position.

When the wafer W that has been aligned is delivered to the holding table 37 by the robot arm 11A, as shown in FIG. 23, the bonding unit 5 is attached to the joint portion 70 of the ring frame f and the lower casing 33B by the attaching unit 5 to attach the adhesive tape DT. . At this time, the surface of the wafer W and the adhesive surface of the adhesive tape DT are predetermined. The gap is close and opposite. Further, in order to facilitate understanding of the tape attaching operation by the attaching unit 5, FIG. 23 shows that the side of the casing 33B described on the left side is rotated by 90 degrees.

When the attaching unit 5 reaches the attaching end position, the cutting unit 23 cuts off the adhesive tape DT. At this time, the rear end of the adhesive tape DT after cutting is protruded from the ring frame f by a predetermined length.

The rotary drive 34 is actuated to rotate the lower casing 33B and move to the lower side of the upper casing 33A. At this time, the lower casing 31C is attached to the other end side of the rotary arm 36 to move to the tape attachment position.

As shown in Fig. 24, the upper casing 33A is lowered to sandwich the adhesive tape DT with the lower casing 33B to form the chamber 7.

The control unit 60 activates the heater 49 to heat the wafer W on the holding table 37 to a predetermined temperature, and simultaneously performs preheating treatment of the adhesive tape PT and pressure reduction in the chamber 7 at substantially the same time.

The preheat treatment was carried out as follows. The heater 63 is maintained at a predetermined temperature as the operation of the device begins. In other words, at the timing when the adhesive tape DT comes into contact with the wafer W, temperature control is performed such that the adhesive is softened moderately and adhered to the wafer W, and the substrate of the adhesive tape DT is moderately deformed. Therefore, at the same time as the chamber 7 is formed, the pressing member 61 is lowered to a predetermined height, and the pressing surface abuts against the adhesive tape PT to start preheating. Further, the temperature of the preheating is appropriately changed depending on the characteristics of the adhesive tape to be used.

The pressure reduction in the chamber 7 is started in a state where the pressing member 61 is pressed against the adhesive tape PT. That is, in a state where the solenoid valves 53, 54, 56 are closed, the vacuum device 51 is actuated to the inner and lower casings of the upper casing 33A. Decompression was carried out in 33B. At this time, the opening degree of the electromagnetic valve 52 is adjusted so that the pressure can be continuously reduced at the same speed in the two casings 33A and 33B.

When the inside of the two casings 33A, 33B is decompressed to a predetermined air pressure, the control unit 60 closes the electromagnetic valve 52 and stops the operation of the vacuum device 51.

Thereafter, the opening degree of the electromagnetic valve 56 is adjusted while leaking, and the inside of the upper casing 33A is gradually raised to a predetermined air pressure. At this time, the air pressure in the lower casing 33B becomes lower than the air pressure in the upper casing 33A, and the differential pressure is applied. As shown in FIGS. 25 and 26, the adhesive tape DT is continuously pulled into the lower casing 33B from the center thereof. In the center, the center of the wafer W that is placed close to it is continuously attached to the outer periphery. Thereafter, the air pressure in the lower casing 33B is set to be the same as the air pressure in the upper casing 33A. In response to this air pressure adjustment, the holding stage 37 is raised and the surface of the ring frame f is set at the same height as the upper surface of the wafer W.

As shown in Fig. 27, the pressing member 61 heated by the heater 63 is lowered to a predetermined height, and the entire surface of the adhesive tape PT is heated while being heated for a predetermined period of time. This height is set to a height at which the circuit including the bump is not damaged depending on the thickness of the adhesive tape PT, the height of the bump on the wafer W, and the like.

Further, during the period in which the adhesive tape DT is attached and pressurized in the chamber 7, the cutting unit 78 is actuated. At this time, the cutter 85 cuts the adhesive tape DT attached to the ring frame f along the ring frame f, and the pressing roller 87 follows the cutter 85 to rotate the belt-cut portion on the ring frame f while continuing to push. Pressure. That is, when the chamber 7 is constituted by the lowered upper casing 33A and the lower casing 33B, the cutter 85 of the cutting unit 78 and the pressing roller 87 also reach the cutting operation position.

As shown in Fig. 28, when the pressurization process is completed, the control unit 60 raises the upper casing 33A, opens the upper casing 33A to the atmosphere, and opens the solenoid valve 54 to open the lower casing 33B side. In the atmosphere.

Further, while the adhesive tape PT is attached to the wafer W in the chamber 7, the wafer W and the ring frame f are placed on the lower case 33C and the frame in the tape attaching position by the robot arms 11A and 76. The holding table 77 performs the attaching process of the adhesive tape DT.

When the attaching process and the pressurizing process of the adhesive tape toward the wafer W in the chamber 7 and the attaching process of the adhesive tape PT to the lower case 33C by the attaching unit 5 are completed, the swing arm 36 is reversed. turn.

The peeling unit 9 is moved toward the peeling start position. As shown in Fig. 29, the fixing piece 66 and the movable piece 68 sandwich the both end sides of the adhesive tape DT which protrudes from the ring frame f. After the state is moved to a predetermined distance obliquely upward, one side is horizontally moved while the adhesive tape PT cut into a wafer shape is continuously peeled off.

When the peeling unit 9 reaches the belt collecting portion 10, the holding of the adhesive tape PT is released, and the adhesive tape PT is dropped to the recovery container 69.

In addition, the peeling process and the peeling process of the adhesive tape DT on the side of the lower case 33B are completed, and the attaching frame in which the wafer W and the ring frame f are integrally formed is carried out, and the adhesive tape is attached to the wafer facing the lower case 33C side. PT treatment, pressure treatment and cutting treatment. As described above, the attaching operation of attaching one wheel of the adhesive tape T to the wafer W is completed, and then the same processing is repeated.

According to the apparatus of this embodiment, even in the case where the circuit is formed on both sides of the wafer W, compared with the conventional method of heating in the planarization process after attaching the adhesive tape DT, the system can be short-time and excellent in precision. The adhesive tape DT is attached to the wafer W.

Further, in the apparatus of this embodiment, the cutting unit 78 may be provided on the side of the tape attaching position provided in the attaching unit 5 in the same manner as the main embodiment.

(2) Preferably, in each of the above embodiments, the decompression time and the warm-up time until the differential pressure is generated in the two spaces in the chamber 7 are adjusted to be the same. However, it is also possible to cause a differential pressure in the chamber 7 and adjust the deformation time until the adhesive tape PT is attached to the wafer W to be included in the warm-up time.

(3) In the apparatus of the above two embodiments, the two lower casings 33B and 33C are provided, but one of them may be provided. In this case, the lower casing can also be constructed to be slidably moved by the swing arm 36 in the same manner as in the above embodiment, and is slid along the linear rail.

(4) In the above embodiment, the heater 63 may be provided only in the pressing member 61.

(5) In the above embodiment, the wafers W and C2 are housed in the same wafer W. However, the wafers W on which the different circuits are formed may be accommodated in the respective bodies C1 and C2. For example, the wafer W having a small unevenness on the circuit formation surface and the wafer W having a large unevenness are separately housed in the body. The adhesive tape PT and the adhesive tape DT are the same in the two wafers W system.

In this case, when a rigid adhesive tape (for example, a PET substrate) is attached to the wafer W by differential pressure in the chamber 7, it is attached to the wafer W. Concavities and convexities are formed on the surface of the adhesive tape on the wafer W having a large surface unevenness. On the other hand, the surface of the adhesive tape which has been attached to the uneven surface has no unevenness.

Therefore, the wafer W having irregularities on the surface of the adhesive tape is subjected to pressure treatment in the chamber 7, and for the wafer W having no unevenness on the surface of the adhesive tape, only the tape attachment treatment using differential pressure can be performed. . In other words, the adhesive tape can be attached to different types of wafers W, and can be carried out in one device.

Further, after the adhesive tape attaching treatment is performed by the differential pressure, the flatness of the surface of the adhesive tape can be measured by the sensor, and the pressure treatment can be performed depending on the presence or absence of the unevenness.

[Industrial availability]

As described above, the present invention is suitable for attaching the adhesive tape to the semiconductor wafer with high accuracy and efficiency irrespective of the state of the circuit formed on the surface of the semiconductor wafer.

Claims (8)

An adhesive tape attaching method is an adhesive tape attaching method in which an adhesive tape is attached to a circuit forming surface of a semiconductor wafer, and is characterized in that: a first attaching process is performed on a pair of first housings constituting the chamber and The bonding portion of one of the second casings is attached to the adhesive tape larger than the inner diameter of the chamber; during the preheating process, the adhesive tape is preheated by the heater after the adhesive tape is formed in the chamber; The attaching process causes the semiconductor wafer to be close to the adhesive surface of the adhesive tape and opposes it, and reduces the air pressure of the space in which the second casing of the semiconductor wafer is held to be lower than the air pressure of the space of the first casing The adhesive tape is attached to the semiconductor wafer at the lower side, and the surface of the adhesive tape attached to the circuit forming surface of the semiconductor wafer is pressed and flattened by the flat surface of the pressing member. The adhesive tape attaching method of claim 1, wherein the preheating process causes the pressing surface of the pressing member in which the heater is embedded to abut against the adhesive tape to perform preheating. The adhesive tape attaching method according to claim 2, wherein the pressurizing process pressurizes the adhesive tape while being heated by the pressing member. The adhesive tape attaching method according to claim 2 or 3, wherein the pressurizing process pressurizes the adhesive tape while heating by the heater provided on the second casing side. An adhesive tape attaching device is an adhesive tape attaching device for attaching an adhesive tape for surface protection to a circuit forming surface of a semiconductor wafer, characterized by comprising: a holding stage for holding the semiconductor wafer; and a chamber a pair of first casings and second casings accommodating the holding table; a tape supply portion that supplies the adhesive tape larger than an inner diameter of the chamber; and a tape attaching mechanism that attaches the adhesive tape a joint portion of the casing; a heater that preheats the adhesive tape attached to the joint portion; and a pressurizing mechanism that causes a differential pressure between the two spaces in the chamber partitioned by the adhesive tape. And pressing the adhesive tape attached to the semiconductor wafer by a pressing member provided in the chamber; the cutting mechanism cuts the adhesive tape along the outer shape of the semiconductor wafer; and the peeling mechanism cuts the semiconductor The adhesive tape of the shape of the wafer is peeled off; and the belt recovery portion collects the adhesive tape after peeling. The adhesive tape attaching device of claim 5, wherein the pressurizing member of the pressurizing mechanism is provided with a heating device. An adhesive tape attaching device is an adhesive tape attaching device for attaching an adhesive tape for supporting a semiconductor wafer and a ring frame, and is characterized in that: a wafer holding table that holds the semiconductor wafer; and a frame holding table , which maintains the aforementioned ring frame; a chamber comprising: a pair of first housings and a second housing that house the wafer holding table; a tape supply unit that supplies the adhesive tape; and a tape attaching mechanism that attaches the adhesive tape to the ring a joint between the frame and one of the casings; a heater that preheats the adhesive tape attached to the ring frame and the joint portion; and a pressurizing mechanism to generate two spaces in the chamber partitioned by the adhesive tape Differential pressure, and pressurizing the surface of the adhesive tape attached to the semiconductor wafer by the flat surface of the pressing member provided in the chamber; the cutting mechanism that cuts the adhesive tape on the ring frame; the peeling mechanism, The adhesive tape after peeling and cutting, and a tape collecting portion that collects the adhesive tape after peeling. The adhesive tape attaching device of claim 7, wherein the pressurizing member of the pressurizing mechanism is provided with a heating device.